1
FEATURES
APPLICATIONS
DESCRIPTION
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007www.ti.com
6-A, 4.5-V to 14-V INPUT, NON-ISOLATED,WIDE-OUTPUT, ADJUSTABLE POWER MODULE WITH TurboTrans™
2
•Up to 6-A Output Current •TurboTrans™ Technology•4.5-V to 14-V Input Voltage •Designed to meet Ultra-Fast TransientRequirements up to 300 A/s•Wide-Output Voltage Adjust (0.69 V to 5.5 V)
•SmartSync Technology•± 1.5% Total Output Voltage Variation•Efficiencies up to 95%•Output Overcurrent Protection
•Complex Multi-Voltage Systems(Nonlatching, Auto-Reset)
•Microprocessors•Operating Temperature: – 40 °C to 85 °C
•Bus Drivers•Safety Agency Approvals– UL/IEC/CSA-C22.2 60950-1•Prebias Startup•On/Off Inhibit•Differential Output Voltage Remote Sense•Adjustable Undervoltage Lockout•Auto-Track™ Sequencing•Ceramic Capacitor Version (PTH08T231W)
The PTH08T230/231W is the higher input voltage (4.5V to 14V) version of the PTH04T230/231W (2.2V to 5.5V),6-A rated, non-isolated power module. This regulator represents the 2nd generation of the PTH series of powermodules which include a reduced footprint and improved features. The PTH08T231W is optimized to be used inapplications requiring all ceramic capacitors.
Operating from an input voltage range of 4.5V to 14V, the PTH08T230/231W requires a single resistor to set theoutput voltage to any value over the range, 0.69V to 5.5V. The wide input voltage range makes thePTH08T230/231W particularly suitable for advanced computing and server applications that use a looselyregulated 8-V to 12-V intermediate distribution bus. Additionally, the wide input voltage range increases designflexibility by supporting operation with tightly regulated 5-V, 8-V, or 12-V intermediate bus architectures.
The module incorporates a comprehensive list of features. Output over-current and over-temperature shutdownprotects against most load faults. A differential remote sense ensures tight load regulation. An adjustableunder-voltage lockout allows the turn-on voltage threshold to be customized. Auto-Track™ sequencing is apopular feature that greatly simplifies the simultaneous power-up and power-down of multiple modules in apower system.
The PTH08T230/231W includes new patent pending technologies, TurboTrans™ and SmartSync. TheTurboTrans feature optimizes the transient response of the regulator while simultaneously reducing the quantityof external output capacitors required to meet a target voltage deviation specification. Additionally, for a targetoutput capacitor bank, TurboTrans can be used to significantly improve the regulator's transient response byreducing the peak voltage deviation. SmartSync allows for switching frequency synchronization of multiplemodules, thus simplifying EMI noise suppression tasks and reduces input capacitor RMS current requirements.Double-sided surface mount construction provides a low profile and compact footprint. Package options includeboth through-hole and surface mount configurations that are lead (Pb) - free and RoHS compatible.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2TurboTrans, Auto-Track, TMS320 are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005 – 2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
PTH08T230W
2
4
8
+
7
Track
GND
TT
3
GND
GND
+Sense 5
L
O
A
D
−Sense
+
10
Inhibit INH/UVLO
Auto−Track
9
6
−Sense
+Sense
SYNC
1
SmartSync
TurboTrans
RTT
1%
0.05 W
(Optional)
VO
CO2
100 µF
(Required)
CO1
200 µF
Ceramic
(Required)
RSET
1%
0.05 W
(Required)
VI
VOAdj
VI
CI
330 µF
(Required)
(Notes B and C)
VO
[D]
PTH08T231W
2Vi
4
8
CI
300 uF
(Required)
7
VI Track
GND VoAdj
Vo
TT
3
GND
GND
RTT
1%
0.05W
(Optional)
+Sense 5
L
O
A
D
−Sense
10
Inhibit INH/UVLO
Auto−Track
9
6
−Sense
+Sense
Vo
SYNC
1
SmartSync
CO
200 µF
Ceramic
(Required)
TurboTrans
RSET
1%
0.05 W
(Required)
(Note A)
[B]
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.
PTH08T230W
A. R
SET
required to set the output voltage to a value higher than 0.69 V. See the Electrical Characteristics table.B. An additional 22- µF ceramic input capacitor is recommended to reduce RMS ripple current.C. For V
I
greater than 8 V, the minimum required C
I
may be reduced to 220 µF plus a 22- µF ceramic capacitor.D. 200 µF of output capacitance can be achieved by using two 100- µF ceramic capacitors or four 47- µF ceramiccapacitors.
PTH08T231W - Ceramic Capacitor Version
A. R
SET
required to set the output voltage to a value higher than 0.69 V. See the Electrical Characteristics table.B. 200 µF of output capacitance can be achieved by using two 100- µF ceramic capacitors or four 47- µF ceramiccapacitors.
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DATASHEET TABLE OF CONTENTS
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or seethe TI website at www.ti.com.
DATASHEET SECTION PAGE NUMBER
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS 3
ELECTRICAL CHARACTERISTICS TABLE (PTH08T230W) 4
ELECTRICAL CHARACTERISTICS TABLE (PTH08T231W) 6
PIN-OUT AND TERMINAL FUNCTIONS 8
TYPICAL CHARACTERISTICS (V
I
= 12V) 9
TYPICAL CHARACTERISTICS (V
I
= 5V) 10
ADJUSTING THE OUTPUT VOLTAGE 11
CAPACITOR RECOMMENDATIONS 13
TURBOTRANS™ INFORMATION 17
UNDERVOLTAGE LOCKOUT (UVLO) 22
SOFT-START POWER-UP 23
OVER-CURRENT PROTECTION 23
OVER-TEMPERATURE PROTECTION 23
OUTPUT ON/OFF INHIBIT 24
REMOTE SENSE 24
SYCHRONIZATION (SMARTSYNC) 25
AUTO-TRACK SEQUENCING 26
PREBIAS START-UP 29
TAPE & REEL AND TRAY DRAWINGS 31
(Voltages are with respect to GND)
UNIT
V
Track
Track pin voltage – 0.3 to V
I
+ 0.3 VV
SYNC
SYNC pin voltage – 0.3 to 6.0 VT
A
Operating temperature range Over V
I
range – 40 to 85Surface temperature of module body or pinsT
wave
Wave soldering temperature AH and AD suffix 260(5 seconds maximum)
°CAS suffix 235
(1)T
reflow
Solder reflow temperature Surface temperature of module body or pins
AZ suffix 260
(1)
T
stg
Storage temperature – 55 to 125
(2)
Mechanical shock Per Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 500Suffix AH and AD 20 GMechanical vibration Mil-STD-883D, Method 2007.2, 20-2000 Hz
Suffix AS and AZ 15Weight 2.5 gramsFlammability Meets UL94V-O
(1) During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above thestated maximum.(2) The shipping tray or tape and reel cannot be used to bake parts at temperatures higher than 65C.
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 3
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ELECTRICAL CHARACTERISTICS
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
T
A
=25 °C, V
I
= 5V, V
O
= 3.3V, C
I
= 330µF, C
O
1 = 200µF ceramic, C
O
2 = 100µF, I
O
= I
O
max (unless otherwise stated)
PARAMETER TEST CONDITIONS PTH08T230W
MIN TYP MAX UNIT
I
O
Output current Over V
O
range 25 °C, natural convection 0 6 A
11 ×V
O0.69 ≤V
O
≤1.2 4.5
(1)
V
I
Input voltage range Over I
O
range V1.2 < V
O
≤3.6 4.5 14
3.6 < V
O
≤5.5 V
O
+1
(2)
14
Output adjust range Over I
O
range 0.69 5.5 V
Set-point voltage tolerance ± 1.0
(3)
%V
o
Temperature variation – 40 °C < T
A
< 85 °C ± 0.25 %V
oV
O
Line regulaltion Over V
I
range ± 3 mV
Load regulation Over I
O
range ± 2 mV
Total output variation Includes set-point, line, load, – 40 °C≤T
A
≤85 °C ± 1.5
(3)
%V
O
R
SET
= 169 Ω, V
I
= 8.0 V, V
O
= 5.0V 95%
R
SET
= 1.21 k Ω, V
O
= 3.3 V 92%
R
SET
= 2.37 k Ω, V
O
= 2.5 V 90%
R
SET
= 4.75 k Ω, V
O
= 1.8 V 88%ηEfficiency I
O
= 6 A
R
SET
= 6.98 k Ω, V
O
= 1.5 V 87%
R
SET
= 12.1 k Ω, V
O
= 1.2 V 85%
R
SET
= 20.5 k Ω, V
O
= 1.0 V 83%
R
SET
= 681 Ω, V
O
= 0.7 V 79%
V
O
Ripple (peak-to-peak) 20-MHz bandwidth 1 %V
O
I
LIM
Overcurrent threshold Reset, followed by auto-recovery 10 A
Recovery Time 70 µSecw/o TurboTrans
C
O
1 = 200 µF, ceramic
V
O
Overshoot 150 mV
w/o TurboTrans
(4)
Recovery Time 100 µSec2.5 A/µs load step
C
O
1 = 200 µF, ceramicTransient response 50% to 100% I
O
max
V
O
Overshoot 100 mVC
O
2 = 330 µF, Type BV
O
= 2.5 V
with TurboTrans Recovery Time 150 µSecC
O
1 = 200 µF, ceramicC
O
2 = 330 µF, Type B
V
O
Overshoot 60 mVR
TT
= 11.3 k Ω
I
IL
Track input current (pin 9) Pin to GND -130
(5)
µA
dV
track
/dt Track slew rate capability C
O
≤C
O
(max) 1 V/ms
V
I
increasing, R
UVLO
= OPEN 4.3 4.45Adjustable Under-voltage lockoutUVLO
ADJ
V
I
decreasing, R
UVLO
= OPEN 4.0 4.2 V(pin 10)
Hysteresis, R
UVLO
≤52.3 k Ω0.5
Input high voltage (V
IH
) Open
(6)
VInhibit control (pin 10) Input low voltage (V
IL
) -0.2 0.6
Input low current (I
IL
), Pin 10 to GND 235 µA
I
in
Input standby current Inhibit (pin 10) to GND, Track (pin 9) open 5 mA
f
s
Switching frequency Over V
I
and I
O
ranges, SmartSync (pin 1) to GND 300 kHz
(1) The maximum input voltage is duty cycle limited to (V
O
×11)V or 14V, whichever is less. The maximum allowable input voltage is afunction of switching frequency, and may increase or decrease when the SmartSync feature is used. Please review the SmartSyncsection of the Application Information for further guidance.(2) The minimum input voltage is 4.5V or (V
O
+1)V, whichever is greater. Additional input capacitance may be required when V
I
< (V
O
+2)V.(3) The set-point voltage tolerance is affected by the tolerance and stability of R
SET
. The stated limit is unconditionally met if R
SET
has atolerance of 1% with 100 ppm/C or better temperature stability.(4) Without TurboTrans, the minimum ESR limit of 7 m Ωmust not be violated.(5) A low-leakage (<100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 9. Theopen-circuit voltage is less than 6.5 Vdc.(6) This control pin has an internal pull-up. Do not place an external pull-up on this pin. If it is left open-circuit, the module operates wheninput power is applied. A small, low-leakage (<100 nA) MOSFET is recommended for control. For additional information, see the relatedapplication information section.
