SXP3101SV - Sumitomo Electric - Datasheet.Directory

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 1

10Gb/s XFP Optical Transceiver Module

SXP3101SV

(IR-2/S-64.2b, 10GBASE-ER/EW, 1550nm EML, PIN-PD)

Features

u 10Gb/s Serial Optical Interface

Ø High quality and reliability optical device and

sub-assemblies

Ø 1550nm EML laser for up to 40km operation

single mode fiber

Ø High sensitivity PIN photodiode and TIA

u XFP MSA Revision 4.0 Compliant

Ø Easy supply management for hot pluggability

Ø Duplex LC Receptacle

Ø XFP Mechanical Interface

with color coded

bail latch for easy removal (Bail color: Red)

Ø XFI High Speed Electrical Interface

Ø 2-wire interface for management and diagnostic

monitoring

Ø Tx_Disable and Rx_LOS functions

u Multi-Protocol

Ø SONET OC-192/SDH STM-64

Ø IEEE802.3ae 10 Gigabit Ethernet

u Low Power Consumption

Ø +3.3V, +5.0V Power Supplies

Ø Power consumption less than 3.5W

Applications

u SONET(OC-192)/SDH(STM64) line card

u 10GE Ethernet switches and routers

u 10GE Core-routers

u 10GE Storage

u Other high speed data connections

SXP3101

(XFP) SER

DES

Framer/Mapper

Ethernet MAC

FC Controlller

SXP3101

(XFP)

SER

DES

Framer/Mapper

Ethernet MAC

FC Controlller

Application Block Diagram

10Gb/s optical signal

10Gb/s XFI

electrical signal 10Gb/s XFI

electrical signal

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 2

1. General Description

The SXP3101SV is a very compact 10Gb/s optical transceiver module for serial optical

communication applications at 10Gb/s. The SXP3101SV converts a 10Gb/s serial

electrical data stream to 10Gb/s optical output signal and a 10Gb/s optical input signal to

10Gb/s serial electrical data streams. The high speed 10Gb/s electrical interface is fully

compliant with XFI specification.

The SXP3101SV is designed for use in a variety of 10Gb/s SONET/SDH equipment

including FEC (9.95Gb/s to 10.7Gb/s) as well as Ethernet LAN (10.3Gb/s) and WAN

(9.95Gb/s) applications. The high performance cooled 1550nm EML transmitter and high

sensitivity PIN receiver provide superior performance for SONET /SDH and Ethernet

applications at up to 40km links.

The fully XFP compliant form factor provides hot pluggability, easy optical port upgrades

and low EMI emission.

2. Functional Description

The SXP3101SV contains a duplex LC connector for the optical interface and a 30-pin

connector for the electrical interface. Figure 2.1 shows the functional block diagram of

SXP3101SV XFP Transceiver.

Transmitter Operation

The transceiver module receives 10Gb/s electrical data and transmits the data as an

optical signal. The transmitter contains a Clock Data Recovery (CDR) circuit that reduces

the jitter of received signal and reshapes the electrical signal before the electrical to optical

(E-O) conversion. The optical output power is maintained constant by an automatic power

control (APC) circuit. The transmitter output can be turned off by TX disable signal, at

TX_DIS pin. When TX_DIS is asserted High, the transmitter is turned off.

Receiver Operation

The received optical signal is converted to serial electrical data signal. The optical

receiver contains a CDR circuits that reshapes and retimes an electrical signal before

sending out to the XFI channel (i.e. XFP connector and high speed signal traces).

The RX_LOS signal indicates insufficient optical power for reliable signal reception at the

receiver.

Management Interface

A 2-wire interface (SCL, SDA) is used for serial ID, digital diagnostics and other control

/monitor functions. The address of XFP transceiver is 1010000x. MOD_DESEL signal can

be used in order to support multiple XFP modules on the same 2-wire interface bus.

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 3

Figure 2.1. Functional Block Diagram

3. Package Dimensions

Figure 3.1 shows the package dimensions of SXP3101SV. SXP3101SV is designed to

be complaint with XFP MSA specification. Package dimensions are specified in section 6.3

of the XFP MSA specification Rev. 4.0.

