Technical Data 4083
Effective June 2017
Supersedes May 2010
Product features
PS04LTVA1
ESD suppressor
•Low trigger voltage and clamping voltage delivers
enhanced ESD protection of very sensitive ICs
•Ultra-low capacitance (0.05pF typ.) ideal for high speed
data applications
•Provides ESD protection with fast response time
(<1ns) allowing equipment to pass IEC 61000-4-2 level
4 test
•Single line, bidirectional device for placement flexibility
•Low profile 0402/1005 design for board space savings
•Low leakage current (<0.1nA typ.) reduces power
consumption
•RoHS compliant, halogen free and lead free for global
acceptance
•Tested to meet automotive specifications (AEC-Q200)
Pb
HALOGEN
HF
FREE
Applications
•Satellite / digital radio
•Mobile phones
•GSM Modules
•HDTV Equipment
•A/V Equipment
•DMB Modules
•Test and measurement
equipment
•Portable game systems
•Personal media players
Packaging
•10,000 pieces in paper tape on 7 inch diameter
(178mm) reel.
Surface Mount Device
•Security equipment
•Broadband network
equipment
•Other RF applications
•High speed data ports
oUSB 2.0/3.0
oIEEE 1394
oDVI
oHigh speed
ethernet
PS04LTVA1 Specifications
Performance Characteristics Value
Rated voltage 5Vdc typical, 12Vdc maximum
Clamping voltage
125V typical
Trigger voltage
2150V typical
Capacitance @ 1MHz 0.05pF typical, 0.15pF maximum
Attenuation change (0-20GHz) -0.2dB typical
Leakage current @ 12Vdc <0.1nA typical
ESD Capability
8kV typical
15kV typical
ESD pulse withstand
1
- IEC 61000-4-2 Direct Discharge
- IEC 61000-4-2 Air Discharge
>1000 pulses typical
1. Per IEC61000-4-2, Level 4 waveform (8kV direct, 30A) measured 30nS after initiation of pulse.
2. Trigger measurement made using Transmission Line Pulse (TLP) method.
3. Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate.
Device Marking
PS04LTVA1 ESD Suppressors are marked on the tape and reel
packages, not individually. Since the product is bi-directional and
symmetrical, no orientation marking is required.
Design Consideration
The location in the circuit for the PS04LTVA has to be carefully
determined. For better performance, the device should be placed
as close to the signal input as possible and ahead of any other
component. Due to the high current associated with an ESD
event, it is recommended to use a “0-stub” pad design (pad
directly on the signal/data line and second pad directly on
common ground).
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved Printed in USA
Publication No. 4083 BU-SB10613
June 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Technical Data 4083
Effective June 2017
PS04LTVA1
ESD suppressor
Dimensions - mm (in)
0.40
(0.016)
2.20
(0.087)
0.70
(0.028)
Recommended Pad Layout - mm (in)
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Peak reflow temperatures and durations:
- IR Reflow = 260°C max for 10 sec. max
- Wave Solder = 260°C max. for 10 sec. max
• Recommended IR Reflow Profile:
Environmental Specifications:
• High Temperature Exposure: MIL-STD-202 Method 108
• Temperature Cycling: 1000 Air to Air cycles -40°C to +125°C JESD22
Method JA-104
•Moisture Resistance Test: MIL-STD-202 Method 106G, 10 cycles
•Biased Humidity: MIL-STD-202 Method 103, 1,000hours +85°C, 85%RH
•Thermal Shock: MIL-STD-202, Method 107G Air-to-Air -55°C to +125°C,
10 cycles
•Vibration Test and Mechanical Shock Test: MIL-STD-202 Method 204 and
Method 213
•Resistance to Solvent: MIL-STD-202 Method 215
•Operating and Storage Temperature Range: -55°C to +125°C
