INCH-POUND MIL-M-38510/16A 21 April 2005____ SUPERSEDING MIL-M-38510/16(USAF) 15 May 1973 MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, TTL, AND GATES, MONOLITHIC SILICON Inactive for new design after 7 September 1995. This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535 1. SCOPE 1.1 Scope. This specification covers the detail requirements for monolithic, silicon, TTL, positive AND logic gating microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.4). 1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein. 1.2.1 Device types. The device types are as follows: Device type 01 02 Circuit Quadruple, 2-input positive AND gate Quadruple, 2-input positive AND gate (open collector output) 1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535. 1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style A B C D GDFP5-F14 or CDFP6-F14 GDFP4-F14 GDIP1-T14 or CDIP2-T14 GDFP1-F14 or CDFP2-F14 14 14 14 14 Flat pack Flat pack Dual-in-line Flat pack Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to bipolar@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at http://assist.daps.dla.mil. AMSC N/A FSC 5962 MIL-M-38510/16A 1.3 Absolute maximum ratings. Supply voltage range ...................................................... Input voltage range ......................................................... Storage temperature range ............................................ Maximum power dissipation per gate, (PD) 1/ ............. Lead temperature (soldering 10 seconds) ...................... Thermal resistance, junction-to-case (JC)...................... Junction temperature (TJ ) 2/ .......................................... -0.5 V dc to +7.0 V dc -1.5 V dc at -12 mA to +5.5 V dc -65C to +150C 50 mW dc 300C (See MIL-STD-1835) 175C 1.4 Recommended operating conditions. Supply voltage ................................................................ Maximum high level input voltage .................................. Minimum high level input voltage ................................... Maximum low level input voltage .................................... Minimum low level input voltage ..................................... Normalized fanout (each output) 3/ ................................ Case operating temperature range (TC ) ......................... 4.5 V dc minimum to 5.5 V dc maximum 5.0 V dc 2.0 V dc 0.8 V dc 0.0 V dc 10 maximum -55C to 125C 2.0 APPLICABLE DOCUMENT 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications and standards. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard for Microelectronics. Interface Standard Electronic Component Case Outlines (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _______ 1/ Must withstand the added PD due to short circuit condition (e.g. IOS) at one output for 5 seconds duration. 2/ Maximum junction temperature should not be exceeded except in accordance with allowable short duration burn-in screening condition in accordance with MIL-PRF-38535. 3/ Device will fanout in both high and low levels to the specified number of inputs of the same device type as that being tested. 2 MIL-M-38510/16A 3. REQUIREMENTS 3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.3 and 6.3). 3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein. 3.3.1 Logic diagram and terminal connections. The logic diagram and terminal connections shall be as specified on figure 1. 3.3.2 Truth tables and logic equations. The truth tables and logic equations shall be as specified on figure 2. 3.3.3 Schematic circuit. The schematic circuit shall be maintained by the manufacturer and made available to the qualifying activity and the preparing activity upon request. 3.3.4 Case outlines. Case outlines shall be as specified in 1.2.3. 3.4 Lead material and finish. Lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6). 