Spansion(R) Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name "Fujitsu", the company that originally developed the specification, Spansion will continue to offer these products to new and existing customers. Continuity of Specifications There is no change to this document as a result of offering the device as a Spansion product. Any changes that have been made are the result of normal document improvements and are noted in the document revision summary, where supported. Future routine revisions will occur when appropriate, and changes will be noted in a revision summary. Continuity of Ordering Part Numbers Spansion continues to support existing part numbers beginning with "MB". To order these products, please use only the Ordering Part Numbers listed in this document. For More Information Please contact your local sales office for additional information about Spansion memory, analog, and microcontroller products and solutions. FUJITSU MICROELECTRONICS DATA SHEET DS04-27300-4Ea ASSP BIPOLAR VOLTAGE DETECTOR MB3761 DESCRIPTION Designed for voltage detector applications, the Fujitsu Microelectronics MB3761 is a dual comparator with a builtin high precision reference voltage generator. Outputs are open-collector outputs and enable use of the ORconnection between both channels. Both channels have hysteresis control outputs. Because of a wide power supply voltage range and a low power supply current, the MB3761 is suitable for power supply monitors and battery backup systems. FEATURES * * * * * Wide power supply voltage range: 2.5 V to 40 V Low power and small voltage dependency supply current: 250 A Typ Built-in stable low voltage generator: 1.20 V Typ Easy-to-add hysteresis characteristics. One type of package (SOP-8pin : 1 type) APPLICATIONS * Industrial Equipment * Arcade Amusement etc. Copyright(c)1994-2008 FUJITSU MICROELECTRONICS LIMITED All rights reserved 2006.5 MB3761 PIN ASSIGNMENT (TOP VIEW) IN-B (+) 1 B HYS-A 2 IN-A 3 OUT-A 4 8 VCC 7 HYS-B 6 OUT-B 5 GND ( -) (+) A ( -) (FPT-8P-M01) 2 MB3761 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Rating Min Max Unit Power Supply Voltage VCC 41 V Output Voltage VO 41 V Output Current IO 50 mA Input Voltage VIN - 0.3 + 6.5 V Power Dissipation PD 350 (TA +70C) mW TSTG - 55 + 125 C Storage Temperature WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Value Unit Min Max VCC 2.5 40 V Operating Ambient Temperature TA - 20 + 75 C Output Current at pin 4 IO4 4.5 mA Output Current at pin 6 IO6 3.0 mA Power Supply Voltage WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand. 3 MB3761 ELECTRICAL CHARACTERISTICS (TA=+25C, VCC=5 V) Parameter Power Supply Voltage Threshold Voltage Deviation of Threshold Voltage Offset Voltage between Outputs Conditions Value Min Typ Max Unit ICCL VCC= 40 V, VIL= 1.0 V - 250 400 A ICCH VCC= 40 V, VIH = 1.5 V - 400 600 A VTH IO = 2 mA, VO= 1 V 1.15 1.20 1.25 V VTH1 2.5 V VCC 5.5 V - 3 12 mV VTH2 4.5 V VCC 40 V - 10 40 mV VOOSA IOA= 4.5 mA, VOA= 2 V, IHA= 20 A, VHA= 3 V - 2.0 - mV VOSSB IOB= 3 