Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called"TAIYO YUDEN' s official sales channel"). It is only applicable to the products purchased from any of TAIYO YUDEN's official sales channel. Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. Caution for export Certain items in this catalog may require specific procedures for export according to"Foreign Exchange and Foreign Trade Control Law"of Japan,"U.S. Export Administration Regulations", and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. 12 notice_e-01 HIGH-Q MULTILAYER CHIP INDUCTOR FOR HIGH FREQUENCY APPLICATIONS (HK SERIES Q TYPE / AQ SERIES) REFLOW FEATURES APPLICATIONS HKQ Series HKQ Series Portable telephones, PHS and W-LAN Multilayer inductor made of advanced ceramics with low-resistivity silver used as internal conductors provides excellent Q and SRF characteristics. Designed to address surface mount inductor needs for applications above 500MHz. Multilayer block structure ensures outstanding reliability, high productivity and product quality. Miscellaneous high-frequency circuits EMI countermeasure in high-frequency circuits AQ Series Mobile telephone, Wireless LAN High frequency module AQ Series Tuner High frequency inductors with high Q and high SRF suitable for high frequency circuit. High-frequency circuits Easy mounting and heat-resistance suitable for replacement of wire-wound inductors. E24 series lineup in a range from 2nH to 10nH makes circuit design easy. Monolithic structure provides high-reliability. ORDERING CODE H K Q 0 6 HKQ 0 3 S Type Multilayer chip inductors for high frequency High Q Version 1 0 External Dimensions LxW mm 0603 0201 0.6x0.3 N Nominal InductancenH Series S U 3.9 10 Q AQ Type Chip inductors for high frequency High Q type 1 0 5 1 0 N J Nominal InductancenH External Dimensions mm 105 0402 1.0x0.6 Example 3N9 10N 3.9 10 *N0.0 nH type T T Example 3N9 10N *N0.0 nH type A J Packaging Tape & Reel Inductance Tolerances H 3% J 5% B 0.1nH C 0.2nH S 0.3nH T Inductance Tolerances H 3% J 5% C 0.2nH S 0.3nH T Packaging Tape & Reel EXTERNAL DIMENSIONS/STANDARD QUANTITY HKQ Type Type L W T e HKQ0603S 0201 HKQ0603U 0201 AQ105 0402 0.60.03 0.0240.001 0.60.03 0.0240.001 1.00.05 0.0390.002 0.30.03 0.0120.001 0.30.03 0.0120.001 0.60.1 0.0240.004 0.30.03 0.0120.001 0.30.03 0.0120.001 0.50.05 0.0200.002 0.10.05 0.0040.002 0.10.05 0.0040.002 0.1750.075 0.0070.003 Standard Quantitypcs Paper Tape Embossed Tape 15000 15000 10000 Unitmm inch Please Contact Our Sales Department office for Products Details. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 102 12 mlci05_e-01 AVAILABLE INDUCTANCE RANGE HKQ0603S Series InductancenH HKQ0603S Imax. [mA] Operating temp.: 0.6 0.7 0.8 0.9 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12.0 15.0 18.0 22.0 0N6 0N7 0N8 0N9 1N0 1N2 1N5 1N8 2N2 2N7 3N3 3N9 4N7 5N6 6N8 8N2 10N 12N 15N 18N 22N 600 55125 550 550 520 490 380 420 370 270 300 260 210 220 210 190 190 160 160 150 140 130 18.0 22.0 , mark indicates the Inductance tolerance code. The product with tolerance less than 0.3nH , 5 is also available. Please contact your local sales office. HKQ0603U Series InductancenH HKQ0603U Imax. [mA] Operating temp.: 0.6 0.7 0.8 0.9 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12.0 15.0 0N6 0N7 0N8 0N9 1N0 1N2 1N5 1N8 2N2 2N7 3N3 3N9 4N7 5N6 6N8 8N2 10N 12N 15N 18N 22N 900 900 900 900 850 800 600 640 500 400 415 390 350 325 305 290 230 230 220 55125 , mark indicates the Inductance tolerance code. The product with tolerance less than 0.3nH , 5 is also available. Please contact your local sales office. 205 190 AQ Series Imax. [mA] Operating temp.: 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12.0 15.0 1N0 1N2 1N5 1N8 2N2 2N7 3N3 3N9 4N7 5N6 6N8 8N2 10N 12N 15N 710 710 710 710 660 630 540 490 450 420 390 360 330 300 280 930 930 930 930 870 820 710 630 590 550 510 470 440 390 360 55125 Operating temp.: 5585 , mark indicates the Inductance tolerance code. The product with tolerance less than 0.3nH , 5 is also available. Please contact your local sales office. PART NUMBERS HKQ0603S EHS Environmental Inductance Hazardous nH Substances Ordering code HKQ0603S 0N6 HKQ0603S 0N7 HKQ0603S 0N8 HKQ0603S 0N9 HKQ0603S 1N0 HKQ0603S 1N1 HKQ0603S 1N2 HKQ0603S 1N3 HKQ0603S 1N4 HKQ0603S 1N5 HKQ0603S 1N6 HKQ0603S 1N7 HKQ0603S 1N8 HKQ0603S 1N9 HKQ0603S 2N0 HKQ0603S 2N1 HKQ0603S 2N2 HKQ0603S 2N3 HKQ0603S 2N4 HKQ0603S 2N5 HKQ0603S 2N6 HKQ0603S 2N7 HKQ0603S 2N8 HKQ0603S 2N9 HKQ0603S 3N0 HKQ0603S 3N1 HKQ0603S 3N2 HKQ0603S 3N3 HKQ0603S 3N4 HKQ0603S 3N5 HKQ0603S 3N6 HKQ0603S 3N7 HKQ0603S 3N8 HKQ0603S 3N9 HKQ0603S 4N3 HKQ0603S 4N7 HKQ0603S 5N1 HKQ0603S 5N6 HKQ0603S 6N2 HKQ0603S 6N8 HKQ0603S 7N5 HKQ0603S 8N2 HKQ0603S 9N1 HKQ0603S 10N HKQ0603S 12N HKQ0603S 15N HKQ0603S 18N HKQ0603S 22N 0.1nH Step E24 Step E12 Step RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 12 15 18 22 Tolerance min. LQ Measuring frequency [MHz] 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 0.3nH, 0.2nH 5%, 3% 5%, 3% 5%, 3% 5%, 3% 5%, 3% 5%, 3% 5%, 3% 5%, 3% 5%, 3% 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 12 12 11 10 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 500 Self-resonant Resistance Rated Thickness frequency DC mm current MHz inch mAmax. 