D1+ Con
D1- Con
GND
D2+ Con
D2- Con
D1+ IC
D1- IC
GND
D2+ IC
D2- IC
1
2
3
4
5
10
9
8
7
6
Features
• AEC-Q101 qualified
• 3.5 GHz differential bandwidth to comply with HDMI 2.0, HDMI 1.4, USB 3.1,
MIPI and LVDS
• Common mode attenuation on LTE, GSM, and GPS frequencies:
– -13 dB at 0.7 GHz
– -24 dB at 1.5 GHz
– -30 dB at 2.4 GHZ
– -26 dB at 2.7 GHZ
– -16 dB at 5.0 GHZ
• Wettable flank for automatic optical inspection
• Low PCB space consumption: 3.5 mm²
• Thin package for compact applications: 0.75 mm
• RoHS package
Complies with the following standards
• UL94, V0
• J-STD-020 MSL level 1
• J-STD-002
• IPC7531 footprint and JEDEC registered package
• ISO 10605, IEC 61000-4-2, C = 150 pF – R = 330 Ω level 4:
– 8 kV (contact discharge)
– 15 kV (air discharge)
• ISO 10605, C = 330 pF – R = 330 Ω level 4:
– 8 kV (contact discharge)
– 15 kV (air discharge)
Description
The ECMF04-4HSWM10Y is an integrated common mode filter designed to suppress
EMI/RFI common mode noise on high speed buses HDMI 1.4, USB 3.1 and MIPI. It
is designed to replace discrete common mode chokes or LTCC.
The device embeds ESD protections on connector side to meets ISO 10605
requirements.
Packaged in QFN-10L with wettable flank, it is compatible with automatic visual
inspection.
Product status link
ECMF04-4HSWM10Y
Product summary
Order code ECMF04-4HSWM10Y
Automotive common mode filter with ESD protection
ECMF04-4HSWM10Y
Datasheet
DS12859 - Rev 1 - December 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
VPP Peak pulse voltage
ISO 10605 (C = 330 pF, R = 330 Ω):
Contact discharge
Air discharge
8
15
kV
ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω):
Contact discharge
Air discharge
8
15
kV
IRMS RMS current 100 mA
Top Operating ambient temperature range -55 to +125
°C
Tstg Storage temperature range -55 to +150
Figure 1. Electrical characteristics (definitions)
VCL
VBR
VRM
IRM
IR
IPP
V
I
VRM Maximum stand-off voltage
VCL Clamping voltage at peak pulse current IPP
IRM Leakage current at VRM
IPP Peak pulse current
VBR Breakdown voltage
RDC DC serial resistance
fC Differential cut off frequency
Table 2. Electrical characteristics (Tamb = 25 °C)
Symbol Test conditions Min. Typ. Max. Unit
VBR IR = 1 mA 6 7 V
IRM VRM = 3 V 100 nA
RDC IDC = 20 mA 5.5 Ω
fcSDD21 = -3 dB 3.5 GHz
VCL 8 kV contact discharge after 30 ns, ISO 10605 (150 pF – 330 Ω) 27 V
ECMF04-4HSWM10Y
Characteristics
DS12859 - Rev 1 page 2/12
1.1 Characteristics (curves)
Figure 2. Differential attenuation versus frequency
(Z0_diff = 100 Ω)
Figure 3. Common mode attenuation versus frequency
(Z0_com = 50 Ω)
Figure 4. ISO 10605 - C = 150 pF, R = 330 Ω (+8 kV contact) Figure 5. ISO 10605 - C = 150 pF, R = 330 Ω (-8 kV contact)
Figure 6. TLP characteristic
-20
-15
-10
-5
0
5
10
15
20
-40 -30 -20 -10 0 10 20 30 40
I(A)
V(V)
ECMF04-4HSWM10Y
Characteristics (curves)
DS12859 - Rev 1 page 3/12
Figure 7. HDMI1.4 – 1.485 Gbps eye diagram without
device Figure 8. HDMI1.4 – 1.485 Gbps eye diagram with device
Figure 9. HDMI2.0 – 5.94 Gbps eye diagram without device
(with worst cable and equalizer)
Figure 10. HDMI2.0 – 5.94 Gbps eye diagram with device
(with worst cable and equalizer)
Figure 11. MIPI - 5.83 Gbps eye diagram without device Figure 12. MIPI - 5.83 Gbps eye diagram with device
ECMF04-4HSWM10Y
Characteristics (curves)
DS12859 - Rev 1 page 4/12
Figure 13. USB3.1 – 5 Gbps eye diagram without device
(with worst cable and equalizer)
Figure 14. USB3.1 – 5 Gbps eye diagram with device (with
worst cable and equalizer)
ECMF04-4HSWM10Y
Characteristics (curves)
DS12859 - Rev 1 page 5/12
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1 QFN-10L package information
Figure 15. QFN-10L package outline
D
E
CD CW
A3
A1
b
L
e
A
1
6
5
10(N)
Seating
plane
1
Table 3. QFN-10L mechanical data
Ref.
