SI-8000HFE Application Note Chopper Type Switching Regulator IC SI-8000HFE/HD Series 3.2nd Edition February 2011 SANKEN ELECTRIC CO., LTD. SI-8000HFE/HD Contents 1. General Description 1-1 Features 3 1-2 Applications 3 1-3 Type 3 2-1 Package Information 4 2-2 Ratings 6 2-3 Circuit Diagram 7 3-1 PWM Output Voltage Control 8 3-2 Overcurrent Protection / Thermal Shutdown 9 2. Specification 3. Operational Description 4. Cautions 4-1 External Components 11 4-2 Pattern Design Notes 15 4-3 Operation Waveform Check 18 4-4 Power Supply Stability 19 4-5 Thermal Design (SI-8008HFE) 23 4-6 Thermal Design (SI-8008HD) 25 5-1 Soft Start 28 5-2 Output ON / OFF Control 29 5-3 Spike Noise Reduction 29 5-4 Reverse Bias Protection 30 6. Typical Characteristics 31 7. Terminology 33 5. Applications 2 SI-8000HFE/HD 1. General Description The SI-8008HFE is a chopper type switching regulator IC which is provided with various functions required for the buck switching regulator and protection functions. By using six external components, a highly efficient switching regulator can be composed. The SI-8008HD is a surface mounting (T0263-5) version of the SI-8008HFE. 1-1 Features - Compact size and large output current of 5.5 A The maximum output current of 5.5 A for the outline of TO220F class - High efficiency of 83% (VIN = 15V/IO = 3A) Heat dissipation is small due to high efficiency to allow for the downsizing of a heat sink. - Six external components The regulator can be composed of input / output capacitor, diode, coil and resistors of Vout setting. - Internal adjustment of output voltage and phase compensation having been done in production Troublesome adjustment of output voltage and phase compensation by means of external components is no longer required. - Reference oscillation by a built-in timing capacitor No external capacitor for setting the oscillation frequency is required. - Built-in functions for overcurrent and thermal shutdown A current limiting type protection circuit against overcurrent and overheat is built in. (automatic restoration type) - Soft start function (capable of ON/OFF output) By adding an external capacitor, it is possible to delay the rise speed of the output voltage. ON/OFF control of the output is also possible. - No insulation plate required No insulation plate is required, when it is fitted to the heat sink, because it is of full molding type. 1-2 Applications For on-board local power supplies, power supplies for OA equipment, stabilization of secondary output voltage of regulator and power supply for communication equipment 1-3 Type - Type: Semiconductor integrated circuits (monolithic IC) - Structure: Resin molding type (transfer molding) 3 SI-8000HFE/HD 2. Specification 2-1 Package Information Pin Assignment 1IN 2SW 3GND 4ADJ 5SS a. Type Number b. Lot Number 1st letter: Last digit of year 2nd letter: Month January to September by Arabic number 2.3 Products WeightApprox.2.3g External Terminal Processing Sn-3Ag-0.5Cu dip October by O November by N December by D 3rd and 4th letter: Day 01-31: Arabic Numerical The dimensions don't include the gate burr. ____ shows the dimensions measured at the top of lead. 4 INVI 4-[1.700.25] . OS . . . . N SSS.S ADJV SWOUT GND PIN assignments 5-0.800.10 1.50 Dp : 0.20 9.200.20 4.900.20 (15) 15.300.30 (0.50) (R0.30) 3-(R0.30) 4.500.20 PIN assignments 1. 2. SW 3. GND 4. ADJ 5. SS (3) (3) 2.000.10 (0.75) 9.900.20 15.300.30 06 2.54 0.30 (R0.30) 2.400.20 (3) +0.15 -0.10 +0.10 -0.05 0.10 1.30 (4.60) (0.40) 5-0.800.10 2x(R0.45) (4.40) (8.00) 4-[1.700.25] 9.200.20 (6.80) Notes: 1) Dimensions do not include molding burr. ) are shown 2) Figures in parentheses ( only for reference. 3) Figures in parentheses [ ] are dimensions after lead forming. 4) Backside bumps: 0.8 mm at maximum 5) Unit: mm (1.75) 10.000.20 SI-8000HFE/HD SI-8008HD (surface mount: TO263-5) Package Information Products Weight: Approx.1.48g 5 4.900.20 SI-8000HFE/HD 2-2 Ratings 2-2-1 Absolute Maximum Ratings Parameter Symbol Rating Unit Input Voltage VIN 43 *1 V Allowable Power Dissipation in Infinite Radiation Pd1 25 W Allowable Power Dissipation without Heat sink Pd2 1.72 W Junction Temperature Tjmax 150 *1 C Storage Temperature Tstg -40 ~ +150 C In the SI-8008HD, only allowable power dissipations are different from the above values. *1. Since the thermal shutdown is provided, it may be operated at Tj > 130C 2-2-2 Recommended Conditions Parameter Symbol SI-8008HFE/HD Unit DC Input Voltage VIN Vo+3v - 40 Output Current IO 0 - 5.5 A Junction Temperature in Operation Tjop -30 - +125 C *2 V *2. VIN = 4.5V or Vout +3V, whichever higher value is recommended. (Ta=25C, Vo=5V, R1=4.2k, R2=0.8k) 2-2-3 Electrical Characteristics Ratings Parameter Setting Reference Voltage Reference Voltage Temperature Coefficient Unit Test Condition Symbol VADJ MIN TYP MAX 0.784 0.800 0.816 VADJ/T V mV/C 0.1 VIN=15V, IO=1A VIN=15, IO=1A,Tc=0 100 Efficiency *3 83 % VIN=15V, IO=3A Operation Frequency fo 150 kHz VIN=15V, IO=3A Line Regulation VLine 60 80 mV VIN=10 - 30V, IO=3A Load Regulation VLoad 20 50 mV VIN=15V, IO=0.2 - 5.5A 6.5 7.5 A 0.5 V 30 A VIN=15VVSS=0V mA VIN=15VIO=0A A VIN=15V Overcurrent Protection Start Current IS 5.6 On/ Off Low Level Voltage VSSL Terminal *4 Flow-out Current at Low Level Voltage ISSL 10 Circuit Current in Non-operation 1 Iq 6 Circuit Current in Non-operation 2 Iq(off) 200 400 VIN=15V VSS=0V 6 SI-8000HFE/HD 2-3 Circuit Diagram 2-3-1 Internal Equivalent Circuit SI-8008HFE VIN 1 SW IN C1 