1PS301,115 - NEXPERIA - Datasheet.Directory

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1. Product profile

1.1 General description

Dual high-speed switching diode, encapsulated in a very small SOT323 (SC-70)

Surface-Mounted Device (SMD) plastic package.

1.2 Features and benefits

1.3 Applications

High-speed switching

General-purpose switching

1.4 Quick reference data

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Single diode loaded.

[3] Double diode loaded.

[4] When switched from IF= 10 mA to IR=10mA; R

L= 100 ; measured at IR=1mA.

1PS301

Dual high-speed switching diode

Rev. 5 — 6 March 2012 Product data sheet

SOT323

High switching speed: trr 4ns Low capacitance: Cd1.5 pF

Repetitive peak reverse voltage:

VRRM 85 V

Repetitive peak forw ar d cu rr en t:

IFRM 500 mA

Reverse voltage: VR80 V Very small SMD plastic package

AEC-Q101 qualified

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Per diode

IFforward current [1]

[2] --250mA

[3] --160mA

IRreverse current VR=80V --0.5A

VRreverse voltage - - 80 V

trr reverse recovery time [4] --4ns

Product data sheet Rev. 5 — 6 March 2012 2 of 11

NXP Semiconductors 1PS301

Dual high-speed switching diode

2. Pinning information

3. Ordering information

4. Marking

[1] * = placeholder for manufacturing site code

5. Limiting values

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 anode (diode 1)

2 anode (diode 2)

3 common cathode

006aab034

Tabl e 3. Ordering i nfo rmation

Type number Package

Name Description Version

1PS301 SC-70 plastic surface-mounted package; 3 leads SOT323

Table 4. Marking codes

Type number Marking code[1]

1PS301 B*3

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

VRRM repetitive peak reverse

voltage -85V

VRreverse voltage - 80 V

IFforward current [1]

[2] -250mA

[3] -160mA

IFRM repetitive peak forward

current tp0.5 s;

0.25 -500mA

IFSM non-repetitive peak forward

current square wave [4]

tp=1s-4A

tp=1s - 0.5 A

Product data sheet Rev. 5 — 6 March 2012 3 of 11

NXP Semiconductors 1PS301

Dual high-speed switching diode

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Single diode loaded.

[3] Double diode loaded.

[4] Tj=25C before surge.

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

7. Characteristics

[1] When switched from IF= 10 mA to IR=10mA; R

L= 100 ; measured at IR=1mA.

[2] When switched from IF=10mA; t

r=20ns.

Per device

Ptot total power dissipation Tamb 25 C[1] -300mW

Tjjunction temperature - 150 C

Tamb ambient temperature 55 +150 C

Tstg storage temperature 65 +150 C

Table 5. Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Per device

Rth(j-a) thermal resistance from

junction to ambient in free air [1] - - 415 K/W

Rth(j-sp) thermal resistance from

junction to solder poi nt - - 200 K/W

Table 7. Characteristics

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Per diode

VFforward voltage IF= 1 mA - 610 - mV

IF= 10 mA - 740 - mV

IF=50mA --1.0V

IF=100mA --1.2V

IRreverse current VR=25V --30nA

VR=80V --0.5A

VR=25V; T

j=150C --30A

VR=80V; T

j=150C - - 100 A

Cddiode capacitance f = 1 MHz; VR=0V --1.5pF

trr reverse recovery time [1] --4ns

VFR forward recovery voltage [2] --1.75V

Product data sheet Rev. 5 — 6 March 2012 4 of 11

NXP Semiconductors 1PS301

Dual high-speed switching diode

(1) Tj= 150 C; typical values

(2) Tj=25C; typical values

(3) Tj=25C; maximum values

(1) VR= 80 V; maximum values

(2) VR= 80 V; typical values

(3) VR= 25 V; typical values

Fig 1. Forward current as a function of forward

voltage Fig 2. Reverse current as a fun ction of junction

temperature

f=1MHz; T

amb =25C FR4 PCB, standard footprint

(1) single diode loaded

(2) double diode loaded

Fig 3. Diod e capacitance as a function of reverse

voltage; typical values Fig 4. Forward current as a function of ambient

temperature; derating curves

VF (V)

