PolySwitch devices for telecommunication and networking
applications were initially designed over ten years ago to meet
the growing demand for resettable overcurrent protection. These
product families help provide protection against power cross
and power induction surge as defined in ITU, Telcordia, and
UL. Available in chip, surface-mount, and radial-leaded
configurations, PolySwitch devices help improve the reliability
of customer premise and network equipment world wide.
Benefits
• Many product choices give engineers more design
flexibility
• Compatible with high volume electronics assembly
• Assist in meeting regulatory requirements
• Improved line balance
• Applicable for legacy POTS and modern digital
communications equipment
Features
• RoHS compliant
• Resettable overcurrent protection
• Surface-mount, radial-leaded, and chip form factors
• Fast time-to-trip
• Agency recognition: UL, CSA, TÜV
• Resistance sorted and matched devices available
• Low parasitic capacitance/flat impedance with
frequency
Target Applications
• Modems
• Phone sets
• Fax machines
• Phone wall outlets
• Alarm systems
• PBX systems
• MDF modules
• Analog and digital line cards
• T1/E1 equipment
• xDSL modems and splitters
• Powered ethernet systems
• VoIP (Voice over IP equipment)
• LAN, WAN equipment
• Customer premise equipment
• Access network hardware
PolySwitch Resettable Devices
Telecommunications and Networking Devices
Telecommunications and Networking Devices
167
13
Protection Application Guide for Telecommunications and Networking Devices*
Overcurrent Protection
Region/ Form Factor SiBar Thyristor
Application Specification Radial-leaded Surface-mount Chip Surge Protectors‡
Customer Premises equipment North America TRF600-150 TS600-170F TVBxxxSA-L,
IT equipment TIA-968-A (formerly TS600-200F TVBxxxSB-L, or
Analog modems, V.90 modems, FCC Part 68), TVAxxxSA-L
ISDN modems, xDSL modems, UL 60950
ADSL splitters, phone sets, fax machines, Europe/Asia/ TRF250-120 TRF250-130F TVBxxxSA-L
answering machines, caller ID, internet South America TRF250-120T TSV-130F TVAxxxSA-L
appliances, PBX systems, POS terminals, ITU K.21 TRF250-145
wall plugs TRF250-180
Access network equipment (†) North America TRF600-160 TS600-170F TVBxxxSC-L
Remote terminals, line repeaters, Telcordia GR-1089 TS600-200F
multiplexers, cross-connects, TSM600-250F
WAN equipment FT600-1250**
TSM600-400F††
Europe/Asia/ TRF250-120 TS250-130F TVBxxxSA-L
South America TRF250-145 TSV250-130F TVAxxxSA-L
ITU K.45 TRF250-120T
TRF250-180
Central office switching equipment (†) North America TRF600-160 TSM600-250F TVBxxxSC-L
Analog/POTS linecards, ISDN linecards, Telcordia GR-1089 TSM600-170F
xDSL modems, ADSL/VDSL splitters, TSM600-200F
T1/E1 linecards, multiplexers, FT600-1250**
CSU/DSU, servers TSM600-400F††
Europe/Asia/ TRF250-120 TS250-130F TVBxxxSA-L
South America TRF250-145 TSV250-130F TVAxxxSA-L
ITU K.20 TRF250-120T
TRF250-180
Primary protection modules (†) North America TRF250-180 N/A
MDF modules, Network Interface Telcordia GR-974
Devices (NID) Europe/Asia/ TRF250-120T TS250-130F TCF250-120T TVBxxxSx-L
South America TRF250-145T TSV250-130F
ITU K.20 TRF250-145
Short-haul/intrabuilding communications North America TRF250-120 TS250-130F TVBxxxSA-L
equipment (†)Telcordia GR-1089 TRF250-145 TSL250-080F TVAxxxSA-L
LAN equipment, VoIP cards, cable intrabuilding TRF250-120T TSV250-130F
telephony NIUs, wireless local loop Europe/Asia/ TRF250-120 TS250-130F TVBxxxSA-L
handsets South America TRF250-145 TSV250-130F TVAxxxSA-L
ITU K.21 TRF250-180
LAN intrabuilding power cross protection TSL250-080F TVBxxxSA-L
LAN equipment, VoIP cards, IP phones TVAxxxSA-L
IEEE 802.3 Power over LAN protection SMD050-2018F N/A
Powered ethernet switches and terminals,
IP phones, wireless LAN base stations,
microcellular base stations, VoIP cards
Cable telephony powering system BBRF550 N/A
Power passing taps BBRF750
To use this guide, follow the steps below:
1. Select your equipment type from the guide below.
2. Select the type of protection depending on the agency and regional specifications in the second column.
3. Select the form factor for your application.
4. Use the Agency Specification/ PolySwitch Device Selection Guide on the next page to select a specific part number for each application based
on the agency requirements.
5. Parts with fast time-to-trip or low resistance are available. Please consult your Raychem Circuit Protection representative.
Notes: *This list is not exhaustive. Raychem Circuit Protection welcomes our customers’ input for additional application ideas for PolySwitch resettable devices.
†For improved line balance in these applications, resistance-matched parts are recommended.
‡For more information on Raychem Circuit Protection SiBar thyristor surge protectors, refer to the SiBar product section on page 33.
** FT600-1250 are surface mount Telecom fuse devices. FT600-0500 and FT600-2000 reference also available. See FT600 section on page 85.
†† Helps meet GR-1089 issue 3
Telecommunications and Networking Devices
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168
PolySwitch Resettable Devices
Agency Specification/PolySwitch Selection Guide for Telecommunications and Networking Devices
Family Product* Lightning Power Cross
TCF250 TCF250-145T ITU K.20/21/45 – 4.0kV 10/700μs†ITU K.20/21/45 – 230VAC, 10Ω
TCF250-180 ITU K.20/21/45 – 600VAC, 600Ω
TCF250-120T
TRF250 TRF250-080U ITU K.20 – 1.0kV 10/700μs ITU K.20 – 230VAC, 10Ω
ITU K.20 – 600VAC, 600Ω
TRF250-110U ITU K.20/21/45 – 1.5kV 10/700μs ITU K.20/21/45 – 230VAC, 10Ω
TRF250-120 ITU K.20/21/45 – 4.0kV 10/700μs†ITU K.20/21/45 – 600VAC, 600Ω
TRF250-120T
TRF250-120U
TRF250-120UT
TRF250-145
TRF250-145U
TRF250-180
TRF250-180US
TSV250 TSV250-130F ITU K.20/21/45 – 1.5kV 10/700μs ITU K.20/21/45 – 230VAC, 10Ω
TS250 TS250-130F ITU K.20/21/45 – 4.0kV 10/700μs†ITU K.20/21/45 – 600VAC, 600Ω
TSL250 TSL250-080F Telcordia GR-1089 Intrabuilding – Surge 1 & 2 Telcordia GR-1089 Intrabuilding – 120VAC, 25A
ITU K.20/21/45 – 230VAC, 10Ω
TR600 TRF600-150 TIA-968-A (formerly FCC Part 68) UL60950, 3rd Ed. – 600VAC, 40A
TRF600-160 Telcordia GR-1089 – Level 1 and 2, issue 2‡Telcordia GR-1089 – 600VAC, 60A
TS600 TS600-170F TIA-968-A (formerly FCC Part 68) UL60950, 3rd Ed. – 600VAC, 40A
TS600-200F-RA Telcordia GR-1089 – Level 1 and 2, issue 2‡Telcordia GR-1089 – 600VAC, 60A
TSM600 TSM600-250F TIA-968-A (formerly FCC Part 68) UL60950, 3rd Ed. – 600VAC, 40A
TSM600-250F-RA Telcordia GR-1089 – Level 1 and 2, issue 2‡ Telcordia GR-1089 – 600VAC, 60A
TSM600-400F TIA-968-A (formerly FCC Part 68) UL60950, 3rd Ed. – 600VAC, 40A
Telcordia GR-1089, issue 3 Telcordia GR-1089 – 600VAC, 60A
FT600** FT600-0500 TIA-968-A - Type A & B UL60950, 600VAC, 40A
FT600-1250 TIA-968-A - Type A & B UL60950, 3rd Ed. – 600VAC, 40A
FT600-2000 Telcordia GR-1089 – 600 VAC, 60A
Use the guide below to select the PolySwitch devices which are typically used in your application. The following pages contain the specifications for the
part numbers recommended below. PolySwitch devices assist telecommunication equipment in meeting the applicable protection requirements of these
industry specifications. Refer to individual agency specifications for test procedures and circuit schematics. Users should independently evaluate the
suitability of, and test each product for their application.
