5962-9322001MRA - NXP SEMICONDUCTORS

Spec. No.

Subject

Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION

151-SRA-E102R

Part No.

E R A 3 10－1

Panasonic Electronic Devices Co., Ltd.

1. Dimension

L W a b t

inch

1.60±0.15

0.63±.006

0.80±0.20

.031±.008

0.30±0.20

.012±.008

0.30±0.20

.012±.008

0.45±0.10

.018±.004

2. Power deratimg Curve

120

100

-55 -40 0 40 80 120 140 160

125

Rated Load(%)

3. Ratings

Item Rated value Explanation

Rated power 0.10 W

(at 70 °C or lower)

When used at ambient temperture over

70°C, the load power should be reduced

as shown in Flg.1

Flg.1 Ambient Temperature (°C)

Category temperature range

-55~+125°C

a a

b b

(1) (2) (3) (4) (5) (6)

(1) Substrate Alumina

(2) Protective

coating Epoxy resin

(3) Resistive

element NiCr alloy

(4) Inner

termination special termination

(5) Between

termination Ni plating

(6) Outer

termination Sn plating

Spec. No.

Subject

Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION

151-SRA-E102R

Part No.

E R A 3 10－2

Panasonic Electronic Devices Co., Ltd.

Rated voltage

Limiting element

voltage

The rated voltage of each resistance should be calculated from the

equation below, and when the rated voltage exceeds the ｌimiting

element voltage, the ｌimiting element voltage should be the rated

voltage.

Limiting element voltage ;75V

E : Rated voltage (V) P : Rated power (W)

R : Rated resistance value (Ω)

Tolerance for

resistance

Resistance range

E-96 series :special

When E-96 series overlap

E-24 series, E-24 series

Should be the first priority

4. Explanation of Part Number

(1) (2) (3) (4) (5) (6) (7)

(1) Product Code : Metal Film Chip Resistors

(2) Size and Rated Power : 1.6 mm x 0.8 mm, 0.10W

(3) Series and marking

Code Series Marking

Y E-24 series 3 digit marking

E E-96 series No marking

(4) T.C.R.

Code T.C.R. Resistance range

Η ± 50x10-6/°C

10Ω ~ 97.6Ω

Ε ± 25x10-6/°C

100Ω ~ 33 kΩ

Κ ±100x10-6/°C 33.2kΩ ~ 330kΩ

(5)Resistance Tolerance

Code Resistance Tolerance

D +/- 0.5%

B +/- 0.1%

(6) Resistance Value

<E-24 series> 3-digits type 123 →12×103 →12kΩ

<E-96 series> 4-digits type 3012 → 301×102 → 30.1kΩ

(7) Packaging Configuration

Code Packaging Configuration

V Taping (5000pcs/reel)

Code. Tolerance for resis.

D ± 0.5%

B ± 0.1%

Tolerance Resistance range Series

D 10 Ω ~330k Ω E-24

B 100Ω ~33k Ω E-24

E R A 3 Y E D 1 0 2 V

RPE

×=

Spec. No.

Subject

Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION

151-SRA-E102R

Part No.

E R A 3 10－3

Panasonic Electronic Devices Co., Ltd.

5. Appearance & Construction

Item Rated value Explanation

Appearance &

Construction

1. The resistive element should be covered with protective coating

that don’t fade easily. The surface of coating should avoid

unevenness, flaw, pinhole and discoloration.

2. The electrode should be printed uniformly, as shown in the

dimensions. The plating should not fade easily, and should avoid

unevenness, flaw, pinhole, projection and discoloration.

3. The electrode should be connected electrically, mechanically to

resistive element.

As far as there shall not designation especially, the following test and measurement

shall be operated under normal temperature (15~35°C), normal humidity(25~75%),

normal atmospheric pressure( 4

108.6 ×~Pa101.06 5

×).

6. Performance Specification

Specifications

Item Chip Resistor Explanation

Resistance

DC Resistance value shall

be within the specified

tolerance

At 20°C, 65%RH

Temperature

Coefficient

Natural resistance change per

Temperature degree centigrade.

