CREAT BY ART
- Low power loss, high efficiency
- Ideal for automated placement
- Guardring for overvoltage protection
- High surge current capability
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
V
RRM
20 30 40 50 60 90 100 150 V
V
RMS
14 21 28 35 42 63 70 105 V
V
DC
20 30 40 50 60 90 100 150 V
I
F(AV)
A
dV/dt V/μs
R
θJL O
C/W
T
JO
C
T
STG O
C
Document Number: D1307003 Version: H13
10000
- 55 to +150
25
- 55 to +125 - 55 to +150
- Moisture sensitivity level: level 1, per J-STD-020
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
1
30
Unit
S
K
110B
0.5 0.75 0.85 V
A
-
Maximum instantaneous forward voltage (Note 1)
@ 1 A V
F
-
2
I
R
0.5
0.95
0.1
Note 1: Pulse test with PW=300μs, 1% duty cycle
Typical thermal resistance
Operating junction temperature range
Storage temperature range
mA
Voltage rate of change (Rated V
R
)
-
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=100℃
T
J
=125 ℃
10 5
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
S
K
13B
S
K
14B
S
K
12B
PARAMETER SYMBOL
SK12B thru SK115B
Surface Mount Schottk
y
Barrier Rectifier
Taiwan Semiconductor
MECHANICAL DATA
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
Weight: 0.093 g (approximately)
DO-214AA (SMB)
Case: DO-214AA (SMB)
FEATURES
S
K
115B
S
K
15B
S
K
16B
S
K
19B
Polarity: Indicated by cathode band
PART NO.
PART NO.
SK16B
SK16B
SK16B
(TA=25℃ unless otherwise noted)
Document Number: D1307003 Version: H13
M4 SMB 3,000 / 13" Plastic reel
Note 1: "xx" defines voltage from 20V (SK12B) to 200V (SK150B)
SK12B thru SK115B
Taiwan Semiconductor
ORDERING INFORMATION
AEC-Q101
QUALIFIED
PACKING CODE PACKINGGREEN COMPOUND
CODE
PACKAGE
SK1xxB
(Note 1) Prefix "H"
R5
Suffix "G"
SMB 850 / 7" Plastic reel
R4 SMB 3,000 / 13" Paper reel
EXAMPLE
PREFERRED P/N AEC-Q101
QUALIFIED PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
SK16B R5 R5
SK16B R5G R5 G Green compound
SK16BHR5 H R5 AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
0
0.25
0.5
0.75
1
1.25
50 60 70 80 90 100 110 120 130 140 150 160 170
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (oC)
FIG.1- MAXIMUM FORWARD CURRENT DERATING
CURVE
SK12B-SK14B
SK15B-SK115B
RESISTIVE OR
INDUCTIVE LOAD
0
10
20
30
40
50
1 10 100
PEAK FORWARD SURGE
CURRENT(A)
NUMBER OF CYCLES AT 60 Hz
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD SURGE
CURRENT
8.3ms Single Half Sine-Wave
JEDEC Method
0.001
0.01
0.1
1
10
100
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT (mA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=75℃
TJ=125℃
SK12B-SK14B
SK15B-SK16B
SK110B-SK115B
0.1
1
10
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
PULSE WIDTH=300μs
1% DUTY CYCLE
SK12B-SK14B
SK15B-SK16B
SK110B-SK115B
Min Max Min Max
A 1.95 2.10 0.077 0.083
B 4.25 4.75 0.167 0.187
C 3.48 3.73 0.137 0.147
D 1.99 2.61 0.078 0.103
E 0.90 1.41 0.035 0.056
F 5.10 5.30 0.201 0.209
G 0.10 0.20 0.004 0.008
H 0.15 0.31 0.006 0.012
P/N = Specific Device Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: D1307003 Version: H13
MARKING DIAGRAM
SK12B thru SK115B
Taiwan Semiconductor
C4.3
D1.8
E6.8
Symbol Unit (mm)
A2.3
B2.5
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
SUGG ESTED PAD LAY OUT
Unit (inch)
0.091
0.098
0.169
0.071
0.268
10
100
1000
0.1 1 10 100
JUNCTION CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
0.1
1
10
100
0.01 0.1 1 10 100
TRANSIENT THERMAL IMPEDANCE
(℃/W)
T-PULSE DURATION (sec)
FIG. 6 TYPICAL TRANSIENT THERMAL
CHARACTERISTICS
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: D1307003 Version: H13
SK12B thru SK115B
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,