Notes: *Applies to all products which share the same prefix.
†Tested with 230V gas discharge tube primary protector.
‡May require additional series resistor to help telecommunication equipment pass Surge 3 (1kV, 10/1000μs).
** See telecom surface-mount fuse section page 85.
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13
TS600 SMD,midSMD
TCF250 TRF250 TS250 TSV250 TSL250 TSM600 TRF600 BBRF RXEF miniSMDC
Voltage Rating (V)*** 60/250 60/250 60/250 60/250 80/250 60/600 60/600 99 60 60
(Operating/Interrupt) 72††
Telcordia UL60950 UL60950
GR-1089 Telcordia Telcordia Cable
Specification ITU ITU ITU ITU Intrabuilding GR-1089 GR-1089 Taps
Hold Current (A)
0.080 — 17.0Ω— — 8.0Ω———— —
0.100 — — — — — — — — 3.5Ω—
0.110 — 7.0Ω—— — — — —— —
0.120 10.5Ω6.0-9.5Ω—— — — — —— —
0.130 — — 8.0-10.5Ω5.5Ω——————
0.140 — — — — — — — — — 4.0Ω
0.145 7.0Ω4.3-5.0Ω—— — — — —— —
0.150 — — — — — — 8Ω—— —
0.160 — — — — — — 5.5-7.0Ω‡‡ —— —
0.170 — — — — — 11.0Ω— — 4.3Ω—
0.180 1.4Ω1.5Ω††† —— — — — —— —
0.200 — — — — — 8.5Ω— — 2.3Ω†† —
0.250 — — — — — 3-3.5Ω‡‡ — — 1.6Ω†† —
0.300 — — — — — — — — — —
0.400 — — — — — — 1.1Ω†† —— —
0.550 — — — — — — — 1.05Ω——
0.750 — — — — — — — 0.58Ω——
Table T1 - Product Series: Size, Current Rating, Voltage Rating, Typical Resistance for
Telecommunications and Networking Devices
Voltage Ratings for Telecommunications and Networking Devices
For Raychem Circuit Protection telecommunications devices (TC, TGC, TCF, TRx, TSx series) there are two applicable voltage ratings. These are Vmax Operating
and Vmax Interrupt. To help understand the nature of these two different voltage ratings the following definitions are provided:
max Operating: For telecommunications devices this is the voltage we have used to obtain component recognition under UL1434. Most Raychem Circuit P
rotection devices (TGC, TCF, TRFx, TSx) are certified at 60V but can withstand higher Vmax. TR600-160 and TSM600 product families are certified at 250V b
ut can withstand higher Vmax. Interrupt conditions as noted above.
max Interrupt: Under specified conditions this is the highest voltage that can be applied to the device at the maximum current. Devices have been designed t
o trip safely under higher power level cross conditions, as listed above, to assist equipment in meeting the appropriate industry conditions.
†† These devices have a maximum operating voltage of 72V
‡‡ These devices have a maximum operating voltage of 250V
*** Voltage Rating for Telecommunications and Networking Devices is dependent upon the nature of the fault conditions. See telecom fuses section on page 86.
††† These devices have a maximum operating voltage of 100V
Table T2 - Thermal Derating for Telecommunications and Networking Devices
[Hold Current (A) at Ambient Temperature (°C)]
Maximun Ambient Temperature
-40˚C -20˚C 0˚C 20˚C 40˚C 50˚C 60˚C 70˚C 85˚C
Part Number
Chip*—60/250V
TCF250
TCF250-120T 0.186 0.165 0.143 0.120 0.099 0.088 0.077 0.066 0.050
TCF250-145T 0.225 0.199 0.172 0.145 0.119 0.106 0.093 0.080 0.060
TCF250-180** 0.269 0.240 0.211 0.180 0.153 0.138 0.123 0.109 0.087
Radial-leaded*—60/250V
TRF250
TRF250-080U 0.124 0.110 0.095 0.080 0.066 0.059 0.051 0.044 0.033
TRF250-110U 0.171 0.151 0.131 0.110 0.091 0.081 0.071 0.061 0.046
TRF250-120 0.186 0.165 0.143 0.120 0.099 0.088 0.077 0.066 0.050
TRF250-145 0.225 0.199 0.172 0.145 0.119 0.106 0.093 0.080 0.060
TRF250-180** 0.279 0.247 0.213 0.180 0.147 0.131 0.115 0.099 0.074
TRF250-180US 0.279 0.247 0.213 0.180 0.147 0.131 0.115 0.099 0.074
Surface†—80/250V
TSL250
TSL250-080F 0.124 0.110 0.095 0.080 0.066 0.059 0.051 0.044 0.033
*60/250V products are designed to help equipment pass ITU specifications (K.20, K.21, etc) and Telcordia GR-1089 Intrabuilding power cross.
†80/250V products are designed to help equipment pass Telcordia GR-1089 Intrabuilding power cross (120VAC/25A).
** Product is not currently available in a resistance matched or sorted option.
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170
PolySwitch Resettable Devices
Table T2 - Thermal Derating for Telecommunications and Networking Devices
[Hold Current (A) at Ambient Temperature (°C)]
Cont'd
...
Maximun Ambient Temperature
-40˚C -20˚C 0˚C 20˚C 40˚C 50˚C 60˚C 70˚C 85˚C
Part Number
Surface*—60/250V
TS250/TSV250
TS250-130F 0.208 0.182 0.156 0.130 0.104 0.091 0.078 0.065 0.045
TSV250-130F 0.208 0.182 0.156 0.130 0.104 0.091 0.078 0.065 0.045
Radial-leaded‡—60/600V
TRF600
TRF600-150 0.233 0.206 0.178 0.150 0.124 0.110 0.096 0.083 0.062
TRF600-160 0.249 0.219 0.190 0.160 0.132 0.117 0.103 0.088 0.066
Surface‡—60/600V
TS600/TSM600
TS600-170F 0.264 0.230 0.200 0.170 0.140 0.125 0.109 0.094 0.070
TS600-200F-RA-B-0.5 0.310 0.275 0.238 0.200 0.165 0.147 0.128 0.110 0.083
TSM600-250F 0.400 0.350 0.300 0.250 0.198 0.170 0.140 0.117 0.083
TSM600-250F-RA 0.400 0.350 0.300 0.250 0.198 0.170 0.140 0.117 0.083
TSM600-400F 0.640 0.560 0.480 0.400 0.320 0.270 0.230 0.190 0.130
Radial-leaded—90V
BBRF**
BBRF550 0.850 0.750 0.650 0.550 0.450 0.400 0.350 0.300 0.220
BBRF750 1.150 1.000 0.900 0.750 0.610 0.550 0.480 0.410 0.300
Radial-leaded—60/72V
RXEF**
RXEF010 0.160 0.140 0.110 0.100 0.080 0.072 0.067 0.050 0.040
RXEF017 0.260 0.230 0.210 0.170 0.140 0.120 0.110 0.090 0.070
RXEF020 0.310 0.270 0.240 0.200 0.160 0.140 0.130 0.110 0.080
RXEF025 0.390 0.340 0.300 0.250 0.200 0.180 0.160 0.140 0.100
RXEF030 0.470 0.410 0.360 0.300 0.240 0.220 0.200 0.160 0.120
Surface—60V
SMD, midSMD**
SMD030F 0.44 0.39 0.32 0.30 0.26 0.23 0.19 0.18 0.15
SMD030F-2018 0.48 0.42 0.35 0.30 0.24 0.21 0.17 0.15 0.10
SMD050F-2018 0.86 0.77 0.70 0.55 0.48 0.43 0.38 0.36 0.26
Surface—60V
miniSMD**
miniSMDC014F 0.23 0.20 0.17 0.14 0.11 0.10 0.09 0.07 0.05
*60/250V products are designed to help equipment pass ITU specifications (K.20, K.21, etc) and Telcordia GR-1089 Intrabuilding power cross.
