Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS Product information in this catalog is as of October 2015. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that TAIYO YUDEN CO., LTD. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. Please contact TAIYO YUDEN CO., LTD. for further details of product specifications as the individual specification is available. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact TAIYO YUDEN CO., LTD. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called TAIYO YUDEN s official sales channel ). It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel. Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. TAIYO YUDEN CO., LTD. grants no license for such rights. Caution for export Certain items in this catalog may require specific procedures for export according to Foreign Exchange and Foreign Trade Control Law of Japan, U.S. Export Administration Regulations , and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. 16 METAL CORE SMD POWER INDUCTORS(MCOILTM MD SERIES) METAL CORE SMD POWER INDUCTORSMCOILTM MD SERIES REFLOW REFLOW PARTS NUMBER M D K K Series name Code MD *Operating Temp.-40+125Including self-generated heat 1 6 1 6 T 1 R 0 M M Nominal inductance Code example R47 1R0 4R7 RDecimal point Series name Metal base coil specification DimensionsLxW Code 1616 2020 3030 4040 5050 DimensionsHmm 0.95 1.0 1.2 1.4 2.0 0.47 1.0 4.7 Inductance tolerance Code M N Inductance tolerance 20 30 Special code Code F M DimensionsLxWmm 1.6x1.6 2.0x2.0 3.0x3.0 4.0x4.0 4.9x4.9 Packaging Code T Nominal inductanceH POWER INDUCTORS INDUCTORS DimensionsH Code JE KK MK PK WK Blank space Special code Ferrite coating Metal coating Internal code Packaging Taping STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY e Recommended Land Patterns B f L e W C H A A Type MDKK1616 MDJE2020 MDKK2020 MDMK2020 MDKK3030 MDMK3030 MDJE4040 MDMK4040 MDWK4040 MDPK5050 A 0.5 B 1.1 C 0.65 0.65 1.35 2.0 0.8 2.2 2.7 1.2 2.8 3.7 1.5 3.6 4.2 Unitmm Type MDKK1616 MDJE2020 MDKK2020 MDMK2020 MDKK3030 MDMK3030 MDJE4040 MDMK4040 MDWK4040 MDPK5050 L W H e f 1.640.1 (0.0650.004) 2.00.15 (0.0790.006) 2.00.15 (0.0790.006) 2.00.15 (0.0790.006) 3.00.1 (0.1180.004) 3.00.1 (0.1180.004) 4.00.2 (0.1570.008) 4.00.2 (0.1570.008) 4.00.2 (0.1570.008) 4.90.2 (0.1930.008) 1.640.1 (0.0650.004) 2.00.15 (0.0790.006) 2.00.15 (0.0790.006) 2.00.15 (0.0790.006) 3.00.1 (0.1180.004) 3.00.1 (0.1180.004) 4.00.2 (0.1570.008) 4.00.2 (0.1570.008) 4.00.2 (0.1570.008) 4.90.2 (0.1930.008) 1.0 max (0.039 max) 0.95 max (0.0374 max) 1.0 max (0.039 max) 1.2 max (0.047 max) 1.0 max (0.039 max) 1.2 max (0.047 max) 0.95 max (0.0374 max) 1.2 max (0.047 max) 2.0 max (0.0787 max) 1.4 max (0.055 max) 0.40 0.2/0.1 (0.016 +0.008/-0.004) 0.500.2 (0.020.008) 0.500.2 (0.020.008) 0.500.2 (0.020.008) 0.900.2 (0.0350.008) 0.900.2 (0.0350.008) 1.10.2 (0.0430.008) 1.10.2 (0.0430.008) 1.10.2 (0.0430.008) 1.200.2 (0.0470.008) 1.00.2 (0.0390.008) 1.250.2 (0.0490.008) 1.250.2 (0.0490.008) 1.250.2 (0.0490.008) 1.90.2 (0.0750.008) 1.90.2 (0.0750.008) 2.50.2 (0.0980.008) 2.50.2 (0.0980.008) 2.50.2 (0.0980.008) 3.30.2 (0.1300.008) Standard quantity pcs Taping 2500 2500 2500 2500 2000 2000 1000 1000 1000 1000 Unitmminch i_smd_MD_e-E04R01 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 16 43 PARTS NUMBER MDKK1616 type EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.47 1.0 1.5 2.2 3.3 4.7 6.8 10 15 20 20 20 20 20 20 20 20 20 - 0.095 0.140 0.185 0.250 0.515 0.640 0.820 1.120 1.800 Parts number EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. MDJE2020T1R0MM MDJE2020T2R2MM MDJE2020T3R3MM MDJE2020T4R7MM MDJE2020T6R8MM MDJE2020T100MM RoHS RoHS RoHS RoHS RoHS RoHS 1.0 2.2 3.3 4.7 6.8 10 20 20 20 20 20 20 - 0.121 0.266 0.340 0.475 0.630 1.040 EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.47 0.68 1.0 1.5 2.2 3.3 4.7 10 15 20 20 20 20 20 20 20 20 20 - 0.046 0.060 0.085 0.133 0.165 0.275 0.435 0.690 1.180 EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.47 0.68 1.0 1.5 2.2 3.3 4.7 20 20 20 20 20 20 20 - 0.046 0.058 0.064 0.086 0.109 0.178 0.242 EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.47 1.0 1.5 2.2 3.3 4.7 6.8 10 20 20 20 20 20 20 20 20 - 0.039 0.086 0.100 0.144 0.248 0.345 0.437 0.575 EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.30 0.33 0.47 1.0 1.5 2.2 3.3 4.7 20 20 20 20 20 20 20 20 - 0.020 0.020 0.027 0.050 0.074 0.112 0.167 0.263 Parts number MDKK1616TR47MM MDKK1616T1R0MM MDKK1616T1R5MM MDKK1616T2R2MM MDKK1616T3R3MM MDKK1616T4R7MM MDKK1616T6R8MM MDKK1616T100MM MDKK1616T150MM Rated current A Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 3,300 1,500 1 2,200 1,200 1 1,750 1,100 1 1,500 950 1 1,150 650 1 950 550 1 630 520 1 550 450 1 460 400 1 MDJE2020 type POWER INDUCTORS INDUCTORS Rated current A Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 3,100 1,550 1 1,550 1,050 1 1,350 950 1 1,200 850 1 800 750 1 700 550 1 MDKK2020 type Parts number MDKK2020TR47MM MDKK2020TR68MM MDKK2020T1R0MM MDKK2020T1R5MM MDKK2020T2R2MM MDKK2020T3R3MM MDKK2020T4R7MM MDKK2020T100MM MDKK2020T150MM Rated current A Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 3,500 2,200 1 3,200 2,000 1 2,900 1,700 1 1,900 1,350 1 1,650 1,200 1 1,300 940 1 1,050 750 1 750 630 1 550 480 1 MDMK2020 type Parts number MDMK2020TR47MM MDMK2020TR68MM MDMK2020T1R0MM MDMK2020T1R5MM MDMK2020T2R2MM MDMK2020T3R3MM MDMK2020T4R7MM Rated current A Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 4,200 2,300 1 3,500 2,000 1 2,550 1,900 1 2,000 1,650 1 1,750 1,450 1 1,350 1,150 1 1,150 950 1 MDKK3030 type Parts number MDKK3030TR47MM MDKK3030T1R0MM MDKK3030T1R5MM MDKK3030T2R2MM MDKK3030T3R3MM MDKK3030T4R7MM MDKK3030T6R8MM MDKK3030T100MM Rated current A Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 5,400 3,900 1 4,400 2,400 1 3,000 2,100 1 2,500 1,900 1 2,000 1,350 1 1,700 1,150 1 1,400 1,000 1 1,100 850 1 MDMK3030 type Parts number MDMK3030TR30MM MDMK3030TR33MM MDMK3030TR47MM MDMK3030T1R0MM MDMK3030T1R5MM MDMK3030T2R2MM MDMK3030T3R3MM MDMK3030T4R7MM Rated current A Saturation current Temperature rise current Idc2 Idc1 7,600 5,500 6,400 5,500 6,300 4,700 4,300 3,300 3,400 2,500 2,800 2,100 2,100 1,650 1,800 1,350 Measuring frequencyMHz 1 1 1 1 1 1 1 1 i_smd_MD_e-E04R01 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 44 16 PARTS NUMBER MDJE4040 type Parts number EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. MDJE4040TR47MM MDJE4040T1R0MM MDJE4040T1R5MM MDJE4040T2R2MM MDJE4040T3R3MM MDJE4040T4R7MM MDJE4040T6R8MM MDJE4040T100MM RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.47 1.0 1.5 2.2 3.3 4.7 6.8 10 20 20 20 20 20 20 20 20 - 0.040 0.069 0.084 0.115 0.200 0.250 0.370 0.510 EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS 0.47 1.0 1.2 1.5 2.2 20 20 20 20 20 - 0.029 0.047 0.047 0.065 0.092 EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.68 1.0 1.5 2.2 3.3 4.7 6.8 10 20 20 20 20 20 20 20 20 - 0.029 0.036 0.065 0.079 0.130 0.160 0.230 0.330 EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.10 0.18 0.22 0.33 0.47 0.68 1.0 1.5 2.2 3.3 4.7 6.8 10 20 20 20 20 20 20 20 20 20 20 20 20 20 - 0.0070 0.0098 0.0098 0.013 0.013 0.016 0.027 0.041 0.054 0.075 0.107 0.158 0.194 EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS 1.0 2.2 3.3 4.7 6.8 10 20 20 20 20 20 20 - 0.040 0.055 0.086 0.102 0.138 0.225 Rated current A Saturation current Temperature rise current Idc2 Idc1 6,000 4,000 4,700 3,000 3,000 2,700 2,400 2,400 2,000 1,800 1,900 1,600 1,500 1,300 1,400 1,100 Measuring frequencyMHz 1 1 1 1 1 1 1 1 MDMK4040 type Parts number Measuring frequencykHz 100 100 100 100 100 MDMK4040M type Parts number MDMK4040TR68MM MDMK4040T1R0MM MDMK4040T1R5MM MDMK4040T2R2MM MDMK4040T3R3MM MDMK4040T4R7MM MDMK4040T6R8MM MDMK4040T100MM Rated current A Saturation current Temperature rise current Idc2 Idc1 6,700 5,000 5,000 4,500 4,500 3,200 3,800 2,800 3,200 2,200 2,500 1,900 1,900 1,600 1,700 1,400 Measuring frequencyMHz 1 1 1 1 1 1 1 1 MDWK4040M type Parts number MDWK4040TR10MM MDWK4040TR18MM MDWK4040TR22MM MDWK4040TR33MM MDWK4040TR47MM MDWK4040TR68MM MDWK4040T1R0MM MDWK4040T1R5MM MDWK4040T2R2MM MDWK4040T3R3MM MDWK4040T4R7MM MDWK4040T6R8MM MDWK4040T1R0MM Rated current A Saturation current Temperature rise current Idc2 Idc1 21,000 12,000 19,000 9,200 17,000 9,200 16,000 7,800 10,000 7,800 8,000 7,300 7,000 5,100 7,000 4,100 5,400 3,500 3,700 3,000 3,500 2,500 2,900 2,000 2,200 1,600 Measuring frequencyMHz 1 1 1 1 1 1 1 1 1 1 1 1 1 POWER INDUCTORS INDUCTORS MDMK4040TR47MF MDMK4040T1R0MF MDMK4040T1R2MF MDMK4040T1R5MF MDMK4040T2R2MF Rated current A Saturation current Temperature rise current Idc2 Idc1 7,500 4,600 5,200 3,500 4,200 3,500 3,700 3,300 3,200 2,500 MDPK5050 type Parts number MDPK5050T1R0MM MDPK5050T2R2MM MDPK5050T3R3MM MDPK5050T4R7MM MDPK5050T6R8MM MDPK5050T100MM Rated current A Saturation current Temperature rise current Idc2 Idc1 8,500 4,300 4,100 3,600 3,800 2,900 3,500 2,500 2,700 2,200 2,200 2,000 Measuring frequencyMHz 1 1 1 1 1 1 The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20) The temperature rise current valueIdc2) is the DC current value having temperature increase up to 40. (at 20) The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value. i_smd_MD_e-E04R01 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 16 45 METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES PACKAGING Minimum Quantity Type MDKK1616 MDJE2020 MDKK2020 MDMK2020 MDKK3030 MDMK3030 MDJE4040 MDMK4040 MDWK4040 MDPK5050 Standard Quantity [pcs] Tape Reel 2500 2500 2000 1000 1000 Tape Material Embossed Tape Top tape Chip Filled Sprocket hole Base tape Chip cavity Chip Taping dimensions Embossed tape 8mm wide (0.315 inches wide) Electrode (bottom view) Type MDKK1616 MDJE2020 MDKK2020 MDMK2020 MDKK3030 MDMK3030 Chip cavity A B 1.790.1 1.790.1 (0.0710.004) (0.0710.004) Insertion pitch F 4.00.1 (0.1570.004) Tape thickness T K 0.250.05 1.10.1 (0.0100.002) (0.0430.004) 2.20.1 0.1020.004 2.20.1 0.1020.004 4.00.1 0.1570.004 0.250.05 0.0090.002 1.30.1 0.0510.004 3.20.1 (0.1260.004) 3.20.1 (0.1260.004) 4.00.1 (0.1570.004) 0.30.05 (0.0120.002) 1.40.1 (0.0550.004) Unitmminch This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_pack_e-E04R01 Embossed tape 12mm wide (0.47 inches wide) Electrode (bottom view) A B Insertion pitch F T K MDJE4040 MDMK4040 MDWK4040 4.30.1 0.1690.004 4.30.1 0.1690.004 8.00.1 0.3150.004 0.30.1 0.0120.004 1.60.1 0.0630.004 MDPK5050 5.250.1 0.2070.004 5.250.1 0.2070.004 8.00.1 0.3150.004 0.30.1 0.0120.004 1.60.1 0.0630.004 Type Chip cavity Tape thickness Unitmminch Leader and Blank portion Reel size Type MDKK1616 MDJE2020 MDKK2020 MDMK2020 MDKK3030 MDMK3030 MDJE4040 MDMK4040 MDWK4040 MDPK5050 D Reel size (Reference values) d W 1800.5 7.0870.019 601.0 2.360.04 10.01.5 0.3940.059 1803.0 7.0870.118 602.0 2.360.08 14.01.5 0.5510.059 Unitmminch This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_pack_e-E04R01 Top Tape Strength Top tape strength Type MDKK1616 MDJE2020 MDKK2020 MDMK2020 MDKK3030 MDMK3030 MDJE4040 MDMK4040 MDWK4040 MDPK5050 Peel-off strength 0.1N1.0N 0.1N1.3N This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_pack_e-E04R01 METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES RELIABILITY DATA 1. Operating Temperature Range Specified Value MD series 40125 Test Methods and Remarks Including self-generated heat 2. Storage Temperature Range Specified Value MD series Test Methods and Remarks 4085 5 to 40 for the product with taping. 