1
FN6307.5
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E,
ISL3175E, ISL3176E, ISL3177E, ISL3178E
±15kV ESD Protected, 3.3V, Full Fail-Safe,
Low Power, High Speed or Slew Rate
Limited, RS-485/RS-422 Transceivers
The Intersil ISL317XE are ±15kV IEC61000 ESD Protected,
3.3V-powered, single transceivers that meet both the
RS-485 and RS-422 standards for balanced communication.
These devices have very low bus currents (+125mA/-100mA),
so they present a true “1/8 unit load” to the RS-485 bus. This
allows up to 256 transceivers on the network without violating
the RS-485 specification’s 32 unit load maximum, and without
using repeaters. For example, in a remote utility meter reading
system, individual meter readings are routed to a concentrator
via an RS-485 network, so the high allowed node count
minimizes the number of repeaters required.
Receiver (Rx) inputs feature a “Full Fail-Safe” design, which
ensures a logic high Rx output if Rx inputs are floating,
shorted, or terminated but undriven.
Hot Plug circuitry ensures that the Tx and Rx outputs remain
in a high impedance state while the power supply stabilizes.
The ISL3170E through ISL3175E utilize slew rate limited
drivers which reduce EMI, and minimize reflections from
improperly terminated transmission lines, or unterminated
stubs in multidrop and multipoint applications. Slew rate limited
versions also include receiver input filtering to enhance noise
immunity in the presence of slow input signals.
The ISL3170E, ISL3171E, ISL3173E, ISL3174E, ISL3176E,
ISL3177E are configured for full duplex (separate Rx input
and Tx output pins) applications. The half duplex versions
multiplex the Rx inputs and Tx outputs to allow transceivers
with output disable functions in 8 Ld packages.
Features
• IEC61000 ESD Protection on RS-485 I/O Pins . . . . . ±15kV
- Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM
• Full Fail-safe (Open, Short, Terminated/Floating)
Receivers
• Hot Plug - Tx and Rx Outputs Remain Three-state During
Power-up (Only Versions with Output Enable Pins)
• True 1/8 Unit Load Allows up to 256 Devices on the Bus
• Single 3.3V Supply
• High Data Rates. . . . . . . . . . . . . . . . . . . . . . up to 20Mbps
• Low Quiescent Supply Current . . . . . . . . . . .800μA (Max)
- Ultra Low Shutdown Supply Current . . . . . . . . . . .10nA
• -7V to +12V Common Mode Input/Output Voltage Range
• Half and Full Duplex Pinouts
• Three State Rx and Tx Outputs Available
• Current Limiting and Thermal Shutdown for driver
Overload Protection
• Tiny MSOP Packages Consume 50% Less Board Space
• Pb-Free (RoHS Compliant)
Applications
• Automated Utility Meter Reading Systems
• High Node Count Systems
• Field Bus Networks
• Security Camera Networks
• Building Environmental Control/ Lighting Systems
• Industrial/Process Control Networks
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER HALF/FULL
DUPLEX DA T A RA TE
(Mbps) SLEW-RATE
LIMITED? HOT
PLUG? # DEVICES
ON BUS RX/TX
ENABLE? QUIESCENT
ICC (µA) LOW POWER
SHUTDOWN? PIN
COUNT
ISL3170E FULL 0.25 YES YES 256 YES 510 YES 10, 14
ISL3171E FULL 0.25 YES NO 256 NO 510 NO 8
ISL3172E HALF 0.25 YES YES 256 YES 510 YES 8
ISL3173E FULL 0.5 YES YES 256 YES 510 YES 10, 14
ISL3174E FULL 0.5 YES NO 256 NO 510 NO 8
ISL3175E HALF 0.5 YES YES 256 YES 510 YES 8
ISL3176E FULL 20 NO YES 256 YES 510 YES 10, 14
ISL3177E FULL 20 NO NO 256 NO 510 NO 8
ISL3178E HALF 20 NO YES 256 YES 510 YES 8
Data Sheet June 8, 2012
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2006-2008, 2012. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
2FN6307.5
June 8, 2012
Pinouts ISL3172E, ISL3175E, ISL3178E
(8 LD MSOP, SOIC)
TOP VIEW
ISL3171E, ISL3174E, ISL3177E
(8 LD MSOP, SOIC)
TOP VIEW
ISL3170E, ISL3173E, ISL3176E
(10 LD MSOP)
TOP VIEW
ISL3170E, ISL3173E, ISL3176E
(14 LD SOIC)
TOP VIEW
RO
RE
DE
DI
1
2
3
4
8
7
6
5
VCC
B/Z
A/Y
GND
D
R
VCC
RO
DI
GND
1
2
3
4
8
7
6
5
A
B
Z
Y
D
R
RO
RE
DE
DI
GND
VCC
A
B
Z
Y
1
2
3
4
5
10
9
8
7
6
D
R
NC
RO
RE
DE
DI
GND
GND
VCC
NC
A
B
Z
Y
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
D
R
Ordering Information
PART NUMBER (Notes 1, 2, 3) PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. #
ISL3170EIBZ 3170EIBZ -40 to +85 14 Ld SOIC M14.15
ISL3170EIUZ 3170Z -40 to +85 10 Ld MSOP M10.118
