= BAT MRSS se MULTILAYER CHIP CERAMIC CAPACITOR Banta BAs HRESHHRMRESELES RA RMRESRN LEH, BEML, HIRATA SIE IRM -BRAR THE, SRNR. PEREATREMS, BATSERREBAR, TSR ETRE. o Flt * BERGE. * Bivh, BEER, EERBERT LE. * AREA eee. * RATE R:) ArT EE HeteR \|\RAREBEA | ARR < 1000V 1. Stee | =50mA 5S 1000V ~ 2000V | 1.2(888E BM) 50mA 5S > 2000V 1. 23ReEBE; 10mA 5S A * FA{FDC-DCRREHWA iG. * AFER. SSR ARAN SKRKARRM Rls. * AFORE SSeeSRL. Emme a RAR IK 1206 CG 100 J 202 N T TO OT T- T TT TT T @ ) @ ORT ON HER OBESE (PP) Ome= Mal alge | select) | 204 ER) | Peat RAK | BEM ie | BR 0603} 0.60 0.30 | 1.60 x 0.80 CG | COGERNPO 100 | 10x10 J +5% 0805 | 0.08 0.05] 2.00 1.25 B X7R 101 10x 10' K +10% 1206 | 0.12 0.06] 3.20 1.60 F Y5V 102. | 10x10" 1210] 0.12x0.10| 3.20x 2.50 1808] 0.18x0.08| 4.50 x 2.00 1812| 0.180.12] 4.50 3.20 2225 | 0.220.25| 5.70 6.30 OLS E tm GRAS) OBA RTAK | PELE RRA TER RAK Ase 6R3 6.3V S | RG Se AR 500 50V Cc Aish Ta space 101 100V N =pemn SAR Ree ( Sane A/a) 65MbBBzei BDC Medium-voltage MLCC DC medium-voltage MLCC has good high-voltage reliability, it is made in special * %* * design that based on the MLCC technology and equipmenis. It is suitable for surface- mounting , can improve the properties of circuits. Features New monolithic structure The size of the capacitor is small, yet has high electrostatic capacitance, can operate at high-voltage levels. Has good solderability. Technology Parameter (refer to the picture below): Rated Voltage |Measuring Condition] Max. charging current] Measuring Time <=1000V 1. 5XUr. 5OmA 5S 1000V~2000V 1. 2xUr. 50mA 58 22000V 1. 2XUr. 10mA 5S Applications: DC-DC converter.. The circuit filter and vibration bell of telephone, electrograph and modem. Snubber circuit for switching power supply. Product Part Number Expression: 66 1206 CG 100 J 202 N T To OT OT TO OT TT T @ @ @ @Dimensions @Dielectric @Normal @Capacitance Type Capacitance(PF) Tolerance Type | British Metric " ; - (Inch) (mm) Code |} Dielectric Expression) Actual Code} Tolerance Material Method Value 0603] 0.60 X0.30/ 1.60.8 5 J +5% CG |COG or NPO 100 10x10 0805] 0.08X0.05/ 2.01.25 7 K +10% B X7R 101 10x10 1206] 0.12xX0.06|3.2x*1.6 2 F Y5V 102 10x10 1210] 0.12X0.10]3.2x2.5 1808] 0.18X0.08| 4.52.0 1812|0.18X0.12|4.5X3.2 2225] 0.22 X0.25/5.7X6.3 Rated Voltage Termination Type @Package Method i Expression| Termination Material Expression : ENR oiesee | Vsti. Method Method eee Ss Pure Silver NOMARKS Bulk Packagin 6R3 6.3V u Iv ina Bag ging Pi 500 50V Cc ure Copper T Taping Packaging N Three Layers Platin : 10" 100V Terminal (Silver or g B Bulk Plastic Copper layer/ Nickel Box Packaging layer /Tin