Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 1 of 6 June 2006
AG102
High Dynamic Range Gain Block Product Information
The Communications Edge
TM
Product Features
x 60 – 3000 MHz
x 14 dB Gain
x 2.4 dB Noise Figure
x +36 dBm OIP3
x Single +3.3 or +4.5 Supply
x Internally matched to 50 :
x Lead-free/Green/RoHS-
compliant SOT-89 Package
x MTTF > 1000 years
Applications
x Mobile Infrastructure
x CATV / DBS
x W-LAN / ISM
x RFID
x Defense / Homeland Security
x Fixed Wireless
Product Description
The AG102 is a general-purpose gain block that offers
good dynamic range and low noise figure in a low-cost
surface-mount package. The combination of near-constant
OIP3 and low noise figure performance over frequency
makes it attractive for both narrowband and broadband
applications. The device combines dependable performance
with superb quality to maintain MTTF values exceeding
1000 years at mounting temperatures of +85 qC and is
available in the environmentally-friendly lead-free/green
/RoHS-compliant SOT-89 package.
The AG102 uses a high reliability GaAs MMIC technology
and only requires DC-blocking and bypass capacitors, and
an inductive RF choke for operation. Internal matching
provides a 50 ohm input / output impedance minimizing the
number of required external components.
The broadband MMIC amplifier is well suited for various
current and next generation wireless technologies such as
GPRS, GSM, CDMA, and W-CDMA. In addition, the
AG102 will work for other applications within the 60 to
3000 MHz frequency range such as fixed wireless.
Functional Diagram
RF IN GND
RF OUT
GND
1
2
3
4
Function Pin No.
Input 1
Output/Bias 3
Ground 2, 4
Specifications (1)
Parameter Units Min Typ Max
Operational Bandwidth MHz 60 3000
Test Frequency MHz 800
Gain dB 13 14 16
Input Return Loss(5) dB 8.5
Output Return Loss dB 20
Output P1dB dBm +18
Output IP3 (2) dBm +33 +36
Noise Figure (3) dB 2.4
Operating Current Range mA 55 70 90
Supply Voltage V 4.5
1. Test conditions unless otherwise noted: T = 25º C, 50
system.
2. 3OIP measured with two tones at an output power of +2.5 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Noise figure can be optimized by matching the input for optimal return loss.
Absolute Maximum Rating
Parameter Rating
Operating Case Temperature -40 to +85 qC
Storage Temperature -55 to +150 qC
DC Voltage +5.5 V
RF Input Power (continuous) +6 dBm
Junction Temperature +220 qC
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance (4)
Parameter Units
Typical
Frequency MHz 900 1900 900 1900
S21 dB 14 12.8 14 12.5
S11 (5) dB -10 -9 -10 -9
S22 dB -27 -22 -28 -19
Output P1dB dBm +18 +18 +16 +16
Output IP3 dBm +36 +36 +35 +35
Noise Figure dB 2.4 2.6 2.3 2.6
Supply Voltage V +4.5 +3.3
Device Current mA 70 68
4. Parameters reflect performance in an AG102-PCB application circuit, as shown on page 4.
5. Input return loss can be dramatically improved (<-20 dB) for narrowband applications as shown on
page 5 of this datasheet.
Ordering Information
Part No. Description
AG102-G High Dynamic Range Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
AG102-PCB 0.8 – 2.6 GHz Fully Assembled Application Circuit
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 2 of 6 June 2006
AG102
High Dynamic Range Gain Block Product Information
The Communications Edge
TM
Typical Device Data
S-Parameters (VDS = +4.5 V, IDS = 70 mA, T = 25
C, 50 ohm system)
Input return loss can be improved with the appropriate input matching network shown later in this datasheet.