1)t21(tR 1R2R ×

−

R1 : Resistance value at reference

temperature(t1)

R2 : Resistance value at test

temperature(t2)

t2 – t1 = 100°C t1 = 25°C

Short-time

overload ± (0.5 % + 0.1Ω)

Resistors shall be applied 2.5 times the

rated voltage for 5 seconds.

However, the upper limit of the voltage in the

test shall be 150V.

Dielectric

Withstanding

No evidence of flashover,

mechanical damage,

arcing or insulation break-

down

Insulation

Resistance Min.

1,000M

AC 100V between substrate and termination for

1 min.

Resistors shall be facing down. After applying DC

100V to the resistor, insulation resistance shall be

measured.

Resit. range TCR

10Ω

~97.6Ω ± 50x10-6/°C

100Ω

~33 kΩ ±25x10 -6/°C

33.2kΩ

~330kΩ ±100x10-6/°C

(10-6/℃)

powersupply

Insulation

resistance

Spec. No.

Subject

Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION

151-SRA-E102R

Part No.

E R A 3 10－4

Panasonic Electronic Devices Co., Ltd.

7. Mechanical characteristic

Specifications

Item Chip Resistor Explanation

Without distinct deforma-

tion in appearance

Bond strength

of the face

plating

± (0.5 % + 0.05Ω)

Substrate : Glass epoxy(t=1.6mm)

Span : 90mm

Bending distance :3mm (10 seconds)

Solderability

Termination should be

covered uniformly with

solder

(min. 95% coverage)

Resistors shall be dipped in the melted sol-

der bath at 5235

°C for 5.02 ± sec.

Flux shall be removed from the surface

of termination with clean organic solvent.

Resistance to

Soldering Heat ± (0.5 % + 0.05Ω) Resistors shall be dipped in the melted

solder bath at 3270

°C for 110 ±°C sec.

Without distinct

deformation in appearance

Resistance to

Solvent ± (0.5 % + 0.05Ω)

olvent solution : Isopropyl alcohol

(1)Dipping 10 +/- 1 hours, dry in room

condition for 30 +/- 10 minutes.

(2)Ultrasonic wave washing : 5 +/- 1 min.

(0.3W/cm2,28kHz)

Dry in room condition for 30 +/-10

minutes.

(unit: mm)

100

1.0 1.0 1.0

Spec. No.

Subject

Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION

151-SRA-E102R

Part No.

E R A 3 10－5

Panasonic Electronic Devices Co., Ltd.

8. Environment Test

Specifications

Item Chip Resistor Explanation

High Temperature

Exposure ± (0.5 % + 0.05Ω) Resistors shall be exposed at125±3°C

for 1000 48

±hours.

Rapid change of

temperatrure ± (0.5 % + 0.05Ω)

355

−

°C 30minutes

↓↑

Normal Within 3minutes 5 cycles

↓↑

3125

°C 30minutes

Damp heat ,

Steady State ± (0.5 % + 0.05Ω)

Resistors shall be exposed at 60±2°C

and 90~95% relative humidity in a humidity

test chamber for 1000 48

±hours.

Load Life ± (1.0 % + 0.1Ω)

Resistors shall be exposed at 70±2°C and

1000 48

±hours. During this time.

The rated voltage shall be applied intermit-

tently for 1.5 hours ON,0.5 hours OFF.

Load Life in

Humidity ± (1.0 % + 0.1Ω)

Resistors shall be exposed to at 40±2°C and

90~95% relative humidity for 1000 48

±hours.

During this time the rated voltage shall be

applied intermittently for 1.5 hours ON,0.5

hours OFF.

9. Marking

Express resistance value on resin side with three digits.

(For example)

101 100

The first two digits are

significant figures of resistance

and the third one denotes number

of zeros following.

E-96 series: No marking

Spec. No.

Subject

Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION

151-SRA-E102R

Part No.