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PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
ELECTRICAL CHARACTERISTICS (continued)T
A
=25 °C, V
I
= 5V, V
O
= 3.3V, C
I
= 330µF, C
O
1 = 200µF ceramic, C
O
2 = 100µF, I
O
= I
O
max (unless otherwise stated)
PARAMETER TEST CONDITIONS PTH08T230W
MIN TYP MAX UNIT
f
SYNC
Synchronization (SYNC) frequency 240 400 kHz
V
SYNCH
SYNC High-Level Input Voltage 2 5.5 VSmartSync ControlV
SYNCL
SYNC Low-Level Input Voltage 0.8 V
t
SYNC
SYNC Minimum Pulse Width 200 nSec
C
I
External input capacitance 330
(7)
µF
Nonceramic 0
(8)
100 5000
(9)Capacitance value µFwithout
Ceramic 200
(8)
500TurboTrans
Equivalent series resistance (non-ceramic) 7 m ΩC
O
External output capacitance
see table 10,000Capacitance value µFwith
(10) (11)Turbotrans
Capacitance ×ESR product (C
O
×ESR) 1000 10,000 µF×mΩ
Per Telcordia SR-332, 50% stress,MTBF Reliability 6.7
10
6
HrT
A
= 40 °C, ground benign
(7) A 330 µF electrolytic input capacitor is required for proper operation. The capacitor must be rated for a minimum of 450 mA rms of ripplecurrent. An additional 22- µF ceramic input capacitor is recommended to reduce rms ripple current. When operating at V
I
> 8V, theminimum required C
I
may be reduced to a 220- µF electrolytic plus a 22- µF ceramic.(8) 200 µF ceramic external output capacitance is required for basic operation. The required ceramic output capacitance can be made up of2×100µF or 4 ×47µF. The minimum output capacitance requirement increases when TurboTrans™ (TT) technology is used. See theApplication Information for more guidance.(9) This is the calculated maximum disregarding TurboTrans™ technology. When the TurboTrans feature is used, the minimum outputcapacitance must be increased. See the TurboTrans application notes for further guidance.(10) When using TurboTrans™ technology, a minimum value of output capacitance is required for proper operation. Additionally, low ESRcapacitors are required for proper operation. See the TurboTrans application notes for further guidance.(11) This is the calaculated maximum when using the TurboTrans feature. Additionally, low ESR capacitors are required for proper operation.See the TurboTrans application notes for further guidance.
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): PTH08T230W PTH08T231W
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ELECTRICAL CHARACTERISTICS
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
T
A
=25 °C, V
I
= 5 V, V
O
= 3.3 V, C
I
= 330 µF, C
O
1 = 200 µF ceramic, and I
O
= I
O
max (unless otherwise stated)
PARAMETER TEST CONDITIONS PTH08T231W
MIN TYP MAX UNIT
I
O
Output current Over V
O
range 25 °C, natural convection 0 6 A
11 ×V
O0.69 ≤V
O
≤1.2 4.5
(1)
V
I
Input voltage range Over I
O
range V1.2 < V
O
≤3.6 4.5 14
3.6 < V
O
≤5.5 V
O
+1
(2)
14
Output adjust range Over I
O
range 0.69 5.5 V
Set-point voltage tolerance ± 1.0
(3)
%V
o
Temperature variation – 40 °C < T
A
< 85 °C ± 0.25 %V
oV
O
Line regulaltion Over V
I
range ± 3 mV
Load regulation Over I
O
range ± 2 mV
Total output variation Includes set-point, line, load, – 40 °C≤T
A
≤85 °C ± 1.5
(3)
%V
O
R
SET
= 169 Ω, V
I
= 8.0 V, V
O
= 5.0V 95%
R
SET
= 1.21 k Ω, V
O
= 3.3 V 92%
R
SET
= 2.37 k Ω, V
O
= 2.5 V 90%
R
SET
= 4.75 k Ω, V
O
= 1.8 V 88%ηEfficiency I
O
= 6 A
R
SET
= 6.98 k Ω, V
O
= 1.5 V 87%
R
SET
= 12.1 k Ω, V
O
= 1.2 V 85%
R
SET
= 20.5 k Ω, V
O
= 1.0 V 83%
R
SET
= 681 Ω, V
O
= 0.7 V 79%
V
O
Ripple (peak-to-peak) 20-MHz bandwidth 1 %V
O
I
LIM
Overcurrent threshold Reset, followed by auto-recovery 10 A
Recovery Time 80 µSecw/o TurboTrans
C
O
1 = 200 µF, ceramic
V
O
Overshoot 85 mV2.5 A/µs load step
Recovery Time 120 µSecw/o TurboTrans
(4)50% to 100% I
O
maxTransient response
C
O
1 = 400 µF, ceramicV
I
= 12 V
V
O
Overshoot 75 mVV
O
= 3.3 V
with TurboTrans Recovery Time 220 µSecC
O
1 = 400 µF, ceramic
V
O
Overshoot 45 mVR
TT
= 8.06 k Ω
I
IL
Track input current (pin 9) Pin to GND -130
(5)
µA
dV
track
/dt Track slew rate capability C
O
≤C
O
(max) 1 V/ms
V
I
increasing, R
UVLO
= OPEN 4.3 4.45Adjustable Under-voltage lockoutUVLO
ADJ
V
I
decreasing, R
UVLO
= OPEN 4.0 4.2 V(pin 10)
Hysteresis, R
UVLO
≤52.3 k Ω0.5
Input high voltage (V
IH
) Open
(6)
VInhibit control (pin 10) Input low voltage (V
IL
) -0.2 0.6
Input low current (I
IL
), Pin 10 to GND 235 µA
I
in
Input standby current Inhibit (pin 10) to GND, Track (pin 9) open 5 mA
f
s
Switching frequency Over V
I
and I
O
ranges, SmartSync (pin 1) to GND 300 kHz
(1) The maximum input voltage is duty cycle limited to (V
O
×11)V or 14V, whichever is less. The maximum allowable input voltage is afunction of switching frequency, and may increase or decrease when the SmartSync feature is used. Please review the SmartSyncsection of the Application Information for further guidance.(2) The minimum input voltage is 4.5V or (V
O
+1)V, whichever is greater. Additional input capacitance may be required when V
I
< (V
O
+2)V.(3) The set-point voltage tolerance is affected by the tolerance and stability of R
SET
. The stated limit is unconditionally met if R
SET
has atolerance of 1% with 100 ppm/C or better temperature stability.(4) Without TurboTrans, the minimum ESR limit of 7 m Ωmust not be violated.(5) A low-leakage (<100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 9. Theopen-circuit voltage is less than 6.5 Vdc.(6) This control pin has an internal pull-up. Do not place an external pull-up on this pin. If it is left open-circuit, the module operates wheninput power is applied. A small, low-leakage (<100 nA) MOSFET is recommended for control. For additional information, see the relatedapplication information section.
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PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
ELECTRICAL CHARACTERISTICS (continued)T
A
=25 °C, V
I
= 5 V, V
O
= 3.3 V, C
I
= 330 µF, C
O
1 = 200 µF ceramic, and I
O
= I
O
max (unless otherwise stated)
PARAMETER TEST CONDITIONS PTH08T231W
MIN TYP MAX UNIT
f
SYNC
Synchronization (SYNC) frequency 240 400 kHz
V
SYNCH
SYNC High-Level Input Voltage 2 5.5 VSmartSync ControlV
SYNCL
SYNC Low-Level Input Voltage 0.8 V
t
SYNC
SYNC Minimum Pulse Width 200 nSec
C
I
External input capacitance 300
(7)
µF
without
Capacitance value Ceramic 200
(8)
5000 µFTurboTrans
C
O
External output capacitance see tableCapacitance value Ceramic 5000
(10)
µFwith
(9)Turbotrans
Capacitance ×ESR product (C
O
×ESR) 100 1000 µF×mΩ
Per Telcordia SR-332, 50% stress,MTBF Reliability 6.7
10
6
HrT
A
= 40 °C, ground benign
(7) 300 µF of ceramic or 330 µF of electrolytic input capacitance is required for proper operation. Electrolytic capacitance must be rated fora minimum of 450 mA rms of ripple current. An additional 22- µF ceramic input capacitor is recommended to reduce rms ripple current.(8) 200 µF ceramic external output capacitance is required for basic operation. The required ceramic output capacitance can be made up of2×100µF or 4 ×47µF. The minimum output capacitance requirement increases when TurboTrans™ (TT) technology is used. See theApplication Information for more guidance.(9) When using TurboTrans™ technology, a minimum value of output capacitance is required for proper operation. Additionally, low ESRcapacitors are required for proper operation. See the TurboTrans application notes for further guidance.(10) This is the calaculated maximum when using the TurboTrans feature. Additionally, low ESR capacitors are required for proper operation.See the TurboTrans application notes for further guidance.
