ASMT-QAB2-FDE0E - AVAGO TECHNOLOGIES

ASMT-QxB2-Fxxxx

Super 0.5 W Power PLCC-4 Surface Mount LED Indicator

Data Sheet

Description

The Super 0.5 W Power PLCC-4 SMT LED is an extension

of Power PLCC-4 SMT LEDs. The package can be driven

at high current due to its superior package design. The

product is able to dissipate the heat more e ciently

compared to the Power PLCC-4 SMT LEDs. These LEDs

produce higher light output with better  ux perfor-

mance compared to the Power PLCC-4 SMT LED.

The Super 0.5 W Power PLCC-4 SMT LEDs are designed

for higher reliability, better performance, and operate

under a wide range of environmental conditions. The

performance characteristics of these new mid-power

LEDs make them uniquely suitable for use in harsh

conditions such as in automotive applications, and in

electronics signs and signals.

To facilitate easy pick and place assembly, the LEDs are

packed in EIA-compliant tape and reel. Every reel is

shipped in single intensity and color bin (except for red),

to provide close uniformity.

Super 0.5 W Power PLCC-4 SMT LED is available in red,

red orange and amber colors.

Features

• Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9

mm)

• High reliability package with enhanced silicone resin

encapsulation

• High intensity brightness with optimum  ux

performance using AllnGaP chip technologies

• Available in Red, Red Orange and Amber colors

• High optical e ciency

• Available in 8 mm carrier tape and 7 inch reel

• Low thermal resistance

• Super wide viewing angle at 120 degrees

• Longer life time with minimum degradation due to

enhanced Silicone resin material

• JEDEC MSL 2a

Applications

• Exterior automotive

- Turn signals

- Side repeaters

- CHSML

- Rear combination lamp

- Side markers

- Truck clearance lamp

• Electronic signs and signals

- Channel lettering

- Contour lighting

- Indoor variable message sign

• O ce automation, home appliances, industrial

equipment

- Front panel backlighting

- Push button backlighting

- Display backlighting

CAUTION: ASMT-QxB2-Fxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions

during handling and processing. Refer to Avago Application Note AN-1142 for additional details.

Package Drawing

Figure 1. Package drawing

Table 1. Device Selection Guide (TJ = 25 °C)

Color Part Number

Luminous Flux, ΦV[1] (lm)

Dice Technology

Min. Flux

(lm)

Typ. Flux

(lm)

Max. Flux

(lm)

Test Current

(mA)

Amber ASMT-QAB2-FDE0E 9.0 11.4 15.0 150 AlInGaP

Red Orange ASMT-QHB2-FEF0E 11.5 14.0 19.5 150 AlInGaP

Red ASMT-QRB2-FCD0E 7.0 9.8 11.5 150 AlInGaP

Notes:

1. ΦV is the total luminous  ux output as measured with an integrating sphere at mono pulse conditions.

2. Tolerance = ±12%.

3.6 0.2

0.5 0.1

3.2 0.2

2.8 0.2

2.2 0.2

1.9 0.2

0.15 (TYP.)

0.8 0.1

0.8 0.3

0.7 0.1

ANODE

MARKING

2.40 1.15 0.05

2.30 0.05

0.41 (TYP.)

0.56 (TYP.)

1. ALL DIMENSIONS IN MILLIMETERS.

2. LEAD POLARITY AS SHOWN IN FIGURE 13.

3. TERMINAL FINISH: Ag PLATING.

4. ENCAPSULATION MATERIAL: SILICONE RESIN.

NOTES:

Part Numbering System

A S M T – Q X1 B 2 – F X2 X3 X4 X5

Packaging Option

Color Bin Selection

Max. Flux Bin Selection

Min. Flux Bin Selection

Color

A - Amber

H - Red Orange

R - Red

Table 4. Electrical Characteristics (TJ = 25°C)

Part Number

Forward Voltage VF

(Volts) @ IF = 150 mA

Reverse Voltage

VR @ 100 μA

Thermal Resistance

RθJ-P (°C/W)

Typ. Max. Min.

ASMT-QAB2-Fxxxx 2.70 3.25 5 60

ASMT-QHB2-Fxxxx 2.70 3.25 5 60

ASMT-QRB2-Fxxxx 3.10 3.55 5 60

Table 2. Absolute Maximum Ratings (TA = 25°C)

Parameters ASMT-QxB2-Fxxxx

DC Forward Current [1] 150 mA

Peak Forward Current [2] 200 mA

Power Dissipation 470 mW

Reverse Voltage 5 V

Junction Temperature 125°C

Operating Temperature -40°C to +110°C

Storage Temperature -40°C to +110°C

Notes:

1. Derate l inearly as shown in Figure 6.

2. Duty Factor = 10%, Frequency = 1kHz.

Table 3. Optical Characteristics (TJ = 25°C)

Color Part Number

Dice

Technology

Dominant

Wavelength

λD[1] (nm)

Viewing

Angle 2θ1/2[2]

(Degrees)

Luminous

E ciency

ηe(lm/W)

Total Flux /

Luminous Intensity

FV (lm) / IV (cd)

Typ. Typ. Typ. Typ.