5 C2 protection SS ON / OFF C3 VOUT Di Overcurrent Overcurren Protection PReg C4 L 2 Latch &and Latch&driver Driver Reset Reset R1 Oscillator Soft Start Oscillator Comparator Thermal Thermal Protection protection ADJ 4 Error amp. R1 Reference Reference Voltage voltage GND 3 2-3-2 Typical Connection Diagram 1 VIN IN SW C4 C1 SS 5 GND 3 ADJ 4 C1: 1500F L1 2 VO C3: around 0.1F R1 Di R2 C2 (only in use of soft start function) C4: 4.7F C3(Css) GND C2: 1000F GND [RPER11H475K5 (MURATA)] L1: 100H Di: FMB-G16L (Sanken products) 7 SI-8000HFE/HD 3. Operational Description 3-1 PWM Output Voltage Control The SI-8000HF series controls the output voltage by the PWM system and comprises PWM comparator, oscillator, error amplifier, reference voltage, output transistor drive circuit etc. For the input of the PWM comparator, the triangular wave output ( 150KHz) from the oscillator and the output of the error amplifier are given. The PWM comparator compares the oscillator output with the error amplifier output to control to turn on the switching transistor at the time when the error amplifier exceeds the error amplifier output. PWM Control Chopper Type Regulator Basic Configuration VOUT Switching Transistor VIN PWM Comparator D1 C2 Drive Circuit Error Amplifier Oscillator Reference Voltage The error amplifier output and oscillator output are compared by the PWM comparator to generate the rectangular wave signal and this signal is inputted into the drive circuit to drive the switching transistor. On the assumption that the output voltage commences to rise, the output of the error amplifier will drop, because the error amplifier is of inverting type. As the output of the error amplifier falls down, the time period during which it falls below the triangular wave level of the oscillator is increased to shorten the ON time of the switching transistor and as a result, the output voltage is maintained at a certain level. As described above, the output voltage is controlled by varying the ON time of the switching transistor, while fixing the switching frequency. (the higher is Vin, the larger is the ON time of the switching transistor.) PWM Comparator Operation Diagram Oscillator Output Error Amplifier ON OFF Output Switching Transistor Output 8 SI-8000HFE/HD The rectangular wave output of the switching transistor is smoothed by the LC low pass filter of a choke coil and capacitor to supply stabilized DC voltage to the load. 3-2 Overcurrent Protection / Thermal Shutdown Output Voltage Characteristics in Overcurrent Output Voltage As Vo drops, the oscillating frequency is lowered. Output Current The SI-8000HF series incorporates a current limiting type overcurrent protection circuit. The overcurrent protection circuit detects the peak current of a switching transistor and when the peak current exceeds the set value, the ON time of the transistor is compulsorily shortened to limit the current by lowering the output voltage. In addition, when the output voltage is lowered, the increase of current at low output voltage is prevented by dropping linearly the switching frequency to about 30 KHz. When the overcurrent condition is released, the output voltage will be automatically restored. Output Voltage Characteristics in Thermal Shutdown Output Voltage Restoration Setting Temperature Protection Setting Temperature Junction Temperature The thermal shutdown circuit detects the semiconductor junction temperature of the IC and when the junction temperature exceeds the set value (around 150C), the output transistor is stopped and the output is turned OFF. When the junction temperature drops from the set value for overheat protection by around 15C, the output transistor is automatically restored. 9 SI-8000HFE/HD * Note for thermal shutdown characteristic This circuit protects the IC against overheat resulting from the instantaneous short circuit, but it should be noted that this function does not assure the operation including reliability in the state that overheat continues due to long time short circuit. 10 SI-8000HFE/HD 4. Cautions 4-1 External Components 4-1-1 Choke coil L1 The choke coil L1 plays a main role in the chopper type switching regulator. In order to maintain the stable operation of the regulator, such dangerous state of operation as saturation state and operation at high temperature due to heat generation must be avoided. The following points should be taken into consideration for the selection of the choke coil. a) The choke coil should be fit for the switching regulator. The coil for a noise filter should not be used because of large loss and generated heat. b) The inductance value should be appropriate. The larger is the inductance of the choke coil, the less is the ripple current flowing across the choke coil, and the output ripple voltage drops and as a result, the overall size of the coil becomes larger. On the other hand, if the inductance is small, the peak current flowing across the switching transistor and diode is increased to make the ripple voltage higher and this operation state is not favorable for maintaining the stable operation. When the ripple voltage of the output voltage becomes too high, the operation is likely to be unstable and waveform skipping or jitter may be generated. It is recommended that the ripple voltage of the output voltage should be 1% or less of the set output voltage. The ripple voltage of the output voltage is determined as the product of IL and ESR (equivalent series