2002 Microchip Technology Inc. DS21426B-page 1
TC4626/TC4627
Features
• Power Driver With On Board Voltage Booster
•LowI
DD –<4mA
• Small Package – 8-Pin PDIP
• Under-Voltage Circuitry
• Fast Rise-Fall Time – <40nsec @1000pF
• Below-Rail Input Protection
Applications
• Raises 5V to drive higher – Vgs (ON) MOSFETs
• Eliminates one system power supply
Device Selection Table
Package Type
General Description
The TC4626/TC4627 are single CMOS high speed
drivers with an on-board voltage boost circuit. These
parts workwith an inputsupplyvoltage from4 to 6volts.
The internal voltage booster will produce a VBOOST
potential up to 12 volts above VIN.ThisV
BOOST is not
regulated, so its voltage is dependent on the input VDD
voltage and output drive loading requirements. An
internal undervoltage lockout circuit keeps the output in
a low state whenVBOOST drops below 7.8 volts. Output
is enabled when VBOOST is above 11.3 volts.
Functional Block Diagram
Part
Number Package Temp. Range
TC4626COE 16-Pin SOIC (Wide) -55°C to +125°C
TC4626CPA 8-Pin PDIP -40°C to +85°C
TC4626EOE 16-Pin SOIC (Wide) -40°C to +85°C
TC4626EPA 8-Pin PDIP 0°C to +70°C
TC4626MJA 8-Pin CERDIP 0°C to +70°C
TC4627COE 16-Pin SOIC (Wide) -55°C to +125°C
TC4627CPA 8-Pin PDIP -40°C to +85°C
TC4627EOE 16-Pin SOIC (Wide) -40°C to +85°C
TC4627EPA 8-Pin PDIP 0°C to +70°C
TC4627MJA 8-Pin CERDIP 0°C to +70°C
1
2
3
45
6
7
8
IN
OUT
C1+
C2
GND
1
2
3
413
14
15
16
VBOOST
NC
IN
C1–
NC
C1+
NC
NC
VDD
C1–
VDD
5
6
7
89
10
11
12
C2
NC
NC
GND
NC
VBOOST
NC
OUT
TC4626
TC4627
TC4626
TC4627
8-Pin PDIP/CERDIP
16-Pin SOIC (Wide)
Voltage
Booster
Clock
C1+
C1-
C2
In
GND
EXT
Output
VBOOST
EXT
V = 2 x VDD
VDD
1
2
3
8
7
4
6
5
C3
Noninverting
TC4627
Inverting
TC4626
(Unregulated 3 x VDD)
UV LOCK
C2
EXT
C1
+
+
+
NOTE: Pin numbers correspond to 8-pin package.
Power CMOS Drivers With Voltage Tripler
TC4626/TC4627
DS21426B-page 2
2002 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage ......................................................6.2V
Input Voltage, Any Terminal
.....................................VS+0.3VtoGND–0.3V
Package Power Dissipation (TA≤ 70°C)
PDIP.........................................................730mW
CERDIP....................................................800mW
SOIC ........................................................760mW
Derating Factor PDIP.......5.6 mW/°C Above 36°C
CERDIP................................................6.0mW/°C
Operating Temperature Range (Ambient)
C Version.........................................0°C to +70°C
E Version......................................-40°C to +85°C
M Version ...................................-55°C to +125°C
Storage Temperature Range..............-65°C to +150°C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC4626/TC4627 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA=+25°C,V
DD =5V,C
1=C
2=C
310µF unless otherwise noted.
