ispLSI 1024 (R) In-System Programmable High Density PLD Functional Block Diagram unctional Block Diagram * HIGH-DENSITY PROGRAMMABLE LOGIC -- High-Speed Global Interconnect -- 4000 PLD Gates -- 48 I/O Pins, Six Dedicated Inputs -- 144 Registers -- Wide Input Gating for Fast Counters, State Machines, Address Decoders, etc. -- Small Logic Block Size for Fast Random Logic -- Security Cell Prevents Unauthorized Copying * HIGH PERFORMANCE E2CMOS(R) TECHNOLOGY -- fmax = 90 MHz Maximum Operating Frequency -- fmax = 60 MHz for Industrial and Military/883 Devices -- tpd = 12 ns Propagation Delay -- TTL Compatible Inputs and Outputs -- Electrically Erasable and Reprogrammable -- Non-Volatile E2CMOS Technology -- 100% Tested * IN-SYSTEM PROGRAMMABLE C7 Output Routing Pool A0 D Q A1 A2 Logic A3 Array C6 C5 D Q D Q Output Routing Pool Features GLB C4 C3 A4 D Q C2 A5 C1 A6 A7 Global Routing Pool (GRP) B0 B1 B2 B3 B4 B5 B6 B7 C0 CLK Output Routing Pool -- In-System ProgrammableTM (ISPTM) 5-Volt Only -- Increased Manufacturing Yields, Reduced Time-toMarket, and Improved Product Quality -- Reprogram Soldered Devices for Faster Debugging * COMBINES EASE OF USE AND THE FAST SYSTEM SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY OF FIELD PROGRAMMABLE GATE ARRAYS -- Complete Programmable Device Can Combine Glue Logic and Structured Designs -- Four Dedicated Clock Input Pins -- Synchronous and Asynchronous Clocks -- Flexible Pin Placement -- Optimized Global Routing Pool Provides Global Interconnectivity 0139-A-isp Description The ispLSI 1024 is a High-Density Programmable Logic Device containing 144 Registers, 48 Universal I/O pins, six Dedicated Input pins, four Dedicated Clock Input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements. The ispLSI 1024 features 5-Volt in-system programmability and in-system diagnostic capabilities. It is the first device which offers non-volatile reprogrammability of the logic, as well as the interconnect to provide truly reconfigurable systems. * ispDesignEXPERTTM - LOGIC COMPILER AND COMPLETE ISP DEVICE DESIGN SYSTEMS FROM HDL SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING -- Superior Quality of Results -- Tightly Integrated with Leading CAE Vendor Tools -- Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZERTM -- PC and UNIX Platforms The basic unit of logic on the ispLSI 1024 device is the Generic Logic Block (GLB). The GLBs are labeled A0, A1 .. C7 (see figure 1). There are a total of 24 GLBs in the ispLSI 1024 device. Each GLB has 18 inputs, a programmable AND/OR/XOR array, and four outputs which can be configured to be either combinatorial or registered. Inputs to the GLB come from the GRP and dedicated inputs. All of the GLB outputs are brought back into the GRP so that they can be connected to the inputs of any other GLB on the device. Copyright (c) 1999 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com 1024_06 1 February 1999 Specifications ispLSI 1024 Functional Block Diagram Figure 1.ispLSI 1024 Functional Block Diagram RESET Generic Logic Blocks (GLBs) IN 5 IN 4 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 C6 I/O 44 C5 A2 C4 Global Routing Pool (GRP) A3 C3 A4 C2 A5 I/O 43 I/O 42 I/O 41 lnput Bus Output