mA, VOB= 2 V, IHB= 3 mA, VHB= 2 V - 2.0 - mV -20C TA +70C - 0.05 - mV/C -10 - +10 mV Temperature Coefficient of Threshold Voltage Difference Voltage on Threshold Voltage between Channel VTHAB - IIL VIL= 1.0 V - 5 IIH VIH= 1.5 V - 100 500 nA Output Leakage Current IOH VO= 40 V, VIL= 1.0 V - - 1 A Hysteresis Output Leakage Current IHLA VCC= 40 V, VHA= 0 V, VIL= 1.0 V - - 0.1 A IHHB VHB= 40 V, VIH= 1.5 V - - 1 A IOLA VO= 1.0 V, VIH= 1.5 V 6 12 - mA IOLB VO= 1.0 V, VIH= 1.5 V 4 10 - mA IHHA VH= 0 V, VIH= 1.5 V 40 80 - A IHLB VH= 1.0 V,VIL = 1.0 V 4 10 - mA VOLA IO= 4.5 mA, VIH = 1.5 V - 120 400 mV VOLB IO= 3.0 mA, VIH= 1.5 V - 120 400 mV VHHA IH= 20 A, VIH= 1.5 V - 50 200 mV VHLB IH= 3.0 mA, VIL= 1.0 V - 120 400 mV tPHL RL= 5 k - 2 - s tPLH RL= 5 k - 3 - s Input Current Output Sink Current Hysteresis Current Output Saturation Voltage Hysteresis Saturation Output Delay Time 4 Symbol nA MB3761 EQUIVALENT CIRCUIT HYS-A 2 OUT-A 4 8 V CC 7 HYS-B 5 GND V REF 1.2 V 3 1 6 IN-A IN-B OUT-B OPERATIONAL DEFINITIONS VO(A) VIN R4 VCC R6 RL R1 1 8 2 7 3 6 R5 R3 RL VIL(A) VIH(A) VIN V H(B) HYS-B VH(B) OUT-B VO(B) 4 5 R2 VIN VO(A) OUT-A VO(B) GND VIN VIL(B) VIH(B) Note: VIH(A) = (1 + R1 )VR R2 VIL(A) = (1 + R1 )VR - R1 VCC R3 R2 // R3 VIH(B) R4 = (1 + ) VR R5 // R6 VIL(B) = (1 + R4 ) VR R5 . VR .=. VTH (=. 1.20 V) R2 // R3 = R2 R3 R2 + R3 R5 // R6 = R5 R6 R5 + R6 5 MB3761 TYPICAL PERFORMANCE CHARACTERISTICS Power Supply Current vs. Power Supply Voltage Ta=+70C Ta=+25C Ta=-20C 400 VIH = 1.5 V 300 Ta=+70C 200 Ta=-20C VIL = 1.0 V Ta=+25C 100 0 0 10 20 30 Hysteresis (A) Current IHHA (A) 150 500 Power Supply Current ICC (A) Hysteresis (A) Current vs. Power Supply Voltage Ta=+70C 120 Ta=+25C Ta=-20C 90 VIH = 1.5 V 60 30 0 0 40 10 Power Supply Voltage VCC (V) Output Saturation (A) Voltage vs. Output Sink (A) Current Output Saturation (B) Voltage VOLB (V) Output Saturation (A) Voltage VOLA (V) Ta= Ta= -20C +25C VCC = 5 V Ta= +70C VIH = 1.5 V 0.6 0.4 0.2 0 0 5 10 15 20 25 Ta= Ta= Ta= -20C +25C +70C 0.8 VCC = 5 V VIH = 1.5 V 0.6 0.4 0.2 0 0 5 10 15 20 25 Output Sink (B) Current IOL(B) (mA) Threshold Voltage vs. Operating Ambient Temperature Threshold Voltage vs. Power Supply Voltage 1.22 Threshold Voltage VTH (V) Threshold Voltage VTH (V) 1.22 1.21 1.20 Ta = +25C 1.19 1.18 10 20 30 Power Supply Voltage VCC (V) 6 40 1.0 Output Sink (A) Current IOL(A) (mA) 1.17 0 30 Output Saturation (B) Voltage vs. Output Sink (B) Current 1.0 0.8 20 Power Supply Voltage VCC (V) 40 1.21 1.20 1.19 V CC = 5 V 1.18 1.17-20 0 +20 +40 +60 +80 Operating Ambient Temperature Ta (C) MB3761 APPLICATION EXAMPLES 1. Addition of Hysteresis VO(A) VCC (VIN) R1 1 8 2 7 3 6 4 5 RL R2 VIL(A) VIN (VCC) VIH(A) VO(A) R1 + R2 . VIH(A) =. (1 + )V R R3 R3 .. (1 + R2 )V R VIL(A) = R3 GND VH(B) VCC R1 RL 1 8 2 7 VH(B) 3 6 VO(B) 4 5 VIH R2 R3 VO(B) C1 VIH VIL(B) GND VIH(B) VIH(B) .=. (1 + R1 )V R R2 R1 . )V R VIL(B) =. (1 + R2 + R3 Note : All calculations occur with the output voltage at 0. The hysteresis values are adjusted for load condition and saturation voltage. 