†80/250V products are designed to help equipment pass Telcordia GR-1089 Intrabuilding power cross (120VAC/25A).
‡60/600V products are designed to help equipment pass UL60950, TIA-968-A (formerly FCC Part 68) and GR1089 specifications.
** Product is not currently available in a resistance matched or sorted option.
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13
Figure T1 - Thermal Derating [Hold Current (A) at Ambient Temperature (°C)]
A = TCF250-180
B = All other TCF
TRFX, TSX, TSMX
series devices
Device's ambient temperature (°C)
Figure T1
For thermal derating of BBRF and RXEF series devices, see radial-leaded product section.
For SMD, midSMD, miniSMDC series, see surface-mount product section.
% of rated hold and trip current
Table T3 - Electrical Characteristics for Telecommunications and Networking Devices
IHIT VMax Operating VMax Interrupt IMax Pd TYP Time-to-Trip RMin RMAX R1 Max Figure for
Part Number (A) (A) (VDC)(V
RMS) (A) (W) (A) (s) (
Ω
)(
Ω
)(
Ω
) Dimension
Chip*—60/250V
TCF250
TCF250-120T 0.120 0.240 60 250 3.0 1.0 1.0 1.20 max 6.3 12.0 18.0 T4
TCF250-145T 0.145 0.290 60 250 3.0 1.0 1.0 1.50 nom 5.0 9.0 14.0 T4
TCF250-180 0.180 0.500 60 250 3.0 1.0 1.0 15.00 nom 0.8 2.0 4.0 T4
Radial-leaded*—60/250V
TRF250
TRF250-080T 0.080 0.160 60 250 3.0 1.0 0.35 4.00 max 15.0 22.0 33.0 T2
TRF250-080U 0.080 0.160 60 250 3.0 1.0 0.35 4.00 max 14.0 20.0 33.0 T2
TRF250-110U 0.110 0.220 60 250 3.0 1.0 1.0 0.75 nom 5.0 9.0 16.0 T2
TRF250-120 0.120 0.240 60 250 3.0 1.0 1.0 1.50 nom 4.0 8.0 16.0 T3
TRF250-120T 0.120 0.240 60 250 3.0 1.0 1.0 0.70 nom 7.0 12.0 16.0 T3
TRF250-120T-RA 0.120 0.240 60 250 3.0 1.0 1.0 1.20 nom 7.0 9.0 16.0 T3
TRF250-120T-RC 0.130 0.260 60 250 3.0 1.0 1.0 3.00 nom 5.4 7.5 14.0 T3
TRF250-120T-RF 0.120 0.240 60 250 3.0 1.0 1.0 0.90 nom 6.0 10.5 16.0 T3
TRF250-120T-R1 0.120 0.240 60 250 3.0 1.0 1.0 1.00 nom 6.0 9.0 16.0 T3
TRF250-120T-R2 0.120 0.240 60 250 3.0 1.0 1.0 0.75 nom 8.0 10.5 16.0 T3
TRF250-120U 0.120 0.240 60 250 3.0 1.0 1.0 1.00 nom 6.0 10.0 16.0 T3
TRF250-120UT 0.120 0.240 60 250 3.0 1.0 1.0 0.70 nom 7.0 12.0 16.0 T3
TRF250-145 0.145 0.290 60 250 3.0 1.0 1.0 2.50 nom 3.0 6.0 14.0 T3
TRF250-145-RA 0.145 0.290 60 250 3.0 1.0 1.0 2.50 nom 3.0 5.5 12.0 T3
TRF250-145-RB 0.145 0.290 60 250 3.0 1.0 1.0 2.00 nom 4.5 6.0 14.0 T3
TRF250-145T 0.145 0.290 60 250 3.0 1.0 1.0 1.00 nom 5.4 7.5 14.0 T3
TRF250-145U 0.145 0.290 60 250 3.0 1.0 1.0 2.00 nom 3.5 6.5 12.0 T3
TRF250-180 0.180 0.650 100 250 10.0 1.5 3.0 0.5 nom 0.8 2.2 4.0 T2
TRF250-180US 0.180 0.650 100 250 10.0 1.4 3.0 0.5 nom/2.0 max 0.8 2.2 4.0 T12
Surface
†
—80/250V
TSL250
TSL250-080F 0.080 0.160 80 250 3.0 1.2 1.0 0.80 nom 5.0 11.0 20.0 T9
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PolySwitch Resettable Devices
Table T3 - Electrical Characteristics for Telecommunications and Networking Devices
IHIT VMax Operating VMax Interrupt IMax Pd TYP Time-to-Trip RMin RMAX R1 Max Figure for
Part Number (A) (A) (VDC)(V
RMS) (A) (W) (A) (s) (
Ω
)(
Ω
)(
Ω
) Dimension
Surface
*
—60/250V
TS250/TSV250
TS250-130F 0.130 0.260 60 250 3.0 1.1 1.0 0.9 nom 6.5 12.0 20.0 T6
— — 60 600 1.0 — — — — — — —
TS250-130F-RA 0.130 0.260 60 250 3.0 1.1 1.0 1.4 nom 6.5 9.0 15.0 T6
— — 60 600 1.0 — — — — — — —
TS250-130F-RB 0.130 0.260 60 250 3.0 1.1 1.0 0.7 nom 9.0 12.0 20.0 T6
— — 60 600 1.0 — — — — — — —
TS250-130F-RC 0.130 0.260 60 250 3.0 1.1 1.0 1.1 nom 7.0 10.0 17.0 T6
— — 60 600 1.0 — — — — — — —
TSV250-130F 0.130 0.260 60 250 3.0 1.5 1.0 2.0 nom 4.0 7.0 12.0‡‡ T7
Radial-leaded
‡
TRF600
TRF600-150 0.150 0.300 60 600 3.0 1.0 1.0 1.4 nom 6.0 10.0 17.0 T3
TRF600-150-RB 0.130 0.260 250 600 3.0 1.0 1.0 4.5 nom 9.0 12.0 22.0 T3
TRF600-160 0.160 0.320 250 600 3.0 1.0 1.0 7.5 nom 4.0 10.0 18.0 T3
TRF600-160-RA 0.160 0.320 250 600 3.0 1.0 1.0 9.5 nom 4.0 7.0 16.0 T3
TRF600-160-R1 0.160 0.320 250 600 3.0 1.0 1.0 9.0 nom 4.0 8.0 17.0 T3
Surface
‡
—60/600V
TS600/TSM600
TS600-170F 0.170 0.400 60 600 3.0 2.5 1.0 10.0 nom 4.0 9.0 18.0 T10
TS600-200F-RA-B-0.5
0.200 0.400 60 600 3.0 2.5 1.0 12.0 nom 4.0 7.5 13.5 T10
TSM600-250F 0.250 0.860 250 600 3.0 2.0 3.0 0.8 nom 1.0 3.5 7.0 T11
TSM600-250F-RA 0.250 0.860 250 600 3.0 2.0 3.0 1.0 nom 1.0 3.0 5.0 T11
TSM600-400F 0.400 1.000 250 600 3.0 2.0 3.0 4.0 nom/14.0 max 0.5 1.5 2.0 T11
Radial-leaded
**
—99V
BBRF
BBRF550 0.550 1.1 — 99 20.0 1.5 1.6 60 max 0.80 1.3 1.95 T2
BBRF750 0.750 1.5 — 99 20.0 1.7 2.0 60 max 0.40 0.75 1.20 T2
Radial-leaded
**
—60,72V
RXEF
RXEF010 0.100 0.200 — 60†† 40.0 0.38 0.50 4.0 max 2.50 4.50 7.50 T2
RXEF017 0.170 0.340 — 60†† 40.0 0.48 0.85 3.0 max 3.30 5.21 8.00 T2
RXEF020 0.200 0.400 — 72†† 40.0 0.41 1.00 2.2 max 1.83 2.75 4.40 T2
RXEF025 0.250 0.500 — 72†† 40.0 0.45 1.25 2.5 max 1.25 1.95 3.00 T2
RXEF030 0.300 0.600 — 72†† 40.0 0.49 1.50 3.0 max 0.88 1.33 2.10 T2
Surface
**
—60V
SMD, midSMD
SMD030F 0.300 0.600 — 60†† 10.0 1.5 1.5 3.0 max 1.20 3.00 4.8 T9
SMD030-2018F 0.300 0.800 — 60†† 20.0 0.7 1.5 1.5 max 0.50 1.40 2.3 T8
SMD050-2018F 0.550 1.200 — 57 10.0 1.0 2.5 5.0 max 0.20 — 1.0 T8
Surface
**
—60V
miniSMD
miniSMDC014F 0.140 0.340 — 60†† 10.0 0.6 1.5 0.15 max 1.5 4.0 6.0 T5
Notes:
*60/250V products are designed to help equipment pass ITU specifications (K.20, K.21, etc) and Telcordia GR-1089 Intrabuilding power cross.