Routing Pool (ORP) I/O 8 A1 Input Bus I/O 4 I/O 5 I/O 6 I/O 7 A0 I/O 47 I/O 46 I/O 45 Output Routing Pool (ORP) I/O 0 I/O 1 I/O 2 I/O 3 C7 I/O 40 I/O 39 I/O 38 I/O 37 I/O 36 I/O 35 I/O 34 I/O 33 I/O 32 C1 A6 C0 A7 SDI/IN 0 SDO/IN 1 B0 B1 Megablock B2 B3 B4 B5 B6 B7 Clock Distribution Network Output Routing Pool (ORP) CLK 0 CLK 1 CLK 2 IOCLK 0 IOCLK 1 Input Bus ispEN SCLK/IN 2 MODE/IN 3 I/O I/O I/O I/O 16 17 18 19 I/O I/O I/O I/O 20 21 22 23 I/O I/O I/O I/O 24 25 26 27 I/O I/O I/O I/O 28 29 30 31 Y Y Y Y 0 1 2 3 0139D_1024.eps The device also has 48 I/O cells, each of which is directly connected to an I/O pin. Each I/O cell can be individually programmed to be a combinatorial input, registered input, latched input, output or bi-directional I/O pin with 3-state control. Additionally, all outputs are polarity selectable, active high or active low. The signal levels are TTL compatible voltages and the output drivers can source 4 mA or sink 8 mA. The GRP has as its inputs the outputs from all of the GLBs and all of the inputs from the bi-directional I/O cells. All of these signals are made available to the inputs of the GLBs. Delays through the GRP have been equalized to minimize timing skew. Clocks in the ispLSI 1024 device are selected using the Clock Distribution Network. Four dedicated clock pins (Y0, Y1, Y2 and Y3) are brought into the distribution network, and five clock outputs (CLK 0, CLK 1, CLK 2, IOCLK 0 and IOCLK 1) are provided to route clocks to the GLBs and I/O cells. The Clock Distribution Network can also be driven from a special clock GLB (B4 on the ispLSI 1024 device). The logic of this GLB allows the user to create an internal clock from a combination of internal signals within the device. Eight GLBs, 16 I/O cells, two dedicated inputs and one ORP are connected together to make a Megablock (see figure 1). The outputs of the eight GLBs are connected to a set of 16 universal I/O cells by the ORP. The I/O cells within the Megablock also share a common Output Enable (OE) signal. The ispLSI 1024 device contains three of these Megablocks. 2 Specifications ispLSI 1024 Absolute Maximum Ratings 1 Supply Voltage Vcc .................................. -0.5 to +7.0V Input Voltage Applied ........................ -2.5 to VCC +1.0V Off-State Output Voltage Applied ..... -2.5 to VCC +1.0V Storage Temperature ................................ -65 to 150C Case Temp. with Power Applied .............. -55 to 125C Max. Junction Temp. (TJ) with Power Applied ... 150C 1. Stresses above those listed under the "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications). DC Recommended Operating Conditions SYMBOL VCC PARAMETER Supply Voltage MIN. MAX. Commercial TA = 0C to +70C 4.75 5.25 Industrial TA = -40C to +85C 4.5 5.5 Military/883 TC = -55C to +125C 4.5 5.5 VIL Input Low Voltage 0 0.8 VIH Input High Voltage 2.0 Vcc + 1 UNITS V V V Table 2- 0005Aisp w/mil.eps Capacitance (TA=25oC, f=1.0 MHz) SYMBOL C1 C2 MAXIMUM1 UNITS TEST CONDITIONS Commercial/Industrial 8 pf VCC=5.0V, VIN=2.0V Military 10 pf VCC=5.0V, VIN=2.0V 10 pf VCC=5.0V, VI/O, VY=2.0V PARAMETER Dedicated Input Capacitance I/O and Clock Capacitance Table 2- 0006 1. Guaranteed but not 100% tested. Data Retention Specifications