Gain vs. Frequency
6
8
10
12
14
16
0 500 1000 1500 2000 2500 3000
Frequency (MHz)
-40c +25c +85c
S11 vs. Frequency
-30
-25
-20
-15
-10
-5
0
0 500 1000 1500 2000 2500 3000
Frequency (MHz)
-40c +25c +85c
S22 vs. Frequency
-40
-30
-20
-10
0
0 500 1000 1500 2000 2500 3000
Frequency (MHz)
-40c +25c +85c
Noise Figure vs. Frequency
0
1
2
3
4
5
6
0 500 1000 1500 2000 2500 3000
Frequency (MHz)
Output Power / Gain vs. Input Power
frequency = 900 MHz, Temp = +25° C
4
6
8
10
12
14
0 2 4 6 8 10 12 14
Input Power (dBm)
Gain (dB)
12
14
16
18
20
22
Output Power (dBm)
Output Power
Gain
Output Power / Gain vs. Input Power
frequency = 1900 MHz, Temp = +25° C
4
6
8
10
12
14
0 2 4 6 8 10 12 14
Input Power (dBm)
Gain (dB)
12
14
16
18
20
22
Output Power (dBm)
Output Power
Gain
Output IP3 vs. Output Power
frequency = 900 / 910 MHz
20
25
30
35
40
0 2 4 6 8 10
Output Power (dBm)
OIP3 (dBm)
-40c +25c +85c
Output IP3 vs. Output Power
frequency = 1900 / 1910 MHz
20
25
30
35
40
0 2 4 6 8 10
Output Power (dBm)
OIP3 (dBm)
-40c +25c +85c
ACPR vs. Channel Power
25 °C, IS-95, 9 Ch. Forward, ±885 kHz offset, 30 kHz Meas BW
-75
-65
-55
-45
-35
6 7 8 9 10 11 12 13
Output Channel Power (dBm)
freq = 1900 MHz
S-Parameters (VD = +4.5 V, ID = 78 mA, T = 25
C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 -4.72 -30.88 15.44 164.91 -21.66 30.26 -9.38 -40.39
250 -8.67 -27.48 13.93 165.39 -20.26 3.92 -16.70 -32.88
500 -8.96 -37.68 13.75 157.18 -20.14 -2.25 -17.56 -31.25
750 -9.06 -51.15 13.60 148.11 -20.02 -7.65 -18.25 -35.67
1000 -9.04 -66.87 13.47 137.91 -19.92 -10.63 -19.05 -43.62
1250 -9.00 -82.11 13.39 128.62 -19.85 -15.19 -20.28 -51.49
1500 -8.89 -97.31 13.13 118.57 -19.73 -18.74 -21.30 -61.37
1750 -8.74 -112.48 12.91 109.09 -19.56 -23.00 -22.57 -73.75
2000 -8.65 -128.51 12.68 99.48 -19.71 -28.33 -25.15 -85.19
2250 -8.40 -142.86 12.48 89.94 -19.53 -33.37 -27.03 -103.19
2500 -7.99 -157.26 12.22 80.41 -19.40 -37.91 -28.58 -135.19
2750 -7.93 -171.48 11.88 71.42 -19.33 -42.30 -28.56 -177.83
3000 -7.47 175.92 11.53 62.05 -19.58 -47.37 -28.48 153.84
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 3 of 6 June 2006
AG102
High Dynamic Range Gain Block Product Information
The Communications Edge
TM
Typical Device Data
S-Parameters (VDS = +3.3 V, IDS = 68 mA, T = 25
C, 50 ohm system)
Input return loss can be improved with the appropriate input matching network shown later in this datasheet.
Gain vs. Frequency
6
8
10
12
14
16
0 500 1000 1500 2000 2500 3000
Frequency (MHz)
-40c +25c +85c
S11 vs. Frequency
-30
-25
-20
-15
-10
-5
0
0 500 1000 1500 2000 2500 3000
Frequency (MHz)
-40c +25c +85c
S22 vs. Frequency
-40
-30
-20
-10
0
0 500 1000 1500 2000 2500 3000
Frequency (MHz)
-40c +25c +85c
Noise Figure vs. Frequency
0
1
2
3
4
5
6
0 500 1000 1500 2000 2500 3000
Frequency (MHz)
Output IP3 vs. Output Power
frequency = 900 / 910 MHz
20
25
30
35
40
0 2 4 6 8 10
Output Power (dBm)
OIP3 (dBm)
-40c +25c +85c
Output Power / Gain vs. Input Power
frequency = 900 MHz, Temp = +25° C
4
6
8
10
12
14
0 2 4 6 8 10 12 14
Input Power (dBm)
Gain (dB)
10
12
14
16
18
20
Output Power (dBm)
Output Power
Gain
Output Power / Gain vs. Input Power
frequency = 1900 MHz, Temp = +25° C
4
6
8
10
12
14
0 2 4 6 8 10 12 14
Input Power (dBm)
Gain (dB)
10
12
14
16
18
20
Output Power (dBm)
Output Power
Gain
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 4 of 6 June 2006
AG102
High Dynamic Range Gain Block Product Information
The Communications Edge
TM
Application Circuit: 800 – 2600 MHz (AG102-PCB)
C=
ID=
56 pF
C5
C=
ID=
56 pF
C2
L=
