ColdFire®
Microcontrollers
freescale.com
MCF5272 ColdFire® Integrated
Microprocessor
User’s Manual
MCF5272UM
Rev. 3
03/2007
Overview
ColdFire Core
Hardware Multiply/Accumulate (MAC) Unit
Local Memory
Debug Support
System Integration Module (SIM)
Interrupt Controller
Chip-Select Module
SDRAM Controller
DMA Controller Module
Ethernet Module
Universal Serial Bus (USB)
Physical Layer Interface Controller (PLIC)
Queued Serial Peripheral Interface (QSPI) Module
Timer Module
UART Modules
General-Purpose I/O Module
Pulse-Width Modulation (PWM) Module
Signal Descriptions
Bus Operation
Appendix B: Buffering and Impedence Matching
Index
Appendix A: List of Memory Maps
1
2
3
4
5
7
8
9
10
11
12
13
14
15
16
17
18
19
A
6
20
B
IND
21
23
22
IEEE 1149.1 Test Access Port (JTAG)
Mechanical Data
Electrical Characteristics
Overview
ColdFire Core
Hardware Multiply/Accumulate (MAC) Unit
Local Memory
Debug Support
System Integration Module (SIM)
Interrupt Controller
Chip-Select Module
SDRAM Controller
DMA Controller Module
Ethernet Module
Universal Serial Bus (USB)
Physical Layer Interface Controller (PLIC)
Queued Serial Peripheral Interface (QSPI) Module
Timer Module
UART Modules
General-Purpose I/O Module
Pulse-Width Modulation (PWM) Module
Signal Descriptions
Bus Operation
Appendix B: Buffering and Impedence Matching
Index
Appendix A: List of Memory Maps
1
2
3
4
5
7
8
9
10
11
12
13
14
15
16
17
18
19
A
6
20
B
IND
21
23
22
IEEE 1149.1 Test Access Port (JTAG)
Mechanical Data
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor v
List of Figures
Figure Page
Number Title Number
1-1 MCF5272 Block Diagram........................................................................................................1-2
2-1 ColdFire Pipeline..................................................................................................................... 2-2
2-2 ColdFire Multiply-Accumulate Functionality Diagram..............................................................2-3
2-3 ColdFire Programming Model ................................................................................................. 2-5
2-4 Condition Code Register (CCR)..............................................................................................2-6
2-5 Status Register (SR) ...............................................................................................................2-8
2-6 Vector Base Register (VBR) ...................................................................................................2-8
2-7 Organization of Integer Data Formats in Data Registers ...................................................... 2-10
2-8 Organization of Integer Data Formats in Address Registers.................................................2-10
2-9 Memory Operand Addressing ...............................................................................................2-11
2-10 Exception Stack Frame Form................................................................................................2-27
3-1 ColdFire MAC Multiplication and Accumulation ...................................................................... 3-1
3-2 MAC Programming Model.......................................................................................................3-2
4-1 SRAM Base Address Register (RAMBAR) .............................................................................4-3
4-2 ROM Base Address Register (ROMBAR)..............................................................................4-5
4-3 Instruction Cache Block Diagram............................................................................................4-8
4-4 Cache Control Register (CACR) ...........................................................................................4-12
4-5 Access Control Register Format (ACRn) .............................................................................. 4-14
5-1 Processor/Debug Module Interface......................................................................................... 5-1
5-2 PSTCLK Timing ...................................................................................................................... 5-2
5-3 Example JMP Instruction Output on PST/DDATA ..................................................................5-5
5-4 Debug Programming Model ....................................................................................................5-6
5-5 Address Attribute Trigger Register (AATR).............................................................................5-7
5-6 Address Breakpoint Registers (ABLR, ABHR)........................................................................ 5-9
5-7 Configuration/Status Register (CSR) .................................................................................... 5-10
5-8 Data Breakpoint/Mask Registers (DBR and DBMR).............................................................5-12
5-9 Program Counter Breakpoint Register (PBR) .......................................................................5-13
5-10 Program Counter Breakpoint Mask Register (PBMR)...........................................................5-13
5-11 Trigger Definition Register (TDR)..........................................................................................5-14
5-12 BDM Serial Interface Timing .................................................................................................5-17
5-13 Receive BDM Packet ............................................................................................................5-18
5-14 Transmit BDM Packet ...........................................................................................................5-18
5-15 BDM Command Format ........................................................................................................5-20
5-16 Command Sequence Diagram.............................................................................................. 5-21
5-17 RAREG/RDREG Command Format ..........................................................................................5-22
5-18 RAREG/RDREG Command Sequence...................................................................................... 5-22
5-19 WAREG/WDREG Command Format .........................................................................................5-23
5-20 WAREG/WDREG Command Sequence ....................................................................................5-23
5-21 READ Command/Result Formats ...........................................................................................5-24
5-22 READ Command Sequence ...................................................................................................5-24
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
vi Freescale Semiconductor
List of Figures (Continued)
Figure Page
Number Title Number
5-23 WRITE Command Format.......................................................................................................5-25
5-24 WRITE Command Sequence..................................................................................................5-26
5-25 DUMP Command/Result Formats.......................................................................................... 5-27
5-26 DUMP Command Sequence...................................................................................................5-27
5-27 FILL Command Format .........................................................................................................5-28
5-28 FILL Command Sequence...................................................................................................... 5-29
5-29 GO Command Format............................................................................................................5-29
5-30 GO Command Sequence.......................................................................................................5-29
5-31 NOP Command Format..........................................................................................................5-30
5-32 NOP Command Sequence ..................................................................................................... 5-30
5-33 RCREG Command/Result Formats.........................................................................................5-30
5-34 RCREG Command Sequence.................................................................................................5-31
5-35 WCREG Command/Result Formats ........................................................................................5-31
5-36 WCREG Command Sequence ................................................................................................5-31
5-37 RDMREG BDM Command/Result Formats..............................................................................5-32
5-38 RDMREG Command Sequence...............................................................................................5-32
5-39 WDMREG BDM Command Format..........................................................................................5-33
5-40 WDMREG Command Sequence..............................................................................................5-33
5-41 Recommended BDM Connector ...........................................................................................5-41
6-1 SIM Block Diagram .................................................................................................................6-1
6-2 Module Base Address Register (MBAR).................................................................................6-4
6-3 System Configuration Register (SCR) ....................................................................................6-5
6-4 System Protection Register (SPR)..........................................................................................6-6
6-5 Power Management Register (PMR) ......................................................................................6-7
6-6 Activate Low-Power Register (ALPR) ................................................................................... 6-10
6-7 Device Identification Register (DIR)......................................................................................6-11
6-8 Watchdog Reset Reference Register (WRRR)..................................................................... 6-12
6-9 Watchdog Interrupt Reference Register (WIRR)...................................................................6-12
6-10 Watchdog Counter Register (WCR)......................................................................................6-13
6-11 Watchdog Event Register (WER)..........................................................................................6-13
7-1 Interrupt Controller Block Diagram..........................................................................................7-2
7-2 Interrupt Control Register 1 (ICR1) ......................................................................................... 7-4
7-3 Interrupt Control Register 2 (ICR2) ......................................................................................... 7-5
7-4 Interrupt Control Register 3 (ICR3) ......................................................................................... 7-5
7-5 Interrupt Control Register 4(ICR4) .......................................................................................... 7-5
7-6 Interrupt Source Register (ISR)............................................................................................... 7-6
7-7 Programmable Interrupt Transition Register (PITR) ............................................................... 7-7
7-8 Programmable Interrupt Wakeup Register (PIWR).................................................................7-8
7-9 Programmable Interrupt Vector Register (PIVR)..................................................................... 7-9
8-1 Chip Select Base Registers (CSBRn).....................................................................................8-3
8-2 Chip Select Option Registers (CSORn) .................................................................................8-5
9-1 SDRAM Controller Signals......................................................................................................9-2
9-2 54-Pin TSOP SDRAM Pin Definition.......................................................................................9-3
9-3 SDRAM Configuration Register (SDCR)................................................................................. 9-6
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor vii
List of Figures (Continued)
Figure Page
Number Title Number
9-4 SDRAM Timing Register (SDTR)............................................................................................ 9-8
9-5 Example Setup Time Violation on SDRAM Data Input during Write.....................................9-12
9-6 Timing Refinement with Inverted SDCLK..............................................................................9-13
9-7 Timing Refinement with True CAS Latency and Inverted SDCLK ........................................9-13
9-8 Timing Refinement with Effective CAS Latency....................................................................9-14
9-9 SDRAM Burst Read, 32-Bit Port, Page Miss, Access = 9-1-1-1...........................................9-16
9-10 SDRAM Burst Read, 32-Bit Port, Page Hit, Access = 5-1-1-1..............................................9-17
9-11 SDRAM Burst Write, 32-Bit Port, Page Miss, Access = 7-1-1-1 ...........................................9-18
9-12 SDRAM Burst Write, 32-Bit Port, Page Hit, Access = 3-1-1-1 ..............................................9-19
9-13 SDRAM Refresh Cycle.......................................................................................................... 9-20
9-14 Enter SDRAM Self-Refresh Mode.........................................................................................9-21
9-15 Exit SDRAM Self-Refresh Mode ...........................................................................................9-22
10-1 DMA Mode Register (DMR) ..................................................................................................10-2
10-2 DMA Interrupt Register (DIR)................................................................................................10-4
10-3 DMA Source Address Register (DSAR)................................................................................10-5
10-4 DMA Destination Address Register (DDAR)......................................................................... 10-6
10-5 DMA Byte Count Register (DBCR) .......................................................................................10-6
11-1 Ethernet Block Diagram ........................................................................................................11-2
11-2 Fast Ethernet Module Block Diagram ...................................................................................11-2
11-3 Ethernet Frame Format......................................................................................................... 11-4
11-4 Ethernet Address Recognition Flowchart..............................................................................11-7
11-5 Ethernet Control Register (ECR).........................................................................................11-11
11-6 Interrupt Event Register (EIR).............................................................................................11-12
11-7 Interrupt Mask Register (EIMR) .........................................................................................11-13
11-8 Interrupt Vector Status Register (IVSR)..............................................................................11-14
11-9 Receive Descriptor Active Register (RDAR)....................................................................... 11-15
11-10 Transmit Descriptor Active Register (TDAR) ......................................................................11-16
11-11 MII Management Frame Register (MMFR) .........................................................................11-17
11-12 MII Speed Control Register (MSCR)..................................................................................11-18
11-13 FIFO Receive Bound Register (FRBR)..............................................................................11-19
11-14 FIFO Receive Start Register (FRSR)................................................................................. 11-20
11-15 Transmit FIFO Watermark (TFWR)....................................................................................11-21
11-16 FIFO Transmit Start Register (TFSR) ................................................................................. 11-22
11-17 Receive Control Register (RCR)......................................................................................... 11-23
11-18 Maximum Frame Length Register (MFLR)..........................................................................11-24
11-19 Transmit Control Register (TCR) ........................................................................................11-25
11-20 RAM Perfect Match Address Low (MALR)..........................................................................11-26
11-21 RAM Perfect Match Address High (MAUR) ........................................................................11-27
11-22 Hash Table High (HTUR)...................................................................................................11-28
11-23 Hash Table Low (HTLR) ....................................................................................................11-29
11-24 Pointer-to-Receive Descriptor Ring (ERDSR).....................................................................11-30
11-25 Pointer-to-Transmit Descriptor Ring (ETDSR).................................................................... 11-31
11-26 Receive Buffer Size (EMRBR) ............................................................................................ 11-32
11-27 Receive Buffer Descriptor (RxBD) ......................................................................................11-35
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
viii Freescale Semiconductor
List of Figures (Continued)
Figure Page
Number Title Number
11-28 Transmit Buffer Descriptor (TxBD)..................................................................................... 11-37
12-1 The USB “Tiered Star” Topology...........................................................................................12-2
12-2 USB Module Block Diagram..................................................................................................12-3
12-3 USB Frame Number Register (FNR) ....................................................................................12-9
12-4 USB Frame Number Match Register (FNMR).......................................................................12-9
12-5 USB Real-Time Frame Monitor Register (RFMR)...............................................................12-10
12-6 USB Real-Time Frame Monitor Match Register (RFMMR)................................................. 12-11
12-7 USB Function Address Register (FAR)...............................................................................12-11
12-8 USB Alternate Settings Register (ASR) .............................................................................. 12-12
12-9 USB Device Request Data 1 Register (DRR1) ...................................................................12-13
12-10 USB Device Request Data 2 Register (DRR2) ...................................................................12-13
12-11 USB Specification Number Register (SPECR) ...................................................................12-14
12-12 USB Endpoint 0 Status Register (EP0SR)..........................................................................12-14
12-13 USB Endpoint 0 IN Configuration Register (IEP0CFG) ......................................................12-15
12-14 USB Endpoint 0 OUT Configuration Register ..................................................................... 12-16
12-15 USB Endpoint 1–7 Configuration Register..........................................................................12-16
12-16 USB Endpoint 0 Control Register (EP0CTL).......................................................................12-17
12-17 USB Endpoint 1-7 Control Register (EPnCTL) ................................................................... 12-20
12-18 USB Endpoint 0 Interrupt Mask (EP0IMR)
and General/Endpoint 0 Interrupt Registers (EP0ISR) ....................................................... 12-22
12-19 USB Endpoints 1–7 Interrupt Status Registers (EPnISR)...................................................12-25
12-20 USB Endpoint 1-7 Interrupt Mask Registers (EPnIMR) ......................................................12-26
12-21 USB Endpoint 0-7 Data Registers (EPnDR) .......................................................................12-27
12-22 USB Endpoint 0-7 Data Present Registers (EPnDPR) .......................................................12-28
12-23 Example USB Configuration Descriptor Structure .............................................................. 12-29
12-24 Recommended USB Line Interface.....................................................................................12-36
12-25 USB Protection Circuit ........................................................................................................12-37
13-1 PLIC System Diagram........................................................................................................... 13-2
13-2 GCI/IDL Receive Data Flow..................................................................................................13-3
13-3 GCI/IDL B-Channel Receive Data Register Demultiplexing..................................................13-4
13-4 GCI/IDL Transmit Data Flow.................................................................................................13-4
13-5 GCI/IDL B Data Transmit Register Multiplexing....................................................................13-5
13-6 B-Channel Unencoded and HDLC Encoded Data ................................................................13-6
13-7 D-Channel HDLC Encoded and Unencoded Data................................................................13-7
13-8 D-Channel Contention ..........................................................................................................13-8
13-9 GCI/IDL Loopback Mode ......................................................................................................13-9
13-10 Periodic Frame Interrupt ..................................................................................................... 13-10
13-11 PLIC Internal Timing Signal Routing...................................................................................13-12
13-12 PLIC Clock Generator.........................................................................................................13-12
13-13 B1 Receive Data Registers P0B1RR–P3B1RR.................................................................. 13-15
13-14 B2 Receive Data Registers P0B2RR – P3B2RR................................................................ 13-16
13-15 D Receive Data Registers P0DRR–P3DRR .......................................................................13-16
13-16 B1 Transmit Data Registers P0B1TR–P3B1TR..................................................................13-17
13-17 B2 Transmit Data Registers P0B2TR–P3B2TR..................................................................13-17
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor ix
List of Figures (Continued)
Figure Page
Number Title Number
13-18 D Transmit Data Registers P0DTR–P3DTR .......................................................................13-18
13-19 Port Configuration Registers (P0CR–P3CR) ......................................................................13-18
13-20 Loopback Control Register (PLCR).....................................................................................13-20
13-21 Interrupt Configuration Registers (P0ICR–P3ICR)..............................................................13-20
13-22 Periodic Status Registers (P0PSR–P3PSR).......................................................................13-22
13-23 Aperiodic Status Register (PASR) ......................................................................................13-23
13-24 GCI Monitor Channel Receive Registers (P0GMR–P3GMR) .............................................13-24
13-25 GCI Monitor Channel Transmit Registers (P0GMT–P3GMT).............................................13-25
13-26 GCI Monitor Channel Transmit Abort Register (PGMTA) ...................................................13-26
13-27 GCI Monitor Channel Transmit Status Register (PGMTS)..................................................13-27
13-28 GCI C/I Channel Receive Registers (P0GCIR–P3GCIR) ................................................... 13-28
13-29 GCI C/I Channel Transmit Registers (P0GCIT–P3GCIT) ................................................... 13-29
13-30 GCI C/I Channel Transmit Status Register (PGCITSR)......................................................13-30
13-31 D-Channel Status Register (PDCSR) .................................................................................13-31
13-32 D-Channel Request Registers (PDRQR)............................................................................13-32
13-33 Sync Delay Registers (P0SDR–P3SDR) ............................................................................13-33
13-34 Clock Select Register (PCSR) ............................................................................................13-34
13-35 Port 1 Configuration Register (P1CR)................................................................................. 13-36
13-36 Port 1 Interrupt Configuration Register (P1ICR) .................................................................13-37
13-37 ISDN SOHO PABX Example ..............................................................................................13-38
13-38 Standard IDL2 10-Bit Mode ................................................................................................ 13-39
13-39 ISDN SOHO PABX Example ..............................................................................................13-40
13-40 Standard IDL2 10-Bit Mode ................................................................................................ 13-41
13-41 Two-Line Remote Access ................................................................................................... 13-41
13-42 Standard IDL2 8-Bit Mode ..................................................................................................13-42
14-1 QSPI Block Diagram .............................................................................................................14-2
14-2 QSPI RAM Model.................................................................................................................. 14-5
14-3 QSPI Mode Register (QMR) ................................................................................................. 14-9
14-4 QSPI Clocking and Data Transfer Example........................................................................14-10
14-5 SPI Modes Timing............................................................................................................... 14-11
14-6 QSPI Delay Register (QDLYR) ...........................................................................................14-11
14-7 QSPI Wrap Register (QWR) ............................................................................................... 14-12
14-8 QSPI Interrupt Register (QIR).............................................................................................14-13
14-9 QSPI Address Register.......................................................................................................14-14
14-10 QSPI Data Register ............................................................................................................14-14
14-11 Command RAM Registers (QCR0–QCR15).......................................................................14-15
15-1 Timer Block Diagram.............................................................................................................15-2
15-2 Timer Mode Registers (TMR0–TMR3)..................................................................................15-3
15-3 Timer Reference Registers (TRR0–TRR3)........................................................................... 15-4
15-4 Timer Capture Registers (TCAP0–TCAP3) ..........................................................................15-4
15-5 Timer Counter (TCN0–TCN3)...............................................................................................15-4
15-6 Timer Event Registers (TER0–TER3)...................................................................................15-5
16-1 Simplified Block Diagram ......................................................................................................16-1
16-2 UART Mode Registers 1 (UMR1n)........................................................................................16-4
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
xFreescale Semiconductor
List of Figures (Continued)
Figure Page
Number Title Number
16-3 UART Mode Register 2 (UMR2n) .........................................................................................16-6
16-4 UART Status Registers (USRn)............................................................................................16-7
16-5 UART Clock-Select Registers (UCSRn) ............................................................................... 16-8
16-6 UART Command Registers (UCRn) .....................................................................................16-9
16-7 UART Receiver Buffer (URBn)............................................................................................16-10
16-8 UART Transmitter Buffers (UTBn) ......................................................................................16-11
16-9 UART Input Port Change Registers (UIPCRn) ................................................................... 16-11
16-10 UART Auxiliary Control Registers (UACRn) .......................................................................16-12
16-11 UART Interrupt Status/Mask Registers (UISRn/UIMRn).....................................................16-13
16-12 UART Divider Upper Registers (UDUn)..............................................................................16-14
16-13 UART Divider Lower Registers (UDLn)...............................................................................16-14
16-14 UART Autobaud Upper Registers (UABUn)........................................................................16-14
16-15 UART Autobaud Lower Registers (UABLn) ........................................................................ 16-14
16-16 UART Transmitter FIFO Registers (UTFn) .........................................................................16-15
16-17 UART Receiver FIFO Registers (URFn)............................................................................. 16-16
16-18 UART Fractional Precision Divider Control Registers (UFPDn)..........................................16-17
16-19 UART Input Port Registers (UIPn) ......................................................................................16-17
16-20 UART Output Port Command Registers (UOP1/UOP0) .....................................................16-18
16-21 UART Block Diagram Showing External and Internal Interface Signals ............................. 16-18
16-22 UART/RS-232 Interface ......................................................................................................16-19
16-23 Clocking Source Diagram ...................................................................................................16-20
16-24 Transmitter and Receiver Functional Diagram.................................................................... 16-22
16-25 Transmitter Timing ..............................................................................................................16-23
16-26 Receiver Timing ..................................................................................................................16-24
16-27 Automatic Echo...................................................................................................................16-27
16-28 Local Loop-Back .................................................................................................................16-27
16-29 Remote Loop-Back .............................................................................................................16-28
16-30 Multidrop Mode Timing Diagram.........................................................................................16-29
16-31 UART Mode Programming Flowchart (Sheet 1 of 5) .......................................................... 16-30
17-1 Port A Control Register (PACNT)..........................................................................................17-3
17-2 Port B Control Register (PBCNT)..........................................................................................17-5
17-3 Port D Control Register (PDCNT) .........................................................................................17-8
17-4 Port A Data Direction Register (PADDR)............................................................................17-10
17-5 Port B Data Direction Register (PBDDR)............................................................................17-10
17-6 Port C Data Direction Register (PCDDR)............................................................................17-11
17-7 Port x Data Register (PADAT, PBDAT, and PCDAT) .........................................................17-11
18-1 PWM Block Diagram (3 Identical Modules)........................................................................... 18-1
18-2 PWM Control Registers (PWCRn) ........................................................................................18-3
18-3 PWM Width Register (PWWDn)............................................................................................18-4
18-4 PWM Waveform Examples (PWCRn[EN] = 1)...................................................................... 18-4
19-1 MCF5272 Block Diagram with Signal Interfaces...................................................................19-2
20-1 Internal Operand Representation..........................................................................................20-5
20-2 MCF5272 Interface to Various Port Sizes.............................................................................20-5
20-3 Longword Read; EBI = 00; 32-Bit Port; Internal Termination................................................20-8
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor xi
List of Figures (Continued)
Figure Page
Number Title Number
20-4 Word Write; EBI = 00; 16-/32-Bit Port; Internal Termination.................................................20-9
20-5 Longword Read with Address Setup; EBI = 00; 32-Bit Port; Internal Termination................ 20-9
20-6 Longword Write with Address Setup; EBI = 00; 32-Bit Port; Internal Termination..............20-10
20-7 Longword Read with Address Hold; EBI = 00; 32-Bit Port; Internal Termination................ 20-10
20-8 Longword Write with Address Hold; EBI = 00; 32-Bit Port; Internal Termination................ 20-11
20-9 Longword Read; EBI = 00; 32-Bit Port; Terminated by TA with One Wait State ................20-11
20-10 Longword Read; EBI=11; 32-Bit Port; Internal Termination................................................20-12
20-11 Word Write; EBI=11; 16/32-Bit Port; Internal Termination ..................................................20-13
20-12 Read with Address Setup; EBI=11; 32-Bit Port; Internal Termination.................................20-14
20-13 Longword Write with Address Setup; EBI=11; 32-Bit Port; Internal Termination................20-14
20-14 Read with Address Hold; EBI=11; 32-Bit Port; Internal Termination...................................20-15
20-15 Longword Write with Address Hold; EBI=11; 32-Bit Port; Internal Termination.................. 20-15
20-16 Longword Read with Address Setup and Address Hold;
EBI = 11; 32-Bit Port, Internal Termination .........................................................................20-16
20-17 Longword Write with Address Setup and Address Hold;
EBI = 11; 32-Bit Port, Internal Termination .........................................................................20-17
20-18 Example of a Misaligned Longword Transfer......................................................................20-18
20-19 Example of a Misaligned Word Transfer............................................................................. 20-18
20-20 Longword Write Access To 32-Bit Port Terminated with TEA Timing.................................20-20
20-21 Master Reset Timing........................................................................................................... 20-22
20-22 Normal Reset Timing .......................................................................................................... 20-23
20-23 Software Watchdog Timer Reset Timing ............................................................................20-24
20-24 Soft Reset Timing ............................................................................................................... 20-25
21-1 Test Access Port Block Diagram...........................................................................................21-2
21-2 TAP Controller State Machine...............................................................................................21-3
21-3 Output Cell (O.Cell) (BC–1) ..................................................................................................21-4
21-4 Input Cell (I.Cell). Observe only (BC–4)................................................................................21-5
21-5 Output Control Cell (En.Cell) (BC–4) .................................................................................... 21-5
21-6 Bidirectional Cell (IO.Cell) (BC–6).........................................................................................21-6
21-7 General Arrangement for Bidirectional Pins..........................................................................21-6
21-8 Bypass Register....................................................................................................................21-8
22-1 MCF5272 Pinout (196 MAPBGA) .........................................................................................22-1
22-2 196 MAPBGA Package Dimensions (Case No. 1128A-01)..................................................22-2
23-1 Clock Input Timing Diagram..................................................................................................23-5
23-2 General Input Timing Requirements .....................................................................................23-7
23-3 Read/Write SRAM Bus Timing..............................................................................................23-9
23-4 SRAM Bus Cycle Terminated by TA...................................................................................23-10
23-5 SRAM Bus Cycle Terminated by TEA.................................................................................23-11
23-6 Reset and Mode Select/HIZ Configuration Timing..............................................................23-12
23-7 Real-Time Trace AC Timing................................................................................................23-13
23-8 BDM Serial Port AC Timing.................................................................................................23-13
23-9 SDRAM Signal Timing ........................................................................................................23-15
23-10 SDRAM Self-Refresh Cycle Timing .................................................................................... 23-16
23-11 MII Receive Signal Timing Diagram.................................................................................... 23-17
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
xii Freescale Semiconductor
List of Figures (Continued)
Figure Page
Number Title Number
23-12 MII Transmit Signal Timing Diagram................................................................................... 23-18
23-13 MII Async Inputs Timing Diagram .......................................................................................23-19
23-14 MII Serial Management Channel Timing Diagram ..............................................................23-20
23-15 Timer Timing .......................................................................................................................23-21
23-16 UART Timing.......................................................................................................................23-22
23-17 IDL Master Timing............................................................................................................... 23-23
23-18 IDL Slave Timing................................................................................................................. 23-25
23-19 GCI Slave Mode Timing...................................................................................................... 23-26
23-20 GCI Master Mode Timing....................................................................................................23-27
23-21 General-Purpose I/O Port Timing........................................................................................ 23-28
23-22 USB Interface Timing..........................................................................................................23-29
23-23 IEEE 1149.1 (JTAG) Timing................................................................................................23-30
23-24 QSPI Timing........................................................................................................................23-31
23-25 PWM Timing........................................................................................................................23-32
B-1 Buffering and Termination.......................................................................................................B-2
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor xiii
Table of Contents
Paragraph Page
Number Title Number
Chapter 1
Overview
1.1 MCF5272 Key Features ................................................................................................................. 1-1
1.2 MCF5272 Architecture .................................................................................................................. 1-4
1.2.1 Version 2 ColdFire Core ..................................................................................................... 1-4
1.2.2 System Integration Module (SIM) ...................................................................................... 1-5
1.2.2.1 External Bus Interface .......................................................................................... 1-5
1.2.2.2 Chip Select and Wait State Generation ................................................................. 1-5
1.2.2.3 System Configuration and Protection ................................................................... 1-5
1.2.2.4 Power Management .............................................................................................. 1-6
1.2.2.5 Parallel Input/Output Ports ................................................................................... 1-6
1.2.2.6 Interrupt Inputs ..................................................................................................... 1-6
1.2.3 UART Module .................................................................................................................... 1-6
1.2.4 Timer Module ..................................................................................................................... 1-7
1.2.5 Test Access Port ................................................................................................................. 1-7
1.3 System Design .............................................................................................................................. 1-7
1.3.1 System Bus Configuration ..................................................................................................1-7
1.4 MCF5272-Specific Features .......................................................................................................... 1-7
1.4.1 Physical Layer Interface Controller (PLIC) ....................................................................... 1-7
1.4.2 Pulse-Width Modulation (PWM) Unit ............................................................................... 1-8
1.4.3 Queued Serial Peripheral Interface (QSPI) ........................................................................ 1-8
1.4.4 Universal Serial Bus (USB) Module .................................................................................. 1-8
Chapter 2
ColdFire Core
2.1 Features and Enhancements ........................................................................................................... 2-1
2.1.1 Decoupled Pipelines ........................................................................................................... 2-1
2.1.1.1 Instruction Fetch Pipeline (IFP) ............................................................................ 2-2
2.1.1.2 Operand Execution Pipeline (OEP) ...................................................................... 2-2
2.1.1.2.1 Illegal Opcode Handling.............................................................................. 2-3
2.1.1.2.2 Hardware Multiply/Accumulate (MAC) Unit.............................................. 2-3
2.1.1.2.3 Hardware Divide Unit.................................................................................. 2-4
2.1.2 Debug Module Enhancements ............................................................................................ 2-4
2.2 Programming Model ...................................................................................................................... 2-4
2.2.1 User Programming Model .................................................................................................. 2-4
2.2.1.1 Data Registers (D0–D7) ....................................................................................... 2-5
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2.2.1.2 Address Registers (A0–A6) .................................................................................. 2-5
2.2.1.3 S tack Pointer (A7, SP) .......................................................................................... 2-5
2.2.1.4 Program Counter (PC) .......................................................................................... 2-6
2.2.1.5 Condition Code Register (CCR) ........................................................................... 2-6
2.2.1.6 MAC Programming Model ................................................................................... 2-7
2.2.2 Supervisor Programming Model ........................................................................................ 2-7
2.2.2.1 Status Register (SR) .............................................................................................. 2-8
2.2.2.2 Vector Base Register (VBR) ................................................................................. 2-8
2.2.2.3 Cache Control Register (CACR) .......................................................................... 2-9
2.2.2.4 Access Control Registers (ACR0–ACR1) ............................................................ 2-9
2.2.2.5 ROM Base Address Register (ROMBAR) ........................................................... 2-9
2.2.2.6 RAM Base Address Register (RAMBAR) ........................................................... 2-9
2.2.2.7 Module Base Address Register (MBAR) ............................................................. 2-9
2.3 Integer Data Formats ..................................................................................................................... 2-9
2.4 Organization of Data in Registers ................................................................................................ 2-10
2.4.1 Organization of Integer Data Formats in Registers .......................................................... 2-10
2.4.2 Organization of Integer Data Formats in Memory ........................................................... 2-11
2.5 Addressing Mode Summary ........................................................................................................ 2-12
2.6 Instruction Set Summary ............................................................................................................. 2-13
2.6.1 Instruction Set Summary .................................................................................................. 2-15
2.7 Instruction Timing ........................................................................................................................ 2-19
2.7.1 MOVE Instruction Execution Times ................................................................................ 2-20
2.7.2 Execution Timings—One-Operand Instructions .............................................................. 2-22
2.7.3 Execution Timings—Two-Operand Instructions .............................................................. 2-22
2.7.4 Miscellaneous Instruction Execution Times .....................................................................2-24
2.7.5 Branch Instruction Execution Times ................................................................................ 2-25
2.8 Exception Processing Overview .................................................................................................. 2-25
2.8.1 Exception Stack Frame Definition ................................................................................... 2-27
2.8.2 Processor Exceptions ........................................................................................................ 2-28
Chapter 3
Hardware Multiply/Accumulate (MAC) Unit
3.1 Overview ........................................................................................................................................ 3-1
3.1.1 MAC Programming Model ................................................................................................. 3-2
3.1.2 General Operation .............................................................................................................. 3-3
3.1.3 MAC Instruction Set Summary .......................................................................................... 3-4
3.1.4 Data Representation ............................................................................................................ 3-4
3.2 MAC Instruction Execution Timings ............................................................................................. 3-4
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Chapter 4
Local Memory
4.1 Interactions between Local Memory Modules .............................................................................. 4-1
4.2 Local Memory Registers ................................................................................................................ 4-2
4.3 SRAM Overview ........................................................................................................................... 4-2
4.3.1 SRAM Operation ................................................................................................................ 4-2
4.3.2 SRAM Programming Model .............................................................................................. 4-2
4.3.2.1 SRAM Base Address Register (RAMBAR) ......................................................... 4-3
4.3.2.2 SRAM Initialization ............................................................................................. 4-4
4.3.2.3 Programming RAMBAR for Power Management ............................................... 4-4
4.4 ROM Overview .............................................................................................................................. 4-5
4.4.1 ROM Operation .................................................................................................................. 4-5
4.4.2 ROM Programming Model ................................................................................................. 4-5
4.4.2.1 ROM Base Address Register (ROMBAR) ........................................................... 4-5
4.4.2.2 Programming ROMBAR for Power Management ............................................... 4-6
4.5 Instruction Cache Overview .......................................................................................................... 4-7
4.5.1 Instruction Cache Physical Organization ........................................................................... 4-7
4.5.2 Instruction Cache Operation ...............................................................................................4-8
4.5.2.1 Interaction with Other Modules ............................................................................ 4-8
4.5.2.2 Cache Coherency and Invalidation ....................................................................... 4-8
4.5.2.3 Caching Modes ..................................................................................................... 4-9
4.5.2.3.1 Cacheable Accesses ..................................................................................... 4-9
4.5.2.3.2 Cache-Inhibited Accesses............................................................................ 4-9
4.5.2.4 Reset ...................................................................................................................4-10
4.5.2.5 Cache Miss Fetch Algorithm/Line Fills ............................................................. 4-10
4.5.3 Instruction Cache Programming Model ........................................................................... 4-12
4.5.3.1 Cache Control Register (CACR) ........................................................................ 4-12
4.5.3.2 Access Control Registers (ACR0 and ACR1) .................................................... 4-14
Chapter 5
Debug Support
5.1 Overview ........................................................................................................................................ 5-1
5.2 Signal Description .......................................................................................................................... 5-2
5.3 Real-Time Trace Support ............................................................................................................... 5-3
5.3.1 Begin Execution of Taken Branch (PST = 0x5) ................................................................. 5-4
5.4 Programming Model ...................................................................................................................... 5-5
5.4.1 Revision A Shared Debug Resources ................................................................................. 5-7
5.4.2 Address Attribute Trigger Register (AATR) ...................................................................... 5-7
5.4.3 Address Breakpoint Registers (ABLR, ABHR) ................................................................. 5-9
5.4.4 Configuration/Status Register (CSR) ............................................................................... 5-10
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5.4.5 Data Breakpoint/Mask Registers (DBR, DBMR) ............................................................ 5-12
5.4.6 Program Counter Breakpoint/Mask Registers
(PBR, PBMR) ............................................................................................................................ 5-13
5.4.7 Trigger Definition Register (TDR) ................................................................................... 5-14
5.5 Background Debug Mode (BDM) ............................................................................................... 5-15
5.5.1 CPU Halt .......................................................................................................................... 5-16
5.5.2 BDM Serial Interface ....................................................................................................... 5-17
5.5.2.1 Receive Packet Format ....................................................................................... 5-18
5.5.2.2 Transmit Packet Format ...................................................................................... 5-18
5.5.3 BDM Command Set ......................................................................................................... 5-19
5.5.3.1 ColdFire BDM Command Format ...................................................................... 5-20
5.5.3.1.1 Extension Words as Required.................................................................... 5-20
5.5.3.2 Command Sequence Diagrams ........................................................................... 5-21
5.5.3.3 Command Set Descriptions ................................................................................ 5-22
5.5.3.3.1 Read A/D Register (RAREG/RDREG)........................................................... 5-22
5.5.3.3.2 Write A/D Register (WAREG/WDREG)........................................................ 5-23
5.5.3.3.3 Read Memory Location (READ)................................................................. 5-24
5.5.3.3.4 Write Memory Location (WRITE)............................................................... 5-25
5.5.3.3.5 Dump Memory Block (DUMP) ................................................................... 5-27
5.5.3.3.6 Fill Memory Block (FILL) .......................................................................... 5-28
5.5.3.3.7 Resume Execution (GO) ............................................................................. 5-29
5.5.3.3.8 No Operation (NOP).................................................................................... 5-30
5.5.3.3.9 Read Control Register (RCREG).................................................................. 5-30
5.5.3.3.10 Write Control Register (WCREG).............................................................. 5-31
5.5.3.3.11 Read Debug Module Register (RDMREG)................................................. 5-32
5.5.3.3.12 Write Debug Module Register (WDMREG)............................................... 5-33
5.6 Real-Time Debug Support ........................................................................................................... 5-33
5.6.1 Theory of Operation .......................................................................................................... 5-34
5.6.1.1 Emulator Mode ................................................................................................... 5-35
5.6.2 Concurrent BDM and Processor Operation ...................................................................... 5-35
5.7 Processor Status, DDATA Definition ........................................................................................... 5-36
5.7.1 User Instruction Set .......................................................................................................... 5-36
5.7.2 Supervisor Instruction Set ................................................................................................5-40
5.8 Freescale-Recommended BDM Pinout ....................................................................................... 5-41
Chapter 6
System Integration Module (SIM)
6.1 Features .......................................................................................................................................... 6-1
6.2 Programming Model ...................................................................................................................... 6-2
6.2.1 SIM Register Memory Map ................................................................................................ 6-2
6.2.2 Module Base Address Register (MBAR) ........................................................................... 6-3
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6.2.3 System Configuration Register (SCR) ............................................................................... 6-5
6.2.4 System Protection Register (SPR) ...................................................................................... 6-6
6.2.5 Power Management Register (PMR) .................................................................................. 6-7
6.2.6 Activate Low-Power Register (ALPR) ............................................................................ 6-10
6.2.7 Device Identification Register (DIR) ............................................................................... 6-11
6.2.8 Software Watchdog Timer ................................................................................................ 6-11
6.2.8.1 Watchdog Reset Reference Register (WRRR) ................................................... 6-12
6.2.8.2 Watchdog Interrupt Reference Register (WIRR) ................................................ 6-12
6.2.8.3 Watchdog Counter Register (WCR) ................................................................... 6-13
6.2.8.4 Watchdog Event Register (WER) ....................................................................... 6-13
Chapter 7
Interrupt Controller
7.1 Overview ........................................................................................................................................ 7-1
7.2 Interrupt Controller Registers ........................................................................................................ 7-2
7.2.1 Interrupt Controller Registers ............................................................................................. 7-3
7.2.2 Interrupt Control Registers (ICR1–ICR4) .......................................................................... 7-4
7.2.2.1 Interrupt Control Register 1 (ICR1) ..................................................................... 7-4
7.2.2.2 Interrupt Control Register 2 (ICR2) ..................................................................... 7-5
7.2.2.3 Interrupt Control Register 3 (ICR3) ..................................................................... 7-5
7.2.2.4 Interrupt Control Register 4 (ICR4) ..................................................................... 7-5
7.2.3 Interrupt Source Register (ISR) .......................................................................................... 7-6
7.2.4 Programmable Interrupt Transition Register (PITR) .......................................................... 7-7
7.2.5 Programmable Interrupt Wakeup Register (PIWR) ............................................................ 7-8
7.2.6 Programmable Interrupt Vector Register (PIVR) ............................................................... 7-9
Chapter 8
Chip Select Module
8.1 Overview ........................................................................................................................................ 8-1
8.1.1 Features ............................................................................................................................... 8-1
8.1.2 Chip Select Usage ............................................................................................................... 8-1
8.1.3 Boot CS0 Operation ........................................................................................................... 8-2
8.2 Chip Select Registers ..................................................................................................................... 8-2
8.2.1 Chip Select Base Registers (CSBR0–CSBR7) ................................................................... 8-3
8.2.2 Chip Select Option Registers (CSOR0–CSOR7) ............................................................... 8-5
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Chapter 9
SDRAM Controller
9.1 Overview ........................................................................................................................................ 9-1
9.2 SDRAM Controller Signals ........................................................................................................... 9-1
9.3 Interface to SDRAM Devices ........................................................................................................ 9-4
9.4 SDRAM Banks, Page Hits, and Page Misses ................................................................................ 9-6
9.5 SDRAM Registers ......................................................................................................................... 9-6
9.5.1 SDRAM Configuration Register (SDCR) ..........................................................................9-6
9.5.2 SDRAM Timing Register (SDTR) ..................................................................................... 9-8
9.6 Auto Initialization .......................................................................................................................... 9-9
9.7 Power-Down and Self-Refresh ...................................................................................................... 9-9
9.8 Performance ................................................................................................................................. 9-10
9.9 Solving Timing Issues with SDCR[INV] .................................................................................... 9-12
9.10 SDRAM Interface ...................................................................................................................... 9-14
9.10.1 SDRAM Read Accesses ................................................................................................. 9-15
9.10.2 SDRAM Write Accesses ................................................................................................ 9-18
9.10.3 SDRAM Refresh Timing ................................................................................................ 9-20
Chapter 10
DMA Controller
10.1 DMA Data Transfer Types ......................................................................................................... 10-1
10.2 DMA Address Modes ................................................................................................................ 10-2
10.3 DMA Controller Registers ......................................................................................................... 10-2
10.3.1 DMA Mode Register (DMR) ......................................................................................... 10-2
10.3.2 DMA Interrupt Register (DIR) ....................................................................................... 10-4
10.3.3 DMA Source Address Register (DSAR) ........................................................................ 10-5
10.3.4 DMA Destination Address Register (DDAR) ................................................................ 10-6
10.3.5 DMA Byte Count Register (DBCR) ............................................................................... 10-6
Chapter 11
Ethernet Module
11.1 Overview .................................................................................................................................... 11-1
11.1.1 Features ........................................................................................................................... 11-1
11.2 Module Operation ...................................................................................................................... 11-1
11.3 Transceiver Connection ............................................................................................................. 11-3
11.4 FEC Frame Transmission ........................................................................................................... 11-4
11.4.1 FEC Frame Reception .................................................................................................... 11-5
11.4.2 CAM Interface ................................................................................................................ 11-6
11.4.3 Ethernet Address Recognition ........................................................................................ 11-6
11.4.4 Hash Table Algorithm ..................................................................................................... 11-8
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11.4.5 Interpacket Gap Time ..................................................................................................... 11-8
11.4.6 Collision Handling .......................................................................................................... 11-8
11.4.7 Internal and External Loopback ..................................................................................... 11-8
11.4.8 Ethernet Error-Handling Procedure ................................................................................ 11-9
11.4.8.1 Transmission Errors .......................................................................................... 11-9
11.4.8.2 Reception Errors ............................................................................................... 11-9
11.5 Programming Model ................................................................................................................ 11-10
11.5.1 Ethernet Control Register (ECR) ...................................................................................11-11
11.5.2 Interrupt Event Register (EIR) ..................................................................................... 11-12
11.5.3 Interrupt Mask Register (EIMR) .................................................................................. 11-13
11.5.4 Interrupt Vector Status Register (IVSR) ....................................................................... 11-14
11.5.5 Receive Descriptor Active Register (RDAR) ............................................................... 11-15
11.5.6 Transmit Descriptor Active Register (TDAR) ............................................................. 11-16
11.5.7 MII Management Frame Register (MMFR) ................................................................. 11-17
11.5.8 MII Speed Control Register (MSCR) ........................................................................... 11-18
11.5.9 FIFO Receive Bound Register (FRBR) ........................................................................ 11-19
11.5.10 FIFO Receive Start Register (FRSR) ......................................................................... 11-20
11.5.11 Transmit FIFO Watermark (TFWR) ........................................................................... 11-21
11.5.12 FIFO Transmit Start Register (TFSR) ........................................................................ 11-22
11.5.13 Receive Control Register (RCR) ................................................................................ 11-23
11.5.14 Maximum Frame Length Register (MFLR) ............................................................... 11-24
11.5.15 Transmit Control Register (TCR) ............................................................................... 11-25
11.5.16 RAM Perfect Match Address Low (MALR) .............................................................. 11-26
11.5.16.1 RAM Perfect Match Address High (MAUR) ............................................... 11-27
11.5.17 Hash Table High (HTUR) ........................................................................................... 11-28
11.5.18 Hash Table Low (HTLR) ............................................................................................ 11-29
11.5.19 Pointer-to-Receive Descriptor Ring (ERDSR) ........................................................... 11-30
11.5.20 Pointer-to-Transmit Descriptor Ring (ETDSR) .......................................................... 1 1-31
11.5.21 Receive Buffer Size Register (EMRBR) .................................................................... 11-32
11.5.22 Initialization Sequence ............................................................................................... 11-33
11.5.22.1 Hardware Initialization ................................................................................. 11-33
11.5.23 User Initialization (Prior to Asserting ETHER_EN) .................................................. 11-33
11.5.24 FEC Initialization ....................................................................................................... 11-34
11.5.24.1 User Initialization (after setting ETHER_EN) .............................................. 11-34
11.6 Buffer Descriptors .................................................................................................................... 11-34
11.6.1 FEC Buffer Descriptor Tables ...................................................................................... 11-35
11.6.1.1 Ethernet Receive Buffer Descriptor (RxBD) .................................................. 11-35
11.6.1.2 Ethernet Transmit Buffer Descriptor .............................................................. 11-37
11.7 Differences between MCF5272 FEC and MPC860T FEC ...................................................... 11-39
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Chapter 12
Universal Serial Bus (USB)
12.1 Introduction ................................................................................................................................ 12-1
12.2 Module Operation ...................................................................................................................... 12-2
12.2.1 USB Module Architecture .............................................................................................. 12-2
12.2.1.1 USB Transceiver Interface ................................................................................ 12-3
12.2.1.2 Clock Generator ................................................................................................ 12-4
12.2.1.3 USB Control Logic ........................................................................................... 12-4
12.2.1.4 Endpoint Controllers ......................................................................................... 12-5
12.2.1.5 USB Request Processor .................................................................................... 12-5
12.3 Register Description and Programming Model ......................................................................... 12-7
12.3.1 USB Memory Map ......................................................................................................... 12-7
12.3.2 Register Descriptions ...................................................................................................... 12-9
12.3.2.1 USB Frame Number Register (FNR) ............................................................... 12-9
12.3.2.2 USB Frame Number Match Register (FNMR) .................................................12-9
12.3.2.3 USB Real-Time Frame Monitor Register (RFMR) ........................................ 12-10
12.3.2.4 USB Real-Time Frame Monitor Match Register (RFMMR) ......................... 12-11
12.3.2.5 USB Function Address Register (FAR) .......................................................... 12-11
12.3.2.6 USB Alternate Settings Register (ASR) ......................................................... 12-12
12.3.2.7 USB Device Request Data 1 and 2 Registers (DRR1/ 2) ............................... 12-13
12.3.2.8 USB Specification Number Register (SPECR) .............................................. 12-14
12.3.2.9 USB Endpoint 0 Status Register (EP0SR) ...................................................... 12-14
12.3.2.10 USB Endpoint 0 IN Configuration Register (IEP0CFG) ............................. 12-15
12.3.2.11 USB Endpoint 0 OUT Configuration Register (OEP0CFG) ........................ 12-16
12.3.2.12 USB Endpoint 1–7 Configuration Register (EPnCFG) ................................ 12-16
12.3.2.13 USB Endpoint 0 Control Register (EP0CTL) .............................................. 12-17
12.3.2.14 USB Endpoint 1–7 Control Register (EPnCTL) .......................................... 12-20
12.3.2.15 USB Endpoint 0 Interrupt Mask (EP0IMR) and General/Endpoint 0 Interrupt
Registers (EP0ISR) .......................................................................................................... 12-22
12.3.2.16 USB Endpoints 1–7 Status / Interrupt Registers (EPnISR) .......................... 12-25
12.3.2.17 USB Endpoint 1–7 Interrupt Mask Registers (EPnIMR) ............................. 12-26
12.3.2.18 USB Endpoint 0–7 Data Registers (EPnDR) ................................................ 12-27
12.3.2.19 USB Endpoint 0–7 Data Present Registers (EPnDPR) ................................. 12-28
12.3.3 Configuration RAM ...................................................................................................... 12-28
12.3.3.1 Configuration RAM Content .......................................................................... 12-28
12.3.3.2 USB Device Configuration Example .............................................................. 12-29
12.3.4 USB Module Access Times .......................................................................................... 12-30
12.3.4.1 Registers ......................................................................................................... 12-30
12.3.4.2 Endpoint FIFOs .............................................................................................. 12-30
12.3.4.3 Configuration RAM ........................................................................................ 12-30
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12.4 Software Architecture and Application Notes ......................................................................... 12-31
12.4.1 USB Module Initialization ........................................................................................... 12-31
12.4.2 USB Configuration and Interface Changes .................................................................. 12-31
12.4.3 FIFO Configuration ...................................................................................................... 12-32
12.4.4 Data Flow ..................................................................................................................... 12-32
12.4.4.1 Control, Bulk, and Interrupt Endpoints .......................................................... 12-33
12.4.4.1.1 IN Endpoints .......................................................................................... 12-33
12.4.4.1.2 OUT Endpoints ...................................................................................... 12-33
12.4.4.2 Isochronous Endpoints .................................................................................... 12-33
12.4.4.2.1 IN Endpoints .......................................................................................... 12-34
12.4.4.2.2 OUT Endpoints ...................................................................................... 12-34
12.4.5 Class- and Vendor-Specific Request Operation ............................................................12-34
12.4.6 remote wakeup and resume Operation ......................................................................... 12-35
12.4.7 Endpoint Halt Feature ................................................................................................... 12-35
12.5 Line Interface ........................................................................................................................... 12-36
12.5.1 Attachment Detection ................................................................................................... 12-36
12.5.2 PCB Layout Recommendations ................................................................................... 12-36
12.5.3 Recommended USB Protection Circuit ........................................................................ 12-37
Chapter 13
Physical Layer Interface Controller (PLIC)
13.1 Introduction ................................................................................................................................ 13-1
13.2 GCI/IDL Block .......................................................................................................................... 13-3
13.2.1 GCI/IDL B- and D-Channel Receive Data Registers ..................................................... 13-3
13.2.2 GCI/IDL B- and D-Channel Transmit Data Registers ................................................... 13-4
13.2.3 GCI/IDL B- and D-Channel Bit Alignment ................................................................... 13-5
13.2.3.1 B-Channel Unencoded Data ............................................................................. 13-5
13.2.3.2 B-Channel HDLC Encoded Data ...................................................................... 13-6
13.2.3.3 D-Channel HDLC Encoded Data ..................................................................... 13-6
13.2.3.4 D-Channel Unencoded Data ............................................................................. 13-7
13.2.3.5 GCI/IDL D-Channel Contention ..................................................................... 13-8
13.2.4 GCI/IDL Looping Modes ............................................................................................... 13-8
13.2.4.1 Automatic Echo Mode ...................................................................................... 13-9
13.2.4.2 Local Loopback Mode ...................................................................................... 13-9
13.2.4.3 Remote Loopback Mode ................................................................................... 13-9
13.2.5 GCI/IDL Interrupts ......................................................................................................... 13-9
13.2.5.1 GCI/IDL Periodic Frame Interrupt ................................................................... 13-9
13.2.5.2 GCI Aperiodic Status Interrupt ...................................................................... 13-10
13.2.5.3 Interrupt Control ............................................................................................. 13-11
13.3 PLIC Timing Generator ........................................................................................................... 13-11
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13.3.1 Clock Synthesis ............................................................................................................ 13-11
13.3.2 Super Frame Sync Generation ...................................................................................... 13-13
13.3.3 Frame Sync Synthesis ................................................................................................... 13-13
13.4 PLIC Register Memory Map ................................................................................................... 13-13
13.5 PLIC Registers ......................................................................................................................... 13-15
13.5.1 B1 Data Receive Registers (P0B1RR–P3B1RR) ......................................................... 13-15
13.5.2 B2 Data Receive Registers (P0B2RR–P3B2RR) ......................................................... 13-16
13.5.3 D Data Receive Registers (P0DRR–P3DRR) .............................................................. 13-16
13.5.4 B1 Data Transmit Registers (P0B1TR–P3B1TR) ......................................................... 13-17
13.5.5 B2 Data Transmit Registers (P0B2TR–P3B2TR) ........................................................ 13-17
13.5.6 D Data Transmit Registers (P0DTR–P3DTR) ............................................................. 13-18
13.5.7 Port Configuration Registers (P0CR–P3CR) ............................................................... 13-18
13.5.8 Loopback Control Register (PLCR) ............................................................................. 13-20
13.5.9 Interrupt Configuration Registers (P0ICR–P3ICR) ..................................................... 13-20
13.5.10 Periodic Status Registers (P0PSR–P3PSR) ................................................................ 13-22
13.5.11 Aperiodic Status Register (PASR) .............................................................................. 13-23
13.5.12 GCI Monitor Channel Receive Registers (P0GMR–P3GMR) ................................... 13-24
13.5.13 GCI Monitor Channel Transmit Registers (P0GMT–P3GMT) .................................. 13-25
13.5.14 GCI Monitor Channel Transmit Abort Register (PGMTA) ....................................... 13-26
13.5.15 GCI Monitor Channel Transmit Status Register (PGMTS) ....................................... 13-27
13.5.16 GCI C/I Channel Receive Registers (P0GCIR–P3GCIR) .......................................... 13-28
13.5.17 GCI C/I Channel Transmit Registers (P0GCIT–P3GCIT) ......................................... 13-29
13.5.18 GCI C/I Channel Transmit Status Register (PGCITSR) ............................................ 13-30
13.5.19 D-Channel Status Register (PDCSR) ......................................................................... 13-31
13.5.20 D-Channel Request Register (PDRQR) ..................................................................... 13-32
13.5.21 Sync Delay Registers (P0SDR–P3SDR) .................................................................... 13-33
13.5.22 Clock Select Register (PCSR) .................................................................................... 13-34
13.6 Application Examples .............................................................................................................. 13-35
13.6.1 Introduction .................................................................................................................. 13-35
13.6.2 PLIC Initialization ........................................................................................................ 13-35
13.6.2.1 Port Configuration Example ........................................................................... 13-35
13.6.2.2 Interrupt Configuration Example .................................................................... 13-37
13.6.3 Example 1: ISDN SOHO PBX with Ports 0, 1, 2, and 3 .............................................. 13-38
13.6.4 Example 2: ISDN SOHO PBX with Ports 1, 2, and 3 .................................................. 13-40
13.6.5 Example 3: Two-Line Remote Access with Ports 0 and 1 ........................................... 13-41
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Chapter 14
Queued Serial Peripheral Interface (QSPI) Module
14.1 Overview .................................................................................................................................... 14-1
14.2 Features ...................................................................................................................................... 14-1
14.3 Module Description ................................................................................................................... 14-1
14.3.1 Interface and Pins ........................................................................................................... 14-3
14.3.2 Internal Bus Interface ..................................................................................................... 14-3
14.4 Operation ................................................................................................................................... 14-3
14.4.1 QSPI RAM ..................................................................................................................... 14-4
14.4.1.1 Receive RAM ................................................................................................... 14-5
14.4.1.2 Transmit RAM .................................................................................................. 14-6
14.4.1.3 Command RAM ............................................................................................... 14-6
14.4.2 Baud Rate Selection ....................................................................................................... 14-6
14.4.3 Transfer Delays ............................................................................................................... 14-7
14.4.4 Transfer Length .............................................................................................................. 14-8
14.4.5 Data Transfer .................................................................................................................. 14-8
14.5 Programming Model .................................................................................................................. 14-9
14.5.1 QSPI Mode Register (QMR) .......................................................................................... 14-9
14.5.2 QSPI Delay Register (QDLYR) ................................................................................... 14-11
14.5.3 QSPI Wrap Register (QWR) ........................................................................................ 14-12
14.5.4 QSPI Interrupt Register (QIR) ...................................................................................... 14-13
14.5.5 QSPI Address Register (QAR) ..................................................................................... 14-14
14.5.6 QSPI Data Register (QDR) .......................................................................................... 14-14
14.5.7 Command RAM Registers (QCR0–QCR15) ............................................................... 14-15
14.5.8 Programming Example ................................................................................................. 14-16
Chapter 15
Timer Module
15.1 Overview .................................................................................................................................... 15-1
15.2 Timer Operation ......................................................................................................................... 15-1
15.3 General-Purpose Timer Registers .............................................................................................. 15-3
15.3.1 Timer Mode Registers (TMR0–TMR3) .......................................................................... 15-3
15.3.2 Timer Reference Registers (TRR0–TRR3) .................................................................... 15-4
15.3.3 Timer Capture Registers (TCAP0–TCAP3) ................................................................... 15-4
15.3.4 Timer Counters (TCN0–TCN3) ..................................................................................... 15-4
15.3.5 Timer Event Registers (TER0–TER3) ........................................................................... 15-5
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Chapter 16
UART Modules
16.1 Overview .................................................................................................................................... 16-1
16.2 Serial Module Overview ............................................................................................................ 16-2
16.3 Register Descriptions ................................................................................................................. 16-2
16.3.1 UART Mode Registers 1 (UMR1n) ............................................................................... 16-4
16.3.2 UART Mode Register 2 (UMR2n) ................................................................................. 16-6
16.3.3 UART Status Registers (USRn) ..................................................................................... 16-7
16.3.4 UART Clock-Select Registers (UCSRn) ........................................................................ 16-8
16.3.5 UART Command Registers (UCRn) .............................................................................. 16-9
16.3.6 UART Receiver Buffers (URBn) ................................................................................. 16-10
16.3.7 UART Transmitter Buffers (UTBn) ............................................................................. 16-11
16.3.8 UART Input Port Change Registers (UIPCRn) ............................................................ 16-11
16.3.9 UART Auxiliary Control Registers (UACRn) ............................................................. 16-12
16.3.10 UART Interrupt Status/Mask Registers (UISRn/UIMRn) .......................................... 16-12
16.3.11 UART Divider Upper/Lower Registers (UDUn/UDLn) ............................................ 16-14
16.3.12 UART Autobaud Registers (UABUn/UABLn) .......................................................... 16-14
16.3.13 UART Transmitter FIFO Registers (UTFn) ............................................................... 16-15
16.3.14 UART Receiver FIFO Registers (URFn) ................................................................... 16-16
16.3.15 UART Fractional Precision Divider Control Registers (UFPDn) .............................. 16-17
16.3.16 UART Input Port Registers (UIPn) ............................................................................ 16-17
16.3.17 UART Output Port Command Registers (UOP1n/UOP0n) ....................................... 16-18
16.4 UART Module Signal Definitions ........................................................................................... 16-18
16.5 Operation ................................................................................................................................. 16-19
16.5.1 Transmitter/Receiver Clock Source .............................................................................. 16-19
16.5.1.1 Programmable Divider .................................................................................... 16-20
16.5.1.2 Calculating Baud Rates ................................................................................... 16-20
16.5.1.2.1 CLKIN Baud Rates................................................................................ 16-20
16.5.1.2.2 External Clock........................................................................................ 16-21
16.5.1.2.3 Autobaud Detection ............................................................................... 16-21
16.5.2 Transmitter and Receiver Operating Modes ................................................................. 16-22
16.5.2.1 Transmitting ................................................................................................... 16-22
16.5.2.2 Receiver .......................................................................................................... 16-24
16.5.2.3 Transmitter FIFO ............................................................................................ 16-25
16.5.2.4 Receiver FIFO ............................................................................................... 16-25
16.5.3 Looping Modes ............................................................................................................. 16-26
16.5.3.1 Automatic Echo Mode .................................................................................... 16-27
16.5.3.2 Local Loop-Back Mode .................................................................................. 16-27
16.5.3.3 Remote Loop-Back Mode ............................................................................... 16-27
16.5.4 Multidrop Mode ............................................................................................................ 16-28
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16.5.5 Bus Operation ............................................................................................................... 16-29
16.5.5.1 Read Cycles .................................................................................................... 16-29
16.5.5.2 Write Cycles ................................................................................................... 16-29
16.5.5.3 Interrupt Acknowledge Cycles ....................................................................... 16-29
16.5.6 Programming ................................................................................................................ 16-30
16.5.6.1 UART Module Initialization Sequence .......................................................... 16-30
Chapter 17
General Purpose I/O Module
17.1 Overview .................................................................................................................................... 17-1
17.2 Port Control Registers ................................................................................................................ 17-2
17.2.1 Port A Control Register (PACNT) .................................................................................. 17-3
17.2.2 Port B Control Register (PBCNT) .................................................................................. 17-5
17.2.3 Port C Control Register .................................................................................................. 17-8
17.2.4 Port D Control Register (PDCNT) ................................................................................. 17-8
17.3 Data Direction Registers .......................................................................................................... 17-10
17.3.1 Port A Data Direction Register (PADDR) .................................................................... 17-10
17.3.2 Port B Data Direction Register (PBDDR) .................................................................... 17-10
17.3.3 Port C Data Direction Register (PCDDR) .................................................................... 17-11
17.4 Port Data Registers .................................................................................................................. 17-11
17.4.1 Port Data Register (PxDAT) ......................................................................................... 17-11
Chapter 18
Pulse-Width Modulation (PWM) Module
18.1 Overview .................................................................................................................................... 18-1
18.2 PWM Operation ......................................................................................................................... 18-2
18.3 PWM Programming Model ....................................................................................................... 18-2
18.3.1 PWM Control Register (PWCRn) .................................................................................. 18-3
18.3.2 PWM Width Register (PWWDn) ................................................................................... 18-4
Chapter 19
Signal Descriptions
19.1 MCF5272 Block Diagram with Signal Interfaces ..................................................................... 19-1
19.2 Signal List .................................................................................................................................. 19-3
19.3 Address Bus (A[22:0]/SDA[13:0]) .......................................................................................... 19-19
19.4 Data Bus (D[31:0]) .................................................................................................................. 19-19
19.4.1 Dynamic Data Bus Sizing ............................................................................................ 19-19
19.5 Chip Selects (CS7/SDCS, CS[6:0]) ......................................................................................... 19-19
19.6 Bus Control Signals ................................................................................................................. 19-20
19.6.1 Output Enable/Read (OE/RD) ...................................................................................... 19-20
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19.6.2 Byte Strobes (BS[3:0]) ................................................................................................. 19-20
19.6.3 Read/Write (R/W) ......................................................................................................... 19-21
19.6.4 Transfer Acknowledge (TA/PB5) ................................................................................. 19-22
19.6.5 Hi-Z .............................................................................................................................. 19-22
19.6.6 Bypass ........................................................................................................................... 19-22
19.6.7 SDRAM Row Address Strobe (RAS0) ........................................................................ 19-22
19.6.8 SDRAM Column Address Strobe (CAS0) ................................................................... 19-22
19.6.9 SDRAM Clock (SDCLK) ............................................................................................. 19-22
19.6.10 SDRAM Write Enable (SDWE) ................................................................................. 19-22
19.6.11 SDRAM Clock Enable (SDCLKE) ............................................................................ 19-22
19.6.12 SDRAM Bank Selects (SDBA[1:0]) .......................................................................... 19-23
19.6.13 SDRAM Row Address 10 (A10)/A10 Precharge (A10_PRECHG) .......................... 19-23
19.7 CPU Clock and Reset Signals .................................................................................................. 19-23
19.7.1 RSTI ............................................................................................................................. 19-23
19.7.2 DRESETEN .................................................................................................................. 19-23
19.7.3 CPU External Clock (CLKIN) ..................................................................................... 19-23
19.7.4 Reset Output (RSTO) ................................................................................................... 19-23
19.8 Interrupt Request Inputs (INT[6:1]) ......................................................................................... 19-23
19.9 General-Purpose I/O (GPIO) Ports .......................................................................................... 19-24
19.10 UART0 Module Signals and PB[4:0] .................................................................................... 19-24
19.10.1 Transmit Serial Data Output (URT0_TxD/PB0) ........................................................ 19-24
19.10.2 Receive Serial Data Input (URT0_RxD/PB1) ............................................................ 19-25
19.10.3 Clear-to-Send (URT0_CTS/PB2) ............................................................................... 19-25
19.10.4 Request to Send (URT0_RTS/PB3) ............................................................................ 19-25
19.10.5 Clock (URT0_CLK/PB4) ........................................................................................... 19-25
19.11 USB Module Signals and PA[6:0] ......................................................................................... 19-25
19.11.1 USB Transmit Serial Data Output (USB_TP/PA0) .................................................... 19-25
19.11.2 USB Receive Serial Data Input (USB_RP/PA1) ........................................................ 19-25
19.11.3 USB Receive Data Negative (USB_RN/PA2) ............................................................ 19-25
19.11.4 USB Transmit Data Negative (USB_TN/PA3) ........................................................... 19-26
19.11.5 USB Suspend Driver (USB_SUSP/PA4) .................................................................... 19-26
19.11.6 USB Transmitter Output Enable (USB_TxEN/PA5) .................................................. 19-26
19.11.7 USB Rx Data Output (USB_RxD/PA6) ..................................................................... 19-26
19.11.8 USB_D+ and USB_D- ................................................................................................ 19-26
19.11.9 USB_CLK .................................................................................................................. 19-26
19.11.10 INT1/USB Wake-on-Ring (USB_WOR) ................................................................. 19-26
19.12 Timer Module Signals ............................................................................................................ 19-27
19.12.1 Timer Input 0 (TIN0) .................................................................................................. 19-27
19.12.2 Timer Output (TOUT0)/PB7 ......................................................................................19-27
19.12.3 Timer Input 1 (TIN1)/PWM Mode Output 2 (PWM_OUT2) .................................... 19-27
19.12.4 Timer Output 1 (TOUT1)/PWM Mode Output 1 (PWM_OUT1) ..............................19-27
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19.13 Ethernet Module Signals ........................................................................................................ 19-27
19.13.1 Transmit Clock (E_TxCLK) ....................................................................................... 19-27
19.13.2 Transmit Data (E_TxD0) ............................................................................................ 19-28
19.13.3 Collision (E_COL) ..................................................................................................... 19-28
19.13.4 Receive Data Valid (E_RxDV) ................................................................................... 19-28
19.13.5 Receive Clock (E_RxCLK) ........................................................................................ 19-28
19.13.6 Receive Data (E_RxD0) ............................................................................................. 19-28
19.13.7 Transmit Enable (E_TxEN) ........................................................................................ 19-28
19.13.8 Transmit Data (E_TxD[3:1]/PB[10:8]) ...................................................................... 19-28
19.13.9 Receive Data (E_RxD[3:1]/PB[13:11]) ...................................................................... 19-28
19.13.10 Receive Error (E_RxER/PB14) ................................................................................ 19-29
19.13.11 Management Data Clock (E_MDC/PB15) ............................................................... 19-29
19.13.12 Management Data (E_MDIO) .................................................................................. 19-29
19.13.13 Transmit Error (E_TxER) .........................................................................................19-29
19.13.14 Carrier Receive Sense (E_CRS) ............................................................................... 19-29
19.14 PWM Module Signals (PWM_OUT0–PWM_OUT2]) ......................................................... 19-29
19.15 Queued Serial Peripheral Interface (QSPI) Signals ............................................................... 19-29
19.15.1 QSPI Synchronous Serial Data Output (QSPI_Dout/WSEL) .................................... 19-30
19.15.2 QSPI Synchronous Serial Data Input (QSPI_Din) ..................................................... 19-30
19.15.3 QSPI Serial Clock (QSPI_CLK/BUSW1) .................................................................. 19-30
19.15.4 Synchronous Peripheral Chip Select 0 (QSPI_CS0/BUSW0) ................................... 19-30
19.15.5 Synchronous Peripheral Chip Select 1 (QSPI_CS1/PA11) ........................................ 19-30
19.15.6 Synchronous Peripheral Chip Select 2 (QSPI_CS2/URT1_CTS) .............................. 19-30
19.15.7 Synchronous Peripheral Chip Select 3 (PA7/DOUT3/QSPI_CS3) ............................19-30
19.16 Physical Layer Interface Controller TDM Ports and UART 1 .............................................. 19-31
19.16.1 GCI/IDL TDM Port 0. ................................................................................................ 19-31
19.16.1.1 Frame Sync (FSR0/FSC0/PA8) .................................................................... 19-31
19.16.1.2 D-Channel Grant (DGNT0/PA9) .................................................................. 19-31
19.16.1.3 Data Clock (DCL0/URT1_CLK) .................................................................. 19-31
19.16.1.4 Serial Data Input (DIN0/URT1_RxD) .......................................................... 19-31
19.16.1.5 UART1 CTS (URT1_CTS/QSPI_CS2) ........................................................ 19-32
19.16.1.6 UART1 RTS (URT1_RTS/INT5) ................................................................. 19-32
19.16.1.7 Serial Data Output (DOUT0/URT1_TxD) ................................................... 19-32
19.16.1.8 D-Channel Request(DREQ0/PA10) ............................................................. 19-32
19.16.1.9 QSPI Chip Select 1 (QSPI_CS1/PA11) ........................................................ 19-32
19.16.2 GCI/IDL TDM Port 1 ................................................................................................. 19-32
19.16.2.1 GCI/IDL Data Clock (DCL1/GDCL1_OUT) ............................................... 19-32
19.16.2.2 GCI/IDL Data Out (DOUT1) ....................................................................... 19-33
19.16.2.3 GCI/IDL Data In (DIN1) ..............................................................................19-33
19.16.2.4 GCI/IDL Frame Sync (FSC1/FSR1/DFSC1) ............................................... 19-33
19.16.2.5 D-Channel Request (DREQ1/PA14) ............................................................ 19-33
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19.16.2.6 D-Channel Grant (DGNT1_INT6/PA15_INT6) ........................................... 19-33
19.16.3 GCI/IDL TDM Ports 2 and 3 ...................................................................................... 19-34
19.16.3.1 GCI/IDL Delayed Frame Sync 2 (DFSC2/PA12) ......................................... 19-34
19.16.3.2 GCI/IDL Delayed Frame Sync 3 (DFSC3/PA13) ......................................... 19-34
19.16.3.3 QSPI_CS3, Port 3 GCI/IDL Data Out 3, PA7 (PA7/DOUT3/QSPI_CS3) ... 19-34
19.16.3.4 INT4 and Port 3 GCI/IDL Data In (INT4/DIN3) ......................................... 19-35
19.17 JTAG Test Access Port and BDM Debug Port ...................................................................... 19-35
19.17.1 Test Clock (TCK/PSTCLK) ........................................................................................ 19-35
19.17.2 Test Mode Select and Force Breakpoint (TMS/BKPT) .............................................. 19-35
19.17.3 Test and Debug Data Out (TDO/DSO) ...................................................................... 19-36
19.17.4 Test and Debug Data In (TDI/DSI) ............................................................................ 19-36
19.17.5 JTAG TRST and BDM Data Clock (TRST/DSCLK) ................................................ 19-36
19.17.6 Freescale Test Mode Select (MTMOD) ..................................................................... 19-36
19.17.7 Debug Transfer Error Acknowledge (TEA) ...............................................................19-36
19.17.8 Processor Status Outputs (PST[3:0]) .......................................................................... 19-36
19.17.9 Debug Data (DDATA[3:0]) ........................................................................................ 19-37
19.17.10 Device Test Enable (TEST) ...................................................................................... 19-37
19.18 Operating Mode Configuration Pins ...................................................................................... 19-37
19.19 Power Supply Pins ................................................................................................................. 19-38
Chapter 20
Bus Operation
20.1 Features ...................................................................................................................................... 20-1
20.2 Bus and Control Signals ............................................................................................................ 20-1
20.2.1 Address Bus (A[22:0]) ................................................................................................... 20-2
20.2.2 Data Bus (D[31:0]) ......................................................................................................... 20-2
20.2.3 Read/Write (R/W) ........................................................................................................... 20-2
20.2.4 Transfer Acknowledge (TA) ........................................................................................... 20-2
20.2.5 Transfer Error Acknowledge (TEA) ............................................................................... 20-3
20.3 Bus Exception: Double Bus Fault .............................................................................................. 20-3
20.4 Bus Characteristics .................................................................................................................... 20-3
20.5 Data Transfer Mechanism .......................................................................................................... 20-4
20.5.1 Bus Sizing ....................................................................................................................... 20-4
20.6 External Bus Interface Types ..................................................................................................... 20-7
20.6.1 Interface for FLASH/SRAM Devices with Byte Strobes ............................................... 20-8
20.6.2 Interface for FLASH/SRAM Devices without Byte Strobes ........................................ 20-12
20.7 Burst Data Transfers ................................................................................................................ 20-17
20.8 Misaligned Operands ............................................................................................................... 20-18
20.9 Interrupt Cycles ........................................................................................................................ 20-19
20.10 Bus Errors .............................................................................................................................. 20-19
20.11 Bus Arbitration ....................................................................................................................... 20-21
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20.12 Reset Operation ...................................................................................................................... 20-21
20.12.1 Master Reset ............................................................................................................... 20-22
20.12.2 Normal Reset .............................................................................................................. 20-23
20.12.3 Software Watchdog Timer Reset Operation ............................................................... 20-24
20.12.4 Soft Reset Operation ................................................................................................... 20-25
Chapter 21
IEEE 1149.1 Test Access Port (JTAG)
21.1 Overview .................................................................................................................................... 21-1
21.2 JTAG Test Access Port and BDM Debug Port .......................................................................... 21-2
21.3 TAP Controller ........................................................................................................................... 21-3
21.4 Boundary Scan Register ............................................................................................................. 21-4
21.5 Instruction Register .................................................................................................................... 21-7
21.6 Restrictions ................................................................................................................................ 21-8
21.7 Non-IEEE 1149.1 Operation ...................................................................................................... 21-8
Chapter 22
Mechanical Data
22.1 Pinout ......................................................................................................................................... 22-1
22.2 Package Dimensions .................................................................................................................. 22-2
Chapter 23
Electrical Characteristics
23.1 Maximum Ratings ...................................................................................................................... 23-1
23.1.1 Supply, Input Voltage, and Storage Temperature ........................................................... 23-1
23.1.2 Operating Temperature ................................................................................................... 23-2
23.1.3 Resistance ....................................................................................................................... 23-2
23.2 DC Electrical Specifications ...................................................................................................... 23-3
23.2.1 Output Driver Capability and Loading ........................................................................... 23-3
23.3 AC Electrical Specifications ...................................................................................................... 23-5
23.3.1 Clock Input and Output Timing Specifications .............................................................. 23-5
23.3.2 Processor Bus Input Timing Specifications .................................................................... 23-6
23.3.3 Processor Bus Output Timing Specifications ................................................................. 23-8
23.4 Debug AC Timing Specifications ............................................................................................ 23-13
23.5 SDRAM Interface Timing Specifications ................................................................................ 23-14
23.6 Fast Ethernet AC Timing Specifications ................................................................................. 23-17
23.6.1 MII Receive Signal Timing (E_RxD[3:0], E_RxDV, E_RxER, and E_RxCLK) ........ 23-17
23.6.2 MII Transmit Signal Timing (E_TxD[3:0], E_TxEN, E_TxER, E_TxCLK) .............. 23-18
23.6.3 MII Async Inputs Signal Timing (CRS and COL) ....................................................... 23-19
23.6.4 MII Serial Management Channel Timing (MDIO and MDC) ..................................... 23-20
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23.7 Timer Module AC Timing Specifications ................................................................................ 23-21
23.8 UART Modules AC Timing Specifications .............................................................................23-22
23.9 PLIC Module: IDL and GCI Interface Timing Specifications ................................................ 23-23
23.10 General-Purpose I/O Port AC Timing Specifications ............................................................ 23-28
23.11 USB Interface AC Timing Specifications .............................................................................. 23-29
23.12 IEEE 1149.1 (JTAG) AC Timing Specifications ................................................................... 23-30
23.13 QSPI Electrical Specifications ............................................................................................... 23-31
23.14 PWM Electrical Specifications .............................................................................................. 23-32
Appendix A
List of Memory Maps
A.1 List of Memory Map Tables............................................................................................................ A-1
Appendix B
Buffering and Impedance Matching
Index 1
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Table Page
Number Title Number
2-1 CCR Field Descriptions ..........................................................................................................2-6
2-2 MOVEC Register Map............................................................................................................. 2-7
2-3 Status Field Descriptions ........................................................................................................2-8
2-4 Integer Data Formats ..............................................................................................................2-9
2-5 ColdFire Effective Addressing Modes..................................................................................2-12
2-6 Notational Conventions........................................................................................................ 2-13
2-7 User-Mode Instruction Set Summary.................................................................................... 2-15
2-8 Supervisor-Mode Instruction Set Summary ......................................................................... 2-18
2-9 Misaligned Operand References..........................................................................................2-19
2-10 Move Byte and Word Execution Times.................................................................................2-20
2-11 Move Long Execution Times................................................................................................2-21
2-12 Move Execution Times.........................................................................................................2-21
2-13 One-Operand Instruction Execution Times........................................................................... 2-22
2-14 Two-Operand Instruction Execution Times...........................................................................2-22
2-15 Miscellaneous Instruction Execution Times ..........................................................................2-24
2-16 General Branch Instruction Execution Times........................................................................2-25
2-17 Bcc Instruction Execution Times..........................................................................................2-25
2-18 Exception Vector Assignments ............................................................................................. 2-26
2-19 Format Field Encoding..........................................................................................................2-27
2-20 Fault Status Encodings ......................................................................................................... 2-28
2-21 MCF5272 Exceptions .......................................................................................................... 2-28
3-1 MAC Instruction Summary ......................................................................................................3-4
4-1 Memory Map of Instruction Cache Registers..........................................................................4-2
4-2 RAMBAR Field Description.....................................................................................................4-3
4-3 Examples of Typical RAMBAR Settings..................................................................................4-4
4-4 ROMBAR Field Description.....................................................................................................4-6
4-5 Examples of Typical ROMBAR Settings ................................................................................. 4-6
4-6 Instruction Cache Operation as Defined by CACR[CENB,CEIB]..........................................4-11
4-7 Memory Map of Instruction Cache Registers........................................................................4-12
4-8 CACR Field Descriptions ......................................................................................................4-13
4-9 ACRn Field Descriptions....................................................................................................... 4-14
5-1 Debug Module Signals............................................................................................................ 5-2
5-2 Processor Status Encoding.....................................................................................................5-3
5-3 BDM/Breakpoint Registers......................................................................................................5-6
5-4 Rev. A Shared BDM/Breakpoint Hardware.............................................................................5-7
5-5 AATR Field Descriptions.........................................................................................................5-7
5-6 ABLR Field Description...........................................................................................................5-9
5-7 ABHR Field Description ..........................................................................................................5-9
5-8 CSR Field Descriptions......................................................................................................... 5-10
5-9 DBR Field Descriptions......................................................................................................... 5-12
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5-10 DBMR Field Descriptions...................................................................................................... 5-12
5-11 Access Size and Operand Data Location .............................................................................5-12
5-12 PBR Field Descriptions .........................................................................................................5-13
5-13 PBMR Field Descriptions ...................................................................................................... 5-13
5-14 TDR Field Descriptions .........................................................................................................5-14
5-15 Receive BDM Packet Field Description ................................................................................5-18
5-16 Transmit BDM Packet Field Description ...............................................................................5-18
5-17 BDM Command Summary .................................................................................................... 5-19
5-18 BDM Field Descriptions.........................................................................................................5-20
5-19 Control Register Map ............................................................................................................5-30
5-20 Definition of DRc Encoding—Read.......................................................................................5-32
5-21 DDATA[3:0]/CSR[BSTAT] Breakpoint Response ................................................................. 5-34
5-22 PST/DDATA Specification for User-Mode Instructions .........................................................5-37
5-23 PST/DDATA Specification for Supervisor-Mode Instructions................................................5-40
6-1 SIM Registers .........................................................................................................................6-3
6-2 MBAR Field Descriptions ....................................................................................................... 6-4
6-3 SCR Field Descriptions........................................................................................................... 6-5
6-4 SPR Field Descriptions ...........................................................................................................6-6
6-5 PMR Field Descriptions...........................................................................................................6-8
6-6 USB and USART Power Down Modes ...................................................................................6-9
6-7 Exiting Sleep and Stop Modes..............................................................................................6-10
6-8 DIR Field Descriptions ..........................................................................................................6-11
6-9 WRRR Field Descriptions .....................................................................................................6-12
6-10 WIRR Field Descriptions.......................................................................................................6-13
6-11 WER Field Descriptions ........................................................................................................6-13
7-1 Interrupt Controller Registers..................................................................................................7-2
7-2 Interrupt and Power Management Register Mnemonics.........................................................7-3
7-3 ICR Field Descriptions ............................................................................................................ 7-4
7-4 ISR Field Descriptions.............................................................................................................7-6
7-5 PITR Field Descriptions ..........................................................................................................7-7
7-6 PIWR Field Descriptions .........................................................................................................7-8
7-7 PIVR Field Descriptions ..........................................................................................................7-9
7-8 MCF5272 Interrupt Vector Table...........................................................................................7-10
8-1 CSCR and CSOR Values after Reset.....................................................................................8-2
8-2 CSBRn Field Descriptions....................................................................................................... 8-3
8-3 Output Read/Write Strobe Levels versus Chip Select EBI Code............................................8-4
8-4 Chip Select Memory Address Decoding Priority .....................................................................8-5
8-5 CSORn Field Descriptions ...................................................................................................... 8-5
9-1 SDRAM Controller Signal Descriptions...................................................................................9-2
9-2 Connecting BS[3:0] to DQMx..................................................................................................9-4
9-3 Configurations for 16-Bit Data Bus..........................................................................................9-4
9-4 Configurations for 32-Bit Data Bus..........................................................................................9-4
9-5 Internal Address Multiplexing (16-Bit Data Bus) .....................................................................9-5
9-6 Internal Address Multiplexing (32-Bit Data Bus) .....................................................................9-5
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor xxxiii
List of Tables (Continued)
Table Page
Number Title Number
9-7 SDCR Field Descriptions ........................................................................................................9-7
9-8 SDTR Field Descriptions.........................................................................................................9-8
9-9 SDRAM Controller Performance, 32-Bit Port, (RCD = 0, RP = 1) or (RCD = 1, RP = 0)...... 9-10
9-10 SDRAM Controller Performance, 32–Bit Port, (RCD = 0, RP = 0)........................................9-10
9-11 SDRAM Controller Performance (RCD = 1, RP = 1), 16-Bit Port.......................................... 9-11
9-12 SDRAM Controller Performance, 16-Bit Port, (RCD=0, RP=1)
or (RCD=1, RP = 0)9-11
9-13 SDRAM Controller Performance, 16-Bit Port, (RCD=0, RP=0).............................................9-12
10-1 DMA Data Transfer Matrix ....................................................................................................10-1
10-2 DMR Field Descriptions ........................................................................................................ 10-2
10-3 DIR Field Descriptions ..........................................................................................................10-4
11-1 MII Mode ...............................................................................................................................11-3
11-2 Seven-Wire Mode Configuration...........................................................................................11-4
11-3 Ethernet Address Recognition .............................................................................................. 11-7
11-4 Transmission Errors..............................................................................................................11-9
11-5 Reception Errors ...................................................................................................................11-9
11-6 FEC Register Memory Map.................................................................................................11-10
11-7 ECR Field Descriptions.......................................................................................................11-11
11-8 EIR Field Descriptions......................................................................................................... 11-12
11-9 EIMR Register Field Descriptions .......................................................................................11-13
11-10 IVSR Field Descriptions ......................................................................................................11-14
11-11 RDAR Register Field Descriptions......................................................................................11-15
11-12 TDAR Field Descriptions.....................................................................................................11-16
11-13 MMFR Field Descriptions....................................................................................................11-17
11-14 MSCR Field Descriptions....................................................................................................11-18
11-15 Programming Examples for MSCR Register.......................................................................11-19
11-16 FRBR Field Descriptions.....................................................................................................11-19
11-17 FRSR Field Descriptions.....................................................................................................11-20
11-18 TFWR Field Descriptions ....................................................................................................11-21
11-19 TFSR Field Descriptions .....................................................................................................11-22
11-20 RCR Field Descriptions.......................................................................................................11-23
11-21 MFLR Field Descriptions.....................................................................................................11-24
11-22 TCR Field Descriptions .......................................................................................................11-25
11-23 MALR Field Descriptions..................................................................................................... 11-26
11-24 MAUR Field Descriptions....................................................................................................11-27
11-25 HTUR Field Descriptions.....................................................................................................11-28
11-26 HTLR Field Descriptions .....................................................................................................11-29
11-27 ERDSR Field Descriptions..................................................................................................11-30
11-28 ETDSR Field Descriptions ..................................................................................................11-31
11-29 EMRBR Field Descriptions..................................................................................................11-32
11-30 Hardware Initialization.........................................................................................................11-33
11-31 ETHER_EN = 0...................................................................................................................11-33
11-32 User Initialization Process (before ETHER_EN).................................................................11-33
11-33 User Initialization (after ETHER_EN)..................................................................................11-34
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
xxxiv Freescale Semiconductor
List of Tables (Continued)
Table Page
Number Title Number
11-34 RxBD Field Descriptions .....................................................................................................11-36
11-35 TxBD Field Descriptions......................................................................................................11-37
12-1 USB Device Requests........................................................................................................... 12-5
12-2 USB Memory Map.................................................................................................................12-7
12-3 FNR Field Descriptions .........................................................................................................12-9
12-4 FNMR Field Descriptions ......................................................................................................12-9
12-5 RFMR Field Descriptions ....................................................................................................12-10
12-6 RFMMR Field Descriptions ................................................................................................. 12-11
12-7 FAR Field Descriptions .......................................................................................................12-11
12-8 ASR Field Descriptions .......................................................................................................12-12
12-9 SPECR Field Descriptions ..................................................................................................12-14
12-10 EP0SR Field Descriptions...................................................................................................12-14
12-11 IEP0CFG Field Descriptions ...............................................................................................12-15
12-12 EP0CTL Field Descriptions.................................................................................................12-17
12-13 EPnCTL Field Descriptions.................................................................................................12-20
12-14 EP0IMR and EP0ISR Field Descriptions ............................................................................ 12-22
12-15 EPnISR Field Descriptions.................................................................................................. 12-25
12-16 EPnIMR Field Descriptions .................................................................................................12-26
12-17 EPnDR Field Descriptions...................................................................................................12-27
12-18 EPnDPR Field Descriptions ................................................................................................12-28
12-19 USB FIFO Access Timing ...................................................................................................12-30
12-20 Example FIFO Setup .......................................................................................................... 12-32
13-1 PLIC Module Memory Map .................................................................................................13-13
13-2 P0CR–P3CR Field Descriptions ......................................................................................... 13-19
13-3 PLCR Field Description.......................................................................................................13-20
13-4 P0ICR–P3ICR Field Descriptions .......................................................................................13-21
13-5 P0PSR–P3PSR Field Descriptions.....................................................................................13-22
13-6 PASR Field Descriptions.....................................................................................................13-23
13-7 P0GMR–P3GMR Field Descriptions................................................................................... 13-24
13-8 P0GMT–P3GMT Field Descriptions.................................................................................... 13-25
13-9 PGMTA Field Descriptions..................................................................................................13-26
13-10 PGMTS Field Descriptions.................................................................................................. 13-27
13-11 P0GCIR–P3GCIR Field Descriptions.................................................................................. 13-28
13-12 P0GCIT–P3GCIT Field Descriptions...................................................................................13-29
13-13 PGCITSR Field Descriptions............................................................................................... 13-30
13-14 PDCSR Field Descriptions..................................................................................................13-31
13-15 PDRQR Field Descriptions..................................................................................................13-32
13-16 P0SDR–P3SDR Field Descriptions.....................................................................................13-33
13-17 PCSR Field Descriptions..................................................................................................... 13-34
14-1 QSPI Input and Output Signals and Functions .....................................................................14-3
14-2 QSPI_CLK Frequency as Function of CPU Clock and Baud Rate .......................................14-7
14-3 QMR Field Descriptions ........................................................................................................14-9
14-4 QDLYR Field Descriptions ..................................................................................................14-11
14-5 QWR Field Descriptions......................................................................................................14-12
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor xxxv
List of Tables (Continued)
Table Page
Number Title Number
14-6 QIR Field Descriptions ........................................................................................................14-13
14-7 QCR0–QCR15 Field Descriptions.......................................................................................14-15
15-1 TMRn Field Descriptions.......................................................................................................15-3
15-2 TERn Field Descriptions .......................................................................................................15-5
16-1 UART Module Programming Model ...................................................................................... 16-3
16-2 UMR1n Field Descriptions ....................................................................................................16-5
16-3 UMR2n Field Descriptions ....................................................................................................16-6
16-4 USRn Field Descriptions.......................................................................................................16-7
16-5 UCSRn Field Descriptions ....................................................................................................16-8
16-6 UCRn Field Descriptions.......................................................................................................16-9
16-7 UIPCRn Field Descriptions .................................................................................................16-11
16-8 UACRn Field Descriptions ..................................................................................................16-12
16-9 UISRn/UIMRn Field Descriptions........................................................................................16-13
16-10 UTFn Field Descriptions......................................................................................................16-15
16-11 URFn Field Descriptions .....................................................................................................16-16
16-12 UFPDn Field Descriptions................................................................................................... 16-17
16-13 UIPn Field Descriptions.......................................................................................................16-17
16-14 UOP1/UOP0 Field Descriptions..........................................................................................16-18
16-15 UART Module Signals.........................................................................................................16-19
16-16 Transmitter FIFO Status Bits...............................................................................................16-25
16-17 Receiver FIFO Status Bits................................................................................................... 16-26
17-1 GPIO Signal Multiplexing ......................................................................................................17-1
17-2 GPIO Port Register Memory Map .........................................................................................17-2
17-3 PACNT Field Descriptions ....................................................................................................17-3
17-4 Port A Control Register Function Bits ...................................................................................17-5
17-5 PBCNT Field Descriptions ....................................................................................................17-6
17-6 Port B Control Register Function Bits ...................................................................................17-7
17-7 PDCNT Field Descriptions ....................................................................................................17-8
17-8 Port D Control Register Function Bits ...................................................................................17-9
17-9 PADDR Field Descriptions..................................................................................................17-10
18-1 PWM Module Memory Map...................................................................................................18-2
18-2 PWCRn Field Descriptions....................................................................................................18-3
18-3 PWWDn Field Descriptions...................................................................................................18-4
19-1 Signal Descriptions Sorted by Function ................................................................................ 19-3
19-2 Signal Name and Description by Pin Number..................................................................... 19-11
19-3 Byte Strobe Operation for 32-Bit Data Bus .........................................................................19-20
19-4 Byte Strobe Operation
for 16-Bit Data Bus—SRAM Cycles19-21
19-5 Byte Strobe Operation
for 16-Bit Data Bus—SDRAM Cycles19-21
19-6 Connecting BS[3:0] to DQMx..............................................................................................19-21
19-7 Processor Status Encoding.................................................................................................19-37
19-8 MCF5272 Bus
Width Selection19-38
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
xxxvi Freescale Semiconductor
List of Tables (Continued)
Table Page
Number Title Number
19-9 MCF5272 CS0 Memory
Bus Width Selection19-38
19-10 MCF5272 High Impedance
Mode Selection19-38
20-1 ColdFire Bus Signal Summary.............................................................................................20-1
20-2 Chip Select Memory
Address Decoding Priority20-4
20-3 Byte Strobe Operation for 32-Bit Data Bus ...........................................................................20-6
20-4 Byte Strobe Operation
for 16-Bit Data Bus—SRAM Cycles20-6
20-5 Byte Strobe Operation
for 16-Bit Data Bus—SDRAM Cycles20-6
20-6 Data Bus Requirement for Read/Write Cycles......................................................................20-7
20-7 External Bus Interface Codes for CSBRs .............................................................................20-8
21-1 JTAG Signals ........................................................................................................................21-2
21-2 Instructions............................................................................................................................21-7
23-1 Maximum Supply, Input Voltage and Storage Temperature ................................................. 23-1
23-2 Operating Temperature......................................................................................................... 23-2
23-3 Thermal Resistance ..............................................................................................................23-2
23-4 DC Electrical Specifications .................................................................................................23-3
23-5 I/O Driver Capability..............................................................................................................23-3
23-6 Clock Input and Output Timing Specifications ...................................................................... 23-5
23-7 Processor Bus Input Timing Specifications...........................................................................23-6
23-8 Processor Bus Output Timing Specifications........................................................................ 23-8
23-9 Debug AC Timing Specification ..........................................................................................23-13
23-10 SDRAM Interface Timing Specifications ............................................................................. 23-14
23-11 MII Receive Signal Timing .................................................................................................. 23-17
23-12 MII Transmit Signal Timing ................................................................................................. 23-18
23-13 MII Async Inputs Signal Timing...........................................................................................23-19
23-14 MII Serial Management Channel Timing.............................................................................23-20
23-15 Timer Module AC Timing Specifications .............................................................................23-21
23-16 UART Modules AC Timing Specifications...........................................................................23-22
23-17 IDL Master Mode Timing, PLIC Ports 1, 2, and 3 ...............................................................23-23
23-18 IDL Slave Mode Timing, PLIC Ports 0–3 ............................................................................23-24
23-19 GCI Slave Mode Timing, PLIC Ports 0–3............................................................................23-25
23-20 GCI Master Mode Timing, PLIC PORTs 1, 2, 3 .................................................................. 23-26
23-21 General-Purpose I/O Port AC Timing Specifications ..........................................................23-28
23-22 USB Interface AC Timing Specifications.............................................................................23-29
23-23 IEEE 1149.1 (JTAG) AC Timing Specifications ..................................................................23-30
23-24 QSPI Modules AC Timing Specifications............................................................................23-31
23-25 PWM Modules AC Timing Specifications............................................................................ 23-32
A-1 On-Chip Module Base Address Offsets from MBAR...............................................................A-1
A-2 CPU Space Registers Memory Map .......................................................................................A-2
A-3 On-Chip Peripherals and Configuration Registers Memory Map............................................A-2
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor xxxvii
List of Tables (Continued)
Table Page
Number Title Number
A-4 Interrupt Control Register Memory Map..................................................................................A-2
A-5 Chip Select Register Memory Map .........................................................................................A-3
A-6 GPIO Port Register Memory Map ...........................................................................................A-3
A-7 QSPI Module Memory Map.....................................................................................................A-4
A-8 PWM Module Memory Map.....................................................................................................A-4
A-9 DMA Module Memory Map .....................................................................................................A-4
A-10 UART0 Module Memory Map..................................................................................................A-5
A-11 UART1 Module Memory Map..................................................................................................A-6
A-12 SDRAM Controller Memory Map.............................................................................................A-7
A-13 Timer Module Memory Map ....................................................................................................A-7
A-14 PLIC Module Memory Map .....................................................................................................A-8
A-15 Ethernet Module Memory Map................................................................................................A-9
A-16 USB Module Memory Map....................................................................................................A-10
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
xxxviii Freescale Semiconductor
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor xxxix
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
© Freescale Semiconductor, Inc., 2005. All rights reserved.
MCF5272 ColdFire® Integrated
Microprocessor
User’s Manual
To provide the most up-to-date information, the revision of our documents on the World Wide Web will
be the most current. Your printed copy may be an earlier revision. T o verify you have the latest information
available, refer to:
http://www.freescale.com/
The following revision history table summarizes changes contained in this document. For your
convenience, the page number designators have been linked to the appropriate location.
Document Revision History
Rev. No. Substantive Change(s)
2.1 Updated to meet Freescale identity guidelines.
3 • Formatting, layout, spelling, and grammar corrections.
• Corrected the TxFIFO bit description In Table 16-9 (was “Once set, this bit is cleared by reading
UTBn”, is “After being set, this bit is cleared by writing UTBn”).
• Corrected Figure 20-12 (OE signal was asserting on the third SDCLK clock cycle, is asserting on the
second SDCLK clock cycle).
• Corrected Figure 20-13 (R/W and BS signals were asserting on the third SDCLK clock cycle, are
asserting on the second SDCLK clock cycle).
• Corrected Figure 20-16 (OE signal was asserting on the third SDCLK clock cycle, is asserting on the
second SDCLK clock cycle).
• Corrected Figure 20-17 (R/W and BS signals were asserting on the third SDCLK clock cycle, are
asserting on the second SDCLK clock cycle).
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
xl Freescale Semiconductor
About This Book
The primary objective of this user’s manual is to define the functionality of the MCF5272 processors for
use by software and hardware developers.
The information in this book is subject to change without notice, as described in the disclaimers on the title
page of this book. As with any technical documentation, it is the readers’ responsibility to be sure he is
using the most recent version of the documentation.
To locate any published errata or updates for this document, refer to the world-wide web at
http://www.freescale.com.
Audience
This manual is intended for system software and hardware developers and applications programmers who
want to develop products with the MCF5272. It is assumed that the reader understands operating systems,
microprocessor system design, basic principles of software and hardware, and basic details of the
ColdFire® architecture.
Organization
Following is a summary and brief description of the major sections of this manual:
•Chapter 1, “Overview,” includes general descriptions of the modules and features incorporated in
the MCF5272, focussing in particular on new features.
•Chapter 2, “ColdFire Core,” provides an overview of the microprocessor core of the MCF5272.
The chapter describes the organization of the Version 2 (V2) ColdFire 5200 processor core and an
overview of the program-visible registers (the programming model) as they are implemented on
the MCF5272. It also includes a full description of exception handling and a table of instruction
timings.
•Chapter 3, “Hardware Multiply/Accumulate (MAC) Unit,” describes the MCF5272
multiply/accumulate unit, which executes integer multiply, multiply-accumulate, and
miscellaneous register instructions. The MAC is integrated into the operand execution pipeline
(OEP).
•Chapter 4, “Local Memory.” This chapter describes the MCF5272 implementation of the ColdFire
V2 local memory specification. It consists of three major sections, as follows.
—Section 4.3, “SRAM Overview,” describes the MCF5272 on-chip static RAM (SRAM)
implementation. It covers general operations, configuration, and initialization. It also provides
information and examples of how to minimize power consumption when using the SRAM.
—Section 4.4, “ROM Overview,” describes the MCF5272 on-chip static ROM. The ROM
module contains tabular data that the ColdFire core can access in a single cycle.
—Section 4.5, “Instruction Cache Overview,” describes the MCF5272 cache implementation,
including organization, configuration, and coherency. It describes cache operations and how
the cache interacts with other memory structures.
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor xli
•Chapter 5, “Debug Support,” describes the Revision A hardware debug support in the MCF5272.
•Chapter 6, “System Integration Module (SIM),” describes the SIM programming model, bus
arbitration, power management, and system-protection functions for the MCF5272.
•Chapter 7, “Interrupt Controller,” describes operation of the interrupt controller portion of the SIM.
Includes descriptions of the registers in the interrupt controller memory map and the interrupt
priority scheme.
•Chapter 8, “Chip Select Module,” describes the MCF5272 chip-select implementation, including
the operation and programming model, which includes the chip-select address, mask, and control
registers.
•Chapter 9, “SDRAM Controller,” describes configuration and operation of the synchronous
DRAM controller component of the SIM, including a general description of signals involved in
SDRAM operations. It provides interface information for memory configurations using most
common SDRAM devices for both 16- and 32-bit-wide data buses. The chapter concludes with
signal timing diagrams.
•Chapter 10, “DMA Controller,” provides an overview of the MCF5272’s one-channel DMA
controller intended for memory-to-memory block data transfers. This chapter describes in detail its
signals, registers, and operating modes.
•Chapter 11, “Ethernet Module,” describes the MCF5272 fast Ethernet media access controller
(MAC). This chapter begins with a feature-set overview, a functional block diagram, and
transceiver connection information for both MII and seven-wire serial interfaces. The chapter
concludes with detailed descriptions of operation and the programming model.
•Chapter 12, “Universal Serial Bus (USB),” provides an overview of the USB module of the
MCF5272, including detailed operation information and the USB programming model.
Connection examples and circuit board layout considerations are also provided.
• The USB Specification, Revision 1.1 is a recommended supplement to this chapter. It can be
downloaded from http://www.usb.org. Chapter 2 of this specification, Terms and Abbreviations,
provides definitions of many of the words found here.
•Chapter 13, “Physical Layer Interface Controller (PLIC),” provides detailed information about the
MCF5272’s physical layer interface controller, a module intended to support ISDN applications.
The chapter begins with a description of operation and a series of related block diagrams starting
with a high-level overview. Each successive diagram depicts progressively more internal detail.
The chapter then describes timing generation and the programming model and concludes with
three application examples.
•Chapter 14, “Queued Serial Peripheral Interface (QSPI) Module,” provides a feature-set overview
and description of operation, including details of the QSPI’s internal RAM organization. The
chapter concludes with the programming model and a timing diagram.
•Chapter 15, “Timer Module,” describes configuration and operation of the four general-purpose
timer modules, timer 0, 1, 2 and 3.
•Chapter 16, “UART Modules,” describes the use of the universal asynchronous/synchronous
receiver/transmitters (UARTs) implemented on the MCF5272, including example register values
for typical configurations.
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
xlii Freescale Semiconductor
•Chapter 17, “General Purpose I/O Module,” describes the operation and programming model of
the three general purpose I/O (GPIO) ports on the MCF5272. The chapter details pin assignment,
direction-control, and data registers.
•Chapter 18, “Pulse-Width Modulation (PWM) Module,” describes the configuration and operation
of the pulse-width modulation (PWM) module. It includes a block diagram, programming model,
and timing diagram.
•Chapter 19, “Signal Descriptions,” provides a listing and brief description of all the MCF5272
signals. Specifically, it shows which are inputs or outputs, how they are multiplexed, and the state
of each signal at reset. The first listing is organized by function, with signals appearing
alphabetically within each functional group. This is followed by a second listing sorted by pin
number.
•Chapter 20, “Bus Operation,” describes the functioning of the bus for data-transfer operations,
error conditions, bus arbitration, and reset operations. It includes detailed timing diagrams showing
signal interaction. Operation of the bus is defined for transfers initiated by the MCF5272 as a bus
master. The MCF5272 does not support external bus masters. Note that Chapter 9, “SDRAM
Controller,” describes DRAM cycles.
•Chapter 21, “IEEE 1 149.1 T est Access Port (JTAG),” describes configuration and operation of the
MCF5272 Joint Test Action Group (JTAG) implementation. It describes those items required by
the IEEE 1149.1 standard and provides additional information specific to the MCF5272. For
internal details and sample applications, see the IEEE 1149.1 document.
•Chapter 22, “Mechanical Data,” provides a functional pin listing and package diagram for the
MCF5272.
•Chapter 23, “Electrical Characteristics,” describes AC and DC electrical specifications and
thermal characteristics for the MCF5272. Because additional speeds may have become available
since the publication of this book, consult Freescale’s ColdFire web page,
http://www.freescale.com, to confirm that this is the latest information.
This manual includes the following two appendixes:
•Appendix A, “List of Memory Maps,” provides the entire address-map for MCF5272
memory-mapped registers.
•Appendix B, “Buffering and Impedance Matching,” provides some suggestions regarding
interface circuitry between the MCF5272 and SDRAMs.
This manual also includes an index.
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor xliii
Suggested Reading
This section lists additional reading that provides background for the information in this manual as well as
general information about the ColdFire architecture.
General Information
The following documentation provides useful information about the ColdFire architecture and computer
architecture in general:
ColdFire Documentation
The ColdFire documentation is available from the sources listed on the back cover of this manual.
Document order numbers are included in parentheses for ease in ordering.
•ColdFire Programmers Reference Manual, R1.0 (MCF5200PRM/AD)
• User’s manuals—These books provide details about individual ColdFire implementations and are
intended to be used in conjunction with The ColdFire Programmers Reference Manual. These
include the following:
—ColdFire MCF5102 User’s Manual (MCF5102UM/AD)
—ColdFire MCF5202 User’s Manual (MCF5202UM/AD)
—ColdFire MCF5204 User’s Manual (MCF5204UM/AD)
—ColdFire MCF5206 User’s Manual (MCF5206EUM/AD)
—ColdFire MCF5206E User’s Manual (MCF5206EUM/AD)
— ColdFire MCF5307 User’s Manual (MCF5307UM/AD)
— ColdFire MCF5407 User’s Manual (MCF5407UM/AD)
•ColdFire Programmers Reference Manual, R1.0 (MCF5200PRM/AD)
•Using Microprocessors and Microcomputers: The Motorola Family, William C. Wray, Ross
Bannatyne, Joseph D. Greenfield
Additional literature on ColdFire implementations is being released as new processors become available.
For a current list of ColdFire documentation, refer to the World Wide Web at http://www.freescale.com.
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
xliv Freescale Semiconductor
Conventions
This document uses the following notational conventions:
MNEMONICS In text, instruction mnemonics are shown in uppercase.
mnemonics In code and tables, instruction mnemonics are shown in lowercase.
italics Italics indicate variable command parameters.
Book titles in text are set in italics.
0x0 Prefix to denote hexadecimal number
0b0 Prefix to denote binary number
REG[FIELD] Abbreviations for registers are shown in uppercase. Specific bits, fields, or ranges
appear in brackets. For example, RAMBAR[BA] identifies the base address field
in the RAM base address register.
nibble A 4-bit data unit
byte An 8-bit data unit
word A 16-bit data unit1
longword A 32-bit data unit
x In some contexts, such as signal encodings, x indicates a don’t care.
n Used to express an undefined numerical value
¬ NOT logical operator
& AND logical operator
| OR logical operator
1. The only exceptions to this appear in the discussion of serial communication modules that support variable-length data
transmission units. To simplify the discussion these units are referred to as words regardless of length.
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor xlv
Acronyms and Abbreviations
Table i lists acronyms and abbreviations used in this document.
Table i. Acronyms and Abbreviated Terms
Term Meaning
ADC Analog-to-digital conversion
ALU Arithmetic logic unit
AVEC Autovector
BDM Background debug mode
BIST Built-in self test
BSDL Boundary-scan description language
CODEC Code/decode
DAC Digital-to-analog conversion
DMA Direct memory access
DSP Digital signal processing
EA Effective address
EDO Extended data output (DRAM)
FIFO First-in, first-out
GPIO General-purpose I/O
I2C Inter-integrated circuit
IEEE Institute for Electrical and Electronics Engineers
IFP Instruction fetch pipeline
IPL Interrupt priority level
JEDEC Joint Electron Device Engineering Council
JTAG Joint Test Action Group
LIFO Last-in, first-out
LRU Least recently used
LSB Least-significant byte
lsb Least-significant bit
MAC Multiply accumulate unit, also Media access controller
MBAR Memory base address register
MSB Most-significant byte
msb Most-significant bit
Mux Multiplex
NOP No operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
xlvi Freescale Semiconductor
OEP Operand execution pipeline
PC Program counter
PCLK Processor clock
PLIC Physical layer interface controller
PLL Phase-locked loop
PLRU Pseudo least recently used
POR Power-on reset
PQFP Plastic quad flat pack
PWM Pulse-width modulation
QSPI Queued serial peripheral interface
RISC Reduced instruction set computing
Rx Receive
SIM System integration module
SOF Start of frame
TAP Test access port
TTL Transistor transistor logic
Tx Transmit
UART Universal asynchronous/synchronous receiver transmitter
USB Universal serial bus
Table i. Acronyms and Abbreviated Terms (continued)
Term Meaning
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor xlvii
Terminology Conventions
Table ii shows terminology conventions used throughout this document.
Table ii. Notational Conventions
Instruction Operand Syntax
Opcode Wildcard
cc Logical condition (example: NE for not equal)
Register Specifications
An Any address register n (example: A3 is address register 3)
Ay,Ax Source and destination address registers, respectively
Dn Any data register n (example: D5 is data register 5)
Dy,Dx Source and destination data registers, respectively
Rc Any control register (example VBR is the vector base register)
Rm MAC registers (ACC, MAC, MASK)
Rn Any address or data register
Rw Destination register w (used for MAC instructions only)
Ry,Rx Any source and destination registers, respectively
Xi index register i (can be an address or data register: Ai, Di)
Register Names
ACC MAC accumulator register
CCR Condition code register (lower byte of SR)
MACSR MAC status register
MASK MAC mask register
PC Program counter
SR Status register
Port Name
DDATA Debug data port
PST Processor status port
Miscellaneous Operands
#<data> Immediate data following the 16-bit operation word of the instruction
<ea> Effective address
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xlviii Freescale Semiconductor
<ea>y,<ea>x Source and destination effective addresses, respectively
<label> Assembly language program label
<list> List of registers for MOVEM instruction (example: D3–D0)
<shift> Shift operation: shift left (<<), shift right (>>)
<size> Operand data size: byte (B), word (W), longword (L)
bc Both instruction and data caches
dc Data cache
ic Instruction cache
# <vector> Identifies the 4-bit vector number for trap instructions
<> identifies an indirect data address referencing memory
<xxx> identifies an absolute address referencing memory
dnSignal displacement value, n bits wide (example: d16 is a 16-bit displacement)
SF Scale factor (x1, x2, x4 for indexed addressing mode, <<1n>> for MAC operations)
Operations
+ Arithmetic addition or postincrement indicator
– Arithmetic subtraction or predecrement indicator
x Arithmetic multiplication
/ Arithmetic division
~ Invert; operand is logically complemented
& Logical AND
| Logical OR
^ Logical exclusive OR
<< Shift left (example: D0 << 3 is shift D0 left 3 bits)
>> Shift right (example: D0 >> 3 is shift D0 right 3 bits)
→Source operand is moved to destination operand
←→ Two operands are exchanged
sign-extended All bits of the upper portion are made equal to the high-order bit of the lower portion
If <condition>
then <operations>
else <operations>
Test the condition. If true, the operations after ‘then’ are performed. If the condition is false and the optional
‘else’ clause is present, the operations after ‘else’ are performed. If the condition is false and else is
omitted, the instruction performs no operation. Refer to the Bcc instruction description as an example.
Table ii. Notational Conventions (continued)
Instruction Operand Syntax
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor xlix
Subfields and Qualifiers
{} Optional operation
() Identifies an indirect address
dnDisplacement value, n-bits wide (example: d16 is a 16-bit displacement)
Address Calculated effective address (pointer)
Bit Bit selection (example: Bit 3 of D0)
lsb Least significant bit (example: lsb of D0)
LSB Least significant byte
LSW Least significant word
msb Most significant bit
MSB Most significant byte
MSW Most significant word
Condition Code Register Bit Names
CCarry
N Negative
VOverflow
X Extend
ZZero
Table ii. Notational Conventions (continued)
Instruction Operand Syntax
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
lFreescale Semiconductor
Register Identifiers
Register identifiers in this user’s manual were changed from names used in early versions of the manual
released under non-disclosure agreement (NDA). Because a significant amount of collateral
documentation, such as source code, was developed using the old register names, Table iii through
Table xvi list the new register names and mnemonics as they should appear in the data book, along with
the old ones. Identifiers that have changed are displayed in boldface type. Those that have not changed are
marked “no change” in the ‘New Mnemonic’ column.
Table iii. On-Chip Peripherals and Configuration Registers Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x0000 Module Base Address Register, Read Only MBAR No change
0x0004 System Configuration Register SCR No change
0x0006 System Protection Register SPR No change
0x0008 Power Management Register PMR No change
0x000E Activate Low Power Register ALPR No change
0x0010 Device Identification Register DIR No change
Table iv. Interrupt Control Register Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x0020 Interrupt Control Register 1 ICR1 No change
0x0024 Interrupt Control Register 2 ICR2 No change
0x0028 Interrupt Control Register 3 ICR3 No change
0x002C Interrupt Control Register 4 ICR4 No change
0x0030 Interrupt Source Register ISR No change
0x0034 Programmable Interrupt Transition Register PITR No change
0x0038 Programmable Interrupt Wakeup Register PIWR No change
0x003F Programmable Interrupt Vector Register PIVR No change
Table v. Chip Select Register Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x0040 CS Base Register 0 CSBR0 No change
0x0044 CS Option Register 0 CSOR0 No change
0x0048 CS Base Register 1 CSBR1 No change
0x004C CS Option Register 1 CSOR1 No change
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor li
0x0050 CS Base Register 2 CSBR2 No change
0x0054 CS Option Register 2 CSOR2 No change
0x0058 CS Base Register 3 CSBR3 No change
0x005C CS Option Register 3 CSOR3 No change
0x0060 CS Base Register 4 CSBR4 No change
0x0064 CS Option Register 4 CSOR4 No change
0x0068 CS Base Register 5 CSBR5 No change
0x006C CS Option Register 5 CSOR5 No change
0x0070 CS Base Register 6 CSBR6 No change
0x0074 CS Option Register 6 CSOR6 No change
0x0078 CS Base Register 7 CSBR7 No change
0x007C CS Option Register 7 CSOR7 No change
Table vi. GPIO Port Register Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x0080 Port A Control Register PACNT No change
0x0084 Port A Data Direction Register PADDR No change
0x0086 Port A Data Register PADAT No change
0x0088 Port B Control Register PBCNT No change
0x008C Port B Data Direction Register PBDDR No change
0x008E Port B Data Register PBDAT No change
0x0094 Port C Data Direction Register PCDDR No change
0x0096 Port C Data Register PCDAT No change
0x0098 Port D Control Register PDCNT No change
Table vii. QSPI Module Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x00A0 QSPI Mode Register SPMODE QMR
0x00A4 QSPI Delay Register SPDELAY QDLYR
0x00A8 QSPI Wrap Register SPWRAP QWR
Table v. Chip Select Register Memory Map (continued)
MBAR
Offset Register Name Old Mnemonic New Mnemonic
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
lii Freescale Semiconductor
0x00AC QSPI Interrupt Register SPINT QIR
0x00B0 QSPI Address Register SPADDR QAR
0x00B4 QSPI Data Register SPDATA QDR
Table viii. PWM Module Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x00C0 PWM Control Register 0 PWMCR1 PWCR0
0x00C4 PWM Control Register 1 PWMCR2 PWCR1
0x00C8 PWM Control Register 2 PWMCR3 PWCR2
0x00D0 PWM Pulse-Width Register 0 PWMWD1 PWWD0
0x00D4 PWM Pulse-Width Register 1 PWMWD2 PWWD1
0x00D8 PWM Pulse-Width Register 2 PWMWD3 PWWD2
Table ix. DMA Module Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x00E0 DMA Mode Register DCMR No change
0x00E6 DMA Interrupt Register DCIR No change
0x00E8 DMA Byte Count Register DBCR No change
0x00EC DMA Source Address Register DSAR No change
0x00F0 DMA Destination Address Register DDAR No change
Table x. UART0 Module Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x0100 UART0 Mode Register 1/2 U1MR1/U1MR2 U0MR1/U0MR2
0x0104 UART0 Status U1SR U0SR
0x0104 UART0 Clock Select Register U1CSR U0CSR
0x0108 UART0 Command Register U1CR U0CR
0x010C UART0 Receive Buffer U1RxB U0RxB
0x010C UART0 Transmit Buffer U1TxB U0TxB
Table vii. QSPI Module Memory Map (continued)
MBAR
Offset Register Name Old Mnemonic New Mnemonic
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor liii
0x0110 UART0 CTS Change Register U1CCR U0CCR
0x0110 UART0 Auxiliary Control Register U1ACR U0ACR
0x0114 UART0 Interrupt Status Register U1ISR U0ISR
0x0114 UART0 Interrupt Mask Register U1IMR U0IMR
0x0118 UART0 Baud Prescaler MSB U1BG1 U0BG1
0x011C UART0 Baud Prescaler LSB U1BG2 U0BG2
0x0120 UART0 AutoBaud MSB Register U1ABR1 U0ABR1
0x0124 UART0 AutoBaud LSB Register U1ABR2 U0ABR2
0x0128 UART0 TxFIFO Control/Status Register U1TxFCSR U0TxFCSR
0x012C UART0 RxFIFO Control/Status Register U1RxFCSR U0RxFCSR
0x0134 UART0 CTS Unlatched Input U1IP U0IP
0x0138 UART0 RTS O/P Bit Set Command Register U1OP1 U0OP1
0x013C UART0 RTS O/P Bit Reset Command Register U1OP0 U0OP0
Table xi. UART1 Module Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x0140 UART1 Mode Register 1/2 U2MR1/U2MR2 U1MR1/U1MR2
0x0144 UART1 Status U2SR U1SR
0x0144 UART1 Clock Select Register U2CSR U1CSR
0x0148 UART1 Command Register U2CR U1CR
0x014C UART1 Receive Buffer U2RxB U1RxB
0x014C UART1 Transmit Buffer U2TxB U1TxB
0x0150 UART1 CTS Change Register U2CCR U1CCR
0x0150 UART1 Auxiliary Control Register U2ACR U1ACR
0x0154 UART1 Interrupt Status Register U2ISR U1ISR
0x0154 UART1 Interrupt Mask Register U2IMR U1IMR
0x0158 UART1 Baud Prescaler MSB U2BG1 U1BG1
0x015C UART1 Baud Prescaler LSB U2BG2 U1BG2
0x0160 UART1 AutoBaud MSB Register U2ABR1 U1ABR1
0x0164 UART1 AutoBaud LSB Register U2ABR2 U1ABR2
0x0168 UART1 TxFIFO Control/Status Register U2TxFCSR U1TxFCSR
Table x. UART0 Module Memory Map (continued)
MBAR
Offset Register Name Old Mnemonic New Mnemonic
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liv Freescale Semiconductor
0x016C UART1 RxFIFO Control/Status Register U2RxFCSR U1RxFCSR
0x0174 UART1 CTS Unlatched Input U2IP U1IP
0x0178 UART1 RTS O/P Bit Set Command Register U2OP1 U1OP1
0x017C UART1 RTS O/P Bit Reset Command Register U2OP0 U1OP0
Table xii. SDRAM Controller Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x0182 SDRAM Configuration Register SDCCR SDCR
0x0186 SDRAM Timing Register SDCTR SDTR
Table xiii. Timer Module Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x0200 Timer 0 Mode Register TMR1 TMR0
0x0204 Timer 0 Reference Register TRR1 TRR0
0x0208 Timer 0 Capture Register TCR1 TCAP0
0x020C Timer 0 Counter Register TCN1 TCN0
0x0210 Timer 0 Event Register TER1 TER0
0x0220 Timer 1 Mode Register TMR2 TMR1
0x0224 Timer 1 Reference Register TRR2 TRR1
0x0228 Timer 1 Capture Register TCR2 TCAP1
0x022C Timer 1 Counter Register TCN2 TCN1
0x0230 Timer 1 Event Register TER2 TER1
0x0240 Timer 2 Mode Register TMR3 TMR2
0x0244 Timer 2 Reference Register TRR3 TRR2
0x0248 Timer 2 Capture Register TCR3 TCAP2
0x024C Timer 2 Counter Register TCN3 TCN2
0x0250 Timer 2 Event Register TER3 TER2
0x0260 Timer 3 Mode Register TMR4 TMR3
0x0264 Timer 3 Reference Register TRR4 TRR3
0x0268 Timer 3 Capture Register TCR4 TCAP3
Table xi. UART1 Module Memory Map (continued)
MBAR
Offset Register Name Old Mnemonic New Mnemonic
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Freescale Semiconductor lv
0x026C Timer 3 Counter Register TCN4 TCN3
0x0270 Timer 3 Event Register TER4 TER3
0x0280 Watchdog Reset Reference Register WRRR No change
0x0284 Watchdog Interrupt Reference Register WIRR No change
0x0288 Watchdog Counter Register WCR No change
0x028C Watchdog Event Register WER No change
Table xiv. PLIC Module Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x0300 Port0 B1 Data Receive PLRB10 P0B1RR
0x0304 Port1 B1 Data Receive PLRB11 P1B1RR
0x0308 Port2 B1 Data Receive PLRB12 P2B1RR
0x030C Port3 B1 Data Receive PLRB13 P3B1RR
0x0310 Port0 B2 Data Receive PLRB20 P0B2RR
0x0314 Port1 B2 Data Receive PLRB21 P1B2RR
0x0318 Port2 B2 Data Receive PLRB22 P2B2RR
0x031C Port3 B2 Data Receive PLRB23 P3B2RR
0x0320 Port0-3 D Data Receive PLRD0
PLRD1
PLRD2
PLRD3
P0DRR
P1DRR
P2DRR
P3DRR
0x0328 Port0 B1 Data Transmit PLTB10 P0B1TR
0x032C Port1 B1 Data Transmit PLTB11 P1B1TR
0x0330 Port2 B1 Data Transmit PLTB12 P2B1TR
0x0334 Port3 B1 Data Transmit PLTB13 P3B1TR
0x0338 Port0 B2 Data Transmit PLTB20 P0B2TR
0x033C Port1 B2 Data Transmit PLTB21 P1B2TR
0x0340 Port2 B2 Data Transmit PLTB22 P2B2TR
0x0344 Port3 B2 Data Transmit PLTB23 P3B2TR
0x0348 Port0-3 D Data Transmit PLTD0
PLTD1
PLTD2
PLTD3
P0DTR
P1DTR
P2DTR
P3DTR
Table xiii. Timer Module Memory Map (continued)
MBAR
Offset Register Name Old Mnemonic New Mnemonic
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lvi Freescale Semiconductor
0x0350 Port0-1 GCI/IDL Configuration Register PLCR0
PLCR1
P0CR
P1CR
0x0354 Port2-3 GCI/IDL Configuration Register PLCR2
PLCR3
P2CR
P3CR
0x0358 Port0-1 Interrupt Configuration Register PLICR0
PLICR1
P0ICR
P1ICR
0x035C Port2-3 Interrupt Configuration Register PLICR2
PLICR3
P2ICR
P3ICR
0x0360 Port0-1 GCI Monitor RX PLGMR0
PLGMR1
P0GMR
P1GMR
0x0364 Port2-3 GCI Monitor RX PLGMR2
PLGMR3
P2GMR
P3GMR
0x0368 Port0-1 GCI Monitor TX PLGMT0
PLGMT1
P0GMT
P1GMT
0x036C Port2-3 GCI Monitor TX PLGMT2
PLGMT3
P2GMT
P3GMT
0x0370 GCI Monitor TX Status
GCI Monitor TX abort
PLGMTS
PLGMTA
PGMTS
PGMTA
0x0374 Port0-3 GCI C/I RX PLGCIR0
PLGCIR1
PLGCIR2
PLGCIR3
P0GCIR
P1GCIR
P2GCIR
P3GCIR
0x0378 Port0-3 GCI C/I TX PLGCIT0
PLGCIT1
PLGCIT2
PLGCIT3
P0GCIT
P1GCIT
P2GCIT
P3GCIT
0x037C GCI C/I TX Status PGCITSR No change
0x0384 Port0-1 Periodic Status PLPSR0
PLPSR1
P0PSR
P1PSR
0x0388 Port2-3 Periodic Status PLPSR2
PLPSR3
P2PSR
P3PSR
0x038C Aperiodic Interrupt Status Register;
Loop back Control
PLASR
PLLCR
PASR
PLCR
0x0392 D Channel Request PLDRQ PDRQR
0x0394 Port0-1 Sync Delay PLSD0
PLSD1
P0SDR
P1SDR
0x0398 Port2-3 Sync Delay PLSD2
PLSD3
P2SDR
P3SDR
0x039C Clock Select PLCKSEL PCSR
Table xiv. PLIC Module Memory Map (continued)
MBAR
Offset Register Name Old Mnemonic New Mnemonic
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor lvii
Table xv. Ethernet Module Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x0840 Ethernet Control Register ECNTRL ECR
0x0844 Ethernet Interrupt Event Register IEVENT EIR
0x0848 Ethernet Interrupt Mask Register IMASK EIMR
0x084C Ethernet Interrupt Vector Status IVEC IVSR
0x0850 Ethernet Rx Ring Updated Flag R_DES_ACTIVE RDAR
0x0854 Ethernet Tx Ring Updated Flag X_DES_ACTIVE TDAR
0x0880 Ethernet MII Data Register MII_DATA MMFR
0x0884 Ethernet MII Speed Register MII_SPEED MSCR
0x08CC Ethernet Receive Bound Register R_BOUND FRBR
0x08D0 Ethernet Rx FIFO Start Address R_FSTART FRSR
0x08E4 Transmit FIFO Watermark X_WMRK TFWR
0x08EC Ethernet Tx FIFO Start Address X_FSTART TFSR
0x0944 Ethernet Rx Control Register R_CNTRL RCR
0x0948 Maximum Frame Length Register MAX_FRM_LEN MFLR
0x0984 Ethernet Tx Control Register X_CNTRL TCR
0x0C00 Ethernet Address (Lower) ADDR_LOW MALR
0x0C04 Ethernet Address (Upper) ADDR_HIGH MAUR
0x0C08 Ethernet Hash Table (Upper) HASH_TABLE_HIGH HTUR
0x0C0C Ethernet Hash Table (Lower) HASH_TABLE_LOW HTLR
0x0C10 Ethernet Rx Descriptor Ring R_DES_START ERDSR
0x0C14 Ethernet Tx Descriptor Rin X_DES_START ETDSR
0x0C18 Ethernet Rx Buffer Size R_BUFF_SIZE EMRBR
0x0C40–
0x0DFF
FIFO RAM E_FIFO EFIFO
Table xvi. USB Module Memory Map
MBAR
Offset Register Name Old Mnemonic New Mnemonic
0x1002 USB Frame Number Register USBFNR FNR
0x1006 USB Frame Number Match Register USBFNMR FNMR
0x100A USB Real-time Frame Monitor Register USBRTFMR RFMR
0x100E USB Real-time Frame Monitor Match Register USBRTFMMR RFMMR
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lviii Freescale Semiconductor
0x1013 USB Function Address Register USBFAR FAR
0x1014 USB Alternate Setting Register USBASR ASR
0x1018 USB Device Request Data1 Register USBDRR1 DRR1
0x101C USB Device Request Data2 Register USBDRR2 DRR2
0x1022 USB Specification Number Register USBSPECR SPECR
0x1026 USB Endpoint 0 Status Register USBEPSR0 EP0SR
0x1028 USB Endpoint 0 IN Config Register USBEPICFG0 IEP0CFG
0x102C USB Endpoint 0 OUT Config Register USBEPOCFG0 OEP0CFG
0x1030 USB Endpoint 1 Configuration Register USBEPCFG1 EP1CFG
0x1034 USB Endpoint 2 Configuration Register USBEPCFG2 EP2CFG
0x1038 USB Endpoint 3 Configuration Register USBEPCFG3 EP3CFG
0x103C USB Endpoint 4 Configuration Register USBEPCFG4 EP4CFG
0x1040 USB Endpoint 5 Configuration Register USBEPCFG5 EP5CFG
0x1044 USB Endpoint 6 Configuration Register USBEPCFG6 EP6CFG
0x1048 USB Endpoint 7 Configuration Register USBEPCFG7 EP7CFG
0x104C USB Endpoint 0 Control Register USBEPCTL0 EP0CTL
0x1052 USB Endpoint 1 Control Register USBEPCTL1 EP1CTL
0x1056 USB Endpoint 2 Control Register USBEPCTL2 EP2CTL
0x105A USB Endpoint 3 Control Register USBEPCTL3 EP3CTL
0x105E USB Endpoint 4 Control Register USBEPCTL4 EP4CTL
0x1062 USB Endpoint 5 Control Register USBEPCTL5 EP5CTL
0x1066 USB Endpoint 6 Control Register USBEPCTL6 EP6CTL
0x106A USB Endpoint 7 Control Register USBEPCTL7 EP7CTL
0x106C USB General/Endpoint 0 Interrupt Status Register USBEPISR0 EP0ISR
0x1072 USB Endpoint 1 Interrupt Status Register USBEPISR1 EP1ISR
0x1076 USB Endpoint 2 Interrupt Status Register USBEPISR2 EP2ISR
0x107A USB Endpoint 3 Interrupt Status Register USBEPISR3 EP3ISR
0x107E USB Endpoint 4 Interrupt Status Register USBEPISR4 EP4ISR
0x1082 USB Endpoint 5 Interrupt Status Register USBEPISR5 EP5ISR
0x1086 USB Endpoint 6 Interrupt Status Register USBEPISR6 EP6ISR
0x108A USB Endpoint 7 Interrupt Status Register USBEPISR7 EP7ISR
0x108C USB Endpoint 0 Interrupt Mask Register USBEPIMR0 EP0IMR
Table xvi. USB Module Memory Map (continued)
MBAR
Offset Register Name Old Mnemonic New Mnemonic
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor lix
NOTE
The MBAR Offset column corresponds to the tables found in Appendix A,
“List of Memory Maps.” 16- and/or 8-bit wide registers may be offset by 0,
1, 2, or 3 bytes from the offset address shown above. Refer to the
appropriate discussions in this document for actual positioning of 16- or
8-bit registers in a 32-bit long word.
