TGA2533-XCC-500-SM-T/R - TriQuint (Qorvo)

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 1 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

Applications

 Point-to-Point Radio

 Ku-Band VSAT

QFN 5x5mm 24L

Product Features

Functional Block Diagram

 Frequency Range: 12.5 – 15.5 GHz

 TOI: 43dBm

 Power: 34.5 dBm Psat, 33 dBm P1dB

 Gain: 27 dB

 Return Loss: 13 dB

 NF: 6 dB

 Integrated Power Detector

 Bias: Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical

 Package Dimensions: 5.0 x 5.0 x 0.85 mm

General Description

Pin Configuration

The TriQuint TGA2533-SM is a Ku-Band Packaged

Power Amplifier. The TGA2533-SM operates from 12.5

to 15.5 GHz and is designed using TriQuint’s power

pHEMT production process.

The TGA2533-SM typically provides 43dBm of TOI at

20dBm Pout/Tone, 33 dBm of output power at 1dB gain

compression, and the small signal gain is 27 dB.

The TGA2533-SM is available in a low-cost, surface

mount 24 lead 5x5 QFN package and is ideally suited for

Point-to-Point Radio, and Ku-Band VSAT Ground

Terminal.

Lead-free and RoHS compliant.

Evaluation Boards are available upon request.

Pin #

Symbol

1, 2, 3, 5, 6, 9, 12, 13, 14,

15, 17

N/C

4

RF IN

7, 8, 23, 24

Vg

16

RF OUT

10, 11, 20, 21

Vd

18

Vref

19

Vdet

22

GND

Ordering Information

Part No.

ECCN

Description

TGA2533-SM

EAR99

Ku-band Power

Amplifier

TGA2533-XCC-500-SM

TGA2533-SM T/R size = 1000 pieces on a 7” reel.

TGA2533-XCC-500-SM T/R size = 500 pieces on a 7” reel.

1

2

3

9

8

7

4

5

6

12

11

10

18

17

16

15

14

13

22

23

24 19

20

21

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 2 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

Specifications

Absolute Maximum Ratings

Parameter

Rating

Drain Voltage,Vd

+8 V

Gate Voltage,Vg

-3 to 0 V

Drain Current, Id

2.24 A

Gate Current, Ig

-11 to 90 mA

Power Dissipation, Pdiss

17.9 W

RF Input Power, CW, 50Ω,T = 25ºC

27 dBm

Channel Temperature, Tch

200 oC

Mounting Temperature (30 Seconds)

260 oC

Storage Temperature

-40 to 150 oC

Operation of this device outside the parameter ranges given

above may cause permanent damage. These are stress

ratings only, and functional operation of the device at these

conditions is not implied.

Recommended Operating Conditions

Parameter

Min

Typical

Max

Units

Vd

6

7.5

V

Id

1.3

A

Id_drive (Under RF

Drive)

1.7

A

Vg

-0.55

V

Electrical specifications are measured at specified test conditions.

Specifications are not guaranteed over all recommended operating

conditions.

Electrical Specifications

Test conditions unless otherwise noted: 25ºC, Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical.

Parameter

Min

Typical

Max

Units

Operational Frequency Range

12.5

15.5

GHz

Gain 12.7 – 13.3 GHz

14.4 – 15.4 GHz

24

25

27

dB

Input Return Loss

13

dB

Output Return Loss

13

dB

Output Power @ Saturation

34.5

dBm

Output Power @ 1 dB Gain Compression

12.7 – 13.3 GHz

14.4 – 15.4 GHz

32

31

33

dBm

Output TOI @ Pout/Tone = 20 dBm

12.7 – 13.3 GHz

14.4 – 15.4 GHz

39.5

43

dBm

Noise Figure

7

dB

Gain Temperature Coefficient

-0.033

dB/°C

Power Temperature Coefficient

-0.005

dBm/°C

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 3 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

Specifications

Thermal and Reliability Information

Parameter

Condition

Rating

Thermal Resistance, θJC, measured to back of package

Tbase = 85 °C

θJC = 5.76 °C/W

Channel Temperature (Tch), and Median Lifetime (Tm)

