Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2015. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that TAIYO YUDEN CO., LTD. shall not be responsible for any defects in products or equipment incor-
porating such products, which are caused under the conditions other than those specified in this catalog or indi-
vidual specification.
■ Please contact TAIYO YUDEN CO., LTD. for further details of product specifications as the individual specification
is available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact TAIYO YUDEN CO., LTD. for more detail in ad-
vance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called TAIYO YUDENs official sales channel).
It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel.
■ Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may
occur in connection with a third party's intellectual property rights and other related rights arising from your usage
of products in this catalog. TAIYO YUDEN CO., LTD. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to Foreign Exchange and For-
eign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
16
i_smd_MD_e-E04R01
METAL CORE SMD POWER INDUCTORS（MCOILTM MD SERIES）
REFLOW
■PARTS NUMBER *Operating Temp.：-40～+125℃（Including self-generated heat）
M D K K 1 6 1 6 T 1 R 0 M M △ △＝Blank space
① ② ③ ④ ⑤ ⑥ ⑦ ⑧
①Series name
Code Series name
MD Metal base coil specification
②Dimensions（H）
Code Dimensions（H）［mm］
JE 0.95
KK 1.0
MK 1.2
PK 1.4
WK 2.0
③Dimensions（L×W）
Code Dimensions（L×W）［mm］
1616 1.6×1.6
2020 2.0×2.0
3030 3.0×3.0
4040 4.0×4.0
5050 4.9×4.9
④Packaging
Code Packaging
T Taping
⑤Nominal inductance
Code
（example） Nominal inductance［μH］
R47 0.47
1R0 1.0
4R7 4.7
※R＝Decimal point
⑥Inductance tolerance
Code Inductance tolerance
M ±20％
N ±30％
⑦Special code
Code Special code
F Ferrite coating
M Metal coating
⑧Internal code
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
L
W H
f
e
e
Recommended Land Patterns
B
A A
C
Type A B C
MDKK1616 0.5 1.1 0.65
MDJE2020
0.65 1.35 2.0
MDKK2020
MDMK2020
MDKK3030 0.8 2.2 2.7
MDMK3030
MDJE4040
1.2 2.8 3.7
MDMK4040
MDWK4040
MDPK5050 1.5 3.6 4.2
Unit：mm
Type L W H e f Standard quantity
［pcs］ Taping
MDKK1616 1.64±0.1
(0.065±0.004)
1.64±0.1
(0.065±0.004)
1.0 max
(0.039 max)
0.40 ＋0.2/－0.1
(0.016 +0.008/-0.004)
1.0±0.2
(0.039±0.008) 2500
MDJE2020 2.0±0.15
(0.079±0.006)
2.0±0.15
(0.079±0.006)
0.95 max
(0.0374 max)
0.50±0.2
(0.02±0.008)
1.25±0.2
(0.049±0.008) 2500
MDKK2020 2.0±0.15
(0.079±0.006)
2.0±0.15
(0.079±0.006)
1.0 max
(0.039 max)
0.50±0.2
(0.02±0.008)
1.25±0.2
(0.049±0.008) 2500
MDMK2020 2.0±0.15
(0.079±0.006)
2.0±0.15
(0.079±0.006)
1.2 max
(0.047 max)
0.50±0.2
(0.02±0.008)
1.25±0.2
(0.049±0.008) 2500
MDKK3030 3.0±0.1
(0.118±0.004)
3.0±0.1
(0.118±0.004)
1.0 max
(0.039 max)
0.90±0.2
(0.035±0.008)
1.9±0.2
(0.075±0.008) 2000
MDMK3030 3.0±0.1
(0.118±0.004)
3.0±0.1
(0.118±0.004)
1.2 max
(0.047 max)
0.90±0.2
(0.035±0.008)
1.9±0.2
(0.075±0.008) 2000
MDJE4040 4.0±0.2
(0.157±0.008)
4.0±0.2
(0.157±0.008)
0.95 max
(0.0374 max)
1.1±0.2
(0.043±0.008)
2.5±0.2
(0.098±0.008) 1000
MDMK4040 4.0±0.2
(0.157±0.008)
4.0±0.2
(0.157±0.008)
1.2 max
(0.047 max)
1.1±0.2
(0.043±0.008)
2.5±0.2
(0.098±0.008) 1000
MDWK4040 4.0±0.2
(0.157±0.008)
4.0±0.2
(0.157±0.008)
2.0 max
(0.0787 max)
1.1±0.2
(0.043±0.008)
2.5±0.2
(0.098±0.008) 1000
MDPK5050 4.9±0.2
(0.193±0.008)
4.9±0.2
(0.193±0.008)
1.4 max
(0.055 max)
1.20±0.2
(0.047±0.008)
3.3±0.2
(0.130±0.008) 1000
Unit：mm（inch）
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
INDUCTORS
／
POWER INDUCTORS
REFLOW
METAL CORE SMD POWER INDUCTORS(MCOILTM MD SERIES)
43
16
■PARTS NUMBER
●MDKK1616 type
Saturation current
Idc1
Temperature rise current
Idc2
MDKK1616TR47MM RoHS 0.47 ±20％- 0.095 3,300 1,500 1
MDKK1616T1R0MM RoHS 1.0 ±20％- 0.140 2,200 1,200 1
MDKK1616T1R5MM RoHS 1.5 ±20％- 0.185 1,750 1,100 1
MDKK1616T2R2MM RoHS 2.2 ±20％- 0.250 1,500950 1
MDKK1616T3R3MM RoHS 3.3 ±20％- 0.515 1,150650 1
MDKK1616T4R7MM RoHS 4.7 ±20％- 0.640950550 1
MDKK1616T6R8MM RoHS 6.8 ±20％- 0.820630520 1
MDKK1616T100MM RoHS 10 ±20％- 1.120550450 1
MDKK1616T150MM RoHS 15 ±20％- 1.800460400 1
●MDJE2020 type
Saturation current
Idc1
Temperature rise current
Idc2
MDJE2020T1R0MM RoHS 1.0 ±20％- 0.121 3,100 1,550 1
MDJE2020T2R2MM RoHS 2.2 ±20％- 0.266 1,550 1,050 1
MDJE2020T3R3MM RoHS 3.3 ±20％- 0.340 1,350950 1
MDJE2020T4R7MM RoHS 4.7 ±20％- 0.475 1,200850 1
MDJE2020T6R8MM RoHS 6.8 ±20％- 0.630800750 1
MDJE2020T100MM RoHS 10 ±20％- 1.040700550 1
●MDKK2020 type
Saturation current
Idc1
Temperature rise current
Idc2
MDKK2020TR47MM RoHS 0.47 ±20％- 0.046 3,500 2,200 1
MDKK2020TR68MM RoHS 0.68 ±20％- 0.060 3,200 2,000 1
MDKK2020T1R0MM RoHS 1.0 ±20％- 0.085 2,900 1,700 1
MDKK2020T1R5MM RoHS 1.5 ±20％- 0.133 1,900 1,350 1
MDKK2020T2R2MM RoHS 2.2 ±20％- 0.165 1,650 1,200 1
MDKK2020T3R3MM RoHS 3.3 ±20％- 0.275 1,300940 1
MDKK2020T4R7MM RoHS 4.7 ±20％- 0.435 1,050750 1
MDKK2020T100MM RoHS 10 ±20％- 0.690750630 1