2.0G 2.4G min. max. >56 >64 10000 0.06 600 >56 >64 10000 0.07 550 >56 >64 10000 0.07 550 >56 >64 10000 0.08 520 56 64 10000 0.09 490 47 54 10000 0.12 420 44 51 10000 0.15 380 42 47 10000 0.19 330 41 47 10000 0.11 440 41 46 10000 0.12 420 41 46 10000 0.13 410 41 46 10000 0.15 380 41 46 10000 0.16 370 40 45 10000 0.20 330 39 44 10000 0.24 300 39 44 10000 0.26 290 39 43 10000 0.28 270 38 43 10000 0.30 270 38 42 10000 0.32 260 35 39 9500 0.20 330 35 39 9300 0.22 310 35 39 9100 0.24 300 35 39 8900 0.25 290 35 39 8700 0.28 270 0.30.03 0.0120.001 35 39 8600 0.28 270 35 39 8400 0.29 270 35 39 8200 0.30 270 35 39 8100 0.32 260 35 39 8000 0.36 240 35 39 7800 0.40 230 35 39 7700 0.41 230 35 38 7600 0.44 220 35 38 7500 0.48 210 35 38 7300 0.48 210 34 37 6500 0.39 230 34 37 6200 0.44 220 34 37 5900 0.49 210 34 37 5500 0.47 210 33 36 5100 0.52 200 32 35 4800 0.55 190 32 34 4600 0.51 200 31 33 4300 0.57 190 30 32 4000 0.73 170 29 31 3800 0.85 160 27 27 3300 0.85 160 24 23 2600 0.89 150 23 21 2300 1.05 140 22 19 1900 1.29 130 QTypicalFrequency [Hz] 500M 800M 1.8G >24 >31 >53 >24 >31 >53 >24 >31 >53 >24 >31 >53 24 31 53 19 26 44 19 25 42 19 25 40 19 24 39 19 24 39 19 24 39 19 24 39 18 24 39 18 23 38 17 23 37 17 23 37 17 23 37 17 23 36 17 22 36 17 22 34 17 22 33 17 22 33 17 22 33 17 22 33 17 22 33 17 22 33 17 22 33 17 22 33 16 22 33 16 22 33 16 22 33 16 22 33 16 22 33 16 22 33 16 21 32 16 21 32 16 21 32 16 21 32 16 21 32 16 21 31 16 20 30 16 20 30 16 20 30 16 20 28 16 20 27 15 19 24 15 19 23 15 19 22 INDUCTORS FOR HIGH FREQUENCY APPLICATIONS INDUCTORS InductancenH AQ105 , mark indicates the Inductance tolerance code. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci05_e-01 12 103 PART NUMBERS HKQ0603U EHS Environmental Hazardous Substances Inductance nH Tolerance min. LQ Measuring frequency [MHz] 500M 800M 1.8G 2.0G 2.4G Self-resonant frequency MHz min. HKQ0603U 0N6 RoHS 0.6 0.3nH0.2nH0.1nH 14 500 >35 >47 >75 >80 >88 10000 0.06 900 HKQ0603U 0N7 RoHS 0.7 0.3nH0.2nH0.1nH 14 500 >35 >47 >75 >80 >88 10000 0.06 900 HKQ0603U 0N8 RoHS 0.8 0.3nH0.2nH0.1nH 14 500 >35 >47 >75 >80 >88 10000 0.06 900 HKQ0603U 0N9 RoHS 0.9 0.3nH0.2nH0.1nH 14 500 >35 >47 >75 >80 >88 10000 0.06 900 HKQ0603U 1N0 RoHS 1 0.3nH0.2nH0.1nH 14 500 >35 >47 >75 >80 >88 10000 0.07 850 HKQ0603U 1N1 RoHS 1.1 0.3nH0.2nH0.1nH 14 500 >35 >47 >75 >80 >88 10000 0.07 850 HKQ0603U 1N2 RoHS 1.2 0.3nH0.2nH0.1nH 14 500 35 47 75 80 88 10000 0.08 800 HKQ0603U 1N3 RoHS 1.3 0.3nH0.2nH0.1nH 14 500 32 43 70 74 82 10000 0.09 760 HKQ0603U 1N4 RoHS 1.4 0.3nH0.2nH0.1nH 14 500 29 39 63 67 75 10000 0.12 640 HKQ0603U 1N5 RoHS 1.5 0.3nH0.2nH0.1nH 14 500 27 36 59 62 69 10000 0.15 600 HKQ0603U 1N6 RoHS 1.6 0.3nH0.2nH0.1nH 14 500 25 33 54 57 63 10000 0.19 510 HKQ0603U 1N7 RoHS 1.7 0.3nH0.2nH0.1nH 14 500 25 32 52 54 61 10000 0.11 680 HKQ0603U 1N8 RoHS 1.8 0.3nH0.2nH0.1nH 14 500 25 32 51 53 59 10000 0.12 640 HKQ0603U 1N9 RoHS 1.9 0.3nH0.2nH0.1nH 14 500 24 31 50 53 58 10000 0.13 620 HKQ0603U 2N0 RoHS 2 0.3nH0.2nH0.1nH 14 500 24 31 50 53 58 10000 0.15 600 HKQ0603U 2N1 RoHS 2.1 0.3nH0.2nH0.1nH 14 500 24 31 50 53 58 10000 0.16 550 HKQ0603U 2N2 RoHS 2.2 0.3nH0.2nH0.1nH 14 500 24 31 50 53 58 10000 0.20 500 HKQ0603U 2N3 RoHS 2.3 0.3nH0.2nH0.1nH 14 500 24 31 49 52 58 10000 0.24 460 HKQ0603U 2N4 RoHS 2.4 0.3nH0.2nH0.1nH 14 500 22 28 45 48 53 10000 0.26 430 HKQ0603U 2N5 RoHS 2.5 0.3nH0.2nH0.1nH 14 500 22 29 46 49 54 10000 0.28 415 HKQ0603U 2N6 RoHS 2.6 0.3nH0.2nH0.1nH 14 500 21 27 44 46 51 10000 0.30 405 HKQ0603U 2N7 RoHS 2.7 0.3nH0.2nH0.1nH 14 500 20 26 41 43 48 10000 0.32 400 HKQ0603U 2N8 RoHS 2.8 0.3nH0.2nH0.1nH 14 500 20 26 41 43 47 9500 0.20 500 HKQ0603U 2N9 RoHS 2.9 0.3nH0.2nH0.1nH 14 500 20 26 41 43 47 9300 0.22 480 HKQ0603U 3N0 RoHS 3 0.3nH0.2nH0.1nH 14 500 20 26 41 43 47 9100 0.24 460 HKQ0603U 3N1 RoHS 3.1 0.3nH0.2nH0.1nH 14 500 20 26 41 43 47 8900 0.25 450 HKQ0603U 3N2 RoHS 3.2 0.3nH0.2nH0.1nH 14 500 20 26 40 43 47 8700 0.28 415 HKQ0603U 3N3 RoHS 3.3 0.3nH0.2nH0.1nH 14 500 20 26 40 43 47 8600 0.28 415 HKQ0603U 3N4 RoHS 3.4 0.3nH0.2nH0.1nH 14 500 20 25 40 43 47 8400 0.29 410 HKQ0603U 3N5 RoHS 3.5 0.3nH0.2nH0.1nH 14 500 20 25 40 42 46 8200 0.30 405 HKQ0603U 3N6 RoHS 3.6 0.3nH0.2nH0.1nH 14 500 19 25 40 42 46 8100 0.32 400 HKQ0603U 3N7 RoHS 3.7 0.3nH0.2nH0.1nH 14 500 19 25 40 42 46 8000 0.36 370 HKQ0603U 3N8 RoHS 3.8 0.3nH0.2nH0.1nH 14 500 19 25 39 41 45 7800 0.40 355 HKQ0603U 3N9 RoHS 3.9 0.3nH0.2nH0.1nH 14 500 19 25 39 41 45 7700 0.41 350 HKQ0603U 4N0 RoHS 4 0.3nH0.2nH0.1nH 14 500 18 25 39 41 45 7600 0.44 335 HKQ0603U 4N1 RoHS 4.1 0.3nH0.2nH0.1nH 14 500 19 25 39 41 45 7500 0.48 320 HKQ0603U 4N2 RoHS 4.2 0.3nH0.2nH0.1nH 14 500 18 24 37 39 43 7300 0.48 320 HKQ0603U 4N3 RoHS 4.3 0.2nH0.3nH 14 500 18 24 37 39 43 6500 0.48 320 HKQ0603U 4N6 RoHS 4.6 0.2nH0.3nH 14 500 18 24 37 39 42 6500 0.39 360 HKQ0603U 4N7 RoHS 4.7 0.2nH0.3nH 14 500 19 24 37 39 42 6400 0.42 350 HKQ0603U 5N0 RoHS 5 0.2nH0.3nH 14 500 19 24 37 39 42 6200 0.44 335 HKQ0603U 5N1 RoHS 5.1 0.2nH0.3nH 14 500 19 24 37 39 42 6100 0.45 330 HKQ0603U 5N4 RoHS 5.4 0.2nH0.3nH 14 500 18 24 36 38 42 5900 0.49 315 HKQ0603U 5N6 RoHS 5.6 0.2nH0.3nH 14 500 18 24 36 37 41 5500 0.47 325 HKQ0603U 5N9 RoHS 5.9 0.2nH0.3nH 14 500 18 23 35 36 39 5500 0.47 325 HKQ0603U 6N2 RoHS 6.2 0.2nH0.3nH 14 500 18 23 35 36 39 5100 0.52 305 HKQ0603U 6N5 RoHS 6.5 0.2nH0.3nH 14 500 18 23 35 36 39 5100 0.52 305 HKQ0603U 6N8 RoHS 6.8 3%5% 14 500 18 23 35 36 39 4800 0.55 305 HKQ0603U 7N1 RoHS 7.1 3%5% 14 500 18 23 35 36 39 4800 0.55 305 HKQ0603U 7N5 RoHS 7.5 3%5% 14 500 18 23 34 35 38 4600 0.55 305 HKQ0603U 7N8 RoHS 7.8 3%5% 14 500 17 22 33 34 36 4600 0.51 310 HKQ0603U 8N2 RoHS 8.2 3%5% 14 500 17 22 33 34 36 4300 0.57 290 HKQ0603U 8N5 RoHS 8.5 3%5% 14 500 17 22 33 34 36 4300 0.57 290 HKQ0603U 9N1 RoHS 9.1 3%5% 14 500 17 22 33 34 36 4000 0.65 270 HKQ0603U 9N4 RoHS 9.4 3%5% 14 500 17 22 33 34 36 4000 0.73 250 HKQ0603U 10N RoHS 10 3%5% 14 500 17 22 33 34 36 3800 0.85 230 HKQ0603U 12N RoHS 12 3%5% 14 500 17 22 31 32 33 3300 0.85 230 HKQ0603U 15N RoHS 15 3%5% 14 500 17 21 28 29 29 2600 0.89 220 HKQ0603U 18N RoHS 18 3%5% 14 500 16 21 26 26 25 2300 1.05 205 HKQ0603U 22N RoHS 22 3%5% 14 500 16 21 26 26 24 1900 1.29 190 Ordering code Q TypicalFrequency [MHz] DC.Resistance max. Rated current mAmax. Thickness mm inch 0.300.03 0.0120.001 , mark indicates the Inductance tolerance code. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 104 12 mlci05_e-01 PART NUMBERS AQ105 Ordering code 105 105 105 105 105 105 105 105 105 105 105 105 105 105 105 105 105 105 105 105 105 105 105 105 Inductance nH min. RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 1.00.3nH 1.20.3nH 1.50.3nH 1.80.3nH 2.00.3nH 2.20.3nH 2.40.3nH 2.70.3nH 3.00.3nH 3.30.3nH 3.60.3nH 3.90.3nH 4.30.3nH 4.70.3nH 5.10.3nH 5.60.3nH 6.20.3nH 6.85% 7.55% 8.25% 9.15% 105% 125% 155% 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 1N0 1N2 1N5 1N8 2N0 2N2 2N4 2N7 3N0 3N3 3N6 3N9 4N3 4N7 5N1 5N6 6N2 6N8 7N5 8N2 9N1 10N 12N 15N TypicalFrequency [MHz] LQ Measuring Q frequency [MHz] 300 800 900 1500 1800 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 53 45 35 32 38 37 34 30 31 32 33 34 29 30 30 30 31 28 28 29 29 28 26 25 129 97 69 61 68 67 54 49 51 54 53 53 47 48 48 48 49 44 45 46 45 45 40 38 147 110 76 66 73 71 59 52 54 57 56 56 50 51 51 51 52 49 50 50 49 48 45 42 217 156 104 92 94 92 74 67 70 72 71 70 64 65 64 65 66 59 60 62 59 57 51 49 244 177 116 100 103 101 86 73 76 79 77 76 71 72 71 71 72 64 65 66 62 60 52 51 Self-resonant frequency MHz DC.Resistance min. Typ. max. Typ. 10000 10000 8000 6000 6000 6000 6000 6000 6000 6000 5000 4000 4000 4000 4000 4000 3900 3900 3700 3600 3400 3200 2700 2300 13000 13000 13000 11000 10500 10000 9600 9200 8700 8300 7800 7300 6900 6400 6300 6200 6100 6000 5500 5000 4800 4500 4300 4100 0.07 0.07 0.07 0.07 0.08 0.08 0.09 0.09 0.11 0.12 0.14 0.15 0.16 0.17 0.19 0.20 0.22 0.23 0.25 0.27 0.29 0.31 0.39 0.45 0.014 0.016 0.030 0.035 0.035 0.040 0.050 0.060 0.070 0.075 0.080 0.085 0.090 0.095 0.110 0.120 0.130 0.130 0.135 0.140 0.150 0.165 0.165 0.190 Rated current Thickness mAmax. mm inch 55 55 125 +85 710 930 710 930 710 930 710 930 660 870 660 870 630 820 630 820 570 740 540 710 500 650 490 630 0.500.05 470 610 0.0200.002 450 590 430 560 420 550 400 520 390 510 370 490 360 470 350 450 330 440 300 390 280 360 , mark indicates the Inductance tolerance code. The product with tolerance less than 0.3nH , 5 is also available. Please contact your local sales office. ELECTRICAL CHARACTERISTICS HKQ0603S Series Q-Characteristics Measured by 8719C Impedance-vs-Frequency characteristics HKQ0603 Measured by 8719C Inductance-vs-Frequency characteristics HKQ0603S Measured by 8719C HKQ0603S 50 50 2.2nH 45 10 40 4 40 Q 30 25 10nH 20 15 Inductance Impedance 35 10nH 102 2.2nH 10 30 20 10 5 0 0.01 10nH 2.2nH 0.1 1 100 10 0.01 0.1 1 10 0.01 0.1 1 10 HKQ0603U Series Q-Characteristics Measured by 8719C Impedance-vs-Frequency characteristics HKQ0603U 90 Measured by 8719C HKQ0603U 60 10000 50 1000 Impedance 60 50 10nH 40 30 100 10 20 40 2.2nH Inductance 70 10nH 30 20 10nH 1 10 10 0 Inductance-vs-Frequency characteristics 2.2nH 80 Q Measured by 8719C HKQ0603U INDUCTORS FOR HIGH FREQUENCY APPLICATIONS INDUCTORS AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ AQ EHS Environmental Hazardous Substances 2.2nH 0.01 0.1 1 AQ Series Q-Characteristics 0.1 0.01 10 Measured by 8719C 0.1 1 10 Impedance-vs-Frequency characteristics Measured by 8719C 0.01 0.1 140 10 Inductance-vs-Frequency characteristics Measured by 8719C AQ105 AQ105 1 AQ105 100000 50 10000 40 2N2 120 Impedance 100 Q 80 10N 60 40 1000 30 10N 100 20 2N2 10 10 20 10N 2N2 0.01 0.1 1 10 1 0.01 0.1 1 10 0.01 0.1 1 10 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci05_e-01 12 105 PACKAGING Taping material Minimum Quantity Tape & Reel Packaging Type CK1608 0603 CK2125 0805 CKS2125 0805 CKP2012 0805 CKP2016 0806 CKP2520 1008 NM2012 0805 NM2520 1008 LK1005 0402 LK1608 0603 LK2125 0805 HK0402 01005 HK0603 0201 HK1005 0402 HK1608 0603 HK2125 0805 HKQ0603S 0201 HKQ0603U 0201 AQ105 0402 BK0402 01005 BK0603 0201 BK1005 0402 BKH1005 0402 BK1608 0603 BK2125 0805 BK2010 0804 BK3216 1206 BKP0603 0201 BKP1005 0402 BKP1608 0603 BKP2125 0805 Thickness mm inch 0.8 0.031 0.85 0.033 1.25 0.049 0.85 0.033 1.25 0.049 0.9 0.035 0.9 0.035 0.7 0.028 0.9 0.035 1.1 0.043 0.9 0.035 1.1 0.043 0.5 0.020 0.8 0.031 0.85 0.033 1.25 0.049 0.2 0.008 0.3 0.012 0.5 0.020 0.8 0.031 0.85 0.033 1.0 0.039 0.3 0.012 0.3 0.012 0.5 0.020 0.2 0.008 0.3 0.012 0.5 0.020 0.5 0.020 0.8 0.031 0.85 0.033 1.25 0.049 0.45 0.018 0.8 0.031 0.3 0.012 0.5 0.020 0.8 0.031 0.85 0.033 Standard Quantitypcs Paper Tape Embossed Tape 4000 4000 2000 4000 2000 3000 3000 3000 3000 2000 3000 2000 10000 4000 4000 2000 20000 15000 10000 4000 4000 3000 15000 15000 10000 15000 10000 10000 4000 4000 2000 4000 4000 15000 10000 4000 4000 16 0 8 212 5 212 5 10 0 5 16 0 8 212 5 0402 0603 10 0 5 16 0 8 0603 10 5 0402 0603 10 0 5 16 0 8 212 5 2 010 0603 10 0 5 16 0 8 212 5 10 0 5 CK CKS CKP CKP CKP NM NM L K HK BK BK 212 5 212 5 2 012 2 016 2520 2 012 2520 212 5 212 5 212 5 3 216 Taping Dimensions Paper tape (0.315 inches wide) Unit : mminch Insertion Pitch A B F 1.00.2 1.80.2 4.00.1 0.8 CK1608 0603 0.0310.0390.0080.0710.0080.1570.004 1.50.2 2.30.2 4.00.1 0.85 CK2125 0805 0.0330.0590.0080.0910.0080.1570.004 0.85 1.50.2 2.30.2 4.00.1 CKS2125 0805 0.0330.0590.0080.0910.0080.1570.004 0.650.1 1.150.1 2.00.05 0.5 LK1005 0402 0.0200.0260.0040.0450.0040.0790.002 1.00.2 1.80.2 4.00.1 0.8 LK1608 0603 0.0310.0390.0080.0710.0080.1570.004 1.50.2 2.30.2 4.00.1 0.85 LK2125 0805 0.0330.0590.0080.0910.0080.1570.004 0.250.04 0.450.04 2.00.05 0.2 HK0402 01005 0.0080.0100.0020.0180.0020.0790.002 0.400.06 0.700.06 2.00.05 0.3 HK0603 0201 0.0120.0160.0020.0280.0020.0790.002 0.650.1 1.150.1 2.00.05 0.5 HK1005 0402 0.0200.0260.0040.0450.0040.0790.002 1.00.2 1.80.2 4.00.1 0.8 HK1608 0603 0.0310.0390.0080.0710.0080.1570.004 0.3 0.400.06 0.700.06 2.00.05 HKQ0603S0201 0.0120.0160.0020.0280.0020.0790.002 0.3 0.400.06 0.700.06 2.00.05 HKQ0603U 0201 0.0120.0160.0020.0280.0020.0790.002 0.750.1 1.150.1 2.00.05 0.5 AQ105 0402 0.0200.0300.0040.0450.0040.0790.002 Type 20000 CK CK CKS L K L K L K HK HK HK HK HKQ AQ BK BK BK BK BK BK BKP BKP BKP BKP BKH Thickness mm inch Chip cavity Tape Thickness T 1.1 0.043max 1.1 0.043max 1.1 0.043max 0.8 0.031max 1.1 0.043max 1.1 0.043max 0.36 0.014max 0.45 0.018max 0.8 0.031max 1.1 0.043max 0.45 0.018max 0.45 0.018max 0.8 0.031max To next page This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP1 12 mlci0109_reli_e-01 PACKAGING Insertion Pitch A B F 0.250.04 0.450.04 2.00.05 0.2 BK0402 01005 0.0080.0100.0020.0180.0020.0790.002 0.400.06 0.700.06 2.00.05 0.3 BK0603 0201 0.0120.0160.0020.0280.0020.0790.002 0.650.1 1.150.1 2.00.05 0.5 BK1005 0402 0.0200.0260.0040.0450.0040.0790.002 1.00.2 1.80.2 4.00.1 0.8 BK1608 0603 0.0310.0390.0080.0710.0080.1570.004 1.50.2 2.30.2 4.00.1 0.85 BK2125 0805 0.0330.0590.0080.0910.0080.1570.004 1.20.1 2.170.1 4.00.1 0.45 BK2010 0804 0.0180.0470.0040.0850.0040.1570.004 0.400.06 0.700.06 2.00.05 0.3 BKP0603 0201 0.0120.0160.0020.0280.0020.0790.002 0.650.1 1.150.1 0.5 2.00.05 BKP1005 0402 0.0200.0260.0040.0450.0040.0790.002 1.00.2 1.80.2 4.00.1 0.8 BKP1608 0603 0.0310.0390.0080.0710.0080.1570.004 1.50.2 2.30.2 4.00.1 0.85 BKP2125 0805 0.0330.0590.0080.0910.0080.1570.004 0.650.1 1.150.1 2.00.05 0.5 BKH1005 0805 0.0200.0260.0040.0450.0040.0790.002 Thickness mm inch Type Chip cavity Tape Thickness T 0.36 0.014max 0.45 0.018max 0.8 0.031max 1.1 0.043max 1.1 0.043max 0.8 0.031max 0.45 0.018max 0.8 0.031max 1.1 0.043max 1.1 0.043max 0.8 0.031max Reel Size 2.00.5 0.0790.031 13.00.2 0.5120.020 Top tape strength The top tape requires a peel-off force of 0.10.7N in the direction of the arrow as illustrated below. Unit : mminch Embossed Tape (0.315 inches wide) Unit : mminch Thickness mm inch Type CK21250805 CKS21250805 CKP20120805 CKP20160806 CKP25201008 NM20120805 NM25201008 LK21250805 HK21250805 BK21250805 BK32161206 1.25 0.049 1.25 0.049 0.9 0.035 0.9 0.035 0.7 0.028 0.9 0.035 1.1 0.043 0.9 0.035 1.1 0.043 1.25 0.049 0.85 0.033 1.0 0.039 1.25 0.049 0.8 0.031 Tape Insertion Thickness Pitch A B F K T 1.50.2 2.30.2 4.00.1 2.0 0.3 0.0590.008 0.0910.008 0.1570.004 0.079 0.012 1.50.2 2.30.2 4.00.1 2.0 0.3 0.0590.008 0.0910.008 0.1570.004 0.079 0.012 1.550.2 2.30.2 4.00.1 1.3 0.3 0.0610.008 0.0910.008 0.1570.004 0.051 0.012 1.80.1 2.20.1 4.00.1 1.3 0.25 0.0710.004 0.0870.004 0.1570.004 0.051 0.01 1.4 0.055 1.4 0.3 2.30.1 2.80.1 4.00.1 0.0910.004 0.1100.004 0.1570.004 0.055 0.012 1.7 0.067 1.550.2 2.30.2 4.00.1 1.3 0.3 0.0610.008 0.0910.008 0.1570.004 0.051 0.012 2.30.1 2.80.1 4.00.1 1.7 0.3 0.0910.004 0.1100.004 0.1570.004 0.067 0.012 1.50.2 2.30.2 4.00.1 2.0 0.3 0.0590.008 0.0910.008 0.1570.004 0.079 0.012 1.5 0.059 0.3 1.50.2 2.30.2 4.00.1 0.0590.008 0.0910.008 0.1570.004 2.0 0.012 0.079 1.50.2 2.30.2 4.00.1 2.0 0.3 0.0590.008 0.0910.008 0.1570.004 0.079 0.012 1.90.1 3.50.1 4.00.1 1.4 0.3 0.0750.004 0.1380.004 0.1570.004 0.055 0.012 Chip cavity LEADER AND BLANK PORTION 160mm or more 6.3inches or more 100mm or more 3.94inches or more Direction of tape feed 400mm ore more 15.7inches or more This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 12 mlci0109_reli-PRP2 RELIABILITY DATA Multilayer chip inductors and beads 1. Operating Temperature Range BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 2. Storage Temperature Range BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 55125 5585 4085 55125 4085 55125 55125 5585 4085 55125 4085 55125 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP3 12 mlci0109_reli_e-01 RELIABILITY DATA Multilayer chip inductors and beads 3. Rated Current BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 240540mA DC 100500mA 1201000mA 200mA 1501500mA 2001200mA 100mA 100200mA 1.0A 8002000mA DC 1.03.0A 1.54.0A 5060mA DC 60500mA DC 110280mA DC 0.71.2A DC 0.91.6A DC 1.11.8A DC 0.81.5A DC 0.91.1A DC 2025mA DC 1150mA DC 5300mA DC 160380mA DC 60470mA DC 110300mA DC 150300mA DC 300mA DC 130600mA DC 130600mA DC 280710mA DC Definition of rated current In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20. In the BK Series P type and CK Series P type, NM Series the rated current is the value of current at which the temperature of the element is increased within 40. In the LK,HK,HKQ,and AQ Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias, or the value of current at which the temperature of the element is increased within 20. 4. Impedance BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 10120 25% 10600 25% 101800 25% 15001800 25% 222500 25% 152500 25% 51000 25% 681000 25% 2233 25% 10220 25% 33470 25% 33330 25% Test Methods and Remarks BK0402 Series Measuring frequency1001MHz Measuring equipmentE4991A or its equivalent Measuring jig16196D or its equivalent BK0603 Series, BKP0603 Series Measuring frequency1001MHz Measuring equipment4291A or its equivalent Measuring jig16193A or its equivalent BK1005 Series, BKP1005 Series, BKH1005 Series Measuring frequency1001MHz Measuring equipment4291A or its equivalent Measuring jig16192A or its equivalent, 16193A or its equivalent ---- BK16082125 Series, BKP16082125 Series Measuring frequency1001MHz Measuring equipment4291A or its equivalent, 4195A or its equivalent Measuring jig16092A or its equivalentor 16192A or its equivalent/HW BK20103216 Series Measuring frequency1001MHz Measuring equipment4291A or its equivalent, 4195A or its equivalent Measuring jig16192A or its equivalent This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 12 mlci0109_reli-PRP4 RELIABILITY DATA Multilayer chip inductors and beads 5. Inductance BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 ---- BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 4.710.0H20% CK2125 0.110.0H20% CKS2125 1.010.0H20% CKP2012 0.474.7H20% CKP2016 0.474.7H20% CKP2520 0.474.7H20% NM2012 0.821.0H20% NM2520 1.02.2H20% LK1005 0.122.2H10% Q 0.122.2H30% LK1608 0.04733.0H20% 0.1012.0H10% Q 0.122.2H30% LK2125 