layer)= BAT MRSS se MULTILAYER CHIP CERAMIC CAPACITOR SER Re Rt( mm) Rilzn | QelRT L W T WB 0603 1608 1.6040.10 | 0.8040.10 | 0.8040.10 | 0.30+0.10 0805 2012 2.00+0.20 | 1.2540.20 | 0.80+0.10 | 0.504+0.25 1.00+0.10 1.25+0.20 1206 3216 3.20+0.30 | 1.60+0.20 | 0.80+0.10 | 0.50+0.25 1.00+0.10 1.25+0.20 1210 3225 3.204+0.30 | 2.50+0.20 2.5 0.50+0.25 1808 4520 4.50+0.40 | 2.00+0.20 <2.0 0.50 +0.10 1812 4532 4.50+0.40 | 3.20+0.30 2.5 0.50+0.10 2225 | 5763 | 5.70+0.50| 6301050] <25 | 1.0+0.25 ESEKE oa eee F) A | ee) ReRME Pr) NPO X7R Y5V NPO X7R Y5V 0603] 100 | 0.5~820 100~10, 000] 2, 200~100,000 |1808) 2000 | 10~470 150~10,000 | = ------ 200 | 0.5~470 100~6,800 | ------- 3000 | 10~470 150~2,200 | ------ 0805} 100 | 0.5~1,500 | 150~100,000 | 10,000 ~ 100,000 4000 | 10~220 150~1,000 ~| = ----- 200 | 0.5~1,500 | 150~22,000 | 10,000 ~ 56,000 5000 | 10 ~22 250 | 0.5~1,500 | 150~22,000 | 10,000 ~ 56,000 1812] 100 | 10~10,000} 150~330,000 | 10,000 ~ 1,000,000 500 | 0.5~560 150~10,000 | ------ 200 |10~5,600 | 150~150,000 {10,000 ~ 470,000 1206; 100 | 0.5~3,300 | 150~220,000] 10,000 ~ 330, 000 250 |10~5,600 | 150~150,000 |10,000 ~ 470,000 200 | 0.5~2,700 | 150~120,000) 10, 0OO~150, 000 500 |10~3,900 | 150~120,000 | ~ ------ 250 | 0.6~2,700 | 150~ 120,000) 10, 000~150, 000 1000 |10~1,200 | 150~27,000 | ~ ------ 500 | 0.56~1,500 |150~33, 000) ~ ------ 2000 | 10~680 150~12,000 | ------ 1000 | 0.5~750 150~10,000} ~_ ------ 8000 | 10~470 150~4,700 | ------ 2000 | 0.5~270 150~2,200 | ------ 4000 | 10~ 220 150~3,300 | ------ 1210] 100 | 10~4,700 | 150~470,000} 10,000 ~ 820,000 5000 | 10~68 200 | 10~3,300 | 150~220,000] 10,000~470,000 |2225} 100 | 10~27,000} 150 ~ 1,000,000 | 10,000 ~ 2,000,000 250 | 10~3,300 | 150~220,000] 10,000 ~ 470,000 200 |10~12,000|) 150~470,000 |10,000~ 680,000 500 | 10~2,200 |150~33,000 | ~ ------ 250 | 10~12,000) 150~470,000 |10,000 ~680,000 1000 | 10~1,000 |}150~10,000 | ~ ------ 500 |10~6,800 | 150~330,000 | ~ ------ 2000 | 10~470 150~6,800 | ------ 1000 |10~2,200 | 150~56,000 | ~ ------ 1808) 100 | 10~4,700 | 150 ~ 220,000} 10,000 ~ 820,000 2000 | 10~1,000 | 150~33,000 |); ~ ------ 200 | 10~3,300 | 150~ 100,000} 10,000 ~ 390,000 3000 | 10~680 150~12,000 | = ------ 250 | 10~3,3800 | 150~ 100,000) 10,000 ~ 390,000 4000 | 10~560 150~10,000 | = ------ 500 | 10~1,800 |150~56,000 | ~ ------ 5000 | 10~120 150~3,300 | = ------ 1000 | 10~820 150~15,000 | = ------ 67MbBBzei e Outside Dimension Type Dimension (mm) British . ee 7 on + ve expression| expression 0603 1608 1.6040.10 | 0.8040.10 | 0.8040.10 | 0.30+0.10 0805 2012 2.00+0.20 | 1.2540.20 | 0.80+0.10 | 0.50+0.25 1'350.20 1206 3216 3.20+0.30 | 1.6040.20 1900-16 0.50+0.25 1210 3225 3.20+0.30] 2.50+0.20 <2.5 0.50+0.25 1808 4520 4.50+0.40] 2.00+0.20 <2.0 0.50+0.10 1812 4532 4.50+0.40 | 3.20+0.30 <2.5 0.50+0.10 2225 5763 5.70+0.50 | 6.30+0.50 <2.5 1.0+0.25 e Capacitance Range Size| Rated Capacitance Range(pf) Size| Rated Capacitance Range(pf) Voltage oltage NPO X7R Y5V NPO X7R Y5V 0603} 100v | 0.5~820 |100~10, 000] 2, 200~100,000 |1808) 2000v| 10~470 150~10,000 | ~ ------ 200v | 0.5~470 |100~6,800 | ~ ------- 3000v | 10~470 150~2,200 | ------ 0805} 100v | 0.5~1,500 |150~ 100,000 | 10,000 ~ 100,000 4000v | 10 ~ 220 150~1,000 | 9 --.- 200v | 0.5~1,500 }150~22,000 | 10,000 ~ 56,000 5000v | 10 ~ 22 250v | 0.5~1,500 }150~22,000 | 10,000 ~ 56,000 1812] 100v | 10~10,000) 150~330,000 {10,000 ~ 1,000,000 500v | 0.5~560 |150~10,000 | ------ 200v |} 10~5,600 | 150~150,000 | 10,000 ~ 470,000 1206 |} 100v | 0.5~3,300 |150 ~ 220,000 | 10,000 ~ 330, 000 250v |} 10~5,600 | 150~150,000 | 10,000 ~ 470,000 200v | 0.5~2,700 }150~ 120,000 | 10, 000~ 150, 000 500v | 10~3,900 | 150~120,000 | ~ ------ 250v | 0.6~2,700 }150~120,000/ 10, 000~150, 000 1000v|10~1,200 | 150~27,000 | ~ ------ 500v | 0.5~1,500 }150~33, OOO; ~~ ------ 2000v | 10 ~ 680 150~12,000 | ------ 1000v} 0.5~750 |150~10,000| ~ ------ 3000v |} 10 ~ 470 150~4,700 | ------ 2000v| 0.5~270 |150~2,200 | ~~ ------ 4000v | 10 ~ 220 150~3,300 | ------ 1210} 100v | 10~4,700 |150~ 470,000 | 10,000 ~ 820,000 5000v | 10 ~68 200v | 10~3,300 |150~220,000 | 10,000~470,000 |2225) 100v | 10~27,000] 150 ~ 1,000,000 |10,000 ~ 2,000,000 250v | 10~3,300 |150~ 220,000 | 10,000 ~ 470,000 200v | 10~12,000] 150~470,000 | 10,000 ~680,000 500v | 10~2,200 }150~33,000 | = ------ 250v | 10~12,000} 150~470,000 | 10,000 ~ 680,000 1000v} 10~1,000]150~10,000 | ~ ------ 500v |} 10~6,800 | 150~330,000 | ~ ------ 2000v| 10~470 150~6,800 | ------ 1000v|}10~2,200 | 150~56,000 | ~ ------ 1808} 100v | 10~4,700 |150~220,000 | 10,000 ~ 820,000 2000v;}10~1,000 | 150~33,000 | ~ ------ 200v | 10~3,300 |150~ 100,000 | 10,000 ~ 390,000 3000v | 10 ~ 680 150~12,000 | ~= ------ 250v | 10~3,300 |150~ 100,000 | 10,000 ~ 390,000 4000v | 10 ~ 560 150~10,000 | ------ 500v | 10~1,800 |150~56,000 | ------ 5000v | 10~ 120 150~3,300 | = ------ 1000v) 10~820 150~15,000 | ~ ------ 68= BAT MRS Sse MULTILAYER CHIP CERAMIC CAPACITOR IgA YSV RBA Rt 0603 0805 1206 1210 1812 2225 Se 100 | 100 } 200 |250 |100 | 200} 250 | 100 |200 |250 |100 |200 | 250 | 100] 200 |} 250 BAe 1000PF 1.5nF 2.2nF 3.3nF 4.7NF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 820nF THF 2.2uF 4.7uF 10uF 77MbBBzei Item Y5V Medium-voltage MLCC niece 0603 0508 4206 1210 1812 