CDST-19-G/20-G
Features
- Fast switching diode.
- Surface mount package ideally for automatic
insertion.
- For general purpose switching applications.
- High conductance.
Mechanical data
- Case: SOT-23
- Terminals: Solder plated, solderable per
MIL-STD-750, Method 2026.
- Weight: 0.008 gram.
Circuit Diagram
High Speed
RoHS Device
Maximum Rating (at Ta=25°C unless otherwise noted)
OC
mA
V
V
-65 ~ +150
500
200
TJ
RθJA
VRM
VR
IO
Junction temperature
Power dissipation
Thermal resistance-Junction to ambient air
DC blocking voltage
Non-Repetitive peak reverse voltage
Parameter Symbol CDST-20-G Unit
TSTG
Average rectified output current
Storage temperature range
PD250
150
mW
SOT-23
Dimensions in inches and (millimeters)
0.066 (1.70)
1 2
3
0.119 (3.00)
0.110 (2.80)
0.103 (2.60)
0.086 (2.20)
0.020 (0.50)
0.012 (0.30)
0.056 (1.40)
0.047 (1.20)
0.041 (1.05)
0.035 (0.90)
0.083 (2.10)
0.007 (0.20) min
0.006 (0.15) max
0.006 (0.15)
0.003 (0.08)
+
-
CDST-19-G
100
100
150
150
OC
OC/W
Electrical Characteristics (at TA=25°C unless otherwise noted)
V
UA
V
50
1
1.25
0.1
trr
VBR
IR
VF
Junction capacitance
Reverse recovery time
Reverse leakage current
Reverse breakdown voltage
Parameter Symbol Min
Max
Unit
Forward voltage
CJ5pF
Test Conditions
100
150
nS
CDST-19-G
CDST-20-G
CDST-19-G
CDST-20-G
IR=100uA
VR=100V
VR=150V
IF=100mA
IF=200mA
VR=0V, f=1MHZ
IF=IR=30mA, Irr=0.1XIR
Page 1
QW-B0021
REV:B
Comchip Technology CO., LTD.
1 2
3
SMD Switching Diodes
Company reserves the right to improve product design , functions and reliability without notice.
Characteristic Curves (CDST-19-G/20-G)
Fig.1 - Forward Characteristics
0.01
0.1
1
10
100
1000
0 1 2
IF, Forward Current (mA)
VF, Forward Voltage (V)
O
TJ=25 C
Fig.2 - Leakage Current vs
Junction Temperature
0.01
0.1
1
10
100
0
IR, Leakage Current (uA)
TJ, Junction Temperature (°C)
100 200
SMD Switching Diodes
Page 2
QW-B0021
REV:B
Comchip Technology CO., LTD.
Company reserves the right to improve product design , functions and reliability without notice.
QW-B0021 Page 3
SMD Switching Diodes
REV:B
Comchip Technology CO., LTD.
Reel Taping Specification
XXX
B C dD D2D1
SOT-23
SYMBOL
A
(mm)
(inch) 2.142 ± 0.039
4.00 ± 0.10
1.50 + 0.10 54.40 ± 1.00 13.00 ± 1.00
4.00 ± 0.10 2.00 ± 0.10
178 ± 2.00
0.059 0.004+7.008 ± 0.079 0.512 ± 0.039
SYMBOL
(mm)
(inch) 0. ± 0.004157 0.157 ± 0.004 0.079 ± 0.004
E F P P0P1W W1
1.75 ± 0.10
0.069 ± 0.004
3.50 ± 0.10
0.138 ± 0.004
SOT-23
3.15 ± 0.10
0.124 ± 0.004
2.77 ± 0.10
0.109 ± 0.004
1.22 ± 0.10
0.048 ± 0.004
12.30 ± 1.0
0.484 ± 0.039
8.00 0.30 /+–0.10
0.315 0.012 /+–0.004
d
F E
B
P1 P0
o
120
D1
D2
D
W1
Company reserves the right to improve product design , functions and reliability without notice.
QW-B0021 Page 4
SMD Switching Diodes
REV:B
Part Number
CDST-19-G
Marking Code
JP
Marking Code
XX
3
1 2
Suggested PAD Layout
CDST-20-G JR
xx = Product type marking code
Comchip Technology CO., LTD.
Standard Packaging
Case Type
SOT-23 3,000
REEL
( pcs )
Reel Size
(inch)
7
REEL PACK
Company reserves the right to improve product design , functions and reliability without notice.
A
C
B
D
E
SIZE (inch)
0.031
(mm)
0.80
1.90
2.02
0.075
0.080
SOT-23
2.82 0.111
A
B
C
D
0.80 0.031
E