ID=
12 nH
L3
C=
ID=
1.8e4 pF
C6
L=
ID=
10 nH
L2
F0=
Loss=
Eeff=
L=
Z0=
1 GHz
0
3.52
170 mil
50 Ohm
NET="AG102"
+4.5 V
Circuit Board Material: .014” FR-4, 4 layers, .062” total thickness
0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6
Frequency (GHz)
9
10
11
12
13
14
S21 (dB)
-25
-20
-15
-10
-5
0
S11, S22 (dB)
DB(|S[1,1]|) * (R)
DB(|S[2,1]|) * (L)
DB(|S[2,2]|) * (R)
Reference Design: 70 MHz
C=1e4 pF
L=180 nH
C=1e4 pF
C=1e4 pF
L=180 nH
C=5.6 pF
NET="AG102"
+4.5 V
0.04 0.05 0.06 0.07 0.08 0.09 0.1 0.11
Frequency (GHz)
12
13
14
15
16
17
S21 (dB)
-25
-20
-15
-10
-5
0
S11, S22 (dB)
DB(|S[1,1]|) (R) DB(|S[2,1]|) (L) DB(|S[2,2]|) (R)
Reference Design: 170 MHz
C=1000 pF
L=220 nH
C=1000 pF
C=1e4 pF
L=39 nH
C=3.9 pF
NET="AG102"
+4.5 V
0.1 0.13 0.16 0.19 0.22 0.25
Frequency (GHz)
12
13
14
15
16
17
S21 (dB)
-25
-20
-15
-10
-5
0
S11, S22 (dB)
DB(|S[1,1]|) (R) DB(|S[2,1]|) (L) DB(|S[2,2]|) (R)
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 5 of 6 June 2006
AG102
High Dynamic Range Gain Block Product Information
The Communications Edge
TM
Reference Design: 450 MHz
C=1000 pF
L=82 nH
C=1000 pF
C=1e4 pF
L=15 nH
C=1.2 pF
NET="AG102"
+4.5 V
0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7
Frequency (GHz)
11
12
13
14
15
16
S21 (dB)
-25
-20
-15
-10
-5
0
S11, S22 (dB)
DB(|S[1,1]|) (R) DB(|S[2,1]|) (L) DB(|S[2,2]|) (R)
Reference Design: 800 MHz
C=100 pF
L=33 nH
C=100 pF
C=100 pF
C=1e4 pF
L=6.8 nH
NET="AG102"
+4.5 V
0.6 0.7 0.8 0.9 1 1.1 1.2
Frequency (GHz)
10
11
12
13
14
15
S21 (dB)
-25
-20
-15
-10
-5
0
S11, S22 (dB)
DB(|S(1,1)|) (R) DB(|S(2,1)|) (L) DB(|S(2,2)|) (R)
Reference Design: 1900 / 2140 MHz
CAP
ID=C3
C=56 pF
IND
ID=L2
L=3 3 nH
CAP
C=56 pF
CAP
ID=C1
C=3.9 pF
IND
ID=L1
L=3.3 nH
CAP
C=1e4 pF
TLINP
ID=TL 1
Z0=50 Ohm
L=1 50 mi l
Eeff=3.4
Loss=0
F0=2 GHz
SUBCKT
NET="AG1 02"
+4 .5 V
1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3
Frequency (GHz)
9
10
11
12
13
14
S21 (dB)
-25
-20
-15
-10
-5
0
S11, S22 (dB)
DB(|S(1,1)|) (R) DB(|S(2,1)|) (L) DB(|S(2,2)|) (R)
Reference Design: CATV Single-ended Operation
L=4.7 nH
C=1.8e4 pF
L=100 nH
C=1000 pF
R=5 Ohm
NET="AG102"
Z=75 Ohm
Z=75 Ohm
+4.5 V
0 0.2 0.4 0.6 0.8 1
Frequency (GHz)
11
12
13
14
15
16
S21 (dB)
-25
-20
-15
-10
-5
0
S11, S22 (dB)
DB(|S[1,1]|) (R) DB(|S[2,1]|) (L) DB(|S[2,2]|) (R)
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 6 of 6 June 2006
AG102
High Dynamic Range Gain Block Product Information
The Communications Edge
TM
AG102-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded
(maximum 245 qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter Rating
Operating Case Temperature -40 to +85 qC
Thermal Resistance, Rth (1) 88 qC/W
Junction Temperature, Tj (2) 113 qC
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 70 mA at an 85
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160
C.
Product Marking
The AG102-G will be marked with an “A1G”
designator. An alphanumeric lot code
(“XXXX-X” ) is also marked below the part
designator on the top surface of the package.
A “3” will be lasermarked in the upper right-
hand corner. The obsolete tin-lead package is
marked with an “A1” designator followed by
an alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1B
Value: Passes
500V to <1000V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value: Passes
1000V to <2000V
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260
C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
MTTF vs. GND Tab Temperature
10
100
1000
10000
60 70 80 90 100 110
Tab Temperature (°C)
MTTF (million hrs)