–1– ACCTB7E 201602-T
ORDERING INFORMATION
For board-to-FPC
A4S
Narrow pitch connectors
(0.4mm pitch)
FEATURES
1. Width 2.5 mm slim two-piece type
connector
Compact and slim structure contributes
overall miniaturization of product design.
<Compared to F4S (40 pins, when
mated)>
Width: 30% down
• Footprint: 30% down
2. ensures
high resistance to various
environments in lieu of slim and low
profile body
3. Mated heights of 0.8 and 1.0 mm are
available for the same foot pattern.
4. Connectors for inspection available
APPLICATIONS
Board-to-FPC connections of mobile
equipment (cellular phones, smart
phones, laptops, and portable music
players, etc.)
Socket Header
2.0mm
2.5mm
RoHS compliant
A4S
0.8
2.5
3.6
1.0
F4S
Bellows contact
construction
(Against dropping!)
Ni barrier
construction
(Against solder rise!)
Porosity treatment
(Against corrosive gases!)
V notch and Double contact constructions
(Against foreign particles and flux!)
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Ni plating on base, Au plating on surface (for Ni barrier available)
<Header>
4: Ni plating on base, Au plating on surface
Package
Nil:
D:
Embossed packaging (8 mm pitch)
Embossed packaging (4 mm pitch)
5: Narrow Pitch Connector A4S (0.4 mm pitch) Socket
6: Narrow Pitch Connector A4S (0.4 mm pitch) Header
Mated height
<Socket>
1: For mated height 0.8/1.0 mm
<Header>
1: For mated height 0.8 mm
2: For mated height 1.0 mm
AXE 2
Number of pins (2 digits)
Functions
2: Without positioning bosses
Narrow pitch connectors A4S (0.4mm pitch)
–2– ACCTB7E 201602-T
PRODUCT TYPES
8 mm pitch embossed packaging
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
4 mm pitch embossed packaging
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
Mated height Number of pins Part number Packing
Socket Header Inner carton (1-reel) Outer carton
0.8mm
10 AXE510127 AXE610124
5,000 pieces 10,000 pieces
12 AXE512127 AXE612124
14 AXE514127 AXE614124
16 AXE516127 AXE616124
18 AXE518127 AXE618124
20 AXE520127 AXE620124
22 AXE522127 AXE622124
24 AXE524127 AXE624124
26 AXE526127 AXE626124
28 AXE528127 AXE628124
30 AXE530127 AXE630124
32 AXE532127 AXE632124
34 AXE534127 AXE634124
36 AXE536127 AXE636124
40 AXE540127 AXE640124
44 AXE544127 AXE644124
50 AXE550127 AXE650124
54 AXE554127 AXE654124
60 AXE560127 AXE660124
64 AXE564127 AXE664124
70 AXE570127 AXE670124
80 AXE580127 AXE680124
1.0mm
10 AXE510127 AXE610224
12 AXE512127 AXE612224
14 AXE514127 AXE614224
20 AXE520127 AXE620224
24 AXE524127 AXE624224
26 AXE526127 AXE626224
30 AXE530127 AXE630224
32 AXE532127 AXE632224
40 AXE540127 AXE640224
44 AXE544127 AXE644224
50 AXE550127 AXE650224
54 AXE554127 AXE654224
60 AXE560127 AXE660224
70 AXE570127 AXE670224
80 AXE580127 AXE680224
Mated height Number of pins Part number Packing
Socket Header Inner carton (1-reel) Outer carton
0.8mm
10 AXE510127D AXE610124D
15,000 pieces 30,000 pieces
12 AXE512127D AXE612124D
14 AXE514127D AXE614124D
16 AXE516127D AXE616124D
20 AXE520127D AXE620124D
24 AXE524127D AXE624124D
30 AXE530127D AXE630124D
34 AXE534127D AXE634124D
40 AXE540127D AXE640124D
44 AXE544127D AXE644124D
50 AXE550127D AXE650124D
60 AXE560127D AXE660124D
64 AXE564127D AXE664124D
Narrow pitch connectors A4S (0.4mm pitch)
–3– ACCTB7E 201602-T
SPECIFICATIONS
Characteristics
Material and surface treatment
Item Specifications Conditions
Electrical
characteristics
Rated current 0.3A/pin contact (Max. 5 A at total pin contacts)
Rated voltage 60V AC/DC
Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 90mΩBased on the contact resistance measurement method
specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force Max. 1.200N/pin contact × pin contacts (initial)
Composite removal force Min. 0.165N/pin contact × pin contacts
Contact holding force
(Socket contact) Min. 0.20N/pin contact Measuring the maximum force.
