ASM3P18S19BF-08TR - ON Semiconductor L.L.C.

ASM3P18S19B

Notebook LCD Panel

EMI Reduction IC

JANUARY 2010 – Rev. 3 ASM3P18S19/D

Features

FCC approved method of EMI attenuation.

Provides up to 15dB EMI reduction.

Generates a low EMI Spread Spectrum clock and a

non-spread reference clock of the input frequency.

Optimized for Frequency range from 20 to 40MHz.

Internal loop filter minimizes external components and

board space.

Low Inherent Cycle-to-Cycle jitter.

Two spread % selections: -1.25% to -1.75%.

3.3V Operating Voltage.

Low power CMOS design.

Supports notebook VGA and other LCD timing

controller applications.

Power Down function for mobile application.

Available in Commercial temperature range.

Available in 8-pin SOIC and TSSOP Packages.

RoHS Compliant

Product Description

The ASM3P18S19B is a Versatile Spread Spectrum

Frequency Modulator designed specifically for input clock

frequencies from 20 to 40MHz. (Refer to Input Frequency

and Modulation Rate Table). The ASM3P18S19B reduces

electromagnetic interference (EMI) at the clock source,

allowing system wide reduction of EMI of down stream

clock and data dependent signals. The ASM3P18S19B

allows significant system cost savings by reducing the

number of circuit board layers, ferrite beads, shielding, and

other passive components that are traditionally required to

pass EMI regulations.

The ASM3P18S19B modulates the output of a single PLL

in order to “spread” the bandwidth of a synthesized clock,

and more importantly, decreases the peak amplitudes of its

harmonics. This results in significantly lower system EMI

compared to the typical narrow band signal produced by

oscillators and most frequency generators. Lowering EMI

by increasing a signal‟s bandwidth is called „Spread

Spectrum Clock Generation‟.

The ASM3P18S19B uses the most efficient and optimized

modulation profile approved by the FCC and is

implemented in a proprietary all digital method.

Applications

The ASM3P18S19B is targeted towards EMI management

for memory and LVDS interfaces in mobile graphic chipsets

and high-speed digital applications such as PC peripheral

devices, consumer electronics, and embedded controller

systems.

Block Diagram

VSS

VDD

ModOUT

XIN/CLKIN

Frequency

Divider

Feedback

Divider

Modulation

Phase

Detector

Loop

Filter

VCO

Output

Divider

PLL

SRS

PD#

Crystal

Oscillator

XOUT

REF

ASM3P18S19B

Rev. 3 | Page 2 of 7 | www.onsemi.com

VDD

PD#

XOUT

REF

1

2

3

4

5

6

7

8

ASM3P18S19B

XIN/ CLKIN

VSS

SRS

ModOUT

Pin Configuration

Pin Description

Pin#

Pin Name

Type

Description

1

XIN / CLKIN

I

Crystal Connection or external frequency input.This pin has dual

functions. It can be connected to either an external crystal or an external

reference clock.

2

VSS

P

Ground Connection. Connect to system ground.

3

SRS

I

Spread range select. Digital logic input used to select frequency deviation

(Refer to Spread Deviation Selection Table). This pin has an internal pull-

up resistor.

4

ModOUT

O

Spread spectrum clock output. (Refer to Input Frequency and Modulation

Rate Table and Spread Deviation Selection Table)

5

REF

O

Non-modulated Reference clock output of the input frequency.

6

PD#

I

Power down control pin. Pull LOW to enable Power-Down mode. This pin

has an internal pull-up resistor.

7

VDD

P

Power Supply for the entire chip.

8

XOUT

O

Crystal Connection. Input connection for an external crystal. If using an

external reference, this pin must be left unconnected.

Input Frequency and Modulation Rate

Part Number

Input Frequency Range

Output Frequency range

Modulation rate

ASM3P18S19B

20MHz to 40MHz

Input Frequency / 512

Spread Deviation Selection

Part Number

SRS

Spread Deviation

ASM3P18S19B

0

-1.25% (DOWN)

1

-1.75% (DOWN)

ASM3P18S19B

Rev. 3 | Page 3 of 7 | www.onsemi.com

Absolute Maximum Ratings

Symbol

Parameter

Rating

Unit

VDD, VIN

Voltage on any pin with respect to Ground

-0.5 to +4.6

V

TSTG

Storage temperature

-65 to +125

°C

TA

Operating temperature

0 to +70

°C

Ts

Max. Soldering Temperature (10 sec)

260

°C

TJ

Junction Temperature

150

°C

TDV

Static Discharge Voltage (As per JEDEC STD22- A114-B)

2

KV

Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect

device reliability.

DC Electrical Characteristics

(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated.)

