MRF392
2MOTOROLA RF DEVICE DATA
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS (1)
Collector–Emitter Breakdown Voltage (IC = 50 mAdc, IB = 0) V(BR)CEO 30 — — Vdc
Collector–Emitter Breakdown Voltage (IC = 50 mAdc, VBE = 0) V(BR)CES 60 — — Vdc
Emitter–Base Breakdown Voltage (IE = 5.0 mAdc, IC = 0) V(BR)EBO 4.0 — — Vdc
Collector Cutof f Current (VCB = 30 Vdc, IE = 0) ICBO — — 5.0 mAdc
ON CHARACTERISTICS (1)
DC Current Gain (IC = 1.0 Adc, VCE = 5.0 Vdc) hFE 40 60 100 —
DYNAMIC CHARACTERISTICS (1)
Output Capacitance (VCB = 28 Vdc, IE = 0, f = 1.0 MHz) Cob —75 95 pF
FUNCTIONAL TESTS (2) — See Figure 1
Common–Emitter Amplifier Power Gain
(VCC = 28 Vdc, Pout = 125 W, f = 400 MHz) Gpe 8.0 10 — dB
Collector Efficiency
(VCC = 28 Vdc, Pout = 125 W, f = 400 MHz) η50 55 — %
Load Mismatch
(VCC = 28 Vdc, Pout = 125 W, f = 400 MHz,
VSWR = 30:1, all phase angles)
ψNo Degradation in Output Power
NOTES:
1. Each transistor chip measured separately.
2. Both transistor chips operating in push–pull amplifier.
Figure 1. 400 MHz Test Fixture
D.U.T.
Z1 Z3
C9
C11
L5
Z4 Z5
L6
C16
C7C6C5C3
–
+ 28 V
L3
L4
C2
C1
Z1 Z3
Z6
Z4 Z5 Z6
C12 C13 C14 C15
B1 B2
L1
C17 C18 C19
C10
+
L2
C8
Z2
C4
Z2
C1, C2 — 240 pF, 100 Mil Chip Cap (ATC) or Equivalent
C3 — 3.6 pF, 100 Mil Chip Cap (ATC) or Equivalent
C4, C8 — 8.2 pF, 100 Mil Chip Cap (ATC) or Equivalent
C5, C6 — 20 pF, 100 Mil Chip Cap (ATC) or Equivalent
C7 — 18 pF, Mini Unelco or Equivalent
C9, C10 — 270 pF, 100 Mil Chip Cap (ATC) or Equivalent
C11, C12, C16, C17 — 470 pF 100 Mil Chip Cap (ATC) or Equivalent
C13, C18 — 680 pF Feedthru
C14, C19 — 0.1 µF Erie Redcap or Equivalent
C15 — 20 µF, 50 V
L1, L2 — 0.15 µH Molded Choke With Ferrite Bead
L3, L4 — 2–1/2 T urns #20 AWG, 0.200 ID
L5, L6 — 3–1/2 T urns #18 AWG, 0.200 ID
B1 — Balun, 50 Ω Semi–Rigid Coaxial Cable 86 Mil OD, 2″ L
B2 — Balun, 50 Ω Semi–Rigid Coaxial Cable 86 Mil OD, 2″ L
Z1 — Microstrip Line 270 Mil L x 125 Mil W
Z2 — Microstrip Line 375 Mil L x 125 Mil W
Z3 — Microstrip Line 280 Mil L x 125 Mil W
Z4 — Microstrip Line 300 Mil L x 125 Mil W
Z5 — Microstrip Line 350 Mil L x 125 Mil W
Z6 — Microstrip Line 365 Mil L x 125 Mil W
Board Material — 0.0625″ Teflon Fiberglass εr = 2.5 ± 0.05 1 oz. Cu.
Board Material — CLAD, Double Sided