MDKK2020T150MM RoHS 15 ±20％- 1.180550480 1
●MDMK2020 type
Saturation current
Idc1
Temperature rise current
Idc2
MDMK2020TR47MM RoHS 0.47 ±20％- 0.046 4,200 2,300 1
MDMK2020TR68MM RoHS 0.68 ±20％- 0.058 3,500 2,000 1
MDMK2020T1R0MM RoHS 1.0 ±20％- 0.064 2,550 1,900 1
MDMK2020T1R5MM RoHS 1.5 ±20％- 0.086 2,000 1,650 1
MDMK2020T2R2MM RoHS 2.2 ±20％- 0.109 1,750 1,450 1
MDMK2020T3R3MM RoHS 3.3 ±20％- 0.178 1,350 1,150 1
MDMK2020T4R7MM RoHS 4.7 ±20％- 0.242 1,150950 1
●MDKK3030 type
Saturation current
Idc1
Temperature rise current
Idc2
MDKK3030TR47MM RoHS 0.47 ±20％- 0.039 5,400 3,900 1
MDKK3030T1R0MM RoHS 1.0 ±20％- 0.086 4,400 2,400 1
MDKK3030T1R5MM RoHS 1.5 ±20％- 0.100 3,000 2,100 1
MDKK3030T2R2MM RoHS 2.2 ±20％- 0.144 2,500 1,900 1
MDKK3030T3R3MM RoHS 3.3 ±20％- 0.248 2,000 1,350 1
MDKK3030T4R7MM RoHS 4.7 ±20％- 0.345 1,700 1,150 1
MDKK3030T6R8MM RoHS 6.8 ±20％- 0.437 1,400 1,000 1
MDKK3030T100MM RoHS 10 ±20％- 0.575 1,100850 1
●MDMK3030 type
Saturation current
Idc1
Temperature rise current
Idc2
MDMK3030TR30MM RoHS 0.30 ±20％- 0.020 7,600 5,500 1
MDMK3030TR33MM RoHS 0.33 ±20％- 0.020 6,400 5,500 1
MDMK3030TR47MM RoHS 0.47 ±20％- 0.027 6,300 4,700 1
MDMK3030T1R0MM RoHS 1.0 ±20％- 0.050 4,300 3,300 1
MDMK3030T1R5MM RoHS 1.5 ±20％- 0.074 3,400 2,500 1
MDMK3030T2R2MM RoHS 2.2 ±20％- 0.112 2,800 2,100 1
MDMK3030T3R3MM RoHS 3.3 ±20％- 0.167 2,100 1,650 1
MDMK3030T4R7MM RoHS 4.7 ±20％- 0.263 1,800 1,350 1
Measuring
frequency［MHz］
Self-resonant
frequency
［MHｚ］（min.）
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］Measuring
frequency［MHz］
Rated current ※） ［ｍA］
Nominal inductance
［μH］Inductance toleranceDC Resistance
［Ω］（max.）
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Self-resonant
frequency
［MHｚ］（min.）
Rated current ※） ［ｍA］
DC Resistance
［Ω］（max.）
Inductance tolerance
EHS
Measuring
frequency［MHz］
Nominal inductance
［μH］
Parts number EHS
Parts number EHS
Rated current ※） ［ｍA］
Measuring
frequency［MHz］
Parts number
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］
Nominal inductance
［μH］
EHS Nominal inductance
［μH］Inductance tolerance
Parts number
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］
i_smd_MD_e-E04R01
Measuring
frequency［MHz］
Measuring
frequency［MHz］
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
INDUCTORS
／
POWER INDUCTORS
44
16
■PARTS NUMBER
●MDJE4040 type
Saturation current
Idc1
Temperature rise current
Idc2
MDJE4040TR47MM RoHS 0.47 ±20％- 0.040 6,000 4,000 1
MDJE4040T1R0MM RoHS 1.0 ±20％- 0.069 4,700 3,000 1
MDJE4040T1R5MM RoHS 1.5 ±20％- 0.084 3,000 2,700 1
MDJE4040T2R2MM RoHS 2.2 ±20％- 0.115 2,400 2,400 1
MDJE4040T3R3MM RoHS 3.3 ±20％- 0.200 2,000 1,800 1
MDJE4040T4R7MM RoHS 4.7 ±20％- 0.250 1,900 1,600 1
MDJE4040T6R8MM RoHS 6.8 ±20％- 0.370 1,500 1,300 1
MDJE4040T100MM RoHS 10 ±20％- 0.510 1,400 1,100 1
●MDMK4040 type
Saturation current
Idc1
Temperature rise current
Idc2
MDMK4040TR47MF RoHS 0.47 ±20％- 0.029 7,500 4,600100
MDMK4040T1R0MF RoHS 1.0 ±20％- 0.047 5,200 3,500100
MDMK4040T1R2MF RoHS 1.2 ±20％- 0.047 4,200 3,500100
MDMK4040T1R5MF RoHS 1.5 ±20％- 0.065 3,700 3,300100
MDMK4040T2R2MF RoHS 2.2 ±20％- 0.092 3,200 2,500100
●MDMK4040M type
Saturation current
Idc1
Temperature rise current
Idc2
MDMK4040TR68MM RoHS 0.68 ±20％- 0.029 6,700 5,000 1
MDMK4040T1R0MM RoHS 1.0 ±20％- 0.036 5,000 4,500 1
MDMK4040T1R5MM RoHS 1.5 ±20％- 0.065 4,500 3,200 1
MDMK4040T2R2MM RoHS 2.2 ±20％- 0.079 3,800 2,800 1
MDMK4040T3R3MM RoHS 3.3 ±20％- 0.130 3,200 2,200 1
MDMK4040T4R7MM RoHS 4.7 ±20％- 0.160 2,500 1,900 1
MDMK4040T6R8MM RoHS 6.8 ±20％- 0.230 1,900 1,600 1
MDMK4040T100MM RoHS 10 ±20％- 0.330 1,700 1,400 1
●MDWK4040M type
Saturation current
Idc1
Temperature rise current
Idc2
MDWK4040TR10MM RoHS 0.10 ±20％- 0.007021,00012,000 1
MDWK4040TR18MM RoHS 0.18 ±20％- 0.009819,000 9,200 1
MDWK4040TR22MM RoHS 0.22 ±20％- 0.009817,000 9,200 1
MDWK4040TR33MM RoHS 0.33 ±20％- 0.01316,000 7,800 1
MDWK4040TR47MM RoHS 0.47 ±20％- 0.01310,000 7,800 1
MDWK4040TR68MM RoHS 0.68 ±20％- 0.016 8,000 7,300 1
MDWK4040T1R0MM RoHS 1.0 ±20％- 0.027 7,000 5,100 1
MDWK4040T1R5MM RoHS 1.5 ±20％- 0.041 7,000 4,100 1
MDWK4040T2R2MM RoHS 2.2 ±20％- 0.054 5,400 3,500 1
MDWK4040T3R3MM RoHS 3.3 ±20％- 0.075 3,700 3,000 1
MDWK4040T4R7MM RoHS 4.7 ±20％- 0.107 3,500 2,500 1
MDWK4040T6R8MM RoHS 6.8 ±20％- 0.158 2,900 2,000 1
MDWK4040T1R0MM RoHS 10 ±20％- 0.194 2,200 1,600 1
●MDPK5050 type
Saturation current
Idc1
Temperature rise current
Idc2
MDPK5050T1R0MM RoHS 1.0 ±20％- 0.040 8,500 4,300 1
MDPK5050T2R2MM RoHS 2.2 ±20％- 0.055 4,100 3,600 1
MDPK5050T3R3MM RoHS 3.3 ±20％- 0.086 3,800 2,900 1
MDPK5050T4R7MM RoHS 4.7 ±20％- 0.102 3,500 2,500 1
MDPK5050T6R8MM RoHS 6.8 ±20％- 0.138 2,700 2,200 1
MDPK5050T100MM RoHS 10 ±20％- 0.225 2,2002,000 1
※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※） The temperature rise current value（Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)
※） The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value.
