Xiamen Hualian Electronics Co. , Ltd. SPECIFICATION DESCRIPTION: RED SUPER BRIGHT LED MODELHFR8010013C 05926037469 05926037471 E-mail xmhlec@public.xm.fj.cn Website : www.xmhl.com 361006 PDF "FinePrint pdfFactory Pro" www.fineprint.com.cn RED SUPER BRIGHT LED SPECIFICATION HFR8010013C 1FEATURES: Low Drive Current, High Intensity of Light Emission. Fast Response Time , Pulse Driven. Water Clear Plastic Molding. 2ABSOLUTE MAXIMUM RATINGS(Ta=25): PARAMETER (1) SYMBOL RATING UNIT Forward Pulse Current Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature 5 (2) Soldering Heat (5s) IFPM 100 mA IFM 50 mA VR 5 V PD 150 mW Topr -25 - +85 Tstg -40 - +100 Tsol 260 (1) Duty1/10 Frequency1KHz (2) 2 mm Up to 2 mm from the body. 3OPTOELECTRIC CHARACTERISTICS(Ta=25): PARAMETER SYMBOL TEST CONDITION MIN TYP MAX UNIT VF IF=20mA - 2.2 2.5 V Reverse Current IR VR=5V - - 10 A Luminous Intensity IV IF=20mA 7.0 10.0 - cd D IF=20mA - 628 - nm IF=20mA - 20 - nm 21/2 IF=20mA - 24 - Forward Voltage Dominate Wave Length Spectral Line Half Width Viewing Angle 2002 6 2 7 PDF "FinePrint pdfFactory Pro" www.fineprint.com.cn RED SUPER BRIGHT LED SPECIFICATION HFR8010013C 4DIMENSION 0.2mm 1. Anode 2. Cathode 2002 6 3 7 PDF "FinePrint pdfFactory Pro" www.fineprint.com.cn RED SUPER BRIGHT LED SPECIFICATION HFR8010013C Packing 6 6.1 220x110mm2 500 / Internally packed with 220x110mm2 plastic bag anti-statically,500pcs/bag. 6 110 220 40 40 CAUTION TO ELECTROSTATIC DAMAGE XIAMEN HUALIAN ELECTRONICS C O.LTD. MA DE IN CHINA 6.2 (220x220x190mm)3 10000 / Externally Packed with 220x220x190mm3 cartons, 10000 pcs/carton. 6.3 Label Xiamen Hualian Electronics Co.., Ltd. P/N: Lot No. Qty. Insp. 7 Precautions 7.1 Forming 1Leads should be formed before soldering. 2002 6 4 7 PDF "FinePrint pdfFactory Pro" www.fineprint.com.cn RED SUPER BRIGHT LED SPECIFICATION HFR8010013C 2Do not form the leads with their bases as a fulcrum. 3 5mm Forming location should be up to 5mm from the epoxy body. 7.2 Installation LED PCB Installation on PCB do not apply physical stress to the leads when mounting LED lamps on PCB. Correct Wrong 7.3 Soldering 1Do not dip epoxy body into solder bath. 2Do not apply stress to the leads while they are heated. 3 30W 3 When soldering LED, the solder iron power should be not more than 30W and with the soldering time not more than 3 seconds. 9.4 Cleaning 1 1 In any case, the cleaning time should be 1 minute or less at a normal temperature. 2 Do not clean LEDs with water as the remains may rust the leads. Alcohol is suggested to be used. 3 LED 300W 30 PCB LED PCB LED When LEDs are ultrasonic-washed, use the ultrasonic output power of less than 300W and the time of less than 30s; do not let the PCB and LEDs touch on the oscillator; do not resonate the LEDs attached on the PCB. 7.5 LED LED 2002 6 5 7 PDF "FinePrint pdfFactory Pro" www.fineprint.com.cn RED SUPER BRIGHT LED SPECIFICATION HFR8010013C The ultra bright LED is an electrostatic insensitive device, so static electricity and surge will damage the LED. It is required to wear a wrist-band when handling the LED. All device, equipment, machinery, desk and ground must be properly grounded. 8 Suggested way of usage. LED 20mA When using LED, it must use a protective resistor in series with DC current about 20 mA. 2002 6 6 7 PDF "FinePrint pdfFactory Pro" www.fineprint.com.cn