†80/250V products are designed to help equipment pass Telcordia GR-1089 Intrabuilding power cross (120VAC/25A).
‡60/600V products are designed to help equipment pass UL60950, TIA-968-A (formerly FCC Part 68) and GR1089 specifications.
** Product is not currently available in a resistance matched or sorted option.
†† Voltage rating for these products is Vmax operating (VDC)
‡‡ R1max measured 1 hour post-trip, or 24 hours post-reflow at 20°C.
IH = Hold current: maximum current device will pass without interruption in 20°C still air.
IT = Trip current: minimum current that will switch the device from low resistance to high resistance in 20°C still air.
VMAX Interrupt = Maximum voltage that can be safely placed across a device in its tripped state under specified fault conditions.
IMAX = Maximum fault current device can withstand without damage at rated voltage.
Pd = Power dissipated from device when in the tripped state in 20°C still air.
R1MAX is measured one hour post-trip or post-reflow at 20°C.
RMAX = Maximum resistance of device as supplied at 20°C unless otherwise specified.
Cont'd
...
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13
Figures T2-T12 - Dimension Figures for Telecommunications and Networking Devices
Figure T2
C
B
D
A
E
C
LC
L
Figure T5
A
C
D
B
E
Figure T8
A
C
B
DE
Figure T3
A
C
B
D
E
C
LC
L
Figure T6
C
E
DA
B
Figure T9
A
E
C
B
DD
CF
DD
A
EE
G
B
Figure T11
Figure T4
A
B
C
Figure T7
A
B
D
F
E
C
Figure T10
C
B
E
A
F
D
Figure T12
Telecommunications and Networking Devices
13
174
PolySwitch Resettable Devices
A
D
E
C
C
LC
L
Table T4 - Dimensions for Telecommunications and Networking Devices in Millimeters (Inches)
Dimension
Part A B C D E F G Figure
Number Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
TCF–60/250V
*
TCF250-120T 5.4 5.6 5.4 5.6 2.0 2.3 — — — — — — — — T4
(0.213) (0.221) (0.213) (0.221) (0.079) (0.091)
TCF250-145T 5.4 5.6 5.4 5.6 2.0 2.5 — — — — — — — — T4
(0.213) (0.221) (0.213) (0.221) (0.080) (0.100)
TCF250-180 9.8 10.4 6.1 6.6 2.0 2.5 — — — — — — — — T4
(0.386) (0.410) (0.242) (0.260) (0.080) (0.100)
TRF250–60/250V
*
TRF250-080T — 5.8 — 9.9 — 4.6 4.7 — 5.0** — — — — — T2
(0.228) (0.390) (0.181) (0.185) — (0.197)
TRF250-080U — 4.8 — 9.3 — 3.8 4.7 — 5.0** — — — — — T2
(0.189) (0.366) (0.150) (0.185) (0.197)
TRF250-110U — 5.3 — 9.4 — 3.8 4.7 — 5.0** — — — — — T2
(0.210) (0.370) (0.150) (0.185) (0.197)
TRF250-120 — 6.5 — 11.0 — 4.6 4.7 — 5.0** — — — — — T3
(0.256) (0.433) (0.181) (0.185) (0.197)
TRF250-120U — 6.0 — 10.0 — 3.8 4.7 — 5.0** — — — — — T3
(0.236) (0.394) (0.150) (0.185) (0.197)
TRF250-145 — 6.5 — 11.0 — 4.6 4.7 — 5.0** — — — — — T3
(0.256) (0.433) (0.181) (0.185) (0.197)
TRF250-145U — 6.0 — 10.0 — 3.8 4.7 — 5.0** — — — — — T3
(0.236) (0.394) (0.150) (0.185) (0.197)
TRF250-180 — 9.0 — 12.0 — 3.8 4.7 — 5.0** — — — — — T2
(0.354) (0.412) (0.150) (0.185) (0.197)
TRF250-180US — 8.1 — — — 3.0 4.7 — 5.0** — — — — — T12
(0.319) (0.118) (0.185) (0.197)
TSL250–80/250V
†
TSL250-080F 6.7 7.9 2.7 3.7 4.8 5.3 0.2 0.4 2.5 3.1 — — —— T9
(0.265) (0.310) (0.110) (0.145) (0.190) (0.210) (0.008) (0.015) (0.100) (0.120)
TS250/TSV250–60/250V
*
TS250-130F 8.5 9.4 — 3.4 — 7.4 0.3
**
— 3.8
**
————— T6
(0.335) (0.370) (0.135) (0.290) (0.011) (0.150)
TSV250-130F — 6.1 — 6.9 — 3.2 0.56 — — 1.9 1.6 2.3 —— T7
(0.240) (0.270) (0.126) (0.022) (0.075) (0.065) (0.091)
TRF600–60/600V
‡
TRF600-150 — 9.0 — 12.5 — 4.6 4.7 — 5.0 — — 9.0 — — T3
— (0.354) — (0.492) — (0.180) (0.185) — (0.197) — — (0.354) — —
TRF600-160 — 16.0 — 12.6 — 6.0 4.7 — 5.0** ————— T3
(0.630) (0.496) (0.236) (0.185) (0.197)
TS600/TSM600–60/600V
‡
TS600-170F 18.2 19.4 11.5 12.3 7.2 8.3 1.6 2.4 9.9 10.4 1.5 2.3 —— T10
(0.720) (0.765) (0.455) (0.485) (0.285) (0.325) (0.065) (0.095) (0.390) (0.410) (0.060) (0.090)
TS600-200F-RA 18.2 19.4 11.5 12.3 7.2 8.3 1.6 2.4 9.9 10.4 1.5 2.3 —— T10
(0.720) (0.765) (0.455) (0.485) (0.285) (0.325) (0.065) (0.095) (0.390) (0.410) (0.060) (0.090)
TSM600-250F — 17.6 — 11.7 — 11.2 — 5.2 — 2.8 0.6 — 2.0 — T11
TSM600-250F-RA (0.69) (0.46) (0.44) (0.20) (0.11) (0.02) (0.080)
TSM600-400F — 17.6 — 11.7 — 11.2 — 5.2 — 2.8 — 1.0 —1.0 T11
(0.69) (0.46) (0.44) (0.23) (0.111) (0.038) (0.038)
BBRF–90V
BBRF-550 — 10.9 — 14.0 — 3.6 7.6 — 4.3 5.8 — — — — T2
(0.43) (0.55) (0.14) (0.30) (0.17) (0.23)
BBRF-750 — 11.9 — 15.5 — 3.6 7.6 — 4.3 5.8 — — — — T2
(0.47) (0.61) (0.14) (0.30) (0.17) (0.23)
RXEF–60, 72V
RXEF010 — 7.4 — 11.6 — 3.0 7.6 — 4.3 5.8 — — — — T2