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1 10
9
7
6
5
43
82
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
PTH08T230/231W
(TOP VIEW)
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTIONNAME NO.
V
I
2 The positive input voltage power node to the module, which is referenced to common GND.V
O
4 The regulated positive power output with respect to the GND.This is the common ground connection for the V
I
and V
O
power connections. It is also the 0 Vdc reference forGND 3
the control inputs.The Inhibit pin is an open-collector/drain, negative logic input that is referenced to GND. Applying a low levelground signal to this input disables the module ’ s output and turns off the output voltage. When the Inhibit controlis active, the input current drawn by the regulator is significantly reduced. If the Inhibit pin is left open-circuit, theInhibit and
module produces an output whenever a valid input source is applied.10UVLO
(1)
This pin is also used for input undervoltage lockout (UVLO) programming. Connecting a resistor from this pin toGND (pin 3) allows the ON threshold of the UVLO to be adjusted higher than the default value. For moreinformation, see the Application Information section.A 0.05 W 1% resistor must be directly connected between this pin and pin 6 ( – Sense) to set the output voltageto a value higher than 0.69 V. The temperature stability of the resistor should be 100 ppm/ °C (or better). Thesetpoint range for the output voltage is from 0.69 V to 5.5 V. If left open circuit, the output voltage will default toV
O
Adjust 7
its lowest value. For further information, on output voltage adjustment see the related application note.The specification table gives the preferred resistor values for a number of standard output voltages.The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.+ Sense 5
For optimal voltage accuracy, +Sense must be connected to V
O
, close to the load.The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.– Sense 6 For optimal voltage accuracy, – Sense must be connected to GND (pin 3), very close to the module (within 10cm).
This is an analog control input that enables the output voltage to follow an external voltage. This pin becomesactive typically 20 ms after the input voltage has been applied, and allows direct control of the output voltagefrom 0 V up to the nominal set-point voltage. Within this range the module's output voltage follows the voltage atTrack 9
the Track pin on a volt-for-volt basis. When the control voltage is raised above this range, the module regulatesat its set-point voltage. The feature allows the output voltage to rise simultaneously with other modules poweredfrom the same input bus. If unused, this input should be connected to V
I
.NOTE: Due to the undervoltage lockout feature, the output of the module cannot follow its own input voltageduring power up. For more information, see the related application note.This input pin adjusts the transient response of the regulator. To activate the TurboTrans feature, a 1%, 0.05 Wresistor must be connected between this pin and pin 5 (+Sense) very close to the module. For a given value ofoutput capacitance, a reduction in peak output voltage deviation is achieved by using this feature. If unused, thisTurboTrans™ 8
pin must be left open-circuit. The resistance requirement can be selected from the TurboTrans resistor table inthe Application Information section. External capacitance must never be connected to this pin unless theTurboTrans resistor is a short, 0 Ω.This input pin sychronizes the switching frequency of the module to an external clock frequency. The SmartSyncfeature can be used to sychronize the switching fequency of multiple PTH08T230/231W modules, aiding EMISmartSync 1
noise suppression efforts. If unused, this pin should be connected to GND (pin 3). For more information, pleasereview the Application Information section.
(1) Denotes negative logic: Open = Normal operation, Ground = Function active
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TYPICAL CHARACTERISTICS
(1) (2)
CHARACTERISTIC DATA ( V
I
= 12 V)
IO− OutputCurrent − A
0
0.5
1.5
1
2.5
0 1 2 5 6
− PowerDissipation − W
PD
VO=2.5V
VO=3.3V
VO=5V
VO=1.8V
VO=1.5V
VO=1.2V
2
3 4
Efficiency − %
IO− OutputCurrent − A
50
55
60
65
75
85
95
100
0 1 2 3 4 5 6
70
80
90
V =5V
O
VO=2.5V
VO=1.8V
VO=1.5V
VO=3.3V
VO=1.2V
I − OutputCurrent − A
O
V OutputVoltageRipple − V (mV)
O PP
−
5
10
15
25
1 2 35
46
0
0
20
V =5V
O
VO=3.3V
VO=1.2V
VO=1.5V
VO=1.8V
VO=2.5V
TA− AmbientTemperature − C
o
IO− OutputCurrent − A
20
30
40
50
60
70
80
90
0 1 2 3 4 5 6
100LFM
NatConv
V =5V
O
TA− AmbientTemperature − C
o
IO− OutputCurrent − A
20
30
40
50
60
70
80
90
0 1 2 3 4 5 6
100LFM
NatConv
V =3.3V
O
TA− AmbientTemperature − C
o
IO− OutputCurrent − A
20
30
40
50
60
70
80
90
0 1 2 3 4 5 6
NatConv
V =1.2V
O
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
EFFICIENCY OUTPUT RIPPLE POWER DISSIPATIONvs vs vsOUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 1. Figure 2. Figure 3.
AMBIENT TEMPERATURE AMBIENT TEMPERATURE AMBIENT TEMPERATUREvs vs vsOUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 4. Figure 5. Figure 6.
(1) The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for theconverter. Applies to Figure 1 ,Figure 2 , and Figure 3 .(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximumoperating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.Applies to Figure 4 and Figure 5 .
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TYPICAL CHARACTERISTICS
(1) (2)
CHARACTERISTIC DATA ( V
I
= 5 V)
IO− OutputCurrent − A
0
0.6
1.4
1.6
0 1 2 5 6
− PowerDissipation − W
PD
1
3 4
0.2
0.4
0.8
1.2
VO=3.3V
VO=0.7V
VO=2.5V
VO=1.2V
VO=1.5V
VO=1.8V
Efficiency − %
IO− OutputCurrent − A
60
65
75
85
95
100
0 1 2 3 4 5 6
70
80
90
VO=2.5V
VO=1.8V
VO=3.3V
VO=1.2V
V =0.7V
O
VO=1.5V
I − OutputCurrent − A
O
V OutputVoltageRipple − V (mV)
O PP
−
2
4
6
10
1 2 35
46
0
0
8
V =0.7V
O
VO=1.2V
VO=1.5V
VO=1.8V
VO=2.5V
VO=3.3V
TA− AmbientTemperature − C
o
IO− OutputCurrent − A
20
30
40
50
60
70
80
90
0 1 2 3 4 5 6
NatConv
ALL VO
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
EFFICIENCY OUTPUT RIPPLE POWER DISSIPATIONvs vs vsOUTPUT CURRENT OUTPUT CURRENT OUTPUT CURRENT
Figure 7. Figure 8. Figure 9.
AMBIENT TEMPERATURE
vsOUTPUT CURRENT
Figure 10.
(1) The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for theconverter. Applies to Figure 7 ,Figure 8 , and Figure 9 .(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximumoperating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.Applies to Figure 10 .
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APPLICATION INFORMATION
ADJUSTING THE OUTPUT VOLTAGE
RSET =10k xW0.69
V -0.69
O
-1.43k W
(1)
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
The V
O
Adjust control (pin 7) sets the output voltage of the PTH08T230/231W. The adjustment range is 0.69V to5.5V. The adjustment method requires the addition of a single external resistor, R
SET
, that must be connecteddirectly between the V
O
Adjust and the – Sense pins. Table 1 gives the standard value of the external resistor fora number of standard voltages, along with the actual output voltage that this resistance value provides.
For other output voltages, the required resistor value can either be calculated using the following formula, orsimply selected from the values given in Table 2 .Figure 11 shows the placement of the required resistor.
Table 1. Preferred Values of R
SET
for Standard Output Voltages
V
O
(Standard) (V) R
SET
(Standard Value) (k Ω) V
O
(Actual) (V)
5.0
(1)
0.169 5.013.3 1.2 3.302.5 2.37 2.511.8 4.7 1.811.5 6.98 1.511.2
(2)
12.1 1.201.0
(2)
20.5 1.010.7
(2)
681 0.70
(1) For V
O
> 3.6 V, the minimum input voltage is (V
O
+ 1) V.(2) The maximum input voltage is (V
O
×11) V or 14 V, whichever is less. The maximum allowable inputvoltage is a function of switching frequency and may increase or decrease when the Smart Syncfeature is used. Review the Smart Sync application section for further guidance.
(1) R
SET
:Use a 0.05 W resistor with a tolerance of 1% and temperature stability of 100 ppm/ °C (or better). Connect theresistor directly between pins 7 and 6, as close to the regulator as possible, using dedicated PCB traces.(2) Never connect capacitors from V
O
Adjust to either GND, V
O
, or +Sense. Any capacitance added to the V
O
Adjust pinaffects the stability of the regulator.
