W78LE51C/W78L051C
8-BIT MICROCONTROLLER
Publication Release Date: December 4, 2006
- 1 - Revision A3
Table of Contents-
1. GENERAL DESCRIPTION......................................................................................................... 2
2. FEATURES................................................................................................................................. 2
3. PIN CONFIGURATIONS ............................................................................................................ 3
4. PIN DESCRIPTION..................................................................................................................... 4
5. FUNCTIONAL DESCRIPTION ................................................................................................... 5
6. ON-CHIP FLASH EPROM CHARACTERISTICS..................................................................... 10
7. SECURITY BITS....................................................................................................................... 10
8. ABSOLUTE MAXIMUM RATINGS ........................................................................................... 11
9. DC CHARACTERISTICS.......................................................................................................... 12
10. AC CHARACTERISTICS.......................................................................................................... 14
11. TIMING WAVEFORMS............................................................................................................. 17
12. TYPICAL APPLICATION CIRCUITS........................................................................................ 19
13. PACKAGE DIMENSIONS......................................................................................................... 21
14. REVISION HISTORY................................................................................................................ 23
W78LE51C/W78L051C
- 2 -
1. GENERAL DESCRIPTION
The W78L051C is an 8-bit microcontroller which can accommodate a wide supply voltage range with
low power consumption. The instruction set for the W78L051C is fully compatible with the standard
8051. The W78L051C contains an 4K bytes Flash EPROM; a 128 bytes RAM; four 8-bit bi-directional
and bit-addressable I/O ports; an additional 4-bit I/O port P4; two 16-bit timer/counters; a hardware
watchdog timer and a serial port. These peripherals are supported by seven sources two-level
interrupt capability. To facilitate programming and verification, the Flash EPROM inside the
W78L051C allows the program memory to be programmed and read electronically. Once the code is
confirmed, the user can protect the code for security.
The W78L051C microcontroller has two power reduction modes, idle mode and power-down mode,
both of which are software selectable. The idle mode turns off the processor clock but allows for
continued peripheral operation. The power-down mode stops the crystal oscillator for minimum power
consumption. The external clock can be stopped at any time and in any state without affecting the
processor.
2. FEATURES
Fully static design 8-bit CMOS microcontroller
Wide supply voltage of 2.4V to 5.5V
128 bytes of on-chip scratchpad RAM
4 KB electrically erasable/programmable Flash EPROM
64 KB program memory address space
64 KB data memory address space
Four 8-bit bi-directional ports
One extra 4-bit bit-addressable I/O port, additional INT2 / INT3
(available on 44-pin PLCC/QFP package)
Two 16-bit timer/counters
One full duplex serial port (UART)
Watchdog Timer
seven sources, two-level interrupt capability
EMI reduction mode
Built-in power management
Code protection mechanism
Packages:
Lead Free (RoHS) DIP 40: W78L051C24DL
Lead Free (RoHS) PLCC 44: W78L051C24PL
Lead Free (RoHS) PQFP 44: W78L051C24FL
W78LE51C/W78L051C
Publication Release Date: December 4, 2006
- 3 - Revision A3
3. PIN CONFIGURATIONS
W78LE51C/W78L051C
- 4 -
4. PIN DESCRIPTION
SYMBOL DESCRIPTIONS
E
A
EXTERNAL ACCESS ENABLE: This pin forces the processor to execute out of
external ROM. It should be kept high to access internal ROM. The ROM address and
data will not be presented on the bus if E
A
pin is high and the program counter is
within on-chip ROM area.
PSEN PROGRAM STORE ENABLE: PSEN enables the external ROM data onto the Port 0
address/ data bus during fetch and MOVC operations. When internal ROM access is
performed, no PSEN strobe signal outputs from this pin.
ALE ADDRESS LATCH ENABLE: ALE is used to enable the address latch that separates
the address from the data on Port 0.
RST RESET: A high on this pin for two machine cycles while the oscillator is running resets
the device.
XTAL1 CRYSTAL1: This is the crystal oscillator input. This pin may be driven by an external
clock.
XTAL2 CRYSTAL2: This is the crystal oscillator output. It is the inversion of XTAL1.
VSS GROUND: Ground potential
VDD POWER SUPPLY: Supply voltage for operation.
P0.0P0.7 PORT 0: Port 0 is a bi-directional I/O port which also provides a multiplexed low order
address/data bus during accesses to external memory. The Port 0 is also an open-
drain port and external pull-ups need to be connected while in programming.