(0.29) (0.46) (0.12) (0.30) (0.17) (0.23)
RXEF017 — 7.4 — 12.7 — 3.0 7.6 — 4.3 5.8 — — — — T2
(0.29) (0.50) (0.12) (0.30) (0.17) (0.23)
RXEF020 — 7.4 — 11.7 — 3.0 7.6 — 4.3 5.8 — — — — T2
(0.29) (0.46) (0.12) (0.30) (0.17) (0.23)
RXEF025 — 7.4 — 12.7 — 3.0 7.6 — 4.3 5.8 — — — — T2
(0.29) (0.50) (0.12) (0.30) (0.17) (0.23)
RXEF030 — 7.4 — 12.7 — 3.0 7.6 — 4.3 5.8 — — — — T2
(0.29) (0.50) (0.12) (0.30) (0.17) (0.23)
midSMD–60V
SMD030F 6.73 7.98 — 3.18 4.8 5.44 0.56 0.71 0.56 0.71 2.16 2.41 — — T9
(0.265) (0.314) (0.125) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095)
SMD030-2018F 4.72 5.44 — 1.78 4.22 4.93 0.25 0.36 0.25 0.36 0.30 0.46 — — T8
(0.186) (0.214) (0.070) (0.166) (0.194) (0.010) (0.014) (0.010) (0.14) (0.012) (0.018)
SMD050-2018F 4.72 5.44 — 1.78 4.22 4.93 0.25 0.36 0.25 0.36 0.30 0.46 — — T8
(0.186) (0.214) (0.070) (0.166) (0.194) (0.010) (0.014) (0.010) (0.14) (0.012) (0.018)
miniSMD–60V
miniSMDC014F 4.37 4.73 0.635 0.89 3.07 3.41 0.30 — 0.25 0.50 — — — — T5
(0.172) (0.186) (0.025) (0.035) (0.121) (0.134) (0.012) (0.010) (0.020)
Notes: *60/250V products are designed to help equipment pass ITU specifications (K.20, K.21, etc) and Telcordia GR-1089 Intrabuilding power cross.
†80/250V product designed to help equipment pass Telcordia GR-1089 Intrabuilding power cross (120VAC/25A).
‡60/600V products are designed to help equipment pass UL 60950,TIA-968-A (formerly FCC Part 68) and Telcordia GR-1089 specification.
** Indicates dimension is typical, not minimum.
Telecommunications and Networking Devices
175
13
Figures T13-T18 - Typical Time-to-trip Curves at 20°C for Telecommunications and Networking Devices
TCF250
A = TCF250-180
B = TCF250-145T
C = TCF250-120T
TRF250
A = TRF250-180
B = TRF250-145/145U
C = TRF250-120/120U
D = TRF250-110U/120UT/120T
E = TRF250-080T/080U/080US
TS250/TSV250/TSL250
A = TSV250-130F
B = TS250-130F
C = TSL250-080F
Figure T13
Figure T14
Figure T15
0.00 0.50 1.00 1.50 2.00 2.50 3.00
100
10
1
0.10
0.01
Time-to-trip (s)
B
C
A
Fault Current (A)
Time-to-trip (s)
0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 2.20 2.40 2.60 2.80 3.00
Fault current (A)
0.01
0.10
1
10
100
1000
A
B
C
D
E
0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 2.20 2.40 2.60 2.80 3.00
Fault current (A)
0.01
0.10
1
10
100
1000
Time-to-trip (s)
C
B
A
C
B
A
Telecommunications and Networking Devices
13
176
PolySwitch Resettable Devices
B
C
A
Figures T13-T18 - Typical Time-to-trip Curves at 20°C for Telecommunications and Networking Devices
TRF600/TS600/TSM600
A = TSM600-250F
B = TS600-170F/200F
C = TRF600-160
D = TRF600-150
E = TSM600-400F
RXEF/BBRF
A = RXEF010
B = RXEF017
C = RXEF020
D = RXEF025
E = RXEF030
F = BBRF550
G = BBRF750
SMD/miniSMDC/midSMD
A = miniSMDC014 &
miniSMDC014F
B = SMD030-2018F
C = SMD030F
D = SMD050-2018F
Cont'd
...
Fault current (A)
Time-to-trip (s)
0.0010.1 1 10 100
0.01
0.1
1
10
100
1000 ABCDE FG
Figure T17
Figure T18
0.1 1 10
100
10
1
0.1
0.01
0.001
Fault current (A)
Time-to-trip (s)
ABCD
A
C
D
A
BCDE
F
G
Figure T16
0.00 0.50 1.00 1.50 2.00 2.50 3.00
0.1
1
10
100
1000
Time-to-trip (s)
Fault Current (A)
C
B
A
CB
A
D
D
E
E
Telecommunications and Networking Devices
177
13 B
TCF250*
Physical Characteristics
Terminal material Nickel foil
TCF250*
Environmental Specifications
Test Conditions
Passive aging 60°C, 1000 hours
85°C, 1000 hours
Humidity aging 85°C, 85% RH, 1000 hours
Thermal shock 125°C, -55°C (10 times)
Solvent resistance MIL-STD-202, Method 215F
Note: Storage conditions: 40°C max., 70% RH max., devices should remain in original sealed bag prior to use. Devices may not meet specified values if these storage conditions are exceeded.
TRF250*
Physical Characteristics
Lead material Tin plated copper, 22AWG
Insulating material Cured epoxy polymer
Flammability per IEC 695-2-2 Needle Flame Test for 20s
Soldering characteristics ANSI/J-STD-002, Category 3
Solder heat withstand IEC-STD 68-2-20, Test Tb, Section 5 Method 1A, condition B: can withstand 10 seconds at 260°C±5°C
Note: Devices are not designed to be placed through a reflow process.
TRF250*
Environmental Specifications
Test Conditions
Passive aging 60°C, 1000 hours
85°C, 1000 hours
Humidity aging 85°C, 85% RH, 1000 hours
Thermal shock 125°C, -55°C (10 times)
Solvent resistance MIL-STD-202, Method 215F
Note: Storage conditions: 40°C max., 70% RH max., devices should remain in original sealed bag prior to use. Devices may not meet specified values if these storage conditions are exceeded.