Dimensions
Millimeters Inches(1)
Min. Typ. Max. Min. Typ. Max.
A 0.70 0.75 0.80 0.0275 0.0295 0.0315
A1 0.00 0.02 0.05 0.0000 0.0008 0.0020
A3 0.20 0.0079
b 0.15 0.20 0.25 0.0059 0.0079 0.0099
D 2.55 2.60 2.65 0.1003 0.1024 0.1044
E 1.30 1.35 1.40 0.0511 0.0531 0.0552
e 0.50 0.0197
L 0.45 0.50 0.55 0.0177 0.0197 0.0217
CW 0.01 0.05 0.09 0.0003 0.0020 0.0032
CD 0.10 0.0039
1. Value in inches are converted from mm and rounded to 4 decimal digits
ECMF04-4HSWM10Y
Package information
DS12859 - Rev 1 page 6/12
3PCB assembly recommendations
Figure 16. Recommended PCB layout
350 µm
350 µm
150 µm
m
µ
0
7
1
m
µ
0
7
1
330 µm
5000 µm
Connector Host
Pad layout
Differential
lanes
(Z0= 100 )
Differential
lanes
(Z0= 100 )
Figure 17. Recommended PCB stack-up Figure 18. Recommended stencil opening (mm)
0.190
2.190
0.500
1.710
0.660
Stencil opening thickness: 100 µm
Figure 19. Wettable flank profile
3.1 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Use solder paste with fine particles: powder particle size is 20-38 μm.
ECMF04-4HSWM10Y
PCB assembly recommendations
DS12859 - Rev 1 page 7/12
3.2 QFN-10L packing information
Figure 20. Footprint recommendations (mm)
0.500
0.200
0.700
1.750
2.200
Figure 21. Marking
XXYM
Dot indicates pin 1
XX: Marking
Y: Year
M: Month
Figure 22. Package orientation in reel
Pin 1 located according to EIA-481
Note: Pocket dimensions are not on scale
Pocket shape may vary depending on package
Figure 23. Tape and reel orientation
Figure 24. Reel dimensions (mm)
Ø 60 Ø 20.2 min
Ø 180 max
Ø 13
2±0.5
14.4
Figure 25. Inner box dimensions (mm)
205
205
30
ECMF04-4HSWM10Y
QFN-10L packing information
DS12859 - Rev 1 page 8/12
Figure 26. Tape and reel outline
Table 4. Tape and reel mechanical data
Ref.
Dimensions
Millimeters
Min. Typ. Max.
ØD0 1.40 1.50 1.50
ØD1 0.80
F 1.65 1.75 1.85
K0 0.85 0.95 1.05
P0 3.9 4.0 4.1
P1 3.9 4.0 4.1
P2 1.95 2.00 2.05
W 7.9 8.0 8.3
3.3 Solder reflow
Figure 27. ST ECOPACK® recommended soldering reflow profile for PCB mounting
250
0
50
100
150
200
240210180150120906030 300
270
-6° C/s
240-245 °C
2 - 3 °C/s
Temperature (°C) -2 °C/s
-3 °C/s
Time (s)
0.9 °C/s
60 sec
(90m ax)
Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.
ECMF04-4HSWM10Y
Solder reflow
DS12859 - Rev 1 page 9/12
Revision history
Table 5. Document revision history
Date Version Changes
17-Dec-2019 1 Initial release.
ECMF04-4HSWM10Y
DS12859 - Rev 1 page 11/12
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
ECMF04-4HSWM10Y
DS12859 - Rev 1 page 12/12