2225 Rated Volatage(V) 100 | 100 | 200 |} 250 |100 | 200 | 250 | 100} 200 | 250 | 100 | 200] 250 | 100} 200 | 250 Capacitance 1O00PF 1.5nF 2.2nF 3.3nF 4.7NF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 820nF Tyr 2.2uF 4.7 uF 1OuF 78= BAT MRS Sse MULTILAYER CHIP CERAMIC CAPACITOR BERR BYSVA SA Staats ah ja HE HRA 1 TiHfaee ew -25C~85C 1. AeA Ae. FED < 1045 EARS TRE. 2. RA BG tis eez. 3. AAS) Se Be, 2 FLA. 2 Shea 4. EB PSE IR FL i), BGR RAS. 5 iy EB i EAE (EA Se HE FH MOR EW. 3 Rt FRERTSBA XAFS RRR. 4 ZA GHEREREA <A ES: HP4278A@#, HP428484, ABU E: TBE: 250 +5C, 5) fB# A BY(D.F.) < 500 x 10 4 38 E:30% ~ 75%, 2. jAllat 1.0 + 0.2V, 3.78 RYHZE 1.0 + 0.1kHz, Talat eee: C <25nF,IR > 40000MQ 2G a BA Ra A (BN: S251 1 ARR). 6 s sR IR) | Coa6nF,R x C> 5008 BLA ae: HEAR LER, 60 + 5 HA BAe EY. BX ie EE RARE SI HR 7 | SRE fit A{B>300V 100V 50mA 5S iit B{e>400V 200V 50mA 5S iit @ B(B>500V 250V 50mA 5S KBE TIARE: i277 150+0/-10'C RURIE 60 + 54) 8 aeeEe8et ELRERRAT ARR Stine $8, ARES IRE TAS 24 + 2 NR. Sam AREX K-25 ~SSCREARRERE, KA EAEF25C PRN S SEER ERE A. XPERRRECRUMBAGH. RARA 9 Fy EE 75% in ARS Bin #AHa235 + 5C ( #Hh245 +5C) MIRA WH 240.5%), BARE: 25+2.5mm/F, 91MbBBzei WiGeneral Y5V MLCC reliability test method Number] Item Standard Test Method Operating -25C~85C 1 Temperature Range Appearance 1.Good ceramic body color %* Check by using microscope= X 10. continuity. 2.The chips have no visualdamages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 5 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width. 3 Dimensions Within the specified dimensions %Using micrometer or vernier calipers 4 Capacitance) Within the specified tolerance %Measuring Equipments: HP4278 capacitance meter, Dissipation < -4 HP4284 capacitance, Factor (DF) =500X 10 % Measuring Conditions: 1.Measuring Temperature: 5 25C+5C. Humidity: 30%~75%. 2.Measuring Voltage: 1.0+0.2vV. 3.Measuring Frequency: 1.0+0.1KHz Insulation C<25nF,IR240000M % Measuring Equipment: Resistance C>25nERXC2500S Insulation resistance meter , (such as Sf2511 insulation 6 resistance). %Measuring Method: Must measure at rated voltage, and measure the IR within 60+ 5seconds. Withstanding Requirement Ur Max. Current | Measuring Time Voltage g >1.5Ur <1000V 50mA 5S 7 >1.2Ur 1000V~2000V| 50mA 5S >1.2Ur 2=2000V 10mA 5S Capacitance Must meet the capacitor First, pre-heat: heat treat GO+5 minutes at Temperature temperature 150+0/-10C, then set it for 24+2 hours at Characteristics | coefficient requirements room temperature. 8 within the operating Measure the capacitance at 55~125C or temperature range. 