ZXM61N03F 30V N-CHANNEL ENHANCEMENT MODE MOSFET SUMMARY V(BR)DSS=30V; RDS(ON)=0.22V; ID=1.4A DESCRIPTION This new generation of high density MOSFETs from Zetex utilises a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications. SOT23 FEATURES * Low on-resistance * Fast switching speed * Low threshold * Low gate drive * SOT23 package APPLICATIONS * DC - DC Converters * Power Management Functions * Disconnect switches * Motor control ORDERING INFORMATION DEVICE REEL SIZE (inches) TAPE WIDTH (mm) QUANTITY PER REEL Top View ZXM61N03FTA 7 8mm embossed 3000 units ZXM61N03FTC 13 8mm embossed 10000 units DEVICE MARKING * N03 ISSUE 1 - JUNE 2004 1 ZXM61N03F ABSOLUTE MAXIMUM RATINGS. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DSS 30 V Gate Source Voltage V GS 20 V Continuous Drain Current (V GS=10V; T A=25C)(b) (V GS=10V; T A=70C)(b) ID 1.4 1.1 A Pulsed Drain Current (c) I DM 7.3 A Continuous Source Current (Body Diode) (b) IS 0.8 A Pulsed Source Current (Body Diode) I SM 7.3 A Power Dissipation at T A=25C (a) Linear Derating Factor PD 625 5 mW mW/C Power Dissipation at T A=25C (b) Linear Derating Factor PD 806 6.4 mW mW/C Operating and Storage Temperature Range T j:T stg -55 to +150 C VALUE UNIT THERMAL RESISTANCE PARAMETER SYMBOL Junction to Ambient (a) R JA 200 C/W Junction to Ambient (b) R JA 155 C/W NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t<5 secs. (c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph. ISSUE 1 - JUNE 2004 2 ZXM61N03F Max Power Dissipation (Watts) CHARACTERISTICS 10 ID - Drain Current (A) Refer Note (a) 1 DC 1s 100ms 10ms 1ms 100m 100us 10m 0.1 1 10 100 Refer Note (b) Refer Note (a) 0.6 0.4 0.2 0 0 20 40 80 60 100 120 T - Temperature (C) Safe Operating Area Derating Curve 160 140 240 Thermal Resistance (C/W) 180 Thermal Resistance (C/W) 0.8 VDS - Drain-Source Voltage (V) Refer Note (b) 160 140 120 100 80 1.0 D=0.5 60 40 D=0.2 20 D=0.1 Single Pulse D=0.05 0 0.0001 0.001 0.01 0.1 1 Refer Note (a) 200 160 120 D=0.5 80 40 D=0.2 D=0.1 10 Single Pulse D=0.05 0 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Pulse Width (s) Transient Thermal Impedance Transient Thermal Impedance ISSUE 1 - JUNE 2004 3 ZXM61N03F ELECTRICAL CHARACTERISTICS (at TA = 25C unless otherwise stated). PARAMETER SYMBOL MIN. TYP.(3) MAX. UNIT CONDITIONS. STATIC Drain-Source Breakdown Voltage V (BR)DSS Zero Gate Voltage Drain Current I DSS Gate-Body Leakage I GSS Gate-Source Threshold Voltage V GS(th) Static Drain-Source On-State Resistance (1) R DS(on) Forward Transconductance (3) g fs 30 V I D=250A, V GS=0V 1 A V DS=30V, V GS=0V 100 nA V GS= 20V, V DS=0V V I D =250A, V DS= V GS V GS=10V, I D=0.91A V GS=4.5V, I D=0.46A S V DS=10V,I D=0.46A 1.0 0.22 0.30 0.87 DYNAMIC (3) Input Capacitance C iss 150 pF Output Capacitance C oss 35 pF Reverse Transfer Capacitance C rss 15 pF Turn-On Delay Time t d(on) 1.9 ns Rise Time tr 2.5 ns Turn-Off Delay Time t d(off) 5.8 ns Fall Time tf 3.0 ns Total Gate Charge Qg 4.1 nC Gate-Source Charge Q gs 0.4 nC Gate-Drain Charge Q