Tbase = 85 °C, Vd = 6 V, Id = 1.3 A,

Pdiss = 7.8 W

Tch = 130 °C

Tm = 5.9 E+6 Hours

Channel Temperature (Tch), and Median Lifetime (Tm)

Under RF Drive

Tbase = 85 °C, Vd = 6 V, Id = 1.7 A,

Pout = 34.5 dBm, Pdiss = 7.38 W

Tch = 128 °C

Tm = 7.2 E+6 Hours

1.E+04

1.E+05

1.E+06

1.E+07

1.E+08

1.E+09

1.E+10

1.E+11

1.E+12

1.E+13

1.E+14

25 50 75 100 125 150 175 200

Median Lifetime, Tm, (Hours)

Channel Temperature, Tch, (°C)

Median Lifetime (Tm) vs. Channel Temperature (Tch)

FET3

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 4 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

Typical Performance

25

26

27

28

29

30

31

32

33

34

35

12 12.5 13 13.5 14 14.5 15 15.5 16

Output Power (dBm)

Frequency (GHz)

Power vs. Frequency

Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical, +25 0C

Psat

P1dB

38

39

40

41

42

43

44

45

12 12.5 13 13.5 14 14.5 15 15.5 16

Output TOI (dBm)

Frequency (GHz)

TOI vs. Frequency vs. Pout/Tone

Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical, +25 0C

Pout/Tone = 21dBm

Pout/Tone = 20dBm

Pout/Tone = 19dBm

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

16

18

20

22

24

26

28

30

32

34

36

-10 -8 -6 -4 -2 0 2 4 6 8 10 12 14

Id (A)

Power (dBm, Gain (dB)

Input Power (dBm)

Power, Gain, Id vs. Input Power @ 14 GHz

Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical, +25 0C

Power

Gain

Id

0.01

0.1

1

10

-5 0 5 10 15 20 25 30 35

Vdiff (V)

Output Power (dBm)

Power Detector vs. Pout vs. Frequency

Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical, +25 0C

12.7GHz

13.3GHz

14.4GHz

15.4GHz

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

20

21

22

23

24

25

26

27

28

29

12 12.5 13 13.5 14 14.5 15 15.5 16

Return Loss (dB)

Gain (dB)

Frequency (GHz)

S-Parameters vs. Frequency

Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical, +25 0C

Gain

IRL

ORL

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

10

12

14

16

18

20

22

24

26

28

30

10 11 12 13 14 15 16 17 18

Return Loss (dB)

Gain (dB)

Frequency (GHz)

S-Parameters vs. Frequency

Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical, +25 0C

Gain

IRL

ORL

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 5 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

Typical Performance

-60

-55

-50

-45

-40

-35

-30

-25

-20

-15

-10

14 16 18 20 22 24 26 28

IM3 (dBc)

Pout/Tone (dBm)

IM3 vs. Pout/Tone vs. Frequency

Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical, +25 0C

12.7GHz

13.3GHz

14.4GHz

15.4GHz

-80

-75

-70

-65

-60

-55

-50

-45

-40

-35

-30

14 16 18 20 22 24 26 28

IM5 (dBc)

Pout/Tone (dBm)

IM5 vs. Pout/Tone vs. Frequency

Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical, +25 0C

12.7GHz

13.30GHz

14.4GHz

15.4GHz

0

1

2

3

4

5

6

7

8

9

10

12 12.5 13 13.5 14 14.5 15 15.5 16

Noise Figure (dB)

Frequency (GHz)

Noise Figure vs. Frequency

Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical, +25 0C

20

21

22

23

24

25

26

27

28

29

12 12.5 13 13.5 14 14.5 15 15.5 16

Gain dB

Frequency (GHz)

Gain vs. Frequency vs. Id

Vd = 6 V, Id = 1.1 - 1.3 A, +25 0C

6V 1.3A

6V 1.2A

6V 1.1A

25

26

27

28

29

30

31

32

33

34

35

12 12.5 13 13.5 14 14.5 15 15.5 16

Psat (dBm)