55~85'C,the capacitance change ratio comparing to that of 25C must be within the specified range. Solderability 75% of the outer electrode should | Dip the capacitor into ethanol or colophony be covered by Tin solution,and then dip it into 235+5C(or 9 245+5C leadless eutectic solder solution) eutectic solder solution hanging lead for 2+0.5seconds. Dipping speed: 25+2.5mm/second. 92= BAT MRS Sse MULTILAYER CHIP CERAMIC CAPACITOR Si ie ia BE AURA Spt FAA BARI SIE IARI: 3677 150+0/-10C ee eenewx | a1 30%6mA eons $38, RES PE 24 +2 , KXKRERTRARSSE. HERHRA D-F. Fala ee 2652 5C AEAHSSBIHE 1021. BE LR. ae SBE PAB 24 + 2 be, ARETE. 10 | TERS JBAGEE: 25+ 2.5mm/#, x TARMEAESI PREZ aE Fed 1 |100c120 | 14}48 2 |170c200 | 14}48 XPHRARSRESSSEAR 1 HATA HmRA( BBR SHRI) Lb. ARIE BAA Mea 10N AY). HE RERE TI FASE REREAKIET, MARES, We Ey STARS HRA RSARAR. 11 in SS A ee ARE HH Fein SRS SE CaP. |<} 10N,10 + 12 REE:1.0mm/#b iaie Sag an Bd SiR RR XS E S RISE ERIBIICR ( BORSA) L. nee SERRE SEE A CARMATE, KIER 1.5mm, RE D.F. asa ZEIRU1055Hz 2 4 He. SARERE I ( HE10 Z55HzRiRE] 10Hz) BHAIDSATR. Tel BEA RBEA Sie 72 ( Meat 6 eR). 12 | iitaRetE 2 XARA RESASEER 3 HATHA AB (BRS ) Lb, ARE 4 PHA 13 | dvd tee AR ig tH ER ok BRB DA. REF ASCE RARE, BRIER, EES SERS HRREGeS RRIAR. 93MbBBzei Number] Item Standard Test Method 10 Resistance to Soldering Appearance No defects visible Cap. Change/Z5U, Y5V: within +30% ratio DF Same as original spec. IR Same as original spec. First pre-heat: heat treat for 60+5 minutes at 150+0/-10C, then set it for 24+2 hours at room temperature. *XxThen pre-heat the capacitance according to the following chart. Dip the capacitor into 265+5C eutectic solder solution for 10+1s. Then set it for 2442 hours at room temperature, then measure. Dipping speed: 25+2.5mm/second. %* Preheat conditions: Stage |Temperature 1 100C1 20C 2 170C200C Time 1Tminute iminute 11 Adhesive Strength of Termination No removal of the terminations or other defects shall occur * Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder. Then apply a 10N force in the direction shown as the arrowhead. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. Se 10N,10+1s tN Speed:1.Omnvs A . Fig. Giss epoxy resinooard 12 Resistance to Soldering Appearance No defects visible or abnormities Capacitance Within the specified tolerance range D.F. Same as original spec. Solder the capacitor to the test jig Glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours). Fig.2 13 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. 