ISL3171EIBZ 3171 EIBZ -40 to +85 8 Ld SOIC M8.15
ISL3171EIUZ 3171Z -40 to +85 8 Ld MSOP M8.118
ISL3172EIBZ 3172 EIBZ -40 to +85 8 Ld SOIC M8.15
ISL3172EIUZ 3172Z -40 to +85 8 Ld MSOP M8.118
ISL3173EIBZ 3173EIBZ -40 to +85 14 Ld SOIC M14.15
ISL3173EIUZ 3173Z -40 to +85 10 Ld MSOP M10.118
ISL3174EIBZ 3174 EIBZ -40 to +85 8 Ld SOIC M8.15
ISL3174EIUZ 3174Z -40 to +85 8 Ld MSOP M8.118
ISL3175EIBZ 3175 EIBZ -40 to +85 8 Ld SOIC M8.15
ISL3175EIUZ 3175Z -40 to +85 8 Ld MSOP M8.118
ISL3176EIBZ 3176EIBZ -40 to +85 14 Ld SOIC M14.15
ISL3176EIUZ 3176Z -40 to +85 10 Ld MSOP M10.118
ISL3177EIBZ 3177 EIBZ -40 to +85 8 Ld SOIC M8.15
ISL3177EIUZ 3177Z -40 to +85 8 Ld MSOP M8.118
ISL3178EIBZ 3178 EIBZ -40 to +85 8 Ld SOIC M8.15
ISL3178EIUZ 3178Z -40 to +85 8 Ld MSOP M8.118
NOTES:
1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E,ISL3175E,
ISL3176E, ISL3177E, ISL3178E. For more information on MSL please see tech brief TB363.
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
3FN6307.5
June 8, 2012
Truth Tables
TRANSMITTING
INPUTS OUTPUTS
RE DE DI Z Y
X1101
X1010
0 0 X High-Z High-Z
1 0 X High-Z * High-Z *
NOTE: *Shutdown Mode (See Note 10), except for ISL3171E,
ISL3174E, ISL3177E
Truth Tables (continued)
RECEIVING
INPUTS OUTPUT
RE DE
Half Duplex
DE
Full Duplex
A-B RO
00 X≥ -0.05V 1
00 X≤ -0.2V 0
0 0 X Inputs
Open/Shorted
1
1 0 0 X High-Z *
1 1 1 X High-Z
NOTE: *Shutdown Mode (See Note 10), except for ISL3171E,
ISL3174E, ISL3177E
Pin Descriptions
PIN FUNCTION
RO Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted.
RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn’t
required, connect RE directly to GND or through a 1kΩ to 3kΩ resistor to GND.
DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the
Tx enable function isn’t required, connect DE to VCC through a 1kΩ to 3kΩ resistor.
DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
GND Ground connection.
A/Y ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input if
DE = 0; pin is an output if DE = 1.
B/Z ±15kV IEC61000 ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0;
pin is an output if DE = 1.
A±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input.
B±15kV IEC61000 ESD Protected RS-485/422 level, inverting receiver input.
Y±15kV IEC61000 ESD Protected RS-485/422 level, noninverting driver output.
Z±15kV IEC61000 ESD Protected RS-485/422 level, inverting driver output.
VCC System power supply input (3.0V to 3.6V).
NC No Connection.
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
4FN6307.5
June 8, 2012
Typical Operating Circuits
ISL3172E, ISL3175E, ISL3178E
ISL3171E, ISL3174E, ISL3177E
ISL3170E, ISL3173E, ISL3176E
0.1µF
+
D
R
7
6
8
1
2
3
4
5
VCC
GND
RO
RE
DE
DI
A/Y
B/Z
+3.3V
0.1µF+
D
R
6
7
8
1
2
3
4
5
VCC
GND
RO
RE
DE
DI
A/Y
B/Z
+3.3V
RTRT
0.1µF
+
D
R8
7
6
5
1
2
3
4
VCC
GND
RO
DI
A
B
Y
Z
+3.3V
0.1µF +
D
R
8
7
6
5
1
2
3
4
VCC
GND
RO
DI
A
B
Y
Z
+3.3V
RT
RT
0.1µF
+
D
R12
11
10
9
14
2
3
4
5
6, 7
VCC
GND
RO
RE
DE
DI
A
B
Y
Z
+3.3V
0.1µF+
D
R
12
11
10
9
14
2
3
4
5
6, 7
VCC
GND
RO
RE
DE
DI
A
B
Y
Z
+3.3V
RT
RT
(PIN NUMBERS FOR SOIC)
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
5FN6307.5
June 8, 2012
Absolute Maximum Ratings Thermal Information
VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
DE, RE (Note 20) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input/Output Voltages
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Thermal Resistance (Typical, Note 4) θJA (°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . 105
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . . 140
10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . 190
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 128
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electri ca l Specific at io ns Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C,
(Note 5)
PARAMETER SYMBOL TEST CONDITIONS TEMP
(°C) MIN
(Note 19) TYP MAX
(Note 19) UNITS
DC CHARACTERISTICS
Driver Differential VOUT VOD RL = 100Ω (RS-422) (Figure 1A, Note 16) Full 2 2.3 - V
RL = 54Ω (RS-485) (Figure 1A) Full 1.5 2 VCC V
No Load - - VCC
RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full 1.5 2.2 - V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
ΔVOD RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V