PARAMETER MINIMUM MAXIMUM UNITS 20 -- Years 10000 -- Cycles Data Retention Erase/Reprogram Cycles Table 2- 0008B 3 Specifications ispLSI 1024 Switching Test Conditions Input Pulse Levels Figure 2. Test Load GND to 3.0V 3ns 10% to 90% Input Rise and Fall Time Input Timing Reference Levels 1.5V Output Timing Reference Levels 1.5V Output Load + 5V R1 See figure 2 Device Output 3-state levels are measured 0.5V from steady-state active level. Test Point Table 2- 0003 CL* R2 Output Load Conditions (see figure 2) Test Condition R1 R2 CL 470 390 35pF Active High 390 35pF Active Low 470 390 35pF Active High to Z at VOH - 0.5V 390 5pF Active Low to Z 470 390 5pF A B C *CL includes Test Fixture and Probe Capacitance. at VOL + 0.5V Table 2- 0004A DC Electrical Characteristics Over Recommended Operating Conditions SYMBOL PARAMETER CONDITION MIN. TYP.3 MAX. - - 0.4 V 2.4 - - V UNITS VOL VOH IIL IIH IIL-isp IIL-PU IOS1 Output Low Voltage IOL =8 mA Output High Voltage IOH =-4 mA Input or I/O Low Leakage Current 0V VIN VIL (MAX.) - - -10 A Input or I/O High Leakage Current 3.5V VIN VCC - - 10 A isp Input Low Leakage Current 0V VIN VIL (MAX.) - - -150 A I/O Active Pull-Up Current 0V VIN VIL - - -150 A Output Short Circuit Current VCC = 5V, VOUT = 0.5V - - -200 mA ICC2,4 Operating Power Supply Current VIL = 0.5V, VIH = 3.0V Commercial - 130 190 mA fTOGGLE = 1 MHz - 135 215 mA Industrial/Military 1. One output at a time for a maximum duration of one second. Vout = 0.5V was selected to avoid test problems by tester ground degradation. Characterized but not 100% tested. 2. Measured using six 16-bit counters. 3. Typical values are at VCC = 5V and TA = 25oC. 4. Maximum ICC varies widely with specific device configuration and operating frequency. Refer to the Power Consumption section of this datasheet and Thermal Management section of the Lattice Semiconductor Data Book and CD-ROM to estimate maximum Table 2-0007A-24 w/mil ICC. 4 Specifications ispLSI 1024 External Timing Parameters Over Recommended Operating Conditions 5 2 PARAMETER TEST # COND. tpd1 tpd2 fmax (Int.) fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 ten tdis twh twl tsu5 th5 -80 -90 DESCRIPTION1 -60 UNITS MIN. MAX. MIN. MAX. MIN. MAX. A 1 Data Propagation Delay, 4PT bypass, ORP bypass A 2 A 3 - 4 - 15 17 - - 80 58.8 - 125 - 20 20 - 25 ns - 60 - MHz 50 - 38 - MHz - 100 - 83 - MHz - 12 Data Propagation Delay, Worst Case Path - Clock Frequency with Internal Feedback3 90.9 Clock Frequency with External Feedback (tsu2 1+ tco1) - 5 Clock Frequency, Max Toggle4 ns - 6 GLB Reg. Setup Time before Clock, 4PT bypass 6 - 7 - 9 - ns A 7 GLB Reg. Clock to Output Delay, ORP bypass - 8 - 10 - 13 ns - 8 GLB Reg. Hold Time after Clock, 4 PT bypass 0 - 0 - 0 - ns - 9 GLB Reg. Setup Time before Clock 9 - 10 - 13 - ns - 10 GLB Reg. Clock to Output Delay - 10 - 12 - 16 ns - 11 GLB Reg. Hold Time after Clock 0 - 0 - 0 - ns A 12 Ext. Reset Pin to Output Delay - 15 - 17 - 22.5 ns 10 - 10 - 13 - ns 18 - 24 ns - 13 Ext. Reset Pulse Duration B 14 Input to Output Enable - 15 - C 15 Input to Output Disable - 15 - 18 - 24 ns - 16 Ext. Sync. Clock Pulse Duration, High 4 - 5 - 6 - ns - 17 Ext. Sync. Clock Pulse Duration, Low 4 - 5 - 6 - ns - 18 I/O Reg. Setup Time before Ext. Sync. Clock (Y2, Y3) 2 - 2 - 2.5 - ns - 19 I/O Reg. Hold Time after Ext. Sync. Clock (Y2, Y3) 6.5 - 6.5 - 8.5 - ns Table 2-0030-24/90,80,60C 1. 