0x1092 USB Endpoint 1 Interrupt Mask Register USBEPIMR1 EP1IMR
0x1096 USB Endpoint 2 Interrupt Mask Register USBEPIMR2 EP2IMR
0x109A USB Endpoint 3 Interrupt Mask Register USBEPIMR3 EP3IMR
0x109E USB Endpoint 4 Interrupt Mask Register USBEPIMR4 EP4IMR
0x10A2 USB Endpoint 5 Interrupt Mask Register USBEPIMR5 EP5IMR
0x10A6 USB Endpoint 6 Interrupt Mask Register USBEPIMR6 EP6IMR
0x10AA USB Endpoint 7 Interrupt Mask Register USBEPIMR7 EP7IMR
0x10AC USB Endpoint 0 Data Register USBEPDAT0 EP0DR
0x10B0 USB Endpoint 1 Data Register USBEPDAT1 EP1DR
0x10B4 USB Endpoint 2 Data Register USBEPDAT2 EP2DR
0x10B8 USB Endpoint 3 Data Register USBEPDAT3 EP3DR
0x10BC USB Endpoint 4 Data Register USBEPDAT4 EP4DR
0x10C0 USB Endpoint 5 Data Register USBEPDAT5 EP5DR
0x10C4 USB Endpoint 6 Data Register USBEPDAT6 EP6DR
0x10C8 USB Endpoint 7 Data Register USBEPDAT7 EP7DR
0x10CE USB Endpoint 0 Data Present Register USBEPDP0 EP0DPR
0x10D2 USB Endpoint 1 Data Present Register USBEPDP1 EP1DPR
0x10D6 USB Endpoint 2 Data Present Register USBEPDP2 EP2DPR
0x10DA USB Endpoint 3 Data Present Register USBEPDP3 EP3DPR
0x10DE USB Endpoint 4 Data Present Register USBEPDP4 EP4DPR
0x10E2 USB Endpoint 5 Data Present Register USBEPDP5 EP5DPR
0x10E6 USB Endpoint 6 Data Present Register USBEPDP6 EP6DPR
0x10EA USB Endpoint 7 Data Present Register USBEPDP7 EP7DPR
0x1400–
0x17FF
USB Configuration RAM, 1 K Bytes USB_CFG_RAM No change
Table xvi. USB Module Memory Map (continued)
MBAR
Offset Register Name Old Mnemonic New Mnemonic
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
lx Freescale Semiconductor
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 1-1
Chapter 1
Overview
This chapter provides an overview of the MCF5272 microprocessor features, including the major
functional components.
1.1 MCF5272 Key Features
A block diagram of the MCF5272 is shown in Figure 1-1. The main features are as follows:
• Static Version 2 ColdFire variable-length RISC processor
— 32-bit address and data path on-chip
— 66-MHz processor core and bus frequency
— Sixteen general-purpose 32-bit data and address registers
— Multiply-accumulate unit (MAC) for DSP and fast multiply operations
• On-chip memories
— 4-Kbyte SRAM on CPU internal bus
— 16-Kbyte ROM on CPU internal bus
— 1-Kbyte instruction cache
• Power management
— Fully-static operation with processor sleep and whole-chip stop modes
— Very rapid response to interrupts from the low-power sleep mode (wake-up feature)
— Clock enable/disable for each peripheral when not used
— Software-controlled disable of external clock input for virtually zero power consumption
(low-power stop mode)
• Two universal asynchronous/synchronous receiver transmitters (UARTs)
— Full-duplex operation
— Based on MC68681 dual-UART (DUART) programming model
— Flexible baud rate generator
— Modem control signals available (CTS and RTS)
— Processor interrupt and wakeup capability
— Enhanced Tx, Rx FIFOs, 24 bytes each
Overview
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
1-2 Freescale Semiconductor
Figure 1-1. MCF5272 Block Diagram
JTAG
V2 ColdFire Processor Complex
4-Kbyte
SRAM
1-Kbyte
SRAM Controller
RAMBAR
4-Entry
Store
Buffer
31 0
Local Memory
Local
Data Bus
Instruction Cache
ACR0
ACR1
CACR
Local Memory
Instruction Unit
Cache
Controller
16-Kbyte
ROM
ROM Controller
ROMBAR
Instruction Fetch
FIFO Instruction Buffer (3 X 32)
Decode, Select, Operand Fetch
Address Generation, Execute
IFP
OEP
D[31:0]
Instruction Address Generation
Memory
Instruction
Bus
SDRAM Controller External
Bus Interface
SYSTEM INTEGRATION MODULE (SIM)
32-Bit Address Bus
32-Bit Data Bus
Interrupt Controller
CS[7:0]
88
8
4 ICRs
MBAR
PIWR
CSORs CSBRs
INT[6:1]
6
DRAM Controller Outputs
PIVR
PITR
ISR
WRRR
WIRRALPR
PMR
System Control Base Address
DIR
Identification
SDRAM Control
SDCR
Parallel Port
Four
Two UARTs
DMA
Ethernet
General-
Purpose
Timers
Control Signals
Chip Select Module
SPR
SCR WCR
WER
USB
QSPI
PLIC
PACNT–
PDCNT PADDR–
PCDDR PADR–
PCDR
SDRAM Timer
SDTR
PWM
Overview
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 1-3
• Ethernet Module
— 10 baseT capability, half or full duplex
— 100 baseT capability, half duplex and limited throughput full duplex (MCF5272)
— On-chip transmit and receive FIFOs
— Off-chip flexible buffer descriptor rings
— Media-independent interface (MII)
• Universal serial bus (USB) module
— 12 Mbps (full speed)
— Fully compatible with USB 1.1 specifications
— Eight endpoints (control, bulk, interrupt Rx, isochronous)
— Endpoint FIFOs
— Selectable on-chip analog interface
• External memory interface
— External glueless 8, 16, and 32-bit SRAM and ROM interface bus
— SDRAM controller supports 16–256 Mbit devices
— External bus configurable for 16 or 32 bits width for SDRAM
— Glueless interface to SRAM devices with or without byte strobe inputs
— Programmable wait state generator
• Queued serial peripheral interface (QSPI)
— Full-duplex, three-wire synchronous transfer
— Up to four chip selects available
— Master operation
— Programmable master bit rates
— Up to 16 preprogrammed transfers
• Timer module
— 4x16-bit general-purpose multi-mode timer
– Input capture and output compare pins for timers 1 and 2
– Programmable prescaler
— 15-nS resolution at 66-MHz clock frequency
— Software watchdog timer
— Software watchdog can generate interrupt before reset
— Processor interrupt for each timer
• Pulse-width modulation (PWM) unit
— Three identical channels
— Independent prescaler TAP point
— Period/duty range variable
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• System integration module (SIM)
— System configuration including internal and external address mapping
— System protection by hardware watchdog
— Versatile programmable chip-select signals with wait-state generation logic
— Up to three 16-bit parallel input/output ports
— Latchable interrupt inputs with programmable priority and edge triggering
— Programmable interrupt vectors for on-chip peripherals
• Physical layer interface controller (PLIC)
— Allows connection using general circuit interface (GCI) or interchip digital link (IDL) physical
layer protocols for 2B + D data
— Three physical interfaces
— Four time-division multiplex (TDM) ports
• IEEE 1149.1 boundary-scan test access port (JTAG) for board-level testing
• Operating voltage: 3.3 V ±0.3 V
• Operating temperature: 0 –70°C
• Operating frequency: DC to 66 MHz, from external CMOS oscillator
• Compact ultra low-profile 196 ball-molded plastic ball-grid array package (PGBA)
1.2 MCF5272 Architecture
This section briefly describes the MCF5272 core, SIM, UART, and timer modules, and test access port.
1.2.1 Version 2 ColdFire Core
Based on the concept of variable-length RISC technology, ColdFire combines the simplicity of
conventional 32-bit RISC architectures with a memory-saving, variable-length instruction set. The main
features of the MCF5272 core are as follows:
• 32-bit address bus directly addresses up to 4 Gbytes of address space
• 32-bit data bus
• Variable-length RISC
• Optimized instruction set for high-level language constructs
• Sixteen general-purpose 32-bit data and address registers
• MAC unit for DSP applications
• Supervisor/user modes for system protection
• Vector base register to relocate exception-vector table
• Special core interfacing signals for integrated memories
• Full debug support
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The Version 2 ColdFire core has a 32-bit address bus and a 32-bit data bus. The address bus allows direct
addressing of up to 4 Gbytes. It supports misaligned data accesses and a bus arbitration unit for multiple
bus masters.
The Version 2 ColdFire supports an enhanced subset of the 68000 instruction set. The MAC provides new
instructions for DSP applications; otherwise, Version 2 ColdFire user code runs unchanged on 68020,
68030, 68040, and 68060 processors. The removed instructions include BCD, bit field, logical rotate,
decrement and branch, integer division, and integer multiply with a 64-bit result. Also, four indirect
addressing modes have been eliminated.
The ColdFire 2 core incorporates a complete debug module that provides real-time trace, background
debug mode, and real-time debug support.
1.2.2 System Integration Module (SIM)
The MCF5272 SIM provides the external bus interface for the ColdFire 2 architecture. It also eliminates
most or all of the glue logic that typically supports the microprocessor and its interface with the peripheral
and memory system. The SIM provides programmable circuits to perform address-decoding and chip
selects, wait-state insertion, interrupt handling, clock generation, discrete I/O, and power management
features.
1.2.2.1 External Bus Interface
The external bus interface (EBI) handles the transfer of information between the internal core and memory ,
peripherals, or other processing elements in the external address space.
1.2.2.2 Chip Select and Wait State Generation
Programmable chip select outputs provide signals to enable external memory and peripheral circuits,
providing all handshaking and timing signals for automatic wait-state insertion and data bus sizing.
Base memory address and block size are programmable, with some restrictions. For example, the starting
address must be on a boundary that is a multiple of the block size. Each chip select is general purpose;
however , any one of the chip selects can be programmed to provide read and write enable signals suitable
for use with most popular static RAMs and peripherals. Data bus width (8-bit, 16-bit, or 32-bit) is
programmable on all chip selects, and furth er decoding is available for protection from user mode acces s
or read-only access.
1.2.2.3 System Configuration and Protection
The SIM provides configuration registers that allow general system functions to be controlled and
monitored. For example, all on-chip registers can be relocated as a block by programming a module base
address, power management modes can be selected, and the source of the most re cent RESET or BERR
can be checked. The hardware watchdog features can be enabled or disabled, and the bus time-out period
can be programmed.
A software watchdog timer is also provided for system protection. If programmed, the timer causes a reset
to the MCF5272 if it is not refreshed periodically by software.
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1.2.2.4 Power Management
The sleep and stop power management modes reduce power consumption by allowing software to shut
down the core, peripherals, or the whole device during inactive periods. To reduce power consumption
further, software can individually disable internal clocks to the on-chip peripheral modules. The
power-saving modes are described as follows:
• Sleep mode uses interrupt control logic to allow any interrupt condition to wake the processor. As
the MCF5272 is fully static, sleep mode is simply the disabling of the core’s clock after the current
instruction completes. An interrupt from any internal or external source causes on-chip power
management logic to reenable the core’s clock; execution resumes with the next instruction. This
allows rapid return from power-down state as compared to a dynamic implementation that must
perform power-on reset processing before software can handle the interrupt request. If interrupts
are enabled at the appropriate priority level, program control passes to the relevant interrupt service
routine.
• Stop mode is entered by the disabling of the external clock input and is achieved by software setting
a bit in a control register. Program execution stops after the current instruction. In stop mode,
neither the core nor peripherals are active. The MCF5272 consumes very little power in this mode.
To resume normal operation, the external interrupts cause the power management logic to
re-enable the external clock input. The MCF5272 resumes program execution from where it
entered stop mode (if no interrupt are pending), or starts interrupt exception processing if interrupts
are pending.
1.2.2.5 Parallel Input/Output Ports
The MCF5272 has up to three 16-bit general-purpose parallel ports, each line of which can be programmed
as either an input or output. Some port lines have dedicated pins and others are shared with other MCF5272
functions. Some outputs have high drive current capability.
1.2.2.6 Interrupt Inputs
The MCF5272 has flexible latched interrupt inputs each of which can generate a separate, maskable
interrupt with programmable interrupt priority level and triggering edge (falling or risin g). Each interrupt
has its own interrupt vector.
1.2.3 UART Module
The MCF5272 has two full-duplex UART modules with an on-chip baud rate generator providing both
standard and non-standard baud rates up to 5 Mbps. The module is functionally equivalent to the MC68681
DUART with enhanced features including 24-byte Tx and Rx FIFOs. Data formats can be 5, 6, 7, or 8 bits
with even, odd, or no parity and up to 2 stop bits in 1/16-bit increments. Receive and transmit FIFOs
minimize CPU service calls. A wide variety of error detection and maskable interrupt capability is
provided.
Using a programmable prescaler or an external source, the MCF5272 system clock supports various baud
rates. Modem support is provided with request-to-send (RTS) and clear-to-send (CTS) lines available
externally. Full-duplex autoecho loopback, local loopback, and remote loopback modes can be selected.
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The UART can be programmed to interrupt or wake up the CPU on various normal or abnormal events.
To reduce power consumption, the UART can be disabled by software if not in use.
1.2.4 Timer Module
The timer module contains five timers arranged in two submodules. One submodule contains a
programmable software watchdog timer. The other contains four independent, identical general-purpose
timer units, each containing a free-running 16-bit timer for use in various modes, including capturing the
timer value with an external event, counting external events, or triggering an external signal or interrupting
the CPU when the timer reaches a set value. Each unit has an 8-bit prescaler for deriving the clock input
frequency from the system clock or external clock input. The output pin associated with each timer has
programmable modes.
To reduce power consumption, the timer module can be disabled by software.
1.2.5 Test Access Port
For system diagnostics and manufacturing testing, the MCF5272 includes user-accessible test logic that
complies with the IEEE 1149.1 standard for boundary scan testing, often referred to as JTAG (Joint Test
Action Group). The IEEE 1149.1 Standard provides more information.
1.3 System Design
This section presents issues to consider when designing with the MCF5272. It describes differences
between the MCF5272 (core and peripherals) and various other standard components that are replaced by
moving to an integrated device like the MCF5272.
1.3.1 System Bus Configuration
The MCF5272 has flexibility in its system bus interfacing due to the dynamic bus sizing feature in which
32-,16-, and 8-bit data bus sizes are programmable on a per-chip sele ct basis. The programmable nature of
the strobe signals (including OE/RD, R/W, BS[3:0], and CSn) should ensure that external decode logic is
minimal or nonexistent. Configuration software is required upon power-on reset before chip-selected
devices can be used, except for chip select 0 (CS0), which is active after power-on reset until programmed
otherwise. BUSW1 and BUSW0 select the initial data bus width for CS0 only . A wake-up from sleep mode
or a restart from stop mode does not require reconfiguration of the chip select registers or other system
configuration registers.
1.4 MCF5272-Specific Features
This section describes features peculiar to the MCF5272.
1.4.1 Physical Layer Interface Controller (PLIC)
The physical layer interface controller (PLIC) allows the MCF5272 to connect at a physical level with
external CODECs and other peripheral devices that use either the general circuit interface (GCI), or
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interchip digital link (IDL), physical layer protocols. This module is primarily intended to facilitate
designs that include ISDN interfaces.
1.4.2 Pulse-Width Modulation (PWM) Unit
The PWM unit is intended for use in control applications. W ith a suitable lo w-pass filter , it can be used as
a digital-to-analog converter. This module generates a synchronous series of pulses. The duty cycle of the
pulses is under software control.
Its main features include the following:
• Double-buffered width register
• Variable-divide prescale
• Three identical, independent PWM modules
• Byte-wide width register provides programmable control of duty cycle.
The PWM implements a simple free-running counter with a width register and comparator such that the
output is cleared when the counter exceeds the value of the width register . When the counter wraps around,
its value is not greater than the width register value, and the output is set high. With a suitable low-pass
filter, the PWM can be used as a digital-to-analog converter.
1.4.3 Queued Serial Peripheral Interface (QSPI)
The QSPI module provides a serial peripheral interface with queued transfer capability. It supports up to
16 stacked transfers at a time, making CPU intervention between transfers unnecessary. Transfer RAMs
in the QSPI are indirectly accessible using address and data registers. Functionality is similar to the QSPI
portion of the QSM (queued serial module) implemented in the MC68332.
The QSPI has the following features:
• Programmable queue to support up to 16 transfers without user intervention
• Supports transfer sizes of 8 to 16 bits in 1-bit increments
• Four peripheral chip-select lines for control of up to 15 devices
• Baud rates from 129.4 Kbps to 33 Mbps at 66 MHz.
• Programmable delays before and after transfers
• Programmable clock phase and polarity
• Supports wrap-around mode for continuous transfers
1.4.4 Universal Serial Bus (USB) Module
The USB controller on the MCF5272 supports device mode data communications with a USB host
(typically a PC). One host and up to 127 attached peripherals share USB bandwidth through a
host-scheduled, token-based protocol. The USB uses a tiered star topology with a hub at the center of each
star. Each wire segment is a point-to-point connection between the host connector and a peripheral
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Chapter 2
ColdFire Core
This chapter provides an overview of the microprocessor core of the MCF5272. The chapter describes the
V2 programming model as it is implemented on the MCF5272. It also includes a full description of
exception handling, data formats, an instruction set summary, and a table of instruction timings.
2.1 Features and Enhancements
The MCF5272 is the most highly-integrated V2 standard product, containing a variety of communications
and general-purpose peripherals. The V2 core was designed to maximize code density and performance
while minimizing die area.
The following list summarizes MCF5272 features:
• Variable-length RISC Version 2 microprocessor core
• Two independent, decoupled pipelines—two-stage instruction fetch pipeline (IFP) and two-stage
operand execution pipeline (OEP)
• Three longword FIFO buffer provides decoupling between the pipelines
• 32-bit internal address bus supporting 4 Gbytes of linear address space
• 32-bit data bus
• 16 user-accessible, 32-bit-wide, general-purpose registers
• Supervisor/user modes for system protection
• Vector base register to relocate exception-vector table
• Optimized for high-level language constructs
2.1.1 Decoupled Pipelines
The IFP prefetches instructions. The OEP decodes instructions, fetches required operands, then executes
the specified function. The two independent, decoupled pipeline structures maximize performance while
minimizing core size. Pipeline stages are shown in Figure 2-1 and are summarized as follows:
• Two-stage IFP (plus optional instruction buffer stage)
— Instruction address generation (IAG) calculates the next prefetch address.
— Instruction fetch cycle (IC) initiates prefetch on the processor’s local instruction bus.
— Instruction buffer (IB) optional stage uses FIFO queue to minimize effects of fetch latency.
• Two-stage OEP
— Decode, select/operand fetch (DSOC) decodes the instruction and selects the required
components for the effective address calculation, or the operand fetch cycle.
— Address generation/execute (AGEX) calculates the operand address, or performs the execution
of the instruction.
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Figure 2-1. ColdFire Pipeline
2.1.1.1 Instruction Fetch Pipeline (IFP)
The IFP generates instruction addresses and fetches. Because the fetch and execution pipelines are
decoupled by a three longword FIFO buffer , the IFP ca n prefetch instructions before the OEP needs them,
minimizing stalls.
2.1.1.2 Operand Execution Pipeline (OEP)
The OEP is a two-stage pipeline featuring a traditional RISC datapath with a register file feeding an
arithmetic/logic unit (ALU). For simple register-to-register instructions, the first stage of the OEP
performs the instruction decode and fetching of the required register operands (OC), while the actual
instruction execution is performed in the second stage (EX).
For memory-to-register instructions, the instruction is effectively staged through the OEP twice in the
following way:
• The instruction is decoded and the components of the operand address are selected (DS).
• The operand address is generated using the execute engine (AG).
• The memory operand is fetched while any register operand is simultaneously fetched (OC).
• The instruction is executed (EX).
Instruction
Instruction
FIFO
Decode & Select,
Address
Data[31:0]
IAG
IC
IB
DSOC
AGEX
Address [31:0]
Instruction Buffer
Address
Generation
Fetch Cycle
Generation,
Execute
Operand Fetch
Operand
Execution
Pipeline
Instruction
Fetch
Pipeline
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For register-to-memory operations, the stage functions (DS/OC, AG/EX) are effectively performed
simultaneously allowing single-cycle execution. For read-modify-write instructions, the pipeline
effectively combines a memory-to-register operation with a store operation.
2.1.1.2.1 Illegal Opcode Handling
On Version 2 ColdFire implementations, only some illegal opcodes (0x0000 and 0x4AFC) are decoded
and generate an illegal instruction exception. Additionally , attempting to execute an illegal line A or line F
opcode generates unique exception types. If any other unsupported opcode is executed, the resulting
operation is undefined.
2.1.1.2.2 Hardware Multiply/Accumulate (MAC) Unit
The MAC is an optional unit in Version 2 that provides hardware support for a limited set of digital signal
processing (DSP) operations used in embedded code, while supporting the integer multiply instructions in
the ColdFire microprocessor family. The MAC features a three-stage execution pipeline, optimized for 16
x 16 multiplies. It is tightly coupled to the OEP, which can issue a 16 x 16 multiply with a 32-bit
accumulation plus fetch a 32-bit operand in a single cycle. A 32 x 32 multiply with a 32-bit accumulation
requires three cycles before the next instruction can be issued.
Figure 2-2 shows basic functionality of the MAC. A full set of instructions are provided for signed and
unsigned integers plus signed, fixed-point fractional input operands.
Figure 2-2. ColdFire Multiply-Accumulate Functionality Diagram
The MAC provides functionality in the following three related areas, which are described in detail in
Chapter 3, “Hardware Multiply/Accumulate (MAC) Unit.”
• Signed and unsigned integer multiplies
• Multiply-accumulate operations with signed and unsigned fractional operands
• Miscellaneous register operations
X
+/-
Operand Y Operand X
Shift 0,1,-1
Accumulator
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2.1.1.2.3 Hardware Divide Unit
The hardware divide unit performs the following integer division operations:
• 32-bit operand/16-bit operand producing a 16-bit quotient and a 16-bit remainder
• 32-bit operand/32-bit operand producing a 32-bit quotient
• 32-bit operand/32-bit operand producing a 32-bit remainder
2.1.2 Debug Module Enhancements
The ColdFire processor core debug interface supports system integration in conjunction with low-cost
development tools. Real-time trace and debug information can be accessed through a standard interface,
which allows the processor and system to be debugged at full speed without costly in-circuit emulators.
On-chip breakpoint resources include the following:
• Configuration/status register (CSR)
• Bus attributes and mask register (AATR)
• Breakpoint registers. These can be used to define triggers combining address, data, and PC
conditions in single- or dual-level definitions. They include the following:
— PC breakpoint register (PBR)
— PC breakpoint mask register (PBMR)
— Data operand address breakpoint registers (ABHR/ABLR)
— Data breakpoint register (DBR)
• Data breakpoint mask register (DBMR)
• Trigger definition register (TDR) can be programmed to generate a processor halt or initiate a
debug interrupt exception
These registers can be accessed through the dedicated debug serial communication channel, or from the
processor’s supervisor programming model, using the WDEBUG instruction.
2.2 Programming Model
The MCF5272 programming model consists of three instruction and register groups—user, MAC (also
user-mode), and supervisor, shown in Figure 2-2. User mode programs are restricted to user and MAC
instructions and programming models. Supervisor -mode system software can reference all user -mode and
MAC instructions and registers and additional supervisor instructions and control registers. The user or
supervisor programming model is selected based on SR[S]. The following sections describe the registers
in the user, MAC, and supervisor programming models.
2.2.1 User Programming Model
As Figure 2-3 shows, the user programming model consists of the following registers:
• 16 general-purpose 32-bit registers, D0–D7 and A0–A7
• 32-bit program counter
• 8-bit condition code register
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Figure 2-3. ColdFire Programming Model
2.2.1.1 Data Registers (D0–D7)
Registers D0–D7 are used as data registers for bit, byte (8-bit), word (16-bit), and longword (32-bit)
operations. They may also be used as index registers.
2.2.1.2 Address Registers (A0–A6)
The address registers (A0–A6) can be used as software stack pointers, index registers, or base address
registers and may be used for word and longword operations.
2.2.1.3 Stack Pointer (A7, SP)
The processor core supports a single hardware stack pointer (A7) used during stacking for subroutine calls,
returns, and exception handling. The stack pointer is implicitly referenced by certain operations and can
be explicitly referenced by any instruction specifying an address register. The initial value of A7 is loaded
31 0
D0 Data registers
D1
D2
D3
D4
D5
D6
D7
31 0
A0 Address registers
A1
A2
A3
A4
A5
A6
A7 Stack pointer
PC Program counter
CCR Condition code register
31 0
MACSR MAC status register
ACC MAC accumulator
MASK MAC mask register
15
31 19 (CCR) SR Status register
Must be zeros VBR Vector base register
CACR Cache control register
ACR0 Access control register 0
ACR1 Access control register 1
ROMBAR ROM base address register
RAMBAR RAM base address register
MBAR Module base address register
User Registers
Supervisor
Registers
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from the reset exception vector , address 0x0000. The same register is used for user and supervisor modes,
and may be used for word and longword operations.
A subroutine call saves the program counter (PC) on the stack and the return restores the PC from the stack.
The PC and the status register (SR) are saved on the stack during exception and interrupt processing. The
return from exception instruction restores SR and PC values from the stack.
2.2.1.4 Program Counter (PC)
The PC holds the address of the executing instruction. For sequential instructions, the processor
automatically increments the PC. When program flow changes, the PC is updated with the target
instruction. For some instructions, the PC specifies the base address for PC-relative operand addressing
modes.
2.2.1.5 Condition Code Register (CCR)
The CCR, Figure 2-4, occupies SR[7–0], as shown in Figure 2-3. CCR[4–0] are indicator flags based on
results generated by arithmetic operations.
76543210
Field — X N Z V C
Reset 000 Undefined
R/W R R/W R/W R/W R/W R/W
Figure 2-4. Condition Code Register (CCR)
CCR fields are described in Table 2-1.
Table 2-1. CCR Field Descriptions
Bits Name Description
7–5 — Reserved, should be cleared.
4 X Extend condition code bit. Assigned the value of the carry bit for arithmetic operations; otherwise not
affected or set to a specified result. Also used as an input operand for multiple-precision arithmetic.
3 N Negative condition code bit. Set if the msb of the result is set; otherwise cleared.
2 Z Zero condition code bit. Set if the result equals zero; otherwise cleared.
1 V Overflow condition code bit. Set if an arithmetic overflow occurs, implying that the result cannot be
represented in the operand size; otherwise cleared.
0 C Carry condition code bit. Set if a carry-out of the data operand msb occurs for an addition or if a borrow
occurs in a subtraction; otherwise cleared.
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2.2.1.6 MAC Programming Model
Figure 2-3 shows the registers in the MAC portion of the user programming model. These registers are
described as follows:
• Accumulator (ACC)—This 32-bit, read/write, general-purpose register is used to accumulate the
results of MAC operations.
• Mask register (MASK)—This 16-bit general-purpose register provides an optional address mask
for MAC instructions that fetch operands from memory. It is useful in the implementation of
circular queues in operand memory.
• MAC status register (MACSR)—This 8-bit register defines configuration of the MAC unit and
contains indicator flags af fected by MAC instructions. Unless noted otherwise, MACSR indicator
flag settings are based on the final result, that is, the result of the final operation involving the
product and accumulator.
2.2.2 Supervisor Programming Model
The MCF5272 supervisor programming model is shown in Figure 2-3. T ypically , system programmers use
the supervisor programming model to implement operating system functions and provide memory and I/O
control. The supervisor programming model provides access to the user registers and additional supervisor
registers, which include the upper byte of the status register (SR), the vector base register (VBR), and
registers for configuring attributes of the address space connected to the Version 2 processor core. Most
supervisor-mode registers are accessed by using the MOVEC instruction with the control register
definitions in Table 2-2.
Table 2-2. MOVEC Register Map
Rc[11–0] Register Definition
0x002 Cache control register (CACR)
0x004 Access control register 0 (ACR0)
0x005 Access control register 1 (ACR1)
0x801 Vector base register (VBR)
0xC00 ROM base address register
0xC04 RAM base address register (RAMBAR)
0xC0F Module base address register (MBAR)
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2.2.2.1 Status Register (SR)
The SR stores the processor status, the interr upt priority mask, and other control bits. Supervisor software
can read or write the entire SR; user software can read or write only SR[7–0], described in Section 2.2.1.5,
“Condition Code Register (CCR).” The control bits indicate processor states—trace mode (T), supervisor
or user mode (S), and master or interrupt state (M). SR is set to 0x27xx after reset.
Table 2-3 describes SR fields.
2.2.2.2 Vector Base Register (VBR)
The VBR holds the base address of the exception vector table in memory. The displacement of an
exception vector is added to the value in this register to access the vector table. VBR[19–0] are not
implemented and are assumed to be zero, forcing the vector table to be aligned on a 0-modulo-1-Mbyte
boundary.
15 8 7 0
System Byte Condition Code Register (CCR)
Field T — S M — I — X N Z V C
Reset00100 111 000 —————
R/W R/W R R/W R/W R R/W R R/W R/W R/W R/W R/W
Figure 2-5. Status Register (SR)
Table 2-3. Status Field Descriptions
Bits Name Description
15 T Trace enable. When T is set, the processor performs a trace exception after every instruction.
13 S Supervisor/user state. Indicates whether the processor is in supervisor or user mode
0 User mode
1 Supervisor mode
12 M Master/interrupt state. Cleared by an interrupt exception. It can be set by software during execution
of the RTE or move to SR instructions so the OS can emulate an interrupt stack pointer.
10–8 I Interrupt priority mask. Defines the current interrupt priority. Interrupt requests are inhibited for all
priority levels less than or equal to the current priority, except the edge-sensitive level-7 request,
which cannot be masked.
7–0 CCR Condition code register. See Figure 2-4.
31 20 19 0
Field Exception vector table base address —
Reset 0000_0000_0000_0000_0000_0000_0000_0000
R/W Written from a BDM serial command or from the CPU using the MOVEC instruction. VBR can be read from
the debug module only. The upper 12 bits are returned, the low-order 20 bits are undefined.
Rc[11–0] 0x801
Figure 2-6. Vector Base Register (VBR)
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2.2.2.3 Cache Control Register (CACR)
The CACR controls operation of the instruction and data cache memory. It includes bits for enabling,
freezing, and invalidating cache contents. It also includes bits for defining the default cache mode and
write-protect fields. See Section 4.5.3.1, “Cache Control Register (CACR).”
2.2.2.4 Access Control Registers (ACR0–ACR1)
The access control registers (ACR0–ACR1) define attributes for two user-defined memory regions.
Attributes include definition of cache mode, write protect, and buffer write enables. See Section 4.5.3.2,
“Access Control Registers (ACR0 and ACR1).”
2.2.2.5 ROM Base Address Register (ROMBAR)
The ROMBAR base address register determines the base address of the internal ROM module and
indicates the types of references mapped to it. The ROMBAR includes a base address, write-protect bit,
address space mask bits, and an enable. Note that the MCF5272 ROM contains data for the HDLC module
and is not user programmable. See Section 4.4.2.1, “ROM Base Address Register (ROMBAR).”
2.2.2.6 RAM Base Address Register (RAMBAR)
The RAMBAR register determines the base address location of the internal SRAM module and indicates
the types of references mapped to it. The RAMBAR includes a base address, write-protect bit, address
space mask bits, and an enable. The RAM base address must be aligned on a 0-modulo-4-Kbyte boundary.
See Section 4.3.2.1, “SRAM Base Address Register (RAMBAR).”
2.2.2.7 Module Base Address Register (MBAR)
The module base address register (MBAR) defines the logical base address for the memory-mapped space
containing the control registers for the on-chip peripherals. See Section 6.2.2, “Module Base Address
Register (MBAR).”
2.3 Integer Data Formats
Table 2-4 lists the integer operand data formats. Integer operands can reside in registers, memory, or
instructions. The operand size for each instruction is either explicitly encoded in the instruction or
implicitly defined by the instruction operation.
Table 2-4. Integer Data Formats
Operand Data Format Size
Bit 1 bit
Byte integer 8 bits
Word integer 16 bits
Longword integer 32 bits
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2.4 Organization of Data in Registers
The following sections describe data organization within the data, address, and control registers.
2.4.1 Organization of Integer Data Formats in Registers
Figure 2-7 shows the integer format for data registers. Each integer data register is 32 bits wide. Byte and
word operands occupy the lower 8- and 16-bit portions of integer data registers, respectively. Longword
operands occupy the entire 32 bits of integer data registers. A data register that is either a source or
destination operand only uses or changes the appropriate lower 8 or 16 bits in byte or word operations,
respectively . The remaining high-order portion does not change. The least significant bit (lsb) of all integer
sizes is zero, the most-significant bit (msb) of a longword integer is 31, the msb of a word integer is 15,
and the msb of a byte integer is 7.
The instruction set encodings do not allow the use of address registers for byte-sized operands. When an
address register is a source operand, either the low-order word or the entire longword operand is used,
depending on the operation size. Word-length source operands are sign-extended to 32 bits and then used
in the operation with an address register destination. When an address register is a destination, the entire
register is affected, regardless of the operation size. Figure 2-8 shows integer formats for address registers.
The size of control registers varies according to function. Some have undefined bits reserved for future
definition by Freescale. Those particular bits read as zeros and must be written as zeros for future
compatibility.
All operations to the SR and CCR are word-size operations. For all CCR operations, the upper byte is read
as all zeros and is ignored when written, regardless of privilege mode.
31 30 1 0
msb lsb Bit (0 ð bit number ð 31)
31 87610
Not used msb Low order byte lsb Byte (8 bits)
31 16 15 14 1 0
Not used msb Lower order word lsb Word (16 bits)
31 30 1 0
msb Longword lsb Longword (32 bits)
Figure 2-7. Organization of Integer Data Formats in Data Registers
31 16 15 0
Sign-Extended 16-Bit Address Operand
31 0
Full 32-Bit Address Operand
Figure 2-8. Organization of Integer Data Formats in Address Registers
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2.4.2 Organization of Integer Data Formats in Memory
All ColdFire processors use a big-endian addressing scheme. The byte-addressable organization of
memory allows lower addresses to correspond to higher order bytes. The address N of a longword data
item corresponds to the address of the high-order word. The lower order word is located at address N + 2.
The address N of a word data item corresponds to the address of the high-order byte. The lower order byte
is located at address N + 1. This organization is shown in Figure 2-9.
31 24 23 16 15 8 7 0
Longword 0x0000_0000
Word 0x0000_0000 Word 0x0000_0002
Byte 0x0000_0000 Byte 0x0000_0001 Byte 0x0000_0002 Byte 0x0000_0003
Longword 0x0000_0004
Word 0x0000_0004 Word 0x0000_0006
Byte 0x0000_0004 Byte 0x0000_0005 Byte 0x0000_0006 Byte 0x0000_0007
.
.
.
Longword 0xFFFF_FFFC
Word 0xFFFF_FFFC Word 0xFFFF_FFFE
Byte 0xFFFF_FFFC Byte 0xFFFF_FFFD Byte 0xFFFF_FFFE Byte 0xFFFF_FFFF
Figure 2-9. Memory Operand Addressing
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2.5 Addressing Mode Summary
Addressing modes are categorized by how they are used. Data addressing modes refer to data operands.
Memory addressing modes refer to memory operands. Alterable addressing modes refer to alterable
(writable) data operands. Control addressing modes refer to memory operands without an associated size.
These categories sometimes combine to f o rm more restrictive categories. Two combined classifications
are alterable memory (both alterable and memory) and data alterable (both alterable and data). Twelve of
the most commonly used effective addressing modes from the M68000 family are available on ColdFire
microprocessors. Table 2-5 summarizes these modes and their categories.
Table 2-5. ColdFire Effective Addressing Modes
Addressing Modes Syntax Mode
Field
Reg.
Field
Category
Data Memory Control Alterable
Register direct
Data
Address
Dn
An
000
001
reg. no.
reg. no.
X
—
—
—
—
—
X
X
Register indirect
Address
Address with Postincrement
Address with Predecrement
Address with Displacement
(An)
(An)+
–(An)
(d16, An)
010
011
100
101
reg. no.
reg. no.
reg. no.
reg. no.
X
X
X
X
X
X
X
X
X
—
—
X
X
X
X
X
Address register indirect with
scaled index
8-bit displacement
(d8, An,
Xi*SF)
110 reg. no. X X X X
Program counter indirect
with displacement (d16, PC) 111 010 X X X —
Program counter indirect with
scaled index
8-bit displacement
(d8, PC,
Xi*SF)
111 011 X X X —
Absolute data addressing
Short
Long
(xxx).W
(xxx).L
111
111
000
001
X
X
X
X
X
X
—
—
Immediate #<xxx> 111 100 X X — —
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2.6 Instruction Set Summary
The ColdFire instruction set is a simplified version of the M68000 instruction set. The removed
instructions include BCD, bit field, logical rotate, decrement and branch, and integer multiply with a 64-bit
result. Nine new MAC instructions have been added.
Table 2-6 lists notational conventions used throughout this manual.
Table 2-6. Notational Conventions
Instruction Operand Syntax
Opcode Wildcard
cc Logical condition (example: NE for not equal)
Register Specifications
An Any address register n (example: A3 is address register 3)
Ay,Ax Source and destination address registers, respectively
Dn Any data register n (example: D5 is data register 5)
Dy,Dx Source and destination data registers, respectively
Rc Any control register (example VBR is the vector base register)
Rm MAC registers (ACC, MAC, MASK)
Rn Any address or data register
Rw Destination register w (used for MAC instructions only)
Ry,Rx Any source and destination registers, respectively
Xi index register i (can be an address or data register: Ai, Di)
Register Names
ACC MAC accumulator register
CCR Condition code register (lower byte of SR)
MACSR MAC status register
MASK MAC mask register
PC Program counter
SR Status register
Port Names
DDATA Debug data port
PST Processor status port
Miscellaneous Operands
#<data> Immediate data following the 16-bit operation word of the instruction
<ea> Effective address
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<ea>y,<ea>x Source and destination effective addresses, respectively
<label> Assembly language program label
<list> List of registers for MOVEM instruction (example: D3–D0)
<shift> Shift operation: shift left (<<), shift right (>>)
<size> Operand data size: byte (B), word (W), longword (L)
bc Instruction cache
# <vector> Identifies the 4-bit vector number for trap instructions
<> identifies an indirect data address referencing memory
<xxx> identifies an absolute address referencing memory
dn Signal displacement value, n bits wide (example: d16 is a 16-bit displacement)
SF Scale factor (x1, x2, x4 for indexed addressing mode, <<1n>> for MAC operations)
Operations
+ Arithmetic addition or postincrement indicator
– Arithmetic subtraction or predecrement indicator
x Arithmetic multiplication
/ Arithmetic division
~ Invert; operand is logically complemented
& Logical AND
| Logical OR
^ Logical exclusive OR
<< Shift left (example: D0 << 3 is shift D0 left 3 bits)
>> Shift right (example: D0 >> 3 is shift D0 right 3 bits)
→Source operand is moved to destination operand
←→ Two operands are exchanged
sign-extended All bits of the upper portion are made equal to the high-order bit of the lower portion
If <condition>
then <operations>
else <operations>
Test the condition. If the condition is true, the operations in the then clause are performed. If the condition
is false and the optional else clause is present, the operations in the else clause are performed. If the
condition is false and the else clause is omitted, the instruction performs no operation. Refer to the Bcc
instruction description as an example.
Table 2-6. Notational Conventions (continued)
Instruction Operand Syntax
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2.6.1 Instruction Set Summary
Table 2-7 lists implemented user-mode instructions by opcode.
Subfields and Qualifiers
{} Optional operation
() Identifies an indirect address
dnDisplacement value, n-bits wide (example: d16 is a 16-bit displacement)
Address Calculated effective address (pointer)
Bit Bit selection (example: Bit 3 of D0)
lsb Least significant bit (example: lsb of D0)
LSB Least significant byte
LSW Least significant word
msb Most significant bit
MSB Most significant byte
MSW Most significant word
Condition Code Register Bit Names
CCarry
N Negative
VOverflow
X Extend
ZZero
Table 2-7. User-Mode Instruction Set Summary
Instruction Operand Syntax Operand Size Operation
ADD Dy,<ea>x
<ea>y,Dx
.L
.L
Source + destination → destination
ADDA <ea>y,Ax .L Source + destination → destination
ADDI #<data>,Dx .L Immediate data + destination → destination
ADDQ #<data>,<ea>x .L Immediate data + destination → destination
ADDX Dy,Dx .L Source + destination + X → destination
AND Dy,<ea>x
<ea>y,Dx
.L
.L
Source & destination → destination
ANDI #<data>,Dx .L Immediate data & destination → destination
ASL Dy,Dx
#<data>,Dx
.L
.L
X/C ← (Dx << Dy) ← 0
X/C ← (Dx << #<data>) ← 0
ASR Dy,Dx
#<data>,Dx
.L
.L
MSB → (Dx >> Dy) → X/C
MSB → (Dx >> #<data>) → X/C
Bcc <label> .B,.W If condition true, then PC + 2 + dn → PC
Table 2-6. Notational Conventions (continued)
Instruction Operand Syntax
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BCHG Dy,<ea>x
#<data>,<ea-1>x
.B,.L
.B,.L
~(<bit number> of destination) → Z,
Bit of destination
BCLR Dy,<ea>x
#<data>,<ea-1>x
.B,.L
.B,.L
~(<bit number> of destination) → Z;
0 → bit of destination
BRA <label> .B,.W PC + 2 + dn → PC
BSET Dy,<ea>x
#<data>,<ea-1>x
.B,.L
.B,.L
~(<bit number> of destination) → Z;
1→ bit of destination
BSR <label> .B,.W SP – 4 → SP; next sequential PC→ (SP); PC + 2 + dn → PC
BTST Dy,<ea>x
#<data>,<ea-1>x
.B,.L
.B,.L
~(<bit number> of destination) → Z
CLR <ea>y,Dx .B,.W,.L 0 → destination
CMP <ea>y,Ax .L Destination – source
CMPA <ea>y,Dx .L Destination – source
CMPI <ea>y,Dx .L Destination – immediate data
DIVS <ea-1>y,Dx
<ea>y,Dx
.W
.L
Dx /<ea>y → Dx {16-bit remainder; 16-bit quotient}
Dx /<ea>y → Dx {32-bit quotient}
Signed operation
DIVU <ea-1>y,Dx
Dy,<ea>x
.W
.L
Dx /<ea>y → Dx {16-bit remainder; 16-bit quotient}
Dx /<ea>y → Dx {32-bit quotient}
Unsigned operation
EOR Dy,<ea>x .L Source ^ destination → destination
EORI #<data>,Dx .L Immediate data ^ destination → destination
EXT #<data>,Dx .B →.W
.W →.L
Sign-extended destination → destination
EXTB Dx .B →.L Sign-extended destination → destination
HALT1None Unsized Enter halted state
JMP <ea-3>y Unsized Address of <ea> → PC
JSR <ea-3>y Unsized SP – 4 → SP; next sequential PC → (SP); <ea> → PC
LEA <ea-3>y,Ax .L <ea> → Ax
LINK Ax,#<d16> .W SP – 4 → SP; Ax → (SP); SP → Ax; SP + d16 → SP
LSL Dy,Dx
#<data>,Dx
.L
.L
X/C ← (Dx << Dy) ← 0
X/C ← (Dx << #<data>) ← 0
LSR Dy,Dx
#<data>,Dx
.L
.L
0 → (Dx >> Dy) → X/C
0 → (Dx >> #<data>) → X/C
MAC Ry,RxSF .L + (.W × .W) → .L
.L + (.L × .L) → .L
ACC + (Ry × Rx){<< 1 | >> 1} → ACC
ACC + (Ry × Rx){<< 1 | >> 1} → ACC; (<ea>y{&MASK}) →
Rw
MACL Ry,RxSF,<ea-1>y,Rw .L + (.W × .W) → .L, .L
.L + (.L × .L) → .L, .L
ACC + (Ry × Rx){<< 1 | >> 1} → ACC
ACC + (Ry × Rx){<< 1 | >> 1} → ACC; (<ea-1>y{&MASK}) →
Rw
MOVE <ea>y,<ea>x .B,.W,.L <ea>y → <ea>x
Table 2-7. User-Mode Instruction Set Summary (continued)
Instruction Operand Syntax Operand Size Operation
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MOVE from
MAC
MASK,Rx
ACC,Rx
MACSR,Rx
.L Rm → Rx
MACSR,CCR .L MACSR → CCR
MOVE to
MAC
Ry,ACC
Ry,MACSR
Ry,MASK
.L Ry → Rm
#<data>,ACC
#<data>,MACSR
#<data>,MASK
.L #<data> → Rm
MOVE from
CCR
CCR,Dx .W CCR → Dx
MOVE to
CCR
Dy,CCR
#<data>,CCR
.B Dy → CCR
#<data> → CCR
MOVEA <ea>y,Ax .W,.L → .L Source → destination
MOVEM #<list>,<ea-2>x
<ea-2>y,#<list>
.L
.L
Listed registers → destination
Source → listed registers
MOVEQ #<data>,Dx .B → .L Sign-extended immediate data → destination
MSAC Ry,RxSF .L - (.W × .W) → .L
.L - (.L × .L) → .L
ACC – (Ry × Rx){<< 1 | >> 1} → ACC
MSACL Ry,RxSF,<ea-1>y,Rw .L - (.W × .W) → .L, .L
.L - (.L × .L) → .L, .L
ACC – (Ry × Rx){<< 1 | >> 1} → ACC;
(<ea-1>y{&MASK}) → Rw
MULS <ea>y,Dx .W X .W → .L
.L X .L → .L
Source × destination → destination
Signed operation
MULU <ea>y,Dx .W X .W → .L
.L X .L → .L
Source × destination → destination
Unsigned operation
NEG Dx .L 0 – destination → destination
NEGX Dx .L 0 – destination – X → destination
NOP none Unsized Synchronize pipelines; PC + 2 → PC
NOT Dx .L ~ Destination → destination
OR <ea>y,Dx
Dy,<ea>x
.L Source | destination → destination
ORI #<data>,Dx .L Immediate data | destination → destination
PEA <ea-3>y .L SP – 4 → SP; Address of <ea> → (SP)
PULSE none Unsized Set PST= 0x4
REMS <ea-1>,Dx .L Dx/<ea>y → Dw {32-bit remainder}
Signed operation
REMU <ea-1>,Dx .L Dx/<ea>y → Dw {32-bit remainder}
Unsigned operation
RTS none Unsized (SP) → PC; SP + 4 → SP
Scc Dx .B If condition true, then 1s ⎯ destination;
Else 0s → destination
Table 2-7. User-Mode Instruction Set Summary (continued)
Instruction Operand Syntax Operand Size Operation
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Table 2-8 describes supervisor-mode instructions.
SUB <ea>y,Dx
Dy,<ea>x
.L
.L
Destination – source → destination
SUBA <ea>y,Ax .L Destination – source → destination
SUBI #<data>,Dx .L Destination – immediate data → destination
SUBQ #<data>,<ea>x .L Destination – immediate data → destination
SUBX Dy,Dx .L Destination – source – X → destination
SWAP Dx .W MSW of Dx ←→ LSW of Dx
TRAP #<vector> Unsized SP – 4 → SP;PC → (SP);
SP – 2 → SP;SR → (SP);
SP – 2 → SP; format → (SP);
Vector address → PC
TRAPF None
#<data>
Unsized
.W
.L
PC + 2 → PC
PC + 4 → PC
PC + 6 → PC
TST <ea>y .B,.W,.L Set condition codes
UNLK Ax Unsized Ax →SP; (SP) → Ax; SP + 4 → SP
WDDATA <ea>y .B,.W,.L <ea>y →DDATA port
1By default the HALT instruction is a supervisor-mode instruction; however, it can be configured to allow user-mode execution
by setting CSR[UHE].
Table 2-8. Supervisor-Mode Instruction Set Summary
Instruction Operand Syntax Operand Size Operation
CPUSHL (bc),(Ax) Unsized Invalidate instruction cache line
HALT1
1The HALT instruction can be configured to allow user-mode execution by setting CSR[UHE].
none Unsized Enter halted state
MOVE from SR SR, Dx .W SR → Dx
MOVE to SR Dy,SR
#<data>,SR
.W Source → SR
MOVEC Ry,Rc .L Ry → Rc
Rc Register Definition
0x002 Cache control register (CACR)
0x004 Access control register 0 (ACR0)
0x005 Access control register 1 (ACR1)
0x801 Vector base register (VBR)
0xC00 ROM base address register (ROMBAR)
0xC04 RAM base address register (RAMBAR)
0xC0F Module base address register (MBAR)
RTE None Unsized (SP+2) → SR; SP+4 → SP; (SP) → PC; SP + formatfield ⎯ SP
STOP #<data> .W Immediate data → SR; enter stopped state
WDEBUG <ea-2>y .L <ea-2>y → debug module
Table 2-7. User-Mode Instruction Set Summary (continued)
Instruction Operand Syntax Operand Size Operation
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2.7 Instruction Timing
The timing data presented in this section assumes the following:
• The OEP is loaded with the opword and all required extension words at the beginning of each
instruction execution. This implies that the OEP spends no time waiting for the IFP to supply
opwords and/or extension words.
• The OEP experiences no sequence-related pipeline stalls. For the MCF5272,the most common
example of this type of stall involves consecutive store operations, excluding the MOVEM
instruction. For all store operations (except MOVEM), certain hardware resources within the
processor are marked as busy for two clock cycles after the final DSOC cycle of the store
instruction. If a subsequent store instruction is encountered within this two-cycle window, it is
stalled until the resource again becomes available. Thus, the maximum pipeline stall involving
consecutive store operations is two cycles.
• The OEP can complete all memory accesses without memory causing any stall conditions. Thus,
timing details in this section assume an infinite zero-wait state memory attached to the core.
• All operand data accesses are assumed to be aligned on the same byte boundary as the operand size:
— 16-bit operands aligned on 0-modulo-2 addresses
— 32-bit operands aligned on 0-modulo-4 addresses
Operands that do not meet these guidelines are misaligned. Table 2-9 shows how the core
decomposes a misaligned operand reference into a series of aligned accesses.
Table 2-9. Misaligned Operand References
A[1:0] Size Bus Operations Additional C(R/W) 1
1Each timing entry is presented as C(r/w), described as follows:
C is the number of processor clock cycles, including all applicable operand fetches and writes, as
well as all internal core cycles required to complete the instruction execution.
r/w is the number of operand reads (r) and writes (w) required by the instruction. An operation
performing a read-modify write function is denoted as (1/1).
x1 Word Byte, Byte 2(1/0) if read
1(0/1) if write
x1 Long Byte, Word, Byte 3(2/0) if read
2(0/2) if write
10 Long Word, Word 2(1/0) if read
1(0/1) if write
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2.7.1 MOVE Instruction Execution Times
The execution times for the MOVE.{B,W,L} instructions are shown in the next tables. Table 2-12 shows
the timing for the other generic move operations.
NOTE
For all tables in this section, the execution time of any instruction using the
PC-relative effective addressing modes is equivalent to the time using
comparable An-relative mode.
ET with {<ea> = (d16,PC)} equals ET with {<ea> = (d16,An)}
ET with {<ea> = (d8,PC,Xi*SF)} equals ET with {<ea> = (d8,An,Xi*SF)}
The nomenclature “(xxx).wl” refers to both forms of absolute addressing,
(xxx).w and (xxx).l.
Table 2-10 lists execution times for MOVE.{B,W} instructions.
Table 2-10. Move Byte and Word Execution Times
Source
Destination
Rx (Ax) (Ax)+ –(Ax) (d16,Ax) (d8,Ax,Xi*SF) (xxx).wl
Dy 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1)
Ay 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1)
(Ay) 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1)
(Ay)+ 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1)
–(Ay) 3(1/0) 31/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1)
(d16,Ay) 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) — —
(d8,Ay,Xi*SF) 4(1/0) 4(1/1) 4(1/1) 4(1/1) — — —
(xxx).w 3(1/0) 3(1/1) 3(1/1) 3(1/1) — — —
(xxx).l 3(1/0) 3(1/1) 3(1/1) 3(1/1) — — —
(d16,PC) 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) — —
(d8,PC,Xi*SF) 4(1/0) 4(1/1) 4(1/1) 4(1/1) — — —
#<xxx> 1(0/0) 3(0/1) 3(0/1) 3(0/1) — — —
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Table 2-11 lists timings for MOVE.L.
Table 2-12 gives execution times for MOVE.L instructions accessing program-visible registers of the
MAC unit, along with other MOVE.L timings. Execution times for moving contents of the ACC or
MACSR into a destination location represent the best-case scenario when the store instruction is executed
and no load, MAC, or MSAC instructions are in the MAC execution pipeline. In general, these store
operations require only one cycle for execution, but if they are preceded immediately by a load, MAC, or
MSAC instruction, the MAC pipeline depth is exposed and execution time is three cycles.
Table 2-11. Move Long Execution Times
Source
Destination
Rx (Ax) (Ax)+ –(Ax) (d16,Ax) (d8,Ax,Xi*SF) (xxx).wl
Dy 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1)
Ay 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1)
(Ay) 2(1/0) 2(1/1) 2(1/1) 2(1/1) 2(1/1) 3(1/1) 2(1/1)
(Ay)+ 2(1/0) 2(1/1) 2(1/1) 2(1/1) 2(1/1) 3(1/1) 2(1/1)
–(Ay) 2(1/0) 2(1/1) 2(1/1) 2(1/1) 2(1/1) 3(1/1) 2(1/1)
(d16,Ay) 2(1/0) 2(1/1) 2(1/1) 2(1/1) 2(1/1) — —
(d8,Ay,Xi*SF) 3(1/0) 3(1/1) 3(1/1) 3(1/1) — — —
(xxx).w 2(1/0) 2(1/1) 2(1/1) 2(1/1) — — —
(xxx).l 2(1/0) 2(1/1) 2(1/1) 2(1/1) — — —
(d16,PC) 2(1/0) 2(1/1) 2(1/1) 2(1/1) 2(1/1) — —
(d8,PC,Xi*SF) 3(1/0) 3(1/1) 3(1/1) 3(1/1) — — —
#<xxx> 1(0/0) 2(0/1) 2(0/1) 2(0/1) — — —
Table 2-12. Move Execution Times
Opcode <ea>
Effective Address
Rn (An) (An)+ –(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
move.l <ea>,ACC 1(0/0) — — — — — — 1(0/0)
move.l <ea>,MACSR 2(0/0) — — — — — — 2(0/0)
move.l <ea>,MASK 1(0/0) — — — — — — 1(0/0)
move.l ACC,Rx 1(0/0) — — — — — — —
move.l MACSR,CCR 1(0/0) — — — — — — —
move.l MACSR,Rx 1(0/0) — — — — — — —
move.l MASK,Rx 1(0/0) — — — — — — —
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2.7.2 Execution Timings—One-Operand Instructions
Table 2-13 shows standard timings for single-operand instructions.
2.7.3 Execution Timings—Two-Operand Instructions
Table 2-14 shows standard timings for two-operand instructions.
Table 2-13. One-Operand Instruction Execution Times
Opcode <ea>
Effective Address
Rn (An) (An)+ -(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #xxx
clr.b <ea> 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) —
clr.w <ea> 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) —
clr.l <ea> 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) —
ext.w Dx 1(0/0) — — — — — — —
ext.l Dx 1(0/0) — — — — — — —
extb.l Dx 1(0/0) — — — — — — —
neg.l Dx 1(0/0) — — — — — — —
negx.l Dx 1(0/0) — — — — — — —
not.l Dx 1(0/0) — — — — — — —
scc Dx 1(0/0) — — — — — — —
swap Dx 1(0/0) — — — — — — —
tst.b <ea> 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0)
tst.w <ea> 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0)
tst.l <ea> 1(0/0) 2(1/0) 2(1/0) 2(1/0) 2(1/0) 3(1/0) 2(1/0) 1(0/0)
Table 2-14. Two-Operand Instruction Execution Times
Opcode <ea>
Effective Address
Rn (An) (An)+ –(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
add.l <ea>,Rx 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0)
add.l Dy,<ea> — 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) —
addi.l #imm,Dx 1(0/0) — — — — — — —
addq.l #imm,<ea> 1(0/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) —
addx.l Dy,Dx 1(0/0) — — — — — — —
and.l <ea>,Rx 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0)
and.l Dy,<ea> — 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) —
andi.l #imm,Dx 1(0/0) — — — — — — —
asl.l <ea>,Dx 1(0/0) — — — — — — 1(0/0)
asr.l <ea>,Dx 1(0/0) — — — — — — 1(0/0)
bchg Dy,<ea> 2(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) —
bchg #imm,<ea> 2(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) — — —
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bclr Dy,<ea> 2(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) —
bclr #imm,<ea> 2(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) — — —
bset Dy,<ea> 2(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) —
bset #imm,<ea> 2(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) — — —
btst Dy,<ea> 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) —
btst #imm,<ea> 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) — — —
cmp.l <ea>,Rx 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0)
cmpi.l #imm,Dx 1(0/0) — — — — — — —
divs.w <ea>,Dx 20(0/0) 23(1/0) 23(1/0) 23(1/0) 23(1/0) 24(1/0) 23(1/0) 20(0/0)
divu.w <ea>,Dx 20(0/0) 23(1/0) 23(1/0) 23(1/0) 23(1/0) 24(1/0) 23(1/0) 20(0/0)
divs.l <ea>,Dx 35(0/0) 38(1/0) 38(1/0) 38(1/0) 38(1/0) — — —
divu.l <ea>,Dx 35(0/0) 38(1/0) 38(1/0) 38(1/0) 38(1/0) — — —
eor.l Dy,<ea> 1(0/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) —
eori.l #imm,Dx 1(0/0) — — — — — — —
lea <ea>,Ax — 1(0/0) — — 1(0/0) 2(0/0) 1(0/0) —
lsl.l <ea>,Dx 1(0/0) — — — — — — 1(0/0)
lsr.l <ea>,Dx 1(0/0) — — — — — — 1(0/0)
mac.w Ry,Rx 1(0/0) — — — — — — —
mac.l Ry,Rx 3(0/0) — — — — — — —
msac.w Ry,Rx 1(0/0) — — — — — — —
msac.l Ry,Rx 3(0/0) — — — — — — —
mac.w Ry,Rx,ea,Rw — 3(1/0) 3(1/0) 3(1/0) 3(1/0) — — —
mac.l Ry,Rx,ea,Rw — 5(1/0) 5(1/0) 5(1/0) 5(1/0) — — —
moveq #imm,Dx — — — — — — — 1(0/0)
msac.w Ry,Rx,ea,Rw — 3(1/0) 3(1/0) 3(1/0) 3(1/0) — — —
msac.l Ry,Rx,ea,Rw — 5(1/0) 5(1/0) 5(1/0) 5(1/0) — — —
muls.w <ea>,Dx 4(0/0) 6(1/0) 6(1/0) 6(1/0) 6(1/0) 7(1/0) 6(1/0) 4(0/0)
mulu.w <ea>,Dx 4(0/0) 6(1/0) 6(1/0) 6(1/0) 6(1/0) 8(1/0) 6(1/0) 4(0/0)
muls.l <ea>,Dx 6(0/0) 8(1/0) 8(1/0) 8(1/0) 8(1/0) — — —
mulu.l <ea>,Dx 6(0/0) 8(1/0) 8(1/0) 8(1/0) 8(1/0) — — —
or.l <ea>,Rx 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0)
or.l Dy,<ea> — 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) —
or.l #imm,Dx 1(0/0) — — — — — — —
rems.l <ea>,Dx 35(0/0) 38(1/0) 38(1/0) 38(1/0) 38(1/0) — — —
remu.l <ea>,Dx 35(0/0) 38(1/0) 38(1/0) 38(1/0) 38(1/0) — — —
sub.l <ea>,Rx 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0)
Table 2-14. Two-Operand Instruction Execution Times (continued)
Opcode <ea>
Effective Address
Rn (An) (An)+ –(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
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2.7.4 Miscellaneous Instruction Execution Times
Table 2-15 lists timings for miscellaneous instructions.
sub.l Dy,<ea> — 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) —
subi.l #imm,Dx 1(0/0) — — — — — — —
subq.l #imm,<ea> 1(0/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) —
subx.l Dy,Dx 1(0/0) — — — — — — —
Table 2-15. Miscellaneous Instruction Execution Times
Opcode <ea>
Effective Address
Rn (An) (An)+ –(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
cpushl (Ax) — 11(0/1) — — — — — —
link.w Ay,#imm 2(0/1) — — — — — — —
move.w CCR,Dx 1(0/0) — — — — — — —
move.w <ea>,CCR 1(0/0) — — — — — — 1(0/0)
move.w SR,Dx 1(0/0) — — — — — — —
move.w <ea>,SR 7(0/0) — — — — — — 7(0/0)
movec Ry,Rc 9(0/1) — — — — — — —
movem.l 1
1n is the number of registers moved by the MOVEM opcode.
<ea>,&list — 1+n(n/0) — — 1+n(n/0) — — —
movem.l &list,<ea> — 1+n(0/n) — — 1+n(0/n) — — —
nop 3(0/0) — — — — — — —
pea <ea> — 2(0/1) — — 2(0/1)2
2PEA execution times are the same for (d16,PC).
3(0/1)3
3PEA execution times are the same for (d8,PC,Xi*SF).
2(0/1) —
pulse 1(0/0) — — — — — — —
stop #imm — — — — — — — 3(0/0)4
4The execution time for STOP is the time required until the processor begins sampling continuously for interrupts.
trap #imm — — — — — — — 15(1/2)
trapf 1(0/0) — — — — — — —
trapf.w 1(0/0) — — — — — — —
trapf.l 1(0/0) — — — — — — —
unlk Ax 2(1/0) — — — — — — —
wddata.l <ea> — 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) —
wdebug.l <ea> — 5(2/0) — — 5(2/0) — — —
Table 2-14. Two-Operand Instruction Execution Times (continued)
Opcode <ea>
Effective Address
Rn (An) (An)+ –(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
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2.7.5 Branch Instruction Execution Times
Table 2-16 shows general branch instruction timing.
Table 2-17 shows timing for Bcc instructions.
2.8 Exception Processing Overview
Exception processing for ColdFire processors is streamlined for performance. Differences from previous
M68000 family processors include the following:
• A simplified exception vector table
• Reduced relocation capabilities using the vector base register
• A single exception stack frame format
• Use of a single, self-aligning system stack pointer
ColdFire processors use an instruction restart exception model but require more software support to
recover from certain access errors. See Table 2-18 for details.
Exception processing can be defined as the time from the detection of the fault condition until the fetch of
the first handler instruction has been initiated. It is comprised of the following four major steps:
1. The processor makes an internal copy of the SR and then enters supervisor mode by setting SR[S]
and disabling trace mode by clearing SR[T]. The occurrence of an interrupt exception also forces
SR[M] to be cleared and the interrupt priority mask to be set to the level of the current interrupt
request.
2. The processor determines the exception vector number. For all faults except interrupts, the
processor performs this calculation based on the exception type. For interrupts, the processor
performs an interrupt-acknowledge (IACK) bus cycle to obtain the vector number from a
peripheral device. The IACK cycle is mapped to a special acknowledge address space with the
interrupt level encoded in the address.
Table 2-16. General Branch Instruction Execution Times
Opcode <ea>
Effective Address
Rn (An) (An)+ –(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx>
bra — — — — 2(0/1) — — —
bsr — — — — 3(0/1) — — —
jmp <ea> — 3(0/0) — — 3(0/0) 4(0/0) 3(0/0) —
jsr <ea> — 3(0/1) — — 3(0/1) 4(0/1) 3(0/1) —
rte — — 10(2/0) — — — — —
rts — — 5(1/0) — — — — —
Table 2-17. Bcc Instruction Execution Times
Opcode Forward Taken Forward Not Taken Backward Taken Backward Not Taken
bcc 3(0/0) 1(0/0) 2(0/0) 3(0/0)
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3. The processor saves the current context by creating an exception s tack frame on the system stack.
ColdFire processors support a single stack pointer in the A7 address register; therefore, there is no
notion of separate supervisor and user stack pointers. As a result, the exception stack frame is
created at a 0-modulo-4 address on the top of the current system stack. Additionally, the processor
uses a simplified fixed-length stack frame for all exceptions. The exception type determines
whether the program counter in the exception stack frame defines the address of the faulting
instruction (fault) or of the next instruction to be executed (next).
4. The processor acquires the address of the first instruction of the exception handler. The exception
vector table is aligned on a 1-Mbyte boundary. This instruction address is obtained by fetching a
value from the table at the address defined in the vector base register. The index into the exception
table is calculated as 4 x vector_number. When the index value is generated, the vector table
contents determine the address of the first instruction of the desired handler. After the fetch of the
first opcode of the handler is initiated, exception processing terminates and normal instruction
processing continues in the handler.
ColdFire processors support a 1024-byte vector table aligned on any 1-Mbyte address boundary; see
Table 2-18. The table contains 256 exception vectors where the first 64 are defined by Freescale; the
remaining 192 are user-defined interrupt vectors.
Table 2-18. Exception Vector Assignments
Vector
Numbers
Vector Offset
(Hex)
Stacked
Program Counter 1Assignment
0 000 — Initial stack pointer
1 004 — Initial program counter
2 008 Fault Access error
3 00C Fault Address error
4 010 Fault Illegal instruction
5 014 Fault Divide by zero
6–7 018–01C — Reserved
8 020 Fault Privilege violation
9 024 Next Trace
10 028 Fault Unimplemented line-a opcode
11 02C Fault Unimplemented line-f opcode
12 030 Next Debug interrupt
13 034 — Reserved
14 038 Fault Format error
15 03C Next Uninitialized interrupt
16–23 040–05C — Reserved
24 060 Next Spurious interrupt
25–31 064–07C Next Level 1–7 autovectored interrupts
32–47 080–0BC Next Trap #0–15 instructions
48–60 0C0–0F0 — Reserved
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ColdFire processors inhibit sampling for interrupts during the first instruction of all exception handlers.
This allows any handler to effectively disable interrupts, if necessary, by raising the interrupt mask level
contained in the status register.
2.8.1 Exception Stack Frame Definition
The exception stack frame is shown in Figure 2-10. The first longword of the exception stack frame
contains the 16-bit format/vector word (F/V) and the 16-bit status register. The second longword contains
the 32-bit program counter address.
The 16-bit format/vector word contains three unique fields:
• Format field—This 4-bit field at the top of the system stack is always written with a value of
{4,5,6,7} by the processor indicating a 2-longword frame format. See Table 2-19. This field
records any longword misalignment of the stack pointer that may have existed when the exception
occurred.
• Fault status field—The 4-bit field, FS[3–0], at the top of the system stack is defined for access and
address errors along with interrupted debug service routines. See Table 2-20.
61 0F4 Fault Unsupported instruction
62–63 0F8–0FC — Reserved
64–255 100–3FC Next User-defined interrupts
1The term ‘fault’ refers to the PC of the instruction that caused the exception. The term ‘next’ refers to the PC
of the instruction that immediately follows the instruction that caused the fault.
31 28 27 26 25 18 17 16 15 0
A7→Format FS[3–2] Vector[7–0] FS[1–0] Status Register
+ 0x04 Program Counter [31–0]
Figure 2-10. Exception Stack Frame Form
Table 2-19. Format Field Encoding
Original A7 at Time of
Exception, Bits 1–0
A7 at First Instruction of
Handler
Format Field Bits
31–28
00 Original A[7–8] 0100
01 Original A[7–9] 0101
10 Original A[7–10] 0110
11 Original A[7–11] 0111
Table 2-18. Exception Vector Assignments (continued)
Vector
Numbers
Vector Offset
(Hex)
Stacked
Program Counter 1Assignment
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• Vector number—This 8-bit field, vector[7–0], defines the exception type. It is calculated by the
processor for internal faults and is supplied by the peripheral for interrupts. See Table 2-18.
2.8.2 Processor Exceptions
Table 2-21 describes MCF5272 exceptions.
Table 2-20. Fault Status Encodings
FS[3–0] Definition
0000-001x Reserved
0100 Error on instruction fetch
0101–011x Reserved
1000 Error on operand write
1001 Attempted write to write-protected space
101x Reserved
1100 Error on operand read
1101–111x Reserved
Table 2-21. MCF5272 Exceptions
Exception Description
Access Error Caused by an error when accessing memory. For an access error on an instruction fetch, the processor
postpones the error reporting until the instruction at the faulted reference is executed. Thus, faults that occur
during instruction prefetches that are followed by a change of instruction flow do not generate an exception.
When the processor attempts to execute an instruction with a faulted opword or extension word, the access
error is signaled, and the instruction is aborted. For this type of exception, the programming model is not
altered by the faulted instruction.
If an access error occurs on an operand read, the processor immediately aborts the current instruction
execution and initiates exception processing. In this case, any address register changes caused by the
auto-addressing modes, (An)+ and -(An), have already occurred. In addition, if an access error occurs during
the execution of a MOVEM instruction loading from memory, registers updated before the fault occurs contain
the memory operand.
Due to the processor pipeline implementation, a write cycle may be decoupled from the execution of the
instruction causing the write. Thus, if an access error occurs on an operand write, the signaling of the error is
imprecise. Accordingly, the PC contained in the exception stack frame represents the location in the program
when the access error is signaled, not necessarily the instruction causing the fault. All programming model
updates associated with the write instruction are complete. The NOP instruction can be used to help identify
write access errors. A NOP is not executed until all previous operations, including any pending writes are
complete. Thus if any previous write terminates with an access error, it is guaranteed to be reported on the
NOP.
Address Error Caused by an attempted execution transferring control to an odd instruction address (that is, if bit 0 of the target
address is set), an attempted use of a word-sized index register (Xi.w) or a scale factor of 8 on an indexed
effective addressing mode, or attempted execution of an instruction with a full-format indexed addressing
mode.
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Illegal
Instruction
On Version 2 ColdFire implementations, only some illegal opcodes (0x0000 and 0x4AFC) are decoded and
generate an illegal instruction exception. Additionally, attempting to execute an illegal line A or line F opcode
generates unique exception types: vectors 10 and 11, respectively. If any other nonsupported opcode is
executed, the resulting operation is undefined.
ColdFire processors do not provide illegal instruction detection on extension words of any instruction, including
MOVEC. Attempting to execute an instruction with an illegal extension word causes undefined results.
Divide by Zero Attempted division by zero causes an exception (vector 5, offset = 0x014) except when the PC points to the
faulting instruction (DIVU, DIVS, REMU, REMS).
Privilege
Violation
Caused by attempted execution of a supervisor mode instruction while in user mode. The ColdFire
Programmer’s Reference Manual lists supervisor- and user-mode instructions.
Tra ce
Exception
ColdFire processors provide instruction-by-instruction tracing. While the processor is in trace mode
(SR[T] = 1), instruction completion signals a trace exception. This allows a debugger to monitor program
execution.
The only exception to this definition is the STOP instruction. If the processor is in trace mode, the instruction
before the STOP executes and then generates a trace exception. In the exception stack frame, the PC points
to the STOP opcode. When the trace handler is exited, the STOP instruction is executed, loading the SR with
the immediate operand from the instruction. The processor then generates a trace exception. The PC in the
exception stack frame points to the instruction after STOP, and the SR reflects the just-loaded value.
If the processor is not in trace mode and executes a STOP instruction where the immediate operand sets the
trace bit in the SR, hardware loads the SR and generates a trace exception. The PC in the exception stack
frame points to the instruction after STOP, and the SR reflects the just-loaded value. Because ColdFire
processors do not support hardware stacking of multiple exceptions, it is the responsibility of the operating
system to check for trace mode after processing other exception types. As an example, consider a TRAP
instruction executing in trace mode. The processor initiates the TRAP exception and passes control to the
corresponding handler. If the system requires that a trace exception be processed, the TRAP exception
handler must check for this condition (SR[15] in the exception stack frame asserted) and pass control to the
trace handler before returning from the original exception.
Debug
Interrupt
Caused by a hardware breakpoint register trigger. Rather than generating an IACK cycle, the processor
internally calculates the vector number (12). Additionally, the M bit and the interrupt priority mask fields of the
SR are unaffected by the interrupt. See Section 2.2.2.1, “Status Register (SR).”
RTE and
Format Error
Exceptions
When an RTE instruction executes, the processor first examines the 4-bit format field to validate the frame type.
For a ColdFire processor, any attempted execution of an RTE where the format is not equal to {4,5,6,7}
generates a format error. The exception stack frame for the format error is created without disturbing the
original exception frame and the stacked PC points to RTE.The selection of the format value provides limited
debug support for porting code from M68000 applications. On M68000 Family processors, the SR was at the
top of the stack. Bit 30 of the longword addressed by the system stack pointer is typically zero; so, attempting
an RTE using this old format generates a format error on a ColdFire processor.
If the format field defines a valid type, the processor does the following:
1 Reloads the SR operand.
2 Fetches the second longword operand.
3 Adjusts the stack pointer by adding the format value to the auto-incremented address after the first longword
fetch.
4 Transfers control to the instruction address defined by the second longword operand in the stack frame.
TRAP Executing TRAP always forces an exception and is useful for implementing system calls. The trap instruction
may be used to change from user to supervisor mode.
Table 2-21. MCF5272 Exceptions (continued)
Exception Description
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If a ColdFire processor encounters any type of fault during the exception processing of another fault, the
processor immediately halts execution with the catastrophic fault-on-fault condition. A reset is required to
force the processor to exit this halted state.
Interrupt
Exception
Interrupt exception processing, with interrupt recognition and vector fetching, includes uninitialized and
spurious interrupts as well as those where the requesting device supplies the 8-bit interrupt vector.
Reset
Exception
Asserting the reset input signal (RSTI) causes a reset exception. Reset has the highest exception priority; it
provides for system initialization and recovery from catastrophic failure. When assertion of RSTI is recognized,
current processing is aborted and cannot be recovered. The reset exception places the processor in supervisor
mode by setting SR[S] and disables tracing by clearing SR[T]. This exception also clears SR[M] and sets the
processor’s interrupt priority mask in the SR to the highest level (level 7). Next, the VBR is initialized to
0x0000_0000. Configuration registers controlling the operation of all processor-local memories (cache and
RAM modules on the MCF5272) are invalidated, disabling the memories.
Note: Other implementation-specific supervisor registers are also affected. Refer to each of the modules in this
manual for details on these registers.
If the processor is not halted and it has ownership of the bus, it initiates the reset exception by performing two
longword read bus cycles. The longword at address 0 is loaded into the stack pointer and the longword at
address 4 is loaded into the PC. After the initial instruction is fetched from memory, program execution begins
at the address in the PC. If an access error or address error occurs before the first instruction executes, the
processor enters the fault-on-fault halted state.
Table 2-21. MCF5272 Exceptions (continued)
Exception Description
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Chapter 3
Hardware Multiply/Accumulate (MAC) Unit
This chapter describes the MCF5272 multiply/accumulate (MAC) unit, which executes integer multiply,
multiply-accumulate, and miscellaneous register instructions. The MAC is integrated into the operand
execution pipeline (OEP).
3.1 Overview
The MAC unit provides hardware support for a limited set of digital signal processing (DSP) operations
used in embedded code, while supporting the integer multiply instructions in the ColdFire microprocessor
family.
The MAC unit provides signal processing capabilities for the MCF5272 in a variety of applications
including digital audio and servo control. Integrated as an execution unit in the processor’ s OEP, the MAC
unit implements a three-stage arithmetic pipeline optimized for 16 x 16 multiplies. Both 16- and 32-bit
input operands are supported by this design in addition to a full set of extensions for signed and unsigned
integers plus signed, fixed-point fractional input operands.
The MAC unit provides functionality in three related areas:
• Signed and unsigned integer multiplies
• Multiply-accumulate operations supporting signed, unsigned, and signed fractional operands
• Miscellaneous register operations
Each of the three areas of support is addressed in detail in the succeeding sections. Logic that supports this
functionality is contained in a MAC module, as shown in Figure 3-1.
Figure 3-1. ColdFire MAC Multiplication and Accumulation
X
+/-
Operand Y Operand X
Shift 0,1,-1
Accumulator
Hardware Multiply/Accumulate (MAC) Unit
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The MAC unit is tightly coupled to the OEP and features a three-stage execution pipeline. To minimize
silicon costs, the ColdFire MAC is optimized for 16 x 16 multiply instructions. The OEP can issue a
16 x 16 multiply with a 32-bit accumulation and fetch a 32-bit operand in the same cycle. A 32 x 32
multiply with a 32-bit accumulation takes three cycles before the next instruction can be issued. Figure 3-1
shows the basic functionality of the ColdFire MAC. A full set of instructions is provided for signed and
unsigned integers plus signed, fixed-point, fractional input operands.
The MAC unit is an extension of the basic multiplier found on most microprocessors. It can perform
operations native to signal processing algorithms in an acceptable number of cycles, given the application
constraints. For example, small digital filters can tolerate some variance in the execution time of the
algorithm; larger , more complicated algorithms such as orthogonal transforms may have more demanding
speed requirements exceeding the scope of any processor architecture and requiring a fully developed DSP
implementation.
The M68000 architecture was not designed for high-speed signal processing, and a large DSP engine
would be excessive in an embedded environment. In striking a middle ground between speed, size, and
functionality, the ColdFire MAC unit is optimized for a small set of operations that involve multiplication
and cumulative additions. Specifically, the multiplier array is optimized for single-cycle, 16 x 16
multiplies producing a 32-bit result, with a possible accumulation cycle following. This is common in a
large portion of signal processing applications. In addition, the ColdFire core architecture has been
modified to allow for an operand fetch in parallel with a multiply, increasing overall performance for
certain DSP operations.
3.1.1 MAC Programming Model
Figure 3-2 shows the registers in the MAC portion of the user programming model.
Figure 3-2. MAC Programming Model
These registers are described as follows:
• Accumulator (ACC)—This 32-bit, read/write, general-purpose register is used to accumulate the
results of MAC operations.
• Mask register (MASK)—This 16-bit general-purpose register provides an optional address mask
for MAC instructions that fetch operands from memory. It is useful in the implementation of
circular queues in operand memory.
• MAC status register (MACSR)—This 8-bit register defines configuration of the MAC unit and
contains indicator flags affected by MAC instructions. Unless noted otherwise, the setting of
MACSR indicator flags is based on the final result, that is, the result of the final operation involving
the product and accumulator.
31 0
MACSR MAC status register
ACC MAC accumulator
MASK MAC mask register
Hardware Multiply/Accumulate (MAC) Unit
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3.1.2 General Operation
The MAC unit supports the ColdFire integer multiply instructions (MULS and MULU) and provides
additional functionality for multiply-accumulate operations. The added MA C instructions to the ColdFire
ISA provide for the multiplication of two numbers, followed by the addition or subtraction of this number
to or from the value contained in the accumulator. The product may be optionally shifted left or right one
bit before the addition or subtraction takes place. Hardware support for saturation arithmetic may be
enabled to minimize software overhead when dealing with potential overflow conditions using signed or
unsigned operands.
These MAC operations treat the operands as one of the following formats:
• Signed integers
• Unsigned integers
• Signed, fixed-point, fractional numbers
To maintain compactness, the MAC module is optimized for 16-bit multiplications. Two 16-bit operands
produce a 32-bit product. Longword operations are performed by reusing the 16-bit multiplier array at the
expense of a small amount of extra control logic. Again, the product of two 32-bit operands is a 32-bit
result. For longword integer operations, only the least significant 32 bits of the product are calculated. For
fractional operations, the entire 63-bit product is calculated and then either truncated or rounded to a 32-bit
result using the round-to-nearest (even) method.
Because the multiplier array is implemented in a 3-stage pipeline, MAC instructions can have an effective
issue rate of one clock for word operations, three for longword integer operations, and four for 32-bit
fractional operations. Arithmetic operations use register-based input operands, and summed values are
stored internally in the accumu lator. Thus, an additional MOVE instruction is necessary to store data in a
general-purpose register. MAC instructions can choose the upper or lower word of a register as the input,
which helps filtering operations in which one data register is loaded with input data and another is loaded
with coefficient data. Two 16-bit MAC operations can be performed without fetching additional operands
between instructions by alternating the word choice during the calculations.
The need to move larg e amounts of data quickly can limit throughput in DSP engines. However, data can
be moved efficiently by using the MOVEM instruction, which automatically generates line-sized burst
references and is ideal for filling registers quickly with input data, filter coefficients, and output data.
Loading an operand from memory into a register during a MAC operation makes some DSP operations,
especially filtering and convolution, more manageable.
The MACSR has a 4-bit operational mode field and three condition flags. The operational mode bits
control the overflow/saturation mode, whether operands are signed or unsigned, whether operands are
treated as integers or fractions, and how rounding is performed. Negative, zero, and overflow flags are also
provided.
The three program-visible MAC registers, a 32-bit accumulator (ACC), the MAC mask register (MASK),
and MACSR, are described in Section 3.1.1, “MAC Programming Model.”
Hardware Multiply/Accumulate (MAC) Unit
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3.1.3 MAC Instruction Set Summary
The MAC unit supports the integer multiply opera tions defined by the baseline ColdFire architecture and
the new multiply-accumulate instructions. Table 3-1 summarizes the MAC unit instruction set.
3.1.4 Data Representation
The MAC unit supports three basic operand types:
• Two’ s complement signed in teger: In this format, an N-bit operand represents a number within the
range -2(N-1) < operand < 2(N-1) - 1. The binary point is to the right of the least significant bit.
• Two’s complement unsigned integer: In this format, an N-bit operand represents a number within
the range 0 < operand < 2N - 1. The binary point is to the right of the least significant bit.
• T wo’ s complement, signed fractional: In an N-bit number, the first bit is the sign bit. The remaining
bits signify the first N-1 bits after the binary point. Given an N-bit number , aN-1aN-2aN-3... a2a1a0,
its value is given by the following formula:
This format can represent numbers in the range –1 < operand < 1 – 2(N-1).
For words and longwords, the greatest negative number that can be represented is –1, whose
internal representation is 0x8000 and 0x0x8000_0000, respectively. The most positive word is
0x7FFF or (1 - 2-15); the most positive longword is 0x7FFF_FFFF or (1 - 2-31).
3.2 MAC Instruction Execution Timings
For information on MAC instruction execution timings, refer to Section 2.7, “Instruction Timing.”
Table 3-1. MAC Instruction Summary
Instruction Mnemonic Description
Multiply Signed MULS <ea>y,Dx Multiplies two signed operands yielding a signed result
Multiply Unsigned MULU <ea>y,Dx Multiplies two unsigned operands yielding an unsigned result
Multiply Accumulate MAC Ry,RxSF
MSAC Ry,RxSF
Multiplies two operands, then adds or subtracts the product to/from
the accumulator
Multiply Accumulate with
Load
MAC Ry,RxSF,Rw
MSAC Ry,RxSF,Rw
Multiplies two operands, then adds or subtracts the product to/from
the accumulator while loading a register with the memory operand
Load Accumulator MOV.L {Ry,#imm},ACC Loads the accumulator with a 32-bit operand
Store Accumulator MOV.L ACC,Rx Writes the contents of the accumulator to a register
Load MACSR MOV.L {Ry,#imm},MACSR Writes a value to the MACSR
Store MACSR MOV.L MACSR,Rx Writes the contents of MACSR to a register
Store MACSR to CCR MOV.L MACSR,CCR Writes the contents of MACSR to the processor’s CCR register
Load MASK MOV.L {Ry,#imm},MASK Writes a value to MASK
Store MASK MOV.L MASK,Rx Writes the contents of MASK to a register
2i1N–+()
ai⋅
i0=
N2–
∑
+
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Chapter 4
Local Memory
This chapter describes the MCF5272 implementation of the ColdFire Version 2 core local memory
specification. It consists of the following sections.
•Section 4.3, “SRAM Overview,” and Section 4.4, “ROM Overview,” describe the on-chip static
RAM (SRAM) and ROM implementations. These chapters cover general operations,
configuration, and initialization. They also provide information and examples showing how to
minimize power consumption when using the ROM and SRAM.
•Section 4.5, “Instruction Cache Overview,” describes the cache implementation, including
organization, configuration, and coherency. It describes cache operations and how the cache
interfaces with other memory structures.
4.1 Interactions Between Local Memory Modules
Depending on configuration information, instruction fetches and data read accesses may be sent
simultaneously to the SRAM, ROM, and cache controllers. This approach is required because the
controllers are memory-mapped devices and the hit/miss determination is made concurrently with the read
data access. Power dissipation can be minimized by configuring the ROM and SRAM base address
registers (ROMBAR and RAMBAR) to mask unused address spaces whenever possible.
If the access address is mapped into the region defined by the SRAM (and this region is not masked), it
provides the data back to the processor and any cache or ROM data is discarded. If the access address does
not hit the SRAM, but is mapped into the region defined by the ROM (and this region is not masked), the
ROM provides the data back to the processor and any cache data is discarded. Accesses from the SRAM
and ROM modules are nev er cached. The complete definition of the processor’s local bus priority scheme
for read references is as follows:
if (SRAM “hits”)
SRAM supplies data to the processor
if (ROM “hits”)
ROM supplies data to the processor
else if (cache “hits”)
cache supplies data to the processor
else system memory reference to access
data
Local Memory
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4.2 Local Memory Registers
Table 4-1 lists the local memory registers. Note the following:
• Addresses not assigned to the register and undefined register bits are reserved. Write accesses to
these bits have no effect; read accesses return zeros.
• The reset value column indicates the r egister initial value at reset. Uninitialized fields may contain
random values after reset.
4.3 SRAM Overview
The SRAM module has the following features:
• 4-Kbyte SRAM, organized as 1K x 32 bits
• Single-cycle access
• Physically located on the ColdFire core's high-speed local bus
• Byte, word, longword address capabilities
• Programmable memory mapping
4.3.1 SRAM Operation
The SRAM module provides a general-purpose memory block the ColdFire core can access in a single
cycle. The location of the memory block can be set to any 4-Kbyte address boundary within the 4-Gbyte
address space. The memory is ideal for storing critical code or data structures or for use as the system stack.
Because the SRAM module is physically connected to the processor's high-speed local bus, it can quickly
service core-initiated accesses or memory-referencing commands from the debug module.
Section 4.1, “Interactions Between Local Memory Modules,” describes priorities when an access address
hits multiple local memory resources.
4.3.2 SRAM Programming Model
The MCF5272 implements the SRAM base address register (RAMBAR), shown in Figure 4-1 and
described in the following section.
Table 4-1. Memory Map of Instruction Cache Registers
Address
(using MOVEC) Name Width Description Reset Value
0x002 CACR 32 Cache control register 0x0000
0x004 ACR0 32 Access control register 0 0x0000
0x005 ACR1 32 Access control register 1 0x0000
0xC00 ROMBAR 32 ROM base address register Uninitialized (except V = 0)
0xC04 RAMBAR 32 SRAM base address register Uninitialized (except V = 0)
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4.3.2.1 SRAM Base Address Register (RAMBAR)
RAMBAR determines the base address location of the internal SRAM module, as well as the definition of
the types of accesses allowed for it.
• RAMBAR is a 32-bit write-only supervisor control register . It is accessed in the CPU address space
via the MOVEC instruction with an Rc encoding of 0xC04. RAMBAR can be read or written in
background debug mode (BDM). At system reset, the V bit is cleared and the remaining bits are
uninitialized. To access the SRAM module, RAMBAR must be written with the appropriate base
address after system reset.
• The SRAM base address register (RAMBAR) can be accessed only in supervisor mode using the
MOVEC instruction with an Rc value of 0xC04.
Figure 4-1. SRAM Base Address Register (RAMBAR)
RAMBAR fields are described in Table 4-2.
31 12 11 9 8 7 6 5 4 3 2 1 0
Field BA — WP — C/I SC SD UC UD V
Reset — 0
R/W W for CPU; R/W for debug
Address CPU space + 0xC04
Table 4-2. RAMBAR Field Description
Bits Name Description
31–12 BA Base address. SRAM module base address. The SRAM module occupies a 4-Kbyte space defined
by BA. SRAM can reside on any 4-Kbyte boundary in the 4-Gbyte address space.
11–9 — Reserved, should be cleared.
8 WP Write protect. Controls read/write properties of the SRAM.
0 Allows read and write accesses to the SRAM module.
1 Allows only read accesses to the SRAM module. Any attempted write reference generates an
access error exception to the ColdFire processor core.
7–6 — Reserved, should be cleared.
5–1 C/I,
SC,
SD,
UC, UD
Address space masks (ASn). These fields allow certain types of accesses to be masked, or inhibited
from accessing the SRAM module. These bits are useful for power management as described in
Section 4.3.2.3, “Programming RAMBAR for Power Management.” In particular, C/I is typically set.
The address space mask bits are follows:
C/I = CPU space/interrupt acknowledge cycle mask. Note that C/I must be set if BA = 0.
SC = Supervisor code address space mask
SD = Supervisor data address space mask
UC = User code address space mask
UD = User data address space mask
For each ASn bit:
0 An access to the SRAM module can occur for this address space
1 Disable this address space from the SRAM module. References to this address space cannot
access the SRAM module and are processed like other non-SRAM references.
0 V Valid. Enables/disables the SRAM module. V is cleared at reset.
0 RAMBAR contents are not valid.
1 RAMBAR contents are valid.
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The mapping of a given access into the SRAM uses the following algorithm to determine if the access hits
in the memory:
if (RAMBAR[0] = 1)
if (requested address[31:12] = RAMBAR[31:12])
if (address space mask of the requested type = 0)
Access is mapped to the SRAM module
if (access = read)
Read the SRAM and return the data
if (access = write)
if (RAMBAR[8] = 0)
Write the data into the SRAM
else Signal a write-protect access error
4.3.2.2 SRAM Initialization
After a hardware reset, the contents of the SRAM module are undefined. The valid bit of RAMBAR is
cleared, disabling the module. If the SRAM needs to be initialized with instructions or data, the following
steps should be performed:
1. Load RAMBAR, mapping the SRAM module to the desired location.
2. Read the source data and write it to the SRAM. Various instructions support this function,
including memory-to-memory MOVE instructions and the MOVEM opcode. The MOVEM
instruction is optimized to generate line-sized burst fetches on 0-modulo-16 addresses, so this
opcode generally provides the best performance.
3. After data is loaded into the SRAM, it may be appropriate to load a revised value into RAMBAR
with new write-protect and address space mask attributes. These attributes consist of the
write-protect and address-space mask fields.
The ColdFire processor or an external BDM emulator using the debug module can perform this
initialization.
4.3.2.3 Programming RAMBAR for Power Management
Depending on the configuration defined by RAMBAR, instruction fetch accesses can be sent to the SRAM
module, ROM module, and instruction cache simultaneously. If the access is mapped to the SRAM
module, it sources the read data, discarding the instruction cache access. If the SRAM is used only for data
operands, setting RAMBAR[SC,UC] lowers power dissipation by disabling the SRAM during all
instruction fetches. Additionally , if the SRAM holds only instructions, setting RAMBAR[SD,UD] reduces
power dissipation.
Consider the examples on Table 4-3 of typical RAMBAR settings:
Table 4-3. Examples of Typical RAMBAR Settings
Data Contained in SRAM RAMBAR[7–0]
Instructions only 0x2B
Data only 0x35
Both instructions and data 0x21
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ROMBAR can be configured similarly, as described in Section 4.4.2.2, “Programming ROMBAR for
Power Management.”
4.4 ROM Overview
The ROM modules has the following features:
• 16-Kbyte ROM, organized as 4K x 32 bits
• Contains data tables for soft HDLC (high-level data link control)
• The ROM contents are not customizeable
• Single-cycle access
• Physically located on ColdFire core's high-speed local bus
• Byte, word, longword address capabilities
• Programmable memory mapping
4.4.1 ROM Operation
The ROM module contains tabular data that the ColdFire core can access in a single cycle. The ROM can
be located on any 16-Kbyte address boundary in the 4-Gbyte address space. Section 4.1, “Interactions
Between Local Memory Modules,” describes priorities when a fetch address hits multiple local memory
resources.
4.4.2 ROM Programming Model
The MCF5272 implements the ROM base address register (ROMBAR), shown in Figure 4-2 and
described in the following section.
4.4.2.1 ROM Base Address Register (ROMBAR)
ROMBAR determines the base address location of the internal ROM module, as well as the definition of
the allowable access types. ROMBAR can be acces sed in supervisor mode using the MOVEC instruction
with an Rc value of 0xC00. It can also be read when the processor is in background debug mode (BDM).
To access the ROM module, ROMBAR should be initialized with the appropriate base address.
ROMBAR fields are described in Table 4-4.
31 1413 876543210
Field BA — — C/I SC SD UC UD V
Reset — 00 ————— 0
R/W W for CPU; R/W for debug
Address CPU space + 0xC00
Figure 4-2. ROM Base Address Register (ROMBAR)
Local Memory
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4.4.2.2 Programming ROMBAR for Power Management
Depending on the ROMBAR configuration, memory accesses can be sent to the ROM module and the
cache simultaneously. If an access hits both, the ROM module sources read data and the instruction cache
access is discarded. Because the ROM contains only for data, setting ROMBAR[SC,UC] lowers power
dissipation by disabling the ROM during instruction fetches.
Table 4-5 shows typical ROMBAR settings:
RAMBAR can be configured similarly, as described in Section 4.3.2.3, “Programming RAMBAR for
Power Management.”
Table 4-4. ROMBAR Field Description
Bits Name Description
31–14 BA Base address. Defines the ROM module base address. ROM can reside on any 16-Kbyte boundary in the
4-Gbyte address space.
13–6 — Reserved, should be cleared.
5–1 C/I, SC,
SD, UC,
UD
Address space masks (ASn). Allows specific address spaces to be enabled or disabled, placing internal
modules in a specific address space. If an address space is disabled, an access to the register in that
address space becomes an external bus access, and the module resource is not accessed. These bits are
useful for power management as described in Section 4.4.2.2, “Programming ROMBAR for Power
Management.” In particular, C/I is typically set.
The address space mask bits are follows:
C/I = CPU space/interrupt acknowledge cycle mask. Note that C/I must be set if BA = 0.
SC = Supervisor code address space mask
SD = Supervisor data address space mask
UC = User code address space mask
UD = User data address space mask
For each ASn bit:
0 An access to the ROM module can occur for this address space
1 Disable this address space from the ROM module. References to this address space cannot access the
ROM module and are processed like other non-ROM references.
0 V Valid. Indicates whether ROMBAR contents are valid. The BA value is not used and the ROM module is not
accessible until V is set.
0 Contents of ROMBAR are not valid.
1 Contents of ROMBAR are valid.
Table 4-5. Examples of Typical ROMBAR Settings
Data Contained In ROM ROMBAR[7–0]
Instructions only 0x2B
Data only 0x35
Both instructions and data 0x21
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4.5 Instruction Cache Overview
The features of the instruction cache are as follows:
• 1-Kbyte direct-mapped cache
• Single-cycle access on cache hits
• Physically located on ColdFire core's high-speed local bus
• Nonblocking design to maximize performance
• 16-byte line-fill buffer
• Configurable cache miss-fetch algorithm
4.5.1 Instruction Cache Physical Organization
The instruction cache, Figure 4-3, is a direct-mapped single-cycle memory, organized as 64 lines, each
containing 16 bytes. Memory consists of a 64-entry tag array (containing addresses and a valid bit) and a
1-Kbyte instruction data array, organized as 64 x 128 bits.
The two memory arrays are accessed in parallel: bits 9–4 of the instruction fetch address provide the index
into the tag array; bits 9–2 address the data array. The tag array outputs the address mapped to the given
cache location along with the valid bit for the line. This address field is compared to bits 31–10 of the
instruction fetch address from the local bus to determine if a cache hit in the memory array has occurred.
If the desired address is mapped into the cache memory, the output of the data array is driven onto the
ColdFire core's local data bus completing the access in a single cycle.
The tag array maintains a single valid bit per line entry. Accordingly, only entire 16-byte lines are loaded
into the instruction cache.
The instruction cache also contains a 16-byte fill buffer that provides temporary storage for the last line
fetched in response to a cache miss. With each instruction fetch, the contents of the line-fill buffer are
examined. Thus, each instruction fetch address examines both the tag memory array and the line-fill buffer
to see if the desired address is mapped into either hardware resource. A cache hit in either the memory
array or the line-fill buffer is serviced in a single cycle. Because the line-f ill buffer ma intains valid bits on
a longword basis, hits in the buffer can be serviced immediately without waiting for the entire line to be
fetched.
If the referenced address is not contained in the memo ry array or the line-fill buf fer, the instruction cache
initiates the required external fetch operation. In most situations, this is a 16-byte line-sized burst
reference.
Hardware is nonblocking, meaning the ColdFire core's local bus is released after the initial access of a
miss. Thus, the cache, SRAM, or ROM module can service subsequent requests while the rest of the line
is being fetched and loaded into the fill buffer.
Generally, longword references are used for sequential fetches. If the processor branches to an odd word
address, a word-sized fetch is generated. The memory array of the instruction cache is enabled only if
CACR[CENB] is asserted.
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Figure 4-3. Instruction Cache Block Diagram
4.5.2 Instruction Cache Operation
The instruction cache is physically connected to the ColdFire core's local bus, allowing it to service all
instruction fetches from the ColdFire core and certain memory fetches initiated by the debug module.
Typically, the debug module's memory references appear as supervisor data accesses but the unit can be
programmed to generate user-mode accesses and/or instruction fetches. The instruction cache processes
any instruction fetch access in the normal manner.
4.5.2.1 Interaction with Other Modules
Because both the instruction cache and high-speed SRAM module are connected to the ColdFire core's
local data bus, certain user -defined configurations can result in simultaneous instruction fetch processing.
If the referenced address is mapped into the SRAM module, that module services the request in a single
cycle. In this case, data accessed from the instruction cache is discarded without generating external
memory references. If the address is not mapped into SRAM space, the instruction cache handles the
request in the normal fashion.
4.5.2.2 Cache Coherency and Invalidation
The instruction cache does not monitor ColdFire co re data refe rences for accesses to cached instructions.
Therefore, software must maintain cache coherency by invalidating the appropriate cache entries after
modifying code segments.
31 9 43 012 31 4
=
31 9
31 0
63
31
0
0
Local Address Bus
Line Buffer
Address
External Data[31:0]
Line Buffer Data Storage
MUX
Data
Fill Hit
Tag
Valid
Local Data Bus
Tag Hit
=
MUX
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Cache invalidation can be performed in the two following ways:
• Setting CACR[CINVA] forces the entire instruction cache to be marked as invalid. The
invalidation operation requires 64 cycles because the cache sequences through the entire tag array,
clearing a single location each cycle. Any subsequent instruction fetch accesses are postponed until
the invalidation sequence is complete.
• The privileged CPUSHL instruction can invalidate a single cache line. When this instruction is
executed, the cache entry defined by bits 9–4 of the source address register is invalidated, provided
CACR[CDPI] is cleared.
These invalidation operations can be initiated from the ColdFire core or the debug module.
4.5.2.3 Caching Modes
For every memory reference generated by the processor or debug module, a set of effective attributes is
determined based on the address and the ACRs. Caching modes determine how the cache handles an
access. An access can be cacheable or cache-inhibited. For normal accesses, the ACRn[CM] bit
corresponding to the address of the access specifies the caching mode. If an address does not match an
ACR, the default caching mode is defined by CACR[DCM]. The specific algorithm is as follows:
if (address == ACR0-address including mask)
effective attributes = ACR0 attributes
else if (address == ACR1-address including mask)
effective attributes = ACR1 attributes
else effective attributes = CACR default attributes
Addresses matching an ACR can also be write protected using ACR[WP].
Reset disables the cache and clears all CACR bits. Reset does not automatically invalidate cac he entrie s;
they must be invalidated through software.
The ACRs allow CACR defaults to be overridden. In addition, some instructions (for example, CPUSHL)
and processor core operations perform accesses that have an implicit cac hing mode associated with them.
The following sections discuss the different caching accesses and their associated cache modes.
4.5.2.3.1 Cacheable Accesses
If ACRn[CM] or the default field of the CACR indicates the access is cacheable, a read access is read from
the cache if matching data is found. Otherwise, the data is read from memory and the cache is updated.
When a line is being read from memory, the longword in the line that contains the core-requested data is
loaded first and the requested data is given immediately to the processor, without waiting for the three
remaining longwords to reach the cache.
4.5.2.3.2 Cache-Inhibited Accesses
Memory regions can be designated as cache-inhibited, which is useful for memory containing targets such
as I/O devices and shared data structures in multiprocessing systems. Do not cache memory-mapped
registers (for example, registers shown with an MBAR offset). If the corresponding ACRn[CM] or
CACR[DCM] indicates cache-inhibited the access is cache-inhibited. The caching operation is identical
for both cache-inhibited modes, which differ only regarding recovery from an external bus error.
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In determining whether a memory location is cacheable or cache-inhibited, the CPU checks
memory-control registers using the following priority:
1. RAMBAR
2. ROMBAR
3. ACR0
4. ACR1
5. If an access does not hit in RAMBAR, ROMBAR, or the ACRs, the default is provided for all
accesses in CACR.
Cache-inhibited write accesses bypass the cache and a corresponding external write is performed.
Cache-inhibited reads bypass the cache and are performed on the external bus, except when all of the
following conditions are true:
• The cache-inhibited fill-buffer bit, CACR[CEIB], is set.
• The access is an instruction read.
• The access is normal (that is, TT = 0).
In this case, a fetched line is stored in the fill buffer and remains valid there; the cache can service
additional read accesses from this buf fer until another fill occurs or a cache-invalidate-all operation occurs.
If ACRn[CM] indicates cache-inhibited, the controller bypasses the cache and performs an external
transfer. To ensure the consistency of cached data, execute a CPUSHL instruction or set CACR[CINVA]
to invalidate the entire cache before switching cache modes.
CPU space-register accesses, such as MOVEC, are treated as cache-inhibited.
4.5.2.4 Reset
A hardware reset clears the CACR disabling the instruction cache.
NOTE
Tag array contents are not affected by reset. Accordingly, system startup
code must explicitly invalidate the cache by setting CACR[CINVA] before
the cache can be enabled.
4.5.2.5 Cache Miss Fetch Algorithm/Line Fills
As discussed in Section 4.5.1, “Instruction Cache Physical Or ganization,” the instruc tion cache hardware
includes a 16-byte line-fill buffer for providing temporary storage for the last fetched instruction.
W ith the cache enabled as defined by CACR[CENB], a cach eable instruction fetch that misses in both the
tag memory and the line-fill buffer generates an external fetch. The size of the external fetch is determined
by the value contained in CACR[CLNF] and the miss address. Table 4-8 shows the relationships between
the CLNF bits, the miss address, and the size of the external fetch.
Depending on the run-time characteristics of the application and the memory response speed, overall
performance may be increased by programming CLNF to values {00, 01}.
Local Memory
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For all cases of a line-sized fetch, the critical longword defined by miss address bits 3–2 is accessed first
followed by the remaining three longwords that are accessed by incrementing the longword address in
0-modulo-16 increments, as shown below:
if miss address[3:2] = 00
fetch sequence = {0x0, 0x4, 0x8, 0xC}
if miss address[3:2] = 01
fetch sequence = {0x4, 0x8, 0xC, 0x0}
if miss address[3:2] = 10
fetch sequence = {0x8, 0xC, 0x0, 0x4}
if miss address[3:2] = 11
fetch sequence = {0xC, 0x0, 0x4, 0x0x8}
When an external fetch is initiated and data is loaded into the line-fill buffer, the instruction cache
maintains a special most-recently-used indicator that tracks the contents of the fill buffer versus its
corresponding cache location. At the time of the miss, the hardware indicator is set, marking the fill buf fer
as most recently used. If a subsequent access occurs to the cache location defined by bits 9–4 of the fill
buffer address, the data in the cache memory array is now most-recently used, so the hardware indicator
is cleared. In all cases, the indicator defines whether the contents of the line-fill buffer or the cache memory
data array are most recently used. If the entire line is pres ent at the time of the next cache miss, the line-fill
buffer co ntents are written into the cache memory array and the fill buffer data is still most recently used
compared to the cache memory array.
The fill buffer can also be used as temporary storage for line-sized bursts of non-cacheable references
under control of CACR[CEIB]. With this bit set, a noncacheable instruction fetch is processed as defined
by Table 4-6. For this condition, the fill buffer is loaded and subsequent references can hit in the buffer,
but the data is never loaded into the cache memory array.
Table 4-6 shows the relationship between CENB, CEIB, and the type of instruction fetch.
Table 4-6. Instruction Cache Operation as Defined by CACR[CENB,CEIB]
CACR[CENB,CEIB] Type of Fetch Description
00 N/A Instruction cache and line-fill buffer are disabled; fetches are word or longword in
size.
01 N/A Instruction cache is disabled but because the line-fill buffer is enabled, CACR[CLNF]
defines fetch size and instructions can be bursted into the line-fill buffer.
1X Cacheable Cache is enabled; CACR[CLNF] defines fetch size and line-fill buffer contents can be
written into the cache memory array.
10 Noncacheable Cache is enabled but the linefill buffer is disabled; fetches are either word or
longword and are not loaded into the line-fill buffer.
11 Noncacheable Cache and line buffer are enabled; CACR[CLNF] defines fetch size; fetches are
loaded into the line-fill buffer but never into the cache memory array.
Local Memory
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4.5.3 Instruction Cache Programming Model
Three supervisor registers define the operation of the instruction cache and local bus controller: the cache
control register (CACR) and two access control registers (ACR0, ACR1). Table 4-7 shows the memory
map of the CACR and ACRs. These registers have the following characteristics:
• The CACR and ACRs can be accessed only in supervisor mode using the MOVEC instruction with
an Rc value of 0x002 (CACR), 0x004 (ACR0), and 0x005 (ACR1).
• Addresses not assigned to the registers and undefined register bits are reserved for future
expansion. Write accesses to these reserved address spaces and reserved register bits have no
effect; read accesses return zeros.
• The reset value column indicates the initial value of the register at reset. Uninitialized fields may
contain random values after reset.
• The access column indicates whether the corresponding register can be read, written or both.
Attempts to read a write-only register cause zeros to be returned. Attempts to write to a read -only
register are ignored.
4.5.3.1 Cache Control Register (CACR)
The CACR controls operation of the instruction cache. It provides a set of default memory access attributes
for when a reference address does not map into spaces d efined by the ACRs. The supervisor -level CACR
is accessed in the CPU address space using the MOVEC instruction with an Rc encoding of 0x002. The
CACR can be read or written when the processor is in background debug mode (BDM).
Table 4-7. Memory Map of Instruction Cache Registers
Address (using MOVEC) Name Width Description Reset Value
0x002 CACR 32 Cache control register 0x0000
0x004 ACR0 32 Access control register 0 0x0000
0x005 ACR1 32 Access control register 1 0x0000
31 30 29 28 27 26 25 24 23 16
Field CENB — CDPI CFRZ — CINVA —
Reset 0000_0000_0000_0000
R/W Write (R/W by debug module)
15 109 8 7654 210
Field — CEIB DCM DBWE — DWP — CLNF
Reset 0000_0000_0000_0000
R/W Write (R/W by debug module)
Rc 0x002
Figure 4-4. Cache Control Register (CACR)
Local Memory
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Table 4-8 describes CACR fields.
Table 4-8. CACR Field Descriptions
Bits Name Description
31 CENB Enable cache.
0 Cache disabled. The cache is not operational, but data and tags are preserved.
1 Cache enabled.
30–29 — Reserved, should be cleared.
28 CDPI Disable CPUSHL invalidation.
0 Cache disabled
1 Cache enabled
27 CFRZ Cache freeze. Allows the user to freeze the contents of the cache. When CFRZ is asserted line fetches
can be initiated and loaded into the line-fill buffer, but a valid cache entry can not be overwritten. If a given
cache location is invalid, the contents of the line-fill buffer can be written into the memory array while CFRZ
is asserted.
0 Normal operation
1 Freeze valid cache lines
26–25 — Reserved, should be cleared.
24 CINVA Cache invalidate all. Writing a 1 to this bit initiates entire cache invalidation. Note the caches are not
cleared on power-up or normal reset.
0 No invalidation is performed.
1 Initiate invalidation of the entire cache. The cache controller sequentially clears V in all sets.
Subsequent accesses stall until invalidation finishes, at which point, CINVA is automatically cleared.
This operation takes 64 clock cycles.
23–11 — Reserved, should be cleared.
10 CEIB Default noncacheable fill buffer. Determines if the fill buffer can store noncacheable accesses
0 Fill buffer not used to store noncacheable instruction accesses (16 or 32 bits).
1 Fill buffer used to store noncacheable accesses. The fill buffer is used only for normal (TT = 0)
instruction reads of a noncacheable region. Instructions are loaded into the fill buffer by a burst access
(same as a line fill). They stay in the buffer until they are displaced, so subsequent accesses may not
appear on the external bus.
Note that this feature can cause a coherency problem for self-modifying code. If CEIB = 1 and a
cache-inhibited access uses the fill buffer, instructions remain valid in the fill buffer until a
cache-invalidate-all instruction, another cache-inhibited burst, or a miss that initiates a fill.
9 DCM Default cache mode. See Section 4.5.2.3, “Caching Modes.”
0 Default cacheable
1 Default noncacheable
8 DBWE Default buffered write enable. Defines the default value for enabling buffered writes. Generally, enabled
buffered writes provide higher system performance but recovery from access errors can be more difficult.
For the ColdFire CPU, reporting access errors on operand writes is always imprecise and enabling
buffered writes simply further decouples the write instruction from the signaling of the fault
0 Termination of an operand write cycle on the processor's local bus is delayed until the external bus cycle
completes.
1 A local bus write cycle is terminated immediately and the operation buffered in the bus controller.
Operand write cycles are effectively decoupled between the processor's local bus and the external bus.
7–6 — Reserved, should be cleared.
5 DWP Default write protect.
0 Read and write accesses permitted
1 Write accesses not permitted
4–2 — Reserved, should be cleared.
Local Memory
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4.5.3.2 Access Control Registers (ACR0 and ACR1)
The ACRs define memory reference attributes for two memory regions (one per ACR). These attributes
affect every memory reference using the ACRs or the set of default attributes contained in the CACR.
ACRs are examined for each memory reference not mapped to the SRAM or ROM module. The
supervisor-level ACRs are accessed in the CPU address space using the MOVEC instruction with an Rc
encoding of 0x004 and 0x005. ACRs can be read and written in BDM mode.
Table 4-9 describes ACRn fields.
I
1–0 CLNF Control longword fetch. Controls the size of the memory request the cache issues to the bus controller for
different initial line access offsets.
CLNF Longword Address Bits
00 01 10 11
00 Line Line Line Longword
01 Line Line Longword Longword
1x Line Line Line Line
31 24 23 16 15 14 13 12 7 6 5 4 3 2 1 0
Field BA BAM EN SM — CM BWE — WP —
Reset 0000_0000_0000_0000
R/W Write (R/W by debug module)
Rc ACR0: 0x004; ACR1: 0x005
Figure 4-5. Access Control Register Format (ACRn)
Table 4-9. ACRn Field Descriptions
Bits Name Description
31–24 BA Base address. Compared with A[31:24]. Eligible addresses that match are assigned the access control
attributes of this register.
23–16 BAM Base address mask. Setting a BAM bit masks the corresponding BA bit. Setting low-order BAM bits can
define contiguous regions exceeding 16 Mbytes. BAM can define multiple noncontiguous regions.
15 EN Enable. Enables or disables the other ACRn bits.
0 Access control attributes disabled
1 Access control attributes enabled
14–13 SM Supervisor mode. Specifies whether only user or supervisor accesses are allowed in this address range or if
the type of access is a don’t care.
00 Match addresses only in user mode
01 Match addresses only in supervisor mode
1x Execute cache matching on all accesses
12–7 — Reserved; should be cleared.
Table 4-8. CACR Field Descriptions (continued)
Bits Name Description
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6 CM Cache mode. Defines whether the memory access is cacheable or noncacheable.
0 Caching enabled
1 Caching disabled
5 BWE Buffered write enable. Generally, the enabling of buffered writes provides higher system performance but
recovery from access errors may be more difficult. For the ColdFire CPU, reporting access errors on operand
writes is always imprecise; enabling buffered writes further decouples the write instruction from the signaling
of the fault.
0 Termination of an operand write cycle on the processor's local bus is delayed until the external bus cycle
is completed.
1 A write cycle on the local bus is terminated immediately and the operation is then buffered in the bus
controller. In this mode, operand write cycles are effectively decoupled between the processor's local bus
and the external bus.
4–3 — Reserved, should be cleared.
2 WP Write protect. Selects the write privilege of the memory region.
0 Read and write accesses permitted
1 Write accesses not permitted
1–0 — Reserved, should be cleared.
Table 4-9. ACRn Field Descriptions (continued)
Bits Name Description
Local Memory
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Chapter 5
Debug Support
This chapter describes the Revision A enhanced hardware debug support in the MCF5272.
5.1 Overview
The debug module is shown in Figure 5-1.
Figure 5-1. Processor/Debug Module Interface
Debug support is divided into three areas:
• Real-time trace support—The ability to determine the dynamic execution path through an
application is fundamental for debugging. The ColdFire solution implements an 8-bit parallel
output bus that reports processor execution status and data to an external emulator system. See
Section 5.3, “Real-Time Trace Support.”
• Background debug mode (BDM)—Provides low-level debugging in the ColdFire processor
complex. In BDM, the processor complex is halted and a variety of commands can be sent to the
processor to access memory and registers. The external emulator uses a three-pin, serial,
full-duplex channel. See Section 5.5, “Background Debug Mode (BDM),” and Section 5.4,
“Programming Model.”
• Real-time debug support—BDM requires the processor to be halted, which many real-time
embedded applications cannot do. Debug interrupts let real-time systems execute a unique service
routine that can quickly save the contents of key registers and variables and return the system to
normal operation. External development systems can access saved data because the hardware
supports concurrent operation of the processor and BDM-initiated commands. See Section 5.6,
“Real-Time Debug Support.”
ColdFire CPU Core
Debug Module
High-speed
Communication Port
DSCLK, DSI, DSO
Control
BKPT
local bus
Trace Port
Debug Support
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5.2 Signal Description
Table 5-1 describes debug module signals. All ColdFire debug signals are unidirectional and related to a
rising edge of the processor core’s clock signal. The standard 26-pin debug connector is shown in
Section 5.8, “Freescale-Recommended BDM Pinout.”
Figure 5-2 shows PSTCLK timing with respect to PST and DDATA.
Figure 5-2. PSTCLK Timing
Table 5-1. Debug Module Signals
Signal Description
Development Serial
Clock (DSCLK)
Internally synchronized input. (The logic level on DSCLK is validated if it has the same value on two
consecutive rising CLKIN edges.) Clocks the serial communication port to the debug module during
packet transfers. Maximum frequency is 1/5 the processor status clock (PSTCLK) speed. At the
synchronized rising edge of DSCLK, the data input on DSI is sampled and DSO changes state.
Development Serial
Input (DSI)
Internally synchronized input that provides data input for the serial communication port to the debug
module.
Development Serial
Output (DSO)
Provides serial output communication for debug module responses. DSO is registered internally.
Breakpoint (BKPT) Input used to request a manual breakpoint. Assertion of BKPT puts the processor into a halted state
after the current instruction completes. Halt status is reflected on processor status signals (PST[3:0]) as
the value 0xF.
Processor Status
Clock (PSTCLK)
Delayed version of the processor clock. Its rising edge appears in the center of valid PST and DDATA
output. See Figure 5-2. PSTCLK indicates when the development system should sample PST and
DDATA values.
Debug Data
(DDATA[3:0])
These output signals display the register breakpoint status as a default, or optionally, captured address
and operand values. The capturing of data values is controlled by the setting of the CSR. Additionally,
execution of the WDDATA instruction by the processor captures operands which are displayed on
DDATA. These signals are updated each processor cycle.
Processor Status
(PST[3:0])
These output signals report the processor status. Table 5-2 shows the encoding of these signals. These
outputs indicate the current status of the processor pipeline and, as a result, are not related to the
current bus transfer. The PST value is updated each processor cycle.
PSTCLK
PST or DDATA
Debug Support
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5.3 Real-Time Trace Support
Real-time trace, which defines the dynamic execution path, is a fundamental debug function. The ColdFire
solution is to include a parallel output port providing encoded processor status and data to an external
development system. This port is partitioned into two 4-bit nibbles: one nibble allows the processor to
transmit processor status, (PST), and the other allows operand data to be displayed (debug data, DDATA).
The processor status may not be related to the current bus transfer.
External development systems can use PST outputs with an external image of the program to completely
track the dynamic execution path. This tracking is complicated by any change in flow, especially when
branch target address calculation is based on the contents of a program-visible register (variant
addressing). DDATA outputs can be configured to display the target address of such instructions in
sequential nibble increments across multiple processor clock cycles, as described in Section 5.3.1, “Begin
Execution of T aken Branch (PST = 0x5).” T wo 32-bit storage elements form a FIFO buffer connecting the
processor’s high-speed local bus to the external development system through PST[3:0] and DDATA[3:0].
The buffer captures branch target addresses and certain data values for eventual display on the DDATA
port, one nibble at a time starting with the least significant bit (lsb).
Execution speed is affected only when both storage elements contain valid data to be dumped to the
DDATA port. The core stalls until one FIFO entry is available.
Table 5-2 shows the encoding of these signals.
Table 5-2. Processor Status Encoding
PST[3:0]
Definition
Hex Binary
0x0 0000 Continue execution. Many instructions execute in one processor cycle. If an instruction requires more clock
cycles, subsequent clock cycles are indicated by driving PST outputs with this encoding.
0x1 0001 Begin execution of one instruction. For most instructions, this encoding signals the first clock cycle of an
instruction’s execution. Certain change-of-flow opcodes, plus the PULSE and WDDATA instructions, generate
different encodings.
0x2 0010 Reserved
0x3 0011 Entry into user-mode. Signaled after execution of the instruction that caused the ColdFire processor to enter
user mode.
0x4 0100 Begin execution of PULSE and WDDATA instructions. PULSE defines logic analyzer triggers for debug and/or
performance analysis. WDDATA lets the core write any operand (byte, word, or longword) directly to the
DDATA port, independent of debug module configuration. When WDDATA is executed, a value of 0x4 is
signaled on the PST port, followed by the appropriate marker, and then the data transfer on the DDATA port.
Transfer length depends on the WDDATA operand size.
0x5 0101 Begin execution of taken branch. For some opcodes, a branch target address may be displayed on DDATA
depending on the CSR settings. CSR also controls the number of address bytes displayed, indicated by the
PST marker value preceding the DDATA nibble that begins the data output. See Section 5.3.1, “Begin
Execution of Taken Branch (PST = 0x5).”
0x6 0110 Reserved
0x7 0111 Begin execution of return from exception (RTE) instruction.
Debug Support
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5.3.1 Begin Execution of Taken Branch (PST = 0x5)
PST is 0x5 when a taken branch is executed. For some opcodes, a branch tar get address may be displayed
on DDATA depending on the CSR settings. CSR also controls the number of address bytes displayed,
which is indicated by the PST marker value immediately preceding the DDAT A nibble that begins the data
output.
Bytes are displayed in least-to-most-significant order. The processor captures only those targ et addresses
associated with taken branches which use a variant addressing mode, that is, RTE and RTS instructions,
JMP and JSR instructions using address register indirect or indexed addressing modes, and all exception
vectors.
The simplest example of a branch instruction using a variant address is the compiled code for a C language
case statement. Typically, the evaluation of this statement uses the variable of an expression as an index
into a table of offsets, where each offset points to a unique case within the structure. For such
change-of-flow operations, the MCF5272 uses the debug pins to output the following sequence of
information on successive processor clock cycles:
1. Use PST (0x5) to identify that a taken branch was executed.
2. Using the PST pins, optionally signal the target address to be displayed sequentially on the DDAT A
pins. Encodings 0x9–0xB identify the number of bytes displayed.
3. The new target address is optionally available on subsequent cycles using the DDATA port. The
number of bytes of the target address displayed on this port is configurable (2, 3, or 4 bytes).
0x8–
0xB
1000–
1011
Indicates the number of bytes to be displayed on the DDATA port on subsequent clock cycles. The value is
driven onto the PST port one PSTCLK cycle before the data is displayed on DDATA.
0x8 Begin 1-byte transfer on DDATA.
0x9 Begin 2-byte transfer on DDATA.
0xA Begin 3-byte transfer on DDATA.
0xB Begin 4-byte transfer on DDATA.
0xC 1100 Exception processing. Exceptions that enter emulation mode (debug interrupt or optionally trace) generate a
different encoding, as described below. Because the 0xC encoding defines a multiple-cycle mode, PST
outputs are driven with 0xC until exception processing completes.
0xD 1101 Entry into emulator mode. Displayed during emulation mode (debug interrupt or optionally trace). Because this
encoding defines a multiple-cycle mode, PST outputs are driven with 0xD until exception processing
completes.
0xE 1110 Processor is stopped. Appears in multiple-cycle format when the MCF5272 executes a STOP instruction. The
ColdFire processor remains stopped until an interrupt occurs, thus PST outputs display 0xE until the stopped
mode is exited.
0xF 1111 Processor is halted. Because this encoding defines a multiple-cycle mode, the PST outputs display 0xF until
the processor is restarted or reset. (see Section 5.5.1, “CPU Halt”)
Table 5-2. Processor Status Encoding (continued)
PST[3:0]
Definition
Hex Binary
Debug Support
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Another example of a variant branch instruction would be a JMP (A0) instruction. Figure 5-3 shows when
the PST and DDAT A outputs that indicate when a JMP (A0) executed, assuming the CSR was programmed
to display the lower 2 bytes of an address.
Figure 5-3. Example JMP Instruction Output on PST/DDATA
PST of 0x5 indicates a taken branch and the marker value 0x9 indicates a 2-byte address. Thus, the
subsequent 4 nibbles of DDATA display the lower 2 bytes of address register A0 in
least-to-most-significant nibble order . The PST outpu t after the JMP instruction completes depends on the
target instruction. The PST can continue with the next instruction before the address has completely
displayed on DDAT A because of the DDAT A FIFO. If the FIFO is full and the next instruction has captured
values to display on DDATA, the pipeline stalls (PST = 0x0) until space is available in the FIFO.
5.4 Programming Model
In addition to the existing BDM commands that provide access to the processor’ s registers and the memory
subsystem, the debug module contains nine registers to support the required functionality. These registers
are also accessible from the processor’s supervisor programming model by executing the WDEBUG
instruction (write only). Thus, the breakpoint hardware in the debug module can be read or written by the
external development system using the debug serial interface or by the operating system running on the
processor core. Software is responsible for guaranteeing that accesses to these resources are serialized and
logically consistent. Hardware provides a locking mechanism in the CSR to allow the external
development system to disable any attempted writes by the processor to the breakpoint registers (setting
CSR[IPW]). BDM commands must not be issued if the MCF5272 is using the WDEBUG instruction to
access debug module registers or the resulting behavior is undefined.
These registers, shown in Figure 5-4, are treated as 32-bit quantities, regardless of the number of
implemented bits.
DDATA
PSTCLK
0x0 0x0 A[3:0]
0x5 0x9 default
PST
A[7:4] A[11:8] A[15:12]
default default default
Debug Support
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Figure 5-4. Debug Programming Model
These registers are accessed through the BDM port by new BDM commands, WDMREG and RDMREG,
described in Section 5.5.3.3, “Command Set Descriptions.” These commands contain a 5-bit field, DRc,
that specifies the register, as shown in Table 5-3.
NOTE
Debug control registers can be written by the external development system
or the CPU through the WDEBUG instruction.
CSR is write-only from the programming model. It can be read or written
through the BDM port using the RDMREG and WDMREG commands.
Table 5-3. BDM/Breakpoint Registers
DRc[4–0] Register Name Abbreviation Initial State Page
0x00 Configuration/status register CSR 0x0000_0000 p. 5-10
0x01–0x05 Reserved — — —
0x06 Address attribute trigger register AATR 0x0000_0005 p. 5-7
0x07 Trigger definition register TDR 0x0000_0000 p. 5-14
0x08 Program counter breakpoint register PBR — p. 5-13
0x09 Program counter breakpoint mask register PBMR — p. 5-13
0x0A–0x0B Reserved — — —
0x0C Address breakpoint high register ABHR — p. 5-9
0x0D Address breakpoint low register ABLR — p. 5-9
0x0E Data breakpoint register DBR — p. 5-12
0x0F Data breakpoint mask register DBMR — p. 5-12
PC breakpoint mask register
PC breakpoint register
Data breakpoint register
Data breakpoint mask register
Trigger definition register
Configuration/status register
Note: Each debug register is accessed as a 32-bit register; shaded fields above are not used (don’t care).
All debug control registers are writable from the external development system or the CPU via the WDEBUG
instruction.
CSR is write-only from the programming model. It can be read or written through the BDM port using the
RDMREG and WDMREG commands.
Address attribute trigger register
Address low breakpoint register
Address high breakpoint register
31 15 7 0
31 15 0
31 15 0
31 15 0
31 15 0
31 15 0
AATR
ABLR
ABHR
CSR
DBR
DBMR
PBR
PBMR
TDR
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5.4.1 Revision A Shared Debug Resources
In the Revision A implementation of the debug module, certain hardware structures are shared between
BDM and breakpoint functionality as shown in Table 5-4.
Thus, loading a register to perform a specific function that shares hardware resources is destructive to the
shared function. For example, a BDM command to access memory overwrites an address breakpoint in
ABHR. A BDM write command overwrites the data breakpoint in DBR.
5.4.2 Address Attribute Trigger Register (AATR)
The address attribute trigger register (AATR), Figure 5-5, defines address attributes and a mask to be
matched in the trigger. The register value is compared with address attribute signals from the processor’s
local high-speed bus, as defined by the setting of the trigger definition register (TDR).
Table 5-5 describes AATR fields.
Table 5-4. Rev. A Shared BDM/Breakpoint Hardware
Register BDM Function Breakpoint Function
AATR Bus attributes for all memory commands Attributes for address breakpoint
ABHR Address for all memory commands Address for address breakpoint
DBR Data for all BDM write commands Data for data breakpoint
151413121110 8765432 0
Field RM SZM TTM TMM R SZ TT TM
Reset 0000_0000_0000_0101
R/W Write only. AATR is accessible in supervisor mode as debug control register 0x06 using the WDEBUG
instruction and through the BDM port using the WDMREG command.
DRc[4–0] 0x06
Figure 5-5. Address Attribute Trigger Register (AATR)
Table 5-5. AATR Field Descriptions
Bits Name Description
15 RM Read/write mask. Setting RM masks R in address comparisons.
14–13 SZM Size mask. Setting an SZM bit masks the corresponding SZ bit in address comparisons.
12–11 TTM Transfer type mask. Setting a TTM bit masks the corresponding TT bit in address comparisons.
10–8 TMM Transfer modifier mask. Setting a TMM bit masks the corresponding TM bit in address comparisons.
7 R Read/write. R is compared with the R/W signal of the processor’s local bus.
6–5 SZ Size. Compared to the processor’s local bus size signals.
00 Longword
01 Byte
10 Word
11 Reserved
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4–3 TT Transfer type. Compared with the local bus transfer type signals.
00 Normal processor access
01 Reserved
10 Emulator mode access
11 Acknowledge/CPU space access
These bits also define the TT encoding for BDM memory commands. In this case, the 01 encoding indicates
an external or DMA access (for backward compatibility). These bits affect the TM bits.
2–0 TM Transfer modifier. Compared with the local bus transfer modifier signals, which give supplemental information
for each transfer type.
TT = 00 (normal mode):
000 Explicit cache line push
001 User data access
010 User code access
011 Reserved
100 Reserved
101 Supervisor data access
110 Supervisor code access
111 Reserved
TT = 10 (emulator mode):
0xx–100 Reserved
101 Emulator mode data access
110 Emulator mode code access
111 Reserved
TT = 11 (acknowledge/CPU space transfers):
000 CPU space access
001–111 Interrupt acknowledge levels 1–7
These bits also define the TM encoding for BDM memory commands (for backward compatibility).
Table 5-5. AATR Field Descriptions (continued)
Bits Name Description
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5.4.3 Address Breakpoint Registers (ABLR, ABHR)
The address breakpoint low and high registers (ABLR, ABHR), Figure 5-6, define regions in the
processor’s data address space that can be used as part of the trigger. These register values are compared
with the address for each transfer on the processor’s high-speed local bus. The trigger definition register
(TDR) identifies the trigger as one of three cases:
1. identically the value in ABLR
2. inside the range bound by ABLR and ABHR inclusive
3. outside that same range
Table 5-6 describes ABLR fields.
Table 5-7 describes ABHR fields.
31 0
Field Address
Reset —
R/W Write only. ABHR is accessible in supervisor mode as debug control register 0x0C using the WDEBUG
instruction and via the BDM port using the RDMREG and WDMREG commands.
ABLR is accessible in supervisor mode as debug control register 0x0D using the WDEBUG instruction and
via the BDM port using the WDMREG command.
DRc[4–0] 0x0D (ABLR); 0x0C (ABHR)
Figure 5-6. Address Breakpoint Registers (ABLR, ABHR)
Table 5-6. ABLR Field Description
Bits Name Description
31–0 Address Low address. Holds the 32-bit address marking the lower bound of the address breakpoint range.
Breakpoints for specific addresses are programmed into ABLR.
Table 5-7. ABHR Field Description
Bits Name Description
31–0 Address High address. Holds the 32-bit address marking the upper bound of the address breakpoint range.
Debug Support
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5.4.4 Configuration/Status Register (CSR)
The configuration/status register (CSR) defines the debug configuration for the processor and memory
subsystem and contains status information from the breakpoint logic. CSR is write-only from the
programming model. It can be read from and written to through the BDM port. CSR is accessible in
supervisor mode as debug control register 0x00 using the WDEBUG instruction and through the BDM
port using the RDMREG and WDMREG commands.
Table 5-8 describes CSR fields.
31 28 27 26 25 24 23 20 19 17 16
Field BSTAT FOF TRG HALT BKPT HRL — IPW
Reset 0000 000 0 0000 0000
R/W1R RRRR R — R/W
1514131211109 8 76543 0
Field MAP TRC EMU DDC UHE BTB —1NPL IPI SSM —
Reset000 00 0 00 0000 0000
R/W R/W R/W R/W R/W R/W R/W R R/W R/W R/W —
DRc[4–0] 0x00
1Bit 7 is reserved for Freescale use and must be written as a zero.
Figure 5-7. Configuration/Status Register (CSR)
Table 5-8. CSR Field Descriptions
Bit Name Description
31–28 BSTAT Breakpoint status. Provides read-only status information concerning hardware breakpoints. BSTAT is
cleared by a TDR write or by a CSR read when either a level-2 breakpoint is triggered or a level-1 breakpoint
is triggered and the level-2 breakpoint is disabled.
0000 No breakpoints enabled
0001 Waiting for level-1 breakpoint
0010 Level-1 breakpoint triggered
0101 Waiting for level-2 breakpoint
0110 Level-2 breakpoint triggered
27 FOF Fault-on-fault. If FOF is set, a catastrophic halt occurred and forced entry into BDM. FOF is cleared
whenever CSR is read.
26 TRG Hardware breakpoint trigger. If TRG is set, a hardware breakpoint halted the processor core and forced
entry into BDM. Reset, the debug GO command, or reading CSR clear TRG.
25 HALT Processor halt. If HALT is set, the processor executed a HALT and forced entry into BDM. Reset, the debug
GO command, or reading CSR clear HALT.
24 BKPT Breakpoint assert. If BKPT is set, BKPT was asserted, forcing the processor into BDM. Reset, the debug
GO command, or reading CSR clear BKPT.
23–20 HRL Hardware revision level. Indicates the level of debug module functionality. An emulator could use this
information to identify the level of functionality supported.
0000 Initial debug functionality (Revision A) (this is the only valid value for the MCF5272)
19–17 — Reserved, should be cleared.
16 IPW Inhibit processor writes. Setting IPW inhibits processor-initiated writes to the debug module’s programming
model registers. IPW can be modified only by commands from the external development system.
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15 MAP Force processor references in emulator mode.
0 All emulator-mode references are mapped into supervisor code and data spaces.
1 The processor maps all references while in emulator mode to a special address space, TT = 10,
TM = 101 or 110.
14 TRC Force emulation mode on trace exception. If TRC = 1, the processor enters emulator mode when a trace
exception occurs. If TRC=0, the processor enters supervisor mode.
13 EMU Force emulation mode. If EMU = 1, the processor begins executing in emulator mode. See Section 5.6.1.1,
“Emulator Mode.”
12–11 DDC Debug data control. Controls operand data capture for DDATA, which displays the number of bytes defined
by the operand reference size before the actual data; byte displays 8 bits, word displays 16 bits, and long
displays 32 bits (one nibble at a time across multiple clock cycles). See Table 5-2.
00 No operand data is displayed.
01 Capture all write data.
10 Capture all read data.
11 Capture all read and write data.
10 UHE User halt enable. Selects the CPU privilege level required to execute the HALT instruction.
0 HALT is a supervisor-only instruction.
1 HALT is a supervisor/user instruction.
9–8 BTB Branch target bytes. Defines the number of bytes of branch target address DDATA displays.
00 0 bytes
01 Lower 2 bytes of the target address
10 Lower 3 bytes of the target address
11 Entire 4-byte target address
See Section 5.3.1, “Begin Execution of Taken Branch (PST = 0x5).”
7 — Reserved, should be cleared.
6 NPL Non- mode. Determines whether the core operates in pipelined or mode or not.
0 Pipelined mode
1 Nonpipelined mode. The processor effectively executes one instruction at a time with no overlap. This
adds at least 5 cycles to the execution time of each instruction. Given an average execution latency of
1.6, throughput in non-pipeline mode would be 6.6, approximately 25% or less of pipelined performance.
Regardless of the NPL state, a triggered PC breakpoint is always reported before the triggering instruction
executes. In normal pipeline operation, the occurrence of an address and/or data breakpoint trigger is
imprecise. In non-pipeline mode, triggers are always reported before the next instruction begins execution
and trigger reporting can be considered precise.
An address or data breakpoint should always occur before the next instruction begins execution. Therefore
the occurrence of the address/data breakpoints should be guaranteed.
5 IPI Ignore pending interrupts.
1 Core ignores any pending interrupt requests signalled while in single-instruction-step mode.
0 Core services any pending interrupt requests that were signalled while in single-step mode.
4 SSM Single-step mode. Setting SSM puts the processor in single-step mode.
0 Normal mode.
1 Single-step mode. The processor halts after execution of each instruction. While halted, any BDM
command can be executed. On receipt of the GO command, the processor executes the next instruction
and halts again. This process continues until SSM is cleared.
3–0 — Reserved, should be cleared.
Table 5-8. CSR Field Descriptions (continued)
Bit Name Description
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5.4.5 Data Breakpoint/Mask Registers (DBR, DBMR)
The data breakpoint register (DBR), Figure 5-8, specify data patterns used as part of the trigger into debug
mode. DBR bits are masked by setting corresponding DBMR bits, as defined in TDR.
Table 5-9 describes DBR fields.
Table 5-10 describes DBMR fields.
The DBR supports both aligned and misaligned references. Table 5-11 shows relationships between
processor address, access size, and location within the 32-bit data bus.
31 0
Field Data (DBR); Mask (DBMR)
Reset Uninitialized
R/W DBR is accessible in supervisor mode as debug control register 0x0E, using the WDEBUG instruction and
through the BDM port using the RDMREG and WDMREG commands.
DBMR is accessible in supervisor mode as debug control register 0x0F,using the WDEBUG instruction and
via the BDM port using the WDMREG command.
DRc[4–0] 0x0E (DBR), 0x0F (DBMR)
Figure 5-8. Data Breakpoint/Mask Registers (DBR and DBMR)
Table 5-9. DBR Field Descriptions
Bits Name Description
31–0 Data Data breakpoint value. Contains the value to be compared with the data value from the processor’s local bus
as a breakpoint trigger.
Table 5-10. DBMR Field Descriptions
Bits Name Description
31–0 Mask Data breakpoint mask. The 32-bit mask for the data breakpoint trigger. Clearing a DBR bit allows the
corresponding DBR bit to be compared to the appropriate bit of the processor’s local data bus. Setting a
DBMR bit causes that bit to be ignored.
Table 5-11. Access Size and Operand Data Location
A[1:0] Access Size Operand Location
00 Byte D[31:24]
01 Byte D[23:16]
10 Byte D[15:8]
11 Byte D[7:0]
0x Word D[31:16]
1x Word D[15:0]
xx Longword D[31:0]
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5.4.6 Program Counter Breakpoint/Mask Registers
(PBR, PBMR)
The PC breakpoint register (PBR) defines an instruction address for use as part of the trigger. This
register’s contents are compared with the processor’s program counter register when TDR is configured
appropriately. PBR bits are masked by setting corresponding PBMR bits. Results are compared with the
processor’s program counter register, as defined in TDR. Figure 5-9 shows the PC breakpoint register.
Table 5-12 describes PBR fields.
Figure 5-9 shows PBMR.
Table 5-13 describes PBMR fields.
31 0
Field Program Counter
Reset —
R/W Write. PC breakpoint register is accessible in supervisor mode using the WDEBUG instruction and through
the BDM port using the RDMREG and WDMREG commands using values shown in Section 5.5.3.3, “Command
Set Descriptions.”
DRc[4–0] 0x08
Figure 5-9. Program Counter Breakpoint Register (PBR)
Table 5-12. PBR Field Descriptions
Bits Name Description
31–0 Address PC breakpoint address. The 32-bit address to be compared with the PC as a breakpoint trigger.
31 0
Field Mask
Reset —
R/W Write. PBMR is accessible in supervisor mode as debug control register 0x09 using the WDEBUG
instruction and via the BDM port using the wdmreg command.
DRc[4–0] 0x09
Figure 5-10. Program Counter Breakpoint Mask Register (PBMR)
Table 5-13. PBMR Field Descriptions
Bits Name Description
31–0 Mask PC breakpoint mask. A zero in a bit position causes the corresponding PBR bit to be compared to the
appropriate PC bit. Set PBMR bits cause PBR bits to be ignored.
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5.4.7 Trigger Definition Register (TDR)
The TDR, shown in Table 5-11, configures the operation of the hardware breakpoint logic that corresponds
with the ABHR/ABLR/AATR, PBR/PBMR, and DBR/DBMR registers within the debug module. The
TDR controls the actions taken under the defined conditions. Breakpoint logic may be configured as a one-
or two-level trigger. TDR[31–16] define the second-level trigger and bits 15–0 define the first-level
trigger.
NOTE
The debug module has no hardware interlocks, so to prevent spurious
breakpoint triggers while the breakpoint registers are being loaded, disable
TDR (by clearing TDR[29,13])before defining triggers.
A write to TDR clears the CSR trigger status bits, CSR[BSTAT].
Table 5-14 describes TDR fields.
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Field TRC EBL EDLW EDWL EDWU EDLL EDLM EDUM EDUU DI EAI EAR EAL EPC PCI
Reset 0000_0000_0000_0000
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Field — EBL EDLW EDWL EDWU EDLL EDLM EDUM EDUU DI EAI EAR EAL EPC PCI
Reset 0000_0000_0000_0000
R/W Write only. Accessible in supervisor mode as debug control register 0x07 using the WDEBUG instruction and
through the BDM port using the WDMREG command.
DRc[4–0] 0x07
Figure 5-11. Trigger Definition Register (TDR)
Table 5-14. TDR Field Descriptions
Bits Name Description
31–30 TRC Trigger response control. Determines how the processor responds to a completed trigger condition. The
trigger response is always displayed on DDATA.
00 Display on DDATA only
01 Processor halt
10 Debug interrupt
11 Reserved
15–14 — Reserved, should be cleared.
29/13 EBL Enable breakpoint. Global enable for the breakpoint trigger. Setting TDR[EBL] enables a breakpoint trigger.
Clearing it disables all breakpoints at that level.
Second-Level Trigger
First-Level Trigger
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5.5 Background Debug Mode (BDM)
The ColdFire Family implements a low-level system debugger in the microprocessor hardware.
Communication with the development system is handled through a dedicated, high-speed serial command
interface. The ColdFire architecture implements the BDM controller in a dedicated hardware module.
Although some BDM operations, such as CPU register accesses, require the CPU to be halted, other BDM
commands, such as memory accesses, can be executed while the processor is running.
28–22
12–6
EDxSetting an EDx bit enables the corresponding data breakpoint condition based on the size and placement
on the processor’s local data bus. Clearing all EDx bits disables data breakpoints.
28/12 EDLW Data longword. Entire processor’s local data bus.
27/11 EDWL Lower data word.
26/10 EDWU Upper data word.
25/9 EDLL Lower lower data byte. Low-order byte of the low-order word.
24/8 EDLM Lower middle data byte. High-order byte of the low-order word.
23/7 EDUM Upper middle data byte. Low-order byte of the high-order word.
22/6 EDUU Upper upper data byte. High-order byte of the high-order word.
21/5 DI Data breakpoint invert. Provides a way to invert the logical sense of all the data breakpoint comparators.
This can develop a trigger based on the occurrence of a data value other than the DBR contents.
20–18/4
–2
EAxEnable address bits. Setting an EA bit enables the corresponding address breakpoint. Clearing all three bits
disables the breakpoint.
20/4 EAI Enable address breakpoint inverted. Breakpoint is based outside the range between ABLR and
ABHR.
19/3 EAR Enable address breakpoint range. The breakpoint is based on the inclusive range defined by
ABLR and ABHR.
18/2 EAL Enable address breakpoint low. The breakpoint is based on the address in the ABLR.
17/1 EPC Enable PC breakpoint. If set, this bit enables the PC breakpoint.
16/0 PCI Breakpoint invert. If set, this bit allows execution outside a given region as defined by PBR and PBMR to
enable a trigger. If cleared, the PC breakpoint is defined within the region defined by PBR and PBMR.
Table 5-14. TDR Field Descriptions (continued)
Bits Name Description
Debug Support
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5.5.1 CPU Halt
Although most BDM operations can occur in parallel with CPU operations, unrestricted BDM operation
requires the CPU to be halted. The sources that can cause the CPU to halt are listed below in order of
priority:
1. A catastrophic fault-on-fault condition automatically halts the processor.
2. A hardware breakpoint can be configured to generate a pending halt condition similar to the
assertion of BKPT. This type of halt is always first made pending in the processor. Next, the
processor samples for pending halt and interrupt conditions once per instruction. When a pending
condition is asserted, the processor halts execution at the next sample point. See Section 5.6.1,
“Theory of Operation.”
3. The execution of a HALT instruction immediately suspends execution. Attempting to execute
HALT in user mode while CSR[UHE] = 0 generates a privilege violation exception. If
CSR[UHE] = 1, HALT can be executed in user mode. After HALT executes, the processor can be
restarted by serial shifting a GO command into the debug module. Execution continues at the
instruction after HALT.
4. The assertion of the BKPT input is treated as a pseudo-interrupt; that is, the halt condition is
postponed until the processor core samples for halts/interrupts. The processor samples for these
conditions once during the execution of each instruction. If there is a pending halt condition at the
sample time, the processor suspends execution and enters the halted state.
The assertion of BKPT should be considered in the following two special cases:
• After the system reset signal is negated, the processor waits for 16 processor clock cycles before
beginning reset exception processing. If the BKPT input is asserted within eight cycles after RSTI
is negated, the processor enters the halt state, signaling halt status (0xF) on the PST outputs. While
the processor is in this state, all resources accessible through the debug m odule can be referenced.
This is the only chance to force the processor into emulation mode through CSR[EMU].
After system initialization, the processor’s response to the GO command depends on the set of
BDM commands performed while it is halted for a breakpoint. Specifically, if the PC register was
loaded, the GO command causes the processor to exit halted state and pass control to the instruction
address in the PC, bypassing normal reset exception processing. If the PC was not loaded, the GO
command causes the processor to exit halted state and continue reset exception processing.
• The ColdFire architecture also handles a special case of BKPT being asserted while the processor
is stopped by execution of the STOP instruction. For this case, the processor exits the stopped mode
and enters the halted state, at which point, all BDM commands may be exercised. When re started,
the processor continues by executing the next sequential instruction, that is, the instruction
following the STOP opcode.
CSR[27–24] indicates the halt source, showing the highest priority source for multiple halt conditions.
Debug Support
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5.5.2 BDM Serial Interface
When the CPU is halted and PST reflects the halt status, the development system can send unrestricted
commands to the debug module. The debug module implements a synchronous protocol using two inputs
(DSCLK and DSI) and one output (DSO), where DSO is specified as a delay relative to the rising edge of
the processor clock. See Table 5-1. The development system serves as the serial communication channel
master and must generate DSCLK.
The serial channel operates at a frequency from DC to 1/5 of the PSTCLK frequency. The channel uses
full-duplex mode, where data is sent and received simultaneously by both master and slave devices. The
transmission consists of 17-bit packets composed of a status/control bit and a 16-bit data word. As shown
in Figure 5-12, all state transitions are enabled on a rising edge of the PSTCLK clock when DSCLK is
high; that is, DSI is sampled and DSO is driven.
Figure 5-12. BDM Serial Interface Timing
DSCLK and DSI are synchronized inputs. DSCLK acts as a pseudo clock enable and is sampled on the
rising edge of the processor CLK as well as the DSI. DSO is delayed from the DSCLK-enabled CLK rising
edge (registered after a BDM state machine state change). All events in the debug module’s serial state
machine are based on the processor clock rising edge. DSCLK must also be sampled low (on a positive
edge of CLK) between each bit exchange. The MSB is transferred first. Because DSO changes state based
on an internally-recognized rising edge of DSCLK, DSDO cannot be used to indicate the start of a serial
transfer. The development system must count clock cycles in a given transfer. C1–C4 are described as
follows:
• C1—First synchronization cycle for DSI (DSCLK is high).
• C2—Second synchronization cycle for DSI (DSCLK is high).
• C3—BDM state machine changes state depending upon DSI and whether the entire input data
transfer has been transmitted.
• C4—DSO changes to next value.
NOTE
A not-ready response can be ignored except during a memory-referencing
cycle. Otherwise, the debug module can accept a new serial transfer after 32
processor clock periods.
PSTCLK
DSCLK
Next State
BDM State
Machine
DSO
DSI
Current State
Current Next
Past Current
C1 C2 C3 C4
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5.5.2.1 Receive Packet Format
The basic receive packet, Figure 5-13, consists of 16 data bits and 1 status bit.
Table 5-15 describes receive BDM packet fields.
5.5.2.2 Transmit Packet Format
The basic transmit packet, Figure 5-14, consists of 16 data bits and 1 control bit.
Table 5-16 describes transmit BDM packet fields.
16 15 0
S Data Field [15:0]
Figure 5-13. Receive BDM Packet
Table 5-15. Receive BDM Packet Field Description
Bits Name Description
16 S Status. Indicates the status of CPU-generated messages listed below. The not-ready response can be ignored
unless a memory-referencing cycle is in progress. Otherwise, the debug module can accept a new serial
transfer after 32 processor clock periods.
S DataMessage
0 xxxxValid data transfer
0 0xFFFFStatus OK
1 0x0000Not ready with response; come again
1 0x0001Error—Terminated bus cycle; data invalid
1 0xFFFFIllegal command
15–0 Data Data. Contains the message to be sent from the debug module to the development system. The response
message is always a single word, with the data field encoded as shown above.
16 15 0
CD[15:0]
Figure 5-14. Transmit BDM Packet
Table 5-16. Transmit BDM Packet Field Description
Bits Name Description
16 C Control. This bit is reserved. Command and data transfers initiated by the development system should clear C.
15–0 Data Contains the data to be sent from the development system to the debug module.
Debug Support
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5.5.3 BDM Command Set
Table 5-17 summarizes the BDM command set. Subsequent paragraphs contain detailed descriptions of
each command. Issuing a BDM command when the processor is accessing debug module registers using
the WDEBUG instruction causes undefined behavior.
Unassigned command opcodes are reserved by Freescale. All unused command formats within any
revision level perform a NOP and return the illegal command response.
Table 5-17. BDM Command Summary
Command Mnemonic Description CPU
State1
1General command effect and/or requirements on CPU operation:
- Halted. The CPU must be halted to perform this command.
- Steal. Command generates bus cycles that can be interleaved with bus accesses.
- Parallel. Command is executed in parallel with CPU activity.
Section Command
(Hex)
Read A/D
register
rareg/
rdreg
Read the selected address or data register and return
the results through the serial interface.
Halted 5.5.3.3.1 0x218 {A/D,
Reg[2:0]}
Write A/D
register
wareg/
wdreg
Write the data operand to the specified address or data
register.
Halted 5.5.3.3.2 0x208 {A/D,
Reg[2:0]}
Read memory
location
read Read the data at the memory location specified by the
longword address.
Steal 5.5.3.3.3 0x1900—byte
0x1940—word
0x1980—lword
Write memory
location
write Write the operand data to the memory location
specified by the longword address.
Steal 5.5.3.3.4 0x1800—byte
0x1840—word
0x1880—lword
Dump
memory block
dump Used with READ to dump large blocks of memory. An
initial READ is executed to set up the starting address of
the block and to retrieve the first result. A DUMP
command retrieves subsequent operands.
Steal 5.5.3.3.5 0x1D00—byte
0x1D40—word
0x1D80—lword
Fill memory
block
fill Used with WRITE to fill large blocks of memory. An initial
WRITE is executed to set up the starting address of the
block and to supply the first operand. A FILL command
writes subsequent operands.
Steal 5.5.3.3.6 0x1C00—byte
0x1C40—word
0x1C80—lword
Resume
execution
go The pipeline is flushed and refilled before resuming
instruction execution at the current PC.
Halted 5.5.3.3.7 0x0C00
No operation nop Perform no operation; may be used as a null command. Parallel 5.5.3.3.8 0x0000
Read control
register
rcreg Read the system control register. Halted 5.5.3.3.9 0x2980
Write control
register
wcreg Write the operand data to the system control register. Halted 5.5.3.3.10 0x2880
Read debug
module
register
rdmreg Read the debug module register. Parallel 5.5.3.3.11 0x2D {0x42
DRc[4:0]}
20x4 is a three-bit field.
Write debug
module
register
wdmreg Write the operand data to the debug module register. Parallel 5.5.3.3.12 0x2C {0x42
DRc[4:0]}
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5.5.3.1 ColdFire BDM Command Format
All ColdFire Family BDM commands include a 16-bit operation word followed by an optional set of one
or more extension words, as shown in Figure 5-15.
Table 5-18 describes BDM fields.
5.5.3.1.1 Extension Words as Required
Some commands require extension words for addresses and/or immediate data. Addresses require two
extension words because only absolute long addressing is permitted. Longword accesses are forcibly
longword-aligned and word accesses are forcibly word-aligned. Immediate data can be 1 or 2 words long.
Byte and word data each requires a single extension word and longword data requires two extension words.
Operands and addresses are transferred most-significant word first. In the following descriptions of the
BDM command set, the optional set of extension words is defined as address, data, or operand data.
15 1098765432 0
Operation 0 R/W Op Size 0 0 A/D Register
Extension Word(s)
Figure 5-15. BDM Command Format
Table 5-18. BDM Field Descriptions
Bit Name Description
15–10 Operation Specifies the command. These values are listed in Table 5 -17.
90Reserved
8 R/W Direction of operand transfer.
0 Data is written to the CPU or to memory from the development system.
1 The transfer is from the CPU to the development system.
7–6 Operand
Size
Operand data size for sized operations. Addresses are expressed as 32-bit absolute values. Note that a
command performing a byte-sized memory read leaves the upper 8 bits of the response data undefined.
Referenced data is returned in the lower 8 bits of the response.
Operand SizeBit Values
00 Byte8 bits
01 Word16 bits
10 Longword32 bits
11 Reserved—
5–4 00 Reserved
3 A/D Address/data. Determines whether the register field specifies a data or address register.
0 Indicates a data register.
1 Indicates an address register.
2–0 Register Contains the register number in commands that operate on processor registers.
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5.5.3.2 Command Sequence Diagrams
The command sequence diagram in Figure 5-16 shows serial bus traffic for commands. Each bubble
represents a 17-bit bus transfer. The top half of each bubble indicates the data the development system
sends to the debug module; the bottom half indicates the debug module’s response to the previous
development system commands. Command and result transactions overlap to minimize latency.
Figure 5-16. Command Sequence Diagram
The sequence is as follows:
• In cycle 1, the development system command is issued (READ in this example). The debug module
responds with either the low-order results of the previous command or a command complete status
of the previous command, if no results are required.
• In cycle 2, the development system supplies the high-order 16 address bits. The debug module
returns a not-ready response unless the received command is decoded as unimplemented, which is
indicated by the illegal command encoding. If this occurs, the development system should
retransmit the command.
NOTE
A not-ready response can be ignored except during a memory-referencing
cycle. Otherwise, the debug module can accept a new serial transfer after 32
processor clock periods.
COMMANDS TRANSMITTED TO THE DEBUG MODULE
COMMAND CODE TRANSMITTED DURING THIS CYCLE
HIGH-ORDER 16 BITS OF MEMORY ADDRESS
LOW-ORDER 16 BITS OF MEMORY ADDRESS
SEQUENCE TAKEN IF
OPERATION HAS NOT
COMPLETED
DATA UNUSED FROM
THIS TRANSFER
SEQUENCE TAKEN IF
ILLEGAL COMMAND
IS RECEIVED BY DEBUG MODULE
RESULTS FROM PREVIOUS COMMAND
RESPONSES FROM THE DEBUG MODULE
NONSERIAL-RELATED ACTIVITY
MS ADDR
"NOT READY"
XXX
"ILLEGAL"
LS ADDR
"NOT READY"
NEXT CMD
"NOT READY"
READ (LONG)
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXXXX
XXX
BERR
MS RESULT
NEXT CMD
LS RESULT
READ
MEMORY
LOCATION
NEXT
COMMAND
CODE
SEQUENCE TAKEN IF BUS
ERROR OCCURS ON
MEMORY ACCESS
HIGH- AND LOW-ORDER
16 BITS OF RESULT
XXX
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• In cycle 3, the development system supplies the low-order 16 address bits. The debug module
always returns a not-ready response.
• At the completion of cycle 3, the debug module initiates a memory read operation. Any serial
transfers that begin during a memory access return a not-ready response.
• Results are returned in the two serial transfer cycles after the memory access completes. For any
command performing a byte-sized memory read operation, the upper 8 bits of the response data are
undefined and the referenced data is returned in the lower 8 bits. The next command’s opcode is
sent to the debug module during the final transfer . If a memory or register access is terminated with
a bus error, the error status (S = 1, DATA = 0x0001) is returned instead of result data.
5.5.3.3 Command Set Descriptions
The following sections describe the commands summarized in Table 5-17.
NOTE
The BDM status bit (S) is 0 for normally completed commands; S = 1 for
illegal commands, not-ready responses, and transfers with bus-errors.
Section 5.5.2, “BDM Serial Interface,” describes the receive packet format.
Freescale reserves unassigned command opcodes for future expansion. Unused command formats in any
revision level perform a NOP and return an illegal command response.
5.5.3.3.1 Read A/D Register (RAREG/RDREG)
Read the selected address or data register and return the 32-bit result. A bus error response is returned if
the CPU core is not halted.
Command/Result Formats:
Command Sequence:
Figure 5-18. RAREG/RDREG Command Sequence
Operand Data: None
Result Data: The contents of the selected register are returned as a longword value,
most-significant word first.
15 1211 87 432 0
Command 0x2 0x1 0x8 A/D Register
Result D[31:16]
D[15:0]
Figure 5-17. RAREG/RDREG Command Format
XXX
MS RESULT
NEXT CMD
LS RESULT
RAREG/RDREG
???
XXX
BERR
NEXT CMD
"NOT READY"
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5.5.3.3.2 Write A/D Register (WAREG/WDREG)
The operand longword data is written to the specified address or data register . A write alters all 32 register
bits. A bus error response is returned if the CPU core is not halted.
Command Format:
Command Sequence
Figure 5-20. WAREG/WDREG Command Sequence
Operand Data Longword data is written into the specified address or data register. The data is
supplied most-significant word first.
Result Data Command complete status is indicated by returning 0xFFFF (with S cleared)
when the register write is complete.
15 12 11 8 7 4 3 2 0
0x2 0x0 0x8 A/D Register
D[31:16]
D[15:0]
Figure 5-19. WAREG/WDREG Command Format
MS DATA
"NOT READY"
XXX
LS DATA
"NOT READY"
NEXT CMD
"NOT READY"
WDREG/WAREG
???
NEXT CMD
"CMD COMPLETE"
BERR
Debug Support
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5.5.3.3.3 Read Memory Location (READ)
Read data at the longword address. Address space is defined by BAAR[TT,TM]. Hardware forces
low-order address bits to zeros for word and longword accesses to ensure that word addresses are
word-aligned and longword addresses are longword-aligned.
Command/Result Formats:
Command Sequence:
Figure 5-22. READ Command Sequence
Operand Data The only operand is the longword address of the requested location.
Result Data Word results return 16 bits of data; longword results return 32. Bytes are returned
in the LSB of a word result, the upper byte is undefined. 0x0001 (S = 1) is returned
if a bus error occurs.
15 12 11 8 7 4 3 0
Byte
Command
0x1 0x9 0x0 0x0
A[31:16]
A[15:0]
ResultXXXXXXXX D[7:0]
Word Command 0x1 0x9 0x4 0x0
A[31:16]
A[15:0]
Result D[15:0]
Longword Command 0x1 0x9 0x8 0x0
A[31:16]
A[15:0]
Result D[31:16]
D[15:0]
Figure 5-21. READ Command/Result Formats
MS ADDR
"NOT READY"
LS ADDR
"NOT READY"
READ (B/W)
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
XXX
BERR
RESULT
NEXT CMD
READ
MEMORY
LOCATION
MS ADDR
"NOT READY"
LS ADDR
"NOT READY"
READ (LONG)
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
XXX
BERR
MS RESULT
XXX
READ
MEMORY
LOCATION
NEXT CMD
LS RESULT
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5.5.3.3.4 Write Memory Location (WRITE)
Write data to the memory location specified by the longword address. The address space is defined by
BAAR[TT,TM]. Hardware forces low-order address bits to zeros for word and longword accesses to
ensure that word addresses are word-aligned and longword addresses are longword-aligned.
Command Formats:
15 12 11 8 7 4 3 1
Byte 0x1 0x8 0x0 0x0
A[31:16]
A[15:0]
XXXXXXXX D[7:0]
Word 0x1 0x8 0x4 0x0
A[31:16]
A[15:0]
D[15:0]
Longword 0x1 0x8 0x8 0x0
A[31:16]
A[15:0]
D[31:16]
D[15:0]
Figure 5-23. WRITE Command Format
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Command Sequence:
Figure 5-24. WRITE Command Sequence
Operand Data This two-operand instruction requires a longword absolute address that specifies
a location to which the data operand is to be written. Byte data is sent as a 16-bit
word, justified in the LSB; 16- and 32-bit operands are sent as 16 and 32 bits,
respectively
Result Data Command complete status is indicated by returning 0xFFFF (with S cleared)
when the register write is complete. A value of 0x0001 (with S set) is returned if
a bus error occurs.
MS ADDR
"NOT READY"
LS ADDR
"NOT READY"
WRITE (B/W)
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
XXX
BERR
"CMD COMPLETE"
NEXT CMD
WRITE
MEMORY
LOCATION
DATA
"NOT READY"
MS ADDR
"NOT READY"
LS ADDR
"NOT READY"
WRITE (LONG)
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
XXX
BERR
"CMD COMPLETE"
NEXT CMD
WRITE
MEMORY
LOCATION
MS DATA
"NOT READY"
LS DATA
"NOT READY"
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5.5.3.3.5 Dump Memory Block (DUMP)
DUMP is used with the READ command to access large blocks of memory. An initial READ is executed to
set up the starting address of the block and to retrieve the first result. If an initial READ is not executed
before the first DUMP, an illegal command response is returned. The DUMP command retrieves subsequent
operands. The initial address is incremented by the operand size (1, 2, or 4) and saved in a temporary
register. Subsequent DUMP commands use this address, perform the memory read, increment it by the
current operand size, and store the updated address in the temporary register.
NOTE
DUMP does not check for a valid address; it is a valid command only when
preceded by NOP, READ, or another DUMP command. Otherwise, an illegal
command response is returned. NOP can be used for intercommand padding
without corrupting the address pointer.
The size field is examined each time a DUMP command is processed, allowing the operand size to be
dynamically altered.
Command/Result Formats:
Command Sequence:
Figure 5-26. DUMP Command Sequence
15 12 11 8 7 4 3 0
Byte Command 0x1 0xD 0x0 0x0
Result XXXXXXXX D[7:0]
Word Command 0x1 0xD 0x4 0x0
Result D[15:0]
Longword Command 0x1 0xD 0x8 0x0
Result D[31:16]
D[15:0]
Figure 5-25. DUMP Command/Result Formats
XXX
"NOT READY"
NEXT CMD
RESULT
XXX
BERR
XXX
"ILLEGAL"
NEXT CMD
"NOT READY"
NEXT CMD
"NOT READY"
READ
MEMORY
LOCATION
DUMP (B/W)
???
XXX
"NOT READY"
NEXT CMD
MS RESULT
XXX
BERR
XXX
"ILLEGAL"
NEXT CMD
"NOT READY"
NEXT CMD
"NOT READY"
READ
MEMORY
LOCATION
DUMP (LONG)
???
NEXT CMD
LS RESULT
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Operand Data: None
Result Data: Requested data is returned as either a word or longword. Byte data is returned in
the least-significant byte of a word result. W ord results return 16 bits of significant
data; longword results return 32 bits. A value of 0x0001 (with S set) is returned if
a bus error occurs.
5.5.3.3.6 Fill Memory Block (FILL)
A FILL command is used with the WRITE command to access large blocks of memory. An initial WRITE is
executed to set up the starting address of the block and to supply the first operand. The FILL command
writes subsequent operands. The initial address is incremented by the operand size (1, 2, or 4) and saved
in a temporary register after the memory write. Subsequent FILL commands use this address, perform the
write, increment it by the current operand size, and store the updated address in the temporary register.
If an initial WRITE is not executed preceding the first FILL command, the illegal command response is
returned.
NOTE
The FILL command does not check for a valid address—FILL is a valid
command only when preceded by another FILL, a NOP, or a WRITE command.
Otherwise, an illegal command response is returned. The NOP command can
be used for intercommand padding without corrupting the address pointer.
The size field is examined each time a FILL command is processed, allowing the operand size to be altered
dynamically.
Command Formats:
15 12 11 8 7 4 3 0
Byte 0x1 0xC 0x0 0x0
XXXXXXXX D[7:0]
Word 0x1 0xC 0x4 0x0
D[15:0]
Longword 0x1 0xC 0x8 0x0
D[31:16]
D[15:0]
Figure 5-27. FILL Command Format
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Command Sequence:
Figure 5-28. FILL Command Sequence
Operand Data: A single operand is data to be written to the memory location. Byte data is sent as
a 16-bit word, justified in the least-significant byte; 16- and 32-bit operands are
sent as 16 and 32 bits, respectively.
Result Data: Command complete status (0xFFFF) is returned when the register write is
complete. A value of 0x0001 (with S set) is returned if a bus error occurs.
5.5.3.3.7 Resume Execution (GO)
The pipeline is flushed and refilled before normal instruction execution resumes. Prefetching begins at the
current address in the PC and at the current privilege level. If any register (such as the PC or SR) is alte red
by a BDM command while the processor is halted, the updated value is used when prefetching resumes.
If a GO command is issued and the CPU is not halted, the command is ignored.
Command Sequence:
Figure 5-30. GO Command Sequence
Operand Data: None
Result Data: The command-complete response (0xFFFF) is returned during the next shift
operation.
15 12 11 8 7 4 3 0
0x0 0xC 0x0 0x0
Figure 5-29. GO Command Format
NEXT CMD
"NOT READY"
"NOT READY"
XXX
BERR
"CMD COMPLETE"
DATA
"NOT READY"
XXX
NEXT CMD
XXX
"ILLEGAL"
NEXT CMD
"NOT READY"
FILL (LONG)
???
WRITE
MEMORY
LOCATION
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
BERR
"CMD COMPLETE"
MS DATA
"NOT READY"
NEXT CMDXXX
"ILLEGAL"
NEXT CMD
"NOT READY"
LS DATA
"NOT READY"
WRITE
MEMORY
LOCATION
FILL (B/W)
???
FILL (LONG)
FILL (B/W)
GO
???
NEXT CMD
"CMD COMPLETE"
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5.5.3.3.8 No Operation (NOP)
NOP performs no operation and may be used as a null command where required.
Command Formats:
Command Sequence:
Figure 5-32. NOP Command Sequence
Operand Data: None
Result Data: The command-complete response, 0xFFFF (with S cleared), is returned during the
next shift operation.
5.5.3.3.9 Read Control Register (RCREG)
Read the selected control register and return the 32-bit result. Accesses to the processor/memory control
registers are always 32 bits wide, regardless of register width. The second and third words of the command
form a 32-bit address, which the debug module uses to generate a special bus cycle to access the specified
control register. The 12-bit Rc field is the same as that used by the MOVEC instruction.
Command/Result Formats:
Rc encoding:
15 12 11 8 7 4 3 0
0x00x00x00x0
Figure 5-31. NOP Command Format
15 12 11 8 7 4 3 0
Command 0x2 0x9 0x8 0x0
0x0 0x0 0x0 0x0
0x0 Rc
Result D[31:16]
D[15:0]
Figure 5-33. RCREG Command/Result Formats
Table 5-19. Control Register Map
Rc Register Definition Rc Register Definition
0x002 Cache control register (CACR) 0x806 MAC accumulator (ACC)
0x004 Access control register 0 (ACR0) 0x80E Status register (SR)
0x005 Access control register 1 (ACR1) 0x80F Program register (PC)
0x801 Vector base register (VBR) 0xC04 RAM base address register (RAMBAR)
0x804 MAC status register (MACSR) 0xC0F Module base address (MBAR)
0x805 MAC mask register (MASK)
NOP
???
NEXT CMD
"CMD COMPLETE"
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Command Sequence:
Figure 5-34. RCREG Command Sequence
Operand Data: The only operand is the 32-bit Rc control register select field.
Result Data: Control register contents are returned as a longword, most-significant word first.
The implemented portion of registers smaller than 32 bits is guaranteed correct;
other bits are undefined.
5.5.3.3.10 Write Control Register (WCREG)
The operand (longword) data is written to the specified control register . The write alters all 32 register bits.
Command/Result Formats:
Command Sequence:
Figure 5-36. WCREG Command Sequence
15 12 11 8 7 4 3 0
Command 0x2 0x8 0x8 0x0
0x0 0x0 0x0 0x0
0x0 Rc
Result D[31:16]
D[15:0]
Figure 5-35. WCREG Command/Result Formats
EXT WORD
"NOT READY"
EXT WORD
"NOT READY"
RCREG
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
XXX
BERR
MS RESULT
READ
MEMORY
LOCATION
NEXT CMD
LS RESULT
XXX
MS ADDR CONTROL
REGISTER
MS ADDR
EXT WORD
"NOT READY"
EXT WORD
"NOT READY"
WCREG
???
NEXT CMD
"NOT READY"
XXX
"NOT READY"
XXX
XXX
BERR
"CMD COMPLETE"
NEXT CMD
WRITE
MEMORY
LOCATION
MS DATA
"NOT READY"
LS DATA
"NOT READY"
CONTROL
REGISTER
WRITE
MS ADDR MS ADDR
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Operand Data: This instruction requires two longword operands. The first selects the register to
which the operand data is to be written; the second contains the data.
Result Data: Successful write operations return 0xFFFF. Bus errors on the write cycle are
indicated by the setting of bit 16 in the status message and by a data pattern of
0x0001.
5.5.3.3.11 Read Debug Module Register (RDMREG)
Read the selected debug module register and return the 32-bit result. The only valid register selection for
the RDMREG command is CSR (DRc = 0x00). Note that this read of the CSR clears CSR[FOF , TRG, HAL T ,
BKPT]; as well as the trigger status bits (CSR[BSTAT]) if either a level-2 breakpoint has been triggered
or a level-1 breakpoint has been triggered and no level-2 breakpoint has been enabled.
Command/Result Formats:
Table 5-20 shows the definition of DRc encoding.
Command Sequence:
Figure 5-38. RDMREG Command Sequence
Operand Data: None
Result Data: The contents of the selected debug register are returned as a longword value. The
data is returned most-significant word first.
15 12 11 8 7 5 4 0
Command 0x2 0xD 100 DRc
Result D[31:16]
D[15:0]
Figure 5-37. RDMREG BDM Command/Result Formats
Table 5-20. Definition of DRc Encoding—Read
DRc[4:0] Debug Register Definition Mnemonic Initial State Page
0x00 Configuration/Status CSR 0x0 p. 5-10
0x01–0x1F Reserved — — —
XXX
MS RESULT
XXX
"ILLEGAL"
NEXT CMD
LS RESULT
NEXT CMD
"NOT READY"
RDMREG
???
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5.5.3.3.12 Write Debug Module Register (WDMREG)
The operand (longword) data is written to the specified debug module register. All 32 bits of the register
are altered by the write. DSCLK must be inactive while the debug module register writes from the CPU
accesses are performed using the WDEBUG instruction.
Command Format:
Table 5-3 shows the definition of the DRc write encoding.
Command Sequence:
Figure 5-40. WDMREG Command Sequence
Operand Data: Longword data is written into the specified debug register. The data is supplied
most-significant word first.
Result Data: Command complete status (0xFFFF) is returned when register write is complete.
5.6 Real-Time Debug Support
The ColdFire Family provides support debugging real-time applications. For these types of embedded
systems, the processor must continue to operate during debug. The foundation of this area of debug support
is that while the processor cannot be halted to allow debugging, the system can generally tolerate small
intrusions into the real-time operation.
The debug module provides three types of breakpoints—PC with mask, operand address range, and data
with mask. These breakpoints can be configured into one- or two-level triggers with the exact trigger
response also programmable. The debug module programming model can be written from either the
external development system using the debug serial interface or from the processor’s supervisor
programming model using the WDEBUG instruction. Only CSR is readable using the external
development system.
Figure 5-39. WDMREG BDM Command Format
15 12 11 8 7 5 4 0
0x2 0xC 100 DRc
D[31:16]
D[15:0]
MS DATA
"NOT READY"
XXX
"ILLEGAL"
LS DATA
"NOT READY"
NEXT CMD
"NOT READY"
WDMREG
???
NEXT CMD
"CMD COMPLETE"
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5.6.1 Theory of Operation
Breakpoint hardware can be configured to respond to triggers in several ways. The response desired is
programmed into TDR. As shown in Table 5-21, when a breakpoint is triggered, an indication
(CSR[BSTAT]) is provided on the DDATA output port when it is not displaying captured processor status,
operands, or branch addresses.
The breakpoint status is also posted in CSR. Note that CSR[BSTAT] is cleared by a CSR read when either
a level-2 breakpoint is triggered or a level-1 breakpoint is triggered and a level-2 breakpoint is not enabled.
Status is also cleared by writing to TDR.
BDM instructions use the appropriate registers to load and configure breakpoints. As the system operates,
a breakpoint trigger generates the response defined in TDR.
PC breakpoints are treated in a precise manner—exception recognition and processing are initiated before
the excepting instruction is executed. All other breakpoint events are recognized on the processor’s local
bus, but are made pending to the processor and sampled like other interrupt conditions. As a result, these
interrupts are imprecise.
In systems that tolerate the processor being halted, a BDM-entry can be used. With TDR[TRC] =01, a
breakpoint trigger causes the core to halt (PST = 0xF).
If the processor core cannot be halted, the debug interrupt can be used. With this configuration,
TDR[TRC] = 10, the breakpoint trigger becomes a debug interrupt to the processor, which is treated higher
than the nonmaskable level-7 interrupt request. As with all interrupts, it is made pending until the
processor reaches a sample point, which occurs once per instruction. Again, the hardware forces the PC
breakpoint to occur before the targeted instruction executes. This is possible b ecause the PC breakpoint is
enabled when interrupt sampling occurs. For address and data breakpoints, reporting is considered
imprecise because several instructions may execute after the triggering address or data is detected.
As soon as the debug interrupt is recognized, the processor aborts execution and initiates exception
processing. This event is signaled externally by the assertion of a unique PST value (PST = 0xD) for
multiple cycles. The core enters emulator mode when exception processing begins. After the standard
8-byte exception stack is created, the processor fetches a unique exception vector, 12, from the vector
table.
Table 5-21. DDATA[3:0]/CSR[BSTAT] Breakpoint Response
DDATA[3:0]/CSR[BSTAT] 1
1Encodings not shown are reserved for future use.
Breakpoint Status
0000/0000 No breakpoints enabled
0010/0001 Waiting for level-1 breakpoint
0100/0010 Level-1 breakpoint triggered
1010/0101 Waiting for level-2 breakpoint
1100/0110 Level-2 breakpoint triggered
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Execution continues at the instruction address in the vector corresponding to the breakpoint triggered. All
interrupts are ignored while the processor is in emulator mode. The debug interrupt handler can use
supervisor instructions to save the necessary contex t such as the state of all progr am-visible registers into
a reserved memory area.
When debug interrupt operations complete, the RTE instruction executes and the processor exits emulator
mode. After the debug interrupt handler completes execution, the external development system can use
BDM commands to read the reserved memory locations.
If a hardware breakpoint such as a PC trigger is left unmodified by the debug interrupt service routine,
another debug interrupt is generated after the completion of the RTE instruction.
5.6.1.1 Emulator Mode
Emulator mode is used to facilitate non-intrusive emulator functionality . This mode can be entered in three
different ways:
• Setting CSR[EMU] forces the processor into emulator mode. EMU is examined only if RSTI is
negated and the processor begins reset exception processing. It can be set while the processor is
halted before reset exception processing begins. See Section 5.5.1, “CPU Halt.”
• A debug interrupt always puts the processor in emulation mode when debug interrupt exception
processing begins.
• Setting CSR[TRC] forces the processor into emulation mode when trace exception processing
begins.
While operating in emulation mode, the processor exhibits the following properties:
• All interrupts are ignored, including level-7 interrupts.
• If CSR[MAP] = 1, all caching of memory and the SRAM module are disabled. All memory
accesses are forced into a specially mapped address space signaled by TT = 0x2, TM = 0x5 or 0x6.
This includes stack frame writes and the vector fetch for the exception that forced entry into this
mode.
The RTE instruction exits emulation mode. The processor status output port provides a unique encoding
for emulator mode entry (0xD) and exit (0x7).
5.6.2 Concurrent BDM and Processor Operation
The debug module supports concurrent operation of both the processor and most BDM commands. BDM
commands may be executed while the processor is running, except those following operations that access
processor/memory registers:
• Read/write address and data registers
• Read/write control registers
For BDM commands that access memory, the debug module requests the processor’s local bus. The
processor responds by stalling the instruction fetch pipeline and waiting for current bus activity to
complete before freeing the local bus for the debug module to perform its access. After the debug module
bus cycle, the processor reclaims the bus.
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Breakpoint registers must be carefully configured in a development system if the processor is executing.
The debug module contains no hardware interlocks, so TDR should be disabled while breakpoint registers
are loaded, after which TDR can be written to define the exact trigger. This prevents spurious breakpoint
triggers.
Because there are no hardware interlocks in the debug unit, no BDM operations are allowed while the CPU
is writing the debug’s registers (DSCLK must be inactive).
Note that the debug module requires the use of the internal bus to perform BDM commands. In Revision
A, if the processor is executing a tight loop that is contained within a single aligned longword, the
processor may never grant the internal bus to the debug module, for example:
align4
label1: nop
bra.b label1
or
align4
label2: bra.w label2
The processor grants the internal bus if these loops are forced across two longwords.
5.7 Processor Status, DDATA Definition
This section specifies the ColdFire processor and debug module’ s generation of the processor status (PST)
and debug data (DDATA) output on an instruction basis. In general, the PST/DDATA output for an
instruction is defined as follows:
PST = 0x1, {PST = [0x89B], DDATA= operand}
where the {...} definition is optional operand information defined by the setting of the CSR.
The CSR provides capabilities to display operands based on reference type (read, write, or both). A PST
value {0x8, 0x9, or 0xB} identifies the size and presence of valid data to follow on the DDATA output {1,
2, or 4 bytes}. Additionally, for certain change-of-flow branch instructions, CSR[BTB] provides the
capability to display the target instruction address on the DDATA output {2, 3, or 4 bytes} using a PST
value of {0x9, 0xA, or 0xB}.
5.7.1 User Instruction Set
Table 5-22 shows the PST/DDATA specification for user -mode instructions. Rn represents any {Dn, An}
register. In this definition, the ‘y’ suffix generally denotes the source and ‘x’ denotes the destination
operand. For a given instruction, the optional operand data is displayed only for those ef fective addresses
referencing memory.The ‘DD’ nomenclature refers to the DDATA outputs.
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Table 5-22. PST/DDATA Specification for User-Mode Instructions
Instruction Operand Syntax PST/DDATA
add.l <ea>y,Rx PST = 0x1, {PST = 0xB, DD = source operand}
add.l Dy,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
addi.l #imm,Dx PST = 0x1
addq.l #imm,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
addx.l Dy,Dx PST = 0x1
and.l <ea>y,Dx PST = 0x1, {PST = 0xB, DD = source operand}
and.l Dy,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
andi.l #imm,Dx PST = 0x1
asl.l {Dy,#imm},Dx PST = 0x1
asr.l {Dy,#imm},Dx PST = 0x1
bcc.{b,w} if taken, then PST = 0x5, else PST = 0x1
bchg #imm,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
bchg Dy,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
bclr #imm,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
bclr Dy,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
bra.{b,w} PST = 0x5
bset #imm,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
bset Dy,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
bsr.{b,w} PST = 0x5, {PST = 0xB, DD = destination operand}
btst #imm,<ea>x PST = 0x1, {PST = 0x8, DD = source operand}
btst Dy,<ea>x PST = 0x1, {PST = 0x8, DD = source operand}
clr.b <ea>x PST = 0x1, {PST = 0x8, DD = destination operand}
clr.l <ea>x PST = 0x1, {PST = 0xB, DD = destination operand}
clr.w <ea>x PST = 0x1, {PST = 0x9, DD = destination operand}
cmp.l <ea>y,Rx PST = 0x1, {PST = 0xB, DD = source operand}
cmpi.l #imm,Dx PST = 0x1
divs.l <ea>y,Dx PST = 0x1, {PST = 0xB, DD = source operand}
divs.w <ea>y,Dx PST = 0x1, {PST = 0x9, DD = source operand}
divu.l <ea>y,Dx PST = 0x1, {PST = 0xB, DD = source operand}
divu.w <ea>y,Dx PST = 0x1, {PST = 0x9, DD = source operand}
eor.l Dy,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
eori.l #imm,Dx PST = 0x1
ext.l Dx PST = 0x1
ext.w Dx PST = 0x1
extb.l Dx PST = 0x1
jmp <ea>x PST = 0x5, {PST = [0x9AB], DD = target address} 1
jsr <ea>x PST = 0x5, {PST = [0x9AB], DD = target address},
{PST = 0xB , DD = destination operand}1
lea <ea>y,Ax PST = 0x1
link.w Ay,#imm PST = 0x1, {PST = 0xB, DD = destination operand}
Debug Support
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5-38 Freescale Semiconductor
lsl.l {Dy,#imm},Dx PST = 0x1
lsr.l {Dy,#imm},Dx PST = 0x1
mac.l PST = 0x1
mac.l Ry,Rx PST = 0x1
mac.l Ry,Rx,ea,Rw PST = 0x1, {PST = 0xB, DD = source operand}
mac.w PST = 0x1
mac.w Ry,Rx PST = 0x1
mac.w Ry,Rx,ea,Rw PST = 0x1, {PST = 0xB, DD = source operand}
move.b <ea>y,<ea>x PST = 0x1, {PST = 0x8, DD = source}, {PST = 0x8, DD = destination}
move.l <ea>y,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
move.l <ea>y,ACC PST = 0x1
move.l <ea>y,MACSR PST = 0x1
move.l <ea>y,MASK PST = 0x1
move.l ACC,Rx PST = 0x1
move.l MACSR,CCR PST = 0x1
move.l MACSR,Rx PST = 0x1
move.l MASK,Rx PST = 0x1
move.w <ea>y,<ea>x PST = 0x1, {PST = 0x9, DD = source}, {PST = 0x9, DD = destination}
move.w CCR,Dx PST = 0x1
move.w {Dy,#imm},CCR PST = 0x1
movem.l #list,<ea>x PST = 0x1, {PST = 0xB, DD = destination},... 2
movem.l <ea>y,#list PST = 0x1, {PST = 0xB, DD = source},... 2
moveq #imm,Dx PST = 0x1
msac.l Ry,Rx PST = 0x1
msac.l Ry,Rx,ea,Rw PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
msac.w Ry,Rx PST = 0x1
msac.w Ry,Rx,ea,Rw PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
muls.l <ea>y,Dx PST = 0x1, {PST = 0xB, DD = source operand}
muls.w <ea>y,Dx PST = 0x1, {PST = 0x9, DD = source operand}
mulu.l <ea>y,Dx PST = 0x1, {PST = 0xB, DD = source operand}
mulu.w <ea>y,Dx PST = 0x1, {PST = 0x9, DD = source operand}
neg.l Dx PST = 0x1
negx.l Dx PST = 0x1
nop PST = 0x1
not.l Dx PST = 0x1
or.l <ea>y,Dx PST = 0x1, {PST = 0xB, DD = source operand}
or.l Dy,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
ori.l #imm,Dx PST = 0x1
pea <ea>y PST = 0x1, {PST = 0xB, DD = destination operand}
pulse PST = 0x4
Table 5-22. PST/DDATA Specification for User-Mode Instructions (continued)
Instruction Operand Syntax PST/DDATA
Debug Support
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Freescale Semiconductor 5-39
Exception ProcessingPST = 0xC,{PST = 0xB,DD = destination},// stack frame
{PST = 0xB,DD = destination},// stack frame
{PST = 0xB,DD = source},// vector read
PST = 0x5,{PST = [0x9AB],DD = target}// handler PC
The PST/DDATA specification for the reset exception is shown below:
Exception ProcessingPST = 0xC,
PST = 0x5,{PST = [0x9AB],DD = target}// handler PC
The initial references at address 0 and 4 are never captured nor displayed since these accesses are treated
as instruction fetches.
For all types of exception processing, the PST = 0xC value is driven at all times, unless the PST output is
needed for one of the optional marker values or for the taken branch indicator (0x5).
rems.l <ea>y,Dx:Dw PST = 0x1, {PST = 0xB, DD = source operand}
remu.l <ea>y,Dx:Dw PST = 0x1, {PST = 0xB, DD = source operand}
rts PST = 0x1, {PST = 0xB, DD = source operand},
PST = 0x5, {PST = [0x9AB], DD = target address}
scc Dx PST = 0x1
sub.l <ea>y,Rx PST = 0x1, {PST = 0xB, DD = source operand}
sub.l Dy,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
subi.l #imm,Dx PST = 0x1
subq.l #imm,<ea>x PST = 0x1, {PST = 0xB, DD = source}, {PST = 0xB, DD = destination}
subx.l Dy,Dx PST = 0x1
swap Dx PST = 0x1
trap #imm PST = 0x13
trapf PST = 0x1
tst.b <ea>x PST = 0x1, {PST = 0x8, DD = source operand}
tst.l <ea>x PST = 0x1, {PST = 0xB, DD = source operand}
tst.w <ea>x PST = 0x1, {PST = 0x9, DD = source operand}
unlk Ax PST = 0x1, {PST = 0xB, DD = destination operand}
wddata.b <ea>y PST = 0x4, {PST = 0x8, DD = source operand
wddata.l <ea>y PST = 0x4, {PST = 0xB, DD = source operand
wddata.w <ea>y PST = 0x4, {PST = 0x9, DD = source operand
1For JMP and JSR instructions, the optional target instruction address is displayed only for those effective address fields
defining variant addressing modes. This includes the following <ea>x values: (An), (d16,An), (d8,An,Xi), (d8,PC,Xi).
2For Move Multiple instructions (MOVEM), the processor automatically generates line-sized transfers if the operand address
reaches a 0-modulo-16 boundary and there are four or more registers to be transferred. For these line-sized transfers, the
operand data is never captured nor displayed, regardless of the CSR value.
The automatic line-sized burst transfers are provided to maximize performance during these sequential memory access
operations.
3During normal exception processing, the PST output is driven to a 0xC indicating the exception processing state. The
exception stack write operands, as well as the vector read and target address of the exception handler may also be displayed.
Table 5-22. PST/DDATA Specification for User-Mode Instructions (continued)
Instruction Operand Syntax PST/DDATA
Debug Support
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5.7.2 Supervisor Instruction Set
The supervisor instruction set has complete access to the user mode instructions plus the opcodes shown
below. The PST/DDATA specification for these opcodes is shown in Table 5-23.
The move-to-SR and RTE instructions include an optional PST = 0x3 value, indicating an entry into user
mode. Additionally, if the execution of a RTE instruction returns the processor to emulator mode, a
multiple-cycle status of 0xD is signaled.
Similar to the exception processing mode, the stopped state (PST = 0xE) and the halted state (PST = 0xF)
display this status throughout the entire time the ColdFire processor is in the given mode.
Table 5-23. PST/DDATA Specification for Supervisor-Mode Instructions
Instruction Operand Syntax PST/DDATA
cpushl PST = 0x1
halt PST = 0x1,
PST = 0xF
move.w SR,Dx PST = 0x1
move.w {Dy,#imm},SR PST = 0x1, {PST = 0x3}
movec Ry,Rc PST = 0x1
rte PST = 0x7, {PST = 0xB, DD = source operand}, {PST = 3}, { PST =0xB, DD =source
operand},
PST = 0x5, {[PST = 0x9AB], DD = target address}
stop #imm PST = 0x1,
PST = 0xE
wdebug <ea>y PST = 0x1, {PST = 0xB, DD = source, PST = 0xB, DD = source}
Debug Support
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5.8 Freescale-Recommended BDM Pinout
The ColdFire BDM connector, Figure 5-41, is a 26-pin Berg connector arranged 2 x 13.
Figure 5-41. Recommended BDM Connector
1
3
5
7
9
11
13
15
17
19
21
23
25
2
4
6
8
10
12
14
16
18
20
22
24
26
Developer reserved 1
GND
GND
RESET
Pad-Voltage2
GND
PST2
PST0
DDATA2
DDATA0
Freescale reserved
GND
Core-Voltage
BKPT
DSCLK
Developer reserved 1
DSI
DSO
PST3
PST1
DDATA3
DDATA1
GND
Freescale reserved
PSTCLK
2Supplied by target
1Pins reserved for BDM developer use.
TEA
Debug Support
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Chapter 6
System Integration Module (SIM)
This chapter provides detailed operation information regarding the system integration module (SIM). It
describes the SIM programming model, bus arbitration, power management, and system-protection
functions for the MCF5272.
6.1 Features
The SIM, shown in Figure 6-1, provides overall control of the bus and serves as the interface between the
ColdFire core processor complex and the internal peripheral devices.
Figure 6-1. SIM Block Diagram
SDRAM Controller External
Bus Interface
SYSTEM INTEGRATION MODULE (SIM)
32-Bit Address Bus
32-Bit Data Bus
Interrupt Controller
CS[7:0]
88
8
4 ICRs
MBAR
PIWR
CSORs CSBRs
INT[6:1]
6
DRAM Controller Outputs
PIVR
PITR
ISR
WRRR
WIRRALPR
PMR
System Control Base Address
DIR
Identification
SDRAM Control
SDCR
Parallel Port
Four
Two UARTs
DMA
Ethernet
General-
Purpose
Timers
V2 COLDFIRE PROCESSOR COMPLEX
Control Signals
Chip Select Module
SPR
SCR WCR
WER
USB
QSPI
PLIC
PACNT–
PDCNT PADDR–
PCDDR PADR–
PCDR
SDRAM Timer
SDTR
PWM
System Integration Module (SIM)
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The following is a list of the key SIM features:
• Module base address register (MBAR)
— Base address location of all internal peripherals, SIM resources, and memory-mapped registers
— Address space masking to internal peripherals and SIM resources
• Interrupt controller
— Programmable interrupt level (1–7) for internal peripheral interrupts
— Up to six external interrupt request inputs
—See Chapter 7, “Interrupt Controller.”
• Chip select module
— Eight dedicated programmable chip selects
— Address masking for memory block sizes from 4 Kbytes to 2 Gbytes
— Programmable wait states and port sizes
— Programmable address setup
— Programmable address hold for read and write
— SDRAM controller interface supported with CS7/SDCS
See Chapter 8, “Chip Select Module.”
• System protection
— Hardware watchdog timer. See Section 6.2.3, “System Configuration Register (SCR).”
— Software watchdog timer. See Section 6.2.8, “Software Watchdog Timer
• Pin assignment register (PAR) configures the parallel port. See Section 6.2.3, “System
Configuration Register (SCR).”
• Power management
— Individual control for each on-chip peripheral
— Choice of low-power modes
See Section 6.2.5, “Power Management Register (PMR).”
• Bus arbitration
— Configure arbitration for internal bus among ColdFire core, Ethernet controller, and DMA
controller. See Section 6.2.3, “System Configuration Register (SCR).”
6.2 Programming Model
The following sections describe the registers incorporated into the SIM.
6.2.1 SIM Register Memory Map
Table 6-1 shows the memory map for the SIM registers. The internal registers in the SIM are
memory-mapped registers offset from the MBAR address pointer defined in MBAR[BA]. This
supervisor-level register is described in Section 6.2.2, “Module Base Address Register (MBAR).” Because
SIM registers depend on the base address defined in MBAR[BA], MBAR must be programmed before
SIM registers can be accessed.
System Integration Module (SIM)
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Freescale Semiconductor 6-3
6.2.2 Module Base Address Register (MBAR)
The supervisor-level MBAR, Figure 6-2, specifies the base address and allowable access types for all
internal peripherals. It is written with a MOVEC instruction using the CPU address 0xC0F. (See the
ColdFire Family Programmer’s Reference Manual.) MBAR can be read or written through the debug
module as a read/write register, as described in.” Once MBAR has been initialized, it can be read and
written in supervisor mode at the address programmed into the base address (BA) field.
The valid bit, MBAR[V], is cleared at system reset to prevent incorrect references before MBAR is
written; other MBAR bits are uninitialized at reset. To access internal peripherals, write MBAR with the
appropriate base address (BA) and set MBAR[V] after system reset.
All internal peripheral registers occupy a single relocatable memory block along 64-Kbyte boundaries. If
MBAR[V] is set, MBAR[BA] is compared to the upper 16 bits of the full 32-bit internal address to
Table 6-1. SIM Registers
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x000 Module base address register (MBAR), after initialization [p. 6-3]
0x004 System configuration register (SCR) [p. 6-5] System protection register (SPR) [p. 6-6]
0x008 Power management register (PMR) [p. 6-7]
0x00C Reserved Active low power register (ALPR) [p. 6-10]
0x010 Device identification register (DIR) [p. 6-11]
0x014–
0x01C
Reserved
Interrupt Controller Registers
0x020 Interrupt control register 1 (ICR1) [p. 7-4]
0x024 Interrupt control register 2 (ICR2) [p. 7-5]
0x028 Interrupt control register 3 (ICR3) [p. 7-5]
0x02C Interrupt control register 4 (ICR4) [p. 7-5]
0x030 Interrupt source register (ISR) [p. 7-6]
0x034 Programmable interrupt transition register (PITR) [p. 7-7]
0x038 Programmable interrupt wakeup register (PIWR) [p. 7-8]
0x03C Reserved Programmable interrupt
vector register (PIVR) [p.
7-9]
Software Watchdog Registers
0x280 Watchdog reset reference register (WRRR) [p. 6-12] Reserved
0x284 Watchdog interrupt reference register (WIRR) [p. 6-12] Reserved
0x288 Watchdog counter register (WCR) [p. 6-13] Reserved
0x28C Watchdog event register (WER) [p. 6-13] Reserved
System Integration Module (SIM)
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determine if an internal peripheral is being accessed. MBAR masks specific address spaces using the
address space fields. Attempts to access a masked address space generate an external bus access.
Addresses hitting overlapping memory spaces take the following priority:
1. SRAM, ROM, and cache
2. MBAR
3. Chip select
Thus, if an overlapping address hits in the SRAM, ROM, or cache, the SIM will not generate a bus cycle,
either externally or to an on-chip peripheral.
NOTE
The MBAR region must be mapped to non-cacheable space.
Table 6-2 describes MBAR fields.
The following example shows how to set the MBAR to location 0x1000_0000 using the D0 register.
Setting MBAR[V] validates the MBAR location. This example assumes all accesses are valid:
move.1 #0x10000001,DO
movec DO,MBAR
31 16 15 5 4 3 2 1 0
Field BA — SC SD UC UD V
Reset Undefined 0
R/W W initially through MOVEC; R/W after initialization in supervisor mode
Address CPU + 0x0C0F initially; MBAR+0x000 after initialization
Figure 6-2. Module Base Address Register (MBAR)
Table 6-2. MBAR Field Descriptions
Bits Field Description
31–16 BA Base address. Defines the base address for a 64-Kbyte address range.
15–5 — Reserved, should be cleared.
4 SC Setting masks supervisor code space in MBAR address range
3 SD Setting masks supervisor data space in MBAR address range
2 UC Setting masks user code space in MBAR address range
1 UD Setting masks user data space in MBAR address range
0 V Valid. Determines whether MBAR settings are valid.
0 MBAR contents are invalid.
1 MBAR contents are valid.
Attribute Mask Bits
System Integration Module (SIM)
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6.2.3 System Configuration Register (SCR)
The system configuration register (SCR), Figure 6-3, provides information and control for a variety of
system features.
Table 6-3 describes SCR fields.
15 14 13 12 11 9 8 7 6 5 4 3 2 0
Field 1 0 RSTSRC — Priority AR SoftRST — BusLock HWR
Reset 1 0 seeTable 6 - 3 0000_1000_0111
R/W R/W; except for RSTSRC[1:0], which are read only
Address MBAR + 0x004
Figure 6-3. System Configuration Register (SCR)
Table 6-3. SCR Field Descriptions
Bits Field Description
15-14 — Reserved. Bit 15 always reads as a 1, bit 14 as a 0. Writing to these bits has no effect.
13–12 RSTSRC Reset source. Indicates the source of the last device reset.
00 Reserved
01 RSTI asserted, DRESETEN not asserted
10 Software watchdog
11 RSTI and DRESETEN asserted
11–9 — Reserved, should be cleared.
8 Priority Selects the bus arbiter priority scheme.
0 Ethernet has highest priority, DMA has next highest priority, CPU has lowest priority.
1 CPU has highest priority, DMA has next highest priority, Ethernet has lowest priority.
This bit should be cleared if the Ethernet module is enabled.
7 AR Assume request. Selects the bus mastership scheme.
0 Current bus master relinquishes the bus after the current bus cycle.
1 Assume current bus master wants the bus for the next bus cycle and include it in the arbitration process.
If AR is set and the current bus master has a higher priority than other requesting masters but is not
requesting the bus for the next cycle, there is a 1 clock dead cycle before the arbiter can reassign the
bus to the next highest priority master.
6 SoftRST Writing a one to this bit resets the on-chip peripherals, excluding the chip select module, interrupt
controller module, GPIO module, and SDRAM controller, and asserts RSTO. The CPU is not reset. The
reset remains asserted for 128 clock cycles. This bit is automatically cleared on negation of the reset.
5–4 — Reserved, should be cleared.
System Integration Module (SIM)
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6.2.4 System Protection Register (SPR)
The system protection register (SPR), Figure 6-4, provides information about bus cycles that have
generated error conditions. These error conditions can optionally generate an access error exception by
using the enable bits.
Figure 6-4. System Protection Register (SPR)
Table 6-4 describes SPR fields.
3 BusLock Locks the ownership of the bus.
0 Ownership of the bus is determined by arbitration.
1 Current bus master retains ownership of the bus indefinitely.
2–0 HWR Hardware watchdog reference. Determines how many clocks to wait before timing out a bus cycle when
SPR[HWTEN] is set. The value programmed should be longer than the response time of the slowest
external peripheral in the system.
000 128
001 256
010 512
011 1024
100 2048
101 4096
110 8192
111 16384
15 14 13 12 11 10 9 8
Field ADC WPV SMV PE HWT RPV EXT SUV
Reset 0000_0000
R/W R/W
76543210
Field ADCEN WPVEN SMVEN PEEN HWTEN RPVEN EXTEN SUVEN
Reset 0000_1011
R/W R/W
Address MBAR + 0x006
Table 6-4. SPR Field Descriptions
Bits Fields Description
15, 7 ADC,
ADCEN
Address decode conflict. This bit is set when an address matches against two chip selects. If ADCEN is
also set, the bus cycle is terminated with an access error exception.
14, 6 WPV,
WPVEN
Write protect violation. This bit is set when a write access is attempted to an area for which the chip select
is set to read only. If WPVEN is also set, the bus cycle is terminated with an access error exception.
13, 5 SMV,
SMVEN
Stopped module violation. This bit is set when an access is attempted to an on-chip peripheral whose
clock has been stopped. If SMVEN is also set, the bus cycle is terminated with an access error exception.
12, 4 PE, PEEN Peripheral error. This bit is set when an access to an on-chip peripheral is terminated with a transfer error.
If PEEN is also set, the bus cycle is terminated with an access error exception.
Table 6-3. SCR Field Descriptions (continued)
Bits Field Description
System Integration Module (SIM)
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6.2.5 Power Management Register (PMR)
The power management register (PMR), Figure 6-5, is used to control the various low-power options
including low-power sleep, low-power stop, and powering down individual on-chip modules.
Table 6-5 describes PMR fields.
11, 3 HWT,
HWTEN
Hardware watchdog timeout. This bit is set when the hardware watchdog timer has reached its
programmed timeout value. If HWTEN is also set, the bus cycle is terminated with an access error
exception.
10, 2 RPV,
RPVEN
Read protect violation. This bit is set when a read access is attempted to an area for which the chip select
is set to write only. If RPVEN is also set, the bus cycle is terminated with an access error exception.
9, 1 EXT,
EXTEN
External transfer error. This bit is set when an external transfer error is reported to the SIM on TEA. If
EXTEN is also set, the bus cycle is terminated with an access error exception.
8, 0 SUV,
SUVEN
Supervisor/user violation. This bit is set when a user mode access is attempted to an area for which the
chip select is set to supervisor only. If SUVEN is also set, the bus cycle is terminated with an access error
exception.
31 30 27 26 25 24
Field BDMPDN — ENETPDN PLIPDN DRAMPDN
Reset 0000_0000
R/W R/W, Supervisor mode only
23 22 21 20 19 18 17 16
Field DMAPDN PWMPDN QSPIPDN TIMERPDN GPIOPDN USBPDN UART1PDN UART0PDN
Reset 0000_0000
R/W R/W, Supervisor mode only
15 11 10 9 8
Field — USBWK UART1WK UART0WK
Reset 0000_0000
R/W R/W, Supervisor mode only
765 4 3 0
Field — MOS SLPEN —
Reset 0000_0000
R/W R/W, Supervisor mode only
Address MBAR+0x008
Figure 6-5. Power Management Register (PMR)
Table 6-4. SPR Field Descriptions (continued)
Bits Fields Description
System Integration Module (SIM)
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Table 6-5. PMR Field Descriptions
Bits Field Description
31 BDMPDN Debug power-down enable. Controls the clocking to the debug module.
0 Clock enabled.
1 Clock disabled.
30–27 — Reserved, should be cleared.
26 ENETPDN Ethernet power-down enable. Controls the clocking to the ethernet module.
0 Clock enabled.
1 Clock disabled.
25 PLIPDN PLIC power-down enable. Controls the clocking to the PLIC module.
0 Clock enabled.
1 Clock disabled.
24 DRAMPDN DRAM controller power-down enable. Controls the clocking to the DRAM controller module.
0 Clock enabled.
1 Clock disabled.
23 DMAPDN DMA controller power-down enable. Controls the clocking to the DMA controller module.
0 Clock enabled.
1 Clock disabled.
22 PWMPDN PWM power-down enable. Controls the clocking to the PWM module.
0 Clock enabled.
1 Clock disabled.
21 QSPIPDN QSPI power-down enable. Controls the clocking to the QSPI module.
0 Clock enabled.
1 Clock disabled.
20 TIMERPDN Timer power-down enable. Controls the clocking to the timer module.
0 Clock enabled.
1 Clock disabled.
19 GPIOPDN Parallel port power-down enable. Controls the clocking to the parallel port module.
0 Clock enabled.
1 Clock disabled.
18 USBPDN USB power-down enable. Controls the clocking to the USB module. Clocking to the USB module may
be turned on by USD_D+ or INT1/USB_WOR, at which time this bit is automatically cleared.
0 Clock enabled.
1 Clock disabled.
17 UART1PDN UART1 power-down enable. Controls the clocking to the UART1 module. Clocking to the UART1
module may be restored when a change in signal level is detected on UART1RxD, at which time this
bit is automatically cleared.
0 Clock enabled.
1 Clock disabled.
16 UART0PDN UART0 power-down enable. Controls the clocking to the UART0 module. Clocking to the UART0
module may be restored when a change in signal level is detected on UART0RxD, at which time this
bit is automatically cleared.
0 Clock enabled.
1 Clock disabled.
15-11 — Reserved, should be cleared.
System Integration Module (SIM)
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Freescale Semiconductor 6-9
Table 6-6 details the interaction between the PDN and WK bits for the USB and USART modules.
10 USBWK USB wakeup enable. Allows clocking to the USB module to be restored when a change in signal level
is detected on USD_D+ or INT1/USB_WOR. See Table 6-6 for a description of the interaction between
the PDN and WK bits.
0 Wakeup disabled.
1 Wakeup enabled. USBPDN must also be set.
9 UART1WK UART1 wakeup enable. Allows clocking to the UART1 module to be restored when a change in signal
level is detected on UART1RxD. See Table 6-6 for a description of the interaction between the PDN and
WK bits.
0 Wakeup disabled.
1 Wakeup enabled. UART1PDN must also be set.
8 UART0WK UART0 wakeup enable. Allows clocking to the UART0 module to be restored when a change in signal
level is detected on UART0RxD. See Table 6-6 for a description of the interaction between the PDN and
WK bits.
0 Wakeup disabled.
1 Wakeup enabled. UART0PDN must also be set.
7-6 — Reserved, should be cleared.
5 MOS Main oscillator stop. Allows the MCF5272 to be put into stop mode, in which internal clocking is stopped
to the entire processor. To enter stop mode, the user must write to the ALPR and then execute a STOP
instruction. See Section 6.2.6, “Activate Low-Power Register (ALPR).” It is not necessary to put any
on-chip modules in power down mode. After setting this bit, a write access must be made to the ALPR
register to actually enter stop mode. D[31:0] are driven low, and other bus signals are negated. Stop
mode is exited when an interrupt is detected on one the external interrupt pins, INT[6:1].
0 Stop mode disabled.
1 Stop mode enabled.
4 SLPEN Sleep enable. Allows the MCF5272 to be put into sleep mode in which internal clocking to the CPU is
disabled.To enter sleep mode, the user must write to the ALPR and then execute a STOP instruction.
See Section 6.2.6, “Activate Low-Power Register (ALPR).” Individual modules may have clocking
disabled through the appropriate PDN bits. After SLPEN is set, a write access must be made to ALPR
to actually enter sleep mode. D[31:0] are driven low, and other bus signals are negated. Sleep mode is
exited when an interrupt is detected from an on-chip peripheral or one of the external interrupt pins,
INT[6:1].
0 Sleep mode disabled.
1 Sleep mode enabled.
3-0 — Reserved, should be cleared.
Table 6-6. USB and USART Power Down Modes
PDN WK Description
0 X Module powered up and operating normally.
1 0 Module in power down and can only be reactivated by clearing PDN.
1 1 Module in power down and can be reactivated by clearing PDN or detecting signal on the receive pins.
Table 6-5. PMR Field Descriptions (continued)
Bits Field Description
System Integration Module (SIM)
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6.2.6 Activate Low-Power Register (ALPR)
ALPR, Figure 6-6, is used to put the MCF5272 into a low power mode (sleep or stop). A low-power mode
is activated by a write access with any data to ALPR followed by a STOP instruction.
The sequence to enter sleep mode is as follows:
1. Set power down and wakeup enable bits in the PMR as desired; set PMR[SLPEN].
2. Set the CPU interrupt priority level in the status register (SR). Interrupts below this level do not
reactivate the CPU. Note that any interrupt will cause the processor to exit low-power mode, but
only unmasked interrupts will cause the processor to resume operation.
3. Perform a write access with any data to ALPR.
4. Execute the STOP instruction. This must be the next instruction executed after the write to the
ALPR.
Sleep mode is exited by an interrupt request from by either an external device or an on-chip peripheral as
detailed in Table 6-7.
The sequence to enter stop mode is:
1. Set PMR[MOS]; clear PMR[SLPEN].
2. Set the CPU interrupt priority level in the status register (SR). Interrupts below this level do not
reactivate the CPU.
3. Perform a write access with any data to ALPR.
4. Execute the STOP instruction. This must be the next instruction executed after the write to the
ALPR.
Stop mode is exited by an interrupt request from an external device as detailed in Table 6-7.
15 0
Field ALPHR
Reset 0000_0000_0000_0000
R/W Write only
Address MBAR + 0x00E
Figure 6-6. Activate Low-Power Register (ALPR)
Table 6-7. Exiting Sleep and Stop Modes
Interrupt Source Exit Sleep Exit Stop USB Wake-on-Ring
Interrupts, INT6–INT2 Yes Ye s No
Interrupt, INT1 Yes Yes Yes
USART1, USART2 Yes, interrupt and Rx signal change No No
QSPI Yes No No
USB Yes, interrupt and Rx signal change No No
PLIC Yes, interrupt No No
General purpose I/O No No No
System Integration Module (SIM)
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6.2.7 Device Identification Register (DIR)
The DIR, Figure 6-7, contains a value representing the identification mark for the MCF5272 device. This
register contains the same value as the JTAG IDCODE register . The version number field will change if a
new revision of the MCF5272 is created.
Figure 6-7. Device Identification Register (DIR)
Table 6-8 describes the DIR fields.
6.2.8 Software Watchdog Timer
The software watchdog timer prevents system lockup should the software become trapped in loops with
no controlled exit. The software watchdog timer can be enabled or disabled through WRRR[EN]. If
enabled, the watchdog timer requires the periodic execution of a software watchdog servicing sequence.
If this periodic servicing action does not occur, the timer counts until it reaches the reset timeout value,
resulting in a hardware reset with RSTO driven low for 16 clocks. SCR[RSTSRC] is updated to indicate
that the software watchdog caused the reset.
General purpose timers Yes, interrupt No No
Ethernet Yes, interrupt No No
DMA controller Yes, interrupt No No
PWM No No No
Hardware watchdog timer No No No
Software watchdog timer Yes, interrupt No No
31 28 27 22 21 12 11 1 0
Field Version
Number
Design Center Device Number JEDEC ID —
Value 0010
forK75N
0100_01 00_0000_0011 0000_0001_110 1
R/W Read only
Address MBAR+0x010
Table 6-8. DIR Field Descriptions
Bits Description
31–28 Version number. Indicates the revision number of the MCF5272.
27–22 Design center. Indicates the ColdFire design center
21–12 Device number. Indicates an MCF5272
11–1 Indicates the reduced JEDEC ID for Freescale. Joint Electron Device Engineering Council (JEDEC) Publication
106-A and Chapter 11 of the IEEE Standard 1149.1 give more information on this field.
Table 6-7. Exiting Sleep and Stop Modes (continued)
Interrupt Source Exit Sleep Exit Stop USB Wake-on-Ring
System Integration Module (SIM)
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If an interrupt timeout value is programmed in WIRR, and this value is reached prior to the reset timeout
value, WER[WIE] is set and a maskable interrupt is issued at the level defined by ICR4[SWTOIPL].
The software watchdog consists of a 15-bit counter with a 15-bit prescaler. It counts up to a maximum of
32768, with a resolution of 32768 clock periods. Thus, at 66 MHz, the resolution of the watchdog is 0.5
msec, with a maximum timeout period of 32768 * 32768 = 230 clock periods or 16.267 S.
Timeout = (WRRR +1) * 32768 clocks
6.2.8.1 Watchdog Reset Reference Register (WRRR)
The watchdog reset reference register (WRRR), Figure 6-8, contains the reference value fo r the softwa re
watchdog timeout causing a reset.
Table 6-9 describes WRRR fields.
6.2.8.2 Watchdog Interrupt Reference Register (WIRR)
The watchdog interrupt reference register (WIRR), Figure 6-9, contains the reference value for the
software watchdog timeout causing an interrupt.
Table 6-10 describes WIRR fields.
15 10
Field REF EN
Reset 1111_1111_1111_1110
R/W R/W
Address MBAR + 0x280
Figure 6-8. Watchdog Reset Reference Register (WRRR)
Table 6-9. WRRR Field Descriptions
Bits Field Description
15–1 REF Reference value. This field determines the reset timeout value.Reset initializes this register to 0xFFFE,
disabling the watchdog timer and setting it to the maximum timeout value.
0 EN Enable watchdog. When enabled, software should periodically write to WCR to avoid reaching the reset
reference value.
0 Watchdog timer disabled.
1 Watchdog timer enabled.
15 10
Field REF IEN
Reset 1111_1111_1111_1110
R/W R/W
Address MBAR + 0x284
Figure 6-9. Watchdog Interrupt Reference Register (WIRR)
System Integration Module (SIM)
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6.2.8.3 Watchdog Counter Register (WCR)
The WCR, Figure 6-10, contains the 16 most significant bits of the software watchdog counter. Writing
any value to WCR resets the counter and prescaler and should be executed on a regular basis if the
watchdog is enabled.
6.2.8.4 Watchdog Event Register (WER)
The WER, Figure 6-11, reports when the watchdog timer reaches the WIRR value.
Table 6-11 describes WER fields.
Table 6-10. WIRR Field Descriptions
Bits Field Description
15-1 REF Reference value. Contains the reference value for the watchdog timeout causing an interrupt.
0 IEN Enable interrupt. When enabled, software should periodically write to WCR to avoid reaching the interrupt
reference value.
0 Disable interrupt.
1 Enable interrupt upon reaching interrupt reference value. If IEN is set when WER[WIE] = 1, an immediate
interrupt occurs.
15 0
Field COUNT
Reset 0000_0000_0000_0000
R/W R/W
Address MBAR + 0x288
Figure 6-10. Watchdog Counter Register (WCR)
15 10
Field — WIE
Reset 0000_0000_0000_0000
R/W R/W
Address MBAR + 0x28C
Figure 6-11. Watchdog Event Register (WER)
Table 6-11. WER Field Descriptions
Bits Field Description
15–1 — Reserved, should be cleared.
0 WIE Watchdog interrupt event.
0 WIRR value has not been reached.
1 WIRR value has been reached.
WIE is cleared by writing a 1 to it. The timer does not negate the interrupt request to the interrupt controller until
WIE is cleared. WIE is set regardless of the state of WIRR[IEN]; however, an interrupt is not asserted to the
controller unless WIRR[IEN] = 1.
System Integration Module (SIM)
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Chapter 7
Interrupt Controller
This chapter describes the operation of the interrupt controller portion of the system integration module
(SIM). It includes descriptions of the registers in the interrupt controller memory map and the interrupt
priority scheme.
7.1 Overview
The SIM provides a centralized interrupt controller for all MCF5272 interrupt sources, which consist of
the following:
• External interrupts INT[6:1]
• Timer modules
• UART modules
• PLIC module
• USB module
• DMA module
• Ethernet module
• QSPI module
• Software watchdog timer (SWT)
Figure 7-1 is a block diagram of the interrupt controller.
The SIM provides the following registers for managing interrupts:
• Four interrupt control registers (ICR1–ICR4), which are used to assign interrupt levels to the
interrupt sources.
• The interrupt source register (ISR) allows reading the instantaneous value of each interrupt source.
• The programmable interrupt transition register (PITR) specifies the triggering transition of the
external interrupt inputs.
• The programmable interrupt wakeup register (PIWR) specifies which interrupt sources can
reactivate the CPU from low-power sleep or stop mode.
• The programmable interrupt vector register (PIVR) specifies which vector number is returned in
response to an interrupt acknowledge cycle.
Interrupt Controller
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Figure 7-1. Interrupt Controller Block Diagram
7.2 Interrupt Controller Registers
The interrupt controller register portion of the SIM memory map is shown in Table 7-1.
All external interrupt inputs are edge sensitive, with the active edge being programmable through PITR.
An interrupt must remain asserted for at least three consecutive rising edges of CPU_ExtCLK to be
considered valid. The priority level of each interrupt source is programmed through the ICRs.
The MCF5272 does not support auto-vectored interrupts. Interrupt service routines for all interrupts should
have vectors in the user-defined interrupt region of the vector table (vectors 64–255). The location of these
vectors is programmable through the PIVR. For more information on the servicing of interrupts, see
Table 7-1. Interrupt Controller Registers
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x020 Interrupt control register 1 (ICR1) [p. 7-4]
0x024 Interrupt control register 2 (ICR2) [p. 7-5]
0x028 Interrupt control register 3 (ICR3) [p. 7-5]
0x02C Interrupt control register 4 (ICR4) [p. 7-5]
0x030 Interrupt source register (ISR) [p. 7-6]
0x034 Programmable interrupt transition register (PITR) [p. 7-8]
0x038 Programmable interrupt wakeup register (PIWR) [p. 7-9]
0x03C Reserved Programmable interrupt
vector register (PIVR)
[p. 7-9]
SYSTEM INTEGRATION MODULE (SIM)
Interrupt Controller
4 ICRs
PIWR
INT[1:6]
6
PIVR
PITR
ISR
Software
Watchdog
Four
Two UARTs
DMA
Ethernet
General-
Purpose
Timers
USB
QSPI
PLIC
Interrupt Controller
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Freescale Semiconductor 7-3
Chapter 2, “ColdFire Core.” Pending interrupts from external sources (INT[6:1]) can be cleared using the
ICRs.
For an interrupt to be successfully processed, stack RAM must be available. A programma ble chip select
is often used for the RAM, in which case, the RAM is not immediately available at startup. Thus, no
interrupts are recognized until PIVR is initialized. The RAM chip select and system stack should be set up
before this initialization.
If more than one interrupt source has the same interrupt priority level (IPL), the interrupt controller daisy
chains the interrupts with the priority order following the bit placement in the PIWR, with INT1 having
the highest priority and SWTO having the lowest priority, as shown in Figure 7-8.
7.2.1 Interrupt Controller Registers
This section describes the registers associated with the interrupt controller. Table 7-2 gives the
nomenclature used for the interrupt and power management registers.
Table 7-2. Interrupt and Power Management Register Mnemonics
Mnemonic or Portion Thereof Description
INT1, INT2, INT3, INT4, INT5, INT6 External interrupt signals 1–6.
TMR0, TMR1, TMR2, TMR3 Timers 3–0 from timer module
USB0, USB1, USB2, USB3, USB4, USB5,
USB6, USB7
USB endpoint 0–7
UART1, UART2 UART1, UART2 modules
PLIP PLIC 2-KHz periodic interrupt, 2B+D data
PLIA PLIC asynchronous and maintenance channels interrupt
DMA DMA controller interrupt
ETx Ethernet module transmit data interrupt
ERx Ethernet module receive data interrupt
ENTC Ethernet module non-time-critical interrupt
QSPI Queued serial peripheral interface
IPL2, IPL1, IPL0 Interrupt priority level bits 2–0
PI Pending interrupt
PDN Power down enable
WK Wakeup enable
SWTO Software watchdog timer time out
Interrupt Controller
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7.2.2 Interrupt Control Registers (ICR1–ICR4)
ICR1–ICR4 are used to configure interrupts from various on- and off-chip sources. When read, the data is
the last value written to the register with the exception of the PI bits, which are transitory functions. These
registers can be accessed as 8-, 16-, or 32-bit registers. An 8- or 16-bit write leaves the remaining bits
intact. To avoid altering other IPL fields when resetting interrupts generated by INT[6:1], read the
required byte, word, or longword from the appropriate ICR, AND.B/W/L its value with a mask whose IPL
bits are all 1 and whose PI bits are 1 for those sources whose PI bit is to be reset and 0 for those sources
whose PI bit is to be left unchanged.
7.2.2.1 Interrupt Control Register 1 (ICR1)
ICR1, Figure 7-2, is used to configure interrupts from various on- and off-chip sources.
Table 7-3 describes ICR1 fields.
31 30 28 27 26 24 23 22 20 19 18 16
Field INT1PI INT1IPL INT2PI INT2IPL INT3PI INT3IPL INT4PI INT4IPL
Reset 0000_0000_0000_0000
15 14 12 11 10 8 7 6 4 3 2 0
Field TMR0PI TMR0IPL TMR1PI TMR1IPL TMR2PI TMR2IPL TMR3PI TMR3IPL
Reset 0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x020
Figure 7-2. Interrupt Control Register 1 (ICR1)
Table 7-3. ICR Field Descriptions
Bits Name Description
31, 27,
23, 19,
15, 11, 7,
3
PI Pending interrupt. Writing a 1 enables the value for the corresponding IPL field to be set. Note: for
external interrupts only, writing a one to this bit clears the corresponding interrupt latch. The external
interrupt must be toggled before another interrupt is latched. For all on-chip interrupt sources, this bit
is cleared when the interrupt is cleared in the module registers.
0 No interrupt pending
1 An interrupt is pending.
30–28,
26–24,
22–20,
18–16,
14-12,
10–8,
6–4, 2–0
IPL Interrupt priority level. Specifies the IPL for the corresponding interrupt source. This field can be
changed only when a 1 is simultaneously written to the corresponding PI bit.
000 The corresponding INT source is inhibited and cannot generate interrupts. The state of the signal
can still be read in the ISR.
001–111The corresponding INT source is enabled and generates an interrupt with the indicated priority
level.
Interrupt Controller
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7.2.2.2 Interrupt Control Register 2 (ICR2)
ICR2, Figure 7-3, is used to configure interrupts from various on-chip sources.
Table 7-3 describes ICR2 fields.
7.2.2.3 Interrupt Control Register 3 (ICR3)
ICR3, Figure 7-4, is used to configure interrupts from various on-chip sources.
Table 7-3 describes ICR3 fields.
7.2.2.4 Interrupt Control Register 4 (ICR4)
ICR4, Figure 7-5, is used to configure interrupts from various on-chip sources.
Table 7-3 describes ICR4 fields.
31 30 28 27 26 24 23 22 20 19 18 16
Field UART1PI UART11IPL UART2PI UART2IPL PLIPPI PLIPIPL PLIAPI PLIAIPL
Reset 0000_0000_0000_0000
15 14 12 11 10 8 7 6 4 3 2 0
Field USB0PI USB0IPL USB1PI USB1IPL USB2PI USB2IPL USB3PI USB3IPL
Reset 0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x024
Figure 7-3. Interrupt Control Register 2 (ICR2)
31 30 28 27 26 24 23 22 20 19 18 16
Field USB4PI USB41IPL USB5PI USB5IPL USB6PI USB6IPL USB7PI USB7IPL
Reset 0000_0000_0000_0000
15 14 12 11 10 8 7 6 4 3 2 0
Field DMAPI DMAIPL ERXPI ERXIPL ETXPI ETXIPL ENTCPI ENTCIPL
Reset 0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x028
Figure 7-4. Interrupt Control Register 3 (ICR3)
31 30 28 27 26 24 23 22 20 19 18 16
Field QSPIPI QSPIIPL INT5PI INT5IPL INT6PI INT6IPL SWTOPI SWTOIPL
Reset 0000_0000_0000_0000
15 0
Field —
Reset 0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x02C
Figure 7-5. Interrupt Control Register 4(ICR4)
Interrupt Controller
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7.2.3 Interrupt Source Register (ISR)
The interrupt source register (ISR), Figure 7-6, is used to read the instantaneous value of all interrupt
sources, both internal and external. Note that the register bits give the value of the interrupt source prior
to input synchronization or polarity correction.
Table 7-4 describes ISR fields.
31 30 29 28 27 26 25 24
Field INT1 INT2 INT3 INT4 TMR0 TMR1 TMR2 TMR3
Reset XXXX_1111
R/W Read only
23 22 21 20 19 18 17 16
Field UART1 UART2 PLI_P PLI_A USB0 USB1 USB2 USB3
Reset 1111_1111
R/W Read only
15 14 13 12 11 10 9 8
Field USB4 USB5 USB6 USB7 DMA ERx ETx ENTC
Reset 1111_1111
R/W Read only
765 4 3 0
Field QSPI INT5 INT6 SWTO —
Reset 1XX1_0000
R/W Read only
Address MBAR+0x030
Figure 7-6. Interrupt Source Register (ISR)
Table 7-4. ISR Field Descriptions
Bits Field Description
31–4 — 0 Interrupt source is high.
1 Interrupt source is low.
3–0 — Reserved, should be cleared.
Interrupt Controller
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Freescale Semiconductor 7-7
7.2.4 Programmable Interrupt Transition Register (PITR)
The programmable interrupt transition register (PITR), Figure 7-7, specifies the triggering (either
high-to-low or low-to-high) on each of the external interrupt inputs.
Table 7-5 describes PITR fields.
31 30 29 28 27 16
Field INT1 INT2 INT3 INT4 —
Reset 0000_0000_0000_0000
15 7654 0
Field — INT5 INT6 —
Reset 0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x034
Figure 7-7. Programmable Interrupt Transition Register (PITR)
Table 7-5. PITR Field Descriptions
Bits Name Description
31–28,
6, 5
— 0 Triggering edge of external interrupt input is high-to-low (negative edge triggered).
1 Triggering edge of external interrupt input is low -to-high (positive edge triggered).
27–7,
4–0
— Reserved, should be cleared.
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7.2.5 Programmable Interrupt Wakeup Register (PIWR)
The programmable interrupt wakeup register (PIWR), Figure 7-8, is used to specify which interrupt
sources are capable of causing the CPU to wake up from low-power SLEEP or STOP modes when their
source is active. All sources are disabled on reset. Note that only the external interrupt pins INT[6:1] can
wake up the CPU from STOP mode.
If more than one interrupt source has the sa me interrupt priority level (IPL) programmed in the ICRs, the
interrupt controller daisy chains the interrupts with the priority order following the bit placement in the
PIWR, with INT1 having the highest priority and SWTO having the lowest priority as shown in Figure 7-8.
Table 7-6 describes PIWR fields.
31 30 29 28 27 26 25 24
Field INT1 INT2 INT3 INT4 TMR0 TMR1 TMR2 TMR3
Reset 1111_1111
R/W R/W
23 22 21 20 19 18 17 16
Field UART1 UART2 PLI_P PLI_A USB0 USB1 USB2 USB3
Reset 1111_1111
R/W R/W
15 14 13 12 11 10 9 8
Field USB4 USB5 USB6 USB7 DMA ERx ETx ENTC
Reset 1111_1111
R/W R/W
765 4 3 0
Field QSPI INT5 INT6 SWTO —
Reset 1111_0000
R/W R/W
Address MBAR+0x038
Figure 7-8. Programmable Interrupt Wakeup Register (PIWR)
Table 7-6. PIWR Field Descriptions
Bits Field Description
31–4 — 0 Interrupt cannot wake up the CPU when interrupt source is active.
1 Interrupt wakes up the CPU from low-power modes.
3–0 — Reserved, should be cleared.
Interrupt Controller
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7.2.6 Programmable Interrupt Vector Register (PIVR)
The programmable interrupt vector register (PIVR), Figure 7-9, specifies the vector numbers the interrupt
controller returns in response to interrupt acknowledge cycles for the various peripherals and discrete
interrupt sources.
Pending interrupts are presented to the processor core in order of priority from highest to lowest. The core
responds to an interrupt request by initiating an interrupt acknowledge cycle to receive a vector number,
which allows the core to locate the interrupt’s service routine. The interrupt controller is able to identify
the source of the highest priority interrupt that is being acknowledged and provide the interrupt vector to
the core. The three most significant bits of the interrupt vector are programmed by the user in the PIVR.
The lower five bits are provided by the interrupt controller, depending on the source, as shown in
Table 7-7.
If the core initiates an interrupt acknowledge cycle prior to the PIVR being programmed, the interrupt
controller returns the uninitialized interrupt vector (0x0F). If the core initiates an interrupt acknowledge
cycle after the PIVR has been initialized, but there is no interrupt pending, the interrupt controller returns
the user a spurious interrupt vector (0xxxx0_0000). Because the interrupt controller responds to all
interrupt acknowledges, a bus error situation cannot occur during an interrupt-acknowledge cycle.
Figure 7-9. Programmable Interrupt Vector Register (PIVR)
Table 7-7 describes PIVR fields.
754 0
Field IV —
Reset 0000_1111
R/W R/W
Address MBAR + 0x03F
Table 7-7. PIVR Field Descriptions
Bits Field Description
7-5 IV These bits provide the high three bits of the interrupt vector for interrupt acknowledge cycles from all sources.
To conform to the core interrupt vector allocation, these bits should be set equal to or greater than 010. See
Table 2-3.
4-0 — Reserved, should be cleared.
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Table 7-8 lists the values for the five least significant bits of the interrupt vector. The vector numbers
shown assume PIVR[IV]=0b010. If another value of PIVR[IV] is used, the vector numbers would change
accordingly.
Table 7-8. MCF5272 Interrupt Vector Table
Vector Number Bits 4–0 Source Function
64 00000 Reserved User Spurious Interrupt
65 00001 INT1 External Interrupt Input 1
66 00010 INT2 External Interrupt Input 2
67 00011 INT3 External Interrupt Input 3
68 00100 INT4 External Interrupt Input 4
69 00101 TMR0 Timer 0
70 00110 TMR1 Timer 1
71 00111 TMR2 Timer 2
72 01000 TMR3 Timer 3
73 01001 UART1 UART 1
74 01010 UART2 UART 2
75 01011 PLIP PLIC 2KHz Periodic
76 01100 PLIA PLIC Asynchronous
77 01101 USB0 USB Endpoint 0
78 01110 USB1 USB Endpoint 1
79 01111 USB2 USB Endpoint 2
80 10000 USB3 USB Endpoint 3
81 10001 USB4 USB Endpoint 4
82 10010 USB5 USB Endpoint 5
83 10011 USB6 USB Endpoint 6
84 10100 USB7 USB Endpoint 7
85 10101 DMA DMA Controller
86 10110 ERx Ethernet Receiver
87 10111 ETx Ethernet Transmitter
88 11000 ENTC Ethernet Module Non-time-critical
89 11001 QSPI Queued Serial Peripheral Interface
90 11010 INT5 External Interrupt Input 5
91 11011 INT6 External Interrupt Input 6
92 11100 SWTO Software Watchdog Timer Timeout
93 11101 Reserved Reserved
94 11110 Reserved Reserved
95 11111 Reserved Reserved
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Chapter 8
Chip Select Module
This chapter describes the chip select module, including the chip select registers, the configuration and
behavior of the chip select signals, and the global chip select functions.
8.1 Overview
The chip select module provides user-programmable control of the eight chip select and four byte strobe
outputs. This subsection describes the operation and programming model of the chip select registers,
including the chip select base and option registers.
8.1.1 Features
The following list summarizes the key chip select features:
• Eight dedicated programmable chip selects
• Address masking for memory block sizes from 4 Kbytes to 2 Gbytes
• Programmable wait states and port sizes
• Programmable address setup
• Programmable address hold for read and write
• SDRAM controller interface supported with CS7/SDCS
• Global chip select functionality
8.1.2 Chip Select Usage
Each of the eight chip selects, CS0–CS7, is configurable for external SRAM, ROM, and peripherals. CS0
is used to access external boot ROM and is enabled after a reset. The data bus width of the external ROM
must be configured at reset by having appropriate pull-down resistors on QSPI_CLK/BUSW1 and
QSPI_CS0/BUSW0. At reset these two signals replace the bus width field in the chip select 0 base register
(CSBR0[BW]).
CS7 must be used for enabling an external SDRAM array. In this mode, it is referred to as SDCS.
NOTE
A detailed description of each bus access type supported by the MCF5272
device is given in Chapter 20, “Bus Operation.”
Chip Select Module
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8-2 Freescale Semiconductor
8.1.3 Boot CS0 Operation
CS0 is enabled after reset and is used to access boot ROM. The memory port width of CS0 is defined by
the state of QSPI_CLK/BUSW1 and QSPI_CS0/BUSW0. These two bits should be configured to define
the width of the boot ROM connected to CS0, as described in Section 19.18, “Operating Mode
Configuration Pins.”
8.2 Chip Select Registers
Each chip select is controlled through two 32-bit registers. The chip select base registers (CSBR0–CSBR7)
are used to enable the chip select and to configure the base address, port size, bus interface type, and
address space. The chip select opt ion registers (CSOR0–CSOR7) are used to configure the address mask,
additional setup/hold, extended burst capability, wait states, and read/write access.
Table 8-1. CSCR and CSOR Values after Reset
Offset Name Chip Select Register Reset
+ 0x040 CSBR0 CS base register 0 0x0000_0x011
1The nibble shown as x resets as 00xx, where the undefined bits represent the
BW field. QSPI_CS0/BUSW0 and QSPI_CLK/BUSW1 program the bus width
for CS0 at reset
+ 0x044 CSOR0 CS option register 0 0xFFFF_F078
+ 0x048 CSBR1 CS base register 1 0x0000_1300
+ 0x04C CSOR1 CS option register 1 0xFFFF_F078
+ 0x050 CSBR2 CS base register 2 0x0000_2300
+ 0x054 CSOR2 CS option register 2 0xFFFF_F078
+ 0x058 CSBR3 CS base register 3 0x0000_3300
+ 0x05C CSOR3 CS option register 3 0xFFFF_F078
+ 0x060 CSBR4 CS base register 4 0x0000_4300
+ 0x064 CSOR4 CS option register 4 0xFFFF_F078
+ 0x068 CSBR5 CS base register 5 0x0000_5300
+ 0x06C CSOR5 CS option register 5 0xFFFF_F078
+ 0x070 CSBR6 CS base register 6 0x0000_6300
+ 0x074 CSOR6 CS option register 6 0xFFFF_F078
+ 0x078 CSBR7 CS base register 7 0x0000_7700
+ 0x07C CSOR7 CS option register 7 0xFFFF_F078
Chip Select Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 8-3
8.2.1 Chip Select Base Registers (CSBR0–CSBR7)
The CSBRs, Figure 8-1, provide a model internal bus cycle against which to match actual bus cycles to
determine whether a specific chip select should assert. A bus cycle in a specific chip select register causes
the assertion of the corresponding external chip select.