Rated current ※） ［ｍA］
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Nominal inductance
［μH］Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］
Measuring
frequency［kHz］
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Parts number EHS
Parts number EHS
Nominal inductance
［μH］Inductance tolerance
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］
Rated current ※） ［ｍA］
i_smd_MD_e-E04R01
Measuring
frequency［MHz］
Measuring
frequency［MHz］
Measuring
frequency［MHz］
Measuring
frequency［MHz］
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
INDUCTORS
／
POWER INDUCTORS
45
16
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_pack_e-E04R01
METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES）
■PACKAGING
①Minimum Quantity
Type Standard Quantity [pcs]
Tape ＆ Reel
MDKK1616 2500
MDJE2020
MDKK2020
MDMK2020
2500
MDKK3030
MDMK3030 2000
MDJE4040
MDMK4040
MDWK4040
1000
MDPK5050 1000
②Tape Material
●Embossed Tape
Top tape
Base tape
Sprocket hole
Chip cavity
Chip
Chip Filled
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
Electrode
(bottom view)
Type Chip cavity Insertion pitch Tape thickness
A B F T K
MDKK1616 1.79±0.1
(0.071±0.004)
1.79±0.1
(0.071±0.004)
4.0±0.1
(0.157±0.004)
0.25±0.05
(0.010±0.002)
1.1±0.1
(0.043±0.004)
MDJE2020
MDKK2020
MDMK2020
2.2±0.1
（0.102±0.004）
2.2±0.1
（0.102±0.004）
4.0±0.1
（0.157±0.004）
0.25±0.05
（0.009±0.002）
1.3±0.1
（0.051±0.004）
MDKK3030
MDMK3030
3.2±0.1
(0.126±0.004)
3.2±0.1
(0.126±0.004)
4.0±0.1
(0.157±0.004)
0.3±0.05
(0.012±0.002)
1.4±0.1
(0.055±0.004)
Unit：mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_pack_e-E04R01
●Embossed tape 12mm wide (0.47 inches wide)
Electrode
(bottom view)
Type Chip cavity Insertion pitch Tape thickness
A B F T K
MDJE4040
MDMK4040
MDWK4040
4.3±0.1
（0.169±0.004）
4.3±0.1
（0.169±0.004）
8.0±0.1
（0.315±0.004）
0.3±0.1
（0.012±0.004）
1.6±0.1
（0.063±0.004）
MDPK5050 5.25±0.1
（0.207±0.004）
5.25±0.1
（0.207±0.004）
8.0±0.1
（0.315±0.004）
0.3±0.1
（0.012±0.004）
1.6±0.1
（0.063±0.004）
Unit：mm（inch）
④Leader and Blank portion
⑤Reel size
Type Reel size (Reference values)
φD φd W
MDKK1616
180±0.5
（7.087±0.019）
60±1.0
（2.36±0.04）
10.0±1.5
（0.394±0.059）
MDJE2020
MDKK2020
MDMK2020
MDKK3030
MDMK3030
MDJE4040
MDMK4040
MDWK4040
180±3.0
（7.087±0.118）
60±2.0
（2.36±0.08）
14.0±1.5
（0.551±0.059）
MDPK5050
Unit：mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_pack_e-E04R01
⑥Top Tape Strength
Top tape strength
Type Peel-off strength
MDKK1616
0.1N～1.0N
MDJE2020
MDKK2020
MDMK2020
MDKK3030
MDMK3030
MDJE4040
MDMK4040
MDWK4040 0.1N～1.3N
MDPK5050
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-E04R01
METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES）
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value MD series －40～＋125℃
Test Methods and
Remarks Including self-generated heat
2. Storage Temperature Range
Specified Value MD series －40～＋85℃
Test Methods and
Remarks －5 to 40℃ for the product with taping.
3. Rated current
Specified Value MD series Within the specified tolerance
4. Inductance
Specified Value MD series Within the specified tolerance
Test Methods and
Remarks
Measuring equipment : LCR Meter （HP 4285A or equivalent）
Measuring condition : Please see item list.
5. DC Resistance
Specified Value MD series Within the specified tolerance
Test Methods and
Remarks Measuring equipment : DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value MD series －
7. Temperature characteristic
Specified Value MD series Inductance change : Within ±10%
Test Methods and
Remarks
Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
8. Resistance to flexure of substrate
Specified Value MD series No damage
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size : 100×40×1.0 mm
Test board material : Glass epoxy-resin
Solder cream thickness : 0.10 mm
9. Insulation resistance : between wires
Specified Value MD series －
10. Insulation resistance : between wire and core
Specified Value MD series －
11. Withstanding voltage : between wire and core
Specified Value MD series －
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-E04R01
12. Adhesion of terminal electrode
Specified Value MD series Shall not come off PC board
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Applied force : 10N to X and Y directions.
Duration : 5s.
Solder cream thickness : 0.10mm.
13. Resistance to vibration
Specified Value MD series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range 10～55Hz
Total Amplitude 1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method 10Hz to 55Hz to 10Hz for 1min.
Time
X
For 2 hours on each X, Y, and Z axis. Y
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value MD series At least 90％ of surface of terminal electrode is covered by new solder.
Test Methods and
Remarks
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature 245±5℃
Time 5±1.0 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
15. Resistance to soldering heat
Specified Value MD series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test sample shall be exposed to reflow oven at 230±5℃ for 40 seconds, with peak temperature at 260±5℃ for 5 seconds, 2 times.
Test board material : Glass epoxy-resin
Test board thickness : 1.0mm
16. Thermal shock
Specified Value MD series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified
time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step Temperature (℃) Duration (min)
1 －40±3 30±3
2 Room temperature Within 3
3 ＋85±2 30±3
4 Room temperature Within 3
17. Damp heat
Specified Value MD series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.
Temperature 60±2℃
Humidity 90～95%RH
Time 500＋24/－0 hour
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-E04R01
18. Loading under damp heat
Specified Value MD series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature 60±2℃
Humidity 90～95％RH
Applied current Rated current
Time 500＋24/－0 hour
19. Low temperature life test
Specified Value MD series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature －40±2℃
Time 500＋24/－0 hour
20. High temperature life test
Specified Value MD series －
21. Loading at high temperature life test
Specified Value MD series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and applied the rated current continuously as shown in
below table.
Temperature 85±2℃
Applied current Rated current
Time 500＋24/－0 hour
22. Standard condition
Specified Value MD series
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_prec_e-E02R01
METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES）
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions ◆Land pattern design
1. Please refer to a recommended land pattern.
Technical
considerations
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
considerations
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
◆Recommended conditions for using a soldering iron (NR10050 Type)
・ Put the soldering iron on the land-pattern.
・ Soldering iron's temperature - Below 350℃
・ Duration - 3 seconds or less
・ The soldering iron should not directly touch the inductor.
Technical
considerations
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
・NR30/40/50/60/80, NRV20/30, NRH24/30, NRS20/40/50/60/80 Type, NR10050 Type, NS101/125 Type
Recommended reflow condition (Pb free solder)