* Bail color is Red. Unit : mm

Figure 3.1. Package Dimensions

TOSA

Driver

System

ROSA

with TIA

Bias Control

Circuit

Current

Monitor

TDP/TDN

RDP/RDN

MOD-DESEL

SCL

SDA

RX_LOS

Rx Power, LOS

Tx Power,Tx Bias

I2C Clock

I2C Data

Optical Output

Optical Input

Signal Conditioner

with LIA

TX_DIS

INTb

MOD_NR

100ohm

REFCLKP

REFCLKN

P_DOWN /RST

MOD_Abs

Signal

Conditioner

TEC

Control

VCC5

VCC3 5.0V

3.3VSXP3101SV

TOSA

Driver

System

ROSA

with TIA

Bias Control

Circuit

Current

Monitor

TDP/TDN

RDP/RDN

MOD-DESEL

SCL

SDA

RX_LOS

Rx Power, LOS

Tx Power,Tx Bias

I2C Clock

I2C Data

Optical Output

Optical Input

Signal Conditioner

with LIA

TX_DIS

INTb

MOD_NR

100ohm

REFCLKP

REFCLKN

P_DOWN /RST

MOD_Abs

Signal

Conditioner

TEC

Control

VCC5

VCC3 5.0V

3.3VSXP3101SV

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 4

4. Pin Assignment and Pin Description

4.1. XFP Transceiver Electrical Pad Layout

Figure 4.1 XFP Transceiver Electrical Pad Layout

4.2. Host PCB XFP Pinout

Figure 4.2 Host PCB XFP Pinout

GND 30

1GND TDP 29

2VEE5 (not in use) TDN 28

3Mod_DESEL GND 27

4INTERRUPTb GND 26

5TX_DIS REFCLKP 25

6VCC5 REFCLKN 24

7GND GND 23

8VCC3 VCC2 (not in use) 22

9VCC3 P_DOWN/RST 21

10 SCL VCC2 (not in use) 20

11 SDA GND 19

12 MOD_ABS RDP 18

13 MOD_NR RDN 17

14 RX_LOS GND 16

15 GND

Toward Bezel

HOST PCB Top View

1GND 30 GND

2VEE5 (not in use) 29 TDP

3Mod_DESEL 28 TDN

4INTERRUPTb 27 GND

5TX_DIS 26 GND

6VCC5 25 REFCLKN

7GND 24 REFCLKP

8VCC3 23 GND

9VCC3 22 VCC2 (not in use)

10 SCL 21 P_DOWN/RST

11 SDA 20 VCC2 (not in use)

12 MOD_ABS 19 GND

13 MOD_NR 18 RDP

14 RX_LOS 17 RDN

15 GND 16 GND

Toward Bezel

Bottom of XFP PCB

(as view hrough top of PCB) Top of XFP PCB

(Top View)

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 5

4.3. Pin Descriptions Table 4.3 Pin Description

Pin#

Name Logic Description Note

1 GND LVTTL-I

Module Ground 1

2 VEE5 -5.2V Power Supply; not in use 3

3 MOD_DESEL

LVTTL-I

Module De-

select; When held Low allows module to

respond to 2-wire serial interface

4 INTERRUPTb

LVTTL-O

Indica

tes presence of an important condition, which can

be read over the 2-

wire serial interface. This pin is an

open collector output and must be pulled up to host_Vcc

on the host board.

5 TX_DIS LVTTL-I

Transmitter

Disable; When asserted High, transmitter

output is turned off. This pin is pulled up to VCC3 in the

module

6 VCC5 +5V Power Supply

7 GND Module Ground 1

8 VCC3 +3.3V Power Supply

9 VCC3 +3.3V Power Supply

SCL I/O 2-wire serial interface clock. Host shall use a pull-

resistor connected to host_Vcc of +3.3V. 2

11 SDA I/O 2-wire serial interface data. Host shall use a pull-

resistor connected to host_Vcc of +3.3V. 2

MOD_ABS LVTTL-O

Indicates Module is not present. Host shall pull up this

pin, and grounded in the module. "

High" when the XFP

module is absent from a host board.