0.04733.0H20% 0.1012.0H10% Q 0.122.2H30% HK0402 1.06.2nH0.3nH 6.812nH5% HK0603 1.06.2nH0.3nH 6.8100nH5% HK1005 1.06.2nH0.3nH 6.8270nH5% HK1608 1.05.6nH0.3nH 6.8470nH5% HK2125 1.55.6nH0.3nH 6.8470nH5% HKQ0603S 0.66.2nH0.3nH 6.822nH5% HKQ0603U 0.66.2nH0.3nH 6.822nH5% AQ105 1.06.2nH0.3nH 6.815nH5% Test Methods and Remarks CK Series Measuring frequency2 to 4MHzCK1608 Measuring frequency2 to 25MHzCK2125 Measuring frequency2 to 10MHzCKS2125 LK Series Measuring frequency10 to 25MHzLK1005 Measuring frequency1 to 50MHzLK1608 Measuring frequency0.4 to 50MHzLK2125 CKP Series, NM Series Measuring frequency1MHz CKP2012, CKP2016, CKP2520, NM2012NM2520 Measuring equipment, jig4194A16085B16092A or its equivalent 4195A4195116092A or its equivalent 4294A16192A or its equivalent 4291A16193A or its equivalent/LK1005 4285A42841A42842C4285161100 CKP2012CKP2016CKP2520NM2012NM2520 Measuring current1mA rms 0.047 to 4.7H 0.1mA rms 5.6 to 33H HKHKQAQ Series Measuring frequency100MHz HK0402HK0603HK1005AQ105 Measuring frequency50/100MHz HK1608HK2125 Measuring frequency500MHz HKQ0603SHKQ0603U Measuring equipment, jig4291A16197A or its equivalent/HK0603AQ105 4291A16193A or its equivalent/HK1005 E4991A16197A or its equivalent/HKQ0603SHKQ0603U 4291A16092in-house made jig or its equivalent/HK1608HK2125 E4991A16196D or its equivalent/HK0402 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP5 12 mlci0109_reli_e-01 RELIABILITY DATA Multilayer chip inductors and beads 6. Q BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY ---- BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 20 min. 1520 min. ---- 1020 min. 1035 min. 1550 min. 3 min. 45 min. 8 min. 812 min. 1018 min. 1013 min. 1013 min. 8 min. Test Methods and Remarks CK Series Measuring frequency2 to 4MHz CK1608 Measuring frequency2 to 25MHz CK2125 LK Series Measuring frequency10 to 25MHz LK1005 Measuring frequency1 to 50MHz LK1608 Measuring frequency0.4 to 50MHz LK2125 Measuring equipment, jig4194A16085B16092A or its equivalent 4195A4195116092A or its equivalent 4294A16192A or its equivalent 4291A16193A or its equivalent/LK1005 Measuring current1mA rms 0.047 to 4.7H 0.1mA rms 5.6 to 33H 7. DC Resistance BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 HKHKQAQ Series Measuring frequency100MHz HK0603HK1005AQ105 Measuring frequency50/100MHz HK1608HK2125 Measuring frequency500MHz HKQ0603SHKQ0603U Measuring equipment, jig 4291A16197A or its equivalent/HK0603AQ105 4291A16193A or its equivalent/HK1005 E4991A16197A or its equivalent/HKQ0603S HKQ0603U 4291A16092A in-house made jig or its equivalent/HK1608HK2125 E4991A16196D or its equivalentHK0402 0.100.53 max. 0.0651.50 max. 0.030.80 max. 1.502.00 max. 0.051.10 max. 0.050.75 max. 0.100.90 max. 0.150.80 max. 0.0650.070 max. 0.0300.20 max. 0.0250.18 max. 0.0200.075 max. 0.450.8530% 0.160.65 max. 0.090.40 typ. 0.120.52 max. 0.100.28 max. 0.080.20 max. 0.050.16 max. 0.100.19 max. 0.130.22 max. 0.411.16 max. 0.22.2 max. 0.11.1 max. 0.180.99 max. 0.113.74 max. 0.084.8 max. 0.052.6 max. 0.101.5 max. 0.061.29 max. 0.061.29 max. 0.070.45 max. CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 Test Methods and Remarks Measuring equipmentVOAC-7412 made by Iwasaki Tsushinki VOAC-7512 made by Iwasaki Tsushinki This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 12 mlci0109_reli-PRP6 RELIABILITY DATA Multilayer chip inductors and beads 8. Self Resonance Frequency SRF BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 1725MHz min. CK2125 24235MHz min. CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 40180MHz min. LK1608 9260MHz min. LK2125 13320MHz min. HK0402 2900010000MHz min. HK0603 90010000MHz min. HK1005 40010000MHz min. HK1608 30010000MHz min. HK2125 2004000MHz min. HKQ0603S 190010000MH min. HKQ0603U 190010000MH min. AQ105 230010000MHz min. Test Methods and Remarks LK Series Measuring equipment4195A or its equivalent Measuring jig4195116092A or its equivalent HKHKQAQ Series Measuring equipment8719C or its equivalent 8753D or its equivalent/HK2125 ---- ---- 9. Temperature Characteristic BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 HK0603 HK1005 HK1608 Inductance changeWithin 10 HK2125 HKQ0603S HKQ0603U AQ105 Test Methods and Remarks HKHKQAQ SeriesTemperature range30 to 85 Reference temperature20 ---- This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP7 12 mlci0109_reli_e-01 RELIABILITY DATA Multilayer chip inductors and beads 10. Resistance to Flexure of Substrate BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 No mechanical damage. CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 Test Methods and Remarks Warp2mmBK Series without 0402size, BKP, BKH, CK, CKS, CKP, NM, LK, HK, HKQ, AQ Series 1mmBK0402, HK0402 Series Testing boardglass epoxy-resin substrate Thickness0.8mm 11. Solderability BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 Test Methods and Remarks Solder temperature2305 Duration41 sec. At least 75 of terminal electrode is covered by new solder. At least 75 of terminal electrode is covered by new solder. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 12 mlci0109_reli-PRP8 RELIABILITY DATA Multilayer chip inductors and beads 12. Resistance to Soldering BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 AppearanceNo significant abnormality. Impedance changeWithin 30 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 No mechanical damage. CK2125 Remaining terminal electrode70 min. CKS2125 CKP2012 Inductance change R104R7 Within 10 CKP2016 6R8100 Within 15 CKP2520 CKS2125 Within 20 NM2012 CKP2012CKP2016CKP2520NM2012NM2520Within 30 NM2520 LK1005 No mechanical damage. Remaining terminal electrode70 min. Inductance changeWithin 15 LK1608 No mechanical damage. Remaining terminal electrode70 min. Inductance change 47N4R7Within 10 5R6330Within 15 LK2125 HK0402 HK0603 HK1005 HK1608 No mechanical damage. Remaining terminal electrode70 min. Inductance changeWithin 5 HK2125 HKQ0603S HKQ0603U AQ105 Test Methods and Remarks Solder temperature2605 Duration100.5 sec. Preheating temperature150 to 180 Preheating time3 min. FluxImmersion into methanol solution with colophony for 3 to 5 sec. Recovery2 to 3 hrs of recovery under the standard condition after the test. See Note 1 13. Thermal Shock BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 AppearanceNo significant abnormality. Impedance changeWithin 30 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 CK2125 Inductance changeWithin 20CKS2125 CKS2125 CKP2012 CKP2016 CKP2520 No mechanical damage. Inductance changeWithin 30 NM2012 NM2520 LK1005 No mechanical damage. LK1608 Inductance changeWithin 10 Q changeWithin 30 LK2125 HK0402 HK0603 HK1005 HK1608 No mechanical damage. Inductance changeWithin 10 Q changeWithin 20 HK2125 HKQ0603S HKQ0603U AQ105 Test Methods and Remarks Conditions for 1 cycle Step 1Minimum operating temperature 0 3 303 min. Step 2Room temperature 2 to 3 min. 3 Step 3Maximum operating temperature 0 303 min. Step 4Room temperature 2 to 3 min. Number of cycles5 Recovery2 to 3 hrs of recovery under the standard condition after the test. See Note 1 (Note 1) When there are questions concerning mesurement resultmeasurement shall be made after 482 hrs of recovery under the standard condition. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP9 12 mlci0109_reli_e-01 RELIABILITY DATA Multilayer chip inductors and beads 14. Damp HeatSteady state BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 AppearanceNo significant abnormality. Impedance changeWithin 30 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 CK2125 CKS2125 Inductance changeWithin 20 CKP2012 CKP2016 CKP2520 No mechanical damage. Inductance changeWithin 30 NM2012 NM2520 LK1005 No mechanical damage. Inductance changeWithin 10 Q changeWithin 30 LK1608 LK2125 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 HK0402 HK0603 HK1005 HK1608 No mechanical damage. Inductance changeWithin 10 Q changeWithin 20 HK2125 HKQ0603S HKQ0603U AQ105 Test Methods and Remarks BK, BKP, BKH Series Temperature402 Humidity90 to 95RH Duration50024 0 hrs Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1 LKCKCKSCKPNMHKHKQAQ Series Temperature402LKCKCKSCKPNM Series 602HKHKQAQ Series Humidity90 to 95RH Duration50012 hrs Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 12 mlci0109_reli-PRP10 RELIABILITY DATA Multilayer chip inductors and beads 15. Loading under Damp Heat BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 AppearanceNo significant abnormality. Impedance changeWithin 30 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 No mechanical damage. Inductance changeWithin 20 No mechanical damage. Inductance changeWithin 30 No mechanical damage. Inductance changeWithin 10 Q changeWithin 30 No mechanical damage. Inductance change0.047 to 12.0HWithin 10 15.0 to 33.0HWithin 15 Q changeWithin 30 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 LK2125 HK0402 HK0603 HK1005 HK1608 No mechanical damage. Inductance changeWithin 10 Q changeWithin 20 HK2125 HKQ0603S HKQ0603U AQ105 Test Methods and Remarks BK, BKP, BKH Series Temperature402 Humidity90 to 95RH Applied currentRated current Duration50024 0 hrs See Note 1 Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. LKCKCKSCKPNMHKHKQAQ Series Temperature402LKCKCKSCKPNM Series 602HKHKQAQ Series Humidity90 to 95RH Applied currentRated current Duration50012 hrs Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1 Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 202 of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note 1) Measurement shall be made after 482 hrs of recovery under the standard condition. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP11 12 mlci0109_reli_e-01 RELIABILITY DATA Multilayer chip inductors and beads 16. Loading at High Temperature BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 AppearanceNo significant abnormality Impedance changeWithin 30 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 No mechanical damage. Inductance changeWithin 20 No mechanical damage. Inductance changeWithin 30 No mechanical damage. Inductance changeWithin 10 Q changeWithin 30 No mechanical damage. Inductance change0.047 to 12.0HWithin 10 15.0 to 33.0HWithin 15 Q changeWithin 30 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 LK2125 HK0402 HK0603 HK1005 HK1608 No mechanical damage. Inductance changeWithin 10 Q changeWithin 20 HK2125 HKQ0603S HKQ0603U AQ105 Test Methods and Remarks BK, BKH Series Temperature1253 Applied currentRated current Duration50024 0 hrs Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1 LKCKCKSCKPNMHKHKQAQBKP Series Temperature852LKCKCKSCKPNMBKP Series 852HK16082125 852HK1005, AQ105 operating temperature range 55 to 85 1252HK0402, HK0603, HK1005, HKQ0603S, HKQ0603U, AQ105 operating temperature range 55 to 125 Applied currentRated current Duration50012 hrs Recovery2 to 3 hrs of recovery under the standard condition after the test. See Note 1 Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 202 of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note 1) Measurement shall be made after 482 hrs of recovery under the standard condition. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 12 mlci0109_reli-PRP12 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors 1. Circuit Design Verification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. Precautions Operating CurrentVerification of Rated current 1. The operating current for inductors must always be lower than their rated values. 2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. 