94= BAT MRS Sse MULTILAYER CHIP CERAMIC CAPACITOR Aa aie JAB Be BATE au 5000 3) Be AE: 1. Omm,/# A | ima b 4. Smm R230 te [} 9 =T". i: 1mm SS y fa (BREAN HA 13 re eh PERE + room 7 amm, amm Fas Fad LXW Fish (mm) (mm) a b c d 4.5X2.0]3.5|/7.0]2.4 4.5X3,.2]3.5|7.0/3.7]1.0 5.7%6.314.5]8.0]5.6 J i er Re = mB] RCC) | RAC min) gre =| Bean 1 | @erTtae+3 | 3023 2 Bin 2-3 D.F sae 3 | BS Lie +2 30+3 14 in= (pie LR. Agee 4 ia 2-3 Spe FRR KE 40 + 27H 9095% BREET ME 500+24/-0/)\BF, axe Ze + 30% Ra HAC HE SR RRS 48 + 2 hee, IATA. ay 3B 15 | iRBERERE) D.F. Ramee LR. Fae SB FRR RR BAB FE + 30% A tices 3K ZE_L ORR AEB MeO 5 (SAUSESE TE MEE 1000 + 12/\B, FE 16 | ear MESRABIBSOMA, HABHASBRE TREE D.F Fase 48 +2 /\RF, 1E(THIE. LR sae 95MbBBzei Number Item Standard Test Method Bending mm Force adding Resistance oo speed: 1. Onm/ i ma) | Force adding b 64. 5mm R230 NY , - Ika S Flexure:S1 13 AS al N\ Capagi tance tS 100mm Fig. 3 Fig. 4 LXW Dimension (mm) a b c d 4.5X2.0]3.5]7.0] 2.4 4.5X3.2}3.5|7.0]3.7]1.0 5. 7X6.3]4.5|8.0]5.6 Temperature /Appearance No defects Stage Temperature CC) Time (min. ) Cycle abnonrmities 1 |Min. Operating Temperature+3] 3043 a: 2 Room Temperature 23 Cap. Change] Within=+2.5 rai g 3 |Max. Operating Temperature 2 3043 4 Room Temperature 23 14 D.F. Same as original spec. LR. Same as original spc. Humidity Appearance No defects or Set the capacitor for 500+24/-0 hours at the Steady __ condition of 40+2C and 90-95% humidity. Then remove State Cap. Change| Within 380% | and set it for 24+2 hours at room temperature, then ratio measure. Same as 15 DF. original spec. IR Same as ue original spec. Life Test Appearance | No defects or | Apply 1.5 times rated voltage to the capacitor for abnonnmities 1000+12 hours at the upper temperature limits, the Cap. Change} within +30% charging current should be less than 50MA. Remove ratio and set it for 24+2 hours at room temperature, 16 DEF. Same as then measure. original spec. LR. Same as original Spec. 96Bek 0 ns Rae = Rr ese MULTILAYER CHIP CERAMIC CAPACITOR * JAA 0402,0603, 0805, 12006 FH RTERHWRERT Kak * A B c D E F G H J T A AS 0402 0.65 | 115 | 8.00 | 350 | 1.75 | 2.00 | 2.00 | 4.00 | 1.50-0/ | (+ +0.10 | +0.10 | +0.10 | 0.05 | 0.10 | +0.05 | +0.05 | +0.10 | +0.10 | 0.80 0603 1.10 | 1.90 | 8.00 | 3.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (RF 0.20 | +0.20 | +0.20 | +0.05 | +0.10 | 0.10 | +0.10 | +0.10 | +0.10 1.10 0805 1.45 | 2.30 | 8.00 | 3.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (+ +0.20 | +0.20 | +0.20 | +0.05 | +0.10 | +0.10 | +0.10 | +0.10 | +0.10 1.10 1006 1.80 | 3.40 | 8.00 | 3.