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IRF7420PbF-1
Parameter Min. Typ. Max. Units Conditions
ISContinuous Source Current MOSFET symbol
(Body Diode) showing the
ISM Pulsed Source Current integral reverse
(Body Diode) p-n junction diode.
VSD Diode Forward Voltage ––– ––– -1.2 V TJ = 25°C, IS = -2.5A, VGS = 0V
trr Reverse Recovery Time ––– 62 93 ns TJ = 25°C, IF = -2.5A
Qrr Reverse Recovery Charge ––– 61 92 μC di/dt = -100A/μs
Source-Drain Ratings and Characteristics
A
-46
-2.5
S
D
G
Repetitive rating; pulse width limited by
max. junction temperature.
Notes:
Pulse width ≤ 400μs; duty cycle ≤ 2%.
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Surface mounted on 1 in square Cu board, t ≤ 10sec.
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage -12 ––– ––– V VGS = 0V, ID = -250μA
ΔV(BR)DSS/ΔTJBreakdown Voltage Temp. Coefficient ––– 0.007 ––– V/°C Reference to 25°C, ID = -1mA
––– ––– 14 VGS = -4.5V, ID = -11.5A
––– 17.5 VGS = -2.5V, ID = -9.8A
––– 26 VGS = -1.8V, ID = -8.1A
VGS(th) Gate Threshold Voltage -0.4 ––– -0.9 V VDS = VGS, ID = -250μA
gfs Forward Transconductance 32 ––– ––– S VDS = -10V, ID = -11.5A
––– ––– -1.0 VDS = -9.6V, VGS = 0V
––– ––– -25 VDS = -9.6V, VGS = 0V, TJ = 70°C
Gate-to-Source Forward Leakage ––– ––– -100 VGS = -8V
Gate-to-Source Reverse Leakage ––– ––– 100 VGS = 8V
QgTotal Gate Charge ––– 38 ––– ID = -11.5A
Qgs Gate-to-Source Charge ––– 8.1 ––– nC VDS = -6V
Qgd Gate-to-Drain ("Miller") Charge ––– 8.7 ––– VGS = -4.5V
td(on) Turn-On Delay Time ––– 8.8 13 VDD = -6V, VGS = -4.5V
trRise Time ––– 8.8 13 ID = -1.0A
td(off) Turn-Off Delay Time ––– 291 437 RD = 6Ω
tfFall Time ––– 225 338 RG = 6Ω
Ciss Input Capacitance ––– 3529 ––– VGS = 0V
Coss Output Capacitance ––– 1013 ––– pF VDS = -10V
Crss Reverse Transfer Capacitance ––– 656 ––– ƒ = 1.0MHz
IGSS
μA
mΩ
RDS(on) Static Drain-to-Source On-Resistance
IDSS Drain-to-Source Leakage Current
nA
ns