X00619 0.8 A sensitive gate SCR Datasheet - production data Features IT(RMS) = 0.8 A VDRM, VRRM = 600 V IGT = 30 to 200 A A G K Applications A Limited gate current topologies Ground fault circuit interrupters Overvoltage crowbar protection in power supplies Protection in electronic ballasts Capacitive discharge ignitions Ignitors (lighting, oven...) K G G A A K TO-92 X00619-MA Table 1. Description The X006 SCR can be used as on/off function in applications where topology does not offer high current for gate triggering. SOT-223 X00619MN Device summary IT(RMS) 0.8 A VDRM / VRRM 600 V IGT 30 to 200 A This device is optimized in forward voltage drop and inrush current capabilities for reduced power losses and high reliability in harsh environments. May 2012 This is information on a product in full production. Doc ID 15755 Rev 2 1/10 www.st.com 10 Characteristics X00619 1 Characteristics Table 2. Absolute ratings (limiting values, Tj = 25 C unless otherwise specified) Symbol Parameter IT(RMS) On-state rms current (180 Conduction angle) IT(AV) Average on-state current (180 Conduction angle) ITSM Non repetitive surge peak on-state current It TO-92 TL = 83 C SOT-223 Tc = 107 C TO-92 TL = 83 C SOT-223 Tc = 107 C tp = 8.3 ms tp = 10 ms Value Unit 0.8 A 0.5 A 10 Tj = 25 C A 9 It Value for fusing tp = 10 ms Tj = 25 C 0.4 A2s di/dt Critical rate of rise of on-state current IG = 2 x IGT, tr 100 ns F = 60 Hz Tj = 125 C 50 A/s IGM Peak gate current tp = 20 s Tj = 125 C 1 A Tj = 125 C 0.1 W - 40 to + 150 - 40 to + 125 C PG(AV) Tstg Tj Average gate power dissipation Storage junction temperature range Operating junction temperature range Table 3. Electrical characteristics (Tj = 25 C unless otherwise specified) Symbol Test conditions Value MIN. IGT Unit 30 A VD = 12 V, RL = 140 200 MAX. VGT 0.8 V MIN. 0.2 V VGD VD = VDRM, RL = 3.3 k, RGK = 1 k VRG IRG = 10 A MIN. 5 V IH IT = 50 mA, RGK = 1 k MAX. 5 mA IL IG = 1 mA, RGK = 1 k MAX. 6 mA MIN. 40 V/s dV/dt Table 4. VD = 67% VDRM, RGK = 1 k 2/10 Tj = 125 C Static electrical characteristics Symbol Test conditions VTM ITM = 1 A, tp = 380 s VTO Threshold voltage Rd Dynamic resistance IDRM IRRM Tj = 125 C VDRM = VRRM, RGK = 1 k Value Unit 1.35 V 0.85 V 245 m Tj = 25 C 1 A Tj = 125 C 100 A Tj = 25 C Tj = 125 C Doc ID 15755 Rev 2 MAX X00619 Characteristics Table 5. Thermal resistances Symbol Parameter Value Rth(j-l) Junction to leads (DC) TO-92 Rth(j-c) Junction to case (DC) SOT-223 Rth(j-a) Figure 1. 0.6 70 30 Max. Junction to ambient (DC) S = 5 cm2 Maximum average power dissipation versus average on-state current Figure 2. P(W) C/W TO-92 150 SOT-223 60 Average and DC on-state current versus case temperature (SOT-223) IT(AV)(A) 1.0 DC180, DC = 30, 60, 120, 90, Unit = 30, 60, 90, 120, 180, DC SOT-223 0.8 0.4 0.6 0.4 0.2 360 IT(AV)(A) 0.2 Tl(C) 0.0 0.0 0.0 0.1 Figure 3. 1.0 0.2 0.3 0.4 0.5 0 0.6 Average and DC on-state current versus lead temperature (TO-92) IT(AV)(A) Figure 4. 1.0 25 75 0.8 0.6 0.6 0.4 0.4 SOT-223 SCU= 5 cm = 180 0.2 0.2 125 IT(AV)(A) DC 0.8 100 Average and DC on-state current versus ambient temperature (free air convection) = 30, 60, 90, 120, 180, DC TO-92 50 Tl(C) Tamb(C) TO-92 SCU= 0.5 cm 0.0 0.0 0 25 50 75 100 125 0 Doc ID 15755 Rev 2 25 50 75 100 125 3/10 Characteristics Figure 5. X00619 Relative variation of thermal impedance junction to ambient versus pulse duration Figure 6. IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25C] Zth(j-a)/Rth(j-a) 1.00 Relative variation of gate trigger, holding and latching current versus junction temperature 1.6 Typical values 1.4 TO-92 1.2 SCU= 0.5 cm 1.0 0.10 0.8 SOT-223 SCU= 5 cm IH and IL 0.6 0.4 0.2 tp(s) 0.01 1.0E-02 Figure 7. 