SCHOTTKY DIE 105 x 125 mils
SC105.....5. Series
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Bulletin I0503J rev. C 05/01
NOTE: 10 mils die thickness is available on specific request only.
Contact factory for information.
NOT TO SCALE
40 (157)
Ø 125 (492)
NOTES:
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS).
2. CONTROLLING DIMENSION: (MILS).
3. DIMENSIONS AND TOLERANCES:
a = 3.18 + 0, - 0.01
(125 + 0, - 0.4)
b = 2.67 + 0, - 0.01
(105 + 0, - 0.4)
c = 3.02 + 0, - 0.01
(119 + 0, - 0.4)
d = 2.51 + 0, - 0.01
(99 + 0, - 0.4)
Ø = 1 ± 0.15
(40 ± 6)
4. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
D = Reject Ink Dot (only on non-conforming dies)
5. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Sawing Street
0.05 + 0, - 0.005
(2 + 0, - 0.2)
a
d
Ø
0.35 ± 0.01
C
A
D
c
b
(14 ± 0.4)
Wafer flat alligned with
side b of the die
SC105.....5. Series
2
Bulletin I0503J rev. C 05/01
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SC105xxxxx5BInked Probed Unsawn Wafer (Wafer in Box) 1170
SC105xxxxx5RProbed Die in Tape & Reel 8,000
SC105xxxxx5PProbed Die in Waffle Pack 1170
SC105xxxxx5FInked Probed Sawn Wafer on Film 1170
Device TJ Max. VRTyp. IR @ 25°C Typ. IR @ 125°C Max. VF @ IFPackage
# (°C) (V) (µA) (mA) (V) Style
SC105R015x5x 125 15 n.a. contact factory
SC105S020x5x 150 20 700 180 0.51 @ 40A TO-220
SC105S030x5x 150 30 220 100 0.49 @ 15A TO-220
SC105S045x5x 150 45 150 75 0.54 @ 15A TO-247
SC105S060x5x 150 60 110 60 0.60 @ 15A TO-247
SC105H045x5x 175 45 35 10 0.62 @ 15A TO-220
SC105H100x5x 175 100 12 7 0.86 @ 15A TO-247
SC105H150x5x 175 150 15 10 1.0 @ 15A TO-220
Electrical Characteristics
Device Metal Thickness Metal Thickness
# Front Metal Back Metal
SC105xxxxA5x Bondable -- Al/Si 30 kÅ -- Cr 1 kÅ Ni 2 kÅ Ag 3 kÅ
SC105xxxxS5x Solderable Ti 2 kÅ Ni 1 kÅ Ag 35 kÅ Cr 1 kÅ Ni 2 kÅ Ag 3 kÅ
Mechanical Data
Device Description Minimum Order Quantity
#Die in Sale Package
Packaging
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.
SC105.....5. Series
3
Bulletin I0503J rev. C 05/01
www.irf.com
SC 105 H 100 S 5 B
1 2 3
1- Schottky Die
2- Chip Dimension in Mils
3- Process (see Electrical Characteristics Table)
4- Voltage code: Code = VRRM
5- Chip surface metallization (see Mechanical Data Table)
6- Wafer Diameter in inches
7- Packaging (see Packaging Table)
4
Device Code
Ordering Information Table
567
H = 830 Process
R = OR'ing Process
S = Standard Process
Wafer on Film
STEEL FRAME
SC105.....5. Series
4
Bulletin I0503J rev. C 05/01
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Wafer in Box
Die in Waffle Pack
ROUND CONTAINER
FOAM DISK
TYVEK DISK
CHIP TRAY POCKET
SC105.....5. Series
5
Bulletin I0503J rev. C 05/01
www.irf.com
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 U.S.A. Tel: (310) 322 3331. Fax: (310) 322 3332.
EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408.
IR CANADA: 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801.
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933.
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220.
IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086.
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630.
IR TAIWAN: 16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: 886 2 2377 9936.
http://www.irf.com Fax-On-Demand: +44 1883 733420 Data and specifications subject to change without notice.
Tape and Reel
BARE DIE CARRIER TAPE
REEL FRAME
