Thick Film, Resistor Array
www.vishay.com For Technical Questions contact: thickfilmchip@vishay.com Document Number: 31048
238 Revision: 29-Mar-10
CRA04P
Vishay
The CRA04P thick film resistor array is constructed on a high
grade ceramic body with concave terminations. A small
package enables the design of high density circuits. The
single component reduces board space, component counts
and assembly costs.
FEATURES
Concave terminal array with square corners
Wide ohmic range: 1R0 to 1M0
8 terminal package with isolated resistors
Pure tin solder contacts on Ni barrier layer,
provides compatibility with lead (Pb)-free and
lead containing soldering processes
Compliant to RoHS directive 2002/95/EC
Halogen-free according to IEC 61249-2-21 definition
Note
(1) Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
Notes
(1) Preferred way for ordering products is by use of the PART NUMBER
(2) Please refer to the table PACKAGING, see next page
STANDARD ELECTRICAL SPECIFICATIONS
MODEL CIRCUIT
POWER RATING
P70 °C
W
LIMITING ELEMENT
VOLTAGE MAX.
V
TEMPERATURE
COEFFICIENT
ppm/K
TOLERANCE
%
RESISTANCE
RANGE
Ω
E-SERIES
CRA04P 03 0.063 50 ± 100 ± 2 10R to 1M0 24
± 200 ± 5 1R0 to 1M0 24
Zero-Ohm-Resistor: Rmax. = 50 mΩ, Imax. = 1 A
TECHNICAL SPECIFICATIONS
PARAMETER UNIT CRA04P
Rated Dissipation P70 (1) W per element 0.063
Limiting Element Voltage Umax. AC/DC V 50
Insulation Voltage Uins (1 min) V 100
Insulation Resistance Ω> 109
Category Temperature Range
°
C - 55 to + 155
PART NUMBER AND PRODUCT DESPRIPTION
PART NUMBER: CRA04P08347K0JTD (1)
MODEL TERMINAL STYLE PIN CIRCUIT VALUE TOLERANCE PACKAGING (2) SPECIAL
CRA04 P 08 3 = 03 R = Decimal
K = Thousand
M = Million
0000 = 0 Ω Jumper
G = ± 2 %
J = ± 5 %
Z = 0 Ω Jumper
TD
TC
PZ
Up to 2 digits
PRODUCT DESCRIPTION: CRA04P 08 03 47K 5 % RT7 e3
CRA04P 08 03 47K 5 % RT7 e3
MODEL TERMINAL COUNT CIRCUIT TYPE RESISTANCE VALUE TOLERANCE PACKAGING (2) LEAD (Pb)-FREE
CRA04P 08 03 10R = 10 Ω
47K = 47 kΩ
1M = 1 MΩ
0R0 = Jumper
± 2 %
± 5 %
RT7
RT6
PZ
e3 = Pure tin
Termination finish
A04P 8340CR JDK0T7
Document Number: 31048 For Technical Questions contact: thickfilmchip@vishay.com www.vishay.com
Revision: 29-Mar-10 239
CRA04P
Thick Film, Resistor Array Vishay
CIRCUIT
03 Circuit
DIMENSIONS
PACKAGING
MODEL TAPE WIDTH DIAMETER PITCH PIECES/REEL
PACKAGING CODE
PAPER TAPE
PART NUMBER PRODUCT DESCRIPTION
CRA04P 8 mm
180 mm/7" 2 mm 10 000 TD RT7
330 mm/13" 2 mm 20 000 TC RT6
330 mm/13" 2 mm 50 000 PZ PZ
- 55 - 25 0 25 50 75 100 125 155 175
120
100
80
60
40
20
0
70
Derating Ambient Temperature in °C
Rated Power in %
AC
W
T
BP
L
c
b
pa
w
PIN
NO#
DIMENSIONS (in millimeters)
LABC
PNOM TW
82.00 0.20 0.32 0.25 0.50 0.45 1.00
TOL.
