Description
This series of bi-color ChipLEDs is designed with the small-
est footprint to achieve high density of components on
board. They have the industry standard footprint of 1.6
mm x 0.8 mm and a height of only 0.5 mm. This makes
them very suitable for cellular phone and mobile equip-
ment backlighting and indication. They are available in
a wide range of color combinations. In order to facilitate
automated pick and place operation, these ChipLEDs are
shipped in tape and reel, with 4000 units per reel. These
parts are compatible with reow soldering.
HSMF-C16x
Miniature Bi-Color Surface Mount ChipLEDs
Data Sheet
Features
• Small size
• 0603 industry standard footprint
• Diused optics
• Operating temperature range of –30˚C to +85˚C
• Compatible with reow soldering
• Available in various color combination
• Available in 8 mm tape on 7" (178 mm) diameter
reels
Applications
• Keypad backlighting
• Symbol indicator
• LCD backlighting
• Pushbutton backlighting
• Front panel indicator
CAUTION: HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate pre-
cautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Device Selection Guide
Part Number Color Package Description
HSMF-C162 AlInGaP Red / AlInGaP Amber Untinted, Diused
HSMF-C163 AlInGaP Red / InGaN Green Untinted, Diused
HSMF-C164 AlInGaP Red / InGaN Blue Untinted, Diused
HSMF-C165 High Eciency Red / GaP Green Untinted, Diused
HSMF-C166 GaP Yellow / GaP Green Untinted, Diused
HSMF-C167 GaP Orange / GaP Green Untinted, Diused
HSMF-C168 InGaN Green / InGaN Blue Untinted, Diused
HSMF-C169 AlInGaP Amber / InGaN Blue Untinted, Diused
2
Package Dimensions
Absolute Maximum Ratings for Each Die at TA = 25˚C
Parameter AlInGaP InGaN GaP Units
DC Forward Current[1] 20 10 20 mA
Power Dissipation 48 38 52 mW
Reverse Voltage 5 5 5 V
LED Junction Temperature 95 95 95 ˚C
Operating Temperature Range –30 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reow soldering prole (Figure 6 & 7)
Note:
1. Derate linearly as shown in Figure 4.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
1.6
(0.063 )
0.16 (0.006)
0.5 (0.020)
0.4
(0.016)
LED DIES
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINALS
0.8 (0.031)
CATHODE LINE
0.3 (0.012)
CATHODE LINE
1
2
3
4
POLARITY
1 3
HSMF-C162
AMBER
2 4 RED
HSMF-C163
GREEN
RED
HSMF-C164
BLUE
RED
HSMF-C165
GREEN
RED
HSMF-C166
GREEN
YELLOW
HSMF-C167
GREEN
ORANGE
HSMF-C168
BLUE
GREEN
HSMF-C169
BLUE
AMBER
3
Electrical Characteristics at TA = 25˚C
Reverse
Breakdown Capacitance Thermal
Forward Voltage VR (Volts) C (pF), @ VF = 0, Resistance
VF (Volts) @ IF[1] @ IR = 100 µA f = 1 MHz RθJ-PIN (˚C/W)
Color Typ. Max. Min. Typ. Typ.
AlInGaP Red 20 mA 1.9 2.4 5 15 300
AlInGaP Amber 20 mA 1.9 2.4 5 11 300
AlInGaP Red[2] 10 mA 1.8 2.3 5 15 300
AlInGaP Amber[2] 10 mA 1.8 2.3 5 11 300
InGaN Green 10 mA 3.4 3.8 5 35 500
InGaN Blue 10 mA 3.4 3.8 5 35 500
HER 20 mA 2.1 2.6 5 5 325
GaP Orange 20 mA 2.2 2.6 5 7 325
GaP Yellow 20 mA 2.1 2.6 5 6 325
GaP Green 20 mA 2.2 2.6 5 9 325
Optical Characteristics at TA = 25˚C
Color
Peak Dominant Luminous
Luminous Intensity Wavelength Wavelength Viewing Angle Ecacy
Iv (mcd) @ IF[1] λpeak (nm) λd[2] (nm) 2 θ1/2 Degrees[3] ηv (lm/W)
Color Min. Typ. Typ. Typ. Typ. Typ.
AlInGaP Red 20 mA 28.5 90 637 626 120 155
AlInGaP Amber 20 mA 28.5 90 595 592 120 480
AlInGaP Red[4] 10 mA 11.2 35 637 626 120 155
AlInGaP Amber[4] 10 mA 11.2 35 595 592 120 480
InGaN Green 10 mA 18 45 523 525 120 500
InGaN Blue 10 mA 2.8 10 468 470 120 80
HER 20 mA 2.8 10 636 621 120 145
GaP Orange 20 mA 2.8 8 605 604 120 380
GaP Yellow 20 mA 2.8 8 589 586 120 500
GaP Green 20 mA 4.5 15 570 572 120 595
Notes:
1. VF Tolerance: ± 0.1 V.
2. The product testing is based on 20 mA. This is for reference only.
Notes:
1. The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the
lamp package.