Table 8-2 describes CSBRn fields.
31 12 11 10 9 8 7 6 5 4 2 1 0
Field BA EBI BW SUPER TT TM CTM ENABLE
Reset CSBR0: 0x0000_0x011; CSBR1: 0x0000_1300; CSBR2: 0x0000_2300; CSBR3: 0x0000_3300;
CSBR4: 0x0000_4300; CSBR5: 0x0000_5300; CSBR6: 0x0000_6300; CSBR7: 0x0000_7700
R/W R/W
Addr 0x040 (CSBR0); 0x048 (CSBR1); 0x050 (CSBR2); 0x058 (CSBR3);
0x060 (CSBR4); 0x068 (CSBR5); 0x070 (CSBR6); 0x078 (CSBR7)
Figure 8-1. Chip Select Base Registers (CSBRn)
Table 8-2. CSBRn Field Descriptions
Bits Name Description
31–12 BA Base address. The starting address of the memory space covered by the chip select. BA is compared with
bits 31–12 of the access to determine whether the current bus cycle is intended for this chip select. Any
combination of BA bits can be masked in the associated CSOR.
11–10 EBI External bus interface modes. These modes are used to multiplex outputs and determine timing of the
appropriate bus interface module onto the device pins.
00 16-/32-bit SRAM/ROM. For 16-/32-bit wide memory devices with byte strobe inputs. CSBR0[EBI] = 00
at reset. Affects all chip selects.
01 SDRAM. One physical bank of SDRAM consisting of 16–256 Mbit devices. CSOR7[WS] must be set
to 0x1F. Affects only CS7/SDCS.
10 Reserved
11 Use SRAM/ROM timing for 8-bit devices without byte strobe inputs.
9–8 BW Bus width. Determines data bus size of the memory-mapped resource for all chip selects except CS0. It
is assumed that boot code for the processor is accessed through the global chip select CS0, so the initial
bus width for this chip select must be configured at reset. QSPI_CS0/BUSW0 and QSPI_CLK/BUSW1 are
used to program the bus width for CS0 at reset.
00 Longword (32 bits)
01 Byte (8 bits)
10 Word (16 bits)
11 Cache line (32 bits)
7 SUPER Supervisor mode.
0 Bus cycle may be in user or supervisor mode (neglecting conditions imposed by setting CTM).
1 The chip select asserts a match only if the transfer modifier indicates a supervisor mode access. A user
access matching BA causes an access error.
SUPER, CTM, TT, and TM are used to restrict bus access. For example, if TT and TM indicate a user data
access and SUPER and CTM are both set, no accesses can occur.
6–5 TT Transfer type. TT and TM may be used to further qualify the address match. If CTM is set, TT and TM must
match the access types for the chip select to assert. See the description of TM.
Chip Select Module
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8-4 Freescale Semiconductor
Table 8-3 describes the interaction between CSBRn[EBI], OE/RD, R/W, and SDWE.
NOTE
The MCF5272 compares the address for the current bus transfer with the
address and mask bits in the CSBRs and CSORs looking for a match. The
priority is listed in Table 8-4 (from highest priority to lowest priority):
4–2 TM Transfer modifier. Operates with TT to determine the access type.
TT TM Function
0x 000 Reserved
0x 001 User data access
0x 010 User instruction access
0x 011–100 Reserved
0x 101 Supervisor data access
0x 110 Supervisor instruction access
0x 111 Reserved
10 000–100 Reserved
10 101 Emulator mode data access
10 110 Emulator mode instruction access
10 111 Reserved
11 000 CPU space access
11 001 Interrupt acknowledge level 1
11 010 Interrupt acknowledge level 2
11 011 Interrupt acknowledge level 3
11 100 Interrupt acknowledge level 4
11 101 Interrupt acknowledge level 5
11 110 Interrupt acknowledge level 6
11 111 Interrupt acknowledge level 7
1 CTM Compare TM. Enables comparison between the access type and the TM and TT bits.
0 TT and TM register bits do not affect address match.
1 TT and TM register bits must match the access type for an address match to occur.
0 ENABLE Enable. Disables/enables the chip select. When disabled, the chip select is never asserted, regardless of
the address on the internal bus. ENABLE is 0 at reset, except CS0 which is 1.
0 Chip select is disabled, no matches can occur and chip select output cannot assert.
1 Chip select is enabled, bus cycles are compared against register contents.
Table 8-3. Output Read/Write Strobe Levels versus Chip Select EBI Code
EBI EBI Function Access Type OE/RD R/W SDWE
00 SRAM, ROM Write High Low High
Read Low High High
01 SDRAM Write High High Low
Read High High High
11 SRAM, ROM Write High Low High
Read Low High High
Table 8-2. CSBRn Field Descriptions (continued)
Bits Name Description
Chip Select Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 8-5
8.2.2 Chip Select Option Registers (CSOR0–CSOR7)
CSOR0–CSOR7, Figure 8-2, are used to configure the address mask, additional setup/hold, extended burst
capability, wait states, and read/write access.
Table 8-5 describes CSORn fields.
Table 8-4. Chip Select Memory Address Decoding Priority
Priority Chip Select
Highest Chip select 0
Chip select 1
Chip select 2
Chip select 3
Chip select 4
Chip select 5
Chip select 6
Lowest Chip select 7
31 12 11 10 9 8 7 6 2 1 0
Field BAM ASET WRAH RDAH EXTBURST — WS RW MRW
Reset 0xFFFF_F078
R/W R/W
Addr 0x044 (CSOR0); 0x04C (CSOR1); 0x054 (CSOR2); 0x05C (CSOR3);
0x064 (CSOR4); 0x06C (CSOR5); 0x074 (CSOR6); 0x07C (CSOR7)
Figure 8-2. Chip Select Option Registers (CSORn)
Table 8-5. CSORn Field Descriptions
Name Name Description
31–12 BAM Address mask. Masks equivalent CSOR[BA] bits. The BAM setting chooses which BA bits to compare
with the corresponding address bit to determine a match.
0 Mask address bit
1 Compare address bit
11 ASET Address setup enable. Controls assertion of chip select with respect to assertion of a valid address that
hits in the chip select address space.
0 Assert chip select on the rising edge of CLK that address is asserted.
1 Delay assertion of chip select for one CLK cycle after address is asserted. During write transfers,
both chip select and R/W are delayed by 1 clock cycle.
R/W asserts 1 clock cycle after assertion of the chip select.
10 WRAH Controls the address, data, and attribute hold time after the termination, internal or external with TA, of
a write cycle that hits in the chip select address space.
0 Do not hold address, data, and attribute signals an extra cycle after chip select and R/W negate on
writes.
1 Hold address, data, and attribute signals an extra cycle after CSx and R/W negate on writes.
Chip Select Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
8-6 Freescale Semiconductor
9 RDAH Controls the address and attribute hold time after the termination, internal or external with TA, of a read
cycle that hits in the chip select address space.
0 Do not hold address and attribute signals an extra cycle after chip select negates on reads.
1 Hold address and attribute signals an extra cycle after chip select negate on reads.
8 EXTBURST Enable extended burst. Valid only for CS7. Reserved bit for CS[0:5]. EXTBURST should be 1 when
external SDRAM is configured for a data bus narrower than the width programmed for the MCF5272.
EBI must be set for SDRAM and the BW must be set to the data bus width of the external SDRAM array.
Example: If the MCF5272 external physical data bus width is 32 or 16 bits but the external SDRAM is
16 bits wide, EXTBURST must be set and BW must be 10 (word) for SDCS.
0 Extended bursts are not enabled.
1 Extended bursts are enabled.
7 — Reserved, should be cleared.
6–2 WS Wait state generator. Specifies the number of wait states (in system clocks) needed before the SIM
generates an internal transfer acknowledge signal to terminate the access.
0x00 No wait states
0x01 1 wait state
...
0x1E 30 wait states
0x1F External access
For example, WS = 0x0A introduces a 10-clock wait before the bus cycle terminates; 0x1F indicates a
source external to the chip select module terminates the access.
For SRAM and ROM accesses EBI codes 00 or 11 and WS = 0x1F, TA must be driven from an external
source to terminate the bus cycle, otherwise the on-chip bus timeout monitor issues a bus error
exception.
For SRAM and ROM accesses with EBI = 00 or 11 and WS = 0x00–0x1E, the chip select module
terminates the bus cycle after the programmed number of system clocks.
For SDRAM accesses with SDCS, EBI = 01, and WS = 0x1F, bus cycles are terminated under control
of the SDRAM controller.
The CSOR0[WS] reset default is 0x1E. The default for all other CSORs is 0x00.
Caution: Never drive TA as an input to terminate SDRAM peripheral accesses.
1 RW RW and MRW determine whether the selected memory region is read only or write only.
0 Read only
1 Write only
0 MRW MRW must be set for value of RW be taken into consideration.
0 Memory covered by chip select is read/write. The memory covered by the chip select is neither read
nor write protected.
1 RW determines whether memory covered by chip select is read only or write only. A conflict causes
either a read or write protect violation.
Table 8-5. CSORn Field Descriptions (continued)
Name Name Description
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 9-1
Chapter 9
SDRAM Controller
This chapter describes configuration and operation of the synchronous DRAM controller component of
the SIM including a general description of signals involved in SDRAM operations. It provides interface
information for memory configurations using most common SDRAM devices for both 16- and 32-bit wide
data buses. The chapter concludes with signal timing diagrams.
9.1 Overview
The MCF5272 incorporates an SDRAM controller, whose main features are as follows:
• Glueless interface to a variety of JEDEC-compliant SDRAM devices.
• MCF5272 data bus width of 16 or 32 bits to SDRAM memory array
• 16- to 256-Mbit device support
• Dedicated bank address pins to provide pin out compatibility for different SDRAM sizes with a
single printed circuit board layout
• Page size from 256–1024 column address locations
• 6-1-1-1 timing for burst-read; 3-1-1-1 timing for burst-write accesses (assuming a page hit at 66
MHz)
• CAS latencies of 1 and 2
• Up to four concurrently activated banks
• SDRAM power down and self refresh
• Refresh timer prescaler supports system clock down to 5 MHz maintaining a 15.6-µS refresh cycle
• Auto initialization of SDRAM
9.2 SDRAM Controller Signals
The SDRAM controller provides all required signals for glueless interfacing to a variety of
JEDEC-compliant SDRAM devices. RAS/CAS address multiplexing and the SDRAM pin A10
auto-precharge function is software configurable for different page sizes. To maintain refresh capability
without conflicting with concurrent accesses on the address and data buses, RAS0, CAS0, SDWE,
SDBA[0:1], SDCLKE, A10_PRECHG, and the SDRAM bank selects are dedicated SDRAM signals.
Figure 9-1 shows the SDRAM controller signal configuration.
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
9-2 Freescale Semiconductor
Figure 9-1. SDRAM Controller Signals
Table 9-1 describes SDRAM controller signals.
Table 9-1. SDRAM Controller Signal Descriptions
Signal Description
A10_PRECHG A10 precharge strobe. A precharge cycle occurs only after a page miss. During precharge, the SDRAM
writes the designated on-chip RAM page buffer back into the SDRAM array. Precharge latency is set
in SDTR[RP]. The reset value is 2 cycles, RP = 01.
BS[3:0] For SDRAM devices, these outputs should be connected to individual DQM signals. During SDRAM
accesses, these signals indicate a byte transfer between SDRAM and the MCF5272 when asserted.
Note that most SDRAMs associate DQM3 with the MSB, in which case BS3 should be connected to
the SDRAM's DQM3 input, and so forth.
CAS0 SDRAM column address strobe output
DRESETEN DRESETEN is asserted to indicate that the SDRAM controller is to be reset whenever RSTI asserts. If
DRESETEN is negated, RSTI does not affect the SDRAM controller, which continues to refresh
external memory. This is useful for debug situations where a reset of the device is required without
losing data located in SDRAM. DRESETEN is normally tied high or low depending on system
requirements. It should never be tied to RSTI or RSTO.
RAS0 SDRAM row address strobe output
SDA[13:0]/
A[22:0]
Fourteen address signals are multiplexed to form SDRAM_ADR[13:0], which are used for connecting
to SDRAM devices as large as 256 Mbits. SDRAM can be configured for 16- or 32-bit wide interface to
the MCF5272 data bus. For an SDRAM array with a 32-bit data bus, SDRAM address signals are
multiplexed starting with A2. For a 16-bit data bus, address signals are multiplexed starting with A1.
SDBA[1:0] SDRAM controller bank address select outputs. Assigned to internal high-order address signals by
programming SDCR[BALOC]. This allows using SDRAM devices of different sizes without changing
the board layout. See Table 9-7.
SDRAM Controller1
1
1
1
4
2
1
1
SDRAMCS/CS7
RAS0
CAS0
SDWE
BS[3:0]
SDBA[1:0]
SDCLKE
SDCLK
A10_PRECHG
A[22:15]
D[31:0]
8
32
Address Multiplexer
Dynamic Bus Sizer
Internal 32-Bit Address Bus
1
A[14:13/SDA[12:11]2
A[11:2]/SDA[9:0]10
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 9-3
Figure 9-2 is the pinout of a 16-bit SDRAM in a 54-pin TSOP (thin, small-outline package) package. Size
can vary from 16–256 Mbits.
Figure 9-2. 54-Pin TSOP SDRAM Pin Definition
SDCLK SDRAM (bus) clock (same frequency as CPU clock). This dedicated output reduces setup and hold
time uncertainty due to process and temperature variations. SDCLK is disabled for SDRAM
power-down mode.
SDCLKE SDRAM clock enable
SDRAMCS/CS7 SDRAM chip select/CS7. The SDRAM is assigned to CS7 (SDRAMCS) of the device chip select
module.
SDWE SDRAM write enable
Table 9-1. SDRAM Controller Signal Descriptions (continued)
Signal Description
VDD
DQ0
VDD
DQ1
DQ2
GND
DQ3
DQ4
VDD
DQ5
DQ6
GND
DQ7
VDD
DQML
R/W
CAS
RAS
CS
BA0
BA1
A10
A0
A1
A2
A3
VDD
GND
DQ15
GND
DQ14
DQ13
VDD
DQ12
DQ11
GND
DQ10
DQ9
VDD
DQ8
GND
NC
DQMH
CLK
CKE
A12
A11
A9
A8
A7
A6
A5
A4
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
VDD
DQ0
VDD
DQ1
DQ2
GND
DQ3
DQ4
VDD
DQ5
DQ6
GND
DQ7
VDD
DQML
R/W
CAS
RAS
CS
BA0
BA1
A10
A0
A1
A2
A3
VDD
VDD
DQ0
VDD
DQ1
DQ2
GND
DQ3
DQ4
VDD
DQ5
DQ6
GND
DQ7
VDD
DQML
R/W
CAS
RAS
CS
BA0
BA1
A10
A0
A1
A2
A3
VDD
GND
DQ15
GND
DQ14
DQ13
VDD
DQ12
DQ11
GND
DQ10
DQ9
VDD
DQ8
GND
NC
DQMH
CLK
CKE
A12
A11
A9
A8
A7
A6
A5
A4
GND
GND
DQ15
GND
DQ14
DQ13
VDD
DQ12
DQ11
GND
DQ10
DQ9
VDD
DQ8
GND
NC
DQMH
CLK
CKE
A12
A11
A9
A8
A7
A6
A5
A4
GND
256 Mbit
128 Mbit
64 Mbit
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
9-4 Freescale Semiconductor
Table 9-2 shows how BS[3:0] should be connected to DQMx for 16- and 32-bit SDRAM configurations.
9.3 Interface to SDRAM Devices
The following tables describes possible memory configurations using most common SDRAM devices for
16- and 32-bit wide data buses.
A device’s data bus width affects its connection to SDRAM address pins. A device can be configured for
external data bus width of 16 or 32 bits by appropriate configuration of the WSEL signal during reset. See
Section 19.18, “Operating Mode Configuration Pins.” The following tables describe address pin
connections and internal address multiplexing.
Table 9-2. Connecting BS[3:0] to DQMx
5272 SDRAM
Data Signals
16 Bit 32 Bit 16 Bit 32 Bit (2 x 16) 32 Bit (1 x 32)
BS3 BS3 DQMH DQMH DQM3 D[31:24]
BS2 BS2 DQML DQML DQM2 D[23:16]
NC BS1 NC DQMH DQM1 D[15:8]
NC BS0 NC DQML DQM0 D[7:0]
Table 9-3. Configurations for 16-Bit Data Bus
Parameter
8-Bit 16-Bit
16 Mbits 64 Mbits 16 Mbits 64 Mbits 128 Mbits 256 Mbits
Number of devices 2 1
Total size 4 Mbytes 16 Mbytes 2 Mbytes 8 Mbytes 16 Mbytes 32 Mbytes
Total page size 1 Kbyte 1 Kbyte 512 Kbytes 512 Kbytes 1 Kbyte 1 Kbyte
Number of banks 2 4 2 4 4 4
Refresh count in 64 mS 4K 4K 4K 4K 4K 8K
Table 9-4. Configurations for 32-Bit Data Bus
Parameter
8-Bit 16-Bit 32-Bit
16 Mbits 64Mbits 16 Mbits 64 Mbits 128 Mbits 256 Mbits 64 Mbits 128 Mbits
Number of devices 4 2 1
Total size 8 Mbytes 32 Mbytes 4 Mbytes 16 Mbytes 32 Mbytes 64 Mbytes 8 Mbytes 16 Mbytes
Total page size 2 Kbytes 2 Kbytes 1 Kbyte 1 Kbyte 2 Kbytes 2 Kbytes 1 Kbyte 1 Kbyte
Number of banks 2 4 2 4 4 4 4 4
Refresh count in 64 mS 4K 4K 4K 4K 4K 8K 4K 8K
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 9-5
Table 9-5. Internal Address Multiplexing (16-Bit Data Bus)
Device Pin SDRAM Pin
8-Bit 16-Bit
16 Mbits 64 Mbits 16 Mbits 64 Mbits 128 Mbits 256 Mbits
A1 A0 A1/A10 A1/A10 A1/A9 A1/A9 A1/A10 A1/A10
A2 A1 A2/A11 A2/A11 A2/A10 A2/A10 A2/A11 A2/A11
A3 A2 A3/A12 A3/A12 A3/A11 A3/A11 A3/A12 A3/A12
A4 A3 A4/A13 A4/A13 A4/A12 A4/A12 A4/A13 A4/A13
A5 A4 A5/A14 A5/A14 A5/A13 A5/A13 A5/A14 A5/A14
A6 A5 A6/A15 A6/A15 A6/A14 A6/A14 A6/A15 A6/A15
A7 A6 A7/A16 A7/A16 A7/A15 A7/A15 A7/A16 A7/A16
A8 A7 A8/A17 A8/A17 A8/A16 A8/A16 A8/A17 A8/A17
A9 A8 A9/A18 A9/A18 A17 A17 A9/A18 A9/A18
A10 A9 A19 A19 A18 A18 A19 A19
A10_PRECHG A10/AP A20 A20 A19 A19 A20 A20
A12 A11 A21 A20 A21 A21
A13 A12 A22
SDBA0 BA0 A21 A22 A20 A21 A22 A23
SDBA1 BA1 A23 A22 A23 A24
Table 9-6. Internal Address Multiplexing (32-Bit Data Bus)
Device Pin SDRAM Pin
8-Bit 16-Bit 32-Bit
16 Mbits 64 Mbits 16 Mbits 64 Mbits 128 Mbits 256 Mbits 64 Mbits 128 Mbits
A2 A0 A2/A11 A2/A11 A2/A10 A2/A10 A2/A11 A2/A11 A2/A10 A2/A10
A3 A1 A3/A12 A3/A12 A3/A11 A3/A11 A3/A12 A3/A12 A3/A11 A3/A11
A4 A2 A4/A13 A4/A13 A4/A12 A4/A12 A4/A13 A4/A13 A4/A12 A4/A12
A5 A3 A5/A14 A5/A14 A5/A13 A5/A13 A5/A14 A5/A14 A5/A13 A5/A13
A6 A4 A6/A15 A6/A15 A6/A14 A6/A14 A6/A15 A6/A15 A6/A14 A6/A14
A7 A5 A7/A16 A7/A16 A7/A15 A7/A15 A7/A16 A7/A16 A7/A15 A7/A15
A8 A6 A8/A17 A8/A17 A8/A16 A8/A16 A8/A17 A8/A17 A8/A16 A8/A16
A9 A7 A9/A18 A9/A18 A9/A17 A9/A17 A9/A18 A9/A18 A9/A17 A9/A17
A10 A8 A10/A19 A10/A19 A18 A18 A10/A19 A10/A19 A18 A18
A11 A9 A20 A20 A19 A19 A20 A20 A19 A19
A10_PRECHG A10/AP A21 A21 A20 A20 A21 A21 A20 A20
A13 A11 A22 A21 A22 A22 A21
A14 A12 A23
SDBA0 BA0 A22 A23 A21 A22 A23 A24 A21 A22
SDBA1 BA1 A24 A23 A24 A25 A22 A23
SDRAM Controller
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9-6 Freescale Semiconductor
9.4 SDRAM Banks, Page Hits, and Page Misses
SDRAMs can have up to four banks addressed by SDBA1 and SDBA0. The two uppermost address lines
of the memory space are mapped to SDBA1 and SDBA0. Specific address lines mapped depend on the
size of the SDRAM array and are defined in the SDCR.
Each of the four bank address registers holds the page address (lower bits of row address) of an activated
page. Each bank can have one open page. A device with two banks can have two open pages. A device
with four banks can have four open pages.
The lower addresses of the row address are compared against the page address register content. If it does
not match, the SDRAM controller precharges the open page on the accessed bank and activates the new
required page. After this, the SDRAM controller executes the READ or WRITE command. Concurrently, the
page address register of the bank is updated. This is called a page miss.
After a bank is activated, it remains activated until the next page access causing a page miss.
A precharge of a deactivated bank is allowed and simply ignored by the SDRAM.
If a memory access is to an open page only the READ or WRITE command is issued to the SDRAM. This is
called a page hit.
In two-page SDRAMs, banks 2 and 3 are invalid and must not be addressed. To avoid address aliasing, the
user should restrict the chip select address range to the sp ace available in the SDRAMs.
9.5 SDRAM Registers
The SDRAM configuration register (SDCR) and the SDRAM timing register (SDTR) are described in the
following sections. Note that SDRAM provides a mode register that is not part of the SDRAM controller
memory model. The SDRAM mode register is automatically configured during initialization.
9.5.1 SDRAM Configuration Register (SDCR)
SDCR is used to configure the SDRAM controller address multiplexers for the type of SDRAM devices
used on the system board.
Table 9-7 describes SDCR fields.
15 14 13 12 11 10 8 7 6 5 4 3 2 1 0
Write — MCAS — BALOC GSL — REG INV SLEEP ACT INIT
Reset 0 00 00 001 0 00 0 1 0 0 0
R/W Read/Write Read-only R/W
Addr MBAR + 0x0182
Figure 9-3. SDRAM Configuration Register (SDCR)
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 9-7
Table 9-7. SDCR Field Descriptions
Bits Name Description
15 — Reserved, should be cleared.
14–13 MCAS Maximum CAS address. Determines which device address output carries the column address msb. For
example, if the SDRAM device has eight column addresses and the data bus is configured for 32 bits, the
column address appears on A[9:2], so the maximum column address is A9. The lsb of the row address is
therefore taken from internal address signal A10 and is used by the SDRAM controller to control address
multiplexing.
00 A7
01 A8
10 A9
11 A10
12–11 — Reserved, should be cleared.
10–8 BALOC Bank address location. Determines the internal addresses that become SDRAM bank addresses.
SDBA1SDBA0
000Reserved
001A21A20
010A22A21
011A23A22
100A24A23
101A25A24
110Reserved
111Reserved
7 GSL Go to sleep. Setting GSL powers down the SDRAM and puts it into auto-refresh mode.
6–5 — Reserved, should be cleared.
4 REG Register read data for 66 MHz. Writing a 1 to REG enables pipeline mode for read data access. It forces
the SDRAM controller to register the read data, adding one wait state to single-read accesses and to the
first word read during a burst. REG must be 1 for clock frequencies above 48 MHz to meet input setup timing
for data input (See electrical characteristics timing SD16). The description of INV shows how REG and INV
interact.
3 INV Invert clock. Inverts SDRAM clock output for timing refinement.
If REG = 0
0 Do not add wait state for read accesses.
1 Shift SDCLK edge 180o
If REG = 1
0 Add wait state for read accesses, all frequencies
1 Invalid, do not use.
2 SLEEP SLEEP mode. This read-only status bit goes high when setting SDCR[GSL] has taken effect and the
SDRAM is powered down. SLEEP is cleared when SDRAM is in auto-refresh mode.
1 ACT Active. This read-only status bit goes high when the SDRAM controller completes its initialization. ACT is
cleared by writing to SDCR.
0 INIT Initialization enable. Setting INIT enables initialization of the SDRAM based on other SDCR bit values.
Initialization starts after the first dummy write access to the SDRAM. CSOR7, CSBR7, and SDTR must be
configured before setting INIT.
CAUTION: CSOR7[WAITST] must equal 0x1F when CS7/SDCS is configured for SDRAM.
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
9-8 Freescale Semiconductor
9.5.2 SDRAM Timing Register (SDTR)
The SDTR is used to configure SDRAM controller refresh counters for the type of SDRAM devices used
and the number of clocks required for each ty pe of SDRAM access. The reset value is 0 x2115. For lower
CPU clock frequencies, precharge and activate times can be reduced to eliminate up to 2 clock cycles from
the read and write accesses. Consult the data sheets of the SDRAMs being considered.
Table 9-8 describes SDTR fields.
15 10 9 8 7 6 5 4 3 2 1 0
Write RTP RC — RP RCD CLT
Reset 0010_00 01 00 01 01 01
R/W R/W
Addr MBAR + 0x0186
Figure 9-4. SDRAM Timing Register (SDTR)
Table 9-8. SDTR Field Descriptions
Bits Name Description
15–10 RTP Refresh timer prescaler. Determines the number of clock cycles x 16 between refreshes. The following table
describes different recommended prescaler settings for different clock frequencies including a margin of 1.2
μS. Recommended values are as follows:
RTP 15.6 µs = 1/f*RTP*16 System Clock
111101 61 66 MHz
101011 43 48 MHz
011101 29 33 MHz
010110 22 25 MHz
000100 4 5 MHz (emulator)
9–8 RC Refresh count. Indicates the number of clock cycles spent in refresh state (RC + 5). Refresh occurs during
the first of these clock cycles; the rest of the time is the delay that must occur before the SDRAM is ready
to do anything else.
00 5 cycles
01 6 cycles (default)
10 7 cycles
11 8 cycles
7–6 — Reserved, should be cleared.
5–4 RP Precharge time. Specifies number of clock cycles taken for a precharge (RP + 1).
00 1 cycle
01 2 cycles (default)
10 3 cycles
11 4 cycles
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 9-9
9.6 Auto Initialization
Each SDRAM requires an initialization sequence before it can be accessed. After power up, the SDRAM
requires a certain time (100 µS) before it can accept the first command of the initialization procedure. After
this time, one PRECHARGE ALL command and eight REFRESH commands are required. After initialization,
an INITIATE LOAD REGISTER SET command is executed, which writes the SDRAM configuration into the
SDRAM device mode register.
SDRAM mode register data is transferred on the address signals, so all SDRAM devices are configured
simultaneously.
Initialization is enabled by setting SDCR[INIT] and performing a dummy write to the SDRAM address
space. The SDRAM controller executes the required PRECHARGE and REFRESH commands and
automatically loads the mode register, which configures the SDRAM as follows:
• SDRAM internal burst is always disabled.
• CAS latency is defined by SDTR[CLT].
SDCR[ACT] is set after initialization.
9.7 Power-Down and Self-Refresh
The SDRAM can be powered down by setting SDCR[GSL]. The SDRAM controller executes the required
power-down command sequence to ensure self-refresh during power down. The SDRAM controller
completes the current memory access then automatically issues the following commands to force the
SDRAM into sleep mode:
precharge all banks
nop
auto refresh command
In self-refresh mode, SDRAM devices can refresh themselves without an external clock. After
power -down completes, SDCR[SLEEP] is set, the SDRAM clock output is driven high, and SDCLKE is
driven low.
3–2 RCD RAS-to-CAS delay. The reset value is 1, requiring 2 clock cycles for SDRAM activation.
00 1 cycle
01 2 cycles (default)
10 3 cycles
11 4 cycles
1–0 CLT CAS latency. Specifies the delay programmed into the SDRAM mode register during initialization, indicating
the time between a READ command being issued to the SDRAM and data appearing on the pins. The
SDRAM controller uses this value to sequence its state machine during read operations. CLT cannot be
changed after the mode register is written.
00 Reserved
01 2-cycle CAS latency (default)
1x Reserved
Table 9-8. SDTR Field Descriptions (continued)
Bits Name Description
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
9-10 Freescale Semiconductor
To wake up the SDRAMs, SDCR[GSL] must be cleared. SDCR[SLEEP] remains set while the SDRAM
is exiting sleep mode and is cleared when the SDRAM c ompletes the correct sequence to exit sleep mode.
9.8 Performance
The maximum performance of the SDRAM controller is determined by the required number of cycles for
page activation and precharge. The read access is influenced by the CAS latency. All SDRAM accesses
are in page mode. The following table shows the number of required cycles including all dead cycles for
each type of read/write SDRAM access. It assumes default timing configuration using an at least
PC100-compliant SDRAM device at 66 MHz. Page miss latency includes the cycles to precharge the last
open page and activate the new page before the read/write access. There are no prechar ge cycles when an
address hits an open page.
In Table 9-9, the timing configuration is RTP = 61, RC = negligible, RCD = 0 (or 1), RP = 1 (or 0), and
CLT = 1.
In Table 9-10, the timing configuration is RTP = 61, RC = negligible, RCD = 0, RP = 0, and CLT = 1.
Table 9-9. SDRAM Controller Performance, 32-Bit Port, (RCD = 0, RP = 1) or (RCD = 1, RP = 0)
SDRAM Access
Number of System Clock Cycles
REG = 0, INV = 0 REG = 1, INV = 0
Single-beat read Page miss 8 9
Page hit 5 6
Single-beat write Page miss 6 6
Page hit 3 3
Burst read Page miss 8-1-1-1 = 11 9-1-1-1 = 12
Page hit 5-1-1-1 = 8 6-1-1-1 = 9
Burst write Page miss 6-1-1-1 = 9 6-1-1-1 = 9
Page hit 3-1-1-1 = 6 3-1-1-1 = 6
Table 9-10. SDRAM Controller Performance, 32–Bit Port, (RCD = 0, RP = 0)
SDRAM Access
Number of System Clock Cycles
REG = 0, INV = 0 REG = 1, INV = 0
Single-beat read Page miss 7 8
Page hit 5 6
Single-beat write Page miss 5 5
Page hit 3 3
Burst read Page miss 7-1-1-1 = 10 8-1-1-1 = 11
Page hit 5-1-1-1 = 8 6-1-1-1 = 9
Burst write Page miss 5-1-1-1 = 8 5-1-1-1 = 8
Page hit 3-1-1-1 = 6 3-1-1-1 = 6
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 9-11
In Table 9-11, the timing configuration is RTP = 61, RC = negligible, RCD = 1, RP = 1, and CLT = 1.
In Table 9-12, the timing configuration is RTP = 61, RC = negligible, RCD = 0 (or 1), RP = 1 (or 0), and
CLT = 1.
Table 9-11. SDRAM Controller Performance (RCD = 1, RP = 1), 16-Bit Port
SDRAM Access
Number of System Clock Cycles
REG = 0, INV = 0 REG = 1, INV = 0
Single-beat read Page miss 9 10
Page hit 5 6
Single-beat
longword read
Page miss 9-1 10-1
Page hit 5-1 6-1
Single-beat write Page miss 7 7
Page hit 3 3
Single-beat
longword write
Page miss 7-1 7-1
Page hit 3-1 3-1
Burst read Page miss 9-1-1-1-1-1-1-1 = 16 10-1-1-1-1-1-1-1 = 17
Page hit 5-1-1-1-1-1-1-1 = 12 6-1-1-1-1-1-1-1 = 13
Burst write Page miss 7-1-1-1-1-1-1-1 = 14 7-1-1-1-1-1-1-1 = 14
Page hit 3-1-1-1-1-1-1-1 = 10 3-1-1-1-1-1-1-1 = 10
Table 9-12. SDRAM Controller Performance, 16-Bit Port, (RCD=0, RP=1)
or (RCD=1, RP = 0)
SDRAM Access
Number of System Clock Cycles
REG = 0, INV = 0 REG = 1, INV = 0
Single-beat read Page miss 8 9
Page hit 5 6
Single-beat longword read Page miss 8-1 9-1
Page hit 5-1 6-1
Single-beat write Page miss 6 6
Page hit 3 3
Single-beat longword write Page miss 6-1 6-1
Page hit 3-1 3-1
Burst read Page miss 8-1-1-1-1-1-1-1 = 15 9-1-1-1-1-1-1-1 = 16
Page hit 5-1-1-1-1-1-1-1 = 12 6-1-1-1-1-1-1-1 = 13
Burst write Page miss 6-1-1-1-1-1-1-1 = 13 6-1-1-1-1-1-1-1 = 13
Page hit 3-1-1-1-1-1-1-1 = 10 3-1-1-1-1-1-1-1 = 10
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
9-12 Freescale Semiconductor
In Table 9-13, the timing configuration is RTP = 61, RC = negligible, RCD = 0, RP = 0, and CLT = 1.
9.9 Solving Timing Issues with SDCR[INV]
When some SDRAM devices (such as 4 x 8 bit wide SDRAMs) are used, the SDCLK and other control
signals are more loaded than data signals. In normal MCF5272 operation, the write data and all other
control signals change with the positive edge of SDCLK. Large capacitive loads on SDCLK can cause long
delays on SDCLK, possibly causing SDRAM hold-time violations during writes. The clock may arrive at
the same time as the write data.
The write data setup time to SDCL K edge may not meet device requirements at the SDRAM. This timing
issue cannot be solved by reducing the SDCLK frequency. SDCLK must be delayed further to meet
setup/hold margin on the SDRAM data input. Setting INV provides a 180° phase shift and moves the
positive clock edge far beyond the data edge.
Figure 9-5. Example Setup Time Violation on SDRAM Data Input during Write
Table 9-13. SDRAM Controller Performance, 16-Bit Port, (RCD=0, RP=0)
SDRAM Access
Number of System Clock Cycles
REG = 0, INV = 0 REG = 1, INV = 0
Single-beat read Page miss 7 8
Page hit 5 6
Single-beat
longword read
Page miss 7-1 8-1
Page hit 5-1 6-1
Single-beat write Page miss 5 5
Page hit 3 3
Single-beat
longword write
Page miss 5-1 5-1
Page hit 3-1 3-1
Burst read Page miss 7-1-1-1-1-1-1-1 = 14 8-1-1-1-1-1-1-1 = 15
Page hit 5-1-1-1-1-1-1-1 = 12 6-1-1-1-1-1-1-1 = 13
Burst write Page miss 5-1-1-1-1-1-1-1 = 12 5-1-1-1-1-1-1-1 = 12
Page hit 3-1-1-1-1-1-1-1 = 10 3-1-1-1-1-1-1-1 = 10
External delay of SDCLK
Data setup delay
Internal CLK
Data bus
SDCLK
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 9-13
As Figure 9-6 shows timing relationships between SDCLK and the remaining data and control signals can
be refined by setting SDCR[INV], which inverts the SDRAM clock. SDCR[REG] must always be cleared
when SDCR[INV] is set.
.
Figure 9-6. Timing Refinement with Inverted SDCLK
NOTE
If the delay difference between the fastest data signal and the slowest control
signal exceeds half of the clock cycle time, the clock shift can cause
hold-time violations on control signals.
The incoming data setup time should be inspected during reads. The active clock edge event of SDCLK
now precedes the MCF5272 internal active clock edge event when (REG = 0). This behavior is frequency
dependent. The two following scenarios are possible:
• High-speed timing refinement with true CAS latency. See Figure 9-7.
• Low-speed timing refinement with reduced effective CAS latency.
If the delay between shifted SDCLK and following internal system clock edge is shorter than the read
access time of the SDRAM, data is sampled with the true CAS latency.
Figure 9-7. Timing Refinement with True CAS Latency and Inverted SDCLK
Shifted delay of SDCLK
Data setup delay
Internal CLK
Data bus
SDCLK
Shifted delay of SDCLK
Delay SDCLK to CLK
SDRAM read access time
TSDCLK_to_CLK - Tacc < 0 => true CAS latency
CASL = 2
Internal
CLK
Data
SDCLK
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
9-14 Freescale Semiconductor
Selecting a system clock frequency low enough that the SDCLK-to-CLK delay is long compared to the
SDRAM read access time reduces effective CAS latency by 1 cycle.
Figure 9-8. Timing Refinement with Effective CAS Latency
NOTE
When reduced effective CAS latency is used, the SDRAM is still
programmed with true CAS latency. The SDRAM controller state machine
must be reprogrammed for the reduced CAS latency . SDRAM initialization
software programs the CAS latency of 2 and transfers it into the SDRAM
mode register. After SDRAM initialization is confirmed, initialization
software should change SDTR[CLT] to CAS latency 1 but should not
reinitialize the SDRAM. The SDRAM controller state machine now runs
with CAS latency 1 and SDRAMs run with CAS latency 2, which increases
bandwidth on the SDRAM bank and improves performance.
9.10 SDRAM Interface
Setting CSBRn[EBI] to 0b01 enables chip select CS7 for use with one physical bank of SDRAM. In this
case, CS7 becomes SDCS. The SDRAM memory array may have a 32- or 16-bit data bus width; an 8-bit
width is not supported. An array may consist of SDRAM devices with 8, 16, or 32 bits data bus width.
Each SDRAM device can have from 16–256 Mbits.
The interface to the SDRAM devices is glueless. The following control signals are dedicated to SDRAM:
SDCS, SDWE, A10_PRECHG, SDCLK, SDCLKE, RAS0, CAS0, and SDBA[1:0].
If SDRAM EBI mode is used, CSOR7[WAITST] should be programmed for 0x1F to ensure that the
internal bus cycle termination signal is sourced from the SDRAM controller and not the chip select
module.
Shifted delay of SDCLK
Delay SDCLK to CLK
SDRAM read access time
TSDCLK_to_CLK - Tacc > 0 => effective CAS latency reduced by 1
CASL = 1
SDCLK
Data
Internal CLK
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 9-15
NOTE
The SDRAM shares address and data signals with external memory and
peripherals. Due to stringent SDRAM timing requirements, it is strongly
recommended to buffer the address, byte strobe, and data buses between the
MCF5272 and non-SDRAM memory and peripherals. Never buffer signals
to the SDRAMs. See Appendix C for details on how to buffer external
memory and peripherals in a system using SDRAM.
The controller allows single-beat read/write accesses and the following burst accesses:
• 16-byte cache line read bursts from 32-bit wide SDRAM with access times of n-1-1-1. The value
of n depends on read, write, page miss, page hit, etc. The enable extended bursts bit in chip select
option register 7 (CSOR7[EXTBURST]) must be cleared, CSBR7[EBI] must be set for SDRAM,
and CSBR7[BW] must be set for a 16-byte cache line width.
• 16-byte cache line read bursts from 16-bit wide SDRAM with access times of n-1-1-1-1-1-1-1.
CSOR7[EXTBURST] must be set, CSBR7[EBI] must be set for SDRAM, and CSBR7[BW] must
be set for 16 bits.
• 16-byte read or write bursts during Ethernet DMA transfers to/from SDRAM with access times of
n-1-1-1 or n-1-1-1-1-1-1-1 depending on 32 or 16 bit SDRAM port width as described in the
previous two paragraphs.
These SDRAM accesses are shown in Figure 9-9 through Figure 9-15. The SDRAM supports a
low-power , self-refreshing sleep mode as shown in Figure 9-14 and Figure 9-15. It is also possible to turn
off the SDRAM controller completely using the power management control register in the SIM.
Figures show burst read and burst writes, with a page miss and a page hit for each case. A single-cycle read
or write is identical to the firs t access of a burst. In normal operation the SDRAM controller refreshes the
SDRAM.
As these examples show , SDCLKE is normally high and SDCLK is always active. SDCLKE can be forced
to 0 and SDCLK can be shut off by putting the SDRAM controller into power down or self-refresh mode.
9.10.1 SDRAM Read Accesses
The read examples, Figure 9-9 and Figure 9-10, show a CAS latency of 2, SDCR[REG] = 0 and
SDCR[INV] = 1.
In T1, the ColdFire core issues the address. This cycle is internal to the device and always occurs. In T2,
the SDRAM controller determines if there is a page miss or hit. This cycle is internal to the device and
always occurs.
Because Figure 9-9 shows a page miss, the PRECHARGE command (T3) and the following cycle occur.
During precharge the SDRAM writes the designated on-chip RAM page buffer back into the SDRAM
array. The number of cycles for a precharge is set by programming SDTR[RP]. The default after reset is
two cycles. The activate new page cycle that follows (T5) is required to open a new page due to the page
miss. Cycle T6 is a wait state for SDRAM activation command. It is added due to default value of 0b01 in
SDTR[RCD]. For lower clock speed systems the RCD value could be written as 00 and this clock cycle
can be removed. Consult the data sheets of the SDRAM devices being used.
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
9-16 Freescale Semiconductor
Figure 9-9. SDRAM Burst Read, 32-Bit Port, Page Miss, Access = 9-1-1-1
Col
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13
Data Data Data Data
Row Col Col Col
Row
Bank x Bank y Bank y
SDCLK
SDCLKE
SDADR[13:0]
A10_PRECHG
SDBA[1:0]
SDCS
RAS0
CAS0
SDWE
BS[3:0]
D[31:0]
Issue
Address
Page
Hit or
Miss?
Precharge
Old Page Activate
New Page
CF2 Core 1Read
2Read
4
Read
3
(7)
Read
CASL = 2
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 9-17
Figure 9-10 shows a similar burst read that hits the page. As in the page-miss example, the SDRAM
controller takes a clock cycle (T2) to determine whether the access is a hit or a miss. Because it is a hit,
the burst operation follows immediately.
Figure 9-10. SDRAM Burst Read, 32-Bit Port, Page Hit, Access = 5-1-1-1
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9
Data Data Data Data
Col Col Col Col
Bank
SDCLK
SDCLKE
SDADR[13:0]
A10_PRECHG
SDBA[1:0]
SDCS
RAS0
SDWE
BS[3:0]
D[31:0]
Issue
Address
Page
Hit or
Miss?
CF2 Core Read
1Read
2Read
4
Read
3
CAS0
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
9-18 Freescale Semiconductor
9.10.2 SDRAM Write Accesses
Like the read operations, shown in Figure 9-9 and Figure 9-10, the write operations require one cycle to
issue the address (T1) and another (T2) to determine whether the access is page hit or miss. In the
burst-write, page-miss example, shown in Figure 9-11, after the SDRAM determines that this is a page
miss (T2), the precharge old page (T3) and activate new page cycles (T5) are required. Cycle T6 is a wait
state for SDRAM activation command as it is in Figure 9-9.
Figure 9-11. SDRAM Burst Write, 32-Bit Port, Page Miss, Access = 7-1-1-1
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11
Data Data Data Data
Row Col Col Col Col
Row
Bank x Bank y Bank y
SDCLK
SDCLKE
SDADR[13:0]
A10_PRECHG
SDBA[1:0]
SDCS
RAS0
CAS0
SDWE
BS[3:0]
D[31:0]
Issue
Address
Page
Hit or
Miss?
Precharge
Old Page Activate
New Page
CF2 Core Write
1Write
2Write
4
Write
3
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 9-19
In the burst-write, page-hit example, shown in Figure 9-12, after the SDRAM controller determines that
the access is a page hit in T2, the burst transfer begins in T3.
Figure 9-12. SDRAM Burst Write, 32-Bit Port, Page Hit, Access = 3-1-1-1
T0 T1 T2 T3 T4 T5 T6 T7 T8
Data Data Data Data
Col Col Col Col
Bank
SDCLK
SDCLKE
SDADR[13:0]
A10_PRECHG
SDBA[1:0]
SDCS
RAS0
SDWE
BS[3:0]
D[31:0]
Issue
Address
Page
Hit or
Miss?
CF2 Core Write
1Write
2Write
4
Write
3
CAS0
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
9-20 Freescale Semiconductor
9.10.3 SDRAM Refresh Timing
Figure 9-13 shows refresh-cycle timing. As in Figure 9-14, during a PRECHARGE ALL command (T1), the
SDRAM writes all of its on-chip RAM page buffers into the SDRAM array. SDTR[RP] determines the
number of dead cycles after a precharge. Note that se lf refresh occurs during T3. In refresh state, SDRAM
cannot accept any other command.
Figure 9-13. SDRAM Refresh Cycle
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9
SDCLK
SDADR[13:0]
A10_PRECHG
SDBA[1:0]
SDCS
RAS0
SDWE
Precharge
All Banks NOP Auto
Refresh
CAS0
SDCLKE (H)
Next Command
tRC
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 9-21
Figure 9-14 shows the timing for entering SDRAM self-refresh mode. During a PRECHARGE ALL command
(T1), the SDRAM writes all of its on-chip RAM page buffers back into the SDRAM array . The SDTR[RP]
value determines the number of dead cycles after a precharge. Note that auto refresh occurs in T3.
SDTR[RC] determines the number of clock cycles the SDRAM remains in refresh state, during which time
it cannot accept other commands.
Figure 9-14. Enter SDRAM Self-Refresh Mode
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13
Internal Clock
SDCLK
SDADR[13:0]
A10_PRECHG
SDBA[1:0]
SDCS
RAS0
SDWE
Precharge
All BanksNOP Self
Refresh
CAS0
SDCR[SLEEP]
SDCLKE
SDRAM Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
9-22 Freescale Semiconductor
Figure 9-15 shows the timing for exiting SDRAM self-refresh mode. Note that SDCR[GSL] is sampled
on the rising edge of the internal clock. If it is 0, as it is here, SDRAM controller signals become active on
the following negative clock edge.
Figure 9-15. Exit SDRAM Self-Refresh Mode
T0 T1 T2 T3 T4 T5 T6 T7 T8
Internal Clock
SDCLK
SDADR[13:0]
SDBA[1:0]
SDCS
RAS0
SDWE
NOP
CAS0
SDCR[GSL]
SDCLKE
NOP NOP NOP NOP NOP NOP
SDCR[SLEEP]
A10_PRECHG
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 10-1
Chapter 10
DMA Controller
The MCF5272 has a one-channel DMA controller that supports memory-to-memory DMA transfers that
can be used for block data moves. This chapter describes in detail its signals, registers, and operating
modes.
10.1 DMA Data Transfer Types
A source and destination address must be specified for any dual-address DMA transfer. These addresses
can have different data transfer types, but there is always a read from the source address followed by a
write to the destination address. On the MCF5272, sources and destinations can be SDRAM, external
SRAM, or on-chip peripheral in any combination.
NOTE
Memory-to-memory DMA transfers run to completion if the assume request
bit in the system configuration register, SCR[AR], is set. This generally
prevents the CPU from recognizing interrupts and blocks bus accesses by
other on-chip bus masters. It is best not to enable SCR[ AR] when the DMA
controller is in use. When AR = 0, the DMA controller allows the CPU and
Ethernet controller to obtain bus access.
Note that transfers to on-chip peripherals are limited by the transfer type supported by a specific peripheral.
Table 10-1. DMA Data Transfer Matrix
Transfer Type
Source or Destination Address
SDRAM External SRAM On-Chip Peripheral
Byte (8 bits) Yes Yes Yes
Word (16 bits) Yes Yes Yes
Longword (32 bits) Yes Yes Yes
Burst (4 x longword) Yes No No
DMA Controller
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
10-2 Freescale Semiconductor
10.2 DMA Address Modes
The DMA address mode determines how the address output by the channel is updated after a transfer to
be ready for the next transfer. The two following modes are supported:
• Static address mode—The address remains unchanged after the transfer completes. This mode
should be used when the source or destination address is the FIFO data port of an on-chip
peripheral.
• Increment address mode—In increment address mode, the address is incremented at the end of the
transfer by the number of bytes transferred. This mode should be used when a source or destination
address is in external memory.
10.3 DMA Controller Registers
The MCF5272 DMA controller supports a single DMA channel which can be used for
memory-to-memory transfers.
10.3.1 DMA Mode Register (DMR)
The DMR controls various operation modes, principally the request and addressing modes. Fields include
the transfer size and modifier, transfer direction, channel enable and reset.
Table 10-2 describes DMR fields.
31 30 29 20 19 18 17 16
Field RESET EN — RQM —
Reset 0000_0000_0000_0000
R/W R/W
15 14 13 12 10 9 8 7 6 5 4 2 1 0
Field — DSTM DSTT DSTS — — SRCM SRCT SRCS
Reset 0 01 1_00 01 0 0 1 1_01 01
R/W R/W
Addr MBAR + 0x00E0
Figure 10-1. DMA Mode Register (DMR)
Table 10-2. DMR Field Descriptions
Bits Name Description
31 RESET Reset. Writing a 1 to this location causes the DMA controller to reset to a condition where no transfers are
taking place. EN is cleared, preventing new transfers.
30 EN Enable. Controls whether the DMA channel is enabled to perform transfers.
0 DMA transfers are disabled.
1 DMA transfers are enabled. The DMA controller can respond to requests from the peripheral or generates
internal requests in dual address mode, so long as the conditions described under the DMA interrupt
flags (see Section 10.3.2, “DMA Interrupt Register (DIR)”) do not prevent transfers from going ahead.
29–20 — Reserved, should be cleared.
DMA Controller
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19–18 RQM Request mode. Determines the request mode of the channel. This must be 11.
00–10 Reserved, do not use.
11 Dual address request mode. Both the DMA source and DMA destination are memory addresses. The
MCF5272 supports only dual-address request mode.
17–15 — Reserved, should be cleared.
14–13 DSTM Destination addressing mode for the channel.
00 Static address mode
01 Increment address mode
1x Reserved, do not use.
12–10 DSTT Destination addressing type. Used internal to the MCF5272 to qualify the address bits. This value should
be compatible with the CSCRn[TM] value used for external RAM or peripheral device access.
000 Reserved
001 User data access
010 User code access
011–100 Reserved
101 Supervisor data access
110 Supervisor code access
111 Reserved
9–8 DSTS Destination data transfer type. The DMA controller buffers data from the source address data fetches until
there are enough bytes to perform a destination data write of the size programmed in these bits. Thus it is
possible to configure source accesses to be byte type and destination addresses to be line burst type. In
this case 16 individual byte reads are performed followed by an indivisible burst write of four longwords.
Longword or line bursts are the most efficient data transfers.
DSTS Data Transfer Type Address Incremented by
00 Longword 4
01 Byte 1
10 Word 2
11 16-byte line burst 16. Valid only for SDRAM.
7 — Reserved, should be cleared.
6 — Reserved, should be cleared.
5 SRCM Source addressing mode of the channel.
0 Static address mode
1 Increment address mode
4–2 SRCT Source addressing type. Used internal to the MCF5272 to qualify the address bits. The value should be
compatible with the CSCRn[TM] value used for external RAM or peripheral device access.
000 Reserved
001 User data access
010 User code access
011 Reserved
100 Reserved
101 Supervisor data access
110 Supervisor code access
111 Reserved
Table 10-2. DMR Field Descriptions (continued)
Bits Name Description
DMA Controller
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10.3.2 DMA Interrupt Register (DIR)
The DIR, Figure 10-2, contains status bits and their corresponding interrupt enables.
Table 10-3 describes DIR fields.
1–0 SRCS Source data transfer type. Determines the amount of data the DMA controller fetches and buffers data from
the source address. When there are enough bytes to perform a destination data write of the size
programmed in DSTS, the data is written to the destination address. Thus source accesses can be
longword type and destination addresses can be line burst type. In this case, 4 longword reads are
performed followed by an indivisible burst write of 4 longwords.
The most efficient data transfer method is to use longword or line burst transfer types.
SRCS Data Transfer Type Address Incremented by
00 Longword 4
01 Byte 1
10 Word 2
11 16-byte line burst 16. Valid only for SDRAM.
15 13 12 11 10 9 8 7 5 4 3 2 1 0
Field — INVEN ASCEN — TEEN TCEN — INV ASC — TE TC
Reset 0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x00E6
Figure 10-2. DMA Interrupt Register (DIR)
Table 10-3. DIR Field Descriptions
Bits Name Description
15–13 — Reserved, should be cleared.
12 INVEN Invalid combination interrupt enable.
0 INV interrupt is disabled.
1 INV interrupt is enabled.
11 ASCEN Address sequence complete interrupt enable.
0 ASC interrupt is disabled.
1 ASC interrupt is enabled.
10 — Reserved, should be cleared.
9 TEEN Transfer error interrupt enable.
0 TE interrupt is disabled.
1 TE interrupt is enabled.
8 TCEN Transfer complete interrupt enable.
0 TC interrupt is disabled.
1 TC interrupt is enabled.
7–5 — Reserved, should be cleared.
Table 10-2. DMR Field Descriptions (continued)
Bits Name Description
DMA Controller
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10.3.3 DMA Source Address Register (DSAR)
The DSAR provides a 32-bit address, which the DMA controller drives onto the internal address bus for
all of the channel’s read accesses. The address value is altered after each read access according to the
addressing mode.
4 INV Invalid combination.
0 No invalid combination detected.
1 An invalid combination of request and address modes is programmed into the mode register. INV
remains set until it is cleared by writing a 1 to it or by a hardware reset. Writing a 0 has no effect. No
further transfers can take place when this bit is set.
3 ASC Address sequence complete.
0 Address sequence is not complete.
1 The address sequence is complete. This occurs when the byte counter decrements to 0. Corresponds
to DMA complete. ASC remains set until it is cleared by writing a 1 to its location or by a hardware reset.
Writing a 0 has no effect. No further transfers can take place when ASC is set. It is important to ensure
that the combination of source address, destination address, and transfer sizes ensures that the byte
counter always decrements to 0.
2 — Reserved, should be cleared.
1 TE Transfer error.
0 No transfer error.
1 A DMA data transfer terminated with an error such as an internally generated bus error. This generally
occurs when the address is not decoded successfully by an on-chip peripheral or by a chip select
register. TE remains set until it is cleared by writing a 1 to its location or by a hardware reset. Writing 0
has no effect. No further transfers can take place when TE is set.
0TCTransfer complete.
1 A data transfer completed successful. The bit is cleared when DMA module is reset. Writing a 0 to this
location has no effect. This bit is available to show that the DMA transfers have started. Otherwise it is
not essential to monitor the status of this bit.
31 0
Field SRCADR
Reset 0000_0000_0000_0000_0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x00EC
Figure 10-3. DMA Source Address Register (DSAR)
Table 10-3. DIR Field Descriptions (continued)
Bits Name Description
DMA Controller
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10.3.4 DMA Destination Address Register (DDAR)
The DDAR provides a 32-bit address that the DMA controller drives onto the internal address bus for all
of the channel’s write accesses. The address is altered after each write access according to the addressing
mode.
10.3.5 DMA Byte Count Register (DBCR)
The DBCR is initially loaded with the number of bytes to be transferred during the DMA. After each
transfer , the DBCR decrements by the number of bytes transferred. DIR[ASC] is set when the byte counter
reaches zero. The user must ensure that the bytes remaining to be transferred and the transfer size are such
that the byte counter decrements to zero or wraps around without setting the ASC flag.
31 0
Field DESTADR
Reset 0000_0000_0000_0000_0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x00F0
Figure 10-4. DMA Destination Address Register (DDAR)
31 24 23 0
Field — BYTCNT
Reset R/W
R/W 0000_0000_0000_0000_0000_0000_0000_0000
Addr MBAR + 0x00E8
Figure 10-5. DMA Byte Count Register (DBCR)
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Chapter 11
Ethernet Module
This chapter begins with a feature-set overview, a functional block diagram, and transceiver connection
information for both MII and seven-wire serial interfaces. The chapter concludes with detailed
descriptions of operation and the programming model.
11.1 Overview
The MCF5272’s integrated fast Ethernet media access controller (MAC) performs the full set of IEEE
802.3/Ethernet CSMA/CD media access control and channel interface functions. It requires an external
interface adaptor and transceiver function to complete the interface to the media.
11.1.1 Features
The fast Ethernet controller (FEC) incorporates the following features:
• Full compliance with the IEEE 802.3 standard
• Support for three different physical interfaces:
— 100 Mbps 802.3 media independent interface (MII)
— 10 Mbps 802.3 MII
— 10 Mbps seven-wire interface
• Half-duplex 100-Mbps operation at system clock frequency Š 50 MHz
• 448 bytes total on-chip transmit and receive FIFO memory to support a range of bus latencies
Note: the total FIFO size is 448 bytes. It is not intended to hold entire frames but only to
compensate for external bus latency . The FIFO can be partit ioned on any 32-bit boundary between
receive and transmit, for example, 32 x 56 receive and 32 x 56 transmit.
• Retransmission from transmit FIFO following a collision, no processor bus used
• Automatic internal flushing of the receive FIFO for runts and collisions with no processor bus use
11.2 Module Operation
The FEC is implemented using a combination of hardware and microcode. Figure 11-1 shows a functional
block diagram of this module.
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11-2 Freescale Semiconductor
Figure 11-1. Ethernet Block Diagram
Figure 11-2 shows a fast Ethernet module.
Figure 11-2. Fast Ethernet Module Block Diagram
Shifter
Rx
Receiver
Control
Unit FIFO
Shifter
Tx Transmitter
Control
Unit
FIFO
Slot Time
Clock
Generator
Internal Clocks
Control
Registers
TXD
RXD
Peripheral Bus
DataData
RCLK
TCLK
and Defer
Counter
RTS = TENA
CD = RENA
CTS = CLSN
CTS = CLSN
CD = RENA
REJECT
Rstrt
Random No.
Dedicated DMA/
CSRs
RAM
RAM I/F
FIFO
Descriptor
Controller
MII Receive Transmit
Bus
Controller
Controller
E_MDC
E_MDIO
E_RxCLK
E_RxDV
E_RxD[3:0]
E_RxER
E_TxCLK
E_TxEN
E_TxD[3:0]
E_TxER
E_CRS,E_COL
Descriptor Access
Internal Bus Interface
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The descriptor controller opens and closes the buffer descriptors. The DMA controller manages the data
transfer. As soon as the DMA channel is initialized, it begins transferring data. An on-board RAM acts as
both a transmit and receive FIFO, and also provides scratch memory for the FEC.
The RAM is the focal point of all data flow in the FEC. The RAM is di vided into three sections: transmit
FIFO, receive FIFO, and descriptor controller memory. User data flows to or from the DMA unit from or
to the receive/transmit FIFOs. T ransmit data flows from the transmit FIFO into the transmit block. Receive
data flows from the receive block into the receive FIFO.
The user controls the FEC by writing into control registers located in each block. The control and status
registers (CSRs) provide global control (for example, Ethernet reset and enable) and interrupt handling.
The MII block provides a serial channel for the FEC and external physical layer device to pass control and
status information.
The descriptor controller manages data flow in both transmit and receive directions. It is programmed with
microcode to open and close buffer descriptors, control the transmit collision recovery process, an d filter
received frame addresses.
The descriptor controller accesses both the transmit and receive descriptor rings through the descriptor
access block. The descriptor access block acts as a dedicated single channel DMA that either reads a
descriptor in external user memory or writes an updated descriptor back into user memory.
11.3 Transceiver Connection
The FEC supports both an MII interface for 10/100 Mbps Ethernet and a seven-wire serial interface for 10
Mbps Ethernet. The interface mode is selected by RCR[MII_MODE]. In MII mode, the 802.3 standard
defines and the FEC module supports 18 signals. These are shown in Table 11-1.
Table 11-1. MII Mode
Signal Description MCF5272 Pin
Transmit clock E_TxCLK
Transmit enable E_TxEN
Transmit data E_TxD[3:0]
Transmit error E_TxER
Collision E_COL
Carrier sense E_CRS
Receive clock E_RxCLK
Receive enable E_RxDV
Receive data E_RxD[3:0]
Receive error E_RxER
Management channel clock E_MDC
Management channel serial data E_MDIO
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The serial mode interface operates in what is generally referred to as AMD mode. The MCF5272
configuration for seven-wire serial mode connections to the external transceiver are shown in Table 11-2.
11.4 FEC Frame Transmission
Figure 11-3 shows the Ethernet frame format.
Figure 11-3. Ethernet Frame Format
The Ethernet transmitter is designed to work with almost no host intervention. As soon as the driver
enables the FEC transmitter by setting ECR[ETHER_EN] and TDAR[24], the FEC fetches the first
transmit buffer descriptor (TxBD). If the user has a frame ready to transmit, DMA of the transmit data
buffer(s) begins immediately. A collision window (512 bits) of transmit data is sent as a DMA to the
transmit FIFO before off-chip transmission begins.
When the transmit FIFO contains 512 bits of data, the FEC asserts E_TxEN and starts transmitting the
preamble sequence, the start-of-frame delimiter, and then the frame data. However , if the line is busy, the
controller defers the transmission (carrier sense is active). Before transmitting, the controller waits for
carrier sense to become inactive. When carrier sense goes inactive, the controller waits to verify that it
Table 11-2. Seven-Wire Mode Configuration
Signal Description MCF5272 Pin
Transmit clock E_TxCLK
Transmit enable E_TxEN
Transmit data E_TxD[0]
Collision E_COL
Receive clock E_RxCLK
Receive enable E_RxDV
Receive data E_RxD[0]
Unused, configure as PB14 E_RxER
Unused input, tie to ground E_CRS
Unused, configure as PB[13:11] E_RxD[3:1]
Unused output, ignore E_TxER
Unused, configure as PB[10:8] E_TxD[3:1]
Unused, configure as PB15 E_MDC
Input after reset, connect to ground E_MDIO
Preamble Start Frame Data
Delimiter
Destination
Address
Type/
Length
Source
Address
Frame Check
Sequence
7 Bytes 1 Byte 6 Bytes 6 Bytes 2 Bytes 46–1500 Bytes 4 Bytes
Stored in Receive Buffer
Stored in Transmit Buffer
NOTE: Short Tx frames are padded automatically by the MCF5272
(Pads)
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stays inactive for 60 bit times. If so, the transmission begins after waiting an additional 36 bit times (96 bit
times after carrier sense originally went inactive).
If a collision occurs during the transmit frame, the FEC follows the specified backoff procedures and
attempts to retransmit the frame until the retry limit is reached. The FEC stores the first 64 bytes of the
transmit frame in internal RAM, so they need not be retrieved from system memory in case of a collision.
This improves external bus use and reduces latency whenever the backof f process results in an immediate
retransmission.
See Figure 11-28 on page 11-37 for the following discussion. When the end of the last transmit buffer in
the current frame is reached, the 32-bit frame check sum is appended (if TxBD[TC] is set) and
transmission is disabled (E_TxEN is negated). Following the transmission of the check sum, the FEC
writes the frame status bits into th e buf fer descriptor and clears the ready bit. When the end of the current
BD is reached but it is not the last buffer in the frame, then only the ready bit is cleared. Short frames are
automatically padded by the transmit logic.
If the transmit frame length exceeds the value programmed in the maximum frame length register, the
BABT interrupt is asserted. However, the entire frame is transmitted and is not truncated. See
Section 11.5.14, “Maximum Frame Length Register (MFLR).”
Both buffer and frame interrupts may be generated as determined by the EIMR register settings.
Setting the graceful transmit stop bit, TCR[GTS], pauses transmission. The FEC transmitter stops
immediately if no transmission is in progress. Otherwise it continues transmission until the current frame
finishes normally or terminates with a collision. When TCR[GTS] is cleared, the FEC resumes
transmission with the next frame.
The FEC transmits bytes lsb first.
11.4.1 FEC Frame Reception
The FEC receiver is designed to work with almost no intervention from the host and can perform address
recognition, CRC, short frame checking, and maximum frame length checking.
When the FEC receiver is enabled by setting ECR[ETHER_EN] and RDAR[24] it immediately starts
processing receive frames. Received frame processing proceeds as follows:
• When E_RxDV asserts, the receiver first checks for a valid header comprised of a preamble and
start-of-frame delimiter (PA/SDF).
• If the PA/SFD is valid, it is stripped off and the frame processed further by the receiver. If a valid
PA/SFD is not found, the frame is ignored.
• In serial mode, the first 16 bit times of E_RxD0 following assertion of E_RxDV (RENA) are
ignored.
• After the first 16 bit times, the data sequence is checked for alternating I/0.
• If a 11 or 00 data sequence is detected during bit times 17 to 21, the remainder of the frame is
ignored.
• After bit time 21, the data sequence is monitored for a valid start-of-frame delimiter (SFD) of 11.
If a 00 is detected, the frame is rejected. When a 1 1 is detected, the PA/SFD sequence is complete.
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• In MII mode, the receiver checks for at least one byte matching the SFD. Zero or more PA bytes
may occur, but if a 00 bit sequence is detected before the SFD byte, the frame is ignored.
• After the first 8 bytes of the frame have been passed to the receive FIFO, the FEC performs address
recognition on the frame.
As soon as a collision window (512 bits) of data is received, and if address recognition has not rejected the
frame, the FEC starts transferring the incoming frame to the receive buffer descriptor’s (RxBD’s)
associated data buffer. If the frame is a runt (due to collision) or is rejected by address recognition, no
receive buffers are filled. Thus, no collision frames are p resented to the user except late collisions, which
indicate serious LAN problems. When the data buffer has been filled, the FEC clears RxBD[E] and
generates an RXB interrupt (if RBIEN is asserted in EIMR register). If the incoming frame exceeds the
length of the data buffer, the FEC fetches the next RxBD in the table and, if it is empty, continues
transferring the rest of the frame to this BD’s associated data buffer.
The RxBD length is determined in the R_BUFF_SIZE value in the EMRBR register. The user should
program R_BUFF_SIZE to be at least 128 bytes. R_BUFF_SIZE must be quad-word (16-byte) aligned.
During reception, the FEC checks for a frame that is either too short or too long. When the frame ends
(carrier sense is negated), the receive CRC field is ch ecked and written to the data buf fer. The data length
written to the last BD in the Ethernet frame is the le ngth of the entire frame. Frames shorter than 64 bytes
are discarded automatically with no system bus impact.
When the receive frame is complete, the FEC sets RxBD[L], writes the other frame status bits into the
RxBD and clears RxBD[E]. The FEC next generates a maskable interrupt (EIR[RFINT], maskable by
EIMR[RFIEN]), indicating that a frame has been received and is in memory . The FEC then waits for a new
frame. The FEC receives serial data lsb first.
11.4.2 CAM Interface
In addition to the FEC address recognition logic, an external CAM may be used for frame reject with no
additional pins other than those in the MII interface. This CAM interface is documented in an application
note titled “Using Freescale’ s Fast Static RAM CAMs with the MPC860T’ s Media Independent Interface,”
located at the following URL: http://www.freescale.com.
11.4.3 Ethernet Address Recognition
The FEC filters the received frames based on the type of destination media access controller address
(hardware address). There are three destination address (DA) types:
• Individual (unicast)
• Group (multicast)
• Broadcast (all-ones group address)
The difference between an individual address and a group address is determined by the I/G bit in the
destination address field. A flowchart for address recognition on received frames is illustrated in
Figure 11-4 and summarized in Table 11-3.
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.
In promiscuous mode (PROM = 1 in RCR), the FEC receives all of the incoming frames regardless of their
address. In this mode, the destination address lookup is still performed and RxBD[MISS] is set
accordingly. If address recognition did not achieve a match, the frame is received with RxBD[MISS] set.
If address recognition achieves a match, the frame is received without setting RxBD[MISS].
Figure 11-4. Ethernet Address Recognition Flowchart
Table 11-3. Ethernet Address Recognition
Destination
Address Type FEC Address Processing
individual The FEC compares the destination address field of the received frame with the 48-bit MAC address
programmed into MALR and MAUR.
group The FEC determines whether or not the group address is a broadcast address. If not broadcast, a hash table
lookup is performed using the 64-entry hash table defined in HTLR and HTUR.
broadcast The frame is accepted unconditionally.
Check Address
Receive Frame
Set Miss Bit
I/G Address
?
Receive Frame
Hash Match
?
Receive Frame
Receive Frame
Promiscuous
Discard Frame
Perfect Match
?
Broadcast
Address
?
G
I
False
True
False
True
False
True (RCR[PROM] = 1)
TrueFalse
Mode
?
(RCR[PROM] = 0)
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11.4.4 Hash Table Algorithm
The hash table process used in the group hash filtering operates as follows. When a frame with the
destination address I/G bit set is received by the FEC, the 48-bit destination media access control (MAC)
address is mapped into one of 64 bins, which are represented by 64 bits stored in HTLR and HTUR. This
is performed by passing the 48-bit MAC address through the on-chip 32-bit CRC generator and selecting
6 bits of the CRC-encoded result to generate a number between 0 and 63. Bit 31 of the CRC result selects
HTUR (bit 31 = 1) or HTLR (bit 31 = 0). Bits 30–26 of the CRC result select the bit within the selected
register. If the CRC generator selects a bit that is set in the hash table, the fra me is accepted; other wise, it
is rejected. The result is that if eight group addresses are stored in the hash table and random group
addresses are received, the hash table prevents roughly 56/64 (or 87.5%) of the group address frames from
reaching memory. Those that do reach memory must be further filtered by the processor to determine if
they truly contain one of the eight preferred addresses.
The effectiveness of the hash table declines as the number of addresses increases.
The hash table registers must be initialized by the user. The CRC32 polynomial to use in computing the
hash is as follows:
11.4.5 Interpacket Gap Time
The minimum interpacket gap time for back-to-back transmission is 96 bit times. After completing a
transmission or after the backoff algorithm completes, the transmitter waits for carrier sense to negate
before starting its interpacket gap time counter. Frame transmission may begin 96 bit times after carrier
sense is negated if it stays negated for at least 60 bit times. If carrier sense asserts during the last 36 bit
times, it is ignored and a collision will occur.
The receiver receives back-to-back frames separated by at least 28 bit times. If an interpacket gap between
receive frames is less than 28 bit times, the following frame may be discarded by the receiver.
11.4.6 Collision Handling
If a collision occurs during transmission, the FEC continues transmitting for at least 32 bit times, sending
a JAM pattern of 32 ones. The JAM pattern follows the preamble sequence if the collisi on occurs during
preamble.
If a collision occurs within 64 byte times, the retry process is initiated. The transmitter waits a random
number of slot times. A slot time is 512 bit times. If a collision occurs after 64 byte times, no
retransmission is performed and the end-of-frame buffer is closed with an LC error indication.
11.4.7 Internal and External Loopback
Both internal and external loopback are supported by the FEC. In loopback mode, both of the FIFOs are
used and the FEC actually operates in a full-duplex fashion. Both internal and external loopback are
configured using combinations of RCR[LOOP].
For internal loopback, set LOOP and clear DRT. E_TxEN and E_TxER cannot assert during internal
loopback.
For external loopback, clear LOOP, set DRT, and configure the external transceiver for loopback.
X32 X26 X23 X22 X16 X12 X11 X10 X8X7X5X4X2X1+ + + + + + + +++++++
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11.4.8 Ethernet Error-Handling Procedure
The FEC reports frame reception and transmission error conditions through the buffer descriptors and the
EIR register.
11.4.8.1 Transmission Errors
Transmission errors are defined in Table 11-4.
11.4.8.2 Reception Errors
Table 11-5 describes reception errors.
Table 11-4. Transmission Errors
Error Description
Tra nsmit ter
Underrun
The FEC sends 32 bits that ensure a CRC error and stops transmitting. All remaining buffers for that frame
are then flushed and closed, with the UN bit set in the last TxBD for that frame. The FEC continues to the
next TxBD and begins transmitting the next frame.
Carrier Sense
Lost during Frame
Transmission
When this error occurs and no collision is detected in the frame, the FEC sets the CSL bit in the last TxBD
for this frame. The frame is sent normally. No retries are performed as a result of this error. The CSL bit is
not set if TCR[FDEN] = 1, regardless of the state of CRS.
Retransmission
Attempts Limit
Expired
When this error occurs, the FEC terminates transmission. All remaining buffers for that frame are then
flushed and closed, with the RL bit set in the last TxBD for that frame. The FEC then continues to the next
TxBD and begins sending the next frame.
Late Collision1
1The definition of what constitutes a late collision is hard-wired in the FEC.
The FEC stops sending. All remaining buffers for that frame are then flushed and closed, with the LC bit set
in the last TxBD for that frame. The FEC then continues to the next TxBD and begins sending the next frame.
Heartbeat Some transceivers have a self-test feature called heartbeat or signal-quality error. To signify a good self-test,
the transceiver indicates a collision within 20 clocks after the FEC sends a frame. This heartbeat condition
does not imply a real collision, but that the transceiver seems to be functioning properly.
If TCR[HBC] is set and the heartbeat condition is not detected by the FEC after a frame transmission, then
a heartbeat error occurs. When this error occurs, the FEC closes the buffer, sets the HB bit in the Tx BD,
and generates the HBERR interrupt if it is enabled.
Table 11-5. Reception Errors
Error Description
Overrun Error The FEC maintains an internal FIFO for receiving data. If a receiver FIFO overrun occurs, the FEC closes the
buffer and sets RxBD[OV].
Non-Octet Error
(Dribbling Bits)
The FEC handles up to seven dribbling bits when the receive frame terminates non-octet aligned and it checks
the CRC of the frame on the last octet boundary. If there is a CRC error, the frame non-octet aligned (NO)
error is reported in the RxBD. If there is no CRC error, no error is reported.
CRC Error When a CRC error occurs with no dribbling bits, the FEC closes the buffer and sets RxBD[CR]. CRC checking
cannot be disabled, but the CRC error can be ignored if checking is not required.
Frame Length
Violation
When the receive frame length exceeds R_HASH[MAX_FRAME_LENGTH], EIR[BABR] is set indicating
babbling receive error, and the LG bit in the end of frame RxBD is set.
Note: Receive frames exceeding 2047 bytes are truncated.
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11.5 Programming Model
This section gives an overview of the registers, followed by a description of the buffers.
The FEC is programmed by a combination of control/status registers (CSRs) and buffer descriptors. The
CSRs are used for mode control and to extract global status information. The desc riptors are used to pass
data buffers and related buffer information between the hardware and software.
Table 11-6 shows the FEC register memory map with each register address, name, and a brief description.
The following sections describe each register in detail.
Table 11-6. FEC Register Memory Map
Offset Name Width Description
0x840 ECR 32 Ethernet control register, [p. 11-11]
0x844 EIR 32 Interrupt event register, [p. 11-12]
0x848 EIMR 32 Interrupt mask register, [p. 11-13]
0x84C IVSR 32 Interrupt vector status register, [p. 11-14]
0x850 RDAR 32 Receive descriptor active register, [p. 11-15]
0x854 TDAR 32 Transmit descriptor active register, [p. 11-16]
0x880 MMFR 32 MII management frame register, [p. 11-17]
0x884 MSCR 32 MII speed control register, [p. 11-18]
0x8CC FRBR 32 FIFO receive bound register, [p. 11-19]
0x8D0 FRSR 32 FIFO receive start register, [p. 11-20]
0x8EC TFSR 32 FIFO transmit start register, [p. 11-22]
0x8E4 TFWR 32 Transmit FIFO watermark, [p. 11-21]
0x944 RCR 32 Receive control register, [p. 11-23]
0x948 MFLR 32 Maximum frame length register, [p. 11-24]
0x984 TCR 32 Transmit control register, [p. 11-25]
0xC00 MALR 32 Lower 32-bits of MAC address
0xC04 MAUR 32 Upper 16-bits of MAC address
0xC08 HTUR 32 Upper 32-bits of hash table, [p. 11-28]
0xC0C HTLR 32 Lower 32-bits of hash table, [p. 11-29]
0xC10 ERDSR 32 Pointer to receive descriptor ring, [p. 11-30]
0xC14 ETDSR 32 Pointer to transmit descriptor ring, [p. 11-31]
0xC18 EMRBR 32 Maximum receive buffer size, [p. 11-32]
0xC40–
0xDFF
EFIFO 32 FIFO RAM space
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11.5.1 Ethernet Control Register (ECR)
The ECR register, Figure 11-5, is used to enable/disable the FEC. It is written by the user and cleared at
system reset.
31 26 25 24 16
Field —TX_RT —
Reset 0000_0000_0000_0000
R/W Read/write
15 21 0
Field — ETHER_EN RESET
Reset 0000_0000_0000_0000
R/W Read/write
Addr MBAR + 0x840
Figure 11-5. Ethernet Control Register (ECR)
Table 11-7. ECR Field Descriptions
Bits Name Description
31–26 — Reserved, should be cleared.
25 TX_RT Transmit retime.
0 Normal operation, seven-wire serial mode.
1 The transmit output signals (E_TxD[3:0], E_TxEN, and E_TxER) are delayed by one-half of a
E_TxCLK period. This bit should be set to provide compatibility with transceivers that have hold
time requirements that exceed the MII specification.
24–2 — Reserved, should be cleared.
1 ETHER_EN Ethernet enable. When this bit is set, the FEC is enabled, and reception and transmission is possible.
When this bit is cleared, reception is immediately stopped and transmission is stopped after a bad
CRC is appended to any frame currently being transmitted. The buffer descriptor(s) for an aborted
transmit frame are not updated following deassertion of ETHER_EN. When ETHER_EN is
deasserted, the DMA, buffer descriptor, and FIFO control logic are reset, including FIFO pointers.
0 RESET Ethernet controller reset. When this bit is set, the equivalent of a hardware reset is performed but it
is local to the FEC. ETHER_EN is cleared and all other FEC registers take their reset values. Also,
any transmission/reception currently in progress is abruptly aborted. This bit is automatically cleared
by hardware once the reset sequence is complete (approximately 16 clock cycles after being set).
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11.5.2 Interrupt Event Register (EIR)
An event that sets a bit in EIR generates an interrupt if the corresponding bit in the interrupt mask register
(EIMR) is set. Bits in the interrupt event register are cleared when a one is written to them. Writing a zero
has no effect.
31 30 29 28 27 26 25 24 23 22 21 20 16
Field HBERR BABR BABT GRA TXF TXB RXF RXB MII EBERR UMINT —
Reset 0000_0000_0000_0000
R/W Read/write
15 0
Field —
Reset 0000_0000_0000_0000
R/W Read/write
Addr MBAR + 0x844
Figure 11-6. Interrupt Event Register (EIR)
Table 11-8. EIR Field Descriptions
Bits Name Description
31 HBERR Heartbeat error. A heartbeat was not detected within the heartbeat window following a transmission.
30 BABR Babbling receive error. A frame was received with length in excess of MAX_FL bytes.
29 BABT Babbling transmit error. The transmitted frame length has exceeded MAX_FL bytes. This condition is
usually caused by a frame that is too long being placed into the transmit data buffer(s). Truncation does
not occur.
28 GRA Graceful stop complete. A graceful stop, which was initiated by setting X_CTRL[GTS], is now complete.
This bit is set as soon as the transmitter has finished transmitting any frame that was in progress when
GTS was set.
27 TXF Transmit frame interrupt. A frame has been transmitted and that the last corresponding buffer descriptor
has been updated.
26 TXB Transmit buffer interrupt. A transmit buffer descriptor has been updated.
25 RXF Receive frame interrupt. A frame has been received and the last corresponding buffer descriptor has
been updated.
24 RXB Receive buffer interrupt. A receive buffer descriptor has been updated.
23 MII MII interrupt. The MII has completed the data transfer requested.
22 EBERR FEC bus error. A bus error occurred when the FEC was accessing an internal bus.
21 UMINT Unmasked interrupt status. An interrupt is currently being asserted to the interrupt controller. This bit is
not maskable.
20–0 — Reserved, should be cleared.
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11.5.3 Interrupt Mask Register (EIMR)
The EIMR register provides control over which possible interrupt events are allowed to actually cause an
interrupt.This register is cleared upon a hardware reset.
31 30 29 28 27 26 25 24 23 22 21 16
Field HBERR BABR BABT GRA TXF TXB RXF RXB MII EBERR —
Reset 0000_0000_0000_0000
R/W Read/write
15 0
Field —
Reset 0000_0000_0000_0000
R/W Read/write
Addr MBAR + 0x848
Figure 11-7. Interrupt Mask Register (EIMR)
Table 11-9. EIMR Register Field Descriptions
Bits Name Description
31–22 See
Figure 11-7
Interrupt mask. Each bit corresponds to an interrupt source defined by the EIR register. The
corresponding EIMR bit determines whether an interrupt condition can generate an interrupt. At
every clock, the EIR samples the signal generated by the interrupting source. The corresponding
EIR bit reflects the state of the interrupt signal even if the corresponding EIMR bit is set.
0 The corresponding interrupt source is masked .
1 The corresponding interrupt source is not masked.
21–0 — Reserved, should be cleared.
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11.5.4 Interrupt Vector Status Register (IVSR)
The IVSR register gives status indicating the class of interrupt being generated by the FEC. Interrupt level
control is provided in the interrupt control registers of the SIMBC.
31 16
Field —
Reset 0000_0000_0000_0000
R/W Read Only
15 43210
Field — IVEC —
Reset 0000_0000_0000_0000
R/W Read Only
Addr MBAR + 0x84C
Figure 11-8. Interrupt Vector Status Register (IVSR)
Table 11-10. IVSR Field Descriptions
Bit Name Description
31–4 — Reserved, should be cleared.
3–2 IVEC Interrupt vector. IVEC gives the highest outstanding priority FEC interrupt. The bit field meanings (from
low priority to high priority) are as follows:
00 No pending FEC interrupt
01 Non-time critical interrupt (All interrupts except TXB, TXF, RXB, and RXF.)
10 Transmit interrupt
11 Receive interrupt
1–0 — Reserved, should be cleared.
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11.5.5 Receive Descriptor Active Register (RDAR)
The RDAR register, Figure 11-9, is a command register that should be written by the user to indicate that
the receive descriptor ring has been updated (empty receive buffers have been pr oduced by the driver with
the E bit set).
The R_DES_ACTIVE bit is set whenever the register is written. This is independent of the data actually
written by the user. When set, the FEC polls the receive descriptor ring and processes receive frames
(provided ETHER_EN is also set). As soon as the FEC polls a receive descriptor whose E bit is not set, it
clears the R_DES_ACTIVE bit and stops polling the receive descriptor ring.
The RDAR register is cleared at reset and when ETHER_EN is cleared.
Figure 11-9. Receive Descriptor Active Register (RDAR)
Table 11-11 describes the RDAR fields.
31 25 24 23 16
Field — R_DES_ACTIVE —
Reset 0000_0000_0000_0000
R/W Read/Write
15 0
Field —
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x850
Table 11-11. RDAR Register Field Descriptions
Bit Name Description
31–25 — Reserved, should be cleared.
24 R_DES_ACTIVE Set when this register is written, regardless of the value written. Cleared by the FEC whenever
no additional empty descriptors remain in the receive ring.
23–0 — Reserved, should be cleared.
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11.5.6 Transmit Descriptor Active Register (TDAR)
The TDAR register, Figure 11-10, is a command register which should be set by the user to indicate that
the transmit descriptor ring has been updated, that is, transmit buffers have been defined by the driver with
the ready bit set in the buffer descriptor.
The X_DES_ACTIVE bit is set whenever the register is written. This is independent of the data actually
written by the user. When TDAR is set, the FEC polls the transmit descriptor ring and processes transmit
frames (provided ETHER_EN is also set). As soon as the FEC polls a transmit descriptor whose ready bit
is not set, it clears the X_DES_ACTIVE bit and stops polling the transmit descriptor ring.
The TDAR register is cleared at reset and when ETHER_EN is cleared. Figure 11-10 describes this
register.
Table 11-12 describes the TDAR fields.
31 25 24 23 16
Field — X_DES_ACTIVE —
Reset 0000_0000_0000_0000
R/W Read/Write
15 0
Field —
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR +0x854
Figure 11-10. Transmit Descriptor Active Register (TDAR)
Table 11-12. TDAR Field Descriptions
Bits Name Description
31–25 — Reserved, should be cleared.
24 X_DES_ACTIVE Set to one when this register is written, regardless of the value written. Cleared by the FEC
whenever no additional ready descriptors remain in the transmit ring.
23–0 — Reserved, should be cleared.
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11.5.7 MII Management Frame Register (MMFR)
The MMFR register, Figure 11-11, is used to communicate with the attached MII compatible PHY
device(s), providing read/write access to their MII registers. Performing a write to the MMFR register
causes a management frame to be sourced, unless the MSCR register has been programmed to 0. In the
case of writing to MMFR when MSCR = 0, if the MSCR register is then written to a non-zero value, an
MII frame is generated with the data previously written to MMFR. This allows MMFR and MSCR to be
programmed in either order if MSCR is currently zero.
Table 11-13 describes the MMFR fields.
To perform a read or write operation on the MII management interface, the MMFR register is written by
the user. To generate a valid read or write management frame, the ST field must be written with a 01
pattern, the OP field must be written with a 01 (management register write frame) or 10 (management
register read frame), and the TA field must be written with a 10. If other patterns are written to these fields,
a frame is generated but will not comply with the IEEE 802.3 MII definition. OP field = 1x produces a
read-frame operation, while OP = 0x produces a write-frame operation.
To generate an 802.3-compliant MII management interface write frame (write to a PHY register), the user
must write {01 01 PHYAD REGAD 10 DATA} to the MMFR register. Writing this pattern causes the
control logic to shift out the data in the MMFR register following a preamble generated by the control state
machine. The contents of MMFR are altered as the contents are serially shifted, and are unpredictable if
read by the user. Once the write management frame operation completes, the MII interrupt is generated.
At this time, the contents of the MMFR register match the original value written.
31 30 29 28 27 23 22 18 17 16
Field ST OP PA RA TA
Reset Undefined
R/W Read/Write
15 0
Field DATA
Reset Undefined
R/W Read/Write
Addr MBAR + 0x880
Figure 11-11. MII Management Frame Register (MMFR)
Table 11-13. MMFR Field Descriptions
Bits Name Description
31–30 ST Start of frame delimiter. Must be programmed to 01 for a valid MII management frame
29–28 OP Operation code. This field must be programmed to 10 (read) or 01(write) to generate a valid MII
management frame. A value of 11 produces a read frame operation while a value of 00 produces a
write frame operation, but these frames are not MII-compliant.
27–23 PA PHY address. Specifies one of up to 32 attached PHY devices
22–18 RA Register address. Specifies one of up to 32 registers within the specified PHY device
17–16 TA Turn around. Must be programmed to 10 to generate a valid MII management frame.
15–0 DATA Management frame data. Field for data to be written to or read from PHY register
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To generate an MII management interface read frame (read a PHY register), the user must write {01 10
PHYAD REGAD 10 XXXX} to MMFR (the contents of the DATA field are a don’t care). Writing this
pattern causes the control logic to s hift out the data in the MMFR register following a preamble generated
by the control state machine.The contents of the MMFR register are altered as the contents are serially
shifted, and are unpredictable if read by the user. Once the read management frame operation completes,
the MII interrupt is generated. At this time the contents of the MMFR register matches the original value
written except for the DATA field, whose contents are replaced by the value read from the PHY register.
If the MMFR register is written while frame generation is in progress, the frame contents are altered.
Software should use the MII interrupt to avoid writing to the MMFR register while frame generation is in
progress.
11.5.8 MII Speed Control Register (MSCR)
The MSCR register, Figure 11-12, provides control of the MII clock (E_MDC pin) frequency, allows
dropping the preamble on the MII management frame and provides observability (intended for
manufacturing test) of an internal counter used in generating the E_MDC clock signal.
Table 11-14 describes the MSCR fields.
31 16
Field —
Reset 0000_0000_0000_0000
R/W Read/Write
15 8 7 6 1 0
Field — DIS_PREAMBLE MII_SPEED —
Reset 0000_0000 0 000_000 0
R/W Read/Write
Addr MBAR + 0x884
Figure 11-12. MII Speed Control Register (MSCR)
Table 11-14. MSCR Field Descriptions
Bits Name Description
31–8 — Reserved, should be cleared.
7 DIS_PREAMBLE Disable preamble. Asserting this bit causes the preamble of 32 consecutive 1’s not to be
prepended to the MII management frame. The MII standard allows the preamble to be dropped
if the attached PHY device(s) do not require it.
6–1 MII_SPEED MII frequency divider. MII_SPEED controls the frequency of the MII management interface
clock (E_MDC) relative to system clock. A value of 0 in this field turns off the E_MDC and
leaves it in low-voltage state. Any non-zero value results in an E_MDC frequency given by the
following formula:
MDC_FREQUENCY = system frequency / (4 * MII_SPEED)
0 — Reserved, should be cleared.
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The MII_SPEED field must be programmed with a value to provide an E_MDC frequency of less than or
equal to 2.5 MHz to be compliant with the IEEE MII specification. The MII_SPEED must be set to a
non-zero value in order to source a read or write management frame. After the management frame is
complete, the MSCR register may optionally be set to zero to turn off the E_MDC. The E_MDC generated
will have a 50% duty cycle except when MII_SPEED is changed during operation. Change will take effect
following either a rising or falling edge of E_MDC.
If the system clock is 50 MHz, programming this register to 0x0000_000A results in an E_MDC frequency
of 25 MHz * 1/10 = 2.5 MHz. Table 11-15 shows optimum values for MII_SPEED as a function of system
clock frequency.
11.5.9 FIFO Receive Bound Register (FRBR)
FRBR is a read-only register used to determine the upper address boundary of the FIFO RAM. Drivers can
use this value, along with the registers FRSR and TFSR, to appropriately divide the available FIFO RAM
between the transmit and receive data paths. The value in this register must be added to MBAR + 0x800
to determine the absolute address.
Table 11-16 describes the FRBR fields.
Table 11-15. Programming Examples for MSCR Register
System Clock Frequency [MII_SPEED] E_MDC frequency
25 MHz 0x3 2.08 MHz
33 MHz 0x4 2.06 MHz
50 MHz 0x5 2.5 MHz
66 MHz 0x7 2.36 MHz
31 16
Field —
Reset 0000_0000_0000_0000
R/W Read only
15 11 10 2 1 0
Field — R_BOUND —
Reset 0000_0 110_0000_00 00
R/W Read only
Addr MBAR + 0x884
Figure 11-13. FIFO Receive Bound Register (FRBR)
Table 11-16. FRBR Field Descriptions
Bits Name Description
31–11 — Reserved, should be cleared.
10–2 R_BOUND End of FIFO RAM. This field contains the ending address of the FIFO RAM, exclusive.
1–0 — Reserved, should be cleared.
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11.5.10 FIFO Receive Start Register (FRSR)
The FRSR register , Figure 11-14, is programmed by the user to indicate the starting address of the receive
FIFO. FRSR marks the boundary between the transmit and receive FIFOs. The transmit FIFO uses
addresses from TFSR to FRSR - 4. The receive FIFO uses addresses from FRSR to FRBR - 4. The value
in this register must be added to MBAR + 0x800 to determine the absolute address.
FRSR needs to be written only to change the default value.
Table 11-17 describes the FRSR fields.
31 16
Field —
Reset 0000_0000_0000_0000
R/W Read/Write
15 11 10 9 2 1 0
Field — 1 R_FSTART —
Reset 0000_0 1 01_0000_00 00
R/W Read/Write
Addr MBAR + 0x8D0
Figure 11-14. FIFO Receive Start Register (FRSR)
Table 11-17. FRSR Field Descriptions
Bits Name Description
31–11 — Reserved, should be cleared.
10 1 Reserved, should be set.
9–2 R_FSTART Receive FIFO starting address. Address of first receive FIFO location. Acts as delimiter between
receive and transmit FIFOs.
1–0 — Reserved, should be cleared.
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11.5.11 Transmit FIFO Watermark (TFWR)
The TFWR register, shown in Figure 11-15, controls the amount of data required in the transmit FIFO
before transmission of a frame can begin. Setting TFWR to larger values reduces the risk of transmit FIFO
underrun due to system bus latency.
Table 11-18 describes the TFWR fields.
31 16
Field —
Reset 0000_0000_0000_0000
R/W Read/Write
15 210
Field —X_WMRK
Reset 0000_0000_0000_00 00
R/W Read/Write
Addr MBAR + 0x8E4
Figure 11-15. Transmit FIFO Watermark (TFWR)
Table 11-18. TFWR Field Descriptions
Bits Name Description
31–2 — Reserved, should be cleared.
1–0 X_WMRK Transmit FIFO watermark. Frame transmission begins when the number of bytes selected by this
field are written into the transmit FIFO, if an end of frame has been written to the FIFO, or if the
FIFO is full before the selected number of bytes are written. The options are:
0X 64 bytes written to transmit FIFO
10 128 bytes written to transmit FIFO
11 192 bytes written to transmit FIFO
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11.5.12 FIFO Transmit Start Register (TFSR)
The TFSR register, Figure 11-16, can be programmed by the user to indicate the starting address of the
transmit FIFO. Usually there is no need to program TFSR. For optimal RAM allocation, do not program
TFSR to a value less than its reset value. The value in this register must be added to MBAR + 0x800 to
determine the absolute address.
The TFSR register is reset to the first available RAM address.
Table 11-19 describes the TFSR fields.
31 16
Field —
Reset 0000_0000_0000_0000
R/W Read/Write
15 11 10 9 2 1 0
Field — 1 X_FSTART —
Reset 0000_0 1 0001_1000 00
R/W Read/Write
Addr MBAR + 0x8EC
Figure 11-16. FIFO Transmit Start Register (TFSR)
Table 11-19. TFSR Field Descriptions
Bits Name Description
31–11 — Reserved, should be cleared.
10 — Reserved, should be set.
9–2 X_FSTART Transmit FIFO starting address. Address of first transmit FIFO location.
1–0 — Reserved, should be cleared.
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11.5.13 Receive Control Register (RCR)
The RCR register, Figure 11-17, controls the operational mode of the receive block.
Table 11-20 describes the RCR fields.
31 16
Field —
Reset 0000_0000_0000_0000
R/W Read/Write
15 43 2 10
Field —PROM MII_MODE DRT LOOP
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x944
Figure 11-17. Receive Control Register (RCR)
Table 11-20. RCR Field Descriptions
Bits Name Description
31–4 — Reserved, should be cleared.
3 PROM Promiscuous mode. All frames are accepted regardless of address matching.
2 MII_MODE MII mode enable. Selects the external interface mode. Setting this bit to one selects MII
mode, setting this bit equal to zero selects seven-wire mode (used only for serial 10 Mbps).
This bit controls the interface mode for both transmit and receive blocks.
1 DRT Disable receive on transmit
0 Receive path operates independently of transmit (use for full duplex or to monitor transmit
activity in half-duplex mode).
1 Disable reception of frames while transmitting (normally used for half-duplex mode).
0 LOOP Internal loopback. If set, transmitted frames are looped back internal to the FEC and the
transmit output signals are not asserted. The system clock is substituted for the E_TxCLK
when LOOP is asserted. DRT must be set to zero when asserting LOOP.
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11.5.14 Maximum Frame Length Register (MFLR)
As shown in Figure 11-18, the MFLR register serves two purposes. Bits 10–0 provide the user R/W
MAX_FL field. The MAX_FL field allows the user to program the maximum legal-size frame. Frames
larger than this size cause the BABT interrupt (transmit frames) or BABR interrupt and receive buffer
descriptor LG bit to be asserted (receive frames). Frames exceeding the MAX_FL are not truncated.
Bits 31–24 provide an eight-bit read-only field that provides address recognition information from the
receive block about the frame currently being received by the FEC.
Table 11-21 describes the MFLR fields.
31 30 29 24 23 16
Field BRDCAST MULTCAST HASH —
Reset 0000_0000_0000_0000
R/W Read/Write
15 11 10 0
Field — MAX_FL
Reset 0000_0 101_1110_1110
R/W Read/Write
Addr MBAR + 0x948
Figure 11-18. Maximum Frame Length Register (MFLR)
Table 11-21. MFLR Field Descriptions
Bits Name Description
31 BRDCAST Broadcast address received. Set if the current receive frame contained a destination address of all
ones (the broadcast address). Cleared if the current receive frame does not correspond to a
broadcast address.
30 MULTCAST Multicast address received. Set if the current receive frame contained a multi-cast destination
address (the least significant bit of the DA was set). Cleared if the current receive frame does not
correspond to a multi-cast address.
29–24 HASH Current hash value. Corresponds to the hash value of the current receive frame’s destination
address. The hash value is a 6-bit field extracted from the least significant portion of the CRC
register.
23–11 — Reserved, should be cleared.
10–0 MAX_FL Maximum frame length. Length is measured starting at DA and includes the CRC at the end of the
frame. Transmit frames longer than MAX_FL cause the BABT interrupt to occur. Receive frames
longer than MAX_FL cause the BABR interrupt to occur and set the LG bit in the end-of-frame buffer
descriptor. Frames exceeding the MAX_FL are not truncated. Transmit frames are never truncated,
but receive frames are truncated at 2k-1 bytes. The MAX_FL field resets to 1518 decimal and can
be programmed either smaller or larger (up to 2k-1). The recommended default value to be
programmed by the user is 1518 or 1522 (if VLAN Tags are supported).
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11.5.15 Transmit Control Register (TCR)
The TCR register, Figure 11-19, controls the operational mode of the transmit block
Table 11-22 describes the TCR fields.
31 16
Field —
Reset 0000_0000_0000_0000
R/W Read/Write
15 3210
Field —FDEN HBC GTS
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x984
Figure 11-19. Transmit Control Register (TCR)
Table 11-22. TCR Field Descriptions
Bits Name Description
31–3 — Reserved, should be cleared.
2 FDEN Full duplex enable. If set, frames are transmitted independent of carrier sense and collision inputs. This
bit should only be modified when ETHER_EN is deasserted.
1 HBC Heartbeat control. If set, the heartbeat check is performed following end of transmission and the HB
bit in the status register is set if the collision input does not assert within the heartbeat window. This bit
should be modified only when ETHER_EN is deasserted.
0 GTS Graceful transmit stop. When this bit is set, the MAC stops transmission after any current frame is
complete and the GRA interrupt in the INTR_EVENT register is asserted. If frame transmission is not
currently underway, the GRA interrupt is asserted immediately. Once transmission is complete, a
restart is accomplished by clearing the GTS bit. The next frame in the transmit FIFO is then transmitted.
If an early collision occurs during transmission when GTS = 1, transmission stops after the collision.
The frame is transmitted again once GTS is cleared. Note that there may be old frames in the transmit
FIFO that are transmitted when GTS is reasserted. To avoid this, deassert ETHER_EN following the
GRA interrupt.
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11.5.16 RAM Perfect Match Address Low (MALR)
The MALR register contains the lower 32 bits of the 48 bit MAC address used in the address recognition
process to compare with the Destination Address field of the receive frames.
This register, shown in Figure 11-20, is not reset and must be initialized by the user prior to operation.
31 16
Field ADDR_LOW
Reset Undefined
R/W Read/Write
15 0
Field ADDR_LOW
Reset Undefined
R/W Read/Write
Addr MBAR + 0xC00
Figure 11-20. RAM Perfect Match Address Low (MALR)
Table 11-23. MALR Field Descriptions
Bits Name Description
31–0 ADDR_LOW Bytes 0 (bits 31–24), 1 (bits 23–16), 2 (bits 15:8), and 3 (bits 7–0) of the 6-byte address.
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11.5.16.1 RAM Perfect Match Address High (MAUR)
The MAUR register contains bytes 4 and 5 of the 48-bit MAC address used in the address recognition
process to compare with the destination address field of the receive frames. Byte 0 is the first byte
transmitted on the network at the start of the frame.
This register is not reset and must be initialized by the user prior to operation. See Figure 11-21.
31 16
Field ADDR_HIGH
Reset Undefined
R/W Read/Write
15 0
Field ADDR_HIGH
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0xC04
Figure 11-21. RAM Perfect Match Address High (MAUR)
Table 11-24. MAUR Field Descriptions
Bits Name Description
31–0 ADDR_HIGH Bytes 4 (bits 31–24) and 5 (bits 23–16) of the 6-byte address.
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11.5.17 Hash Table High (HTUR)
The HTUR register, Figure 11-22, contains the upper 32 bits of the 64-bit hash table used in the address
recognition process for receive frames with a multicast address.
This register is not reset and must be initialized by the user prior to operation.
31 16
Field HASH_HIGH
Reset Undefined
R/W Read/Write
15 0
Field HASH_HIGH
Reset Undefined
R/W Read/Write
Addr MBAR + 0xC08
Figure 11-22. Hash Table High (HTUR)
Table 11-25. HTUR Field Descriptions
Bits Name Description
31–0 HASH_HIGH The HTUR register contains the upper 32 bits of the 64-bit hash table used in the address
recognition process for receive frames with a multicast address.
Bit 31 of HTUR contains hash index bit 63.
Bit 0 of HTUR contains hash index bit 32.
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11.5.18 Hash Table Low (HTLR)
The HTLR register, Figure 11-23, contains the lower 32 bits of the 64-bit hash table used in the address
recognition process for receive frames with a multicast address.
This register is not reset and must be initialized by the user prior to operation.
31 16
Field HASH_LOW
Reset Undefined
R/W Read/Write
15 0
Field HASH_LOW
Reset Undefined
R/W Read/Write
Addr MBAR + 0xC0C
Figure 11-23. Hash Table Low (HTLR)
Table 11-26. HTLR Field Descriptions
Bits Name Description
31–0 HASH_LOW The HTLR register contains the lower 32 bits of the 64-bit hash table used in the address
recognition process for receive frames with a multicast address.
Bit 31 of HTLR contains hash index bit 31.
Bit 0 of HTLR contains hash index bit 0.
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11.5.19 Pointer-to-Receive Descriptor Ring (ERDSR)
This register , Figure 11-24, provides a pointer to the start of the circular receive buf fer descriptor queue in
external memory. This pointer must be long-word aligned. However , it is recommended it be aligned on a
16-byte boundary (address evenly divisible by 16) in order to improve bus utilization. Bits 1 and 0 should
be written to 0 by the user. Non-zero values in these two bit positions are ignored by the hardware.
This register is not reset and must be initialized by the user prior to operation.
31 16
Field R_DES_START
Reset Undefined
R/W Read/Write
15 210
Field R_DES_START 0 0
Reset Undefined
R/W Read/Write
Addr MBAR + 0xC10
Figure 11-24. Pointer-to-Receive Descriptor Ring (ERDSR)
Table 11-27. ERDSR Field Descriptions
Bits Name Description
31–2 R_DES_START Pointer to start of receive buffer descriptor queue.
1–0 — Reserved, should be cleared.
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11.5.20 Pointer-to-Transmit Descriptor Ring (ETDSR)
This register provides a pointer to the start of the circular transmit buffer descriptor queue in external
memory. This pointer must be long-word aligned. However, it is recommended it be aligned on a 16 byte
boundary (address evenly divisible by 16) in order to improve bus utilization. Bits 1 and 0 should be set
to 0 by the user. Non-zero values in these two bit positions are ignored by the hardware.
This register is not reset and must be initialized by the user prior to operation.
31 16
Field X_DES_START
Reset Undefined
R/W Read/Write
15 210
Field X_DES_START 0 0
Reset Undefined
R/W Read/Write
Addr MBAR + 0xC14
Figure 11-25. Pointer-to-Transmit Descriptor Ring (ETDSR)
Table 11-28. ETDSR Field Descriptions
Bits Name Description
31–2 X_DES_START Pointer to start of transmit buffer descriptor queue.
1–0 — Reserved, should be cleared.
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11.5.21 Receive Buffer Size Register (EMRBR)
The EMRBR register dictates the maximum size of all receive buffers. Note that because receive frames
are truncated at 2k-1 bytes, only bits 10–4 are used. This value should take into consideration that the
receive CRC is always written into the last receive buffer. To allow one maximum size frame per buffer,
R_BUFF_SIZE must be set to MAX_FL or larger . The R_BUFF_SIZE must be evenly divisible by 16. To
insure this, bits 3–0 are forced low. To minimize bus utilization (descriptor fetches), it is recommended
that R_BUFF_SIZE be at least 256 bytes.
This register, Figure 11-26, is not reset and must be initialized by the user prior to operation.
31 16
Field —
Reset 0000_0000_0000_0000
R/W Read/Write
15 11 10 4 3 0
Field — R_BUFF_SIZE —
Reset 0000_0 0000
R/W Read/Write
Addr MBAR + 0xC18
Figure 11-26. Receive Buffer Size (EMRBR)
Table 11-29. EMRBR Field Descriptions
Bits Name Description
31–11 — Reserved, should be cleared.
10–4 R_BUFF_SIZE Receive buffer size.
3–0 — Reserved, should be cleared.
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11.5.22 Initialization Sequence
This section describes which registers and RAM locations are reset due to hardware reset, which are reset
due to the FEC reset, and what locations the user must initialize before enabling the FEC.
As soon as the FEC is initialized and enabled, it operates autonomously. Typically, the driver writes only
to RDAR, TDAR, and EIR during operation.
11.5.22.1 Hardware Initialization
In the FEC, hardware resets only those registers that generate interrupts to the MCF5272 processor or
cause conflict on bidirectional buses. The registers are reset due to a hardware reset.
Other registers reset whenever the ETHER_EN bit is cleared. Clearing ETHER_EN immediately stops all
DMA and transmit activity after a bad CRC is sent, as shown in Table 11-31
11.5.23 User Initialization (Prior to Asserting ETHER_EN)
The user must initialize portions the FEC prior to setting the ETHER_EN bit. The exact values depend on
the particular application. The sequence is similar to the procedure defined in Table 11-32.
Table 11-30. Hardware Initialization
User/System Register/Machine Reset Value
User ECR Cleared
EIR Cleared
EIMR Cleared
MSCR Cleared
System MII State Machine Prevent conflict on MMFR
Table 11-31. ETHER_EN = 0
System/User Location Effect
System DMA block All DMA activity is terminated
XMIT block Transmission is Aborted
User RDAR Cleared
TDAR Cleared
Table 11-32. User Initialization Process (before ETHER_EN)
Step Description
1Set EIMR
2 Clear EIR
3 Set IVSR (define ILEVEL)
4 Set FRSR (optional)
5 Set TFSR (optional)
6 Set MAUR and MALR
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11.5.24 FEC Initialization
In the FEC, the descriptor control machine initializes a few registers whenever the ETHER_EN control is
asserted. The transmit and receive FIFO pointers are reset, the transmit backoff random number is
initialized, and the transmit and receive blocks are activated. After the FEC initialization sequence is
complete, the hardware is ready for operation, waiting for RDAR and TDAR to be asserted by the user.
11.5.24.1 User Initialization (after setting ETHER_EN)
The user initializes portions of the FEC after setting ETHER_EN. The exact values depend on the
particular application. The sequence probably resembles the steps shown in Table 11-33, though these
could also be done before asserting ETHER_EN.
11.6 Buffer Descriptors
Data associated with the FEC controller is stored in buffers, which are referenced by buffer descriptors
(BDs) organized as tables in the dual-port RAM. These tables have the same basic configuration as those
used by the USB.
The BD table allows users to define separate buffers for transmission and reception. Each table forms a
circular queue, or ring. The FEC uses status and control fields in the BDs to inform the core that the buffers
have been serviced, to confirm reception and transmission events, or to indicate error conditions.
7 Set HTUR and HTLR
8Set EMRBR
9 Set ERDSR
10 Set ETDSR
11 Set RCR
12 Set TCR
13 Set MSCR (optional)
14 Initialize (Empty) TxBD
15 Initialize (Empty) RxBD
Table 11-33. User Initialization (after ETHER_EN)
Step Description
1 Fill Receive Descriptor Ring with Empty Buffers
2Set RDAR
Table 11-32. User Initialization Process (before ETHER_EN) (continued)
Step Description
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11.6.1 FEC Buffer Descriptor Tables
The data for the fast Ethernet frames must reside in memory external to the FEC. The data for a frame is
placed in one or more buffers. Each buffer has a pointer to it in a buffer descriptor (BD). In addition to
pointing to the buffer, the BD contains the current state of the buf fer. To permit maximum user flexibility,
the BDs are also located in external memory.
Software defines buffers by allocating/initializing me mor y and initializ i ng buffer descriptors. Setting the
RxBD[E] or TxBD[R] produces the buff er. Software writing to either TDAR or RDAR tells the FEC that
a buffer has been placed in external memory for the transmit or receive data traffic, respectively. The
hardware reads the BDs and processes the buffers after they have been defined. After the data DMA is
complete and the BDs have been written by the DMA engine, RxBD[E] or TxBD[R] are cleared by
hardware to indicate that the buffer has been processed. Software may poll the BDs to detect when the
buffers have been processed or may rely on the buffer/frame interrupts.
The ETHER_EN signal operates as a reset to the BD/DMA logic. When ETHER_EN is negated, the DMA
engine BD pointers are reset to point to the starting transmit and receive BDs. The buffer descriptors are
not initialized by hardware during reset. At least one transmit and receive BD must be initialized by
software (write 0x0000_0000 to the most significant word of buffer descriptor) before the ETHER_EN bit
is set.
The BDs are organized in two separate rings, one for receive buf fers and one for transmit buffers. ERDSR
defines the starting address of the receive BDs and ETDSR the same for the transmit BDs. The last buf fer
descriptor in each ring is defined by the wrap (W) bit. When set, W indicates that the next descriptor in the
ring is at the location pointed to by ERDSR and ETDSR for the receive and transmit rings, respectively.
Buffers descriptor rings must start on a double-word boundary.
The format of the transmit and receive buffer descriptors are given in Figure 11-27 and Figure 11-28.
11.6.1.1 Ethernet Receive Buffer Descriptor (RxBD)
In the RxBD, the user initializes the E and W bits in the first word and the pointer in the second word.
When the buf fer has been sent as a DMA, the FEC will modify the E, L, M, LG, NO, SH, CR, and OV bits
and write the length of the used portion of the buffer in the first word. The M, LG, NO, SH, CR, and OV
bits in the first word of the buffer descriptor are modified by the FEC only when the L bit is set.
The first word of the RxBD contains control and status bits. Its format is detailed below.
1514131211109876543210
+0 E RO1 W RO2 L — M BC MC LG NO SH CR OV TR
+2 DATA LENGTH
+4 Rx Data Buffer Pointer A[31–16]
+6 Rx Data Buffer Pointer A[15–0]
Figure 11-27. Receive Buffer Descriptor (RxBD)
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NOTE
Anytime the software drive r se ts an E bit in a receive descriptor, the driver
should immediately write to RDAR.
Table 11-34. RxBD Field Descriptions
Bits Name Description
15 E Empty. Written by the FEC (= 0) and user (= 1).
0 The data buffer associated with this BD has been filled with received data, or data reception has been
aborted due to an error condition. The status and length fields have been updated as required.
1 The data buffer associated with this BD is empty, or reception is currently in progress.
14 RO1 Receive software ownership. This field is reserved for use by software. This read/write bit is not modified
by hardware, nor does its value affect hardware.
13 W Wrap. Written by the user.
0 =The next buffer descriptor is found in the consecutive location.
1 =The next buffer descriptor is found at the location defined in ERDSR.
12 RO2 Receive software ownership. Reserved for use by software. This read/write bit is not modified by
hardware, nor does its value affect hardware.
11 L Last in frame. Written by the FEC.
0 =The buffer is not the last in a frame.
1 =The buffer is the last in a frame.
10–9 — Reserved, should be cleared.
8 M Miss. Written by the FEC. This bit is set by the FEC for frames that were accepted in promiscuous mode,
but were flagged as a miss by the internal address recognition. Thus, while in promiscuous mode, the
user can use the M-bit to quickly determine whether the frame was destined to this station. Valid only if
the L-bit and the PROM bit are set.
0 The frame was received because of an address recognition hit.
1 The frame was received because of promiscuous mode.
7 BC Broadcast. Written by the FEC. Will be set if DA is broadcast. (FF-FF-FF-FF-FF-FF)
6 MC Mulitcast. Written by the FEC. Is set if DA is multicast and not BC.
5 LG Rx frame length violation. Written by the FEC. A frame length greater than MAX_FL was recognized.
Frames exceeding 2047 bytes are truncated to prevent wrapping hardware length counters. Valid only if
the L-bit is set.
4 NO Rx non-octet-aligned frame. Written by the FEC. A frame that contained a number of bits not divisible by
8 was received, and the CRC check that occurred at the preceding byte boundary generated an error.
Valid only if the L-bit is set. If this bit is set, the CR bit is not set.
3 SH Short frame. Written by the FEC. A frame length that was less than the minimum defined for this channel
was recognized. The FEC does not support SH and this bit is always cleared.
2 CR Rx CRC error. Written by the FEC. Contains a CRC error and is an integral number of octets in length.
Valid only if the L-bit is set.
1 OV Overrun. Written by the FEC. A receive FIFO overrun occurred during frame reception. If this bit is set,
the other status bits, M, LG, NO, SH, CR, and CL, lose their normal meaning and are zero. Valid only if
the L-bit is set.
0 TR Truncated receive frame. Written by the FEC. Set if the receive frame is truncated. Frames greater than
or equal to 2048 bytes are truncated.
Offset
+ 2
Data
Length
Written by the FEC. Data length is the number of octets written by the FEC into this BD’s data buffer if L
= 0 (the value is equal to EMRBR), or the length of the frame including CRC if L = 1. It is written by the
FEC once as the BD is closed.
Offset
+ 4
Rx Buffer
Pointer
Written by the user. The receive buffer pointer, which always points to the first location of the associated
data buffer, must always be evenly divisible by 16. The buffer must reside in memory external to the FEC.
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11.6.1.2 Ethernet Transmit Buffer Descriptor
Data is presented to the FEC for transmission by arranging it in buffers referenced by the channel’ s TxBDs.
The FEC confirms transmission or indicates error conditions using the BDs to inform the host that the
buffers have been serviced. In the TxBD, the user initializes the R, W, L, and TC bits and the length (in
bytes) in the first word and the buffer pointer in the second words.
If L = 0, then the FEC sets the R bit to 0 in the first word of the BD when the buffer is sent as a DMA.
Status bits are not modified.
If L = 1, then the FEC sets the R bit to 0 and will modify the DEF, HB, LC, RL, RC, UN, and CSL status
bits in the first word of the BD after the buffer is sent as a DMA, and frame transmission is complete.
The TxBD fields are detailed in Table 11-35.
15 14 13 12 11 10 9 8 7 6 5 2 1 0
+0 R TO1 W TO2 L TC DEF HB LC RL RC UN CSL
+2 DATA LENGTH
+4 Tx Data Buffer Pointer A[31–16]
+6 Tx Data Buffer Pointer A[15–0]
Figure 11-28. Transmit Buffer Descriptor (TxBD)
Table 11-35. TxBD Field Descriptions
Bits Name Description
15 R Ready. Written by the FEC (= 0) and user (= 1).
0 The data buffer associated with this BD is not ready for transmission. The user is free to
manipulate this BD or its associated data buffer. The FEC clears this bit after the buffer has
been transmitted or after an error condition is encountered.
1 The data buffer, which has been prepared for transmission by the user, has not been
transmitted or is currently being transmitted. No fields of this BD may be written by the user
once this bit is set.
14 TO1 Transmit software ownership bit.Reserved for use by software. This read/write bit is not modified
by hardware, nor does its value affect hardware.
13 W Wrap. Written by the user.
0 The next buffer descriptor is found in the consecutive location.
1 The next buffer descriptor is found at the location defined in ETDSR.
12 TO2 Transmit software ownership bit. Reserved for use by software. This read/write bit is not modified
by hardware, nor does its value affect hardware.
11 L Last in frame. Written by the user.
0 The buffer is not the last in the transmit frame.
1 The buffer is the last in the transmit frame.
10 TC Tx CRC. Written by the user and is only valid if L = 1.
0 End transmission immediately after the last data byte.
1 Transmit the CRC sequence after the last data byte.
9 DEF Defer indication. Written by the FEC and is only valid if L = 1. The FEC had to defer while trying
to transmit a frame. This bit is not set if a collision occurs during transmission.
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An underrun occurs when, during transmit, the transmit FIFO empties before the end of the frame. Then,
a bad CRC is appended to the partially transmitted data. In addition, the UN bit is set in the last BD for the
current frame. This situation can occur if the FEC cannot access an internal bus, or if the next BD in the
frame is not available.
NOTE
Anytime the software driver sets an R bit in a transmit descriptor , the driver
should immediately write to TDAR.
8 HB Heartbeat error. Written by the FEC and is valid only if L = 1. The collision input was not asserted
within the heartbeat window following the completion of transmission. Cannot be set unless the
HBC bit is set in the TCR register.
7 LC Late collision. Written by the FEC and is only valid if L = 1. A collision has occurred after 56 data
bytes are transmitted. The FEC terminates the transmission.
6 RL Retransmission limit. Written by the FEC and is only valid if L = 1. The transmitter has failed retry
limit + 1 attempts to successfully transmit a message due to repeated collisions on the medium.
5–2 RC Retry count. Written by the FEC and is valid only if L = 1. These four bits indicate the number of
retries required before this frame is successfully transmitted. If RC = 0, then the frame was
transmitted correctly the first time. If RC = 15, then the frame was transmitted successfully while
the retry count was at its maximum value. If RL is set, then RC has no meaning.
1 UN Underrun. Written by the FEC and is only valid if L = 1. The FEC encountered a transmit FIFO
underrun while transmitting one or more of the data buffers associated with this frame. When
transmit FIFO underrun occurs, transmission of the frame stops, and an incorrect CRC is
appended. The remaining buffer(s) associated with this frame are sent as a DMA and dumped by
the transmit logic.
0 CSL Carrier sense lost. Written by the FEC and is valid only if L = 1. Carrier sense dropped out or never
asserted during transmission of a frame without collision.
- Data Length Written by the user. Data length is the number of octets the FEC should transmit from this BD’s
data buffer. It is never modified by the FEC. Bits [10–0] are used by the DMA engine; bits [15–11]
are ignored.
- Tx Buffer Pointer Written by the user. The transmit buffer pointer, which contains the address of the associated data
buffer, may be even or odd. The buffer must reside in memory external to the FEC. This value is
never modified by the FEC.
Table 11-35. TxBD Field Descriptions (continued)
Bits Name Description
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11.7 Differences between MCF5272 FEC and MPC860T FEC
The MCF5272 features the same FEC as the MPC860T with a few dif ferences. The following list pertains
to the MCF5272.
• Limited throughput full-duplex 100 Mbps operation. External bus use is the limiting factor.
• Only big-endian mode is supported for buffer descriptors and buffers.
• Separate interrupt vectors for Rx, Tx and non-time critical interrupts
• Interrupt priority is set in the interrupt controller
• The formula for calculating E_MDC clock frequency differs between MCF5272 and MPC860T:
— MCF5272: E_MDC_FREQUENCY= system frequency / (4 * MII_SPEED)
— MPC860T: E_MDC_FREQUENCY= system frequency / (2 * MII_SPEED)
NOTE
MCF5272 ethernet controller signal names are generally identical to those
used in the MPC860T , except for a prefix of ‘E_’. For example, MDC in the
MPC860T corresponds to E_MDC in the MCF5272.
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Chapter 12
Universal Serial Bus (USB)
This chapter provides an overview of the USB module of the MCF5272, including detailed operation
information and the USB programming model. Connection examples and circuit board layout
considerations are also provided.
The USB Specification, Revision 1.1 is a recommended supplement to this chapter. It can be downloaded
from http://www.usb.org. Chapter 2 of this specification, Terms and Abbr eviations, provides definitions of
many of the terms found here.