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (RF 0.20 | +0.20 | +0.20 | +0.05 | 0.10 | +0.10 | +0.10 | +0.10 | +0.10 1.10 137Maze Mi Package e Paper Tape Taping Top cover tape Carrier tape(paper) Polyatyrene reel S Cavity for chip Dimensions of paper take taping for0402,0603, 0805, 1206 Sprocket Hole J Cavity for chip Code * A B Cc D E F G H J T Paper size 0402 0.65 | 1.15 8.00 | 3.50 1.75 2.00 | 2.00 | 4.00 | 1.50-0/ | Below +0.10 | +0.10 +0.10 +0.05 |} +0.10 +0.05 | +0.05 +0.10 +0.10 0.80 0603 1.10 | 1.90 8.00 | 3.50 1.75 4.00 | 2.00 | 4.00 | 1.50-0/ | Below +0.20| +0.20 | +0.20] +0.05] +0.10 | +0.10] +0.10 | +0.10| +0.10 1.10 0805 1.45 | 2.30 8.00 | 3.50 1.75 4.00 | 2.00 | 4.00 | 1.50-0/ | Below +0.20| +0.20 | +0.20] +0.05|] +0.10 | +0.10] +0.10 | +0.10| +0.10 1.10 1.80 | 3.40 8.00 | 3.50 1.75 4.00 | 2.00 | 4.00 | 1.50-0/ | Below 1206 +0.20] +0.20 | +0.20] +0.05] +010 | +010] +0.10 | +0.10] +0.10 1.10 138Bex 0 ns Rae = Rr ese MULTILAYER CHIP CERAMIC CAPACITOR ait * A B c D E F G H J T AR Hs BA 0805 1.55 | 2.35 | 8.00 | 3.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (EF 0.20 | 40.20 | +0.20 | +0.05 | +0.10 | 40.10 | +0.10 | 0.10 | +0.10 1.50 1206 1.95 | 3.60 | 8.00 | 3.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (+ 0.20 | 40.20 | +0.20 | +0.05 | +0.10 | +0.10 | #0.10 | 0.10 | +0.10 1.85 1240 2.70 | 342 | 8.00 | 3.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (+ 0.10 | 40.10 | 0.10 | 40.05 | +0.10 | 40.10 | +0.05 | 0.10 | +0.10 3.2 1808 2.20 | 4.95 | 12.00 | 5.50 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | (+ 0.10 | 40.10 | +0.10 | +0.05 | +0.10 | +0.10 | +0.05 | 0.10 | +0.10 3.0 4812 3.66 | 4.95 | 12.00 | 5.50 | 1.75 | 8.00 | 2.00 | 4.00 | 1.50-0/ | (e+ +0.10 | +0.10 | +0.10 | +0.05 | +0.10 | #0.10 | #0.05 | +0.10 | +0.10 4.0 HE RALRARY HERE 139Maze e Embossed Taping Top cover tape Carrier tape Polystyrene reel Cavity for chip * Dimensions of embossed taping for 0805, 1206, 1210, 1808, 1812 type Sprocket J Cavity for chip an Code A B C D E F G H J T Tape size 0805 155 | 235 | 800 | 350 | 1.75 | 400 | 200 | 4.00 | 1.50-0/ | &F +0.20 | +0.20| +0.20| +0.05 | +0.10 | +0.10 | +0.10 | +0.10| +010 | 1.50 1495 | 360 | 800 | 350 | 1.75 | 400 | 200 | 4.00 | 1.50-0/ | 1206 +0.20 | +0.20| +0.20| +0.05 | +0.10 | +0.10 | +0.10 | +0.10 | +010 | 1.85 121 270 | 3.42 | 8.00 | 350 | 1.75 | 400 | 200 | 4.00 | 1.50-c0/ | EF 0 +0.10 | +0.10| +0.10 | +0.05 | +0.10 | +0.10 | +0.05 | +0.10 | +010 | 3.2 1 2.20 | 495 | 12.00 | 550 | 1.75 | 4.00 | 2.00 | 4.00 | 1.50-0/ | &F 808 +0.10 | +0.10| +0.10 | +0.05 | +0.10 | +0.10 | +0.05 | +0.10 | +010 | 3.0 4812 3.66 | 495 | 1209 | 5.50 | 1.75 | 8.00 | 2.00 | 4.00 | 1.50-0/ | RF +0.10 | +0.10 | +0.10 +0.05 |} +0.10 | +0.10 | 40.05 | 40.10 +0.10 4.0 Note:The place with "*" means where needs exactly dimensions. 