P1.0P1.7
PORT 1: Port 1 is a bi-directional I/O port with internal pull-ups. The bits have alternate
functions which are described below:
T2(P1.0): Timer/Counter 2 external count input
T2EX(P1.1): Timer/Counter 2 Reload/Capture control
P2.0P2.7 PORT 2: Port 2 is a bi-directional I/O port with internal pull-ups. This port also provides
the upper address bits for accesses to external memory.
PORT 3: Port 3 is a bi-directional I/O port with internal pull-ups. All bits have alternate
functions, which are described below:
RXD(P3.0) : Serial Port receiver input
TXD(P3.1) : Serial Port transmitter output
INT0 (P3.2) : External Interrupt 0
P3.0P3.7 INT1(P3.3) : External Interrupt 1
T0(P3.4) : Timer 0 External Input
T1(P3.5) : Timer 1 External Input
WR(P3.6) :External Data Memory Write Strobe
RD(P3.7) : External Data Memory Read Strobe
P4.0P4.3 PORT 4: Another bit-addressable bidirectional I/O port P4. P4.3 and P4.2 are alternative
function pins. It can be used as general I/O port or external interrupt input sources
(INT2 /INT3 ).
W78LE51C/W78L051C
Publication Release Date: December 4, 2006
- 5 - Revision A3
5. FUNCTIONAL DESCRIPTION
The W78L051C architecture consists of a core controller surrounded by various registers, five general
purpose I/O ports, 128 bytes of RAM, two timer/counters, and a serial port. The processor supports
111 different opcodes and references both a 64K program address space and a 64K data storage
space.
New Defined Peripheral
In order to be more suitable for I/O, an extra 4-bit bit-addressable port P4 and two external interrupt
INT2 , INT3 has been added to either the PLCC or QFP 44 pin package. And description follows:
1. INT2/ INT3
Two additional external interrupts, INT2 and INT3 , whose functions are similar to those of external
interrupt 0 and 1 in the standard 80C52. The functions/status of these interrupts are
determined/shown by the bits in the XICON (External Interrupt Control) register. The XICON register is
bit-addressable but is not a standard register in the standard 80C52. Its address is at 0C0H. To
set/clear bits in the XICON register, one can use the "SETB (/CLR) bit" instruction. For example,
"SETB 0C2H" sets the EX2 bit of XICON.
XICON - external interrupt control (C0H)
PX3 EX3 IE3 IT3 PX2 EX2 IE2 IT2
PX3: External interrupt 3 priority high if set
EX3: External interrupt 3 enable if set
IE3: If IT3 = 1, IE3 is set/cleared automatically by hardware when interrupt is detected/serviced
IT3: External interrupt 3 is falling-edge/low-level triggered when this bit is set/cleared by software
PX2: External interrupt 2 priority high if set
EX2: External interrupt 2 enable if set
IE2: If IT2 = 1, IE2 is set/cleared automatically by hardware when interrupt is detected/serviced
IT2: External interrupt 2 is falling-edge/low-level triggered when this bit is set/cleared by software
Eight-source interrupt informations:
INTERRUPT SOURCE VECTOR
ADDRESS
POLLING
SEQUENCE WITHIN
PRIORITY LEVEL
ENABLE
REQUIRED
SETTINGS
INTERRUPT TYPE
EDGE/LEVEL
External Interrupt 0 03H 0 (highest) IE.0 TCON.0
Timer/Counter 0 0BH 1 IE.1 -
External Interrupt 1 13H 2 IE.2 TCON.2
Timer/Counter 1 1BH 3 IE.3 -
Serial Port 23H 4 IE.4 -
External Interrupt 2 33H 5 XICON.2 XICON.0
External Interrupt 3 3BH 6 (lowest) XICON.6 XICON.3
W78LE51C/W78L051C
- 6 -
2. PORT4
Another bit-addressable port P4 is also available and only 4 bits (P4<3:0>) can be used. This port
address is located at 0D8H with the same function as that of port P1, except the P4.3 and P4.2 are
alternative function pins. It can be used as general I/O pins or external interrupt input sources (INT2 ,
INT3 ).
Example:
P4 REG 0D8H
MOV P4, #0AH ; Output data "A" through P4.0P4.3.
MOV A, P4 ; Read P4 status to Accumulator.
ORL P4.#00000001B ; Set P4.0 to be high state
ANL P4.#11111110B ; Clear P4.0 to be low state.