2. PCB Design Pattern configurations Design of Land-patterns 1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used size of filletcan directly affect inductor performance. Therefore, the following items must be carefully considered in the design of solder land patterns: 1The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. 2When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated Precautions by solder-resist. 3The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns smaller than terminal electrode of chips. Pattern configurations Inductor layout on panelizedbreakawayPC boards 1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processesPCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to minimize stress. Pattern configurations Design of Land-patterns 1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts larger fillets which extend above the component end terminations. Examples of improper pattern designs are also shown. 1Recommended land dimensions for a typical chip inductor land patterns for PCBs Recommended land dimensions for wave-soldering 1608 2125 3216 1.6 2.0 3.2 0.8 1.25 1.6 0.81.0 1.01.4 1.82.5 0.50.8 0.81.5 0.81.7 0.60.8 0.91.2 1.21.6 Recommended land dimensions for reflow-soldering Type L W A B C Size Size Type L W A B C 0402 0603 1005 105 1608 2012 2125 2016 3216 2520 0.4 0.6 1.0 1.0 1.6 2.0 2.0 2.0 3.2 2.5 0.2 0.3 0.5 0.6 0.8 1.25 1.25 1.6 1.6 2.0 0.150.25 0.200.30 0.450.55 0.500.55 0.81.0 0.81.2 0.81.2 0.81.2 1.82.5 1.01.4 0.100.20 0.200.30 0.400.50 0.300.40 0.60.8 0.81.2 0.81.2 0.81.2 0.61.5 0.61.0 0.150.30 0.250.40 0.450.55 0.600.70 0.60.8 0.91.6 0.91.6 1.22.0 1.22.0 1.82.2 Unitmm Unitmm Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. Recommended land dimension for Reflow-soldering Size Technical considerations Type L W a b c d 3216 3.2 1.6 0.70.9 0.81.0 0.40.5 0.8 2010 2.0 1.0 0.50.6 0.50.6 0.20.3 0.5 Unitmm 2Examples of good and bad solder application Item Not recommended Recommended Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded components near mounted components Horizontal component placement To next page This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP13 12 mlci0109_reli_e-01 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors 2. PCB Design Pattern configurations Inductor layout on panelizedbreakawayPC boards 1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board warp or deflection. Item Not recommended Recommended Deflection of the board Technical considerations 1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout. An example below should be counted for better design. 1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure. 3. Considerations for automatic placement Adjustment of mounting machine 1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards. 2. The maintenance and inspection of the mounter should be conducted periodically. Precautions Selection of Adhesives 1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. Adjustment of mounting machine 1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: 1The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. 2The pick-up pressure should be adjusted between 1 and 3N static loads. 3To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement: Item Improper method Proper method Single-sided mounting Double-sided mounting 2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. Technical considerations Selection of Adhesives 1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the following precautions should be noted in the application of adhesives. 1Required adhesive characteristics a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive should have sufficient strength at high temperatures. c. The adhesive should have good coating and thickness consistency. d. The adhesive should be used during its prescribed shelf life. e. The adhesive should harden rapidly. f. The adhesive must not be contaminated. g. The adhesive should have excellent insulation characteristics. h. The adhesive should not be toxic and have no emission of toxic gasses. 2When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad. Recommended conditions Figure a b c 0805 case sizes as examples 0.3mm min 100120m Area with no adhesive This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 12 mlci0109_reli-PRP14 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors 4. Soldering Selection of Flux 1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use; 1Flux used should be with less than or equal to 0.1 wt%Chlorine conversion methodof halogenated content. Flux having a strong acidity content should not be applied. 2When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level. Precautions 3When using water-soluble flux, special care should be taken to properly clean the boards. Soldering 1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us about peak temperature when you use lead-free paste. Selection of Flux 1-1. When too much halogenated substance Chlorine, etc.content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor. 1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. Soldering 1-1. Preheating when soldering Heating: Chip inductor components should be preheated to within 100 to 130 of the soldering. Cooling: The temperature difference between the components and cleaning process should not be greater than 100. Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. Recommended conditions for soldering Reflow soldering Temperature profile Temperature 300 Pb free soldering Peak 260 max 10 sec max 200 Gradually cooling Preheating 100 0 150 60 sec min Heating above 230 40 sec max Ceramic chip components should be preheated to within 100 to 130 of the soldering. Assured to be reflow soldering for 2 times. Caution Temperature Pb free soldering 1. The ideal condition is to have solder mass filletcontrolled to 1/2 to 1/3 of the thickness of the inductor, as shown below: Pb free soldering Temperature 300 300 Peak 260 max Peak 260 max 10 sec max 10 sec max 200 200 Gradually Gradually cooling cooling Preheating 150 Preheating 100 100 150 Heating above 230 Temperature sec min Pb free 12060 sec min 40 soldering sec max 0 Technical considerations 3000 2. Because excessive dwell times can detrimentally affect solderability, soldering shouldtobe kept as close to recommended times as possible. maxduration CeramicPeak chip 260 components should be preheated Wave soldering Temperature profile Ceramic chip components should be preheated to max within 10010 to sec 130 of the soldering. within 100 to 130 of the soldering. Assured to be reflow soldering for 2 times. Assured to be wave soldering for 1 time. Except for reflow soldering type. Gradually cooling Preheating 200 100 Temperature Pb Temperature Pb free free soldering soldering 150 Heating above 230 300 400 Peak max 60260 sec min 40 sec maxmax 350 0 10 sec max 3 sec max 300 Ceramic chip components should be preheated to 200 within 100 to 130 Gradually of the soldering. Gradually Preheating Assured to be reflow soldering for 2 times. cooling cooling 150 200 100 100 120 sec60min sec min Pb free soldering Temperature 30000 max should be preheated to CeramicPeak chip260 components T190 3216Type max , 1303225 max within 10010 to sec 130 of the soldering. Type ming Assured to be wave soldering for 1 time. It is recommended to use 20W soldering iron and 200 Except for reflow soldering type. Gradually the tipPreheating is 1 or less. cooling The soldering the 150iron should not directly touch Caution 100 components. Assured iron for 1 time. Temperature to be solderingPb free soldering 1. Make sure the inductors are preheated sufficiently. 400 120 sec min 350 max 100 to 130. Note: Theshould above profiles thegreater maximum allowable 2. The temperature difference between the inductor and melted0solder notarebe than 3 sec max are soldering condition, therefore these profiles 3. Cooling after soldering should be as gradual as possible. 300 Ceramic chip components should be preheated to not always recommended. Gradually within 100 to 130 the soldering. ofsoldering 4. Wave soldering must not be applied to the inductors designated as for reflow only. cooling Assured to be wave soldering for 1 time. 200 Hand soldering Temperature profile Except for reflow soldering type. 100 Temperature 4000 60 sec min Pb free soldering 350 max T1903216Type max , 1303225 3 sec max 300 Type ming It is recommended iron and Gradually to use 20W soldering the tip is 1 or less. cooling 200 The soldering iron should not directly touch the components. 100 Assured to be soldering iron for 1 time. 60 sec min Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are T190 3216Type max , 1303225 not always recommended. Type ming It is recommended to use 20W soldering iron and the tip is 1 or less. The soldering iron should not directly touch the components. Assured to be soldering iron for 1 time. 0 Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. Caution 1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm. 2. The soldering iron should not directly touch the inductor. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP15 12 mlci0109_reli_e-01 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors 5. Cleaning Precautions Technical considerations Cleaning conditions 1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of the cleaning e.g. to remove soldering flux or other materials from the production process. 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics. Cleaning conditions 1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's electrical properties especially insulation resistance. 2. Inappropriate cleaning conditions insufficient or excessive cleaningmay detrimentally affect the performance of the inductors. 1Excessive cleaning a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked; Ultrasonic output Below 20W/ Ultrasonic frequency Below 40kHz Ultrasonic washing period 5 min. or less 6. Post cleaning processes Application of resin coatings, moldings, etc. to the PCB and components. 1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the inductor's performance. 2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor Precautions damage or destruction. 3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors. The use of such resins, molding materials etc. is not recommended. 7. Handling splitting along perforations Breakaway PC boards 1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. General handling precautions 1. Always wear static control bands to protect against ESD. 2. Keep the inductors away from all magnets and magnetic objects. 3. Use non-magnetic tweezers when handling inductors. Precautions 4. Any devices used with the inductorssoldering irons, measuring instrumentsshould be properly grounded. 5. Keep bare hands and metal products i.e., metal deskaway from chip electrodes or conductive areas that lead to chip electrodes. 6. Keep inductors away from items that generate magnetic fields such as speakers or coils. Mechanical considerations 1. Be careful not to subject the inductors to excessive mechanical shocks. 1If inductors are dropped on the floor or a hard surface they should not be used. 2When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions Ambient temperature Below 40 Humidity Below 70% RH Precautions The ambient temperature must be kept below 30. Even under ideal storage conditions inductor electrode solderability decreases as time passes, so inductors should be used within 6 months from the time of delivery. Technical considerations *The packaging material should be kept where no chlorine or sulfur exists in the air. Storage 1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 12 mlci0109_reli-PRP16