As the contact is axially pull out.
Environmental
characteristics
Ambient temperature –55°C to +85°C No icing or condensation.
Soldering heat resistance
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals) Infrared reflow soldering
300°C within 5 sec. 350°C within 3 sec. Soldering iron
Storage temperature –55°C to +85°C (product only)
–40°C to +50°C (emboss packing) No icing or condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 90mΩ
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Lifetime
characteristics Insertion and removal life 30 times Repeated insertion and removal speed of max. 200 times/
hours
Unit weight 20 pin contacts Socket: 0.02 g Header: 0.01 g
Part name Material Surface treatment
Molded
portion
LCP resin
(UL94V-0)
Contact and
Post Copper alloy
Contact portion:
Base: Ni plating Surface: Au plating
Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating Surface: Au plating (except the terminal tips)
Order Temperature (°C) Time (minutes)
1
2
3
4
–55
85
–55
0
330
Max. 5
30
Max. 5
+3
0
0
3
Narrow pitch connectors A4S (0.4mm pitch)
–4– ACCTB7E 201602-T
DIMENSIONS (Unit: mm)
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Socket (Mated height: 0.8 mm/1.0 mm)
0.08
(Contact and
soldering terminals)
Terminal coplanarity
Y note
0.15±0.03
A
B±0.1
0.40±0.05
Z note 0.30±0.03
C±0.1
2.20
0.70 (Suction face)
0.77
2.50
(0.90)
2.50
1.06
General tolerance: ±0.2
Note: Since the soldering terminals has a single-piece construction,
sections Y and Z are electrically connected.
Dimension table (mm)
Number of pins/
dimension A B C
10 4.50 1.60 3.40
12 4.90 2.00 3.80
14 5.30 2.40 4.20
16 5.70 2.80 4.60
18 6.10 3.20 5.00
20 6.50 3.60 5.40
22 6.90 4.00 5.80
24 7.30 4.40 6.20
26 7.70 4.80 6.60
28 8.10 5.20 7.00
30 8.50 5.60 7.40
32 8.90 6.00 7.80
34 9.30 6.40 8.20
36 9.70 6.80 8.60
40 10.50 7.60 9.40
44 11.30 8.40 10.20
50 12.50 9.60 11.40
54 13.30 10.40 12.20
60 14.50 11.60 13.40
64 15.30 12.40 14.20
70 16.50 13.60 15.40
80 18.50 15.60 17.40
CAD Data
Header (Mated height: 0.8 mm)
2.00
0.08
(Post and
soldering terminals)
Terminal coplanarity
Soldering terminals
0.15±0.03
B±0.1
0.40±0.05
Soldering terminals
0.15±0.03
C±0.1
A
1.42
0.70 (Suction face)
0.65
1.46
0.84
(0.31)
General tolerance: ±0.2
Dimension table (mm)
Number of pins/
dimension A B C
10 3.80 1.60 3.20
12 4.20 2.00 3.60
14 4.60 2.40 4.00
16 5.00 2.80 4.40
18 5.40 3.20 4.80
20 5.80 3.60 5.20
22 6.20 4.00 5.60
24 6.60 4.40 6.00
26 7.00 4.80 6.40
28 7.40 5.20 6.80
30 7.80 5.60 7.20
32 8.20 6.00 7.60
34 8.60 6.40 8.00
36 9.00 6.80 8.40
40 9.80 7.60 9.20
44 10.60 8.40 10.00
50 11.80 9.60 11.20
54 12.60 10.40 12.00