3. Reduce EMI Emission
Because of on-chip Flash EPROM, when a program is running in internal ROM space, the ALE will be
unused. The transition of ALE will cause noise, so it can be turned off to reduce the EMI emission if it
is useless. Turning off the ALE signal transition only requires setting the bit 0 of the AUXR SFR, which
is located at 08Eh. When ALE is turned off, it w ill be reactivated when the program accesses external
ROM/RAM data or jumps to execute an external ROM code. The ALE signal will turn off again after it
has been completely accessed or the program returns to internal ROM code space. The AO bit in the
AUXR register, when set, disables the ALE output. In order to reduce EMI emission from oscillation
circuitry, W78L051C allows user to diminish the gain of on-chip oscillator amplifiers by using
programmer to clear the B7 bit of security register. Once B7 is set to 0, a half of gain will be
decreased. Care must be taken if user attempts to diminish the gain of oscillator amplifier, reducing a
half of gain may effect to external crystal operating improperly at high frequency above 20 MHz. The
value of R and C1, C2 may need some adjustment while running at lower gain.
***AUXR - Auxiliary register (8EH)
- - - - - - - AO
AO: Turn off ALE output.
4. Power-off Flag
***PCON - Power control (87H)
- - - POF GF1 GF0 PD IDL
POF: Power off flag. Bit is set by hardware when power on reset. It can be cleared by software
to determine chip reset is a warm boot or cold boot.
GF1, GF0: These two bits are general-purpose flag bits for the user.
PD: Power down mode bit. Set it to enter power down mode.
IDL: Idle mode bit. Set it to enter idle mode.
The power-off flag is located at PCON.4. This bit is set when VDD has been applied to the part. It can
be used to determine if a reset is a warm boot or a cold boot if it is subsequently reset by software.
W78LE51C/W78L051C
Publication Release Date: December 4, 2006
- 7 - Revision A3
Watchdog Timer
The Watchdog timer is a free-running timer which can be programmed by the user to serve as a
system monitor, a time-base generator or an event timer. It is basically a set of dividers that divide the
system clock. The divider output is selectable and determines the time-out interval. When the time-out
occurs a system reset can also be caused if it is enabled. The main use of the Watchdog timer is as a
system monitor. This is important in real-time control applications. In case of power glitches or electro-
magnetic interference, the processor may begin to execute errant code. If this is left unchecked the
entire system may crash. The watchdog time-out selection will result in different time-out values
depending on the clock speed. The Watchdog timer will de disabled on reset. In general, software
should restart the Watchdog timer to put it into a known state. The control bits that support the
Watchdog timer are discussed below.
Watchdog Timer Control Register
Bit: 7 6 5 4 3 2 1 0
ENW CLRW WIDL - - PS2 PS1 PS0
Mnemonic: WDTC Address: 8FH
ENW : Enable watch-dog if set.
CLRW: Clear watch-dog timer and prescaler if set. This flag will be cleared automatically
WIDL : If this bit is set, watch-dog is enabled under IDLE mode. If cleared, watch-dog is disabled
under IDLE mode. Default is cleared.
PS2, PS1, PS0: Watch-dog prescaler timer select. Prescaler is selected when set PS20 as follows:
PS2 PS1 PS0 PRESCALER SELECT
0 0 0 2
0 0 1 4
0 1 0 8
0 1 1 16
1 0 0 32
1 0 1 64
1 1 0 128
1 1 1 256
The time-out period is obtained using the following equation:
1
OSC 2 PRESCALER 1000 12 mS
14
×× × ×
Before Watchdog time-out occurs, the program must clear the 14-bit timer by writing 1 to WDTC.6
(CLRW). After 1 is written to this bit, the 14-bit timer, prescaler and this bit will be reset on the next
instruction cycle. The Watchdog timer is cleared on reset.
W78LE51C/W78L051C
- 8 -
OSC 1/12 PRESCALER 14-BIT TIMER
CLEAR
CLRW
EXTERNAL
RESET
INTERNAL
RESET
WIDL
IDLE
ENW
Watchdog Timer Block Diagram
Typical Watch-Dog time-out period when OSC = 20 MHz
PS2 PS1 PS0 WATCHDOG TIME-OUT PERIOD
0 0 0 19.66 mS
0 1 0 39.32 mS
0 0 1 78.64 mS
0 1 1 157.28 mS
1 0 0 314.57mS
1 0 1 629.14 mS
1 1 0 1.25 S
1 1 1 2.50 S
Clock
The W78L051C is designed to be used with either a crystal oscillator or an external clock. Internally,
the clock is divided by two before it is used. This makes the W78L051C relatively insensitive to duty
cycle variations in the clock. The W78L051C incorporates a built-in crystal oscillator. To make the
oscillator work, a crystal must be connected across pins XTAL1 and XTAL2. In addition, a load
capacitor must be connected from each pin to ground. An external clock source should be connected
to pin XTAL1. Pin XTAL2 should be left unconnected. The XTAL1 input is a CMOS-type input, as
required by the crystal oscillator.
