MURB1660CTG, MURB1660CTT4G, NRVUB1660CTT4G SWITCHMODE Power Rectifier http://onsemi.com D2PAK Power Surface Mount Package These state-of-the-art devices are designed for use in switching power supplies, inverters, and as free wheeling diodes. ULTRAFAST RECTIFIER 16 AMPERES, 600 VOLTS Features Package Designed for Power Surface Mount Applications Ultrafast 60 Nanosecond Recovery Times 175C Operating Junction Temperature Epoxy Meets UL 94 V-0 @ 0.125 in High Temperature Glass Passivated Junction High Voltage Capability to 600 V Low Leakage Specified @ 150C Case Temperature Short Heat Sink Tab Manufactured - Not Sheared! Similar in Size to Industrial Standard TO-220 Package AEC-Q101 Qualified and PPAP Capable NRVU Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements Pb-Free Packages* D2PAK CASE 418B STYLE 3 1 4 3 MARKING DIAGRAM AY WW U1660G AKA Mechanical Characteristics: Case: Epoxy, Molded, Epoxy Meets UL 94 V-0 Weight: 1.7 Grams (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: Machine Model, C > 400 V Human Body Model, 3B > 8000 V A Y WW U1660 G AKA = Assembly Location = Year = Work Week = Specific Device Code = Pb-Free Package = Diode Polarity ORDERING INFORMATION Device MURB1660CTG Package Shipping D2PAK 50 Units/Rail (Pb-Free) MURB1660CTT4G D2PAK (Pb-Free) 800 / Tape & Reel NRVUB1660CTT4G D2PAK (Pb-Free) 800 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 - Rev. 8 1 Publication Order Number: MURB1660CT/D MURB1660CTG, MURB1660CTT4G, NRVUB1660CTT4G MAXIMUM RATINGS (Per Leg) Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 600 V Average Rectified Forward Current (Rated VR, TC = 150C) Total Device IF(AV) 8.0 16 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 150C) IFM Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Operating Junction and Storage Temperature Range A 16 A 100 TJ, Tstg -65 to +175 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS (Per Leg) Symbol Value Unit Maximum Thermal Resistance, Junction-to-Case RqJC 2.0 C/W Maximum Thermal Resistance, Junction-to-Ambient (Note 1) RqJA 50 C/W TL 260 C Symbol Max Unit Rating Temperature for Soldering Purposes: 1/8 from Case for 5 Seconds 1. See Chapter 7 for mounting conditions. ELECTRICAL CHARACTERISTICS (Per Leg) Characteristic Maximum Instantaneous Forward Voltage (Note 2) (iF = 8.0 Amp, TC = 150C) (iF = 8.0 Amp, TC = 25C) vF Maximum Instantaneous Reverse Current (Note 2) (Rated dc Voltage, TC = 150C) (Rated dc Voltage, TC = 25C) iR Maximum Reverse Recovery Time (IF = 1.0 Amp, di/dt = 50 Amp/ms) (IF = 0.5 Amp, iR = 1.0 Amp, IREC = 0.25 Amp) trr V 1.20 1.50 mA 500 10 ns 60 50 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. 10 K 20 1.0 K 400 I R, REVERSE CURRENT (A) i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 100 50 TJ = 150C 10 25C 5.0 2.0 100C 1.0 TJ = 150C 10 100C 2.0 1.0 0.4 25C 0.1 0.04 0.3 0.1 100 40 0.01 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 100 vF, INSTANTANEOUS VOLTAGE (V) 200 300 400 500 VR, REVERSE VOLTAGE (V) Figure 1. Typical Forward Voltage, Per Leg Figure 2. Typical Reverse Current, Per Leg http://onsemi.com 2 600 10 PF(AV), AVERAGE POWER DISSIPATION (WATTS I F(AV), AVERAGE FORWARD CURRENT (AMPS) MURB1660CTG, MURB1660CTT4G, NRVUB1660CTT4G RATED VR APPLIED RqJC = 2C/W 9.0 8.0 DC 7.0 6.0 5.0 4.0 SQUARE WAVE 3.0 2.0 1.0 0 140 150 180 160 170 TC, CASE TEMPERATURE (C) 14 13 12 11 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 SQUARE WAVE DC TJ = 175C 0 1 9 10 Figure 4. Power Dissipation, Per Leg 1.0 D = 0.5 0.5 0.2 P(pk) 0.1 0.1 0.05 0.01 ZqJC(t) = r(t) RqJC D curves apply for power pulse train shown read time at T1 t1 0.05 t2 Duty Cycle, D = t1/t2TJ(pk) - TC = P(pk) ZqJC(t) SINGLE PULSE 0.02 0.01 0.01 0.02 0.05 0.1 0.2 0.5 1 2 5 10 20 50 t, TIME (ms) Figure 5. Thermal Response 1K 300 C, CAPACITANCE (pF) r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED Figure 3. Current Derating, Case, Per Leg 2 3 4 5 6 7 8 IF(AV), AVERAGE FORWARD CURRENT (AMPS) TJ = 25C 100 30 10 1 10 VR, REVERSE VOLTAGE (V) Figure 6. Typical Capacitance, Per Leg http://onsemi.com 3 100 100 200 500 1K MURB1660CTG, MURB1660CTT4G, NRVUB1660CTT4G PACKAGE DIMENSIONS D2PAK 3 CASE 418B-04 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B-01 THRU 418B-03 OBSOLETE, NEW STANDARD 418B-04. C E V W -B- 4 1 2 A S 3 -T- SEATING PLANE K J G D W H 3 PL 0.13 (0.005) DIM A B C D E F G H J K L M N P R S V M T B VARIABLE CONFIGURATION ZONE M N R P L M L M M F F F VIEW W-W 1 VIEW W-W 2 VIEW W-W 3 SOLDERING FOOTPRINT* 10.49 8.38 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4 MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE U L INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 MURB1660CTG, MURB1660CTT4G, NRVUB1660CTT4G ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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