E R A 3 10－6

Panasonic Electronic Devices Co., Ltd.

10. Common Precautions in Handling Resistors

! Notice for use

(1) This specification shows the quality and performance of a u nit comp onent. Before adoption, be sure to

evaluate and verify the product mounting it in your pr oduct.

(2) We take no responsibility for troubles caused by the product usage that is not specified in this specification.

(3) In advance-notification to us is required in case you demand high reliability i n the resistors because there is a

possibility that a trouble or a failure in our resistor which is used in your transportation units (e.g. Trains, cars,

ships, traffic signal equipment etc.), ocean floor-equipment, medical equipment, aerospace equipm ent,

electrothermal goods, combustion and gas equipment, power station control equipment, informati on control

equipment, rotating equipment, disaster and crime preventive equip ment, various safety devices, and the

equivalent equipment may cause critic al damage occurrence such as loss of life or property.

In addition, use fail-safe design as mentioned below for preventing extensive damage and for ensuring the

safety:

*Ensure safety by the system in which the protective circuits and/or protective equipment are installed.

*Ensure safety by the system in which a single failure does not cause unsafety by installing such as

redundant circuits.

(4) When a dogma shall be occurred about safety for this product, be sure to inform us rapidly,

operate your technical examination.

(5) The product is designed to use in ge neral standard applications of general electric

equipment (AV products, household e lectric appliances, office equipment, information and

communication equipment, etc.); hence, it do not take the use under the following special

environments into consideration.

Accordingly, the use in the following special environments, and such e nvir onmental conditions may

affect the performance of the product; prior to use, verify the performance, reliability, etc. thoroughly.

1) Use in liquids such as water, oil, chemical, and organic solvent.

2) Use under direct sunlight, in outdoor or in dusty atmospheres.

3) Use in places full of corrosive gases such as sea bre eze, Cl2, H2S, NH3, SO2, and NOX.

4) Use in environment with large static electricity or strong electromagnetic waves or

strong radial ray.

5) Where the product is close to a heating compon ent, or where an inflammable such as

a polyvinyl chlorid e wir e is arranged close to the product.

6) Where the resistor is sealed or c oated with resin et c.

7) Where solvent, water, or water-soluble detergent is used in cleaning free soldering and in flux cleaning

after soldering. (Pay particular attention to water-soluble flux.)

8) Use in such a place where the product is wetted due to dew co ndensation.

(6) If transient load (heavy load in a short time) like pulse is expected to be applied, carry out

evaluation and confirmation test with resistors actually mounted on your own board.

When the load of more than rated power is applied under the load condition at steady state, it

may impair performance and/or reliability of resistor. Never exceed the rated power and

rated voltage. Temperature of resistors may become high even with specified conditions. Please c onfir m

safety of heat from resistors on print circuit board and components around them. Wh en the product shall be

used under special condition, be sure to ask us in advance.

(7) Halogen type (Chlorine type, Bromine type, etc.) or other high-activity flux is not

recommended as t he residue may affect performance or reliability of resistors.

Strong acid flux, water soluble-flux and flux including fluorine ion shall not be used.

(8) When soldering with soldering iron, never to uch the body of the chip resistor wit h a t ip of

the soldering iron. When using a soldering iron with a tip at high temperature, solder for a

time as short as possible. (three seconds or less up to 3 50 deg.C)

(9) Avoid physical shock to the resistor and nipping of the resist or wit h hard tool (a pair of

pliers or tweezers) as it may damage protective film or the body of resistor and may affect

resistor’s performance.

(10) Avoid immersion of chip resistor in solvent for long time. Use solvent after the effect of

immersion is confirmed.

Spec. No.

Subject

Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION

151-SRA-E102R

Part No.

E R A 3 10－7

Panasonic Electronic Devices Co., Ltd.

11. Storage Method

If the product is stored in the following environments and conditions, the performance and

solderability may be badly affected, avoid the storage in the following environments.

(1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and

NOX.