Figure 11. V
O
Adjust Resistor Placement
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PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
Table 2. Output Voltage Set-Point Resistor Values
V
O
Required R
SET
(k Ω) V
O
Required (V) R
SET
(Ω)
0.70 0.681 3.00 1.54 k0.75 0.113 3.10 1.43 k0.80 61.9 3.20 1.33 k0.85 41.2 3.30 1.21 k0.90 31.6 3.40 1.13 k0.95 24.9 3.50 1.02 k1.00 20.5 3.60 9311.10 15.4 3.70 8661.20 12.1 3.80 7871.30 9.88 3.90 7151.40 8.25 4.00 6491.50 6.98 4.10 5901.60 6.04 4.20 5361.70 5.36 4.30 4751.80 4.75 4.40 4321.90 4.22 4.50 3832.00 3.83 4.60 3322.10 3.40 4.70 2872.20 3.09 4.80 2492.30 2.87 4.90 2102.40 2.61 5.00 1692.50 2.37 5.10 1332.60 2.15 5.20 1002.70 2.00 5.30 66.52.80 1.82 5.40 34.82.90 1.69 5.50 4.99
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CAPACITOR RECOMMENDATIONS FOR THE PTH08T230/231W POWER MODULE
Capacitor Technologies
Input Capacitor (Required)
Input Capacitor Information
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
Electrolytic CapacitorsWhen using electrolytic capacitors, high quality, computer-grade electrolytic capacitors are recommended.Aluminum electrolytic capacitors provide adequate decoupling over the frequency range, 2 kHz to 150 kHz,and are suitable when ambient temperatures are above -20 °C. For operation below -20 °C, tantalum,ceramic, or OS-CON type capacitors are required.
Ceramic Capacitors
Above 150 kHz the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramiccapacitors have a low ESR and a resonant frequency higher than the bandwidth of the regulator. They canbe used to reduce the reflected ripple current at the input as well as improve the transient response of theoutput.
Tantalum, Polymer-Tantalum CapacitorsTantalum type capacitors may only used on the output bus, and are recommended for applications where theambient operating temperature is less than 0 °C. The AVX TPS series and Kemet capacitor series aresuggested over many other tantalum types due to their lower ESR, higher rated surge, power dissipation,and ripple current capability. Tantalum capacitors that have no stated ESR or surge current rating are notrecommended for power applications.
The PTH08T231W requires a minimum input capacitance of 300 µF of ceramic type. (330 µF of electrolytic inputcapacitance may also be used. See the following paragraph for the required electrolytic capacitor ratings.)
The PTH08T230W requires a minimum input capacitance of 330 µF. The ripple current rating of the capacitormust be at least 450mArms. An optional 22- µF X5R/X7R ceramic capacitor is recommended to reduce the RMSripple current. When operating with an input voltage greater than 8 V, the minimum required input capacitancemay be reduced to a 220- µF electrolytic plus a 22- µF ceramic.
The size and value of the input capacitor is determined by the converter ’ s transient performance capability. Thisminimum value assumes that the converter is supplied with a responsive, low inductance input source. Thissource should have ample capacitive decoupling, and be distributed to the converter via PCB power and groundplanes.
Ceramic capacitors should be located as close as possible to the module's input pins, within 0.5 inch (1,3 cm).Adding ceramic capacitance is necessary to reduce the high-frequency ripple voltage at the module's input. Thiswill reduce the magnitude of the ripple current through the electroytic capacitor, as well as the amount of ripplecurrent reflected back to the input source. Additional ceramic capacitors can be added to further reduce the RMSripple current requirement for the electrolytic capacitor.
Increasing the minimum input capacitance to 680µF is recommended for high-performance applications, orwherever the input source performance is degraded.
The main considerations when selecting input capacitors are the RMS ripple current rating, temperature stability,and less than 100 m Ωof equivalent series resistance (ESR).
Regular tantalum capacitors are not recommended for the input bus. These capacitors require a recommendedminimum voltage rating of 2 ×(maximum dc voltage + ac ripple). This is standard practice to ensure reliability. Notantalum capacitors were found with a sufficient voltage rating to meet this requirement.
When the operating temperature is below 0 °C, the ESR of aluminum electrolytic capacitors increases. For theseapplications, OS-CON, poly-aluminum, and polymer-tantalum types should be considered.
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Output Capacitor (Required)
Output Capacitor Information
TurboTrans Output Capacitance
Non-TurboTrans Output Capacitance
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
The PTH08T231W requires a minimum output capacitance of 200 µF of ceramic type.
The PTH08T230W requires a minimum output capacitance of 200 µF ceramic type. An optional 100 µF ofnon-ceramic, low-ESR capacitance is recommended for improved performance. See the ElectricalCharacteristics table for maximum capacitor limits.
The required capacitance above the minimum will be determined by actual transient deviation requirements. Seethe TurboTrans Technology application section within this document for specific capacitance selection.
When selecting output capacitors, the main considerations are capacitor type, temperature stability, and ESR.When using the TurboTrans feature, the capacitance x ESR product should also be considered (see the followingsection).
Ceramic output capacitors added for high-frequency bypassing should be located as close as possible to theload to be effective. Ceramic capacitor values below 10 µF should not be included when calculating the totaloutput capacitance value.
When the operating temperature is below 0 °C, the ESR of aluminum electrolytic capacitors increases. For theseapplications, OS-CON, poly-aluminum, and polymer-tantalum types should be considered.
TurboTrans allows the designer to optimize the output capacitance according to the system transient designrequirement. High quality, ultra-low ESR capacitors are required to maximize TurboTrans effectiveness. Whenusing TurboTrans, the capacitor's capacitance (in µF) ×ESR (in m Ω) product determines its capacitor type; TypeA, B, or C. These three types are defined as follows:Type A = (100 ≤capacitance ×ESR ≤1000) (e.g. ceramic)Type B = (1000 < capacitance ×ESR ≤5000) (e.g. polymer-tantalum)Type C = (5000 < capacitance ×ESR ≤10,000) (e.g. OS-CON)
When using more than one type of output capacitor, select the capacitor type that makes up the majority of yourtotal output capacitance. When calculating the C ×ESR product, use the maximum ESR value from the capacitormanufacturer's data sheet.
Working Examples:
A capacitor with a capacitance of 330 µF and an ESR of 5m Ω, has a C ×ESR product of 1650 µFxm Ω(330 ×5).This is a Type B capacitor. A capacitor with a capacitance of 1000 µF and an ESR of 8m Ω, has a C ×ESR productof 8000 µFxm Ω(1000 ×8). This is a Type C capacitor.
See the TurboTrans Technology application section within this document for specific capacitance selection.
Table 3 includes a preferred list of capacitors by type and vendor. See the Output Bus / TurboTrans column.
If the TurboTrans feature is not used, minimum ESR and maximum capacitor limits must be followed. Systemstability may be effected and increased output capacitance may be required without TurboTrans.
When using the PTH08T230W without the TurboTrans feature, observe the minimum ESR of the entire outputcapacitor bank. The minimum ESR limit of the output capacitor bank is 7m Ω. A list of preferred low-ESR typecapacitors, are identified in Table 3 . Large amounts of capacitance may reduce system stability when not usingthe TurboTrans feature.
When using the PTH08T231W without the TurboTrans feature, the maximum amount of capacitance is tbd µF ofceramic type. Large amounts of capacitance may reduce system stability.
Using the TurboTrans feature improves system stability, improves transient response, and reduces theamount of output capacitance required to meet system transient design requirements.
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Designing for Fast Load Transients
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
The transient response of the dc/dc converter has been characterized using a load transient with a di/dt of2.5A/ µs. The typical voltage deviation for this load transient is given in the Electrical Characteristics table usingthe minimum required value of output capacitance. As the di/dt of a transient is increased, the response of aconverter ’ s regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherentlimitation with any dc/dc converter once the speed of the transient exceeds its bandwidth capability.
If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met withadditional low ESR ceramic capacitor decoupling. Generally, with load steps greater than 100A/ µs, addingmultiple 10 µF ceramic capacitors plus 10 ×1µF, and numerous high frequency ceramics ( ≤0.1 µF) is all that isrequired to soften the transient higher frequency edges. The PCB location of these capacitors in relation to theload is critical. DSP, FPGA and ASIC vendors identify types, location and amount of capacitance required foroptimum performance. Low impedance buses, unbroken PCB copper planes, and components located as closeas possible to the high frequency devices are essential for optimizing transient performance.