NOTE
Unless otherwise stated, all mention of the USB specification refers to
revision 1.1.
12.1 Introduction
The universal serial bus (USB) is an industry-standard extension to the PC architecture. The USB
controller on the MCF5272 supports device mode data communication between itself and a USB host
device, typically a PC. One host and up to 127 attached peripherals share USB bandwidth through a
host-scheduled, token-based protocol. The USB uses a tiered star topology with a hub at the center of each
star, as shown in Figure 12-1. Each wire segment is a point-to-point connection between the host A
connector and a peripheral B connector.
The USB cables contain four wires, two for data and two for power. The USB full-speed bit rate is
12 Mbps. A limited-capability, low-speed mode is also defined at 1.5 Mbps.
The MCF5272 includes the following features:
• Supports full-speed 12-Mbps USB devices and low-speed 1.5-Mbps devices
• Full compliance with the Universal Serial Bus Specification, Revision 1.1
• Automatic processing of USB standard device requests: CLEAR_FEATURE, GET_CONFIGURATION,
GET_DESCRIPTOR, GET_INTERFACE, GET_STATUS, SET_ADDRESS, SET_CONFIGURATION,
SET_FEATURE, and SET_INTERFACE
• Supports either internal or external USB transceiver
• Programmable 512-byte receive and 512-byte transmit FIFO buffers
• USB device controller with protocol control and administration for up to eight endpoints, 16
interfaces, and 16 configurations
• Programmable endpoint types with support for up to eight control, interrupt, bulk, or isochronous
endpoints
• Independent interrupts for each endpoint
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• Supports remote wakeup
• Detects start-of-frame and missed start-of-frame for isochronous endpoint synchronization
• Notification of start-of-frame, reset, suspend, and resume events
Figure 12-1. The USB “Tiered Star” Topology
12.2 Module Operation
The MCF5272 USB system consists of a protocol state machine which controls the transmitter and
receiver modules. The state machine implements only the USB function state diagram. The MCF5272
USB controller can serve as a USB function endpoint, but cannot serve as a USB host.
12.2.1 USB Module Architecture
A block diagram of the USB module is shown in Figure 12-2. The module is partitioned into five
functional blocks. These blocks are USB internal transceiver, clock generator, USB control logic, USB
request processor, and endpoint controllers.
B
AA
AA
B
B
A
PeripheralPeripheral
Peripheral
A
A
Hub
Hub
B
B
B
B
Universal Serial Bus (USB)
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Figure 12-2. USB Module Block Diagram
12.2.1.1 USB Transceiver Interface
The USB module supports either an internal or external USB transceiver. USB_D+ and USB_D- drive
USB cable D+ and D- lines, respectively. With additional external protection circuitry (see 12.5.3,
“Recommended USB Protection Circuit”), equipment can be built that complies with Universal Serial Bus
Specification, Rev. 1.1. Transceiver performance specifications are described in the Chapter 7 of the
Universal Serial Bus Specification. See note on page , [p. 12-1].
When the internal transceiver is selected, (USBEPCTL0[AFEEN] is cleared), the driven outputs can be
observed by using the parallel port A if these pins are configured for USB, using the PACNT register,
17.2.1, “Port A Control Register (PACNT)”.
The USB module has separate power pins for the internal transceiver.
NOTE
USB_GND should always be grounded.
Clock
Generator
USB Request
Processor
512-Byte
IN FIFO
512-Byte
OUT FIFO
1024-Byte
Configuration
RAM
USB_D-
USB_D+
USB_VDD
USB_GND
USB_TP
USB_TxEN
USB_TN
USB_RP
USB_RN
USB_RxD
USB_Susp
System Clock
Internal Bus
USB Control
Logic
USB_ExtCLK
Endpoint
Controllers
Internal
Transceiver
External Transceiver
Interface
To USB
Cable
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However, to reduce power consumption, USB_VDD may be left unconnected if either of the following is
true:
• The USB module is not used.
• An external transceiver is used.
12.2.1.2 Clock Generator
The USB module requires two clock inputs; the system clock and a 48-MHz data clock. The data clock
source is selectable between the USB_ExtCLK pin or the system clock. The clock generator automatically
uses the external clock as the data clock if it detects the presence of a clock signal on the USB_CLK pin
during system reset. This automatic selection can be overridden by setting bit USBEPCTL0[CLK_SEL],
. If a clock signal is not present on USB_CLK, the clock generator uses the system clock.
NOTE
In all cases, the system clock must be at least 24-MHz for the USB module
to function properly. If the system clock is used for the USB data clock, the
system clock frequency must be 48-MHz.
12.2.1.3 USB Control Logic
The control logic performs the following functions:
• For transmitted data:
— Packet creation
— Parallel-to-serial conversion
— CRC generation
— NRZI encoding
— Bit stuffing
• For received data:
— Sync detection
— Packet identification
— End-of-packet detection
— Serial-to-parallel conversion
— CRC validation
— NRZI decoding
— Bit unstuffing
• For error detection:
— Bad CRC
— Timeout waiting for end-of-packet
— Bit stuffing violations
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12.2.1.4 Endpoint Controllers
The MCF5272 has eight independent endpoint controllers that manage data transfer between the on-chip
CPU and the USB host for each endpoint. These controllers provide event notification to the user and
manage the IN and OUT FIFO dual-port RAM buffers.
The USB endpoint configuration registers (USBEPOCFGn or USBEPICFGn) are used to configure each
endpoint to support either control, interrupt, bulk, or isochronous transfers.
USB always uses endpoint 0 as a control pipe, so it must be configured for control transfer mode.
Additional control pipes can be provided by other endpoints.
A total of 1024 bytes of dual-port RAM are available for transmit and receive FIFO buf fers. This RAM is
partitioned to provide 512 bytes for each direction. The user is responsible for configuring the FIFO for
each endpoint. This configuration is flexible within the following constraints:
• FIFO size must be an integral power of 2
• FIFO size must be at least twice the maximum packet size
• FIFO starting address must be aligned on a boundary defined by the FIFO size.
For example, an endpoint with a maximum packet size of 32 bytes can have a FIFO size of 64, 128, or 256
bytes and a starting address of 0, 64, 128, 192, 256, etc.
12.2.1.5 USB Request Processor
The MCF5272 USB request processor automatically processes all of the USB standard requests listed in
Table 12-1 except for SYNC_FRAME and the optional SET_DESCRIPTOR request. The SYNC_FRAME request
is passed to the user as a vendor-specific request. The USB module responds with a request error when the
SET_DESCRIPTOR request is issued. These standard requests are defined in Chapter 9 of the USB
Specification. See beginning of Page 12-1.
Table 12-1. USB Device Requests
Device Request USB Request Processor Action
clear_feature Request processor clears the feature specified by the feature selector parameter. Currently, remote
wakeup and endpoint halt are the only features defined by the USB specification. If the feature to be
cleared is remote wakeup, the USB block disables the remote wakeup functionality. If the feature to be
cleared is endpoint halt, the request processor activates the selected endpoint. The user is notified
when the remote wakeup is disabled or an endpoint halt is cleared.
get_configuration Returns the current configuration as set by a previous SET_CONFIGURATION request. No user
notification is provided. No user action required.
get_descriptor Reads the specified device or configuration descriptor from the configuration RAM and transfers it to
the host. Requests for a configuration descriptor returns all of the descriptors associated with a given
configuration including interface, endpoint, and class-specific descriptors. This request fails if the
configuration RAM has not been initialized. No user notification is provided.
The optional requests for string descriptors are not handled automatically by the request processor.
GET_DESCRIPTOR requests for string descriptors are passed to the user as a vendor specific request.
The string descriptors must be stored in external memory and not the configuration RAM.
get_interface Returns the selected alternate setting for the specified interface. No user notification is provided.
Universal Serial Bus (USB)
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get_status Returns the current status of the specified device, endpoint or interface. No user notification is
provided, no user action required.
set_address Loads the specified address into USBFAR. The control logic begins responding to the new address
once the status stage of the request completes successfully. No user notification is provided unless
debug mode is enabled.
set_configuration Reads the configuration RAM. If the configuration is cleared, the USB module is placed into the
unconfigured state. If a valid configuration is selected, the appropriate endpoint controllers are
activated. An invalid configuration number or error in the configuration descriptor causes the USB
module to return a STALL response to the host. The user is notified when this request completes
successfully and must initialize the active endpoint controllers.
set_descriptor Not supported. Returns request error.
set_feature Sets the specified feature. Remote wakeup and endpoint halt are the only features defined in the USB
Specification, Revision 1.0. If the specified feature is remote wakeup, the USB enables the remote
wakeup functionality. If the specified feature is endpoint halt, the USB request processor halts the
selected endpoint. A halted endpoint returns a STALL response to any requests.
set_interface Allows the host to select an alternate setting for the specified interface. If a valid alternate setting is
selected, the appropriate endpoint controllers are activated. The user is notified upon successful
completion of this request and must reinitialize the affected endpoint controllers.
NOTE: The user must read the descriptor structure to determine which endpoints correspond to a
given interface.
sync_frame Passed to the user as a vendor specific request.
Table 12-1. USB Device Requests (continued)
Device Request USB Request Processor Action
Universal Serial Bus (USB)
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12.3 Register Description and Programming Model
This section contains a detailed description of each register and its specific function.
12.3.1 USB Memory Map
The operation of the USB is controlled by writing control bytes into the appropriate registers. Table 12-2
is a memory map for USB registers. All of the registers are longword aligned even though they are not all
32 bits wide.
Table 12-2. USB Memory Map
Offset [31:24] [23:16] [15:8] [7:0]
0x1000 Reserved USB Frame Number Register (FNR)
0x1004 Reserved USB Frame Number Match Register (FNMR)
0x1008 Reserved USB Real-time Frame Monitor Register (RFMR)
0x100C Reserved USB Real-time Frame Monitor Match Register (RFMMR)
0x1010 Reserved USB Function Address
Register (FAR)
0x1014 USB Alternate Setting Register (ASR)
0x1018 USB Device Request Data1 Register (DRR1)
0x101C USB Device Request Data2 Register (DRR2)
0x1020 Reserved USB Specification Number Register (SPECR)
0x1024 Reserved USB Endpoint 0 Status Register (EP0SR)
0x1028 USB Endpoint 0 IN Config Register (IEP0CFG)
0x102C USB Endpoint 0 OUT Config Register (OEP0CFG)
0x1030 USB Endpoint 1 Configuration Register (EP1CFG)
0x1034 USB Endpoint 2 Configuration Register (EP2CFG)
0x1038 USB Endpoint 3 Configuration Register (EP3CFG)
0x103C USB Endpoint 4 Configuration Register (EP4CFG)
0x1040 USB Endpoint 5 Configuration Register (EP5CFG)
0x1044 USB Endpoint 6 Configuration Register (EP6CFG)
0x1048 USB Endpoint 7 Configuration Register (EP7CFG)
0x104C USB Endpoint 0 Control Register (EP0CTL)
0x1050 Reserved USB Endpoint 1 Control Register (EP1CTL)
0x1054 Reserved USB Endpoint 2 Control Register (EP2CTL)
0x1058 Reserved USB Endpoint 3 Control Register (EP3CTL)
0x105C Reserved USB Endpoint 4 Control Register (EP4CTL)
0x1060 Reserved USB Endpoint 5 Control Register (EP5CTL)
0x1064 Reserved USB Endpoint 6 Control Register (EP6CTL)
0x1068 Reserved USB Endpoint 7 Control Register (EP7CTL)
Universal Serial Bus (USB)
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0x106C USB General/Endpoint 0 Interrupt Status Register (EP0ISR)
0x1070 Reserved USB Endpoint 1 Interrupt Status Register (EP1ISR)
0x1074 Reserved USB Endpoint 2 Interrupt Status Register (EP2ISR)
0x1078 Reserved USB Endpoint 3 Interrupt Status Register (EP3ISR)
0x107C Reserved USB Endpoint 4 Interrupt Status Register (EP4ISR)
0x1080 Reserved USB Endpoint 5 Interrupt Status Register (EP5ISR)
0x1084 Reserved USB Endpoint 6 Interrupt Status Register (EP6ISR)
0x1088 Reserved USB Endpoint 7 Interrupt Status Register (EP7ISR)
0x108C USB Endpoint 0 Interrupt Mask Register (EP0IMR)
0x1090 Reserved USB Endpoint 1 Interrupt Mask Register (EP1IMR)
0x1094 Reserved USB Endpoint 2 Interrupt Mask Register (EP2IMR)
0x1098 Reserved USB Endpoint 3 Interrupt Mask Register (EP3IMR)
0x109C Reserved USB Endpoint 4 Interrupt Mask Register (EP4IMR)
0x10A0 Reserved USB Endpoint 5 Interrupt Mask Register (EP5IMR)
0x10A4 Reserved USB Endpoint 6 Interrupt Mask Register (EP6IMR)
0x10A8 Reserved USB Endpoint 7 Interrupt Mask Register (EP7IMR)
0x10AC USB Endpoint 0 Data Register (EP0DR)
0x10B0 USB Endpoint 1 Data Register (EP1DR)
0x10B4 USB Endpoint 2 Data Register (EP2DR)
0x10B8 USB Endpoint 3 Data Register (EP3DR)
0x10BC USB Endpoint 4 Data Register (EP4DR)
0x10C0 USB Endpoint 5 Data Register (EP5DR)
0x10C4 USB Endpoint 6 Data Register (EP6DR)
0x10C8 USB Endpoint 7 Data Register (EP7DR)
0x10CC Reserved USB Endpoint 0 Data Present Register (EP0DPR)
0x10D0 Reserved USB Endpoint 1 Data Present Register (EP1DPR)
0x10D4 Reserved USB Endpoint 2 Data Present Register (EP2DPR)
0x10D8 Reserved USB Endpoint 3 Data Present Register (EP3DPR)
0x10DC Reserved USB Endpoint 4 Data Present Register (EP4DPR)
0x10E0 Reserved USB Endpoint 5 Data Present Register (EP5DPR)
0x10E4 Reserved USB Endpoint 6 Data Present Register (EP6DPR)
0x10E8 Reserved USB Endpoint 7 Data Present Register (EP7DPR)
0x1400
–
0x17FF
USB Configuration RAM, 1 K Bytes
Table 12-2. USB Memory Map (continued)
Offset [31:24] [23:16] [15:8] [7:0]
Universal Serial Bus (USB)
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12.3.2 Register Descriptions
The following are detailed register diagrams and field descriptions.
12.3.2.1 USB Frame Number Register (FNR)
Once every 1 ms, the USB host issues a start-of-frame packet containing a frame number . The FNR register
captures this frame number. Figure 12-3 shows the FNR.
Figure 12-3. USB Frame Number Register (FNR)
Table 12-3 describes FNR fields.
12.3.2.2 USB Frame Number Match Register (FNMR)
FNMR is used to signal, via the FRM_MAT interrupt, when a particular frame number is issued by the
USB host. To avoid a false match during intermediate states of a byte write operation to the FNMR,
Figure 12-4, byte accesses to this register are not supported and cause an access error.
Figure 12-4. USB Frame Number Match Register (FNMR)
Table 12-4 describes FNMR fields.
15 11 10 0
Field — FRM
Reset 0000_0000_0000_0000
R/W Read
Addr MBAR + 0x1002
Table 12-3. FNR Field Descriptions
Bits Name Description
15–11 — Reserved, should be cleared.
10–0 FRM USB frame number. Contains the current USB frame number. FRM is updated with the new frame number
each time the device successfully receives a start-of-frame (SOF) packet from the USB host. The new frame
number is contained in the SOF packet.
15 11 10 0
Field — FRM_MAT
Reset 0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x1006
Table 12-4. FNMR Field Descriptions
Bits Name Description
15–11 — Reserved, should be cleared
10–0 FRM_MAT Frame number match value. Contains the USB frame number match value. When the FNR value equals
the value in the register, a FRM_MAT interrupt is generated.
Universal Serial Bus (USB)
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12.3.2.3 USB Real-Time Frame Monitor Register (RFMR)
The value in the RFMR can be used to determine approximately how much time has elapsed since the USB
host sent its last start-of-frame packet.
Because the hardware does not guarantee that any of the bit values are stable during the read access:
• only the higher-order bits should be used
• the returned data should always be de-glitched by verifying that the same value is seen on the
higher-order bits for two consecutive read cycles.
Figure 12-5 shows the USB real-time frame monitor register.
Figure 12-5. USB Real-Time Frame Monitor Register (RFMR)
Table 12-5 lists field descriptions for the USB real-time frame monitor register.
15 14 13 0
Field — RTFM
Reset 0000_0000_0000_0000
R/W Read
Addr MBAR + 0x100A
Table 12-5. RFMR Field Descriptions
Bits Name Description
15–14 — Reserved, should be cleared.
13–0 RTFM Real-time frame count. Contains the current USB frame counter value. The counter is incremented one
time for every USB bit time and is reset when a SOF packet from the host is detected or an artificial start
of frame (ASOF) interrupt is generated.
Universal Serial Bus (USB)
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12.3.2.4 USB Real-Time Frame Monitor Match Register (RFMMR)
To avoid intermediate false values in the real-time frame monitor match register, Figure 12-6, byte
accesses are not supported and cause an access error.
Figure 12-6. USB Real-Time Frame Monitor Match Register (RFMMR)
Table 12-6 lists field descriptions for the USB real-time frame monitor match register.
12.3.2.5 USB Function Address Register (FAR)
Figure 12-7 shows the USB function address register (FAR). If EP0CTL[DEBUG] is set,
EP0CTL[DEV_CFG] also reflects any change in FAR. If DEBUG is zero, the MCF5272 USB controller
is not notified if the function address changes. This value is for information only.
Figure 12-7. USB Function Address Register (FAR)
Table 12-7 gives the USB function address register field descriptions.
15 14 13 0
Field — RTFM_MAT
Reset 0011_1111_1111_1111
R/W R/W
Addr MBAR + 0x100E
Table 12-6. RFMMR Field Descriptions
BIts Name Description
15–14 — Reserved, should be cleared
13–0 RTFM_MAT Real-time frame monitor match. Contains the real-time frame monitor match value. When the RFMR
value equals the value in the register, an ASOF interrupt is generated. The value programmed in this
register should not be less than 0x2EE0--the nominal period
between SOF packets.
76 0
Field — FAD
Reset 0000_0000
R/W Read
Addr MBAR + 0x1013
Table 12-7. FAR Field Descriptions
Bits Name Description
7 — Reserved, should be cleared
6–0 FAD USB function address. This field holds the USB address of the device. The USB module writes this field
with the USB address assigned to the device with a SET_ADDRESS device request.
Universal Serial Bus (USB)
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12.3.2.6 USB Alternate Settings Register (ASR)
Defines which of several possible interfaces is currently active.
Figure 12-8 shows the USB alternate settings register. The configuration descriptors must be read by the
user in order to determine which interfaces are currently valid.
Figure 12-8. USB Alternate Settings Register (ASR)
Table 12-8 lists field descriptions for the USB alternate settings register.
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Field IF15_AS IF14_AS IF13_AS IF12_AS IF11_AS IF10_AS IF9_AS IF8_AS
Reset 0000_0000_0000_0000
R/W Read
1514131211109876543210
Field IF7_AS IF6_AS IF5_AS IF4_AS IF3_AS IF2_AS IF1_AS IF0_AS
Reset 0000_0000_0000_0000
R/W Read
Addr MBAR + 0x1014
Table 12-8. ASR Field Descriptions
Bits Name Description
31–0 IFn_AS USB alternate settings for interface n. This field indicates which alternate setting is active for each
interface.
00 Alternate Setting 0
01 Alternate Setting 1
10 Alternate Setting 2
11 Alternate Setting 3
Universal Serial Bus (USB)
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12.3.2.7 USB Device Request Data 1 and 2 Registers (DRR1/ 2)
The device request data registers, Figure 12-9 and Figure 12-10, are used to notify the user that an optional
standard, class-specific, or vendor-specific request has been received and to pass the request type and
parameters to the application. The fields in DRR1 and DRR2 are defined in Chapter 9 of the USB
Specification. See top of page, [p. 12-1].
Figure 12-9. USB Device Request Data 1 Register (DRR1)
Figure 12-10. USB Device Request Data 2 Register (DRR2)
31 16
Field wValue
Reset 0000_0000_0000_0000
R/W Read
15 8 7 0
Field bRequest bmRequestType
Reset 0000_0000_0000_0000
R/W Read
Addr MBAR + 0x1018
31 16
Field wLength
Reset 0000_0000_0000_0000
R/W Read
15 0
Field wIndex
Reset 0000_0000_0000_0000
R/W Read
Addr MBAR + 0x101C
Universal Serial Bus (USB)
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12.3.2.8 USB Specification Number Register (SPECR)
Figure 12-11 shows the USB specification number register.
Table 12-9 lists field descriptions for the USB specification number register.
12.3.2.9 USB Endpoint 0 Status Register (EP0SR)
Figure 12-12 shows the USB endpoint 0 status register. Only written via the standard
SET_CONFIGURATION request by the host.
Table 12-10 lists field descriptions the USB endpoint 0 status register.
15 43 0
Field SPEC MRN
Reset 0001_0001_0000_0001
R/W Read
Addr MBAR + 0x1022
Figure 12-11. USB Specification Number Register (SPECR)
Table 12-9. SPECR Field Descriptions
Bits Name Descriptions
15–4 SPEC USB specification release number. This field identifies the release of the USB Specification that the device
complies with. The USB Specification Release Number is in binary-coded decimal (BCD) format.
3–0 MRN Module revision number.
15 12 11 10 3 2 1 0
Field CONFIG WAKE_ST — HALT_ST DIR —
Reset 0000_0000_0000_0001
R/W Read
Addr MBAR + 0x1026
Figure 12-12. USB Endpoint 0 Status Register (EP0SR)
Table 12-10. EP0SR Field Descriptions
Bits Name Descriptions
15–12 CONFIG Current configuration number. Indicates which configuration is active. Receiving a
SET_CONFIGURATION USB standard device request sets the active configuration. A
configuration setting of 0 means that the device is unconfigured. Valid only when
EPISR0[DEV_CFG] is set
11 WAKE_ST Remote wakeup status. Indicates whether the USB module has been enabled to generate remote
wakeup resume signaling.
1 Enabled. The USB host has issued the SET_FEATURE request with the Remote wakeup feature
selector set.
0 Disabled. The USB host has issued the CLEAR_FEATURE request with the remote wakeup
feature selector set, or has not set this feature since a USB or system reset has occurred.
10–3 — Reserved, should be cleared.
Universal Serial Bus (USB)
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12.3.2.10 USB Endpoint 0 IN Configuration Register (IEP0CFG)
Figure 12-13 shows the USB Endpoint 0 IN configuration (IEP0CFG) register.
Table 12-11 lists field descriptions for the IEP0CFG register. Only longword writes are allowed. The
maximum packet size for endpoint 0 is eight bytes. W riting to the register resets the FIFO. Any data in the
FIFO are discarded, and the associated EPnDP register is also reset.
2 HALT_ST Current endpoint 0 halt status. Indicates whether endpoint 0 is currently halted or active. Endpoint
0 is halted if there is an error processing a request. A halt is cleared automatically by a SETUP
packet.
1 Endpoint 0 halted
0 Endpoint 0 active
1 DIR Current endpoint 0 direction. Indicates whether endpoint 0 is currently accessed as an IN or OUT
endpoint.
1 The endpoint is configured as an IN endpoint
0 The endpoint is configured as an OUT endpoint
0 — Reserved, should be cleared.
31 22 21 20 16
Field MAX_PACKET — FIFO_SIZE
Reset 0000_0000_0000_0000
R/W R/W
15 11 10 9 0
Field FIFO_SIZE — FIFO_ADDR
Reset 0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x1028
Figure 12-13. USB Endpoint 0 IN Configuration Register (IEP0CFG)
Table 12-11. IEP0CFG Field Descriptions
Bits Name Descriptions
31–22 MAX_PACKET Maximum packet size. Must be written with the maximum packet size defined in the device
descriptor for endpoint 0 or the endpoint descriptors for other endpoints.
21 — Reserved, should be cleared.
20–11 FIFO_SIZE Size of the FIFO. Sets the depth of the FIFO buffer for the endpoint. The FIFO size must be a power
of 2. For non-isochronous endpoints, the FIFO size must be at least two times the maximum packet
size.
10 — Reserved, should be cleared.
9–0 FIFO_ADDR Starting address in the FIFO buffer memory for the endpoint’s FIFO. Reading this field returns the
current write pointer for IN endpoints or the read pointer for OUT endpoints for the FIFO.
Table 12-10. EP0SR Field Descriptions
Bits Name Descriptions
Universal Serial Bus (USB)
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12.3.2.11 USB Endpoint 0 OUT Configuration Register (OEP0CFG)
Figure 12-14 shows the USB endpoint 0 OUT configuration register.
See Table 12-11 for a description of the fields.
12.3.2.12 USB Endpoint 1–7 Configuration Register (EPnCFG)
Figure 12-15 shows the USB endpoint 1–7 configuration register.
See Table 12-11 for a description of the fields.
31 22 21 20 16
Field MAX_PACKET — FIFO_SIZE
Reset 0000_0000_0000_0000
R/W R/W
15 11 10 9 0
Field FIFO_SIZE — FIFO_ADDR
Reset 0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x102C
Figure 12-14. USB Endpoint 0 OUT Configuration Register
31 22 21 20 16
Field MAX_PACKET — FIFO_SIZE
Reset 0000_0000_0000_0000
R/W R/W
15 10 9 0
Field FIFO_SIZE — FIFO_ADDR
Reset 0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x1030, 0x1034, 0x1038, 0x103C, 0x1040, 0x1044, 0x1048
Figure 12-15. USB Endpoint 1–7 Configuration Register
Universal Serial Bus (USB)
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12.3.2.13 USB Endpoint 0 Control Register (EP0CTL)
Figure 12-16 shows the USB endpoint 0 control register. provides both module level and endpoint 0
specific control (bits 0-9) functions.
Table 12-12 lists field descriptions for the USB endpoint 0 control register.
31 23
Field —
Reset 0000_0000
R/W R/W
22 19 18 17 16
Field — DEBUG WOR_LVL WOR_EN
Reset 0000_0000
R/W R/W
15 14 13 12 11 10 9 8
Field CLK_SEL RESUME AFE_EN BUS_PWR USB_EN CFG_RAM_VAL CMD_ERR CMD_OVER
Reset 0000_0000
R/W R/W
765432 10
Field CRC_ERR — OUT_LVL IN_LVL IN_DONE —
Reset 0000_0000
R/W R/W
Addr MBAR + 0x104C
Figure 12-16. USB Endpoint 0 Control Register (EP0CTL)
Table 12-12. EP0CTL Field Descriptions
Bits Name Description
31–19 — Reserved, should be cleared.
18 DEBUG Debug mode. Enters debug mode. Debug mode enables CRC error generation and notification of
a change of address.
0 Normal operation
1 Enable debug mode functions
17 WOR_LVL Wake-on-ring level select. Selects the active level of INT1 for the wake-on-ring function.
0 Wake-on-ring function is invoked when INT1 pin is 0.
1 Wake-on-ring function is invoked when INT1 pin is 1.
16 WOR_EN Wake-on-ring enable. Generates a RESUME when the active level is detected on INT1 pin.
0 Wake-on-ring function disabled
1 Wake-on-ring function enabled
Note: the wake-on-ring function generates a RESUME only if the USB module is enabled for
remote wakeup by the host, for example, WAKE_ST = 1, and is suspended.
15 CLK_SEL Clock source selection. Overrides the clock source for the USB module. If the USB_ExtCLK pin is
selected after reset, setting this bit forces the USB module to use the internal system clock.
0 Clock is retrieved from the clock selected at reset.
1 Clock is retrieved from the internal system clock.
Note: the selected clock must have a frequency of 48 MHz.
Universal Serial Bus (USB)
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14 RESUME Generates RESUME condition. Used to exit the SUSPEND state. The USB control logic ensures
the forced resume duration is greater than 10 ms. This command bit is write-only and always
returns 0 when read.
0Default
1 Generate RESUME condition (force data lines to K state)
Note: this command generates a RESUME only if the USB is both suspended and enabled for
remote wakeup by the host, that is, USBEPSR0[WAKE_ST] = 1.
13 AFE_EN External USB analog front-end enable. Used to select the internal or external USB analog front
end (AFE). The internal AFE is selected by default.
0 The USB internal AFE is powered up and the external transceiver interface is disabled. The
driven outputs can be observed on the parallel port A signals if they are configured for USB.
1 The USB internal AFE is powered down and the external transceiver interface is enabled. The
internal transceiver outputs, (USBH and USBL), are high impedance.
12 BUS_PWR Select bus-powered mode. Used to select between bus-powered and self-powered mode. This bit
only affects the response to a GET_STATUS device request. This bit should be set according to
the current configuration.
0 Self-powered mode
1 Bus-powered mode
11 USB_EN Enables and disables the USB control logic. Has no effect on USB register values. When cleared,
the outputs are high impedance, preventing any response to the host. This bit should be set after
USB module registers are initialized and the descriptors are copied into the configuration RAM.
0 Disable USB module
1 Enable USB module
10 CFG_RAM_VAL Enable USB configuration RAM. Notifies the USB module that the user has loaded the
configuration RAM. Must be set in order for the USB module to process the USB standard device
requests that access the configuration RAM. These requests are GET_DESCRIPTOR,
SET_CONFIGURATION, and SET_INTERFACE. When this bit is set, accesses to the configuration RAM
cause an access error.
0 Configuration RAM invalid
1 Configuration RAM valid
9 CMD_ERR Command error for device request interface. Used to indicate to the endpoint controller that an
error has been encountered during class or vendor specific device request or SYNCH_FRAME
command processing. This command bit is write only and always returns 0 when read.
Result of RequestCMD_OVERCMD_ERR
Processed device request successfully10
Error processing the request11
Busy processing the request0X
Note: CMD_OVER and CMD_ERR have to be written simultaneously. The CMD_OVER and
CMD_ERR bits control the status stage response for vendor and class specific requests.
8 CMD_OVER Command over for device request interface. Used to indicate to the endpoint controller that
processing of a class or vendor specific device request or SYNCH_FRAME command has been
completed by the user. This command bit is write only and always returns 0 when read.
Note: CMD_OVER and CMD_ERR have to be written simultaneously. The CMD_OVER and
CMD_ERR bits control the status stage response for vendor and class specific requests.
Table 12-12. EP0CTL Field Descriptions (continued)
Bits Name Description
Universal Serial Bus (USB)
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7 CRC_ERR CRC error generation enable. This bit enables CRC error generation for debug and test purpose.
In order to use this feature, the DEBUG bit must be set. Enabling this bit causes a CRC error on
the next data packet transmitted. The CRC_ERR bit must be set again in order to generate
another CRC error. This bit only applies to IN transfers. This command bit is write-only and always
returns 0 when read.
1 CRC error generation if DEBUG = 1
0 default value
6 — Reserved, should be cleared.
5–4 OUT_LVL Endpoint 0 OUT FIFO level for interrupt. This field selects the FIFO level to generate an OUT_LVL
interrupt. The OUT_LVL interrupt is generated when the FIFO fills above the selected level.
00 FIFO 25% Full
01 FIFO 50% Full
10 FIFO 75% Full
11 FIFO 100% Full
3–2 IN_LVL Endpoint 0 IN FIFO level for interrupt. This field selects the FIFO level to generate an IN_LVL
interrupt. The IN_LVL interrupt is generated when the FIFO falls below the selected level.
00 FIFO 25% Empty
01 FIFO 50% Empty
10 FIFO 75% Empty
11 FIFO 100% Empty
1 IN_DONE This bit controls the USB's response to IN tokens from the host. This bit is set at Reset and must
be cleared by software when the last byte of a transfer has been written to the IN-FIFO. This bit is
then subsequently set by the USB core when an end of transfer (EOT) event occurs indicating that
the transfer has been completed. An end of transfer (EOT) event is indicated by one of the
following:
a) An IN packet is transmitted that contains less than the maximum number of bytes defined at
endpoint configuration.
b) A zero length IN packet is transmitted. This occurs when the previously transmitted IN packet
was full, and no more data remains in the IN-FIFO. Hence a single zero length packet must be
sent to indicate EOT.
0 CPU has completed writing to the IN-FIFO and transfer is in progress. The USB module will
send any amount of data in the FIFO or a zero-length packet when the FIFO is empty.
1 Transfer completed or CPU Busy writing transfer into the IN-FIFO. The USB module will only
send maximum size packets or NAK responses if the FIFO contains less than a maximum size
packet. This bit is set at Reset and on an EOT event.
0 — Reserved, should be cleared.
Table 12-12. EP0CTL Field Descriptions (continued)
Bits Name Description
Universal Serial Bus (USB)
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12.3.2.14 USB Endpoint 1–7 Control Register (EPnCTL)
Figure 12-17 shows the USB endpoint 1–7 control register.
Figure 12-17. USB Endpoint 1-7 Control Register (EPnCTL)
Table 12-13 lists the field descriptions for the USB endpoint 1–7 control register.
15 8
Field —
Reset 0000_0000
R/W R/W
76543210
Field CRC_ERR ISO_MODE — FIFO_LVL IN_DONE STALL
Reset 0000_0004
R/W R/W
Addr MBAR + 0x1052, 0x1056, 0x105A, 0x105E, 0x1062, 0x1066, 0x106A
Table 12-13. EPnCTL Field Descriptions
Bits Name Description
15–8 — Reserved, should be cleared.
7 CRC_ERR CRC error generation enable. Enables CRC error generation for debug and test purposes. To use this
feature, the DEBUG bit must be set. Enabling this bit causes a CRC error on the next non-zero-length
data packet transmitted. The CRC_ERR bit must be set again in order to generate another CRC error.
This bit is only valid for IN endpoints. This command bit is write only and always returns 0 when read.
0 Default Value
1 CRC error generation if DEBUG = 1
6 ISO_MODE Isochronous transfer mode. This bit must be set when the endpoint is configured for isochronous
mode.
0 Non-isochronous transfer mode
1 Isochronous transfer mode
5–4 — Reserved, should be cleared.
3–2 FIFO_LVL Endpoint n FIFO level for interrupt. This field selects the FIFO level to generate a FIFO_LVL interrupt.
The FIFO_LVL interrupt is generated when the FIFO fills above (OUT) or falls below (IN) the selected
level.
IN FIFOOUT FIFO
00 FIFO 25% emptyFIFO 25% full
01 FIFO 50% emptyFIFO 50% full
10 FIFO 75% emptyFIFO 75% full
11 FIFO emptyFIFO full
Universal Serial Bus (USB)
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1 IN_DONE This bit controls the USB's response to IN tokens from the host. Set at Reset and on an EOT event
and must be cleared by software when the last byte of a transfer has been written to the IN-FIFO. This
bit is then subsequently set by the USB core when an end of transfer (EOT) event occurs, indicating
that the transfer has been completed. An end of transfer (EOT) event is indicated by one of the
following:
a) An IN packet is transmitted that contains less than the maximum number of bytes defined at
endpoint configuration.
b) A zero length IN packet is transmitted. This occurs when the previously transmitted IN packet was
full, and no more data remains in the IN-FIFO. Hence a single zero length packet must be sent to
indicate EOT.
0 CPU has completed writing to the IN-FIFO and transfer is in progress. The USB module sends all
the data in the FIFO, or a zero-length packet when the FIFO is empty.
1 Transfer completed or CPU is busy writing to the IN-FIFO. The USB module only sends
maximum-sized packets or NAK responses if the FIFO contains less data than the maximum
packet size.
0 STALL Force STALL response. Causes the endpoint to return a STALL handshake when polled by either IN
or OUT token by the USB host controller. The STALL handshake causes the endpoint to be halted.
The STALL bit is not valid for isochronous endpoints. This command bit is write-only and always
returns 0 when read.
0 Default
1 Send STALL handshake
Table 12-13. EPnCTL Field Descriptions
Bits Name Description
Universal Serial Bus (USB)
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12.3.2.15 USB Endpoint 0 Interrupt Mask (EP0IMR) and General/Endpoint 0
Interrupt Registers (EP0ISR)
Figure 12-18 shows the USB endpoint 0 interrupt mask and general/endpoint 0 interrupt registers.
NOTE
Interrupt bits are reset by writing a 1 to the specified bits. Writing 0 has no
effect.
Table 12-14 lists field descriptions for the USB endpoint 0 interrupt mask and general/endpoint 0 interrupt
registers.
31 24
Field —
Reset 0000_0000
R/W R/W
23 17 16
Field — DEV_CFG
Reset 0000_0000
R/W R/W
15 14 13 12 11 10 9 8
Field VEND_REQ FRM_MAT ASOF SOF WAKE_CHG RESUME SUSPEND RESET
Reset 0000_0000
R/W R/W
76543210
Field OUT_EOT OUT_EOP OUT_LVL IN_EOT IN_EOP UNHALT HALT IN_LVL
Reset 0000_0000
R/W R/W
Addr MBAR + 0x108C (EP0IMR); MBAR + 0x106C (EP0ISR)
Figure 12-18. USB Endpoint 0 Interrupt Mask (EP0IMR)
and General/Endpoint 0 Interrupt Registers (EP0ISR)
Table 12-14. EP0IMR and EP0ISR Field Descriptions
Bits Name Description
31–17 — Reserved, should be cleared.
16 DEV_CFG Device configuration change interrupt. Set when a device configuration change has been
received. The USB standard device requests SET_CONFIGURATION and SET_INTERFACE
generate a DEV_CFG interrupt. Any IN or OUT packets to the active endpoints cause a NAK
response to the host while this bit is set in order to allow the user to initialize the endpoints’
FIFO’s. Note that if one of these requests is done repeatedly and therefore the registers don’t
change, a DEV_CFG interrupt is still generated. If debug mode is enabled, a change in FAR also
generates an interrupt.
0 No interrupt pending
1 Device configuration change received
Universal Serial Bus (USB)
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15 VEND_REQ Class or vendor specific request received. Set when a class- or vendor-specific request is
received. When the application detects assertion of VEND_REQ interrupt, it should begin
reading DRR1 and DRR2.
0 No interrupt pending
1 Class or vendor specific request received
14 FRM_MAT Frame number match. Set when the USB frame number matches the value written to the FNMR
register.
0 No interrupt pending
1 Frame number match
13 ASOF Artificial start of frame detected. Set when an artificial SOF is generated. The ASOF is used to
notify the user that a SOF packet was not detected as expected.
0 No interrupt pending
1 Artificial SOF generated
12 SOF Start of frame (SOF) detected. Set when a SOF packet is detected.
0 No interrupt pending
1 SOF detected
11 WAKE_CHG Remote wakeup status change interrupt. Indicates that a change has occurred in the
EPSR0[WAKE_ST].
0 No interrupt pending
1 Remote wakeup status bit has changed
10 RESUME Resume. Set when the USB block is in the suspend state and detects resume signaling on the
USB data lines. User-initiated resume signaling also causes the RESUME interrupt to be
asserted.
0 No interrupt pending
1 USB resume signal detected
9 SUSPEND Suspend. Set when the USB module detects a suspend state on the USB data lines. The USB
suspends when the bus is idle for at least 3 ms.
0 No interrupt pending
1 USB suspend state detected
8 RESET USB Reset. Set when the USB module detects a USB reset. A USB reset is caused by a
single-ended zero (SE0) greater than 2.5 µs. A USB reset has no effect on the registers written
by the user.
0 No interrupt pending
1 USB reset signal detected
7 OUT_EOT End of transfer. Set when the end of a transfer has been reached for OUT FIFO. An OUT_EOT
is generated when a packet with a size less than the maximum packet size or the first zero-length
packet following maximum size packets is received. The EPDP0 must be read before clearing
this interrupt in order to determine the number of bytes of remaining data in the FIFO for the last
transfer. Any packets received from the host cause a NAK response until the OUT_EOT interrupt
is cleared.
0 No interrupt pending
1 Transfer completed
6 OUT_EOP End of packet. Set when a packet is successfully received for endpoint 0 OUT.
0 No interrupt pending
1 OUT packet received successfully
5 OUT_LVL OUT FIFO threshold level. Indicates that the FIFO level has risen above the level set in the
EPCTL0 register.
0 No interrupt pending
1 OUT FIFO threshold level reached
Table 12-14. EP0IMR and EP0ISR Field Descriptions (continued)
Bits Name Description
Universal Serial Bus (USB)
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4 IN_EOT End of transfer. This bit is set when the end of a transfer has been reached for an IN endpoint.
An EOT interrupt is generated when a packet with a size less than the maximum packet size or
the first zero-length packet following maximum size packets is sent.
0 No interrupt pending
1 Transfer completed
3 IN_EOP End of packet. This bit is set when a packet has been sent successfully for endpoint 0 IN.
0 No interrupt pending
1 IN packet sent successfully
2 UNHALT Unhalt. This bit is set when the endpoint 0 HALT_ST bit is cleared by a SETUP packet or USB
reset.
0 No interrupt pending
1 Endpoint halt cleared
1 HALT Halt. This bit is set when the endpoint 0 HALT_ST bit is set due to a STALL response to the host.
0 No interrupt pending
1 Endpoint halted
0 IN_LVL IN FIFO threshold level. This bit indicates that the FIFO level has fallen below the level set in the
EPCTL0 register.
0 No interrupt pending
1 IN FIFO threshold level reached
Table 12-14. EP0IMR and EP0ISR Field Descriptions (continued)
Bits Name Description
Universal Serial Bus (USB)
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12.3.2.16 USB Endpoints 1–7 Status / Interrupt Registers (EPnISR)
Figure 12-19 shows the USB endpoints 1-7 status/interrupt registers.
Figure 12-19. USB Endpoints 1–7 Interrupt Status Registers (EPnISR)
Table 12-15 lists field descriptions for the USB endpoints 1–7 interrupt status registers.
15 14 13 12 5 4 3 2 1 0
Field HALT_ST DIR PRES — EOT EOP UNHALT HALT FIFO_LVL
Reset 0000_0000_0000_0000
R/W Interrupt bits are cleared by writing a 1 to the specified bits. Bits 13–15 are read-only status bits.
Addr MBAR + 0x1072, 0x1076, 0x107A, 0x107E, 0x1082, 0x1086, 0x108A
Table 12-15. EPnISR Field Descriptions
Bits Name Description
15 HALT_ST Current status of endpoint n. This bit indicates whether endpoint n is currently halted or active.
HALT_ST is set due to a SET_FEATURE request with the endpoint halt feature selector set or a
STALL response to an IN or OUT packet. HALT_ST is cleared by a CLEAR_FEATURE request with
the endpoint halt feature selector set.
0 Endpoint n active
1 Endpoint n halted
14 DIR Current direction of endpoint n. This bit indicates whether endpoint n is currently configured as an
IN or OUT endpoint.
0 Endpoint n configured as an OUT endpoint
1 Endpoint n configured as an IN endpoint
13 PRES Endpoint n present. This bit indicates whether or not endpoint n is present in the current
configuration.
0 Endpoint n absent
1 Endpoint n present
12–5 — Reserved, should be cleared.
4 EOT End of transfer interrupt. Set when the end of a transfer has been reached. An EOT interrupt is
generated when a packet with a size less than the maximum packet size or the first zero-length
packet following maximum size packets is sent or received. For OUT endpoints, the EPDPn must be
read before clearing this interrupt in order to determine the number of bytes of remaining data in the
FIFO for the last transfer. For OUT endpoints, any packets received from the host cause a NAK
response until the EOT interrupt is cleared. For IN endpoints, the user must wait until the EOT
interrupt is set before writing the next transfer to the FIFO.
0 No interrupt pending
1 Transfer completed
3 EOP End of packet interrupt. Set when a packet is successfully sent or received on endpoint n.
0 No interrupt pending
1 Packet sent or received successfully
2 UNHALT Endpoint unhalt interrupt. Set when the endpoint n HALT_ST bit is cleared.
0 No interrupt pending
1 Endpoint n unhalted
Universal Serial Bus (USB)
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12.3.2.17 USB Endpoint 1–7 Interrupt Mask Registers (EPnIMR)
Figure 12-20 shows the USB endpoint 1–7 interrupt mask register.
Figure 12-20. USB Endpoint 1-7 Interrupt Mask Registers (EPnIMR)
Table 12-16 lists field descriptions for the USB endpoint 1–7 interrupt mask register.
1 HALT Endpoint halt interrupt. Set when the endpoint n HALT_ST bit is set.
0 No interrupt pending
1 Endpoint n halted
0 FIFO_LVL FIFO threshold level reached interrupt. Indicates that the FIFO level has risen above or fallen below
the level set in the EPCTLn register for OUT or IN endpoints, respectively.
0 No interrupt pending
1 FIFO threshold level reached
15 5 4 3 2 1 0
Field — EOT_EN EOP_EN UNHALT_EN HALT_EN FIFO_LVL_EN
Reset 0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x1092, 0x1096, 0x109A, 0x109E, 0x10A2, 0x10A6, 0x10AA
Table 12-16. EPnIMR Field Descriptions
Bits Name Description
15–5 — Reserved, should be cleared.
4–0 Interrupt mask. These bits are set when the user wants to activate the interrupt source for the specific bit.
Refer to Table 12-15 for a description of each interrupt source.
1 Interrupt Enabled
0 Interrupt Disabled
Table 12-15. EPnISR Field Descriptions (continued)
Bits Name Description
Universal Serial Bus (USB)
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12.3.2.18 USB Endpoint 0–7 Data Registers (EPnDR)
Figure 12-21 shows the USB endpoint 0-7 data registers.
Table 12-17 lists field descriptions for the USB endpoint 0–7 data registers.
Table 12-17. EPnDR Field Descriptions
31 16
Field DATA
Reset 0000_0000_0000_0000
R/W R/W
15 0
Field DATA
Reset 0000_0000_0000_0000
R/W R/W
Addr MBAR + 0x10AC, 0x10B0, 0x10B4, 0x10B8, 0x10BC, 0x10C0, 0x10C4, 0x10C8
Figure 12-21. USB Endpoint 0-7 Data Registers (EPnDR)
Bits Name Description
31–0 DATA The EPnDR registers allow data to be written to/from each endpoint’s FIFO. For IN endpoints, the registers
are write-only and writing to a full FIFO is ignored. For OUT endpoints, the registers are read-only, and
reading from an empty FIFO returns undefined data. These registers can be accessed using 8-, 16-, or
32-bit accesses in order to read/write 1, 2, or 4 bytes from/to the FIFO at one time.
Universal Serial Bus (USB)
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12.3.2.19 USB Endpoint 0–7 Data Present Registers (EPnDPR)
Figure 12-22 shows the USB endpoint 0-7 data present registers. used to coordinate user access to FIFO
with external devices to prevent data loss (overwrite) says how much free space is still available. Gives
amount of data just received.
Figure 12-22. USB Endpoint 0-7 Data Present Registers (EPnDPR)
Table 12-18 describes EPDPn fields.
12.3.3 Configuration RAM
The USB module supports up to 1 KByte of USB descriptors. The configuration RAM begins at address
MBAR + 0x1400 and is longword accessible only. EPCTL0[CFG_RAM_VAL] must be cleared to access
the configuration RAM, otherwise an access error results.
12.3.3.1 Configuration RAM Content
The USB host must configure a device before that device’s function can be used. The host configures the
device by first reading the descriptors for the device. The descriptors must follow the format described in
Chapter 9 of the USB specification and any relevant class specification.
NOTE
The USB descriptors use little endian format for word and longword fields.
The MCF5272 uses big endian format for words and longwords. The user
must make sure that any word or longword fields are stored in the correct
byte order.
15 9 8 0
Field — DATA_PRES
Reset 0000_0000_0000_0000
R/W Read
Addr MBAR + 0x10CE, 0x10D2, 0x10D6, 0x10DA, 0x10DE, 0x10E2, 0x10E6, 0x10EA
Table 12-18. EPnDPR Field Descriptions
Bits Name Description
15–9 — Reserved, should be cleared.
8–0 DATA_PRES Endpoint n data present. This field reflects the number of bytes in the endpoint’s FIFO. This field
is updated when the user writes to or reads from the FIFO and when the control logic accesses
the FIFO. For non-isochronous endpoints, the FIFO level is only updated when a complete
packet is received or transmitted without any errors. This occurs synchronously with an EOP
interrupt. For isochronous endpoints, the FIFO level is updated by the control logic in real-time
rather than only after the transfer of a complete packet.
Note: for non-isochronous OUT endpoints, this field is frozen while an EOT interrupt is pending
in order to allow the user to determine the number of bytes to read for the last transfer. For
endpoint 0, EPDP0 monitors the OUT FIFO only.
Universal Serial Bus (USB)
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A device may support multiple configurations. Within any one configuration, the device may support
multiple interfaces. An interface consists of a set of en d points that pres ents to the h ost a single feature or
function of the device. An interface within a configuration may have alternate settings that redefine the
characteristics of the associated endpoints. All devices must provide a device descriptor and at least one
configuration, interface and endpoint descriptor. Each configuration must have at least one interface and
one endpoint descriptor. Only one configuration is effective at any time, but several interfaces and their
related endpoints may be operational at the same time. Only one setting for a particular interface is
effective at any time.
12.3.3.2 USB Device Configuration Example
The example descriptor structure in Figure 12-23 shows a device with three different configurations. Refer
to Chapter 9 of the USB Specification for information on the contents of each descriptor.
Figure 12-23. Example USB Configuration Descriptor Structure
This example is described in the configuration RAM sequence shown below . The device descriptor begins
at address MBAR + 0x1400. Each descriptor must immediately follow the previous descriptor without any
empty locations between them.
1. Device Descriptor
2. Configuration #1 Descriptor
3. Interface #0 Descriptor
4. Endpoint #1 Descriptor
5. Endpoint #2 Descriptor
6. Interface #1 Descriptor
7. Endpoint #3 Descriptor
8. Configuration #2 Descriptor
Endpoint #2
Descriptor
Endpoint #1
Descriptor
Endpoint #1
Descriptor
Endpoint #3
Descriptor
Endpoint #2
Descriptor
Endpoint #1
Descriptor
Interface #0
Descriptor
Interface #1
Descriptor
Interface #0
Descriptor
Interface #0
Descriptor
Configuration #1
Descriptor
Configuration #2
Descriptor
Configuration #3
Descriptor
Device
Descriptor
Universal Serial Bus (USB)
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9. Interface #0 Descriptor
10. Endpoint #1 Descriptor
11. Configuration #3 Descriptor
12. Interface #0 Descriptor
13. Endpoint #1 Descriptor
14. Endpoint #2 Descriptor
12.3.4 USB Module Access Times
The access times for the USB module depend on whether the access is to a register, to an endpoint FIFO
(EPnDR register), or to the configuration RAM.
12.3.4.1 Registers
The USB module registers are accessed through the internal S-bus. Each register access takes 3 clock
cycles for reads and writes.
12.3.4.2 Endpoint FIFOs
The FIFO access time depends on the size, the time between accesses, and whether the previous FIFO
access was for the same endpoint. After a longword access to an endpoint’s FIFO, the next longword in
the FIFO is cached for a quicker access time on the next longword read. This mechanism is reset every
time another endpoint is accessed. Table 12-19 shows the access times for the FIFOs.
12.3.4.3 Configuration RAM
The configuration RAM is longword accessible only. Access times for reads from the configuration RAM
are eight clock cycles per access. Clock cycle access times for back-to-back writes to the configuration
RAM are 3-5-5-5-5-5... Access times for writes separated by at least 1 clock cycle are 3-3-3-3-3-3…
Table 12-19. USB FIFO Access Timing
Access Type Read Write
Byte 5 4
Word 6 4
Long (back to back) 8-4-6-6-6-6... 4-6-6-6-6-6...
Long (1 clock gap) 8-3-5-5-5-5... 4-5-5-5-5-5...
Long (2 clock gap) 8-3-4-4-4-4... 4-4-4-4-4-4...
Long (3+ clock gap) 8-3-3-3-3-3... 4-4-4-4-4-4...
Universal Serial Bus (USB)
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12.4 Software Architecture and Application Notes
This section describes architecture and applications.
12.4.1 USB Module Initialization
At power-up, the USB module should be initialized within 20 ms if the USB port is connected. This time
corresponds to the 10 ms reset signaling and 10 ms reset recovery time when a device is detected. The
following steps are necessary to initialize the USB module for operation:
1. Clear EP0CTL[CFG_RAM_VAL,USB_EN].
2. Load the configuration RAM with the descriptors from external ROM. The starting configuration
RAM address is MBAR + 0x1400.
3. Select the internal or external USB transceiver in EPC0TL.
4. Write IEP0CFG and OEP0CFG to initialize the EP0 IN and OUT FIFOs.
5. Initialize the EP0 interrupt vectors.
6. Clear all interrupt bits in EP0ISR.
7. Enable the desired EP0 interrupt sources in EP0IMR.
8. Set EP0CTL[USB_EN, CFG_RAM_VALID].
12.4.2 USB Configuration and Interface Changes
Although the USB module handles the SET_CONFIGURATION and SET_INTERFACE requests, the
user is still required to perfor m some initialization when the configuration or alternate settings change. A
configuration or alternate setting change is signaled by the DEV_CFG interrupt. The following steps are
required to service the DEV_CFG interrupt.
1. Read EPSR0 and ASR to determine the current configuration and alternate settings.
2. Read the endpoint descriptors for the current configuration and alternate settings to determine the
endpoint type and maximum packet size for all of the active endpoints.
3. Write EPnCFG for all active endpoints to initialize the FIFOs.
4. Initialize the interrupt vectors for the active endpoints.
5. Clear all interrupt bits in the EPnISR registers for all active endpoints.
6. Enable the desired interrupt sources in the EPnIMR registers.
7. Clear the DEV_CFG interrupt bit to allow the USB module to access the FIFOs.
Universal Serial Bus (USB)
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12.4.3 FIFO Configuration
The USB module allows a very flexible FIFO configuration. The FIFO configuration is very application
dependent. The FIFO configuration depends on the current configuration number, alternate setting for each
interface, and each endpoint’ s type and packet size. The USB module contains two separate 512-byte FIFO
spaces: one for IN and one for OUT endpoints. The following guidelines must be adhered to when
configuring the FIFO’s:
• The MAX_PACKET field in the EPnCFG registers must match the wMaxPacketSize field in the
corresponding endpoint descriptor. An incorrect setting causes USB errors and unexpected
interrupts.
•EPnCFG[FIFO_SIZE] must be a power of 2 and must be at least two packets for non-isochronous
endpoints.
• The FIFO_ADDR field in the EPnCFG registers must be aligned to a boundary defined by the
FIFO_SIZE field. For example, a FIFO with a size equal to 64 bytes can have a starting address of
0, 64, 128, 192, 256, etc.
• The FIFO space for an endpoint defined by FIFO_SIZE and FIFO_ADDR must not overlap with
the FIFO space for any other endpoint with the same direction.
An example FIFO configuration with a variety of endpoint types and packet sizes is shown in Table 12-20.
12.4.4 Data Flow
The handling of the data flow to and from each endpoint can be divided between isochronous and
non-isochronous endpoints. Isochronous endpoints are designed to transfer streaming data which is
continuous and real-time in creation, delivery, and consumption. The timely delivery of isochronous data
is ensured at the expense of potential transient losses in the data stream. In other words, any error in
electrical transmission in not corrected by hardware mechanisms such as retries. An example of streaming
data is voice.
The other endpoint types transfer message based, or bursted data where integrity of the data is more
important than timely delivery.
Table 12-20. Example FIFO Setup
Endpoint
Number
Endpoint
Direction Endpoint Type Max Packet Size FIFO Size FIFO Starting
Address EPnCFG Value
0 IN Control 8 32 480 0x020101C0
0 OUT Control 8 32 384 0x02010180
1 IN Interrupt 17 64 384 0x04420180
2 IN Bulk 64 128 256 0x10040100
3 OUT Bulk 32 128 256 0x08040100
4 IN Isochronous 5 32 448 0x014101C0
5 OUT Isochronous 5 32 416 0x014101A0
6 IN Isochronous 300 256 0 0x4B080000
7 OUT Isochronous 300 256 0 0x4B080000
Universal Serial Bus (USB)
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12.4.4.1 Control, Bulk, and Interrupt Endpoints
The data flow for control, bulk, and interrupt endpoints can be handled the same way for all 3 types of
endpoints. Control, bulk, and interrupt endpoints all support guaranteed data delivery. If the host detects
an error during the read of a packet from an IN endpoint, it requests that the packet be resent from the
device. The USB FIFO mechanism takes care of this without interrupting the CPU. In a similar fashion,
the USB FIFO mechanism keeps a received packet from being read by the user until the control logic
validates the packet for transmission errors.
12.4.4.1.1 IN Endpoints
The following example demonstrates how to transmit a transfer on an IN endpoint:
1. Wait until the last transfer is complete (an EOT interrupt has occurred).
2. Write data to the FIFO to fill it.
3. Wait for EOP interrupt or poll EOP bit.
4. Read EPnDP to determine the number of bytes that can be written to the FIFO. Normally , only one
packet should be written unless the software does not service the EOP immediately.
5. Write data to the FIFO to fill it or until all of the data for the transfer has been written.
6. Repeat steps 5–7 until all of the data for the transfer has been written to the FIFO.
7. Clear EPnCTL[IN_DONE].
8. W ait for the EOT interrupt or poll the EOT bit. The user can now begin processing the next transfer .
12.4.4.1.2 OUT Endpoints
The following example demonstrates how to handle a received transfer on an OUT endpoint:
1. Wait for the EOP interrupt or poll the EOP bit.
2. Read EPnDP to determine number of bytes in the FIFO.
3. Read the indicated number of bytes of data from the FIFO into a buffer.
4. Repeat steps 1–3 until EOT is set.
5. When EOT is set, the transfer is complete. While EOT is set, the FIFO is locked and any packets
sent for the next transfer cause a NAK response.
6. Read EPnDP to determine the number of bytes in the FIFO if any for the last transfer . The EOT bit
can be cleared once this register has been read.
7. Read the indicated number of bytes of data from the FIFO into a buffer.
8. The user can now process the received transfer.
12.4.4.2 Isochronous Endpoints
The data flow for isochronous endpoints must be handled differently than the data flow for
non-isochronous endpoints. Data on isochronous endpoints is generally streaming data. Therefore, there
is no concept of transfers and EOT. In addition, isochronous endpoints differ from other endpoint types in
two distinct ways. Isochronous endpoints support packet sizes up to 1023 bytes and isochronous packets
are never resent. In order to support the large packet sizes, the FIFO size can be less than two times the
Universal Serial Bus (USB)
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packet size and the EPDPn registers are updated in real-time, not just at the end of a packet as with other
endpoint types. If the packet size is larger than the FIFO size, the FIFO level interrupt must be used.
Isochronous packets are guaranteed to occur once per USB frame. The SOF and ASOF interrupts are
provided in order for the user to synchronize the data flow with the USB. The SO F interrupt occurs every
1 ms provided the USB is active. The ASOF interrupt is generated if the USB module fails to detect a SOF
packet within the set timeout period.
It is strongly recommended that interrupts be used rather than polling for isochronous endpoints as
isochronous endpoints do not have any error detection or flow-control mechanisms. If the packet size is
larger than the FIFO size, using interrupts is required.
12.4.4.2.1 IN Endpoints
The user should write one packet of data to the IN FIFO per frame. If an ASOF interrupt occurs, the user
may wish to insert additional data in the data stream if the data for the frame is lost. The following example
demonstrates how to handle an isochronous IN packet each frame with a packet size lar ger than the FIFO
size:
1. Wait for the SOF interrupt for synchronization.
2. Write data to the FIFO until filled.
3. Wait for FIFO_LVL interrupt.
4. Read EPnDP to determine the number of bytes that can be written to the FIFO.
5. Write data to the FIFO to fill it or until all of the data for the packet has been written.
6. Repeat steps 3–5 until the entire packet has been written to the FIFO.
12.4.4.2.2 OUT Endpoints
The user should read one packet of data from the OUT FIFO per frame. If an ASOF interrupt occurs, the
user may wish to discard the data for the frame. The following example demonstrates how to handle an
isochronous OUT packet each frame with a packet size larger than the FIFO size:
1. Wait for SOF interrupt for synchronization. The user may want to track that a packet is received
for every frame.
2. Wait for the FIFO_LVL interrupt.
3. Read EPDPn to determine number of bytes in the FIFO.
4. Read data the indicated number of bytes from the FIFO.
5. Repeat steps 2–4 until entire packet is received.
6. Wait for EOP or SOF interrupt and read any remaining data in the FIFO.
7. An EOT interrupt indicates a short or zero-length packet.
12.4.5 Class- and Vendor-Specific Request Operation
The class- and vendor-specific requests are specific to a particular device class or vendor, and are not
processed by the USB request processor. When the USB module receives a class or vendor request, the
parameters for the request are written to the DRR1 and DRR2 registers and the user is notified of the
Universal Serial Bus (USB)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 12-35
request with the VEND_REQ interrupt. The user must take the following step to process a class or vendor
request:
1. Read DRR1 and DRR2 to determine the request type.
2. If the request has a data stage, the EP0 FIFO should be read or written with the number of bytes as
defined in the DRR2[wLength]. Refer to for more details on accessing the FIFOs.
3. When the user has finished processing the request, EP0CTL[CMD_OVER] must be set to signal
completion of the request. [CMD_ERR] must also be set simultaneously if an error was
encountered while processing the request.
12.4.6 REMOTE WAKEUP and RESUME Operation
The MCF5272 supports USB RESUME initiated from three different sources. Two of the sources are for
remote wakeup capability. The three different resume mechanisms are listed below:
• The user sets EP0CTL[RESUME]. The USB module responds to this only if the USB is in the
suspended state and EP0SR[WAKE_ST] is set. The ColdFire core must be running to write
E0PCTL. To meet USB timing specifications, the RESUME bit must not be set until two
milliseconds have elapsed since the USB module entered suspend state.
• The wake-on-ring INT1 interrupt pin is at the active level defined in EP0CTL. The USB module
responds to the INT1 pin only if the wake-on-ring function is enabled, the USB is in the suspended
state and EP0SR[WAKE_ST] is set. The ColdFire core may be powered down, and the resume
signaling wakes up the ColdFire core. The wake-on-ring function must not be enabled until two
milliseconds have elapsed since the USB module entered the suspend state in order to meet USB
specification timing requirements.
• The USB module detects any activity on the USB, which may be normal bus activity, resume
signaling, or reset signaling. The ColdFire core may be powered down, and the resume signaling
wakes up the ColdFire core.
12.4.7 Endpoint Halt Feature
USB has the ability to halt endpoints due to errors. The user is notified when an endpoint is halted and
when the halt is cleared. When an endpoint is halted, the user should abort the current transfer and
reinitialize the FIFO for the endpoint. An endpoint can be halted for a variety of reasons.
•SET_FEATURE request with the endpoint halt feature selector set.
•EPnCTL[STALL] is set by the user . This bit should be set on ly when there is a critical error on the
endpoint.
• On control endpoints, an error processing a request.
A halted endpoint can be cleared in several different ways:
•CLEAR_FEATURE request with the endpoint halt feature selector set.
• A USB reset signal.
•A
SET_CONFIGURATION or SET_INTERFACE request.
• On control endpoints, a SETUP token for the next request.
Universal Serial Bus (USB)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
12-36 Freescale Semiconductor
12.5 Line Interface
The recommended line interface is shown in Figure 12-24. The transistor used to control the 1.5–kΩ
pull-up resistor is optional.
Figure 12-24. Recommended USB Line Interface
12.5.1 Attachment Detection
The USB specification requires that a pull-up resistor must be placed on the D+ signal for the upstream
hub to detect attachment of a full-speed device. The user may optionally want to control the attach/detach
detection by software instead of only at power on and off. W ith software control of the pull-up resistor , the
user has unlimited time to initialize the USB module. The software controlled pull-up resistor can be
implemented with only a few discrete components. The recommended circuit for implementing software
control of the pull-up resistor is shown in Figure 12-24.
12.5.2 PCB Layout Recommendations
The device has input protection on all pins and may source or sink a limited amount of current without
damage.
The most important considerations for PCB layout deal with noise: noise on the power supply, noise
generated by the digital circuitry on the device, and noise resulting from coupling digital signals into the
analog signals. The best PCB layout methods to prevent noise–induced problems are as follows:
• Keep digital signals as far away from analog signals (D+ and D-) as possible.
• Use short, low inductance traces for the analog circuitry to reduce inductive, capacitive, and radio
frequency noise sensitivities.
• Use short, low inductance traces for digital circuitry to reduce inductive, capacitive, and radio
frequency radiated noise.
GP I/O pin
USB_D+
USB_D-
USB
Series B
Receptacle
Vbus
D+
D–
GND
3.3 V
1kΩ
100Ω
33Ω
33Ω
1.5kΩ±5%
MCF5272
Universal Serial Bus (USB)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 12-37
• Bypass capacitors should be connected between the Vdd and GND pairs with minimal trace length.
These capacitors help supply the instantaneous currents of the digital circuitry, in addition to
decoupling the noise that may be generated by other sections of the device or other circuitry on the
power supply.
• Use short, wide, low inductance traces to connect all of the GND pins together and, with a single
trace, connect all of the GND pins to the power supply ground. This helps to reduce voltage spikes
in the ground circuit caused by high-speed digital current spikes. Suppressing these voltage spikes
on the integrated circuit is the reason for multiple GND leads. A PCB with a ground plane
connecting all of the digital and analog GND pins together is the optimal ground configuration,
producing the lowest resistance and inductance in the ground circuit.
• Use short, wide, low inductance traces to connect all of the Vdd power supply pins together and,
with a single trace, connect all of the Vdd pins to the 3.3V power supply. Connecting all of the
digital and analog Vdd pins to the power plane would be the optimal power distribution method for
a multi-layer PCB with a power plane.
• The 48-MHz oscillator must be located as close as possible to the chip package. This is required to
minimize parasitic capacitance between crystal traces and ground.
12.5.3 Recommended USB Protection Circuit
Figure 12-25 shows the recommended external ESD protection circuit for the USB.
Figure 12-25. USB Protection Circuit
1
2
3
4
330
1.5K
33
33
22pF
22pF
2 x MMBD301LT1
Schottky Diode
USB Port
BZX84C3V3LT1
Zener Diode 0.1μF
+3.3V+3.3V
D +
D –
Universal Serial Bus (USB)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
12-38 Freescale Semiconductor
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 13-1
Chapter 13
Physical Layer Interface Controller (PLIC)
This chapter provides detailed information about the MCF5272’s physical layer interface controller
(PLIC), a module intended to support ISDN applications. The chapter begins with a description of
operation and a series of related block diagrams starting with a high-level overview. Each successive
diagram depicts progressively more internal detail. The chapter then describes timing generation, the
programming model, and concludes with three application examples.
The reader is assumed to have a basic familiarity with ISDN technology and terminology. A glossary
containing many ISDN terms can be found on the web at the following URL:
http://www.tribecatech.com/isdnterm.htm.
13.1 Introduction
The physical layer interface controller (PLIC) allows the MCF5272 to connect at a physical level with
external CODECs (coder/decoder) and other peripheral devices that use either the general circuit interface
(GCI) or interchip digital link (IDL) physical layer protocols. This module is primarily intended to
facilitate designs that include ISDN (integrated services digital network) interfaces.
The MCF5272 has four dedicated physical layer interface ports for connecting to external ISDN
transceivers, codecs, and other peripherals. There are three sets of pins for the se inter faces. Port 0 has its
own dedicated set of pins. Ports 1, 2, and 3 share a set of pins. Port 3 can also be configured to use a
dedicated pin set. Ports 1, 2, and 3 always share the same data clock (DCL).
When the ports are operated in slave mode, the PLIC can support a DCL frequency of 4.096 MHz and
frame sync frequency (FSC/FSR) of 8 KHz. When in master mode, DCL should be no greater than
one-twentieth of the CPU clock (CLKIN), with a maximum FSC/FSR of 8 KHz.
This chapter is written from the perspective of connect ing to an ISDN transceiver with 8-KHz frame sync.
The MCF5272 PLIC has four ports, port 0 – port 3, connected through three pin sets, numbered 0, 1, and 3.
A port can service, read, or write any 2B + D channel. As shown in Figure 13-1, port 0 connects through
pin set 0, and ports 1 and 2 both connect through set 1. port 3 can use either pin set 1 or 3. Pin set 3 consists
of data in and data out. Data clock and frame sync are common to pin set 1 and 3. In the case of set 1, which
connects multiple ports, separate delayed frame sync generators are provided for each port which
distinguish each port’s active time slots. See Section 13.6, “Application Examples” for further
information.
Physical Layer Interface Controller (PLIC)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
13-2 Freescale Semiconductor
Figure 13-1 illustrates the basic PLI C system.
Figure 13-1. PLIC System Diagram
The four ports have the following timing and connectivity features:
• Port 0: Connects through pin set 0. Operates as a slave-only port; that is, an external device must
source frame sync clock/frame sync receive (FSC/FSR) and data clock (DCL). These pins are
unidirectional inputs. Din0 and Dout0 are dedicated pins for port 0.
• Port 1: Connects through pin set 1. Operates as a master or slave port. In slave mode an external
device must source FSC/FSR and DCL. In master mode, DCL1 and FSC1/FSR1 are outputs. These
signals are in turn derived from the DCL0 and FSC/FSR from port 0. For port 1 to function in
master mode, port 0 must be enabled with an external transceiver sourcing DCL and FSC/FSR. The
physical interface pins Din1 and Dout1 serve ports 1, 2, and 3.
• Port 2: Connects through pin set 1. Operates as a slave-only port. Port 2 shares a data clock with
port 1: DCL1 when port 1 is in slave mode or GDCL when port 1 is in master mode. A delayed
frame sync, DFSC2, derived from FSC1, is connected to the DFSC2 output and fed to the port 2
IDL/GCI block. Users can synchronize the port 2 IDL/GCI block with an offset frame sync, (offset
with respect to the port 1 GCI/IDL block), by programming the port 2 sync delay register , P2SDR.
• Port 3: Connects through pin set 1 or 3. Operates as a slave-only port. Port 3 shares a data clock
with port 1: DCL1 when port 1 is in slave mode, or GDCL, when port 1 is in master mode. A
delayed frame sync, DFSC3, is derived from FSC1 and is fed to the port 3 IDL/GCI block.
Programming the port 3 sync delay register, P3SDR, allows it to be synchronized with an offset
Internal Interface Registers
Port 1 Port 2 Port 3
Pin Set 1 Mux
GCI/IDL GCI/IDL GCI/IDL
Pin Set 3
Mux
Timing
Gen
Timing
Gen Timing
Gen
Port 0
GCI/IDL
Pin Set 0
PA8/FSC0/FSR0, PA9/DGNT0,
DCL0/URT1_CLK, DIN0/URT1_RxD,
DOUT0/URT1_TxD, PA10/DREQ0
Pin Set 1
FSC1/FSR1/DFSC1,
DCL1/GDCL1_OUT, PA14,
PA15_INT6/DGNT1_INT6, DOUT1, DIN1
Pin Set 3
PA7/QSPI_CS3/DOUT3,
DIN3/INT4
DIN3
DOUT
Internal Bus
Timing
Generator
32 32 32 32
Physical Layer Interface Controller (PLIC)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 13-3
frame sync (offset with respect to the port 1 GCI/IDL block). Port 3 can also have dedicated data
in and data out pins, DIN3 and DOUT3 of pin set 3 (see Section 13.5.7, “Port Configuration
Registers (P0CR–P3CR)”). This allows the MCF5272 to connect to ISDN NT1s that have a
common frame sync and clock, but two sets of serial data-in and data-out pins.
The MCF5272 PLIC provides two sets of D-channel arbitration control pins:
• DREQ0 and DGNT0 for pin set 0
• DREQ1 and DGNT1 for pin set 1
Because pin set 1 connects ports 1, 2, and 3, these ports do not have D-channel arbitration control signals.
13.2 GCI/IDL Block
This section describes the GCI/IDL block.
13.2.1 GCI/IDL B- and D-Channel Receive Data Registers
Figure 13-2. GCI/IDL Receive Data Flow
The maximum data rate received for each GCI/IDL port is 144 Kbps: the sum of two 64-Kbps B channels
and one 16-Kbps D-channel. Frames of B1 and B2 channels are packed together to form longwords (32
bits). Frames of D-channels are packed together to form bytes. For channels B and D, this requires CPU
service at a 2-KHz rate, because it requires four frames to fill the 32-bit B-channel register and the 8-bit
D-channel register.
The CPU should service the B1 and B2 registers once every 500 μS. Overrun conditions can be avoided
only if the CPU services these registers in a timely manner.
The MCF5272 has 4 GCI/IDL interfaces. Thus the theoretical maximum is twelve 32-bit da ta registers to
be read. For most applications the typical number is less.
D Channel
B1 Shift Register B2 Shift Register D Shift Register
DIN
DCL
B2 ChannelB1 Channel
32 32 8
Internal Bus
Demultiplexing
Circuitry
Physical Layer Interface Controller (PLIC)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
13-4 Freescale Semiconductor
Figure 13-3 shows the shift register, shadow register, internal bus register, and multiplexor for each B
receive channel.
After reset, the B- and D-channel shift registers and shadow registers are initialized to all ones.
Figure 13-3. GCI/IDL B-Channel Receive Data Register Demultiplexing
13.2.2 GCI/IDL B- and D-Channel Transmit Data Registers
Figure 13-4. GCI/IDL Transmit Data Flow
The maximum transmission rate for e ach GCI/IDL port is 144 Kbps: the sum of two 64-Kbps B channels
and one 16-Kbps D-channel. Frames of B1, B2, and D-channels are packed together in a similar way to the
receive side.
Because the reception and transmission of information on the GCI/IDL interface is deterministic, a
common interrupt is generated at the 2-KHz rate. It is expected that a common interrupt service routine
services the transmit and receive registers.
After reset, the B- and D-channel shift registers and shadow registers are initialized to all ones.
8 bits
DEMUX
32 bits
Internal Bus
8-KHz Rate
Shift Register (B1 or B2)
2-KHz transfer and interrupt
8 bits 8 bits 8 bits 8 bits
Shadow Register
START END
DIN
64 Kbps
32
32
B1, B2, Receive
Data Register
B1 B2 D
B1 Shift Register B2 Shift Register D Shift Register
Dout
DCL
32 32 8
Internal Bus
Multiplexing
Circuitry
Physical Layer Interface Controller (PLIC)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 13-5
Figure 13-5. GCI/IDL B Data Transmit Register Multiplexing
13.2.3 GCI/IDL B- and D-Channel Bit Alignment
Unencoded voice is normally presented on the physical line most significant bit first (left aligned). See the
MC145484 data sheet for an example. Accordingly, the MCF5272 normally assumes incoming data are
left-aligned.
However, this convention is reversed when the data stream is HDLC (high-level data link control)
encoded. HDLC-stuffing and unstuffing are done by counting bits from the lsb. The look-up table in the
software HDLC on this device transmits the lsb first.
13.2.3.1 B-Channel Unencoded Data
Because unencoded voice data appears on the physical interface most significant bit (msb) first, the msb
is left aligned in the transmit and receive shift register; that is, the first bit of B-channel received data is
aligned in the msb position as shown in Figure 13-6.
The CPU uses longword (32-bit) registers (like P0B1RR) to communicate B-channel data to/from the
PLIC. These registers are loaded by concatenating four of the 8-bit/8-KHz frames. The four frames are
aligned sequentially as shown in Figure 13-6, with the first frame in the most significant byte (MSB)
position, and the fourth frame taking the least significant byte (LSB) position. See Section 13.5.1, “B1
Data Receive Registers (P0B1RR–P3B1RR),” or Section 13.5.5, “B2 Data Transmit Registers
(P0B2TR–P3B2TR),” for more information about some of these registers.
8 bits
MUX
Internal Bus
8-KHz Rate
Shift Register
2-KHz transfer and interrupt
Shadow Register 8 bits 8 bits 8 bits 8 bits
START END
32 bits
32
32
B1, B2 Transmit
Data Register
Physical Layer Interface Controller (PLIC)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
13-6 Freescale Semiconductor
.
Figure 13-6. B-Channel Unencoded and HDLC Encoded Data
13.2.3.2 B-Channel HDLC Encoded Data
When the incoming B channels contain HDLC encoded data they are presented on the physical line least
significant bit (lsb) first. The Soft HDLC expects the first bit received to be aligned in the lsb position of
a byte, with the last bit received aligned in the msb position.
Because the presentation of HDLC encoded data on the physical interface is lsb (least significant bit) first
for B1 and B2 the lsb is right-aligned in the transmit and receive shift register, that is, the first bit of the
B-channel received is aligned in the lsb position through to the last received bit of a byte that is aligned in
the msb position.
The ordering of the bytes over four frames within the longword register is as for unencoded data; that is,
the first frame is aligned in the MSB through to the fourth frame, which is aligned in the LSB position. See
Figure 13-6.
13.2.3.3 D-Channel HDLC Encoded Data
When the incoming D channels contain HDLC-encoded data, they are presented on the physical line lsb
first. The Soft HDLC expects the firs t bit received to be aligne d in the lsb position of a byte, with the last
bit received aligned in the msb position.
DCL
FSR
Din/Dout
Frame 0 Frame 1
B
7
B
6
B
5
B
4
B
3
B
2
B
1
B
0
B
7
B
6
B
5
B
4
B
3
B
2
B
1
B
0
B
7
B
6
B
5
B
4
B
3
B
2
B
1
B
0
B
7
B
6
B
5
B
4
B
3
B
2
B
1
B
0
32-bit B1/B2 Receive/Transmit Registers, PnB1RR, PnB2RR, PnB1TR, PnB2TR
Frame 0 Frame 1 Frame 2 Frame 3
B
7
B
6
B
5
B
4
B
3
B
2
B
1
B
0
B
7
B
6
B
5
B
4
B
3
B
2
B
1
B
0
B
7
B
6
B
5
B
4
B
3
B
2
D0D1
Din/Dout
B 1 B 2 D
B
0
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
0
B
1
B
2
B
3
B
4
B
5
D0D1
B
0
B
1
B
2
B
3
B
4
B
5
B
6
B
7
Unencoded
HDLC
Encoded
Physical Layer Interface Controller (PLIC)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 13-7
Because the presentation of HDLC encoded data on the physical interface is lsb first, the lsb is
right-aligned in the transmit and receive shift register.
A D-channel byte is formed by concatenating two D bits from each of four frames. This data is also
right-aligned in the D-channel receive register as shown in Figure 13-7.
Figure 13-7. D-Channel HDLC Encoded and Unencoded Data.
13.2.3.4 D-Channel Unencoded Data
As with the B channel, a mechanism is provided to support incoming D channels containing unencoded
data, even though as of this document’s publication date, no communication protocols using unencoded
D-channel data are known.
As with unencoded (PCM encoded) B-channel data, it is assumed unencoded D-channel information is
presented on the physical line msb first. The msb is left-aligned in the transmit and receive shift register,
that is, the first bit received is aligned in the msb position through to the last received bit of a byte that is
aligned in the lsb position.
A D-channel byte is formed by concatenating two D bits from each frame over four consecutive frames as
shown in Figure 13-7. These 8 bits are also left-aligned in the D-channel receive register, that is, the first
two D-channel bits from the first frame go into the two msbs, B7 and B6, the next two D-channel bits from
the second frame in B5 and B4, and so on, until the last two D-channel bits in the fourth frame are aligned
in B1 and B0.
DCL
FSR
Din/Dout D0D1
Frame 0 Frame 1
Frame 3210
D7 D6 D5 D4 D3 D2 D1 D0
D2D3D4D5
D6
D7
Frame 2 Frame 3
Din/Dout D7D6D5D4D3D2
D1
D0
Unencoded
HDLC
Encoded
8-Bit D-Channel Receive/Transmit Register, RD, TD
Physical Layer Interface Controller (PLIC)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
13-8 Freescale Semiconductor
13.2.3.5 GCI/IDL D-Channel Contention
Typically, when the CPU wants to transmit a D-channel packet, it starts the HDLC framer.
In IDL mode, when the CPU can start sending data from the prepared HDLC frame to the D-channel
transmit register, it asserts DREQ by setting the appropriate DRQ bit in the PDRQR register. The
D-channel controller hardware looks for a valid DGRANT back from the layer 1 transceiver and, assuming
DREQ is also valid, begins transmitting the D-channel packet. PDCSR[DGn] reflects the value of the
dedicated DGRANT pin. Refer to the MC145574 data sheet for SCIT mode information.
In GCI mode the only D-channel contention control is provided by PnCR[G/S], Section 13.5.7, “Port
Configuration Registers (P0CR–P3CR).” Provided the PLIC operates in SCIT mode, PDCSR[DGn],
Section 13.5.19, “D-Channel Status Register (PDCSR),” is defined by the state of PnCR[G/S], and is used
to control D-channel transmission along with PDRQR[DRQn], Section 13.5.20, “D-Channel Request
Register (PDRQR).” In GCI mode, the PLIC ports do not support any other form of D-channel contention
such as the indirect mode found on the Freescale MC145574. In GCI mode, the DGRANT pin function
found in IDL mode is disabled and the pin can be defined for other functions. Please note that the
D-channel periodic interrupts in both the receive and transmit direction are not disabled even though the
shift register is disabled by DREQ, DGRANT, and PDRQR[DCNTIn] (Section 13.5.20, “D-Channel
Request Register (PDRQR)”) configuration.
An override mechanism for D-channel contention control is provided through the D-channel ignore
DCNTI bit.
Figure 13-8 illustrates this functionality:
Figure 13-8. D-Channel Contention
13.2.4 GCI/IDL Looping Modes
The PLIC ports can be configured to operate in various looping modes as shown in Figure 13-9. These
modes are useful for local and remote system diagnostic functions.
The loopback modes are independent signal loopbacks for the respective ports. These loopbacks allow for
the echoing of local or remote information. In auto-echo or remote-loopback modes there is no time
switching or time slot assignment function. All data received on Din is transmitted on Dout during the
same time slot. Similarly, in local-loopback mode, the information transmitted on the Dout pin is echoed
back on Din during the same time slot.
The PLIC transmitter and receiver should both be disabled when switching between modes.
Shift Register Enable
DGRANT
DREQ
DCNTI
Physical Layer Interface Controller (PLIC)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 13-9
13.2.4.1 Automatic Echo Mode
The port automatically retransmits the received data on a bit-by-bit basis in this mode. The local
CPU-to-receiver communication continues normally , but the CPU-to-transmitter link is disabled. While in
this mode, received data is clocked on the receiver clock and retransmitted on transmit Dout pin.
13.2.4.2 Local Loopback Mode
TxData is internally connected to RxData in this mode. This mode is useful for testing the operation of a
local port by sending data to the transmitter and checking data assembled by the receiver. In this manner ,
correct channel operations can be assured. Also, both transmitter and CPU-to-receiver communications
continue normally in this mode. While in this mode, the receive Din pin is ignored, the transmit Dout is
held marking, and the receiver is clocked by the transmitter clock.
13.2.4.3 Remote Loopback Mode
The channel automatically tran smits received data on the transmit Dout pin on a bit-by-bit basis in this
mode. The local CPU-to-transmitter link is disabled. This mode is useful in testing receiver and transmitter
operation of a remote channel. While in this mode, the receiver clock is used for the transmitter.
Figure 13-9. GCI/IDL Loopback Mode
13.2.5 GCI/IDL Interrupts
The PLIC module generates two interrupts—the periodic frame interrupt and the aperiodic status interrupt.
13.2.5.1 GCI/IDL Periodic Frame Interrupt
The frame interrupt is a periodic 2-KHz interrupt as shown in Figure 13-10. This is the normal interrupt
rate for servicing the incoming and outgoing B and D channels. This service routine must execute in a
timely manner. Each of the B- and D-channel transmit and receive registers should be written and read
prior to the next 2-KHz interrupt for underrun or overrun conditions to be prevented.
Disabled
CPU
Rx
Tx
Disabled
(a) Automatic Echo
Disabled
CPU
Rx
Tx
Disabled
(b) Local Loopback
Din
Dout
Din
Dout
CPU
Rx
Tx
(c) Remote Loopback
Din
Dout
Disabled
Disabled
Disabled
Disabled
Physical Layer Interface Controller (PLIC)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
13-10 Freescale Semiconductor
Note that only the active, that is enabled, B- and D-channel receive and tr ansmit registers need to be read
and written. B and D channels which are not active need not have their receive and transmit registers read
and written.
Figure 13-10. Periodic Frame Interrupt
It should be clear from Figure 13-10 that due to the double buffering through the PLIC shadow register,
frame (n) is written to the PLIC transmit register during the interrupt service routine of the previous frame,
frame (n-1). Similarly on the receive side, frame (n) is read from the PLIC receive register during the
interrupt service routine of the following frame, frame (n + 2). Figure 13-10 shows that the minimum
delay through the PLIC, when not in loopback mode, is two 2-KHz frames, or 1 mS.
13.2.5.2 GCI Aperiodic Status Interrupt
The aperiodic status interrupt is an interrupt which is driven by a number of conditions. The CPU services
this interrupt by reading the aperiodic status register, ASR, and by reading or writing the relevant C/I or
monitor channel register or registers which have generated this interrupt. Once read, the interrupt is
cleared. Each port and individual interrupts within each port is maskable. The following conditions for
each of the ports can trigger this interrupt:
• Monitor channel receive: ASR defines which port or ports have generated a monitor channel
receive interrupt. The interrupt service routine must then read the appropriate GMR register or
registers to clear the monitor channel receive interrupt.
• Monitor channel transmit: ASR defines which port or ports have generated a monitor channel
transmit interrupt. The interrupt service routine must then read the appropriate GMT register or
registers to clear the monitor channel transmit interrupt.
• C/I channel receive: ASR defines which port or ports have generated a C/I channel receive
interrupt. The interrupt service routine must then read the appropriate GCIR register or registers to
clear the C/I channel receive interrupt.
• C/I channel transmit: ASR defines which port or ports have generated a C/I channel transmit
interrupt. The interrupt service routine must then read the appropriate GCIT register or registers to
clear the C/I channel transmit interrupt.
Slot 0 Slot 1 Slot 2 Slot 3
Frame n Frame n + 1
2-KHz interrupt 2-KHz interrupt
Interrupt service routine
Read Frame n -1 (B&D)
Write Frame n + 1 (B&D)
Interrupt service routine
Read Frame n (B&D)
Write Frame n + 2 (B&D)
Interrupt service routine
Read Frame n + 1 (B&D)
Write Frame n + 3 (B&D)
500
μ
s
125
μ
s
Slot 0 Slot 1 Slot 2 Slot 3 Slot 0 Slot 1
Frame n + 2
Slot 2
2-KHz interrupt
Physical Layer Interface Controller (PLIC)
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Freescale Semiconductor 13-11
13.2.5.3 Interrupt Control
There are a number of control mechanisms for the periodic and aperiodic interrupts on the PLIC.
• Clearing the ON/OFF bit in the port configuration register, Section 13.5.7, “Port Configuration
Registers (P0CR–P3CR),” turns the port off and masks all periodic and aperiodic interrupts for the
affected port.
• Clearing the enable bits, ENB1 or ENB2, in the port configuration register masks the periodic
transmit and receive interrupts associated with the respective B1 or B2 channel.
• Specific interrupt enables are provided in each port’ s ICR. This includes a port interrupt enable, IE,
which masks all periodic and aperiodic interrupts. In addition, there are interrupt enables for
specific conditions. These are listed in Section 13.5.9, “Interrupt Configuration Registers
(P0ICR–P3ICR).”
13.3 PLIC Timing Generator
13.3.1 Clock Synthesis
The PLIC clock generator employs a completely digital, synchronous design which can be used to
synthesize a new clock by multiplying an incoming reference clock. This clock generator is not a PLL—it
has no VCO or phase comparator.
The frequency multiplication factor is always an integral power of two between 2 and 256 inclusive. The
amount of phase jitter exhibited by the synthesized clock increases as the synthesized clock frequency
approaches CLKIN’s frequency. As a general guide, the maximum generated DCL should be no greater
than one-twentieth of CLKIN’ s frequency. Therefore, given a CLKIN of 66 MHz, the maximum frequency
which can be synthesized with acceptable jitter is approximately 3.3 MHz.
The clock generator uses a 14-bit counter to divide CLKIN. This limits the reference clock’s minimum
frequency to CLKIN divided by 16,384.
To summarize these two points:
• Synthesized clock x 20 < CLKIN(Recommended)
• Reference clock > CLKIN / 16,384(Required)
The control of the clock generator block is provided through the PCSR register detailed in Section 13.5.22,
“Clock Select Register (PCSR).”
The process is illustrated by this example. Suppose the following:
• CPU clock = 66 MHz
• Reference clock = 64 KHz
• Synthesized clock = 1.024 MHz
The appropriate reference clock is selected by programming PLCLKSEL[CKI1, CKI0], Section 13.5.22,
“Clock Select Register (PCSR).” The multiplication factor is 16 (1.024 MHz / 64 KHz) and is specified
by PLCLKSEL[CMULT0-2]. The division ratio between the synthesized clock (GDCL), 1.024 MHz, and
the synthesized frame sync (Gen_FSC) must be set. (A Gen_FSC of 8 KHz is assumed). This division ratio
is selected by means of FDIV[2-0]. Finally, the clock generation block should be taken out of bypass by
setting PCSR[NBP].
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13-12 Freescale Semiconductor
The above settings can be made by a single write of the 16-bit value 0x802B to PCSR.
The following restrictions should be observed when using the clock generator module:
• The smallest multiplication factor is 2.
• CLKIN should be significantly greater than (> 20 times) the synthesized clock.
Figure 13-11 and Figure 13-12 show the connectivity and relationship of the timing signals within the
PLIC block.
Figure 13-11. PLIC Internal Timing Signal Routing
Figure 13-12. PLIC Clock Generator
Port 0
Port 1
Port 2
Port 3
Prog Delay 0
Prog Delay 1
Prog Delay 2
DCL1
FSC1
Prog Delay 3
DFSC2
DCL1
DCL1
DFSC2
DFSC3
DCL1/GDCL1_OUT
FSC1/FSR1/DFSC1
P1CR[M/S]
DCL0/URT1_CLK
PA8/ FSC0/FSR0
GCI/IDL
GCI/IDL
GCI/IDL
GCI/IDL
DCL0
DFSC0
SFSC Gen
FSC0
FSC1
P1CR[FSM] P0CR[M2-M0]
2-KHz to CPU
DFSC1
DFSC0 Pin
Mux 0
Pin
Mux 1
P0SDR[15:0]
P1SDR[15:0]
DFSC3
P2SDR[15:0]
P3SDR[15:0]
Mux Multiply
Block
Divider
Block
Gen_FSC
GDCL
CKI[1:0] CMULT[2:0] FDIV[2:0]
DCL0/URT1_CLK
O192K
PA8/ FSC0/FSR0
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Freescale Semiconductor 13-13
13.3.2 Super Frame Sync Generation
Figure 13-11 shows the generation of the 2-KHz super frame sync. The choice of either FSC0 or FSC1 is
possible using P1CR[FSM]. This allows either the port 0 or port 1 timing to be used to generate the 2-KHz
super frame sync interrupt. The SFSC block then divides this accordingly . When P1CR[FSM] is set, FSC1
is the source of the super frame sync. In case P1CR[MS] is 0 (that is, port 1 is in slave mode), the interrupt
is ultimately driven by an external source. In case the M/S bit is 1 (that is, port 1 is in master mode), FSC1
ultimately comes from port 0.
13.3.3 Frame Sync Synthesis
Figure 13-11 illustrates the relationships between the various frame sync clocks. DFSC1 is generated
through programmable delay 1 referenced to DFSC0. DFSC2 and DFSC3 are generated through
programmable delays 2 and 3 referenced to DFSC1. Note well the following:
• P0SDR settings affect DFSC[0–3]
• P1SDR settings affect DFSC[1–3]
• P2SDR settings affect only DFSC2
• P3SDR settings affect only DFSC3
13.4 PLIC Register Memory Map
Table 13-1 lists the PLIC registers with their offset address from MBAR and their default value on reset.
Table 13-1. PLIC Module Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x0300 Port0 B1 Data Receive (P0B1RR)
0x0304 Port1 B1 Data Receive (P1B1RR)
0x0308 Port2 B1 Data Receive (P2B1RR)
0x030C Port3 B1 Data Receive (P3B1RR)
0x0310 Port0 B2 Data Receive (P0B2RR)
0x0314 Port1 B2 Data Receive (P1B2RR)
0x0318 Port2 B2 Data Receive (P2B2RR)
0x031C Port3 B2 Data Receive (P3B2RR)
0x0320 Port0 D Data Receive
(P0DRR)
Port1 D Data Receive
(P1DRR)
Port2 D Data Receive
(P2DRR)
Port3 D Data Receive
(P3DRR)
0x0328 Port0 B1 Data Transmit (P0B1TR)
0x032C Port1 B1 Data Transmit (P1B1TR)
0x0330 Port2 B1 Data Transmit (P2B1TR)
0x0334 Port3 B1 Data Transmit (P3B1TR)
0x0338 Port0 B2 Data Transmit (P0B2TR)
0x033C Port1 B2 Data Transmit (P1B2TR)
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0x0340 Port2 B2 Data Transmit (P2B2TR)
0x0344 Port3 B2 Data Transmit (P3B2TR)
0x0348 Port0 D Data Transmit
(P0DTR)
Port1 D Data Transmit
(P1DTR)
Port2 D Data Transmit
(P2DTR)
Port3 D Data Transmit
(P3DTR)
0x0350 Port0 GCI/IDL Configuration register (P0CR) Port1 GCI/IDL Configuration register (P1CR)
0x0354 Port2 GCI/IDL Configuration register (P2CR) Port3 GCI/IDL Configuration register (P3CR)
0x0358 Port0 Interrupt Configuration register (P0ICR) Port1 Interrupt Configuration register (P1ICR)
0x035C Port2 Interrupt Configuration register (P2ICR) Port3 Interrupt Configuration register (P3ICR)
0x0360 Port0 GCI monitor Rx (P0GMR) Port1 GCI monitor Rx (P1GMR)
0x0364 Port2 GCI monitor Rx (P2GMR) Port3 GCI monitor Rx (P3GMR)
0x0368 Port0 GCI monitor Tx (P0GMT) Port1 GCI monitor Tx (P1GMT)
0x036C Port2 GCI monitor Tx (P2GMT) Port3 GCI monitor Tx (P3GMT)
0x0370 Reserved GCI monitor Tx status
(PGMTS)
GCI monitor Tx abort
(PGMTA)
Reserved
0x0374 Port0 GCI C/I Rx (P0GCIR) Port1 GCI C/I Rx (P1GCIR) Port2 GCI C/I Rx (P2GCIR) Port3 GCI C/I Rx (P3GCIR)
0x0378 Port0 GCI C/I Tx (P0GCIT) Port1 GCI C/I Tx (P1GCIT) Port2 GCI C/I Tx (P2GCIT) Port3 GCI C/I Tx (P3GCIT)
0x037C Reserved GCI C/I Tx Status
(PGCITSR)
0x0383 Reserved GCI C/I D-Channel Status
(PDCSR)
0x0384 Port0 periodic status (P0PSR) Port1 periodic status (P1PSR)
0x0388 Port2 periodic status (P2PSR) Port3 periodic status (P3PSR)
0x038C Aperiodic Interrupt status register (PASR) Reserved Loop back Control (PLCR)
0x0390 Reserved D-Channel Request (PDRQR)
0x0394 Port0 Sync Delay (P0SDR) Port1 Sync Delay (P1SDR)
0x0398 Port2 Sync Delay (P2SDR) Port3 Sync Delay (P3SDR)
0x039C Reserved Clock Select (PCSR)
Table 13-1. PLIC Module Memory Map (continued)
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
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Freescale Semiconductor 13-15
13.5 PLIC Registers
Any bits in the following registers marked 0 have no function. When the register is a read/write register,
these bits should be cleared.
Some registers are described that control more than one port. In these cases, parentheses indicates to which
port the control bits relate; for example, LM0(0) is the LM0 bit for port 0.
13.5.1 B1 Data Receive Registers (P0B1RR–P3B1RR)
All bits in these registers are read only and are set on hardware or software reset.
The PnB1RRs contain the last four frames of data received on channel B1. (P0B1RR is the B1 channel
data for port 0, P1B1RR is B1 for port 1, and so on.) The data are packed from the least significant byte
(LSB), up to the most significant byte (MSB).
These registers are aligned on longword boundaries from MBAR + 0x300 for P0B1RR to
MBAR + 0x30C for P3B1RR. See Section 13.2.3, “GCI/IDL B- and D-Channel Bit Alignment,” for the
frame and bit alignment within the 32-bit word.
31 24 23 16
Field Frame 0 Frame 1
Reset 1111_1111 1111_1111
R/W Read Only
15 8 7 0
Field Frame 2 Frame 3
Reset 1111_1111 1111_1111
R/W Read Only
Addr MBAR + 0x300 (P0B1RR); 0x304 (P1B1RR); 0x308 (P2B1RR); 0x30C (P3B1RR)
Figure 13-13. B1 Receive Data Registers P0B1RR–P3B1RR
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13-16 Freescale Semiconductor
13.5.2 B2 Data Receive Registers (P0B2RR–P3B2RR)
All bits in these registers are read only and are set on hardware or software reset.
The PnB2RR registers contain the last four frames of data received on channel B2. (P0B2RR is the B2
channel data for port 0, P1B2RR is B2 for port 1, and so on.) The data are packed from LSB to MSB.
These registers are aligned on long-word boundaries from MBAR + 0x310 for P0B2RR to
MBAR + 0x31C for P3B2RR. See Section 13.2.3, “GCI/IDL B- and D-Channel Bit Alignment,” for the
frame and bit alignment within the 32-bit word.
Figure 13-14 shows the B2 receive data registers.
13.5.3 D Data Receive Registers (P0DRR–P3DRR)
All bits in these registers are read-only and are set on hardware or software reset.
The PnDRR registers contain the last four frames of D-channel receive data packed from the least
significant bit, (lsb), to the most significant bit, (msb), for each of the four physical ports on the MCF5272.
P0DRR is the D-channel byte for port 0, P1DRR the D channel for port 1, and so on.
Each of the four byte-addressable registers, P0DRR-P3DRR, are packed to form one 32-bit register,
PnDRR, located at MBAR + 0x320. P0DRR is located in the MSB of the PnDRR register, P3DRR is
located in the LSB of the PnDRR register.
31 24 23 16
Field Frame 0 Frame 1
Reset 1111_1111 1111_1111
R/W Read Only
15 8 7 0
Field Frame 2 Frame 3
Reset 1111_1111 1111_1111
R/W Read Only
Addr MBAR + 0x310 (P0B2RR); 0x314 (P1B2RR); 0x318 (P2B2RR); 0x31C (P3B2RR)
Figure 13-14. B2 Receive Data Registers P0B2RR – P3B2RR
31 24 23 16
Field P0DRR P1DRR
Reset 1111_1111 1111_1111
R/W Read Only
15 8 7 0
Field P2DRR P3DRR
Reset 1111_1111 1111_1111
R/W Read Only
Addr MBAR + 0x320 (P0DRR); 0x321 (P1DRR); 0x322 (P2DRR); 0x323 (P3DRR)
Figure 13-15. D Receive Data Registers P0DRR–P3DRR
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Freescale Semiconductor 13-17
13.5.4 B1 Data Transmit Registers (P0B1TR–P3B1TR)
All bits in these registers are read/write and are set on hardware or software reset.
The PnB1TR registers contain four frames of transmit data for channel B1. (P0B1TR is the B1 channel
transmit data for port 0, P1B1TR is B1 transmit for port 1, and so on.) The data are packed from LSB to
MSB.
These registers are aligned on long-word boundaries from MBAR + 0x328 for P0B1TR to
MBAR + 0x334 for P3B1TR. See Section 13.2.3, “GCI/IDL B- and D-Channel Bit Alignment,” for the
frame and bit alignment within the 32-bit word.
13.5.5 B2 Data Transmit Registers (P0B2TR–P3B2TR)
All bits in these registers are read/write and are set on hardware or software reset.
The PnB2TR registers contain four frames of transmit data for port n of channel B2. (P0B2TR is the B2
channel transmit data for port 0, P1B2TR is B2 transmit for port 1, and so on.) The data are packed from
LSB to MSB.
These registers are aligned on long-word boundaries from MBAR + 0x338 for P0B2TR to
MBAR + 0x344 for P3B2TR. Please refer to Section 13.2.3, “GCI/IDL B- and D-Channel Bit Alignment”
for the frame and bit alignment within the 32-bit word.
31 24 23 16
Field Frame 0 Frame 1
Reset 1111_1111 1111_1111
R/W Read/Write
15 8 7 0
Field Frame 2 Frame 3
Reset 1111_1111 1111_1111
R/W Read/Write
Addr MBAR + 0x328 (P0B1TR); 0x32C (P1B1TR); 0x330 (P2B1TR); 0x334 (P3B1TR)
Figure 13-16. B1 Transmit Data Registers P0B1TR–P3B1TR
31 24 23 16
Field Frame0 Frame1
Reset 1111_1111 1111_1111
R/W Read/Write
15 8 7 0
Field Frame2 Frame3
Reset 1111_1111 1111_1111
R/W Read/Write
Addr MBAR + 0x338 (P0B2TR); 0x33C (P1B2TR); 0x340 (P2B2TR); 0x344 (P3B2TR)
Figure 13-17. B2 Transmit Data Registers P0B2TR–P3B2TR
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13.5.6 D Data Transmit Registers (P0DTR–P3DTR)
All bits in these registers are read/write and are set on hardware or software reset.
The PLTD registers contain four frames of D-channel transmit data, packed from lsb to msb, for each of
the four physical ports on the MCF5272. P0DTR is the D-channel byte for port 0, P1DTR the D channel
for port 1, and so on.
The four byte-addressable 8-bit registers, P0DTR–P3DTR, are packed to form one 32-bit register , PLTD.
PLTD is aligned on a long-word boundary at MBAR + 0x348 and can be read as a single 32-bit register.
P0DTR is located in the MSB of the PLTD register, P3DTR is located in the LSB of the PLTD register.
13.5.7 Port Configuration Registers (P0CR–P3CR)
PnCR are registers containing configuration information for each of the four ports on the MCF5272.
All bits in these registers are read/write and are cleared on hardware or software reset.
31 24 23 16
Field P0DTR P1DTR
Reset 1111_1111 1111_1111
R/W Read/Write
15 8 7 0
Field P2DTR P3DTR
Reset 1111_1111 1111_1111
R/W Read/Write
Addr MBAR + 0x348 (P0DTR); 0x349 (P1DTR); 0x34A (P2DTR); 0x34B (P3DTR)
Figure 13-18. D Transmit Data Registers P0DTR–P3DTR
15 14 12 11 10 9 8 7 6 5 4 3 2 1 0
P0CR ON/OFF M — G/S — ACT — — — — SHB2 SHB1 ENB2 ENB1
P1CR ON/OFF — M M/S G/S FSM ACT — — — — SHB2 SHB1 ENB2 ENB1
P2CRON/OFF— — —————————SHB2SHB1ENB2ENB1
P3CR ON/OFF — — — — — — — DMX — — — SHB2 SHB1 ENB2 ENB1
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x350 (P0CR); 0x352 (P1CR); 0x354 (P2CR); 0x356 (P3CR)
Figure 13-19. Port Configuration Registers (P0CR–P3CR)
Physical Layer Interface Controller (PLIC)
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Freescale Semiconductor 13-19
Table 13-2. P0CR–P3CR Field Descriptions
Bits Name Description
15 ON/OFF 0 Port is off and in a steady state condition. In this state, the B and D channels on the transmit side are
high impedance when in GCI/IDL. The receive registers are all set. In IDL and GCI modes with the port
in this state, all periodic and aperiodic interrupts associated with the port are disabled.
1 Switches on the port for operation in the configured mode.
14–12 M Mode. Selects between various modes of operation as described below. Note: bit 14 is relevant to port 0
only. The IDL modes on the PLIC only support short frame sync.
Port 1-3 Port 0
000 IDL8IDL8
001 IDL10IDL10
010 GCIGCI
011 ReservedReserved
10xReservedReserved
11xReservedReserved
11 M/S Master/Slave. Defines the direction of the DCL1 and FSC1 pins.
0 DCL1 and FSC1 are inputs and are sourced from an external master. Note: This bit is relevant to port 1
only, as port 0 is always in slave mode.
1 enables DCL1 and FSC1 to be outputs, that is, the MCF5272 drives DCL1 and FSC1.
10 G/S GCI/SCIT.
0 The normal mode of GCI is used (i.e. no D-channel contention control).
1 Selects SCIT mode of operation for the GCI interfaces.
9 FSM Frame Sync Master.
0 Default reset value. 2-KHz interrupt is generated from port 0.
1 Port 1 FSC/FSR is used to generate the 2-KHz interrupt.
8 ACT GCI Activation.
0 Default reset value.
1 Causes Dout to transition to a logic low for the respective port. This bit is only operational when the port
is in GCI mode. Setting the ACT bit in any other mode has no effect. It is the responsibility of the CPU to
clear the ACT bit when normal operation on Dout is required. This bit is intended to be used to request
activation from the upstream DCL/FSC driver. Periodic interrupts commence as soon as the upstream
device generates DCL, provided the appropriate interrupts, such as IE, B1RIE, and so on, are enabled for
the port.
7 DMX Data multiplex.
0 port 3 Dout and Din are multiplexed onto Dout1 and Din1.
1 enables port 3 Dout and Din to be connected to dedicated output and input pins, DOUT3 and DIN3.
3 SHB2 B2 channel shift direction.
0 B2 channel data is received/transmitted msb first. The msb-first convention is often used for
communication with PCM CODECs and converters.
1 B2 channel data is received/transmitted lsb first. The lsb-first convention is used when the data is to be
HDLC encoded.
2 SHB1 B1 channel shift direction. See SHB2.
1 ENB2 Enable B2 data channel.
0 The B2 channel is disabled and all periodic interrupts in both receive and transmit directions are
disabled. The behavior of Din and Dout in this state is shown below.
1 Enables the B2 data channel for the respective port.
0 ENB1 Enable B1 data channel. See ENB2.
Mode Din Dout
IDL All 1s High Impedance
GCI Operational (data on Din visible) Open drain
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13.5.8 Loopback Control Register (PLCR)
All bits in this register are cleared on hardware or software reset.
The PLCR is an 8-bit register containing the configuration information for all four ports on the MCF5272.
NOTE
In loopback mode, the respective port must be enabled (using
PnCR[ON/OFF]) along with the B1 and B2 channels (using PnCR[ENB1,
ENB2]) and the D channel (using PDRQR[DCNTI] when in IDL mode, for
instance). Also, if more than one of ports 1, 2, or 3 are programmed in
loopback mode, it is necessary to program the appropriate frame sync
function using the sync delay registers discussed in Section 13.5.21, “Sync
Delay Registers (P0SDR–P3SDR).”
13.5.9 Interrupt Configuration Registers (P0ICR–P3ICR)
All bits in these registers are read/write and are cleared on hardware or software reset.
The PnICR registers contain interrupt configuration bits for each of the four ports on the MCF5272.
76543210
Field LM3 LM2 LM1 LM0
Reset 0000_0000
R/W Read/Write
Addr MBAR + 0x38F
Figure 13-20. Loopback Control Register (PLCR)
Table 13-3. PLCR Field Description
Bits Name Description
7-6 LM3 Loopback mode control, port 3.
00 Normal
01 Auto-echo
10 Local Loopback
11 Remote Loopback
5-4 LM2 Loopback mode control, port 2. See LM3.
3-2 LM1 Loopback mode control, port 1. See LM3.
1-0 LM0 Loopback mode control, port 0. See LM3.
15 14 12 11 10 9 8 7 6 5 4 3 2 1 0
PLCIR0–3 IE — GCR GCT GMR GMT — DTIE B2TIE B1TIE DRIE B2RIE B1RIE
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x0358 (P0ICR); 0x035A (P1ICR); 0x035C (P2ICR); 0x035E (P3ICR)
Figure 13-21. Interrupt Configuration Registers (P0ICR–P3ICR)
Physical Layer Interface Controller (PLIC)
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Freescale Semiconductor 13-21
Table 13-4. P0ICR–P3ICR Field Descriptions
Bits Name Description
15 IE Interrupt enable. Allows the port to generate interrupts to the CPU. When cleared, the IE bit masks all
periodic and aperiodic interrupts associated with the respective port.
14–12 — Reserved, should be cleared.
11 GCR Interrupt enable for the C/I channel receive.
0 Interrupt masked
1 Interrupt enabled. When set, an interrupt is enabled which occurs when the corresponding GCR
status bit is set.
10 GCT C/I channel transmit Interrupt enable.
0 Interrupt masked
1 Interrupt enabled.
9 GMR Interrupt enable for the monitor channel receive.
0 Interrupt masked
1 Interrupt enabled.
8 GMT Interrupt enable for the monitor channel transmit.
0 Interrupt masked
1 Interrupt enabled.
7–6 — Reserved, should be cleared.
5 DTIE D transmit interrupt enable.
0 Interrupt masked
1 Interrupt enabled.Interrupt occurs when the corresponding PnPSR[DTDE] or PnPSR[DTUE] is set.
4 B2TIE B2 transmit interrupt enable.
0 Interrupt masked
1 Interrupt enabled. Interrupt occurs when the corresponding PnPSR[B2TDE] or PnPSR[B2TUE] is
set.
3 B1TIE B1 transmit interrupt enable.
0 Interrupt masked
1 Interrupt enabled. Interrupt occurs when the corresponding PnPSR[B1TDE] or PnPSR[B1TUE] is
set.
2 DRIE D receive interrupt enable.
0 Interrupt masked
1 Interrupt enabled. Interrupt occurs when the corresponding PnPSR[DRDF] or PnPSR[DROE] is
set.
1 B2RIE B2 receive interrupt enable.
0 Interrupt masked
1 Interrupt enabled. Interrupt occurs when the corresponding PnPSR[B2RDF] or PnPSR[B2ROE] is
set.
0 B1RIE B1 receive interrupt enable.
0 Interrupt masked
1 Interrupt enabled.Interrupt occurs when the corresponding PnPSR[B1RDF] or PnPSR[B1ROE] is
set.
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13.5.10 Periodic Status Registers (P0PSR–P3PSR)
All bits in these registers are read only and are set on hardware or software reset.
PnPSR are 16-bit registers containing the interrupt status information for the B- and D-channel transmit
and receive registers for each of the four ports on the MCF5272.
15 12 11 10 9 8 7 6 5 4 3 2 1 0
P0PSR–3 — DTUE B2TUE B1TUE DROE B2ROE B1ROE DTDE B2TDE B1TDE DRDF B2RDE B1RDF
Reset 0000_0000_0000_0000
R/W Read Only
Addr MBAR + 0x384 (P0PSR); 0x386 (P1PSR); 0x388 (P2PSR); 0x38A (P3PSR)
Figure 13-22. Periodic Status Registers (P0PSR–P3PSR)
Table 13-5. P0PSR–P3PSR Field Descriptions
Bits Name Description
15–12 — Reserved, should be cleared.
11 DTUE D data transmit underrun error. This bit is set when the data in the PLTD transmit data register for the
respective port was transferred to the transmit shadow register, which was already empty indicated by
DTDE. DTUE is automatically cleared, when the PnPSR register has been read by the CPU.
10 B2TUE B2 data transmit underrun error. This bit is set when the data in the PnB2TR transmit data register for
the respective port was transferred to the transmit shadow register, which was already empty indicated
by B2TDE. B2TUE is automatically cleared when the PnPSR register has been read by the CPU.
9 B1TUE B1 data transmit underrun error. This bit is set when the data in the PnB1TR transmit data register for
the respective port was transferred to the transmit shadow register, which was already empty indicated
by B1TDE. B1TUE is automatically cleared when the PnPSR register has been read by the CPU.
8 DROE D-Channel data receive overrun error. This bit is set when the data in the D receive shadow register
for the respective port has been transferred to the receive data register PnDRR, which was already full
indicated by DRDF. DROE is automatically cleared when the PnPSR register has been read by the
CPU.
7 B2ROE B2 data receive overrun error. This bit is set when the data in the B2 receive shadow register for the
respective port has been transferred to the receive data register PnB2RR, which was already full
indicated by B2RDF. B2ROE is automatically cleared when the PnPSR register has been read by the
CPU.
6 B1ROE B1 data receive overrun error. This bit is set when the data in the B1 receive shadow register for the
respective port has been transferred to the receive data register PnB1RR, which was already full
indicated by B1RDF. B1ROE is automatically cleared when the PnPSR register has been read by the
CPU. Note: Overrun and Underrun conditions are caused by the B and/or D-channel receive or
transmit data registers not being read or written prior to a 2-KHz super frame arriving.
5 DTDE D data transmit data empty. This bit is set when the data in the PLTD transmit data register for the
respective port has been transferred to the transmit shadow register. This bit is cleared when the CPU
writes data to PLTD.
4 B2TDE B2 data transmit data empty. This bit is set when the data in the PnB2TR transmit data register for the
respective port has been transferred to the transmit shadow register. This bit is cleared when the CPU
writes data to PnB2TR.
3 B1TDE B1 data transmit data empty. This bit is set when the data in the PnB1TR transmit data register for the
respective port has been transferred to the transmit shadow register. This bit is cleared when the CPU
writes data to PnB1TR.
Physical Layer Interface Controller (PLIC)
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Freescale Semiconductor 13-23
13.5.11 Aperiodic Status Register (PASR)
All bits in this register are read only and are set on hardware or software reset.
The PASR register is a 16-bit register containing the aperiodic interrupt status information for the C/I and
monitor channel transmit and receive registers for all four ports on the MCF5272. An aperiodic interrupt
condition remains asserted as long as any one of the bits within the PASR register is set.
2 DRDF D receive data full. This bit indicates that the D receive data register for the respective port is full.
DRDF is cleared when the CPU reads the receive data register PnDRR.
1 B2RDF B2 receive data full. This bit indicates that the B2 receive data register for the respective port is full.
B2RDF is cleared when the CPU reads the receive data register PnB2RR.
0 B1RDF B1 receive data full. This bit indicates that the B1 receive data register for the respective port is full.
B1RDF is cleared when the CPU reads the receive data register PnB2RR.
1514131211109876543210
Field GCR
3
GCT
3
GMR
3
GMT
3
GCR
2
GCT
2
GMR
2
GMT
2
GCR
1
GCT
1
GMR
1
GMT
1
GCR
0
GCT
0
GMR
0
GMT
0
Reset 0000_0000_0000_0000
R/W Read Only
Addr MBAR + 0x38C
Figure 13-23. Aperiodic Status Register (PASR)
Table 13-6. PASR Field Descriptions
Bits Name Description
15, 11, 7, 3 GCRnGCI C/I received. When set, this bit indicates that valid new data has been written to a GCI C/I
receive register. An interrupt is queued when this bit is set if the GCR interrupt enable bit has
been set in the corresponding PnICR register. The GCR bit and associated interrupt are
automatically cleared when the corresponding PnGCIR register has been read by the CPU.
14, 10, 6, 2 GCTnGCI C/I transmitted. When set, this bit indicates that a C/I register is empty. An interrupt is
queued when this bit is set if the GCT interrupt enable bit has been set in the corresponding
PnICR register. The GCT bit and associated interrupt are automatically cleared when the
PGCITSR register has been read by the CPU.
13, 9, 5, 1 GMRnGCI monitor received. When set, this bit indicates that data has been written to a monitor
channel receive register. An interrupt is queued when this bit is set if the GMR interrupt enable
bit has been set in the corresponding PnICR register. The GMR bit and associated interrupt are
automatically cleared when the corresponding PnGMR register has been read by the CPU.
12, 8, 4, 0 GMTnGCI monitor transmitted. When set, this bit indicates that the monitor channel transmit register
is empty. An interrupt is queued when this bit is set if the GMT interrupt enable bit has been set
in the corresponding PnICR register. The GMT bit and associated interrupt are automatically
cleared when the PGMTS register has been read by the CPU.
Table 13-5. P0PSR–P3PSR Field Descriptions
Bits Name Description
Physical Layer Interface Controller (PLIC)
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13-24 Freescale Semiconductor
13.5.12 GCI Monitor Channel Receive Registers (P0GMR–P3GMR)
All bits in these registers are read only and are initialized to 0x00FF on hardware or software reset.
PnGMR are 16-bit registers containing the received monitor channel bits for each of the four receive ports
on the MCF5272.
A byte of monitor channel data received on a certain port is put into an associated register using the format
shown in Figure 13-24. A maskable interrupt is generated when a byte is written into any of these four
registers.
15 11 10 9 8 7 0
Field — EOM AB MC M
Reset 0000_0000_1111_1111
R/W Read Only
Addr MBAR + 0x360 (P0GMR); 0x362 (P1GMR); 0x364 (P2GMR); 0x366 (P3GMR)
Figure 13-24. GCI Monitor Channel Receive Registers (P0GMR–P3GMR)
Table 13-7. P0GMR–P3GMR Field Descriptions
Bits Name Description
15–11 — Reserved, should be cleared.
10 EOM End of message.
0 Default at reset.
1 Indicates to the CPU that an end-of-message condition has been recognized on the E bit. EOM is
automatically cleared when the PnGMR register has been read by the CPU.
9 AB Abort.
0 Default at reset.
1 Indicates that the GCI controller has recognized an abort condition and is acknowledging the abort.
It is automatically cleared by the CPU when the PnGMR register has been read.
8 MC Monitor change.
0 Default at reset.
1 Indicates to the CPU that the monitor channel data byte written to the respective PnGMR register
has changed and that the data is available for processing. Automatically cleared by the CPU when
the PnGMR register has been read. Clearing this bit by reading this register also clears the
aperiodic GMR interrupt.
7–0 M Monitor channel data byte.
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 13-25
13.5.13 GCI Monitor Channel Transmit Registers (P0GMT–P3GMT)
All bits in these registers are read/write and are cleared on hardware or software reset.
The PnGMT registers are 16 bit register containing the control and monitor channel bits to be transmitted
for each of the four ports on the MCF5272.
A byte of monitor channel data to be transmitted on a certain port is put into an associated register using
the format shown in Figure 13-25. A maskable interrupt is generated when this byte of data has been
successfully transmitted.
15 10 9 8 7 0
Field — L R M
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x368 (P0GMT); 0x36A (P1GMT); 0x36C (P2GMT); 0x36E (P3GMT)
Figure 13-25. GCI Monitor Channel Transmit Registers (P0GMT–P3GMT)
Table 13-8. P0GMT–P3GMT Field Descriptions
Bits Name Description
15–10 — Reserved, should be cleared.
9LLast.
0 Default reset value
1 Set by the CPU. Indicates to the monitor channel controller to transmit the end of message signal on the
E bit. Both PnGMT[L] and PnGMT[R] must be set for the monitor channel controller to send the end of
message signal. PnGMT[M7:0] are ignored and 0xFF is sent with the end of message condition
necessitating sending the monitor channel information using PnGMT[R] to control the monitor channel
transmitter, followed at the end of the frame by setting PnGMT[L] and PnGMT[R]. The L bit is automatically
cleared by the GCI controller.
8 R Ready.
0 Default reset value.
1 Set by the CPU. Indicate to the monitor channel controller that a byte of data is ready for transmission.
Automatically cleared by the GCI controller when it generates a transmit acknowledge (ACK bit in PGMTS
register) or when the L bit is reset.
7–0 M Monitor channel data byte. Written by the CPU when a byte is ready for transmission.
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13.5.14 GCI Monitor Channel Transmit Abort Register (PGMTA)
All bits in this register are read/write and are cleared on hardware or software reset.
The PGMTA register contains the abort control bits for each of the four ports on the MCF5272 for the
transmit monitor channel.