MOD_NR LVTTL-O

Module not ready; When High, Indicates Module

Operational Fault. This pin is an open col

lector and

must be pulled to host_Vcc on the host board.

RX_LOS LVTTL-O

Receiver Loss

of Signal; When high, indicates insufficient

optical input power to the module. This pin is an open

col

lector and must be pulled to host_Vcc on the host

board.

GND Module Ground

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 6

Pin#

Name Logic Description Note

GND Module Ground

RDN CML-O

Receiver Inverted Data Output; AC coupled inside the

module.

RDP CML-O Receiver Non-

Inverted Data Output; AC coupled in side

the module.

GND Module Ground 1

VCC2 +1.8V Power Supply; not in use 3

P_DOWN/RST

LVTTL-I

Power down; Whe

n High, module is limited power mode.

Low for normal operation.

Reset; The falling edge indicates complete reset of the

module. This pin is pulled up to VCC3 in the module.

VCC2 +1.8V Power Supply; not in use 3

GND Module Ground 1

REFCLKP PECL-I Reference clock Non-Inverted Input; not in use

REFCLKN PECL-I Reference clock Inverted Input; not in use

GND Module Ground 1

TDN CML-I

Transmitter Inverted Data Input; AC coupled in side the

module.

TDP CML-I

Transmitter Inverted Data Input; AC coupled in side the

module.

GND Module Ground 1

Note

1: Module ground pins are isolated from the module case and chassis ground within the module.

2: Shall be pulled up with 4.7k to 10k ohm to a voltage between 3.15V and 3.45V on the host board.

3: Not connected internally.

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 7

5. Absolute Maximum Ratings and Recommended Operating Conditions

Table 5.1. Absolute Maximum Ratings

Parameter

Symbol

Min

Max

Unit

Note

Strage Temperature

Tst

-40

degC

Relative Humidity (non-condensation)

Operating Case Temperature

Topc

-5

degC

Short-term operating case temperature

Top-short

-10

degC

Supply Voltage

VCC5

-0.3

6.0

Supply Voltage

VCC3

-0.5

3.6

Voltage on LVTTL Input

Vilvttl

-0.5

VCC3+0.5

LVTTL Output Current

Iolvttl

Voltage on Open Collector Output Voco 0 6 V

Receiver Input Optical Power Mip 3dBm 3

Note:

1: Ta: -10 to 60degC with 1.5m/s airflow with an additional heat sink.

2: Performance is not guaranteed. The short term temperature range will not occur

continuously, but only during a period of maximum 15 days per year of which 4 days

maximum continuously.

3: PIN Receiver

Table 5.2. Recommended Operating Conditions and Supply Requirements

Parameter Symbol Min Max Unit Note

Operating Case Temperature Topc -5 70 degC

Relative Humidity (non-condensing) Rhop 85 %

Power Supply Voltage VCC5 4.75 5.25 V

Power Supply Voltage VCC3 3.135 3.465 V

Power Supply Current ICC5 500 mA

Power Supply Current

ICC3

750

Total Power Consumption

3.5

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 8

6. Electrical Interface

6.1. High Speed Electrical Interface

XFI Application Reference model

Figure 6.1.1 shows the high speed electrical interface (XFI) compliance points.

XFI electrical interface is specified for each compliance point in Chapter 3 of the XFP MSA

specification.