3. Rated current Specified Value MD series Within the specified tolerance 4. Inductance Specified Value Test Methods and Remarks MD series Measuring equipment Measuring condition Within the specified tolerance : LCR Meter HP 4285A or equivalent : Please see item list. 5. DC Resistance Specified Value MD series Test Methods and Remarks Measuring equipment Within the specified tolerance : DC ohmmeter HIOKI 3227 or equivalent 6. Self resonance frequency Specified Value MD series 7. Temperature characteristic Specified Value MD series Test Methods and Remarks Measurement of inductance shall be taken at temperature range within 40125. With reference to inductance value at 20., change rate shall be calculated. Inductance change : Within 10% 8. Resistance to flexure of substrate Specified Value Test Methods and Remarks MD series No damage The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating until deflection of the test board reaches to 2 mm. Test board size : 100x40x1.0 mm Test board material : Glass epoxy-resin Solder cream thickness : 0.10 mm 9. Insulation resistance : between wires Specified Value MD series 10. Insulation resistance : between wire and core Specified Value MD series 11. Withstanding voltage : between wire and core Specified Value MD series This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_reli_e-E04R01 12. Adhesion of terminal electrode Specified Value MD series Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. Applied force : 10N to X and Y directions. Duration : 5s. Solder cream thickness Shall not come off PC board : 0.10mm. 13. Resistance to vibration Inductance change : Within 10% No significant abnormality in appearance. Specified Value MD series Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. Then it shall be submitted to below test conditions. Frequency Range 1055Hz Total Amplitude 1.5mm (May not exceed acceleration 196m/s2) Sweeping Method 10Hz to 55Hz to 10Hz for 1min. X Time Y For 2 hours on each X, Y, and Z axis. Z Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 14. Solderability Specified Value MD series Test Methods and Remarks The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table. Flux : Methanol solution containing rosin 25%. Solder Temperature 2455 Time 51.0 sec. Immersion depth : All sides of mounting terminal shall be immersed. At least 90 of surface of terminal electrode is covered by new solder. 15. Resistance to soldering heat Inductance change : Within 10% No significant abnormality in appearance. Specified Value MD series Test Methods and Remarks The test sample shall be exposed to reflow oven at 2305 for 40 seconds, with peak temperature at 2605 for 5 seconds, 2 times. Test board material : Glass epoxy-resin Test board thickness : 1.0mm 16. Thermal shock Inductance change : Within 10% No significant abnormality in appearance. Specified Value MD series Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles. Conditions of 1 cycle Step Temperature () Duration (min) 1 403 303 2 Room temperature Within 3 3 852 303 4 Room temperature Within 3 17. Damp heat Specified Value Test Methods and Remarks MD series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table. Temperature 602 Humidity 9095%RH Time 50024/0 hour This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_reli_e-E04R01 18. Loading under damp heat Specified Value Test Methods and Remarks MD series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current continuously as shown in below table. Temperature 602 Humidity 9095RH Applied current Rated current Time 50024/0 hour 19. Low temperature life test Specified Value Test Methods and Remarks MD series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below table. Temperature 402 Time 50024/0 hour 20. High temperature life test Specified Value MD series 21. Loading at high temperature life test Specified Value Test Methods and Remarks MD series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and applied the rated current continuously as shown in below table. Temperature 852 Applied current Rated current Time 50024/0 hour 22. Standard condition Specified Value MD series Standard test condition : Unless otherwise specified, temperature is 2015 and 6520of relative humidity. When there is any question concerning measurement result: In order to provide correlation data, the test shall be condition of 202 of temperature, 655% relative humidity. Inductance is in accordance with our measured value. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_reli_e-E04R01 METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES PRECAUTIONS 1. Circuit Design Precautions Operating environment 1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. 2. PCB Design Precautions Technical considerations Land pattern design 1. Please refer to a recommended land pattern. Land pattern design Surface Mounting Mounting and soldering conditions should be checked beforehand. Applicable soldering process to this products is reflow soldering only. 3. Considerations for automatic placement Precautions Technical considerations Adjustment of mounting machine 1. Excessive impact load should not be imposed on the products when mounting onto the PC boards. 2. Mounting and soldering conditions should be checked beforehand. Adjustment of mounting machine 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. 4. Soldering Precautions Reflow soldering 1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. 2. The product shall be used reflow soldering only. 3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering. Lead free soldering 1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc sufficiently. Recommended conditions for using a soldering iron (NR10050 Type) Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350 Duration - 3 seconds or less The soldering iron should not directly touch the inductor. Reflow soldering 1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. NR30/40/50/60/80, NRV20/30, NRH24/30, NRS20/40/50/60/80 Type, NR10050 Type, NS101/125 Type Recommended reflow condition (Pb free solder) Technical considerations 5. Cleaning Precautions Technical considerations Cleaning conditions 1. Washing by supersonic waves shall be avoided. Cleaning conditions 1. If washed by supersonic waves, the products might be broken. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_prec_e-E02R01 6. Handling Precautions Handling 1. Keep the product away from all magnets and magnetic objects. Breakaway PC boards (splitting along perforations) 1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. Mechanical considerations 1. Please do not give the product any excessive mechanical shocks. 2. Please do not add any shock and power to a product in transportation. Pick-up pressure 1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part. Packing 1. Please avoid accumulation of a packing box as much as possible. Board mounting 1. There shall be no pattern or via between terminals at the bottom of product. 2. Components which are located in peripheral of product shall not make contact with surface (top, side) of product. Technical considerations Handling 1. There is a case that a characteristic varies with magnetic influence. Breakaway PC boards (splitting along perforations) 1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs. Mechanical considerations 1. There is a case to be damaged by a mechanical shock. 2. There is a case to be broken by the handling in transportation. Pick-up pressure 1. Damage and a characteristic can vary with an excessive shock or stress. Packing 1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products. Board mounting 1. If there is pattern or via between terminals at the bottom of product, it may cause characteristics change. 2. If components which are located in peripheral of product make contact with surface (top, side) of product, it may cause damage or characteristics change. 7. Storage conditions Precautions Storage 1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled. Recommended conditions Ambient temperature : 540 Humidity : Below 70% RH The ambient temperature must be kept below 30. Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, product should be used within 6 months from the time of delivery. In case of storage over 6 months, solderability shall be checked before actual usage. Technical considerations Storage 1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_smd_MD_prec_e-E02R01 METAL CORE WIRE-WOUND CHIP POWER INDUCTORS(MCOILTM MA SERIES) METAL CORE WIRE-WOUND CHIP POWER INDUCTORSMCOILTM MA SERIES REFLOW REFLOW PARTS NUMBER M A K * Operating Temp.-40+105Including self-generated heat K 2 Series name Code MA 0 1 6 T 1 R 0 M POWER INDUCTORS INDUCTORS Nominal inductance Code example R47 1R0 4R7 RDecimal point Series name Metal Core Wire-wound Chip Power Inductor DimensionsT Code KK MK DimensionsTmm 1.0 1 .2 DimensionsLxW Code 2016 2520 Nominal inductanceH 0.47 1.0 4.7 Inductance tolerance Code M DimensionsLxWmm 2 .0x1.6 2 .5x2.0 Packaging Code T Blank space Inductance tolerance 20 Special code Code Packaging Taping Special code Standard Internal code STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY Type L W MAKK2016 T MAKK2520 e MAMK2520 L W T e 2.00.1 0.0790.004 2.50.2 0.0980.008 2.50.2 0.0980.008 1.60.1 0.0630.004 2.00.2 0.0790.008 2.00.2 0.0790.008 1.0 max 0.039 max 1.0 max 0.039 max 1.2 max 0.047 max 0.50.3 0.0200.012 0.50.3 0.0200.012 0.50.3 0.0200.012 Standard quantity pcs Taping 3000 3000 3000 Unitmminch PARTS NUMBER MAKK2016 type EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.24 0.47 0.68 1.0 1.5 2.2 3.3 4.7 20 20 20 20 20 20 20 20 - 0.042 0.460 0.065 0.075 0.130 0.160 0.255 0.380 EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS 0.47 0.68 1.0 2.2 4.7 20 20 20 20 20 - 0.046 0.059 0.072 0.156 0.300 Parts number EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. MAMK2520TR47M MAMK2520TR68M MAMK2520T1R0M MAMK2520T2R2M MAMK2520T3R3M MAMK2520T4R7M RoHS RoHS RoHS RoHS RoHS RoHS 0.47 0.68 1 2.2 3.3 4.7 20 20 20 20 20 20 - 0.039 0.048 0.059 0.110 0.156 0.260 Parts number MAKK2016TR24M MAKK2016TR47M MAKK2016TR68M MAKK2016T1R0M MAKK2016T1R5M MAKK2016T2R2M MAKK2016T3R3M MAKK2016T4R7M Rated current Amax. Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 4,200 3,000 2 3,200 2,800 2 2,500 2,500 2 2,200 2,200 2 1,600 1,650 2 1,500 1,500 2 1,150 1,200 2 1,000 950 2 MAKK2520 type Parts number MAKK2520TR47M MAKK2520TR68M MAKK2520T1R0M MAKK2520T2R2M MAKK2520T4R7M Rated current Amax. Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 3,900 3,200 2 3,700 2,900 2 2,700 2,500 2 1,900 1,500 2 1,300 1,100 2 MAMK2520 type The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20) The temperature rise current valueIdc2) is the DC current value having temperature increase by 40. (at 20) The rated current value is following either Idc1 or Idc2, which is the lower one. Rated current Amax. Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 4,200 3,400 2 3,200 3,200 2 3,100 2,700 2 2,000 1,900 2 1,800 1,700 2 1,500 1,300 2 i_wound_MA_e-E04R01 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 46 16 METAL CORE WIRE-WOUND CHIP POWER INDUCTORS(MCOILTM MA-H SERIES) METAL CORE WIRE-WOUND CHIP POWER INDUCTORSMCOILTM MA-H SERIES REFLOW REFLOW PARTS NUMBER M A K * Operating Temp.-40+125Including self-generated heat K 2 0 Series name Code MA 6 H 1 R 0 M Nominal inductanceH 0.47 1.0 4.7 Inductance tolerance Code M DimensionsLxWmm 2 .0x1.6 2 .5x2.0 Inductance tolerance 20 Special code Code Packaging or Special specification TapingHigh characteristics Special code Standard Internal code STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY Type L W MAKK2016H T MAKK2520H e MAMK2520H Standard quantity pcs Taping L W T e 2.00.1 0.0790.004 2.50.2 0.0980.008 2.50.2 0.0980.008 1.60.1 0.0630.004 2.00.2 0.0790.008 2.00.2 0.0790.008 1.0 max 0.039 max 1.0 max 0.039 max 1.2 max 0.047 max 0.50.3 0.0200.012 0.50.3 0.0200.012 0.50.3 0.0200.012 3000 POWER INDUCTORS INDUCTORS DimensionsTmm 1.0 1 .2 DimensionsLxW Code 2016 2520 Blank space Nominal inductance Code example R47 1R0 4R7 RDecimal point Series name Metal Core Wire-wound Chip Power Inductor DimensionsT Code KK MK Packaging Code H 1 3000 3000 Unitmminch PARTS PARTS NUMBER NUMBER MAKK2016H MAKK2016H type type EHS EHS Nominal Nominal inductance inductance H H Inductance Inductance tolerance tolerance RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.24 0.24 0.33 0.33 0.47 0.47 0.68 0.68 1.0 1.0 20 20 20 20 20 20 20 20 20 20 EHS EHS Nominal Nominal inductance inductance H H Inductance Inductance tolerance tolerance RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.33 0.33 0.47 0.47 0.68 0.68 1.0 1.0 2.2 2.2 20 20 20 20 20 20 20 20 20 20 Parts Parts number number EHS EHS Nominal Nominal inductance inductance H H Inductance Inductance tolerance tolerance MAMK2520HR47M MAMK2520HR47M MAMK2520HR68M MAMK2520HR68M MAMK2520H1R0M MAMK2520H1R0M MAMK2520H1R5M MAMK2520H1R5M MAMK2520H2R2M MAMK2520H2R2M RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.47 0.47 0.68 0.68 1.0 1.0 1.5 1.5 2.2 2.2 20 20 20 20 20 20 20 20 20 20 Parts Parts number number MAKK2016HR24M MAKK2016HR24M MAKK2016HR33M MAKK2016HR33M MAKK2016HR47M MAKK2016HR47M MAKK2016HR68M MAKK2016HR68M MAKK2016H1R0M MAKK2016H1R0M Self-resonant Self-resonant frequency frequency MHmin. MHmin. ------ DC DC Resistance Resistance max. max. 0.026 0.026 0.030 0.030 0.036 0.036 0.050 0.050 0.070 0.070 MAKK2520H MAKK2520H type type Parts Parts number number MAKK2520HR33M MAKK2520HR33M MAKK2520HR47M MAKK2520HR47M MAKK2520HR68M MAKK2520HR68M MAKK2520H1R0M MAKK2520H1R0M MAKK2520H2R2M MAKK2520H2R2M Self-resonant Self-resonant frequency frequency MHmin. MHmin. ------ DC DC Resistance Resistance max. max. 0.026 0.026 0.029 0.029 0.043 0.043 0.053 0.053 0.120 0.120 MAMK2520H MAMK2520H type type Self-resonant Self-resonant frequency frequency MHmin. MHmin. ------ DC DC Resistance Resistance max. max. 0.026 0.026 0.036 0.036 0.045 0.045 0.065 0.065 0.090 0.090 Rated Rated current current Amax. Amax. Measuring Measuring Saturation Temperature Saturation current current Temperature rise rise current current frequencyMHz frequencyMHz Idc2 Idc1 Idc2 Idc1 5,800 4,000 22 5,800 4,000 4,700 3,500 4,700 3,500 22 4,300 3,300 4,300 3,300 22 3,200 2,700 3,200 2,700 22 2,700 2,300 2,700 2,300 22 Rated Rated current current Amax. Amax. Measuring Measuring Saturation current current Temperature Saturation Temperature rise rise current current frequencyMHz frequencyMHz Idc2 Idc1 Idc2 Idc1 6200 4300 22 6200 4300 5700 4000 22 5700 4000 4300 3400 22 4300 3400 3800 3000 22 3800 3000 2500 1800 22 2500 1800 Rated Rated current current Amax. Amax. Measuring Measuring Saturation Temperature Saturation current current Temperature rise rise current current frequencyMHz frequencyMHz Idc2 Idc1 Idc2 Idc1 5800 4100 22 5800 4100 5100 3500 22 5100 3500 4300 3100 22 4300 3100 3300 2600 22 3300 2600 2800 2200 22 2800 2200 The The saturation saturation current current value value (Idc1) (Idc1) is is the the DC DC current current value value having having inductance inductance decrease decrease down down to to 30%. 