76543 0
Field AR3 AR2 AR1 AR0 —
Reset 0000_0000
R/W Read/Write
Addr MBAR + 0x372
Figure 13-26. GCI Monitor Channel Transmit Abort Register (PGMTA)
Table 13-9. PGMTA Field Descriptions
Bits Name Description
7 AR3 Abort request, port 3.
0 Default reset value.
1 Set by the CPU, this bit causes the monitor channel controller to transmit the end of message signal on the
E bit. Automatically cleared by the monitor channel controller on receiving an abort, that is, when PGMTS[AB]
is set.
6 AR2 Abort request, port 2. See AR3.
5 AR1 Abort request, port 1. See AR3.
4 AR0 Abort request, port 0. See AR3.
3–0 — Reserved, should be cleared.
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Freescale Semiconductor 13-27
13.5.15 GCI Monitor Channel Transmit Status Register (PGMTS)
All bits in this register are read only and are cleared on hardware or software reset.
The PGMTS register contains the monitor channel status bits for each of the four transmit ports on the
MCF5272.
76543210
Field ACK3 ACK2 ACK1 ACK0 AB3 AB2 AB1 AB0
Reset 0000_0000
R/W Read Only
Addr MBAR + 0x371
Figure 13-27. GCI Monitor Channel Transmit Status Register (PGMTS)
Table 13-10. PGMTS Field Descriptions
Bits Name Description
7 ACK3 Acknowledge, port 3.
0 Default reset value.
1 Indicates to the CPU that the GCI controller has transmitted the previous monitor channel information.
Automatically cleared by the CPU reading the register. The clearing of this bit by reading this register also
clears the aperiodic GMT interrupt.
6 ACK2 Acknowledge, port 2. See ACK3.
5 ACK1 Acknowledge, port 1. See ACK3.
4 ACK0 Acknowledge, port 0. See ACK3.
3 AB3 Abort, port 3.
0 Default reset value.
1 Indicates to the CPU that the GCI controller has aborted the current message. This bit is automatically
cleared by the CPU reading the register. When the GCI controller sets this bit, it also clears the AR bit in the
PGMTA register, the ACK bit in the GMTS register, and the L and R bits in the PnGMT register.
2 AB2 Abort, port 2. See AB3.
1 AB1 Abort, port 1. See AB3.
0 AB0 Abort, port 0. See AB3.
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13.5.16 GCI C/I Channel Receive Registers (P0GCIR–P3GCIR)
All bits in these registers are read only and are cleared on hardware or software reset.
The PnGCIR registers contain the received C/I bits for one of each of the four ports on the MCF5272.
31 29 28 27 26 25 24 23 21 20 19 18 17 16
Field — F C3C2C1C0 — F C3C2C1C0
Chan P0GCIR P1GCIR
Reset 0000_0000_0000_0000
R/W Read Only
15 13 12 11 10 9 8 7 5 4 3 2 1 0
Field — F C3C2C1C0 — F C3C2C1C0
Chan P2GCIR P3GCIR
Reset 0000_0000_0000_0000
R/W Read Only
Addr MBAR + 0x374 (P0GCIR), 0x375 (P1GCIR), 0x376 (P2GCIR), 0x377 (P3GCIR)
Figure 13-28. GCI C/I Channel Receive Registers (P0GCIR–P3GCIR)
Table 13-11. P0GCIR–P3GCIR Field Descriptions
Bits Name Description
31–29, 23–21,
15–13, 7–5
— Reserved, should be cleared.
28, 20, 12, 4 F Full. This bit is set by the C/I channel controller to indicate to the CPU that new C/I channel data
has been received and is available for processing. It is automatically cleared by a CPU read. The
clearing of this bit by reading this register also clears the aperiodic GCR interrupt.
27–24, 19–16,
11–8, 3–0
C3–C0 C/I bits. These four bits are received on the GCI or SCIT channel 0. When a change in the C/I data
value is received in two successive frames, it is interpreted as being valid and is passed on to the
CPU, via this register. A maskable interrupt is generated when data is written into any of the four
available positions.
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Freescale Semiconductor 13-29
13.5.17 GCI C/I Channel Transmit Registers (P0GCIT–P3GCIT)
All bits in these registers are read/write and are cleared on hardware or software reset.
The PnGCIT registers are 8-bit registers containing the monitor channel bits to be transmitte d for each of
the four ports on the MCF5272.
31 29 28 27 26 25 24 23 21 20 19 18 17 16
Field — R C3C2C1C0 — R C3C2C1C0
Chan P0GCIT P1GCIT
Reset 0000_0000_0000_0000
R/W Read/Write
15 13 12 11 10 9 8 7 5 4 3 2 1 0
Field — R C3C2C1C0 — R C3C2C1C0
Chan P2GCIT P3GCIT
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x378 (P0GCIT), 0x379 (P1GCIT), 0x37A (P3GCIT), 0x37B (P4GCIT)
Figure 13-29. GCI C/I Channel Transmit Registers (P0GCIT–P3GCIT)
Table 13-12. P0GCIT–P3GCIT Field Descriptions
Bits Name Description
31–29, 23–21,
15–13, 7–5
— Reserved, should be cleared.
28, 20, 12, 4 R Ready. This bit is set, by the CPU to indicate to the C/I channel controller that data is ready for
transmission. The transition of this bit from a 0 to a 1 starts the C/I state machine which responds
with the ACK bit once transmission of two successive C/I words is complete. This bit is
automatically cleared by the GCI controller when it generates a transmit acknowledge (ACK bit in
PGCITSR register). The clearing of this bit by reading this register also clears the aperiodic GCT
interrupt.
27–24, 19–16,
11–8, 3–0
C3–C0 C/I bits. The CPU writes C/I data to be transmitted, on the GCI or SCIT channel 0, into these
positions. The CPU must ensure that this data is not overwritten before it has been transmitted the
required minimum amount of times, that is, so any change is detected and confirmed by a receiver.
A maskable interrupt is generated when this data has been successfully transmitted
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13.5.18 GCI C/I Channel Transmit Status Register (PGCITSR)
All bits in this register are read only and are cleared on hardware or software reset.
The PGCITSR register is an 8-bit register containing the C/I channel status bits for each of the four
transmit ports on the MCF5272.
7 43210
Field — ACK3 ACK2 ACK1 ACK0
Reset 0000_0000
R/W Read Only
Addr MBAR + 0x37F
Figure 13-30. GCI C/I Channel Transmit Status Register (PGCITSR)
Table 13-13. PGCITSR Field Descriptions
Bits Name Description
7–4 — Reserved, should be cleared.
3 ACK3 Acknowledge, port 3.
0 Default reset value.
1 Set by the C/I channel controller to indicate that the previous C/I data has been transmitted in
two successive C/I words. The ACK bit is automatically cleared by the CPU when the PGCITSR
register has been read.
2 ACK2 Acknowledge, port 2. See ACK3.
1 ACK1 Acknowledge, port 1. See ACK3.
0 ACK0 Acknowledge, port 0. See ACK3.
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 13-31
13.5.19 D-Channel Status Register (PDCSR)
All bits in this register are read only and are cleared on hardware or software reset. The register is also
cleared after a read operation.
The PDCSR register contains the D-channel status bits for all four ports on the MCF5272.
76543210
Field — DG1 DG0 DC3 DC2 DC1 DC0
Reset 0000_0000
R/W Read Only
Addr MBAR + 0x383
Figure 13-31. D-Channel Status Register (PDCSR)
Table 13-14. PDCSR Field Descriptions
Bits Name Description
7–6 — Reserved, should be cleared.
5 DG1 D-channel grant, port 1.
0 Default reset value.
1 In IDL mode, indicates the status of DGRANT. When the external DGNT has a logic 1, the
corresponding DG1/DG0 bit is set. In GCI mode, DG1 and DG0 reflects the inverted value of the
SCIT bit. The significance of this bit is the same in IDL or GCI mode, that is, in IDL mode when the
DG bit is set, the D channel is granted. In GCI mode when the DG bit is set, this corresponds to the
GO condition. In both cases the D channel is granted and communication may commence.
4 DG0 D-channel grant, port 0. See DG1.
3 DC3 D-channel change, port 3.
0 Default reset value.
1 Indicates that a value other than 0xFF (all ones) exists the D-channel receive register.
2 DC2 D-channel change, port 2. See DC3.
1 DC1 D-channel change, port 1. See DC3.
0 DC0 D-channel change, port 0. See DC3.
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13.5.20 D-Channel Request Register (PDRQR)
All bits in this read/write register are cleared on hardware or software reset.
The PDRQR register contains D-channel control bits for all four ports on the MCF5272.
15 12 11 10 9 8 7 2 1 0
Field — SHDD(1) DCNTI(1) SHDD(0) DCNTI(0) — DRQ
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x392
Figure 13-32. D-Channel Request Registers (PDRQR)
Table 13-15. PDRQR Field Descriptions
Bits Name Description
15–12 — Reserved, should be cleared.
11, 9 SHDD D-channel shift direction.
0 D-channel data is msb first. The first bit received is assumed to be the most significant bit and is
loaded into the msb position of the D-channel receive register for the respective port. SHDD(1)
configures the shift direction for ports 1, 2 and 3, SHDD(0) configures the shift direction for port 0.
1 D-channel data is lsb first for the D channel. The first bit received is assumed to be the least
significant bit and is loaded into the lsb position of the D-channel receive register for the
respective port.
10, 8 DCNTI D-channel control ignore. Allows the D-Channel contention function to be ignored.
00 contention active on both ports
01 ignore contention on port 0
10 ignore contention on port 1
11 ignore contention on both ports
7–2 — Reserved, should be cleared.
1–0 DRQ The value written to these bits is driven onto the DREQ pins associated with port 0 and port 1. When
set, a logic high, 1, is driven on to the corresponding pin.
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Freescale Semiconductor 13-33
13.5.21 Sync Delay Registers (P0SDR–P3SDR)
All bits in these registers are read/write and are cleared on hardware or software reset.
The PnSDR registers contain the frame sync delay bits for each of the four ports on the MCF5272.
NOTE
If a sync delay value of 0 is specified, that is, PnSDR[SD] = 0x000, then the
programmable delay block is transparent. When bypassed, the input frame
sync passes directly to the output, making the frame-sync-width function
defined by PnSDR[FSW] unavailable.
The 8-bit frame-sync-width should not be confused with long frame sync
mode. The PLIC only supports short frame sync in IDL8 and IDL10 bit
modes for interfacing to external transceivers.
15 14 13 10 9 0
Field FSW1 FSW0 — SD
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x394 (P0SDR); 0x396 (P1SDR); 0x398 (P2SDR); 0x39A (P3SDR)
Figure 13-33. Sync Delay Registers (P0SDR–P3SDR)
Table 13-16. P0SDR–P3SDR Field Descriptions
Bits Name Description
15–14 FSW[1–0] Frame sync width. Sets the width, in clock cycles, of the output frame sync pulse.
00 Frame sync width = 1
01 Frame sync width = 2
10 Frame sync width = 8
11 Frame sync width = 16
13–10 — Reserved, should be cleared.
9–0 SD Sync delay. Range: 0–1023. Sets the delay, in DCL clock cycles, for DFSC3–DFSC0. The delay period
should be doubled in GCI mode because GCI has two clock cycles per data bit. See Section 13.3, “PLIC
Timing Generator,” for further information.
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13-34 Freescale Semiconductor
13.5.22 Clock Select Register (PCSR)
All bits in this register are read/write and are cleared on hardware or software reset.
PCSR controls the PLIC clock generation block. Please refer to Section 13.3, “PLIC Ti ming Generator,”
for certain restrictions on the use of the clock generation block.
15 14 8 7 6 5 3 2 0
Field NBP — CKI FDIV CMULT
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x39E
Figure 13-34. Clock Select Register (PCSR)
Table 13-17. PCSR Field Descriptions
Bits Name Description
15 NBP Non-bypass mode select for the clock generation module.
0 The clock generation module is bypassed. Gen_FSC and GDCL are connected to FSC0 and
DCL0.
1 Selects non-bypassed mode. Gen_FSC and GDCL are synthesized from the incoming FSC0
or DCL0.
14–8 — Reserved, should be cleared.
7–6 CKI Clock select Input. Selects the source clock for the clock generation block.
00 DCL0
01 FSC0
1xReserved
5–3 FDIV FSC divide. Sets the divide ratio between GDCL and Gen_FSC.
000 ÷4
001 ÷8
010 ÷16
011 ÷32
100 ÷64
101 ÷128
110 ÷192
111 ÷256
2–0 CMULT Clock multiplication ratio. Sets the ratio of the reference clock frequency to the GDCL frequency.
000 x 2
001 x 4
010 x 8
011 x 16
100 x 32
101 x 64
110 x 128
111 x 256
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Freescale Semiconductor 13-35
13.6 Application Examples
This section provides examples for applications.
13.6.1 Introduction
The following section describes the initialization of the PLIC ports and gives three application examples
demonstrating the connection of multiple transceivers or CODECs to the PLIC module.
13.6.2 PLIC Initialization
The ports on the PLIC module of the MCF5272 require a number of registers to be configured after
power-on reset and prior to use. The following are the steps necessary for initializing the ports.
The port configuration registers, PnCR, and the interrupt configuration register, PnICR, must be initialized
before using any port.
13.6.2.1 Port Configuration Example
• Specify which ports are active.
• Specify the operational modes, IDL8, IDL10, and so on, for the active ports, PnCR[M].
• If GCI mode is specified in PnCR[M], select whether GCI SCIT mode is to be used, PnCR[G/S]
• If port 1 is used, program whether the 2-KHz frame interrupt is to be derived from port 0 or port 1,
PnCR[FSM].
• If port 1 is used, program whether it receives as inputs DCL and FSC or whether it drives these
signals as outputs.
• If the port is in GCI mode, the PnCR[ACT] bit may be set if GCI Activation should be requested.
• If port 3 is used, program the PnCR[DMX] bit if this port is routed through physical interface 3
(DIN3/DOUT3).
• Program the shift direction for the B1 and B2 channels, PnCR[SHB1–SHB2], to specify msb or lsb
first.
• Program PnCR[ENB1–ENB2] to specify whether B1 or B2 is enabled at initialization.
The following example shows a basic configuration of port 1, assuming the following:
• Port 1 is active as slave using IDL10 mode
• 2-KHz frame interrupt derived from port 1
• msb first on B1 and B2
• B1 and B2 disabled.
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Figure 13-35. Port 1 Configuration Register (P1CR)
The programming of the P1CR register in the above example is achieved with the following ColdFire code
sequence assuming the equates and init sections include the following:
equates and init:
...
Module_Regs_Addr EQU 0x00300000 ;address of on-chip registers
P1CR EQU 0x352 ;offset of P1CR register
P1ICR EQU 0x35A
...
move.l #Module_Regs_Addr, A5 ;reference register from A5
...
move.w #0x9200,d0 ;port 1 config ON, IDL10, SLAVE, port1 FSM
;msb first on B1 and B2, B1 and B2 disabled
move.w d0,P1CR(A5) ;write to P1CR register
The above code segment is an example only.
FSM (port 1 Only)
SCIT MODE (GCI ONLY)
SLAVE MODE
IDL10 MODE
Reserved
Port on
Reserved
B2 msb First
B1 msb First
B2 Disabled
B1 Disabled
1514131211109876543210
P1CR1001001000000000
0x9200
GCI ACT (GCI ONLY)
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13.6.2.2 Interrupt Configuration Example
The PnICR registers should be configured according to the specific interrupts, periodic and aperiodic,
required for each port. In addition, the port interrupt enable, (PnICR[IE]) should be set for each active port
prior to receiving interrupts.
Assuming port 1 is configured as in the above example then the following configuration would enable
periodic interrupts on port 1 with only the D channel active.
Figure 13-36. Port 1 Interrupt Configuration Register (P1ICR)
The programming of the P1ICR in the above example is achieved with the following ColdFire code
sequence assuming the equates and init sections as in the previous P1CR example:
...
move.w #0x8024,d0 ; port 1 IE and D-channel interrupts enabled
move.w d0,P1ICR(A5) ; write value to PnICR
...
GCI only
Port 0 only
IE enabled
Reserved
DTIE enabled
B2TIE disabled
DRIE enabled
B2RIE disabled
1514131211109876543210
P1ICR1000000000100100
0x8024
B1RIE disabled
B1TIE disabled
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13.6.3 Example 1: ISDN SOHO PBX with Ports 0, 1, 2, and 3
In this example, all four ports are used to connect an external transceiver and six CODECs. Port 0 and
port 1 are programmed in slave mode. An external transceiver , MC145574, is connected to port 0. Port 1,
2, and 3 are used to connect up to six external PCM CODECs.
Figure 13-37. ISDN SOHO PABX Example
In the previous example, Freescale’s MC14LC5480 CODECs and MC145574 S/T transceiver are shown.
The S/T transceiver in this example is connected to port 0 and the FSC0 frame sync signal is used
exclusively for synchronizing the data on the transceiver’s IDL interface. CODECs 1 and 2 are connected
to frame sync 1, FSC1. CODECs 3 and 4 are connected to DFSC2 which is the output of programmable
Din1
Dout1
FSC1
DCL1
MC145574
MC14LC5480
CODEC 4
CODEC5
Interface 1
DFSC2
DFSC3
CODEC6
Tx
DT
DT
DT
DT
Rx
DR
DR
DR
DR
CODEC 3
MC14LC5480
MC14LC5480
MC14LC5480
BCLKT
BCLKT
BCLKT
BCLKT
FST
FST
FST
FST
IDL SYNC
IDL CLK
FSR
FSR
GND
GND
Din0
Dout0
FSC0
DCL0
Interface 0
MC14LC5480
CODEC 2
DT
DT
DR
DR
CODEC 1
MC14LC5480
BCLKT
BCLKT
FST
FST
FSR
FSR
GND
Vdd
DGrant
DRequest
DGNT0
DREQ0
MCF5272
BCLKR
Vdd
BCLKR
BCLKR
Vdd
FSR
Vdd
BCLKR
BCLKR
Vdd
FSR
Vdd
BCLKR
Physical Layer Interface Controller (PLIC)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 13-39
delay 2. Programmable delay 2 generates a delayed frame sync with reference to FSC1. Similarly
CODECs 5 and 6 are connected to DFSC3 which is the output of programmable delay 3. Programmable
delay 3 generates a delayed frame sync also with reference to FSC1. The MC14LC5480 CODECs, when
in IDL mode, may be programmed using the FSR pin, to select whether the CODEC is receiving and
transmitting on the B1 or the B2 time slot. See the MC14LC5480 data sheet for further information.
Figure 13-38 shows the IDL bus timing relationship of the CODECs and MC145574 transceiver when in
standard IDL2 10-bit mode with a common frame sync.
Figure 13-38. Standard IDL2 10-Bit Mode
The S/T transceiver is connected to port 0, Din0/Dout0. The DCL and FSC generated from the S/T
transceiver are connected to DCL0, FSC0, and also feed port 1, DCL1, and FSC1 because port 1 is
synchronized to these S/T generated timing signals. The six CODECs are connected to Din1 and Dout1.
To provide six discrete 64-Kbps channels on the port 1 IDL interface, the delayed frame syncs are
programmed to synchronize the CODECs on non-overlapping time slots. CODEC 1 transmits and receives
in the B1 time slot. CODEC 2 transmits and receives in the B2 time slot, which starts 10 DCL cycles later ,
and so on for the other CODECs. CODECs 3 and 4 are synchronized to DFSC2 which is generated 20 DCL
cycles after FSC1 by loading the programmable delay 2 register with 0x0014. The DFSC3 signal
synchronizes CODECs 5 and 6. DFSC3 is generated 40 DCL cycles after FSC1 by loading the
programmable delay 3 register with 0x0028.
Only the port 0 D-channel is used in this example; DREQ0 and DGNT0 are connected to the S/T
transceiver.
The GCI mode of operation is analogous. In GCI mode, port 0 can be configured to support the SCIT
channel.
B1 B2
MC145574
B4 B5 B6
CODEC 1 CODEC 2 CODEC 3 CODEC 4
DCL
FSC1
DFSC2
DFSC3
Din1/
Dout1
FSC0
B1 B2 D
Din0/
Dout0
CODEC5 CODEC6
B3
D
Physical Layer Interface Controller (PLIC)
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13-40 Freescale Semiconductor
13.6.4 Example 2: ISDN SOHO PBX with Ports 1, 2, and 3
In this example, port 0 is not used. The port 0 pins are multiplexed with UAR T0 and in this example, port 0
is used to connect to an external transceiver to provide an RS232 interface. Port 1 is programmed in slave
mode and an external U (or S/T) transceiver is connected to port 1. Port 2 and port 3 are used to connect
up to four external PCM CODECs.
Figure 13-39. ISDN SOHO PABX Example
In the above example, Freescale’s MC14LC5480 CODECs and MC145572 U transceiver are shown. The
U transceiver in this example is connected to port 1 and the FSC1 frame sync signal is used exclusively
for synchronizing the data on the U transceiver’ s IDL interface. CODECs 1 and 2 are connected to delayed
frame sync 2, DFSC2, which is the output of programmable delay 2. Programmable delay 2 generates a
delayed frame sync with reference to FSC1. Similarly CODECs 3 and 4 are connected to DFSC3 which is
the output of programmable delay 3. Programmable delay 3 generates a delayed frame sync also with
reference to FSC1. The MC14LC5480 CODECs, when in IDL mode, may be programmed using the FSR
pin to select whether the CODEC is receiving and transmitting on the B1 or the B2 time slot (see
MC14LC5480 data sheet for further information).
Figure 13-40 shows the IDL bus timing relationship of the CODECs and U transceiver when in standard
IDL2 10-bit mode with a common frame sync.
UART0
Din1
Dout1
FSC1
DCL1
MC145572
MC14LC5480
CODEC 2
CODEC 3
Interface1
DFSC2
DFSC3
CODEC 4
Tx
DT
DT
DT
DT
Rx
DR
DR
DR
DR
CODEC 1
MC14LC5480
MC14LC5480
MC14LC5480
BCLKT
BCLKT
BCLKT
BCLKT
FST
FST
FST
FST
IDL SYNC
IDL CLK
MCF5272
FSR
GND
BCLKR
Vdd
FSR
GND
BCLKR
Vdd
FSR
Vdd
BCLKR
RS232
Transceiver
FSR
Vdd
BCLKR
Physical Layer Interface Controller (PLIC)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 13-41
Figure 13-40. Standard IDL2 10-Bit Mode
In the above example, CODEC 1 transmits and receives in the B3 time slot once the U transceiver has
completed the D channel. From the rising edge of FSC1, this is at least 19 DCL clocks later. In
Figure 13-40, a short, optional delay, is shown between the end of the D channel and the start of the B3
channel. For example, let us say this is 1 DCL clocks long. This defines the programmable delay 1 value
to be 20, (19 + 1), or 0x0014. The DFSC3 signal synchronizes CODECs 3 and 4, and the rising edge of
this frame sync occurs 20 clocks after DFSC2, therefore 40 DCL clocks after FSC1. This defines the value
for programmable delay 3 to be 40, (19 + 1 + 20), or 0x0028.
13.6.5 Example 3: Two-Line Remote Access with Ports 0 and 1
In this example, ports 0 and 1 are connected to two S/T transceivers. Ports 0 and 1 are programmed in
slave mode. Ports 2 and 3 are not used, and may be disabled.
Figure 13-41. Two-Line Remote Access
B1 B2
D
U Transceiver
B3 B4 B5 B6
CODEC 1 CODEC 2 CODEC 3 CODEC 4
DCL
FSC1
DFSC2
DFSC3
Din1/
Dout1 D
MC145574 #1
Interface 1
Tx
Rx
IDL SYNC
IDL CLK
Din0
Dout0
FSC0
DCL0
Interface 0
DGrant
DRequest
DGNT0
DREQ0
Din1
Dout1
FSC1
DCL1
DGNT1
DREQ1
Tx
Rx
IDL SYNC
IDL CLK
DGrant
DRequest
MC145574 #2
MCF5272
Physical Layer Interface Controller (PLIC)
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13-42 Freescale Semiconductor
Two of Freescale’s MC145574 S/T transceivers are shown connected to ports 0 and 1. The frame sync
control signal FSC0 is connected to S/T transceiver one, while FSC1 is connected to transceiver two.
Figure 13-42 shows an example of the IDL bus timing relationship of the S/T transceivers when in
standard IDL2 8-bit mode with a common frame sync.
Figure 13-42. Standard IDL2 8-Bit Mode
B1 B2 D
MC145574 #1
DCL
FSC0
FSC1
Din0/
Din1/
Dout1
Dout0 B1 B2 D
MC145574 #2
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Freescale Semiconductor 14-1
Chapter 14
Queued Serial Peripheral Interface (QSPI) Module
This chapter describes the queued serial peripheral interface (QSPI) module. Following a feature-set
overview is a description of operation including details of the QSPI’s internal RAM organization. The
chapter concludes with the programming model and a timing diagram.
14.1 Overview
The queued serial peripheral interface module provides a serial peripheral interface with queued transfer
capability. It allows users to enqueue up to 16 transfers at once, eliminating CPU intervention between
transfers. Transfer RAMs in the QSPI are indirectly accessible using address and data registers.
Functionality is very similar, but not identical, to the QSPI portion of the QSM (queued serial module)
implemented in the MC68332.
14.2 Features
• Programmable queue to support up to 16 transfers without user intervention
• Supports transfer sizes of 8 to 16 bits in 1-bit increments
• Four peripheral chip-select lines for control of up to 15 devices
• Baud rates from 129.4 Kbps to 16.5 Mbps at 66 MHz
• Programmable delays before and after transfers
• Programmable clock phase and polarity
• Supports wraparound mode for continuous transfers
14.3 Module Description
The QSPI module communicates with the integrated ColdFire CPU using internal memory mapped
registers located starting at MBAR + 0xA0. See also Section 14.5, “Programming Model.” A block
diagram of the QSPI module is shown in Figure 14-1.
Queued Serial Peripheral Interface (QSPI) Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
14-2 Freescale Semiconductor
Figure 14-1. QSPI Block Diagram
Queue Control
Block
Queue
Pointer
CLKIN
4
Done
Comparator
End Queue
Pointer
Status
Regs
Delay
Counter
Control Logic
Control
Regs
80-Byte
QSPI
RAM
Chip
Select
Command
Divide by 2 Baud Rate
Generator
MSBit LSBit
Logic
Array
QSPI_CLK
QSPI_CS[3:0]
QSPI_Din
8/16 Bit Shift Reg.
Rx/Tx Data Reg.
QSPI_Dout
4
4
4
Internal Bus
4
QSPI
Address
Register
QSPI
Data
Register
Queued Serial Peripheral Interface (QSPI) Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 14-3
14.3.1 Interface and Pins
The module provides as many as 15 ports and a total of seven signals: QSPI_Dout, QSPI_Din, QSPI_CLK,
QSPI_CS0, QSPI_CS1, QSPI_CS2, and QSPI_CS3.
Peripheral chip-select signals, QSPI_CS[0:3], are used to select an external device as the source or
destination for serial data transfer. Signals are asserted at a logic level corresponding to the value of the
QSPI_CS[3:0] bits in the command RAM whenever a command in the queue is executed. More than one
chip-select signal can be asserted simultaneously.
Although QSPI_CS[0:3] will function as simple chip selects in most applications, up to 15 ports can be
selected by decoding them with an external 4-to-16 decoder.
Note that chip selects QSPI_CS[3:1] are multiplexed with other pin functions. QSPI_Dout, QSPI_CLK,
and QSPI_CS0 are multiplexed with MCF5272 configuration inputs that only function during system
reset.
14.3.2 Internal Bus Interface
Because the QSPI module only operates in master mode, the master bit in the QSPI mode register
(QMR[MSTR]) must be set for the QSPI to function properly. The QSPI can initiate serial transfers but
cannot respond to transfers initiated by other QSPI masters.
14.4 Operation
The QSPI uses a dedicated 80-byte block of static RAM accessible both to the module and the CPU to
perform queued operations. The RAM is divided into three segments as follows:
• 16 command control bytes (command RAM)
• 16 transmit data words, (transfer RAM)
• 16 receive data words (transfer RAM)
RAM is organized so that 1 byte of command control data, 1 word of transmit data, and 1 word of receive
data comprise 1 queue entry, 0x0–0xF.
The user initiates QSPI operation by loading a queue of commands in command RAM, writing transmit
data into transmit RAM, and then enabling the QSPI data transfer. The QSPI executes the queued
commands and sets the completion flag in the QSPI interrupt register (QIR[SPIF]) to signal their
completion. Optionally, QIR[SPIFE] can be enabled to generate an interrupt.
Table 14-1. QSPI Input and Output Signals and Functions
Signal Name Hi-Z or Actively Driven Function
QSPI Data Output (QSPI_Dout) Configurable Serial data output from QSPI
QSPI Data Input (QSPI_Din) N/A Serial data input to QSPI
Serial Clock (QSPI_CLK) Actively driven Clock output from QSPI
Peripheral Chip Selects (QSPI_CS[3:0]) Actively driven Peripheral selects
Queued Serial Peripheral Interface (QSPI) Module
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14-4 Freescale Semiconductor
The QSPI uses four queue pointers. The user can access three of them through fields in QSPI wrap register
(QWR):
• The new queue pointer, QWR[NEWQP], points to the first command in the queue.
• An internal queue pointer points to the command currently being executed.
• The completed queue pointer, QWR[CPTQP], points to the last command executed.
• The end queue pointer, QWR[ENDQP], points to the final command in the queue.
The internal pointer is initialized to the same value as QWR[NEWQP]. During normal operation, the
following sequence repeats:
1. The command pointed to by the internal pointer is executed.
2. The value in the internal pointer is copied into QWR[CPTQP].
3. The internal pointer is incremented.
Execution continues at the internal pointer address unless the QWR[NEWQP] value is changed. After each
command is executed, QWR[ENDQP] and QWR[CPTQP] are compared. When a match occurs,
QIR[SPIF] is set and the QSPI stops unless wraparound mode is enabled. Setting QWR[WREN] enables
wraparound mode.
QWR[NEWQP] is cleared at reset. When the QSPI is enabled, execution begins at address 0x0 unless
another value has been written into QWR[NEWQP]. QWR[ENDQP] is clea red at reset but is changed to
show the last queue entry before the QSPI is enabled. QWR[NEWQP] and QWR[ENDQP] can be written
at any time. When the QWR[NEWQP] value changes, the internal pointer value also changes unless a
transfer is in progress, in which case the transfer completes normally. Leaving QWR[NEWQP] and
QWR[ENDQP] set to 0x0 causes a single transfer to occur when the QSPI is enabled.
Data is transferred relative to QSPI_CLK which can be generated in any one of four combinations of phase
and polarity using QMR[CPHA, CPOL]. Data is transferred most significant bit (msb) first. The number
of bits transferred defaults to eight, but can be set to any value from 8 to 16 by writing a value into the
BITSE field of the command RAM, QCR[BITSE] .
14.4.1 QSPI RAM
The QSPI contains an 80-byte block of static RAM that can be accessed by both the user and the QSPI.
This RAM does not appear in the MCF5272 memory map because it can only be accessed by the user
indirectly through the QSPI address register (QAR) and the QSPI data register (QDR). The RAM is
divided into three segments with 16 addresses each:
• receive data RAM, the initial destination for all incoming data
• transmit data RAM, a buffer for all out-bound data
• command RAM, where commands are loaded
The transmit and command RAM are write-only by the user. The receive RAM is read-only by the user.
Figure 14-2 shows the RAM configuration. The RAM contents are undefined immediately after a reset.
The command and data RAM in the QSPI is indirectly accessible with QDR and QAR as 48 separate
locations that comprise 16 words of transmit data, 16 words of receive data and 16 bytes of commands.
Queued Serial Peripheral Interface (QSPI) Module
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Freescale Semiconductor 14-5
A write to QDR causes data to be written to the RAM entry specified by QAR[ADDR] and causes the
value in QAR to increment. Correspondingly, a read at QDR returns the data in the RAM at the address
specified by QAR[ADDR]. This also causes QAR to increment. A read access requires a single wait s tate.
14.4.1.1 Receive RAM
Data received by the QSPI is stored in the receive RAM segment located at 0x10 to 0x1F in the QSPI RAM
space. The user reads this segment to retrieve data from the QSPI. Data words with less than 16 bits are
stored in the least significant bits of the RAM. Unused bits in a receive queue entry are set to zero upon
completion of the individual queue entry.
NOTE
Throughout ColdFire documentation, ‘word’ is used consistently and
exclusively to designate a 16-bit data unit. The only exceptions to this
appear in discussions of serial communication modules such as QSPI that
support variable-length data units. To simplify these discussions the
functional unit is referred to as a ‘word’ regardless of length.
QWR[CPTQP] shows which queue entries have been executed. The user can query this field to determine
which locations in receive RAM contain valid data.
Relative
Address Register Function
0x00 QTR0 Transmit RAM
0x01 QTR1
. . 16 bits wide
..
..
0x0F QTR15
0x10 QRR0 Receive RAM
0x11 QRR1
. . 16 bits wide
..
..
0x1F QRR15
0x20 QCR0 Command RAM
0x21 QCR1
. . 8 bits wide
..
..
0x2F QCR15
Figure 14-2. QSPI RAM Model
Queued Serial Peripheral Interface (QSPI) Module
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14-6 Freescale Semiconductor
14.4.1.2 Transmit RAM
Data to be transmitted by the QSPI is stored in the transmit RAM segment located at addresses 0x0 to 0xF.
The user normally writes 1 word into this segment for each queue command to be executed. The user
cannot read transmit RAM.
Out-bound data must be written to transmit RAM in a right-justified format. The unused bits are ignored.
The QSPI copies the data to its data serializer (shift register) for transmission. The data is transmitted most
significant bit first and remains in transmit RAM until overwritten by the user.
14.4.1.3 Command RAM
The CPU writes one byte of control information to this segment for each QSPI command to be executed.
Command RAM is write-only memory from a user’s perspective.
Command RAM consists of 16 bytes with each byte divided into two fields. The peripheral chip select
field controls the QSPI_CS signal levels for the transfer. The command control field provides transfer
options.
A maximum of 16 commands can be in the queue. Queue execution proceeds from the address in
QWR[NEWQP] through the address in QWR[ENDQP].
The QSPI executes a queue of commands defined by the control bits in each command RAM entry which
sequence the following actions:
• chip-select pins are activated
• data is transmitted from transmit RAM and received into the receive RAM
• the synchronous transfer clock QSPI_CLK is generated
Before any data transfers begin, control data must be written to the command RAM, and any out-bound
data must be written to transmit RAM. Also, the queue pointers must be initialized to the first and last
entries in the command queue.
Data transfer is synchronized with the internally generated QSPI_CLK, whose phase and polarity are
controlled by QMR[CPHA] and QMR[CPOL]. These control bits determine which QSPI_CLK edge is
used to drive outgoing data and to latch incoming data.
14.4.2 Baud Rate Selection
The maximum QSPI clock frequency is one-fourth the clock frequency applied at the CLKIN pin. Baud
rate is selected by writing a value from 2–255 into QMR[BAUD]. The QSPI uses a prescaler to derive the
QSPI_CLK rate from the system clock, CLKIN, divided by two.
A baud rate value of zero turns off the QSPI_CLK. The desired QSPI_CLK baud rate is related to CLKIN
and QMR[BAUD] by the following expression:
QMR[BAUD] = CLKIN / [2 ×(desired QSPI_CLK baud rate)]
Queued Serial Peripheral Interface (QSPI) Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 14-7
14.4.3 Transfer Delays
The QSPI supports programmable delays for the QSPI_CS signals before and after a transfer. The time
between QSPI_CS assertion and the leading QSPI_CLK edge, and the time between the end of one transfer
and the beginning of the next, are both independently programmable.
The chip select to clock delay enable (DSCK) bit in command RAM, QCR[DSCK], enables the
programmable delay period from QSPI_CS assertion until the leading edge of QSPI_CLK. QDLYR[QCD]
determines the period of delay before the leading edge of QSPI_CLK. The following expression
determines the actual delay before the QSPI_CLK leading edge:
QSPI_CS-to-QSPI_CLK delay = QCD/CLKIN frequency
QCD has a range of 1–127.
When QCD or DSCK equals zero, the standard delay of one-half the QSPI_CLK period is used.
The delay after transmit enable (DT) bit in command RAM enables the programmable delay period from
the negation of the QSPI_CS signals until the start of the next transfer . The delay after transfer can be used
to provide a peripheral deselect interval. A delay can also be inserted between consecutive transfers to
allow serial A/D converters to complete conversion. There are two transfer delay options: the user can
choose to delay a standard period after serial transfer is complete or can specify a delay period. Writing a
value to QDLYR[DTL] specifies a delay period. The DT bit in command RAM determines whether the
standard delay period (DT = 0) or the specified delay period (DT = 1) is used. The following expression
is used to calculate the delay:
Delay after transfer = 32 ×QDLYR[DTL] /CLKIN frequency (DT = 1)
where QDLYR[DTL] has a range of 1–255.
A zero value for DTL causes a delay-after-transfer value of 8192/CLKIN frequency.
Standard delay after transfer = 17/CLKIN frequency (DT = 0)
Receiving devices need at least the standard delay (DT=0) between successive transfers for long data
streams because the QSPI module requires time to load a transmit RAM entry for transfer. If CLKIN is
operating at a slower rate, the delay between transfers must be increased proportionately.
Table 14-2. QSPI_CLK Frequency as Function of CPU Clock and Baud Rate
QMR [BAUD]
CPU Clock
66 MHz 48 MHz 33 MHz 20 MHz
2 16,500,000 12,000,000 8,250,000 5,000,000
4 8,250,000 6,000,000 4,125,000 2,500,000
8 4,125,000 3,000,000 2,062,500 1,250,000
16 2,062,500 1,500,000 1,031,250 625,000
32 1,031,250 750,000 515,625 312,500
255 129,412 94,118 64,706 39,216
Queued Serial Peripheral Interface (QSPI) Module
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14-8 Freescale Semiconductor
14.4.4 Transfer Length
There are two transfer length options. The user can choose a default value of 8 bits or a programmed value
of 8 to 16 bits inclusive. The programmed value must be written into QMR[BITS]. The bits per transfer
enable (BITSE) field in the command RAM determines whether the default value (BITSE = 0) or the
BITS[3–0] value (BITSE = 1) is used. QMR[BITS] gives the required number of bits to be transferred,
with 0b0000 representing 16.
14.4.5 Data Transfer
Operation is initiated by setting QDLYR[SPE]. Shortly after QDLYR[SPE] is set, the QSPI executes the
command at the command RAM address pointed to by QWR[NEWQP]. Data at the pointer address in
transmit RAM is loaded into the data serializer and transmitted. Data that is simultaneously received is
stored at the pointer address in receive RAM.
When the proper number of bits has been transferred, the QSPI stores the working queue pointer value in
QWR[CPTQP], increments the working queue pointer, and loads the next data for transfer from the
transmit RAM. The command pointed to by the incremented working queue pointer is executed next
unless a new value has been written to QWR[NEWQP]. If a new queue pointer value is written while a
transfer is in progress, then that transfer is completed normally.
When the CONT bit in the command RAM is set, the QSPI_CS signals are asserted between transfers.
When CONT is cleared, QSPI_CS[0:3] are negated between transfers. The QSPI_CS signals are not high
impedance.
When the QSPI reaches the end of the queue, it asserts the SPIF flag, QIR[SPIF]. If QIR[SPIFE] is set, an
interrupt request is generated when QIR[SPIF] is asserted. Then the QSPI clears QDLYR[SPE] and stops,
unless wraparound mode is enabled.
Wraparound mode is enabled by setting QWR[WREN]. The queue can wrap to pointer address 0x0, or to
the address specified by QWR[NEWQP], depending on the state of QWR[WRTO].
In wraparound mode, the QSPI cycles through the queue continuously, even while requesting interrupt
service. QDLYR[SPE] is not cleared when the last command in the queue is executed. New receive data
overwrites previously received data in the receive RAM. Each time the end of the queue is reached,
QIR[SPIFE] is set. QIR[SPIF] is not automatically reset. If interrupt driven QSPI service is used, the
service routine must clear QIR[SPIF] to abort the current request. Additional interrupt requests during
servicing can be prevented by clearing QIR[SPIFE].
There are two recommended methods of exiting wraparound mode: clearing QWR[WREN] or setting
QWR[HAL T]. Exiting wraparound mode by clearing QDLYR[SPE] is not recommended because this may
abort a serial transfer in progress. The QSPI sets SPIF, clears QDLYR[SPE], and stops the first time it
reaches the end of the queue after QWR[WREN] is cleared. After QWR[HALT] is set, the QSPI finishes
the current transfer, then stops executing commands. After the QSPI stops, QDLYR[SPE] can be cleared.
Queued Serial Peripheral Interface (QSPI) Module
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Freescale Semiconductor 14-9
14.5 Programming Model
The programming model for the QSPI consists of six registers. They are the QSPI mode register (QMR),
QSPI delay register (QDLYR), QSPI wrap register (QWR), QSPI interrupt register (QIR), QSPI address
register (QAR), and the QSPI data register (QDR).
There are a total of 80 bytes of memory used for transmit, receive, and control data. This memory is
accessed indirectly using QAR and QDR.
Registers and RAM are written and read by the CPU.
14.5.1 QSPI Mode Register (QMR)
The QMR register, shown in Figure 14-3, determines the basic operating modes of the QSPI module.
Parameters such as clock polarity and phase, baud rate, master mode operation, and transfer size are
determined by this register. The data output high impedance enable, DOHIE, controls the operation of
QSPI_Dout between data transfers. When DOHIE is cleared, QSPI_Dout is actively driven between
transfers. When DOHIE is set, QSPI_Dout assumes a high impedance state.
NOTE
Because the QSPI does not operate in slave mode , the master mode enable
bit, QMR[MSTR], must be set for the QSPI module to operate correctly.
Table 14-3 gives QMR field descriptions.
15 14 13 10 9 8 7 0
Field MSTR DOHIE BITS CPOL CPHA BAUD
Reset 0000_0001_0000_0100
R/W R/W
Address MBAR + 0x00A0
Figure 14-3. QSPI Mode Register (QMR)
Table 14-3. QMR Field Descriptions
Bits Name Description
15 MSTR Master mode enable.
0 Reserved, do not use.
1 The QSPI is in master mode. Must be set for the QSPI module to operate correctly.
14 DOHIE Data output high impedance enable. Selects QSPI_Dout mode of operation.
0 Default value after reset. QSPI_Dout is actively driven between transfers.
1 QSPI_Dout is high impedance between transfers.
Queued Serial Peripheral Interface (QSPI) Module
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14-10 Freescale Semiconductor
Figure 14-4 shows an example of a QSPI clocking and data transfer.
Figure 14-4. QSPI Clocking and Data Transfer Example
13–10 BITS Transfer size. Determines the number of bits to be transferred for each entry in the queue.
Value Bits per transfer
0000 16
0001– 0111 Reserved
1000 8
1001 9
1010 10
1011 11
1100 12
1101 13
1110 14
1111 15
9 CPOL Clock polarity. Defines the clock polarity of SCK.
0 The inactive state value of QSPI_CLK is logic level 0.
1 The inactive state value of QSPI_CLK is logic level 1.
8 CPHA Clock phase. Defines the QSPI_CLK clock-phase.
0 Data captured on the leading edge of QSPI_CLK and changed on the following edge of QSPI_CLK.
1 Data changed on the leading edge of QSPI_CLK and captured on the following edge of QSPI_CLK.
7–0 BAUD Baud rate divider. The baud rate is selected by writing 0, or a value in the range 2–255. 1 is not a valid
value. A value of zero disables the QSPI. The desired QSPI_CLK baud rate is related to CLKIN and
QMR[BAUD] by the following expression:
QMR[BAUD] = SystemClock / [2 ×(desired QSPI_CLK baud rate)]
Table 14-3. QMR Field Descriptions (continued)
Bits Name Description
QSPI_CLK
QSPI_Dout
QSPI_Din
QSPI_CS
AB
QMR[CPOL] = 0
QMR[CPHA] = 1
QCR[CONT] = 0
Chip selects are active low
A = QDLYR[QCD]
B = QDLYR[DTL]
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
msb
Queued Serial Peripheral Interface (QSPI) Module
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Freescale Semiconductor 14-11
Figure 14-5 shows the timing of the four SPI modes.
Figure 14-5. SPI Modes Timing
14.5.2 QSPI Delay Register (QDLYR)
Figure 14-6 shows the QSPI delay register.
Table 14-4 gives QDLYR field descriptions.
Table 14-4. QDLYR Field Descriptions
15 14 8 7 0
Field SPE QCD DTL
Reset 0000_0100_0000_0100
R/W R/W
Address MBAR + 0x00A4
Figure 14-6. QSPI Delay Register (QDLYR)
Bits Name Description
15 SPE QSPI enable. When set, the QSPI initiates transfers in master mode by executing commands in the
command RAM. Automatically cleared by the QSPI when a transfer completes.The user can also clear this
bit to abort transfer unless QIR[ABRTL] is set. The recommended method for aborting transfers is to set
QWR[HALT].
14–8 QCD QSPILCK Delay. When the DSCK bit in the command RAM, is set this field determines the length of the
delay from assertion of the chip selects to valid QSPI_CLK transition.
7–0 DTL Delay after transfer.When the DT bit in the command RAM sets this field determines the length of delay
after the serial transfer.
SCK
SCK
SCK
SCK
(CPOL = 0, CPHA = 0)
(CPOL = 0, CPHA = 1)
(CPOL = 1, CPHA = 0)
(CPOL = 1, CPHA = 1)
Queued Serial Peripheral Interface (QSPI) Module
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14-12 Freescale Semiconductor
14.5.3 QSPI Wrap Register (QWR)
Table 14-5 gives QWR field descriptions.
15 14 13 12 11 8 7 4 3 0
Field HALT WREN WRTO CSIV ENDQP –NEWQP
Reset 0000_0000_0000_0000
R/W R/W
Address MBAR + 0x00A8
Figure 14-7. QSPI Wrap Register (QWR)
Table 14-5. QWR Field Descriptions
Bits Name Description
15 HALT Halt transfers. Assertion of this bit causes the QSPI to stop execution of commands once it has
completed execution of the current command.
14 WREN Wraparound enable. Enables wraparound mode.
0 Execution stops after executing the command pointed to by QWR[ENDQP].
1 After executing command pointed to by QWR[ENDQP], wrap back to entry zero, or the entry pointed
to by QWR[NEWQP] and continue execution.
13 WRTO Wraparound location. Determines where the QSPI wraps to in wraparound mode.
0 Wrap to RAM entry zero.
1 Wrap to RAM entry pointed to by QWR[NEWQP].
12 CSIV QSPI_CS inactive level.
0 QSPI chip select outputs return to zero when not driven from the value in the current command RAM
entry during a transfer (that is, inactive state is 0, chip selects are active high).
1 QSPI chip select outputs return to one when not driven from the value in the current command RAM
entry during a transfer (that is, inactive state is 1, chip selects are active low).
11–8 ENDQP End of queue pointer. Points to the RAM entry that contains the last transfer description in the queue.
7–4 CPTQP Completed queue entry pointer. Points to the RAM entry that contains the last command to have been
completed. This field is read only.
3–0 NEWQP Start of queue pointer. This 4-bit field points to the first entry in the RAM to be executed on initiating a
transfer.
Queued Serial Peripheral Interface (QSPI) Module
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Freescale Semiconductor 14-13
14.5.4 QSPI Interrupt Register (QIR)
Figure 14-8 shows the QSPI interrupt register.
Table 14-6 describes QIR fields.
The command and data RAM in the QSPI is indirectly accessible with QDR and QAR as 48 separate
locations that comprise 16 words of transmit data, 16 words of receive data and 16 bytes of commands.
A write to QDR causes data to be written to the RAM entry specified by QAR[ADDR]. This also causes
the value in QAR to increment.
15 14 13 12 11 10 9 8 7 4 3 2 1 0
Field WCEFB ABRTB — ABRTL WCEFE ABRTE — SPIFE — WCEF ABRT — SPIF
Reset 0000_0000_0000_0000
R/W R/W
Address MBAR + 0x00AC
Figure 14-8. QSPI Interrupt Register (QIR)
Table 14-6. QIR Field Descriptions
BIts Name Description
15 WCEFB Write collision access error enable. A write collision occurs during a data transfer when the RAM entry
containing the command currently being executed is written to by the CPU with the QDR. When this bit
is asserted, the write access to QDR results in an access error.
14 ABRTB Abort access error enable. An abort occurs when QDLYR[SPE] is cleared during a transfer. When set,
an attempt to clear QDLYR[SPE] during a transfer results in an access error.
13 — Reserved, should be cleared.
12 ABRTL Abort lock-out. When set, QDLYR[SPE] cannot be cleared by writing to the QDLYR. QDLYR[SPE] is only
cleared by the QSPI when a transfer completes.
11 WCEFE Write collision interrupt enable. Interrupt enable for WCEF. Setting this bit enables the interrupt, and
clearing it disables the interrupt.
10 ABRTE Abort interrupt enable. Interrupt enable for ABRT flag. Setting this bit enables the interrupt, and clearing
it disables the interrupt.
9 — Reserved, should be cleared.
8 SPIFE QSPI finished interrupt enable. Interrupt enable for SPIF. Setting this bit enables the interrupt, and
clearing it disables the interrupt.
7–4 — Reserved, should be cleared.
3 WCEF Write collision error flag. Indicates that an attempt has been made to write to the RAM entry that is
currently being executed. Writing a 1 to this bit clears it and writing 0 has no effect.
2 ABRT Abort flag. Indicates that QDLYR[SPE] has been cleared by the user writing to the QDLYR rather than
by completion of the command queue by the QSPI. Writing a 1 to this bit clears it and writing 0 has no
effect.
1 — Reserved, should be cleared.
0 SPIF QSPI finished flag. Asserted when the QSPI has completed all the commands in the queue. Set on
completion of the command pointed to by QWR[ENDQP], and on completion of the current command
after assertion of QWR[HALT]. In wraparound mode, this bit is set every time the command pointed to
by QWR[ENDQP] is completed. Writing a 1 to this bit clears it and writing 0 has no effect.
Queued Serial Peripheral Interface (QSPI) Module
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14-14 Freescale Semiconductor
Correspondingly, a read at QDR returns the data in the RAM at the address specified by QAR[ADDR].
This also causes QAR to increment. A read access requires a single wait state.
NOTE
The QAR does not wrap after the last queue entry within each section of the
RAM.
14.5.5 QSPI Address Register (QAR)
The QAR, shown in Figure 14-9, is used to specify the location in the QSPI RAM that read and write
operations affect.
14.5.6 QSPI Data Register (QDR)
The QDR, shown in Figure 14-10, is used to access QSPI RAM indirectly. The CPU reads and writes all
data from and to the QSPI RAM through this register. A read or write to QDR causes the value in QAR to
increment.
15 65 0
Field — ADDR
Reset 0000_0000_0000_0000
R/W R/W
Address MBAR + 0x00B0
Figure 14-9. QSPI Address Register
15 0
Field DATA
Reset 0000_0000_0000_0000
R/W R/W
Address MBAR + 0x00B4
Figure 14-10. QSPI Data Register
Queued Serial Peripheral Interface (QSPI) Module
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Freescale Semiconductor 14-15
14.5.7 Command RAM Registers (QCR0–QCR15)
The command RAM is accessed using the upper byte of QDR. The QSPI cannot modify information in
command RAM.
There are 16 bytes in the command RAM. Each byte is divided into two fields. The chip select field enables
external peripherals for transfer. The command field provides transfer operations.
NOTE
The command RAM is accessed only using the most significant byte of
QDR and indirect addressing based on QAR[ADDR].
Figure 14-11 shows the command RAM register.
15 14 13 12 11 8 7 0
Field CONT BITSE DT DSCK QSPI_CS –
Reset Undefined
R/W Write Only
Address QAR[ADDR]
Figure 14-11. Command RAM Registers (QCR0–QCR15)
Table 14-7 gives QCR field descriptions.
Table 14-7. QCR0–QCR15 Field Descriptions
Bits Name Description
15 CONT Continuous.
0 Chip selects return to inactive level defined by QWR[CSIV] when transfer is complete.
1 Chip selects remain asserted between transfers for a transfer of up to 16 words of data.1
1In order to keep the chip setects asserted for all transfers, the QWR[CSIV] bit must be set to control the level that the chip
selects return to after the first transfer.
14 BITSE Bits per transfer enable.
0 Eight bits
1 Number of bits set in QMR[BITS]
13 DT Delay after transfer enable.
0 Default reset value.
1 The QSPI provides a variable delay at the end of serial transfer to facilitate interfacing with
peripherals that have a latency requirement. The delay between transfers is determined by
QDLYR[DTL].
12 DSCK Chip select to QSPI_CLK delay enable.
0 Chip select valid to QSPI_CLK transition is one-half QSPI_CLK period.
1 QDLYR[QCD] specifies the delay from QSPI_CS valid to QSPI_CLK.
11–8 QSPI_CS Peripheral chip selects. Used to select an external device for serial data transfer. More than one
chip select may be active at once, and more than one device can be connected to each chip
select. Bits 11–8 map directly to QSPI_CS[3:0], respectively. If it is desired to use those bits as
a chip select value, then an external demultiplexor must be connected to the QSPI_CS[3:0] pins.
7–0 — Reserved, should be cleared.
Queued Serial Peripheral Interface (QSPI) Module
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14-16 Freescale Semiconductor
14.5.8 Programming Example
The following steps are necessary to set up the QSPI 12-bit data transfers and a QSPI_CLK of 4.125 MHz.
The QSPI RAM is set up for a queue of 16 transfers. All four QSPI_CS signals are used in this example.
1. Enable all QSPI_CS pins on the MCF5272. Write PACNT with 0x0080_4000 to enable QSPI_CS1
and QSPI_CS3.Write PDCNT with 0x0000_0030 to enable QSPI_CS2.
2. Wr ite the QMR with 0xB308 to set up 12-bit data words with the data shifted on the falling clock
edge, and a clock frequency of 4.125 MHz (assuming a 66-MHz CLKIN).
3. Write QDLYR with the desired delays.
4. Write QIR with 0xD00D to enable write collision, abort bus errors, and clear any interrupts.
5. Write QAR with 0x0020 to select the first command RAM entry.
6. Write QDR with 0x7E00, 0x7E00, 0x7E00, 0x7E00, 0x7D00, 0x7D00, 0x7D00, 0x7D00, 0x7B00,
0x7B00, 0x7B00, 0x7B00, 0x7700, 0x7700, 0x7700, and 0x7700 to set up four transfers for each
chip select. The chip selects are active low in this example.
7. Write QAR with 0x0000 to select the first transmit RAM entry.
8. Write QDR with sixteen 12-bit words of data.
9. Write QWR with 0x0F00 to set up a queue beginning at entry 0 and ending at entry 15.
10. Set QDLYR[SPE] to enable the transfers.
11. Wait until the transfers are complete. QIR[SPIF] is set when the transfers are complete.
12. Write QAR with 0x0010 to select the first receive RAM entry.
13. Read QDR to get the received data for each transfer.
14. Repeat steps 5 through 13 to do another transfer.
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Chapter 15
Timer Module
This chapter describes configuration and operation of the four general-purpose timer modules, timer 0, 1,
2 and 3.
15.1 Overview
The timer module has four identical general-purpose 16-bit timers and a software watchdog timer,
described in Chapter 6, “System Integration Module (SIM).”
Each general-purpose timer consists of a timer mode register (TMRn), a timer capture register (TCAPn),
a 16-bit timer counter (TCNn), a timer reference register (TRRn), and a timer event register (TERn). The
TMRs contain the prescaler value programmed by the user. The four timer units have the following
features:
• Maximum period of 4 seconds at 66 MHz
• 15-nS resolution at 66 MHz
• Programmable sources for the clock input, including external clock
• Input capture capability with programmable trigger edge on input pins
• Output compare with programmable mode for the output pins
• Free run and restart modes
15.2 Timer Operation
The timer units consist of four identical, independent 16-bit timers, timers 0–3. For timers 0 and 1, the
clock input to the prescaler is selected from the main clock (divided by 1 or 16) or from the corresponding
timer input (TIN0 or TIN1) pin. For timers 2 and 3, the clock input to the prescaler can be selected only
from the main clock (divided by 1 or 16). TIN is internally synchronized to the internal clock, with a
synchronization delay between two and three main clocks. The clock input source is selected by the CLK
bits of the corresponding timer mode register (TMR0–TMR3). The prescaler is programmed to divide the
clock input by values from 1 to 256. The output of the prescaler is used as an input to the 16-bit counter.
The maximum timer resolution is one system clock cycle (15 nS at 66 MHz). The maximum period (the
reference value is all ones) is 268,435,456 cycles = 24×28×216 (4 seconds at 66 MHz).
The timer can be configured to count until a reference is reached at which point it can either start a new
time count immediately or continue to run. The free run/restart bit, TMRn[FRR], selects each mode. Upon
reaching the reference value, the TER0 or TER1 bit is set, and an interrupt is issued if the output reference
interrupt enable bit, TMR[ORI], is set.
Timer Module
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15-2 Freescale Semiconductor
Figure 15-1. Timer Block Diagram
T i mers 0 and 1 may output a signal on the timer outputs (TOUT0 or T OUT 1) when the reference value is
reached, as selected by the output mode bit, TMR[OM]. This signal can be an active-low pulse or a toggle
of the current output, under program control.
The TCAPs are used to latch counter values when the corresponding input capture edge detector detects a
defined transition (of TIN0, TIN1, URT0_RxD, or URT1_RxD). The type of transition triggering the
capture is selected by the capture edge bits, TMR[CE].A capture or reference event sets the TER bit and
generates a maskable interrupt.
Data [16)
Timer
Clock
Generator
Divider
Timer Mode Register (TMR0)
Prescaler Mode Bits
Timer Counter (TCN0)
15 0
Timer Reference Register (TRR0)
15 0
Timer Capture Register (TCAP0)
15 0
15 0
Capture
Detection
System Clock or
System Clock/16
TIN0
TOUT0
Clock
Timer 0
Timer 1
Interrupt (T1)
Interrupt (T0)
TOUT1
TIN1
Timer
Clock
Generator
Divider
Timer Mode Register (TMR 2)
Prescaler Mode Bits
Timer Counter (TCN2)
15 0
Timer Reference Register (TRR2)
15 0
Timer Capture Register (TCAP2)
15 0
15 0
Capture
Detection
System Clock or
System Clock/16
UART0_RxD
Clock
Timer 2
Timer 3
Interrupt (T3)
Interrupt (T2)
UART1_RxD
Timer Event Register (TER0)
15 0
Timer Event Register (TER2)
15 0
Timer Module
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Freescale Semiconductor 15-3
15.3 General-Purpose Timer Registers
The following sections describe the timer registers.
15.3.1 Timer Mode Registers (TMR0–TMR3)
The TMRs, Table 15-2, have fields for choosing a prescaler, a clock edge, and other parameters.
TMRn fields are described in Table 15-1.
15 876543210
Field PRESCALER (PS) CE OM1ORI FRR CLK RST
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x200 (TMR0); 0x220 (TMR1); 0x240 (TMR2); 0x260 (TMR3)
1 Not implemented (reserved) in TMR2 and TMR3.
Figure 15-2. Timer Mode Registers (TMR0–TMR3)
Table 15-1. TMRn Field Descriptions
Bits Name Description
15–8 PS Prescaler. Programmed to divide the clock input by values from 1 to 256. The value 0000_0000 divides the
clock by 1; the value 1111_1111 divides the clock by 256.
7–6 CE Capture edge and enable interrupt.
00 Disable capture and interrupt on capture event
01 Capture on rising edge only and generate interrupt on capture event
10 Capture on falling edge only and generate interrupt on capture event
11 Capture on any edge and generate interrupt on capture event
5 OM Output mode (TMR0 and TMR1 only. Reserved in TMR2 and TMR3)
0 Active-low pulse for one system clock cycle (15 nS at 66 MHz)
1 Toggle output
TOUTn is high at reset but is unavailable externally until the appropriate port control register is configured for
this function. See Section 17.2, “Port Control Registers.”
4 ORI Output reference interrupt enable
0 Disable interrupt for reference reached (does not affect interrupt on capture function)
1 Enable interrupt upon reaching the reference value If ORI is 1 when the TER[REF] is set, an immediate
interrupt occurs.
3 FRR Free run/restart
0 Free run. Timer count continues to increment after the reference value is reached.
1 Restart. Timer count is reset immediately after the reference value is reached.
2–1 CLK Input clock source for the timer
00 Stop count
01 Master system clock
10 Master system clock divided by 16. TIN0 and TIN1 are external to the MCF5272 and are not synchronized
to the system clock, so successive timeout lengths may vary slightly.
11 Corresponding TIN pin, TIN0 or TIN1 (falling edge), unused in TMR2 and TMR3
The minimum high and low periods for TIN as the clock source is 1 system clock, which gives a maximum TIN
frequency of clock/2.
Timer Module
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15-4 Freescale Semiconductor
15.3.2 Timer Reference Registers (TRR0–TRR3)
Each TRR holds a 16-bit reference value that is compared with the free-running TCN as part of the output
compare function. A match occurs when TCN increments to equal TRR.
15.3.3 Timer Capture Registers (TCAP0–TCAP3)
Each TCAP is used to latch the TCN value during a capture operation when an edge occurs on the
respective TIN0, TIN1, UART0_RxD, or UART1_RxD, as programmed in TMRn.
15.3.4 Timer Counters (TCN0–TCN3)
TCN registers are 16-bit up counters. Reading a TCNn gives the current counter value without affecting
counting. A write cycle to a TCN register causes it to be cleared.
0 RST Reset timer.
0 A transition from 1 to 0 resets the timer. Other register values can be written. The counter/timer/prescaler
are not clocked unless the timer is enabled.
1 Enable timer
15 0
Field REF (16-bit reference value)
Reset 1111_1111_1111_1111
R/W Read/Write
Addr MBAR + 0x204 (TRR0); 0x224 (TRR1); 0x244 (TRR2); 0x264 (TRR3)
Figure 15-3. Timer Reference Registers (TRR0–TRR3)
15 0
Field CAP (16-bit capture counter value)
Reset 0000_0000_0000_0000
R/W Read Only
Addr MBAR + 0x208 (TCAP0); 0x228 (TCAP1); 0x248 (TCAP2); 0x268 (TCAP3)
Figure 15-4. Timer Capture Registers (TCAP0–TCAP3)
15 0
Field COUNT (16-bit timer counter value)
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x20C (TCN0); 0x22C (TCN1); 0x24C (TCN2); 0x26C (TCN3)
Figure 15-5. Timer Counter (TCN0–TCN3)
Table 15-1. TMRn Field Descriptions (continued)
Bits Name Description
Timer Module
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Freescale Semiconductor 15-5
15.3.5 Timer Event Registers (TER0–TER3)
TERs are used to report events recognized by the timer. On recognition of an event, the timer sets the
appropriate TERn bit, regardless of the corresponding interrupt enable bits (ORI and CE) in the TMRn.
Writing a 1 to a bit clears it; writing 0 has no effect. Both bits mus t be cleared before the timer can negate
the request to the interrupt controller. Both bits may be cleared simultaneously.
Table 15-2 describes TERn fields.
15 210
Field — REF CAP
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x210 (TER0); 0x230 (TER1); 0x250 (TER2); 0x270 (TER3)
Figure 15-6. Timer Event Registers (TER0–TER3)
Table 15-2. TERn Field Descriptions
Bits Name Description
15–2 — Reserved, should be cleared.
1 REF Output reference event.
0 The counter has not reached the TRR value
1 The counter reached the TRR value. TMR[ORI] is used to enable the interrupt request caused by this
event. Write a 1 to this bit to clear the event condition.
0 CAP Capture event.
0 The counter value has not been latched into the TCAP.
1 The counter value is latched in the TCAP. TMR[CE] is used to enable capture and the interrupt request
caused by this event. Write a 1 to this bit to clear the event condition.
Timer Module
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Freescale Semiconductor 16-1
Chapter 16
UART Modules
This chapter describes the use of the universal asynchronous/synchronous receiver/transmitters (UARTs)
implemented on the MCF5272 and includes programming examples. All references to UART refer to one
of these modules.
16.1 Overview
The MCF5272 contains two independent UARTs. Each UART can be clocked by either URT_CLK or
CLKIN, eliminating the need for an external crystal. As Figure 16-1 shows, each UAR T module interfaces
directly to the CPU and consists of the following:
• Serial communication channel
• Programmable transmitter and receiver clock generation
• Internal channel control logic
• Interrupt control logic
Figure 16-1. Simplified Block Diagram
The serial communication channel provides a full-duplex asynchronous/synchronous receiver and
transmitter deriving an operating frequency from CLKIN or an external clock of the correct frequency
(URT_CLK). The transmitter converts parallel data from the CPU to a serial bit stream, inserting
appropriate start, stop, and parity bits. It outputs the resulting stream on the channel transmitter serial data
output (TxD). See Section 16.5.2.1, “Transmitting.”
The receiver converts serial data from the channel receiver serial data input (RxD) to parallel format,
checks for a start, stop, and parity bits, or break conditions, and transfers the assembled character onto the
bus during read operations. The receiver may be polled- or interrupt-driven. See Section 16.5.2.2,
“Receiver.”
Serial
Interrupt Control
Logic or
Internal Channel
Control Logic
Programmable
Clock
Communications
Channel
Generation
System Integration
Module (SIM)
Interrupt
Controller
UART
CLKIN
URT_CTS
URT_RTS
URT_RxD
URT_TxD
External clock (URT_CLK)
UART Modules
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16-2 Freescale Semiconductor
16.2 Serial Module Overview
The MCF5272 contains two independent UART modules, whose features are as follows:
• Each clocked by either URT_CLK or CLKIN, eliminating a need for an external crystal
• Full-duplex asynchronous/synchronous receiver/transmitter channel
• 24-byte FIFO receiver
—CTS receiver FIFO control
— Receiver FIFO timeout
• 24-byte FIFO transmitter
• Independently programmable receiver and transmitter clock sources
• Programmable data format:
— 5–8 data bits plus parity
— Odd, even, no parity, or force parity
— One, one-and-a-half, or two stop bits
• Each channel programmable to normal (full-duplex), automatic echo, local loop-back, or remote
loop-back mode
• Automatic wake-up mode for multidrop applications
• Eight maskable interrupt conditions
• Parity, framing, and overrun error detection
• False-start bit detection
• Line-break detection and generation
• Detection of breaks originating in the middle of a character
• Start/end break interrupt/status
• Autobaud capability
The MCF5272 UART modules are identical to those on other ColdFire devices, such as the MCF5206e,
with the following exceptions:
• The MCF5272 receiver and transmitter FIFOs have been expanded to 24 bytes.
• Interrupts can be programmed to occur at various levels of FIFO fullness on both the receiver and
transmitter.
• Autobaud capability has been added to automatically calculate the character transmission rate from
the first received character.
• Registers have been added to increase accuracy in clock generation.
16.3 Register Descriptions
This section contains a detailed description of each register and its specific function. Flowcharts in
Section 16.5.6, “Programming,” describe basic UAR T module programming. The opera tion of the UAR T
module is controlled by writing control bytes into the appropriate registers. Table 16-1 is a memory map
for UART module registers.
UART Modules
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Freescale Semiconductor 16-3
Table 16-1. UART Module Programming Model
MBAR Offset
[31:24] [23:16] [15:8] [7:0]
UART0 UART1
0x100 0x140 UART mode
registers1—(UMR1n) [p.
16-4], (UMR2n) [p. 16-6]
—
0x104 0x144 (Read) UART status
registers—(USRn) [p. 16-7]
—
(Write) UART clock-select
register1—(UCSRn) [p. 16-8]
—
0x108 0x148 (Read) Do not access.2—
(Write) UART command
registers—(UCRn) [p. 16-9]
—
0x10C 0x14C (UART/Read) UART receiver
buffers—(URBn) [p. 16-10]
—
(UART/Write) UART
transmitter buffers—(UTBn)
[p. 16-11]
—
0x110 0x150 (Read) UART input port
change registers—(UIPCRn)
[p. 16-11]
—
(Write) UART auxiliary control
registers1—(UACRn) [p.
16-12]
—
0x114 0x154 (Read) UART interrupt status
registers—(UISRn) [p. 16-12]
—
(Write) UART interrupt mask
registers—(UIMRn) [p. 16-12]
—
0x118 0x158 (Read) Do not access.2—
UART divider upper
registers—(UDUn) [p. 16-14]
—
0x11C 0x15C (Read) Do not access.2—
UART divider lower
registers—(UDLn) [p. 16-14]
—
0x120 0x160 (Read) UART autobaud
register MSB—(UABUn) [p.
16-17]
—
(Write) Do not access.2—
0x124 0x164 (Read) UART autobaud
register LSB—(UABLn) [p.
16-17]
—
(Write) Do not access2—
0x128 0x168 UART Transmitter FIFO
registers—(UTFn) [p. 16-4]
—
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16-4 Freescale Semiconductor
NOTE
UART registers are accessible only as bytes.
16.3.1 UART Mode Registers 1 (UMR1n)
The UART mode registers 1 (UMR1n) control configuration. UMR1n can be read or written when the
mode register pointer points to it, at RESET or after a RESET MODE REGISTER POINTER command using
UCRn[MISC]. After UMR1n is read or written, the pointer points to UMR2n.
Table 16-2 describes UMR1n fields.
0x12C 0x16C UART Receiver FIFO
registers—(URFn) [p. 16-4]
—
0x130 0x170 UART Fractional Precision
Divider Control registers
(UFPDn) [p. 16-17]
—
0x134 0x174 (Read) UART input port
registers—(UIPn) [p. 16-17]
—
(Write) Do not access.2—
0x138 0x178 (Read) Do not access.2—
(Write) UART output port bit
set command
registers—(UOP1n3) [p.
16-18]
—
0x13C 0x17C (Read) Do not access.2—
(Write) UART output port bit
reset command
registers—(UOP0n3) [p.
16-18]
—
1UMR1n, UMR2n, and UCSRn should be changed only after the receiver/transmitter is issued a software reset command. That
is, if channel operation is not disabled, undesirable results may occur.
2This address is for factory testing. Reading this location results in undesired effects and possible incorrect transmission or
reception of characters. Register contents may also be changed.
3Address-triggered commands
7 6 543210
Field RxRTS RxIRQ/FFULL ERR PM PT B/C
Reset 0000_0000
R/W R/W
Address MBAR + 0x100 (UART0), 0x140 (UART1). After UMR1n is read or written, the pointer points to UMR2n.
Figure 16-2. UART Mode Registers 1 (UMR1n)
Table 16-1. UART Module Programming Model (continued)
MBAR Offset
[31:24] [23:16] [15:8] [7:0]
UART0 UART1
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Freescale Semiconductor 16-5
Table 16-2. UMR1n Field Descriptions
Bits Name Description
7 RxRTS Receiver request-to-send. Allows the RTS output to control the CTS input of the transmitting device to
prevent receiver overrun. If both the receiver and transmitter are incorrectly programmed for RTS control,
RTS control is disabled for both. Transmitter RTS control is configured in UMR2n[TxRTS].
0 The receiver has no effect on RTS.
1 When a valid start bit is received, RTS is negated if the UART's FIFO is full. RTS is reasserted when the
FIFO has an empty position available.
If RTS is controlled by the fill level of the receiver FIFO via UACRn[RTSL], this bit should be cleared.
6 RxIRQ/FF
ULL
Receiver interrupt select.
0 RxRDY is the source that generates IRQ.
1 FFULL is the source that generates IRQ.
If more detail on the status of the FIFO is required, UISRn{RxFIFO] indicates a change in the FIFO status
as programmed in URFn[RXS].
5 ERR Error mode. Configures the FIFO status bits, USRn[RB,FE,PE].
0 Character mode. The USRn values reflect the status of the character at the top of the FIFO. ERR must
be 0 for correct A/D flag information when in multidrop mode.
1 Block mode. The USRn values are the logical OR of the status for all characters reaching the top of the
FIFO because the last RESET ERROR STATUS command for the channel was issued. See Section 16.3.5,
“UART Command Registers (UCRn).”
4–3 PM Parity mode. Selects the parity or multidrop mode for the channel. The parity bit is added to the transmitted
character, and the receiver performs a parity check on incoming data. The value of PM affects PT, as shown
below.
2 PT Parity type. PM and PT together select parity type (PM = 0x) or determine whether a data or address
character is transmitted (PM = 11).
PM Parity Mode Parity Type (PT= 0) Parity Type (PT= 1)
00 With parity Even parity Odd parity
01 Force parity Low parity High parity
10 No parity n/a
11 Multidrop mode Data character Address character
1–0 B/C Bits per character. Select the number of data bits per character to be sent. The values shown do not include
start, parity, or stop bits.
00 5 bits
01 6 bits
10 7 bits
11 8 bits
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
16-6 Freescale Semiconductor
16.3.2 UART Mode Register 2 (UMR2n)
UART mode registers 2 (UMR2n) control UART module configuration. UMR2n can be read or written
when the mode register pointer points to it, which occurs after any access to UMR1n. UMR2n accesses do
not update the pointer.
Table 16-3 describes UMR2n fields.
76543 0
Field CM TxRTS TxCTS SB
Reset 0000_0000
R/W R/W
Address MBAR + 0x100, 0x140. After UMR1n is read or written, the pointer points to UMR2n.
Figure 16-3. UART Mode Register 2 (UMR2n)
Table 16-3. UMR2n Field Descriptions
Bits Name Description
7–6 CM Channel mode. Selects a channel mode. Section 16.5.3, “Looping Modes,” describes individual modes.
00 Normal
01 Automatic echo
10 Local loop-back
11 Remote loop-back
5 TxRTS Transmitter ready-to-send. Controls negation of RTS to automatically terminate a message transmission when
the transmitter is disabled after completion of a transmission. Attempting to program a receiver and transmitter
in the same channel for RTS control is not permitted and disables RTS control for both.
0 The transmitter has no effect on RTS.
1 When the transmitter is disabled after transmission completes, setting this bit automatically clears
UOP[RTS] one bit time after any characters in the channel transmitter shift and holding registers are
completely sent, including the programmed number of stop bits.
4 TxCTS Transmitter clear-to-send. If both TxCTS and TxRTS are enabled, TxCTS controls the operation of the
transmitter.
0 CTS has no effect on the transmitter.
1 Enables clear-to-send operation. The transmitter checks the state of CTS each time it is ready to send a
character. If CTS is asserted, the character is sent; if it is negated, the channel TxD remains in the high state
and transmission is delayed until CTS is asserted. Changes in CTS as a character is being sent do not affect
its transmission.
3–0 SB Stop-bit length control. Selects the length of the stop bit appended to the transmitted character. Stop-bit lengths
of 9/16th to 2 bits are programmable for 6–8 bit characters. Lengths of 1 1/16th to 2 bits are programmable for
5-bit characters. In all cases, the receiver checks only for a high condition at the center of the first stop-bit
position, that is, one bit time after the last data bit or after the parity bit, if parity is enabled. If an external 1x
clock is used for the transmitter, clearing bit 3 selects one stop bit and setting bit 3 selects 2 stop bits for
transmission.
SB 5 Bits 6–8 Bits SB 5 Bits 6–8 Bits SB 5–8 Bits SB 5–8 Bits
0000 1.063 0.563 0100 1.313 0.813 1000 1.563 1100 1.813
0001 1.125 0.625 0101 1.375 0.875 1001 1.625 1101 1.875
0010 1.188 0.688 0110 1.438 0.938 1010 1.688 1110 1.938
0011 1.250 0.750 0111 1.500 1.000 1011 1.750 1111 2.000
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-7
16.3.3 UART Status Registers (USRn)
The USRn, Figure 16-4, shows status of the transmitter, the receiver, and the FIFO.
Table 16-4 describes USRn fields.
76543210
Field RB FE PE OE TxEMP TxRDY FFULL RxRDY
Reset 0000_0000
R/W Read only
Address MBAR + 0x104 (USR0), 0x144 (USR1)
Figure 16-4. UART Status Registers (USRn)
Table 16-4. USRn Field Descriptions
Bits Name Description
7 RB Received break. The received break circuit detects breaks that originate in the middle of a received
character. However, a break in the middle of a character must persist until the end of the next detected
character time.
0 No break was received.
1 An all-zero character of the programmed length was received without a stop bit. RB is valid only when
RxRDY = 1. Only a single FIFO position is occupied when a break is received. Further entries to the FIFO
are inhibited until RxD returns to the high state for at least one-half bit time, which is equal to two
successive edges of the UART clock.
6 FE Framing error.
0 No framing error occurred.
1 No stop bit was detected when the corresponding data character in the FIFO was received. The stop-bit
check occurs in the middle of the first stop-bit position. FE is valid only when RxRDY = 1.
5 PE Parity error. Valid only if RxRDY = 1.
0 No parity error occurred.
1 If UMR1n[PM] = 0x (with parity or force parity), the corresponding character in the FIFO was received with
incorrect parity. If UMR1n[PM] = 11 (multidrop), PE stores the received A/D bit.
4 OE Overrun error. Indicates whether an overrun occurs.
0 No overrun occurred.
1 One or more characters in the received data stream have been lost. OE is set upon receipt of a new
character when the FIFO is full and a character is already in the shift register waiting for an empty FIFO
position. When this occurs, the character in the receiver shift register and its break detect, framing error
status, and parity error, if any, are lost. OE is cleared by the RESET ERROR STATUS command in UCRn.
3 TxEMP Transmitter empty.
0 The transmitter buffer is not empty. Either a character is being shifted out, or the transmitter is disabled.
The transmitter is enabled/disabled by programming UCRn[TC].
1 The transmitter has underrun (both the transmitter holding register and transmitter shift registers are
empty). This bit is set after transmission of the last stop bit of a character if there are no characters in the
transmitter holding register awaiting transmission.
2 TxRDY Transmitter ready.
0 The CPU loaded the transmitter holding register or the transmitter is disabled.
1 The transmitter holding register is empty and ready for a character. TxRDY is set when a character is sent
to the transmitter shift register and when the transmitter is first enabled. If the transmitter is disabled,
characters loaded into the transmitter holding register are not sent.
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16-8 Freescale Semiconductor
16.3.4 UART Clock-Select Registers (UCSRn)
The UART clock-select registers (UCSRn) select an external clock on the URT_CLK input (divided by 1
or 16) or a prescaled CLKIN as the clocking source for the transmitter and receiver. See Section 16.5.1,
“T ransmitter/Receiver Clock Source.” The transmitter and receiver can use different clock sources. T o use
CLKIN for both, set UCSRn to 0xDD.
Table 16-5 describes UCSRn fields.
1 FFULL FIFO full. This bit is equivalent to URF[FULL].
0 The FIFO is not full but may hold unread characters.
1 A character was received and the receiver FIFO is now full. Any characters received when the FIFO is full
are lost.
0 RxRDY Receiver ready
0 The CPU has read the receiver buffer and no characters remain in the FIFO after this read.
1 One or more characters were received and are waiting in the receiver buffer FIFO.
7430
Field RCS TCS
Reset 0000_0000
R/W Write only
Address MBAR + 0x104 (UCSR0), 0x144 (UCSR1)
Figure 16-5. UART Clock-Select Registers (UCSRn)
Table 16-5. UCSRn Field Descriptions
Bits Name Description
7–4 RCS Receiver clock select. Selects the clock source for the receiver channel.
1101 Prescaled CLKIN
1110 URT_CLK divided by 16
1111 URT_CLK
3–0 TCS Transmitter clock select. Selects the clock source for the transmitter channel.
1101 Prescaled CLKIN
1110 URT_CLK divided by 16
1111 URT_CLK
Table 16-4. USRn Field Descriptions (continued)
Bits Name Description
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Freescale Semiconductor 16-9
16.3.5 UART Command Registers (UCRn)
The UART command registers (UCRn), Figure 16-6, supply commands to the UART. Only multiple
commands that do not conflict can be specified in a single write to a UCRn. For example, RESET
TRANSMITTER and ENABLE TRANSMITTER cannot be specified in one write.
Table 16-6 describes UCRn fields and commands. Examples in Section 16.5.2, “T ransmitter and Receiver
Operating Modes,” show how these commands are used.
76 43210
Field ENAB MISC TC RC
Reset 0000_0000
R/W Write only
Address MBAR + 0x108, 0x148
Figure 16-6. UART Command Registers (UCRn)
Table 16-6. UCRn Field Descriptions
Bits Value Command Description
7 ENAB — Enable autobaud
0 Autobaud disabled.
1 Autobaud enabled. The transmission rate is calculated from the first received
character. If the rate must be recalculated, ENAB must first be cleared and reset.
UISRn[ABC] indicates a transmission rate has been calculated and loaded into the
UART divider registers. UDUn and UDULn must be initialized to 0x00 before enabling
autobaud.
6–4 MISC Field (This field selects a single command.)
000 no command —
001 reset mode register
pointer
Causes the mode register pointer to point to UMR1n.
010 reset receiver Immediately disables the receiver, clears USRn[FFULL,RxRDY], and reinitializes the
receiver FIFO pointer. No other registers are altered. Because it places the receiver in
a known state, use this command instead of RECEIVER DISABLE when reconfiguring the
receiver.
011 reset transmitter Disables the transmitter and clears USRn[TxEMP,TxRDY]. No other registers are
altered. Because it places the transmitter in a known state, use this command instead
of TRANSMITTER DISABLE when reconfiguring the transmitter.
100 reset error status Clears USRn[RB,FE,PE,OE]. Also used in block mode to clear all error bits after a data
block is received.
101 reset break– change
interrupt
Clears the delta break bit, UISRn[DB].
110 start break Forces TxD low. If the transmitter is empty, the break may be delayed up to one bit time.
If the transmitter is active, the break starts when character transmission completes. The
break is delayed until any character in the transmitter shift register is sent. Any character
in the transmitter holding register is sent after the break. The transmitter must be
enabled for the command to be accepted. This command ignores the state of CTS.
111 stop break Causes TxD to go high (mark) within two bit times. Any characters in the transmitter
buffer are sent.
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
16-10 Freescale Semiconductor
16.3.6 UART Receiver Buffers (URBn)
The receiver buffers contain one serial shift register and a 24-byte FIFO. RxD is connected to the serial
shift register. The CPU reads from the top of the stack while the receiver shifts and updates from the
bottom when the shift register is full (see Figure 16-24). RB contains the character in the receiver.
3–2 TC Field (This field selects a single command)
00 no action taken Causes the transmitter to stay in its current mode: if the transmitter is enabled, it
remains enabled; if the transmitter is disabled, it remains disabled.
01 transmitter enable Enables operation of the channel’s transmitter. USRn[TxEMP,TxRDY] are set. If the
transmitter is already enabled, this command has no effect.
10 transmitter disable Terminates transmitter operation and clears USRn[TxEMP,TxRDY]. If a character is
being sent when the transmitter is disabled, transmission completes before the
transmitter becomes inactive. If the transmitter is already disabled, the command has
no effect.
11 — Reserved, do not use.
1–0 RC (This field selects a single command)
00 no action taken Causes the receiver to stay in its current mode. If the receiver is enabled, it remains
enabled; if disabled, it remains disabled.
01 receiver enable If the UART module is not in multidrop mode (UMR1n[PM] ¦ 11), RECEIVER ENABLE
enables the channel's receiver and forces it into search-for-start-bit state. If the receiver
is already enabled, this command has no effect.
10 receiver disable Disables the receiver immediately. Any character being received is lost. The command
does not affect receiver status bits or other control registers. If the UART module is
programmed for local loop-back or multidrop mode, the receiver operates even though
this command is selected. If the receiver is already disabled, the command has no
effect.
11 — Reserved, do not use.
7 0
Field RB
Reset 0000_0000
R/W Read only
Address MBAR + 0x10C,0x14C
Figure 16-7. UART Receiver Buffer (URBn)
Table 16-6. UCRn Field Descriptions (continued)
Bits Value Command Description
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-11
16.3.7 UART Transmitter Buffers (UTBn)
The transmitter buffers consist of a 24-byte FIFO and the transmitter shift register. The FIFO accepts
characters from the bus master if the channel’s USRn[TxRDY] is set. A write to the transmitter buffer
clears TxRDY, inhibiting any more characters until the FIFO can accept more data. When the shift register
is empty, it checks if the holding register has a valid character to be sent (TxRDY = 0). If there is a valid
character , the shift register loads it and sets USRn[TxRDY] again. W rites to the transmitter buf fer have no
effect when the channel’s TxRDY = 0 and when the transmitter is disabled.
Figure 16-8 shows UTBn. TB contains the character in the transmitter buffer.
16.3.8 UART Input Port Change Registers (UIPCRn)
The input port change registers (UIPCRn), Figure 16-9, hold the current s tate and the change-of-state for
CTS.
Table 16-7 describes UIPCRn fields.
7 0
Field TB
Reset 0000_0000
R/W Write only
Address MBAR + 0x10C,0x14C
Figure 16-8. UART Transmitter Buffers (UTBn)
7 543 10
Field — COS 111 CTS
Reset 0000_011 CTS
R/W Read only
Address MBAR + 0x110 (UIPCR0), 0x150 (UIPCR1)
Figure 16-9. UART Input Port Change Registers (UIPCRn)
Table 16-7. UIPCRn Field Descriptions
Bits Name Description
7–5 — Reserved, should be cleared.
4 COS Change of state (high-to-low or low-to-high transition).
0 No change-of-state since the CPU last read UIPCRn. Reading UIPCRn clears UISRn[COS].
1 A change-of-state longer than 25–50 μs occurred on the CTS input. UACRn can be programmed to generate
an interrupt to the CPU when a change of state is detected.
3–1 — Reserved, should be cleared.
0 CTS Current state. Starting two serial clock periods after reset, CTS reflects the state of CTS. If CTS is detected
asserted at that time, COS is set, which initiates an interrupt if UACRn[IEC] is enabled.
0 The current state of the CTS input is asserted.
1 The current state of the CTS input is negated.
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
16-12 Freescale Semiconductor
16.3.9 UART Auxiliary Control Registers (UACRn)
The UAR T auxiliary control registers (UACRn), Figure 16-10, control the input enable as well as the R TS
control based on the receiver FIFO level.
Table 16-8 describes UACRn fields.
16.3.10 UART Interrupt Status/Mask Registers (UISRn/UIMRn)
The UART interrupt status registers (UISRn), Figure 16-11, provide status for all potential interrupt
sources. UISRn contents are masked by UIMRn. If corresponding UISRn and UIMRn bits are set, the
internal interrupt output is asserted. If a UIMRn bit is cleared, the state of the corresponding UISRn bit has
no effect on the output.
NOTE
T rue status is prov ided in the UISRn regardless of UIMRn settings. UISRn
is cleared when the UART module is reset.
73210
Field — RTSL IEC
Reset 0000_0000
R/W Write only
Address MBAR + 0x110 (UACR0), 0x150 (UACR1)
Figure 16-10. UART Auxiliary Control Registers (UACRn)
Table 16-8. UACRn Field Descriptions
Bits Name Description
7–3 — Reserved, should be cleared.
2–1 RTSL RTS level. Determines when RTS is negated by the receiver relative to the fullness of the receiver FIFO. Note
that RTS must first be manually asserted by a write to UOP0n.
00 FIFO level control disabled
01 Receiver FIFO Š 25% full
10 Receiver FIFO Š 50% full
11 Receiver FIFO Š 75% full
Receiver overrun can be prevented by using the RTS output to control the CTS input of the transmitting device.
Attempting to program a receiver and transmitter in the same channel for RTS control is not permitted and
disables RTS control for both.
0 IEC Input enable control.
0 Setting the corresponding UIPCRn bit has no effect on UISRn[COS].
1 UISRn[COS] is set and an interrupt is generated when the UIPCRn[COS] is set by an external transition on
the CTS input (if UIMRn[COS] = 1).
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-13
Table 16-9 describes UISRn and UIMRn fields.
76 32 1 0
Field COS ABC RXFIFO TXFIFO RXFTO DB FFULL/RxRDY TxRDY
Reset 0000_0000
R/W Read only for status, write only for mask.
Address MBAR + 0x114 (UISR0), 0x154 (UISR1); MBAR + 0x114 (UIMR0), 0x154 (UIMR1)
Figure 16-11. UART Interrupt Status/Mask Registers (UISRn/UIMRn)
Table 16-9. UISRn/UIMRn Field Descriptions
Bits Name Description
7 COS Change-of-state.
0UIPCRn[COS] is not selected.
1 Change-of-state occurred on CTS and was programmed in UACRn[IEC] to cause an interrupt.
6 ABC Autobaud calculation.
0 Autobaud is disabled or is waiting for the first receiver character.
1 The baud rate has been calculated and loaded into the clock source divider (UDUn and UDLn).
After being set, this bit is cleared by writing to UCRn[ENAB].
5 RxFIFO Receiver FIFO status. After being set, this bit is cleared by reading URBn.
0 FIFO status indication is disabled or the receiver status has not changed.
1 The receiver status has changed as programmed in URFn[RXS].
4 TxFIFO Transmitter FIFO status. After being set, this bit is cleared by writing UTBn.
0 FIFO status indication is disabled or the transmitter status has not changed.
1 The transmitter status has changed as programmed in UTFn[TXS].
3 RxFTO Receiver FIFO timeout.
0 No receiver FIFO timeout. This bit is cleared by reading all remaining data in the receiver FIFO, by
receiving another character into the FIFO, or if the receiver is disabled. The count to timeout is restarted
when RxFTO is cleared.
1 The receiver FIFO has timed out at 64 baud with unread data below the FIFO fullness level.
2 DB Delta break.
0 No new break-change condition to report. Section 16.3.5, “UART Command Registers (UCRn),” describes
the RESET BREAK-CHANGE INTERRUPT command.
1 The receiver detected the beginning or end of a received break.
1FFULL/R
xRDY
RxRDY (receiver ready) if UMR1n[FFULL/RxRDY] = 0; FIFO full (FFULL) if UMR1n[FFULL/RxRDY] = 1.
Duplicate of USRn[FFULL/RxRDY].
0 TxRDY Transmitter ready. This bit is the duplication of USRn[TxRDY].
0 The transmitter holding register was loaded by the CPU or the transmitter is disabled. Characters loaded
into the transmitter holding register when TxRDY = 0 are not sent.
1 The transmitter holding register is empty and ready to be loaded with a character.
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
16-14 Freescale Semiconductor
16.3.11 UART Divider Upper/Lower Registers (UDUn/UDLn)
The UDUn registers (formerly called UBG1n) hold the MSB, and the UDL n registers (formerly UBG2n)
hold the LSB of the preload value. UDUn and UDLn concatenate to provide a divider to CLKIN for
transmitter/receiver operation, as described in Section 16.5.1.2.1, “CLKIN Baud Rates.”
NOTE
The minimum value that can be loaded on the concatenation of UDUn with
UDLn is 0x0002. Both UDUn and UDLn are write-only and cannot be read
by the CPU.
16.3.12 UART Autobaud Registers (UABUn/UABLn)
The UABUn registers hold the MSB, and the UABLn registers hold the LSB of the calculated baud rate.
If UCRn[ENAB] is set, the value in these registers is automatically loaded into UDUn and UDLn.
7 0
Field Divider MSB
Reset 0000_0000
R/W Write only
Address MBAR + 0x118 (UDU0), 0x158 (UDU1)
Figure 16-12. UART Divider Upper Registers (UDUn)
7 0
Field Divider LSB
Reset 0000_0000
R/W Write only
Address MBAR + 0x11C (UDL0), 0x15C (UDL1)
Figure 16-13. UART Divider Lower Registers (UDLn)
7 0
Field Autobaud MSB
Reset 0000_0000
R/W Read only
Address MBAR + 0x120 (UABU0), 0x160 (UABU1)
Figure 16-14. UART Autobaud Upper Registers (UABUn)
7 0
Field Autobaud LSB
Reset 0000_0000
R/W Read only
Address MBAR + 0x124 (UABL0), 0x164 (UABL1)
Figure 16-15. UART Autobaud Lower Registers (UABLn)
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-15
16.3.13 UART Transmitter FIFO Registers (UTFn)
The UTFn registers contain control and status bits for the transmitter FIFO. Note that some bits are
read-only.
Table 16-10 describes UTFn fields.
7654 0
Field TXS FULL TXB
Reset 1100_0000
R/W R/W R R
Address MBAR + 0x128 (UTF0), 0x168 (UTF1)
Figure 16-16. UART Transmitter FIFO Registers (UTFn)
Table 16-10. UTFn Field Descriptions
Bits Name Description
7–6 TXS Transmitter status. When written to, these bits control the meaning of UISRn[TxFIFO].
00 Inhibit transmitter FIFO status indication in UISRn.
01 Transmitter FIFO Š 25% empty
10 Transmitter FIFO Š 50% empty
11 Transmitter FIFO Š 75% empty
When read, these bits indicate the emptiness level of the FIFO.
00 Transmitter FIFO < 25% empty
01 Transmitter FIFO Š 25% empty
10 Transmitter FIFO Š 50% empty
11 Transmitter FIFO Š 75% empty
5 FULL Transmitter FIFO full.
0 Transmitter FIFO is not full and can be loaded with a character.
1 Transmitter FIFO is full. Characters loaded into the transmitter FIFO when it is full are not transmitted.
4–0 TXB Transmitter buffer data level. Indicates the number of bytes, between 0 and 24, stored in the transmitter FIFO.
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16-16 Freescale Semiconductor
16.3.14 UART Receiver FIFO Registers (URFn)
The URFn registers contain control and status bits for the receiver FIFO. Note that some bits are r ead only .
Table 16-11 describes URFn fields.
7654 0
Field RXS FULL RXB
Reset 0000_0000
R/W R/W R R
Address MBAR + 0x12C (URF0), 0x16C (URF1)
Figure 16-17. UART Receiver FIFO Registers (URFn)
Table 16-11. URFn Field Descriptions
Bits Name Description
7–6 RXS Receiver status. When written to, these bits control the meaning of UISRn[RxFIFO].
00 Inhibit receiver FIFO status indication in UISRn.
01 Receiver FIFO Š 25% full
10 Receiver FIFO Š 50% full
11 Receiver FIFO Š 75% full
When read, these bits indicate the emptiness level of the FIFO.
00 Receiver FIFO < 25% full
01 Receiver FIFO Š 25% full
10 Receiver FIFO Š 50% full
11 Receiver FIFO Š 75% full
5 FULL Receiver FIFO full.
0 Receiver FIFO is not full and can be loaded with a character.
1 Receiver FIFO is full. Characters loaded from the receiver when the FIFO is full are lost.
This bit is identical to USRn[FFULL].
4–0 RXB Receiver buffer data level. Indicates the number of bytes, between 0 and 24, stored in the receiver FIFO.
UART Modules
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-17
16.3.15 UART Fractional Precision Divider Control Registers (UFPDn)
The UFPDn registers allow greater accuracy when deriving a transmitter/receiver clock source from
CLKIN. The use of the UFPDn registers is o ptional; if the c ontents are left in the reset state, code written
for other ColdFire devices containing UART modules will not be affected by the addition of these
registers. The contents of these registers allow the frequency to be divided by a factor of up to 16. When
autobaud is used, these registers are updated automatically to reflect the clock rate being used. Host
software can write to these registers to make fine adjustments to the clock rate. See Section 16.5.1.2,
“Calculating Baud Rates,” for an example of UFPDn programming.
Table 16-12 describes UFPDn fields.
16.3.16 UART Input Port Registers (UIPn)
The UIP registers, Figure 16-19, show the current state of the CTS input.
Table 16-13 describes UIPn fields.
743 0
Field — FD
Reset 0000_0000
R/W R/W
Address MBAR + 0x130 (UFPD0), 0x170 (UFPD1)
Figure 16-18. UART Fractional Precision Divider Control Registers (UFPDn)
Table 16-12. UFPDn Field Descriptions
Bits Name Description
7–4 — Reserved, should be cleared.
3–0 FD Fractional divider. The value of these bits, from 0 to 15, determine the scale factor by which the clocking source
for the transmitter and/or receiver is scaled.
710
Field — CTS
Reset 1111_1111
R/W Read only
Address MBAR + 0x134 (UIP0), 0x174 (UIP1)
Figure 16-19. UART Input Port Registers (UIPn)
Table 16-13. UIPn Field Descriptions
Bits Name Description
7–1 — Reserved, should be cleared.
0CTSCTS
state.The CTS value is latched and reflects the state of the input pin when UIPn is read. Note: This bit
has the same function and value as UIPCRn[RTS].
0 The current state of the CTS input is logic 0.
1 The current state of the CTS input is logic 1.
UART Modules
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
16-18 Freescale Semiconductor
16.3.17 UART Output Port Command Registers (UOP1n/UOP0n)
The R TS output can be asserted by writing a 1 to UOP1n[R TS] and negated by writing a 1 to UOP0n[RTS].
See Figure 16-20.
Table 16-14 describes UOP1 and UOP0 fields.
16.4 UART Module Signal Definitions
Figure 16-21 shows both the external and internal signal groups.
Figure 16-21. UART Block Diagram Showing External and Internal Interface Signals
710
Field — RTS
Reset 0000_0000
R/W Write only
Addr UART0: MBAR + 0x138 (UOP1), 0x13C (UOP0); UART1 0x178 (UOP1), 0x17C (UOP0)
Figure 16-20. UART Output Port Command Registers (UOP1/UOP0)
Table 16-14. UOP1/UOP0 Field Descriptions
Bits Name Description
7–1 — Reserved, should be cleared.
0 RTS Output port parallel output. Controls assertion (UOP1)/negation (UOP0) of RTS output.
0 Not affected.
1 Asserts RTS (UOP1). Negates RTS (UOP0).
Internal
Receive Buffer
Transmit Buffer
Input Port
Output Port
Interface
UART Module
Address Bus
Control
Control
Logic
or
Internal Bus
Data
to CPU
IRQ
To Interrupt
Controller
(SIM)
External
Interface
Signals
CLKIN Clock Source
Generator
URT_CTS
URT_RTS
URT_RxD
URT_TxD
External clock (URT_CLK)
24-Character
24-Character
UART Modules
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-19
An internal interrupt request signal (IRQ) is provided to notify the interrupt controller of an interrupt
condition. The output is the logical NOR of unmasked UISRn bits. The interrupt levels of the UART
modules are programmed in SIM register ICR2. See Section 7.2, “Interrupt Controller Registers.”
Table 16-15 briefly describes the UART module signals.
NOTE
The terms ‘assertion’ and ‘negation’ are used to avoid confusion between
active-low and active-high signals. ‘Asserted’ indicates that a signal is
active, independent of the voltage level; ‘negated’ indicates that a signal is
inactive.
Figure 16-22 shows a signal configuration for a UART/RS-232 interface.
Figure 16-22. UART/RS-232 Interface
16.5 Operation
This section describes operation of the clock source generator, transmitter, and receiver.
16.5.1 Transmitter/Receiver Clock Source
CLKIN serves as the basic timing reference for the clock source generator logic, which consists of a clock
generator and a programmable 16+4-bit divider (UDU, UDL, UFPD) dedicated to the UART. The clock
generator cannot produce standard baud rates if CLKIN is used, so the 16-bit divider should be used.
Table 16-15. UART Module Signals
Signal Description
Transmitter Serial
Data Output
(URT_TxD)
URT_TxD is held high (mark condition) when the transmitter is disabled, idle, or operating in the local
loop-back mode. Data is shifted out on URT_TxD on the falling edge of the clock source, with the least
significant bit (lsb) sent first.
Receiver Serial Data
Input (URT_RxD)
Data received on URT_RxD is sampled on the rising edge of the clock source, with the lsb received first.
Clear-to-Send
(URT_CTS)
This input can generate an interrupt on a change of state.
Request-to-Send
(URT_RTS)
This output can be programmed to be negated or asserted automatically by either the receiver or the
transmitter. It can control serial data flow when connected to a transmitter’s CTS.
Clock (URT_CLK) The UART’s external clock source. It can be used in 1x or 16x mode. When both the transmitter and
receiver use the timer as the clock source (UCR = 0xDD), the 16x clock is driven out on UARTCLK. If
either the transmitter or receiver use an external clock (1x or 16x), URT_CLK is an input.
DO2
DI1
DI2
DO1
RS-232 TransceiverUART
URT_RTS
URT_CTS
URT_TxD
URT_RxD
UART Modules
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
16-20 Freescale Semiconductor
16.5.1.1 Programmable Divider
As Figure 16-23 shows, the UART transmitter and receiver can use the following clock sources:
• An external clock signal on the URT_CLK pin that can be divided by 16. When not divided,
URT_CLK provides a synchronous clock mode; when divided by 16, it is asynchronous.
• CLKIN supplies an asynchronous clock source that is prescaled by 32 and then divided by the
16-bit value programmed in UDUn and UDLn. See Section 16.3.11, “UAR T Divider Upper/Lower
Registers (UDUn/UDLn).” The precision of this clock source can be tuned using the 4-bit value
programmed in UFPDn.
Note that when autobaud mode is enabled, the UFPDn, UDUn, and UDLn are automatically loaded with
the calculated baud rate. However, the calculated value can be overridden by a programmed value at any
time.
The choice of URT_CLK or CLKIN is programmed in the UCSR.
Figure 16-23. Clocking Source Diagram
16.5.1.2 Calculating Baud Rates
The following sections describe how to calculate baud rates.
16.5.1.2.1 CLKIN Baud Rates
When CLKIN is the UART clocking source, it goes through a divide-by-32 prescaler and then passes
through the 16-bit divider of the concatenated UDUn and UDLn registers. The UFPD register can be used
UART
x1
Prescaler
x16
Prescaler
Clock
Generator
4-Bit
Divider 16-Bit
Prescaler
Clocking sources programmed in UCSR
URT_CLK
URT_TxD
URT_RxD
Tx
Rx
Rx Buffer
Tx Buffer
CLKIN
1-Bit Divider
(UDU, UDL)
(UFPD)
UART Modules
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-21
to improve the accuracy of the clock source as shown in the following example using a 48 MHz CLKIN
and 230kbs UART baud rate:
1. UART Divider= CLKIN / (16 x 2 x UART Baud Rate)
= 48E06 / (32 x 230E03)
= 6.52
= 6 (truncate to lowest whole number)
UDU = 0x00, UDL = 0x06
2. The truncation has resulted in an effective 8.7% error (0.52/6)
3. Using the formula Fractional Divider = (truncated remainder * 16)
= 0.52 * 16
= 8.32
= 8 (truncate to nearest whole number)
UFPD = 0x08
4. This now gives an effective total error in the baud rate as:
%Error = 100 x (Truncated remainder) / (16 x (UD + UFPD/16)]
= 100 x 0.32 / (16 x (6 + 8/16))
= 32 / 104
= 0.31%
16.5.1.2.2 External Clock
An external source clock (URT_CLK) can be used as is or divided by 16.
16.5.1.2.3 Autobaud Detection
The UART can determine the clock rate of a received character stream from the timing of the received
pattern. If UCRn[ENAB] is set, the autobaud detector searches for a low level o n URT_RxD, indicating a
start bit. Start-bit length is measured until URT_RxD returns to a high level, then the transmission rate is
calculated and loaded into UDUn, UDLn, and UFPDn.
The calculated transmission rate can be determined by reading UABUn and UABLn. Errors may occur in
the calculation of high transmission rates due to distortion effects from the external drivers. If the
calculated rate is inaccurate, UDUn, UDLn, and UFPDn must be written with the appropriate value as soon
as possible to ensure that characters are properly received by the UART. The first character is always
correctly captured, even though the transmission rate is not yet calculated.
The first character must be an odd character such as ‘a’ or ‘A’ to ensure that it contains an isolated start
bit. The parity mode can be determined by monitoring subsequent characters.
The process for using the autobaud detector is as follows:
• UDUn, UDLn, and UFPDn must be initialized to 0x00.
• The receiver and transmitter clock sources must be set to TIMER (UCSR = 0xDD).
• Autobaud must be enabled (UCR[ENAB] = 1).
• The receiver must be enabled (UCR[RC] = 01).
Baudrate Externalclockfrequency
16or1
---------------------------------------------------------------------=
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
16-22 Freescale Semiconductor
Once enabled, the autobaud detector can calculate the transmission rate only once. If a new calculation is
required, UCR[ENAB] must first be cleared and then set again. Thus, a new UART connection cannot be
hot-plugged into an active UAR T connection if that connection is operating at a different rate without first
reinitializing the autobaud detector.
16.5.2 Transmitter and Receiver Operating Modes
Figure 16-24 is a functional block diagram of the transmitter and receiver showing the command and
operating registers, which are described generally in the following sections and described in detail in
Section 16.3, “Register Descriptions.”
Figure 16-24. Transmitter and Receiver Functional Diagram
16.5.2.1 Transmitting
The transmitter is enabled through the UART command register (UCRn). When it is ready to accept a
character, the UART sets USRn[TxRDY]. The transmitter converts parallel data from the CPU to a serial
bit stream on TxD. It automatically sends a start bit followed by the programmed number of data bits, an
optional parity bit, and the programmed number of stop bits. The lsb is sent first. Data is shifted from the
transmitter output on the falling edge of the clock source.
After the stop bits are sent, if no new character is in the transmitter holding register, the TxD output
remains high (mark condition) and the transmitter empty bit, USRn[TxEMP], is set. T ransmission resumes
and TxEMP is cleared when the CPU loads a new character into the UART transmitter buffer (UTB n). If
the transmitter receives a disable command, it continues until any character in the transmitter shift register
is completely sent.
UART Command Register (UCR0) W
UART Status Register (USR0) R
Transmitter Shift Register
UART Mode Register 1 (UMR1) R/W
UART Mode Register 2 (UMR2) R/W
Transmitter FIFO W
Receiver Shift Register
Receiver FIFO R
UART
External
Interface
RXD
TXD
UART Transmit
FIFO (UTB)
(24 Bytes)
UART Receive
FIFO (URB)
(24 Bytes)
UART Modules
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-23
If the transmitter is reset through a software command, operation stops immediately (see Section 16.3.5,
“UART Command Registers (UCRn)”). The transmitter is reenabled through the UCRn to resume
operation after a disable or software reset.
If the clear-to-send operation is enabled, CTS must be asserted for the character to be transmitted. If CTS
is negated in the middle of a transmission, the character in the shift register is sent and TxD remains in
mark state until CTS is reasserted. If the transmitter is forced to send a continuous low condition by issuing
a START BREAK command, the transmitter ignores the state of CTS.
If the transmitter is programmed to automatically negate RTS when a message transmission completes,
RTS must be asserted manually before a message is sent. In applications in which the transmitter is
disabled after transmission is complete and R TS is appropriately programmed, R TS is negated one bit time
after the character in the shift register is completely transmitted. The transmitter must be manually
reenabled by reasserting RTS before the next message is to be sent.
The transmitter must be enabled prior to accepting a START BREAK command. If the transmitter is disabled
while the BREAK is active, the BREAK is not terminated. The BREAK can only be terminated by using
the STOP BREAK command.
Figure 16-25 shows the functional timing information for the transmitter.
Figure 16-25. Transmitter Timing
C1
1
C2 C3 Break C4 C6
TxD
Transmitter
Enabled
USRn[TxRDY]
W
2
WWWWWWW
CTS
3
RTS
4
Manually asserted
by
BIT
-
SET
command Manually
asserted
Start
break C5
not
transmitted
C6C4 Stop
break
C3C2C1
1
C1 in transmission
3
UMR2n[TxCTS] = 1
1
Cn = transmit characters
2
W = write
4
UMR2n
[TxRTS] = 1
internal
module
select
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
16-24 Freescale Semiconductor
16.5.2.2 Receiver
The receiver is enabled through its UCRn, as described in Section 16.3.5, “UART Command Registers
(UCRn).” Figure 16-26 shows receiver functional timing.
Figure 16-26. Receiver Timing
When the receiver detects a high-to-low (mark-to-space) transition of the start bit on RxD, the state of RxD
is sampled each 16× clock for eight clocks, starting one-half clock after the transition (asynchronous
operation) or at the next rising edge of the bit time clock (synchronous operation). If RxD is sampled high,
the start bit is invalid and the search for the valid start bit begins again.
If RxD is still low, a valid start bit is assumed and the receiver continues sampling the input at one-bit time
intervals, at the theoretical center of the bit, until the proper number of data bits and parity, if any, is
assembled and one stop bit is detected. Data on the RxD input is sampled on the rising edge of the
programmed clock source. The lsb is received first. The data is then transferred to a receiver holding
register and USRn[RxRDY] is set. If the character is less than eight bits, the most significant unused bits
in the receiver holding register are cleared.
After the stop bit is detected, the receiver immediately looks for the next start bit. However, if a non-zero
character is received without a stop bit (framing error) and RxD remains low for one-half of the bit period
after the stop bit is sampled, the receive r operates as if a new start bit were detect ed. Parity error, framing
error , overrun error, and received break conditions set the respective PE, FE, OE, RB error , and break flags
in the USRn at the received character boundary and are valid only if USRn[RxRDY] is set.
If a break condition is detected (RxD is low for the entire character including the stop bit), a character of
all zeros is loaded into the receiver holding register (RHR) and USRn[RB,RxRDY] are set. RxD must
return to a high condition for at least one-half bit time before a search for the next start bit begins.
C1 C2 C25 C27 C28 C29
C3 C26
C26, C27, and C82 are lost
(C2)
Status
Data
(C3)
Status
Data
(C4)
Status
Data
C26
is lost
Reset by
command
RxD
Receiver
Enabled
USRn
[RxRDY]
Overrun
RTS4
internal
module
select
USRn
[FFULL]
(C1)
Status
Data
USRn
[OE]
Automatically asserted
when ready to receive
Manually asserted first time,
automatically negated if overrun occurs
UOP0[RTS] = 1
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-25
The receiver detects the beginning of a break in the middle of a character if the break persists through the
next character time. If the break begins in the middle of a character, the receiver places the damaged
character in the Rx FIFO stack and sets the corresponding USRn error bits and USRn[RxRDY]. Then, if
the break lasts until the next character time, the receiver places an all-zero character into the Rx FIFO and
sets USRn[RB,RxRDY].
16.5.2.3 Transmitter FIFO
Whenever the CPU writes a character for transmission into UTB, the character is placed into the 24-byte
transmitter FIFO. UTB fills the last spot in the FIFO and holds the last character to be transmitted.
Visibility into the status of the FIFO is provided by various bits and interrupts, as shown in Table 16-16.
16.5.2.4 Receiver FIFO
The FIFO stack is used in the UART’ s receiver buffer logic. The FIFO is 24 bytes deep. The receive buffer
consists of the FIFO and a receiver shift register connected to the RxD (see Figure 16-24). Data is
assembled in the receiver shift register and loaded into the top empty receiver holding register position of
the FIFO. Similar to the transmitter, several status bits and interrupts provide visibility into the status of
the FIFO.
In addition to the data byte, three status bits, parity error (PE), framing error (FE), and received break (RB),
are appended to each data character in the FIFO; OE (overrun error) is not appended. By programming the
ERR bit in the channel’s mode register (UMR1n), status is provided in character or block modes.
USRn[RxRDY] is set when at least one character is available to be read by the CPU. A read of the receiver
buffer produces an output of data from the top of the FIFO stack. After the read cycle, the data at the top
of the FIFO stack and its associated status bits are popped and the receiver shif t register can add new data
at the bottom of the stack. The FIFO-full status bit (FFULL) is set if all 24 stack positions are filled with
data. Either the RxRDY or FFULL bit can be selected to cause an interrupt.
The two error modes are selected by UMR1n[ERR] as follows:
• In character mode (UMR1n[ERR] = 0), status is given in the USRn for the character at the top of
the FIFO.
• In block mode, the USRn shows a logical OR of all characters reaching the top of the FIFO stack
since the last RESET ERROR STATUS command. Status is updated as characters reach the top of the
FIFO stack. Block mode offers a data-reception speed advantage where the software overhead of
error-checking each character cannot be tolerated. However , errors are not detected until the check
is performed at the end of an entire message—the faulting character in the block is not identified.
Table 16-16. Transmitter FIFO Status Bits
Status Bit Indicated Condition Interrupt
USR[TxEMP] = 1 The transmitter FIFO and shift register are empty and a data underrun occurred.
USR[TxRDY] = 1 At least one FIFO stage is available for a character to be transmitted. If this bit is cleared, the
FIFO is full and a subsequent write to the FIFO will be ignored.
Ye s
USR[FFULL] = 1 The programmed level of emptiness (UTF[TXS]) has been reached. Yes
UTF[TXS] Indicates the level of emptiness of the transmitter FIFO
UTF[TXB] Indicates the number of characters, 0–24, in the transmitter FIFO
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16-26 Freescale Semiconductor
In either mode, reading the USRn does not affect the FIFO. The FIFO is popped only when the receive
buffer is read. The USRn should be read before reading the receive buffer. If all 24 receiver holding
registers are full, a new character is held in the receiver shift register until space is available. However, if
a second new character is received, the character in the receiver shift register is lost, the FIFO is unaffected,
and USRn[OE] is set when the receiver detects the start bit of the new overrunning character.
Visibility into the status of the FIFO is provided by various bits and interrupts, as shown in Table 16-17.
T o support flow control, the receiver can be programmed to automatically negate and assert R TS, in which
case the receiver automatically negates RTS when a valid start bit is detected and the FIFO stack is full.
The receiver asserts RTS when a FIFO position becomes available; therefore, overrun errors can be
prevented by connecting RTS to the CTS input of the transmitting device.
NOTE
The receiver can still read characters in the FIFO stack if the receiver is
disabled. If the receiver is reset, the FIFO stack, RTS control, all receiver
status bits, and interrupt requests are reset. No more characters are received
until the receiver is reenabled.
16.5.3 Looping Modes
The UAR T can be configured to operate in various looping modes as shown in Figure 16-26. These modes
are useful for local and remote system diagnostic functions and are described in the following paragraphs
and in Section 16.3, “Register Descriptions.”
The UART’s transmitter and receiver should be disabled when switching between modes, as the selected
mode is activated immediately upon mode selection, regardless of whether a character is being received
or transmitted.
Table 16-17. Receiver FIFO Status Bits
Status Bit Indicated Condition Interrupt
USR[FFULL] = 1 All FIFO positions contain data Yes
USR[RxRDY] = 1 At least one character is available to be read by the CPU. Yes
USR[RxFIFO] = 1 The programmed level of fullness (UTF[RXS]) has been reached. Yes
USR[RxFTO] = 1 The receiver FIFO holds unread data, and the FIFO status
has not changed in at least 64 receiver clocks.
Ye s
URF[RXS] Indicates the level of fullness of the receiver FIFO
URF[RXB] Indicates the number of characters, 0–24, in the receiver FIFO.
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-27
16.5.3.1 Automatic Echo Mode
In automatic echo mode, shown in Figure 16-27, the UART automatically resends received data bit by bit.
The local CPU-to-receiver communication continues normally, but the CPU-to-transmitter link is
disabled. In this mode, received data is clocked on the receiver clock and resent on TxD. The receiver must
be enabled, but the transmitter need not be.
Figure 16-27. Automatic Echo
Because the transmitter is inactive, USRn[TxEMP,TxRDY] are inactive and data is sent as it is received.
Received parity is checked but is not recalculated for transmission. Character framing is also checked, but
stop bits are sent as they are received. A received break is echoed as rece ived until the next valid start bit
is detected. Autobaud operation does not affect automatic echo mode; that is, the first character received
is correctly echoed back.
16.5.3.2 Local Loop-Back Mode
Figure 16-28 shows how TxD and RxD are internally connected in local loop-back mode. This mode is for
testing the operation of a local UAR T module channel by sending data to the transmitter and checking data
assembled by the receiver to ensure proper operations.
Figure 16-28. Local Loop-Back
Features of this local loop-back mode are as follows:
• Transmitter and CPU-to-receiver communications continue normally in this mode.
• RxD input data is ignored
• TxD is held marking
• The receiver is clocked by the transmitter clock. The transmitter must be enabled, but the receiver
need not be.
16.5.3.3 Remote Loop-Back Mode
In remote loop-back mode, shown in Figure 16-29, the channel automatically transmits received data bit
by bit on the TxD output. The local CPU-to-transmitter link is disabled. This mode is useful in testing
receiver and transmitter operation of a remote channel. For this mode, the transmitter uses the receiver
clock.
CPU
Disabled Disabled
RxD Input
TxD Input
Tx
Rx
CPU
Disabled
Disabled RxD Input
TxD Input
Tx
Rx
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
16-28 Freescale Semiconductor
Because the receiver is not active, received data cannot be read by the CPU and error status conditions are
inactive. Received parity is not checked and is not recalculated for transmission. S top bits are sent as they
are received. A received break is echoed as received until the next valid start bit is detected.
Figure 16-29. Remote Loop-Back
16.5.4 Multidrop Mode
Setting UMR1n[PM] programs the UART to operate in a wake-up mode for multidrop or multiprocessor
applications. In this mode, a master can transmit an address character followed by a block of data
characters targeted for one of up to 256 slave stations.
Although slave stations have their channel receivers disabled, they continuously monitor the master’ s data
stream. When the master sends an address character , the slave receiver channel notifies its respective CPU
by setting USRn[RxRDY] and generating an interrupt (if programmed to do so). Each slave station CPU
then compares the received address to its station address and enables its receiver if it wishes to receive the
subsequent data characters or block of data from the master station. Slave stations not addressed continue
monitoring the data stream. Data fields in the data stream are separated by an address character. After a
slave receives a block of data, its CPU disables the receiver and repeats the process.Functional timing
information for multidrop mode is shown in Figure 16-30.
A character sent from the master station consists of a start bit, a programmed number of data bits, an
address/data (A/D) bit flag, and a programmed number of stop bits. A/D = 1 indicates an address character;
A/D = 0 indicates a data character. The polarity of A/D is selected through UMR1n[PT]. UMR1n should
be programmed before enabling the transmitter and loading the corresponding data bits into the transmit
buffer.
In multidrop mode, the receiver continuously monitors the received data stream, regardless of whether it
is enabled or disabled. If the receiver is disabled, it sets the RxRDY bit and loads the character into the
receiver holding register FIFO stack provided the received A/D bit is a one (address tag). The character is
discarded if the received A/D bit is zero (data tag). If the receiver is enabled, all received characters are
transferred to the CPU through the receiver holding register stack during read operations.
In either case, the data bits are loaded into the data portion of the stack while the A/D bit is loaded into the
status portion of the stack normally used for a parity error (USRn[PE]).
Detection of breaks and framing or overrun errors operates normally. The A/D bit replaces the parity bit,
so parity is neither calculated nor checked. Messages in this mode may still contain error detection and
correction information. If 8-bit characters are not required, software can be used to calculate parity and
append it to the 5-, 6-, or 7-bit character.
CPU
Disabled
Disabled RxD Input
TxD Input
Tx
Rx
Disabled
Disabled
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MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-29
Figure 16-30. Multidrop Mode Timing Diagram
16.5.5 Bus Operation
This section describes bus operation during read, write, and interrupt acknowledge cycles to the UART
module.
16.5.5.1 Read Cycles
The UART module responds to reads with byte data. Reserved registers return zeros.
16.5.5.2 Write Cycles
The UART module accepts write data as bytes. Write cycles to read-only or reserved registers complete
normally without exception processing, but data is ignored.
16.5.5.3 Interrupt Acknowledge Cycles
An internal interrupt request signal notifies the interrupt controller of any unmasked interrupt conditions.
The interrupt priority level is programmed in ICR2.