60 13.80 11.60 13.20
64 14.60 12.40 14.00
70 15.80 13.60 15.20
80 17.80 15.60 17.20
CAD Data
Narrow pitch connectors A4S (0.4mm pitch)
–5– ACCTB7E 201602-T
Header (Mated height: 1.0 mm)
Socket and Header are mated
EMBOSSED TAPE DIMENSIONS (Unit: mm)
0.70 (Suction face)
2.00
0.85
0.84
(0.31)
1.46
0.15±0.03
C±0.1
1.42
A
B±0.1
0.15±0.03
0.40±0.05
Soldering terminals
Soldering terminals
0.08
(Post and
soldering terminals)
Terminal coplanarity
General tolerance: ±0.2
Dimension table (mm)
Number of pins/
dimension A B C
10 3.80 1.60 3.20
12 4.20 2.00 3.60
14 4.60 2.40 4.00
20 5.80 3.60 5.20
24 6.60 4.40 6.00
26 7.00 4.80 6.40
30 7.80 5.60 7.20
32 8.20 6.00 7.60
40 9.80 7.60 9.20
44 10.60 8.40 10.00
50 11.80 9.60 11.20
54 12.60 10.40 12.00
60 13.80 11.60 13.20
70 15.80 13.60 15.20
80 17.80 15.60 17.20
Socket
Header
0.80±0.1
1.00±0.1
Header
Socket
Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
• 8 mm pitch embossed packaging
Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape I Tape II
(A±0.3)
(8.0) (2.0) (4.0)
(B)
(C)
(1.75)
Leading direction after packaging
(A )
+0.3
0.1
(8.0) (2.0) (4.0)
(C)
(1.75)
1.5 dia.
+0.1
0
1.5 dia.
+0.1
0
Embossed mounting-hole
Taping reel
Top cover tape
Embossed carrier tape
(D±1)
380 dia.
Label
• 4 mm pitch embossed packaging
Leading direction after packaging
(1.75)
(C)
(A )
(4.0)(2.0)
(4.0)
+0.3
0.1
Tape III
1.5 dia.
+0.1
0
Narrow pitch connectors A4S (0.4mm pitch)
–6– ACCTB7E 201602-T
Dimension table (Unit: mm)
• 8 mm pitch embossed packaging
• 4 mm pitch embossed packaging
Connector orientation with respect to embossed tape feeding direction
Type/Mated height Number of pins Type of taping A B C D Quantity per reel
Common for sockets
and headers
0.8 mm/1.0 mm
Max. 24 Tape I 16.0 7.5 17.4 5,000
26 to 70 Tape I 24.0 11.5 25.4 5,000
80 Tape II 32.0 28.4 14.2 33.4 5,000
Type/Mated height Number of pins Type of taping A B C D Quantity per reel
Common for sockets
and headers 0.8 mm
Max. 24 Tape III 16.0 7.5 17.4 15,000
30 to 64 Tape III 24.0 11.5 25.4 15,000
Type
Direction
of tape progress
Common for A4S
Socket Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Narrow pitch connectors A4S (0.4mm pitch)
–7– ACCTB7E 201602-T
TABLE OF PRODUCT TYPES
: Available for sale
Notes: 1. Please inquire about number of pins other than those shown above.
2. Please inquire with us regarding availability.
3. Please keep the minimum order quantities no less than 50 pieces per lot.
4. Please inquire if further information is needed.
PRODUCT TYPES
Note: When placing an order, substitute the (asterisk) in the above part number with the number of pins for the specific connector.
