17, 2014 4 Revision 7.0
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(5)
Supply Voltage (VCC) ..................................... −0.5V to +4.0V
Input Voltage (VIN) ................................. −0.5V to VCC + 0.5V
LVPECL Output Current (IOUT)
Continuous ............................................................ 50mA
Surge .................................................................. 100mA
Input Current
Source or Sink Current on (IN,
/IN) ....................
±50mA
VREF-AC Current
Source or Sink Current on (IVT) ............................. ±2mA
Lead Temperature (soldering, 20s) ............................ 260°C
Storage Temperature (Ts) ......................... –65°C to +150°C
Operating Ratings(6)
Supply Voltage Range ......................... +2.375V to +2.625V
............................................................... +3.0V to +3.6V
Ambient Temperature (TA) .......................... –40°C to +85°C
Package Thermal Resistance(7)
(θJA) Still Air........................................................ 60°C/W
(θJA) Junction to Board ....................................... 32°C/W
DC Electrical Characteristics(8)
TA = –40°C to +85°C, unless otherwise noted.
Symbol Parameter Condition Min. Typ. Max. Units
V
CC
Power Supply 2.375
3.0 2.625
3.6 V
I
CC
Power Supply Current No load, max. VCC 47 70 mA
RIN Input Resistance (IN-to-VT) 45 50 55 Ω
RDIFF-IN Differential Input Resistance
(IN-to-/IN) 90 100 110 Ω
VIH Input HIGH Voltage (IN, /IN) 1.2
V
CC
V
VIL Input LO W Voltage (IN, /IN) 0 VIH – 0.1 V
VIN Input Voltage Swing (IN, /IN) See Figure 1. 0.1 1.7 V
VDIFF_IN Differential Input Voltage Swing
|IN – /IN| See Figure 2. 0.2 V
VREF–AC Output Reference Voltage
V
CC
– 1.525
V
CC
– 1.425
V
CC
– 1.325 V
LVTTL/LVCMOS Input DC Electrical Characteristics
VCC = 2.375V to 3.60V; VEE = 0V; TA = –40°C to +85°C
Symbol Parameter Condition Min. Typ. Max. Units
VIH Input HIGH Voltage 2.0 VCC V
VIL Input LO W Voltage 0 0.8 V
IIH Input HIGH Current –125 20 µA
IIL Input LO W Current –300 µA
Notes:
5. Permanent device dam age may occur if absolute maximum ratings are exceeded. This is a stre ss rating only and functi onal operati on is not implied
at conditions other than those det ailed in the operat i onal sections of this datas heet. Exposure to absolute maxim um rati ng conditi ons f or extended
periods may affect device reliability.
6. The datas heet limits are not guaranteed i f the device is operated beyond the operating ratings.
7. Package t hermal resist ance assumes the exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. ΨJB and θJA
values are determined for a 4 -layer board at the still-air pack age thermal resistance, unless otherwise stated.
8. The ci rcuit is designed to meet the DC specifications shown in the above table after thermal equil i bri um has been established.