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200048Y • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 24, 2017 1
DATA SHEET
SMP1321 Series: Low Capacitance, Plastic Packaged PIN
Diodes
Applications
High-performance wireless switches
Features
Capacitance: 0.18 pF typical @ 30 V
Series resistance: 1.05 Ω typical @ 10 mA
Packages rated MSL1, 260 C per JEDEC J-STD-020
Skyworks Green
TM
products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green
TM
, document number
SQ04–0074.
Description
The SMP1321 series of plastic packaged, surface mountable PIN
diodes is designed for use in high volume switch applications
from 10 MHz to more than 10 GHz. The low capacitance of these
diodes (0.25 pF maximum at 30 V), combined with a low
resistance (2.0 Ω maximum at 10 mA), makes the SMP1321
series particularly suited for high isolation, series-connected PIN
diode switches in battery operated circuits.
The SMP1321 series is available in a selection of plastic
packages and a variety of configurations that include a small
footprint SC-79, a low inductance SOT-23, a miniature SOD-882,
and an SOD-323.
Table 1 describes the various packages and marking of the
SMP1321 series.
DATA SHEET • SMP1321 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
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Table 1. SMP1321 Series Packaging and Marking
Common Anode Series Pair Low Inductance Single Single Single
SOT-23 SOT-23 SOT-23
SC-79
Green™
SOD-882
Green™
SOD-323
Green™
SMP1321-003LF
Green™
Marking: RM9
♦SMP1321-005LF
Green™
Marking: RM2
SMP1321-007LF
Green™
Marking: RMB
SMP1321-079LF
Marking: Cathode and C6
SMP1321-040LF
Marking: C
SMP1321-011LF
Marking: RM
LS = 1.5 nH LS = 1.5 nH LS = 0.4 nH LS = 0.7 nH LS = 0.45 nH LS = 1.5 nH
The Pb-free symbol or “LF” in the part number denotes a lead-free, RoHS-compliant package unless otherwise noted as Green™.
Tin/lead (Sn/Pb) packaging is not recommended for new designs.
SMP1321-007
For the -007 configuration of the SOT-23 package, the package
inductance is effectively reduced to 0.4 nH compared to the
1.5 nH value of the standard configuration. This lower inductance
is particularly beneficial when the diodes are used as shunt
connected switches at frequencies higher than 500 MHz in which
inductance is the primary limitation on maximum switch isolation.
To achieve the effective 0.4 nH, the SOT-23 package must be
inserted in the microstrip circuit board with a gap in the trace, as
shown in Figure 1. Because of the polarity of the diode junction,
this low inductance feature is realizable only with the cathode
connected to ground.
Ground
Gap
200048-001
Figure 1. SOT-23 Package Trace Gap
Electrical and Mechanical Specifications
The part number and configuration for the SMP1321 series are
provided in Table 1. The absolute maximum ratings of the
SMP1321 series are provided in Table 2. Electrical specifications
are provided in Table 3. Resistance versus temperature
measurements are provided in Table 4.
Typical performance characteristics of the SMP1321 series are
illustrated in Figures 2 to 5.
Package Dimensions
Package dimensions are shown in Figures 6 to 12 (even
numbers), and tape and reel dimensions are provided in Figures 7
to 13 (odd numbers).
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SMP1321 series is rated to Moisture Sensitivity Level 1
(MSL1) at 260 C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
DATA SHEET • SMP1321 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
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200048Y • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 24, 2017 3
Table 2. SMP1321 Series Absolute Maximum Ratings (Per Junction)1
Parameter Symbol Minimum Maximum Units
Reverse voltage VR 100 V
Power dissipation @ 25 °C lead temperature PD 400 mW
Storage temperature TSTG –65 +150 C
Operating temperature TA –65 +150 C
Electrostatic discharge:
Human Body Model (HBM), Class 1A
ESD
500
V
1 Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters
set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
ESD HANDLING: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device.
This device must be protected at all times from ESD when handling or transporting. Static charges may easily produce
potentials of several kilovolts on the human body or equipment, which can discharge without detection.
Industry-standard ESD handling precautions should be used at all times.
