Multilayer Ceramic Chip Capacitors
1 of 3
Creation Date : July 13, 2019 (GMT)
C2012X8R1H104K125AA
TDK item description C2012X8R1H104KT****
Applications Commercial Grade
Please refer to Part No. CGA4J2X8R1H104K125AA for Automotive use.
Feature 150°C High Temperature Application
Series C2012 [EIA 0805]
Status Production
Size
Length(L) 2.00mm ±0.20mm
Width(W) 1.25mm ±0.20mm
Thickness(T) 1.25mm ±0.20mm
Terminal Width(B) 0.20mm Min.
Terminal Spacing(G) 0.50mm Min.
Recommended Land Pattern (PA) 1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB) 1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC) 0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance 100nF ±10%
Rated Voltage 50VDC
Temperature Characteristic X8R(±15%)
Dissipation Factor (Max.) 3%
Insulation Resistance (Min.) 5000MΩ
Other
Soldering Method Wave (Flow)
Reflow
AEC-Q200 No
Packing Blister (Plastic)Taping [180mm Reel]
Package Quantity 2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Multilayer Ceramic Chip Capacitors
2 of 3
Creation Date : July 13, 2019 (GMT)
C2012X8R1H104K125AA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C2012X8R1H104K125AA
ESR
C2012X8R1H104K125AA
Capacitance
C2012X8R1H104K125AA
DC Bias Characteristic
C2012X8R1H104K125AA
Temperature Characteristic
C2012X8R1H104K125AA(No Bias) C2012X8R1H104K125AA(DC Bias =
25V )
Ripple Temperature Rising
C2012X8R1H104K125AA(100kHz) C2012X8R1H104K125AA(500kHz) C2012X8R1H104K125AA(1MHz)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Multilayer Ceramic Chip Capacitors
3 of 3
Creation Date : July 13, 2019 (GMT)
C2012X8R1H104K125AA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