ADD1TxD
Transmitter
Enabled
USRn
[TxRDY]
C0 ADD211
internal
module
select
A/D A/D A/D
ADD1RxD
Receiver
Enabled
USRn
[RxRDY]
C0 ADD211
internal
module
select
A/D A/D A/D
0
A/D
0
A/D
(C0)
Status Data
(ADD 2)
Status DataADD 1
Peripheral Station
Master Station
UMR1n[PM] = 11
UMR1n[PM] = 11
UMR1n[PT] = 1
ADD 1
UMR1n[PT] = 0
C0
UMR1n[PT] = 2
ADD 2
UMR1n[PM] = 11
UART Modules
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
16-30 Freescale Semiconductor
16.5.6 Programming
The software flowchart, Figure 16-31, consists of the following:
• UART module initialization—These routines consist of SINIT and CHCHK (sheets 1 and 2).
Before SINIT is called at system initialization, the calling routine allocates 2 words on the system
stack. On return to the calling routine, SINIT passes UAR T status data on the stack. If SINIT finds
no errors, the transmitter and receiver are enabled. SINIT calls CHCHK to perform the checks.
When called, SINIT places the UAR T in local loop-back mode and checks for the following errors:
— Transmitter never ready
— Receiver never ready
— Parity error
— Incorrect character received
• I/O driver routine—This routine (sheets 4 and 5) consists of INCH, the terminal input character
routine which gets a character from the receiver, and OUTCH, which sends a character to the
transmitter.
• Interrupt handling—Consists of SIRQ (sheet 4), which is executed after the UART module
generates an interrupt caused by a change-in-break (beginning of a break). SIRQ then clears the
interrupt source, waits for the next change-in-break interrupt (end of break), clears the interrupt
source again, then returns from exception processing to the system monitor.
16.5.6.1 UART Module Initialization Sequence
NOTE
UART module registers can be accessed by word or byte operations, but
only data byte D[7:0] is valid.
Figure 16-31 shows the UART module initialization sequence.
Figure 16-31. UART Mode Programming Flowchart (Sheet 1 of 5)
UART Modules
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-31
Figure 16-31. UART Mode Programming Flowchart (Sheet 2 of 5)
UART Modules
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
16-32 Freescale Semiconductor
Figure 16-31. UART Mode Programming Flowchart (Sheet 3 of 5)
UART Modules
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 16-33
Figure 16-31. UART Mode Programming Flowchart (Sheet 4 of 5)
UART Modules
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
16-34 Freescale Semiconductor
Figure 16-31. UART Mode Programming Flowchart (Sheet 5 of 5)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 17-1
Chapter 17
General Purpose I/O Module
This chapter describes the operation and programming model of the three general-purpose I/O (GPIO)
ports on the MCF5272. It includes details about pin assignment, direction-control, and data registers.
17.1 Overview
The MCF5272 provides up to 48 general-purpose I/O signals. The GPIO signal multiplexing is shown in
Table 17-1. All GPIO pins are individually programmable as inputs or outputs. At reset, all configurable
multifunction GPIO pins default to general purpose inputs and all multifunction pins that are not shared
with a GPIO pin default to high impedance. To avoid indeterminate read values and reduce power
consumption, internal pull-up resistors are active immediately upon reset, and remain active until the
corresponding port direction registers are programmed.
The general-purpose I/O signals are configured as three ports, each having up to 16 signals. These three
general-purpose I/O ports are shared with other signals as follows:
Control registers for each port select the function (GPIO or peripheral pin) assigned to each pin. Pins can
have as many as four functions including GPIO. There is no configuration register for GPIO port C
because its pins are configured by WSEL during device reset.
An additional port, port D, has only a control register which is used to configure the pins that are not
multiplexed with any GPIO signals.
Table 17-1. GPIO Signal Multiplexing
GPIO Signal Also Multiplexed on the Same Pins
PA[6:0] External USB transceiver interface signals
PA7 QSPI_CS3 and DOUT3
PA[15:8] PLIC TDM ports 0 and 1
PB[7:0] UART1 signals and the bus control signal TA
PB[15:8] Ethernet controller signals
PC[15:0] Data bus signals D[15:0]. These are only available (as GPIO) when the device is
configured for 16-bit data bus mode using the WSEL signal
General Purpose I/O Module
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17-2 Freescale Semiconductor
17.2 Port Control Registers
The port control registers are used to configure all pins that carry signals multiplexed from different
on-chip modules. Each pin is configured with a two-bit field. Pin functions are referred to as
function 0b00–0b11. The function 0 signals corresponding to GPIO ports A and B are immediately
available after reset.
Wherever a signal function includes a GPIO port bit, the function defaults to an input after a reset and can
be read in the corresponding port data register.
Pin functions are generally grouped logically. For example, all UART1 signals are multiplexed with port
B and have the control register function code of 0b01.
There is no port C control register. Port C is enabled when the 16-bit-wide external data bus mode is
selected at reset by the input level on QSPI_DOUT/WSEL. The port D control register is used to configure
pins that have multiple functions (0b01 through 0b11) but no GPIO function.
CAUTION
Do not attempt to program a pin function that is not defined. Where no
function is defined, the function code is labeled ‘Reserved’ and is
considered invalid. Programming any control register field with a reserved
value has an unpredictable effect on the corresponding pin’s operation.
Reserved function codes cannot be reliably read. Attempts to read them
yield undetermined values.
Table 17-2. GPIO Port Register Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x0080 Port A Control Register (PACNT)
0x0084 Port A Data Direction Register (PADDR) Reserved
0x0086 Reserved Port A Data Register (PADAT)
0x0088 Port B Control Register (PBCNT)
0x008C Port B Data Direction Register (PBDDR) Reserved
0x008E Reserved Port B Data Register (PBDAT)
0x0094 Port C Data Direction Register (PCDDR) Reserved
0x0096 Reserved Port C Data Register (PCDAT)
0x0098 Port D Control Register (PDCNT)
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Freescale Semiconductor 17-3
17.2.1 Port A Control Register (PACNT)
PACNT is used to configure pins that source signals multiplexed with GPIO port A.
Table 17-3 describes PACNT fields. Table 17-4 provides the same information organized by function.
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Field PACNT15 PACNT14 PACNT13 PACNT12 PACNT11 PACNT10 PACNT9 PACNT8
Reset 0000_0000_0000_0000
R/W Read/Write
1514131211109876543210
FieldPACNT7PACNT6PACNT5PACNT4PACNT3PACNT2PACNT1PACNT0
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x0080
Figure 17-1. Port A Control Register (PACNT)
Table 17-3. PACNT Field Descriptions
Bits Name Description
31–30 PACNT15 Configure pin M3. If this pin is programmed to function as INT6, it is not available as a GPIO.
00 PA15
01 DGNT1
1xReserved
29–28 PACNT14 Configure pin M2
00 PA14
01 DREQ1
1xReserved
27–26 PACNT13 Configure pin L3
00 PA13
01 DFSC3
1xReserved
25–24 PACNT12 Configure pin L2
00 PA12
01 DFSC2
1xReserved
23–22 PACNT11 Configure pin L1
00 PA11
01 Reserved
10 QSPI_CS1
11 Reserved
21–20 PACNT10 Configure pin K5
00 PA10
01
DREQ0
1xReserved
19–18 PACNT9 Configure pin J3
00 PA9
01 DGNT0
1xReserved
General Purpose I/O Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
17-4 Freescale Semiconductor
INT6 is always available on pin M3. It can be enabled by programming the appropriate bits in interrupt
control register 4, see Section 7.2.2.4, “Interrupt Control Register 4 (ICR4), and the programmable
interrupt transition register described in Section 7.2.4, “Programmable Interrupt Transition Register
(PITR).
17–16 PACNT8 Configure pin J2
00 PA8
01
FSC0/FSR0
1xReserved
15–14 PACNT7 Configure pin P1
00 PA7
01 QSPI_CS3
10 DOUT3
11 Reserved
13–12 PACNT6 Configure pin E1
00 PA6
01 USB_RxD
1xReserved
11–10 PACNT5 Configure pin E2
00 PA5
01 USB_TxEN
1xReserved
9–8 PACNT4 Configure pin E3
00 PA4
01 USB_Susp
1xReserved
7–6 PACNT3 Configure pin E4
00 PA3
01 USB_TN
1xReserved
5–4 PACNT2 Configure pin E5
00 PA2
01 USB_RN
1xReserved
3–2 PACNT1 Configure pin D1
00 PA1
01 USB_RP
1xReserved
1–0 PACNT0 Configure pin D2
00 PA0
01 USB_TP
1xReserved
Table 17-3. PACNT Field Descriptions (continued)
Bits Name Description (continued)
General Purpose I/O Module
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Freescale Semiconductor 17-5
17.2.2 Port B Control Register (PBCNT)
PBCNT, shown in Figure 17-2, is used to configure the pins assigned to signals that are multiplexed with
GPIO port B.
Table 17-5 describes PBCNT fields. Table 17-6 provides the same information organized by function.
Table 17-4. Port A Control Register Function Bits
Pin Number PACNT[xx] = 00
(Function 0b00)
PACNT[xx] = 01
(Function 0b01)
PACNT[xx] = 10
(Function 0b10)
PACNT[xx] = 11
(Function 0b11)
D2 PA0 USB_TP — —
D1 PA1 USB_RP — —
E5 PA2 USB_RN — —
E4 PA3 USB_TN — —
E3 PA4 USB_Susp — —
E2 PA5 USB_TxEN — —
E1 PA6 USB_RxD — —
P1 PA7 QSPI_CS3 DOUT3 —
J2 PA8 FSC0/FSR0 — —
J3 PA9 DGNT0 — —
K5 PA10 DREQ0 — —
L1 PA11 Reserved QSPI_CS1 —
L2 PA12 DFSC2 — —
L3 PA13 DFSC3 — —
M2 PA14 DREQ1 — —
M3 PA15 DGNT11
1If this pin is programmed to function as INT6, it is not available as a GPIO.
——
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Field PBCNT15 PBCNT14 PBCNT13 PBCNT12 PBCNT11 PBCNT10 PBCNT9 PBCNT8
Reset 0000_0000_0000_0000
R/W Read/Write
1514131211109876543210
Field PBCNT7 PBCNT6 PBCNT5 PBCNT4 PBCNT3 PBCNT2 PBCNT1 PBCNT0
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x0088
Figure 17-2. Port B Control Register (PBCNT)
General Purpose I/O Module
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17-6 Freescale Semiconductor
Table 17-5. PBCNT Field Descriptions
Bits Name Description
31–30 PBCNT15 Configure pin P10
00 PB15
01 E_MDC
1xReserved
29–28 PBCNT14 Configure pin L9
00 PB14
01 E_RxER
1xReserved
27–26 PBCNT13 Configure pin M9
00 PB13
01 E_RxD1
1xReserved
25–24 PBCNT12 Configure pin N9
00 PB12
01 E_RxD2
1xReserved
23–22 PBCNT11 Configure pin P9
00 PB11
01 E_RxD3
10 Reserved
11 Reserved
21–20 PBCNT10 Configure pin L8
00 PB10
01 E_TxD1
1xReserved
19–18 PBCNT9 Configure pin M8
00 PB9
01 E_TxD2
1xReserved
17–16 PBCNT8 Configure pin N8
00 PB8
01 E_TxD3
1xReserved
15–14 PBCNT7 Configure pin M6
00 PB7
01 TOUT0
1xReserved
13–12 PBCNT6 Configure pin G4
00 PB6
01 Reserved
1xReserved
11–10 PBCNT5 Configure pin F3
00 PB5
01 TA
1xReserved
General Purpose I/O Module
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Freescale Semiconductor 17-7
Table 17-6 provides the same information as Table 17-6, but organized by function instead of register field.
9–8 PBCNT4 Configure pin G3
00 PB4
01 URT0_CLK
1xReserved
7–6 PBCNT3 Configure pin H3
00 PB3
01 URT0_RTS
1xReserved
5–4 PBCNT2 Configure pin H2
00 PB2
01 URT0_CTS
1xReserved
3–2 PBCNT1 Configure pin H1. The signal URT0_RxD is always internally connected to TIN2.
00 PB1
01 URT0_RxD/TIN2
1xReserved
1–0 PBCNT0 Configure pin H4
00 PB0
01 URT0_TxD
1xReserved
Table 17-6. Port B Control Register Function Bits
Pin Number PBCNTxx = 00
(Function 0b00)
PBCNTxx = 01
(Function 0b01)
PBCNTxx = 10
(Function 0b10)
PBCNTxx = 11
(Function 0b11)
H4 PB0 URT0_TxD — —
H1 PB1 URT0_RxD/TIN2 — —
H2 PB2 URT0_CTS ——
H3 PB3 URT0_RTS ——
G3 PB4 URT0_CLK — —
F3 PB5 TA — —
G4 PB6 — — —
M6 PB7 TOUT0 — —
N8 PB8 E_TxD3 — —
M8 PB9 E_TxD2 — —
L8 PB10 E_TxD1 — —
P9 PB11 E_RxD3 — —
N9 PB12 E_RxD2 — —
M9 PB13 E_RxD1 — —
L9 PB14 E_RxER — —
P10 PB15 E_MDC — —
Table 17-5. PBCNT Field Descriptions (continued)
Bits Name Description (continued)
General Purpose I/O Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
17-8 Freescale Semiconductor
17.2.3 Port C Control Register
There is no port C control register. Port C is enabled only when the external data bus is 16 bits wide. This
is done by holding QSPI_DOUT/WSEL high during reset. When QSPI_DOUT/WSEL is low during reset,
the external data bus is 32 bits wide and port C is unavailable.
17.2.4 Port D Control Register (PDCNT)
PDCNT, shown in Table 17-8, is used to configure pins that have multiple functions but no associated
GPIO capability. Port D has no data register nor data direction register.
Table 17-7 describes PDCNT fields. Table 17-8 provides the same information organized by function.
31 16
Field —
Reset —
R/W —
1514131211109876543210
Field PDCNT7 PDCNT6 PDCNT5 PDCNT4 PDCNT3 PDCNT2 PDCNT1 PDCNT0
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x0098
Figure 17-3. Port D Control Register (PDCNT)
Table 17-7. PDCNT Field Descriptions
Bits Name Description
31–16 — Reserved
15–14 PDCNT7 Configure pin K6.
00 High impedance
01 PWM_OUT2
10 TIN1
11 Reserved
13–12 PDCNT6 Configure pin P5.
00 High impedance
01 PWM_OUT1
10 TOUT1
11 Reserved
11–10 PDCNT5 Configure pin P2.
00 High impedance
01 Reserved
10 DIN3
11 INT4
9–8 PDCNT4 Configure pin K1.
00 High impedance
01 DOUT0
10 URT1_TxD
11 Reserved
General Purpose I/O Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 17-9
Table 17-8 provides the same informa tion as Table 17-7 but organized by function instead of register field.
7–6 PDCNT3 Configure pin K3.
00 High impedance
01 Reserved
10 URT1_RTS
11 INT5
5–4 PDCNT2 Configure pin K2.
00 High impedance
01 Reserved
10 URT1_CTS
11 QSPI_CS2
3–2 PDCNT1 Configure pin K1. The signal URT1_RxD is always internally connected to TIN3.
00 High impedance
01 DIN0
10 URT1_RxD/TIN3
11 Reserved
1–0 PDCNT0 Configure pin J4.
00 High impedance
01 DCL0
10 URT1_CLK
11 Reserved
Table 17-8. Port D Control Register Function Bits
PIN Number PDCNTxx = 00
(Function 0b00)
PDCNTxx = 01
(Function 0b01)
PDCNTxx = 10
(Function 0b10)
PDCNTxx = 11
(Function 0b11)
J4 Pin is high Z DCL0 URT1_CLK —
K1 Pin is high Z DIN0 URT1_RxD1/TIN3
1URT1_RxD is always internally connected to timer 3 (TIN3).
—
K2 Pin is high Z — URT1_CTS QSPI_CS2
K3 Pin is high Z — URT1_RTS INT5
K4 Pin is high Z DOUT0 URT1_TxD —
P2 Pin is high Z — DIN3 INT4
P5 Pin is high Z PWM_OUT1 TOUT1 —
K6 Pin is high Z PWM_OUT2 TIN0 —
8-15 — — — —
Table 17-7. PDCNT Field Descriptions (continued)
Bits Name Description (continued)
General Purpose I/O Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
17-10 Freescale Semiconductor
17.3 Data Direction Registers
These registers are used to program GPIO port signals as inputs or outputs. The data direction bit for any
line is ignored unless that line is configured for general purpose I/O in the appropriate control register. If
a GPIO line changes from an input to an output, the initial data on that pin is the last data written to the
latch by the corresponding data register.
At system reset, these register bits are all cleared, configuring all port I/O lines as general purpose inputs.
Bootstrap software must write an appropriate value into the data direction register to configure GPIO port
signals as outputs. When these registers are first written, any internal pullups on the corresponding I/O pins
are disabled.
A detailed description is provided only for data direction register A (PADDR). The control bits in all three
registers operate in the same manner.
17.3.1 Port A Data Direction Register (PADDR)
The PADDR determines the signal direction of each parallel port pin programmed as a GPIO port in the
PACNT.
17.3.2 Port B Data Direction Register (PBDDR)
The PBDDR determines the signal direction of each parallel port pin programmed as a GPIO port in the
PBCNT.
15 0
Field PADDR
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x0084
Figure 17-4. Port A Data Direction Register (PADDR)
Table 17-9. PADDR Field Descriptions
Bits Name Description
15–0 PADDR Data direction bits. Each data direction bit selects the direction of the signal as follows:
0 Signal is defined as an input.
1 Signal is defined as an output.
15 0
Field PBDDR
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x008C
Figure 17-5. Port B Data Direction Register (PBDDR)
General Purpose I/O Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 17-11
17.3.3 Port C Data Direction Register (PCDDR)
The PCDDR determines the signal direction of each parallel port pin programmed as a GPIO port in the
PCCNT.
17.4 Port Data Registers
These 16-bit bidirectional registers are used to read or write the logic states of the GPIO lines. This register
has no effect on pins not configured for general-purpose I/O.
After a system reset, these register bits are all cleared. When any port lines are configured as outputs, a
logic zero appears on those pins, unless the data register is written with an initial data value prior to setting
the pin direction.
The reset values given in the following register diagrams are the port output v alues written to the registers
during reset, and do not reflect the value of a register read cycle. Register reads always return the
instantaneous value of the corresponding pins.
17.4.1 Port Data Register (PxDAT)
In the following description PxDAT refers to PADAT, PBDAT, or PCDAT.
The PxDAT value for inputs corresponds to the logic level at the pin; for outputs, the value corresponds to
the logic level driven onto the pin. Note that PxDAT has no effect on pins which have not been configured
for GPIO.
15 0
Field PCDDR
Reset 0000_0000_0000_0000
R/W Read/Write
Addr MBAR + 0x0094
Figure 17-6. Port C Data Direction Register (PCDDR)
15 0
Field PxDAT
Reset Undefined
R/W Read/Write
Addr MBAR + 0x0086 (PADAT); 0x008E (PBDAT); 0x0096 (PCDAT)
Figure 17-7. Port x Data Register (PADAT, PBDAT, and PCDAT)
General Purpose I/O Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
17-12 Freescale Semiconductor
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 18-1
Chapter 18
Pulse-Width Modulation (PWM) Module
This chapter describes the configuration and operation of the pulse-width modulation (PWM) module. It
includes a block diagram, programming model, and timing diagram.
18.1 Overview
The PWM module shown in Figure 18-1, generates a synchronous series of pulses having programmable
duty cycle. With a suitable low-pass filter, the PWM can be used as a digital-to-analog converter.
Figure 18-1. PWM Block Diagram (3 Identical Modules)
PWM_OUT2
PWM_OUT1
PWM_OUT0
SYS CLOCK
PRESCALER
COUNTER
CONTROL REG.
WIDTH REG.
WIDTH BUFFER
PWCR[CKSL]
EN
Internal Bus
COMPARATOR GENERATOR
FRC1
Pulse-Width Modulation (PWM) Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
18-2 Freescale Semiconductor
Summary of the main features include:
• Double-buffered width register
• Variable-divide prescale
• Three independent PWM modules
• Byte-wide width register provides programmable duty cycle control
18.2 PWM Operation
The PWM is a simple free-running counter combined with a pulse-width register and a comparator such
that the output is cleared whenever the counter value exceeds the width register value. When the counter
overflows, or “wraps around,” its value becomes less than or equal to the value of the width register, and
the output is set. With a suitable low-pass filter, the PWM can be used as a digital-to-analog converter.
The width register is double-buffered so that a new value can be loaded for the next cycle without affecting
the current cycle. At the beginning of each period, the value of the width buf fer register is loaded into the
width register, which feeds the comparator. This value is used for comparison during the next cycle. The
prescaler contains a variable divider that can reduce the incoming clock frequency by certain values
between 1 and 32768.
18.3 PWM Programming Model
This section describes the registers and control bits in the PWM module. There are three independent
PWM modules, each with its own control and width registers. The memory map for the PWM is shown in
Table 18-1.
Table 18-1. PWM Module Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x00C0 PWM Control Register 0
(PWCR0)
Reserved
0x00C4 PWM Control Register 1
(PWCR1)
Reserved
0x00C8 PWM Control Register 2
(PWCR2)
Reserved
0x00D0 PWM Pulse-Width Register 0
(PWWD0)
Reserved
0x00D4 PWM Pulse-Width Register 1
(PWWD1)
Reserved
0x00D8 PWM Pulse-Width Register 2
(PWWD2)
Reserved
Pulse-Width Modulation (PWM) Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 18-3
18.3.1 PWM Control Register (PWCRn)
This register, shown in Figure 18-2, controls the overall operation of the PWM. Unless disabled and then
re-enabled, writing to PWCR while the PWM is running will not alter its operation until the current output
cycle finishes. For example, if the prescale value is changed while the PWM is enabled, the new value will
not take effect until after the counter has “wrapped around”. The PWM must be disabled and then
re-enabled to affect its operation before the end of the current output cycle.
Figure 18-2. PWM Control Registers (PWCRn)
Table 18-2 gives PWCR field descriptions.
76543 0
Field EN FRC1 LVL — CKSEL
Reset 0010_0000
R/W Read/Write
Address MBAR + 0x0C0 (PWCR0); + 0x0C4 (PWCR1); + 0x0C8 (PWCR2)
Table 18-2. PWCRn Field Descriptions
Bits Name Description
7ENEnable.
0 Disables the PWM. While disabled, the PWM is in low-power mode and the prescaler does not count.
When the PWM is disabled, the output is forced to the value of PWCRn[LVL].
1 Enables the PWM.
6 FRC1 Force output high.
0 Default reset value. PWM functions normally.
1 The PWM drives the output high for the entire counter period. PWCRn[FRC1] has a lower priority than
PWCRn[EN], so setting PWCRn[FRC1] while PWCRn[EN] is cleared has no effect. There are two ways
to drive the PWM output high. If PWCRn[EN] is cleared, PWM output immediately assumes the value of
PWCRn[LVL]. If PWCRn[FRC1] is set while PWCRn[EN] is set, the PWM output does not go high until
after the current output cycle completes.
5 LVL Disable level. Determines the PWM output level whenever the PWM is disabled.
0 The PWM output is low while disabled.
1 The PWM output is high while disabled.
4 — Reserved, should be cleared.
3–0 CKSL Prescale clock. These bits select the clock frequency divider, that is, the output of the divider chain, as
shown below.
CKSL[3:0] Divisor
0000 1
0001 2
0010 4
... ...
111132768
Pulse-Width Modulation (PWM) Module
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
18-4 Freescale Semiconductor
18.3.2 PWM Width Register (PWWDn)
This register, shown in Figure 18-3, controls the width of the output pulse. When the counter become
greater than or equal to the value in this register, the output is cleared for the remainder of the period. When
the counter overflows, or wraps around, the counter value becomes less than or equal to the value of the
width register and the output is set high.
Writing to the width register while the PWM is enabled will not alter the operation of the PWM until the
end of the current output cycle. That is, the width value is not modified until after the counter has wrapped
around. The PWM must be disabled and then re-enabled to affect its operation before the end of the current
output cycle.
Figure 18-3. PWM Width Register (PWWDn)
Figure 18-4 shows example PWM waveforms and their dependence on PWWD[PW].
Figure 18-4. PWM Waveform Examples (PWCRn[EN] = 1)
7 0
Field PW
Reset 0000_0000
R/W R/W
Address MBAR + 0x0D0 (PWWD0); + 0x0D4 (PWWD1); + 0x0D8 (PWWD2)
Table 18-3. PWWDn Field Descriptions
Bits Name Description
7–0 PW Pulse width. Range 0x00–0xFF. When the counter value become greater than PWWD[PW], the output is
cleared for the remainder of the period. When the counter overflows, or wraps around, the counter value
becomes less than or equal to PWWD[PW] and the output is set.
256T
T
128T
255T
T
128T
255T
PWWD[PW] = 0x00
PWWD[PW] = 0x01
PWWD[PW] = 0x80
PWWD[PW] = 0xFF
PWCRn[CKSL] = 0000: T = 1 x CPU clock period
PWCRn[CKSL] = 1111: T = 32768 x CPU clock period
PWCRn[FRC1] = 1
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-1
Chapter 19
Signal Descriptions
This chapter provides a listing and brief description of all the MCF5272 signals. It shows it shows which
are inputs or outputs, how they are multiplexed, and the state of each signal at reset. The first listing is
organized by function with signals appearing alphabetically within each functional group. This is followed
by a second listing sorted by pin number. Some pins serve as many as four different functions.
19.1 MCF5272 Block Diagram with Signal Interfaces
Figure 19-1 shows the MCF5272 block diagram and how the modules and signals interact. Refer also to
Table 19-1 and Table 19-2 for a list of the signals sorted by function and pin number, respectively.
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-2 Freescale Semiconductor
Figure 19-1. MCF5272 Block Diagram with Signal Interfaces
TDO/DSO
TMS/BKPT
TRST/DSCLK
TCK/PSTCLK
TDI/DSI
MTMOD
DDATA[3:0]
PST[3:0]
E_TxD0
E_TxEN
E_TxCLK
E_COL
E_RxDV
E_RxD0
E_RxCLK
E_TxER
E_CRS
PB8/E_TxD3
PB9/E_TxD2
PB10/E_TxD1
PB11/E_RxD3
PB12/E_RxD2
PB13/E_RxD1
PB14/E_RxER
PB15/E_MDC
E_MDIO
PA[15:0]
PB[15:0]
PC[15:0]
PB0/URT0_TXD
PB1/URT0_RXD
PB2/URT0_CTS
PB3/URT0_RTS
PB4/URT0_CLK
QSPI_Dout/WSEL
QSPI_Din
QSPI_CLK/BUSW1
QSPI_CS0/BUSW0
PA11/QSPI_CS1
PA7/QSPI_CS3/DOUT3
URT1_CTS/QSPI_CS2
A[22:0]/SDA[13:0]
D[31:0]/(D[31:16]/PC15:0)
CS[6:0]
R/W
BS[3:0]
OE/RD
PB5/TA
TEA
SDCS/CS7
RAS0
CAS0
SDCKE
SDCLK
SDBA[1:0]
SDWE
A10_PRECHG
DOUT0/URT1_TxD
DIN0/URT1_RxD
PA10_DREQ0
PA9/DGNT0
DCL0/URT1_CLK
PA8 /FS C0/ FSR 0
URT1_RTS/INT5
URT1_CTS/QSPI_CS2
DOUT1
DIN1
PA14/DREQ1
PA15_INT6/DGNT1_INT6
DCL1/GDCL1_OUT
FSC1/FSR1/DFSC1
PA1 2 /D FSC 2
PA1 3 /D FSC 3
PA7/QSPI_CS3/DOUT3
DIN3/INT4
PWM_OUT0
PWM_OUT1/TOUT1
PB7/TOUT0
JTAG
and
BDM
FAST
ETHERNET
CONTROLLER
GPIO
UART0
QSPI
USB
TIN0
PWM_OUT2/TIN1
USB_CLK
USB_D–
USB_D+
PA6/USB_RXD
PA5/USB_TXEN
PA4/USB_Susp
PA2/USB_RN
PA1/USB_RP
PA3/USB_TN
PA0/USB_TP
USB_WOR/INT1
TIMER/PIT
WATCHDOG
PWM
PLIC
PORTS 1, 2,
and 3
PLIC
PORT 0
UART1
EXTERNAL
BUS
INTERFACE
EXT
INTERRUPTS
INT[6:1] CLKIN
BYPASS
HiZ
RSTO RSTI
DRESETEN
ROM
16 KBYTES RAM
4 KBYTES
INSTRUCTION
CACHE RAM
1 KBYTE
V2 ColdFire
CPU
and MAC/DIV
K
TO
M
M BUS
SWITCH/
ARB
KBUS
MBUS
SBUS
10 BASE-T
7 WIRE
10/100 BASE-T MII INTERFACE
EXTERNAL CPU AND SDRAM BUSDEDICATATED SDRAM CONTROL
NOTE: GPIO pins shown above are multiplexed with most other signals.
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-3
19.2 Signal List
Table 19-1 summarizes the signals, showing default pin functions after system reset. General-purpose port
signals all default to inputs after reset. Table 19-2 presents the same information sorted by pin number
instead of signal function.
NOTE:
In this manual, the term ‘asserted’ indicates the active signal state; ‘negated’
indicates inactive. Names of active-low signals are given overbars, for
example, INT1 and SDWE.
Table 19-1. Signal Descriptions Sorted by Function (Sheet 1 of 8)
Configured
by
(see notes)1
Pin Functions
Description
Map
BGA
Pin
I/O Drive
(mA) Cpf
0 (Reset) 1 2 3
A0 — — — A0 D10 O 6 30
A1 SDA0 — — A1/SDRAM-16bit A0 B12 O 6 30
A10 SDA9 SDA8 — A10/SDRAM-16bit
A9/SDRAM-32bit A8
D12 O 6 30
A10_PRECHG — — — SDRAM A10_Precharge D14 O 10 30
A11 — SDA9 — A11/SDRAM-32bit A9 C11 O 6 30
A12 SDA11 – — A12/SDRAM-16bit A11 B11 O 6 30
A13 SDA12 SDA11 — A13/SDRAM-16bit
A12/SDRAM-32bit A11
A11 O 6 30
A14 SDA13 SDA12 — A14/SDRAM-16bit
A13/SDRAM-32bit A12
C10 O 6 30
A15 — — — A15 D9 O 6 30
A16 — — — A16 D8 O 6 30
A17 — — — A17 D7 O 6 30
A18 — — — A18 C6 O 6 30
A19 — — — A19 D6 O 6 30
A2 SDA1 SDA0 — A2/SDRAM-16bit
A1/SDRAM-32bit A0
A12 O 6 30
A20 — — — A20 B5 O 6 30
A21 — — — A21 C5 O 6 30
A22 — — — A22 E9 O 6 30
A3 SDA2 SDA1 — A3/SDRAM-16bit
A2/SDRAM-32bit A1
A13 O 6 30
A4 SDA3 SDA2 — A4/SDRAM-16bit
A3/SDRAM-32bit A2
A14 O 6 30
A5 SDA4 SDA3 — A5/SDRAM-16bit
A4/SDRAM-32bit A3
B13 O 6 30
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-4 Freescale Semiconductor
A6 SDA5 SDA4 — A6/SDRAM-16bit
A5/SDRAM-32bit A4
B14 O 6 30
A7 SDA6 SDA5 — A7/SDRAM-16bit
A6/SDRAM-32bit A5
C12 O 6 30
A8 SDA7 SDA6 — A8/SDRAM-16bit
A7/SDRAM-32bit A6
C13 O 6 30
A9 SDA8 SDA7 — A9/SDRAM-16bit
A8/SDRAM-32bit A7
C14 O 6 30
BS0 — — — Byte strobe 0 A9 O 6 30
BS1 — — — Byte strobe 1 C8 O 6 30
BS2 — — — Byte strobe 2 E12 O 6 30
BS3 — — — Byte strobe 3 E13 O 6 30
CAS0 — — — SDRAM column select
strobe
C9 O 10 30
CLKIN — — — CPU external clock input M14 I
BUSW[1:0]2 CS0/Boot — — — Chip select 0 K9 O 6 30
CS1 — — — Chip select 1 K10 O 6 30
CS2 — — — Chip select 2 P11 O 6 30
CS3 — — — Chip select 3 N11 O 6 30
CS4 — — — Chip select 4 M11 O 6 30
CS5 — — — Chip select 5 L11 O 6 30
CS6 — — — Chip select 6 P12 O 6 30
WSEL pin2D0 PC0 — — D0/port C bit 0 L12 I/O 6 30
WSEL pin2D1 PC1 — — D1/port C bit 1 L13 I/O 6 30
WSEL pin2D10 PC10 — — D10/port C bit 10 H11 I/O 6 30
WSEL pin2D11 PC11 — — D11/port C bit 11 G11 I/O 6 30
WSEL pin2D12 PC12 — — D12/port C bit 12 F11 I/O 6 30
WSEL pin2D13 PC13 — — D13/port C bit 13 E11 I/O 6 30
WSEL pin2D14 PC14 — — D14/port C bit 14 D11 I/O 6 30
WSEL pin2D15 PC15 — — D15/port C bit 15 E10 I/O 6 30
WSEL pin2D16 D0 — — D16/D0 A5 I/O 6 30
WSEL pin2D17 D1 — — D17/D1 B6 I/O 6 30
WSEL pin2D18 D2 — — D18/D2 A6 I/O 6 30
WSEL pin2D19 D3 — — D19/D3 C7 I/O 6 30
WSEL pin2D2 PC2 — — D2/port C bit 2 L14 I/O 6 30
Table 19-1. Signal Descriptions Sorted by Function (Sheet 2 of 8)
Configured
by
(see notes)1
Pin Functions
Description
Map
BGA
Pin
I/O Drive
(mA) Cpf
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-5
WSEL pin2D20 D4 — — D20/D4 B7 I/O 6 30
WSEL pin2D21 D5 — — D21/D5 A7 I/O 6 30
WSEL pin2D22 D6 — — D22/D6 A8 I/O 6 30
WSEL pin2D23 D7 — — D23/D7 B8 I/O 6 30
WSEL pin2D24 D8 — — D24/D8 F12 I/O 6 30
WSEL pin2D25 D9 — — D25/D9 F13 I/O 6 30
WSEL pin2D26 D10 — — D26/D10 F14 I/O 6 30
WSEL pin2D27 D11 — — D27/D11 G12 I/O 6 30
WSEL pin2D28 D12 — — D28/D12 G13 I/O 6 30
WSEL pin2D29 D13 — — D29/D13 G14 I/O 6 30
WSEL pin2D3 PC3 — — D3/port C bit 3 K11 I/O 6 30
WSEL pin2D30 D14 — — D30/D14 H14 I/O 6 30
WSEL pin2D31 D15 — — D31/D15 H13 I/O 6 30
WSEL pin2D4 PC4 — — D4/port C bit 4 K12 I/O 6 30
WSEL pin2D5 PC5 — — D5/port C bit 5 K13 I/O 6 30
WSEL pin2D6 PC6 — — D6/port C bit 6 K14 I/O 6 30
WSEL pin2D7 PC7 — — D7/port C bit 7 J11 I/O 6 30
WSEL pin2D8 PC8 — — D8/port C bit 8 J12 I/O 6 30
WSEL pin2D9 PC9 — — D9/port C bit 9 J13 I/O 6 30
HIZ — — — High impedance enable N14 I 30
DCL1/
GDCL1_OUT
— — — PLIC ports 1, 2, 3 data
clock/Generated DCL out
M1 I/O 4 30
DDATA0 — — — Debug data 0 C3 O 4 30
DDATA1 — — — Debug data 1 A2 O 4 30
DDATA2 — — — Debug data 2 B2 O 4 30
DDATA3 — — — Debug data 3 A1 O 4 30
DIN1 — — — PLIC ports 1, 2, 3 data
input
N2 I
DOUT1 — — — PLIC ports 1, 2, 3 data
output
N1 O 2 30
DRESETEN — — — DRAM controller reset
enable
N12 I
E_COL — — — Collision P6 I
E_CRS — — — Carrier sense (100
base-T Ethernet only)
L10 I
Table 19-1. Signal Descriptions Sorted by Function (Sheet 3 of 8)
Configured
by
(see notes)1
Pin Functions
Description
Map
BGA
Pin
I/O Drive
(mA) Cpf
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-6 Freescale Semiconductor
E_MDIO — — — Management channel
serial data (100 base-T
only)
N10 I/O 2
E_RxCLK — — — Ethernet Rx clock N7 I
E_RxD0 — — — Ethernet Rx data P7 I
E_RxDV — — — Ethernet Rx data valid M7 I
E_Tx CLK — — — Ethernet Tx clock L7 I
E_TxD0 — — — Ethernet Tx data N6 O 4 30
E_TxEN — — — Ethernet Tx enable P8 O 2 30
E_TxER — — — Transmit error (100
base-T Ethernet only)
M10 O 2 30
FSC1/FSR1/
DFSC1
— — — PLIC port 1 IDL FSR/GCI
FSC1/Generated frame
sync 1 Out
L4 I/O 2 30
GND Ground — — E[7,8]
F[7,8]
G[6–9]
H[6–9]
J[7,8]
Port D Cntl
Reg3High Z DCL0 URT1_CLK — Port 0 data clock/UART1
baud clock
J4 I
Port D Cntl
Reg3High Z DIN0 URT1_RxD — IDL/GCI data in/UART1
Rx data
K1 I
Port D Cntl
Reg3High Z – URT1_
CTS
QSPI_
CS2
UART1 CTS/QSPI_CS2 K2 I/O 2 30
Port D Cntl
Reg3High Z – URT1_RTS INT5 UART1 RTS/INT5 K3 I/O 2 30
Port D Cntl
Reg3High Z DOUT0 URT1_TxD — IDL-GCI data Out/UART1
Tx data
K4 O 2 30
Port D Cntl
Reg3High Z – DIN3 INT4 Interrupt 4 input/PLIC
port 3 data input
P2 I
Port D Cntl
Reg3High Z PWM_
OUT1
TOUT1 — PWM output compare 1
/Timer 1 output compare
P5 O 4 30
Port D Cntl
Reg3High Z PWM_
OUT2
TIN1 — PWM output compare 2
/Timer 1 input
K6 I/O 4 30
INT1/
USB_WOR
— — — Interrupt input 1/USB
wake-on-ring
M4 I
INT2 — — — Interrupt input 1 P3 I
INT3 — — — Interrupt input 3 N3 I
Table 19-1. Signal Descriptions Sorted by Function (Sheet 4 of 8)
Configured
by
(see notes)1
Pin Functions
Description
Map
BGA
Pin
I/O Drive
(mA) Cpf
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-7
MTMOD — — — 0 selects JTAG mode, 1
selects BDM mode
B3 I
OE/RD — — — Output enable/Read P13 O 4 30
Port A Cntl
Reg3PA0 USB_TP — — Port A bit 0/
USB Tx positive
D2 I/O 2 30
Port A Cntl
Reg3PA1 USB_RP — — Port A bit 1/
USB Rx positive
D1 I/O 2 30
Port A Cntl
Reg3PA10 DREQ0 — — Port A bit 10/IDL DREQ0 K5 I/O 2 30
Port A Cntl
Reg3PA11 — QSPI_CS1 — Port A bit 11/QSPI chip
select 1
L1 I/O 2 30
Port A Cntl
Reg3PA12 DFSC2 — — Port A bit 12/Delayed
frame sync 2
L2 I/O 2 30
Port A Cntl
Reg3PA13 DFSC3 — — Port A bit 13/Delayed
frame sync 3
L3 I/O 2 30
Port A Cntl
Reg3PA14 DREQ1 — — Port A bit 14/PLIC port 1
IDL D-channel request
M2 I/O 4 30
Port A Cntl
Reg3PA15_INT6 DGNT1_INT6 — — Port A bit 15/PLIC port 1
D-channel grant/Interrupt
6 input
M3 I/O 2 30
Port A Cntl
Reg3PA2 USB_RN — — Port A bit 2/
USB Rx negative
E5 I/O 2 30
Port A Cntl
Reg3PA3 USB_TN — — Port A bit 3/
USB Tx negative
E4 I/O 2 30
Port A Cntl
Reg3PA4 USB_
Susp
— — Port A bit 4/
Suspend USB driver
E3 I/O 2 30
Port A Cntl
Reg3PA5 USB_TxEN — — Port A bit 5/USB
transmitter enable
E2 I/O 2 30
Port A Cntl
Reg3PA6 USB_RxD — — Port A bit 6/USB receive
data output
E1 I/O 2 30
Port A Cntl
Reg3PA7 QSPI_CS3 DOUT3 — PA7/QSPI chip select
4/PLIC port 3 data output
P1 I/O 2 30
Port A Cntl
Reg3PA8 FSC0/
FSR0
— — Port A bit 8/IDL FSR0 &
GCI FSC0
J2 I/O 2 30
Port A Cntl
Reg3PA9 DGNT0 — — Port A bit 9//IDL DGNT0 J3 I/O 2 30
Port B Cntl
Reg3PB0 URT0_TxD — — Port B bit 0/UART0 Tx
data
H4 I/O 4 30
Port B Cntl
Reg3PB1 URT0_RxD — — Port B bit 1/UART0 Rx
data
H1 I/O 2 30
Table 19-1. Signal Descriptions Sorted by Function (Sheet 5 of 8)
Configured
by
(see notes)1
Pin Functions
Description
Map
BGA
Pin
I/O Drive
(mA) Cpf
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-8 Freescale Semiconductor
Port B Cntl
Reg3PB10 E_TxD1 — — Port B bit 10/Tx data bit 1
(100 Base-T Ethernet
only)
L8 I/O 4 30
Port B Cntl
Reg3PB11 E_RxD3 — — Port B bit 11/Rx data bit 3
(100 Base-T Ethernet
only)
P9 I/O 2 30
Port B Cntl
Reg3PB12 E_RxD2 — — Port B bit 12/Rx data bit 2
(100 Base-T Ethernet
only)
N9 I/O 2 30
Port B Cntl
Reg3PB13 E_RxD1 — — Port B bit 13/Rx data bit 1
(100 Base-T Ethernet
only)
M9 I/O 2 30
Port B Cntl
Reg3PB14 E_RxER — — Port B bit 14/Receive
Error (100 Base-T
Ethernet only)
L9 I/O 2 30
Port B Cntl
Reg3PB15 E_MDC — — Port B bit 15/
Management Channel
Clock (100 Base-T only)
P10 I/O 2 30
Port B Cntl
Reg3PB2 URT0_
CTS
— — Port B bit 2/UART0 CTS H2 I/O 2 30
Port B Cntl
Reg3PB3 URT0_
RTS
— — Port B bit 3/UART0 RTS H3 I/O 4 30
Port B Cntl
Reg3PB4 URT0_CLK — — Port B bit 4/UART0 baud
clock
G3 I/O 2 30
Port B Cntl
Reg3PB5 TA — — Port B bit 5/Transfer
acknowledge
F3 I/O 2
Port B Cntl
Reg3PB6 — — — Port B bit 6 G4 I/O 2 30
Port B Cntl
Reg3PB7 TOUT0 — — Port B bit 7/Timer 0
output compare
M6 I/O 4 30
Port B Cntl
Reg3PB8 E_TxD3 — — Port B bit 8/Tx data bit 3
(100 Base-T Ethernet
only)
N8 I/O 4 30
Port B Cntl
Reg3PB9 E_TxD2 — — Port B bit 9/Tx data bit 2
(100 Base-T Ethernet
only)
M8 I/O 4 30
PST0 — — — Internal processor status
0
B1 O 4 30
PST1 — — — Internal processor status
1
C2 O 4 30
PST2 — — — Internal processor status
2
C1 O 4 30
Table 19-1. Signal Descriptions Sorted by Function (Sheet 6 of 8)
Configured
by
(see notes)1
Pin Functions
Description
Map
BGA
Pin
I/O Drive
(mA) Cpf
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-9
PST3 — — — Internal processor status
3
D3 O 4 30
PWM_OUT0 — — — PWM output compare 0 N5 O 4 30
QSPI_CLK/
BUSW1
— — — QSPI serial clock/CS0
bus width bit 1
L5 O 4 30
QSPI_CS0/
BUSW0
— — — QSPI peripheral chip
select 0/CS0 bus width
bit 0
M5 O 2 30
QSPI_Din — — — QSPI data input P4 I
QSPI_Dout/
WSEL
— — — QSPI data output/Bus
width selection
N4 I/O 4 30
R/W — — — Read/Write P14 O 10 30
RAS0 — — — SDRAM row select
strobe
A10 O 10 30
RSTI — — — Device reset M12 I
RSTO — — — Reset output strobe F4 O 4 30
SDBA0 — — — SDRAM bank 0 select J14 O 10 30
SDBA1 — — — SDRAM bank 1 select H12 O 10 30
SDCLK — — — SDRAM (bus) clock,
Same frequency as CPU
clock
E14 O 10 30
SDCLKE — — — SDRAM clock enable D13 O 10 30
SDCS/
CS7
— — — SDRAM chip select/CS7 B10 O 10 30
SDWE — — — SDRAM write enable B9 O 10 30
BYPASS — — — Bypass internal test
mode
M13 O 4 30
MTMOD4TCK PSTCLK — — JTAG test clock in/
BDM PSTCLK output
C4 I/O 4 30
MTMOD4TDI DSI — — JTAG test data in/BDM
data in
A4 I
MTMOD4TDO DSO — — JTAG test data out
/BDM data out
D5 O 4 30
TEA — — — BDM debug transfer error
acknowledge
A3 I
TEST — — — Device test mode enable E6 I
TIN0 — — — Timer 0 input L6 I
MTMOD4TMS BKPT — — JTAG test mode/BDM
select breakpoint input
B4 I
Table 19-1. Signal Descriptions Sorted by Function (Sheet 7 of 8)
Configured
by
(see notes)1
Pin Functions
Description
Map
BGA
Pin
I/O Drive
(mA) Cpf
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-10 Freescale Semiconductor
MTMOD4TRST DSCLK — — JTAG reset/BDM clock D4 I
USB_CLK — — — USB external 48-MHz
clock input
J1 I
USB_D+ — — — USB line driver high,
analog5F1 O – 30
USB_D– — — — USB line driver low,
analog5F2 O – 30
USB_GND — — — USB transceiver GND G2 I
USB_VDD — — — USB transceiver VDD G1 I
VDD +3.3V — — F[5,6]
F[9,10]
G[5,10]
H[5,10]
J[5,6]
J[9,10]
K[7,8]
N13
1No entry in this column means that after reset the pin is not reconfigurable and has only one definition.
2WSEL, BUSW1, BUSW0, HIZ, and others, refers to function determined by pull-up or pull-down value as seen by these
address pins during reset.
3“Port x Cntl Reg” refers to pin function programmed by software writing to GPIO port configuration registers.
4MTMOD means that pin function is determined by state of the MTMOD signal.
5Requires external protection circuitry to meet USB 1.1 electrical requirements under all conditions (see 12.5.3,
“Recommended USB Protection Circuit”).
Table 19-1. Signal Descriptions Sorted by Function (Sheet 8 of 8)
Configured
by
(see notes)1
Pin Functions
Description
Map
BGA
Pin
I/O Drive
(mA) Cpf
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-11
Table 19-2 presents signal names, functions, and descriptions sorted by pin numbers.
Table 19-2. Signal Name and Description by Pin Number (Sheet 1 of 8)
Map
BGA
Pin
Pin Functions
Name Description I/O
0 (Reset) 1 2 3
A1 DDATA3 — — — DDATA3 Debug data 3 O
A2 DDATA1 — — — DDATA1 Debug data 1 O
A3 TEA — — — TEA BDM debug transfer error
acknowledge
I
A4 TDI DSI — — TDI/DSI JTAG test data in/BDM
data in
I
A5 D16 D0 — — D16/D0 D16/D0 I/O
A6 D18 D2 — — D18/D2 D18/D2 I/O
A7 D21 D5 — — D21/D5 D21/D5 I/O
A8 D22 D6 — — D22/D6 D22/D6 I/O
A9 BS0 — — — BS0 Byte strobe 0 O
A10 RAS0 — — — RAS0 SDRAM row select strobe O
A11 A13 SDA12 SDA11 — A13/SDA12/SDA11 A13/SDRAM-16bit
A12/SDRAM-32bit A11
O
A12 A2 SDA1 SDA0 — A2/SDA1/SDA0 A2/SDRAM-16bit
A1/SDRAM-32bit A0
O
A13 A3 SDA2 SDA1 — A3/SDA2/SDA1 A3/SDRAM-16bit
A2/SDRAM-32bit A1
O
A14 A4 SDA3 SDA2 — A4/SDA3/SDA2 A4/SDRAM-16bit
A3/SDRAM-32bit A2
O
B1 PST0 — — — PST0 Internal processor status
0
O
B2 DDATA2 — — — DDATA2 Debug data 2 O
B3 MTMOD — — — MTMOD 0 selects JTAG mode, 1
selects BDM mode
I
B4 TMS BKPT — — TMS/BKPT JTAG test mode/BDM
select breakpoint input
I
B5 A20 — — — A20 A20 O
B6 D17 D1 — — D17/D1 D17/D1 I/O
B7 D20 D4 — — D20/D4 D20/D4 I/O
B8 D23 D7 — — D23/D7 D23/D7 I/O
B9 SDWE — — — SDWE SDRAM write enable O
B10 SDCS/
CS7
— — — SDCS / CS7 SDRAM chip select/CS7 O
B11 A12 SDA11 — — A12/SDA11 A12/SDRAM-16bit A11 O
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-12 Freescale Semiconductor
B12 A1 SDA0 — — A1/SDA0 A1/SDRAM-16bit A0 O
B13 A5 SDA4 SDA3 — A5/SDA4/SDA3 A5/SDRAM-16bit
A4/SDRAM-32bit A3
O
B14 A6 SDA5 SDA4 — A6/SDA5/SDA4 A6/SDRAM-16bit
A5/SDRAM-32bit A4
O
C1 PST2 — — — PST2 Internal processor status
2
O
C2 PST1 — — — PST1 Internal processor status
1
O
C3 DDATA0 — — — DDATA0 Debug data 0 O
C4 TCK PSTCLK — — TCK/PSTCLK JTAG test clock in/
BDM PSTCLK output
I/O
C5 A21 — — — A21 A21 O
C6 A18 — — — A18 A18 O
C7 D19 D3 — — D19/D3 D19/D3 I/O
C8 BS1 — — — BS1 Byte strobe 1 O
C9 CAS0 — — — CAS0 SDRAM column select
strobe
O
C10 A14 SDA13 SDA12 — A14/SDA13/SDA12 A14/SDRAM-16bit
A13/SDRAM-32bit A12
O
C11 A11 — SDA9 — A11/SDA9 A11/SDRAM-32bit A9 O
C12 A7 SDA6 SDA5 — A7/SDA6/SDA5 A7/SDRAM-16bit
A6/SDRAM-32bit A5
O
C13 A8 SDA7 SDA6 — A8/SDA7/SDA6 A8/SDRAM-16bit
A7/SDRAM-32bit A6
O
C14 A9 SDA8 SDA7 — A9/SDA8/SDA7 A9/SDRAM-16bit
A8/SDRAM-32bit A7
O
D1 PA1 USB_RP — — PA1/USB_RP Port A bit 1/
USB Rx positive
I/O
D2 PA0 USB_TP — — PA0/USB_TP Port A bit 0/
USB Tx positive
I/O
D3 PST3 — — — PST3 Internal processor
status 3
O
D4 TRST DSCLK — — TRST/DSCLK JTAG reset/BDM clock I
D5 TDO DSO — — TDO/DSO JTAG test data out
/BDM data out
O
D6 A19 — — — A19 A19 O
D7 A17 — — — A17 A17 O
Table 19-2. Signal Name and Description by Pin Number (Sheet 2 of 8)
Map
BGA
Pin
Pin Functions
Name Description I/O
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-13
D8 A16 — — — A16 A16 O
D9 A15 — — — A15 A15 O
D10 A0 — — — A0 A0 O
D11 D14 PC14 — — D14/PC14 D14/port C bit 14 I/O
D12 A10 SDA9 SDA8 — A10/SDA9/SDA8 A10/SDRAM-16bit
A9/SDRAM-32bit A8
O
D13 SDCLKE — — — SDCLKE SDRAM clock enable O
D14 A10_PRECHG — — — A10_PRECHG SDRAM A10_Precharge O
E1 PA6 USB_RxD — — PA6/USB_RxD Port A bit 6/USB receive
data output
I/O
E2 PA5 USB_TxEN — — PA5/USB_TxEN Port A bit 5/USB
transmitter enable
I/O
E3 PA4 USB_
Susp
— — PA4/USB_Susp Port A bit 4/
Suspend USB driver
I/O
E4 PA3 USB_TN — — PA3/USB_TN Port A bit 3/
USB Tx negative
I/O
E5 PA2 USB_RN — — PA2/USB_RN Port A bit 2/
USB Rx negative
I/O
E6 TEST – — — TEST Device test mode enable I
E7 GND Ground — — GND
E8 GND Ground — — GND
E9 A22 – — — A22 A22 O
E10 D15 PC15 — — D15/PC15 D15/port C bit 15 I/O
E11 D13 PC13 — — D13/PC13 D13/port C bit 13 I/O
E12 BS2 — — — BS2 Byte strobe 2 O
E13 BS3 — — — BS3 Byte strobe 3 O
E14 SDCLK — — — SDCLK SDRAM (bus) clock,
Same frequency as CPU
clock
O
F1 USB_D+ — — — USB_D+ USB line driver high,
analog
O
F2 USB_D- — — — USB_D- USB line driver low,
analog
O
F3 PB5 TA — — PB5/TA Port B bit 5/Transfer
acknowledge
I/O
F4 RSTO — — — RSTO Reset output strobe O
F5 VDD +3.3V — — VDD
Table 19-2. Signal Name and Description by Pin Number (Sheet 3 of 8)
Map
BGA
Pin
Pin Functions
Name Description I/O
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-14 Freescale Semiconductor
F6 VDD +3.3V — — VDD
F7 GND Ground — — GND
F8 GND Ground — — GND
F9 VDD +3.3V — — VDD
F10] VDD +3.3V — — VDD
F11 D12 PC12 — — D12/PC12 D12/port C bit 12 I/O
F12 D24 D8 — — D24/D8 D24/D8 I/O
F13 D25 D9 — — D25/D9 D25/D9 I/O
F14 D26 D10 — — D26/D10 D26/D10 I/O
G1 USB_VDD — — — USB_VDD USB transceiver VDD I
G2 USB_GND — — — USB_GND USB transceiver GND I
G3 PB4 URT0_CLK — — PB4/URT0_CLK Port B bit 4/UART0 baud
clock
I/O
G4 PB6 — — — PB6 Port B bit 6 I/O
G5 VDD +3.3V — — VDD
G6 GND Ground — — GND
G7 GND Ground — — GND
G8 GND Ground — — GND
G9 GND Ground — — GND
G10 VDD +3.3V — — VDD
G11 D11 PC11 — — D11/PC11 D11/port C bit 11 I/O
G12 D27 D11 — — D27/D11 D27/D11 I/O
G13 D28 D12 — — D28/D12 D28/D12 I/O
G14 D29 D13 — — D29/D13 D29/D13 I/O
H1 PB1 URT0_RxD — — PB1/URT0_RxD Port B bit 1/UART0 Rx
data
I/O
H2 PB2 URT0_
CTS
— — PB2/URT0_CTS Port B bit 2/UART0 CTS I/O
H3 PB3 URT0_
RTS
— — PB3/URT0_RTS Port B bit 3/UART0 RTS I/O
H4 PB0 URT0_TxD — — PB0/URT0_TxD Port B bit 0/UART0 Tx
data
I/O
H5 VDD +3.3V — — VDD
H6 GND Ground — — GND
H7 GND Ground — — GND
Table 19-2. Signal Name and Description by Pin Number (Sheet 4 of 8)
Map
BGA
Pin
Pin Functions
Name Description I/O
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-15
H8 GND Ground — — GND
H9 GND Ground — — GND
H10 VDD +3.3V — — VDD
H11 D10 PC10 — — D10/PC10 D10/port C bit 10 I/O
H12 SDBA1 — — — SDBA1 SDRAM bank 1 select O
H13 D31 D15 — — D31/D15 D31/D15 I/O
H14 D30 D14 — — D30/D14 D30/D14 I/O
J1 USB_CLK — — — USB_CLK USB external 48-MHz
clock input
I
J2 PA8 FSC0/
FSR0
— — PA8/FSC0/FSR0 Port A bit 8/IDL FSR0 &
GCI FSC0
I/O
J3 PA9 DGNT0 — — PA9/DGNT0 Port A bit 9//IDL DGNT0 I/O
J4 High Z DCL0 URT1_CLK — DCL0/URT1_CLK Port 0 data clock/UART1
baud clock
I
J5 VDD +3.3V — — VDD
J6 VDD +3.3V — — VDD
J7 GND Ground — — GND
J8 GND Ground — — GND
J9 VDD +3.3V — — VDD
J10 VDD +3.3V — — VDD
J11 D7 PC7 — — D7/PC7 D7/port C bit 7 I/O
J12 D8 PC8 — — D8/PC8 D8/port C bit 8 I/O
J13 D9 PC9 — — D9/PC9 D9/port C bit 9 I/O
J14 SDBA0 — — — SDBA0 SDRAM bank 0 select O
K1 High Z DIN0 URT1_RxD — DIN0/URT1_RxD IDL/GCI data in/UART1
Rx data
I
K2 High Z — URT1_
CTS
QSPI_
CS2
URT1_CTS/QSPI_CS2 UART1 CTS/QSPI_CS2 I/O
K3 High Z — URT1_RTS INT5 URT1_RTS/INT5 UART1 RTS/INT5 I/O
K4 High Z DOUT0 URT1_TxD — DOUT0/URT1_TxD IDL-GCI data Out/UART1
Tx data
O
K5 PA10 DREQ0 — — PA10/DREQ0 Port A bit 10/IDL DREQ0 I/O
K6 High Z PWM_
OUT2
TIN1 — PWM_OUT2/TIN1 PWM output compare 2
/Timer 1 input
I/O
K7 VDD +3.3V — — VDD
K8 VDD +3.3V — — VDD
Table 19-2. Signal Name and Description by Pin Number (Sheet 5 of 8)
Map
BGA
Pin
Pin Functions
Name Description I/O
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-16 Freescale Semiconductor
K9 CS0/Boot — — — CS0/Boot Chip select 0 O
K10 CS1 — — — CS1 Chip select 1 O
K11 D3 PC3 — — D3/PC3 D3/port C bit 3 I/O
K12 D4 PC4 — — D4/PC4 D4/port C bit 4 I/O
K13 D5 PC5 — — D5/PC5 D5/port C bit 5 I/O
K14 D6 PC6 — — D6/PC6 D6/port C bit 6 I/O
L1 PA11 — QSPI_CS1 — PA11/QSPI_CS1 Port A bit 11/QSPI chip
select 1
I/O
L2 PA12 DFSC2 — — PA12/DFSC2 Port A bit 12/Delayed
frame sync 2
I/O
L3 PA13 DFSC3 — — PA13/DFSC3 Port A bit 13/Delayed
frame sync 3
I/O
L4 FSC1/FSR1/
DFSC1
— — — FSC1/FSR1/DFSC1 PLIC port 1 IDL FSR/GCI
FSC1/Generated frame
sync 1 Out
I/O
L5 QSPI_CLK/
BUSW1
— — — QSPI_CLK / BUSW1 QSPI serial clock/CS0
bus width bit 1
O
L6 TIN0 — — — TIN0 Timer 0 input I
L7 E_Tx CLK — — — E_Tx CLK Ethernet Tx clock I
L8 PB10 E_TxD1 — — PB10/E_TxD1 Port B bit 10/Tx data bit 1
(100 Base-T Ethernet
only)
I/O
L9 PB14 E_RxER — — PB14/E_RxER Port B bit 14/Receive
Error (100 Base-T
Ethernet only)
I/O
L10 E_CRS — — — E_CRS Carrier sense (100
base-T Ethernet only)
I
L11 CS5 — — — CS5 Chip select 5 O
L12 D0 PC0 — — D0/PC0 D0/port C bit 0 I/O
L13 D1 PC1 — — D1/PC1 D1/port C bit 1 I/O
L14 D2 PC2 — — D2/PC2 D2/port C bit 2 I/O
M1 DCL1/
GDCL1_OUT
— — — DCL1/GDCL1_OUT PLIC ports 1, 2, 3 data
clock/Generated DCL out
I/O
M2 PA14 DREQ1 — — PA14/DREQ1 Port A bit 14/PLIC port 1
IDL D-channel request
I/O
M3 PA15_INT6 DGNT1_INT6 — — PA15_INT6/DGNT1_INT6 Port A bit 15/PLIC port 1
D-channel grant/Interrupt
6 input
I/O
Table 19-2. Signal Name and Description by Pin Number (Sheet 6 of 8)
Map
BGA
Pin
Pin Functions
Name Description I/O
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-17
M4 INT1/
USB_WOR
———INT1/ USB_WOR Interrupt input 1/USB
wake-on-ring
I
M5 QSPI_CS0/
BUSW0
— — — QSPI_CS0 / BUSW0 QSPI peripheral chip
select 0/CS0 bus width bit
0
O
M6 PB7 TOUT0 — — PB7/TOUT0 Port B bit 7/Timer 0
output compare
I/O
M7 E_RxDV — — — E_RxDV Ethernet Rx data valid I
M8 PB9 E_TxD2 — — PB9/E_TxD2 Port B bit 9/Tx data bit 2
(100 Base-T Ethernet
only)
I/O
M9 PB13 E_RxD1 — — PB13/E_RxD1 Port B bit 13/Rx data bit 1
(100 Base-T Ethernet
only)
I/O
M10 E_TxER — — — E_TxER Transmit error (100
base-T Ethernet only)
O
M11 CS4 — — — CS4 Chip select 4 O
M12 RSTI — — — RSTI Device reset I
M13 BYPASS — — — BYPASS Bypass internal test
mode
O
M14 CLKIN — — — CLKIN CPU external clock input I
N1 DOUT1 — — — DOUT1 PLIC ports 1, 2, 3 data
output
O
N2 DIN1 — — — DIN1 PLIC ports 1, 2, 3 data
input
I
N3 INT3 — — — INT3 Interrupt input 3 I
N4 QSPI_Dout/
WSEL
— — — QSPI_Dout / WSEL QSPI data output/Bus
width selection
I/O
N5 PWM_OUT0 — — — PWM_OUT0 PWM output compare 0 O
N6 E_TxD0 — — — E_TxD0 Ethernet Tx data O
N7 E_RxCLK — — — E_RxCLK Ethernet Rx clock I
N8 PB8 E_TxD3 — — PB8/E_TxD3 Port B bit 8/Tx data bit 3
(100 Base-T Ethernet
only)
I/O
N9 PB12 E_RxD2 — — PB12/E_RxD2 Port B bit 12/Rx data bit 2
(100 Base-T Ethernet
only)
I/O
N10 E_MDIO — — — E_MDIO Management channel
serial data (100 base-T
only)
I/O
Table 19-2. Signal Name and Description by Pin Number (Sheet 7 of 8)
Map
BGA
Pin
Pin Functions
Name Description I/O
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-18 Freescale Semiconductor
N11 CS3 — — — CS3 Chip select 3 O
N12 DRESETEN — — — DRESETEN DRAM controller reset
enable
I
N13 VDD +3.3V — —
N14 HIZ — — — HiZ High impedance enable I
P1 PA7 QSPI_CS3 DOUT3 — PA7/QSPI_CS3/DOUT3 PA7/QSPI chip select
4/PLIC port 3 data output
I/O
P2 High Z — DIN3 INT4 DIN3/INT4 Interrupt 4 input/PLIC
port 3 data input
I
P3 INT2 — — — INT2 Interrupt input 1 I
P4 QSPI_Din — — — QSPI_Din QSPI data input I
P5 High Z PWM_
OUT1
TOUT1 — PWM_OUT1/TOUT1 PWM output compare 1
/Timer 1 output compare
O
P6 E_COL — — — E_COL Collision I
P7 E_RxD0 — — — E_RxD0 Ethernet Rx data I
P8 E_TxEN — — — E_TxEN Ethernet Tx enable O
P9 PB11 E_RxD3 — — PB11/E_RxD3 Port B bit 11/Rx data bit 3
(100 Base-T Ethernet
only)
I/O
P10 PB15 E_MDC — — PB15/E_MDC Port B bit 15/
Management Channel
Clock (100 Base-T only)
I/O
P11 CS2 — — — CS2 Chip select 2 O
P12 CS6 — — — CS6/AEN Chip select 6 O
P13 OE/RD — — — OE/RD Output enable/Read O
P14 R/W ——— R/WRead/Write O
Table 19-2. Signal Name and Description by Pin Number (Sheet 8 of 8)
Map
BGA
Pin
Pin Functions
Name Description I/O
0 (Reset) 1 2 3
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-19
19.3 Address Bus (A[22:0]/SDA[13:0])
The 23 dedicated address signals, A[22:0], define the address of external byte, word, and longword
accesses. These three-state outputs are the 23 lsbs of the internal 32-bit address bus and are multiplexed
with the SDRAM controller row and column addresses (SDA[13:0]).
Fourteen address signals are used for connecting to SDRAM devices as large as 256 Mbits.
The MCF5272 supports SDRAM widths of 16 or 32 bits. For a 32-bit width, SDRAM address signals are
multiplexed starting with A2. For a 16-bit width, address signals are multiplexed starting with A1.
19.4 Data Bus (D[31:0])
The 32-bit, three-state, bidirectional, non-multiplexed data bus transfers data to and from the MCF5272.
A read or write operation can transfer 8, 16, or 32 bits in one bus cycle. When a 16-bit data bus is used,
mode parallel port C pins can be multiplexed onto D[15:0].
Data read from or written to on-chip peripherals is visible on the external data bus when the device’s
external bus width is 32 bits. When the device is configured for external 16-bit wide data bus and the data
access is 32 bits wide, the lower 16 bits of on-chip data are not visible externally. On-chip cache, ROM,
and SRAM accesses are not visible externally.
19.4.1 Dynamic Data Bus Sizing
When the device is in normal mode, dynamic bus sizing lets the programmer change data bus width
between 8, 32, and 16 bits for each chip select. The initial width for the bootstrap program chip select, CS0,
is determined by the state of BUSW[1:0]. The program should select bus widths for the other chip selects
before accessing the associated memory space.
19.5 Chip Selects (CS7/SDCS, CS[6:0])
The eight chip selects, CS[7:0], allow the MCF5272 to interface directly to SRAM, EPROM, EEPROM,
and external memory-mapped peripherals. These signals can be programmed for an address location, with
masking capabilities, port size, burst capability indication, and wait-state generation.
CS0 provides a special function as a global chip select that allows access to boot ROM at reset. CS0 can
have its address redefined after reset. CS0 is the only chip select initialized and enabled during reset. All
other chip selects are disabled at reset and must be initialized by device initialization software.
CS7/SDCS can be configured to access RAM or ROM or one physical bank of SDRAM. Only CS7 can
be used for SDRAM chip select.
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-20 Freescale Semiconductor
19.6 Bus Control Signals
This section describes bus control signals.
19.6.1 Output Enable/Read (OE/RD)
The output enable/read signal (OE/RD) defines the data transfer direction for the data bus D[31:0] for
accesses to SRAM, ROM or external peripherals. A low (logic zero) level indicates a read cycle while a
high (logic one) indicates a write cycle.
This signal is normally connected to the OE pins of external SRAM, ROM, or FLASH.
19.6.2 Byte Strobes (BS[3:0])
The byte strobes (BS[3:0]) define the flow of data on the data bus. During SRAM and peripheral accesses,
these outputs indicate that data is to be latched or driven onto a byte of the data when driven low. BSn
signals are asserted only to the memory bytes used during a read or write access.
BSn signals are asserted during accesses to on-chip peripherals but not to on-chip SRAM, cache, or ROM.
During SDRAM accesses, these signals indicate a byte transfer between SDRAM and the MCF5272 when
driven high.
For SRAM or FLASH devices, BS[3:0] outputs should be connected to individual byte strobe signals.
For SDRAM devices, BS[3:0] should be connected to individual SDRAM DQM signals. Note that most
SDRAMs associate DQM3 with the MSB, in which case BS3 should be connected to the SDRAM's
DQM3 input.
Table 19-3. Byte Strobe Operation for 32-Bit Data Bus
BS3 BS2 BS1 BS0 Access Type Access Size Data Located On
1111 None None —
1110FLASH/SRAM Byte D[31:24]
1101FLASH/SRAM D[23:16]
1 0 1 1 FLASH/SRAM D[15:8]
0111FLASH/SRAM D[7:0]
1 1 0 0 FLASH/SRAM Word D[31:16]
0 0 1 1 FLASH/SRAM D[15:0]
0 0 0 0 FLASH/SRAM Longword D[31:0]
1110 SDRAM Byte D[7:0]
1 1 0 1 SDRAM D[15:8]
1011 SDRAM D[23:16]
0111 SDRAM D[31:24]
1 1 0 0 SDRAM Word D[15:0]
0011 SDRAM D[31:16]
0 0 0 0 SDRAM Longword D[31:0]
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-21
NOTE
In 16-bit bus mode, longword accesses are performed as two sequential
word accesses.
Table 19-6 shows how BS[3:0] should be connected to DQMx for 16- and 32-bit SDRAM configurations.
19.6.3 Read/Write (R/W)
R/W is programmed on a per -chip-select basis for use with SRAM and external peripheral write accesses.
It should be connected to the external peripheral or memory write enable signal.
R/W acts as a write strobe to external SRAM when the decoded chip select is configured for e ither of the
two SRAM/ROM modes. It is asserted during on-chip peripherals accesses and negated during on-chip
SRAM accesses.
Table 19-4. Byte Strobe Operation
for 16-Bit Data Bus—SRAM Cycles
BS1 BS0 Access Size Data Located On
1 1 None —
1 0 Byte D[31:24]
0 1 Byte D[23:16]
0 0 Word D[31:16]
Table 19-5. Byte Strobe Operation
for 16-Bit Data Bus—SDRAM Cycles
BS3 BS2 Access Type Data Located On
1 1 None —
1 0 Byte D[23:16]
0 1 Byte D[31:24]
0 0 Word D[31:16]
Table 19-6. Connecting BS[3:0] to DQMx
5272 SDRAM
Data Signals
16 Bit 32 Bit 16 Bit 32 Bit (2 x 16) 32 Bit (1 x 32)
BS3 BS3 DQMH DQMH DQM3 D[31:24]
BS2 BS2 DQML DQML DQM2 D[23:16]
NC BS1 NC DQMH DQM1 D[15:8]
NC BS0 NC DQML DQM0 D[7:0]
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-22 Freescale Semiconductor
19.6.4 Transfer Acknowledge (TA/PB5)
Assertion of the transfer acknowledge (TA/PB5) input terminates an external bus cycle. It is enabled on a
per chip select basis by programming the wait state field to 0x1F in the corresponding chip select option
register (CSORn[WS]). This pin requires a 4.7-K¾ pull-up resistor or external logic that drives inactive
high.
TA must always be returned high before it can be detected again. Asserting TA into the next bus cycle has
no effect and does not terminate the bus cycle.
NOTE:
Even though EBI modes set to SDRAM require setting the wait state field
in the chip select option register to 31, a low signal should never be applied
to TA during such accesses. For SDRAM accesses the bus cycle is
terminated internally by circuitry in the SDRAM module.
19.6.5 Hi-Z
HiZ is a test signal. When it is connected to GND during reset, all output pins are driven to high impedance.
A 4.7-K¾ pullup resistor should be connected to this signal if the Hi-Z function is not used. Hi-Z
configuration input is sampled on the rising edge of Reset Output (RSTO).
19.6.6 Bypass
Bypass is a Freescale test mode signal. This signal should be left unconnected.
19.6.7 SDRAM Row Address Strobe (RAS0)
RAS0 is the SDRAM row address strobe output.
19.6.8 SDRAM Column Address Strobe (CAS0)
CAS0 is the SDRAM column address strobe output.
19.6.9 SDRAM Clock (SDCLK)
The SDRAM clock output (SDCLK) is the same frequency as the CPU clock.
19.6.10 SDRAM Write Enable (SDWE)
This output is the SDRAM write enable.
19.6.11 SDRAM Clock Enable (SDCLKE)
This output is the SDRAM clock enable.
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-23
19.6.12 SDRAM Bank Selects (SDBA[1:0])
These outputs are the SDRAM bank select signals.
19.6.13 SDRAM Row Address 10 (A10)/A10 Precharge (A10_PRECHG)
This output is the SDRAM row address 10 and the precharge strobe.
19.7 CPU Clock and Reset Signals
This section describes clock and reset signals in the CPU.
19.7.1 RSTI
RSTI is the primary reset input to the device. Asserting RSTI immediately resets the CPU and peripherals.
However, the reset of the SDRAM controller and hence SDRAM contents depend on DRESETEN.
Asserting RSTI also causes RSTO to be asserted for 32K CPU clock cycles.
19.7.2 DRESETEN
DRESETEN is asserted to indicate that the SDRAM controller is to be reset whenever RSTI asserts. If
DRESETEN is high, RSTI does not affect the SDRAM controller, which continues to refresh external
memory. This is useful for debug situations where a reset of the device is required without losing data
located in SDRAM. DRESETEN is normally tied high or low depending on system requirements. It should
never be tied to RSTI or RSTO.
19.7.3 CPU External Clock (CLKIN)
CLKIN should be connected to an external clock oscillator. The CLKIN input frequency can range from
DC to 66 MHz. The frequency input to this signal must be greater than twice the frequency applied at E_Tx
CLK. The clock frequency applied to CLKIN must exceed 24 MHz when the system uses a USB
peripheral.
19.7.4 Reset Output (RSTO)
Reset output (RSTO ) is driven low for 128 CPU clocks when the soft reset bit of the system configuration
register (SCR[SOFTRST]) is set. I t is driven low for 32K CPU clocks when the software watchdog timer
times out or when a low input level is applied to RSTI.
19.8 Interrupt Request Inputs (INT[6:1])
The six interrupt request inputs (INT[6:1]) can generate separate, maskable interrupts on negative edge
(high to low) or positive edge (low to high) transitions. In addition to the triggering edge being
programmable, the priority can also be programmed. Each interrupt input has a separate programmable
interrupt level.
Signal Descriptions
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After a device reset, INT[4:1] are enabled but the function is masked. INT4/DIN3 function can be changed
by software. INT[3:1] functions are always assigned to dedicated pins.
Interrupts INT[6:4] are multiplexed with other functions as follows:
• DGNT1_INT6/PA15_INT6
•INT5/URT1_RTS
•INT4/DIN3
INT1 is also internally connected to the USC_WOR function.
The INT6 function is always available regardless of the other functions enabled on this pin.
19.9 General-Purpose I/O (GPIO) Ports
Each of the three GPIO ports is 16 bits wide. Each port line can be individually configured as input or
output. Except where indicated, each pin function is independently selectable between the corresponding
port pin or the other functions that may be multiplexed onto the pin. After reset all pins multiplexed with
GPIO signals default to inputs.
Port A general purpose I/O, PA[15:8] are multiplexed with PLIC TDM port 1 pins.
Port A general purpose I/O, PA[6:0] are multiplexed with USB module signals. PA7 is multiplexed with
QSPI_CS3 and DOUT3.
Port B general purpose I/O, PB[4:0] are multiplexed with the UART0 interface pins. If the UART0
interface is enabled, PB[4:0] are unavailable. PB5 is multiplexed with TA. PB6 is dedicated. PB7 is
multiplexed with TOUT0.
Port B general purpose I/O, PB[15:8] are multiplexed with the Ethernet interface pins. If the Ethernet
interface is enabled, PB[15:8] are unavailable.
Port C general purpose I/O, PC[15:0] are multiplexed with D[15:0]. When 32-bit wide bus mode is
selected, port C is unavailable.
19.10 UART0 Module Signals and PB[4:0]
The UART0 module uses the signals in this section for data and clock signals.
These signals are multiplexed with the GPIO port B signals PB[4:0].
19.10.1 Transmit Serial Data Output (URT0_TxD/PB0)
UART0 mode: UR T0_TxD is the transmitter serial data output for the UAR T0 module. The output is held
high (mark condition) when the transmitter is disabled, idle, or in the local loopback mode. Data is shifted
out, lsb first, on this pin at the falling edge of the serial clock source.
Port B mode: This pin can also be configured as the PB0 I/O.
Signal Descriptions
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Freescale Semiconductor 19-25
19.10.2 Receive Serial Data Input (URT0_RxD/PB1)
UART0 mode: URT0_RxD is the receiver serial data input for the UART0 module. Data received on this
pin is sampled on the rising edge of the serial clock source lsb first. When the UART0 clock is stopped for
power-down mode, any transition on this pin restarts it.
Port B mode: This pin can also be configured as the PB1 I/O.
19.10.3 Clear-to-Send (URT0_CTS/PB2)
UART0 mode: Asserting the UR T0_CTS input is the clear- to-send (CTS) input, indicating to the UART0
module that it can begin data transmission.
Port B mode: This pin can also be configured as the PB2 I/O.
19.10.4 Request to Send (URT0_RTS/PB3)
UART0 mode: Asserting URT0_RTS output is an automatic request to send output from the UART0
module. URT0_RTS can also be configured to be asserted and negated as a function of the RxFIFO level.
Port B mode: This pin can also be configured as the PB3 I/O.
19.10.5 Clock (URT0_CLK/PB4)
UART0 mode: URT0_CLK provides a clock input that can be a 1x or 16x baud rate clock.
Port B mode: This pin can also be configured as the PB4 I/O.
19.11 USB Module Signals and PA[6:0]
The USB module uses the signals in this section for data and clock signals. These signals are multiplexed
with the GPIO port A signals PA[6:0].
19.11.1 USB Transmit Serial Data Output (USB_TP/PA0)
USB mode: USB_TP is the non-inverted data transmit output.
Port A mode: This pin can also be configured as the PA0 I/O.
19.11.2 USB Receive Serial Data Input (USB_RP/PA1)
USB mode: USB_RP is the non-inverted receive data input.
Port A mode: This pin can also be configured as the PA1 I/O.
19.11.3 USB Receive Data Negative (USB_RN/PA2)
USB mode: USB_RN is the inverted receive data input.
Port A mode: This pin can also be configured as the PA2 I/O.
Signal Descriptions
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19-26 Freescale Semiconductor
19.11.4 USB Transmit Data Negative (USB_TN/PA3)
USB mode: USB_TN is the inverted data transmit output.
Port A mode: This pin can also be configured as the PA3 I/O.
19.11.5 USB Suspend Driver (USB_SUSP/PA4)
USB mode: USB_SUSP is used to put the USB driver in suspend operation.
Port A mode: This pin can also be configured as the PA4 I/O.
19.11.6 USB Transmitter Output Enable (USB_TxEN/PA5)
USB mode: USB_TxEN enables the transceiver to transmit data on the bus. It requires a 4.7-K¾ pullup
resistor to ensure that the external USB Tx driver is off between the MCF5272 coming out of reset and
initializing the port A pin configuration register.
Port A mode: This pin can also be configured as the PA5 I/O.
19.11.7 USB Rx Data Output (USB_RxD/PA6)
USB mode: USB_RxD is the receive data output from the differential receiver inputs USB_RN and
USB_RP.
Port A mode: This pin can also be configured as the PA6 I/O.
19.11.8 USB_D+ and USB_D-
USB_D+ and USB_D- are the on-chip USB interface transceiver signals. When these signals are enabled,
the USB module uses them to communicate to an external USB bus. When not used, each signal should
be pulled to VDD using a 4.7-K¾ resistor.
19.11.9 USB_CLK
USB_CLK is used to connect an external 48-MHz oscillator to the USB module. When this pin is tied to
GND or VDD, the USB module automatically uses the internal CPU clock. In this case the CLKIN must
be 48 MHz if the system is to use the USB function.
19.11.10 INT1/USB Wake-on-Ring (USB_WOR)
The USB module allows for INT1 to generate the USB wake-on-ring signal to the USB host controller.
This function is enabled by a control bit in the USB module. WOR is provided to allow the CPU and the
USB interface to be woken up when in power down mode. This occurs when the USB controller detects a
resume state at the USB inputs.
The interrupt output of an ISDN transceiver, such as the MC145574, can be connected to
INT1/USB_WOR. Before putting the device into sleep mode, the USB module’s wake on ring function
Signal Descriptions
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Freescale Semiconductor 19-27
can be enabled, the INT1 interrupt can be disabled, and USB power-down modes can be enabled along
with its interrupt. Then when the ISDN transceiver is activated, its interrupt request can generate the USB
wake on ring signal, which causes the host controller on the PC to initiate USB traffic to the device. This
in turn causes the USB module to wake up the CPU. Note that USB_WOR, when configured by setting
USBEPCTL0[WOR_EN], is level-sensitive.
19.12 Timer Module Signals
This section describes timer module signals.
19.12.1 Timer Input 0 (TIN0)
The timer input (TIN0) can be programmed to cause events to occur in timer counter 1. It can either clock
the event counter or provide a trigger to the timer value capture logic.
19.12.2 Timer Output (TOUT0)/PB7
Timer mode: Timer output (TOUT0) is the output from timer 0.
Port B mode: This pin can also be configured as I/O pin PB7.
19.12.3 Timer Input 1 (TIN1)/PWM Mode Output 2 (PWM_OUT2)
Timer mode: Timer input 1 (TIN1) can be programmed as an input that causes events to occur in timer
counter 2. This can either clock the event counter or provide a trigger to the timer value capture logic.
PWM mode: Pulse-width modulator 2 (PWM_OUT2) compare output.
19.12.4 Timer Output 1 (TOUT1)/PWM Mode Output 1 (PWM_OUT1)
Timer mode: Timer output (TOUT1) is the output from timer 1.
PWM mode: Pulse-width modulator 1 (PWM_OUT1) compare output.
19.13 Ethernet Module Signals
The following signals are used by the Ethernet module for data and clock signals.
These signals are multiplexed with the parallel port B PB15–PB8 signals.
19.13.1 Transmit Clock (E_TxCLK)
This is an input clock which provides a timing reference for E_TxEN, E_TxD[3:0] and E_TxER.
Signal Descriptions
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19-28 Freescale Semiconductor
19.13.2 Transmit Data (E_TxD0)
E_TxD0 is the serial output Ethernet data and is only valid during the assertion of Tx_EN. This signal is
used for 10-Mbps Ethernet data. This signal is also used for MII mode data in conjunction with
E_TxD[3:1].
19.13.3 Collision (E_COL)
The E_COL input is asserted upon detection of a collision and remains asserted while the collision persists.
This signal is not defined for full-duplex mode.
19.13.4 Receive Data Valid (E_RxDV)
Asserting the receive data valid (E_RxDV) input indicates that the PHY has valid nibbles present on the
MII. E_RxDV should remain asserted from the first recovered nibble of the frame through to the last
nibble. Assertion of E_RxDV must start no later than the SFD and exclude any EOF.
19.13.5 Receive Clock (E_RxCLK)
The receive clock (E_RxCLK) input provides a timing reference for E_RxDV, E_RxD[3:0], and E_RxER.
19.13.6 Receive Data (E_RxD0)
E_RxD0 is the Ethernet input data transferred from the PHY to the media-access controller when E_RxDV
is asserted. This signal is used for 10-Mbps Ethernet data. This signal is also used for MII mode Ethernet
data in conjunction with E_RxD[3:1].
19.13.7 Transmit Enable (E_TxEN)
The transmit enable (E_TxEN) output indicates when valid nibbles are present on the MII. This signal is
asserted with the first nibble of a preamble and is negated before the first E_TxCLK following the final
nibble of the frame.
19.13.8 Transmit Data (E_TxD[3:1]/PB[10:8])
Ethernet mode: These pins contain the serial output Ethernet data and are valid only during assertion of
E_TxEN in MII mode.
Port B mode: These pins can also be configured as I/O pins PB[10:8].
19.13.9 Receive Data (E_RxD[3:1]/PB[13:11])
Ethernet mode: These pins contain the Ethernet input data transferred from the PHY to the media-access
controller when E_RxDV is asserted in MII mode operation.
Port B mode: These pins can also be configured as I/O pins PB[13:11].
Signal Descriptions
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Freescale Semiconductor 19-29
19.13.10 Receive Error (E_RxER/PB14)
Ethernet mode: E_RxER is an input signal which when asserted along with E_RxDV signals that the PHY
has detected an error in the current frame. When E_RxDV is not asse rted E_RxER has no ef fect. Applies
to MII mode operation.
Port B mode: This pin can also be configured as PB14 I/O.
19.13.11 Management Data Clock (E_MDC/PB15)
Ethernet mode: E_MDC is an output clock which provides a timing reference to the PHY for data transfers
on the E_MDIO signal. Applies to MII mode operation.
Port B mode: This pin can also be configured as I/O pin PB15.
19.13.12 Management Data (E_MDIO)
The bidirectional E_MDIO signal transfers control information between the external PHY and the
media-access controller. Data is synchronous to E_MDC. Applies to MII mode operation. This signal is
an input after reset. When the FEC is operated in 10Mbps 7-wire interface mode, this signal should be
connected to Vss.
19.13.13 Transmit Error (E_TxER)
Ethernet mode: When the E_TxER output is asserted for one or more clock cycles while E_TxEN is also
asserted, the PHY sends one or more illegal symbols. E_TxER has no ef fect at 10 Mbps or when E_TxEN
is negated. Applies to MII mode operation.
19.13.14 Carrier Receive Sense (E_CRS)
E_CRS is an input signal which when asserted signals that transmit or receive medium is not idle. Applies
to MII mode operation.
19.14 PWM Module Signals (PWM_OUT0–PWM_OUT2])
PWM_OUT0–PWM_OUT2 are the outputs of the compare logic within the pulse-width modulator
(PWM) modules.
• PWM_OUT0 is always available.
• PWM_OUT1 is multiplexed with TOUT1.
• PWM_OUT2 is multiplexed with TIN1.
19.15 Queued Serial Peripheral Interface (QSPI) Signals
This section describes signals used by the queued serial peripheral interface (QSPI) module. Four QSPI
chip selects, QSPI_CS[3:0], are multiplexed with the physical layer interface pins and GPIO port A.
QSPI_CS0 is always available. QSPI_CS3 is multiplexed with DOUT3 and PA7.
Signal Descriptions
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19-30 Freescale Semiconductor
19.15.1 QSPI Synchronous Serial Data Output (QSPI_Dout/WSEL)
The QSPI synchronous serial data output (QSPI_Dout) can be programmed to be driven on the rising or
falling edge of SCK. Each byte is sent msb first.
WSEL configuration input is sampled on the rising edge of Reset Output (RSTO).
19.15.2 QSPI Synchronous Serial Data Input (QSPI_Din)
The QSPI synchronous serial data input (QSPI_Din) can be programmed to be sampled on the rising or
falling edge of QSPI_CLK. Each byte is written to RAM lsb first.
19.15.3 QSPI Serial Clock (QSPI_CLK/BUSW1)
The QSPI serial clock (QSPI_CLK/BUSW1) provides the serial clock from the QSPI. The polarity and
phase of QSPI_CLK are programmable. The output frequency is programmed according to the following
formula, in which n can be any value between 1 and 255:
QSPI_CLK = CLKIN/(2 ×n)
At reset, QSPI_CLK/BUSW1 is used to configure the width of memory connected to CS0.
BUSW1 configuration input is sampled on the rising edge of Reset Output (RSTO).
19.15.4 Synchronous Peripheral Chip Select 0 (QSPI_CS0/BUSW0)
The synchronous peripheral chip select 0 (QSPI_CS0) output provides a QSPI peripheral chip select that
can be programmed to be active high or low. During reset, this pin is used to configure the width of
memory connected to CS0.
BUSW0 configuration input is sampled on the rising edge of Reset Output (RSTO).
19.15.5 Synchronous Peripheral Chip Select 1 (QSPI_CS1/PA11)
See Section 19.16.1.9, “QSPI Chip Select 1 (QSPI_CS1/PA11).”
QSPI_CS1 can be programmed to be active high or low.
19.15.6 Synchronous Peripheral Chip Select 2 (QSPI_CS2/URT1_CTS)
See Section 19.16.1.5, “UART1 CTS (URT1_CTS/QSPI_CS2).”
19.15.7 Synchronous Peripheral Chip Select 3 (PA7/DOUT3/QSPI_CS3)
See Section 19.16.3.3, “QSPI_CS3, Port 3 GCI/IDL Data Out 3, PA7 (PA7/DOUT3/QSPI_CS3).” See
description for GPIO ports.
Signal Descriptions
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Freescale Semiconductor 19-31
19.16 Physical Layer Interface Controller TDM Ports and UART 1
The MCF5272 has four dedicated physical layer interface ports for connecting to external ISDN
transceivers, CODECs and other peripherals. There are three sets of pins for these interfaces. Port 0 has its
own dedicated set of pins. Ports 1, 2, and 3 share a set of pins. Port 3 can also be configured to use a
dedicated pin set. Ports 1, 2, and 3 always share the same data clock (DCL).
19.16.1 GCI/IDL TDM Port 0.
This section describes signals used by the PLIC module port 0 interface.
19.16.1.1 Frame Sync (FSR0/FSC0/PA8)
IDL mode: FSR0 is an input for the 8-KHz frame sync for port 0.
GCI mode: FSC0 is an input for the 8-KHz frame sync for port 0. It is active high in this mode. Normally
the GCI FSC signal is two clocks wide and is aligned with the first B-channel bit of the GCI frame. Many
U-interface devices including the MC145572 and MC145576 change the width of FSC to one clock every
12 mS. This indicates U-interface super frame boundary.
Port A mode: This pin can be independently configured as PA8.
19.16.1.2 D-Channel Grant (DGNT0/PA9)
IDL mode: This pin can be independently configured as the input, DGNT0, used by a layer-one ISDN S/T
transceiver to indicate that D-channel access has been granted.
Port A mode: This pin can be independently configured as I/O pin PA9.
19.16.1.3 Data Clock (DCL0/URT1_CLK)
IDL mode: This pin is the clock used to clock data in and out of DIN0 and DOUT0 for IDL port 0. Data
is clocked into DIN0 on the falling edge and clocked out of DOUT0 on the rising edge of DCL0.
GCI mode: This pin is used to clock data in and out of DIN0 and DOUT0 for GCI port 0. DCL0 is twice
the bit rate (two clocks per data bit).
UART1: URT1_CLK provides a clock input which can be the baud rate clock.
19.16.1.4 Serial Data Input (DIN0/URT1_RxD)
IDL mode: The DIN0 input is for clocking data into IDL port 0. Data is clocked into DIN0 on the falling
edge of DCL0.
GCI mode: The DIN0 input is for clocking data into GCI port 0. DCL0 is twice the bit rate (two clocks per
data bit).
UART1: URT1_RxD is the receiver serial data input for the UART1 module. Data received on this pin is
sampled on the rising edge of the serial clock source with the least significant bit first. When the UART1
clock is stopped for power-down mode, any transition on this pin restarts it.
Signal Descriptions
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19-32 Freescale Semiconductor
19.16.1.5 UART1 CTS (URT1_CTS/QSPI_CS2)
UART1: URT1_CTS is the clear-to-send input indicating to the UART1 module that it can begin data
transmission.
QSPI mode: This output pin provides a QSPI peripheral chip select, QSPI_CS2, when in Master mode.
QSPI_CS2 can be programmed to be active high or low.
19.16.1.6 UART1 RTS (URT1_RTS/INT5)
Interrupt mode: This pin can be used as INT5.
UART1: The URT1_RTS output is an automatic request to send output from the UART1 module. It can
be configured to be asserted and negated as a function of the RxFIFO level.
19.16.1.7 Serial Data Output (DOUT0/URT1_TxD)
IDL mode: The DOUT0 output is for clocking data out of IDL port 0. Data is clocked out of DOUT0 on
the rising edge of DCL0.
GCI mode: The DOUT0 output is for clocking data out of GCI port 0. DCL0 is twice the bit rate (two
clocks per data bit).
UART1: URT1_TxD is the transmitter serial data output for the UART1 module. The output is held high
('mark' condition) when the transmitter is disabled, idle, or operating in the local loop back mode. Data is
shifted out, least significant bit first, on this pin at the falling edge of the serial clock source.
19.16.1.8 D-Channel Request(DREQ0/PA10)
IDL mode: This pin can be independently configured as the DREQ0 output for signaling to a layer-1 S/T
transceiver that a frame of data is ready to be sent on the port 0 D channel.
Port A mode: In GCI or IDL modes this pin can be independently configured as PA10.
19.16.1.9 QSPI Chip Select 1 (QSPI_CS1/PA11)
QSPI mode: QSPI_CS1 is a QSPI peripheral chip select.
Port A mode: In GCI or IDL modes this pin can be independently configured as PA11.
19.16.2 GCI/IDL TDM Port 1
Physical Layer Interface port 1 is an additional GCI/IDL port. Als o internally co nnected to these pins are
GCI/IDL serial ports 2 and 3.
19.16.2.1 GCI/IDL Data Clock (DCL1/GDCL1_OUT)
IDL mode: DCL1 is the data clock used to clock data in and out of the DIN1 and DOUT1 pins for IDL
port 1. Data is clocked in to DIN1 on the falling edge of DCL1. Data is clocked out of DOUT1 on the rising
edge of DCL1.
Signal Descriptions
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Freescale Semiconductor 19-33
GCI mode: GDCL1_OUT is used to clock data in and out of DIN1 and DOUT1 for GCI port 1. DCL1 is
twice the bit rate; that is, two clocks per data bit.
When this pin is configured as an output, the GDCL1_OUT clock signal from the on-chip synthesizer
clock generator is output on this pin. Also GDCL1_OUT is used to internally drive all ports and delayed
sync generators associated with ports 1, 2, and 3.
19.16.2.2 GCI/IDL Data Out (DOUT1)
IDL mode: The DOUT1 output is for clocking data out of IDL port 1. Data is clocked out of DOUT1 on
the rising edge of DCL1. DOUT1 is also used for clocking data from ports 2 and 3.
GCI mode: The DOUT1 output is for clocking data out of GCI port 1. DCL1 is twice the bit rate, that is,
two clocks per data bit.
19.16.2.3 GCI/IDL Data In (DIN1)
IDL mode: The DIN1 input is for clocking data into IDL port 1. Data is clocked into DIN1 on the falling
edge of DCL1. DIN1 is also used for clocking data into ports 2 and 3.
GCI mode: The DIN1 input is for clocking data into GCI port 1. DCL1 is twice the bit rate, that is, two
clocks per data bit. DIN1 is also used for clocking data into ports 2 and 3.
19.16.2.4 GCI/IDL Frame Sync (FSC1/FSR1/DFSC1)
IDL mode: FSR1 is an input for the 8-KHz frame sync for port 1.
GCI mode: FSC1 is an input for the 8-KHz frame sync for port 1. Normally the GCI FSC signal is two
clocks wide and is aligned with the first B channel bit of the GCI frame. Many U-interface devices
including the MC145572 and MC145576 change the width of FSC to one clock every 12 mS, indicating
a U-interface super frame boundary. The MCF5272 can accept either frame sync width.
When this pin is configured as an output, the DFSC1 sync signal from the on-chip clock synthesizer is
output on this pin. Also DFSC1 is used to internally drive the port 1 frame sync and the delayed sync
generators associated with ports 2 and 3. The width of DFSC1 can be configured for 1, 2, 8, or 16 DCL
clocks duration. The location of DFSC1 is programmable in single clock increments up to a maximum
count of 0x3FF.
19.16.2.5 D-Channel Request (DREQ1/PA14)
IDL mode: This pin can be configured as the DREQ1 output in IDL mode for signalling to a layer 1 S/T
transceiver that a frame of data is ready to be sent on the port 1 D channel.
Port A mode: I/O pin PA14.
19.16.2.6 D-Channel Grant (DGNT1_INT6/PA15_INT6)
This pin can be independently configured as the input, DGNT1, used by a Layer one ISDN S/T transceiver
to indicate that D-channel access has been granted.
Signal Descriptions
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19-34 Freescale Semiconductor
Port A mode: I/O pin PA15.
Special interrupt mode: The INT6 interrupt can be enabled independently of the pin being configured for
DGNT1 or PA15. This is particularly useful when configured for PA15 operation because INT6 can be
used to signal a change of data on the PAx pins.
19.16.3 GCI/IDL TDM Ports 2 and 3
Physical Layer Interface port 2 is an additional GCI/IDL port. This Physical Layer Interface shares the
DIN1, DOUT1, and DCL1 pins of Physical Layer Interface port 1. The operating mode is selected by the
same register control bit that selects the operating mode for port 1.
Physical Layer Interface port 3 is an additional GCI/IDL port. This Physical Layer Interface shares the
DIN1, DOUT1, and DCL1 pins of Physical Layer Interface port 1. The operating mode is selected by the
same register control bit that selects the operating mode for port 1.
Port 3 can also have its input and output signals redirected to DIN3 and DOUT3 respectively.
19.16.3.1 GCI/IDL Delayed Frame Sync 2 (DFSC2/PA12)
IDL/GCI Modes: DFSC2 is used as a programmable delayed frame sync for external IDL/GCI devices that
use port 2 but are connected to the port 1 data pins. Port 2 uses the DFSC2 frame sync internally to ensure
alignment with external devices synchronized with DFSC2. The width of this signal can be configured for
1, 2, 8, or 16 DCL clocks duration. The location of this frame sync is programmable in single clock
increments up to a maximum count of 0x3FF.
Port A mode: I/O pin PA12.
19.16.3.2 GCI/IDL Delayed Frame Sync 3 (DFSC3/PA13)
Output pin DFSC3. This active high signal is used as a programmable delayed frame sync for external
IDL/GCI devices that use port 3 but are connected to the port 1 or port 3 data pins. Port 3 uses the DFSC3
frame sync internally to ensure alignment with external devices synchronized with DFSC3. The width of
this signal can be configured for 1, 2, 8, or 16 DCL clocks duration. The location of this frame sync is
programmable in single clock increments up to a maximum count of 0x3FF.
Port A mode: I/O pin PA13.
19.16.3.3 QSPI_CS3, Port 3 GCI/IDL Data Out 3, PA7 (PA7/DOUT3/QSPI_CS3)
QSPI mode: The QSPI chip select, QSPI_CS3, is the default configuration after device reset. QSPI_CS3
can be programmed to be active high or low.
IDL mode: This pin can be configured as a dedicated output for clocking data out of IDL port 3. Data is
clocked out of DOUT3 on the rising edge of DCL1. After device reset port 3 is connected to DOUT1 by
setting a bit in the PLIC module configuration register , this pin can be configured as a dedicated output for
IDL/GCI port 3.
Signal Descriptions
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Freescale Semiconductor 19-35
GCI mode: This pin can be configured as a dedicated output for clocking data out of GCI port 3. Data is
clocked out of DOUT3 on the rising edge of DCL1. DCL1 is twice the bit rate, that is, two clocks per data
bit. This is done by setting a bit in the PLIC module configuration register this pin can be configured as a
dedicated output for IDL/GCI port 3.
Port A mode: I/O pin PA7.
19.16.3.4 INT4 and Port 3 GCI/IDL Data In (INT4/DIN3)
IDL mode: This pin can be configured as a dedicated input, DIN3, for clocking data into IDL port 3. Data
is clocked into DIN3 on the falling edge of DCL1. Data is clocked into DIN3 on the falling edge of DCL1.
This is done by setting a bit in the PLIC module configuration register. Note that the appropriate bits must
be set in the pin configuration register to reassign this pin from the interrupt module to the PLIC module.
GCI mode: This pin can be configured as a dedicated input, DIN3, for clocking data into GCI port 3. DCL1
is twice the bit rate, that is, two clocks per data bit. This is done by setting a bit in the PLIC module
configuration register . Note that the appropriate bits must be set in the pin configuration register to reassign
this spin from the interrupt module to the PLIC module.
Interrupt mode: This signal can be configured as interrupt input 4.
19.17 JTAG Test Access Port and BDM Debug Port
The MCF5272 supports the Freescale background debug mode (BDM) for ColdFire processors. It also
supports a JTAG test interface.
The following signals do not support JT AG due to the critical timing required to support SDRAM memory:
BS[3:0], RAS0, CAS0, SDCLK, SDCLKE, SDRAMCS/CS7, SDWE, A10_PRECHG, SDBA[1:0],
D[31:0], A[15:0].
19.17.1 Test Clock (TCK/PSTCLK)
JT AG mode: TCK is the dedicated JTAG test logic clock, independent of the CPU system clock. This input
provides a clock for on-board test logic defined by the IEEE 1149.1 standard.
TCK should be grounded if the JTAG port is not used and MTMOD is tied low.
BDM mode: PSTCLK is an output at the same frequency as the CPU clock. It is used for indicating valid
processor status data on the PST and DDATA pins.
19.17.2 Test Mode Select and Force Breakpoint (TMS/BKPT)
JTAG mode: The TMS input controls test mode operations for on-board test logic defined by the IEEE
1149.1 standard. Connecting TMS to VDD disables the test controller, making all JTAG circuits
transparent to the system.
BDM mode: The hardware breakpoint input, BKPT, requires a 10-K¾ pullup resistor.
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-36 Freescale Semiconductor
19.17.3 Test and Debug Data Out (TDO/DSO)
JTAG mode: The TDO output is for shifting data out of the serial data port logic. Shifting out of data
depends on the state of the JTAG controller state machine and the instructions currently in the instruction
register. This data shift occurs on the falling edge of TCK. When TDO is not outputting data it is placed
in a high-impedance state. TDO can also be three-stated to allow bussed or parallel connections to other
devices having JTAG test access ports.
BDM mode: DSO is the debug data output.
19.17.4 Test and Debug Data In (TDI/DSI)
JTAG mode: The TDI input is for loading the serial data port shift registers (boundary scan registers,
bypass register and instruction register). Shifting in of data depends on the state of the JTAG controller
state machine and the instruction currently in the instruction register. Data is shifted in on the rising edge
of TCK.
BDM mode: DSI is the debug serial data input. This signal requires a 10-K¾ pullup resistor.
19.17.5 JTAG TRST and BDM Data Clock (TRST/DSCLK)
JTAG mode: TRST asynchronously resets the JTAG TAP logic when low.
BDM mode: DSCLK is the BDM serial data clock input. It requires a 10-K¾ pullup resistor.
19.17.6 Freescale Test Mode Select (MTMOD)
MTMOD: When the MTMOD input is low, JTAG mode is enabled. When it is high, BDM mode is
enabled.
19.17.7 Debug Transfer Error Acknowledge (TEA)
An external slave asserts the TEA input to indicate an error condition for the current bus transfer. It is
provided to allow full debug port capability. The assertion of TEA causes the MCF5272 to abort the
current bus cycle. If a 10-K¾ pullup resistor is not connected, external logic must drive TEA high when it
is inactive. TEA has no effect during SDRAM accesses. If high parasitic capacitance occurs on the printed
circuit board, a lower value pullup resistor may be needed.
19.17.8 Processor Status Outputs (PST[3:0])
PST[3:0] outputs indicate core status, as shown in Table 19-7. Debug mode timing is synchronous with
the processor clock; status is unrelated to the current bus transfer.
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 19-37
19.17.9 Debug Data (DDATA[3:0])
Debug data signals (DDATA[3:0]) display captured processor data and breakpoint status.
19.17.10 Device Test Enable (TEST)
TEST is used to put the device into various manufacturing test modes. It should be tied to VDD for normal
operation.
19.18 Operating Mode Configuration Pins
The MCF5272 has four mode-select signals, some of which are shared with output signals used during
normal device operation. These signals are HI-Z, QSPI_Dout/WSEL, QSPI_CLK/BUSW1, and
QSPI_CS0/BUSW0. BYPASS is a Freescale test mode signal and should never have a pull-down resistor .
The remaining three mode-select signals must each have a 4.7-K¾ pull-up or pull-down resistor. These
signals are sampled on the rising edge of Reset Output (RSTO).
Table 19-7. Processor Status Encoding
PST[3:0] Definition
0000 Continue execution
0001 Begin execution of an instruction
0010 Begin execution of PULSE instruction or WDDATA.
0011 Entry into user mode
0100 Begin execution of PULSE instruction
0101 Begin execution of taken branch
0110 Reserved
0111 Begin execution of RTE instruction
1000 Begin 1 byte transfer on DDATA
1001 Begin 2 byte transfer on DDATA
1010 Begin 3 byte transfer on DDATA
1011 Begin 4 byte transfer on DDATA
1100 1
1These encodings are asserted for multiple cycles.
Exception processing
1101 1Emulator mode entry exception processing
1110 1Processor is stopped, waiting for an interrupt
1111 1Processor is halted
Signal Descriptions
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
19-38 Freescale Semiconductor
19.19 Power Supply Pins
The VDD/GND pins are connected to 3.3 V supply and associated ground. When the on-chip USB
transceiver is used, the USB_VDD and USB_GND pins are connected to the 3.3 V device supply and
associated ground. When the on-chip USB transceiver is not used, USB_GND should be connected to the
device GND and USB_VDD left unconnected. Refer to Section 12.2.1.1 USB Transceiver Interface.
Table 19-8. MCF5272 Bus
Width Selection
WSEL Data Bus Width
032 bits
116 Bits
Table 19-9. MCF5272 CS0 Memory
Bus Width Selection
BUSW1 BUSW0 CS0 Bus Width
0 0 32 bits
0 1 8 bits
1 0 16 bits
1 1 Reserved, do not use.
Table 19-10. MCF5272 High Impedance
Mode Selection
HI-Z Data Bus Width
0 Enable HI-Z mode, all pins are high impedance
1 Normal operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-1
Chapter 20
Bus Operation
The MCF5272 bus interface supports synchronous data transfers that can be terminated synchronously or
asynchronously and also can be burst or burst-inhibited between the MCF5272 and other devices in the
system. This chapter describes the functioning of the bus for data-transfer operations, error conditions, bus
arbitration, and reset operations. It includes detailed timing diagrams showing signal interaction. Refer
also to Figure 19-1 for an overview of how the signals interact with each module of the MCF5272.
Operation of the bus is defined for transfers initiated by the MCF5272 as a bus master . The MCF5272 does
not support external bus masters. The MCF5272 has three on-chip bus masters—the CPU, the Ethernet
controller, and the memory-to-memory DMA controller.
20.1 Features
The following list summarizes the key bus operation features:
• 23 bits of address and 32 bits of data
• Device physical data bus width configurable for 16 or 32 bits
• Accesses 8-, 16-, and 32-bit port sizes
• Generates byte, word, longword, and line size transfers
• Burst and burst-inhibited transfer support
• Internal termination generation
20.2 Bus and Control Signals
Table 20-1 summarizes MCF5272 bus signals described in Chapter 19, “Signal Descriptions.”
Table 20-1. ColdFire Bus Signal Summary
Signal Name Description I/O
A[22:0] Address bus O
BS[3:0] Byte strobes O
CS[7:0] Chip selects O
D[31:0] Data bus I/O
INT[6:1] Interrupt request I
OE Output enable O
R/W Read/write O
TA Transfer acknowledge I
TEA Transfer error acknowledge I
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
20-2 Freescale Semiconductor
20.2.1 Address Bus (A[22:0])
These output signals provide the location of a bus transfer. The address can be external SRAM, ROM,
FLASH, SDRAM, or peripherals.
NOTE
The ColdFire core outputs 32 bits of address to the internal bus controller.
Of these 32 bits, only A[22:0] are output to pins on the MCF5272.
20.2.2 Data Bus (D[31:0])
These three-state bidirectional signals provide the general-purpose data path between the MCF5272 and
all other devices. The data bus can transfer 8, 16, 32, or 128 bits of data per bus transfer. The MCF5272
can be configured for an external physical data bus of 32- or 16-bits width. When configured for 16-bit
external data bus width, D[15:0] become GPIO port C. A write cycle drives all 32 or 16 bits of the data
bus regardless of the chip select port width and operand size.
20.2.3 Read/Write (R/W)
This output signal defines the data transfer direction for the current bus cycle. A high (logic one) level
indicates a read cycle; a low (logic zero) level indicates a write cycle. During SDRAM bus cycles R/W is
driven high. When the CPU is in SLEEP or STOP modes, this signal is driven high.
NOTE
Use the OE signal to control any external data bus transceivers. In systems
containing numerous external peripherals, the chip selects should be used to
qualify any external transceivers. This ensures the transceivers are active
only when the desired peripheral is accessed. Using only the R/W signal to
control an external transceiver may lead to data bus conflicts in some system
architectures.
20.2.4 Transfer Acknowledge (TA)
This active-low synchronous input signal indicates the successful completion of a requested data transfer
operation. During MCF5272-initiated transfers, transfer acknowledge (TA) is an asynchronous input
signal from the referenced slave device indicating completion of the transfer.
The MCF5272 edge-detects and retimes the TA input. This means that an additional wait state may or may
not be inserted. For example if the active chip select is used to immediately generate the TA input, one or
two wait states may be inserted in the bus access.
The TA signal function is not available after reset. It must be enabled by configuring the appropriate pin
configuration register bits along with the value of CSORn[WS]. If TA is not used, it should either have a
pullup resistor or be driven through gating logic that always ensures the input is inactive. TA should be
negated on the negating edge of the active chip select.
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-3
TA must always be negated before it can be recognized as asserted again. If held asserted into the following
bus cycle, it has no effect and does not terminate the bus cycle.
NOTE
For the MCF5272 to accept the transfer as successful with a transfer
acknowledge, TEA must be negated throughout the transfer.
TA is not used for termination during SDRAM accesses.
20.2.5 Transfer Error Acknowledge (TEA)
An external slave asserts this active-low input signal to abort a transfer . The assertion of TEA immediately
aborts the bus cycle. The assertion of TEA has precedence over the assertion of TA.
The MCF5272 edge-detects and retimes the TEA input. TEA is an asynchronous input signal.
The TEA signal function is available after reset. If TEA is not used, a pullup resistor or gating logic must
be used to ensure the input is inactive. TEA should be negated on the negating edge of the active chip
select. TEA must always be negated before it can be recognized as asserted again. If held asserted into the
following bus cycle, it has no effect and does not abort the bus cycle.
TEA has no affect during SDRAM accesses.
20.3 Bus Exception: Double Bus Fault
When a bus error or an address error occurs during the exception processing sequence for a previous bus
error, a previous address error, or a reset exception, the bus or address error causes a double bus fault. If
the MCF5272 experiences a double bus fault, it enters the halted state. To exit the halt state, reset the
MCF5272.
20.4 Bus Characteristics
The MCF5272 uses the address bus (A[22:0]) to specify the location for a data transfer and the data bus
(D[31:0] or D[31:16]) to transfer the data. Control signals indicate the direction of the transfer. The
selected device or the number of wait states programmed in the chip select base registers (CSBRs), the
chip select option registers (CSORs), the SDRAM configuration and SDRAM timing registers (SDCR,
SDTR) control the length of the cycle.
The MCF5272 clock is distributed internally to provide logic timing. All SRAM and ROM mode bus
signals should be considered as asynchronous with respect to CLKIN. SDCR[INV] allows the SDRAM
control signals to be asserted and negated synchronous with the rising or falling edge of SDCLK. The
SDRAM control signals are BS[3:0], SDBA[1:0], RAS0, CAS0, SDWE, A10_PRECHG, SDCLKE, and
CS7/SDCS.
The asynchronous INT[6:1] signals are internally synchronized to resolve the input to a valid level before
being used.
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
20-4 Freescale Semiconductor
20.5 Data Transfer Mechanism
The MCF5272 supports byte, word, and longword operands and allows accesses to 8-, 16-, and 32-bit data
ports. The MCF5272 supports port sizes of the specific memory, enables internal generation of transfer
termination, and sets the number of wait states for the external slave being accessed by programming the
CSBRs, CSORs, SDCR, and SDTR. For more information on programming these registers, refer to the
SIM, chip select, and SDRAM controller chapters.
NOTE
The MCF5272 compares the address for the current bus transfer with the
address and mask bits in the CSBRs and CSORs looking for a match. The
priority is listed in Table 20-2 (from highest priority to lowest priority):
20.5.1 Bus Sizing
The MCF5272 can be configured for an external physical data bus width of 16 bits by pulling
QSPI_Dout/WSEL high, or for 32 bits by pulling QSPI_Dout/WSEL low during reset. When the external
physical address bus size is configured for 16 bits, the signals D[15:0] become general purpose I/O port C.
The MCF5272 determines the port size for each transfer from the CSBRs at the start of each bus cycle.
This allows the MCF5272 to transfer operands from 8-, 16-, or 32-bit ports. The size of the transfer is
adjusted to accommodate the port size indicated. A 32-bit port must reside on data bus bits D[31:0], a
16-bit port must reside on data bus bits D[31:16], and an 8-bit port must reside on data bus bits D[31:24].
This requirement ensures that the MCF5272 correctly transfers valid data to 8-, 16-, and 32-bit ports.
The bytes of operands are designated as shown in Figure 20-1. The most significant byte of a longword
operand is OP0; OP3 is the least significant byte. The two bytes of a word length operand are OP2 (most
significant) and OP3. The single byte of a byte length operand is OP3. These designations are used in the
figures and descriptions that follow.
Table 20-2. Chip Select Memory
Address Decoding Priority
Priority Chip Select
Highest Chip Select 0
Chip Select 1
Chip Select 2
Chip Select 3
Chip Select 4
Chip Select 5
Chip Select 6
Lowest Chip Select 7
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-5
Figure 20-1. Internal Operand Representation
Figure 20-2 shows the required organization of data ports on the MCF5272 for 8-, 16-, and 32 bit devices.
The four bytes shown are connected through the internal data bus and data multiplexer to the external data
bus. This path is how the MCF5272 supports programmable port sizing and operand misalignment. The
data multiplexer establishes the necessary connections for different combinations of address and data
sizes.
Figure 20-2. MCF5272 Interface to Various Port Sizes
The multiplexer takes the four bytes of the 32-bit bus and routes them to their required positions. For
example, OP3 can be routed to D[7:0], as would be the normal case when interfacing to a 32-bit port. OP3
can be routed to D[23:16] for interfacing to a 16-bit port, or it can be routed to D[31:24] for interfacing to
an 8-bit port. The operand size, address, and port size of the memory being accessed determines the
positioning of bytes.
LONGWORD OPERAND
WORD OPERAND
BYTE OPERAND
31 0
15 0
70
OP3
OP3
OP3
OP2
OP2OP0 OP1
REGISTER
MULTIPLEXER
EXTERNAL
DATA BUS
ADDRESS
BYTE 0
INTERNAL TO
MCF5272
8-BIT PORT
16-BIT PORT
32-BIT PORT
BYTE 1
BYTE 2
BYTE 3
BYTE 0 BYTE 1
BYTE 2 BYTE 3
BYTE 0 BYTE 1 BYTE 2 BYTE 3
D[31:24] D[23:16] D[15:8] D[7:0]
ROUTING AND DUPLICATION
OP0 OP1 OP2 OP3
A1 A0
00
00
10
00
01
10
11
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
20-6 Freescale Semiconductor
Table 20-3 through Table 20-5 describe data bus byte strobes. Note that most SDRAMs associate DQM3
with the MSB, thus BS3 should be connected to the SDRAM's DQM3 input.
Table 20-3. Byte Strobe Operation for 32-Bit Data Bus
BS3 BS2 BS1 BS0 Access Type Access Size Data Located On
1111 None None —
1110FLASH/SRAM Byte D[31:24]
1101FLASH/SRAM D[23:16]
1 0 1 1 FLASH/SRAM D[15:8]
0111FLASH/SRAM D[7:0]
1 1 0 0 FLASH/SRAM Word D[31:16]
0 0 1 1 FLASH/SRAM D[15:0]
0 0 0 0 FLASH/SRAM Longword D[31:0]
1110 SDRAM Byte D[7:0]
1 1 0 1 SDRAM D[15:8]
1011 SDRAM D[23:16]
0111 SDRAM D[31:24]
1 1 0 0 SDRAM Word D[15:0]
0011 SDRAM D[31:16]
0 0 0 0 SDRAM Longword D[31:0]
Table 20-4. Byte Strobe Operation
for 16-Bit Data Bus—SRAM Cycles
BS1 BS0 Access Size Data Located On
1 1 None —
1 0 Byte D[31:24]
0 1 Byte D[23:16]
0 0 Word D[31:16]
Table 20-5. Byte Strobe Operation
for 16-Bit Data Bus—SDRAM Cycles
BS3 BS2 Access Type Data Located On
1 1 None —
1 0 Byte D[23:16]
0 1 Byte D[31:24]
0 0 Word D[31:16]
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-7
Table 20-6 lists the bytes that should be driven on the data bus during read cycles by the external peripheral
device being accessed, and the pattern of the data transfer for write cycles to the external data bus.
For read cycles, the entries shown as Byte X are portions of the requested operand that are read. The
operand being read is defined by the size of the transfer and A[1:0] for the bus cycle. Bytes labeled “X”
are don’t cares and are not required during that read cycle. Bytes labeled “–” are not valid transfers.
For write cycles from the internal multiplexer of the MCF5272 to the external data bus A[1:0] is
incremented according to the transfer size. For example, if a longword transfer is generated to a 16-bit port,
the MCF5272 starts the cycle with A[1:0] set to 0x0 and reads the first word. The address in then
incremented to 0x2 and the second word is read. The data for both word reads is taken from D[31:16].
Bytes labeled “X” are don’t cares.
20.6 External Bus Interface Types
The MCF5272 supports three types of external bus interfaces. The interface type is programmed using
CSBRn[EBI]. The EBI codes are summarized in Table 20-7.
Table 20-6. Data Bus Requirement for Read/Write Cycles
Transfer Size A[1:0]
External Data Bytes Required
32-Bit Port 16-Bit Port 8-Bit Port
D[31:24] D[23:16] D[15:8] D[7:0] D[31:24] D[23:16] D[31:24]
Byte 00 Byte 0 X X X Byte 0 X Byte 0
01 X Byte 1 X X X Byte 1 Byte 1
10 X X Byte 2 X Byte 2 X Byte 2
11 X X X Byte 3 X Byte 3 Byte 3
Word 00 Byte 0 Byte 1 X X Byte 0 Byte 1 Byte 0
01 — — — — — — Byte 1
10 X X Byte2 Byte 3 Byte 2 Byte 3 Byte 2
11 — — — — — — Byte 3
Longword 00 Byte 0 Byte 1 Byte 2 Byte 3 Byte 0 Byte 1 Byte 0
01 — — — — — — Byte 1
10 — — — — Byte 2 Byte 3 Byte 2
11 — — — — — — Byte 3
Line 00 Byte 0 Byte 1 Byte 2 Byte 3 Byte 0 Byte 1 Byte 0
01 — — — — — — Byte 1
10 — — — — Byte 2 Byte 3 Byte 2
11 — — — — — — Byte 3
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
20-8 Freescale Semiconductor
20.6.1 Interface for FLASH/SRAM Devices with Byte Strobes
CSBRn[EBI] is 00 for FLASH/SRAM devices and peripherals having 16- or 32-bit data bus widths. These
memory devices have separate pins for independent byte strobes, write enable, chip select, and output
enable. All chip selects support this EBI mode.
The number of wait states required for the external memory or peripheral is programmed through
CSORn[WS]. The external transfer acknowledge signal, TA, is provided to allow off-chip control of wait
states. External control of wait states is enabled when CSORn[WS] is 0x1F. When TA is used to terminate
the bus cycle, the bus cycle will have a minimum of one wait states. Additional wait states can be added
by delaying the assertion of TA.
Figure 20-3. Longword Read; EBI = 00; 32-Bit Port; Internal Termination
NOTE
Wait states, if needed, are added immediately after C2 in Figure 20-3.
Table 20-7. External Bus Interface Codes for CSBRs
A0 CSBRn[EBI] Applicable Chip Select Note
16-/32-bit
SRAM/ROM
00 All For 16/32 bit wide memory devices with byte strobe inputs. BS[3:0]
are byte read/write enables in this mode. CSBR0[EBI] = 00 at
reset.