5. Cleaning
Precautions ◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
Technical
considerations
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_prec_e-E02R01
6. Handling
Precautions
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
◆Board mounting
1. There shall be no pattern or via between terminals at the bottom of product.
2. Components which are located in peripheral of product shall not make contact with surface (top, side) of product.
Technical
considerations
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
◆Board mounting
1. If there is pattern or via between terminals at the bottom of product, it may cause characteristics change.
2. If components which are located in peripheral of product make contact with surface (top, side) of product, it may cause damage or
characteristics change.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : －5～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
i_wound_MA_e-E04R01
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MA SERIES）
REFLOW
■.pmeT gnitarepO * REBMUN STRAP ：-40～+105℃（Including self-generated heat）
M A K K 2 0 1 6 T 1 R 0 M △ △ △＝Blank space
① ② ③ ④ ⑤ ⑥ ⑦ ⑧
①Series name
Code Series name
MA Metal Core Wire-wound Chip Power Inductor
②Dimensions（T）
Code Dimensions（T）［mm］
0.1 KK
2.1 KM
③Dimensions（L×W）
Code Dimensions（L×W）［mm］
6.1×0.2 6102
0.2×5.2 0252
④Packaging
Code Packaging
gnipaT T
⑤Nominal inductance
Code
（example） Nominal inductance［μH］
74.0 74R
0.1 0R1
7.4 7R4
※R＝Decimal point
⑥Inductance tolerance
Code Inductance tolerance
％02± M
⑦Special code
Code Special code
dradnatS △
⑧Internal code
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
L
T
e
W
Type L W T e Standard quantity
［pcs］ Taping
MAKK2016 2.0±0.1
（0.079±0.004）
1.6±0.1
（0.063±0.004）
1.0 max
（0.039 max）
0.5±0.3
（0.020±0.012） 3000
MAKK2520 2.5±0.2
（0.098±0.008）
2.0±0.2
（0.079±0.008）
1.0 max
（0.039 max）
0.5±0.3
（0.020±0.012） 3000
MAMK2520 2.5±0.2
（0.098±0.008）
2.0±0.2
（0.079±0.008）
1.2 max
（0.047 max）
0.5±0.3
（0.020±0.012） 3000
Unit：mm（inch）
■PARTS NUMBER
●MAKK2016 type
Saturation current
Idc1
Temperature rise current
Idc2
MAKK2016TR24M RoHS 0.24 ±20％- 0.042 4,200 3,000 2
MAKK2016TR47M RoHS 0.47 ±20％- 0.460 3,200 2,800 2
MAKK2016TR68M RoHS 0.68 ±20％- 0.065 2,500 2,500 2
MAKK2016T1R0M RoHS 1.0 ±20％- 0.075 2,200 2,200 2
MAKK2016T1R5M RoHS 1.5 ±20％- 0.130 1,600 1,650 2
MAKK2016T2R2M RoHS 2.2 ±20％- 0.160 1,500 1,500 2
MAKK2016T3R3M RoHS 3.3 ±20％- 0.255 1,150 1,200 2
MAKK2016T4R7M RoHS 4.7 ±20％- 0.380 1,000 950 2
●MAKK2520 type
Saturation current
Idc1
Temperature rise current
Idc2
MAKK2520TR47M RoHS 0.47 ±20％- 0.046 3,900 3,200 2
MAKK2520TR68M RoHS 0.68 ±20％- 0.059 3,700 2,900 2
MAKK2520T1R0M RoHS 1.0 ±20％- 0.072 2,700 2,500 2
MAKK2520T2R2M RoHS 2.2 ±20％- 0.156 1,900 1,500 2
MAKK2520T4R7M RoHS 4.7 ±20％- 0.300 1,300 1,100 2
●MAMK2520 type
Saturation current
Idc1
Temperature rise current
Idc2
MAMK2520TR47M RoHS 0.47 ±20％- 0.039 4,200 3,400 2
MAMK2520TR68M RoHS 0.68 ±20％- 0.048 3,200 3,200 2
MAMK2520T1R0M RoHS 1 ±20％- 0.059 3,100 2,700 2
MAMK2520T2R2M RoHS 2.2 ±20％- 0.110 2,000 1,900 2
MAMK2520T3R3M RoHS 3.3 ±20％- 0.156 1,800 1,700 2
MAMK2520T4R7M RoHS 4.7 ±20％- 0.260 1,500 1,300 2
※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※） The temperature rise current value（Idc2) is the DC current value having temperature increase by 40℃. (at 20℃)
※） The rated current value is following either Idc1 or Idc2, which is the lower one.
Rated current ※） ［ｍA］（max.）Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］（max.）Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］（max.）Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］Inductance tolerance
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
INDUCTORS
／
POWER INDUCTORS
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS(MCOIL
TM
MA SERIES)
REFLOW
46
16
i_wound_MA-H_e-E04R01
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MA-H SERIES）
REFLOW
■. pme T g n i t a r e pO *
R E BMU N S T R A P
：-40～+125℃（Including self-generated heat）
M A K K 2 0 1 6 H 1 R 0 M △ △ △＝Blank space
① ② ③ ④ ⑤ ⑥ ⑦ ⑧
①Series name
Code Series name
MA Metal Core Wire-wound Chip Power Inductor
②Dimensions（T）
Code Dimensions（T）［mm］
0.1 KK
2.1 KM
③Dimensions（L×W）
Code Dimensions（L×W）［mm］
6.1×0.2 6102
0.2×5.2 0252
④Packaging
Code Packaging or Special specification
H Taping（High characteristics）
⑤Nominal inductance
Code
（example） Nominal inductance［μH］
74.0 7 4R
0.1 0R1
7.4 7R4
※R＝Decimal point
⑥Inductance tolerance
Code Inductance tolerance
％0 2± M
⑦Special code
Code Special code
d r adna tS △
⑧Internal code
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
L
T
e
W
Type L W T e Standard quantity
［pcs］ Taping
MAKK2016H 2.0±0.1
（0.079±0.004）
1.6±0.1
（0.063±0.004）
1.0 max
（0.039 max）
0.5±0.3
（0.020±0.012） 3000
MAKK2520H 2.5±0.2
（0.098±0.008）
2.0±0.2
（0.079±0.008）
1.0 max
（0.039 max）
0.5±0.3
（0.020±0.012） 3000
MAMK2520H 2.5±0.2
（0.098±0.008）
2.0±0.2
（0.079±0.008）
1.2 max
（0.047 max）
0.5±0.3
（0.020±0.012） 3000
Unit：mm（inch）
■PARTS NUMBER
●MAKK2016H type
Saturation current
Idc1
Temperature rise current
Idc2
MAKK2016HR24M RoHS 0.24 ±20％- 0.026 5,800 4,000 2
MAKK2016HR33M RoHS 0.33 ±20％- 0.030 4,700 3,500 2
MAKK2016HR47M RoHS 0.47 ±20％- 0.036 4,300 3,300 2
MAKK2016HR68M RoHS 0.68 ±20％- 0.050 3,200 2,700 2
MAKK2016H1R0M RoHS 1.0 ±20％- 0.070 2,700 2,300 2
●MAKK2520H type
Saturation current
Idc1
Temperature rise current
Idc2
MAKK2520HR33M RoHS 0.33 ±20％-0.026 6200 4300 2
MAKK2520HR47M RoHS 0.47 ±20％-0.029 5700 4000 2
MAKK2520HR68M RoHS 0.68 ±20％-0.043 4300 3400 2
MAKK2520H1R0M RoHS 1.0 ±20％-0.053 3800 3000 2
MAKK2520H2R2M RoHS 2.2 ±20％-0.120 2500 1800 2
●MAMK2520H type
Saturation current
Idc1
Temperature rise current
Idc2
MAMK2520HR47M RoHS 0.47 ±20％-0.026 5800 4100 2
MAMK2520HR68M RoHS 0.68 ±20％-0.036 5100 3500 2
MAMK2520H1R0M RoHS 1.0 ±20％-0.045 4300 3100 2
MAMK2520H1R5M RoHS 1.5 ±20％-0.065 3300 2600 2
MAMK2520H2R2M RoHS 2.2 ±20％-0.090 2800 2200 2
※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※） The temperature rise current value（Idc2) is the DC current value having temperature increase by 40℃. (at 20℃)
※） The rated current value is following either Idc1 or Idc2, which is the lower one.