30%. (at (at 20) 20) The The temperature temperature rise rise current current valueIdc2) valueIdc2) is is the the DC DC current current value value having having temperature temperature increase increase by by 40. 40. (at (at 20) 20) The rated current value is following either Idc1 or Idc2, which is the lower one. The rated current value is following either Idc1 or Idc2, which is the lower one. i_wound_MA-H_e-E04R01 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 16 47 METAL CORE WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM MA SERIES / MCOILTM MA- SERIES) PACKAGING Minimum Quantity Type MAKK2016 MAKK2520 MAMK2520 Standard Quantity [pcs] Tape Reel 3000 3000 3000 Tape Material Embossed Tape Top tape Chip Filled Sprocket hole Base tape Chip cavity Chip Taping dimensions Embossed tape 8mm wide (0.315 inches wide) Type MAKK2016 MAKK2520 MAMK2520 Chip cavity A B 1.90.1 2.30.1 0.0750.004 0.0910.004 2.30.1 2.80.1 (0.0910.004) (0.1100.004) 2.30.1 2.80.1 (0.0910.004) (0.1100.004) Insertion pitch F 4.00.1 0.1570.004 4.00.1 0.1570.004 4.00.1 (0.1570.004) Tape thickness T K 0.250.05 1.1 max 0.0090.002 0.043 max 0.30.05 1.1 max (0.0120.002) 0.043 max 0.30.05 1.45 max (0.0120.002) (0.057 max) Unitmminch Leader and Blank portion Blank portions Chip cavity Blank portions Leader Direction of tape feed 160 mm or more 160 mm 200 mm 400 mm 560 mm This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MA_pack_e-E04R01 Reel size Type MAKK2016 MAKK2520 MAMK2520 D Reel size (Reference values) d W 180+0/-3 7.087+0/-0.118 60+1/-0 2.36+0.039/0 10.01.5 0.3940.059 Unitmminch Top Tape Strength The top The top tape requires a peel-off force of 0.1 to 1.2N in the direction of the arrow as illustrated below. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MA_pack_e-E04R01 METAL CORE WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM MA SERIES / MCOILTM MA- SERIES) RELIABILITY DATA 1. Operating Temperature Range Specified Value Test Methods and Remarks MA series 40105 MA-H series 40125 Including self-generated heat 2. Storage Temperature Range Specified Value Test Methods and Remarks MA series 4085 MA-H series 0 to 40 for the product with taping. 3. Rated current Specified Value MA series MA-H series Within the specified tolerance 4. Inductance Specified Value Test Methods and Remarks MA series MA-H series Measuring equipment Measuring frequency Within the specified tolerance : LCR Meter HP 4285A or equivalent : 2MHz1V 5. DC Resistance Specified Value Test Methods and Remarks MA series MA-H series Measuring equipment Within the specified tolerance : DC ohmmeter HIOKI 3227 or equivalent 6. Self resonance frequency Specified Value MA series MA-H series 7. Temperature characteristic Specified Value Test Methods and Remarks MA series MA-H series Inductance change : Within 15% Measurement of inductance shall be taken at temperature range within 4085. With reference to inductance value at 20., change rate shall be calculated. 8. Resistance to flexure of substrate Specified Value Test Methods and Remarks MA series MA-H series No damage The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating until deflection of the test board reaches to 2 mm. Test board size : 100x40x1.0 mm Test board material : Glass epoxy-resin Solder cream thickness : 0.12 mm This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MA_reli_e-E04R01 9. Insulation resistance : between wires Specified Value MA series MA-H series 10. Insulation resistance : between wire and core Specified Value MA series MA-H series MAKK2016MAMK2520 DC25V 100k min MAKK2520 DC20V 100k min 11. Withstanding voltage : between wire and core Specified Value MA series MA-H series 12. Adhesion of terminal electrode Specified Value Test Methods and Remarks MA series MA-H series No abnormality. The test samples shall be soldered to the test board by the reflow. Applied force : 10N to X and Y directions. Duration : 5s. Solder cream thickness : 0.12mm. 13. Resistance to vibration Specified Value Test Methods and Remarks MA series MA-H series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. Then it shall be submitted to below test conditions. Frequency Range 1055Hz Total Amplitude 1.5mm (May not exceed acceleration 196m/s2) Sweeping Method 10Hz to 55Hz to 10Hz for 1min. X Time Y For 2 hours on each X, Y, and Z axis. Z Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 14. Solderability Specified Value Test Methods and Remarks MA series MA-H series At least 90 of surface of terminal electrode is covered by new solder. The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table. Flux : Methanol solution containing rosin 25%. Solder Temperature 2455 Time 50.5 sec. Immersion depth : All sides of mounting terminal shall be immersed. 15. Resistance to soldering heat Specified Value Test Methods and Remarks MA series MA-H series Inductance change : Within 10% No significant abnormality in appearance. The test sample shall be exposed to reflow oven at 230 for 40 seconds, with peak temperature at 2600/5 for 5 seconds, 3 times. Test board material : Glass epoxy-resin Test board thickness : 1.0mm Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MA_reli_e-E04R01 16. Thermal shock Specified Value Test Methods and Remarks MA series MA-H series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles. Conditions of 1 cycle Step Temperature () Duration (min) 1 403 303 2 Room temperature Within 3 3 852 303 4 Room temperature Within 3 Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 17. Damp heat Specified Value Test Methods and Remarks MA series MA-H series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table. Temperature 602 Humidity 9095%RH Time 50024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 18. Loading under damp heat Specified Value Test Methods and Remarks MA series MA-H series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current continuously as shown in below table. Temperature 602 Humidity 9095RH Applied current Rated current Time 50024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 19. Low temperature life test Specified Value Test Methods and Remarks MA series MA-H series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below table. Temperature 402 Time 50024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 20. High temperature life test Specified Value Test Methods and Remarks MA series MA-H series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below table. Temperature 852 Time 50024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 21. Loading at high temperature life test Specified Value MA series MA-H series This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MA_reli_e-E04R01 22. Standard condition MA series Specified Value MA-H series Standard test condition : Unless otherwise specified, temperature is 2015 and 6520of relative humidity. When there is any question concerning measurement result: In order to provide correlation data, the test shall be condition of 202 of temperature, 655% relative humidity. Inductance is in accordance with our measured value. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MA_reli_e-E04R01 METAL CORE WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM MA SERIES / MCOILTM MA- SERIES) PRECAUTIONS 1. Circuit Design Precautions Operating environment 1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. 2. PCB Design Precautions Technical considerations Land pattern design 1. Please refer to a recommended land pattern. Land pattern design Surface Mounting Mounting and soldering conditions should be checked beforehand. Applicable soldering process to this products is reflow soldering only. 3. Considerations for automatic placement Precautions Technical considerations Adjustment of mounting machine 1. Excessive impact load should not be imposed on the products when mounting onto the PC boards. 2. Mounting and soldering conditions should be checked beforehand. Adjustment of mounting machine 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. 4. Soldering Precautions Reflow soldering 1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. 2. The product shall be used reflow soldering only. 3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering. Lead free soldering 1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc sufficiently. Reflow soldering 1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. Recommended reflow condition (Pb free solder) Technical considerations 5. Cleaning Precautions Technical considerations Cleaning conditions 1. Washing by supersonic waves shall be avoided. Cleaning conditions 1. If washed by supersonic waves, the products might be broken. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MA_prec_e-E04R01 6. Handling Precautions Technical considerations Handling 1. Keep the product away from all magnets and magnetic objects. Breakaway PC boards (splitting along perforations) 1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. Mechanical considerations 1. Please do not give the product any excessive mechanical shocks. 2. Please do not add any shock and power to a product in transportation. Pick-up pressure 1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part. Packing 1. Please avoid accumulation of a packing box as much as possible. Handling 1. There is a case that a characteristic varies with magnetic influence. Breakaway PC boards (splitting along perforations) 1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs. Mechanical considerations 1. There is a case to be damaged by a mechanical shock. 2. There is a case to be broken by the handling in transportation. Pick-up pressure 1. Damage and a characteristic can vary with an excessive shock or stress. Packing 1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products. 7. Storage conditions Precautions Storage 1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled. Recommended conditions Ambient temperature : 040 Humidity : Below 70% RH The ambient temperature must be kept below 30. Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, product should be used within 6 months from the time of delivery. In case of storage over 6 months, solderability shall be checked before actual usage. Technical considerations Storage 1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MA_prec_e-E04R01 METAL WIRE-WOUND CHIP POWER INDUCTORS(MCOILTM MB SERIES) METAL WIRE-WOUND CHIP POWER INDUCTORSMCOILTM MB SERIES REFLOW REFLOW PARTS NUMBER M B K * Operating Temp.