resistance) of the output capacitor, therefore when the ESR is too large, a problem may happen. The ESR should also be taken into account as well as the selection of the output capacitor. Vout ripple = IL x ESR of output capacitor Large Inductance Small Ripple Voltage/ Current C2 The larger is the inductance, the smaller will be the ripple current/voltage. But the outer size of the coil becomes larger. Small Inductance Large Ripple Voltage/ Current C2 The smaller is the inductance, the larger will be the ripple current/voltage. Although the outer size of the coil is smaller, the operation is likely to be unstable. The inductance value shown in the specifications should be considered as a reference value for the stable operation and the appropriate inductance value can be obtained by the equation (1). However, it should be noted that the ripple value should also be adjusted to be appropriate. 11 SI-8000HFE/HD IL shows the ripple current value of the choke coil and the lower limit of inductance is set as described in the following. - In the case that the output current to be used is nearly equal to the maximum rating (5.5A) of the SI-8000H: output current x 0.1 or so - In the case that the output current to be used is approximately 3A or less: output current x 0.3 - 0.4 L1 (VIN VOUT ) VOUT IL VIN f (1) For example, where VIN = 25V, VOUT = 5V, IL = 0.5A, frequency = 150 KHz, L1 (25 5) 5 53.3uH 0.5 25 150 103 As shown above, the coil of about 54H may be selected. However, it is to be noted that the peak current of the switching transistor is increased depending on the calculated inductance value. Therefore, the peak current detection system is adopted for overcurrent detection and in this case, the overcurrent detection point may become lower. c) The rated current shall be met. The rated current of the choke coil must be higher than the maximum load current to be used. When the load current exceeds the rated current of the coil, the inductance is sharply decreased to the extent that it causes saturation state at last. Please note that overcurrent may flow since the high frequency impedance becomes low. d) Noise shall be low. In the open magnetic circuit core which is of drum shape, since magnetic flux passes outside the coil, the peripheral circuit may be damaged by noise. It is recommended to use the toroidal type, EI type or EE type coil which has a closed magnetic circuit type core as much as possible. 4-1-2 Input Capacitor C1, C4 The input capacitor is operated as a bypass capacitor of the input circuit to supply steep currents to the regulator during switching and to compensate the voltage drop of the input side. Therefore, the input capacitor should be placed as close as to the regulator IC. Even in the case that the rectifying capacitor of the AC rectifier circuit is located in the input circuit, the input capacitor cannot play a role of the rectifying capacitor unless it is placed near the SI-8000HF. The selection of C1 shall be made in consideration of the following points: a) The requirement of withstand voltage shall be met. b) The requirement of the allowable ripple voltage shall be met. 12 SI-8000HFE/HD Current Flow of C1 IIN Current Waveform of C1 C1 VIN 1.VIN Ripple Current 0 Iv Ip C1 Ton T D Ton T The ripple current of the input capacitor is increased in accordance with the increase of the load current. If the withstanding voltages or allowable ripple voltages are exceeded or used without derating, it is in danger of causing not only the decreasing the capacitor lifetime (burst, capacitance decrease, equivalent impedance increase, etc) but also the abnormal oscillations of regulator. Therefore, the selection with sufficient margin is needed. The effective value of ripple current flowing across the input capacitor can be obtained by the following equation (2): Irms 1.2 Vo Io Vin (2) For instance, where VIN = 20V, Io = 3A and Vo= 5V, Irms 1.2 5 3 0.9 A 20 Therefore, it is necessary to select the capacitor with the allowable ripple current of 0.9A or higher. In addition to the electrolytic capacitor C1, either a ceramic capacitor with the high frequency characteristic or a film capacitor C4 is required. For the film capacitor, 0.47F is recommended, while 4.7F is recommended for the ceramic capacitor in which the capacitance is likely to be lowered due to applied voltage. It is important to lay out C4 nearer to the IC than C1. 4-1-3 Output Capacitor C2 The output capacitor C2 composes a LC low pass filter together with a choke coil L1 and functions as a rectifying capacitor of switching output. The current equivalent to the pulse current IL of the choke coil current is charged and discharged in the output capacitor. Therefore, it is necessary to meet the requirements of withstand voltage and allowable ripple current with sufficient margin like the input capacitor. 