NOTES
For board-to-FPC
A4S
Connectors for
inspection usage
(0.4mm pitch)
Product name Number of pins
A4S
for inspection
10 12 14 16 18 20 22 24 26 28 30 32 34 36 40 44 50 54 60 64 70 80
✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩
Specifications Part No. Specifications Part No.
Socket Without positioning bosses AXE5E∗∗26 Header Without positioning bosses AXE6E∗∗26
FEATURES
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
APPLICATIONS
Ideal for module unit inspection and
equipment assembly inspection
Note: Mating retention force cannot be
warranted.
Please avoid using for applications other
than inspection.
Socket Header
2.0mm
2.5mm
RoHS compliant
Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
• Socket (Mated height: 0.8mm/1.0mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 70%)
• Header (Mated height: 0.8mm/1.0mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
0.20±0.03
1.06±0.03
2.90±0.03
(0.50)
(0.92)
0.23±0.03
0.40±0.03
0.90±0.03
1.45±0.03
C 0.30
1.90±0.03
: Insulation area
1.60±0.01
2.90±0.01
0.20±0.01
(0.40)
1.45±0.01
0.90±0.01
0.40±0.01
(0.65)
C 0.30
2.00±0.01
2.80±0.01
Please refer to the latest product
specifications when designing your
product.
0.23±0.03
0.40±0.03
0.45±0.03
0.80±0.03
0.60±0.03
1.66±0.03
(0.53)
(0.65)
1.10±0.03
2.40±0.03
0.80±0.01
0.60±0.01
1.66±0.01
(0.53)
0.45±0.01
0.40±0.01
(0.52)
1.26±0.01
2.30±0.01
0.20±0.01
–1– ACCTB48E 201606-T
For board-to-board/board-to-FPC
About safety Remarks
Regarding the design of devices and PC board patterns
Regarding the selection of the connector placement machine and the mounting
procedures
Notes on Using Narrow pitch Connectors/
High Current Connectors
1) Do not use these connectors beyond
the specification sheets. The usage
outside of specified rated current,
dielectric strength, and environmental
conditions and so on may cause circuitry
damage via abnormal heating, smoke,
and fire.
2) In order to avoid accidents, your
thorough specification review is
appreciated.
Please contact us if your usage is out of
the specifications. Otherwise, Panasonic
Corporation cannot guarantee the quality
and reliability.
3) Panasonic Corporation is consistently
striving to improve quality and reliability.
However, the fact remains that electrical
components and devices generally cause
failures at a given statistical probability.
Furthermore, their durability varies with
use environments or use conditions. In
this respect, please check for actual
electrical components and devices under
actual conditions before use.
Continued usage in a state of degraded
condition may cause the deteriorated
insulation, thus result in abnormal heat,
smoke or firing. Please carry out safety
design and periodic maintenance
including redundancy design, design for
fire spread prevention, and design for
malfunction prevention so that no
accidents resulting in injury or death, fire
accidents, or social damage will be
caused as a result of failure of the
products or ending life of the products.
1) When using the board to board
connectors, do not connect a pair of
board with multiple connectors.
Otherwise, misaligned connector
positions may cause mating failure or
product breakage.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) PC board
Control the thicknesses of the coverlay
and adhesive to prevent poor soldering.
This connector has no stand-off.
Therefore, minimize the thickness of the
coverlay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
7) When mounting connectors on a FPC
board:
When the connector soldered to FPC is
mated or unmated, solder detachment
may occur by the force to the terminals.
Connector handling is recommended in
the condition when the reinforcing plate is
attached to the backside of FPC where
the connector is mounted. The external
dimension of the reinforcing plate is
recommended to be larger than the
dimension of “PC board recommended
process pattern” (extended dimension of
one side is approximately 0.5 to 1.0 mm).
The materials and thickness of the
reinforcing plate are glass epoxy or
polyimide (thickness 0.2 - 0.3 mm) or
SUS (thickness 0.1 - 0.2 mm).