3.5 IGT Tj(C) 0.0 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 Relative variation of holding current versus gate-cathode resistance (typical values) -40 -20 Figure 8. IH[RGK] / IH[RGK=1k] 100.0 0 20 40 60 80 100 120 Relative variation of dV/dt immunity versus gate-cathode resistance (typical values) dV/dt[RGK] / dV/dt[RGK=1k] VD = 0.67xVDRM 3.0 2.5 10.0 2.0 1.5 1.0 1.0 0.5 RGK(k) RGK(k) 0.0 1.E-02 Figure 9. 0.1 1.E-01 1.E+00 1.E+01 1.E+02 1.0E+00 1.0E+01 Relative variation of dV/dt immunity Figure 10. Surge peak on-state current versus versus gate-cathode capacitance number of cycles (typical values) dV/dt[CGK] / dV/dt[RGK=1k] 100 1.0E-01 10 VD = 0.67xVDRM Rgk = 1 k ITSM(A) 9 Non repetitive 8 Tj initial=25 C tp=10ms One cycle 7 6 5 10 Repetitive 4 Tl= 25 C 3 2 1 0 1 4/10 Number of cycles 1 CGK(nF) 10 1 Doc ID 15755 Rev 2 10 100 1000 X00619 Characteristics Figure 11. Non repetitive surge peak on state current for a sinusoidal pulse and corresponding value of I2T 2 100 Figure 12. On-state characteristics (maximum values) 2 ITSM(A), I t (A s) 10.0 ITM(A) Tj initial=25 C ITSM 10 1.0 TJ=125 C 1 It TJ=25 C tp(ms) VTM(V) 0 0.01 T j max Vto =0.85 V Rd =245 m 0.1 0.10 1.00 10.00 0.5 1.0 1.5 2.0 2.5 3.0 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (SOT-223) 130 Rth(j-a)(C/W) Epoxy printed circuit board FR4 copper thickness = 35 m 120 110 100 90 80 70 60 50 40 30 20 10 S(cm) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Doc ID 15755 Rev 2 4.0 4.5 5.0 5/10 Ordering information scheme 2 X00619 Ordering information scheme Figure 14. Ordering information scheme X 006 19 M Sensitive SCR series Current 006 = 0.8 A Sensitivity 19 = 30 A to 200 A Voltage M = 600 V Package A = TO-92 N = SOT-223 Package 1AA2 = Bulk (TO-92) 2AL2 = Ammopac k (TO-92) 5AL2 = Tape and reel (TO-92 and SOT-223) 6/10 Doc ID 15755 Rev 2 A 1AA2 X00619 3 Package information Package information Epoxy meets UL94, V0 Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 6. TO-92 (plastic) dimensions Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A - 1.35 - - 0.053 - B - - 4.70 - - 0.185 C - 2.54 - - 0.100 - D 4.40 - - 0.173 - - E 12.70 - - 0.500 - - F - - 3.70 - - 0.146 a - - 0.50 - - 0.019 A a B C F D E Doc ID 15755 Rev 2 7/10 Package information X00619 Table 7. SOT-223 dimensions Dimensions Ref. V A A1 Millimeters Min. c Typ. A B A1 e1 Inches Max. Min. Typ. Max. 1.80 0.071 0.02 0.10 0.001 0.004 B 0.60 0.70 0.85 0.024 0.027 0.033 B1 2.90 3.00 3.15 0.114 0.118 0.124 c 0.24 0.26 0.35 0.009 0.010 0.014 (1) 6.30 6.50 6.70 0.248 0.256 0.264 D B1 D 4 H E 1 2 e 3 2.3 e1 0.090 4.6 0.181 E(1) 3.30 3.50 3.70 0.130 0.138 0.146 H 6.70 7.00 7.30 0.264 0.276 0.287 e V 10 max 1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches) Figure 15. SOT-223 footprint 3.25 1.32 5.16 7.80 1.32 2.30 8/10 Doc ID 15755 Rev 2 0.95 X00619 4 Ordering information Ordering information Table 8. Ordering information Order code Marking Package Weight X00619MA1AA2 X00619MA2AL2 X0619 MA TO-92 0.2 g X00619MA5AL2 Base qty Delivery mode 2500 Bulk 2000 Ammopack 2000 Tape and reel X00619MN5AL2 5 X0 619 MN SOT-223 0.12 g 1000 Revision history Table 9. Document revision history Date Revision Changes 26-May-2009 1 First issue 03-May-2012 2 Added SOT-223 package. Doc ID 15755 Rev 2 9/10 X00619 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. 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