Driver Common-Mode VOUT VOC RL = 54Ω or 100Ω (Figure 1A) Full - 2 3 V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔVOC RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V
Logic Input High Voltage VIH DI, DE, RE Full 2 - - V
Logic Input Low Voltage VIL DI, DE, RE Full - - 0.8 V
Logic Input Hysteresis VHYS DE, RE (Note 15) 25 - 100 - mV
Logic Input Current IIN1 DI = DE = RE = 0V or VCC (Note 18) Full -2 - 2 μA
Input Current (A, B, A/Y, B/Z) IIN2 DE = 0V, VCC = 0V or
3.6V
VIN = 12V Full - 80 125 μA
VIN = -7V Full -100 -50 - μA
Output Leakage Current (Y, Z) (Full
Duplex Versions Only, Note 13)
IIN3 RE = 0V, DE = 0V,
VCC = 0V or 3.6V
VIN = 12V Full - 10 40 μA
VIN = -7V Full -40 -10 - μA
Output Leakage Current (Y, Z)
in Shutdown Mode (Full Duplex,
Note 13)
IIN4 RE = VCC, DE = 0V,
VCC = 0V or 3.6V
VIN = 12V Full - 10 40 μA
VIN = -7V Full -40 -10 - μA
Driver Short-Circuit Current,
VO = High or Low
IOSD1 DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 7) Full - - ±250 mA
Receiver Differential Threshold
Voltage
VTH -7V ≤ VCM ≤ 12V Full -200 -125 -50 mV
Receiver Input Hysteresis ΔVTH VCM = 0V 25 - 15 - mV
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
6FN6307.5
June 8, 2012
Receiver Output High Voltage VOH IO = -4mA, VID = -50mV Full VCC - 0.6 - - V
Receiver Output Low Voltage VOL IO = -4mA, VID = -200mV Full - 0.17 0.4 V
Three-State (high impedance)
Receiver Output Current (Note 13)
IOZR 0.4V ≤ VO ≤ 2.4V Full -1 0.015 1 μA
Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V Full 96 150 - kΩ
Receiver Short-Circuit Current IOSR 0V ≤ VO ≤ VCC Full ±730±60 mA
Thermal Shutdown Threshold TSD Full - 150 - °C
SUPPLY CURRENT
No-Load Supply Current (Note 6) ICC DI = 0V or VCC DE = VCC,
RE = 0V or VCC
Full - 510 800 μA
DE = 0V, RE = 0V Full - 480 700 μA
Shutdown Supply Current
(Note 13)
ISHDN DE = 0V, RE = VCC, DI = 0V or VCC Full - 0.01 12 μA
ESD PERFORMANCE
RS-485 Pins (A, Y, B, Z, A/Y, B/Z) IEC61000-4-2, Air-Gap Discharge Method 25 - ±15 - kV
IEC61000-4-2, Contact Discharge Method 25 - ±8-kV
Human Body Model, From Bus Pins to GND 25 - ±15 - kV
All Pins HBM, per MIL-STD-883 Method 3015 25 - ±7-kV
Machine Model 25 - 200 - V
DRIVER SWITCHING CHARACTERISTICS (ISL3170E, ISL3171E, ISL3172E, 250kbps)
Maximum Data Rate fMAX VOD = ±1.5V, CD = 820pF (Figure 4,
Note 17)
Full 250 800 - kbps
Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 250 1100 1500 ns
Driver Differential Output Skew tSKEW RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 6 100 ns
Driver Differential Rise or Fall Time tR, tFRDIFF = 54Ω, CD = 50pF (Figure 2) Full 350 960 1600 ns
Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
(Notes 8, 13)
Full - 26 600 ns
Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Notes 8, 13)
Full - 200 600 ns
Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
(Note 13)
Full - 28 55 ns
Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Note 13)
Full - 30 55 ns
Time to Shutdown tSHDN (Notes 10, 13) Full 50 200 600 ns
Driver Enable from Shutdown to
Output High
tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
(Notes 10, 11, 13)
Full - 180 700 ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Notes 10, 11, 13)
Full - 100 700 ns
DRIVER SWITCHING CHARACTERISTICS (ISL3173E, ISL3174E, ISL3175E, 500kbps)
Maximum Data Rate fMAX VOD = ±1.5V, CD = 820pF (Figure 4,
Note 17)
Full 500 1600 - kbps
Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 180 350 800 ns
Driver Differential Output Skew tSKEW RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 1 30 ns
Driver Differential Rise or Fall Time tR, tFRDIFF = 54Ω, CD = 50pF (Figure 2) Full 200 380 800 ns
Electri ca l Specific at io ns Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C,
(Note 5)
PARAMETER SYMBOL TEST CONDITIONS TEMP
(°C) MIN
(Note 19) TYP MAX
(Note 19) UNITS
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
7FN6307.5
June 8, 2012
Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
(Notes 8, 13)
Full - 26 350 ns
Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Notes 8, 13)
Full - 100 350 ns
Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
(Note 13)
Full - 28 55 ns
Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Note 13)
Full - 30 55 ns
Time to Shutdown tSHDN (Notes 10, 13) Full 50 200 600 ns
