Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model 2425B50-100J
Preliminary
Xinger Balun
50Ω to 200Ω Balanced
Description
The 2425B50-100J is a low profile sub-miniature balanced to unbalanced
transformer designed for differential inputs and output locations on next generation
wireless chipsets in an easy to use surface mount package covering 802.11b+g.
The 2425B50-100J is ideal for high volume manufacturing and is higher
performance than traditional ceramic, and lumped element baluns. The 2425B50-
100J has an unbalanced port impedance of 50Ω and a 200Ω balanced port
impedance*. This transformation enables single ended signals to be applied to
differential ports on modern integrated chipsets. The output ports have equal
amplitude (-3dB) with 180 degree phase differential. The 2425B50-100J is available
on tape and reel for pick and place high volume manufacturing.
ELECTRICAL SPECIFICATIONS**
Frequency
Unbalanced
Port
Impedance
Balanced
Port
Impedance*
Return
Loss
Insertion
Loss
GHz Ohms Ohms dB min dB max
2.4 – 2.5 50 200 10 1.0***
Amplitude
Balance
Phase
Balance
Power
Handling
ΘJC
Operating
Temp.
dB max Degrees max Watts ºC / Watt ºC
Features:
• 2.4 – 2.5 GHz
• 180° Transformer
• 50 Ohm to 2 x 100 Ohm
• 802.11 b+g Compliant
• Low Insertion Loss
• Low Power
• Input to Output DC Isolation
• Surface Mountable
• Tape & Reel 2 180±10 0.5 TBD -55 to +85
**Specification based on performance of unit properly installed on microstrip printed circuit
boards with 50 Ω nominal impedance. Specifications subject to change without notice.
* 50Ω reference to ground
*** Insertion Loss stated at room temperature (1.1 dB Max at +85 ºC)
Outline Drawing
Mechanical Outline
Dimensions are in Inches [Millimeters]
Tolerances are Non-Cumulative
.050±.010
[1.27±0.25]
.080±.010
[2.03±0.25]
1 2 3
6 5 4
Bottom View (Far-side)Side ViewTop View (Near-side)
.027±.003
[0.70±0.08]
.032±.004
[0.82±0.10]6X .008±.004
[0.20±0.10]
6X .012±.004
[0.30±0.10]
+ RF GND
Pin
3
6
1
2
4
5
Designation
In
GND / DC Feed
Out 1
Out 2
GND
NC
2X .014±.004
[0.35±0.10]
Orientation
Marker Denotes
Pin Location
Orientation
Marker Denotes
Pin Location
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model 2425B50-100J
Preliminary
Typical Broadband Performance: 2.0 GHz. to 3.0 GHz.
Pin Configuration:
The internal configuration of the Xinger balun is diagramed to the
left; the unbalanced port is terminated in an open-circuit and the two
balanced ports are connected to ground. The ground connection for
the two balanced ports are connected together and brought out on a
common pin of the balun. This pin is labeled “DC/RF ground”. For
many chipset applications there is an opportunity to use this
configuration as a single bias point if applicable.
The use of differential circuits is increasing in highly integrated
circuits, because of its inherent noise immunity properties.
Differential circuits have superior performance when looking at
properties like cross coupling, immunity to external noise sources
and power supply noise. When designing power amplifiers
differential circuits also help minimize 2nd and 3rd order
intermodulation products.
The construction of the Xinger balun is bonded multi-layered
stripline made of low loss dielectric material with plated through vias
connecting the internal circuitry to the external printed circuit board,
similar to that of the Xinger hybrids and directional couplers.
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model 2425B50-100J
Preliminary
Typical Performance: 2.35 GHz. to 2.55 GHz.
Mounting Configuration:
Mounting Footprint
Dimensions are in Inches [Millimeters]
.033
[0.85]
6X .002
[0.05]
6X .010
[0.25]
6X .012
[0.30]
4X .014
[0.35]
Plated thru
hole to
ground
3X Transmission
Line
Circuit Pattern
Footprint Pad (s)
Solder Resist
In order for Xinger surface mount components to work
optimally, there must be a 50Ω transmission line to the
balanced port and 100Ω transmission lines from the
unbalanced ports. If this condition is not satisfied, amplitude
balance, insertion loss and VSWR may not meet published
specifications.
All of the Xinger components are constructed from ceramic
filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal coefficient
of expansion (CTE) of 17 ppm/oC
An example of the PCB footprint used in the testing of these
parts is shown to the left. in specific designs, the
transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying
pick and place equipment tolerances.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model 2425B50-100J
Preliminary
Packaging and Ordering Information
Parts are available in reel and are packaged per EIA 481-2. Parts are oriented in tape and reel as shown below. Minimum order
quantities are 4000 per reel. See Model Numbers below for further ordering information.