-40+105Including self-generated heat K 1 6 0 Series name Code MB 8 T 1 R 0 M Packaging Code T Series name Metal Wire-Wound chip power inductor POWER INDUCTORS INDUCTORS DimensionsT Code KK MK Nominal inductance Code example R24 1R0 4R7 RDecimal point DimensionsTmm 1.0 1.2 DimensionsLxW Code Typeinch 1608 2012 2520 16080603 20120805 25201008 Blank space Dimensions LxWmm 1.6x0.8 2.0x1.25 2.5x2.0 Inductance tolerance Code M N Packaging Taping Nominal inductanceH 0.24 1.0 4.7 Inductance tolerance 20 30 Internal code STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY Recommended Land Patterns Surface Mounting Mounting and soldering conditions should be checked beforehand. Applicable soldering process to these products is reflow soldering Type A 1608 0.55 2012 0.60 2520 0.60 Type MBKK1608 MBKK2012 MBMK2520 only. B 0.70 1.00 1.50 C 1.00 1.45 2.00 Unitmm Standard quantitypcs Paper tape Embossed tape L W T e 1.60.2 0.0630.008 2.00.2 0.0790.008 2.50.2 0.0980.008 0.80.2 0.0310.008 1.250.2 0.0490.008 2.00.2 0.0790.008 1.0 max 0.040 max 1.0 max 0.040 max 1.2 max 0.047 max 0.450.15 0.0160.006 0.50.2 0.0200.008 0.50.2 0.0200.008 3000 3000 3000 Unitmminch i_wound_MB_e-E04R01 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 48 16 PARTS NUMBER 16080603TYPE EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.24 0.47 0.68 1.0 1.5 2.2 3.3 4.7 30 30 30 20 20 20 20 20 - 0.049 0.104 0.120 0.150 0.200 0.345 0.512 0.730 EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.24 0.47 0.68 1.0 1.5 2.2 3.3 4.7 30 30 30 20 20 20 20 20 - 0.041 0.078 0.090 0.106 0.173 0.290 0.500 0.615 Parts number EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. MBMK2520TR24N MBMK2520TR47N MBMK2520TR68N MBMK2520T1R0M MBMK2520T1R5M MBMK2520T2R2M MBMK2520T3R3M MBMK2520T4R7M RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 0.24 0.47 0.68 1.0 1.5 2.2 3.3 4.7 30 30 30 20 20 20 20 20 - 0.026 0.042 0.058 0.072 0.106 0.159 0.260 0.380 Parts number MBKK1608TR24N MBKK1608TR47N MBKK1608TR68N MBKK1608T1R0M MBKK1608T1R5M MBKK1608T2R2M MBKK1608T3R3M MBKK1608T4R7M Rated current A Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 1,650 2,300 1.0 1,100 1,400 1.0 950 1,200 1.0 800 1,150 1.0 650 1,000 1.0 520 750 1.0 450 600 1.0 370 500 1.0 20120805TYPE Parts number 25201008TYPE Rated current A Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 4,750 3,500 1.0 3,900 2,600 1.0 3,150 2,150 1.0 2,350 1,850 1.0 2,050 1,500 1.0 1,800 1,250 1.0 1,400 970 1.0 1,150 800 1.0 The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20) The temperature rise current value (Idc2) is the DC current value having temperature increase up to 40. (at 20) POWER INDUCTORS INDUCTORS MBKK2012TR24N MBKK2012TR47N MBKK2012TR68N MBKK2012T1R0M MBKK2012T1R5M MBKK2012T2R2M MBKK2012T3R3M MBKK2012T4R7M Rated current A Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 3,000 2,400 1.0 2,000 1,650 1.0 1,800 1,500 1.0 1,500 1,450 1.0 1,200 1,100 1.0 900 850 1.0 700 650 1.0 600 600 1.0 i_wound_MB_e-E04R01 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 16 49 METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM MB SERIES) PACKAGING Minimum Quantity Type MBKK1608 MBKK2012 MBMK2520 Standard Quantity [pcs] Tape Reel 3000 3000 3000 Tape Material Embossed Tape Top tape Chip Filled Sprocket hole Base tape Chip cavity Chip Taping dimensions Embossed tape 8mm wide (0.315 inches wide) K T Electrode (bottom view) Type MBKK1608 MBKK2012 MBMK2520 Chip cavity A 1.1 (0.043) 1.45 (0.057) 2.3 (0.091) B 1.9 (0.075) 2.2 (0.087) 2.8 (0.110) Insertion pitch F 4.00.1 (0.1570.004) 4.00.1 (0.1570.004) 4.00.1 (0.1570.004) Tape thickness T K 0.250.05 1.6 max (0.0100.002) (0.063 max) 0.250.05 1.6 max (0.0100.002) (0.063 max) 0.30.05 1.45 max (0.0120.002) (0.057 max) Unitmminch Leader and Blank portion This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_pack_e-E04R01 Reel size Type MBKK1608 MBKK2012 MBMK2520 D Reel size (Reference values) d W 180+0/-3 7.087+0/-0.118 60+1/-0 2.36+0.039/0 10.01.5 0.3940.059 Unitmminch Top Tape Strength The top The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_pack_e-E04R01 METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM MB SERIES) RELIABILITY DATA 1. Operating Temperature Range Specified Value MB series 40105 Test Methods and Remarks Including self-generated heat 2. Storage Temperature Range Specified Value MB series Test Methods and Remarks 4085 0 to 40 for the product with taping. 3. Rated current Specified Value MB series Within the specified tolerance 4. Inductance Specified Value MB series Test Methods and Remarks Measuring equipment Measuring frequency Within the specified tolerance : LCR Meter HP 4285A or equivalent : 1MHz1V 5. DC Resistance Specified Value MB series Test Methods and Remarks Measuring equipment Within the specified tolerance : DC ohmmeter HIOKI 3227 or equivalent 6. Self resonance frequency Specified Value MB series 7. Temperature characteristic Specified Value MB series Test Methods and Remarks Measurement of inductance shall be taken at temperature range within 40105. With reference to inductance value at 20., change rate shall be calculated. Inductance change : Within 15% 8. Resistance to flexure of substrate Specified Value Test Methods and Remarks MB series No damage The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating until deflection of the test board reaches to 2 mm. Test board size : 100x40x1.0 mm Test board material : Glass epoxy-resin Solder cream thickness : 0.1 mm 9. Insulation resistance : between wires Specified Value MB series 10. Insulation resistance : between wire and core Specified Value MB series DC25V 100k min 11. Withstanding voltage : between wire and core Specified Value MB series This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_reli_e-E04R01 12. Adhesion of terminal electrode Specified Value MB series No abnormality. Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. Applied force : 10N to X and Y directions. Duration : 5s. Solder cream thickness : 0.1mm. 13. Resistance to vibration Inductance change : Within 10% No significant abnormality in appearance. Specified Value MB series Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. Then it shall be submitted to below test conditions. Frequency Range 1055Hz Total Amplitude 1.5mm (May not exceed acceleration 196m/s2) Sweeping Method 10Hz to 55Hz to 10Hz for 1min. X Time Y For 2 hours on each X, Y, and Z axis. Z Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 14. Solderability Specified Value MB series Test Methods and Remarks The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table. Flux : Methanol solution containing rosin 25%. Solder Temperature 2455 Time 50.5 sec. Immersion depth : All sides of mounting terminal shall be immersed. At least 90 of surface of terminal electrode is covered by new solder. 15. Resistance to soldering heat Inductance change : Within 10% No significant abnormality in appearance. Specified Value MB series Test Methods and Remarks The test sample shall be exposed to reflow oven at 230 for 40 seconds, with peak temperature at 2600/5 for 5 seconds, 3 times. Test board material : Glass epoxy-resin Test board thickness : 1.0mm Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 16. Thermal shock Inductance change : Within 10% No significant abnormality in appearance. Specified Value MB series Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles. Conditions of 1 cycle Step Temperature () Duration (min) 1 403 303 2 Room temperature Within 3 3 852 303 4 Room temperature Within 3 Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 17. Damp heat Specified Value Test Methods and Remarks MB series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table. Temperature 602 Humidity 9095%RH Time 100024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_reli_e-E04R01 18. Loading under damp heat Specified Value Test Methods and Remarks MB series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current continuously as shown in below table. Temperature 602 Humidity 9095RH Applied current Rated current Time 100024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 19. Low temperature life test Specified Value Test Methods and Remarks MB series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below table. Temperature 402 Time 100024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 20. High temperature life test Specified Value Test Methods and Remarks MB series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below table. Temperature 852 Time 50024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 21. Loading at high temperature life test Specified Value MB series 22. Standard condition Specified Value MB series Standard test condition : Unless otherwise specified, temperature is 2015 and 6520of relative humidity. When there is any question concerning measurement result: In order to provide correlation data, the test shall be condition of 202 of temperature, 655% relative humidity. Inductance is in accordance with our measured value. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_reli_e-E04R01 METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM MB SERIES) PRECAUTIONS 1. Circuit Design Precautions Operating environment 1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. 2. PCB Design Precautions Technical considerations Land pattern design 1. Please refer to a recommended land pattern. Land pattern design Surface Mounting Mounting and soldering conditions should be checked beforehand. Applicable soldering process to this products is reflow soldering only. 3. Considerations for automatic placement Precautions Technical considerations Adjustment of mounting machine 1. Excessive impact load should not be imposed on the products when mounting onto the PC boards. 2. Mounting and soldering conditions should be checked beforehand. Adjustment of mounting machine 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. 4. Soldering Precautions Reflow soldering 1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. 2. The product shall be used reflow soldering only. 3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering. Lead free soldering 1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc sufficiently. Technical considerations Temperature Reflow soldering 1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. Recommended reflow condition (Pb free solder) 5sec max 300 Peak260+0/-5 150180 200 100 40sec max 9030sec 230 min 0 Heating Timesec 5. Cleaning Precautions Technical considerations Cleaning conditions 1. Washing by supersonic waves shall be avoided. Cleaning conditions 1. If washed by supersonic waves, the products might be broken. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_prec_e-E03R01 6. Handling Precautions Technical considerations Handling 1. Keep the product away from all magnets and magnetic objects. Breakaway PC boards (splitting along perforations) 1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. Mechanical considerations 1. Please do not give the product any excessive mechanical shocks. 2. Please do not add any shock and power to a product in transportation. Pick-up pressure 1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part. Packing 1. Please avoid accumulation of a packing box as much as possible. Handling 1. There is a case that a characteristic varies with magnetic influence. Breakaway PC boards (splitting along perforations) 1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs. Mechanical considerations 1. There is a case to be damaged by a mechanical shock. 2. There is a case to be broken by the handling in transportation. Pick-up pressure 1. Damage and a characteristic can vary with an excessive shock or stress. Packing 1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products. 7. Storage conditions Precautions Storage 1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled. Recommended conditions Ambient temperature : 040 Humidity : Below 70% RH The ambient temperature must be kept below 30. Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, product should be used within 6 months from the time of delivery. In case of storage over 6 months, solderability shall be checked before actual usage. Technical considerations Storage 1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_MB_prec_e-E03R01 METAL WIRE-WOUND CHIP POWER INDUCTORS(MCOILTM ME SERIES) REFLOW REFLOW PARTS NUMBER M E K * Operating Temp.