2. 3. 4. 5. Unless noted otherwise, all parameters use a GRP load of 4 GLBs, 20 PTXOR path, ORP and Y0 clock. Refer to Timing Model in this data sheet for further details. Standard 16-Bit loadable counter using GRP feedback. fmax (Toggle) may be less than 1/(twh + twl). This is to allow for a clock duty cycle of other than 50%. Reference Switching Test Conditions Section. 5 Specifications ispLSI 1024 Internal Timing Parameters1 PARAMETER Inputs tiobp tiolat tiosu tioh tioco tior tdin GRP tgrp1 tgrp4 tgrp8 tgrp12 tgrp16 tgrp24 GLB t4ptbp t1ptxor t20ptxor txoradj tgbp tgsu tgh tgco tgr tptre tptoe tptck ORP torp torpbp 2 # -90 DESCRIPTION -80 -60 UNITS MIN. MAX. MIN. MAX. MIN. MAX. 20 I/O Register Bypass - 1.6 - 2.0 - 2.7 ns 21 I/O Latch Delay - 2.4 - 3.0 - 4.0 ns 22 I/O Register Setup Time before Clock 4.8 - 5.5 - 7.3 - ns 23 I/O Register Hold Time after Clock 2.1 - 1.0 - 1.3 - ns 24 I/O Register Clock to Out Delay - 2.4 - 3.0 - 4.0 ns 25 I/O Register Reset to Out Delay - 2.8 - 2.5 - 3.3 ns 26 Dedicated Input Delay - 3.2 - 4.0 - 5.3 ns 27 GRP Delay, 1 GLB Load - 1.2 - 1.5 - 2.0 ns 28 GRP Delay, 4 GLB Loads - 1.6 - 2.0 - 2.7 ns 29 GRP Delay, 8 GLB Loads - 2.4 - 3.0 - 4.0 ns 30 GRP Delay, 12 GLB Loads - 3.0 - 3.8 - 5.0 ns 31 GRP Delay, 16 GLB Loads - 3.6 - 4.5 - 6.0 ns 32 GRP Delay, 24 GLB Loads - 5.0 - 6.3 - 8.3 ns 33 4 Product Term Bypass Path Delay - 5.2 - 6.5 - 8.6 ns 34 1 Product Term/XOR Path Delay - 5.7 - 7.0 - 9.3 ns 35 20 Product Term/XOR Path Delay - 7.0 - 8.0 - 10.6 ns 36 XOR Adjacent Path Delay3 - 8.2 - 9.5 - 12.7 ns 37 GLB Register Bypass Delay - 0.8 - 1.0 - 1.3 ns 38 GLB Register Setup Time before Clock 1.2 - 1.0 - 1.3 - ns 39 GLB Register Hold Time after Clock 3.6 - 4.5 - 6.0 - ns 40 GLB Register Clock to Output Delay - 1.6 - 2.0 - 2.7 ns 41 GLB Register Reset to Output Delay - 2.0 - 2.5 - 3.3 ns 42 GLB Product Term Reset to Register Delay - 8.0 - 10.0 - 13.3 ns 43 GLB Product Term Output Enable to I/O Cell Delay - 7.8 - 9.0 - 12.0 ns 44 GLB Product Term Clock Delay 2.8 6.0 3.5 7.5 4.6 9.9 ns 45 ORP Delay - 2.4 - 2.5 - 3.3 ns 46 ORP Bypass Delay - 0.4 - 0.5 - 0.7 ns 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR Adjacent path can only be used by Hard Macros. 6 Specifications ispLSI 1024 Internal Timing Parameters1 PARAMETER Outputs tob toen todis Clocks tgy0 tgy1/2 tgcp tioy2/3 tiocp 2 # -90 DESCRIPTION -80 -60 UNITS MIN. MAX. MIN. MAX. MIN. MAX. 47 Output Buffer Delay - 2.4 - 3.0 - 4.0 ns 48 I/O Cell OE to Output Enabled - 4.0 - 5.0 - 6.7 ns 49 I/O Cell OE to Output Disabled - 4.0 - 5.0 - 6.7 ns 50 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 3.6 3.6 4.5 4.5 6.0 6.0 ns 51 Clock Delay, Y1 or Y2 to Global GLB Clock Line 2.8 4.4 3.5 5.5 4.6 7.3 ns 52 Clock Delay, Clock GLB to Global GLB Clock Line 0.8 4.0 1.0 5.0 1.3 6.6 ns 53 Clock Delay, Y2 or Y3 to I/O Cell Global Clock Line 2.8 4.4 3.5 5.5 4.6 7.3 ns 54 Clock Delay, Clock GLB to I/O Cell Global Clock Line 0.8 4.0 1.0 5.0 1.3 6.6 ns - 8.2 - 9.0 - 12.0 ns Global Reset tgr 55 Global Reset to GLB and I/O Registers 