Figure 6.1.1 XFI Application Reference Model

XFI Module Transmitter Input Electrical Interface Specification at B’

Table 6.1.1 XFI Transmitter Input Electrical Specification at B’

Note

1: 0.05-0.1 GHz

2: 0.1-5.5GHz

3: 5.5-12GHz, SDD11(dB)=8-20.66Log10(f/5.5), with f in GHz

4: 0.1-15GHz

5: Eye Mask is defined in Figure 6.1.2

C' C

B' BCapacitors

XFP Connector

ASIC/

SERDES

Receiver

Transmitter

O/E

E/O

XFP Module

Parameter -B'

symbol

Min

Typ

Max

Units

Note

Reference differential Input Impedance Zd 100 Ohm

Termination Mismatch dZm 5%

Input AC Common mode Voltage 25 mV(RMS)

20 dB 1

Differential Input Return Loss SDD11 8dB 2

See 3 3

Comon Mode Input Return Loss SCC11 3dB 4

Differential to Common Mode Conversion SCD11 10 dB 4

Total Input Non-DDJ Jitter TJtnd 0.41 UIp-p

Total Input Jitter TJ 0.61 UIp-p

Input Jitter for ITU-T 20kHz-80MHz Gjin1 150 mUIp-p

Input Jitter for ITU-T 4MHz-80MHz Gjin2 50 mUIp-p

X1 0.305 UI

Eye Mask Y1 60 mV 5

Y2 410 mV

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 9

XFI Module Receiver Output Electrical Interface Specification at C’

Table 6.1.2 XFI Receiver Output Electrical Specification at C’

Note

1: 0.05-0.1 GHz

2: 0.1-5.5GHz

3: 5.5-12GHz, SDD11(dB)=8-20.66Log10(f/5.5), with f in GHz

4: 0.1-15GHz

5: Eye Mask is defined in Figure 6.1.3

Figure 6.1.2 Tranmitter Input Eye Mask Figure 6.1.3 Receiver Output Eye Mask

Parameter -C'

symbol

Min

Typ

Max

Units

Note

Reference differential Output Impedance Zd 100 Ohm

Termination Mismatch dZm 5%

Output AC Common mode Voltage 15 mV(RMS)

Output Rise and Fall time (20%-80%) trh, tfh 24 ps

20 dB 1

Differential Output Return Loss SDD22 8dB 2

See 3 3

Comon Mode Input Return Loss SCC22 3dB 4

Determinstic Jitter TJtnd 0.18 UIp-p

Total Jitter TJ 0.34 UIp-p

X1 0.17 UI

Eye Mask X2 0.42 UI 5

Y1 170 mV

Y2 425 mV

-Y2

-Y1

X1 1-X101.0 X2 1-X201.0X1 1-X1

-Y2

-Y1

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 10

XFI Reference Clock Specification

Note that the reference clock is not needed for SXP3101SV. The differential reference

clock signals if used are internally terminated across a 100Ohm resistance as shown in

Figure 2.1.

6. CDR Specification

Transmitter CDR Table 6.1 Transmitter CDR Specification

Note

1: In order to meet SONET/SDH jitter transfer requirement, de-jitter PLL will be needed on

the host board SerDes.

2: Frequency < 120kHz

3: Frequency > 120kHz

Receiver CDR

Table 6.2 Receiver CDR Specification

Note

1: Frequency < 120kHz

2: Frequency > 120kHz

Parameter symbol Min Typ Max Units Note

Jitter Transfer Bandwidth BW 8MHz 1

Jitter Transfer Peaking Jp1 0.1 dB 2

Jp2

Parameter symbol Min Typ Max Units Note

Jitter Transfer Bandwidth BW 8MHz

Jitter Transfer Peaking Jp1 0.1 dB 1

Jp2

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 11

Table 6.3.1 Low Speed Control and Alarm Signals Electrical Interface

Note

1: Pull-up resistor must be connected to host_Vcc on the host board. Iol(max)=3mA

2: Pull-up resistor must be connected to host_Vcc on the host board.

3: Pull-up resistor connected to VCC3 within XFP module. Iil(max)= -10µA.

4: Pull-up resistor connected to VCC3 within XFP module. Iih(max)= 10µA.

5: Pull-up resistor must be connected to host_Vcc on the host board. Iol(max)= -10µA.

6: Pull-up resistor must be connected to host_Vcc on the host board. Iol(max)= 10µA.