W78LE51C/W78L051C
Publication Release Date: December 4, 2006
- 9 - Revision A3
Power Management
Idle Mode
The idle mode is entered by setting the IDL bit in the PCON register. In the idle mode, the internal
clock to the processor is stopped. The peripherals and the interrupt logic continue to be clocked. The
processor will exit idle mode when either an interrupt or a reset occurs.
Power-down Mode
When the PD bit of the PCON register is set, the processor enters the power-down mode. In this
mode all of the clocks are stopped, including the oscillator. The only way to exit power-down mode is
by a reset.
Reset
The external RESET signal is sampled at S5P2. To take effect, it must be held high for at least two
machine cycles while the oscillator is running. An internal trigger circuit in the reset line is used to
deglitch the reset line when the W78L051C is used with an external RC network. The reset logic also
has a special glitch removal circuit that ignores glitches on the reset line.
During reset, the ports are initialized to FFH, the stack pointer to 07H, PCON (with the exception of bit
4) to 00H, and all of the other SFR registers except SBUF to 00H. SBUF is not reset.
W78LE51C/W78L051C
- 10 -
6. ON-CHIP FLASH EPROM CHARACTERISTICS
7. SECURITY BITS
During the on-chip Flash EPROM operation mode, the Flash EPROM can be programmed and
verified repeatedly. Until the code inside the Flash EPROM is confirmed OK, the code can be
protected. The protection of Flash EPROM and those operations on it are described below. The
W78L051C has a Special Setting Register, the Security Register, which can not be accessed in
normal mode. The Security register can only be accessed from the Flash EPROM operation mode.
Those bits of the Security Registers can not be changed once they have been programmed from high
to low. They can only be reset through erase-all operation. The Security Register is addressed in the
Flash EPROM operation mode by address #0FFFFh.
B0B1
B0 : Lock bit, logic 0 : active
B1 : MOVC inhibit,
logic 0 : the MOVC instruction in external memory
cannot access the code in internal memory.
logic 1 : no restriction.
Default 1 for all security bits.
Special Setting Register
Security Bits 4KB Flash EPROM
Program Memory
Reserved
Security Register 0FFFFh
0000h
0FFFh
Reserved B2
B2 : Encryption
logic 0 : the encryption logic enable
logic 1 : the encryption logic disable
Reserved bits must be kept in logic 1.
B7
B7 : Osillator Control
logic 0 : 1/2 gain
logic 1 : Full gain
D7 D6 D5 D4 D3 D2 D1 D0
W78LE51C/W78L051C
Publication Release Date: December 4, 2006
- 11 - Revision A3
Lock bit
This bit is used to protect the customer's program code in the W78L051C. It may be set after the
programmer finishes the programming and verifies sequence. Once this bit is set to logic 0, both the
Flash EPROM data and Special Setting Registers can not be accessed again.
MOVC Inhibit
This bit is used to restrict the accessible region of the MOVC instruction. It can prevent the MOVC
instruction in external program memory from reading the internal program code. When this bit is set to
logic 0, a MOVC instruction in external program memory space will be able to access code only in the
external memory, not in the internal memory. A MOVC instruction in internal program memory space
will always be able to access the ROM data in both internal and external memory. If this bit is logic 1,
there are no restrictions on the MOVC instruction.
Encryption
This bit is used to enable/disable the encryption logic for code protection. Once encryption feature is
enabled, the data presented on port 0 will be encoded via enc ryption logic. Only whole chip erase will
reset this bit.
8. ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL MIN. MAX. UNIT
DC Power Supply VDDVSS -0.3 +7.0 V
Input Voltage VIN VSS -0.3 VDD +0.3 V
Operating Temperature TA 0 70
°C
Storage Temperature TST -55 +150
°C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability
of the device.
W78LE51C/W78L051C
- 12 -
9. DC CHARACTERISTICS
VSS = 0V, TA = 25° C, unless otherwise specified.
SPECIFICATION
PARAMETER SYM.