(2) Storage in places exposed to direct sunlight.

(3) Storage in places outside the temperature range of 5 oC to 35 oC and humidity range of

45 %RH to 85 %RH.

(4) The period of guarantee for performance such as solderability is 1 year after our

delivery; and this condition applies only to the case where the storage method specified

in item (1) to (3) has been followed.

12. Laws and Regulations

(1) This product has not been manufactured with any ozone-depleting chemical controlled

under the Montreal Protocol.

(2) This product complies with the RoHS Directive (Restriction of the use of certain Hazardous

substances in electrical and electronic equipment (DIRECTIVE 2002/95/EC)).

(3) All materials used in this part are registered material under the Law Concerning the

examination and Regulation of Manufacturs, etc. of Chemical substances.

(4) All the materials used in this part contain no brominated materials of PBBOS or PBBS as

the flame-retardant.

(5) If you need the notice by letter of “A preliminary judgement on the laws of Japan

foreign exchange and foreign trade control”, be sure to let us know.

13. Production Site

Country: Japan

Plant: Panasonic Electronic Devices Japan Co., Ltd.

Spec. No.

Subject

Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION

151-SRA-E102R

Part No.

E R A 3 10－8

Panasonic Electronic Devices Co., Ltd.

14. Tape and Reel Package

14.1 Structure and reel dimensions shall be as shown in the figure below.

Inaccordance with EIAJ ET-7200.

14.2 Carrier Tape Dimensions

P1 P2 P0

Sprocket hole

Chip resistor

Chi

hole

A B W F E

(mm) 1.10±0.10 1.90±0.10 8.00±0.20 3.50±0.05 1.75±0.10

(inch) .043±.004 .074±.004 .314±.008 .137±.002 .069±.004

P1 P2 P0 D0 T

(mm) 4.00±0.10 2.00±0.05 4.00±0.10 0.10

1.50 ± 0.70±0.05

(inchi) .157±.004 .079±.002 .157±.004 .004

.059 ± .028±.002

14.3 Tapping specifications

14.3.1 Taping

(1) Minimum Bending Radius

There shall be no defection of chip and no breakage of carrier tape in case carrier tape

have been bent by minimum bending radius (15mm). Test shall be conducted for 1 time.

(2) Resistance to climate of top tape

The top tape shall not tear off after exposure at 60 oC, 90 %RH to 95 %RH for 120 h.

(3) Peeling strength

Peeling strength shall be within 0.049 N to 0.49 N. There shall be no burr or breakage

after test. Test method is as follows:

Carrier tape

Top tape

dhesive tape Unit : mm

Min. 60.0

11.4 +/-

9.0 +/- 1.0

180.0 +0 /

13.0 +/- 1.0

Min. 60.0

Spec. No.

Subject

Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION

151-SRA-E102R

Part No.

E R A 3 10－9

Panasonic Electronic Devices Co., Ltd.

14.3.2 Quantity in Taping: 5000 pcs. /reel

14.3.3 Tape packaging

(1) Resistance side shall be facing upward.

(2) Chip resistor shall not be sticking to top tape and bottom tape.

(3) Chip resistor shall be easy to take out from carrier tape and chip hole or sprocket hole

shall not have flash and break.

14.4 Outer Packaging

Quantity: 20 reels (Max. 100,000pcs.)

* When taping shall not reach Max. or quantity, the remaining empty space shall be buried

with buffer material.

* When the quantity shall be few, alternative packaging methods may be used. No problem

must occur during the exportation of the product.

14.5 Marking (Label)

Items listed below shall be displayed.

(1) Side of reel (Marking shall be on one side)

1)Part name, 2)Part number, 3)Quantity, 4)Lot number, 5)Maker name, 6) Production country

(2)Packaging box

1)Customer name, 2)Part name, 3)Part number, 4)Customer part number, 5)Quantity.

6)Maker name, 7)Production country

Peeling directionCarrier tape

Top tape

10 o

Tape

Marking