7: at 400KHz, 3.0kohms, at 100kHz 8.0kohms max

8: at 400KHz, 0.8kohms, at 100kHz 2.0kohms max

Parameter

symbol

Min

Typ

Max

Units

Note

Vol 0.0 0.4 1

Voh Vcc-0.5 Vcc+0.3 2

Vil -0.3 0.8 3

Vih 2.0 VCC3+0.3 4

Vol 0.0 0.4 1

Voh Vcc-0.5 Vcc+0.3 2

Vil -0.3 VCC3*0.3 5

Vih VCC3*0.7 VCC3+0.5 6

Capacitance for XFP SCL and SDA I/O pin Ci 14 pF

100 pF 7

400 pF 8

Total bus capacitive load for SCL and SDA

XFP Interrupt, Mod_NR, RX_LOS

XFP TX_DIS, P_DOWN/RST

XFP SCL and SDA Output

XFP SCL and SDA Input

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 12

7. Optical Interface

Table 7.1 Optical Interface

Note

1: Data rate tolerance

IR-2/S-64.2b, 10GBASE-EW : typ.+/-20ppm

10GBASE-ER : typ.+/-100ppm

2: Measured at 9.95328Gbps, Framed PRBS2^31-1, NRZ

3: Measured at 10.3125Gbps, Non-framed PRBS2^31-1, NRZ

4: When there is no applied jitter on electrical input to the module

Transmitter Optical Interface

Parameter Symbol Min. Typ. Max. Unit Note

Operating Data Rate -9.95 10.75 Gb/s 1

Output Center Wavelength ltc 1530 1550 1565 nm

Spectral Width dl 1nm

SMSR SMSR 30 -dB

Average Output Power Po -1 2dBm 2

Disabled Power Poff -30 dBm 2

Extinction Ratio ER 8.2 -dB 2

Optical Modulation Amplitude (10G Ethernet) OMA -1.7 dBm 3

Transmitter and dispersion penalty (10G Ethernet) TDP 3.0 dB 3

OMA-TDP (10G Ethernet) OMAtdp -2.1 dBm 3

Eye Mask 1 (SONET/SDH) GR-253-CORE/ITU-T G.691 2

Eye Mask 2 (10G Ethernet) 3

Generation Jitter 1 (20kHz - 80MHz) 0.15 UIp-p 2, 4

Generation Jitter 2 (50kHz - 80MHz) 0.10 UIp-p 2, 4

Generation Jitter 3 (4MHz - 80MHz) 0.05 UIp-p 2, 4

RIN RIN -128 dB/Hz

Receiver Optical Interface

Parameter Symbol Min. Typ. Max. Unit Note

Operating Data Rate -9.95 10.75 Gb/s 1

Input Center Wavelength lrc 1260 1565 nm

Overload Rovl 0.5 -dBm

Minimum Sensitivity Pmin --14 dBm 2

Sensitivity in OMA OMAo -14.1 dBm

Stressed Sensitivity in OMA OMAst -11.3 dBm

RX_LOS Assert Level RLOSa -23 -19 dBm

RX_LOS Deassert Level RLOSd -18 dBm

RX_LOS Hysteresis RLOSh 0.5 3dB

Optical Path Penalty PN -2dB 2

Optical Return Loss ORL 27 -dB

Jitter Tolerance JTL GR-253-CORE/ITU-T G.783

IEEE802.3ae

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 13

8. Electrical and Optical I/O Signal Relationship

Table.8.1 Electrical Input Signal vs. Optical Output Signal

TDP TDN

High Low ON (High)

Low High OFF (Low)

High High OFF (Low)

Low Low OFF (Low)

Input Signal Optical Output Signal

Table.8.2 TX_DIS vs. Optical Output Power

TX_DIS Optical Output Power

Low (VIL=-0.3 to 0.8V) Enabled

High (VIH =2.0 to VCC3+0.3V) Disabled (<-30dBm)

Figure.8.1 Optical Input Power vs. RX_LOS

RX_LOS [V]

Optical Input Power

[dBm]

Vol

Voh

RXLOSdRXLOSa

RX_LOS [V]

Optical Input Power

[dBm]

Vol

Voh

RXLOSdRXLOSa

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 14

9. User Interface

9.1. XFP Mechanical Interface

XFP Mechanical Interface is specified in the Chapter 6 in the XFP MSA specification.