MIN. MAX. UNIT TEST CONDITIONS
Operating Voltage VDD 2.4 5.5 V
- 20 mA No load VDD = 5.5V
Operating Current IDD - 3 mA No load VDD = 2.4V
- 6 mA VDD = 5.5V, FOSC = 20 MHz
Idle Current IIDLE - 1.5 mA VDD = 2.4V, FOSC = 12 MHz
- 50
μA VDD = 5.5V, FOSC = 20 MHz
Power Down Current IPWDN - 20
μA VDD = 2.4V, FOSC = 12 MHz
Input Current
P1, P2, P3, P4 IIN1 -50 +10 μA VDD = 5.5V
VIN = 0V or VDD
Input Current
RST IIN2 -10 +300 μA VDD = 5.5V
0 < VIN < VDD
Input Leakage Current
P0, E
A
ILK -10 +10 μA VDD = 5.5V
0V < VIN < VDD
Logic 1 to 0 Transition
Current
P1, P2, P3, P4 ITL [*4] -500 - μA VDD = 5.5V
VIN = 2.0V
Input Low Voltage 0 0.8 V VDD = 4.5V
P0, P1, P2, P3, P4,
E
A
VIL1 0 0.5 V VDD = 2.4V
Input Low Voltage 0 0.8 V VDD = 4.5V
RST[*1] VIL2 0 0.3 V VDD = 2.4V
Input Low Voltage 0 0.8 V VDD = 4.5V
XTAL1 [*3] VIL3 0 0.6 V VDD = 2.4V
Input High Voltage 2.4 VDD
+0.2 V VDD = 5.5V
P0, P1, P2, P3, P4,E
A
VIH1 1.4 VDD
+0.2 V VDD = 2.4V
Input High Voltage 3.5 VDD
+0.2 V VDD = 5.5V
RST[*1] VIH2 1.7 VDD
+0.2 V VDD = 2.4V
Input High Voltage 3.5 VDD
+0.2 V VDD = 5.5V
XTAL1 [*3] VIH3 1.6 VDD
+0.2 V VDD = 2.4V
W78LE51C/W78L051C
Publication Release Date: December 4, 2006
- 13 - Revision A3
DC Characteristics, continued
SPECIFICATION
PARAMETER SYM.
MIN. MAX. UNIT TEST CONDITIONS
Output Low Voltage - 0.45 V VDD = 4.5V, IOL = +2 mA
P1, P2, P3, P4 VOL1 - 0.25 V VDD = 2.4V, IOL = +1 mA
Output Low Voltage - 0.45 V VDD = 4.5V, IOL = +4 mA
VOL2 - 0.25 V VDD = 2.4V, IOL = +2 mA
PSENP0, ALE, [*2]
Sink Current 4 12 mA VDD = 4.5V, Vin = 0.45V
ISK1
P1, P2, P3, P4 1.8 5.4 mA VDD = 2.4V, Vin = 0.45V
Sink Current 8 16 mA VDD = 4.5V, Vin = 0.45V
ISK2
P0, ALE, PSEN 4.5 9 mA VDD = 2.4V, Vin = 0.45V
Output High Voltage 2.4 - V VDD = 4.5V, IOH = -100 μA
VOH1 1.4 - V
P1, P2, P3, P4 VDD = 2.4V, IOH = -8 μA
Output High Voltage 2.4 - V VDD = 4.5V, IOH = -400 μA
VOH2 1.4 - V
VDD = 2.4V, IOH = -200 μA
PSENP0, ALE, [*2]
Source Current -100 -250 VDD = 4.5V, Vin = 2.4V
μA
ISR1 -20 -50 VDD = 2.4V, Vin = 1.4V P1, P2, P3, P4 μA
Source Current -8 -14 mA VDD = 4.5V, Vin = 2.4V
ISR2
P0, ALE, PSEN -1.9 -3.8 mA VDD = 2.4V, Vin = 1.4V
Notes:
*1. RST pin is a Schmitt trigger input.
*2. P0, ALE and /PSEN are tested in the external access mode.
*3. XTAL1 is a CMOS input.
*4. Pins of P1, P2, P3, P4 can source a transition current when they are being externally driven from 1 to 0.
W78LE51C/W78L051C
- 14 -
10. AC CHARACTERISTICS
The AC specifications are a function of the particular process used to manufacture the part, the ratings
of the I/O buffers, the capacitive load, and the internal routing capacitance. Most of the specifications
can be expressed in terms of multiple input clock periods (TCP), and actual parts will usually
experience less than a ±20 nS variation. The numbers below represent the performance expected
from a 0.6micron CMOS process when using 2 and 4 mA output buffers.