TS250*/TSV250*/TSL250†
Physical Characteristics
Terminal material Tin plated brass, Nickel under plating
Soldering characteristics EIC 60008-2-58
TS250*/TSV250*/TSL250†
Environmental Specifications
Test Conditions
Passive aging 60°C, 1000 hours
85°C, 1000 hours
Humidity aging 85°C, 85% RH, 500 hours
Thermal shock 125°C, -55°C (10 times)
Solvent resistance MIL-STD-202, Method 215F
Note: Storage conditions: 40°C max., 70% RH max., devices should remain in original sealed bag prior to use. Devices may not meet specified values if these storage conditions are exceeded.
TRF600‡
Physical Characteristics
Lead material Tin plated copper, 22AWG
Insulating material†† Cured epoxy polymer
Flammability per IEC 695-2-2 Needle flame test for 20s
Soldering characteristics ANSI/J-STD-002, Category 3
Solder heat withstand IEC-STD 68-2-20, Test Tb, Section 5 Method 1A, condition B: can withstand 10 seconds at 260°C±5°C
Note: Devices are not designed to be placed through a reflow process. Contact your Raychem Circuit Protection representative for TR600 series devices that are compatible with this process.
(Operating temperature range for all listed products is -40°C to 85°C)
*
60/250V products are designed to help equipment pass ITU specifications (K.20, K.21, etc) and Telcordia GR-1089 Intrabuilding power cross.
†
80/250V product designed to help equipment pass Telcordia GR-1089 Intrabuilding power cross (120VAC/25A).
‡
60/600V products are designed to help equipment pass UL 60950,TIA-968-A (formerly FCC Part 68) and Telcordia GR-1089 specification.
**
For physical and environmental characteristics of RXEF, see the radial-leaded product section. For SMD, midSMD, and miniSMDC series, see surface-mount product section.
††
Excluding TRF 600-150
Table T5 - Physical Characteristics and Environmental Specifications for Telecommunications
and Networking Devices**
Telecommunications and Networking Devices
13
178
PolySwitch Resettable Devices
(Operating temperature range for all listed products is -40°C to 85°C)
TRF600‡
Environmental Specifications
Test Conditions
Passive aging 60°C, 1000 hours
85°C, 1000 hours
Humidity aging 85°C, 85% RH, 1000 hours
Thermal shock 125°C, -55°C (10 times)
Solvent resistance MIL-STD-202, Method 215F
Note: Storage conditions: 40°C max., 70% RH max., devices should remain in original sealed bag prior to use. Devices may not meet specified values if these storage conditions are exceeded.
TS600‡
Physical Characteristics
Terminal material Tin-plated brass
Insulating material Nylon resin (UL94V-0), 1000V dielectric rating
Flammability IEC 695-2-2 Needle Flame Test for 20s
Soldering characteristics ANSI/J-STD-002, Category 3
Solder heat withstand IEC-STD 68-2-20, Test Tb, Section 5 Method 1A
TS600‡
Environmental Specifications
Test Conditions
Passive aging 60°C, 1000 hours
85°C, 1000 hours
Humidity aging 85°C, 85% RH, 1000 hours
Thermal shock 125°C, -55°C (10 times)
Solvent resistance MIL-STD-202, Method 215F
Note: Storage conditions: 40°C max., 70% RH max., devices should remain in original sealed bag prior to use. Devices may not meet specified values if these storage conditions are exceeded.
TSM600
Environmental Specifications
Lead material Tin-plated brass
Case material Nylon resin (UL94 V-0), 1000 V dielectric rating
Lead solderability IEC60068-2-58, Method 7
Solder heat withstand IEC-STD 68-2-20, Test Tb, Section 5, Method 1A
Solvent resistance MIL-STD-202, Method 215J
Flammability rating IEC 695-2-2 Needle Flame Test for 20 s
Storage humidity Per IPC/JEDEC J-STD-020A Level 2a
Note: Storage conditions: 40°C max., 70% RH max., devices should remain in original sealed bag prior to use. Devices may not meet specified values if these storage conditions are exceeded.
BBRF
Physical Characteristics
Lead material Tin/lead-plated copper, 0.52mm2 (20AWG), ø 0.81mm (0.032 in.)
Soldering characteristics Solderability per ANSI/J-STD-002 Category 3
Solder heat withstand per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260˚C ± 5˚C
Insulating material Cured, flame-retardant epoxy polymer; meets UL 94V-0
Note: Devices are not designed to be placed through a reflow process.
BBRF
Environmental Specifications
Test Conditions Resistance Change
Passive aging 70°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85% RH, 1000 hours ±5%
Thermal shock 85°C, -40°C (10 times) ±5%
Solvent resistance MIL-STD-202, Method 215F No change
*
60/250V products are designed to help equipment pass ITU specifications (K.20, K.21, etc) and Telcordia GR-1089 Intrabuilding power cross.
†
80/250V product designed to help equipment pass Telcordia GR-1089 Intrabuilding power cross (120VAC/25A).
‡
60/600V products are designed to help equipment pass UL 60950,TIA-968-A (formerly FCC Part 68) and Telcordia GR-1089 specification.
**
For physical and environmental characteristics of RXEF, see the radial-leaded product section. For SMD, midSMD, and miniSMDC series, see surface-mount product section.
Table T5 - Physical Characteristics and Environmental Specifications for
Telecommunications and Networking Devices**
Cont'd
...
Telecommunications and Networking Devices
179
13
Table T6 - Packaging and Marking Information for Telecommunications and Networking Devices
Part Number Bag Quantity Tape & Reel Quantity Standard Package Part Marking Agency Recognition
Chip*—60/250V
TCF250
TCF250-120T 2,500 — 10,000 — —
TCF250-145T 2,500 — 10,000 — —
TCF250-180 2,500 — 10,000 — —
Radial-leaded*—60/250V
TRF250
TRF250-080U 500 — 10,000 — UL, CSA, TÜV
TRF250-080U-2 — 1,500 7,500 — UL, CSA, TÜV
TRF250-080T 500 — 10,000 08F UL, CSA, TÜV
TRF250-110U 500 — 10,000 — UL, CSA, TÜV
TRF250-110U-2 — 1,500 7,500 — UL, CSA, TÜV
TRF250-120 500 — 10,000 20F UL, CSA, TÜV
TRF250-120-2 — 1,500 7,500 20F UL, CSA, TÜV
TRF250-120T 500 — 10,000 20F UL, CSA, TÜV
TRF250-120T-2 — 1,500 7,500 20F UL, CSA, TÜV
TRF250-120U 500 — 10,000 20F UL, CSA, TÜV
TRF250-120U-2 — 1,500 7,500 20F UL, CSA, TÜV
TRF250-120UT 500 — 10,000 20F UL, CSA, TÜV
TRF250-145 500 — 10,000 45F UL, CSA, TÜV
TRF250-145-2 — 1,500 7,500 45F UL, CSA, TÜV
TRF250-145-RA 500 — 10,000 45F UL, CSA, TÜV
TRF250-145U 500 — 10,000 45F UL, CSA, TÜV
TRF250-145U-2 — 1,500 7,500 45F UL, CSA, TÜV
TRF250-180 500 — 10,000 80F UL, CSA, TÜV
TRF250-180-2 — 1,500 7,500 80F UL, CSA, TÜV
TRF250-180US 500 — 10,000 — UL, CSA, TÜV
Surface
†
—80/250V
TSL250
TSL250-080F-2 — 1,500 7,500 T08 UL,CSA,TÜV
Surface*—60/250V
TS250/TSV250
TS250-130F-2 — 1,500 7,500 T13 UL, CSA, TÜV
TSV250-130F-2 — 1,200 6,000 T13V UL, CSA, TÜV
Radial-leaded
‡
—60/600V
TRF600
TRF600-150 500 — 10,000 150F UL, CSA, TÜV
TRF600-150-2 — 1,500 7,500 150F UL, CSA, TÜV
TRF600-160 500 — 10,000 160F UL, CSA, TÜV
TRF600-160-2 — 600 3,000 160F UL, CSA, TÜV
Surface
‡
—60/600V
TS600/TSM600
TS600-170F-2 — 300 900 T20 UL, CSA
TS600-200F-RA-2 — 300 900 T20 UL, CSA
TSM600-250F-2 — 200 1,000 TSM600 UL, CSA
TSM600-250F-RA-2 — 200 1,000 TSM600 UL, CSA
TSM600-400F-2 — 200 1,000 TSM600 UL (CSA pending)
Radial-leaded**—90V
BBRF
BBRF550 500 — 10,000 B550 UL, CSA
BBRF550-2 — 1,500 7,500 B550 UL, CSA
BBRF750 500 — 10,000 B750 UL, CSA
BBRF750-2 — 1,500 7,500 B750 UL, CSA
Radial-leaded**—60, 72V
RXEF
RXEF010 500 — 10,000 X010 UL, CSA, TÜV
RXEF010-2 — 3,000 15,000 X010 UL, CSA, TÜV
RXEF017 500 — 10,000 X017 UL, CSA, TÜV
RXEF017-2 — 2,500 12,500 X017 UL, CSA, TÜV
RXEF020 500 — 10,000 X020 UL, CSA, TÜV
RXEF020-2 — 3,000 15,000 X020 UL, CSA, TÜV
RXEF025 500 — 10,000 X025 UL, CSA, TÜV
RXEF025-2 — 3,000 15,000 X025 UL, CSA, TÜV
RXEF030 500 — 10,000 X030 UL, CSA, TÜV
RXEF030-2 — 3,000 15,000 X030 UL, CSA, TÜV
Notes:
*60/250V products are designed to help equipment pass ITU specifications (K.20, K.21, etc) and Telcordia GR-1089 Intrabuilding power cross.