XFP Mechanical Components

Figure 8.1 shows the XFP transceiver concept and mechanical components.

Figure 9.1 XFP Mechanical Interface Concept and Components

XFP Host board Mechanical Layout

XFP Host Board Layout is specified in the Figure 35 of the XFP MSA specification (Rev.

4.0).

Host Board XFP Connector Footprint and Layout

Host board XFP connector layout is specified in the Figure 36 of the XFP MSA

Specification (Rev. 4.0).

XFP Datum Alignment and Bezel Design

XFP datum alignment (depth) is specified in the Figure 30 of the XFP MSA specification

(Rev. 4.0).

The recommended bezel design is specified in the Figure 37 of the XFP MSA specification

(Rev. 4.0).

XFP Connector and XFP Cage Assembly

The XFP 30-contact connector mechanical specification is shown in Figure 39 of the XFP

MSA specification (Rev. 4.0)

The XFP Cage Assembly mechanical specification is shown in the Figure 41 of the XFP

MSA specification (Rev. 4.0).

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 15

9.2. Management Interface

XFP 2-Wire Serial Interface Protocol

XFP 2-wire serial interface is specified in the Chapter 4 of the XFP MSA specification.

The XFP 2-wire serial interface is used for serial ID, digital diagnostics, and certain control

functions. The 2-wire serial interface is mandatory for all XFP modules. The 2-wire serial

interface address of the XFP module is 1010000X(A0h). In order to access to multiple

modules on the same 2-wire serial bus, the XFP has a MOD_DESEL (module deselect

pin). This pin (which is pull high or deselected in the module) must be held low by the host

to select of interest and allow communication over 2-wire serial interface. The module must

not respond to or accept 2-wire serial bus instructions unless it is selected.

XFP Management Interface

XFP Managed interface is specified in the Chapter 5 of the XFP MSA specification.

Figure 8.2 shows the structure of the memory map. The normal 256 Byte address space is

divided into lower and upper blocks of 128 Bytes. The lower block of 128 Byte is always

directly available and is used for the diagnostics and control functions that must be

accessed repeatedly. Multiple blocks of memories are available in the upper 128 Bytes of

the address space. These are individually addressed through a table select Byte which the

user enters into a location in the lower address space. The upper address space tables are

used for less frequently accessed functions and control space for future standards

definition.

Figure 9.2 2-wire Serial Interface Memory Map

Digital

Diagnostic

functions

4 Btyte Password Change

Page Select Byte Entry

4 Btyte Password Entry

User

EEPROM

Data

(not protected)

Reserved

for Future

Diagnostic

Functions

Vendor

Specific

Functions Reserved

128-

255

128-

255

128-

255

128-

255

128-

255

118

119-122

123-126

127

Table 00h Table 01h Table 02h Table 03h-7Fh Table 80h-FFh

XFP MSA

Serial ID

Data

Vendor

Specific

ID Data

223

224

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 16

9.3. A/D Accuracy and Values

Table 9.3.1 A/D Accuracy

Data Address Parameter Accuracy Relative

accuracy

Units Display Note

96-97 Temperature +/-3degC NA Signed 2's complement

integer degC Junction temperature of

monitoring IC.

98-99

100-101 Tx Bias +/-10% NA ×2µA Specified by nominal value

102-103 Tx Power +/-2dB@BOL (Note1)

(Range: -1 to +2dBm

+/-1dB

(Note2)

×0.1µW Average Power

104-105 Rx Power +/-2dB@BOL (Note1)

(Range: -16 to

+0.5dBm)

+/-1dB

(Note2) ×0.1µW At specified transmitter

wavelength.