Symbol Parameter Min Typ Max Units Test Conditions
Input
VIH Logic 1, High Input Voltage 2.4 — — V
VIL Logic 0, Low Input Voltage — — 0.8 V
IIN Input Current -1 — 1 µA0V ≤ VIN ≤ VDRIVE
Output
VOH High Output Voltage VBOOST –0.025 — — V
VOL Low Output Voltage — — 0.025 V
ROOutput Resistance, High — 10 15 ΩIOUT =10mA,V
DD =5V
ROOutput Resistance, Low — 8 10 ΩIOUT =10mA,V
DD =5V
IPK Peak Output Current — 1.5 — A
Switching Time
tRRiseTime — 33 40 nsec Figure3-1,Figure3-2
tFFall Time — 27 35 nsec Figure 3-1, Figure 3-2
tD1 Delay Time — 35 45 nsec Figure 3-1, Figure 3-2
tD2 Delay Time — 45 55 nsec Figure 3-1, Figure 3-2
FMAX Maximum Switching Frequency 1.0 — — MHz VDD =5V,V
BOOST >8.5V,
Figure 3-1
Voltage Booster
R3Voltage Tripler Output
Source Resistance —300400ΩIL=10mA,V
DD =5V
R2Voltage Doubler Output
Source Resistance —120200Ω
FOSC Oscillator Frequency 12 — 28 kHz
VOSC Oscillator Amplitude Measured
at C1- 4.5 — 10 V RLOAD =10kΩ
UV @VBOOST Undervoltage Threshold 7.0 7.8 8.5 V
VSTART @VBOOST Start Up Voltage 10.5 11.3 12 V
VBOOST @VDD = 5V 14.6 — — V No Load
2002 Microchip Technology Inc. DS21426B-page 3
TC4626/TC4627
TC4626/TC4627 ELECTRICAL SPECIFICATIONS (CONTINUED)
Symbol Parameter Min Typ Max Units Test Conditions
Power Supply
IDD Power Supply Current — — 2.5 mA VIN = LOW or HIGH
VDD Supply Voltage 4.0 — 6.0 V
Electrical Characteristics: Over operating temperature range, VDD =5V,C
1=C
2=C
310µF unless otherwise noted.
Symbol Parameter Min Typ Max Units Test Conditions
Input
VIH Logic 1, High Input Voltage 2.4 — — V
VIL Logic 0, Low Input Voltage — — 0.8 V
IIN Input Current -10 — 1 µA0V ≤ VIN ≤ VBOOST
Output
VOH High Output Voltage VDRIVE –0.025 — — V
VOL Low Output Voltage — — 0.025 V
ROOutput Resistance, High — 15
15 20
25
ΩIOUT =10mA,V
DD =5V
C&EVersion(T
A=70°Cor85°C)
M Version (TA=125°C)
ROOutput Resistance, Low — 10
10 13
15
ΩIOUT =10mA,V
DD =5V
C&EVersion(T
A=70°Cor85°C)
M Version (TA=125°C)
IPK Peak Output Current — 1.5 — A
Switching Time
tRRise Time — — 55 nsec Figure 3-1, Figure 3-2
tFFall Time — — 50 nsec Figure 3-1, Figure 3-2
tD1 Delay Time — — 60 nsec Figure 3-1, Figure 3-2
tD2 Delay Time — — 70 nsec Figure 3-1, Figure 3-2
FMAX Maximum Switching Frequency 750 — — kHz VDD =5V,V
BOOST >8.5V,
Figure 3-1
Voltage Booster
R3Voltage Boost Output
Source Resistance — 400 500 ΩIL=10mA,V
DD =5V
R2Voltage Doubler Output
Source Resistance — 170 300 Ω
FOSC Oscillator Frequency 5 — 50 kHz
VOSC Oscillator Amplitude
Measured at C1- 4.5 — 10 V RLOAD =10kΩ
UV @VBOOST Undervoltage Threshold 7.0 7.8 8.5 V
VSTART @VBOOST Start Up Voltage 10.5 11.3 12 V
VBOOST @VDD = 5V 14.6 — — V No Load
Power Supply
IDD Power Supply Current — — 4 mA VIN = LOW or HIGH
VDD Supply Voltage 4.0 — 6.0 V
TC4626/TC4627
DS21426B-page 4
2002 Microchip Technology Inc.
2.0 PIN DESCRIPTIONS
ThedescriptionsofthepinsarelistedinTable2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin No.
(8-Pin PDIP,
CERDIP) Symbol Description
1C1-
2C1+
3C2
4 GND Ground.
5OUT
6V
BOOST
7IN
8V
DD
Pin No.