Driver Enable from Shutdown to
Output High
tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
(Notes 10, 11, 13)
Full - 180 700 ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Notes 10, 11, 13)
Full - 100 700 ns
DRIVER SWITCHING CHARACTERISTICS (ISL3176E, ISL3177E, ISL3178E, 20Mbps)
Maximum Data Rate fMAX VOD = ±1.5V, CD = 350pF (Figure 4,
Note 17)
Full 20 28 - Mbps
Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 27 40 ns
Driver Differential Output Skew tSKEW RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 1 3 ns
Driver Output Skew, Part-to-Part ΔtDSKEW RDIFF = 54Ω, CD = 50pF (Figure 2, Note 14) Full - - 11 ns
Driver Differential Rise or Fall Time tR, tFRDIFF = 54Ω, CD = 50pF (Figure 2) Full - 9 15 ns
Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
(Notes 8, 13)
Full - 17 50 ns
Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Notes 8, 13)
Full - 16 40 ns
Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
(Note 13)
Full - 25 40 ns
Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Note 13)
Full - 28 50 ns
Time to Shutdown tSHDN (Notes 10, 13) Full 50 200 600 ns
Driver Enable from Shutdown to
Output High
tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
(Notes 10, 11, 13)
Full - 180 700 ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Notes 10, 11, 13)
Full - 90 700 ns
RECEIVER SWITCHING CHARACTERISTICS (All Versions)
Maximum Data Rate fMAX VID = ±1.5V (Note 17) ISL3170E-75E Full 12 20 - Mbps
ISL3176E-78E Full 20 35 - Mbps
Receiver Input to Output Delay tPLH, tPHL (Figure 5) ISL3170E-75E Full 25 70 120 ns
ISL3176E-78E Full 25 33 60 ns
Receiver Skew | tPLH - tPHL |t
SKD (Figure 5) Full - 1.5 4 ns
Receiver Skew, Part-to-Part ΔtRSKEW (Figure 5, Note 14) Full - - 15 ns
Receiver Enable to Output High tZH RL = 1kΩ, CL = 15pF,
SW = GND (Figure 6),
(Notes 9, 13)
ISL3170E-75E Full 5 15 20 ns
ISL3176E-78E Full 5 11 17 ns
Receiver Enable to Output Low tZL RL = 1kΩ, CL = 15pF,
SW = VCC (Figure 6),
(Notes 9, 13)
ISL3170E-75E Full 5 15 20 ns
ISL3176E-78E Full 5 11 17 ns
Electri ca l Specific at io ns Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C,
(Note 5)
PARAMETER SYMBOL TEST CONDITIONS TEMP
(°C) MIN
(Note 19) TYP MAX
(Note 19) UNITS
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
8FN6307.5
June 8, 2012
Receiver Disable from Output High tHZ RL = 1kΩ, CL = 15pF,
SW = GND (Figure 6),
(Note 13)
ISL3170E-75E Full 5 12 20 ns
ISL3176E-78E Full 4 7 15 ns
Receiver Disable from Output Low tLZ RL = 1kΩ, CL = 15pF,
SW = VCC (Figure 6),
(Note 13)
ISL3170E-75E Full 5 13 20 ns
ISL3176E-78E Full 4 7 15 ns
Time to Shutdown tSHDN (Notes 10, 13) Full 50 180 600 ns
Receiver Enable from Shutdown to
Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6),
(Notes 10, 12, 13)
Full - 240 500 ns
Receiver Enable from Shutdown to
Output Low
tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6),
(Notes 10, 12, 13)
Full - 240 500 ns
NOTES:
5. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
6. Supply current specification is valid for loaded drivers when DE = 0V.
7. Applies to peak current. See “Typical Performance Curves” starting on page 12 for more information.
8. When testing devices with the shutdown feature, keep RE = 0 to prevent the device from entering SHDN.
9. When testing devices with the shutdown feature, the RE signal high time must be short enough (typically <100ns) to prevent the device from
entering SHDN.
10. Versions with a shutdown feature are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 50ns, the
parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown.
See “Low Power Shutdown Mode” on page 12.
11. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN.
12. Set the RE signal high time >600ns to ensure that the device enters SHDN.
13. Does not apply to the ISL3171E, ISL3174E and ISL3177E.
14. ΔtSKEW is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC,
temperature, etc.). Only applies to the ISL3176E through ISL3178E.
15. ISL3170E through ISL3175E only.
16. VCC ≥ 3.15V
17. Limits established by characterization and are not production tested.
18. If the Tx or Rx enable function isn’t needed, connect the enable pin to the appropriate supply (see “Pin Descriptions” on page 3) through a 1kΩ
to 3kΩ resistor.
19. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
20. If the DE or RE input voltage exceeds the VCC voltage by more than 500mV, then current will flow into the logic pin. The current is limited by a
340Ω resistor (so ≈13mA with VIN = 5V and VCC = 0V) so no damage will occur if VCC ≤ VIN ≤ 7V for short periods of time.
Test Circuits and Waveforms
FIGURE 1A. VOD AND VOC FIGURE 1B. VOD WITH COMMON MODE LOAD
FIGURE 1. DC DRIVER TEST CIRCUITS
Electri ca l Specific at io ns Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C,
(Note 5)
PARAMETER SYMBOL TEST CONDITIONS TEMP
(°C) MIN
(Note 19) TYP MAX
(Note 19) UNITS
D
DE
DI
VCC
VOD
VOC
RL/2
RL/2
Z
Y
D
DE
DI
VCC
VOD
375Ω
375Ω
Z
Y
RL = 60ΩVCM
-7V to +12V
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
9FN6307.5
June 8, 2012
FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES (EXCEPT ISL3171E, ISL3174E, ISL3177E)
FIGURE 4A. TEST CIRCUIT FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. DRIVER DATA RATE
Test Circuits and Waveforms (Continued)
D
DE
DI
VCC
SIGNAL
GENERATOR
CD
RDIFF
Z
Y
OUT (Z)
3V
0V
1.5V1.5V
VOH
VOL
OUT (Y)
tPLH tPHL
DIFF OUT (Y to Z)
tR
+VOD
-VOD
90% 90%
tF
10% 10%
DI
SKEW = |tPLH - tPHL|
D
DE
DI Z
Y
VCC
GND
SW
PARAMETER OUTPUT RE DI SW
tHZ Y/Z X 1/0 GND
tLZ Y/Z X 0/1 VCC
tZH Y/Z 0 (Note 8) 1/0 GND
tZL Y/Z 0 (Note 8) 0/1 VCC
tZH(SHDN) Y/Z 1 (Note 11) 1/0 GND
tZL(SHDN) Y/Z 1 (Note 11) 0/1 VCC
SIGNAL
GENERATOR
500Ω
50pF
OUT (Y, Z)
3V
0V
1.5V1.5V
VOH
0V
VOH - 0.25V
tHZ
OUT (Y, Z)
VCC
VOL
VOL + 0.25V
tLZ
DE
OUTPUT HIGH
OUTPUT LOW
tZL, tZL(SHDN)
tZH, tZH(SHDN)
NOTE 10
50%
50%
NOTE 10
NOTE 10
D
DE
DI
VCC
SIGNAL
GENERATOR
Z
Y
CDVOD
+
-
54Ω
3V
0V
DIFF OUT (Y to Z) +VOD
-VOD
DI
0V
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
10 FN6307.5
June 8, 2012
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a
point-to-multipoint (multidrop) standard, which allows only
one driver and up to 10 (assuming one unit load devices)
receivers on each bus. RS-485 is a true multipoint standard,
which allows up to 32 one-unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 spec requires that
drivers must handle bus contention without sustaining any
damage.
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as
long as 4000’, so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.
Receiver Features
These devices utilize a differential input receiver for maximum
noise immunity and common mode rejection. Input sensitivity
is better than ±200mV, as required by the RS-422 and RS-485
specifications.
Receiver input resistance of 96kΩ surpasses the RS-422
spec of 4kΩ and is eight times the RS-485 “Unit Load (UL)”
requirement of 12kΩ minimum. Thus, these products are
known as “one-eighth UL” transceivers and there can be up
to 256 of these devices on a network while still complying
with the RS-485 loading specification.
Receiver inputs function with common mode voltages as great
as +9V/-7V outside the power supplies (i.e., +12V and -7V),
making them ideal for long networks where induced voltages
and ground potential differences are realistic concerns.
All the receivers include a “Full Fail-Safe” function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating) or shorted. Fail-safe with shorted
inputs is achieved by setting the Rx upper switching point to
-50mV, thereby ensuring that the Rx sees 0V differential as a
high input level.
FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. RECEIVER PROPAGATION DELAY
FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES (EXCEPT ISL3171E, ISL3174E, ISL3177E)
Test Circuits and Waveforms (Continued)
SIGNAL
GENERATOR
RRO
RE
A
B
GND 15pF
RO
+1.5V
-1.5V
tPLH
0V0V
VCC
0V
1.5V 1.5V
tPHL
A
1kΩVCC
GND
SW
PARAMETER DE A SW
tHZ X +1.5V GND
tLZ X -1.5V VCC
tZH (Note 9) 0 +1.5V GND
tZL (Note 9) 0 -1.5V VCC
tZH(SHDN) (Note 12) 0 +1.5V GND
tZL(SHDN) (Note 12) 0 -1.5V VCC
SIGNAL
GENERATOR
RRO
RE
A
B
GND
15pF
RO
3V
0V
1.5V1.5V
VOH
0V
1.5V VOH - 0.25V
tHZ
RO
VCC
VOL
1.5V VOL + 0.25V
tLZ
RE
OUTPUT HIGH
OUTPUT LOW
tZL, tZL(SHDN)
tZH, tZH(SHDN)
NOTE 10
NOTE 10
NOTE 10
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
11 FN6307.5
June 8, 2012
Receivers easily meet the data rates supported by the
corresponding driver, and all receiver outputs (except on the
ISL3171E, ISL3174E and ISL3177E) are tri-statable via the
active low RE input.