106-107 Vcc +/-3% NA ×100µV 3.3V Only

Reserved

Table 9.3.2 A/D Values

Byte Bit Name

Description

96 All Temperature MSB Signed 2's complement integer temperature (-40 to

+125degC) based on internal temperature measurement

97 All Temperature LSB

Fractional part of temperature(count/256)

98-99 All

Reserved

100 All Tx Bias MSB

101 All Tx Bias LSB

102 All Tx Power MSB

103 All Tx Power LSB

104 All Rx Power MSB

105 All Rx Power LSB

106 All Vcc MSB

107 All Vcc LSB

108 All AUX 2 MSB

109 All AUX 2 LSB TBD

Measured Laser Bias Current in mA. Bias current is full 16

bit value *2µA. (Full range of 0 to 131mA)

Measured Tx output power in mW. Tx power is full 16 bit

value *0.1µW. (Full range of -40 to +8.2dBm)

Measured Rx input power in mW. Tx power is full 16 bit

value *0.1µW. (Full range of -40 to +8.2dBm)

Internally measured transceiver supply voltage. Vcc is full

16 bit value*100µV. (Full range of 0 to +6.55 Volts)

Note1. Over specified temperature and voltage

Note2. Over specified temperature and voltage range over the life of the product into a fixed measurement

system

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 17

9.4. Serial ID Memory Map (Data Field – Page 01h)

Address Size

(Bytes) Name Hex ASC Description Address Size

(Bytes) Name Hex ASC Description

128 1Identifier 06 XFP module 192 AF 3.5W

3.5W Max 193 96 1.5W (Note3)

With CDR 194 A8 500mA/800mA

130 1Connector 07 LC Connector 195 00 (Note4)

131 22 10GBASE-ER/EW 196

132 00 197

133 00 198

134 00 199

135 00 200

136 20 S-64.2b 201

137 00 202

138 00 203

139 1Encoding B0 64B/66B, SONET Scrambled, NRZ 204

140 1BR-Min 64 9.95Gbps 205

141 1BR-Max 6C 10.75Gbps 206

142 1Length (SMF)-km 28 40km 207

143 1Length (E-50 µm) 00 208

144 1Length (50 µm) 00 209

145 1Length (62.5 µm) 00 210

146 1Length (Copper) 00 211

147 1Device Tech 74 212

148 53 S213

149 75 u 214

150 6D m215

151 69 i216

152 74 t217

153 6F o 218

154 6D m219

155 6F oNo BER Support

156 45 EAverage Power

157 6C lOptional Soft TX_Disable

158 65 eOptional Soft P_down

159 63 c222 1 Aux Monitoring 70 +3.3V Support Voltage

160 74 t223 1 CC_EXT Note7

161 72 r

162 69 i224

163 63 c225

164 1CDR Support F0 226

165 00 227

166 00 228

167 5F 229

168 53 S230

169 58 X231

170 50 P232

171 33 3 233

172 31 1 234

173 30 0 235

174 31 1 236

175 53 S237

176 56 V238

177 20 239

178 20 240

179 20 241

180 20 242

181 20 243

182 20 244

183 20 245

184 41 to 5A A to Z Variable 246

185 20 247

186 79 248

187 18 249

188 0F 250

189 A0 251

190 1Max Case Temp 46 70degC 252

191 1CC_BASE Note2 253

254

255

8Tranciver

16 Vendor name

221

220 1 Diagnostic Monitoring Type

1550nm @ RT

2Wavelength Tolerance +/-20nm (Note1)

Vendor rev

16 Vendor PN

Extended ID Field

4Power Supply

Base ID Filed

129 1Ext. Indentifier 90

2Wavelength

Lot

Note6

Vendor Specific ID Fileds

Date Code8

3Vendor OUI

60Enhanced Options1

Day

Month

Year

Vendor SN

Note1.The guaranteed +/- range of transmitter output wavelength under all normal operating conditions.

Note2. Address 191 is check sum of bytes 128 to 190.

Note3. Maximum total power dissipation in power down mode

Note4. +1.8V/-5.2V is not in use.

Note5. Address 196 to 211 Vendor Serial Number

Note6. Address 212 to 219 Date code

Note7. Address 223 is check sum of bytes 192 to 222.