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 7 Specifications ispLSI 1024 ispLSI Timing Model I/O Cell GRP GLB ORP I/O Cell Feedback Ded. In I/O Pin (Input) #55 #26 I/O Reg Bypass 4 PT Bypass GLB Reg Bypass ORP Bypass #20 #28 #33 #37 #46 Input D Register Q RST #21 - 25 GRP Loading Delay #27, 29, 30, 31, 32 20 PT XOR Delays GLB Reg Delay ORP Delay GRP 4 D Clock Distribution #51, 52, 53, 54 Q RST #55 Reset Y1,2,3 #34, 35, 36 #38, 39, 40, 41 Control RE PTs OE #42, 43, CK 44 #50 Y0 Derivations of tsu, th and tco from the Product Term Clock1 tsu = Logic + Reg su - Clock (min) = (tiobp + tgrp4 + t20ptxor) + (tgsu) - (tiobp + tgrp4 + tptck(min)) = (#20 + #28 + #35) + (#38) - (#20 + #28 + #44) 5.5 ns = (2.0 + 2.0 + 8.0) + (1.0) - (2.0 + 2.0 + 3.5) th = Clock (max) + Reg h - Logic = (tiobp + tgrp4 + tptck(max)) + (tgh) - (tiobp + tgrp4 + t20ptxor) = (#20 + #28 + #44) + (#39) - (#20 + #28 + #35) 4.0 ns = (2.0 + 2.0 + 7.5) + (4.5) - (2.0 + 2.0 + 8.0) tco = Clock (max) + Reg co + Output = (tiobp + tgrp4 + tptck(max)) + (tgco) + (torp + tob) = (#20 + #28 + #44) + (#40) + (#45 + #47) 19.0 ns = (2.0+ 2.0 +7.5) + (2.0) + (2.5 + 3.0) Derivations of tsu, th and tco from the Clock GLB1 tsu = Logic + Reg su - Clock (min) = (tiobp + tgrp4 + t20ptxor) + (tgsu) - (tgy0(min) + tgco + tgcp(min)) = (#20 + #28 + #35) + (#38) - (#50 + #40 + #52) 5.5 ns = (2.0 + 2.0 + 8.0) + (1.0) - (4.5 + 2.0 + 1.0) th = Clock (max) + Reg h - Logic = (tgy0(max) + tgco + tgcp(max)) + (tgh) - (tiobp + tgrp4 + t20ptxor) = (#50 + #40 + #52) + (#39) - (#20 + #28 + #35) 4.0 ns = (4.5 + 2.0 + 5.0) + (4.5) - (2.0 + 2.0 + 8.0) tco = Clock (max) + Reg co + Output = (tgy0(max) + tgco + tgcp(max)) + (tgco) + (torp + tob) = (#50 + #40 + #52) + (#40) + (#45 + #47) 19.0 ns = (4.5 + 2.0 + 5.0) + (2.0) + (2.5 + 3.0) 1. Calculations are based upon timing specifications for the ispLSI 1024-80. 8 #45 #47 I/O Pin (Output) #48, 49 Specifications ispLSI 1024 Maximum GRP Delay vs GLB Loads ispLSI 1024-60 GRP Delay (ns) 6 5 ispLSI 1024-80 4 ispLSI 1024-90 3 2 1 0 4 8 GLB Loads 12 16 0126A-80-24-isp.eps Power Consumption Power consumption in the ispLSI 1024 device depends on two primary factors: the speed at which the device is operating, and the number of Product Terms used. Fig- ure 3 shows the relationship between power and operating speed. Figure 3. Typical Device Power Consumption vs fmax 200 ispLSI 1024 ICC (mA) 150 100 50 0 10 20 30 40 50 60 70 80 fmax (MHz) Notes: Configuration of Six 16-bit Counters Typical Current at 5V, 25C ICC can be estimated for the ispLSI 1024 using the following equation: ICC = 42 + (# of PTs * 0.45) + (# of nets * Max. freq * 0.008) where: # of PTs = Number of Product Terms used in design # of nets = Number of Signals used in device Max. freq = Highest Clock Frequency to the device The ICC estimate is based on typical conditions (VCC = 5.0V, room temperature) and an assumption of 2 GLB loads on average exists. These values are for estimates only. Since the value of ICC is sensitive to operating conditions and the program in the device, the actual ICC should be verified. 