Clock Input Waveform
T
T
XTAL1
F
CH CL
OP, TCP
PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTES
FOP Operating Speed 0 - 20 MHz 1
TCP Clock Period 50 - - nS 2
TCH Clock High 25 - - nS 3
TCL Clock Low 25 - - nS 3
Notes:
1. The clock may be stopped indefinitely in either state.
2. The TCP specification is used as a reference in other specifications.
3. There are no duty cycle requirements on the XTAL1 input.
Program Fetch Cycle
PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTES
TAAS Address Valid to ALE Low - - nS 4
1 TCP -Δ
TAAH Address Hold from ALE Low - - nS 1, 4
1 TCP -Δ
TAPL - - nS 4
ALE Low to PSEN 1 TCP -Δ
Low
TPDA - - 2 TCP nS 2
PSEN Low to Data Valid
TPDH 0 - 1 TCP nS 3
Data Hold after PSEN High
TPDZ 0 - 1 TCP nS
Data Float after PSEN High TALW ALE Pulse Width - nS 4
2 TCP
2 TCP -Δ
TPSW - nS 4
3 TCP
3 TCP -Δ
PSEN Pulse Width
Notes:
1. P0.0P0.7, P2.0P2.7 remain stable throughout entire memory cycle.
2. Memory access time is 3 TCP.
PSEN
3. Data have been latched internally prior to going high.
4. "Δ" (due to buffer driving delay and wire loading) is 20 nS.
W78LE51C/W78L051C
Publication Release Date: December 4, 2006
- 15 - Revision A3
Data Read Cycle
PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTES
TDAR - nS 1, 2
3 TCP +Δ
3 TCP -Δ
ALE Low to RD Low
TDDA
RD Low to Data Valid - - 4 TCP nS 1
TDDH 2 TCP 0 - nS
Data Hold from RD High
TDDZ
Data Float from RD High 0 - 2 TCP nS
TDRD - nS 2
6 TCP
6 TCP -Δ
RD Pulse Width
Notes:
1. Data memory access time is 8 TCP.
2. "Δ" (due to buffer driving delay and wire loading) is 20 nS.
Data Write Cycle
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
TDAW - nS
3 TCP -Δ 3 TCP +Δ
ALE Low to WR Low
TDAD - - nS
1 TCP -Δ
Data Valid to WR Low
TDWD - - nS
1 TCP -Δ
Data Hold from WR High
TDWR 6 TCP - nS
6 TCP -Δ
WR Pulse Width
Note: "Δ" (due to buffer driving delay and wire loading) is 20 nS.
Port Access Cycle
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
TPDS 1 TCP Port Input Setup to ALE Low - - nS
TPDH Port Input Hold from ALE Low 0 - - nS
TPDA 1 TCP Port Output to ALE - - nS
Note: Ports are read during S5P2, and output data becomes available at the end of S6P2. The timing data are referenced to
ALE, since it provides a convenient reference.
W78LE51C/W78L051C
- 16 -
Program Operation
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
VPP Setup Time TVPS 2.0 - - μS
Data Setup Time TDS 2.0 - - μS
Data Hold Time TDH 2.0 - - μS
Address Setup Time TAS 2.0 - - μS
Address Hold Time TAH 0 - - μS
290 300 310 TPWP μS
CE Program Pulse Width for Program Operation TOCS OECTRL Setup Time 2.0 - - μS
TOCH OECTRL Hold Time 2.0 - - μS
2.0 - - TOES μS
OE Setup Time TDFP 0 - 130 nS
OE High to Output Float - - 150 nS TOEV
OE Data Valid from
Note: Flash data can be accessed only in flash mode. The RST pin must pull in VIH status, the ALE pin must pull in VIL status,
and the PSEN pin must pull in VIH status.