13 SI-8000HFE/HD Current Flow of C2 IL Vout L1 Ripple Current ESR Current Waveform of C2 C2 Io 0 RL IL C2 The ripple current of the output capacitor is equal to the ripple current of the choke coil and does not vary even if the load current increases or decreases. The ripple current effective value of the output capacitor is obtained by the equation (3). Irms IL 2 3 (3) When IL = 0.5A, Irms 0.5 014 . A 2 3 Therefore a capacitor having the allowable ripple current of 0.14A or higher is required. In addition, the output ripple voltage Vrip of the regulator is determined by a product of the pulse current IL of the choke coil current (= C2 charging/discharging current) and the equivalent series resistance ESR of the output capacitor. Vrip IL C2ESR (4) It is therefore necessary to select a capacitor with low equivalent series resistance ESR in order to lower the output ripple voltage. As for general electrolytic capacitors of same product series, the ESR shall be lower, for the products of higher capacitance with same withstand voltage, or with higher withstand voltage (almost proportional to larger externals) with same capacitance. When IL = 0.5A, Vrip = 40mV, C2esr 40 0.5 80m As shown above, a capacitor with the ESR of 80m or lower should be selected. In addition, since the ESR varies with temperature and increases at low temperature, it is required to examine the ESR at the actual operating temperatures. It is recommended to contact capacitor manufacturers for the ESR value since it is peculiar to capacitors. However, if the ESR of the output capacitor is too low (10 - 30m or lower), the phase margin within the feedback loop of the regulator will be short to make the operation unstable. Therefore, it is not appropriate that a tantalum capacitor or a laminated ceramic capacitor is used for the output capacitor as an 14 SI-8000HFE/HD independent component. However, connecting a tantalum capacitor or a laminated ceramic capacitor in parallel with an electrolytic capacitor is effective in reducing the output ripple voltage only when it is used at low temperature (< 0C). 4-1-4 Flywheel Diode D1 The flywheel diode D1 is to discharge the energy which is stored in the choke coil at switching OFF. For the flywheel diode, the Schottky barrier diode must be used. If a general rectifying diode or fast recovery diode is used, the IC may be destroyed by applying reverse voltage due to the recovery and ON voltage. In addition, since the output voltage from the SW terminal (pin 2) of the SI-8000HF series is almost equivalent to the input voltage, the flywheel diode with the reverse withstand voltage of the input voltage or higher should be used. It is recommended not use the ferrite bead for the flywheel diode. 4-2 Pattern Design Notes 4-2-1 High Current Line Since high current flows in the bold lines in the connection diagram, the pattern should be as wide and short as possible. SI-8008HFE R1 R2 4-2-2 Input / Output Capacitor The input capacitor C1 and the output capacitor C2 should be placed to the IC as close as possible. If the rectifying capacitor for AC rectifier circuit is on the input side, it can be used as an input capacitor. However, if it is not close to the IC, the input capacitor should be connected in addition to the rectifying capacitor. Since high current is discharged and charged through the leads of input/output capacitor at high speed, the leads should be as short as possible. A similar care should be taken for the patterning of the capacitor. C1,C2 Improper Pattern Example C1,C2 Proper Pattern Example 15 SI-8000HFE/HD 4-2-3 ADJ Terminal (Output Voltage Set-up) The ADJ terminal is a feedback detection terminal for controlling the output voltage. It is recommended to connect it as close as possible to the output capacitor C2. When they are not close, the abnormal oscillation may be caused due to the poor regulation and increase of switching ripple. The output voltage set-up is achieved by connecting R1 and R2. IADJ should be set to be around 1mA. (The IADJ lower limit is 0.8mA, and the upper limit is not defined. However, it is necessary to consider that the consumption current shall increase according to the IADJ value, resulting in lower efficiency.) R1, R2 and output voltage are calculated from the following equations: IADJ = VADJ / R2 R1 = (Vo-VADJ) / IADJ *VADJ = 0.8V 2% R2 = VADJ / IADJ VOUT R1x (VADJ/R2) + VADJ The layout of voltage detection line should be made in compact form for stable operation in order to avoid the effect of switching noise. IADJ - R2 should be connected for the stable operation when set to Vo = 0.8V. - It is recommended to set the output voltage to 8% or higher of the input voltage. Constants and variation range are shown in the following table in the case that the output voltage is set for the output voltage setting resistors R1 and R2 by the resistance constants of existing accuracy of 1% and 0.5%, 16 SI-8000HFE/HD TableR1,R2Vo of constants for R1/R2 Vo setting of SI-80008HFE SI-8008HFE Target Vout(V) Resistance Constants of Accuracy of 1% 1% Vout (V) R1 1.2 402 1.8 1000 2.5 1690 3.3 2490 5 4220 9 8250 12 11000 24 23200 Resistance Constants of Accuracy of 0.5% 0.5% Accuracy (%) Accuracy (%) R2( Calculated (%) R1 R2( Calculated (%) +2.61 +2.26 806 402 806 -2.73 -2.41 +2.72 +2.72 806 1010 806 -3.48 -2.41 +4.15 +2.64 787 1690 796 -2.64 -2.73 +2.67 +2.86 806 2490 796 -4.31 -2.67 +3.50 +2.68 806 4170 796 -3.85 -3.00 +3.75 +2.95 806 8160 796 -3.89 -2.88 +3.77 +2.58 787 11100 796 -3.96 -3.27 +3.25 +3.11 806 23400 806 -4.57 -2.84 The wiring of ADJ terminal, R1 and R2 that run parallel to the flywheel diode should be avoided, because switching noise may interfere with the detection voltage to cause abnormal oscillation. It is recommended to implement the wiring from the ADJ terminal to R2 as short as possible. - Mounting Board Pattern Example Component Insertion Type (SI-8008HFE) Surface Mount Type (SI-8008HD) SI-8008HFE C4 C1 Top View: Silk Print Side 17 SI-8000HFE/HD 4-3 Operation Waveform Check It can be checked by the waveform between the pin 2 and 3 (SW - GND) of the SI-8000H whether