Driver Features
The RS-485/422 driver is a differential output device that
delivers at least 1.5V across a 54Ω load (RS-485) and at
least 2V across a 100Ω load (RS-422). The drivers feature
low propagation delay skew to maximize bit width and to
minimize EMI.
All drivers are tri-statable via the active high DE input, except
on the ISL3171E, ISL3174E and ISL3177E.
The 250kbps and 500kbps driver outputs are slew rate
limited to minimize EMI and to reduce reflections in
unterminated or improperly terminated networks. Outputs of
the ISL3176E through ISL3178E drivers are not limited, so
faster output transition times allow data rates of at least
20Mbps.
Hot Plug Function
When a piece of equipment powers up, there is a period of
time where the processor or ASIC driving the RS-485 control
lines (DE, RE) is unable to ensure that the RS-485 Tx and
Rx outputs are kept disabled. If the equipment is connected
to the bus, a driver activating prematurely during power up
may crash the bus. To avoid this scenario, the ISL317XE
versions with output enable pins incorporate a “Hot Plug”
function. During power up, circuitry monitoring VCC ensures
that the Tx and Rx outputs remain disabled for a period of time,
regardless of the state of DE and RE. This gives the
processor/ASIC a chance to stabilize and drive the RS-485
control lines to the proper states.
ESD Protection
All pins on these devices include class 3 (>7kV) Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (driver outputs and receiver inputs)
incorporate advanced structures allowing them to survive
ESD events in excess of ±15kV HBM and ±15kV
IEC61000. The RS-485 pins are particularly vulnerable to
ESD damage because they typically connect to an exposed
port on the exterior of the finished product. Simply touching
the port pins, or connecting a cable, can cause an ESD
event that might destroy unprotected ICs. These new ESD
structures protect the device whether or not it is powered
up, and without degrading the RS-485 common mode
range of -7V to +12V. This built-in ESD protection
eliminates the need for board level protection structures
(e.g., transient suppression diodes), and the associated,
undesirable capacitive load they present.
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-485 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe than
the HBM test. The extra ESD protection built into this
device’s RS-485 pins allows the design of equipment
meeting level 4 criteria without the need for additional board
level protection on the RS-485 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc. so it is difficult to obtain
repeatable results. The ISL317XE RS-485 pins withstand
±15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. The ISL317XE survive ±8kV contact
discharges on the RS-485 pins.
Data Rate, Cables, and Terminations
RS-485/422 are intended for network lengths up to 4000’,
but the maximum system data rate decreases as the
transmission length increases. Devices operating at 20Mbps
are limited to lengths less than 100’, while the 250kbps
versions can operate at full data rates with lengths of several
thousand feet.
Twisted pair is the cable of choice for RS-485/422 networks.
Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common mode
signals, which are effectively rejected by the differential
receivers in these ICs.
Proper termination is imperative, when using the 20Mbps
devices to minimize reflections. Short networks using the
250kbps versions need not be terminated, but, terminations
are recommended unless power dissipation is an overriding
concern.
In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, stubs
connecting receivers to the main cable should be kept as
short as possible. Multipoint (multi-driver) systems require
that the main cable be terminated in its characteristic
impedance at both ends. Stubs connecting a transceiver to
the main cable should be kept as short as possible.
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
12 FN6307.5
June 8, 2012
Built-In Driver Overload Protection
As stated previously, the RS-485 spec requires that drivers
survive worst case bus contentions undamaged. These
devices meet this requirement via driver output short circuit
current limits, and on-chip thermal shutdown circuitry.
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 spec, even at the common mode
voltage range extremes. Additionally, these devices utilize a
foldback circuit which reduces the short circuit current, and
thus the power dissipation, whenever the contending voltage
exceeds either supply.
In the event of a major short circuit condition, devices also
include a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissipation, allowing the die to cool. The
drivers automatically re-enable after the die temperature
drops about 15°. If the contention persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared.
Receivers stay operational during thermal shutdown.
Low Power Shutdown Mode
These CMOS transceivers all use a fraction of the power
required by their bipolar counterparts, but some also include
a shutdown feature that reduces the already low quiescent
ICC to a 10nA trickle. These devices enter shutdown
whenever the receiver and driver are simultaneously
disabled (RE =V
CC and DE = GND) for a period of at least
600ns. Disabling both the driver and the receiver for less
than 50ns guarantees that the transceiver will not enter
shutdown.
Note that receiver and driver enable times increase when the
transceiver enables from shutdown. Refer to Notes 8 through
12, at the end of the “Electrical Specification table” on page 8,
for more information.