gd 0.63 nC Diode Forward Voltage (1) V SD 0.95 V T J=25C, I S=0.91A, V GS=0V Reverse Recovery Time (3) t rr 11.0 ns T J=25C, I F=0.91A, di/dt= 100A/s Reverse Recovery Charge (3) Q rr 3.5 nC V DS=25 V, V GS=0V, f=1MHz SWITCHING(2) (3) V DD =15V, I D=0.91A R G=6.2, R D=16 (refer to test circuit) V DS=24V,V GS=10V, I D =0.91A (refer to test circuit) SOURCE-DRAIN DIODE NOTES (1) Measured under pulsed conditions. Width300s. Duty cycle 2% . (2) Switching characteristics are independent of operating junction temperature. (3) For design aid only, not subject to production testing. ISSUE 1 - JUNE 2004 4 ZXM61N03F TYPICAL CHARACTERISTICS 3.5V 1 3V 100m 2.5V 10m 1 5V 4V 3V 100m 2.5V 10m 2.0V 1m 10 0.01 1 10 100 VDS - Drain-Source Voltage (V) Output Characteristics Ouput Characteristics VDS=10V 0.1 T=150C T=25C 1.5 2.5 3.5 2.0 RDS(on) 1.5 VGS=10V ID=0.91A 1.0 VGS=VDS ID=250uA 0.5 VGS(th) 0 -100 VGS - Gate-Source Voltage (V) ISD - Reverse Drain Current (A) VGS=4.5V VGS=10V 0.1 1 10 0 50 100 150 200 Normalised RDS(on) and VGS(th) v Temperature 10 1 -50 Tj - Junction Temperature (C) Typical Transfer Characteristics RDS(on) - Drain-Source On-Resistance ( ) 0.1 VDS - Drain-Source Voltage (V) 1 0.1 VGS +150C 1 100u 0.1 10 0.01 10 ID - Drain Current (A) 4V 1m ID - Drain Current (A) VGS 9V 5V +25C Normalised RDS(on) and VGS(th) ID - Drain Current (A) 10 100 ID - Drain Current (A) 100 10 1 100m 10m T=150C T=25C 1m 100 0 0.2 0.4 0.6 0.8 1.0 1.2 VSD - Source-Drain Voltage (V) On-Resistance v Drain Current Source-Drain Diode Forward Voltage ISSUE 1 - JUNE 2004 5 ZXM61N03F C - Capacitance (pF) 250 VGS - Gate-Source Voltage (V) TYPICAL CHARACTERISTICS Vgs=0V f=1MHz Ciss Coss Crss 200 150 100 50 0 0.1 1 10 100 10 ID=0.91A VDS=24V 8 6 4 2 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VDS - Drain-Source Voltage (V) Q - Charge (nC) Capacitance v Drain-Source Voltage Gate-Source Voltage v Gate Charge Basic Gate Charge Waveform Gate Charge Test Circuit Switching Time Waveforms Switching Time Test Circuit ISSUE 1 - JUNE 2004 6 ZXM61N03F PAD LAYOUT DETAILS N PACKAGE DIMENSIONS DIM Millimetres Inches Min Max Min Max A 2.67 3.05 0.105 0.120 B 1.20 1.40 0.047 0.055 C - 1.10 - 0.043 D 0.37 0.53 0.0145 0.021 F 0.085 0.15 0.0033 0.0059 G NOM 1.9 K 0.01 0.10 0.0004 0.004 L 2.10 2.50 0.0825 0.0985 N NOM 0.95 NOM 0.075 NOM 0.037 Zetex plc. Fields New Road, Chadderton, Oldham, OL9-8NP, United Kingdom. Telephone: (44)161 622 4422 (Sales), (44)161 622 4444 (General Enquiries) Fax: (44)161 622 4420 Zetex GmbH Streitfeldstrae 19 D-81673 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 Zetex Inc. 47 Mall Drive, Unit 4 Commack NY 11725 USA Telephone: (516) 543-7100 Fax: (516) 864-7630 Zetex (Asia) Ltd. 3510 Metroplaza, Tower 2 Hing Fong Road, Kwai Fong, Hong Kong Telephone:(852) 26100 611 Fax: (852) 24250 494 These are supported by agents and distributors in major countries world-wide Zetex plc 1999 Internet:http://www.zetex.com This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. ISSUE 1 - JUNE 2004 7