140e BASH Ame EB( 3%) = Rr ese MULTILAYER CHIP CERAMIC CAPACITOR a Fe | Se oR ( HB) 0 0 0000 | //0000 00 J UU I-A l1 KF200mm *F200mm KF200mm PIAA e S88 RY (Stz:mm) A E oF OL G eRTRE A B Cc D E F G 178,00 + 2.00 3.00 | 13.00+0.50 21.00 + 0.80 D50.00RE A 10.00+1.50 |412MAX 330.00 + 2.00 3.00 | 13.00+0.50 21.00 + 0.80 50.008 EA 10.00+1.50 |12MAX 141Maze e Structure of leader part and end part of the carrier paper End(Vacant position) | Chip carrier | Vacant position Leader part(covertape) QO 0 Q0O000 | //0000 00 FUU UU 0 UV Over200mm e Reel Dimensions (unit: mm) Over200mm Over200mm Feeding direction E | F U G e Code A B Cc D E F G 178.004+2.00 | 3.00 13.00+0.50 21.00+0.80 | 50.00 ormax | 10.00+1.50 | 12MAX 330.004+2.00 | 3.00 13.00+0.50 21.00+0.80 | 50.00 ormax | 10.00+1.50 | 12MAX 142Tea HS Rl mie (Aan wee ee es i S BAT MRSS ss MULTILAYER CHIP CERAMIC CAPACITOR / C (B) Re Rafe: O.1N<RIRESEEE<O.7N; ZERIBER:, ARG REAARRE, MHA RETSTERE. EBL. e ERR MAR 2a A B T C D E Rt 6.80 +0.10 8.80 + 1.00 12.00+0.10 | 15.00+0.10/-0} 2.00+0/-0.10 | 4.70+0.10 =n F Ww G H L | R+t| 31.50+0.20/-0 | 36.00+0/-0.2 | 19.00+0.35 7.00 + 0.35 110.00+0.70 | 5.00+0.35 gee eeeeeee nese ee eeeaeeeseseaeeeeseneeeeeeaees Le F (oe zy 1St5hL E I F W I L c ARS Rt BERANE AR he Base We Ra] ALE 0402] 10000 20000 5000 0603! 4000 15000 5000 0805} 4000 | 3000 10000 5000 1206] 4000 | TSX1.35mm 3000} 5000 5000 T>1. 35mm 2000 T<1. 80mm 2000 1210 TS 1, 80mm 1000 2000 1808 2000 2000 <1. 1812 TS Sean 500. 2000 2225 500 500 3035 500 He: BRACKET RR AHERRE. 143MbBBzei i TAPING SPECIFICATION e Top cover tape peeling strength (A)Paper Taping (6)Cover tape peeling direction . sO 4nd givect wad give" N \ verte 0 we O ex ON Cover taps 5 Cove T 0-15 Carrier Standard: 0.1N<peeling forc<0.7N; No paper dirty remains on the scotch when peeling, and no sticks to top and bottom cover tape. Bulk Case Package Symbol A B T Cc D E Dimension} 6.80+0.10 8.8041.00 |12.0040.10)15.00+0. 10/-1}2.0040/-0.10} 4.70+0.10 Symol F WwW G H L | Dimension |31 .50+0.20/-0) 36.00+0/-0.2}19.00+0.35} 7.00+0.35 | 110.00+0.70} 5.00+0.35 pretense escnscesseescesccsscescescosscessesconas Lr Pee l zy = E I F Ww L e Pack Quantity ; Pakaging method and quantity Size Note: W h ki Paper tape| Plastistic | |Bulkplastic | Normal bulk |INOl@: Ve can Choose packing taping embossed taping | box packaging] packaging style and quantity can be according to the 0402 10000 20000 5000 customer's requirement. 0603 4000 15000 5000 0805 4000 3000 10000 5000 1206 4000 TS 1. 35mm 3000 5000 5000 T>1. 35mm 2000 TS1. 80mm 2000 1210 T>1. 80mm 1000 2000 1808 2000 2000 <1. 1812 TS 85mm 500. 2000 2225 500 500 3035 500 144