†80/250V product designed to help equipment pass Telcordia GR-1089 Intrabuilding power cross (120VAC/25A).
‡60/600V products are designed to help equipment pass UL 60950,TIA-968-A (formerly FCC Part 68) and Telcordia GR-1089 specifications.
** Product is not currently available in a resistance-matched or resistance sorted option.
Telecommunications and Networking Devices
13
180
PolySwitch Resettable Devices
Table T6 - Packaging and Marking Information for Telecommunications and Networking Devices
Cont'd
...
UL File # E74889
CSA File #78165C
TÜV Per IEC60730-1 Certificate # for individual products available upon request.
Agency Recognition for Telecommunications and Networking Devices
For agency recognition infornation on BBRF and RXEF series, see radial-leaded product section. For SMD, midSMD and miniSMDC series,
see surface-mount product section.
Table T7 - Recommended Pad Layouts for Surface-mount Telecommunications and Networking
Devices in millimeters (inches) Nominal
Figure T20
A
B
A
B
C
D
Figure T19
B
B
A
C
E
B
A
C D
F
G
Figure T21
Device A B C D E F G Figures for Dimensions
TS250 (All) 4.6 1.8 6.1 — — — — T19
(0.18) (0.07) (0.24) — — — —
TSV250-130F 2.29 2.41 6.35 3.43 — — — T20
(0.09) (0.095) (0.25) (0.135) — — —
TSL250-080F 3.6 1.8 5.5 — — — — T19
(0.14) (0.07) (0.22) — — — —
TS600 (All) 10.42 3.30 3.35 — — — — T19
(0.410) (0.130) (0.132) — — — —
TSM600 5.20 17.80 5.54 6.75 2.08 3.12 8.39 T21
(0.205) (0.701) (0.218) (0.266) (0.082) (0.123) (0.331)
SMD030-2018F 4.6 1.5 3.4 — — — — T19
(0.18) (0.06) (0.13) — — — —
SMD030F 3.1 2.3 5.1 — — — — T19
(0.12) (0.09) (0.20) — — — —
SMD050-2018F 4.6 1.5 3.4 — — — — T19
(0.18) (0.06) (0.13) — — — —
miniSMDC014F 3.15 1.78 3.45* — — — — T19
(0.124) (0.07) (0.136*) — — — —
Part Number Bag Quantity Tape & Reel Quantity Standard Package Part Marking Agency Recognition
Surface**—60V
SMD, midSMD
SMD030F-2 2,000 10,000 030 UL, CSA, TÜV
SMD030-2018F-2 4,000 20,000 A03 UL, CSA, TÜV
SMD050-2018F-2 4,000 20,000 A05 UL, CSA
Surface**—60V
miniSMD
miniSMDC014F-2 2,000 10,000 14 UL, CSA, TÜV
Notes:
*60/250V products are designed to help equipment pass ITU specifications (K.20, K.21, etc) and Telcordia GR-1089 Intrabuilding power cross.
†80/250V product designed to help equipment pass Telcordia GR-1089 Intrabuilding power cross (120VAC/25A).
‡60/600V products are designed to help equipment pass UL 60950,TIA-968-A (formerly FCC Part 68) and Telcordia GR-1089 specifications.
** Product is not currently available in a resistance-matched or resistance sorted option.
Telecommunications and Networking Devices
181
13
Solder Reflow and Rework Recommendations for Telecommunications and Surface-mount Devices
Figure T22
Preheating
50
100
150
200
250
300
0
10 to 20
Temperature (°C)
Soldering Cooling
120
30 to 90
Time(s)
Solder Reflow
• Recommended reflow methods: IR, vapor
phase oven, hot air oven.
• Surface-mount devices are not designed to
be wave soldered to the bottom side of the
board (with the exception of
miniSMDC014F).
• Recommended maximum paste thickness
of 0.25mm (0.010 in).
• Devices can be cleaned using standard
industry methods and solvents.
Rework
• If a device is removed from the board, it
should be discarded and replaced with a
new device.
Table T8 - TRF250/TRF600 Tape and Reel Specifications for Telecommunications and Networking Device
Dimension EIA IEC
Description Mark Mark Dimensions (mm) Tolerance
TRF250/TRF600 devices are available in tape and reel packaging per EIA 468-B standard. See Figures T23 and T24 for details.
Carrier tape width W W 18 -0.5/+1.0
Hold down tape width W4W05 Minimum
Top distance between tape edges W6W23 Maximum
Sprocket hole position W5W19 -0.5/+0.75
Sprocket hole diameter D0D04±0.2
Abcissa to plane (straight lead) H H 18.5 ±3.0
Abcissa to plane (kinked lead)* H0H016 -0.5/+0.6
Abcissa to top H1H132.2 Maximum
Overall width w/lead protrusion — C143.2 Maximum
Overall width w/o lead protrusion — C242.5 Maximum
Lead protrusion L1I11.0 Maximum
Protrusion of cut-out L L 11 Maximum
Protrusion beyond hold down tape I2I2Not specified —
Sprocket hole pitch P0 P0 12.7 ±0.3
Device pitch: TRF250 — — 12.7 —
Device pitch: TRF600 — — 25.4 —
Pitch tolerance — — 20 consecutive ±1
Tape thickness t t 0.9 Maximum
Tape thickness with splice* t1— 2.0 Maximum
Splice sprocket hole alignment — — 0 ±0.3
Body lateral deviation ΔhΔh0 ±1.0
Body tape plane deviation ΔpΔp0 ±1.3
Lead spacing plane deviation ΔP1P10±0.7
Lead spacing* F F 5.08 ±0.6
Reel width w2w 56 Maximum
Reel diameter a d 370 Maximum
Space between flanges less device w1— 4.75 ±3.25
Arbor hole diameter c f 26 ±12.0
Core diameter n h 80 Maximum
Box — — 56/372/372 Maximum
Consecutive missing pieces* — — 3 maximum —
Empty places per reel* — — Not specified —
Note: *Differs from EIA specification.