Table 3. Input/Output Capacitors
(1)
Capacitor Characteristics Quantity
Max Output Bus
(2)Max.Capacitor Vendor,
RippleWorking Value ESR Physical InputType Series (Style)
No Turbo-Current Vendor Part No.Voltage (µF) at 100 Size (mm) Bus
Turbo- Transat 85 °CkHz
Trans Cap Type
(3)(Irms)
Panasonic
FC (Radial) 25 V 1000 43m Ω1690mA 16 ×15 1 ≥2 N/R
(4)
EEUFC1E102S
FC (Radial) 25 V 820 38m Ω1655mA 12 ×20 1 ≥1 N/R
(4)
EEUFC1E821S
FC (SMD) 35 V 470 43m Ω1690mA 16 ×16,5 1 ≥1 N/R
(4)
EEVFC1V471N
FK (SMD) 35 V 1000 35m Ω1800mA 16 ×16,5 1 ≥2 N/R
(4)
EEVFK1V102M
United Chemi-Con
PTB, Poly-Tantalum(SMD) 6.3 V 330 25m Ω2600mA 7,3 ×4,3 ×2.8 N/R
(5)
1 ~ 4 C ≥2
(6)
6PTB337MD6TER (V
O
≤5.1V)
(7)
LXZ, Aluminum (Radial) 35 V 680 38m Ω1660mA 12,5 ×20 1 1 ~ 3 N/R
(4)
LXZ35VB681M12X20LL
PS, Poly-Alum (Radial) 16 V 330 14m Ω5060mA 10 ×12,5 1 1 ~ 3 B ≥2
(6)
16PS330MJ12
PS, Poly-Alum (Radial) 6.3 V 390 12m Ω5500mA 8 ×12,5 N/R
(5)
1 ~ 2 B ≥1
(6)
6PS390MH11 (V
O
≤5.1V)
(7)
PXA, Poly-Alum (SMD) 16 V 330 14m Ω5050mA 10 ×12,2 1 1 ~ 3 B ≥2
(6)
PXA16VC331MJ12TP
PXA, Poly-Alum (Radial) 10 V 330 14m Ω4420mA 8 ×12,2 N/R
(5)
1 ~ 2 B ≥1
(6)
PXA10VC331MH12
Nichicon, Aluminum
PM (Radial) 25 V 1000 43m Ω1520mA 18 ×15 1 ≥2 N/R
(4)
UPM1E102MHH6
HD (Radial) 35 V 470 23m Ω1820mA 10 ×20 1 ≥2 N/R
(4)
UHD1V471HR
Panasonic, Poly-Aluminum 2.0 V 390 5m Ω4000mA 7,3 ×4,3 ×4,2 N/R
(5)
N/R
(8)
B≥2
(6)
EEFSE0J391R(V
O
≤1.6V)
(7)
(1) Capacitor Supplier VerificationPlease verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because oflimited availability or obsolete products.RoHS, Lead-free and Material DetailsSee the capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements.Component designators or part number deviations can occur when material composition or soldering requirements are updated.(2) Additional output capacitance must include the required 200 µF of ceramic type.(3) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor SelectionCapacitor Types:a. Type A = (100 < capacitance ×ESR ≤1000)b. Type B = (1,000 < capacitance ×ESR ≤5,000)c. Type C = (5,000 < capacitance ×ESR ≤10,000)(4) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR ×capacitance products. Aluminum and higherESR capacitors can be used in conjunction with lower ESR capacitance.(5) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.(6) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor SelectionCapacitor Types:a. Type A = (100 < capacitance ×ESR ≤1000)b. Type B = (1,000 < capacitance ×ESR ≤5,000)c. Type C = (5,000 < capacitance ×ESR ≤10,000)(7) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.(8) N/R – Not recommended. The ESR value of this capacitor is below the required minimum when not using TurboTrans.
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PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
Table 3. Input/Output Capacitors (continued)Capacitor Characteristics Quantity
Max Output Bus
(2)Max.Capacitor Vendor,
RippleWorking Value ESR Physical InputType Series (Style)
No Turbo-Current Vendor Part No.Voltage (µF) at 100 Size (mm) Bus
Turbo- Transat 85 °CkHz
Trans Cap Type
(3)(Irms)
Sanyo
TPE, Poscap (SMD) 10 V 330 25m Ω3300mA 7,3 ×4,3 N/R
(9)
1 ~ 3 C ≥1
(10)
10TPE330MF
(11)
TPE, Poscap (SMD) 2.5 V 470 7m Ω4400mA 7,3 ×4,3 N/R
(9)
1 ~ 2 B ≥2
(10)
2R5TPE470M7(V
O
≤1.8V)
(11)
TPD, Poscap (SMD) 2.5 V 1000 5m Ω6100mA 7,3 ×4,3 N/R
(9)
N/R
(12)
B≥1
(10)
2R5TPD1000M5(V
O
≤1.8V)
(11)
SEP, OS-CON (Radial) 16 V 330 16m Ω4700mA 10 ×13 1 1 ~ 2 B ≥1
(10)
16SEP330M
SEPC, OS-CON (Radial) 16 V 470 10m Ω6100mA 10 ×13 1 1 ~ 2 B ≥2
(10)
16SEPC470M
SVP, OS-CON (SMD) 16 V 330 16m Ω4700mA 10 ×12,6 1 1 ~ 2 B ≥1
(10)
16SVP330M
AVX, Tantalum
TPM Multianode 10 V 330 23m Ω3000mA 7,3 ×4,3 ×4,1 N/R
(9)
1 ~ 3 C ≥2
(10)
TPME337M010R0035
TPS Series III (SMD) 10 V 330 40m Ω1830mA 7,3 ×4,3 ×4,1 N/R
(9)
1 ~ 6 N/R
(13)
TPSE337M010R0040 (V
O
≤5V)
(14)
TPS Series III (SMD) 4 V 1000 25m Ω2400mA 7,3 ×6,1 ×3.5 N/R
(9)
1 ~ 5 N/R
(13)
TPSV108K004R0035 (V
O
≤2.1V)
(14)
Kemet, Poly-Tantalum
T520 (SMD) 10 V 330 25m Ω2600mA 7,3 ×4,3 ×4,1 N/R
(9)
1 ~ 3 C ≥2
(10)
T520X337M010ASE025
(11)
T530 (SMD) 6.3 V 330 15m Ω3800mA 7,3 ×4,3 ×4,1 N/R
(9)
2 ~ 3 B ≥2
(10)
T530X337M010ASE015
(11)
T530 (SMD) 4 V 680 5m Ω7300mA 7,3 ×4,3 ×4,1 N/R
(9)
N/R
(12)
B≥1
(10)
T530X687M004ASE005 (V
O
≤3.5V)
(11)
T530 (SMD) 2.5 V 1000 5m Ω7300mA 7,3 ×4,3 ×4,1 N/R
(9)
N/R
(12)
B≥1
(10)
T530X108M2R5ASE005 (V
O
≤2.0V)
(11)
Vishay-Sprague
597D, Tantalum (SMD) 10 V 330 35m Ω2500mA 7,3 ×5,7 ×4,1 N/R
(9)
1 ~ 5 N/R
(13)
597D337X010E2T
94SA, OS-CON (Radial) 16 V 470 20m Ω6080mA 12 ×22 1 1 ~ 3 C ≥2
(10)
94SA477X0016GBP
94SVP OS-CON(SMD) 16 V 330 17m Ω4500mA 10 ×12,7 2 2 ~ 3 C ≥1
(10)
94SVP337X06F12
Kemet, Ceramic X5R 16 V 10 2m Ω– 3225 1 ≥1
(15)
A
(10)
C1210C106M4PAC
(SMD) 6.3 V 47 2m ΩN/R
(9)
≥1
(15)
A
(10)
C1210C476K9PAC
Murata, Ceramic X5R 6.3 V 100 2m Ω– 3225 N/R
(9)
≥1
(15)
A
(10)
GRM32ER60J107M
(SMD) 6.3 V 47 N/R
(9)
≥1
(15)
A
(10)
GRM32ER60J476M
25 V 22 1 ≥1
(15)
A
(10)
GRM32ER61E226K
16 V 10 1 ≥1
(15)
A
(10)
GRM32DR61C106K
TDK, Ceramic X5R 6.3 V 100 2m Ω– 3225 N/R
(9)
≥1
(15)
A
(10)
C3225X5R0J107MT
(SMD) 6.3 V 47 N/R
(9)
≥1
(15)
A
(10)
C3225X5R0J476MT
16 V 10 1 ≥1
(15)
A
(10)
C3225X5R1C106MT0
16 V 22 1 ≥1
(15)
A
(10)
C3225X5R1C226MT
(9) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.(10) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor SelectionCapacitor Types:a. Type A = (100 < capacitance ×ESR ≤1000)b. Type B = (1,000 < capacitance ×ESR ≤5,000)c. Type C = (5,000 < capacitance ×ESR ≤10,000)(11) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.(12) N/R – Not recommended. The ESR value of this capacitor is below the required minimum when not using TurboTrans.(13) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR ×capacitance products. Aluminum and higherESR capacitors can be used in conjunction with lower ESR capacitance.(14) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 50% of the working voltage.(15) Any combination of ceramic capacitor values is limited as listed in the Electrical Characteristics table.
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TURBOTRANS
TurboTrans™ Technology
TurboTrans™ Selection
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
TurboTrans technology is a feature introduced in the T2 generation of the PTH/PTV family of power modules.TurboTrans optimizes the transient response of the regulator with added external capacitance using a singleexternal resistor. Benefits of this technology include reduced output capacitance, minimized output voltagedeviation following a load transient, and enhanced stability when using ultra-low ESR output capacitors. Theamount of output capacitance required to meet a target output voltage deviation will be reduced with TurboTransactivated. Likewise, for a given amount of output capacitance, with TurboTrans engaged, the amplitude of thevoltage deviation following a load transient will be reduced. Applications requiring tight transient voltagetolerances and minimized capacitor footprint area will benefit greatly from this technology.
Using TurboTrans requires connecting a resistor, R
TT
, between the +Sense pin (pin5) and the TurboTrans pin(pin8). The value of the resistor directly corresponds to the amount of output capacitance required. All T2products require a minimum value of output capacitance whether or not TurboTrans is used. For thePTH08T230W, the minimum required capacitance is 200 µF. When using TurboTrans, capacitors with acapacitance ×ESR product below 10,000 µF×mΩare required. (Multiply the capacitance (in µF) by the ESR (inmΩ) to determine the capacitance ×ESR product.) See the Capacitor Selection section of the datasheet for avariety of capacitors that meet this criteria.