3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table 1 and apply over the full recommended case operating temperature range, unless otherwise specified. 3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table III. 3.7 Marking. Marking shall be in accordance with MIL-PRF-38535. 3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 1 (see MIL-PRF-38535, appendix A). 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit, or function as described herein. 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535. 4.3 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior to qualification and conformance inspection. The following additional criteria shall apply: a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer. c. Additional screening for space level product shall be as specified in MIL-PRF-38535. 3 MIL-M-38510/16A TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Device type Min 2.4 Limits Units Max High-level output voltage VOH VCC = 4.5 V, VIN = 2.0 V IOH = -800 A for all inputs of gate under test 1/ 01 Low-level output voltage VOL VCC = 4.5 V, IOL = 16 mA VIN = 0.8 V for all inputs of gate under test 1/ All 0.4 V Input clamp voltage VIC VCC = 4.5 V, IIN = -12 mA TC = 25C All -1.5 V Maximum collector cut-off current ICEX VCC = 4.5 V, VIN = 2.0 V VOH = 5.5 V 02 250 A High-level input current IIH1 VCC = 5.5 V, VIN = 2.4 V 2/ All 40 A High-level input current IIH2 VCC = 5.5 V, VIN = 5.5 V 2/ All 100 A Low-level input current IIL VCC = 5.5 V, VIN = 0.4 V 1/ All -0.7 -1.6 mA Short-circuit output current IOS VCC = 5.5 V 1/ 3/ 01 -20 -55 mA High-level supply current ICCH VCC = 5.5 V 1/ VIN = 5.5 V All 21 mA Low-level supply current ICCL VCC = 5.5 V 2/ VIN = 0 V All 33 mA Propagation delay time, high-to-low-level tPHL CL = 50 pF, RL = 390 01 3 32 ns 02 3 38 ns Propagation delay time, low-to-high-level tPLH 01 3 40 ns 02 3 49 ns 1/ 2/ 3/ CL = 50 pF, RL = 390 All unspecified inputs at 5.5 V. All unspecified inputs grounded. Not more than one output should be shorted at a time. 4 V MIL-M-38510/16A TABLE II. Electrical test requirements. Subgroups (see table III) Class S Devices Class B Devices 1 1 Final electrical test parameters 1*, 2, 3, 9 1*, 2, 3, 9 Group A test requirements 1, 2, 3, 9, 10, 11 1, 2, 3, 9, Group B electrical test parameters when using the method 5005 QCI option 1, 2, 3 N/A Groups C end point electrical parameters 1, 2, 3 1, 2, 3 MIL-PRF-38535 Test requirement Interim electrical parameters Additional electrical subgroups for Group C periodic inspections None 10, 11 Group D end point electrical parameters 1, 2, 3 1, 2, 3 *PDA applies to subgroup 1. 4.4 Technology Conformance Inspection (TCI). Technology conformance inspection shall be in accordance with MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 shall be omitted. 4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535. 4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows: a. End point electrical parameters shall be as specified in table II herein. b. Subgroups 3 and 4 shall be added to the group C inspection requirements for class B devices and shall consist of the tests, conditions, and limits specified for subgroups 10 and 11 of group A. c. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. 4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-point electrical parameters shall be as specified in table II herein. 4.5 Methods inspection. Methods of inspection shall be as specified in the appropriate tables and as follows: 4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given are conventional current and positive when flowing into the referenced terminal. 5 MIL-M-38510/16A FIGURE 1. Logic diagram and terminal connections (top view). Device types 01 and 02 Truth table (each gate) Input Output A B Y L L L H L L L H L H H H Positive logic Y = AB FIGURE 2. Truth table and logic equations. 6 MIL-M-38510/16A FIGURE 3. Schematic circuits for device type 01. 