2. Voltage Detection for Alarm VO VCC R3 RL R1 R2 1 8 2 7 3 6 4 5 VO VCCL VCCH VCC VCCH = (1 + R1 )VR R2 R4 GND For hysteresis, a positive feedback from pin 2 or 7 is required. VCCL = (1 + R3 )VR R4 VCCL 2.5 V 7 MB3761 3. Voltage Detection for Alarm VO VCC R3 RL R1 R4 1 8 2 7 3 6 4 5 VO VCC VCCL VCCH R2 GND VCCH = (1 + R3 )VR R4 VCCL = (1 + R1 )VR R2 VCCL 2.5 V 4. Programmable Zener V CC V Z = (1 + R1 VZ R2 + R3 1 8 2 7 3 6 4 5 VZ V CC - V Z 6 mA R1 R2 + R3 GND Note : Channel B can be used independently. 8 R2 ) VR R3 MB3761 5. Recovery Reset Circuit V CC = 5 V R1 R2 3.3 k 15 k R4 330 k 6.8 k R3 1 8 2 7 3 6 4 5 OUT R5 6.8 k 0.1 F C1 OUT GND 9 MB3761 TYPICAL CHARACTERISTICS DC Characteristics Response Characteristics V CC (V) V O (V) 6 4 0 V O (V) 2 0 1 3 2 4 6 5 Power-On Reset Time is provided by the following approximate equation: tRST 10 R1 (R2 + R3 ) VTH R3 R4 = -C1 R4 * In VTH { 1 - VCC (1 + R1 R2 + R3 * The recommended value of hFE of the external transistor is from 50 to 200. * In the case of an instant power fail, the remaining charge in C1 effects tRST. * If necessary, the reversed output is provided on HYS terminal { * = VCCL + V CC V CC (H) VO 4.4 t RST 30 ms Voltage Threshold Levels (VCCL and VCCH) and Hysteresis Width can be changed by the resistors (R1 through R4). R1 + R2 + R3 VCCL = VTH R3 VCCH V CC (L) 0 0 V CC (V) * 5 ) MB3761 NOTES ON USE * Take account of common impedance when designing the earth line on a printed wiring board. * Take measures against static electricity. - For semiconductors, use antistatic or conductive containers. - When storing or carrying a printed circuit board after chip mounting, put it in a conductive bag or container. - The work table, tools and measuring instruments must be grounded. - The worker must put on a grounding device containing 250 k to 1 M resistors in series. * Do not apply a negative voltage - Applying a negative voltage of -0.3 V or less to an LSI may generate a parasitic transistor, resulting in malfunction. ORDERING INFORMATION Part number Package Remarks MB3761PF- 8-pin plastic SOP (FPT-8P-M01) Conventional version MB3761PF-E1 8-pin plastic SOP (FPT-8P-M01) Lead Free version RoHS Compliance Information of Lead (Pb) Free version The LSI products of Fujitsu Microelectronics with "E1" are compliant with RoHS Directive , and has observed the standard of lead, cadmium, mercury, Hexavalent chromium, polybrominated biphenyls (PBB) , and polybrominated diphenyl ethers (PBDE) . The product that conforms to this standard is added "E1" at the end of the part number. MARKING FORMAT (Lead Free version) Lead Free version 3761 E1XXXX XXX INDEX 11 MB3761 LABELING SAMPLE (Lead free version) Lead free mark JEITA logo MB123456P - 789 - GE1 (3N) 1MB123456P-789-GE1 1000 (3N)2 1561190005 107210 JEDEC logo G Pb QC PASS PCS 1,000 MB123456P - 789 - GE1 2006/03/01 ASSEMBLED IN JAPAN MB123456P - 789 - GE1 1/1 0605 - Z01A 1000 1561190005 Lead Free version 12 MB3761 MB3761PF-E1 RECOMMENDED CONDITIONS OF MOISTURE SENSITIVITY LEVEL Item