Amber ASMT-QAB2-Fxxxx AlInGaP 594.5 120 28 3.3

Red Orange ASMT-QHB2-Fxxxx AlInGaP 617.0 120 35 3.3

Red ASMT-QRB2-Fxxxx AlInGaP 624.0 120 21 3.3

Notes:

1. The dominant wavelength, λD, is derived from the CIE Chromaticity diagram and represents the color of the device.

2. θ1/2 is the o -axis angle where the luminous intensity is 1/2 the peak intensity.

Figure 2. Relative intensity vs. wavelength Figure 3. Forward current vs. forward voltage

Figure 4. Relative intensity vs. forward current Figure 5. Relative intensity vs. temperature

Figure 6a. Maximum forward current vs. ambient temperature. Derated

based on TJMAX = 125°C, RθJ-A = 130°C/W, 110°C/W, 100°C/W and 80°C/W.

WAVELENGTH – nm

RELATIVE INTENSITY

1.0

0.8

380 480 580 680 730 780

630530430

0.6

0.4

0.2

AlInGaP RED

0.1

0.3

0.5

0.7

0.9 AlInGaP AMBER

AlInGaP

RED-ORANGE

FORWARD VOLTAGE – V

140

160

180

200

FORWARD CURRENT – mA

100

120

AlInGaP RED

AlInGaP AMBER

AlInGaP

RED-ORANGE

050

DC FORWARD CURRENT – mA

0.4

RELATIVE LUMINOUS INTENSITY

(NORMALIZED AT 150 mA)

200100 150

0.2

0.8

0.6

1.0

1.2

RED/RED-ORANGE

AMBER

-50 -25 0

JUNCTION TEMPERATURE – C

0.4

RELATIVE LUMINOUS INTENSITY

(NORMALIZED AT 25 C)

12525 50 75 100

0.2

0.8

0.6

1.0

2.2

1.2

1.4

1.6

1.8

2.0

RED

AMBER

RED-ORANGE

160

20 60 80 120

MAXIMUM FORWARD CURRENT – mA

JUNCTION TEMPERATURE – °C

100

120

140

100

RJA =

80 °C/W

RJA = 110 °C/W

RJA = 100 °C/W

RJA = 130 °C/W

Figure 6b. Maximum forward current vs. solder point temperature.

Derated based on TJMAX = 125°C, RJP = 60°C/W.

160

20 60 80 120

CURRENT – mA

TEMPERATURE – °C

100

120

140

100

AMBER / RED-ORANGE

RED

Figure 7a. Maximum pulse current vs. ambient temperature. Derated

based on TA = 25°C, RθJ-A =110°C/W.

Figure 7b. Maximum pulse current vs. ambient temperature.Derated vased

on TA= 85°C, RθJ-P =110°C/W.

0.00

0.10

0.20

0.30

1.00E-05 1.00E-03 1.00E-01 1.00E+01

tp - Time - (S)

CURRENT - A

D = tp

D =

0.05

0.10

0.25

0.50

0.00

0.10

0.20

0.30

1.00E-05 1.00E-03 1.00E-01 1.00E+01

tp - Time - (S)

CURRENT - A

D = tp

D =

0.05

0.10

0.25

0.50

Figure 9. Forward voltage shift vs. temperature

Figure 10. Radiation pattern

Figure 8. Dominant wavelength vs. forward current – AlInGaP devices

DOMINANT WAVELENGTH – nm

580

FORWARD CURRENT – mA

200

620

630

100

600

150

590

610

AlInGaP RED

AlInGaP RED-ORANGE

AlInGaP AMBER

FORWARD VOLTAGE SHIFT (V)

-50

-0.15

TJ – JUNCTION TEMPERATURE – C

100

0.05

0.10

-25

0.15

0255075

-0.05

-0.10

NORMALIZED INTENSITY

-90

ANGULAR DISPLACEMENT – DEGREES

0.9

0.6

1.0

-60 -30

0.4

30 600

0.3

0.2

0.1

0.5

0.8

0.7

Figure11. Recommended pick and place nozzle size Figure 12. Recommended Pb-free re ow soldering pro le

Note: For detail information on re ow soldering of Avago sur-

face mount LEDs, do refer to Avago Application Note AN 1060

Surface Mounting SMT LED Indicator Components.

217 °C

200 °C

150 °C

60 - 120 SEC.

-6 °C/SEC. MAX.

3 °C/SEC. MAX.

255 - 260 °C

100 SEC. MAX.

10 - 30 SEC.

TIME

TEMPERATURE

(Acc. to J-STD-020C)

Figure 13. Recommended soldering pad pattern

ANODE

MARKING

0.4

0.3

MINIMUM 55 mm2 OF ANODE PAD

FOR IMPROVED HEAT DISSIPATION

2.4

0.6

0.9 X 6

4.6

1.1

1.3 x 6

ANODE

MARKING

C C

A A

SOLDER MASK

ANODE

CATHODE

Note: Diameter "ID" should

be bigger than 2.3mm

Figure 14. Tape leader and trailer dimensions

200 mm MIN. FOR ∅180 REEL.

