Model 2425B50-100J Preliminary Xinger Balun 50 to 200 Balanced Description The 2425B50-100J is a low profile sub-miniature balanced to unbalanced transformer designed for differential inputs and output locations on next generation wireless chipsets in an easy to use surface mount package covering 802.11b+g. The 2425B50-100J is ideal for high volume manufacturing and is higher performance than traditional ceramic, and lumped element baluns. The 2425B50100J has an unbalanced port impedance of 50 and a 200 balanced port impedance*. This transformation enables single ended signals to be applied to differential ports on modern integrated chipsets. The output ports have equal amplitude (-3dB) with 180 degree phase differential. The 2425B50-100J is available on tape and reel for pick and place high volume manufacturing. ELECTRICAL SPECIFICATIONS** Features: * * * * * * * * * 2.4 - 2.5 GHz 180 Transformer 50 Ohm to 2 x 100 Ohm 802.11 b+g Compliant Low Insertion Loss Low Power Input to Output DC Isolation Surface Mountable Tape & Reel Frequency Unbalanced Port Impedance Balanced Port Impedance* Return Loss Insertion Loss GHz Ohms Ohms dB min dB max 2.4 - 2.5 50 200 10 1.0*** Amplitude Balance Phase Balance Power Handling JC dB max Degrees max Watts C / Watt C 2 18010 0.5 TBD -55 to +85 Operating Temp. **Specification based on performance of unit properly installed on microstrip printed circuit boards with 50 nominal impedance. Specifications subject to change without notice. * 50 reference to ground *** Insertion Loss stated at room temperature (1.1 dB Max at +85 C) Outline Drawing Top View (Near-side) .080.010 [2.030.25] Side View Bottom View (Far-side) .027.003 [0.700.08] .032.004 [0.820.10] .050.010 [1.270.25] Orientation Marker Denotes Pin Location Dimensions are in Inches [Millimeters] Mechanical Outline Orientation Marker Denotes Pin Location Pin Designation 1 In 2 GND / DC Feed + RF GND 3 Out 1 4 Out 2 5 GND 6 NC 1 2 2X .014.004 [0.350.10] 3 6X .008.004 [0.200.10] 6 5 6X .012.004 [0.300.10] 4 Tolerances are Non-Cumulative Available on Tape and Reel For Pick and Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model 2425B50-100J Preliminary Typical Broadband Performance: 2.0 GHz. to 3.0 GHz. Pin Configuration: The internal configuration of the Xinger balun is diagramed to the left; the unbalanced port is terminated in an open-circuit and the two balanced ports are connected to ground. The ground connection for the two balanced ports are connected together and brought out on a common pin of the balun. This pin is labeled "DC/RF ground". For many chipset applications there is an opportunity to use this configuration as a single bias point if applicable. The use of differential circuits is increasing in highly integrated circuits, because of its inherent noise immunity properties. Differential circuits have superior performance when looking at properties like cross coupling, immunity to external noise sources and power supply noise. When designing power amplifiers nd rd differential circuits also help minimize 2 and 3 order intermodulation products. The construction of the Xinger balun is bonded multi-layered stripline made of low loss dielectric material with plated through vias connecting the internal circuitry to the external printed circuit board, similar to that of the Xinger hybrids and directional couplers. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Available on Tape and Reel For Pick and Place Manufacturing. Model 2425B50-100J Preliminary Typical Performance: 2.35 GHz. to 2.55 GHz. Mounting Configuration: 6X .012 [0.30] 6X .010 [0.25] 4X .014 [0.35] .033 [0.85] 6X .002 [0.05] 3X Transmission Line Circuit Pattern Footprint Pad (s) Solder Resist Dimensions are in Inches [Millimeters] Mounting Footprint Plated thru hole to ground In order for Xinger surface mount components to work optimally, there must be a 50 transmission line to the balanced port and 100 transmission lines from the unbalanced ports. If this condition is not satisfied, amplitude balance, insertion loss and VSWR may not meet published specifications. All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/oC An example of the PCB footprint used in the testing of these parts is shown to the left. in specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances. Available on Tape and Reel For Pick and Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model 2425B50-100J Preliminary Packaging and Ordering Information Parts are available in reel and are packaged per EIA 481-2. Parts are oriented in tape and reel as shown below. Minimum order quantities are 4000 per reel. See Model Numbers below for further ordering information. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Available on Tape and Reel For Pick and Place Manufacturing.