Ver. 201306
Part no. Size
(inch/mm) Inductance
(uH)@1MHz DC
Resistance()Rated Current (A)
1
Typ.
Rated Current (A)
2
Max. Typ.
CIG22H1R0MNE 1008/2520 1.0 ±20 % 0.080±25 % 3.3 1.5 2.0
CIG22H1R2MNE 1008/2520 1.2 ±20 % 0.094±20 % 2.8 1.5 1.9
CIG22H1R5MNE 1008/2520 1.5 ±20 % 0.104±20 % 2.4 1.5 1.6
CIG22H2R2MNE 1008/2520 2.2 ±20 % 0.116±20 % 1.8 1.2 1.6
CIG22H3R3MNE 1008/2520 3.3 ±20 % 0.133±20 % 1.0 1.0 1.5
CIG22H4R7MNE 1008/2520 4.7 ±20 % 0.233±20 % 0.95 0.8 1.0
Rated Current (A)
1
:DC current value when Inductance dropsto 30% of nominal Inductance value (ONLY REFERENCE)
Rated Current (A)
2
:DC current value when the self-generation of heat risesto 40(Reference ambient temperature:25)
Operating temperature range: 40 to +125°C (Including self-temperature rise)
Test equipment: Agilent :E4991A+16092A
1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.)
FEATURES
APPLICATION
CHARACTERISTIC DATA
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
DIMENSION
TYPE Dimension [mm]
L W T D
22 2.5±0.2 2.0±0.2 1.1±0.1 0.55±0.25
DESCRIPTION
Multilayer Power Inductor
RECOMMENDED LAND PATTERN
CIG22H Series (2520/ EIA 1008)
High Current Type
Low DC resistance
Magnetically shielded structure
Free of all RoHS-regulated substances
Monolithic structure for high reliability
Ver. 201306
CI G 22 H 1R0 M N E
(1) (2) (3) (4) (5) (6) (7) (8)
(1) Chip Inductor (2) Power Inductor
(3) Dimension (4) Product Series (H:High Current Type)
(5) Inductance (1R0:1.0uH) (6) Tolerance (M:±20%)
(7) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(8) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping 2,500
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW SOLDERING FLOW SOLDERING
Any data in this sheet are subject to change, modify or discontinue without notice.
The data sheets include the typical data for design reference only. If there is any question
regarding the data sheets, please contact our sales personnel or application engineers.