0.0 2.01.50.5 1.0

006aac851

100

200

300

(mA)

(1) (2) (3)

mbg380

102

200

0 100 Tj (°C)

(μA)

10−2

10−1

(1) (2) (3)

VR (V)

0161248

006aac852

0.4

0.2

0.6

0.8

(pF)

0.0

0 100 200

300

200

100

mbg444

Tamb (°C)

(mA) (1)

(2)

Product data sheet Rev. 5 — 6 March 2012 5 of 11

NXP Semiconductors 1PS301

Dual high-speed switching diode

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

(1) IR=1mA

Input signal: reverse pulse rise time tr= 0.6 ns; reverse voltage pulse duration tp= 100 ns; duty cycle =0.05

Oscilloscope: rise time tr=0.35ns

Fig 5. Reverse recovery time test circuit and wav eforms

Input signal: forward pulse rise time tr= 20 ns; forward current pulse duration tp100 ns; duty cycle 0.005

Fig 6. F orward recovery voltage test circuit and waveforms

trr

(1)

+ IFt

output signal

trtpt

10 %

90 %

input signal

V = VR + IF × RS

RS = 50

D.U.T.

Ri = 50

SAMPLING

OSCILLOSCOPE

mga881

10 %

90 %

input signal

= 50 Ω

OSCILLOSCOPE

1 kΩ450 Ω

D.U.T.

mga882

VFR

output signal

Product data sheet Rev. 5 — 6 March 2012 6 of 11

NXP Semiconductors 1PS301

Dual high-speed switching diode

9. Package outline

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

Fig 7. Package outline SOT323 (SC-70)

04-11-04Dimensions in mm

0.45

0.15

1.1

0.8

2.2

1.8

2.2

2.0 1.35

1.15

1.3

0.4

0.3 0.25

0.10

Table 8. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packing quantity

3000 10000

1PS301 SOT323 4 mm pitch, 8 mm tape and reel -115 -135

Product data sheet Rev. 5 — 6 March 2012 7 of 11

NXP Semiconductors 1PS301

Dual high-speed switching diode

11. Soldering

Fig 8. Reflow soldering footprint SOT323 (SC-70)

Fig 9. Wave soldering footprint SOT323 (SC-70)

solder lands

solder resist

occupied area

solder paste

sot323_fr

2.65

2.35 0.6

(3×)

0.5

(3×)

0.55

(3×)

1.325

1.85

1.3

Dimensions in mm

sot323_fw

3.65 2.1

1.425

(3×)

4.6

(2×)

2.575

1.8

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

Product data sheet Rev. 5 — 6 March 2012 8 of 11

NXP Semiconductors 1PS301

Dual high-speed switching diode

12. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

1PS301 v.5 20120306 Product data sheet - 1PS301 v.4

Modifications: •The format of this document has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Section 1.1 “General description”: amended

•Table 1 “Quick reference data”: added

•Section 4 “Marking”: updated

•Section 8 “Test in f ormation”: added

•Figure 7: superseded by minimized package outline drawing

•Section 10 “Packing information”: added

•Section 11 “Soldering”: added

•Section 13 “Legal information”: updated

1PS301 v.4 19990506 Product data sheet - 1PS301 v.3

1PS301 v.3 19961004 Product specification - 1PS301 v.2

1PS301 v.2 19960903 Product specification - 1PS301 v.1

1PS301 v.1 19960403 Product specification - -

Product data sheet Rev. 5 — 6 March 2012 9 of 11

NXP Semiconductors 1PS301

Dual high-speed switching diode

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still unde r

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short dat a sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those descri bed in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

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contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semi conductors’ aggreg ate and cumulative liabil ity towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

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authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for il lustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconduc tors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Not hing in this document may be interpret ed or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyri ghts, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the obj ective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 5 — 6 March 2012 10 of 11

NXP Semiconductors 1PS301

Dual high-speed switching diode

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All refe renced brands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors 1PS301

Dual high-speed switching diode

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 6 March 2012

Document identifier: 1PS301

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 5

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6

10 Packing information . . . . . . . . . . . . . . . . . . . . . 6

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

14 Contact information. . . . . . . . . . . . . . . . . . . . . 10

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11