SDRAM 01 CS7/SDCS only One physical bank of SDRAM consisting of 16–256 Mbit devices.
The CS7/SDCS CSORn[WS] must be set to 0x1F.
Reserved 10 — —
8-bit
SRAM/ROM
11 All SRAM/ROM timing for 8 bit wide memory devices without byte
strobe inputs. BS[3:0] function as byte write enables in this mode.
SDCLK
A[22:0]
D[31:0]
OE, BS[3:0]
R/W
CSn
C1 C2
(H)
(H)
TA
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-9
Figure 20-4. Word Write; EBI = 00; 16-/32-Bit Port; Internal Termination
Figure 20-5. Longword Read with Address Setup; EBI = 00; 32-Bit Port; Internal Termination
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
BS[3:2]
C1 C2
BS[1:0]
TA
(H)
(H)
(H)
SDCLK
A[22:0]
D[31:0]
OE, BS[3:0]
R/W
CSn
TA
C1 C2 C3
(H)
(H)
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
20-10 Freescale Semiconductor
Figure 20-6. Longword Write with Address Setup; EBI = 00; 32-Bit Port; Internal Termination
Figure 20-7. Longword Read with Address Hold; EBI = 00; 32-Bit Port; Internal Termination
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
BS[3:0]
TA
C1 C2 C3
(H)
(H)
SDCLK
A[22:0]
D[31:0]
OE, BS[3:0]
R/W
CSn
TA
C1 C2 C3
(H)
(H)
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-11
Figure 20-8. Longword Write with Address Hold; EBI = 00; 32-Bit Port; Internal Termination
Figure 20-9. Longword Read; EBI = 00; 32-Bit Port; Terminated by TA with One Wait State
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
BS[3:0]
TA
C1 C2 C3
(H)
(H)
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
BS[3:0]
TA
C1 C2 CW C3
Bus Operation
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20-12 Freescale Semiconductor
20.6.2 Interface for FLASH/SRAM Devices without Byte Strobes
CSBRn[EBI] is 11 for FLASH/SRAM devices and for peripherals having 8-bit data bus widths and no byte
strobe inputs. These type of memory devices have separate pins for write enable, chip select, and output
enable. All chip selects support this EBI mode.
The key difference between EBI = 11 and EBI = 00 is that BS[3:0] can be directly connected to the R/W
inputs of the 8-bit wide SRAM devices and the R/W output from the MCF5272 can be left unconnected.
The number of wait states required for the external memory or peripheral can be programmed in
CSORn[WS]. The external transfer acknowledge signal, TA, is provided to allow off-chip control of wait
states. External control of wait states is enabled when CSORn[WS] is 0x1F.
Figure 20-10. Longword Read; EBI=11; 32-Bit Port; Internal Termination
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
BS[3:0]
TA
C1 C2
(H)
(H)
(H)
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-13
Figure 20-11. Word Write; EBI=11; 16/32-Bit Port; Internal Termination
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
BS[1:0]
BS[3:2]
C1 C2
(H)
(H)
(H)TA
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
20-14 Freescale Semiconductor
Figure 20-12. Read with Address Setup; EBI=11; 32-Bit Port; Internal Termination
Figure 20-13. Longword Write with Address Setup; EBI=11; 32-Bit Port; Internal Termination
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
BS[3:0]
TA
C1 C2 C3
(H)
(H)
(H)
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
BS[3:0]
TA
C1 C2 C3
(H)
(H)
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-15
Figure 20-14. Read with Address Hold; EBI=11; 32-Bit Port; Internal Termination
Figure 20-15. Longword Write with Address Hold; EBI=11; 32-Bit Port; Internal Termination
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
BS[3:0]
TA
C1 C2 C3
(H)
(H)
(H)
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
BS[3:0]
TA
C1 C2 C3
(H)
(H)
Bus Operation
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20-16 Freescale Semiconductor
Figure 20-16. Longword Read with Address Setup and Address Hold;
EBI = 11; 32-Bit Port, Internal Termination
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
BS[3:0]
TA
C2 C3C1 C4
(H)
(H)
(H)
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-17
Figure 20-17. Longword Write with Address Setup and Address Hold;
EBI = 11; 32-Bit Port, Internal Termination
20.7 Burst Data Transfers
The MCF5272 uses line read transfers to access 16 bytes to support cache line filling DMA transfers, and
MOVEM instructions, when appropriate. A cache line read accesses a block of four longwords, aligned to
a longword memory boundary, by supplying a starting address that points to one of the longwords and
incrementing A[3:0] of the supplied address for each transfer . A longword read accesses a single longword
aligned to a longword boundary and increments A1 and A0 if the accessed port size is smaller than 32 bits.
A word read accesses a single word of data, aligned to a word boundary and increments A0 if the accessed
port size is smaller than 16 bits.
The MCF5272 uses line write transfers to access a 16-byte operand for MOVEM instructions and DMA
transfers, when appropriate. A line write accesses a block of four longwords, aligned to a longword
memory boundary, by supplying a starting address that points to one of the longwords and increments
A[3:0] of the supplied address for each transfer. A longword write accesses a single longword aligned to
a longword boundary and increments A1 and A0 if the accessed port size is smaller than 32 bits. A word
write accesses a single word of data, aligned to a word boundary and increments A0 if the accessed port
size is smaller than 16 bits.
The MCF5272 hardware supports the following types of burst transfers.
• Sixteen byte cache line read bursts from 32-bit wide SDRAM with access times of n-1-1-1. The
value of n depends on read, write, page miss, page hit, etc. See Chapter 9, “SDRAM Controller,”
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
BS[3:0]
TA
C1 C2 C3 C4
(H)
(H)
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
20-18 Freescale Semiconductor
for complete details of access times. To enable this type of transfer, CSOR7[EXTBURST] must be
cleared, CSBR7[EBI] must be 01, and CSBR7[BW] must be 11.
• Sixteen byte cache line read bursts from 16-bit wide SDRAM with access times of n-1-1-1-1-1-1-1.
CSOR7[EXTBURST] must be set, CSBR7[EBI] must be 01, and CSBR7[BW] must be 10.
• Sixteen byte read or write bursts during Ethernet DMA transfers to/from SDRAM with access
times of n-1-1-1 or n-1-1-1-1-1-1-1 depending on 32 or 16 bit SDRAM port width as described in
the previous two paragraphs.
All bursts to and from SRAM or from ROM appear as a sequence of four single longword accesses in the
case of 32-bit wide memory. In the case of 16-bit wide SRAM or ROM memory, a burst appears as a
sequence of eight single word accesses. In the case of 8 bit wide SRAM or ROM memory a burst appears
as a sequence of sixteen single byte accesses. It is never necessary to set CSORn[EXTBURST] when
CSORn[EBI] = 00 or 1 1. CSBRn[BW] = 1 1 is invalid for SRAM/ROM; it should be programmed with the
port size.
20.8 Misaligned Operands
All MCF5272 data formats can be located in memory on any byte boundary. A byte operand is properly
aligned at any address; a word operand is misaligned at an odd address; and a longword is misaligned at
an address that is not evenly divisible by four . However, because operands can reside at any byte boundary ,
they can be misaligned.
Although the MCF5272 does not enforce any alignment restrictions for data operands (including program
counter (PC) relative data addressing), significant performance degradation can occur when additional bus
cycles are required for longword or word operands that are misaligned. For maximum performance, data
items should be aligned on their natural boundaries. All instruction words and extension words must reside
on word boundaries. An address error exception occurs with any attempt to prefetch an instruction word
at an odd address.
The MCF5272 converts misaligned operand accesses to a sequence of aligned accesses. Figure 20-18
illustrates the transfer of a longword operand from a byte address to a 32-bit port, requiring more than one
bus cycle. Figure 20-19 is similar to the example illustrated in Figure 20-18 except that the operand is
word-sized and the transfer requires only two bus cycles.
Figure 20-18. Example of a Misaligned Longword Transfer
Figure 20-19. Example of a Misaligned Word Transfer
Transfer 1
Transfer 2
Transfer 3
—
—
Byte 3
Byte 0
—
—
—
Byte 1
—
—
Byte 2
—
31 24 23 16 15 8 7 0
001
010
100
A[2:0]
Transfer 1
Transfer 2
—
Byte 1
—
—
—
—
Byte 0
—
31 24 23 16 15 8 7 0
001
100
A[2:0]
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-19
20.9 Interrupt Cycles
All interrupt vectors are internally generated. The MCF5272 does not support external interrupt
acknowledge cycles. The System Integration Module prioritizes all interrupt requests and issues the
appropriate vector number in response to an interrupt acknowledge cycle. Refer to the System Integration
chapter for details on the interrupt vectors and their priorities.
When an external peripheral device requires the services of the CPU, it can signal the ColdFire core to take
an interrupt exception. The external peripheral devices use the interrupt request signals (INTx) to signal
an interrupt condition to the MCF5272. The interrupt exception transfers control to a routine that responds
appropriately.
There are a total of six external interrupt inputs, INT[6:1]. Depending on the pin configuration between
three and six of these pins are available. Each interrupt input pin is dedicated to an external periphe ral. It
is possible to have multiple external peripherals share an INTx pin but software must then determine which
peripheral caused the interrupt. The interrupt priority level and the signal level of each interrupt pin are
individually programmable.
The MCF5272 continuously samples the external interrupt input signals and synchronizes and debounces
these signals. An interrupt request must be held constant for at least two consecutive CLK periods to be
considered a valid input. MCF5272 latches the interrupt and the interrupt controller responds as
programmed. The interrupt service routine must clear the latch in the ICR registers.
NOTE
All internal interrupts are level sensitive only. External interrupts are
edge-sensitive as programmed in the PITR. Interrupts must remain stable
and held valid for two clock cycles while they are internally synchronized
and latched.
The MCF5272 takes an interrupt exception for a pending interrupt within one instruction boundary after
processing any other pending exception with a higher priority. Thus, the MCF5272 executes at least one
instruction in an interrupt exception handler before recognizing another interrupt request.
20.10 Bus Errors
The system hardware can use the transfer error acknowledge (TEA) signal to abort the current bus cycle
when a fault is detected. A bus error is recognized during a bus cycle when TEA is asserted.
NOTE
The signal TEA is not intended for use in normal operation since each chip
select can be programmed to automatically terminate a bus cycle at a time
defined by the bits programmed into the wait state field of the Chip Select
Option Register. There is an on chip bus monitor which can be configured
to generate an internal TEA signal.
When the MCF5272 recognizes a bus error condition for an access, the access is terminated immediately.
An access that requires mo re than one transfer aborts without completing the remaining transfers if TEA
is asserted, regardless of whether the access uses burst or non-burst transfers.
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
20-20 Freescale Semiconductor
Figure 20-20 shows a longword write access to a 32-bit port with a transfer error.
Figure 20-20. Longword Write Access To 32-Bit Port Terminated with TEA Timing
Clock 1 (C1)
The write cycle starts in C1. During C1, the MCF5272 places valid values on the address bus
(A[22:0]) and the chip select signal.
Clock 2 (C2)
During C2, the MCF5272 drives the data bus, the byte strobes, and R/W.
Clock 3 (C3)
During C3, the selected device detects an error and asserts TEA. At the end of C3 or Cx, the
MCF5272 samples the level of TEA. If it is asserted, the transfer of the longword is aborted and
the transfer terminates.
NOTE
This example shows TEA being asserted during C3. TEA can be asserted
earlier or later than C3.
NOTE
If TA is asserted when debug transfer error -acknowledge (TEA) is asserted,
the transfer is terminated with a bus error.
SDCLK
A[22:0]
D[31:0]
OE
R/W
CSn
TEA
BS[3:0]
(H)
C1 C2 C3 Cx C4
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-21
NOTE
TEA normally should be asserted for no more than three CLKIN periods.
The minimum is two clock periods.
NOTE
TEA is internally synchronized on the rising edge of CLKIN. Depending on
when this synchronization takes place, the Cx cycle may not occur.
20.11 Bus Arbitration
The MCF5272 does not allow external bus masters. There are three on-chip bus masters. These are the
ColdFire core, the Fast Ethernet Controller, and the memory-to-memory DMA Controller.
20.12 Reset Operation
The MCF5272 supports four types of reset, two of which are external hardware resets (master reset and
normal reset), a soft reset, which is generated by setting SCR[SOFTRST], and the software watchdog
reset.
There are two reset input pins, RSTI and DRESETEN. When DRESETEN is asserted, any of the reset
sources reset the SDRAM controller. When DRESETEN is negated, the SDRAM controller is not reset.
This is useful during software debugging since it is preferable to retain SDRAM data in the case of
catastrophic system failure. In a production system, if may be preferable to tie DRESETEN low.
Master reset resets the entire MCF5272 including the SDRAM controller. Master reset occurs when both
RSTI and DRESETEN are asserted simultaneously. This is the reset that should be applied to the
MCF5272 device at power up.
Normal reset resets all of the MCF5272 with the exception of the SDRAM controller . Normal reset occurs
when RSTI is asserted and DRESETEN is negated. Normal reset allows DRAM refresh cycles to continue
at the programmed rate and with the programmed waveform timing while the remainder of the system is
being reset, maintaining the data stored in DRAM.
SCR[SOFTRST] resets all on-chip peripherals and devices connected to RSTO. It resets the SDRAM
controller only when DRESETEN is asserted.
The software watchdog reset acts as an internally generated normal reset when DRESETEN is negated. It
resets the SDRAM controller only when DRESETEN is asserted.
NOTE
Master reset must be asserted for all power-on resets. This is done by driving
RSTI and DRESETEN low simultaneously. Failure to assert master reset
during power-on sequences results in unpredictable DRAM controller
behavior.
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
20-22 Freescale Semiconductor
20.12.1 Master Reset
To perform a master reset, an external device asserts RSTI and DRESETEN simultaneously for a
minimum of six CLKIN cycles after VDD is within tolerance. This should always be done when power is
initially applied. A master reset resets the entire device including the SDRAM controller.
Figure 20-21 is a functional timing diagram of the master reset operation, illustrating relationships among
VDD, RSTI, DRESETEN, RSTO, mode selects, and bus signals.
CLKIN must be stable by the time VDD reaches the minimum operating specification. RSTI and
DRESETEN are internally synchronized on consecutive rising and falling clocks before being used. They
must meet the specified setup and hold times to the falling edge of CLKIN only if recognition by a specific
falling edge is required
.
Figure 20-21. Master Reset Timing
When the assertion of RSTI is recognized internally, the MCF5272 asserts the reset out pin (RSTO ). The
RSTO pin is asserted as long as RSTI is asserted and remains asserted for 32,768 CLKIN cycles after RSTI
is negated.
During the master reset period, all outputs are driven to their default levels. Once RSTO negates, all bus
signals continue to remain in this state until the ColdFire core begins the first bus cycle for reset exception
processing.
The levels of the mode select inputs, QSPI_Dout/WSEL, QSPI_CLK/BUSW1, and QSPI_CS0/BUSW0,
are sampled when RSTO negates and they select the port size of CS0 and the physical data bus width after
a master reset occurs. The INTx signals are synchronized and are registered on the last falling edge of
CLKIN where RSTI is asserted.
A master reset causes any bus cycle (including SDRAM refresh cycles) to terminate. In addition, master
reset initializes registers appropriately for a reset exception. During an external master reset,
SCR[RSTSRC] is set to 0b1 1 to indicate that assertion of RSTI and DRESETEN caused the previous reset.
VDD
RSTI
Mode Select
CLKIN
RSTO
T >= 6
CLK CYCLES T = 32,768
CLK CYCLES T >= 22
CLK CYCLES
BUS SIGNALS
DRESETEN
Inputs
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-23
20.12.2 Normal Reset
External normal resets should be performed anytime it is important to maintain the data stored in SDRAM
during a reset. An external normal reset is performed when an external device asserts RSTI while negating
DRESETEN. At power on reset both RSTI and DRESETEN must be asserted simultaneously. If
DRESETEN is not asserted at the same time as RSTI at power up, the SDRAMC cannot be initialized by
software.
During an external normal reset, RSTI must be asserted for a minimum of six CLKINs. Figure 20-22 is a
functional timing diagram of external normal reset operation, illustrating relationships among RSTI,
DRESETEN, RSTO, mode selects, and bus signals. RSTI and DRESETEN are internally synchronized on
consecutive falling and rising clocks before being used and must meet the specified setup and hold times
to the falling edge of CLKIN only if recognition by a specific falling edge is required
.
Figure 20-22. Normal Reset Timing
The levels of the mode select inputs, QSPI_Dout/WSEL, QSPI_CLK/BUSW1, QSPI_CS0/BUSW0, and
HiZ are sampled when RSTO negates and they select the port size of CS0 and the physical data bus width
after a master reset occurs. RSTO is asserted as long as RSTI is asserted and remains asserted for 32,768
CLKIN cycles after RSTI is negated. For proper normal reset opera tion, DRESETEN must be negated as
long as RSTI is asserted.
The levels of the mode select inputs, QSPI_Dout/WSEL, QSPI_CLK/BUSW1, and QSPI_CS0/BUSW0,
are sampled when RSTO negates and they select the port size of CS0 and the physical data bus width after
a master reset occurs. The INTx signals are synchronized and are registered on the last falling edge of
CLKIN where RSTI is asserted.
During the normal reset period, all outputs are driven to their default levels. Once RSTO negates, all bus
signals continue to remain in this state until the ColdFire core begins the first bus cycle for reset exception
processing.
VDD
RSTI
Mode Select
CLKIN
RSTO
T >= 6
CLK CYCLES T = 32,768
CLK CYCLES T >= 22
CLK CYCLES
BUS SIGNALS
DRESETEN
Inputs
(H)
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
20-24 Freescale Semiconductor
A normal reset causes all bus activity except SDRAM refresh cycles to te rminate. Durin g a normal reset,
SDRAM refresh cycles continue to occur at the programmed rate and with the programmed waveform
timing. In addition, normal reset initializes registers appropriately for a reset exception. During a normal
reset, SCR[RSTSRC] is set to 0b01 to indicate assertion of RSTI with DRESETEN negated caused the
previous reset.
20.12.3 Software Watchdog Timer Reset Operation
A software watchdog timer is provided to allow periodic monitoring of software activity. If the software
watchdog is not periodically accessed by software it can programmed to generate a reset after a timeout
period. When the timeout occurs, an internal reset is asserted for 32K clocks, resetting internal registers as
with a normal reset. The RSTO pin simultaneously asserts for 32K clocks after the software watchdog
timeout. Figure 20-23 illustrates the timing of RSTO when asserted by a software watchdog timeout.
Figure 20-23. Software Watchdog Timer Reset Timing
NOTE
Like the normal reset, the internal reset generated by a software watchdog
timeout does not reset the SDRAM controller unless DRESETEN is low
during the reset. When DRESETEN is high, SDRAM refreshes continue to
be generated during and after the reset at the programme d rate and with the
programmed waveform timing.
During the software watchdog timer reset period, all outputs are driven to their default levels. Once RSTO
negates, all bus signals continue to remain in this state until the ColdFire core begins the first bus cycle for
reset exception processing.
During a software watchdog timer reset, SCE[RSTSRC] is set to 0b10 to indicate the software watchdog
as the source of the previous reset.
CLKIN
RSTO
BUS SIGNALS
SOFTWARE
INTERNAL
WATCHDOG
TIMEOUT
RSTI
T = 32K
CLKIN CYCLES
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 20-25
NOTE
The levels of the mode pins are not sampled during a software watchdog
reset. If the port size and acknowledge features of CS0 are different from the
values programmed in CSBR0 and CSOR0 at the time of the software
watchdog reset, you must assert RSTI during software watchdog reset to
cause the mode pins to be resampled.
20.12.4 Soft Reset Operation
If the soft reset bit, SCR[SOFTRST], is programmed to generate a reset, RST O is asserted for 128 clocks,
resetting all external devices as with a normal or master reset. All internal peripherals with the exception
of the SIM, chip select, interrupt controller, GPIO module, and SDRAM controller are reset also. The
SDRAM controller is reset only when DRESETEN is tied low.
SCR[SOFTRST] is automatically cleared at the end of the 128 clock period. Software can monitor this bit
to determine the end of the soft reset. Figure 20-24 shows the timing of RSTO when asserted by
SCR[SOFTRST].
Figure 20-24. Soft Reset Timing
NOTE
Like the normal reset, the soft reset does not reset the SDRAM controller
unless DRESETEN is asserted during the reset. When DRESETEN is
negated, SDRAM refreshes continue to be generated during and after reset
at the programmed rate and with the programmed waveform timing.
During the soft reset period, all bus signals continue to operate normally.
CLKIN
RSTO
SoftRST
T = 128
CLK CYCLES
INTERNAL
PERIPHERALS
RSTI
Bus Operation
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
20-26 Freescale Semiconductor
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 21-1
Chapter 21
IEEE 1149.1 Test Access Port (JTAG)
This chapter describes the dedicated user-accessible test logic implemented on the MCF5272. This test
logic complies fully with the IEEE 1149.1 Standard Test Access Port and Boundary Scan Architecture.
This chapter describes those items required by the standard and provides additional information specific
to the MCF5272 implementation. For internal details and sample applications, see the IEEE 1149.1
document.
21.1 Overview
Problems with testing high-density circuit boards led to development of this standard under the
sponsorship of the Test Technology Committee of IEEE and the Joint Test Action Group (JTAG). The
MCF5272 supports circuit board test strategies based on this standard.
The test logic includes a test access port (TAP) consisting a 16-state controller , an instruction register , and
three test registers (a 1-bit bypass register , a 265-bit boundary-scan register , and a 32- bit ID register). The
boundary scan register links the device’s pins into one shift register. The contents of this register can be
found at the ColdFire website at http://www.freescale.com. Test logic, implemented using static logic
design, is independent of the device system logic. The TAP includes the following dedicated signals:
• TCK—Test clock input to synchronize the test logic.
• TMS—Test mode select input (with an internal pullup resistor) that is sampled on the rising edge
of TCK to sequence the TAP controller's state machine.
• TDI—Test data input (with an internal pull-up resistor) that is sampled on the rising edge of TCK.
• TDO—three-state test data output that is actively driven in the shift-IR and shift-DR controller
states. TDO changes on the falling edge of TCK.
These signals, described in detail in Table 21-1, are enabled by negating the Freescale test mode signal
(MTMOD).
The MCF5272 implementation can do the following:
• Perform boundary scan operations to test circuit board electrical continuity
• Sample MCF5272 system pins during operation and transparently shift out the result in the
boundary scan register
• Bypass the MCF5272 for a given circuit board test by effectively reducing the boundary-scan
register to a single bit
• Disable the output drive to pins during circuit-board testing
• Drive output pins to stable levels
IEEE 1149.1 Test Access Port (JTAG)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
21-2 Freescale Semiconductor
NOTE
Precautions to ensure that the IEEE 1 149.1 test logic does not interfere with
non-test operation are described in Section 21.7, “Non-IEEE 1149.1
Operation.”
Figure 21-1 shows the MCF5272 implementation of IEEE 1149.1.
Figure 21-1. Test Access Port Block Diagram
21.2 JTAG Test Access Port and BDM Debug Port
The JTAG test interface shares pins with the debug modules (see Table 21-1).
Table 21-1. JTAG Signals
Signal Description
TCK/
PSTCLK
Test clock. TCK is the dedicated JTAG test logic clock input, independent of the CPU system clock. It provides a
clock for on-board test logic defined by the IEEE 1149.1 standard. TCK should be grounded if the JTAG port is not
used and MTMOD is tied low.
TMS/
BKPT
Test mode select. This input controls test mode operations for on-board test logic defined by the IEEE 1149.1
standard. Connecting TMS to VDD disables the test controller, making all JTAG circuits transparent to the system.
TDO/
DSO
Test and debug data out. Output for shifting data out of serial data port logic. Shifting out data depends on the state
of the JTAG controller state machine and the instructions in the instruction register. The shift occurs on the falling
edge of TCK. When not outputting data, TDO is placed in high-impedance state. TDO can also be three-stated to
allow bused or parallel connections to other devices having JTAG test access ports.
Decoder
4-Bit Instruction Register
ID (32 bits)
Boundary-Scan Register
Test Data Register
TAP
Controller
Bypass
(1 Bit)
TDC
TDI
TMS
TCK
30
IEEE 1149.1 Test Access Port (JTAG)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 21-3
21.3 TAP Controller
The TAP controller is a synchronous state machine that controls JTAG logic and interprets the sequence
of logical values on TMS. The value adjacent to each arrow in the state machine in Figure 21-2 reflects
the value of TMS sampled on the rising edge of TCK. For a description of the TAP controller states, refer
to the IEEE 1149.1 document.
Figure 21-2. TAP Controller State Machine
TDI/DSI Test and debug data in. Input provided for loading serial data port shift registers (boundary-scan, bypass, and
instruction registers). Shifting in of data depends on the state of the JTAG controller state machine and the
instruction currently in the instruction register. Data is shifted in on the rising edge of TCK.
TRST/
DSCLK
JTAG test reset. TRST asynchronously resets the JTAG TAP logic when low.
MTMOD Freescale test mode select. Negating MTMOD enables JTAG mode; asserting it enables BDM mode.
Table 21-1. JTAG Signals (continued)
Signal Description
IEEE 1149.1 Test Access Port (JTAG)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
21-4 Freescale Semiconductor
21.4 Boundary Scan Register
The boundary scan register contains bits for all device signal and clock pins and associated control signals.
Bidirectional pins include a single scan bit for data (IO.Cell) as shown in Figure 21-6. These bits are
controlled by an enable cell, shown in Figure 21-5. The control bit value determines whether the
bidirectional pin is an input or an output. One or more bidirectional data bits can be serially connected to
a control bit as shown in Figure 21-7. Note that when bidirectional data bits are sampled, bit data can be
interpreted only after examining the I/O control bit to determine pin direction.
Open-drain bidirectional bits require separate input and output cells as no direction control is available
from which to determine signal direction. Programmable open-drain signals also have an enable cell
(XXX.de) to select whether the pin is open drain or push-pull. Signals with pull-up or pull-down resistors
have an associated enable cell (XXX.pu); one enable cell can control multiple resistors.
Figure 21-3 to Figure 21-8 show the four MCF5272 cell types.
Figure 21-3. Output Cell (O.Cell) (BC–1)
MUX
Update DR
G1
1 = EXTEST, CLAMP, HI-Z
0 = Otherwise
To output
buffer
To next
cell
Shift DR
From last
cell Clock DR
Data from
system
logic
1
1
MUX
G1
1
11 D
C1 1 D
C1
IEEE 1149.1 Test Access Port (JTAG)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 21-5
Figure 21-4. Input Cell (I.Cell). Observe only (BC–4)
Figure 21-5. Output Control Cell (En.Cell) (BC–4)
MUX
Update DR
G1
1 = EXTEST, CLAMP, HI-Z
0 = Otherwise
I/O direction
To next
cell
Shift DR
From last
cell Clock DR
Output control
from system
logic
1
1
MUX
G1
1
11 D
C1 1 D
C1
0 = HI-Z
1 = Otherwise
To output
buffer
IEEE 1149.1 Test Access Port (JTAG)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
21-6 Freescale Semiconductor
Figure 21-6. Bidirectional Cell (IO.Cell) (BC–6)
Figure 21-7. General Arrangement for Bidirectional Pins
MUX
Update DR
G1
1 = EXTEST, CLAMP, HI-Z
0 = Otherwise
To next
cell
Shift DR
From last
cell Clock DR
Data
from system
logic
1
1
MUX
G1
1
11 D
C1 1 D
C1
To output
buffer
From input
buffer
1 = Output
MUX
G1
1
1
MUX
G1
1
1
0 = Input
Data
to system
logic
IEEE 1149.1 Test Access Port (JTAG)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 21-7
21.5 Instruction Register
The MCF5272 IEEE 1149.1 implementation includes the three mandatory public instructions (EXTEST,
SAMPLE/PRELOAD, and BYPASS), the optional public ID instruction, plus two additional public
instructions (CLAMP and HI-Z) defined by IEEE 1149.1. The MCF5272 includes a 4-bit instruction
register without parity, consisting of a shift register with four parallel outputs. Data is transferred from the
shift register to the parallel outputs during the update-IR controller state. The 4 bits are used to decode the
instructions in Table 21-2.
The parallel output of the instruction register is reset to 0001 in the test-logic-reset controller state. Note
that this preset state is equivalent to the ID instruction.
Table 21-2. Instructions
B[3:0] Instruction Description
0000 EXTEST The external test (EXTEST) instruction selects the boundary scan register. EXTEST asserts internal
reset for the MCF5272 system logic to force a predictable benign internal state while performing
external boundary scan operations.
By using the TAP, the register is capable of a) scanning user-defined values into the output buffers, b)
capturing values presented to input pins, c) controlling the direction of bidirectional pins, and d)
controlling the output drive of three-state output pins. For more details on the function and uses of
EXTEST, please refer to the IEEE 1149.1 document.
0001 ID During the capture-IR controller state, the parallel inputs to the instruction shift register are loaded with
the 4-bit binary value (0001). The parallel outputs, however, remain unchanged by this action since an
update-IR signal is required to modify them.
0010 SAMPLE/
PRELOAD
The SAMPLE/PRELOAD instruction selects the boundary scan register and provides two separate
functions. First, it provides a means to obtain a snapshot of system data and control signals. The
snapshot occurs on the rising edge of TCK in the capture-DR controller state. The data can be
observed by shifting it transparently through the boundary scan register.
Because there is no internal synchronization between the IEEE 1149.1 clock (TCK) and the system
clock (CLKOUT), the user must provide some form of external synchronization to achieve meaningful
results.
The second function of SAMPLE/PRELOAD is to initialize the boundary scan register output bits prior
to selection of EXTEST. This initialization ensures that known data appears on the outputs when
entering the EXTEST instruction.
1001 HI-Z The HI-Z instruction anticipates the need to backdrive the output pins and protect the input pins from
random toggling during circuit board testing. The HIGHZ instruction selects the bypass register, forcing
all output and bidirectional pins to the high-impedance state.
The HI-Z instruction goes active on the falling edge of TCK in the update-IR state when the data held
in the instruction shift register is equivalent to octal 5.
1100 CLAMP When the CLAMP instruction is invoked, the boundary scan multiplexer control signal EXTEST is
asserted, and the BYPASS register is selected. CLAMP should be invoked after valid data has been
shifted into the boundary scan register, e.g., by SAMPLE/PRELOAD. CLAMP allows static levels to be
presented at the MCF5272 output and bidirectional pins, like EXTEST, but without the shift latency of
the boundary scan register from TDI to TDO.
1101 Reserved Reserved
1111 BYPASS The BYPASS instruction selects the single-bit bypass register as shown in Figure 21-8. This creates a
shift register path from TDI to the bypass register and, finally, to TDO, circumventing the boundary
scan register. This instruction is used to enhance test efficiency when a component other than the
MCF5272 becomes the device under test. When the bypass register is selected by the current
instruction, the shift register stage is set to a logic zero on the rising edge of TCK in the capture-DR
controller state. Therefore, the first bit to be shifted out after selecting the bypass register is always a
logic zero.
IEEE 1149.1 Test Access Port (JTAG)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
21-8 Freescale Semiconductor
Figure 21-8 shows the structure of the bypass register.
Figure 21-8. Bypass Register
21.6 Restrictions
The control afforded by the output enable signals using the boundary scan register and the EXTEST
instruction requires a compatible circuit board test environment to avoid configurations that could damage
the device. The user must avoid situations in which the MCF5272 output drivers are enabled into actively
driven networks. Overdriving the TDO driver when it is active is not recommended.
21.7 Non-IEEE 1149.1 Operation
In non-IEEE 1 149.1 operation, IEEE 1149.1 test logic must be made transparent to system logic by forcing
the TAP controller into test-logic-reset state, which takes at least five consecutive TCK rising edges with
TMS high. TMS has an internal pull-up resistor and may be left unconnected.
If TMS is unconnected or connected to VCC, the TAP controller cannot exit test-logic-reset state,
regardless of the TCK state. This requires the TMS, TCK, and TDI inputs to be high.
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 22-1
Chapter 22
Mechanical Data
This chapter contains drawings showing the pinout and the packaging and mechanical characteristics of
the MCF5272.
22.1 Pinout
Figure 22-1 shows a pinout of the MCF5272.
1234567891011121314
ADDATA3DDATA1TEA TDI/
DSI
D16/
D0D18/
D2D21/
D5D22/
D6BS0RAS0A13/
SDA12/
SDA11
A2/
SDA1/
SDA0
A3/
SDA2/
SDA1
A4/
SDA3/
SDA2
BPST0DDATA2MTMOD TMS/
BKPT A20 D17/
D1D20/
D4D23/
D7SDWE SDCS/
CS7A12/
SDA11 A1/
SDA0
A5/
SDA4/
SDA3
A6/
SDA5/
SDA4
CPST2PST1DDATA0TCK/
PSTCLK A21 A18 D19/
D3BS1CAS0A14/
SDA13/
SDA12
A11/
SDA9
A7/
SDA6/
SDA5
A8/
SDA7/
SDA6
A9/
SDA8/
SDA7
DPA1/
USB_RP
PA0/
USB_TP PST3TRST/
DSCLK
TDO/
DSO A19 A17 A16 A15 A0D14/
PC14
A10/
SDA9/
SDA8SDCLKE A10_PRECHG
EPA6/
USB_RXD
PA5/
USB_TXEN
PA4/
USB_SUSP
PA3/
USB_TN
PA2/
USB_RN TEST GND GND A22 D15/
PC15 D13/
PC13 BS2BS3SDCLK
FUSB_D+USB_D-PB5/
TA RSTO VDD VDD GND GND VDD VDD D12/
PC12 D24/
D8D25/
D9D26/
D10
GUSB_VDD USB_GND PB4/
URT0_CLK PB6VDD GND GND GND GND VDD D11/
PC11 D27/
D11 D28/
D12 D29/
D13
HPB1/
URT0_RXD
PB2/
URT0_CTS
PB3/
URT0_RTS
PB0/
URT0_TXD VDD GND GND GND GND VDD D10/
PC10 SDBA1D31/
D15 D30/
D14
JUSB_CLK
PA8/
FSC0/
FSR0
PA9/
DGNT0DCL0/
URT1_CLK VDD VDD GND GND VDD VDD D7D8D9SDBA0
KDIN0/
URT1_RXD
URT1_CTS/
QSPI_CS2URT1_RTS/
INT5DOUT0/
URT1_TXD
PA10/
DREQ0PWM_OUT2/
TIN1VDD VDD CS0/
BOOT CS1D3/
PC3D4/
PC4D5/
PC5D6/
PC6
LPA11/
QSPI_CS1PA12/
DFSC2PA13/
DFSC3
FSC1/
FSR1/
DFSC1
QSPI_CLK/
BUSW1TIN0E_TXCLK PB10/
E_TXD1PB14/
E_RXER E_CRS CS5D0/
PC0D1/
PC1D2/
PC2
MDCL1/
GDCL1_OUT
PA14/
DREQ1PA15_INT6/
DGNT1_INT6INT1/
USB_WOR
QSPI_CS0/
BUSW0PB7/
TOUT0E_RXDV PB9/
E_TXD2PB13/
E_RXD1E_TXER CS4RSTI BYPASS CLKIN
NDOUT1DIN1INT3QSPI_DOUT/
WSEL PWM_OUT0E_TXD0E_RXCLK PB8/
E_TXD3PB12/
E_RXD2E_MDIO CS3DRESE
TEN VDD HiZ
PPA7/
QSPI_CS3/
DOUT3
DIN3/
INT4INT2QSPI_DIN PWM_OUT1/
TOUT1E_COL E_RXD0E_TXEN PB11/
E_RXD3PB15/
E_MDC CS2CS6OE/
RD R/W
Figure 22-1. MCF5272 Pinout (196 MAPBGA)
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-1
Chapter 23
Electrical Characteristics
This chapter describes AC and DC electrical specifications and thermal characteristics for the MCF5272
microcontroller . Because additional speeds may have become available since the publication of this book,
consult Freescale’s ColdFire web page, http://www.freescale.com, to confirm that this is the latest
information.
23.1 Maximum Ratings
This section contains information on the maximum ratings of the MCF5272 microcontroller.
23.1.1 Supply, Input Voltage, and Storage Temperature
Table 23-1 lists maximum voltages and temperatures.
The ratings in Table 23-1 define maximum conditions to which the MCF5272 may be subjected without
being damaged. However, the device cannot operate normally while exposed to these electrical extremes.
This device contains circuitry that protects against damage from high static voltages or electrical fields;
however , normal precautions should be taken to avoid application of voltages higher than maximum-rated
voltages to this high-impedance circuit. Reliability improves when unused inputs are tied to an appropriate
logic voltage level (GND or VDD).
Table 23-1. Maximum Supply, Input Voltage and Storage Temperature
Rating Symbol Value Unit
Supply voltage VDD –0.3 to + 4.0 V
Maximum operating voltage VDD +3.6 V
Minimum operating voltage VDD +3.0 V
Input voltage Vin –0.5 to +5.5 V
Storage temperature range Tstg –55 to 150 °C
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-2 Freescale Semiconductor
23.1.2 Operating Temperature
Table 23-2 lists operating temperatures.
23.1.3 Resistance
Table 23-3 lists thermal resistance values.
Table 23-2. Operating Temperature
Characteristic Symbol
Value
Unit
Standard Extended
Maximum operating junction temperature TJ100 115 °C
Maximum operating ambient temperature T
Amax 701
1Use this maximum operating ambient temperature only as a system design guideline. All device operating parameters are
guaranteed only when the junction temperature lies within the specified range.
851°C
Minimum operating ambient temperature T
Amin 0-40°C
Table 23-3. Thermal Resistance
Characteristic Symbol Value Unit
Junction to ambient, natural convection Single layer board (1s) θJA 511,2
1θJA and Ψjt parameters are simulated in accordance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of θJA and power dissipation specifications in the system design to prevent device junction temperatures
from exceeding the rated specification. System designers should be aware that device junction temperatures can be
significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature specification
can be verified by physical measurement in the customer’s system using the Ψjt parameter, the device power dissipation, and
the method described in EIA/JESD Standard 51-2.
2Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
°C/W
Junction to ambient, natural convection Four layer board (2s2p) θJMA 261,3
3Per JEDEC JESD51-6 with the board horizontal.
°C/W
Junction to ambient (@200 ft/min) Single layer board (1s) θJMA 411,3 °C/W
Junction to ambient (@200 ft/min) Four layer board (2s2p) θJMA 231,3 °C/W
Junction to board θJB 154
4Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
°C/W
Junction to case θJC 105
5Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
°C/W
Junction to top of package Natural convection Ψjt 21,6
6Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
°C/W
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-3
23.2 DC Electrical Specifications
Table 23-4 lists DC electrical temperatures.
23.2.1 Output Driver Capability and Loading
Table 23-5 lists values for drive capability and output loading.
Table 23-4. DC Electrical Specifications
Characteristic Symbol Min Max Unit
Operation voltage range VDD 3.0 3.6 V
Input high voltage VIH 2. 0 5.0 V
Input low voltage VIL GND 0.8 V
Input signal undershoot — — 0.8 V
Input signal overshoot — — 0.8 V
Input leakage current @ GND, VDD CLKIN, D[31:0], PA[15:0], PB[15:0], TIN[1:0],
IRQ[6:1], CLK, TEA, PST[3:0], DDATA[3:0], RSTI, DRESETEN, TDI, TCK, HIZ,
MTMOD
Iin —20μA
HI-Z (three-state) leakage current @GND, VDD, A[22:0], D[31:0], OE/RD, R/W,
TDO/DSO
ITSI —20μΑ
Signal low input current, VIL = 0.8 V, TMS/BKPT, TDI/DSI, TRST/DSCLK IIL 01mA
Signal high input current, VIH = 2.0 V TMS/BKPT, TDI/DSI, TRST/DSCLK IIH 01mA
Output high voltage V
OH 2.4 — V
Output low voltage V
OL —0.5V
Pin capacitance1
1This specification periodically sampled but not 100% tested.
Cin —10pF
Table 23-5. I/O Driver Capability
Signal Drive Capability Output Load (CL)
A[22:0] 6 mA 30 pF
D[31:0] 6 mA 30 pF
CS[6:0] 6 mA 30 pF
BS 6 mA 30 pF
OE/RD 4 mA 30 pF
DACK/HIZ 4 mA 30 pF
TC/BYPASS 4 mA 30 pF
A10_PRECHG 10 mA 30 pF
R/W 10 mA 30 pF
SDBA[1:0] 10 mA 30 pF
RAS0 10 mA 30 pF
CAS0 10 mA 30 pF
SDCLK 10 mA 30 pF
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-4 Freescale Semiconductor
SDWE 10 mA 30 pF
SDCLKE 10 mA 30 pF
SDCS/CS7 10 mA 30 pF
TDO/DSO 4 mA 30 pF
TCK/PSTCLK 4 mA 30 pF
DDATA[3:0] 4 mA 30 pF
PST[3:0] 4 mA 30 pF
RSTO 4 mA 30 pF
PA[13:0] 2 mA 30 pF
PA14 4 mA 30 pF
PA15_INT6 2 mA 30 pF
PB0,PB3,PB7 4 mA 30 pF
PB[2:1],PB[6:4] 2 mA 30 pF
PB[10:8] 4 mA 30 pF
PB[15:11] 2 mA 30 pF
USB_D+ 1—
USB_D- 1—
DOUT1 2 mA 30 pF
FSC1 2 mA 30 pF
DCL1 4 mA 30 pF
URT2_CTS 2 mA 30 pF
URT2_RTS 2 mA 30 pF
URT2_TxD 2 mA 30 pF
QSPI_Dout 4 mA 30 pF
QSPI_CLK 4 mA 30 pF
QSPI_CS0 2 mA 30 pF
PWM_OUT[3:1] 4 mA 30 pF
E_TxD0 4 mA 30 pF
E_TxEN 2 mA 30 pF
E_MDIO 2 mA 30 pF
E_TxERR 2 mA 30 pF
1Requires external protection circuitry to meet USB 1.1 electrical requirements
under all conditions (see 12.5.3, “Recommended USB Protection Circuit”).
Table 23-5. I/O Driver Capability (continued)
Signal Drive Capability Output Load (CL)
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-5
23.3 AC Electrical Specifications
NOTE
AC timing specifications may be subject to change during ongoing
qualification.
AC timing specifications assume maximum output load capacitance on all
output pins including SDCLK. If this value is different, the input and output
timing specifications would need to be adjusted to match the clock load.
AC timing specifications referenced to SDCLK assume SDRAM control
register bit 3 is 0. After reset this bit is set.
23.3.1 Clock Input and Output Timing Specifications
Table 23-6 lists clock input and output timings.
Clock input and output timings listed in Table 23-6 are shown in Figure 23-1.
Figure 23-1. Clock Input Timing Diagram
Table 23-6. Clock Input and Output Timing Specifications
Name Characteristic
0–66 MHz
Unit
Min Max
Frequency of operation 0 66.00 MHz
C1 CLKIN period (T) 1
1The clock period is referred to as T in the electrical specifications. The time for T is always in nS. Timing specifications can be
given in terms of T. For example, 2T+5 nS
15 — nS
C2 2
2Specification values are not tested.
CLKIN fall time (from Vh = 2.4 V to Vl = 0.5 V) — 2 nS
C3 2 CLKIN rise time (from Vl = 0.5 V to Vh = 2.4 V) — 2 nS
C4 CLKIN duty cycle (measured at 1.5 V) 45 55 %
C4a3
3Specification values listed are for maximum frequency of operation.
CLKIN pulse-width high (measured at 1.5 V) 6.75 8.25 nS
C4b3CLKIN pulse-width low (measured at 1.5 V) 6.75 8.25 nS
CLKIN
C1
C4a C4b
C3C2 Vh
Vl
(input)
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-6 Freescale Semiconductor
23.3.2 Processor Bus Input Timing Specifications
Table 23-7 lists processor bus input timings.
NOTE
All processor bus timings are synchronous; that is, input setup/hold and
output delay with respect to the rising edge of a reference clock. The
reference clock is the SDCLK output.
All other timing relationships can be derived from these values.
Table 23-7. Processor Bus Input Timing Specifications
Name Characteristic1
1All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0.
0–66 MHz
Unit
Min Max
Control Inputs
B1a 2
2RSTI, TA, TEA, and INTx are synchronized internally. The setup time must be met only if recognition is needed on a particular
clock edge.
RSTI valid to SDCLK (setup) 6.5 — nS
B1b 2 TA valid to SDCLK (setup) 8—nS
B1c 2 TEA valid to SDCLK (setup) 8 — nS
B1d 2 INTx valid to SDCLK (setup) 8 — nS
B1e 2 BKPT valid to PSTCLK (setup) 10 — nS
B1f Mode selects (BUSW[1:0], WSEL, HiZ) valid to SDCLK (setup) (when RSTI asserted) 8 — nS
B2d SDCLK to asynchronous control inputs (RSTI, TA, TEA, INTx) invalid (hold) 2 — nS
B2e SDCLK to mode selects (BUSW[1,0], WSEL, HIZ) invalid (hold) (when RSTI asserted) 2 — nS
B2f PSTCLK to asynchronous control input BKPT invalid (hold) 0 — nS
B3 RSTI width low 10T — nS
Data Inputs
B4 Data input (D[31:0]) valid to SDCLK (setup) 14 — nS
B5 SDCLK to data input (D[31:0]) invalid (hold) 0 — nS
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-7
Timings listed in Table 23-7 are shown in Figure 23-2.
Figure 23-2. General Input Timing Requirements
Invalid Invalid
SDCLK Output
TSETUP THOLD
Input Setup And Hold
1.5V
trise = 1.5 nS
Vh = VIH
Vl = VIL
1.5V1.5V Valid
tfall = 1.5 nS
Vh = VIH
Vl = VIL
Input Rise Time
Input Fall Time
* The timings are also valid for inputs sampled on the negative clock edge.
Inputs
SDCLK B4 B5
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-8 Freescale Semiconductor
23.3.3 Processor Bus Output Timing Specifications
Table 23-8 lists processor bus output timings.
NOTE
Above 48 MHz, the memory bus may need to be configured for one wait
state. It is the responsibility of the user to determine the ac tual frequency at
which to insert a wait state since this depends on the access time of SRAM
or SDRAM used in a particular system implementation.
Wait states are inserted for SRAM accesses by programming bits 6–2 of the
chip select option registers.
A wait state is added for SDRAM read accesses by setting bit 4 of the
SDRAM control register.
Table 23-8. Processor Bus Output Timing Specifications
Name Characteristic 1
1All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0.
0–66 MHz
Unit
Min Max
Control Outputs
B6a SDCLK to chip selects (CS[6:0]) valid — 12 nS
B6b SDCLK to byte enables (BS[3:0]) valid — 9.5 nS
B6c SDCLK to output enable (OE) valid — 9.0 nS
B6d SDCLK to write enable (R/W) valid — 8 nS
B6e SDCLK to reset output (RSTO) valid — 13.5 nS
B7a SDCLK to control output (CS[6:0], OE) invalid (output hold) 1.5 — nS
B7b SDCLK to control output (BS[3:0], R/W) invalid (output hold) 1.0 — nS
B7c SDCLK to reset output (RSTO) invalid (output hold) 4 — nS
Address and Attribute Outputs
B8 SDCLK to address (A[22:0]) valid — 13.0 nS
B9 SDCLK to address (A[22:0]) invalid (output hold) 1.5 — nS
Data Outputs
B11 SDCLK to data output (D[31:0]) valid — 11 nS
B122
2Data output is held valid for one CPU clock period after deassertion of BS[3:0]
SDCLK to data output (D[31:0]) invalid (output hold) 1 — nS
B13 SDCLK to data output (D[31:0]) high impedance — 6 nS
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-9
Read/write SRAM bus timings listed in Table 23-8 are shown in Figure 23-3, Figure 23-4, Figure 23-5,
and Figure 23-6.
Figure 23-3. Read/Write SRAM Bus Timing
SDCLK
CSn
A[22:0]
OE
R/W
BS[3:0]
D[31:0]
TA
(H)
(H)
S0 S2 S4 S5
S1 S3 S0 S1 S2 S3 S4 S5 S0 S1 S2
TEA (H)
B6a
B8
B7a
B9
B6c B7a
B6b B7b
B4
B5
B11 B12
B6d B7b
B7aB6a
B9B8
B6b B7b
B13
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-10 Freescale Semiconductor
Figure 23-4 shows an SRAM bus cycle terminated by TA showing timings listed in Table 23-8.
Figure 23-4. SRAM Bus Cycle Terminated by TA
SDCLK
CSn
A[22:0]
OE
R/W
BS[3:0]
TA
(H)
S0 S2 S4 S5
S1 S3 SW0 SW1 S0 S1
TEA (H)
B6a
B8
B7a
B9
B6c B7a
B6b B7b
B2d
B1b
D[31:0]
B4
B5
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-11
Figure 23-5 shows an SRAM bus cycle terminated by TEA showing timings listed in Table 23-8.
Figure 23-5. SRAM Bus Cycle Terminated by TEA
SDCLK
CSn
A[22:0]
OE
R/W
BS[3:0]
D[31:0]
TA
(H)
S0 S2 S4 S5
S1 S3 SW0 SW1 S0 S1
TEA
(H)
B6a
B8
B7a
B9
B6c B7a
B6b B7b
B2d
B1c
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-12 Freescale Semiconductor
Figure 23-6 shows reset and mode Select/HIZ configuration timing showing parameters listed in
Table 23-8.
Figure 23-6. Reset and Mode Select/HIZ Configuration Timing
RSTI
Mode selects
SDCLK
(BUSW[1,0],
WSEL,HIZ)
B3
B1f
B2e
Reset is asynchronous.
Assert for at least 2
consecutive SDCLK
rising edges
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-13
23.4 Debug AC Timing Specifications
Table 23-9 lists specifications for the debug AC timing parameters shown in Figure 23-8.
Figure 23-7 shows real-time trace timing for the values in Table 23-9.
Figure 23-7. Real-Time Trace AC Timing
Figure 23-8 shows BDM serial port AC timing for the values in Table 23-9.
Figure 23-8. BDM Serial Port AC Timing
Table 23-9. Debug AC Timing Specification
Num Characteristic
0-66 MHz
Units
Min Max
D1 PST[3:0], DDATA[3:0] to PSTCLK valid — 8.5 nS
D2 PSTCLK to PST[3:0], DDATA[3:0] hold 1 — nS
D3 DSI-to-DSCLK setup 1 — PSTCLKs
D4 1
1DSCLK and DSI are synchronized internally. D4 is measured from the synchronized DSCLK input relative to the rising edge
of PSTCLK.
DSCLK-to-DSO hold 4 — PSTCLKs
D5 DSCLK cycle time 5 — PSTCLKs
PSTCLK
PST[3:0], DDATA[3:0]
D2
D1
DSI
DSO
Current Next
PSTCLK
Past Current
DSCLK
D3
D4
D5
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-14 Freescale Semiconductor
23.5 SDRAM Interface Timing Specifications
Table 23-10 lists SDRAM interface timings.
Figure 23-9 shows SDRAM timings listed in Table 23-10.
NOTE
Above 48 MHz, the memory bus may need to be configured for one wait
state. It is the responsibility of the user to determine the ac tual frequency at
which to insert a wait state since this depends on the access time of SRAM
or SDRAM used in a particular system implementation.
Wait states are inserted for SRAM accesses by programming bits 6–2 of the
chip select option registers.
A wait state is added for SDRAM read accesses by setting bit 4 of the
SDRAM control register.
Table 23-10. SDRAM Interface Timing Specifications
Name Characteristic 1
1All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0.
0–66 MHz
Unit
Min Max
Control Inputs
SD1 SDCLK to address output A[22:0] valid — 13.0 nS
SD2 SDCLK to address output A[22:0] invalid (output hold) 1 —
SD3 SDCLK to DQM[3:0] valid — 9 nS
SD4 SDCLK to DQM[3:0] invalid (output hold) 1.0 —
SD5 SDCLK to data output (D[31:0]) valid (signal from driven or three-state) — 13.0 nS
SD6 SDCLK to data output (D[31:0]) invalid (output hold) 1 —
SD7 SDCLK to CAS0, RAS0, SDBA[1:0], SDCLKE, SDRAMWE, valid — 7 nS
SD8 SDCLK to CAS0, RAS0, SDBA[1:0], SDCLKE, SDRAMWE, invalid (output hold) 1 —
SD9 SDCLK to SDCS valid — 8 nS
SD10 SDCLK to SDCS invalid (output hold) 1.0 —
SD11 SDCLK to A10_PRECHG valid — 9.5
SD12 SDCLK to A10_PRECHG invalid (output hold) 1.0 —
SD13 SDCLK to data output (D[31:0]) high impedance — 6 nS
SD14 Data input (D[31:0]) valid to SDCLK (setup) (pipeline mode, SDRAM control register b4
= 1)
5.5 — nS
SD15 Data input (D[31:0]) valid to SDCLK (setup) (straight-through mode, SDRAM control
register b4 = 0)
13.0 — nS
SD16 SDCLK to data input (D[31:0]) invalid (hold) 0 — nS
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-15
Figure 23-9. SDRAM Signal Timing
SDCLK
DATA IN
(READ SDCR
DATA OUT
(WRITE)
SD1
RAS0
CAS0
SDADR[13:0]
DQMx
SD3
SD5 SD6
SD16
SD14
SD8
SD7
SD7
SD8
SDWE
SD8
SD7
SDBA[1:0]
SD7
SD4
DATA IN
SD16
SD15
(READ SDCR
(b4=0))
(b4=1))
A10_PRECHG
SD12
SD11
T0 T1 T2 T3 T4 T5 T6
Col Col Col Col
SDCS
SD10
SD9
SD2
SD8
SDCLKE
SD8
SD7
SD13
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-17
23.6 Fast Ethernet AC Timing Specifications
MII signals use TTL signal levels compatible with devices operating at either 5.0 V or 3.3 V.
23.6.1 MII Receive Signal Timing (E_RxD[3:0], E_RxDV, E_RxER, and
E_RxCLK)
The receiver functions correctly up to a E_RxCLK maximum frequency of 25 MHz +1%. There is no
minimum frequency requirement. In addition, the processor clock frequency must exceed twice the
E_RxCLK frequency.
Table 23-11 lists MII receive channel timings.
Figure 23-11 shows MII receive signal timings listed in Table 23-11.
Figure 23-11. MII Receive Signal Timing Diagram
Table 23-11. MII Receive Signal Timing
Num Characteristic 1
1E_RxDV, E_RxCLK, and E_RxD0 have same timing in 10 Mbit 7-wire interface mode.
Min Max Unit
M1 E_RxD[3:0], E_RxDV, Rx_ERR to E_RxCLK setup 5 — nS
M2 E_RxCLK to E_RxD[3:0], E_RxDV, Rx_ERR hold 5 — nS
M3 E_RxCLK pulse-width high 35% 65% E_RxCLK period
M4 E_RxCLK pulse-width low 35% 65% E_RxCLK period
M1 M2
E_RxCLK (input)
E_RxD[3:0] (inputs)
E_RxDV
E_RxER
M3
M4
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-18 Freescale Semiconductor
23.6.2 MII Transmit Signal Timing (E_TxD[3:0], E_TxEN, E_TxER,
E_TxCLK)
Table 23-12 lists MII transmit channel timings.
The transmitter functions correctly up to a E_TxCLK maximum frequency of 25 MHz +1%. There is no
minimum frequency requirement. In addition, the processor clock frequency must exceed twice the
E_TxCLK frequency.
The transmit outputs (E_TxD[3:0], E_TxEN, E_TxER) can be programmed to transition from either the
rising or falling edge of E_TxCLK, and the timing is the same in either case. This options allows the use
of non-compliant MII PHYs.
Refer to the Ethernet chapter for details of this option and how to enable it.
Figure 23-12 shows MII transmit signal timings listed in Table 23-12.
Figure 23-12. MII Transmit Signal Timing Diagram
Table 23-12. MII Transmit Signal Timing
Num Characteristic1
1E_TxCLK, ETxD0, and E_TxEN have the same timing in 10 Mbit 7-wire interface mode.
Min Max Unit
M5 E_TxCLK to E_TxD[3:0], E_TxEN, E_TxER invalid 5 — nS
M6 E_TxCLK to E_TxD[3:0], E_TxEN, E_TxER valid — 25 nS
M7 E_TxCLK pulse-width high 35% 65% E_TxCLK period
M8 E_TxCLK pulse-width low 35% 65% E_TxCLK period
M6
E_TxCLK (input)
E_TxD[3:0] (outputs)
E_TxEN
E_TxER
M5
M7
M8
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-19
23.6.3 MII Async Inputs Signal Timing (CRS and COL)
Table 23-13 lists MII asynchronous inputs signal timing.
Figure 23-13 shows MII asynchronous input timings listed in Table 23-13.
Figure 23-13. MII Async Inputs Timing Diagram
Table 23-13. MII Async Inputs Signal Timing
Num Characteristic Min Max Unit
M91
1E_COL has the same timing in 10 Mbit 7-wire interface mode.
E_CRS, E_COL minimum pulse width 1.5 — E_TxCLK period
E_CRS, E_COL
M9
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-20 Freescale Semiconductor
23.6.4 MII Serial Management Channel Timing (MDIO and MDC)
Table 23-14 lists MII serial management channel timings. The FEC functions correctly with a maximum
MDC frequency of 2.5 MHz.
Figure 23-14 shows MII serial management channel timings listed in Table 23-14.
Figure 23-14. MII Serial Management Channel Timing Diagram
Table 23-14. MII Serial Management Channel Timing
Num Characteristic Min Max Unit
M10 MDC falling edge to MDIO output invalid (minimum propagation delay) 0 — nS
M11 MDC falling edge to MDIO output valid (max prop delay) — 25 nS
M12 MDIO (input) to MDC rising edge setup 10 — nS
M13 MDIO (input) to MDC rising edge hold 0 — nS
M14 MDC pulse-width high 40% 60% MDC period
M15 MDC pulse-width low 40% 60% MDC period
M11
MDC (output)
MDIO (output)
M12 M13
MDIO (input)
M10
M14
M15
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-21
23.7 Timer Module AC Timing Specifications
Table 23-15 lists timer module AC timings.
Figure 23-15 shows timer module timings listed in Table 23-15.
Figure 23-15. Timer Timing
Table 23-15. Timer Module AC Timing Specifications
Name Characteristic 1
1All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0.
0–66 MHz
Unit
Min Max
T1 TIN1 cycle time 3T — nS
T2 TIN1 valid to SDCLK (setup) 6 — nS
T3 SDCLK to TIN[1:0] invalid (hold) 0 — nS
T4 TIN1 pulse width 1T — nS
SDCLK
TIN1 IN
TIN1 IN
T2 T3
T1
T4
T2 T3T2
(Capture Mode
Synchronization)
(Clock Mode)
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-22 Freescale Semiconductor
23.8 UART Modules AC Timing Specifications
Table 23-16 lists UART AC timings.
Figure 23-16 shows UART module timings listed in Table 23-16.
Figure 23-16. UART Timing
Table 23-16. UART Modules AC Timing Specifications
Name Characteristic 1
1All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0.
0–66 MHz
Unit
Min Max
UT1 URTnRxD valid to SDCLK (setup) 6 — nS
UT2 SDCLK to URTn_RxD invalid (hold) 0 — nS
UT3 URTn_CTS valid to SDCLK (setup) 6 — nS
UT4 SDCLK to URTn_CTS invalid (hold) 0 — nS
UT5 SDCLK to URTn_TxD valid — 7 nS
UT6 SDCLK to URTn_TxD invalid (output hold) 3 — nS
UT7 SDCLK to URTn_RTS valid — 7 nS
UT8 SDCLK to URTn_RTS invalid (output hold) 3 — nS
UT5
SDCLK
URTn_TxD
UT6
UT1
UT2
URTn_RxD
UT7
URTn_RTS
UT8
UT3
UT4
URTn_CTS
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-23
23.9 PLIC Module: IDL and GCI Interface Timing Specifications
Table 23-17 shows timing for IDL master mode, PLIC ports 1, 2, and 3.
Figure 23-17 shows IDL master timings listed in Table 23-17.
Figure 23-17. IDL Master Timing
Table 23-17. IDL Master Mode Timing, PLIC Ports 1, 2, and 3
Name Characteristic Min Typ Max Unit
P1 1, 2
1For most telecommunications applications the period should be set to 125 µS. Refer to clock generator planning in PLIC
chapter.
2Same as DCL0 and FSC0 if internal clock generator configured for pass-through mode.
DFSC[1:3] period 125 µS
P2 Delay from rising edge of GDCL1_OUT to rising edge of DFSC[3:1] — — 20 nS
P3 Delay from rising edge of GDCL1_OUT to DFSC[3:1] Invalid (output Hold 2 — — nS
P4 3, 2
3GDCL1_OUT must be less than 1/20th of the CPU operating frequency. This is to ensure minimum jitter to CODECs that may
be connected to Ports 1,2,3.
GDCL1_OUT clock period 20T — —
P5 4, 2
4Based on generated GDCL1_OUT less than 1/20 of CPU clock frequency.
GDCL1_OUT pulse-width high 45 50 55 % of period
P6 4, 2 GDCL1_OUT pulse-width low 45 50 55 % of period
P7 Delay from rising edge of GDCL1_OUT to Low-Z and valid data on DOUT[1,3] — — 30 nS
P8 Delay from rising edge of GDCL1_OUT to DOUT[3:1] Invalid (Output Hold) 2 — — nS
P9 Delay from rising edge of GDCL1_OUT to High-Z on DOUT[1,3] — — 30 nS
P10 Data valid on DIN[1:3] before falling edge of GDCL1_OUT (setup time) 25 — — nS
P11 Data valid on DIN[1:3] after falling edge of GDCL1_OUT (hold time) 25 — — nS
DIN1, DIN3
DOUT1, DOUT3
GDCL1_OUT
P1
P4
P3 P5
P6
P7 P8 P9
P11
P10
P2
DFSC[3:1]
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-24 Freescale Semiconductor
Table 23-18 lists timing for IDL slave mode.
Table 23-18. IDL Slave Mode Timing, PLIC Ports 0–3
Name Characteristic Min Typ Max Unit
P14 1
1FSR occurs on average every 125 μs.
FSR0, FSR1 period — 125 — μs
P15a FSR0 or FSC0 valid before the falling edge of DCL0 (setup time) 25 — — nS
P22 DCL clock frequency 256 — 4096 Khz
P23 DCL pulse-width high 45 — 55 % of DCL period
P24 DCL pulse-width low 45 — 55 % of DCL period
P15b FSR1 or FSC1 valid before the falling edge of DCL1 (setup time) 25 — — nS
P16a DCL0 to FSR0 or FSC0 input Invalid (hold time) 25 — — nS
P16b DCL1 to FSR1 or FSC1 input Invalid (hold time) 25 — — nS
P17a Delay from rising edge of DCL0 to low-z and valid data on DOUT0 — — 30 nS
P17b Delay from rising edge of DCL1 to low-z and valid data on DOUT1 and
DOUT3
— — 30 nS
P19a Delay from rising edge of DCL0 to high-z on DOUT0 — — 30 nS
P19b Delay from rising edge of DCL1 to high-z on DOUT1 and DOUT3 — — 30 nS
P20 2
2In IDL slave mode, DCL may be any frequency multiple of 8 KHz between 256 KHz and 4.096 MHz inclusive.
Delay from rising edge of DCL1 to DFSC2, DFSC3 Invalid (output hold) 2 — — nS
P25 Data valid on DIN0 before falling edge of DCL0 (setup time) 25 — — nS
P25 Data valid on DIN1, DIN3 before falling edge of DCL1 (setup time) 25 — — nS
P26 Data valid on DIN0 after falling edge of DCL0 (hold time) 25 — — nS
P26 Data valid on DIN1, DIN3 after falling edge of DCL1 (hold time) 25 — — nS
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-25
Figure 23-18 shows IDL slave timings listed in Table 23-18.
Figure 23-18. IDL Slave Timing
Table 23-19 lists timings for GCI slave mode.
Table 23-19. GCI Slave Mode Timing, PLIC Ports 0–3
Name Characteristic Min Max Unit
P30 FSC input high before the falling edge of DCL0, DCL1 (setup time) 25 — nS
P31 FSC0 input low before the rising edge of DCL0 (deassertion setup time),
FSC1 input low before the rising edge of DCL1 (deassertion setup time)
25 nS
P32 FSC0 input high after the falling edge of DCL0 (hold time),
FSC1 input high after the falling edge of DCL1 (hold time)
25 — nS
P33 DCL0, DCL1 clock frequency — 8192 KHz
P34 DCL0, DCL1 pulse-width low 45 55 % of DCL period
P35 DCL0, DCL1 pulse-width high 45 55 % of DCL period
P38 Delay from rising edge of FSC0 to low-z and valid data on DOUT0
Delay from rising edge of FSC1 to low-z and valid data on DOUT1
Delay from rising edge of DFSC2 to low-z and valid data on DOUT1
Delay from rising edge of DFSC3 to low-z and valid data on DOUT1, DOUT3
—30 nS
P39 Delay from rising edge of DCL0 to data valid on DOUT0,
Delay from rising edge of DCL1 to data valid on DOUT1, DOUT3
—30 nS
P40 Delay from rising edge of DCL0 to high-z on DOUT0,
Delay from rising edge of DCL1 to high-Z on DOUT1, DOUT3
—30 nS
P41 Data valid on DIN0 before rising edge of DCL0,
Data valid on DIN1 or DIN3 before rising edge of DCL1
25 — nS
P42 Data valid on DIN0 after rising edge of DCL0,
Data valid on DIN1 or DIN3 after rising edge of DCL1
25 — nS
DFSC[2:3]
DCL[0:1]
FSR[0,1]
P14
P14
P19
P18
P16
P15
P17
P20 P21
P22
P23
P24
P26
P25
DOUT[0,1,3]
DIN[0:3]
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-26 Freescale Semiconductor
Figure 23-19 shows GCI slave timings listed in Table 23-19.
Figure 23-19. GCI Slave Mode Timing
Table 23-20 lists timings for GCI master mode.
Table 23-20. GCI Master Mode Timing, PLIC PORTs 1, 2, 3
Name Characteristic Min Max Unit Name
P50 1
1For most telecommunications applications the period of DFSC[1:3] should be set to 125 µS. Refer to clock generator planning
in PLIC chapter.
Delay from rising edge of GDCL1_OUT to rising edge of DFSC[1:3] — — 20 nS
P51 1Delay from rising edge of GDCL1_OUT to falling edge of DFSC[1:3] — — 20 nS
P52 2,3
2GDCL1_OUT must be less than 1/20th of the CPU operating frequency to ensure minimum jitter to CODECs connected to
Ports 1, 2, 3.
3Same as DCL0 and FSC0 if internal clock generator configured for pass-through mode.
GDCL1_OUT clock period 20T — — nS
P53 2,4
4Based on generated GDCL1_OUT less than 1/20 of CPU clock frequency.
GDCL1_OUT pulse-width low 45 50 55 % of period
P54 2,4 GDCL1_OUT pulse-width high 45 50 55 % of period
P57 Delay from rising edge of GDCL1_OUT to Low-Z and valid data on DOUT[1,3] — — 30 nS
P58 Delay from rising edge of GDCL1_OUT to data valid on DOUT[1,3] — — 30 nS
P59 Delay from rising edge of GDCL1_OUT to High-Z on DOUT[1,3] — — 30 nS
P60 Data valid on DIN[1:3] before rising edge of GDCL1_OUT (setup time) 25 — — nS
P61 Data valid on DIN[1:3] after rising edge of GDCL1_OUT (hold time) 25 — — nS
DOUT[0,1,3]
FSC[0,1]
DCL[0:1]
P35
P34
P40
P39
P38
P30
P32
P31
P42
P41
P33
DIN[0,1,3]
DFSC[2,3]
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-28 Freescale Semiconductor
23.10 General-Purpose I/O Port AC Timing Specifications
Table 23-21 lists GPIO port timings.
Figure 23-21 shows GPIO timings listed in Table 23-21.
Figure 23-21. General-Purpose I/O Port Timing
Table 23-21. General-Purpose I/O Port AC Timing Specifications
Name Characteristic 1
1All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0.
0–66 MHz
Unit
Min Max
G1 PORTx input setup time to SDCLK (rising) 6 — nS
G2 PORTx input hold time from SDCLK (rising) 0 — nS
G3 SDCLK to PORTx output valid — 11.5 nS
G4 SDCLK to PORTx output invalid (output hold) 1 — nS
P3
SDCLK
PORTx OUT
P4
P1
P2
PORTx IN
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-29
23.11 USB Interface AC Timing Specifications
Table 23-22 lists USB interface timings.
NOTE
USB signals are sampled; setup and hold times are not normally required in
a transceiver connection.
Figure 23-22 shows USB timings listed in Table 23-22.
Figure 23-22. USB Interface Timing
Table 23-22. USB Interface AC Timing Specifications
Name Characteristic
48-66 MHz
Unit
Min Max
US1 USB_CLK frequency of operation 1
1USB_CLK accuracy should be +- 500ppm or better. USB_CLK may be stopped to conserve power.
48 48 MHz
US2 2
2Specification values are not tested.
USB_CLK fall time (from Vh = 2.4V to Vl = 0.5V) — 2 nS
US3 2USB_CLK rise time (from Vl = 0.5V to Vh = 2.4V) — 2 nS
US4 USB_CLK duty cycle (measured at 1.5 V) 45 55 %
US5 USB Inputs (USB_RP, USB_RN, USB_RxD) setup time to USB_CLK (rising) 6 — nS
US6 USB Inputs (USB_RP, USB_RN, USB_RxD) hold time from USB_CLK (rising) 6 — nS
US7 USB_CLK to USB outputs valid (USB_TP, USB_TN, USB_SUSP, USB_TxEN) — 12 nS
US8 USB_CLK to USB outputs invalid (output hold) (USB_TP, USB_TN, USB_SUSP, USB_TxEN) 3 — nS
USB_CLK
US1
US4a US4b
US3US2 Vh
Vl
(input)
US7
USB_TP
US8
US5
US6
USB_RP
USB_RN
USB_RxD
USB_TN
USB_SUSP
USB_TxEN
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-30 Freescale Semiconductor
23.12 IEEE 1149.1 (JTAG) AC Timing Specifications
Table 23-23 lists JTAG timings.
Figure 23-23 shows JTAG timings listed in Table 23-23.
Figure 23-23. IEEE 1149.1 (JTAG) Timing
Table 23-23. IEEE 1149.1 (JTAG) AC Timing Specifications
Name Characteristic
0–66 MHz
Unit
Min Max
— TCK frequency of operation 0 10 MHz
J1 TCK cycle time 100 — nS
J2a TCK clock pulse high width measured at 1.5 V 40 — nS
J2b TCK clock pulse low width measured at 1.5 V 40 — nS
J3a TCK fall time (from Vh = 2.4 V to Vl = 0.5 V) — 5 nS
J3b TCK rise time (from Vl = 0.5 V to Vh = 2.4 V) — 5 nS
J4 TDI, TMS to TCK rising (setup) 10 — nS
J5 TCK rising edge to TDI, TMS invalid (hold) 15 — nS
J6 Boundary scan data valid to TCK rising edge (setup) 10 — nS
J7 Boundary scan data invalid to TCK rising edge (hold) 15 — nS
J8 TRST pulse-width (asynchronous to clock edges) 15 — nS
J9 TCK falling edge to TDO valid (signal from driven or three-state) — 30 nS
J10 TCK falling edge to TDO high impedance — 30 nS
J11 TCK falling edge to boundary scan data valid (signal from driven or three-state) — 35 nS
J12 TCK falling edge to boundary scan data high impedance — 35 nS
TCK
J1 J3bJ3a Vh
Vl
J2a J2b
J4
J5
J6
J7
Boundary
J9 J10
TRST
TDO
J8
J11 J12
TDI, TMS
Scan Data
Inputs
Boundary
Scan Data
Outputs
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor 23-31
23.13 QSPI Electrical Specifications
Table 23-24 lists QSPI timings.
The values in Table 23-24 correspond to Figure 23-24.
Figure 23-24. QSPI Timing
Table 23-24. QSPI Modules AC Timing Specifications
Name Characteristic
0–66 MHz
Unit
Min Max
QS1 QSPI_CS[3:0] to QSPI_CLK 1T1
1T is defined as clock period in nS. See Table 23-6.
127T1nS
QS2 QSPI_CLK high to QSPI_DOUT valid. — 20 nS
QS3 QSPI_CLK high to QSPI_DOUT invalid. (Output hold) 0 — nS
QS4 QSPI_DIN to QSPI_CLK (Input setup) 10 — nS
QS5 QSPI_DIN to QSPI_CLK (Input hold) 10 — nS
QSPI_CS[3:0]
QSPI_CLK
QSPI_DOUT
QS5
QS1
QSPI_DIN
QS3 QS4
QS2
Electrical Characteristics
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
23-32 Freescale Semiconductor
23.14 PWM Electrical Specifications
Table 23-25 lists PWM timings.
The values in Table 23-25 correspond to Figure 23-25.
Figure 23-25. PWM Timing
Table 23-25. PWM Modules AC Timing Specifications
Name Characteristic 1
1All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0.
0–66 MHz
Unit
Min Max
PW1 2
2Parameter tested
SDLCK high to PWM_OUT[2:0] valid, high or low. — 11 nS
PW2 2SDLCK high to PWM_OUT[2:0] invalid. (Output hold) 2.5 — nS
PWM_OUT[2:0]
SDCLK
PW1 PW2
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor A-1
Appendix A
List of Memory Maps
The MCF5272 memory map is given in this section.
The addresses for the system configuration registers are absolute addresses in the MCF5272 CPU space
memory map. The on-chip peripheral modules are configured as a group by programming the module base
address register, (MBAR).
In the title block for each module is shown the offset address of the given register from the base address
programmed in MBAR.
The following formula allows calculation of the absolute address of a given register.
Absolute address = MBAR + register offset
A.1 List of Memory Map Tables
Table A-1. On-Chip Module Base Address Offsets from MBAR
Module Module Base
Address Mnemonic
Configuration Registers MBAR+0x0000 CFG_Base
Interrupt Registers MBAR+0x0020 INT_Base
Chip Select Registers MBAR+0x0040 CS_Base
Ports Registers MBAR+0x0080 GPIO_Base
QSPI Module Registers MBAR+0x00A0 QSPI_Base
PWM Module Registers MBAR+0x00C0 PWM_Base
DMA Module Registers MBAR+0x00E0 DMAC_Base
UART0 Module Registers MBAR+0x0100 UART0_Base
UART1 Module Registers MBAR+0x0140 UART1_Base
SDRAM Controller Registers MBAR+0x0180 SDRAMC_Base
Timer Module Registers MBAR+0x0200 Timer_Base
PLIC Module Registers MBAR+0x0300 PLIC_Base
Ethernet Module Registers MBAR+0x0800 ENET_Base
USB Module Registers MBAR+0x1000 USB_Base
List of Memory Maps
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
A-2 Freescale Semiconductor
NOTE
MBAR must only be written using the MOVEC instruction. Writing to
address MBAR+0x0000 causes unpredictable device operation.
Table A-2. CPU Space Registers Memory Map
CPU SPACE
ADDRESS NAME Size SYSTEM CONFIGURATION REGISTERS Program Access Debug Access
0x0002 (CACR) 32 Cache Control Register MOVEC RCREG, WCREG
0x0004 (ACR0) 32 Cache Access Control Register 0 MOVEC RCREG, WCREG
0x0005 (ACR1) 32 Cache Access Control Register 1 MOVEC RCREG, WCREG
0x008x A7:A0 32 Address registers A7:A0 MOVE RAREG, WAREG
0x008x D7:D0 32 Data registers D7:D0 MOVE RDREG, WDREG
0x0801 (VBR) 32 Vector Base Register MOVEC RCREG, WCREG
0x080E CCR 8 Condition Code Register (Debug only) MOVE to/from CCR RCREG, WCREG
0x080F PC 32 Program Counter (Debug only) RCREG, WCREG
0x0C00 ROMBAR 32 ROM Base Address Register MOVEC RCREG, WCREG
0x0C04 RAMBAR 32 SRAM Base Address Register MOVEC RCREG, WCREG
0x0C0F MBAR 32 Module Base Address Register MOVEC
Table A-3. On-Chip Peripherals and Configuration Registers Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x0000 Module Base Address Register, Read Only (MBAR)
0x0004 System Configuration Register (SCR) Reserved
0x0006 Reserved System Protection Register (SPR)
0x0008 Power Management Register (PMR)
0x000E Reserved Activate Low Power Register (ALPR)
0x0010 Device Identification Register (DIR)
Table A-4. Interrupt Control Register Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x0020 Interrupt Control Register 1 (ICR1)
0x0024 Interrupt Control Register 2 (ICR2)
0x0028 Interrupt Control Register 3 (ICR3)
0x002C Interrupt Control Register 4 (ICR4)
0x0030 Interrupt Source Register (ISR)
0x0034 Programmable Interrupt Transition Register (PITR)
0x0038 Programmable Interrupt Wakeup Register (PIWR)
0x003F Reserved Programmable Interrupt
Vector Register (PIVR)
List of Memory Maps
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor A-3
Table A-5. Chip Select Register Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x0040 CS Base Register 0 (CSBR0)
0x0044 CS Option Register 0 (CSOR0)
0x0048 CS Base Register 1 (CSBR1)
0x004C CS Option Register 1 (CSOR1)
0x0050 CS Base Register 2 (CSBR2)
0x0054 CS Option Register 2 (CSOR2)
0x0058 CS Base Register 3 (CSBR3)
0x005C CS Option Register 3 (CSOR3)
0x0060 CS Base Register 4 (CSBR4)
0x0064 CS Option Register 4 (CSOR4)
0x0068 CS Base Register 5 (CSBR5)
0x006C CS Option Register 5 (CSOR5)
0x0070 CS Base Register 6 (CSBR6)
0x0074 CS Option Register 6 (CSOR6)
0x0078 CS Base Register 7 (CSBR7)
0x007C CS Option Register 7 (CSOR7)
Table A-6. GPIO Port Register Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x0080 Port A Control Register (PACNT)
0x0084 Port A Data Direction Register (PADDR) Reserved
0x0086 Reserved Port A Data Register (PADAT)
0x0088 Port B Control Register (PBCNT)
0x008C Port B Data Direction Register (PBDDR) Reserved
0x008E Reserved Port B Data Register (PBDAT)
0x0094 Port C Data Direction Register (PCDDR) Reserved
0x0096 Reserved Port C Data Register (PCDAT)
0x0098 Port D Control Register (PDCNT)
List of Memory Maps
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
A-4 Freescale Semiconductor
Table A-7. QSPI Module Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x00A0 QSPI Mode Register (QMR) Reserved
0x00A4 QSPI Delay Register (QDLYR) Reserved
0x00A8 QSPI Wrap Register (QWR) Reserved
0x00AC QSPI Interrupt Register (QIR) Reserved
0x00B0 QSPI Address Register (QAR) Reserved
0x00B4 QSPI Data Register (QDR) Reserved
Table A-8. PWM Module Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x00C0 PWM Control Register 1
(PWCR1)
Reserved
0x00C4 PWM Control Register 2
(PWCR2)
Reserved
0x00C8 PWM Control Register 3
(PWCR3)
Reserved
0x00D0 PWM Pulse-Width Register
1 (PWWD1)
Reserved
0x00D4 PWM Pulse-Width Register
2 (PWWD2)
Reserved
0x00D8 PWM Pulse-Width Register
3 (PWWD3)
Reserved
Table A-9. DMA Module Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x00E0 DMA Mode Register (DCMR)
0x00E6 DMA Interrupt Register (DCIR)
0x00E8 DMA Byte Count Register (DBCR)
0x00EC DMA Source Address Register (DSAR)
0x00F0 DMA Destination Address Register (DDAR)
List of Memory Maps
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor A-5
Table A-10. UART0 Module Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x0100 UART0 Mode Register 1/2
(U0MR1/U0MR2)
Reserved
0x0104 UART0 Status (U0SR) Reserved
0x0104 UART0 Clock Select
Register (U0CSR)
Reserved
0x0108 UART0 Command Register
(U0CR)
Reserved
0x010C UART0 Receive Buffer
(U0RxB)
Reserved
0x010C UART0 Transmit Buffer
(U0TxB)
Reserved
0x0110 UART0 CTS Change
Register (U0CCR)
Reserved
0x0110 UART0 Auxiliary Control
Register (U0ACR)
Reserved
0x0114 UART0 Interrupt Status
Register (U0ISR)
Reserved
0x0114 UART0 Interrupt Mask
Register (U0IMR)
Reserved
0x0118 UART0 Baud Prescaler
MSB (U0BG1)
Reserved
0x011C UART0 Baud Prescaler
LSB (U0BG2)
Reserved
0x0120 UART0 AutoBaud MSB
Register (U0ABR1)
Reserved
0x0124 UART0 AutoBaud LSB
Register (U0ABR2)
Reserved
0x0128 UART0 TxFIFO
Control/Status Register
(U0TxFCSR)
Reserved
0x012C UART0 RxFIFO
Control/Status Register
(U0RxFCSR)
Reserved
0x130 UART0 Fractional Precision
Divider Control Registers
(UFPDn)
Reserved
0x0134 UART0 CTS Unlatched
Input (U0IP)
Reserved
0x0138 UART0 RTS O/P Bit Set
Command Register
(U0OP1)
Reserved
0x013C UART0 RTS O/P Bit Reset
Command Register
(U0OP0)
Reserved
List of Memory Maps
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
A-6 Freescale Semiconductor
Table A-11. UART1 Module Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x0140 UART1 Mode Register 1/2
(U1MR1/U1MR2)
Reserved
0x0144 UART1 Status (U1SR) Reserved
0x0144 UART1 Clock Select
Register (U1CSR)
Reserved
0x0148 UART1 Command Register
(U1CR)
Reserved
0x014C UART1 Receive Buffer
(U1RxB)
Reserved
0x014C UART1 Transmit Buffer
(U1TxB)
Reserved
0x0150 UART1 CTS Change
Register (U1CCR)
Reserved
0x0150 UART1 Auxiliary Control
Register (U1ACR)
Reserved
0x0154 UART1 Interrupt Status
Register (U1ISR)
Reserved
0x0154 UART1 Interrupt Mask
Register (U1IMR)
Reserved
0x0158 UART1 Baud Prescaler
MSB (U1BG1)
Reserved
0x015C UART1 Baud Prescaler
LSB (U1BG2)
Reserved
0x0160 UART1 AutoBaud MSB
Register (U1ABR1)
Reserved
0x0164 UART1 AutoBaud LSB
Register (U1ABR2)
Reserved
0x0168 UART1 TxFIFO
Control/Status Register
(U1TxFCSR)
Reserved
0x016C UART1 RxFIFO
Control/Status Register
(U1RxFCSR)
Reserved
0x170 UART1 Fractional Precision
Divider Control Registers
(UFPDn)
Reserved
0x0174 UART1 CTS Unlatched
Input (U1IP)
Reserved
0x0178 UART1 RTS O/P Bit Set
Command Register
(U1OP1)
Reserved
0x017C UART1 RTS O/P Bit Reset
Command Register
(U1OP0)
Reserved
List of Memory Maps
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor A-7
Table A-12. SDRAM Controller Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x0180 Reserved SDRAM Configuration Register (SDCR)
0x0184 Reserved SDRAM Timing Register (SDTR)
Table A-13. Timer Module Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x0200 Timer 0 Mode Register (TMR0) Reserved
0x0204 Timer 0 Reference Register (TRR0) Reserved
0x0208 Timer 0 Capture Register (TCAP0) Reserved
0x020C Timer 0 Counter Register (TCN0) Reserved
0x0210 Timer 0 Event Register (TER0) Reserved
0x0220 Timer 1 Mode Register (TMR1) Reserved
0x0224 Timer 1 Reference Register (TRR1) Reserved
0x0228 Timer 1 Capture Register (TCAP1) Reserved
0x022C Timer 1 Counter Register (TCN1) Reserved
0x0230 Timer 1 Event Register (TER1) Reserved
0x0240 Timer 2 Mode Register (TMR2) Reserved
0x0244 Timer 2 Reference Register (TRR2) Reserved
0x0248 Timer 2 Capture Register (TCAP2) Reserved
0x024C Timer 2 Counter Register (TCN2) Reserved
0x0250 Timer 2 Event Register (TER2) Reserved
0x0260 Timer 3 Mode Register (TMR3) Reserved
0x0264 Timer 3 Reference Register (TRR3) Reserved
0x0268 Timer 3 Capture Register (TCAP3) Reserved
0x026C Timer 3 Counter Register (TCN3) Reserved
0x0270 Timer 3 Event Register (TER3) Reserved
0x0280 Watchdog Reset Reference Register (WRRR) Reserved
0x0284 Watchdog Interrupt Reference Register (WIRR) Reserved
0x0288 Watchdog Counter Register (WCR) Reserved
0x028C Watchdog Event Register (WER) Reserved
List of Memory Maps
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
A-8 Freescale Semiconductor
Table A-14. PLIC Module Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x0300 Port0 B1 Data Receive (P0B1RR)
0x0304 Port1 B1 Data Receive (P1B1RR)
0x0308 Port2 B1 Data Receive (P2B1RR)
0x030C Port3 B1 Data Receive (P3B1RR)
0x0310 Port0 B2 Data Receive (P0B2RR)
0x0314 Port1 B2 Data Receive (P1B2RR)
0x0318 Port2 B2 Data Receive (P2B2RR)
0x031C Port3 B2 Data Receive (P3B2RR)
0x0320 Port 0 D Data Receive
(P0DRR)
Port 1 D Data Receive
(P1DRR)
Port 2 D Data Receive
(P2DRR)
Port 3 D Data Receive
(P3DRR)
0x0328 Port0 B1 Data Transmit (P0B1TR)
0x032C Port1 B1 Data Transmit (P1B1TR)
0x0330 Port2 B1 Data Transmit (P2B1TR)
0x0334 Port3 B1 Data Transmit (P3B1TR)
0x0338 Port0 B2 Data Transmit (P0B2TR)
0x033C Port1 B2 Data Transmit (P1B2TR)
0x0340 Port2 B2 Data Transmit (P2B2TR)
0x0344 Port3 B2 Data Transmit (P3B2TR)
0x0348 Port 0 D Data Transmit
(P0DTR)
Port 1 D Data Transmit
(P1DTR)
Port 2 D Data Transmit
(P2DTR)
Port 3 D Data Transmit
(P3DTR)
0x0350 Port0 GCI/IDL Configuration Register (P0CR) Port1 GCI/IDL Configuration Register (P1CR)
0x0354 Port2 GCI/IDL Configuration Register (P2CR) Port3 GCI/IDL Configuration Register (P3CR)
0x0358 Port0 Interrupt Configuration Register (P0ICR) Port1 Interrupt Configuration Register (P1ICR)
0x035C Port2 Interrupt Configuration Register (P2ICR) Port3 Interrupt Configuration Register (P3ICR)
0x0360 Port0 GCI Monitor RX (P0GMR) Port1 GCI Monitor RX (P1GMR)
0x0364 Port2 GCI Monitor RX (P2GMR) Port3 GCI Monitor RX (P3GMR)
0x0368 Port0 GCI Monitor TX (P0GMT) Port1 GCI Monitor TX (P1GMT)
0x036C Port2 GCI Monitor TX (P2GMT) Port3 GCI Monitor TX (P3GMT)
0x0370 Reserved GCI Monitor TX Status
(PGMTS)
GCI Monitor TX abort
(PGMTA)
Reserved
0x0374 Port0 GCI C/I RX (P0GCIR) Port1 GCI C/I RX (P1GCIR) Port2 GCI C/I RX (P2GCIR) Port3 GCI C/I RX (P3GCIR)
0x0378 Port0 GCI C/I TX (P0GCIT) Port1 GCI C/I TX (P1GCIT) Port2 GCI C/I TX (P2GCIT) Port3 GCI C/I TX (P3GCIT)
0x037C Reserved GCI C/I TX Status
(PGCITSR)
0x0383 Reserved GCI D-Channel Status
(PDCSR)
0x0384 Port0 Periodic Status (P0PSR) Port1 Periodic Status (P1PSR)
0x0388 Port2 Periodic Status (P2PSR) Port3 Periodic Status (P3PSR)
List of Memory Maps
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor A-9
0x038C Aperiodic Interrupt Status Register (PASR) Reserved Loop back Control (PLCR)
0x0392 Reserved D Channel Request (PDRQR)
0x0394 Port0 Sync Delay (P0SDR) Port1 Sync Delay (P1SDR)
0x0398 Port2 Sync Delay (P2SDR) Port3 Sync Delay (P3SDR)
0x039C Reserved Clock Select (PCSR)
Table A-15. Ethernet Module Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x0840 Ethernet Control Register (ECR)
0x0844 Ethernet Interrupt Event Register (EIR)
0x0848 Ethernet Interrupt Mask Register (EIMR)
0x084C Ethernet Interrupt Vector Status (IVSR)
0x0850 Ethernet Rx Ring Updated Flag (RDAR)
0x0854 Ethernet Tx Ring Updated Flag (TDAR)
0x0880 Ethernet MII Data Register (MMFR)
0x0884 Ethernet MII Speed Register (MSCR)
0x08CC Ethernet Receive Bound Register (FRBR)
0x08D0 Ethernet Rx FIFO Start Address (FRSR)
0x08E4 Transmit FIFO Watermark (TFWR)
0x08EC Ethernet Tx FIFO Start Address (TFSR)
0x0944 Ethernet Rx Control Register (RCR)
0x0948 Maximum Frame Length Register (MFLR)
0x0984 Ethernet Tx Control Register (TCR)
0x0C00 Ethernet Address (Lower) (MALR)
0x0C04 Ethernet Address (Upper) (MAUR)
0x0C08 Ethernet Hash Table (Upper) (HTUR)
0x0C0C Ethernet Hash Table (Lower) (HTLR)
0x0C10 Ethernet Rx Descriptor Ring (ERDSR)
0x0C14 Ethernet Tx Descriptor Rin (ETDSR)
0x0C18 Ethernet Rx Buffer Size (EMRBR)
0x0C40–
0x0DFF
FIFO RAM (EFIFO)
Table A-14. PLIC Module Memory Map (continued)
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
List of Memory Maps
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
A-10 Freescale Semiconductor
Table A-16. USB Module Memory Map
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
0x1002 Reserved USB Frame Number Register (FNR)
0x1006 Reserved USB Frame Number Match Register (FNMR)
0x100A Reserved USB Real-time Frame Monitor Register (RFMR)
0x100E Reserved USB Real-time Frame Monitor Match Register (RFMMR)
0x1013 Reserved USB Function Address
Register (FAR)
0x1014 USB Alternate Setting Register (ASR)
0x1018 USB Device Request Data1 Register (DRR1)
0x101C USB Device Request Data2 Register (DRR2)
0x1022 Reserved USB Specification Number Register (SPECR)
0x1026 Reserved USB Endpoint 0 Status Register (EP0SR)
0x1028 USB Endpoint 0 IN Config Register (IEP0CFG)
0x102C USB Endpoint 0 OUT Config Register (OEP0CFG)
0x1030 USB Endpoint 1 Configuration Register (EP1CFG)
0x1034 USB Endpoint 2 Configuration Register (EP2CFG)
0x1038 USB Endpoint 3 Configuration Register (EP3CFG)
0x103C USB Endpoint 4 Configuration Register (EP4CFG)
0x1040 USB Endpoint 5 Configuration Register (EP5CFG)
0x1044 USB Endpoint 6 Configuration Register (EP6CFG)
0x1048 USB Endpoint 7 Configuration Register (EP7CFG)
0x104C USB Endpoint 0 Control Register (EP0CTL)
0x1052 Reserved USB Endpoint 1 Control Register (EP1CTL)
0x1056 Reserved USB Endpoint 2 Control Register (EP2CTL)
0x105A Reserved USB Endpoint 3 Control Register (EP3CTL)
0x105E Reserved USB Endpoint 4 Control Register (EP4CTL)
0x1062 Reserved USB Endpoint 5 Control Register (EP5CTL)
0x1066 Reserved USB Endpoint 6 Control Register (EP6CTL)
0x106A Reserved USB Endpoint 7 Control Register (EP7CTL)
0x106C USB General/Endpoint 0 Interrupt Status Register (EP0ISR)
0x1092 Reserved USB Endpoint 1 Interrupt Status Register (EP1ISR)
0x1096 Reserved USB Endpoint 2 Interrupt Status Register (EP2ISR)
0x109A Reserved USB Endpoint 3 Interrupt Status Register (EP3ISR)
0x109E Reserved USB Endpoint 4 Interrupt Status Register (EP4ISR)
0x10A2 Reserved USB Endpoint 5 Interrupt Status Register (EP5ISR)
0x10A6 Reserved USB Endpoint 6 Interrupt Status Register (EP6ISR)
0x10AA Reserved USB Endpoint 7 Interrupt Status Register (EP7ISR)
List of Memory Maps
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor A-11
0x108C USB Endpoint 0 Interrupt Mask Register (EP0IMR)
0x1090 Reserved USB Endpoint 1 Interrupt Mask Register (EP1IMR)
0x1094 Reserved USB Endpoint 2 Interrupt Mask Register (EP2IMR)
0x1098 Reserved USB Endpoint 3 Interrupt Mask Register (EP3IMR)
0x109C Reserved USB Endpoint 4 Interrupt Mask Register (EP4IMR)
0x10A0 Reserved USB Endpoint 5 Interrupt Mask Register (EP5IMR)
0x10A4 Reserved USB Endpoint 6 Interrupt Mask Register (EP6IMR)
0x10A8 Reserved USB Endpoint 7 Interrupt Mask Register (EP7IMR)
0x10AC USB Endpoint 0 Data Register (EP0DR)
0x10B0 USB Endpoint 1 Data Register (EP1DR)
0x10B4 USB Endpoint 2 Data Register (EP2DR)
0x10B8 USB Endpoint 3 Data Register (EP3DR)
0x10BC USB Endpoint 4 Data Register (EP4DR)
0x10C0 USB Endpoint 5 Data Register (EP5DR)
0x10C4 USB Endpoint 6 Data Register (EP6DR)
0x10C8 USB Endpoint 7 Data Register (EP7DR)
0x10CE Reserved USB Endpoint 0 Data Present Register (EP0DPR)
0x10D2 Reserved USB Endpoint 1 Data Present Register (EP1DPR)
0x10D6 Reserved USB Endpoint 2 Data Present Register (EP2DPR)
0x10DA Reserved USB Endpoint 3 Data Present Register (EP3DPR)
0x10DE Reserved USB Endpoint 4 Data Present Register (EP4DPR)
0x10E2 Reserved USB Endpoint 5 Data Present Register (EP5DPR)
0x10E6 Reserved USB Endpoint 6 Data Present Register (EP6DPR)
0x10EA Reserved USB Endpoint 7 Data Present Register (EP7DPR)
0x1400
–
0x17FF
USB Configuration RAM, 1 K Bytes
Table A-16. USB Module Memory Map (continued)
MBAR
Offset [31:24] [23:16] [15:8] [7:0]
List of Memory Maps
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
A-12 Freescale Semiconductor
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor B-1
Appendix B
Buffering and Impedance Matching
When required:
• SDRAM and a large number of external peripherals are required for a particular system
configuration.
• Some peripherals may have excessive input capacitance.
• Minimize signal reflections at higher clock speeds.
• Minimize capacitive loading on signals to SDRAMs.
• Operation of MCF5272 at highest frequencies, i.e. 66MHz, requires clean signals to ensure setup
and hold times are met and to minimize EMC noise in terms of overshoot and undershoot of
signals.
What to do:
• Add buffers on address and control signals shared by SDRAM and other peripherals.
• NEVER put buffers between the MCF5272 device and the SDRAMs.
• Put termination resistors as close as possible to outputs.
• Or use buffers that have integral termination resistors.
Buffering and Impedance Matching
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
B-2 Freescale Semiconductor
Figure B-1. Buffering and Termination
R4
R1
R1
R1
R1
RA1
RA2
R2
RA5
RA3
RA4
RA6
RA7
RA8
RA9
RA10
RA3
SDRAM
Flash
D31:D0
Device
D31:D0
#1 Device
D31:D0
#2 Device
D31:D0
#3
CS0CS1CS2CS3
32
OE
CS0
CS1
CS2
CS3
D31:D0
Signals
M CF5272
CS7
32
n
DIR
EN
B[7:0]
A[7:0]
74LVC245
Signal = BS[3:0]
= Ax:A2 (32 bit bus)
= Ax:A1 (16 bit bus)
RA1, RA2, RA3, ...
R1, R2, ... = Resistor Arrays 10-75 ohms
= resistor 10-75 ohms
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor Index-1
Index
A
Access control register, 4-14
ACR0 and ACR1, 4-14
Activate low-power register, 6-10
Address bus, 20-2
Address variant , 5-4
Addressing
mode summary, 2-12
Addressing mode summary, 2-12
Arbitration, bus, 20-21
Architecture overview, 1-4
Async inputs signal timing , 23-19
Audience, 1-xl
B
Baud rate
calculating, 16-20
selection, 14-6
Branch instruction execution
timing, 2-25
Buffer descriptors
Ethernet, 11-34
USB controller, 11-34
Buffering and impedance matching, B-1
Bus
arbitration, 20-21
burst data transfers, 20-17
configurations overview, 1-7
data transfer mechanism, 20-4
errors, 20-19
exceptions, 20-3
external interface, 1-5
external interface types, 20-7
interface for FLASH/SRAM, 20-8
interrupt acknowledge cycles, 20-19
master reset, 20-22
misaligned operands, 20-18
normal reset, 20-23
read/write (R/W), 20-2
reset operation, 20-21
sizing, 20-4
soft reset operation, 20-25
software watchdog timer reset operation, 20-24
transfer acknowledge (TA), 20-2
transfer error acknowledge (TEA), 20-3
Byte strobes, 20-8
C
Cache
configuration register, 2-9
registers, access control, 2-9
Cache control register, 4-12
Caches
coherency and validation, 4-8
miss fetch algorithm/line fills, 4-10
CAM interface, 11-6
CCR, 2-6
Chip select
base registers, 8-3
CS0 special case, 8-2
option registers, 8-5
overview, features, usage, 8-1
registers, 8-2
Chip selects
general overview, 1-5
Clock generator, USB, 12-4
ColdFire
documentation, 1-xliii
ColdFire core
addressing mode summary, 2-12
condition code register (CCR), 2-6
exception processing overview, 2-25
features and enhancements, 2-1
instruction set summary, 2-13
integer data formats, 2-9
programming model, 2-4
status register, 2-8
supervisor programming model, 2-7
user programming mode, 2-4
Condition code register, 2-6
Conventions
notational, 1-xliv
terminology, 1-xlvii
Core
version 2
overview, 1-4
D
Data
bus, 20-2
Debug
attribute trigger register, 5-7
BDM command set summary, 5-19
Index
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Index-2 Freescale Semiconductor
breakpoint operation, 5-34
module enhancements, 2-4
real-time support, 5-33
taken bran ch, 5-4
theory, 5-34
Device identification register, 6-11
DMA
address modes, 10-2
byte count register, 10-6
controller registers, 10-2
data transfer types, 10-1
destination address register, 10-6
interrupt register, 10-4
mode register, 10-2
source address register, 10-5
Documentation, 1-xliii
DSCLK, 5-2
E
Electrical specifications
AC, 23-5
AC timing
debug, 23-13
fast Ethernet, 23-17
GPIO port, 23-28
IEEE 1149.1 (JTAG), 23-30
USB interface, 23-29
clock input and output timing, 23-5
DC, 23-3
DL and GCI interface timing, 23-23
maximum ratings, 23-1
MII async inputs signal timing, 23-19
operating temperature, 23-2
output loading, 23-3
processor bus input timing, 23-6
QSPI, 23-31,23-32
SDRAM interface timing, 23-14
supply, input voltage, and storage temperature, 23-1
thermal resistance, 23-2
timer module AC timing, 23-21
USART module AC timing, 23-22
Ethernet
address recognition, 11-6
buffer descriptors
receive, 11-35
transmit, 11-37
CAM interface, 11-6
collision handling, 11-8
control register, 11-11
descriptor active register, 11-15
descriptor ring register
pointer-to-receive, 11-30
pointer-to-transmit, 11-31
error handling, 11-9
FEC initialization, 11-34
FIFO
receive bound register, 11-19
receive start register, 11-20
transmit start register, 11-22
frame
reception, 11-5
transmission, 11-4
hardware initialization, 11-33
hash table
algorithm, 11-8
high register, 11-28
low register, 11-29
initialization sequence, 11-33
internal and external loopback, 11-8
interpacket gap time, 11-8
interrupt
event register, 11-12
mask register, 11-13
vector status register, 11-14
loopbacks, 11-8
maximum frame length register, 11-24
MII
management frame register, 11-17
speed control register, 11-18
module operation, 11-1
programming model, 11-10
RAM perfect match address register
high, 11-27
low, 11-26
receive buffer size register, 11-32
receive control register, 11-23
transceiver connection, 11-3
transmit
control regist er, 11-25
descriptor active register, 11-16
FIFO watermark, 11-21
user initialization, 11-33
Exception processing
overview, 2-25
processor exceptions, 2-28
stack frame definition, 2-27
Exceptions
bus, 20-3
Execution timings
miscellaneous, 2-24
one operand, 2-22
two operands, 2-22
External bus interface overview, 1-5
F
Fault-on-fault halt, 5-16
Features overview, 1-1
Frame reception, 11-5
Index
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor Index-3
G
GPIO
overview, 17-1
port
control registers, 17-2,17-8
data direction registers, 17-10
data registers, 17-11
H
Halt, fault-on-fault, 5-16
Hardware
Ethernet initialization, 11-33
Hash table
Ethernet algotithm, 11-8
I
Initialization sequence
Ethernet, 11-33
Instruction cache
interaction with other modules, 4-8
operation, 4-8
overview, 4-7
physical organization, 4-7
programming model, 4-12
reset, 4-10
Instruction execution times, 2-24
Instruction set
fetch pipeline, 2-2
general summary, 2-13
MAC summary, 3-4
MAC unit execution times, 3-4
summary, 2-15
Integer data formats, 2-9
memory, 2-11
registers, 2-10
Integer data formats in memory, 2-11
Integer data formats in registers, 2-10
Interrupt controller
overview, 7-1
pending and mask registers, 7-4,7-5,7-5,7-5
Interrupts
bus acknowledge cycles, 20-19
PLIC GCI, 13-10
request inputs, 19-23
J
JTAG
BDM debug port, 21-2
boundary scan register, 21-4
IDCODE register, 6-11
instruction register, 21-7
overview, 21-1
restrictions, 21-8
TAP controller, 21-3
test access port, 21-2
L
Local memory
module interactions, 4-1
registers, 4-2
Loopback, Ethernet internal and external, 11-8
M
MAC
data representation, 3-4
hardware support, 2-3
instruction execution timings, 3-4
instruction set summary, 3-4
operation, 3-3
programming model, 2-4,2-7
programming modelProgramming models
MAC, 3-2
Matching
buffering and impedance, B-1
MBAR, 7-6,7-8
Mechanical data
package dimensions, 22-2
pinout, 22-1
Memory
integer data formats, 2-11
Memory maps
list of tables, A-1
USB, 12-7
Memory, SIM register, 6-2
MII
serial management channel timing, 23-20
transmit signal timing, 23-18
Modules
base address register, 2-9
debug, 2-4
MOVE instruction s ti mi ng, 2-20
N
Non-IEEE 1149.1 operation, 21-8
O
Opcodes
illegal handling, 2-3
Organization, 1-xl
Output port command registers, 16-18
P
Parallel input/output ports, 1-6
Index
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Index-4 Freescale Semiconductor
Pin descriptions, ??–19-38
address bus, 19-19
byte strobes, 19-20
clock, 19-25
data bus, 19-19
dynamic data bus sizing, 19-19
general-purpose I/O ports, 19-24
interrupt request inputs, 19-23
JTAG test access port and BDM debug port, 19-35–19-37
operating mode configuration, 19-37
PLI TDM ports, 19-30–19-35
power supply, 19-38
QSPI signals, 19-29–??
RSTI,19-23
SDRAM
bank selects, 19-23
clock enable, 19-22
column address strobe, 19-22
row address 10, 19-23
row address strobe, 19-22
write enable, 19-22
UART0 module signals, 19-24–19-25
USB module signals and PA, 19-25–19-27
Pipelines
instruction fetch, 2-2
operand execution, 2-2
PLIC
aperiodic status register, 13-23
application examples, 13-35–13-42
automatic echo mode, 13-9
B1 data
receive registers, 13-15
transmit registers, 13-17
B2 data
receive registers, 13-16
transmit registers, 13-17
B-Channel
HDLC encoded data, 13-6
unencoded data, 13-5
clock select register, 13-34
clock synthesis, 13-11
D data
receive registers, 13-16
transmit registers, 13-18
D-Channel
HDLC encoded data, 13-6
unencoded data, 13-7
D-Channel request register, 13-32
D-Channel status register, 13-31
frame sync synthesis, 13-13
GCI C/I channel
receive registers, 13-28
transmit registers, 13-29
transmit status register, 13-30
GCI interrupts aperiodic status, 13-10
GCI monitor channel
receive registers, 13-24
transmit abort register, 13-26
transmit registers, 13-25
transmit status register, 13-27
GCI/IDL
B- and D-Channel
receive data registers, 13-3
transmit data registers, 13-4
B- and D-Channel bit alignment, 13-5
block, 13-3
D-Channel contention, 13-8
looping modes, 13-8
periodic frame interrupts, 13-9
initialization, 13-35
interrupt configuration
example, 13-37
registers, 13-20
interrupt control, 13-11
introduction, 13-1
local loopback mode, 13-9
loopback control register, 13-20
periodic status registers, 13-22
port configuration
example, 13-35
registers, 13-18
register memory map, 13-13
registers, general, 13-15
remote loopback mode, 13-9
super frame sync generation, 13-13
sync delay registers, 13-33
timing generator, 13-11
Ports
parallel input/output, 1-6
Power management registers, 6-7
Program counter, 2-6
Programming model
PWM, 18-2
QSPI, 14-9
Programming models
Ethernet, 11-10
instruction cache, 4-12
MAC, 2-7
overview, 2-4
ROM, 4-5
SIM, 6-2
SRAM, 4-2
supervisor, 2-7,2-7
user, 2-4
PST outputs, 5-3
PULSE instruction, 5-3
PWM
control regist er, 18-3
operation, 18-2
overview, 18-1
Index
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor Index-5
programming model, 18-2
width register, 18-4
Q
QSPI
address register, 14-14
baud rate selection, 14-6
command RAM bit description, 14-15
data register, 14-14
delay register, 14-11
interrupt, 14-13
mode register, 14-9
module description, 14-1
operation, 14-3
overview and features, 14-1
programming
example, 14-16
model, 14-9
RAM
command, 14-6
model, 14-4
receive, 14-5
transmit, 14-6
slave bus interface, 14-3
transfer
data, 14-8
delays, 14-7
length, 14-8
wrap register, 14-12
R
RAM
QSPI command bit description, 14-15
USB configuration, 12-28,12-30
RAM base address registers, 2-9
RAMBAR
overview, 4-3
power management program ming, 4-4
Read/write, bus, 20-2
Registers
A0–A6, 2-5
A7, 2-5
AATR, 5-7
ABLR/ABHR, 5-6,5-9
access control, 2-9,4-14
activate low-power, 6-10
address, 2-5
address (A0 – A6), 2-5
ALPR, 6-10
B2 data transmit, 13-17
BI data receive, 13-15
cache configuration, 2-9
cache control, 4-12
CACR, 2-9
CCR, 2-6
chip select
base, 8-3
general, 8-2
option, 8-5
condition code, 2-6,2-6
condition code (CCR), 2-6
CSBR, 8-3
CSOR, 8-5
CSR, 5-10
D data receive, 13-16
D0–D7, 2-5
data, 2-5
data breakpoint/mask, 5-12
data D0 - D7, 2-5
DBCR, 10-6
D-Channel request, 13-32
DDAR, 10-6
debug attribute trigger, 5-7
descriptor active, 11-15
device identification, 6-11
DIR, 10-4
DMA
byte count, 10-6
controller, 10-2
destination address, 10-6
interrupt, 10-4
mode, 10-2
sourse address, 10-5
DMR, 10-2
DSAR, 10-5
Ethernet control, 11-11
FIFO
receive bound, 11-19
receive start, 11-20
transmit start, 11-22
GCI
C/I channel transmit status, 13-30
monitor channel transmit abort, 13-26
GPIO
control port, 17-2–17-8
data, 17-11
data direction, 17-10
hash table
high, 11-28
low, 11-29
IDCODE, 6-11
integer data formats in, 2-10
interrupt
event, 11-12
mask, 11-13
vector status, 11-14
interrupt controller
pending and mask, 7-5,7-5
Index
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Index-6 Freescale Semiconductor
interrupt controller, pending and mask, 7-4,7-5
JTAG instruction, 21-7
local memory, 4-2
MASK, 2-6
maximum frame length, 11-24
MBAR, 2-9,6-3
MII management frame, 11-17
MII speed control, 11-18
module base address, 2-9
output port command, 16-18
P0B1RR–P3B1RR, 13-15
P0B2RR–P3B2RR, 13-16
P0CR–P3CR, 13-18
P0GCIR–P3GCIR, 13-28
P0GMT–P3GMT, 13-25
P0ICR–P3ICR, 13-20
P0PSR–P3PSR, 13-22
P0SDR–P3SDR, 13-33
P3B1TR–P0B1TR, 13-17
P3B2TR–P0B2TR, 13-17
P3DRR–P0DRR, 13-16
P3DTR–P0DTR, 13-18
P3GCIT–P0GCIT, 13-29
P3GMR–P0GMR, 13-24
PADDR, 17-10
PAR, 7-9
PASR, 13-23
PBDDR, 17-10
PBR, 5-13
PCDDR, 17-11
PCSR, 13-34
PDCSR, 13-31
PDRQR, 13-32
PGCITSR, 13-30
PGMTA, 13-26
PGMTS, 13-27
PLCR, 13-20
PLIC
aperiodic status, 13-23
B1 data transmit, 13-17
B2 data receive, 13-16
clock select, 13-34
D data transmit, 13-18
D-Channel status, 13-31
GCI C/I channel
receive, 13-28
transmit, 13-29
GCI monitor channel
general, 13-24
transmit, 13-25
transmit status, 13-27
general, 13-15
interrupt configuration, 13-20
loopback control, 13-20
memory map, 13-13
periodic status, 13-22
port configuration , 13-18
receive data, 13-3
sync delay, 13-33
transmit data, 13-4
PMR, 6-7
pointer-to-receive descriptor ring, 11-30
pointer-to-transmit descript or ri ng, 11-31
power management, 6-7
PWM control, 18-3
PWM width, 18-4
QSPI
address, 14-14
data, 14-14
delay, 14-11
interrupt, 14-13
mode, 14-9
wrap, 14-12
RAM base address, 2-9
RAM perfect match address
high, 11-27
low, 11-26
RAMBAR, 2-9
RAREG/RDREG, 5-22
RCREG, 5-30
RDMREG, 5-32
read control, 5-30
read debug module, 5-32
receive buffer size, 11-32
receive control, 11-23
ROM base address, 4-5
SCR, 6-5
SDCR, 9-6
SDRAM
configuration, 9-6
general, 9-6
timing, 9-8
SDTR, 9-8
SIM
base address, 7-6,7-8
memory map, 6-2
module base address, 6-3
SPR, 6-6
SR, 2-8
SRAM base address, 4-3
status, 2-8,2-8
system configuration, 6-5
system protection, 6-6
TCR, 15-4
TDR, 5-14
TER, 15-5
timer
capture, 15-4
event, 15-5
general-purpose, 15-3
Index
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor Index-7
mode, 15-3
reference, 15-4
TMR, 15-3
transmit
control, 11-25
descriptor active, 11-16
FIFO watermark, 11-21
trigger definition, 5-14
TRR, 15-4
UACR, 16-12
UART modules, 16-2–16-18
UCR, 16-9
UCSR, 16-8
UDU/UDL, 16-14,16-14,16-15,16-16
UIP, 16-17
UIPCR, 16-11
UISR, 16-12
USB
access, 12-30
alternate settings, 12-12
endpoint
control, 12-17–12-20
data, 12-27
data present, 12-28
interrupt mask , 12-26
status interrupt, 12-25
frame number, 12-9
function address, 12-11
USB general, 12-9–12-28
VB, 2-8
vector base, 2-8,2-8
WAREG/WDREG, 5-23
watchdog
counter, 6-13
event, 6-13
interrupt reference, 6-12
WCR, 6-13
WCREG, 5-31
WDMREG, 5-33
WER, 6-13
WIRR, 6-12
write control, 5-31
write debug module, 5-33
Reset
instruction cache, 4-10
ROM
base address register, 4-5
operation, 4-5
overview, 4-5
programming model, 4-5
ROMBAR
overview, 4-5
power management program ming, 4-6
S
SDCR, 9-12
SDRAM
auto initialization, 9-9
banks, page hits, page misses, 9-6
configuration register, 9-6
controller si gn al s, 9-1
devices interface, 9-4
interface, 9-14
performance, 9-10
power-down and self-refresh, 9-9
read accesses, 9-15
refresh timing, 9-20
registers, 9-6
solving timing issues, 9-12
timing register, 9-8
write accesses, 9-18
Serial management channel timin g, 23-20
Signals
bus control, 19-20–19-23
bypass, 19-22
chip selects, 19-19
clear-to-send, 19-25
CPU clock and reset, 19-23
CPU external clock, 19-23
DRESETEN,19-23
Ethernet module, 19-27–19-29
Hi-Z, 19-22
output enable/read, 19-20
PWM module, 19-29
read/write, 19-21
receive serial data input, 19-25
request to send, 19-25
reset output, 19-23
timer module, 19-27,19-27
transfer acknowledge, 19-22
transmit serial data output, 19-24
USB
receive data negative, 19-25
receive serial data input, 19-25
Rx data output, 19-26
suspend driver, 19-26
transmit data negative, 19-26
transmit serial data output, 19-25
transmitter output enable, 19-26
USB_CLK, 19-26
USB_D+ and USB_D-, 19-26
wake-on-ring, 19-26
SIM
overview, 1-5
programming model, 6-2
register memory map, 6-2
Software watchdog timer, 6-11
SRAM
Index
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Index-8 Freescale Semiconductor
base address register, 4-3
initialization, 4-4
overview and operation, 4-2
programming model, 4-2
Stack pointer, 2-5,2-5
Status register, 2-8
STOP instruction, 5-4,5-16
Suggested reading, 1-xliii
Supervisor
programming model, 2-7
System configuration and protection, 1-5
System protection register, 6-6
T
TAP controller, 21-3
TCN0–TCN3, 15-4
Test access port, 1-7
Timer module
capture registers, 15-4
counters, 15-4
event registers, 15-5
general-purpose registers, 15-3
mode registers, 15-3
operation, 15-1
overview, 1-7,15-1
reference registers, 15-4
Timers
bus software watchdog, 20-24
Timing
branch instruction execution, 2-25
clock input and output, 23-5
fast Ethernet AC, 23-17
GPIO port AC, 23-28
JTAG AC, 23-30
MAC unit instructions, 3-4
MII
transmit signal, 23-18
MII async input signal, 23-19
MOVE instructions, 2-20
one operand, 2-22
PLI, 23-23
processor bus input, 23-6
SDRAM interface, 23-14
serial management channel, 23-20
timer module AC, 23-21
two operands , 2-22
USART AC, 23-22
USB interface AC, 23-29
Timings
SDRAM refresh, 9-20
Transmit signal timing, 23-18
U
UART modules
bus operation
interrupt acknowledge cycles, 16-29
read cycles, 16-29
write cycles, 16-29
clock source baud rates, 16-20
external clock, 16-21
FIFO stack in UART0, 16-25
initialization sequence, 16-30
looping modes, 16-26
automatic echo, 16-27
local loop-back, 16-27
remote loop-back, 16-27
mode registers, 16-4
multidrop mode, 16-28
overview, 1-6
programming, 16-30
receiver enabled, 16-24
register description, 16-2
serial overview , 16-2
signal definitions, 16-18
transmitter/receiver
clock source, 16-19
modes, 16-22
transmitting in UART mode, 16-22
USB
access times, 12-30
alternate settings register, 12-12
architecture, 12-2
attachment detection, 12-36
buffer descriptors, 11-34
class- and vendor-specific request operation, 12-34
clock gener a tor, 12-4
configuration and interface changes, 12-31
configuration RAM, 12-28,12-30
control logic, 12-4
control, bulk, and interrupt endpoi nts, 12-33
data flow, 12-32
device configuration example, 12-29
endpoint
controllers, 12-5
data present registers, 12-28
data registers, 12-27
FIFOs, 12-30
halt feature, 12-35
interrupt mask registers, 12-26
status interrupt registers, 12-25
endpoint control registers, 12-17,12-20
FIFO configuration, 12-32
frame number match register, 12-9
function address register, 12-11
IN endpoints, 12-33,12-34
initialization, 12-31
Index
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Freescale Semiconductor Index-9
isochronous endpoints, 12-33
line interface, 12-36
memory map, 12-7
module operation, 12-2
OUT endpoints, 12-33,12-34
overview, 12-1
PCB layout recommendations, 12-36
register
access, 12-30
descriptions, 12-9,12-28
remote wakeup and resume operation, 12-35
request processor, 12-5
software architecture and application notes, 12-31
transceiver interface, 12-3
User programming model, 2-5
V
Variant address, 5-4
Vector base register, 2-8,2-8
Version 2 ColdFire core overvi ew, 1-4
W
Wait state generation
overview, 1-5
Watchdog
counter register, 6-13
event register, 6-13
interrupt reference register, 6-12
WDDATA execution, 5-3
Index
MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3
Index-10 Freescale Semiconductor
Overview
ColdFire Core
Hardware Multiply/Accumulate (MAC) Unit
Local Memory
Debug Support
System Integration Module (SIM)
Interrupt Controller
Chip-Select Module
SDRAM Controller
DMA Controller Module
Ethernet Module
Universal Serial Bus (USB)
Physical Layer Interface Controller (PLIC)
Queued Serial Peripheral Interface (QSPI) Module
Timer Module
UART Modules
General-Purpose I/O Module
Pulse-Width Modulation (PWM) Module
Signal Descriptions
Bus Operation
Appendix B: Buffering and Impedence Matching
Index
Appendix A: List of Memory Maps
1
2
3
4
5
7
8
9
10
11
12
13
14
15
16
17
18
19
A
6
20
B
IND
21
23
22
IEEE 1149.1 Test Access Port (JTAG)
Mechanical Data
Electrical Characteristics
Overview
ColdFire Core
Hardware Multiply/Accumulate (MAC) Unit
Local Memory
Debug Support
System Integration Module (SIM)
Interrupt Controller
Chip-Select Module
SDRAM Controller
DMA Controller Module
Ethernet Module
Universal Serial Bus (USB)
Physical Layer Interface Controller (PLIC)
Queued Serial Peripheral Interface (QSPI) Module
Timer Module
UART Modules
General-Purpose I/O Module
Pulse-Width Modulation (PWM) Module
Signal Descriptions
Bus Operation
Appendix B: Buffering and Impedence Matching
Index
Appendix A: List of Memory Maps
1
2
3
4
5
7
8
9
10
11
12
13
14
15
16
17
18
19
A
6
20
B
IND
21
23
22
IEEE 1149.1 Test Access Port (JTAG)
Mechanical Data
Electrical Characteristics
blank
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MCF5272UM
Rev. 3, 03/2007