Figure 12 through Figure 17 show the amount of output capacitance required to meet a desired transient voltagedeviation with and without TurboTrans for several capacitor types; TypeA (e.g. ceramic), TypeB (e.g.polymer-tantalum), and TypeC (e.g. OS-CON). To calculate the proper value of R
TT
, first determine your requiredtransient voltage deviation limits and magnitude of your transient load step. Next, determine what type of outputcapacitors will be used. (If more than one type of output capacitor is used, select the capacitor type that makesup the majority of your total output capacitance). Knowing this information, use the chart in Figure 12 throughFigure 17 that corresponds to the capacitor type selected. To use the chart, begin by dividing the maximumvoltage deviation limit (in mV) by the magnitude of your load step (in Amps). This gives a mV/A value. Find thisvalue on the Y-axis of the appropriate chart. Read across the graph to the 'With TurboTrans' plot. From thispoint, read down to the X-axis which lists the minimum required capacitance, C
O
, to meet that transient voltagedeviation. The required R
TT
resistor value can then be calculated using the equation or selected from theTurboTrans table. The TurboTrans tables include both the required output capacitance and the correspondingR
TT
values to meet several values of transient voltage deviation for 25%(1.5A), 50%(3A), and 75%(4.5A) outputload steps.
The chart can also be used to determine the achievable transient voltage deviation for a given amount of outputcapacitance. Selecting the amount of output capacitance along the X-axis, reading up to the 'With TurboTrans'curve, and then over to the Y-axis, gives the transient voltage deviation limit for that value of output capacitance.The required R
TT
resistor value can be calculated using the equation or selected from the TurboTrans table.
As an example, let's look at a 12-V application requiring a 45mV deviation during an 3A, 50% load transient. Amajority of 330 µF, 10m Ωouput capacitors are used. Use the 12V, Type B capacitor chart, Figure 14 . Dividing45mV by 3A gives 15mV/A transient voltage deviation per amp of transient load step. Select 15mV/A on theY-axis and read across to the 'With TurboTrans' plot. Following this point down to the X-axis gives us a minimumrequired output capacitance of approximately 850 µF. The required R
TT
resistor value for 850 µF can then becalculated or selected from Table 5 . The required R
TT
resistor is 1.82 k Ω.
To see the benefit of TurboTrans, follow the 15mV/A marking across to the 'Without TurboTrans' plot. Followingthat point down shows that you would need a minimum of 4000 µF of output capacitance to meet the sametransient deviation limit. This is the benefit of TurboTrans. A typical TurboTrans schematic is shown in Figure 18 .
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C − Capacitance − µF
Transient − mV/A
20
10
9
8
7
30
4000
3000
2000
1000
500
400
300
200
5000
900
600
700
800
100
40
PTH08T231 Type A
Ceramic Capacitors
Without TurboTrans
With TurboTrans
C − Capacitance − µF
Transient − mV/A
20
10
9
8
7
30
4000
3000
2000
1000
500
400
300
200
5000
900
600
700
800
100
40
PTH08T231 Type A
Ceramic Capacitors
Without TurboTrans
With TurboTrans
RTT =40x 1-(C /1000)
O
5 x(C /1000)-1
O
(k )W
[]
(2)
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
PTH08T231W Type A Capacitors
12-V INPUT 5-V INPUT
Figure 12. Capacitor Type A, 100 ≤C( µF) x ESR(m Ω)≤Figure 13. Capacitor Type A, 100 ≤C( µF) x ESR(m Ω)≤1000 1000(e.g. Ceramic) (e.g. Ceramic)
Table 4. Type A TurboTrans C
O
Values and Required R
TT
Selection Table
Transient Voltage Deviation (mV) 12 V Input 5 V Input
C
O
R
TT
C
O
R
TT25% load step 50% load step 75% load step Minimum Required Minimum Required(1.5 A) (3 A) (4.5 A) Required Output TurboTrans Required Output TurboTransCapacitance ( µF) Resistor (k Ω) Capacitance ( µF) Resistor (k Ω)
45 90 135 200 open 200 open40 80 120 240 150 210 63435 70 105 300 56.2 260 97.630 60 90 400 23.7 340 37.425 50 75 560 9.76 460 16.520 40 60 840 2.0 660 5.915 30 45 N/A N/A 1450 short
R
TT
Resistor Selection
The TurboTrans resistor value, R
TT
can be determined from the TurboTrans programming equation:
Where C
O
is the total output capacitance in µF. C
O
values greater than or equal to 1000 µF require R
TT
to bea short, 0 Ω.To ensure stability, a minimum amount of output capacitance is required for a given R
TT
resistor value. Thevalue of R
TT
must be calculated using the minimum required output capacitance determined from thecapacitor transient response charts above.
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C − Capacitance − µF
Transient − mV/A
1000
500
400
300
200
600
700
100
5000
4000
3000
2000
10000
6000
20
10
9
8
7
30
40
50
60
Without TurboTrans
With TurboTrans
C − Capacitance − µF
Transient − mV/A
1000
500
400
300
200
600
700
100
5000
4000
3000
2000
10000
6000
20
10
9
8
7
30
40
50
60
Without TurboTrans
With TurboTrans
RTT =40x 1-(C /1000)
O
5 x(C /1000)-1
O
(k )W
[]
(3)
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
PTH08T230W Type B Capacitors
12-V INPUT 5-V INPUT
Figure 14. Capacitor Type B, 1000 < C( µF) x ESR(m Ω)≤Figure 15. Capacitor Type B, 1000 < C( µF) x ESR(m Ω)≤5000 5000(e.g. Polymer-Tantalum) (e.g. Polymer-Tantalum)
Table 5. Type B TurboTrans C
O
Values and Required R
TT
Selection Table
Transient Voltage Deviation (mV) 12 V Input 5 V Input
C
O
R
TT
C
O
R
TT25% load step 50% load step 75% load step Minimum Required Minimum Required(1.5 A) (3 A) (4.5 A) Required Output TurboTrans Required Output TurboTransCapacitance ( µF) Resistor (k Ω) Capacitance ( µF) Resistor (k Ω)
75 150 225 200 open 200 open60 120 180 260 100 270 82.550 100 150 320 45.3 330 41.240 80 120 420 21.0 430 19.630 60 90 600 8.06 610 7.6825 50 75 740 3.83 760 3.4020 40 60 980 0.205 1000 short15 30 45 3800 short 4500 short
R
TT
Resistor Selection
The TurboTrans resistor value, R
TT
can be determined from the TurboTrans programming equation:
Where C
O
is the total output capacitance in µF. C
O
values greater than or equal to 1000 µF require R
TT
to bea short, 0 Ω.To ensure stability, a minimum amount of output capacitance is required for a given R
TT
resistor value. Thevalue of R
TT
must be calculated using the minimum required output capacitance determined from thecapacitor transient response charts above.
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C − Capacitance − µF
Transient − mV/A
1000
500
400
300
200
600
700
100
5000
4000
3000
2000
10000
6000
20
10
9
8
7
30
40
50
60
Without TurboTrans
With TurboTrans
C − Capacitance − µF
Transient − mV/A
1000
500
400
300
200
600
700
100
5000
4000
3000
2000
10000
6000
20
10
9
8
7
30
40
50
60
Without TurboTrans
With TurboTrans
RTT =40x 1-(C /1000)
O
5 x(C /1000)-1
O
(k )W
[]
(4)
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
PTH08T230W Type C Capacitors
12-V INPUT 5-V INPUT
Figure 16. Capacitor Type C, 5000 < C( µF) x ESR(m Ω)≤Figure 17. Capacitor Type C, 5000 < C( µF) x ESR(m Ω)≤10,000 10,000(e.g. OS-CON) (e.g. OS-CON)
Table 6. Type C TurboTrans C
O
Values and Required R
TT
Selection Table
Transient Voltage Deviation (mV) 12 V Input 5 V Input
C
O
R
TT
C
O
R
TT25% load step 50% load step 75% load step Minimum Required Minimum Required(1.5 A) (3 A) (4.5 A) Required Output TurboTrans Required Output TurboTransCapacitance ( µF) Resistor (k Ω) Capacitance ( µF) Resistor (k Ω)
75 150 225 200 open 200 open60 120 180 230 205 250 12150 100 150 300 56.2 310 49.940 80 120 390 25.5 400 24.330 60 90 570 9.31 580 8.8725 50 75 720 4.32 730 4.1220 40 60 960 0.422 980 0.20515 30 45 3100 short 4000 short
R
TT
Resistor Selection
The TurboTrans resistor value, R
TT
can be determined from the TurboTrans programming equation:
Where C
O
is the total output capacitance in µF. C
O
values greater than or equal to 1000 µF require R
TT
to bea short, 0 Ω.To ensure stability, a minimum amount of output capacitance is required for a given R
TT
resistor value. Thevalue of R
TT
must be calculated using the minimum required output capacitance determined from thecapacitor transient response charts above.
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Product Folder Link(s): PTH08T230W PTH08T231W
www.ti.com
PTH08T230W
AutoTrack
GND
GND GND
VoAdj
TT +Sense
+Sense
−Sense
−Sense
INH/UVLO
SYNC
C 1
200 F
(Required)
O
m
Ceramic
C
330 F
(Required)
I
m
VO
VO
VI
VI
C 2
O
1200 F
TypeB
m
R
0k
TT
W
R
1%
SET
0.05W
TurboTransTM
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
A. The value of R
TT
must be calculated using the total value of output capacitance.
Figure 18. Typical TurboTrans Schematic
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UNDERVOLTAGE LOCKOUT (UVLO)
Threshold Adjust
RUVLO =
70.74-VTHD
V -4.26
THD
kW
(5)
Calculated Values
Inhibit/
UVLO Prog
GND
PTH08T230W
3
2
10
+
GND
RUVLO
VI
VI
CI
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
The PTH08T230/231W power modules incorporate an input undervoltage lockout (UVLO). The UVLO featureprevents the operation of the module until there is sufficient input voltage to produce a valid output voltage. Thisenables the module to provide a clean, monotonic powerup for the load circuit, and also limits the magnitude ofcurrent drawn from the regulator ’ s input source during the power-up sequence.