(16-Pin SOIC
Wide) Symbol Description
1C1-
2 NC No connect.
3C1+
4 NC No connect.
5C2
6 NC No connect.
7 NC No connect.
8 GND Ground.
9OUT
10 NC No connect.
11 VBOOST
12 NC No connect.
13 IN
14 NC No connect.
15 NC No connect.
16 VDD
2002 Microchip Technology Inc. DS21426B-page 5
TC4626/TC4627
3.0 APPLICATIONS INFORMATION
FIGURE 3-1: INVERTING DRIVER
SWITCHING TIME FIGURE 3-2: NONINVERTING DRIVER
SWITCHING TIME
0.1µF Ceramic
VBOOST
+5V
10%
90%
10%
90%
10%
90%
0V
0V
TC4626
C1+
C1-
VDD = 5V
C2
VBOOST
38
7
1
6
5
2
4
CL = 1000pF
Input
Input
Output
tD1
tF
tD2
Input: 100kHz,
square wave,
t
RISE = tFALL ≤ 10nsec
Output
tR
C1
10µF
C2
10µF
C3
10µF0.1µF Ceramic
VBOOST
+5V
TC4627
C1+
C1-
VDD = 5V
C2
VBOOST
38
7
1
6
5
2
4
CL = 1000pF
Input
Input
Output
tD1
tF
tD2
Input: 100kHz,
square wave,
tRISE = tFALL ≤ 10nsec
Output tR
C1
10µF
C2
10µF
C3
10µF
90%
10%
10% 10%
90%
0V
0V
90%
TC4626/TC4627
DS21426B-page 6
2002 Microchip Technology Inc.
3.1 BOOSTER FUNCTION
The voltage booster is an unregulated voltage tripler
circuit. The tripler consists of three sets of internal
switches and three external capacitors. S1a and S1b
charge capacitor C1 to VDD potential. S2a and S2b add
C1 potential to VDD input to charge C2 to 2 x VDD.S3a
and S3b add C1 potential to C2 to charge C3 to 3 x
VDD. The position of the switches is controlled by the
internal 4 phase clock.
FIGURE 3-3: VOLTAGE BOOSTER
FIGURE 3-4: POSITION OF SWITCHES
C3
C2
6
3
8
2
C1
S1a
S1b
GND
4
S2a
S2b
2 x VDD
3 x VDD, VBOOST
6
S3b
S3a
1
(4 to 6V)
VDD
+
+
+
Pin 2
Voltage
Pin 1
Voltage
3 x VDD
2 x VDD
VDD
2 x VDD
VDD
0
On
Off
S1
On
Off
S2
On
Off
S3
Pin 1 & 2 Waveforms
2002 Microchip Technology Inc. DS21426B-page 7
TC4626/TC4627
4.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
V
OUT
HI (Volts)
TC4626 VOH vs. Frequency
5500 1,000 1,500 2,000 2,500 3,000 3,500
16
14
12
10
8
6
4
2
0
FREQUENCY (kHz)
470pF
2200pF
1000pF
VS = 5V
TA = -55°C
FREQUENCY (kHz)
TC4626 VOH vs. Frequency
5500 1,000 1,500 2,000 2,500 3,000 3,500
14
12
10
8
6
4
2
0
470pF
2200pF 1000pF
V
OUT
HI (Volts)
VS = 5V
TA = 125°C
Time (nsec)
-40 -20 0 20 40 60 80
60
50
40
30
20
0
Delay Time vs. Temperature
100
10
120
VS = 5V
CLOAD = 1000pF
Input = 0-5V;
TR & TF <10nsec;
@ <20kHz
TEMPERATURE (°C)
tD2
tD1
tRISE
tFALL
V
OUT
HI (Volts)
14
12
10
8
6
4
2
0
10 500 1,000 1,500 2,000 2,500 3,000 3,500
FREQUENCY (kHz)
470pF
2200pF 1000pF
VS = 5V
TA = 25°C
TC4626 VOH vs. Frequency
Time (nsec)
-40 -20 0 20 40 60 80
100
80
60
40
20
0
Delay Time vs. Temperature
100 120
Input = 0-5V;
TR & TF <10nsec;
@ <20kHz
VS = 4V
CLOAD = 1000pF
TEMPERATURE (°C)
tD2
tD1
tRISE
tFALL
Delay Time vs. Temperature
Time (nsec)
-40 -20 0 20 40 60 80
50
40
30
20
0
100
10
120
VS = 6V
CLOAD = 1000pF
Input = 0-5V;
TR & TF <10nsec;
@ <20kHz
TEMPERATURE (°C)