0127A-24-80-isp 9 Specifications ispLSI 1024 Pin Description NAME PLCC and JLCC PIN NUMBERS 24, 28, 32, 39, 43, 47, 58, 62, 66, 5, 9, 13, 25, 29, 33, 40, 44, 48, 59, 63, 67, 6, 10, 14 TQFP PIN NUMBERS DESCRIPTION Input/Output Pins - These are the general purpose I/O pins used by the logic array. I/O 0 - I/O 3 I/O 4 - I/O 7 I/O 8 - I/O 11 I/O 12 - I/O 15 I/O 16 - I/O 19 I/O 20 - I/O 23 I/O 24 - I/O 27 I/O 28 - I/O 31 I/O 32 - I/O 35 I/O 36 - I/O 39 I/O 40 - I/O 43 I/O 44 - I/O 47 22, 26, 30, 37, 41, 45, 56, 60, 64, 3, 7, 11, 23, 27, 31, 38, 42, 46, 57, 61, 65, 4, 8, 12, IN 4 - IN 5 2, 15 ispEN 19 16 SDI/IN 01 21 18 MODE/IN 31 55 68 SDO/IN 11 34 35 SCLK/IN 21 49 58 NC2 -- 1, 24, 38, 51, 74, 87, RESET 20 17 Y0 16 9 Y1 54 67 Y2 51 60 Dedicated Clock input. This clock input is brought into the clock distribution network, and can optionally be routed to any GLB and/or any I/O cell on the device. Y3 50 59 Dedicated Clock input. This clock input is brought into the clock distribution network, and can optionally be routed to any I/O cell on the device. GND 1, 18, 35, 52 14, 61, 15, 36, 37, 62, 89, 90 VCC 17, 36, 53, 68 10, 65, 11, 66, 19, 23, 31, 42, 46, 54, 69, 73, 81, 92, 96, 4, 20, 28, 32, 43, 47, 55, 70, 78, 82, 93, 97, 5, 91, 8 21, 29, 33, 44, 48, 56, 71, 79, 83, 94, 98, 6, 22, 30, 34, 45, 53, 57, 72, 80, 84, 95, 3, 7 Input - These pins are dedicated input pins to the device. Input - Dedicated in-system programming enable input pin. This pin is brought low to enable the programming mode. The MODE, SDI, SDO and SCLK options become active. Input - This pin performs two functions. When ispEN is logic low, it functions as an input pin to load programming data into the device. SDI/IN 0 is also used as one of the two control pins for the isp state machine. It is a dedicated input pin when ispEN is logic high. Input - This pin performs two functions. When ispEN is logic low, it functions as pin to control the operation of the isp state machine. It is a dedicated input pin when ispEN is logic high. Output/Input - This pin performs two functions. When ispEN is logic low, it functions as an output pin to read serial shift register data. It is a dedicated input pin when ispEN is logic high. Input - This pin performs two functions. When ispEN is logic low, it functions as a clock pin for the Serial Shift Register. It is a dedicated input pin when ispEN is logic high. 2, 25, 39, 52, 75, 88, 12, 13, 26, 27, 49, 50, 63 64, 76, 77 99, 100 No Connect Active Low (0) Reset pin which resets all of the GLB and I/O registers in the device. Dedicated Clock input. This clock input is connected to one of the clock inputs of all of the GLBs on the device. Dedicated Clock input. This clock input is brought into the clock distribution network, and can optionally be routed to any GLB on the device. 40, 41, 85, 86 Ground (GND) VCC 1. Pins have dual function capability. 2. NC pins are not to be connected to any active signals, Vcc or GND. 10 Table 2 - 0002C-24 Specifications ispLSI 1024 Pin Configuration 2 4 3 I/O 31 I/O 30 I/O 29 IN 4 GND 5 I/O 32 I/O 38 I/O 37 I/O 36 6 7 I/O 33 I/O 39 8 I/O 35 I/O 34 I/O 41 I/O 40 9 VCC I/O 42 ispLSI 1024 68-Pin PLCC Pinout Diagram 1 68 67 66 65 64 63 62 61 I/O 43 10 60 I/O 28 I/O 44 I/O 45 11 59 12 58 I/O 27 I/O 26 I/O 46 13 57 I/O 25 I/O 47 14 56 I/O 24 IN 5 Y0 15 55 16 54 IN3/MODE1 Y1 53 VCC 52 GND Y2 Y3 VCC 17 ispLSI 1024 GND ispEN 18 Top View 19 51 RESET 1SDI/IN 0 20 50 21 49 I/O 0 I/O 1 22 48 IN2/SCLK1 I/O 23 23 47 I/O 22 I/O 2 24 46 I/O 3 I/O 4 25 45 I/O 21 I/O 20 26 44 I/O 19 I/O 18 I/O 16 I/O 17 I/O 15 I/O 14 VCC I/O 12 I/O 13 GND 1SDO/IN 1 I/O 9 I/O 10 I/O 11 I/O 8 I/O 6 I/O 7 I/O 5 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 1. Pins have dual function capability. 