Typical Performance Curves VCC = 3.3V, TA = +25°C; Unless Otherwise Specified
FIGURE 7. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE FIGURE 8. DRIVER DIFFERENTIAL OUTPUT VOL TAGE vs
TEMPERATURE
FIGURE 9. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE FIGURE 10. SUPPLY CURRENT vs TEMPERATURE
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
0
20
40
60
80
100
120
-40 0 50 85
TEMPERATURE (°C)
DIFFERENTIAL OUTPUT VOLTAGE (V)
-25 25 75
RDIFF = 100Ω
1.85
1.90
1.95
2.00
2.05
2.10
2.15
2.20
2.25
2.30
2.35
RDIFF = 54Ω
OUTPUT VOLTAGE (V)
-7 -6 -4 -2 0 2 4 6 8 10 12
OUTPUT CURRENT (mA)
-50
0
50
100
150
200
-100
-150
Y OR Z = HIGH
Y OR Z = LOW
ISL317XE
ISL3170E THRU ISL3175E
ISL3176E/77E/78E
-40 0 50 85
TEMPERATURE (°C)
ICC (mA)
-25 25 75
0.46
0.47
0.48
0.49
0.50
0.51
0.52
ISL3172E/75E/ 78E, DE = VCC, RE = X
ISL3170E/73E/76E, DE = X, RE = 0V; ISL3171E/74E/77E
ISL3172E/75E/78E, DE = 0V, RE = 0V
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
13 FN6307.5
June 8, 2012
FIGURE 1 1. DRIVER DIFFERENTIAL PROP AGA TION DELAY
vs TEMPERATURE (ISL3170E, ISL3171E,
ISL3172E)
FIGURE 12. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3170E, ISL3171E, ISL3172E)
FIGURE 13. DRIVER DIFFERENTIAL PROP AGA TION DELA Y
vs TEMPERATURE (ISL3173E, ISL3174E,
ISL3175E)
FIGURE 14. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3173E, ISL3174E, ISL3175E)
Typical Performance Curves VCC = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued)
-40 0 50 85
TEMPERATURE (°C)
-25 25 75
PROPAGATION DELAY (ns)
tPLH
tPHL
1080
1100
1120
1140
1160
1180
1200
1220
-40 0 50 85
TEMPERATURE (°C)
SKEW (ns)
-25 25 75
5.5
6.0
6.5
7.0
7.5
8.0
|CROSS POINT OF Y↑ AND Z↓ − CROSS POINT OF Y↓ AND Z↑|
-40 0 50 85
TEMPERATURE (°C)
-25 25 75
PROPAGATION DELAY (ns)
tPLH
tPHL
340
345
350
355
360
365
370
-40 0 50 85
TEMPERATURE (°C)
SKEW (ns)
-25 25 75
0.2
0.4
0.6
0.8
1.0
1.2
1.4
|CROSS POINT OF Y↑ AND Z↓ − CROSS POINT OF Y↓ AND Z↑|
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
14 FN6307.5
June 8, 2012
FIGURE 15. DRIVER DIFFERENTIAL PROP AGA TION DELA Y
vs TEMPERATURE (ISL3176E, ISL3177E,
ISL3178E)
FIGURE 16. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3176E, ISL3177E, ISL3178E)
FIGURE 17. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL3170E, ISL3171E, ISL3172E) FIGURE 18. DRIVER AND RECEIVER W A VEFORMS,
HIGH TO LOW (ISL3170E, ISL3171E, ISL3172E)
Typical Performance Curves VCC = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued)
-40 0 50 85
TEMPERATURE (°C)
-25 25 75
PROPAGATION DELAY (ns)
22
23
24
25
26
27
28
29
30
31
32
tPHL
tPLH
-40 0 50 85
TEMPERATURE (°C)
SKEW (ns)
-25 25 75
0.60
0.65
0.70
0.75
0.80
0.85
0.90
0.95
|CROSS POINT OF Y↑ AND Z↓ − CROSS POINT OF Y↓ AND Z↑|
TIME (400ns/DIV)
RECEIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
0
5
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
0
0.5
1.0
1.5
2.0
2.5
3.0
B/Z
A/Y
TIME (400ns/DIV)
RECEIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
0
5
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
0
0.5
1.0
1.5
2.0
2.5
3.0
B/Z
A/Y
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
15 FN6307.5
June 8, 2012
FIGURE 19. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL3173E, ISL3174E, ISL3175E) FIGURE 20. DRIVER AND RECEIVER W A VEFORMS,
HIGH TO LOW (ISL3173E, ISL3174E, ISL3175E)
FIGURE 21. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL3176E, ISL3177E, ISL3178E) FIGURE 22. DRIVER AND RECEIVER W A VEFORMS,
HIGH TO LOW (ISL3176E, ISL3177E, ISL3178E)
FIGURE 23. RECEIVER OUTPUT CURRENT vs RECEIVER
OUTPUT VOLTAGE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
535
PROCESS:
Si Gate BiCMOS
Typical Performance Curves VCC = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued)
TIME (200ns/DIV)
RECEIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
0
5
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
0
0.5
1.0
1.5
2.0
2.5
3.0
B/Z
A/Y
TIME (200ns/DIV)
RECEIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
0
5
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
0
0.5
1
1.5
2
2.5
3
B/Z
A/Y
TIME (10ns/DIV)
RECEIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
0
5
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
0
0.5
1.0
1.5
2.0
2.5
3.0
B/Z
A/Y
TIME (10ns/DIV)
RECEIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
0
5
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
0
0.5
1.0
1.5
2.0
2.5
3.0
B/Z
A/Y
RECEIVER OUTPUT VOLTAGE (V)
RECEIVER OUTPUT CURRENT (mA)
01.02.03.03.5
1.5 2.50.5
0
5
10
15
20
25
30
35
VOH, +25°C
VOH, +85°C
VOL, +25°C
VOL, +85°C
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
16 FN6307.5
June 8, 2012
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Package Outline Drawing
M8.118
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 7/11
DETAIL "X"
SIDE VIEW 2
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
PIN# 1 ID
0.25 - 0.36
DETAIL "X"
0.10 ± 0.05
(4.40)
(3.00)
(5.80)
H
C
1.10 MAX
0.09 - 0.20
3°±3°
GAUGE
PLANE 0.25
0.95 REF
0.55 ± 0.15
B
0.08 C A-B D
3.0±0.05
12
8
0.85±010
SEATING PLANE
A
0.65 BSC
3.0±0.05 4.9±0.15
(0.40)
(1.40)
(0.65)
D
5
5
SIDE VIEW 1
Dimensioning and tolerancing conform to JEDEC MO-187-AA
Plastic interlead protrusions of 0.15mm max per side are not
Dimensions in ( ) are for reference only.