tD2
tD1
tRISE
tFALL
TC4626/TC4627
DS21426B-page 8
2002 Microchip Technology Inc.
TYPICAL CHARACTERISTICS (CONTINUED)
VOUT HI (Volts)
1234567
13
12
11
10
9
8
8
FREQUENCY x 100 kHz
9100
14
15
16
2,200pF
470pF
1,000pF
VS = 5V
TA = 25°C
TC4626 VOH vs. Frequency
VOUT HI (Volts)
1234 567
13
12
11
10
9
8
8
FREQUENCY x 100 kHz
9100
14
15
16
470pF
2,200pF
1,000pF
V
S
= 5V
T
A
= 125°C
TC4626 VOH vs. Frequency
1234567
13
12
11
10
9
8
8
FREQUENCY x 100 kHz
9100
14
15
16
2,200pF
470pF
1,000pF
VS = 5V
TA = -55°C
TC4626 VOH vs. Frequency
VOUT HI (Volts)
2002 Microchip Technology Inc. DS21426B-page 9
TC4626/TC4627
5.0 PACKAGING INFORMATION
Package marking data not available at this time.
5.1 Package Dimensions
3
°
MIN.
PIN 1
.260
(
6.60
)
.240
(
6.10
)
.045
(
1.14
)
.030
(
0.76
)
.070
(
1.78
)
.040
(
1.02
)
.400
(
10.16
)
.348
(
8.84
)
.200
(
5.08
)
.140
(
3.56
)
.150
(
3.81
)
.115
(
2.92
)
.110
(
2.79
)
.090
(
2.29
)
.022
(
0.56
)
.015
(
0.38
)
.040
(
1.02
)
.020
(
0.51
)
.015
(
0.38
)
.008
(
0.20
)
.310
(
7.87
)
.290
(
7.37
)
.400
(
10.16
)
310
7.87
8-Pin Plastic DIP
Dimensions: inches (mm)
.400
(
10.16
)
.370
(
9.40
)
.300
(
7.62
)
.230
(
5.84
)
.065
(
1.65
)
.045
(
1.14
)
.055
(
1.40
)
MAX
.
.020
(
0.51
)
MIN
.
PIN 1
.200
(
5.08
)
.160
(
4.06
)
.200
(
5.08
)
.125
(
3.18
)
.110
(
2.79
)
.090
(
2.29
)
.020
(
0.51
)
.016
(
0.41
)
.040
(
1.02
)
.020
(
0.51
)
.320
(
8.13
)
.290
(
7.37
)
.150
(
3.81
)
MIN.
3
°
MIN.
8-Pin CDIP
(
Narrow
)
.015
(
0.38
)
.008
(
0.20
)
.400
(
10.16
)
.320
(
8.13
)
Dimensions: inches (mm)
TC4626/TC4627
DS21426B-page 10
2002 Microchip Technology Inc.
Package Dimensions (Continued)
8
°
MAX.
PIN 1
.299 (7.59)
.291 (7.40)
.413 (10.49)
.398 (10.10)
.019 (0.48)
.014 (0.36)
.012 (0.30)
.004 (0.10)
.104 (2.64)
.097 (2.46) .013 (0.33)
.009 (0.23)
.050 (1.27)
.016 (0.40)
.419 (10.65)
.398 (10.10)
.050 (1.27) TYP.
16-Pin SOIC (Wide)
Dimensions: inches (mm)
2002 Microchip Technology Inc. DS21426B-page11
TC4626/TC4627
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC4626/TC4627
DS21426B-page12 2002 Microchip Technology Inc.
NOTES:
2002 Microchip Technology Inc. DS21426B-page 13
TC4626/TC4627
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ,microID,MPLAB,PIC,PICmicro,PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nologyIncorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro®8-bit MCUs, KEELOQ®code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
DS21426B-page 14
2002 Microchip Technology Inc.
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Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
05/01/02
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