The UVLO characteristic is defined by the ON threshold (V
THD
) voltage. Below the ON threshold, the Inhibitcontrol is overridden, and the module does not produce an output. The hysteresis voltage, which is the differencebetween the ON and OFF threshold voltages, is set at 500 mV. The hysteresis prevents start-up oscillations,which can occur if the input voltage droops slightly when the module begins drawing current from the inputsource.
The UVLO feature of the PTH08T230/231W module allows for limited adjustment of the ON threshold voltage.The adjustment is made via the Inhibit/UVLO control pin (pin 10) using a single resistor (see Figure 19 ). Whenpin 10 is left open circuit, the ON threshold voltage is internally set to its default value, which is 4.3 V. The ONthreshold might need to be raised if the module is powered from a tightly regulated 12-V bus. Adjusting thethreshold prevents the module from operating if the input bus fails to completely rise to its specified regulationvoltage.
Equation 5 determines the value of R
UVLO
required to adjust V
THD
to a new value. The default value is 4.3 V, andit may be adjusted, but only to a higher value.
Table 7 shows a chart of standard resistor values for R
UVLO
for different values of the ON threshold (V
THD
)voltage.
Table 7. Standard R
UVLO
values for Various V
THD
values
V
THD
(V) 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0
R
UVLO
(k Ω)88.7 52.3 37.4 28.7 23.2 19.6 16.9 14.7 13.0 11.8 10.5 9.76 8.87
Figure 19. UVLO Implementation
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Soft-Start Power Up
t-Time=4ms/div
I (2 A/div)
I
V (5V/div)
I
V (2V/div)
O
PTH08T230W
Track
GND
GND
3
2
CI
VI
VI
Overcurrent Protection
Overtemperature Protection (OTP)
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
The Auto-Track feature allows the power-up of multiple PTH/PTV modules to be directly controlled from theTrack pin. However in a stand-alone configuration, or when the Auto-Track feature is not being used, the Trackpin should be directly connected to the input voltage, V
I
(see Figure 20 ).
Figure 20. Defeating the Auto-Track Function Figure 21. Power-Up Waveform
When the Track pin is connected to the input voltage the Auto-Track function is permanently disengaged. Thisallows the module to power up entirely under the control of its internal soft-start circuitry. When power up isunder soft-start control, the output voltage rises to the set-point at a quicker and more linear rate. From themoment a valid input voltage is applied, the soft-start control introduces a short time delay (typically 2ms – 10ms)before allowing the output voltage to rise. The output then progressively rises to the module ’ s setpoint voltage.Figure 21 shows the soft-start power-up characteristic of the PTH08T230W operating from a 12-V input bus andconfigured for a 3.3-V output. The waveforms were measured with a 6-A constant current load and theAuto-Track feature disabled. The initial rise in input current when the input voltage first starts to rise is the chargecurrent drawn by the input capacitors. Power-up is complete within 20 ms.
For protection against load faults, all modules incorporate output overcurrent protection. Applying a load thatexceeds the regulator's overcurrent threshold causes the regulated output to shut down. Following shutdown, amodule periodically attempts to recover by initiating a soft-start power-up. This is described as a hiccup mode ofoperation, whereby the module continues in a cycle of successive shutdown and power up until the load fault isremoved. During this period, the average current flowing into the fault is significantly reduced. Once the fault isremoved, the module automatically recovers and returns to normal operation.
A thermal shutdown mechanism protects the module ’ s internal circuitry against excessively high temperatures. Arise in the internal temperature may be the result of a drop in airflow, or a high ambient temperature. If theinternal temperature exceeds the OTP threshold, the module ’ s Inhibit control is internally pulled low. This turnsthe output off. The output voltage drops as the external output capacitors are discharged by the load circuit. Therecovery is automatic, and begins with a soft-start power up. It occurs when the sensed temperature decreasesby about 10 °C below the trip point.The overtemperature protection is a last resort mechanism to prevent thermal stress to the regulator.Operation at or close to the thermal shutdown temperature is not recommended and reduces the long-termreliability of the module. Always operate the regulator within the specified safe operating area (SOA) limits forthe worst-case conditions of ambient temperature and airflow.
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Output On/Off Inhibit
PTH08T230W
GND
GND
3
10
Q1
BSS138
1=Inhibit
Inhibit/
UVLO
CI
VI
VI2
t-Time=4ms/div
I (1 A/div)
I
V (2V/div)
O
V (2V/div)
INH
Remote Sense
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
For applications requiring output voltage on/off control, the PTH08T230/231W incorporates an output Inhibitcontrol pin. The inhibit feature can be used wherever there is a requirement for the output voltage from theregulator to be turned off.
The power modules function normally when the Inhibit pin is left open-circuit, providing a regulated outputwhenever a valid source voltage is connected to V
I
with respect to GND.
Figure 22 shows the typical application of the inhibit function. Note the discrete transistor (Q1). The Inhibit inputhas its own internal pull-up. An external pull-up should never be connected to the inhibit pin. The input is notcompatible with TTL logic devices. An open-collector (or open-drain) discrete transistor is recommended forcontrol.
Figure 22. On/Off Inhibit Control Circuit Figure 23. Power-Up Response from Inhibit Control
Turning Q1 on applies a low voltage to the Inhibit control pin and disables the output of the module. If Q1 is thenturned off, the module executes a soft-start power-up sequence. A regulated output voltage is produced within 15ms. Figure 23 shows the typical rise in both the output voltage and input current, following the turn-off of Q1. Theturn off of Q1 corresponds to the rise in the waveform, V
INH
. The waveforms were measured with a 6-A constantcurrent load.
Differential remote sense improves the load regulation performance of the module by allowing it to compensatefor any IR voltage drop between its output and the load in either the positive or return path. An IR drop is causedby the output current flowing through the small amount of pin and trace resistance. Connecting the +Sense (pin5) and – Sense (pin 6) pins to the respective positive and ground reference of the load terminals improves theload regulation of the output voltage at the connection points.
With the sense pins connected at the load, the difference between the voltage measured directly between the V
Oand GND pins, and that measured at the Sense pins, is the amount of IR drop being compensated by theregulator. This should be limited to a maximum of 300mV.
If the remote sense feature is not used at the load, connect the +Sense pin to V
O
(pin4) and connect the – Sensepin to the module GND (pin 3).
The remote sense feature is not designed to compensate for the forward drop of nonlinear or frequencydependent components that may be placed in series with the converter output. Examples include OR-ingdiodes, filter inductors, ferrite beads, and fuses. When these components are enclosed by the remote senseconnection they are effectively placed inside the regulation control loop, which can adversely affect thestability of the regulator.
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Smart Sync
VO
VI
INH/UVLO -Sense
GND
GND
Track SYNC TT
VoAdj
C 2
330 F
I
m
C 2
200 F
O
m
R 2
SET
V =5V
I
V 1
O
V 2
O
PTH08T240W
VCC
GND
f =2xf
clock modules
CLK
CLR
SN74LVC2G74
0o
PRE
D
Q
Q
180o
+Sense
GND
C 1
200 F
O
m
R 1
SET
C 1
330 F
I
m
VO
VI
INH/UVLO -Sense
GND
Track SYNC TT
VoAdj
PTH08T230W
+Sense
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
Smart Sync is a feature that allows multiple power modules to be synchronized to a common frequency. Drivingthe Smart Sync pins with an external oscillator set to the desired frequency, synchronizes all connected modulesto the selected frequency. The synchronization frequency can be higher or lower than the nominal switchingfrequency of the modules within the range of 240 kHz to 400 kHz (see Electrical Specifications table forfrequency limits). Synchronizing modules powered from the same bus, eliminates beat frequencies reflected backto the input supply, and also reduces EMI filtering requirements. These are the benefits of Smart Sync. Powermodules can also be synchronized out of phase to minimize source current loading and minimize inputcapacitance requirements. Figure 24 shows a standard circuit with two modules syncronized 180 °out of phaseusing a D flip-flop.
Figure 24. Typical SmartSync Circuit
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Smart Sync Input Voltage Limits
V-InputVoltage-V
I
V -OutputVoltage-V
O
240kHz
400kHz
350kHz
300kHz
0.7
15
0.9 1.1 1.3 1.5 1.7 2.51.9 2.1 2.3
5
14
7
6
9
8
11
10
13
12
Auto-Track™ Function
How Auto-Track™ Works
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
The maximum input voltage allowed for proper synchronization is duty cycle limited. When using Smart Sync, themaximum allowable input voltage varies as a function of output voltage and switching frequency. Operationally,the maximum input voltage is inversely proportional to switching frequency. Synchronizing to a higher frequencycauses greater restrictions on the input voltage range. For a given switching frequency, Figure 25 shows how themaximum input voltage varies with output voltage.
For example, for a module operating at 400kHz and an output voltage of 1.2V, the maximum input voltage is10V. Exceeding the maximum input voltage may cause in an increase in output ripple voltage and increasedoutput voltage variation.
As shown in Figure 25 , input voltages below 6V can operate down to the minimum output voltage over the entiresynchronization frequency range. See the Electrical Characteristics table for the synchronization frequency rangelimits.
Figure 25. Input Voltage vs Output Voltage
The Auto-Track function is unique to the PTH/PTV family, and is available with all POLA products. Auto-Trackwas designed to simplify the amount of circuitry required to make the output voltage from each module power upand power down in sequence. The sequencing of two or more supply voltages during power up is a commonrequirement for complex mixed-signal applications that use dual-voltage VLSI ICs such as the TMS320™ DSPfamily, microprocessors, and ASICs.
Auto-Track works by forcing the module output voltage to follow a voltage presented at the Track control pin
(1)
.This control range is limited to between 0 V and the module set-point voltage. Once the track-pin voltage israised above the set-point voltage, the module output remains at its set-point
(2)
. As an example, if the Track pinof a 2.5-V regulator is at 1 V, the regulated output is 1 V. If the voltage at the Track pin rises to 3 V, the regulatedoutput does not go higher than 2.5 V.
