Bulletin I0503J rev. C 05/01 SC105.....5. Series SCHOTTKY DIE 105 x 125 mils a 0.35 0.01 (14 0.4) c NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). 3. DIMENSIONS AND TOLERANCES: a = 3.18 + 0, - 0.01 (125 + 0, - 0.4) b = 2.67 + 0, - 0.01 (105 + 0, - 0.4) c = 3.02 + 0, - 0.01 (119 + 0, - 0.4) d = 2.51 + 0, - 0.01 (99 + 0, - 0.4) O = 1 0.15 (40 6) A d b C D O 40 (157) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) D = Reject Ink Dot (only on non-conforming dies) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade Sawing Street 0.05 + 0, - 0.005 (2 + 0, - 0.2) Wafer flat alligned with side b of the die O 125 (492) NOT TO SCALE NOTE: 10 mils die thickness is available on specific request only. Contact factory for information. www.irf.com 1 SC105.....5. Series Bulletin I0503J rev. C 05/01 Electrical Characteristics Device TJ Max. VR Typ. IR @ 25C Typ. IR @ 125C Max. VF @ IF Package # (C) (V) (A) (mA) (V) Style SC105R015x5x 125 15 SC105S020x5x 150 20 700 180 0.51 @ 40A TO-220 SC105S030x5x 150 30 220 100 0.49 @ 15A TO-220 SC105S045x5x 150 45 150 75 0.54 @ 15A TO-247 SC105S060x5x 150 60 110 60 0.60 @ 15A TO-247 SC105H045x5x 175 45 35 10 0.62 @ 15A TO-220 SC105H100x5x 175 100 12 7 0.86 @ 15A TO-247 SC105H150x5x 175 150 15 10 1.0 @ 15A TO-220 n.a. contact factory Mechanical Data Device # Metal Thickness Front Metal Metal Thickness Back Metal SC105xxxxA5x Bondable -- Al/Si 30 kA -- Cr 1 kA Ni 2 kA Ag 3 kA SC105xxxxS5x Solderable Ti 2 kA Ni 1 kA Ag 35 kA Cr 1 kA Ni 2 kA Ag 3 kA Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination. Shelf life for parts stored in above condition is 2 years. If the storage is done in normal atmosphere shelf life is reduced to six months. Packaging Device # 2 Description Minimum Order Quantity Die in Sale Package SC105xxxxx5B Inked Probed Unsawn Wafer (Wafer in Box) 1170 SC105xxxxx5R Probed Die in Tape & Reel 8,000 SC105xxxxx5P Probed Die in Waffle Pack 1170 SC105xxxxx5F Inked Probed Sawn Wafer on Film 1170 www.irf.com SC105.....5. Series Bulletin I0503J rev. C 05/01 Ordering Information Table Device Code SC 105 1 2 H 100 S 5 B 3 4 5 6 7 1 - Schottky Die 2 - Chip Dimension in Mils 3 - Process (see Electrical Characteristics Table) 4 - Voltage code: Code = VRRM 5 - Chip surface metallization (see Mechanical Data Table) 6 - Wafer Diameter in inches 7 - Packaging (see Packaging Table) H = 830 Process R = OR'ing Process S = Standard Process Wafer on Film STEEL FRAME www.irf.com 3 SC105.....5. Series Bulletin I0503J rev. C 05/01 Wafer in Box ROUND CONTAINER TYVEK DISK FOAM DISK Die in Waffle Pack CHIP TRAY POCKET 4 www.irf.com SC105.....5. Series Bulletin I0503J rev. C 05/01 Tape and Reel REEL FRAME BARE DIE CARRIER TAPE WORLD HEADQUARTERS: EUROPEAN HEADQUARTERS: IR CANADA: IR GERMANY: IR ITALY: IR FAR EAST: IR SOUTHEAST ASIA: IR TAIWAN: http://www.irf.com www.irf.com 233 Kansas St., El Segundo, California 90245 U.S.A. Tel: (310) 322 3331. Fax: (310) 322 3332. Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408. 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801. Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933. Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220. K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086. 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630. 16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: 886 2 2377 9936. Fax-On-Demand: +44 1883 733420 Data and specifications subject to change without notice. 5