the switching operation is normal or not. The examples of waveforms at normal and abnormal operations are shown below: 1. Normal Operation (continuous area) 2. Normal Operation (discontinuous area) 3. When C1 and C4 is distant from IC 4. When C2 is distant from IC The continuous area is an area where the DC component of the triangular wave is superimposed on the current flowing across the choke coil and the discontinuous area is an area where the current flowing across the choke coil is intermittent (a period of zero current may happen.) because the current flowing across the choke coil is low. Therefore, when the load current is high, the area is a continuous area and when the same current is low, the area is a discontinuous area. In the continuous area, the switching waveform is formed in the normal rectangular waveform (waveform 1) and in the discontinuous area, damped oscillation is caused in the switching waveform (waveform 2), but this is a normal operation without any problem. In the meantime, when the IC is far from C1, C4 or C2 jitter which disturbs the ON - OFF time of switching will happen as shown in the waveforms (3, 4). As described above, C1 and C4 should be connected close to the IC. 18 SI-8000HFE/HD 4-4 Power Supply Stability 4-4-1 Phase Margin This block diagram shows that the chopper type regulator is a negative feedback amplifier which controls the output voltage by constantly comparing with the output voltage and the reference voltage which is set in advance. Therefore, it has a negative feedback loop to control the output by detecting the variation of output voltage with the error amplifier. L1 Reference Voltage Control Block ESR Reference Voltage -180deg Negative Feedback Loop Load C2 0deg The phase within the negative feedback loop is displaced by 180 to negate the variation of the output voltage, but in the event that the phase is further delayed by 180 in the state that the amplification degree (gain) is 1 or more, the total phase delay amounts to 360 to deviate from the stable operation zone to cause abnormal oscillation. This is called Barkhausen oscillation conditions. Therefore, the oscillation conditions should not be accrued in the actual stabilized power supply. It is possible to judge whether the Barkhausen oscillation conditions are accrued or not by means of frequency and gain/phase characteristics of the negative feedback loop. The frequency-gain/phase characteristics are called Bode diagram. 1-step Differential Amplifier IN OUT Bode Diagram Example 20dB 0dB 9k 1k -0deg -45deg -90deg Gain 0.1fp Frequency Phase fp 10fp In the Bode diagram, the frequency at which the gain is 1 (0 dB) is called gain intersection and the frequency at which the phase of feedback loop is -180 is called phase intersection. Unless the phase reaches -180 at the frequency of gain intersection, the oscillation conditions are not met. In this respect, the phase at gain intersection - (-180) is equal to the phase at gain intersection + 180 and this value is used as a margin to -180 which is called phase margin. The more the phase margin is, the less 19 SI-8000HFE/HD likely the abnormal oscillation is to occur against the variation of environmental conditions such as input/output conditions and temperature. Therefore, sufficient phase margin should be taken into consideration in order to maintain the stable operation. Stability Judgment at Bode Diagram Gain Characteristics Gain Characteristics Gain Intersection 0dB Phase Characteristics 0dB Gain Intersection Frequency Frequency Phase Characteristics Phase Margin (>0) -180deg Phase Intersection Phase Intersection -180deg Stable Unstable Phase Margin (<0) 4-4-2 Phase Characteristics of Regulator IC The phase characteristics of the chopper type regulator are synthesized by the phase characteristics inside the regulator IC and that of the LC filter. The phase characteristics inside the regulator IC are generally determined by the delay time of the control block and the phase characteristic of the output error amplifier. Among these two factors, the phase delay due to the delay time of the control block rarely causes problems in actual use. Therefore, the phase characteristics of the error amplifier are important. With respect to the compensation of phase characteristics of the output error amplifier, there are two types of regulator ICs. One is that compensation is made in the IC in advance, while another type is that external components such as resistors and capacitors are added to the IC for compensation. In the former case, it is only a matter of selection of the LC filter, but in the latter case, appropriate phase compensation should be made in accordance with the application of the product. 