7 MIL-M-38510/16A FIGURE 3. Schematic circuits for device type 02. 8 MIL-M-38510/16A FIGURE 3. Schematic circuits for device type 02- Continued. 9 MIL-M-38510/16A NOTES: 1. The generator has the following characteristics: tP = 0.5 s, PRR = 1 MHz and ZOUT 50 . 2. CL includes probe and jig capacitance. 3. All diodes are 1N3064 or equivalent. Figure 5. Switching time test circuit. 10 TABLE III. Group A inspection for device type 01. Terminal conditions (pins not designated are open) Subgroup MILSTD-883 method Cases A,B,C,D Test No. VOL " " " " " " " VOH " " " IOS " " " IIH1 " " " " " " " 3007 " " " " " " " 3006 " " " 3011 " " " 3010 " " " " " " " IIH2 " " " " " " " IIL " " " " " " " ICCH ICCL VIC " " " " " " " 1 2 3 4 5 6 1A 1B 1Y 2A 2B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 0.8 V 5.5 V " " " " " " 2.0 V 5.5 V " " " 5.5 V 0.8 V 5.5 V " " " " " 2.0 V 5.5 V " " " 16 mA 16 mA 5.5 V 5.5 V 0.8 V 5.5 V " " " " " 2.0 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 0.8 V 5.5 V " " " " 2.0 V 5.5 V 5.5 V 5.5 V 5.5 V 2.4 V GND " " " " " " GND 2.4 V GND " " " " " GND GND 2.4 V GND " " " " GND " " 2.4 V GND " " " GND " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " 3009 " " " " " " " 3005 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 5.5 V GND " " " " " " 0.4 V 5.5 V " " " " " " " " 5.5 V GND " " " " " 5.5 V 0.4 V 5.5 V " " " " " " " " 5.5 V GND " " " " 5.5 V 5.5 V 0.4 V 5.5 V 5.5 V " " " " " " " 5.5 V GND " " " 5.5 V " " 0.4 V 5.5 V " " " " 3005 42 GND GND GND GND 43 44 45 46 47 48 49 50 -12 mA -.8 mA 2Y 7 16 mA 16 mA -.8 mA GND GND -12 mA -12 mA -12 mA 2 Same tests, terminal conditions and limits as subgroup 1, except TC = 125C and VIC tests are omitted. 3 Same tests, terminal conditions and limits as subgroup 1, except TC = -55C and VIC tests are omitted. GND 8 3Y 9 10 3A 3B 5.5 V " " " 0.8 V 5.5 V " " " " 2.0 V 5.5 V 5.5 V " " " " 0.8 V 5.5 V " " " 2.0 V 5.5 V 11 4Y 12 13 14 Meas. terminal 4A 4B VCC 5.5 V " " " " " 0.8 V 5.5 V 5.5 V " " 2.0 V 5.5 V " " " " " " 0.8 V 5.5 V " " 2.0 V 1Y 1Y 2Y 2Y 3Y 3Y 4Y 4Y 1Y 2Y 3Y 4Y 1Y 2Y 3Y 4Y 1A 1B 2A 2B 3A 3B 4A 4B 1A 1B 2A 2B 3A 3B 4A 4B 1A 1B 2A 2B 3A 3B 4A 4B Min Test limits Max 5.5 V 5.5 V GND " " " 2.4 V GND " " GND " " " " 2.4 V GND " 5.5 V GND " " " " " 2.4 V GND 5.5 V GND " " " " " " 2.4 V 4.5V " " " " " " " " " " " 5.5 V " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " 5.5 V GND " " 5.5 V " " " 0.4 V 5.5 V " " " " " " " " 5.5 V GND " 5.5 V " " " " 0.4 V 5.5 V " " " " " " " " 5.5 V GND 5.5 V " " " " " 0.4 V 5.5 V 5.5 V GND " " " " " " 5.5 V 5.5 V " " " " " " 0.4 V 5.5 V " " " " " " " " " " " " " " " " " VCC " GND GND GND GND " VCC 33 " -12 mA 4.5 V " " " " " " " 1A 1B 2A 2B 3A 3B 4A 4B -1.5 " " " " " " " V " " " " " " " " " " " " " " " 16 mA 16 mA -.8 mA GND 16 mA 16 mA -.8 mA GND -12 mA -12 mA -12 mA 0.4 " " " " " " " Unit 2.4 " " " -20 " " " -0.7 " " " " " " " -55 " " " 40 " " " " " " " 100 " " " " " " " -1.6 " " " " " " " 21 V " " " " mA " " " A " " " " " " " " " " " " " " " mA " " " " " " " " MIL-M-38510/16A 11 1 TC = 25C " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " Symbol TABLE III. Group A inspection for device type 01. - Continued. Terminal conditions (pins not designated are open) Subgroup MILSTD-883 method Cases A,B,C,D Test No. tPHL " " " tPLH " " " 3003 (Fig 5) " " " " " " tPHL " " " tPLH " " " tPHL " " " tPLH " " " 1 2 3 1A 1B 1Y 51 52 53 54 55 56 57 58 IN 2.4 V OUT " " " " " " " " 59 60 61 62 63 64 65 66 IN " " " " " " " " 67 68 69 70 71 72 73 74 IN IN 2.4 V 4 2B 2Y IN 2.4 V OUT OUT 2.4 V 2.4 V 2.4 V OUT 2.4 V OUT OUT IN IN OUT OUT IN 2.4 V 2.4 V OUT IN IN 6 2A IN 2.4 V 5 2.4 V OUT OUT IN 2.4 V OUT 7 GND GND " " " " " " " " " " " " " " " " " " " " " " " 8 3Y OUT OUT OUT OUT OUT OUT 9 3A IN IN IN IN IN IN 10 3B 11 4Y 12 4A 13 4B 2.4 V OUT IN 2.4 V OUT IN 2.4 V 2.4 V 2.4 V OUT IN 2.4 V OUT IN 2.4 V 2.4 V 2.4 