Rated current ※） ［ｍA］（max.）Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］（max.）Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］（max.）Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
■PARTS NUMBER
●MAKK2016H type
Saturation current
Idc1
Temperature rise current
Idc2
MAKK2016HR24M RoHS 0.24 ±20％ - 0.026 5,800 4,000 2
MAKK2016HR33M RoHS 0.33 ±20％ - 0.030 4,700 3,500 2
MAKK2016HR47M RoHS 0.47 ±20％ - 0.036 4,300 3,300 2
MAKK2016HR68M RoHS 0.68 ±20％ - 0.050 3,200 2,700 2
MAKK2016H1R0M RoHS 1.0 ±20％ - 0.070 2,700 2,300 2
●MAKK2520H type
Saturation current
Idc1
Temperature rise current
Idc2
MAKK2520HR33M RoHS 0.33 ±20％ - 0.026 6200 4300 2
MAKK2520HR47M RoHS 0.47 ±20％ - 0.029 5700 4000 2
MAKK2520HR68M RoHS 0.68 ±20％ - 0.043 4300 3400 2
MAKK2520H1R0M RoHS 1.0 ±20％ - 0.053 3800 3000 2
MAKK2520H2R2M RoHS 2.2 ±20％ - 0.120 2500 1800 2
●MAMK2520H type
Saturation current
Idc1
Temperature rise current
Idc2
MAMK2520HR47M RoHS 0.47 ±20％ - 0.026 5800 4100 2
MAMK2520HR68M RoHS 0.68 ±20％ - 0.036 5100 3500 2
MAMK2520H1R0M RoHS 1.0 ±20％ - 0.045 4300 3100 2
MAMK2520H1R5M RoHS 1.5 ±20％ - 0.065 3300 2600 2
MAMK2520H2R2M RoHS 2.2 ±20％ - 0.090 2800 2200 2
※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※） The temperature rise current value（Idc2) is the DC current value having temperature increase by 40℃. (at 20℃)
※） The rated current value is following either Idc1 or Idc2, which is the lower one.
Rated current ※） ［ｍA］（max.） Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］ Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］（max.） Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］ Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］（max.） Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］ Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
i_wound_MA-H_e-E04R01
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
INDUCTORS
／
POWER INDUCTORS
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS(MCOIL
TM
MA-H SE
RIES)
REFLOW
47
16
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_pack_e-E04R01
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS
(MCOIL
TM MA SERIES / MCOILTM MA-Ｈ SERIES)
■PACKAGING
①Minimum Quantity
Type Standard Quantity [pcs]
Tape ＆ Reel
MAKK2016 3000
MAKK2520 3000
MAMK2520 3000
②Tape Material
●Embossed Tape
Top tape
Base tape
Sprocket hole
Chip cavity
Chip
Chip Filled
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
Type Chip cavity Insertion pitch Tape thickness
A B F T K
MAKK2016 1.9±0.1
（0.075±0.004）
2.3±0.1
（0.091±0.004）
4.0±0.1
（0.157±0.004）
0.25±0.05
（0.009±0.002）
1.1 max
（0.043 max）
MAKK2520 2.3±0.1
(0.091±0.004)
2.8±0.1
(0.110±0.004)
4.0±0.1
（0.157±0.004）
0.3±0.05
(0.012±0.002)
1.1 max
（0.043 max）
MAMK2520 2.3±0.1
(0.091±0.004)
2.8±0.1
(0.110±0.004)
4.0±0.1
(0.157±0.004)
0.3±0.05
(0.012±0.002)
1.45 max
(0.057 max)
Unit：mm（inch）
④Leader and Blank portion
160 mm ～ 200 mm
Direction of tape feed
Blank portions Chip cavity Leader
160 mm or more
400 mm ～ 560 mm
Blank portions
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_pack_e-E04R01
⑤Reel size
Type Reel size (Reference values)
φD φd W
MAKK2016 180+0/-3
（7.087+0/-0.118）
60+1/-0
（2.36+0.039/0）
10.0±1.5
（0.394±0.059）
MAKK2520
MAMK2520
Unit：mm（inch）
⑥Top Tape Strength
The top The top tape requires a peel-off force of 0.1 to 1.2N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_reli_e-E04R01
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS
(MCOIL
TM MA SERIES / MCOILTM MA-Ｈ SERIES)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value MA series －40～＋105℃
MA-H series －40～＋125℃
Test Methods and
Remarks Including self-generated heat
2. Storage Temperature Range
Specified Value MA series －40～＋85℃
MA-H series
Test Methods and
Remarks 0 to 40℃ for the product with taping.
3. Rated current
Specified Value MA series Within the specified tolerance
MA-H series
4. Inductance
Specified Value MA series Within the specified tolerance
MA-H series
Test Methods and
Remarks
Measuring equipment : LCR Meter （HP 4285A or equivalent）
Measuring frequency : 2MHz、1V
5. DC Resistance
Specified Value MA series Within the specified tolerance
MA-H series
Test Methods and
Remarks Measuring equipment : DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value MA series －
MA-H series
7. Temperature characteristic
Specified Value MA series Inductance change : Within ±15%
MA-H series
Test Methods and
Remarks
Measurement of inductance shall be taken at temperature range within －40℃～＋85℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
8. Resistance to flexure of substrate
Specified Value MA series No damage
MA-H series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size : 100×40×1.0 mm
Test board material : Glass epoxy-resin
Solder cream thickness : 0.12 mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_reli_e-E04R01
9. Insulation resistance : between wires
Specified Value MA series －
MA-H series
10. Insulation resistance : between wire and core
Specified Value MA series MAKK2016、MAMK2520 タイプ：DC25V 100kΩ min
MAKK2520 タイプ ：DC20V 100kΩ min
MA-H series
11. Withstanding voltage : between wire and core
Specified Value MA series －
MA-H series
12. Adhesion of terminal electrode
Specified Value MA series No abnormality.
MA-H series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Applied force : 10N to X and Y directions.
Duration : 5s.
Solder cream thickness : 0.12mm.
13. Resistance to vibration
Specified Value MA series Inductance change : Within ±10%
No significant abnormality in appearance.
MA-H series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range 10～55Hz
Total Amplitude 1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method 10Hz to 55Hz to 10Hz for 1min.
Time
X
For 2 hours on each X, Y, and Z axis. Y
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value MA series At least 90％ of surface of terminal electrode is covered by new solder.
MA-H series
Test Methods and
Remarks
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature 245±5℃
Time 5±0.5 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
15. Resistance to soldering heat
Specified Value MA series Inductance change : Within ±10%
No significant abnormality in appearance.
MA-H series
Test Methods and
Remarks
The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 3 times.
Test board material : Glass epoxy-resin
Test board thickness : 1.0mm
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_reli_e-E04R01
16. Thermal shock
Specified Value MA series Inductance change : Within ±10%
No significant abnormality in appearance.
MA-H series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified
time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step Temperature (℃) Duration (min)
1 －40±3 30±3
2 Room temperature Within 3
3 ＋85±2 30±3
4 Room temperature Within 3
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
17. Damp heat
Specified Value MA series Inductance change : Within ±10%
No significant abnormality in appearance.
MA-H series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.
Temperature 60±2℃
Humidity 90～95%RH
Time 500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
18. Loading under damp heat
Specified Value MA series Inductance change : Within ±10%
No significant abnormality in appearance.
MA-H series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature 60±2℃
Humidity 90～95％RH
Applied current Rated current
Time 500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
19. Low temperature life test
Specified Value MA series Inductance change : Within ±10%
No significant abnormality in appearance.
MA-H series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature －40±2℃
Time 500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
20. High temperature life test
Specified Value MA series Inductance change : Within ±10%
No significant abnormality in appearance.