Frequency (GHz)

Saturated Power vs. Frequency vs. Id

Vd = 6 V, Id = 1.1 - 1.3 A, +25 0C

6V 1.3A

6V 1.2A

6V 1.1A

38

39

40

41

42

43

44

45

12 12.5 13 13.5 14 14.5 15 15.5 16

OTOI @ 20dBm Pout/Tone (dBm)

Frequency (GHz)

TOI vs. Frequency vs. Id

Vd = 6 V, Id = 1.1 - 1.3 A, +25 0C

6V 1.3A

6V 1.2A

6V 1.1A

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 6 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

Typical Performance

22

23

24

25

26

27

28

29

30

31

12 12.5 13 13.5 14 14.5 15 15.5 16

Gain (dB)

Frequency (GHz)

Gain vs. Frequency vs. Temperature

Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical

-40C

+25C

+85C

26

27

28

29

30

31

32

33

34

35

36

12 12.5 13 13.5 14 14.5 15 15.5 16

Psat (dBm)

Frequency (GHz)

Psat vs. Frequency vs. Temperature

Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical

-40C

+25C

+85C

26

27

28

29

30

31

32

33

34

35

36

12 12.5 13 13.5 14 14.5 15 15.5 16

P1dB (dBm)

Frequency (GHz)

P1dB vs. Frequency vs. Temperature

Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical

-40C

+25C

+85C

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 7 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

Application Circuit

Vg can be biased from either side (pins 7 and 8 or pins 23 and 24), and the non-biased side can be left open.

Vd must be biased from both sides (pins 10, 11, 20, and 21).

Bias-up Procedure

Bias-down Procedure

Vg set to -1.5 V

Turn off RF supply

Vd set to +6 V

Reduce Vg to -1.5V. Ensure Id ~ 0 mA

Adjust Vg more positive until quiescent Id is 1.3A.

This will be ~ Vg = -0.55 V

Turn Vd to 0 V

Apply RF signal to RF Input

Turn Vg to 0 V

The TGA2533-SM will be marked with the “2533” designator and a lot code marked below the part designator. The “YY”

represents the last two digits of the year the part was manufactured, the “WW” is the work week, and the “XXXX” is an auto-

generated number.

1

2

3

9

8

7

4

5

6

12

11

10

18

17

16

15

14

13

22

23

24 19

20

21 100K Ohms

R1

RF IN

J1

RF OUT

J2

Vg = -0.55 V

Typical

C2 1 uF100 pF C5 100 pF

C3

Vd = 6 V

Id = 1.3 A

C1 1 uF100 pF C4

100K Ohms

R2

+

_6 V

Vdiff

Vdet

Vref

1 uF

C6

2533

YYWW

XXXX

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 8 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

Pin Description

1

2

3

9

8

7

4

5

6

12

11

10

18

17

16

15

14

13

22

23

24 19

20

21

25

Symbol

Description

1, 2, 3, 5, 6, 13, 14,

15, 17

N/C

No internal connection; must be grounded on PCB

4

RF IN

Input, matched to 50 ohms

7, 8, 23, 24

Vg

Gate voltage. ESD protection included; Bias network is required; can be biased

from either side (pins 7 and 8 or pins 23 and 24), and non-biased side can be left

opened; see Application Circuit on page 7 as an example.

9, 12

N/C

No internal connection. Can be grounded on PCB or left open

10, 11, 20, 21

Vd

Drain voltage. Bias network is required; must be biased from both sides; see

Application Circuit on page 7 as an example.

16

RF OUT

Output, matched to 50 ohms

18

Vref

Reference diode output voltage.

19

Vdet

Detector diode output voltage. Varies with RF output power.

22

GND

Internal grounding; can be grounded on PCB or left open

25

GND

Backside Paddle. Multiple vias should be employed to minimize inductance

and thermal resistance; see Mounting Configuration on page 11 for suggested

footprint.