200 mm MIN. FOR ∅330 REEL.

TRAILER COMPONENT LEADER

480 mm MIN. FOR ∅180 REEL.

960 mm MIN. FOR ∅330 REEL.

USER FEED DIRECTION

Figure 15. Tape dimensions

Figure 16. Reeling orientation

CATHODE SIDE

PRINTED LABEL

USER FEED DIRECTION

3.8 ± 0.1

2.29 ± 0.1

0.229 ± 0.01

ALL DIMENSIONS IN mm.

2 ± 0.054 ± 0.1 4 ± 0.1

3.05 ± 0.1

3.5 ± 0.05

8+0.3

–0.1

1.75 ± 0.1

Ø1.5 +0.1

–0

8°

Ø1+0.1

–0

Device Color (X1)

A Amber

H Red Orange

RRed

Flux Bin Select (X2X3)

Individual reel will contain parts from one bin only.

X2Min Flux Bin

X3Max Flux Bin

Flux Bin Limits

Bin ID Min. (lm) Max. (lm)

A 4.30 5.50

B 5.50 7.00

C 7.00 9.00

D 9.00 11.50

E 11.50 15.00

F 15.00 19.50

G 19.50 25.50

H 25.50 33.00

J 33.00 43.00

K 43.00 56.00

L 56.00 73.00

Tolerance of each bin limit = ±12%.

Color Bin Select (X4)

Individual reel will contain parts from one full bin only.

0 Full Distribution

A 1 and 2 only

B 2 and 3 only

C 3 and 4 only

D 4 and 5 only

E 5 and 6 only

G 1, 2 and 3 only

H 2, 3 and 4 only

J 3, 4 and 5 only

K 4, 5 and 6 only

M 1, 2, 3 and 4 only

N 2, 3, 4 and 5 only

P 3, 4, 5 and 6 only

R 1, 2, 3, 4 and 5 only

S 2, 3, 4, 5 and 6 only

Z Special Color Bin

Color Bin Limits

Amber/Yellow Min. (nm) Max. (nm)

2 583.0 586.0

3 586.0 589.0

4 589.0 592.0

5 592.0 595.0

6 595.0 598.0

Red Orange Min. (nm) Max. (nm)

1 611.0 616.0

2 616.0 620.0

3 620.0 625.0

Red Min. (nm) Max. (nm)

Full Distribution 620.0 635.0

Tolerance of each bin limit = ±1 nm.

For product information and a complete list of distributors, please go to our website: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-0232EN - September 30, 2011

VF Binning

Bin Min. Max.

2D 2.35 2.50

2E 2.50 2.65

2F 2.65 2.80

2G 2.80 2.95

2H 2.95 3.10

2J 3.10 3.25

2K 3.25 3.40

2L 3.40 3.55

Tolerance of each bin = ±0.1 V.

Packaging Option (X5 )

Option Test Current Package Type Reel Size

E 150 mA Top Mount 7 Inch

Handling Precaution

The encapsulation of the product is made of silicone

for better reliability of the product. As silicone is a soft

material, please do not press on the silicone or poke a

sharp object onto the silicone. This might damage the

product and cause premature failure. During assembly

or handling, the unit should be held on the body only.

Please refer to Avago Application Note AN 5288 for

detailed information.

Moisture Sensitivity

This product is quali ed as Moisture Sensitive Level 2a

per Jedec J-STD-020. Precaution when handling this

moisture sensitive product is important to ensure the

reliability of the product. Do refer to Avago Application

Note AN5305 Handling of Moisture Sensitive Surface

Mount Devices for details.

A. Storage before use

- Unopen moisture barrier bag (MBB) can be stored

at <40°C/90%RH for 12 months. If the actual shelf

life has exceeded 12 months and the HIC indicates

that baking is not required, then it is safe to re ow

the LEDs per the original MSL rating.

B. Control after opening the MBB

- The humidity indicator card (HIC) shall be read im-

mediately upon opening of MBB.

- The LEDs must be kept at <30°C/60%RH at all times

and all high temperature related processes, includ-

ing soldering, curing or rework, need to be com-

pleted within 672 hours.

C. Control for un nished reel

- For any unused LEDs, they need to be stored in

sealed MBB with desiccant or desiccator at <5%RH.

D. Control of assembled boards

- If the PCB soldered with the LEDs is to be subjected

to other high temperature processes, the PCB needs

to be stored in sealed MBB with desiccant or desic-

cator at <5% RH to ensure no LEDs have exceeded

their  oor life of 672 hours.

E. Baking is required if:

- “10%” is Not Green and “5%” HIC indicator is Azure.

- The LEDs are exposed to condition of >30°C/60%

RH at any time.

- The LEDs  oor life exceeded 672 hours.

Recommended baking condition: 60 ± 5°C for 20 hours.