Table 3. SMP1321 Series Electrical Specifications (Per Junction)1
(TA = +25 C, Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
Reverse current IR V
R = 100 V 10 μA
Capacitance2 C
T F = 1 MHz, V = 30 V 0.18 0.25 pF
Resistance RS F = 100 MHz
I = 1 mA
I = 10 mA
3.00
1.05
2.00
Ω
Ω
Forward voltage VF I
F = 10 mA 0.85 V
Carrier lifetime TI IF = 10 mA 0.4 μs
I region width 12 μm
1 Performance is guaranteed only under the conditions listed in this table.
2 CT is 0.4 pF maximum for the SMP1321-007.
Table 4. Resistance vs Temperature @ 500 MHz (Per Junction)
IF
(mA)
RS @ –55 °C
(Ω)
RS @ –15 °C
(Ω)
RS @ +25 °C
(Ω)
RS @ +65 °C
(Ω)
RS @ +100 °C
(Ω)
0.02 47.4 50.0 56.3 61.5 65.1
0.10 12.0 12.6 13.9 15.4 16.4
0.3 5.2 5.4 5.8 6.4 6.9
0.5 3.6 3.8 4.1 4.5 4.8
1.0 2.4 2.5 2.6 2.8 3.1
10 1.03 1.04 1.04 1.07 1.15
20 0.871 0.888 0.873 0.889 0.956
100 0.669 0.659 0.642 0.645 0.695
DATA SHEET • SMP1321 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
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Typical Performance Characteristics (Per Junction)
0.01 0.1 1 10 100
Forward Current (mA)
Series Resistance (Ω)
0.1
1
10
100
200048-002
Figure 2. Series Resistance vs Current @ 100 MHz
0 1 2 5 10 20 50
0
0.2
0.1
0.4
0.6
0.5
0.3
0.8
0.7
Reverse Voltage (V)
Capacitance (pF)
200048-004
Figure 4. Capacitance vs Reverse Voltage
(1 MHz to 1 GHz)
400 500 600 700 800 900 1000
0.01
0.1
1
10
100
Forward Voltage (mV)
Forward Current (mA)
200048-003
Figure 3. Forward Current vs Voltage
0 500 1000 1500 2000
Frequency (MHz)
Conductance (μS)
0 V
10 V
40 V
0
100
200
300
400
500
600
700
800
200048-005
Figure 5. Conductance vs Frequency and Reverse Voltage
DATA SHEET • SMP1321 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
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200048Y • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 24, 2017 5
0.060 (1.50 mm) Min
0.067 (1.70 mm) Max
0.010
(0.25 mm) Min
0.014
(0.35 mm) Max
0.043 (1.10 mm) Min
0.051 (1.30 mm) Max
0.020
(0.50 mm) Min
0.028
(0.70 mm) Max
0.003
(0.07 mm) Min
0.008
(0.20 mm) Max
10° Max
10° Max
0.028
(0.70 mm) Min
0.035
(0.90 mm) Max
0.006 (0.15 mm) Min
Polarity
Indicator Area
12
200048-006Dimensions are in inches (millimeters shown in parentheses)
Box
or
Bar
Figure 6. SC-79 Package Dimension Drawing
200048-007
Notes:
1. Carrier tape: black conductive polycarbonate or polystyrene.
2. Cover tape material: transparent conductive PSA.
3. Cover tape size: 5.4 mm width.
4. ESD-surface resistivity is ≤1 x 108 Ohms/square per
EIA, JEDEC TNR Specification.
5. All measurements are in millimeters.
8.00 ± 0.20
0.229 ± 0.02 (T)
3.50 ± 0.05
Section A
Section B
Ø1.50± 0.10
Ø0.50± 0.05
4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.05
0.80 ± 0.05 (Ko)
1.95 ± 0.05 (Bo)
1.40 ± 0.05
0.39 ± 0.05
0.90 ± 0.05 (Ao)
1.75 ± 0.10
2
o
Max
2° Max
A
B
B
A
Pin 1 Indicator
Figure 7. SC-79 Tape and Reel Dimensions
DATA SHEET • SMP1321 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
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3
2
1
0.035 (0.89 mm) Min
0.044 (1.12 mm) Max
0.0005 (0.01 mm) Min
0.004 (0.10 mm) Max
0.012 (0.30 mm) Min
0.020 (0.50 mm) Max
0.003 (0.080 mm) Min
0.008 (0.20 mm) Max
8° Max
0.022 (0.550 mm) Ref
0.110 (2.80 mm) Min
0.120 (3.04 mm) Max
0.083 (2.10 mm) Min
0.104 (2.64 mm) Max
0.037 (0.95 mm) Ref
0.047 (1.20 mm) Min
0.055 (1.40 mm) Max
0.076 (1.92 mm) Ref
0.020 (0.51 mm) Ref
200048-008
Dimensions are in inches (millimeters shown in parentheses)
0.012 (0.300 mm) Min
0.020 (0.500 mm) Max
Figure 8. SOT-23 Package Dimension Drawing
Notes:
1. Carrier tape: black conductive polycarbonate.
2. Cover tape material: transparent conductive PSA.
3. Cover tape size: 5.40 mm width.
4. Tolerance ±0.10 mm.
5. Ten sprocket hole pitch cumulative tolerance: ±0.2 mm.
6. All measurements are in millimeters.
7. Alternative carrier tape dimensions are:
Ao = 3.3
Bo = 2.9
Ko = 1.22
3.10 (Ao)
1.0
2.2
2.70 (Bo)
8.00 + 0.3/–0.1
4.00
4.00
(See Note 5)
2.00 ± 0.05
3.50 ± 0.05
1.75 ± 0.10
Section A
A
A
0.25 ± 0.05
0.8 ± 0.05
1.20 (Ko)
ø1.00 Min
R 0.5 Typ Pin 1 Indicator
ø1.5 + 0.1/–0
200048-009
R 0.3 Max
Figure 9. SOT-23 Tape and Reel Dimensions
DATA SHEET • SMP1321 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
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Notes:
1. All measurements are in millimeters.
2. Dimensions and tolerances according to ASME Y14.5M-1994.
3. These packages are used principally for discrete devices.
4. This dimension includes stand-off height and package body thickness,
but does not include attached features, e.g., external heatsink or chip capacitors.
An integral heatslug is not considered an attached feature.
5. This dimension is primarily terminal plating, but does not include small metal protrusion.
0.05
2X
0.05
0.46 + 0.04
–0.06
0.05/0.00
Terminal 1
0.03 C
2X 0.25 ± 0.05
2X
Pin 1 Indicator
0.600
A
0.650
C
B
1.000
Seating Plane
4 2X 0.50 ± 0.05
0.10
M
A B
0.10
M
A B
0.325
5
200048-010
Figure 10. SOD-882 Package Dimension Drawing
200048-011
Section A
Section B
2.00 ± 0.05 ∅1.55 ± 0.05 (D0)
∅0.40 ± 0.05 (D1)
Cathode
Indicator
0.20
1.15 ± 0.05 (Bo)
0.70 ± 0.05 (A0)
4.00 ± 0.10
A
BB A
2.00 ± 0.05
0.47 ± 0.05 (Ko)
1.75 ± 0.10
3.50 ± 0.05
8.00 ± 0.1
Notes:
1. Carrier tape: black conductive polycarbonate.
2. Cover tape: transparent conductive material.
3. Cover tape size: 5.4 mm width.
4. ESD surface resistivity is ≥1 x 10
4
~ ≤ 1 x 10
8
Ohms/square.
5. All dimensions are in millimeters.
Figure 11. SOD-882 Tape and Reel Dimensions
DATA SHEET • SMP1321 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
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12
0.090 (2.29 mm) Min
0.107 (2.72 mm) Max 0.000 (0 mm) Min
0.004 (0.10 mm) Max
0.012 (0.305 mm) Min
0.016 (0.406 mm) Max
0.036 (0.91 mm) Min
0.046 (1.17 mm) Max
0.010 (0.25 mm) Min
0.018 (0.46 mm) Max
0.005 (0.127 mm) Min
0.008 (0.203 mm) Max
0.044
(1.12 mm) Min
0.054
(1.37 mm) Max
0.025
(0.635 mm) Min
0.037
(0.940 mm) Max
0.013
(0.33 mm) Min
0.017
(0.43 mm) Max
Cathode
Indicator
0.008 Ref
Gauge Datum
For Foot Length
Measurement
0.060 (1.52 mm) Min
0.070 (1.78 mm) Max
200048-012
Dimensions are in inches (millimeters shown in parentheses)
Figure 12. SOD-323 Package Dimension Drawing
200048-013
Pin 1
Indicator
2.00 ± 0.05
0.30 ± 0.05
4.00
4.00
(See Note 4)
1.52 (Ao)
2.90 (Bo)
1.35 (Ko)
1.07 (K1)
2.08
0.84
R0.5 Typ
R0.3 Max
Ø1.50 +0.1/–0
Ø1.00 Min
8.00 +0.30/–0.10
3.50 ± 0.05
1.75 ± 0.10
Section A
Notes:
1. Carrier tape: black conductive polystyrene.
2. Cover tape: transparent conductive PSA.
3. Cover tape size: 5.4 mm width.
4. 10 sprocket hole pitch cumulative tolerance: ±0.20 mm.
5. All measurements are in millimeters.
A
A
Figure 13. SOD-323 Tape and Reel Dimensions
DATA SHEET • SMP1321 SERIES: LOW CAPACITANCE, PLASTIC PACKAGED PIN DIODES
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