• As this connector has temporary locking
structure, the connector mating may be
separated by the dropping impact
depend on the size, weight or bending
force of the FPC. Please consider the
measures at usage to prevent the mating
separation.
8) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Connector
Spacer
Spacer PC board
Screw
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the chucking force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
6) In case of dry condition, please note
the occurrence of static electricity.
The product may be adhered to the
embossed carrier tape or the cover tape
in dry condition.
Recommended humidity is from 40%RH
to 60%RH and please remove static
electricity by ionizer in manufacturing
process.
Notes on Using Narrow pitch Connectors/High Current Connectors
–2– ACCTB48E 201606-T
Regarding soldering
Handling Single Components
Precautions for mating
Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals.
(Please refer to the specification for detail
because the temperature setting differs
by products.)
2) As for cream solder printing, screen
printing is recommended.
3) When setting the screen opening area
and PC board foot pattern area, refer the
recommended PC board pattern and
window size of metal mask on the
specification sheet, and make sure that
the size of board pattern and metal mask
at the base of the terminals are not
increased.
4) Please pay attentions not to provide
too much solder. It makes miss mating
because of interference at soldering
portion when mating.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) The condition of solder or flux rise and
wettability varies depending on the type
of solder and flux. Solder and flux
characteristics should be taken into
consideration and also set the reflow
temperature and oxygen level.
7) Do not use resin-containing solder.
Otherwise, the contacts might be firmly
fixed.
8) Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
For products other than the ones above,
please refer to the latest product
specifications.
9) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector before
mounting.
10) Consult us when using a screen-
printing thickness other than that
recommended.
Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
Table A
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) These connector is low profile type. If
too much solder is supplied for hand
soldering, It makes miss mating because
of interference at soldering portion.
Please pay attentions.
Solder reworking
1) Finish reworking in one operation.
2) In case of soldering rework of bridges.
Don’t use supplementary solder flux.
Doing so may cause contact problems by
flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
Terminal Paste
solder
PC board
foot pattern
Product name Soldering iron temperature
SMD type connectors 300°C within 5 sec.
350°C within 3 sec.
60 to 120 sec.
Preheating
Peak temperature
200°C
220°C
Upper limited (Solder heat resistance)
Peak temperature 260°C
230°C
180°C
150°C
70 sec.
25 sec.
Lower limited (Solder wettability)
Time
Temperature
Apply the solder
wire here
Terminal
Pattern
PC board
Small angle as
possible up to
45 degrees
Soldering
iron
1) Make sure not to drop or allow parts to
fall from work bench.
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
This product is designed with ease of
handling. However, in order to prevent the
deformation or damage of contacts and
molding, take care and do not mate the
connectors as shown right.
Strongly pressed and twisted
Tilted mating
Press-fitting while the mating
inlets of the socket and
header are not matched.
Notes on Using Narrow pitch Connectors/High Current Connectors
–3– ACCTB48E 201606-T
Cleaning flux from PC board
Handling the PC board after mounting the connector
Storage of connectors
Other Notes
Regarding sample orders to confirm proper mounting
There is no need to clean this product.
If cleaning it, pay attention to the
following points to prevent the negative
effect to the product.
1) Keep the cleaning solvent clean and
prevent the connector contacts from
contamination.
2) Some cleaning solvents are strong and
they may dissolve the molded part and
characters, so pure water passed liquid
solvent is recommended.
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
1) Do not remove or insert the electrified
connector (in the state of carrying current
or applying voltage).
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Product failures due to condensation
are not covered by warranty.
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50-
piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Condition when delivered from manufacturing
Required number
of products for
sample production
(Unit 50 pcs.)
Embossed tape
amount required for
the mounting
Reel
(Delivery can also be made on a reel by
customer request.)
Please refer to the latest product
specifications when designing your
product.