W78LE51C/W78L051C
Publication Release Date: December 4, 2006
- 17 - Revision A3
11. TIMING WAVEFORMS
Program Fetch Cycle
S1
XTAL1
S2 S3 S4 S5 S6 S1 S2 S3 S4 S5 S6
ALE
PORT 2
A0-A7
A0-A7 Data
A0-A7 Code
T
A0-A7 Data
Code
PORT 0
PSEN
PDH, TPDZ
TPDA
TAAH
TAAS
TPSW
TAPL
TALW
Data Read Cycle
S2 S3S5 S6 S1S2 S3 S4S5 S6 S1S4
XTAL1
ALE
PSEN
DATA
A8-A15
PORT 2
PORT 0 A0-A7
RD TDDH, TDDZ
TDDA
TDRD
TDAR
W78LE51C/W78L051C
- 18 -
Data Write Cycle
S2 S3S5 S6 S1S2 S3 S4S1S5 S6S4
XTAL1
ALE
PSEN
A8-A15
DATA OUT
PORT 2
PORT 0 A0-A7
WR T
TDAW
DAD
TDWR
TDWD
Port Access Cycle
XTAL1
ALE
S5 S6 S1
DATA OUT
T
T
PORT
INPUT
T
SAMPLE
PDA
PDHPDS
W78LE51C/W78L051C
Publication Release Date: December 4, 2006
- 19 - Revision A3
12. TYPICAL APPLICATION CIRCUITS
Expanded External Program Memory and Crystal
AD0
A0 A0 A0
10 A1
9 A2
8 A3
7 A4
6 A5
5 A6
4 A7
3 A8
25 A9
24 A10
21 A11
23 A12
2 A13
26 A14
27 A15
1
CE
20
OE
22
O0 11
O1 12
O2 13
O3 15
O4 16
O5 17
O6 18
O7 19
27512
AD0 D0
3 Q0 2
D1
4 Q1 5
D2
7 Q2 6
D3
8 Q3 9
D4
13 Q4 12
D5
14 Q5 15
D6
17 Q6 16
D7
18 Q7 19
OC
1
G
11
74373
AD0
EA
31
XTAL1
19
XTAL2
18
RST
9
INT0
12 INT1
13 T0
14 T1
15
P1.0
1 P1.1
2 P1.2
3 P1.3
4 P1.4
5 P1.5
6 P1.6
7 P1.7
8
39
38
37
36
35
34
33
32
21
22
23
24
25
26
27
28
17
WR
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
RD 16
PSEN 29
ALE 30
TXD 11
RXD 10
W78LE51C/W78L051C
10 u
8.2 K
DD
CRYSTAL
C1 C2
R
AD1
AD2
AD3
AD4
AD5
AD6
AD7
A8
AD1
AD2
AD3
AD4
AD5
AD6
AD7
GND
A1
A2
A3
A4
A5
A6
A7
A1
A2
A3
A4
A5
A6
A7
A8
A9
AD1
AD2
AD3
AD4
AD5
AD6
AD7
A10
A11
A12
A13
A14
A15
GND
A9
A10
A11
A12
A13
A14
A15
V
DD
V
Figure A
CRYSTAL C1 C2 R
16 MHz 30P 30P -
20 MHz 15P 15P -
Above table shows the reference values for crystal applications (full gain).
Note: C1, C2, R components refer to Figure A.
W78LE51C/W78L051C
- 20 -
Expanded External Data Memory and Oscillator
10 u
8.2 K
DD
OSCILLATOR
EA
31
XTAL1
19
XTAL2
18
RST
9
INT0
12 INT1
13 T0
14 T1
15
1
2
3
4
5
6
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P1.6
7 P1.7
8
P0.0 39
P0.1 38
P0.2 37
P0.3 36
P0.4 35
P0.5 34
P0.6 33
P0.7 32
P2.0 21
P2.1 22
P2.2 23
P2.3 24
P2.4 25
P2.5 26
P2.6 27
P2.7 28
RD 17
WR 16
PSEN 29
ALE 30
TXD 11
RXD 10
W78LE51C/W78L051C
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
A0
A1
A2
A3
A4
A5
A6
A7
D0
3 Q0 2
D1
4 Q1 5
D2
7 Q2 6
D3
8 Q3 9
D4
13 Q4 12
D5
14 Q5 15
D6
17 Q6 16
D7
18 Q7 19
OC
1
G
11
74373
A0
A1
A2
A3
A4
A5
A6
A7
10
9
8
7
6
5
4
3
A0
A1
A2
A3
A4
A5
A6
A7
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
11
12
13
15
16
17
18
19
D0
D1
D2
D3
D4
D5
D6
D7
A8
A9
A10
A11
A12
A13
A14
25
24
21
23
26
1
20
2
A8
A9
A10
A11
A12
A13
A14
CE
GND
A8
A9
A10
A11
A12
A13
A14
GND
22
27 OE
WR
20256
V
DD
V
Figure B
W78LE51C/W78L051C
Publication Release Date: December 4, 2006
- 21 - Revision A3
13. PACKAGE DIMENSIONS
40-pin DIP
Seating Plane
1. Dimension D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.
6. General appearance spec. should be based on
final visual inspection spec.