Dimensions are measured at Datum Plane "H".
Plastic or metal protrusions of 0.15mm max per side are not
Dimensions are in millimeters.
3.
4.
5.
6.
NOTES:
1.
2. and AMSEY14.5m-1994.
included.
included.
0.10C
M
17 FN6307.5
June 8, 2012
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
TOP VIEW
INDEX
AREA
123
-C-
SEATING PLANE
x 45°
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatche d area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0. 024 inch) .
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
SIDE VIEW “A
SIDE VIEW “B”
1.27 (0.050)
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
0.50 (0.20)
0.25 (0.01)
5.00 (0.197)
4.80 (0.189) 1.75 (0.069)
1.35 (0.053)
0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013)
8°
0°
0.25 (0.010)
0.19 (0.008)
1.27 (0.050)
0.40 (0.016)
1.27 (0.050)
5.20(0.205)
1
2
3
45
6
7
8
TYPICAL RECOMMENDED LAND PATTERN
2.20 (0.087)
0.60 (0. 023)
18
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No lice nse is gran t ed by i mpli catio n or other wise u nder an y p a tent or patent righ t s of Int ersi l or it s sub sidi ari es.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6307.5
June 8, 2012
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums and to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only
L
0.25
(0.010)
L1
R1
R
4X q
4X q
GAUGE
PLANE
SEATING
PLANE
EE1
N
12
TOP VI EW
INDEX
AREA
-C-
-B-
0.20 (0.008) ABC
SEATING
PLANE
0.20 (0.008) C
0.10 (0.004) C
-A-
-H-
SIDE VIEW
b
eD
A
A1
A2
-B-
END VIEW
0.20 (0.008) CD
E1
C
L
C
a
- H -
-A -
- B -
- H -
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.037 0.043 0.94 1.10 -
A1 0.002 0.006 0.05 0.15 -
A2 0.030 0.037 0.75 0.95 -
b 0.007 0.011 0.18 0.27 9
c 0.004 0.008 0.09 0.20 -
D 0.116 0.120 2.95 3.05 3
E1 0.116 0.120 2.95 3.05 4
e 0.020 BSC 0.50 BSC -
E 0.187 0.199 4.75 5.05 -
L 0.016 0.028 0.40 0.70 6
L1 0.037 REF 0.95 REF -
N10 107
R 0.003 - 0.07 - -
R1 0.003 - 0.07 - -
5o15o5o15o-
α0o6o0o6o-
Rev. 0 12/02
θ
19 FN6307.5
June 8, 2012
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Package Outline Drawing
M14.15
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 10/09
A
D
4
0.25 A-BMC
C
0.10 C
5B
D
3
0.10 A-BC
4
0.20C 2X
2X
0.10 DC 2X
H
0.10 C
6
36
ID MARK
PIN NO.1 (0.35) x 45°
SEAT IN G PLANE
GAUGE PLANE
0.25
(5.40)
(1.50)
1.27
0.31-0.51 4° ± 4°
DETAIL"A" 0.22±0.03
0.10-0.25
1.25 MIN
1.75 MAX
(1.27) (0.6)
6.0
8.65
3.9
7
14 8
Dimensioning and tolerancing conform to AMSEY14.5m-1994.
Dimension does not include interlead flash or protrusions.
Dimensions in ( ) for Reference Only.
Interlead flash or protrusions sha ll not exceed 0.25mm per side.
Datums A and B to be determined at Datum H.
4.
5.
3.
2.
Dimensions are in millimeters.
NOTES:
1.
The pin #1 indentifier may be either a mold or mark feature.
6. Does not include dambar protrusion. Allowable dambar protrusion
7. Reference to JEDEC MS-012-AB.
shall be 0.10mm total in excess of lead width at maximum condition.
DETAIL "A"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
