SPEC NO: DSAL4011 REV NO: V.1 DATE: NOV/22/2010 PAGE: 1 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007407
2.2x1.4mm SURFACE MOUNT LED LAMP
Part Number: AA2214SES/J3-AMT
Hyper Red
Features
zHigh reliability LED package.
z2.2mm x 1.4mm, 1.3mm high.
zLow power consumption.
zAvailable on tape and reel.
zPackage : 2000pcs / reel.
zMoisture sensitivity level : level 3.
zRoHS compliant.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.008") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
Applications
zTraffic signaling.
zBacklighting (illuminated advertising , general lighting).
zInterior and exterior automotive lighting.
zSubstitution of micro incandescent lamps.
zReading lamps.
zSignal and symbol luminaire for orientation.
zMarker lights (e.g. Steps, exit ways, etc).
zDecorative and entertainment lighting.
zIndoor and outdoor commercial and residential
architectural lighting.
Description
The Hyper Red device is based on light emitting diode chip
made from AlGaInP.
SPEC NO: DSAL4011 REV NO: V.1 DATE: NOV/22/2010 PAGE: 2 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007407
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter
of the nozzle should be as large as possible.
5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
SPEC NO: DSAL4011 REV NO: V.1 DATE: NOV/22/2010 PAGE: 3 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007407
Selection Guide
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity/ luminous Flux: +/-15%.
Electrical / Optical Characteristics at Ta=25°C
Absolute Maximum Ratings at Ta=25°C
Notes:
1. Rth(j-a) Results from mounting on PC board FR4 (pad size≥16 mm2 per pad),
2. 1/10 Duty Cycle, 0.1ms Pulse Width.
Part No. Dice Lens Type
Iv (mcd) [2]
@ 20mA
V
iewing
Angle [1]
Code. Min. Max. 2θ1/2
AA2214SES/J3-AMT Hyper Red (AlGaInP) Water Clear
V 1300 1600
120°
W 1600 1900
X 1900 2300
Notes:
1.The dominant Wavelength (λ d) above is the setup value of the sorting machine. (Tolerance λ d : ±1nm. )
2. Forward Voltage: +/-0.1V.
Parameter Symbol Value Unit
Power dissipation PD 140 mW
Reverse Voltage VR 5 V
Junction temperature TJ 120 °C
Operating Temperature Top -40 To +10 0 °C
Storage Temperature Ts tg -40 To + 1 2 0 °C
DC Forward Current[1] IF 50 mA
Peak Forward Current [2] IFM 150 mA
Electrostatic Discharge Threshold (HBM) 3000 V
Thermal Resistance (Junction/ambient) [1] Rth j-a 350 °C/W
Parameter Symbol Value Unit
Wavelength at peak emission IF=20mA [Typ.] λpeak 640 nm
Dominant Wavelength IF=20mA [Min.] λ dom [1] 615 nm
Dominant Wavelength IF=20mA [Max.] λ dom [1] 635 nm
Spectral bandwidth at 50%ΦREL MAX IF=20mA [Typ.] Δλ 25 nm
Forward Voltage IF=20mA [Min.]
VF [2]
-
V
Forward Voltage IF=20mA [Typ.] 2.2
Forward Voltage IF=20mA [Max.] 2.8
Reverse Current (VR = 5V) [Max.] IR 10 uA
Temperature coefficient of λpeak
IF=20mA, -10 °C≤ T≤100 °C [Typ.] TC λpeak 0.14 nm/°C
Temperature coefficient of λdom
IF=20mA, -10 °C≤ T≤100 °C [Typ.] TC λdom 0.04 nm/°C
Temperature coefficient of VF
IF=20mA, -10 °C≤ T≤100 °C [Typ.] TCV -2.0 mV/°C
SPEC NO: DSAL4011 REV NO: V.1 DATE: NOV/22/2010 PAGE: 4 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007407
Hyper Red AA2214SES/J3-AMT
SPEC NO: DSAL4011 REV NO: V.1 DATE: NOV/22/2010 PAGE: 5 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007407
AA2214SES/J3-AMT
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1) Reel Dimension
Tape Dimensions
(Units : mm)
SPEC NO: DSAL4011 REV NO: V.1 DATE: NOV/22/2010 PAGE: 6 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007407
PACKING & LABEL SPECIFICATIONS AA2214SES/J3-AMT
SPEC NO: DSAL4011 REV NO: V.1 DATE: NOV/22/2010 PAGE: 7 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007407
Failure Criteria
Items Symbols Conditions Failure Criteria
luminous Intensity lv IF = 20mA Testing Min. Value <Spec.Min.Value x 0.5
Forward Voltage VF IF = 20mA Testing Max. Value ≥Spec.Max.Value x 1.2
Reverse Current IR VR = Maximum Rated Reverse Voltage Testing Max. Value ≥Spec.Max.Value x 2.5
High temp. storage test - - Occurrence of notable decoloration, deformation
and cracking
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below
Lot Tolerance Percent Defective (LTPD) : 10%
No. Test Item Standards Test Condition Test Times /
Cycles
Number of
Damaged
1 Continuous operating test - Ta =25°C ,IF = maximum rated current* 1,000 h 0 / 22
2 High Temp. operating test EIAJED-
4701/100(101) Ta = 100°C IF = maximum rated current* 1,000 h 0 / 22
3 Low Temp. operating test - Ta = -40°C, IF = maximum rated current* 1,000 h 0 / 22
4 High temp. storage test EIAJED-
4701/100(201) Ta = maximum rated storage temperature 1,000 h 0 / 22
5 Low temp. storage test EIAJED-
4701/100(202) Ta = -40°C 1,000 h 0 / 22
6 High temp. & humidity storage test EIAJED-
4701/100(103) Ta = 60°C, RH = 90% 1,000 h 0 / 22
7 High temp. & humidity operating test EIAJED-
4701/100(102)
Ta = 60°C, RH = 90%
IF = maximum rated current* 1,000 h 0 / 22
8 Soldering reliability test EIAJED-
4701/100(301)
Moisture soak : 30°C,70% RH, 72h
Preheat : 150~180°C(120s max.)
Soldering temp : 260°C(10s)
3 times 0 / 18
9 Thermal shock operating test - Ta = -40°C(15min) ~ 100°C(15min)
IF = derated current at 100°C 1,000 cycles 0 / 22
10 Thermal shock test - Ta = -40°C(15min) ~ maximum rated
storage temperature(15min) 1,000 cycles 0 / 22
11 Electric Static Discharge (ESD) EIAJED-
4701/100(304) C = 100pF , R2 = 1.5KΩ V = 3000V Once each
Polarity 0 / 22
12 Vibration test - a = 196m/s² , f = 100~2KHz ,
t = 48min for all xyz axes 4 times 0 / 22
* : Refer to forward current vs. derating curve diagram