4-4-3 Phase Characteristics of LC Filter The phase margin of the chopper type regulator depends largely on the phase characteristics of the LC filter for output smoothing. The phase characteristic of the LC filter theoretically shows the characteristics of a secondary delay factor. Resonance is caused at a specific frequency due to the combination of inductance L1 of coil and of capacitance C2 of the capacitor and at frequency higher than the resonance point, the 20 SI-8000HFE/HD phase is delayed by 180at a maximum. The resonance frequency is expressed as shown in the equation (5): LC 1 (5) 2 LC The phase characteristics are 0 if they are lower than the resonance frequency fLC. The phase characteristics are 180 if they are higher than the resonance frequency fLC. Accordingly, when the LC filter for output smoothing shows the theoretical phase characteristics, the phase delay reaches -180 in this filter portion and the phase margin will be zero for this regulator. However, in the actual LC filter, the phase delay of the LC filter is less than 180 because of influence of the equivalent series resistance (ESR) of capacitor. Consequently, the phase margin can be secured for the regulator because of this phase compensation effect of the equivalent series resistance (ESR). LC Filter Phase Characteristics LC L1 0deg ESR VIN Phase Delay VOUT C2 ESR High ESR: ESR: ESR Low -180deg ESR 00 ESR: fLC Frequency Generally speaking, when such capacitors as tantalum capacitors or laminated capacitors are used for the output LC filter, the phase delay of filters will be large. Therefore, from the view point of securing the phase margin, use of the electrolytic capacitor is preferable. 4-4-4 Relation of Phase Characteristics of Internal IC and LC Filter As described above, the phase characteristics of the chopper type regulator is almost determined by the phase characteristics of the error amplifier and LC filter. In this respect, the relation between these two characteristics is important. When the gain lowering commencement frequency of the error amplifier, namely the first pole frequency fp and the resonant frequency of the LC filter fLC are closer, the phase margin of the regulator is decreased because of concentrated phase delay. In this respect, the proper distribution of fp and fLC is important. Normally, the phase delay of error amplifier commences from 0.1 times of the first pole frequency fp. In order to avoid the concentration of phase delay, the resonant frequency of the LC filter fLC should be kept to be less than 0.1 times of the first pole frequency fp of the error amplifier. 21 SI-8000HFE/HD Phase Phase Characteristics: Phase Characteristics: fpfLC when fp and fLC are close Phase fpf LC when fp and fLC are distant fp fp Amplification Section Amplification Section LC Filter LC LC Filter LC fLC -180deg fLC -180deg Synthesized Characteristics Long Phase Delay Short Phase Delay Synthesized Characteristics -180deg Frequency -180deg Frequency Generally, the frequency fp of the chopper type regulator IC is set from several KHz to higher than ten KHz. With respect to the constants of LC filters described in the applications of each regulator IC, if the inductance of coil or capacitance of the capacitor is set to be less than the recommended values, the resonant frequency fLC of the LC filter may rises to decrease the phase margin. Care should be taken to this phenomenon. The constants of peripheral components should be properly selected according to the applications of each regulator I.C. 22 SI-8000HFE/HD 60 630 50 540 40 450 Gain 30 360 20 270 10 180 0 90 -10 -20 0 Phase Phase () Gain (dB) dB TypicalReg Characteristics of Gain and Phase -90 -30 -180 -40 100 1000 Frequency (Hz) Hz -270 10000 4-5 Thermal Design (SI-8008HFE) 4-5-1 Calculation of Heat Dissipation The relation among the power dissipation Pd of regulator, junction temperature Tj, case temperature Tc, heat sink temperature Tfin and ambient temperature Ta is as follows: Pd (Power dissipation) Pd() Tj: Junction temperature (125C MAX) Tj (125 MAX) Chip jc( ) jc: Thermal resistance between junction and case 5C / W 5 /W Case Tc: Case( temperature (internal Tc frame temperature) ) Heat sink i: Thermal) resistance between case and heat sink) 0.4 - 0.6C / W i( 0.4 0.6 /W T fin: Heat sink temperature Tfin fin: Heat sink thermal resistance fin() Ta: temperature Ta Ambient Tj Tc (6) jc Tj Tfin (7) Pd jc i Pd 23 SI-8000HFE/HD Pd Tj Ta (8) jc i fin The TjMAX is an inherent value for each product, therefore it must be strictly observed. For this purpose, it is required to design the heat sink in compliance with PdMAX, TaMAX (determination of fin). The heat derating graphically describes this relation. The designing of the heat sink is carried out by the following procedure: 1) The maximum ambient temperature Ta MAX in the set is obtained. 2) The maximum power dissipation PdMAX is obtained. 100 VOUT Pd VOUT Io 1 Vf Io1 (9) VIN x * x= efficiency (%), Vf= diode forward voltage 3) The size of heat sink is determined from the intersection of the heat derating. The required thermal resistance of the heat sink can be also calculated. The thermal resistance required for the heat sink is obtained by the following equation: i fin Tj Ta jc Pd (10) An example of heat calculation for using SI-8008HFE under the conditions of VIN = 15V, Io = 4A and Ta = 85C is shown below. Where efficiency = 80% , Vf = 0.5V from the typical characteristics, 5 100 Pd 5 4 1 0.5 4 1 3.67W 80 15 125 85 i fin 5 5.9C / W 2.75 As a result, the heat sink with the thermal resistance of 5.9C /W or less is required. As described above, the heat sink is determined, but the derating of 10 - 20% or more is used. Actually, heat dissipation effect significantly changes depending on the difference in component mounting. Therefore, heat sink temperature or case temperature should be checked with the heat sink mounted. The maximum rating Tjmax of the SI-8008HFE is 150C, but it is recommended to design the heat sink at TjMAX < 125C since the thermal shutdown circuit may be operated at 130C or higher. 