-40+125Including self-generated heat K 2 Series name Code ME 0 1 6 T 1 R 0 M POWER INDUCTORS INDUCTORS Nominal inductance Code example R47 1R0 4R7 RDecimal point Series name Metal Wire-wound Chip Power Inductor DimensionsT Code KK DimensionsTmm 1.0 DimensionsLxW Code 2016 Nominal inductanceH 0.47 1.0 4.7 Inductance tolerance Code M DimensionsLxWmm 2 .0x1.6 Packaging Code T Blank space Inductance tolerance 20 Special code Code Packaging Taping Special code Standard Internal code STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY Type L W T e Standard quantity pcs Taping MEKK2016 2.00.2 0.0790.008 1.60.2 0.0630.008 1.0 max 0.039 max 0.50.3 0.0200.012 3000 Unitmminch PARTS NUMBER MEKK2016 type Parts number MEKK2016TR47M MEKK2016T1R0M MEKK2016T2R2M EHS Nominal inductance H Inductance tolerance Self-resonant frequency MHmin. DC Resistance max. RoHS RoHS RoHS 0.47 1.0 2.2 20 20 20 - 0.030 0.060 0.150 Rated current Amax. Measuring Saturation current Temperature rise current frequencyMHz Idc2 Idc1 4,500 4,300 1 3,600 3,100 1 2,400 1,900 1 The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20) The temperature rise current valueIdc2) is the DC current value having temperature increase up to 40. (at 20) The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value. Idc2 Measurement board data Material:FR4 Board dimensions100x50x1.6t Pattern dimensions45x45 (Double side board) Pattern thickness70m i_wound_ME_e-E04R01 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 50 16 METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM ME SERIES) PACKAGING Minimum Quantity Type MEKK2016 Standard Quantity [pcs] Tape Reel 3000 Tape Material Embossed Tape Top tape Chip Filled Sprocket hole Base tape Chip cavity Chip Taping dimensions Embossed tape 8mm wide (0.315 inches wide) Type MEKK2016 Chip cavity A B 1.90.1 2.450.1 0.0750.004 0.0970.004 Insertion pitch F 4.00.1 0.1570.004 Tape thickness T K 0.250.05 1.2 max 0.0090.002 0.047 max Unitmminch Leader and Blank portion Blank portions Chip cavity Blank portions Leader Direction of tape feed 160 mm or more 160 mm 200 mm 400 mm 560 mm This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_ME_pack_e-E04R01 Reel size Type MEKK2016 D Reel size (Reference values) d W 180+0/-3 7.087+0/-0.118 60+1/-0 2.36+0.039/0 10.01.5 0.3940.059 Unitmminch Top Tape Strength The top The top tape requires a peel-off force of 0.1 to 1.0N in the direction of the arrow as illustrated below. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_ME_pack_e-E04R01 METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM ME SERIES) RELIABILITY DATA 1. Operating Temperature Range Specified Value ME series 40125 Test Methods and Remarks Including self-generated heat 2. Storage Temperature Range Specified Value ME series Test Methods and Remarks 4085 0 to 40 for the product with taping. 3. Rated current Specified Value ME series Within the specified tolerance 4. Inductance Specified Value ME series Test Methods and Remarks Measuring equipment Measuring frequency Within the specified tolerance : LCR Meter HP 4294A or equivalent : 1MHz0.5V 5. DC Resistance Specified Value ME series Test Methods and Remarks Measuring equipment Within the specified tolerance : DC ohmmeter HIOKI 3227 or equivalent 6. Self resonance frequency Specified Value ME series 7. Temperature characteristic Specified Value ME series Test Methods and Remarks Measurement of inductance shall be taken at temperature range within 4085. With reference to inductance value at 20., change rate shall be calculated. Inductance change : Within 15% 8. Resistance to flexure of substrate Specified Value Test Methods and Remarks ME series No damage The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating until deflection of the test board reaches to 2 mm. Test board size : 100x40x1.0 mm Test board material : Glass epoxy-resin Solder cream thickness : 0.12 mm 9. Insulation resistance : between wires Specified Value ME series 10. Insulation resistance : between wire and over-coating Specified Value ME series DC25V 100kmin 11. Withstanding voltage : between wire and over-coating Specified Value ME series This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_ME_reli_e-E04R01 12. Adhesion of terminal electrode Specified Value ME series No abnormality. Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. Applied force : 10N to X and Y directions. Duration : 5s. Solder cream thickness : 0.12mm. 13. Resistance to vibration Specified Value ME series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. Then it shall be submitted to below test conditions. Test Methods and Remarks Frequency Range Total Amplitude Sweeping Method 1055Hz 1.5mm (May not exceed acceleration 196m/s2) 10Hz to 55Hz to 10Hz for 1min. X Time Y For 2 hours on ach X, Y, and Z axis. Z Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 14. Solderability Specified Value ME series At least 90 of surface of terminal electrode is covered by new solder. Test Methods and Remarks The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table. Flux : Methanol solution containing rosin 25%. Solder Temperature 2455 Time 50.5 sec. Immersion depth : All sides of mounting terminal shall be immersed. 15. Resistance to soldering heat Inductance change : Within 10% No significant abnormality in appearance. Specified Value ME series Test Methods and Remarks The test sample shall be exposed to reflow oven at 230 for 40 seconds, with peak temperature at 2600/5 for 5 seconds, 2 times. Test board material : Glass epoxy-resin Test board thickness : 1.0mm Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 16. Thermal shock Inductance change : Within 10% No significant abnormality in appearance. Specified Value ME series Test Methods and Remarks The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles. Conditions of 1 cycle Step Temperature () Duration (min) 1 403 303 2 Room temperature Within 3 3 852 303 4 Room temperature Within 3 Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 17. Damp heat Specified Value Test Methods and Remarks ME series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table. Temperature 602 Humidity 9095%RH Time 50024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_ME_reli_e-E04R01 18. Loading under damp heat Specified Value Test Methods and Remarks ME series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current continuously as shown in below table. Temperature 602 Humidity 9095RH Applied current Rated current Time 50024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 19. Low temperature life test Specified Value Test Methods and Remarks ME series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below table. Temperature 402 Time 50024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 20. High temperature life test Specified Value Test Methods and Remarks ME series Inductance change : Within 10% No significant abnormality in appearance. The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below table. Temperature 852 Time 50024/0 hour Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. 21. Loading at high temperature life test Specified Value ME series 22. Standard condition Specified Value ME series Standard test condition : Unless otherwise specified, temperature is 2015 and 6520of relative humidity. When there is any question concerning measurement result: In order to provide correlation data, the test shall be condition of 202 of temperature, 655% relative humidity. Inductance is in accordance with our measured value. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_ME_reli_e-E04R01 METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM ME SERIES) PRECAUTIONS 1. Circuit Design Precautions Operating environment 1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. 2. PCB Design Precautions Technical considerations Land pattern design 1. Please refer to a recommended land pattern. Land pattern design Surface Mounting Mounting and soldering conditions should be checked beforehand. Applicable soldering process to this products is reflow soldering only. 3. Considerations for automatic placement Precautions Technical considerations Adjustment of mounting machine 1. Excessive impact load should not be imposed on the products when mounting onto the PC boards. 2. Mounting and soldering conditions should be checked beforehand. Adjustment of mounting machine 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. 4. Soldering Precautions Reflow soldering 1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. 2. The product shall be used reflow soldering only. 3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering. Lead free soldering 1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc sufficiently. Reflow soldering 1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. Recommended reflow condition (Pb free solder) Technical considerations 5. Cleaning Precautions Technical considerations Cleaning conditions 1. Washing by supersonic waves shall be avoided. Cleaning conditions 1. If washed by supersonic waves, the products might be broken. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_ME_prec_e-E04R01 6. Handling Precautions Technical considerations Handling 1. Keep the product away from all magnets and magnetic objects. Breakaway PC boards (splitting along perforations) 1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. Mechanical considerations 1. Please do not give the product any excessive mechanical shocks. 2. Please do not add any shock and power to a product in transportation. Pick-up pressure 1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part. Packing 1. Please avoid accumulation of a packing box as much as possible. Handling 1. There is a case that a characteristic varies with magnetic influence. Breakaway PC boards (splitting along perforations) 1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs. Mechanical considerations 1. There is a case to be damaged by a mechanical shock. 2. There is a case to be broken by the handling in transportation. Pick-up pressure 1. Damage and a characteristic can vary with an excessive shock or stress. Packing 1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products. 7. Storage conditions Precautions Storage 1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled. Recommended conditions Ambient temperature : 040 Humidity : Below 70% RH The ambient temperature must be kept below 30. Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, product should be used within 6 months from the time of delivery. In case of storage over 6 months, solderability shall be checked before actual usage. Technical considerations Storage 1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_ME_prec_e-E04R01 METAL MULTILAYER CHIP POWER INDUCTORS(MCOILTM MC SERIES) METAL MULTILAYER CHIP POWER INDUCTORSMCOILTM MC SERIES REFLOW REFLOW PARTS NUMBER M C K * Operating Temp.-40+125(Including self-generated heat) K 2 0 1 2 T Series name Code MC 1 R 0 M G Blank space Packaging Code Series name Metal base multilayer chip power inductor Nominal inductance Code example R24 R47 1R0 RDecimal point Thicknessmm 0.65 max 1.0 max DimensionsLxW Code Typeinch 1608 2012 16080603 20120805 Dimensions LxWmm 1.6x0.8 2.0x1.2 Nominal inductanceH POWER INDUCTORS INDUCTORS Thickness Code FE KK Packaging Taping 0.24 0.47 1.0 Inductance tolerance Code M Inductance tolerance 20 Special code Code G Special code 5 surface terminal STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY Standard quantitypcs Paper tape Embossed tape Type L W T e MCFE1608 0603 MCKK2012 0805 1.60.2 0.0630.008 2.00.2 0.0790.008 0.80.2 0.0310.008 1.20.2 0.0470.008 0.65 max 0.026 max 1.0 max 0.039 max 0.30.2 0.0120.008 0.50.3 0.020.012 4000 3000 Unitmminch PARTS NUMBER MC1608 Parts number EHS Nominal inductance H Inductance tolerance MCFE1608TR24MG MCFE1608TR47MG MCFE1608T1R0MG RoHS RoHS RoHS 0.24 0.47 1.0 20 20 20 Parts number EHS Nominal inductance H Inductance tolerance MCKK2012T1R0MG RoHS 1.0 20 DC Resistance max. typ. 0.100 0.075 0.150 0.114 0.340 0.270 Rated current(Idc1) Amax. Rated current(Idc2) Amax. Measuring frequency MHz Thickness mmmax. 2.6 2.0 1.4 1.5 1.2 0.8 1 1 1 0.65 0.65 0.65 DC Resistance max. typ. 0.123 0.100 Rated current(Idc1) Amax. Rated current(Idc2) Amax. Measuring frequency MHz Thickness mmmax. 