Ultra Hight Bright Surface Mounting Chip LED InGaAIP S-GW Type Unit: mm 2 5 5 2 2 5 1 0.6 LNJ406K54RW ********* LNJ406K54RW ******** Amber LNJ806R58RW ********* LNJ806R58RW ******** Orange 5 Lighting Color 1.25 Global Prat No. 1.7 0.5 0.1 Conventional Part No. 0.3 0.1 2.9 Lighting Color PD(mW) IF(mA) IFP(mA) VR(V) Topr(C) Tstg(C) Amber 50 20 60 4 -25 +85 -30 +100 Orange 50 20 60 4 -25 +85 -30 +100 0.2 0 0.05 0.9 +- 0.1 (0.11) Adsolute Maximum Ratings (Ta = 25C) Pulse width 1 msec. The condition of IFP is duty 10%, Pulse width 1 msec 1 2 1: Anode 2: Cathode Electro-Optical Characteristics (Ta = 25C) Conventional Lighting IO Lens Color Part No. Color Typ Min LNJ406K54RW Amber Yellow Diffused 8.5 3.5 LNJ806R58RW Orange Red Diffused 5.0 2.0 Unit mcd mcd - - 3/4I IO IF F 30 Typ 2.0 1.9 V Max 2.3 2.3 V Typ 15 17 nm IR IF 10 10 mA 3/4V IO F Max 100 100 A VR 4 4 V 3/4T a 100 0.5 W R W 58 R R 54 10 K 06 J4 1 06 N L 5 L N 3 J8 5 R 6 0 J8 30 N 0 4 J N L Forward Current 5 W R 8 L 4 5 K 6 Relative Luminous Intensity 50 W R 10 Luminous Intensity P Typ 595 620 nm VF IF 10 10 mA 3 0.3 0.1 1 1 3 5 10 30 50 100 500 300 100 LN J80 6R LN J40 50 58R 6K W 54R W 30 10 300 1.6 1.8 Forward Current 2.0 2.2 -20 2.4 0 Forward Voltage 20 40 60 80 100 Ambient Temperature IF 3/4T a Relative Luminous Intensity 25 LNJ406K54RW 100 Directive Characteristics LNJ806R58RW 80 60 20 0 10 30 20 30 40 80 50 50 60 600 700 800 90 100 70 5 20 80 Wavelength 15 10 40 70 20 20 60 60 40 0 96 10 40 500 Forward Current Relative Luminous Intensity Wavelength Characteristics 80 90 80 60 40 20 0 20 40 60 Relative Luminous Intensity 80 100 0 0 20 40 60 80 Ambient Temperature 100 Caution for Safety Gallium arsenide material (GaAs) is used in this product. DANGER Therefore, do not burn, destroy, cut, crush, or chemically decompose the product, since gallium arsenide material in powder or vapor form is harmful to human health. Observe the relevant laws and regulations when disposing of the products. Do not mix them with ordinary industrial waste or household refuse when disposing of GaAs-containing products. Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and afterunpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company. Please read the following notes before using the datasheets A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited. 2001 MAR