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 18

9.5. Supply filter

Figure 9.5 Supply Filter

9.6. Recommended Electrical Interface

Figure 9.6 Recommended Electrical Interface

4.7uH

0.1uF 22uF 0.1uF

4.7uH

Host +3.3V

XFP Connector

XFP Module

0.1uF 22uF 0.1uF

Host +5.0V

0.1uF 22uF 0.1uF

4.7uH

Host +1.8V (not in use)

0.1uF 22uF 0.1uF

4.7uH

Host -5.2V (not in use)

Vcc5

Vcc3

Vcc2

Vee5

4.7uH

0.1uF 22uF 0.1uF

4.7uH

Host +3.3V

XFP Connector

XFP Module

0.1uF 22uF 0.1uF

Host +5.0V

0.1uF 22uF 0.1uF

4.7uH

Host +1.8V (not in use)

0.1uF 22uF 0.1uF

4.7uH

Host -5.2V (not in use)

Vcc5

Vcc3

Vcc2

Vee5

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 19

10. Qualification Testing

SXP3101SV 10Gb/s transceiver is qualified to Sumitomo Electric Industries internal design

and manufacturing standards. Telecordia GR-468-CORE reliability test standards, using

methods per MIL-STD-883 for mechanical integrity, endurance, moisture, flammability and

ESD thresholds, are followed.

11. Laser Safety Information

SXP3101SV OC-192 transceiver uses a semiconductor laser system that is classified as

Class 1 laser products per the Laser Safety requirements of FDA/CDRH, 21 CFR1040.10

and 1040.11. These products have also been tested and certified as Class 1 laser products

per IEC 60825-1 International standards.

Caution

_______________________________________________________________________________

If this product is used under conditions not recommended in the specification or is used with

unauthorized revision, the classification for laser product safety is invalid. Reclassify the product at

your responsibility and take appropriate safety measures.

_______________________________________________________________________________

12. Electromagnetic Compatibility (Pending)

EMI (Emission)

SXP3101SV is designed to meet FCC Class B limits for emissions and noise immunity per

CENELEC EN50 081 and 082 specifications.

RF Immunity

SXP3101SV has an immunity to operate when tested in accordance with IEC 61000-4-3

(80- 1000MHz, Test Level 3) and GR-1089.

Electrostatic Discharge (ESD) Immunity

SXP3101SV has an immunity against direct and indirect ESD when tested accordance

with IEC 61000-4-2.

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 20

13. Ordering Information

13.1. Part Numbering System

13.2. Evaluation Board Kit

For test purposes, Evaluation Board model number SK3101A and SP3101A may be

ordered to use with the SXP3101 Series transceivers.

SK3101A : SPX3101 XFP evaluation board

SP3101A : XFP 2-wire serial interface evaluation kit

13.3. Ordering Number Code

Table 13. SXP3101 Application Code

SXP3101SV 40km STD-SMF 1.55mm EML PIN S-64.2b IR-2

10GBASE-

ER/EW

O/E ITU-T

G.691 IEEE

802.3ae

Telecordia

GR-253

P/N Distance Fiber E/O

SXP 3101 SV

PREFIX Model Number

3101 Application Code

SV: SONET IR-2/SDH S-64.2b

10GBASE-ER/EW

TS-S04D168A

November, 2004

Preliminary Specification

SXP3101 Series Sumitomo Electric Industries, Ltd. Page 21

14. Contact Information

U.S.A.

ExceLight Communications, 4021 Stirrup Creek Drive, Suite 200 Durham, NC 27703

Tel. +1-919-361-1600 / Fax. +1-919-361-1619

E-mail: info@excelight.com

http://www.excelight.com

Europe

Sumitomo Electric Europe Ltd., 220, Centennial Park, Elstree, Herts, WD6 3SL, United

Kingdom

Tel. +44-208-953-8681

Fax. +44-208-207-5950

E-mail: photonics@sumielectric.com

http://www.sumielectric.com

Japan

Sumitomo Electric Industries, Ltd.

1, Taya-cho, Sakae-ku, Yokohama, 244-8588

Tel. +81-45-853-7154 / Fax. +81-45-851-1932

E-mail: product-info@ppd.sei.co.jp

http://www.sei.co.jp/Electro-optic/index.html