Condition Mounting Method IR (infrared reflow) , Manual soldering (partial heating method) Mounting times 2 times Storage period Before opening Please use it within two years after Manufacture. From opening to the 2nd reflow Less than 8 days When the storage period after opening was exceeded Please processes within 8 days after baking (125 C, 24H) 5 C to 30 C, 70%RH or less (the lowest possible humidity) Storage conditions [Temperature Profile for FJ Standard IR Reflow] (1) IR (infrared reflow) H rank : 260 C Max 260 C 255 C 170 C ~ 190 C (b) RT (a) (a) Temperature Increase gradient (b) Preliminary heating (c) Temperature Increase gradient (d) Actual heating (d') (e) Cooling (c) (d) (e) (d') : Average 1 C/s to 4 C/s : Temperature 170 C to 190 C, 60s to 180s : Average 1 C/s to 4 C/s : Temperature 260 C Max; 255 C or more, 10s or less : Temperature 230 C or more, 40s or less or Temperature 225 C or more, 60s or less or Temperature 220 C or more, 80s or less : Natural cooling or forced cooling Note : Temperature : the top of the package body (2) Manual soldering (partial heating method) Conditions : Temperature 400 C Max Times : 5 s max/pin 13 MB3761 PACKAGE DIMENSION 8-pin plastic SOP (FPT-8P-M01) 8-pin plastic SOP (FPT-8P-M01) Lead pitch 1.27 mm Package width x package length 5.3 x 6.35 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 2.25 mm MAX Weight 0.10 g Code (Reference) P-SOP8-5.3x6.35-1.27 Note 1) *1 : These dimensions include resin protrusion. Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. +0.25 +.010 +0.03 *1 6.35 -0.20 .250 -.008 0.17 -0.04 +.001 8 .007 -.002 5 *2 5.300.30 7.800.40 (.209.012) (.307.016) INDEX Details of "A" part +0.25 2.00 -0.15 +.010 .079 -.006 1 1.27(.050) "A" 4 0.470.08 (.019.003) 0.13(.005) (Mounting height) 0.25(.010) 0~8 M 0.500.20 (.020.008) 0.600.15 (.024.006) +0.10 0.10 -0.05 +.004 .004 -.002 (Stand off) 0.10(.004) C 14 2002 FUJITSU LIMITED F08002S-c-6-7 Dimensions in mm (inches). Note: The values in parentheses are reference values. MB3761 MEMO 15 FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD. 151 Lorong Chuan, #05-08 New Tech Park, Singapore 556741 Tel: +65-6281-0770 Fax: +65-6281-0220 http://www.fujitsu.com/sg/services/micro/semiconductor/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 47, 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 http://emea.fujitsu.com/microelectronics/ FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm.3102, Bund Center, No.222 Yan An Road(E), Shanghai 200002, China Tel: +86-21-6335-1560 Fax: +86-21-6335-1605 http://cn.fujitsu.com/fmc/ Korea FUJITSU MICROELECTRONICS KOREA LTD. 206 KOSMO TOWER, 1002 Daechi-Dong, Kangnam-Gu,Seoul 135-280 Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://www.fmk.fujitsu.com/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, 11 Canton Road Tsimshatsui, Kowloon Hong Kong Tel: +852-2377-0226 Fax: +852-2376-3269 http://cn.fujitsu.com/fmc/tw All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners. Edited Strategic Business Development Dept.