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 9 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

Applications Information

PC Board Layout

Top RF layer is 0.008” thick Rogers RO4003, єr = 3.38. Metal layers are 1-oz copper.

Microstrip 50 Ω line detail: width = 0.0175”.

The pad pattern shown has been developed and tested for optimized assembly at TriQuint

Semiconductor. The PCB land pattern has been developed to accommodate lead and

package tolerances. Since surface mount processes vary from company to company, careful

process development is recommended.

For further technical information, refer to the TGA2533-SM Product Information page.

C1

C4

C5

C6

R1

R2

Vg

GND

NC

Vd

GND

NC

Vd

Vref

NC

Vdet

GND

C2

C3

Bill of Material

Ref Des

Value

Description

Manufacturer

Part Number

C1, C2, C3

100 pF

Cap, 0402, 50V, 5%, COG

various

C4, C5, C6

1 uF

Cap, 0603, 25V, 5%, X5R

various

R1, R2

100K Ohms

Res, 0603, 1/16W, 5%, SMD

various

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 10 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

Mechanical Information

Package Information and Dimensions

All dimensions are in millimeters.

This package is lead-free/RoHS-compliant with a copper alloy base (CDA194), and the plating material on the leads is 100%

matte Sn. It is compatible with both lead-free (maximum 260 °C reflow temperature) and tin-lead (maximum 245 °C reflow

temperature) soldering processes.

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 11 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

.675

Mechanical Information

Mounting Configuration

All dimensions are in millimeters (inches).

Notes:

1. A heatsink underneath the area of the PCB for the mounted device

is recommended for proper thermal operation.

2. Ground / thermal vias are critical for the proper performance of this device.

Vias have a final plated thru diameter of .40 mm (.016”).

Tape and Reel Information

Tape and reel specifications for this part are also available on the TriQuint website in the “Application Notes” section.

Standard T/R size = 500 pieces on a 7 x 0.5” reel.

CARRIER AND COVER TAPE DIMENSIONS

Part

Feature

Symbol

Size (in)

Size (mm)

Cavity

Length

A0

0.207

5.25

Width

B0

0.207

5.25

Depth

K0

0.043

1.10

Pitch

P1

0.315

8.00

Distance Between Centerline

Cavity to Perforation

Length Direction

P2

0.079

2.00

Cavity to Perforation

Width Direction

F

0.217

5.50

Cover Tape

Width

C

0.374

9.5

Carrier Tape

Width

W

0.472

12.0

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 12 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

Product Compliance Information

ESD Information

ESD Rating: Class 0

Value: ≥ 200 V and < 250 V

Test: Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

Solderability

Compatible with the latest version of J-STD-020, Lead

free solder, 260°C

This part is compliant with EU 2002/95/EC RoHS

directive (Restrictions on the Use of Certain Hazardous

Substances in Electrical and Electronic Equipment).

This product also has the following attributes:

 Lead Free

 Halogen Free (Chlorine, Bromine)

 Antimony Free

 TBBP-A (C15H12Br402) Free

 PFOS Free

 SVHC Free

MSL Rating

Level MSL1 at +260 °C convection reflow

The part is rated Moisture Sensitivity Level MSL1 at 260°C per

JEDEC standard IPC/JEDEC J-STD-020.

ECCN

US Department of Commerce: EAR99

Recommended Soldering Temperature Profile

TGA2533-SM

Ku-Band Power Amplifier

Data Sheet: Rev G 02/22/16

- 13 of 13 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network®

Contact Information

For the latest specifications, additional product information, worldwide sales and distribution locations, and information about

TriQuint:

Web: www.triquint.com Tel: +1.972.994.8465

Email: info-sales@tqs.com Fax: +1.972.994.8504

For technical questions and application information:

Email: info-networks@tqs.com

Important Notice

The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained

herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint

assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained

herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with

the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest

relevant information before placing orders for TriQuint products. The information contained herein or any use of such

information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property

rights, whether with regard to such information itself or anything described by such information.

TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining

applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.