2. The dominant wavelength λd is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
3. θ1/2 is the o-axis angle where the luminous intensity is 1/2 the peak intensity.
4. The product testing is based on 20 mA. This is for reference purpose.
4
Intensity (Iv) Bin Limits[1]
Intensity @ 20 mA (mcd)
Bin ID Min. Max.
A 0.11 0.18
B 0.18 0.29
C 0.29 0.45
D 0.45 0.72
E 0.72 1.10
F 1.10 1.80
G 1.80 2.80
H 2.80 4.50
J 4.50 7.20
K 7.20 11.20
L 11.20 18.00
M 18.00 28.50
N 28.50 45.00
P 45.00 71.50
Q 71.50 112.50
R 112.50 180.00
S 180.00 285.00
T 285.00 450.00
U 450.00 715.00
V 715.00 1125.00
W 1125.00 1800.00
X 1800.00 2850.00
Y 2850.00 4500.00
Tolerance: ± 15%.
Color Bin Limits[1]
Yellow/Amber Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Tolerance: ± 0.5 nm
InGaN Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Tolerance: ± 1 nm
Note:
1. Bin categories are established for classi-
cation of products. Products may not be
available in all categories. Please contact
your Avago representative for information
on currently available bins.
Note:
1. Bin categories are established for classi-
cation of products. Products may not be
available in all categories. Please contact
your Avago representative for information
on currently available bins.
Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 561.5 564.5
B 564.5 567.5
C 567.5 570.5
D 570.5 573.5
E 573.5 576.5
Tolerance: ± 0.5 nm
Blue Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Tolerance: ± 1 nm
Orange Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
F 612.0 615.0
Tolerance: ± 1 nm
5
Figure 2. Forward current vs. forward voltage.
Figure 1. Relative intensity vs. wavelength.
Figure 3. Luminous intensity vs. forward current.
400
100
0600 700
20
RELATIVE INTENSITY – %
WAVELENGTH – nm
500
HSMF-C16x fig 1
60
40
80
450 550 650
10
50
30
70
90
InGaN
BLUE
InGaN
GREEN
AS
AMBER
AS
RED
AS
ORANGE
100
10
1
0.11.5 2.5 3.5 4.0
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
3.0
HSMF-C16x fig 2
2.0
InGaN
AS AlInGaP
0 5 15
I
F
– FORWARD CURRENT – mA
0
0.4
1.4
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
HSMF-C16x fig 3a
30
0.8
0.2
1.0
10
0.6
1.2
AS AlInGaP
20 25
0 4 12
I
F
– FORWARD CURRENT – mA
0
0.4
1.4
1.6
LUMINOUS INTENSITY
(NORMALIZED AT 10 mA)
HSMF-C16x fig 3b
16
0.8
0.2
1.0
8
0.6
1.2
2 6 10 14
InGaN
GaP GREEN
GaP YELLOW
GaP ORANGE
HER
500 550 600 650 700 750
WAVELENGTH - nm
RELATIVE INTENSITY
1.0
0.5
0
1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3
VF – FORWARD VOLTAGE – V
IF – FORWARD CURRENT – mA
100
10
1
0
HER
GaP
ORANGE
GaP YELLOW
GaP GREEN
0 5 15
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
0.6
0.2
0.8
10 30
1.4
25
1.2
GaP
6
Figure 4. Maximum forward current vs. ambient
temperature.
Figure 5. Relative intensity vs. angle.
Figure 7. Recommended Pb-free reow soldering prole.
Figure 8. Recommended soldering pad pattern.
HSMF-C16x fig 5
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
0
25
020 60 80 100
5
IF MAX. – MAXIMUM FORWARD CURRENT – mA
TA – AMBIENT TEMPERATURE – °C
40
15
20
10
10 30 50 70 90
InGaN
AlInGaP/GaP
Figure 6. Recommended reow soldering prole.
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
(Acc. to J-STD-020C)
10 - 30 SEC.
TIME
TEMPERATURE
Figure 9. Reeling orientation.
Figure 10. Reel dimensions.
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
x
x
x
x
x
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020)
5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
8
Figure 11. Tape dimensions.
Figure 12. Tape leader and trailer dimensions.
HSMF-C16x fig 15
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (± 0.004)
DIM. B
± 0.10 (± 0.004)PART NUMBER
DIM. C
± 0.10 (± 0.004)
HSMF-C16x SERIES 1.75 (0.069) 0.95 (0.037) 0.60 (0.024)
Reow Soldering
For more information on reow soldering, refer to Ap-
plication Note 1060, Surface Mounting SMT LED Indicator
Components.
Storage Condition:
5 to 30˚C @ 60% RH max.
Baking is required under the condition:
a) the blue silica gel indicator becoming white/trans-
parent color
b) the pack has been opened for more than 1 week
Baking recommended condition: 60 ± 5˚C for 20 hours.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies, Limited. All rights reserved. Obsoletes 5989-4810EN
AV02-0584EN - July 23, 2007