MA-H series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature 85±2℃
Time 500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
21. Loading at high temperature life test
Specified Value MA series －
MA-H series
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_reli_e-E04R01
22. Standard condition
Specified Value
MA series Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
MA-H series
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_prec_e-E04R01
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS
(MCOIL
TM MA SERIES / MCOILTM MA-Ｈ SERIES)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions ◆Land pattern design
1. Please refer to a recommended land pattern.
Technical
considerations
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
considerations
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
Technical
considerations
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
Recommended reflow condition (Pb free solder)
5. Cleaning
Precautions ◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
Technical
considerations
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_prec_e-E04R01
6. Handling
Precautions
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
Technical
considerations
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : 0～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
i_wound_MB_e-E04R01
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MB SERIES）
REFLOW
■PARTS NUMBER * Operating Temp.：-40～+105℃（Including self-generated heat）
M B K K 1 6 0 8 T 1 R 0 M △ △＝Blank space
① ② ③ ④ ⑤ ⑥ ⑦
①Series name
Code Series name
MB Metal Wire-Wound chip power inductor
②Dimensions（T）
Code Dimensions（T）［mm］
KK 1.0
MK 1.2
③Dimensions（L×W）
Code Type（inch） Dimensions
（L×W）［mm］
1608 1608（0603） 1.6×0.8
2012 2012（0805） 2.0×1.25
2520 2520（1008） 2.5×2.0
④Packaging
Code Packaging
T Taping
⑤Nominal inductance
Code
（example） Nominal inductance［μH］
R24 0.24
1R0 1.0
4R7 4.7
※R＝Decimal point
⑥Inductance tolerance
Code Inductance tolerance
M ±20％
N ±30％
⑦Internal code
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
Surface Mounting
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to these products is reflow soldering only.
Type A B C
1608 0.55 0.70 1.00
2012 0.60 1.00 1.45
2520 0.60 1.50 2.00
Unit：mm
Type L W T e Standard quantity［pcs］
Paper tape Embossed tape
MBKK1608 1.6±0.2
（0.063±0.008）
0.8±0.2
（0.031±0.008）
1.0 max
（0.040 max）
0.45±0.15
（0.016±0.006） － 3000
MBKK2012 2.0±0.2
（0.079±0.008）
1.25±0.2
（0.049±0.008）
1.0 max
（0.040 max）
0.5±0.2
（0.020±0.008） － 3000
MBMK2520 2.5±0.2
（0.098±0.008）
2.0±0.2
（0.079±0.008）
1.2 max
（0.047 max）
0.5±0.2
（0.020±0.008） － 3000
Unit：mm（inch）
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
INDUCTORS
／
POWER INDUCTORS
METAL WIRE-WOUND CHIP POWER INDUCTORS(MCOIL
TM
MB SERIES)
REFLOW
48
16
■PARTS NUMBER
●1608（0603）TYPE
Saturation current
Idc1
Temperature rise current
Idc2
MBKK1608TR24N RoHS 0.24 ±30％ - 0.049 1,650 2,300 1.0
MBKK1608TR47N RoHS 0.47 ±30％ - 0.104 1,100 1,400 1.0
MBKK1608TR68N RoHS 0.68 ±30％ - 0.120 950 1,200 1.0
MBKK1608T1R0M RoHS 1.0 ±20％ - 0.150 800 1,150 1.0
MBKK1608T1R5M RoHS 1.5 ±20％ - 0.200 650 1,000 1.0
MBKK1608T2R2M RoHS 2.2 ±20％ - 0.345 520 750 1.0
MBKK1608T3R3M RoHS 3.3 ±20％ - 0.512 450 600 1.0
MBKK1608T4R7M RoHS 4.7 ±20％ - 0.730 370 500 1.0
●2012（0805）TYPE
Saturation current
Idc1
Temperature rise current
Idc2
MBKK2012TR24N RoHS 0.24 ±30％ - 0.041 3,000 2,400 1.0
MBKK2012TR47N RoHS 0.47 ±30％ - 0.078 2,000 1,650 1.0
MBKK2012TR68N RoHS 0.68 ±30％ - 0.090 1,800 1,500 1.0
MBKK2012T1R0M RoHS 1.0 ±20％ - 0.106 1,500 1,450 1.0
MBKK2012T1R5M RoHS 1.5 ±20％ - 0.173 1,200 1,100 1.0
MBKK2012T2R2M RoHS 2.2 ±20％ - 0.290 900 850 1.0
MBKK2012T3R3M RoHS 3.3 ±20％ - 0.500 700 650 1.0
MBKK2012T4R7M RoHS 4.7 ±20％ - 0.615 600 600 1.0
●2520（1008）TYPE
Saturation current
Idc1
Temperature rise current
Idc2
MBMK2520TR24N RoHS 0.24 ±30％ - 0.026 4,750 3,500 1.0
MBMK2520TR47N RoHS 0.47 ±30％ - 0.042 3,900 2,600 1.0
MBMK2520TR68N RoHS 0.68 ±30％ - 0.058 3,150 2,150 1.0
MBMK2520T1R0M RoHS 1.0 ±20％ - 0.072 2,350 1,850 1.0
MBMK2520T1R5M RoHS 1.5 ±20％ - 0.106 2,050 1,500 1.0
MBMK2520T2R2M RoHS 2.2 ±20％ - 0.159 1,800 1,250 1.0
MBMK2520T3R3M RoHS 3.3 ±20％ - 0.260 1,400 970 1.0
MBMK2520T4R7M RoHS 4.7 ±20％ - 0.380 1,150 800 1.0
※）The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※）The temperature rise current value (Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］ Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］ Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
Rated current ※） ［ｍA］ Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］ Inductance tolerance
Rated current ※） ［ｍA］ Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］ Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
i_wound_MB_e-E04R01
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
INDUCTORS
／
POWER INDUCTORS
49
16
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_pack_e-E04R01
METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM MB SERIES)
■PACKAGING
①Minimum Quantity
Type Standard Quantity [pcs]
Tape ＆ Reel
MBKK1608 3000
MBKK2012 3000
MBMK2520 3000
②Tape Material
●Embossed Tape
Top tape
Base tape
Sprocket hole
Chip cavity
Chip
Chip Filled
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
K
T
Electrode
(bottom view)
Type Chip cavity Insertion pitch Tape thickness
A B F T K
MBKK1608 1.1
(0.043)
1.9
(0.075)
4.0±0.1
(0.157±0.004)
0.25±0.05
(0.010±0.002)
1.6 max
(0.063 max)
MBKK2012 1.45
(0.057)
2.2
(0.087)
4.0±0.1
(0.157±0.004)
0.25±0.05
(0.010±0.002)
1.6 max
(0.063 max)
MBMK2520 2.3
(0.091)
2.8
(0.110)
4.0±0.1
(0.157±0.004)
0.3±0.05
(0.012±0.002)
1.45 max
(0.057 max)
Unit：mm（inch）
④Leader and Blank portion
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_pack_e-E04R01
⑤Reel size
Type Reel size (Reference values)
φD φd W
MBKK1608 180+0/-3
（7.087+0/-0.118）
60+1/-0
（2.36+0.039/0）
10.0±1.5
（0.394±0.059）
MBKK2012
MBMK2520
Unit：mm（inch）
⑥Top Tape Strength
The top The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E04R01
METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM MB SERIES)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value MB series －40～＋105℃
Test Methods and
Remarks Including self-generated heat
2. Storage Temperature Range
Specified Value MB series －40～＋85℃
Test Methods and
Remarks 0 to 40℃ for the product with taping.
3. Rated current
Specified Value MB series Within the specified tolerance
4. Inductance
Specified Value MB series Within the specified tolerance
Test Methods and
Remarks
Measuring equipment : LCR Meter （HP 4285A or equivalent）
Measuring frequency : 1MHz、1V
5. DC Resistance
Specified Value MB series Within the specified tolerance
Test Methods and
Remarks Measuring equipment : DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value MB series －
7. Temperature characteristic
Specified Value MB series Inductance change : Within ±15%
Test Methods and
Remarks
Measurement of inductance shall be taken at temperature range within －40℃～＋105℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
8. Resistance to flexure of substrate
Specified Value MB series No damage
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size : 100×40×1.0 mm
Test board material : Glass epoxy-resin
Solder cream thickness : 0.1 mm
9. Insulation resistance : between wires
Specified Value MB series －
10. Insulation resistance : between wire and core
Specified Value MB series DC25V 100kΩ min
11. Withstanding voltage : between wire and core
Specified Value MB series －
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E04R01
12. Adhesion of terminal electrode
Specified Value MB series No abnormality.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Applied force : 10N to X and Y directions.