V OUT IN 2.4 V OUT IN 2.4 V 2.4 V Meas. terminal Min Test limits Max Unit 5.0 V " " " " " " " 1A to 1Y 2A to 2Y 3A to 3Y 4A to 4Y 1A to 1Y 2A to 2Y 3A to 3Y 4A to 4Y 3 " " " " " " " 25 " " " 31 " " " ns " " " " " " " " " " " " " " " 1A to 1Y 2A to 2Y 3A to 3Y 4A to 4Y 1A to 1Y 2A to 2Y 3A to 3Y 4A to 4Y " " " " " " " " 32 " " " 40 " " " " " " " " " " " " " " " " " " " 1A to 1Y 2A to 2Y 3A to 3Y 4A to 4Y 1A to 1Y 2A to 2Y 3A to 3Y 4A to 4Y " " " " " " " " 32 " " " 40 " " " " " " " " " " " 14 VCC MIL-M-38510/16A 12 9 TC = 25C " " " " " " 10 TC = 125C " " " " " " 11 TC = -55C " " " " " " Symbol TABLE III. Group A inspection for device type 02. Terminal conditions (pins not designated are open) Subgroup MILSTD-883 method Cases A,B,C,D Test No. 1A 1B 1Y 2A 2B VOL " " " " " " " ICEX " " " 3007 " " " " " " " 1 2 3 4 5 6 7 8 9 10 11 12 0.8 V 5.5 V " " " " " " 2.0 V 5.5 V " " 5.5 V 0.8 V 5.5 V " " " " " 2.0 V 5.5 V " " 16 mA 16 mA 5.5 V 5.5 V 0.8 V 5.5 V " " " " " 2.0 V 5.5 V 5.5 V 5.5 V " " 0.8 V 5.5 V " " " " 2.0 V 5.5 V 5.5 V IIH1 " " " " " " " IIH2 " " " " " " " IIL " " " " " " " ICCL 3010 " " " " " " " " " " " " " " " 3009 " " " " " " " 3005 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 2.4 V GND " " " " " " 5.5 V GND " " " " " " 0.4 V 5.5 V " " " " " " GND GND 2.4 V GND " " " " " " 5.5 V GND " " " " " 5.5 V 0.4 V 5.5 V " " " " " GND GND GND 2.4 V GND " " " " " " 5.5 V GND " " " " 5.5 V 5.5 V 0.4 V 5.5 V " " " " GND GND " " 2.4 V GND " " " " " " 5.5 V GND " " " 5.5 V " " 0.4 V 5.5 V " " " GND ICCH 3005 38 5.5 V 5.5 V 5.5 V 5.5 V 39 40 41 42 43 44 45 46 -12 mA VIC " " " " " " " 1 2 3 5.5 V 4 5 6 2Y 16 mA 16 mA 5.5 V -12 mA -12 mA -12 mA 2 Same tests, terminal conditions and limits as subgroup 1, except TC = 125C and VIC tests are omitted. 3 Same tests, terminal conditions and limits as subgroup 1, except TC = -55C and VIC tests are omitted. 7 GND 8 10 3A 3B 5.5 V " " " 0.8 V 5.5 V " " " " 2.0 V 5.5 V 5.5 V " " " " 0.8 V 5.5 V " " " 2.0 V 5.5 V " " " " " " " " " " " " " " " " " " " " " " " " " GND " " " 2.4 V GND " " " " " " 5.5 V GND " " 5.5 V " " " 0.4 V 5.5 V " " GND " 5.5 V GND " " " " " " " " " " " " " " " " " " " 3Y 9 16 mA 16 mA 5.5 V 11 4Y 12 13 14 Meas. terminal Min Test limits Max Unit 4A 4B VCC 5.5 V " " " " " 0.8 V 5.5 V " " " 2.0 V 5.5 V " " " " " " 0.8 V 5.5 V " " 2.0 V 4.5 V " " " " " " " " " " " 1Y 1Y 2Y 2Y 3Y 3Y 4Y 4Y 1Y 2Y 3Y 4Y 0.4 " " " " " " " 250 " " " GND " " " " 2.4 V GND " " " " " " 5.5 V GND GND 5.5 V " " " " 0.4 V 5.5 V " GND GND " " " " " 2.4 V GND " " " " " " 5.5 V GND 5.5 V " " " " " 0.4 V 5.5 V GND GND " " " " " " 2.4 V " " " " " " " 5.5 V 5.5 V " " " " " " 0.4 V GND 5.5 V " " " " " " " " " " " " " " " " " " " " " " " " 1A 1B 2A 2B 3A 3B 4A 4B 1A 1B 2A 2B 3A 3B 4A 4B 1A 1B 2A 2B 3A 3B 4A 4B VCC 40 " " " " " " " 100 " " " " " " " -1.6 " " " " " " " 33 5.5 V 5.5 V 5.5 V " VCC 21 " -12 mA 4.5 V " " " " " " " 1A 1B 2A 2B 3A 3B 4A 4B -1.5 " " " " " " " V " " " " " " " 16 mA 16 mA 5.5 V -12 mA -12 mA -12 mA -0.7 " " " " " " " V " " " " " " " A " " " " " " " " " " " " " " " " " " " mA " " " " " " " " MIL-M-38510/16A 13 1 TC = 25C " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " Symbol TABLE III. Group A inspection for device type 02. - Continued. Terminal conditions (pins not designated are open) Subgroup MILSTD-883 method Cases A,B,C,D Test No. 3003 (Fig 5) 1 2 3 1A 1B 1Y 47 48 49 50 51 52 53 54 IN 2.4 V OUT tPHL " " " tPLH " " " 55 56 57 58 59 60 61 62 IN tPHL " " " tPLH " " " 63 64 65 66 67 68 69 70 IN tPHL " " " tPLH " " " IN 2.4 V 4 2B 2Y IN 2.4 V OUT OUT 2.4 V 2.4 V 2.4 V OUT 2.4 V OUT OUT IN IN OUT OUT IN 2.4 V 2.4 V OUT IN IN 6 2A IN 2.4 V 5 2.4 V OUT OUT IN 2.4 V OUT 7 GND GND " " " " " " " " " " " " " " " " " " " " " " " 8 3Y OUT OUT OUT OUT OUT OUT 9 3A IN IN IN IN IN IN 10 3B 11 4Y 12 4A 13 4B 2.4 V OUT IN 2.4 V OUT IN 2.4 V 2.4 V 2.4 V OUT IN 2.4 V OUT IN 2.4 V 2.4 