0123C-isp.eps 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 ispLSI 1024 Top View 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 NC1 NC1 I/O 28 I/O 27 I/O 26 I/O 25 I/O 24 IN3/MODE2 Y1 VCC VCC NC1 NC1 GND GND Y2 Y3 IN2/SCLK2 I/O 23 I/O 22 I/O 21 I/O 20 I/O 19 NC1 NC1 1NC 1NC I/O 5 I/O 6 I/O 7 I/O 8 I/O 9 I/O 10 I/O 11 2SDO/IN1 GND GND 1NC 1NC VCC VCC I/O 12 I/O 13 I/O 14 I/O 15 I/O 16 I/O 17 I/O 18 1NC 1NC 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 1NC 1NC I/O 43 I/O 44 I/O 45 I/O 46 I/O 47 IN5 Y0 VCC VCC 1NC 1NC GND GND ispEN RESET 2SDI/1N0 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 1NC 1NC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 NC1 NC1 I/O 42 I/O 41 I/O 40 I/O 39 I/O 38 I/O 37 I/O 36 IN4 GND GND NC1 NC1 VCC VCC I/O 35 I/O 34 I/O 33 I/O 32 I/O 31 I/O 30 I/O 29 NC1 NC1 ispLSI 1024 100-Pin TQFP Pinout Diagram 1. NC pins are not to be connected to any active signal, Vcc or GND. 2. Pins have dual function capability. 11 0766A-24-isp Specifications ispLSI 1024 Pin Configuration 2 4 3 I/O 31 I/O 30 I/O 29 IN 4 GND 5 I/O 32 I/O 38 I/O 37 I/O 36 6 7 I/O 33 I/O 39 8 I/O 35 I/O 34 I/O 41 I/O 40 9 VCC I/O 42 ispLSI 1024 68-Pin JLCC Pinout Diagram 1 68 67 66 65 64 63 62 61 I/O 43 10 60 I/O 28 I/O 44 I/O 45 11 59 12 58 I/O 27 I/O 26 I/O 46 13 57 I/O 25 I/O 47 14 56 I/O 24 IN 5 15 55 IN 3/MODE1 Y0 16 54 Y1 VCC 17 53 VCC GND 18 ispLSI 1024/883 52 GND ispEN RESET 19 Top View 51 Y2 20 50 Y3 1SDI/IN 0 21 49 I/O 0 22 48 IN 2/SCLK1 I/O 23 I/O 1 23 47 I/O 22 I/O 2 24 46 I/O 3 I/O 4 25 45 I/O 21 I/O 20 44 I/O 19 26 I/O 16 I/O 17 I/O 18 I/O 15 I/O 14 VCC I/O 12 I/O 13 1SDO/IN 1 GND I/O 9 I/O 10 I/O 11 I/O 8 I/O 6 I/O 7 I/O 5 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 1. Pins have dual function capability. 0123-24-isp/JLCC 12 Specifications ispLSI 1024 Part Number Description ispLSI 1024 - XX X X X Device Family ispLSI Grade Blank = Commercial I = Industrial /883 = 883 Military Process Device Number Package J = PLCC T = TQFP H = JLCC Power L = Low Speed 90 = 90 MHz fmax 80 = 80 MHz fmax 60 = 60 MHz fmax 00212-80B-isp1024 Ordering Information COMMERCIAL Family fmax (MHz) tpd (ns) Ordering Number Package 90 12 ispLSI 1024-90LJ 68-Pin PLCC 90 12 ispLSI 1024-90LT 100-Pin TQFP 80 15 ispLSI 1024-80LJ 68-Pin PLCC 80 15 ispLSI 1024-80LT 100-Pin TQFP 60 20 ispLSI 1024-60LJ 68-Pin PLCC 60 20 ispLSI 1024-60LT 100-Pin TQFP ispLSI INDUSTRIAL Family fmax (MHz) tpd (ns) Ordering Number Package 60 20 ispLSI 1024-60LJI 68-Pin PLCC 60 20 ispLSI 1024-60LTI 100-Pin TQFP ispLSI MILITARY/883 Family fmax (MHz) tpd (ns) Ordering Number SMD # Package ispLSI 60 20 ispLSI 1024-60LH/883 5962-9476101MXC 68-Pin JLCC Note: Lattice Semiconductor recognizes the trend in military device procurement towards using SMD compliant devices, as such, ordering by this number is recommended. 13 Table 2-0041A-24-isp