Duration : 5s.
Solder cream thickness : 0.1mm.
13. Resistance to vibration
Specified Value MB series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range 10～55Hz
Total Amplitude 1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method 10Hz to 55Hz to 10Hz for 1min.
Time
X
For 2 hours on each X, Y, and Z axis. Y
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value MB series At least 90％ of surface of terminal electrode is covered by new solder.
Test Methods and
Remarks
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature 245±5℃
Time 5±0.5 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
15. Resistance to soldering heat
Specified Value MB series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 3 times.
Test board material : Glass epoxy-resin
Test board thickness : 1.0mm
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
16. Thermal shock
Specified Value MB series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified
time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step Temperature (℃) Duration (min)
1 －40±3 30±3
2 Room temperature Within 3
3 ＋85±2 30±3
4 Room temperature Within 3
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
17. Damp heat
Specified Value MB series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.
Temperature 60±2℃
Humidity 90～95%RH
Time 1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E04R01
18. Loading under damp heat
Specified Value MB series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature 60±2℃
Humidity 90～95％RH
Applied current Rated current
Time 1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
19. Low temperature life test
Specified Value MB series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature －40±2℃
Time 1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
20. High temperature life test
Specified Value MB series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature 85±2℃
Time 500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
21. Loading at high temperature life test
Specified Value MB series －
22. Standard condition
Specified Value MB series
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_prec_e-E03R01
METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM MB SERIES)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions ◆Land pattern design
1. Please refer to a recommended land pattern.
Technical
considerations
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
considerations
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
Technical
considerations
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
Recommended reflow condition (Pb free solder)
5sec max
40sec max
230℃ min
90±30sec
Peak：260+0/-5℃
150～180
Heating Time［sec］
300
200
100
0
Temperature［℃］
5. Cleaning
Precautions ◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
Technical
considerations
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_prec_e-E03R01
6. Handling
Precautions
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
Technical
considerations
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : 0～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
i_wound_ME_e-E04R01
REFLOW
■.pmeT gnitarepO * REBMUN STRAP ：-40～+125℃（Including self-generated heat）
M E K K 2 0 1 6 T 1 R 0 M △ △ △＝Blank space
① ② ③ ④ ⑤ ⑥ ⑦ ⑧
①Series name
Code Series name
ME Metal Wire-wound Chip Power Inductor
②Dimensions（T）
Code Dimensions（T）［mm］
0.1 KK
③Dimensions（L×W）
Code Dimensions（L×W）［mm］
6.1×0.2 6102
④Packaging
Code Packaging
gnipaT T
⑤Nominal inductance
Code
（example） Nominal inductance［μH］
74.0 74R
0.1 0R1
7.4 7R4
※R＝Decimal point
⑥Inductance tolerance
Code Inductance tolerance
％02± M
⑦Special code
Code Special code
dradnatS △
⑧Internal code
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Type L W T e Standard quantity
［pcs］ Taping
MEKK2016 2.0±0.2
（0.079±0.008）
1.6±0.2
（0.063±0.008）
1.0 max
（0.039 max）
0.5±0.3
（0.020±0.012） 3000
Unit：mm（inch）
■PARTS NUMBER
●MEKK2016 type
Saturation current
Idc1
Temperature rise current
Idc2
MEKK2016TR47M RoHS 0.47 ±20％- 0.030 4,500 4,300 1
MEKK2016T1R0M RoHS 1.0 ±20％- 0.060 3,600 3,100 1
MEKK2016T2R2M RoHS 2.2 ±20％- 0.150 2,400 1,900 1
※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※） The temperature rise current value（Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)
※） The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value.
※） Idc2 Measurement board data Material:FR4
Board dimensions：100×50×1.6t ㎜
Pattern dimensions：45×45 ㎜ (Double side board)
Pattern thickness：70μm
Rated current ※） ［ｍA］（max.）Measuring
frequency［MHz］
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
INDUCTORS
／
POWER INDUCTORS
METAL WIRE-WOUND CHIP POWER INDUCTORS(MCOILTM ME SERIES)
REFLOW
50
16
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_pack_e-E04R01
METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM ME SERIES)
■PACKAGING
①Minimum Quantity
Type Standard Quantity [pcs]
Tape ＆ Reel
MEKK2016 3000
②Tape Material
●Embossed Tape
Top tape
Base tape
Sprocket hole
Chip cavity
Chip
Chip Filled
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
Type Chip cavity Insertion pitch Tape thickness
A B F T K
MEKK2016 1.9±0.1
（0.075±0.004）
2.45±0.1
（0.097±0.004）
4.0±0.1
（0.157±0.004）
0.25±0.05
（0.009±0.002）
1.2 max
（0.047 max）
Unit：mm（inch）
④Leader and Blank portion
160 mm ～ 200 mm
Direction of tape feed
Blank portions Chip cavity Leader
160 mm or more
400 mm ～ 560 mm
Blank portions
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_pack_e-E04R01
⑤Reel size
Type Reel size (Reference values)
φD φd W
MEKK2016 180+0/-3
（7.087+0/-0.118）
60+1/-0
（2.36+0.039/0）
10.0±1.5
（0.394±0.059）
Unit：mm（inch）
⑥Top Tape Strength
The top The top tape requires a peel-off force of 0.1 to 1.0N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_reli_e-E04R01
METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM ME SERIES)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value ME series －40～＋125℃
Test Methods and
Remarks Including self-generated heat
2. Storage Temperature Range
Specified Value ME series －40～＋85℃
Test Methods and
Remarks 0 to 40℃ for the product with taping.
3. Rated current
Specified Value ME series Within the specified tolerance
4. Inductance
Specified Value ME series Within the specified tolerance
Test Methods and
Remarks
Measuring equipment : LCR Meter （HP 4294A or equivalent）
Measuring frequency : 1MHz、0.5V
5. DC Resistance
Specified Value ME series Within the specified tolerance
Test Methods and
Remarks Measuring equipment : DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value ME series －
7. Temperature characteristic
Specified Value ME series Inductance change : Within ±15%
Test Methods and
Remarks
Measurement of inductance shall be taken at temperature range within －40℃～＋85℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
8. Resistance to flexure of substrate
Specified Value ME series No damage
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size : 100×40×1.0 mm
Test board material : Glass epoxy-resin
Solder cream thickness : 0.12 mm
9. Insulation resistance : between wires
Specified Value ME series －
10. Insulation resistance : between wire and over-coating
Specified Value ME series DC25V 100kΩmin
11. Withstanding voltage : between wire and over-coating
Specified Value ME series －
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_reli_e-E04R01
12. Adhesion of terminal electrode
Specified Value ME series No abnormality.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Applied force : 10N to X and Y directions.
Duration : 5s.
Solder cream thickness : 0.12mm.
13. Resistance to vibration
Specified Value ME series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range 10～55Hz
Total Amplitude 1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method 10Hz to 55Hz to 10Hz for 1min.
Time
X
For 2 hours on ach X, Y, and Z axis. Y
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value ME series At least 90％ of surface of terminal electrode is covered by new solder.
Test Methods and
Remarks
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature 245±5℃
Time 5±0.5 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
15. Resistance to soldering heat
Specified Value ME series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 2 times.
Test board material : Glass epoxy-resin
Test board thickness : 1.0mm
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
16. Thermal shock
Specified Value ME series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified
time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step Temperature (℃) Duration (min)
1 －40±3 30±3
2 Room temperature Within 3
3 ＋85±2 30±3
4 Room temperature Within 3
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
17. Damp heat
Specified Value ME series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.