4-5-2 Installation to Heat sink Selection of silicon grease When the SI-8000HFE is installed to the heat sink, silicon grease should be thinly and evenly coated between the IC and heat sink. Without coating, thermal resistance i is significantly increased because of contact failure due to micro concavity/convexity between the backside of the IC and the surface of the heat sink to accelerate the heating of the IC, resulting in shorter life of the IC. In some kind of silicon grease to be used, oil component may be separated to penetrate into the IC, resulting in the deformation of packages or the adverse effect on built-in elements. Any other silicon grease than one based on the modified silicon oil shall not be used. The recommended silicon greases are as follows: 24 SI-8000HFE/HD Sanken's recommended silicon greases: Types Suppliers G746 Shin-Etsu Chemical Co., Ltd. SC102 Toray Silicone Co., Ltd. YG6260 Momentive Performance Materials Inc. Tightening torque of fixing screws In order to keep the thermal resistance between the IC and the heat sink at low level without damaging the IC package, it is necessary to control the torque of fixing screws in a proper way. Even if silicon grease is coated, the thermal resistance i increases if the tightening torque is not enough. Change rate of thermal resistance (%) % For the SI-8008HFE, 58.8 - 68.6Ncm (6.0 - 7.0 kg cm) are recommended. 110 105 100 95 90 0 20 40 60 Ncm Tightening Torque (N cm) 80 100 * 1. The change rate of thermal resistance in the case that 58.8N cm (6kg cm) is expressed as 100% is shown above. * 2. The silicon grease G746 shall be used. 4-6 Thermal Design (SI-8008HD) 4-6-1 Calculation of heat dissipation In the case of the surface mounting type SI-8008HD, the thermal design shall be made below Tjmax in a similar way to the insertion components as described above, but in the case of surface mounting, the heat is dissipated toward the copper foil on the mounting board, therefore the thermal design should be made in consideration of copper foil area, board material and number of copper foil layers. The stem part of the backside of the SI-8008HD is connected with pin 3 (GND) by the inner frame and heat dissipation performance is improved by taking the larger GND pattern which is directly connected with the stem part. In order to confirm the junction temperature, the temperature of the stem spot shown below should be measured to calculate the temperature by the following equation. 25 SI-8000HFE/HD Tj = Tc + Pd x 3C /W * Tc = Actually measured stem temperature Temperature measurement point Junction thermal resistance: 3C /W D SI-8000H Series IO-PSI-8000H Output Current-Power Dissipation D Characteristics Io-P Output Current-Power Dissipasion 10 VIN=8V 9 Power Dissipation (W) PD (W) Power Dissipation VIN=15V 8 VIN=30V 7 VIN=40V 6 5 4 3 2 1 0 0 1 2 3 4 5 6 Output Current Io Io (A)(A) Output Current Io - Pd reference data of the SI-8000H series is shown above. Since the SI-8008HD is a surface mounting package, heat is radiated to the printed board Cu foil. Therefore, it may be difficult to consume fully 5.5A from a view point of the heat radiation. Normally 2 3A is consumed and it is assumed that 5.5A may be consumed instantly. The reference data of thermal resistance in the case that the copper foil area is changed on the single side glass epoxy board FR4 is shown in the next page. 26 SI-8000HFE/HD vs Copper area vs Junction to air (Typical) 55 50 45 40 35 30 0 200 400 600 800 1000 1200 1400 1600 1800 27 SI-8000HFE/HD 5. Applications 5-1 Soft Start When a capacitor is connected to terminal 5, the soft start is activated when the input voltage is applied. Vout rises in relation with the charging voltage of Css. Therefore, the rough estimation is done by the time constant calculation of Css charging. The capacitor Css controls the rise time by controlling the OFF period of PWM control. The rise time tss is obtained approximately by the following equation: The terminal 5 should be open, when the soft start is not used. VIN SI-8008H SI-8000FF tss = (Css x VssA) / IssL (sec) VssA 2.3V 5.SS VOUT Css Tss Since the SS terminal is pulled up (3.6V TYP) with the internal power supply of IC, the external voltage can not be applied. If Css is high, it takes time to discharge Css after Vin is turned OFF. It is recommended to use the Css with the value of 10F or less. When Vin drops, the charges of Css are discharged from the Vin terminal. SI-8008 HFE Css Css vs - Start-up Time SI-8008HFE Vo=5V Co=680uF Vo=5v Co=680uF 10000 1000 Start-up Time (ms) ms Measured value of start-up time Calculated value 100 10 1 0.1 0.001 0.01 0.1 Css Css(uF) uF 1 10 28 SI-8000HFE/HD The reference data of calculated value and actual value of start-up time of CSS are shown above. If there is no Css or it is extremely low, Vout rises at the time constants charging the output capacitor with the output current restricted by the overcurrent protection Is. At CSS = 0. 