V 2.4 V OUT IN 2.4 V OUT IN 2.4 V 2.4 V Meas. terminal Min Test limits Max Unit 5.0 V " " " " " " " 1A to 1Y 2A to 2Y 3A to 3Y 4A to 4Y 1A to 1Y 2A to 2Y 3A to 3Y 4A to 4Y 3 " " " " " " " 33 " " " 39 " " " ns " " " " " " " " " " " " " " " 1A to 1Y 2A to 2Y 3A to 3Y 4A to 4Y 1A to 1Y 2A to 2Y 3A to 3Y 4A to 4Y " " " " " " " " 38 " " " 49 " " " " " " " " " " " " " " " " " " " 1A to 1Y 2A to 2Y 3A to 3Y 4A to 4Y 1A to 1Y 2A to 2Y 3A to 3Y 4A to 4Y " " " " " " " " 38 " " " 49 " " " " " " " " " " " 14 VCC MIL-M-38510/16A 14 9 TC = 25C " " " " " " 10 TC = 125C " " " " " " 11 TC = -55C " " " " " " Symbol MIL-M-38510/16A 5. PACKAGING 5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Service or Defense Agency, or within the military service's system command. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but it is not mandatory) 6.1 Intended use. Microcircuits conforming to this specification are intended for logistic support of existing equipment. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Title, number, and date of the specification. b. PIN and compliance identifier, if applicable (see 1.2). c. Requirements for delivery of one copy of the conformance inspection data pertinent to the device inspection lot to be supplied with each shipment by the device manufacturer, if applicable. d. Requirement for certificate of compliance, if applicable. e. Requirements for notification of change of product or process to acquiring activity in addition to notification to the qualifying activity, if applicable. f. Requirements for failure analysis (including required test condition of method 5003), corrective action and reporting of results, if applicable. g. Requirements for product assurance options. h. Requirements for carriers, special lead lengths or lead forming, if applicable. These requirements shall not affect the part number. Unless otherwise specified, these requirements will not apply to direct purchase by or direct shipment to the Government. i. Requirements for "JAN" marking. j. Packaging requirements (see 5.1). 6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199. 6.4 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists. 15 MIL-M-38510/16A 6.5 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331, and as follows: GND .................................................. Electrical ground (common terminal) VIN ..................................................... Voltage level at an input terminal VIC ..................................................... Input clamp voltage IIN ...................................................... Current-flowing into an input terminal 6.6 Logistic support. Lead materials and finishes (see 3.3) are interchangeable. Unless otherwise specified, microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material and finish A (see 3.4). Longer lead lengths and lead forming shall not affect the part number. 6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry microcircuit types may not have equivalent operational performance characteristics across military temperature ranges or reliability factors equivalent to MIL-M-35810 device types and may have slight physical variations in relation to case size. The presence of this information should not be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535. Device type 01 02 Commercial type 5408 5409 6.8 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. Custodians: Army - CR Navy - EC Air Force - 11 DLA - CC Preparing activity: DLA - CC (Project 5962-2105) Review activities: Army - MI, SM Navy - AS, CG, MC, SH, TD Air Force - 03, 19, 99 NOTE: The activities listed above were interested in this document as of the date of this document. Since organizations and responsibilities can change, you should verify the currency of the information above using the ASSIST Online database at http://assist.daps.dla.mil. 16