When under Auto-Track control, the regulated output from the module follows the voltage at its Track pin on avolt-for-volt basis. By connecting the Track pin of a number of these modules together, the output voltages followa common signal during power up and power down. The control signal can be an externally generated masterramp waveform, or the output voltage from another power supply circuit
(3)
. For convenience, the Track inputincorporates an internal RC-charge circuit. This operates off the module input voltage to produce a suitable risingwaveform at power up.
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Typical Auto-Track™ Application
Notes on Use of Auto-Track™
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
The basic implementation of Auto-Track allows for simultaneous voltage sequencing of a number of Auto-Trackcompliant modules. Connecting the Track inputs of two or more modules forces their track input to follow thesame collective RC-ramp waveform, and allows their power-up sequence to be coordinated from a commonTrack control signal. This can be an open-collector (or open-drain) device, such as a power-up reset voltagesupervisor IC. See U3 in Figure 26 .
To coordinate a power-up sequence, the Track control must first be pulled to ground potential. This should bedone at or before input power is applied to the modules. The ground signal should be maintained for at least20 ms after input power has been applied. This brief period gives the modules time to complete their internalsoft-start initialization
(4)
, enabling them to produce an output voltage. A low-cost supply voltage supervisor IC,that includes a built-in time delay, is an ideal component for automatically controlling the Track inputs at powerup.
Figure 26 shows how the TL7712A supply voltage supervisor IC (U3) can be used to coordinate the sequencedpower up of PTH08T230/231W modules. The output of the TL7712A supervisor becomes active above an inputvoltage of 3.6 V, enabling it to assert a ground signal to the common track control well before the input voltagehas reached the module's undervoltage lockout threshold. The ground signal is maintained until approximately 28ms after the input voltage has risen above U3's voltage threshold, which is 10.95 V. The 28-ms time period iscontrolled by the capacitor C3. The value of 2.2 µF provides sufficient time delay for the modules to completetheir internal soft-start initialization. The output voltage of each module remains at zero until the track controlvoltage is allowed to rise. When U3 removes the ground signal, the track control voltage automatically rises. Thiscauses the output voltage of each module to rise simultaneously with the other modules, until each reaches itsrespective set-point voltage.
Figure 27 shows the output voltage waveforms after input voltage is applied to the circuit. The waveforms, V
O
1and V
O
2, represent the output voltages from the two power modules, U1 (3.3 V) and U2 (1.8 V), respectively.V
TRK
, V
O
1, and V
O
2 are shown rising together to produce the desired simultaneous power-up characteristic.
The same circuit also provides a power-down sequence. When the input voltage falls below U3's voltagethreshold, the ground signal is re-applied to the common track control. This pulls the track inputs to zero volts,forcing the output of each module to follow, as shown in Figure 28 . Power down is normally complete before theinput voltage has fallen below the modules' undervoltage lockout. This is an important constraint. Once themodules recognize that an input voltage is no longer present, their outputs can no longer follow the voltageapplied at their track input. During a power-down sequence, the fall in the output voltage from the modules islimited by the Auto-Track slew rate capability.
1. The Track pin voltage must be allowed to rise above the module set-point voltage before the moduleregulates at its adjusted set-point voltage.2. The Auto-Track function tracks almost any voltage ramp during power up, and is compatible with rampspeeds of up to 1 V/ms.3. The absolute maximum voltage that may be applied to the Track pin is the input voltage V
I
.4. The module cannot follow a voltage at its track control input until it has completed its soft-start initialization.This takes about 20 ms from the time that a valid voltage has been applied to its input. During this period, itis recommended that the Track pin be held at ground potential.5. The Auto-Track function is disabled by connecting the Track pin to the input voltage (V
I
). When Auto-Track isdisabled, the output voltage rises at a quicker and more linear rate after input power has been applied.
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 27
Product Folder Link(s): PTH08T230W PTH08T231W
www.ti.com
V =12V
I
+
TL7712A
VCC
GND
SENSE
RESIN
REF
CT
RESET
RESET
8
7
2
1
3
5
6
4RRST
10kW
U2
U3
+
PTH08T210W
PTH08T230W
VI
VI
VO
VO
Inhibit/
UVLOProg
Inhibit/
UVLOProg
+Sense
+Sense
–Sense
–Sense
GND
GND
AutoTrack
VoAdj
VoAdj
TurboTrans
RTT
VO1=3.3V
VO2=1.8V
CO1
CI1
RSET1
1.21kW
Smart
Sync
CREF
0.1 Fm
CT
2.2 Fm
U1
AutoTrack TurboTrans
RTT
CO2
CI2
RSET2
4.75kW
t-Time=20ms/div
V 1(1V/div)
O
V 2(1V/div)
O
V (1V/div)
TRK
t-Time=400 s/divm
V 1(1V/div)
O
V 2(1V/div)
O
V (1V/div)
TRK
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
Figure 26. Sequenced Power Up and Power Down Using Auto-Track
Figure 27. Simultaneous Power Up With Auto-Track Figure 28. Simultaneous Power Down With Auto-TrackControl Control
28 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated
Product Folder Link(s): PTH08T230W PTH08T231W
www.ti.com
Prebias Startup Capability
t-Time=4ms/div
V (1V/div)
O
I (2 A/div)
O
V (1V/div)
IN
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
A prebias startup condition occurs as a result of an external voltage being present at the output of a powermodule prior to its output becoming active. This often occurs in complex digital systems when current fromanother power source is backfed through a dual-supply logic component, such as an FPGA or ASIC. Anotherpath might be via clamp diodes as part of a dual-supply power-up sequencing arrangement. A prebias can causeproblems with power modules that incorporate synchronous rectifiers. This is because under most operatingconditions, these types of modules can sink as well as source output current.
The PTH family of power modules incorporate synchronous rectifiers, but does not sink current during startup
(1)
,or whenever the Inhibit pin is held low. However, to ensure satisfactory operation of this function, certainconditions must be maintained
(2)
.Figure 30 shows an application demonstrating the prebias startup capability.The startup waveforms are shown in Figure 29 . Note that the output current (I
O
) is negligible until the outputvoltage rises above the voltage backfed through the intrinsic diodes.
The prebias start-up feature is not compatible with Auto-Track. When the module is under Auto-Track control, itsinks current if the output voltage is below that of a back-feeding source. To ensure a pre-bias hold-off one oftwo approaches must be followed when input power is applied to the module. The Auto-Track function musteither be disabled
(3)
, or the module ’ s output held off (for at least 50 ms) using the Inhibit pin. Either approachensures that the Track pin voltage is above the set-point voltage at start up.1. Startup includes the short delay (approximately 10 ms) prior to the output voltage rising, followed by the riseof the output voltage under the module ’ s internal soft-start control. Startup is complete when the outputvoltage has risen to either the set-point voltage or the voltage at the Track pin, whichever is lowest.2. To ensure that the regulator does not sink current when power is first applied (even with a ground signalapplied to the Inhibit control pin), the input voltage must always be greater than the output voltage throughoutthe power-up and power-down sequence.3. The Auto-Track function can be disabled at power up by immediately applying a voltage to the module ’ sTrack pin that is greater than its set-point voltage. This can be easily accomplished by connecting the Trackpin to V
I
.
Figure 29. Prebias Startup Waveforms
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 29
Product Folder Link(s): PTH08T230W PTH08T231W
www.ti.com
ASIC
+
Vo=2.5V
3.3V
VI=5V
R
2.37kW
SET
VCORE VCCIO
Io
PTH08T230W
Track
VIVO
GNDInhibit Vadj
+Sense
C
330 Fm
I
+
C
200 Fm
O
-Sense
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
Figure 30. Application Circuit Demonstrating Prebias Startup
30 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated
Product Folder Link(s): PTH08T230W PTH08T231W
www.ti.com
TRAY AND TAPE & REEL DRAWINGS
PTH08T230W , PTH08T231W
SLTS265F – NOVEMBER 2005 – REVISED MAY 2007
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 31
Product Folder Link(s): PTH08T230W PTH08T231W
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
PTH08T230WAD ACTIVE DIP MOD
ULE ECL 10 36 Pb-Free
(RoHS) Call TI N / A for Pkg Type
PTH08T230WAS ACTIVE DIP MOD
ULE ECM 10 36 TBD Call TI Level-1-235C-UNLIM
PTH08T230WAST ACTIVE DIP MOD
ULE ECM 10 250 TBD Call TI Level-1-235C-UNLIM
PTH08T230WAZ ACTIVE DIP MOD
ULE BCM 10 36 Pb-Free
(RoHS) Call TI Level-3-260C-168 HR
PTH08T230WAZT ACTIVE DIP MOD
ULE BCM 10 250 Pb-Free
(RoHS) Call TI Level-3-260C-168 HR
PTH08T231WAD ACTIVE DIP MOD
ULE ECL 10 36 Pb-Free
(RoHS) Call TI N / A for Pkg Type
PTH08T231WAS ACTIVE DIP MOD
ULE ECM 10 36 TBD Call TI Level-1-235C-UNLIM
PTH08T231WAST ACTIVE DIP MOD
ULE ECM 10 250 TBD Call TI Level-1-235C-UNLIM
PTH08T231WAZ ACTIVE DIP MOD
ULE BCM 10 36 Pb-Free
(RoHS) Call TI Level-3-260C-168 HR
PTH08T231WAZT ACTIVE DIP MOD
ULE BCM 10 250 Pb-Free
(RoHS) Call TI Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 9-Oct-2007
Addendum-Page 1
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