Telecommunications and Networking Devices
13
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PolySwitch Resettable Devices
W4
H0
H1
P1
D0
P0
AB
I2
L1
F
Reference plane
Direction of unreeling
Cross section A - B
Δ
h
Δ
h
L
t
W5
H1
W
H
Δ
p
Δ
p
C2
C1
n
c
Cross section
Optional shape: Circular or polygonal
Reel
Upper side
Lower side
a
w
2
w
1
Tape
Direction
of
unreeling
Figure T23 - EIA Referenced Taped Component Dimensions for TRF Devices
Figure T24 - Reel Dimensions for TRF Devices
TS devices are packaged per EIA 481 and EIA 481-2 standards. See Figures T25 and T26 for details.
Table T9 - TS Tape and Reel Specifications for Telecommunications and Networking Devices
TS250/TSL250/TSV250
Dimension TS250 TSV250 TSL250
Description EIA MARK Dimension(mm) Tolerance(mm) Dimension(mm) Tolerance(mm) Dimension(mm) Tolerance(mm)
Carrier tape width W 16 ±0.3 16 ±0.3 16 ±0.3
Sprocket hole pitch P04.0 ±0.10 4.0 ±0.1 4.0 ±0.10
P112.0 ±0.10 8.0 ±0.1 8.0 ±0.10
P22.0 ±0.10 2.0 ±0.1 2.0 ±0.10
A06.9 ±0.23 5.5 ±0.1 5.5 ±0.10
B09.6 ±0.15 6.2 ±0.1 7.9 ±0.10
B1 MAX. 12.1 — 8.0 — 9.2 —
Sprocket hole diameter D01.5 -0/+0.1 1.55 ±0.05 1.55 ±0.05
F 7.5 ±0.10 7.5 ±0.10 7.5 ±0.10
E11.75 ±0.10 1.75 ±0.10 1.75 ±0.10
E2 MIN. 14.25 — — — — —
Tape thickness TMAX. 0.4 — 0.45 — 0.35 —
Tape thickness with T1 MAX. 0.1 — 0.1 — 0.1 —
splice cover tape thickness
K03.4 ±0.15 7.00 ±0.1 3.70 ±0.10
Leader min. 300 — 390 — 390 —
Trailer min. 300 — 160 — 160 —
Reel dimensions
Reel diameter A max. 340 — 340 — 340 —
Core diameter N min. 50 — 50 — 50 —
Space between flanges less device W116.4 -0/+2.0 16.4 -0/+2.0 16.4 -0/+2.0
Reel width W2 MAX. 22.4 — 22.4 — 22.4 —
Telecommunications and Networking Devices
183
13
TS600
Dimension
Description EIA Mark Dimension (mm) Tolerance (mm)
Carrier tape width W 32 ±0.3
Sprocket hole pitch P04.0 ±0.1
P116 ±0.1
P22.0 ±0.1
A010 ±0.1
B019.2 ±0.1
B1 max. 21.6
Sprocket hole diameter D01.5 -0/+0.1
F 14.2 ±0.1
E1 1.75 ±0.1
E2 min. 28.4 ±0.1
Tape thickness Tmax. 0.50 ±0.5
Tape thickness with splice T1 max. 0.1
K013.2 ±0.1
Leader min. 390
Trailer min. 160
Reel Dimensions
Reel diameter A max. 360
Core diameter N min. 50
Space between flanges less device W132.4 -0/+2.0
Reel width W2 max. 40
TSM600
Dimension
Description EIA Mark Dimension (mm) Tolerance (mm)
Carrier tape width W 32 ±0.3
Sprocket hole pitch P04.0 ±0.1
P124 ±0.1
P22.0 ±0.1
A011.2 ±0.1
B017.8 ±0.1
B1 max. 23.45
Sprocket hole diameter D 1.5 -0/+0.1
F 14.2 ±0.1
E11.74 ±0.1
E2 min. 28.4 ±0.1
Tape thickness T max. 0.5 ±0.5
Tape thickness with splice T1 max. 0.1
K011.9 ±0.1
Leader min. 390
Trailer min. 160
Reel Dimensions
Reel diameter A max. 360
Core diameter N min. 50
Space between flanges less device W132.4 -0/+2.0
Reel width W2 max. 40
For tape and reel specifications for BBRF and RXEF devices, see radial-leaded section. For SMD, midSMD, miniSMDC see surface-mount section.
Table T9 - TS Tape and Reel Specifications for Telecommunications and Networking Devices
Cover tape
Center lines
of cavity
T
K
0
D
0
P
2
P
0
E
1
Embossment
E
2
FW
B
0
A
0
P
1
T
1
B
1
Cont'd
...
Figure T25 - EIA Referenced Taped Component Dimensions for TS Devices
Telecommunications and Networking Devices
13
184
PolySwitch Resettable Devices
A
W
2
(measured at hub)
W
1
(measured at hub)
N (hub dia.)
Cover tape
Embossed cavity
Carrier tape
Figure T26 - EIA Referenced Reel Dimensions for TS Devices
Part Numbering System for Radial-leaded Telecommunications and Networking Devices
*F = RoHS compliant, ELV compliant
(Blank) = Bulk
2 – Tape and reel packaging
B-x.x = Resistance matched in bins of x.xΩ (optional)
Rx = Resistance range (optional)
Modifier (optional)
U - Uncoated clip S - Straight lead T - Fast Trip device
Hold Current (mA)
Product series (TR, TRF)
TRF*250 -120 T -RA -B-0.5 -2
Part Numbering System for Surface-mount Telecommunications and Networking Devices
(Blank) = Bulk
2 – Tape and reel packaging
B-x.x = Resistance matched in bins of x.xΩ (optional)
Rx = Resistance range (optional)
F = RoHS Compliant, ELV Compliant
Hold Current (mA)
Product Series (TS, TSV, TSL, TSM)
TSx600 -200 F -RA -B-0.5 -2
Telecommunications and Networking Devices
185
13
WARNING:
Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
The devices are intended for protection against occasional overcurrent or overtemperature fault conditions and should not be
used when repeated fault conditions or prolonged trip events are anticipated.
Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the
performance of the devices.
Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic,
thermal, and mechanical procedures for electronic components.
Operation in circuit with a large inductance can generate a circuit voltage (L di/dt) above the rated voltage of the
PolySwitch resettable device.
Part Numbering System for Chip Telecommunications and Networking Devices
TCF*250 -120 T -RA -B-0.5
*F = RoHS compliant, ELV compliant
Modifier (optional)
T - Fast Trip device
B-x.x = Resistance matched in bins of x.xΩ (optional)
Rx = Resistance range (optional)
Hold Current (mA)
Product Series
Resistance-sorted and Resistance-matched Devices
Telecommunications and Networking Devices
13
186
PolySwitch Resettable Devices
Most TCF, TRF and TS devices are available in resistance-sorted and/or resistance-matched versions.
Resistance sorted devices
Resistance sorted devices (part number suffix “Rx”, where x = 1, 2, A, B, C, F etc.) are supplied with resistance values that are within
specified segments of the device’s full range of resistance.
Feature
• Narrow resistance range.
Benefits
• Greater flexibility for design engineers.
• Lower resistance devices can allow for increased loop length on line card designs.
• Higher resistance devices may provide greater protection by offering faster time-to-trip.
Resistance-matched Devices
Resistance-matched devices are supplied such that all parts in one particular package (or reel) are within 0.5Ω of each other (1.0Ω for
TRF250-080T devices). Individual matched packages are supplied from the full resistance range of the specified device.
Feature
• Tighter resistance balance between any two parts in a package.
Benefits
• Resistance-matched devices may reduce the tip-ring resistance differential, reducing the possibility of line imbalance.