001F in the start-up time graph above, time constants charging output capacitors with output current restricted by overcurrent protection are predominant rather than time constants by Css. Time constants at output capacitor start-up t = (Co x Vo) / Is(at no load) * The amount of load current is deducted from the Is value at load. 5-2 Output ON/ OFF Control The output ON-Off control is possible using the SS (No.5) terminal. The output is turned OFF when the terminal 5 voltage falls below VssL (0.5V) by such as open collector. It is possible to use the soft start together. Since the soft start terminal has been already pulled up (3.7V TYP), no voltage shall be applied from the external side. SI-8000H SI-8000S,SS SI-8000H SI-8000S,SS 5.SS 5.SS C3 Css SS+ON/OFF ON/OFF 5-3 Spike Noise Reduction In order to reduce the spike noise, it is possible to compensate the output waveform of the SI-8000H and the recovery time of the diode by a capacitor, but it should be noted that the efficiency is also slightly reduced. around 10 10 IN 11.VIN around 1000pF 1000pF 2.SW 2.SW SI-8000H SI-8000FF around 10 10 3.GND around 1000pF 1000pF 29 SI-8000HFE/HD Without noise reduction circuit With noise reduction circuit A resistor of 10 and a capacitor of 2200pF are connected to external resistor *When the spike noise is observed with an oscilloscope, the lead wire may function as an antenna and the spike noise may be observed extremely higher than usual if the probe GND lead wire is too long. In the observation of spike noise, the probe lead wire should be as short as possible and be connected with the root of the output capacitor. 5-4 Reverse Bias Protection A diode for reverse bias protection will be required between input and output when the output voltage is higher than the input terminal voltage, such as in battery chargers. SI-8000H SI-8001FFE SI-8000S,SS 30 SI-8000HFE/HD 6. Typical Characteristics (1) Efficiency SI-8008H Io vs SI-8000H IO - Efficiency VOVo=1.2v =1.2V 70 Vin=4.5v 5v 5.5v 8v 10v 65 % Efficiency (%) 60 55 50 45 40 35 30 0 1 2 3 4 Io A 5 IO - Efficiency Io vs Vo=3.3V Vo=3.3V 85 Vin=6V 10V 15V 20V 25V 30V 40V 80 Efficiency n (%) %] 6 75 70 65 60 0.0 1.0 2.0 3.0 Output Current Io[A] 4.0 5.0 6.0 SI-8008HFE SI-8008HFE Efficiency Vo=5v Vo=5V 90 85 % Efficiency (%) 80 Vin=8v Vin=10v Vin=15v Vin=20v Vin=30v Vin=40v 75 70 65 60 0 1 2 3 Iout A 4 5 6 31 SI-8000HFE/HD IO - Io Efficiency vs VOVo=12V = 12V 95 90 %] Efficiency n (%) 85 15V 20V 25V 30V 40V 80 75 70 0.0 2Rising 2.0 3.0 Output Current Io[A] Characteristics 4Over 4.0 5.0 6.0 Current Protection 6 6 Io=0A Output Voltage VO (V) Output Voltage VO (V) 1.0 5 4 Io=5.5A 3 Io=1A~4A 2 5 4 VIN=10V 3 VIN=15V VIN=20V VIN=30V 2 VIN=40V 1 1 0 2 4 6 8 10 0 5Thermal Input Voltage Load Regulation 3 5.06 Output Voltage VO (V) 5.04 VIN=40v Vout (V) Output Voltage 6 8 Output Current Protection 6 Load regulation 30v 20v 5 4 Output Current Io (A) Input Voltage VIN (V) 5.02 2 15v 4.98 VIN=15V, Io=10mA 5 4 3 2 4.96 8v 1 4.94 4.92 0 0 1 2 3 4 Iout Output Current Iout(A) (A) Output Current 5 40 80 120 160 6 Junction Temperature Tj (C) 32 SI-8000HFE/HD 7. Terminology - Jitter It is a kind of abnormal switching operations and is a phenomenon that the switching pulse width varies in spite of the constant condition of input and output. The output ripple voltage peak width is increased when a jitter occurs. - Recommended Conditions It shows the operation conditions required for maintaining normal circuit functions. It is required to meet the conditions in actual operations. - Absolute Maximum Ratings It shows the destruction limits. It is required to take care so that even one item does not exceed the specified value for a moment during instantaneous or normal operation. - Electrical Characteristics It is the specified characteristic value in the operation under the conditions shown in each item. If the operating conditions are different, it may be out of the specifications. - PWM (Pulse Width Modulation) It is a kind of pulse modulation systems. The modulation is achieved by changing the pulse width in accordance with the variation of modulation signal waveform (the output voltage for chopper type switching regulator). - ESR (Equivalent Series Resistance) It is the equivalent series resistance of a capacitor. It acts in a similar manner to the resistor series-connected to the capacitor. 33 SI-8000HFE/HD Notice The contents of this description are subject to change without prior notice for improvement etc. Please make sure that any information to be used is the latest one. Any example of operation or circuitry described in this application note is only for reference, and we are not liable to any infringement of industrial property rights, intellectual property rights or any other rights owned by third parties resulting from such examples. In the event that you use any product described here in combination with other products, please review the feasibility of combination at your responsibility. Although we endeavor to improve the quality and reliability of our product, in the case of semi-conductor components, defects or failures which occur at a certain rate of probability are inevitable. The user should take into adequate consideration the safety design in the equipment or the system in order to prevent accidents causing death or injury, fires, social harms etc.. Products described here are designed to be used in the general-purpose electronic equipment (home appliances, office equipment, communication terminals, measuring equipment etc.). If used in the equipment or system requiring super-high reliability (transport machinery and its control equipment, traffic signal control equipment, disaster/crime prevention system, various safety apparatus etc.), please consult with our sales office. Please do not use our product for the equipment requiring ultrahigh reliability (aerospace equipment, atomic control, medical equipment for life support etc.) without our written consent. The products described here are not of radiation proof type. The contents of this brochure shall not be transcribed nor copied without our written consent. 34