.
1.3721.219
0.0540.048
Notes:
Symbol Min. Nom. Max. Max.
Nom.
Min.
Dimension in inch Dimension in mm
0.050 1.27
0.210 5.334
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.406
0.254
3.937
0.457
4.064
0.559
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.203
3.048
0.254
3.302
0.356
3.556
0.540 0.550
0.545 13.72 13.97
13.84
17.01
15.24
14.986 15.494
0.6000.590 0.610
2.286 2.54 2.7940.090 0.100 0.110
A
B
c
D
e
A
L
S
A
A1
2
E
B1
1
e
E1
a
2.055 2.070 52.20 52.58
015
0.090 2.286
0.650
0.630 16.00 16.51
protrusion/intrusion.
4. Dimension B1 does not include dambar
5. Controlling dimension: Inches.
150
eA
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
B
40 21
20
1
2
44-pin PLCC
44 40
39
29
2818
17
7
61
L
c
1
b
2
A
H
D
D
eb
EHE
y
A
A1
Seating Plane
D
G
GE
Symbol Min. Nom. Max. Max.
Nom.
Min.
Dimension in inch Dimension in mm
A
e
HE
L
y
b
c
D
A
A1
2
E
b1
HD
G
GD
E
Notes:
on final visual inspection spec.
4. General appearance spec. should be based
3. Controlling dimension: Inches
protrusion/intrusion.
2. Dimension b1 does not include dambar
flash.
1. Dimension D & E do not include interlead
0.020
0.145
0.026
0.016
0.008
0.648
0.590
0.680
0.090
0.150
0.028
0.018
0.010
0.653
0.610
0.690
0.100
0.050 BSC
0.185
0.155
0.032
0.022
0.014
0.658
0.630
0.700
0.110
0.004
0.508
3.683
0.66
0.406
0.203
16.46
14.99
17.27
2.296
3.81
0.711
0.457
0.254
16.59
15.49
17.53
2.54
1.27
4.699
3.937
0.813
0.559
0.356
16.71
16.00
17.78
2.794
0.10
BSC
16.71
16.59
16.46
0.658
0.653
0.648
16.00
15.4914.99
0.6300.610
0.590
17.7817.53
17.27
0.700
0.690
0.680
θ
W78LE51C/W78L051C
- 22 -
44-pin PQFP
Seating Plane
11
22
12
See Detail F
eb
A
y1
AA
L
L1
c
EE
H
1
D
44
H
D
34
33
Detail F
1. Dimension D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeter
4. General appearance spec. should be based
on final visual inspection spec.
0.2540.101
0.0100.004
Notes:
Symbol Min. Nom. Max. Max.
Nom.
Min.
Dimension in inch Dimension in mm
A
b
c
D
e
HD
HE
L
y
A
A
L1
1
2
E
0.006 0.152
---
0.002
0.075
0.01
0.081
0.014
0.087
0.018
1.90
0.25
0.05
2.05
0.35
2.20
0.45
0.390
0.025
0.063
0.003
07
0.394
0.031
0.398
0.037
9.9
0.80
0.65
1.6
10.00
0.8
10.1
0.95
0.3980.394
0.390
0.530
0.520
0.510 13.45
13.2
12.95
10.1
10.00
9.9
7
0
0.08
0.031
0.01 0.02 0.25 0.5
---
--- --- --- ---
θ
2
θ
0.025 0.036 0.635 0.952
0.530
0.520
0.510 13.45
13.2
12.95
0.051 0.075 1.295 1.905
W78LE51C/W78L051C
Publication Release Date: December 4, 2006
- 23 - Revision A3
14. REVISION HISTORY
VERSION DATE PAGE REASONS FOR CHANGE
A1 May 19, 2005 Initial Issued
Remove block diagram
A2 October 2, 2006 Change operating frequency into 20MHz
A3 December 4, 2006 2 Remove all Leaded package parts
Important Notice
Winbond products are not designed, intended, authorized or w arranted for use as components
in systems or equipment intended for surgical implantation, atomic energy control
instruments, airplane or spaceship instruments, transportation instruments, traffic signal
instruments, combustion control instruments, or for other applications intended to support or
sustain life. Further more, Winbond products are not intended for applications w herein failure
of Winbond products could result or lead to a situation wherein personal injury, death or
severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their
ow n risk and agree to fully indemnify Winbond for any damages resulting from such improper
use or sales.