2.0 1.4 1 1.0 MC2012 Idc1 is the DC value at which the initial L value is decreased within 30% by the application of DC bias. at 20 Idc2 is the DC value at which the temperature of element is increased within 40 by the application of DC bias. at 20 i_mlci_MC_e-E04R01 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 16 51 Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors Multilayer common mode choke coilsMC series F type Metal Multilayer Chip Power Inductors (MCOILTM MC series) PACKAGING Minimum Quantity Tape & Reel Packaging Type CK16080603 CK21250805 CKS21250805 CKP16080603 CKP20120805 CKP20160806 CKP25201008 NM20120805 NM25201008 LK10050402 LK16080603 LK21250805 HK06030201 HK10050402 HK16080603 HK21250805 HKQ040201005 HKQ0603W0201 HKQ0603C0201 HKQ0603S0201 HKQ0603U0201 AQ1050402 BK040201005 BK06030201 BK10050402 BKH06030201 BKH10050402 BK16080603 BK21250805 BK20100804 BK32161206 BKP040201005 BKP06030201 BKP10050402 BKP16080603 BKP21250805 MCF06050202 MCF08060302 MCF12100504 MCF20100804 MCFE16080603 MCKK20120805 Thickness mminch 0.8 0.031 0.850.033 1.250.049 0.850.033 1.250.049 0.8 0.031 0.9 0.035 0.9 0.035 0.7 0.028 0.9 0.035 1.1 0.043 0.9 0.035 0.9 0.035 1.1 0.043 0.5 0.020 0.8 0.031 0.850.033 1.250.049 0.3 0.012 0.5 0.020 0.8 0.031 0.850.033 1.0 0.039 0.2 0.008 0.3 0.012 0.3 0.012 0.3 0.012 0.3 0.012 0.5 0.020 0.2 0.008 0.3 0.012 0.5 0.020 0.3 0.012 0.5 0.020 0.8 0.031 0.850.033 1.250.049 0.450.018 0.8 0.031 0.2 0.008 0.3 0.012 0.5 0.020 0.8 0.031 0.850.033 0.3 0.012 0.4 0.016 0.550.022 0.450.018 0.650.026 1.000.039 Standard Quantity pcs Paper Tape Embossed Tape 4000 4000 2000 4000 2000 4000 3000 3000 3000 3000 2000 3000 3000 2000 10000 4000 4000 2000 15000 10000 4000 4000 3000 20000 40000 15000 15000 15000 15000 10000 20000 15000 10000 15000 10000 4000 4000 2000 4000 4000 20000 15000 10000 4000 4000 15000 10000 5000 4000 4000 3000 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E04R01 Taping material Card board carrier tape Top tape Base tape Sprocket hole Bottom tape Chip cavity CK CKP CK CKS LK LK LK HK HK HK HKQ HKQ AQ 1608 1608 2125 2125 1005 1608 2125 0603 1005 1608 0402 0603 105 BK BK BK BK BK BK BKP BKP BKP BKP BKP BKH BKH MCF MC 0402 0603 1005 1608 2125 2010 0402 0603 1005 1608 2125 0603 1005 0605 1608 CK CKS CKP CKP CKP NM NM LK HKQ HK 2125 2125 2012 2016 2520 2012 2520 2125 0402 2125 BK BK MCF MCF MCF MC 2125 3216 0806 1210 2010 2012 Chip Filled Chip Embossed Tape Top tape Sprocket hole Base tape Chip cavity Chip Filled Chip Taping Dimensions Paper tape (8mm wide) This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E04R01 Type Thickness mminch CK16080603 0.8 0.031 CK21250805 0.850.033 CKS21250805 0.850.033 CKP16080603 0.8 0.031 LK10050402 0.5 0.020 LK16080603 0.8 0.031 LK21250805 0.850.033 HK06030201 0.3 0.012 HK10050402 0.5 0.020 HK16080603 0.8 0.031 HKQ040201005 0.2 0.008 HKQ0603W0201 0.3 0.012 HKQ0603C0201 0.3 0.012 HKQ0603S0201 0.3 0.012 HKQ0603U0201 0.3 0.012 AQ1050402 0.5 0.020 BK040201005 0.2 0.008 BK06030201 0.3 0.012 BK10050402 0.5 0.020 BK16080603 0.8 0.031 BK21250805 0.850.033 BK20100804 0.450.018 BKP040201005 0.2 0.008 BKP06030201 0.3 0.012 BKP10050402 0.5 0.020 BKP16080603 0.8 0.031 BKP21250805 0.850.033 BKH06030201 0.3 0.012 BKH10050402 0.5 0.020 MCF06050202 0.3 0.012 MCFE16080603 0.650.026 Chip cavity 1.00.2 1.80.2 0.0390.008 0.0710.008 1.50.2 2.30.2 0.0590.008 0.0910.008 1.50.2 2.30.2 0.0590.008 0.0910.008 1.00.2 1.80.2 0.0390.008 0.0710.008 0.650.1 1.150.1 0.0260.004 0.0450.004 1.00.2 1.80.2 0.0390.008 0.0710.008 1.50.2 2.30.2 0.0590.008 0.0910.008 0.400.06 0.700.06 0.0160.002 0.0280.002 0.650.1 1.150.1 0.0260.004 0.0450.004 1.00.2 1.80.2 0.0390.008 0.0710.008 0.250.04 0.450.04 0.0100.002 0.0180.002 0.400.06 0.700.06 0.0160.002 0.0280.002 0.400.06 0.700.06 0.0160.002 0.0280.002 0.400.06 0.700.06 0.0160.002 0.0280.002 0.400.06 0.700.06 0.0160.002 0.0280.002 0.750.1 1.150.1 0.0300.004 0.0450.004 0.250.04 0.450.04 0.0100.002 0.0180.002 0.400.06 0.700.06 0.0160.002 0.0280.002 0.650.1 1.150.1 0.0260.004 0.0450.004 1.00.2 1.80.2 0.0390.008 0.0710.008 1.50.2 2.30.2 0.0590.008 0.0910.008 1.20.1 2.170.1 0.0470.004 0.0850.004 0.250.04 0.450.04 0.0100.002 0.0180.002 0.400.06 0.700.06 0.0160.002 0.0280.002 0.650.1 1.150.1 0.0260.004 0.0450.004 1.00.2 1.80.2 0.0390.008 0.0710.008 1.50.2 2.30.2 0.0590.008 0.0910.008 0.400.06 0.700.06 0.0160.002 0.0280.002 0.650.1 1.150.1 0.0260.004 0.0450.004 0.620.03 0.770.03 0.0240.001 0.0300.001 1.10.05 1.90.05 0.0430.002 0.0750.002 Insertion Pitch 4.00.1 0.1570.004 4.00.1 0.1570.004 4.00.1 0.1570.004 4.00.1 0.1570.004 2.00.05 0.0790.002 4.00.1 0.1570.004 4.00.1 0.1570.004 2.00.05 0.0790.002 2.00.05 0.0790.002 4.00.1 0.1570.004 2.00.05 0.0790.002 2.00.05 0.0790.002 2.00.05 0.0790.002 2.00.05 0.0790.002 2.00.05 0.0790.002 2.00.05 0.0790.002 2.00.05 0.0790.002 2.00.05 0.0790.002 2.00.05 0.0790.002 4.00.1 0.1570.004 4.00.1 0.1570.004 4.00.1 0.1570.004 2.00.05 0.0790.002 2.00.05 0.0790.002 2.00.05 0.0790.002 4.00.1 0.1570.004 4.00.1 0.1570.004 2.00.05 0.0790.002 2.00.05 0.0790.002 2.00.05 0.0790.002 4.00.1 0.1570.004 Tape Thickness 1.1max 0.043max 1.1max 0.043max 1.1max 0.043max 1.1max 0.043max 0.8max 0.031max 1.1max 0.043max 1.1max 0.043max 0.45max 0.018max 0.8max 0.031max 1.1max 0.043max 0.36max 0.014max 0.45max 0.018max 0.45max 0.018max 0.45max 0.018max 0.45max 0.018max 0.8max 0.031max 0.36max 0.014max 0.45max 0.018max 0.8max 0.031max 1.1max 0.043max 1.1max 0.043max 0.8max 0.031max 0.36max 0.014max 0.45max 0.018max 0.8max 0.031max 1.1max 0.043max 1.1max 0.043max 0.45max 0.018max 0.8max 0.031max 0.45max 0.018max 0.72max 0.028max Unit : mminch This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E04R01 Embossed Tape (8mm wide) Type Thickness mminch CK21250805 1.250.049 CKS21250805 1.250.049 CKP20120805 0.9 0.035 CKP20160806 0.9 0.035 Chip cavity 1.50.2 2.30.2 0.0590.008 0.0910.008 1.50.2 2.30.2 0.0590.008 0.0910.008 1.550.2 2.30.2 0.0610.008 0.0910.008 1.80.1 2.20.1 0.0710.004 0.0870.004 Insertion Pitch 4.00.1 0.1570.004 4.00.1 0.1570.004 4.00.1 0.1570.004 4.00.1 0.1570.004 2.30.1 0.0910.004 2.80.1 0.1100.004 4.00.1 0.1570.004 1.550.2 0.0610.008 2.30.2 0.0910.008 4.00.1 0.1570.004 2.30.1 0.0910.004 2.80.1 0.1100.004 4.00.1 0.1570.004 1.50.2 0.0590.008 2.30.2 0.0910.008 4.00.1 0.1570.004 1.50.2 0.0590.008 2.30.2 0.0910.008 4.00.1 0.1570.004 1.50.2 0.0590.008 1.90.1 0.0750.004 0.750.05 0.0300.002 1.150.05 0.0450.002 1.10.1 0.0430.004 1.550.2 0.0610.008 2.30.2 0.0910.008 3.50.1 0.1380.004 0.950.05 0.0370.002 1.400.05 0.0550.002 2.30.1 0.0910.004 2.30.2 0.0910.008 4.00.1 0.1570.004 4.00.1 0.1570.004 2.00.05 0.0790.002 4.00.1 0.1570.004 4.00.1 0.1570.004 4.00.1 0.1570.004 0.7 0.028 CKP25201008 0.9 0.035 1.1 0.043 NM20120805 0.9 0.035 0.9 0.035 NM25201008 1.1 0.043 LK21250805 1.250.049 0.850.033 HK21250805 1.0 0.039 BK21250805 1.250.049 BK32161206 0.80.031 MCF08060302 0.4 0.016 MCF12100504 0.550.022 MCF20100804 0.450.018 MCKK20120805 1.0 0.039 Tape Thickness K T 2.0 0.3 0.079 0.012 2.0 0.3 0.079 0.012 1.3 0.3 0.051 0.012 1.3 0.25 0.051 0.01 1.4 0.055 1.4 0.3 0.055 0.012 1.7 0.067 1.3 0.3 0.051 0.012 1.4 0.055 0.3 0.012 1.7 0.067 2.0 0.3 0.079 0.012 1.5 0.059 0.3 0.012 2.0 0.079 2.0 0.3 0.079 0.012 1.4 0.3 0.055 0.012 0.55 0.3 0.022 0.012 0.65 0.3 0.026 0.012 0.85 0.3 0.033 0.012 1.3 0.25 0.051 0.010 Unit : mminch This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E04R01 Embossed Tape (4mm wide) Chip cavity Thickness mminch 0.2 0.008 Type HKQ040201005 0.23 0.43 Insertion Pitch 1.00.02 Tape Thickness K T 0.5max. 0.25max. Unit : mm LEADER AND BLANK PORTION Blank portion Chip cavity Blank portion Leader 100mm or more (3.94inches or more) 160mm or more (6.3inches or more) Direction of tape feed 400mm or more (15.7inches or more) Reel Size t E C R B D A W A 1782.0 B 50 or more C 13.00.2 4mm width tape 8mm width tape t 1.5max. 2.5max. W 51.0 101.5 D 21.00.8 E 2.00.5 R 1.0 (Unit : mm) Top tape strength The top tape requires a peel-off force of 0.10.7N in the direction of the arrow as illustrated below. Pull direction 015 Top tape Base tape This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E04R01 Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors Multilayer common mode choke coilsMC series F type Metal Multilayer Chip Power Inductors (MCOILTM MC series) RELIABILITY DATA 1. Operating Temperature Range BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY Specified Value 55125 BK2010 BK3216 BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HKQ0402 HK0603 HK1005 HK1608 HK2125 HKQ0603W/HKQ0603C/HKQ0603S/ HKQ0603U/ AQ105 MCFE1608 MCKK2012 5585 4085 4085 55125 4085 55125 40125Including self-generated heat This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 2. Storage Temperature Range BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY Specified Value 55125 BK2010 BK3216 BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HKQ0402 HK0603 HK1005 HK1608 HK2125 HKQ0603W/HKQ0603C/HKQ0603S/ HKQ0603U/ AQ105 MCFE1608 MCKK2012 5585 4085 4085 55125 4085 55125 4085 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 3. Rated Current BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 150750mA DC 100500mA DC 1201000mA DC 115450mA DC 200300mA DC 1501500mA DC 2001200mA DC 100mA DC 100200mA DC 0.551.1A DC 0.81.8A DC 0.82.4A DC 1.03.0A DC 1.54.0A DC 0.05A DC 0.10.13A DC 0.10.15A DC 0.1A DC 5060mA DC 60500mA DC 110280mA DC 0.350.9A DC 0.71.7A DC 0.91.6A DC 1.11.8A DC 1.01.2A DC 0.91.2A DC 2025mA DC 1150mA DC 5300mA DC 60470mA DC 110300mA DC (-55+125 200900mA DC (-55+85) 150300mA DC 300mA DC 100500mA DC 100850mA DC 160850mA DC 130600mA DC 190900mA DC 280710mA DC Idc1 14002600A DC, Idc2 8001500mA DC Idc1 2000mA DC, Idc2 1400A DC BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 Specified Value CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0402 HKQ0603W HKQ0603C HKQ0603S HKQ0603U AQ105 MCFE1608 MCKK2012 Definition of rated current In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20. In the BK Series P type, CK Series P type, NM Series, the rated current is the value of current at which the temperature of the element is increased within 40. In the LK, HK, HKQ0603, and AQ Series, the rated current is either the DC value at which the initial L value is decreased within 5% with the application of DC bias, or the value of current at which the temperature of the element is increased within 20. In the HKQ0402(9N1), the rated current is either the DC value at which the initial L value is decreased within 5% with the application of DC bias, or the value of current at which the temperature of the element is increased within 20. In the HKQ0402(10N), the rated current is either the DC value at which the initial L value is decreased within 5% with the application of DC bias, or the value of current at which the temperature of the element is increased within 25. In the MC Series, Idc1 is the DC value at which the initial L value is decreased within 30% and Idc2 is the DC value at which the temperature of element is increased within 40 by the application of DC bias. at 20 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 4. Impedance BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY Specified Value Test Methods and Remarks BK2010 BK3216 10330 5(10), 25%(Other) 101200 25% 101800 25% 251500 25% 6001800 25% 222500 25% 152500 25% 51000 25% 601000 25% 1033 5(10)25%(Other) 10120 5(10), 25%(Other) 10330 5(EM100), 25%(Other) 33470 25% 33330 25% 1290 5(12), 20%(35), 25%(Other) 1290 5(12), 20%(Other) 4090 20%2H900,25%Other 90 25% BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HKQ0402 HK0603 HK1005 HK1608 HK2125 HKQ0603W/HKQ0603C/HKQ0603S/ HKQ0603U AQ105 MCFE1608 MCKK2012 BK0402Series, BKP0402Series Measuring frequency : 1001MHz Measuring equipment : E4991Aor its equivalent Measuring jig : 16197Aor its equivalent BK0603Series, BKP0603Series Measuring frequency : 1001MHz Measuring equipment : 4291Aor its equivalent Measuring jig : 16193Aor its equivalent BK1005Series, BKP1005Series ,BKH1005Series Measuring frequency : 1001MHz Measuring equipment : 4291Aor its equivalent Measuring jig : 16192Aor its equivalent, 16193Aor its equivalent BK16082125Series, BKP16082125Series Measuring frequency : 1001MHz Measuring equipment : 4291Aor its equivalent, 4195Aor its equivalent Measuring jig : 16092Aor its equivalent or 16192Aor its equivalent/HW BK20103216Series, MCF Series Measuring frequency : 1001MHz Measuring equipment : 4291Aor its equivalent, 4195Aor its equivalent Measuring jig : 16192Aor its equivalent This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 5. Inductance BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY Specified Value BK2010 BK3216 BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0402 HKQ0603W HKQ0603C HKQ0603S HKQ0603U AQ105 MCFE1608 MCKK2012 CKLKCKPNMMC Series Measuring frequency Measuring frequency Measuring frequency Measuring frequency Measuring frequency Measuring frequency Measuring frequency Measuring equipment /jig Test Methods and Remarks Measuring current HKHKQAQ Series Measuring frequency Measuring frequency Measuring frequency Measuring frequency Measuring frequency Measuring equipment /jig 4.710.0H 20% 0.110.0H 20% 1.010.0H 20% 0.332.2H 20% 0.474.7H 20% 0.474.7H 20% 0.474.7H 20% 0.821.0H 20% 1.02.2H 20% 0.122.2H 10 or 20% 0.04733.0H 20% 0.1012.0H 10% 0.04733.0H 20% 0.1012.0H 10% 1.06.2nH 0.3nH 6.8100nH 5% 1.06.2nH 0.3nH 6.8270nH 5% 1.05.6nH 0.3nH 6.8470nH 5% 1.55.6nH 0.3nH 6.8470nH 5% 0.53.9nH 0.1 or 0.2 or 0.3nH 4.35.6nH 0.3nH or 3% or 5% 6.247nH 3 or 5% 0.63.9nH 0.1 or 0.2 or 0.3nH 4.36.2nH 0.2 or 0.3nH or 3 or 5% 6.827nH 3 or 5% 33100nH 5% 0.63.9nH 0.1 or 0.2 or 0.3nH 4.36.2nH 0.2 or 0.3nH 6.822nH 3 or 5% 0.66.2nH 0.2 or 0.3nH 6.822nH 3 or 5% 0.64.2nH 0.1 or 0.2 or 0.3nH 4.36.5nH 0.2 or 0.3nH 6.822nH 3 or 5% 1.06.2nH 0.3nH 6.815nH 5% 0.241.0H 20% 