©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 03/17/16
Low Capacitance ESD Protection - SP7538P Series
Description
Applications
The SP7538P integrates 8 channels of ultra low capacitance
rail-to-rail diodes and an additional zener diode to provide
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). This robust
device can safely absorb repetitive ESD strikes above the
maximum level specified in the IEC61000-4-2 international
standard (±8kV contact discharge) without performance
degradation. The extremely low loading capacitance also
makes it ideal for protecting high speed signal pins such as
V-By-One, HDMI, USB3.0, USB2.0, and IEEE 1394.
Features
• ESD, IEC61000-4-2,
±12kV contact, ±25kV air
• EFT, IEC61000-4-4, 40A
(tP=5/50ns)
• Lightning, IEC61000-
4-5 2nd edition, 4A
(tP=8/20μs)
• Low capacitance of 0.5pF
(TYP) per I/O
• Low leakage current of
1.5μA (MAX) at 5V
• Halogen free, Lead free
and RoHS compliant
• V-By-One
• Embedded DisplayPort
• USB 2.0/3.0 Ports
• HDMI
• Flat Panel Displays
• LCD/LED TVs
• Smartphones
• Mobile Computing
Pinout
12
789
453
6
Functional Block Diagram
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
SP7538P Series 0.5pF 12KV Diode Array RoHS
Pb
GREEN
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 03/17/16
Low Capacitance ESD Protection - SP7538P Series
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 4.0 A
TOP Operating Temperature -40 to 150 °C
TSTOR Storage Temperature -55 to 150 °C
Electrical Characteristics (TOP=25ºC)
8/20μS Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.05.0 10.015.020.025.030.0
Time (μs)
Percent of IPP
Clamping Voltage vs IPP
0.0
2.0
4.0
6.0
8.0
10.0
1.02.0 3.04.0
Clamp Voltage (V
C
)
Peak Pulse Current-I
PP
(A)
Capacitance vs. Reverse Bias
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
00.5 11.5 22.533.5 44.5 5
Capacitance (pF)
Bias Voltage (V)
Transmission Line Pulsing(TLP) Plot
0
5
10
15
20
036912 15
TLP Voltage (V)
TLP Current (A)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR ≤ 1µA 5.0 V
Reverse Leakage Current ILEAK VR=5V, Any I/O to GND 1. 5 µA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Fwd 6.6 V
IPP=2A, tp=8/20µs, Fwd 7. 0 V
Dynamic Resistance2RDYN TLP, tP=100ns, I/O to GND 0.3 Ω
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact) ±12 kV
IEC61000-4-2 (Air) ±25 kV
Diode Capacitance1CI/O-GND Reverse Bias=0V, f=1 MHz 0.5 pF
Diode Capacitance1CI/O-/O Reverse Bias=0V, f=1 MHz 0.3 pF
Note: 1 Parameter is guaranteed by design and/or device characterization.
2 Transmission Line Pulse (TLP) with 100ns width and 2ns rise time.
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 03/17/16
Low Capacitance ESD Protection - SP7538P Series
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min)) 150°C
- Temperature Max (Ts(max)) 200°C
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.004 inches(0.102mm)
Substrate material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Part Numbering System
SP 7538P U T G
Series Package
U=μDFN-9 (3.8x1.0mm)
T= Tape & Reel
G= Green
TVS Diode Arrays
(SPA Diodes)
®
Part Number Package Marking Min. Order Qty.
SP7538PUTG µDFN-9 SP7538x 3000
Ordering Information Part Marking System
x
Product Series Assembly Site
SP7538
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 03/17/16
Low Capacitance ESD Protection - SP7538P Series
Package Dimensions
µDFN-9 (3.8x1.0mm)
JEDEC MO-229
Symbol
Millimeters Inches
Min Nom Max Min Nom Max
A0.45 0.50 0.55 0.018 0.020 0.022
A1 - 0.02 0.05 - 0.001 0.002
b0.15 0.20 0.25 0.006 0.008 0.010
c0.10 0.15 0.20 0.004 0.006 0.008
D3.70 3.80 3.90 0.146 0.150 0.154
e0.80 BSC 0.031 BSC
e1 0.90 BSC 0.035 BSC
E0.90 1.00 1.10 0.035 0.039 0.043
L0.20 0.30 0.40 0.008 0.012 0.016
Embossed Carrier Tape & Reel Specification
Symbol Millimeters
A0 1.35 +/- 0.10
B0 4.00 +/- 0.05
DØ 1.50 + 0.1/ -0
D1 Ø 1.00 +/-0.05
E1.75 +/- 0.10
F5.50 +/- 0.05
K0 0.72 +/- 0.05
P4.00 +/- 0.10
P0 4.00 +/- 0.10
P2 2.00 +/- 0.05
T0.25 +/- 0.02
W12.00 + 0.30 /- 0.10
5° Max