Symbol

Parameter

Min

Typ

Max

Unit

VIL

Input Low voltage

VSS - 0.3

-

0.8

V

VIH

Input High voltage

2.0

-

VDD + 0.3

V

IIL

Input Low current (inputs PD#, SRS)

-60.0

-

-20.0

µA

IIH

Input High current

-

1.0

µA

IXOL

XOUT Output low current @ 0.4V, VDD = 3.3V

-

3

-

mA

IXOH

XOUT Output high current @ 2.5V, VDD = 3.3V

-

3

-

mA

VOL

Output Low voltage VDD = 3.3V, IOL = 20mA

-

0.4

V

VOH

Output High voltage VDD = 3.3V, IOH = 20mA

2.5

-

V

ICC

Dynamic supply current normal mode

3.3V and 25pF probe loading

7.1

fIN - min

-

26.9

fIN - max

mA

IDD

Static supply current standby mode

-

4.5

-

mA

VDD

Operating Voltage

-

3.3

-

V

tON

Power up time (first locked clock cycle after power up)

-

0.18

-

mS

ZOUT

Clock Output impedance

-

50

-

Ω

AC Electrical Characteristics

Symbol

Parameter

Min

Typ

Max

Unit

fIN

Input Frequency

20

-

40

MHz

fOUT

Output Frequency

20

-

40

MHz

tLH*

Output Rise time

Measured from 0.8V to 2.0V

-

0.66

-

nS

tHL*

Output Fall time

Measured from 0.8V to 2.0V

-

0.65

-

nS

tJC

Jitter (Cycle to cycle)

-200

-

200

pS

tD

Output Duty cycle

45

50

55

%

*tLH and tHL are measured into a capacitive load of 15pF

ASM3P18S19B

Rev. 3 | Page 4 of 7 | www.onsemi.com

Package Information

8-lead (150-mil) SOIC Package

Symbol

Dimensions

Inches

Millimeters

Min

Max

Min

Max

A1

0.004

0.010

0.10

0.25

A

0.053

0.069

1.35

1.75

A2

0.049

0.059

1.25

1.50

B

0.012

0.020

0.31

0.51

C

0.007

0.010

0.18

0.25

D

0.193 BSC

4.90 BSC

E

0.154 BSC

3.91 BSC

e

0.050 BSC

1.27 BSC

H

0.236 BSC

6.00 BSC

L

0.016

0.050

0.41

1.27

θ

0°

8°

0°

8°

Package length (Excluding end flash) D - 188 ~ 193 mils.

Package length (Including end flash) D1 - 198 ~ 207 mils.

ASM3P18S19B

Rev. 3 | Page 5 of 7 | www.onsemi.com

E

H

A

A1

A2

D

B

C

L

e

8-lead TSSOP (4.40-MM Body)

Symbol

Dimensions

Inches

Millimeters

Min

Max

Min

Max

A

0.043

1.10

A1

0.002

0.006

0.05

0.15

A2

0.033

0.037

0.85

0.95

B

0.008

0.012

0.19

0.30

C

0.004

0.008

0.09

0.20

D

0.114

0.122

2.90

3.10

E

0.169

0.177

4.30

4.50

e

0.026 BSC

0.65 BSC

H

0.252 BSC

6.40 BSC

L

0.020

0.028

0.50

0.70

θ

0°

8°

0°

8°

Note: Controlling dimensions are millimeters

TSSOP – 0.0325 grams unit weight

ASM3P18S19B

Rev. 3 | Page 6 of 7 | www.onsemi.com

Ordering Information

Part Number

Marking

Package Type

Temperature

ASM3P18S19BF-08TT

3P18S19BF

8-Pin TSSOP, TUBE, Pb Free

Commercial

ASM3P18S19BF-08TR

3P18S19BF

8-Pin TSSOP, TAPE & REEL , Pb Free

Commercial

P3P18S19BF-08ST

3P18S19BF

8-Pin SOIC, TUBE, Pb Free

Commercial

P3P18S19BF-08SR

3P18S19BF

8-Pin SOIC, TAPE & Pb Free

Commercial

ASM3P18S19BG-08TT

3P18S19BG

8-Pin TSSOP, TUBE, Green

Commercial

ASM3P18S19BG-08TR

3P18S19BG

8-Pin TSSOP, TAPE & REEL, Green

Commercial

ASM3P18S19BG-08ST

3P18S19BG

8-Pin SOIC, TUBE, Green

Commercial

ASM3P18S19BG-08SR

3P18S19BG

8-Pin SOIC, TAPE & REEL, Green

Commercial

Products are available for industrial temperature range operation. Please contact factory for more information.

Device Ordering Information

A S M 3 P 1 8 S 1 9 B F - 0 8 T R

Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.

O = SOT U = MSOP

S = SOIC E = TQFP

T = TSSOP L = LQFP

A = SSOP U = MSOP

V = TVSOP P = PDIP

B = BGA D = QSOP

Q = QFN X = SC-70

DEVICE PIN COUNT

X= Automotive I= Industrial P or n/c = Commercial

(-40C to +125C) (-40C to +85C) (0C to +70C)

1 = Reserved 6 = Power Management

2 = Non PLL based 7 = Power Management

3 = EMI Reduction 8 = Power Management

4 = DDR support products 9 = Hi Performance

5 = STD Zero Delay Buffer 0 = Reserved

ON Semiconductor Mixed Signal Product

PART NUMBER

F = LEAD FREE AND RoHS COMPLIANT PART

G = GREEN PACKAGE, LEAD FREE, and RoHS

R = Tape & Reel, T = Tube or Tray

ASM3P18S19B

Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003

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