1.0 H 20% : 24MHzCK1608 : 225MHzCK2125 : 210MHzCKS2125 : 1025MHzLK1005 : 150MHzLK1608 : 0.450MHzLK2125 : 1MHzCKP1608CKP2012CKP2016CKP2520NM2012NM2520MCFE1608MCKK2012 :4194A16085B16092Aor its equivalent 4195A4195116092Aor its equivalent 4294A16192Aor its equivalent 4291A16193Aor its equivalent/LK1005 4285A 42841A 42842C 42851 61100 or its equivalent /CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520MCFE1608MCKK2012 :1mA rms0.0474.7H 0.1mA rms5.633H : 100MHzHK0603HK1005AQ105 : 50/100MHzHK1608HK2125 : 500MHzHKQ0603CHKQ0603SHKQ0603U : 300/500MHzHKQ0603W : 100/500MHzHKQ0402 :4291A16197Aor its equivalent/HK0603AQ105 4291A16193Aor its equivalent/HK1005 E4991A16197Aor its equivalent/HKQ0603SHKQ0603UHKQ0603WHKQ0603C 4291A16092A in-house made jigor its equivalent/HK1608HK2125 E4991A16196Dor its equivalent/HKQ0402 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 6. Q BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY Specified Value BK2010 BK3216 BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0402 HKQ0603W HKQ0603C HKQ0603S HKQ0603U AQ105 MCFE1608 MCKK2012 LK Series Measuring frequency Measuring frequency Measuring frequency Measuring equipment /jig Measuring current Test Methods and Remarks HKHKQAQ Series Measuring frequency Measuring frequency Measuring frequency Measuring frequency Measuring frequency Measuring equipment /jig 1020 min. 1035 min. 1550 min. 45 min. 8 min. 812 min. 1018 min. 38 min. 615 min. 1415 min. 1013 min. 14 min. 8 min. : 1025MHzLK1005 : 150MHzLK1608 : 0.450MHzLK2125 :4194A16085B16092Aor its equivalent 4195A4195116092Aor its equivalent 4294A16192Aor its equivalent 4291A16193Aor its equivalent/LK1005 1mA rms0.0474.7H 0.1mA rms5.633H : 100MHzHK0603HK1005AQ105 : 50/100MHzHK1608HK2125 : 500MHzHKQ0603CHKQ0603SHKQ0603U : 300/500MHzHKQ0603W : 100/500MHzHKQ0402 :4291A16197Aor its equivalent/HK0603AQ105 4291A16193Aor its equivalent/HK1005 E4991A16197Aor its equivalent/HKQ0603SHKQ0603UHKQ0603WHKQ0603C 4291A16092A in-house made jigor its equivalent/HK1608, HK2125 E4991A16196Dor its equivalentHKQ0402 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 7. DC Resistance BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY Specified Value Test Methods and Remarks BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0402 HKQ0603W HKQ0603C HKQ0603S HKQ0603U AQ105 MCFE1608 MCKK2012 BK2010 BK3216 0.071.2max. 0.0651.50 max. 0.030.90 max. 0.263.20 max. 0.852.00 max. 0.051.10 max. 0.050.75 max. 0.100.90 max. 0.150.80 max. 0.050.15 max. 0.0300.180 max. 0.02730.220 max. 0.0250.18 max. 0.0200.075 max. 2.56.5 max 2.55.0 max. 2.54.5 max. 4.5 max. 0.450.8530% 0.160.65 max. 0.120.52 max. 0.150.35 max. 0.080.28 max. 0.0750.20 max 0.050.16 max. 0.100.15 max. 0.110.22 max. 0.411.16 max. 0.22.2 max. 0.11.1 max. 0.113.74 max. 0.084.8 max. 0.052.6 max. 0.101.5 max. 0.085.0 max. 0.074.1 max. 0.071.6 max. 0.061.29 max. 0.061.29 max. 0.070.45 max. 0.1000.340 max. 0.123 max. Measuring equipmentVOAC-7412, VOAC-7512, VOAC-7521made by Iwasaki Tsushinki, HIOKI3227 (or its equivalent) This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 8. Self Resonance FrequencySRF BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY Specified Value Test Methods and Remarks BK2010 BK3216 BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0402 HKQ0603W HKQ0603C HKQ0603S HKQ0603U AQ105 MCFE1608 MCKK2012 LKCK Series : Measuring equipment Measuring jig HKHKQAQ Series : Measuring equipment 1725MHz min. 24235MHz min. 2475MHz min. 40180MHz min. 9260MHz min. 13320MHz min. 90010000MHz min. 40010000MHz min. 30010000MHz min. 2004000MHz min. 120010000MHz min. 80010000MHz min. 250010000MHz min. 190010000MHz min. 190010000MHz min. 230010000MHz min. : 4195Aor its equivalent : 4195116092Aor its equivalent : 8719Cor its equivalent8753Dor its equivalent/HK2125 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 9. Temperature Characteristic BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY Specified Value BK2010 BK3216 BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0402 HKQ0603W HKQ0603C Inductance changeWithin 10 HKQ0603S Test Methods and Remarks HKQ0603U AQ105 MCFE1608 MCKK2012 HKHKQAQ Series Temperature range Reference temperature MC Series Temperature range Reference temperature : 3085 : 20 : 4085 : 20 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 10. Resistance to Flexure of Substrate BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY Specified Value BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0402 HKQ0603W HKQ0603C HKQ0603S HKQ0603U AQ105 MCFE1608 MCKK2012 Warp Testing board Thickness BK2010 BK3216 No mechanical damage. : 2mmBK Series without 0402sizeBKPBKH1005CKCKSCKPNMLKHKHKQ0603SHKQ0603U AQ SeriesMCF1210MC Series : 1mmBK0402BKP0402BKH0603HKQ0402HKQ0603WHKQ0603C SeriesMCF Series without 1210 size, : glass epoxy-resin substrate : 0.8mm 20 Test Methods and Remarks R-230 Board Warp Deviation1 45 45 Unitmm This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 11. Solderability BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY Specified Value Test Methods and Remarks BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0402 HKQ0603W HKQ0603C HKQ0603S HKQ0603U AQ105 MCFE1608 MCKK2012 Solder temperature Solder temperature Duration BK2010 BK3216 At least 75 of terminal electrode is covered by new solder. At least 75 of terminal electrode is covered by new solder. 2305 (JIS Z 3282 H60A or H63A) 2453 (Sn/3.0Ag/0.5Cu) 41 sec. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 12. Resistance to Soldering BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY Specified Value BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0402 HKQ0603W HKQ0603C HKQ0603S HKQ0603U AQ105 MCFE1608 MCKK2012 BK2010 BK3216 AppearanceNo significant abnormality Impedance changeWithin 30 AppearanceNo significant abnormality Impedance changeWithin 20 No mechanical damage. Remaining terminal electrode70 min Inductance change R104R7 Within 10 6R8100 Within 15 CKS2125 Within 20 CKP1608CKP2012CKP2016CKP2520NM2012NM2520 Within 30 No mechanical damage. Remaining terminal electrode70 min. Inductance change Within 15 No mechanical damage. Remaining terminal electrode70 min. Inductance change 47N4R7 Within 10 5R6330 Within 15 No mechanical damage. Remaining terminal electrode70 min. Inductance change Within 5 No mechanical damage. Remaining terminal electrode70 min. Inductance change Within 10 Solder temperature 2605 Duration 100.5 sec. Test Methods and Preheating temperature 150 to 180 Remarks Preheating time 3 min. Flux Immersion into methanol solution with colophony for 3 to 5 sec. Recovery 2 to 3 hrs of recovery under the standard condition after the test.See Note 1 (Note 1) When there are questions concerning measurement resultmeasurement shall be made after 482 hrs of recovery under the standard condition. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 13. Thermal Shock BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 AppearanceNo significant abnormality Impedance change Within 30 BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 AppearanceNo significant abnormality Impedance change Within 20 MCF 1210 MCF 2010 CK1608 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 CK2125 Inductance changeWithin 20 CKS2125 CKS2125 Specified Value CKP1608 CKP2012 CKP2016 No mechanical damage. Inductance change Within 30 CKP2520 NM2012 NM2520 LK1005 No mechanical damage. LK1608 Inductance change Within 10 Q change Within 30 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0402 No mechanical damage. Inductance change Within 10 Q change Within 20 HKQ0603W HKQ0603C HKQ0603S HKQ0603U AQ105 MCFE1608 AppearanceNo significant abnormality Inductance change Within 10 MCKK2012 Conditions for 1 cycle Step temperature timemin. 1 Minimum operating temperature 0/3 303 Test Methods and 2 Room temperature 23 Remarks 3 Maximum operating temperature 3/0 303 4 Room temperature 23 Number of cycles5 Recovery2 to 3 hrs of recovery under the standard condition after the test.See Note 1 (Note 1) When there are questions concerning measurement resultmeasurement shall be made after 482 hrs of recovery under the standard condition. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 14. Damp Heat Steady state BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY Specified Value BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 BK2010 BK3216 AppearanceNo significant abnormality Impedance change Within 30 AppearanceNo significant abnormality Impedance change Within 20 No mechanical damage. Inductance change Within 20 Q change Within 30 Inductance change Within 20 No mechanical damage. Inductance change Within 30 No mechanical damage. Inductance change Within 10 Q change Within 30 No mechanical damage. Inductance change Within 20 Q change Within 30 HK0603 HK1005 HK1608 HK2125 HKQ0402 No mechanical damage. Inductance change Within 10 Q change Within 20 HKQ0603W HKQ0603C HKQ0603S HKQ0603U AQ105 MC1608 AppearanceNo significant abnormality Inductance change Within 10 MC2012 BKBKPBKH SeriesMCF Series Temperature 402 Humidity 90 to 95RH Duration 50024/0 hrs Recovery 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.See Note 1 Test Methods and Remarks LKCKCKSCKPNMHKHKQAQMC Series Temperature 402 LKCKCKSCKPNM Series 602 HKHKQAQMC Series Humidity 90 to 95RH Duration 50012 hrs Recovery 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.See Note 1 (Note 1) When there are questions concerning measurement resultmeasurement shall be made after 482 hrs of recovery under the standard condition. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 15. Loading under Damp Heat BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 Specified Value CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 BK2010 BK3216 AppearanceNo significant abnormality Impedance change Within 30 No mechanical damage. Inductance change Within 20 Q change Within 30 No mechanical damage. Inductance change Within 20 No mechanical damage. Inductance change Within 30 No mechanical damage. Inductance change Within 10 Q change Within 30 No mechanical damage. Inductance change 0.04712.0H Within 10 15.033.0H Within 15 Q change Within 30 No mechanical damage. Inductance change Within 20 Q change Within 30 HK0603 HK1005 HK1608 HK2125 HKQ0402 No mechanical damage. Inductance change Within 10 Q change Within 20 HKQ0603W HKQ0603C HKQ0603S HKQ0603U AQ105 MCFE1608 AppearanceNo significant abnormality Inductance change Within 10 MCKK2012 BKBKPBKH Series Temperature 402 Humidity 90 to 95RH Applied current Rated current Duration 50024/0 hrs Recovery 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.See Note 1 Test Methods and LKCKCKSCKPNKHKHKQAQMC Series Remarks Temperature 402 LKCKCKSCKPNM Series 602 HKHKQAQMC Series Humidity 90 to 95RH Applied current Rated current Duration 50012 hrs Recovery 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.See Note 1 Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 202 of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note 1) Measurement shall be made after 482 hrs of recovery under the standard condition. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 16. Loading at High Temperature BK0402 BK0603 BK1005 BKH0603 BKH1005 BK1608 BK2125 ARRAY BKP0402 BKP0603 BKP1005 BKP1608 BKP2125 MCF 0605 MCF 0806 MCF 1210 MCF 2010 CK1608 CK2125 CKS2125 Specified Value CKP1608 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 BK2010 BK3216 AppearanceNo significant abnormality Impedance change Within 30 AppearanceNo significant abnormality Impedance change Within 20 No mechanical damage. Inductance change Within 20 Q change Within 30 No mechanical damage. Inductance change Within 20 No mechanical damage. Inductance change Within 30 No mechanical damage. Inductance change Within 10 Q change Within 30 No mechanical damage. Inductance change 0.04712.0H Within 10 15.033.0H Within 15 Q change Within 30 No mechanical damage. Inductance change Within 20 Q change Within 30 HK0603 HK1005 HK1608 HK2125 HKQ0402 No mechanical damage. Inductance change Within 10 Q change Within 20 HKQ0603W HKQ0603C HKQ0603S HKQ0603U AQ105 MCFE1608 AppearanceNo significant abnormality Inductance change Within 10 MCKK2012 BKBKHBKP SeriesMCF Series Temperature : 1253BKBKH Series : 853BKPMCF Series Applied current Rated current Duration 50024/0 hrs Recovery 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1 Test Methods and LKCKCKSCKPNMHKHKQAQMC Series Remarks Temperature : 852LKCKCKSCKPNMMC Series : 852HK16082125 : 852HK1005, AQ105 operating temperature range5585 : 1252HKQ0402, HK0603, HK1005, HKQ0603S, HKQ0603U, HKQ0603W, HKQ0603C, AQ105 operating temperature range55125 Applied current Rated current Duration 50012 hrs Recovery 2 to 3 hrs of recovery under the standard condition after the test.See Note 1 Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 202 of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note 1) Measurement shall be made after 482 hrs of recovery under the standard condition. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_reli_e-E04R01 Precautions on the use of Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors Multilayer common mode choke coilsMC series F type Metal Multilayer Chip Power Inductors (MCOILTM MC series) PRECAUTIONS 1. Circuit Design Precautions Verification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. Operating CurrentVerification of Rated current 1. The operating current for inductors must always be lower than their rated values. 2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. 2. PCB Design Precautions Pattern configurationsDesign of Land-patterns 1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder usedsize of filletcan directly affect inductor performance. Therefore, the following items must be carefully considered in the design of solder land patterns: 1 The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. 2 When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. 3 The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns smaller than terminal electrode of chips. Pattern configurationsInductor layout on panelized breakaway PC boards 1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to minimize stress. Pattern configurationsDesign of Land-patterns 1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amountslarger fillets which extend above the component end terminations. Examples of improper pattern designs are also shown. 1 Recommended land dimensions for a typical chip inductor land patterns for PCBs Land pattern Solder-resist Chip inductor Chip inductor W C B Technical considerations A B Recommended land dimensions for wave-soldering Type 1608 2012 2125 L 1.6 2.0 2.0 Size W 0.8 1.25 1.25 A 0.81.0 1.01.4 1.01.4 B 0.50.8 0.81.5 0.81.5 C 0.60.8 0.91.2 0.91.2 L Unitmm 2016 2520 2.0 2.5 1.6 2.0 1.01.4 1.01.4 0.81.5 0.61.0 1.31.6 1.62.0 3216 3.2 1.6 1.82.5 0.81.7 1.21.6 Recommended land dimensions for reflow-soldering Unitmm Type 0402 0603 1005 105 1608 L 0.4 0.6 1.0 1.0 1.6 Size W 0.2 0.3 0.5 0.6 0.8 A 0.150.25 0.200.30 0.450.55 0.500.55 0.81.0 B 0.100.20 0.200.30 0.400.50 0.300.40 0.60.8 C 0.150.30 0.250.40 0.450.55 0.600.70 0.60.8 2012 2.0 1.25 0.81.2 0.81.2 0.91.6 2125 2.0 1.25 0.81.2 0.81.2 0.91.6 2016 2.0 1.6 0.81.2 0.81.2 1.22.0 2520 2.5 2.0 1.01.4 0.61.0 1.82.2 3216 3.2 1.6 1.82.5 0.61.5 1.22.0 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_prec_e-E04R01 b b a a a a Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. Recommended land dimension for Reflow-soldering d c c Type 3216 2010 1210 0806 0605 L 3.2 2.0 1.25 0.85 0.65 Size W 1.6 1.0 1.0 0.65 0.50 a 0.70.9 0.50.6 0.450.55 0.250.35 0.270.33 b 0.81.0 c 0.40.5 d 0.8 Unitmm d 2 Examples of good and bad solder application Item 0.50.6 0.20.3 0.5 0.70.8 0.250.35 0.170.23 0.250.35 0.250.35 0.200.26 0.55 0.5 0.4 Not recommended Recommended Lead wire of component Solder-resist Mixed mounting of SMD and leaded components Chassis Solder (for grounding) Solder-resist Component placement close to the chassis Electrode pattern Lead wire of component Soldering iron Hand-soldering of leaded components near mounted components Solder-resist Solder-resist Horizontal component placement Pattern configurationsInductor layout on panelized breakaway PC boards 1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board warp or deflection. Item Not recommended Recommended Position the component at a right angle to the direction of the mechanical stresses that are anticipated. Deflection of the board 1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout. An example below should be counted for better design. E D Perforation C A B Slit Magnitude of stress ABCDE 1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_prec_e-E04R01 3. Considerations for automatic placement Precautions Adjustment of mounting machine 1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards. 2. The maintenance and inspection of the mounter should be conducted periodically. Selection of Adhesives 1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. Adjustment of mounting machine 1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: 1 The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. 2 The pick-up pressure should be adjusted between 1 and 3N static loads. 3 To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement: Item Improper method Proper method Single-sided mounting chipping or cracking supporting pins or back-up pins Double-sided mounting chipping or cracking Technical considerations supporting pins or back-up pins 2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. Selection of Adhesives 1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the following precautions should be noted in the application of adhesives. 1 Required adhesive characteristics a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive should have sufficient strength at high temperatures. c. The adhesive should have good coating and thickness consistency. d. The adhesive should be used during its prescribed shelf life. e. The adhesive should harden rapidly. f. The adhesive must not be contaminated. g. The adhesive should have excellent insulation characteristics. h. The adhesive should not be toxic and have no emission of toxic gasses. 2 When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad. Amount of adhesives After inductors are bonded Recommended conditions a a Figure 0805 case sizes as examples a 0.3mm min b b 100120m c Area with no adhesive c c 4. Soldering Precautions Selection of Flux 1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use; 1 Flux used should be with less than or equal to 0.1 wt% Chlorine conversion method of halogenated content. Flux having a strong acidity content should not be applied. 2 When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level. 3 When using water-soluble flux, special care should be taken to properly clean the boards. Soldering 1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us about peak temperature when you use lead-free paste. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_prec_e-E04R01 Selection of Flux 1-1. When too much halogenated substanceChlorine, etc.content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor. 1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. Soldering 1-1. Preheating when soldering Heating: Chip inductor components should be preheated to within 100 to 130 of the soldering. Cooling: The temperature difference between the components and cleaning process should not be greater than 100. Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. Reflow soldering Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering 300 300 Peak 260 Max. Within 10sec. 230 Within 10sec. 60sec. 60sec Min. 200 Min. Temperature Temperature Preheating Slow cooling 100 0 200 Slow cooling 100 0 Preheating150 Heating above 230 60sec. Min. 40sec. Max. Ceramic chip components should be preheated to within 100 to 130 of the soldering. Assured to be reflow soldering for 2 times. Caution 1. The ideal condition is to have solder massfilletcontrolled to 1/2 to 1/3 of the thickness of the inductor, as shown below: 1/2T1/3T Inductor Solder Technical considerations T PC board 2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible. Wave soldering Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering 300 Preheating 120sec. Min. Peak 260 Max. Within 10sec. 230250 Within 3sec. 200 Slow cooling 100 Temperature Temperature 300 200 120sec. Min. Preheating 150 100 Slow cooling 0 0 Ceramic chip components should be preheated to within 100 to 130 of the soldering. Assured to be wave soldering for 1 time. Except for reflow soldering type. Caution 1. Make sure the inductors are preheated sufficiently. 2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130. 3. Cooling after soldering should be as gradual as possible. 4. Wave soldering must not be applied to the inductors designated as for reflow soldering only. Hand soldering Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering 400 400 Peak 350 Max. Within 3sec. 230280 Within 3sec. 300 200 Slow cooling 100 0 Preheating 60sec. Min. Temperature Temperature 300 T Slow cooling 200 100 0 Preheating 150 Min. 60sec. Min. 190 3216Type max, 130 3225 Type min It is recommended to use 20W soldering iron and the tip is 1or less. The soldering iron should not directly touch the components. Assured to be soldering iron for 1 time. Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_prec_e-E04R01 Caution 1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm. 2. The soldering iron should not directly touch the inductor. 5. Cleaning Precautions Cleaning conditions 1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of the cleaninge.g. to remove soldering flux or other materials from the production process. 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics. Technical considerations Cleaning conditions 1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's electrical propertiesespecially insulation resistance. 2. Inappropriate cleaning conditionsinsufficient or excessive cleaningmay detrimentally affect the performance of the inductors. 1 Excessive cleaning a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked; Ultrasonic output Below 20W/ Ultrasonic frequency Below 40kHz Ultrasonic washing period 5 min. or less 6. Post cleaning processes Precautions Application of resin coatings, moldings, etc. to the PCB and components. 1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the inductor's performance. 2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor damage or destruction. 3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors. The use of such resins, molding materials etc. is not recommended. 7. Handling Precautions Breakaway PC boardssplitting along perforations 1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. General handling precautions 1. Always wear static control bands to protect against ESD. 2. Keep the inductors away from all magnets and magnetic objects. 3. Use non-magnetic tweezers when handling inductors. 4. Any devices used with the inductors soldering irons, measuring instruments should be properly grounded. 5. Keep bare hands and metal productsi.e., metal deskaway from chip electrodes or conductive areas that lead to chip electrodes. 6. Keep inductors away from items that generate magnetic fields such as speakers or coils. Mechanical considerations 1. Be careful not to subject the inductors to excessive mechanical shocks. 1 If inductors are dropped on the floor or a hard surface they should not be used. 2 When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Precautions Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions Ambient temperature Below 30 Humidity Below 70% RH The ambient temperature must be kept below 40. Even under ideal storage conditions inductor electrode solderability decreases as time passes, so inductors should be used within 6 months from the time of delivery. *The packaging material should be kept where no chlorine or sulfur exists in the air. Technical considerations Storage 1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_prec_e-E04R01 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Taiyo Yuden: MDMK2020T1R0MM MDMK2020T1R5MM MDMK2020T2R2MM MDMK2020T3R3MM MDMK2020T4R7MM MDMK2020TR47MM MDMK4040T1R0MF MDMK4040T1R2MF MDMK4040T1R5MF MDMK4040T2R2MF MDMK4040TR47MF MDPK5050T4R7MM MDKK1616T4R7MM MDKK1616T3R3MM MDKK3030T100MM MDKK3030T2R2MM MDKK3030T6R8MM MDKK1616T1R0MM MDKK1616T1R5MM MDKK1616TR47MM MDKK2020T150MM MDMK2020T1R0MMV MDMK2020T1R5MMV MDMK2020TR47MMV MDMK4040TR47MFV MDKK1616T2R2MM MDKK2020T4R7MM MDKK2020TR47MM MDKK3030T1R5MM MDKK3030TR47MM MDMK2020TR68MM MDMK2020TR68MMV MDMK3030TR30MM MDMK3030TR47MM MDMK4040T2R2MFV MDMK4040T4R7MM MDMK3030T3R3MM MDMK3030T4R7MM MDMK4040T100MM MDKK2020T100MM MDKK2020T2R2MM MDKK2020T3R3MM MDMK2020T2R2MMV MDMK3030T1R0MM MDMK4040T1R0MFV MDMK4040T1R0MM MDMK4040T2R2MM MDMK4040T6R8MM MDKK2020T1R0MM MDKK2020T1R5MM MDKK2020TR68MM MDKK3030T1R0MM MDKK3030T3R3MM MDKK3030T4R7MM MDMK2020T3R3MMV MDMK2020T4R7MMV MDMK3030T1R5MM MDMK3030T2R2MM MDMK4040T1R2MFV MDMK4040T1R5MFV MDMK4040T1R5MM MDMK4040T3R3MM MDMK4040TR68MM MDPK5050T3R3MM MDPK5050T6R8MM MDPK5050T100MM MDPK5050T2R2MM MDPK5050T1R0MM