± 0.20 ± 0.10 ± 0.10 ± 0.15 - ± 0.10 ± 0.10
SOLDER PAD DIMENSIONS (in millimeters)
cwpa b
WAVE 0.5 1.5 0.5 0.32 0.5
CRA04P
Vishay Thick Film, Resistor Array
www.vishay.com For Technical Questions contact: thickfilmchip@vishay.com Document Number: 31048
240 Revision: 29-Mar-10
Note
(1) Figures are given for a single element
All tests are carried out in accordance with the following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-802, detail specification
IEC 60068-2 environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR) (1)
STABILITY CLASS 2 OR BETTER
Stability for product type: 10 Ω to 1 MΩ1 Ω to 1 MΩ
CRA04P
4.5 - Resistance - ± 2 % ± 5 %
4.7 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown
4.13 - Short time overload 2 × Umax.; Duration according to style ± (0.5 % R + 0.05 Ω)
4.17.2 58 (Td) Solderability
Solder bath method; Sn60Pb40;
non-activated flux; (235 ± 5) °C; (2 ± 0.2) s
Good tinning ( 95 % covered)
no visible damage
Solder bath method; Sn96.5Ag3Cu0.5;
non-activated flux; (245 ± 5) °C; (3 ± 0.3) s
Good tinning ( 95 % covered)
no visible damage
4.8.4.2 - Temperature coefficient (20/- 55/20) °C and (20/125/20) °C ± 100 ppm/K ± 200 ppm/K
4.32 21 (UU3) Shear (adhesion) 45 N No visible damage
4.33 21 (UU1) Substrate bending Depth 2 mm; 3 times
No visible damage,
no open circuit in bent position
± (0.25 % R + 0.05 Ω)
4.19 14 (Na) Rapid change of temperature
30 min. at - 55 °C; 30 min at 125 °C
5 cycles
1000 cycles
± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
4.23 - Dry heat -
± (2 % R + 0.05 Ω)
4.23.2 2 (Ba) Damp heat, cyclic 125 °C; 16 h
4.23.3 30 (Db) Cold 55 °C; 90 % RH; 24 h; 1 cycle
4.23.4 1 (Aa) Low air pressure - 55 °C; 2 h
4.23.5 13 (M) - 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic 55 °C; 90 % RH; 24 h; 5 cycle
4.23.7 - D.C. load
4.25.1 - Endurance at 70 °C 1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
4.18.2 58 (Td) Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s ± (0.5 % R + 0.05 Ω)
4.35 - Flammability, needle flame test IEC 60695-11-5; 10 s No burning after 30 s
4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; (93 ± 3) % RH; 56 days ± (1 % R + 0.05 Ω)
4.25.3 - Endurance at
upper category temperature 155 °C; 1000 h ± (2 % R + 0.1 Ω)
4.40 - Electrostatic discharge
(human body model)
IEC 61340-3-1; 3 positive and 3 negative
discharges; ESD voltage according to style ± (1 % R + 0.05 Ω)
4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage
4.30 45 (XA) Solvent resistance of marking Isopropyl alcohol; 50 °C; method 1;
toothbrush
Marking legible,
no visible damage
4.22 6 (Fc) Vibration, endurance by sweeping f = 10 Hz to 2000 Hz; x, y, z 1.5 mm;
A 200 m/s2; 10 sweeps per axis ± (0.5 % R + 0.05 Ω)
4.37 - Periodic electric overload 0.1 s on; 2.5 s off; 1000 cycles ± (1 % R + 0.05 Ω)
4.27 - Single pulse high voltage overload,
10 µs/700 µs 10 pulses ± (1 % R + 0.05 Ω)
U2.5 x P70 x R=
UP
70 x R=
UP
70 x RU
max.
=
U15 x P70 x R2 x Umax.
=
Û10 x P70 x R2 x Umax.
=
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Revision: 02-Oct-12 1Document Number: 91000
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