Temperature 60±2℃
Humidity 90～95%RH
Time 500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_reli_e-E04R01
18. Loading under damp heat
Specified Value ME series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature 60±2℃
Humidity 90～95％RH
Applied current Rated current
Time 500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
19. Low temperature life test
Specified Value ME series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature －40±2℃
Time 500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
20. High temperature life test
Specified Value ME series Inductance change : Within ±10%
No significant abnormality in appearance.
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature 85±2℃
Time 500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
21. Loading at high temperature life test
Specified Value ME series －
22. Standard condition
Specified Value ME series
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_prec_e-E04R01
METAL WIRE-WOUND CHIP POWER INDUCTORS (MCOILTM ME SERIES)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions ◆Land pattern design
1. Please refer to a recommended land pattern.
Technical
considerations
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
considerations
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
Technical
considerations
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
Recommended reflow condition (Pb free solder)
5. Cleaning
Precautions ◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
Technical
considerations
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_prec_e-E04R01
6. Handling
Precautions
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
Technical
considerations
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : 0～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
i_mlci_MC_e-E04R01
METAL MULTILAYER CHIP POWER INDUCTORS（MCOILTM MC SERIES）
REFLOW
■.pmeT gnitarepO * REBMUN STRAP ：-40～+125℃(Including self-generated heat)
M C K K 2 0 1 2 T 1 R 0 M G △＝Blank space
① ② ③ ④ ⑤ ⑥ ⑦
①Series name
Code Series name
MC Metal base multilayer chip power inductor
②Thickness
Code Thickness［mm］
xam 56.0 EF
xam 0.1 KK
③Dimensions（L×W）
Code Type（inch） Dimensions
（L×W）［mm］
1608 1608（0603） 1.6×0.8
2012 2012（0805） 2.0×1.2
④Packaging
Code Packaging
gnipaT Ｔ
⑤Nominal inductance
Code
（example） Nominal inductance［μH］
42.0 42R
74.0 74R
0.1 0R1
※R＝Decimal point
⑥Inductance tolerance
Code Inductance tolerance
％02± M
⑦Special code
Code Special code
G 5 surface terminal
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Type L W T e Standard quantity［pcs］
Paper tape Embossed tape
MCFE1608
（0603）
1.6±0.2
（0.063±0.008）
0.8±0.2
（0.031±0.008）
0.65 max
（0.026 max）
0.3±0.2
（0.012±0.008） 4000 －
MCKK2012
（0805）
2.0±0.2
（0.079±0.008）
1.2±0.2
（0.047±0.008）
1.0 max
（0.039 max）
0.5±0.3
（0.02±0.012） ― 3000
Unit：mm（inch）
■PARTS NUMBER
●MC1608
（max.） （typ.）
MCFE1608TR24MG RoHS 0.24 ±20％0.100 0.075 2.6 1.5 1 0.65
MCFE1608TR47MG RoHS 0.47 ±20％0.150 0.114 2.0 1.2 1 0.65
MCFE1608T1R0MG RoHS 1.0 ±20％0.340 0.270 1.4 0.8 1 0.65
●MC2012
（max.） （typ.）
MCKK2012T1R0MG RoHS 1.0 ±20％0.123 0.100 2.0 1.4 1 1.0
※Idc1 is the DC value at which the initial L value is decreased within 30% by the application of DC bias. （at 20℃）
※Idc2 is the DC value at which the temperature of element is increased within 40℃ by the application of DC bias. （at 20℃）
DC Resistance
［Ω］
Rated
current(Idc1)
［A］（max.）
Measuring
frequency
［MHz］
Thickness
［mm］（max.）
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Rated
current(Idc2)
［A］（max.）
Thickness
［mm］（max.）
Parts number EHS Nominal inductance
［μH］Inductance tolerance
Measuring
frequency
［MHz］
DC Resistance
［Ω］
Rated
current(Idc1)
［A］（max.）
Rated
current(Idc2)
［A］（max.）
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
INDUCTORS
／
POWER INDUCTORS
METAL MULTILAYER CHIP POWER INDUCTORS(MCOIL
TM
MC SERIES)
REFLOW
51
16
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E04R01
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■PACKAGING
①Minimum Quantity
●Tape & Reel Packaging
Type Thickness
mm（inch）
Standard Quantity ［pcs］
Paper Tape Embossed Tape
CK1608（0603） 0.8 （0.031） 4000 －
CK2125（0805） 0.85（0.033） 4000 －
1.25（0.049） － 2000
CKS2125（0805） 0.85（0.033） 4000 －
1.25（0.049） － 2000
CKP1608（0603） 0.8 （0.031） 4000 －
CKP2012（0805） 0.9 （0.035） － 3000
CKP2016（0806） 0.9 （0.035） － 3000
CKP2520（1008）
0.7 （0.028） － 3000
0.9 （0.035） － 3000
1.1 （0.043） － 2000
NM2012（0805） 0.9 （0.035） － 3000
NM2520（1008） 0.9 （0.035） － 3000
1.1 （0.043） － 2000
LK1005（0402） 0.5 （0.020） 10000 －
LK1608（0603） 0.8 （0.031） 4000 －
LK2125（0805） 0.85（0.033） 4000 －
1.25（0.049） － 2000
HK0603（0201） 0.3 （0.012） 15000 －
HK1005（0402） 0.5 （0.020） 10000 －
HK1608（0603） 0.8 （0.031） 4000 －
HK2125（0805） 0.85（0.033） － 4000
1.0 （0.039） － 3000
HKQ0402（01005） 0.2 （0.008） 20000 40000
HKQ0603W（0201） 0.3 （0.012） 15000 －
HKQ0603C（0201） 0.3 （0.012） 15000 －
HKQ0603S（0201） 0.3 （0.012） 15000 －
HKQ0603U（0201） 0.3 （0.012） 15000 －
AQ105（0402） 0.5 （0.020） 10000 －
BK0402（01005） 0.2 （0.008） 20000 －
BK0603（0201） 0.3 （0.012） 15000 －
BK1005（0402） 0.5 （0.020） 10000 －
BKH0603（0201） 0.3 （0.012） 15000 －
BKH1005（0402） 0.5 （0.020） 10000 －
BK1608（0603） 0.8 （0.031） 4000 －
BK2125（0805） 0.85（0.033） 4000 －
1.25（0.049） － 2000
BK2010（0804） 0.45（0.018） 4000 －
BK3216（1206） 0.8 （0.031） － 4000
BKP0402（01005） 0.2 （0.008） 20000 －
BKP0603（0201） 0.3 （0.012） 15000 －
BKP1005（0402） 0.5 （0.020） 10000 －
BKP1608（0603） 0.8 （0.031） 4000 －
BKP2125（0805） 0.85（0.033） 4000 －
MCF0605（0202） 0.3 （0.012） 15000 －
MCF0806（0302） 0.4 （0.016） － 10000
MCF1210（0504） 0.55（0.022） － 5000
MCF2010（0804） 0.45（0.018） － 4000
MCFE1608（0603） 0.65（0.026） 4000 -
MCKK2012（0805） 1.00（0.039） - 3000
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E04R01
②Taping material
●Card board carrier tape
Top tape
Base tape
Sprocket hole
Bottom tape Chip cavity
Chip Filled
Chip
CK 1608
CKP 1608
CK 2125
CKS 2125
LK 1005
LK 1608
LK 2125
HK 0603
HK 1005
HK 1608
HKQ 0402
HKQ 0603
AQ 105
BK 0402
BK 0603
BK 1005
BK 1608
BK 2125
BK 2010
BKP 0402
BKP 0603
BKP 1005
BKP 1608
BKP 2125
BKH 0603
BKH 1005
MCF 0605
MC 1608
●Embossed Tape
Top tape
Base tape
Sprocket hole
Chip cavity
Chip Filled
Chip
CK 2125
CKS 2125
CKP 2012
CKP 2016
CKP 2520
NM 2012
NM 2520
LK 2125
HKQ 0402
HK 2125
BK 2125
BK 3216
MCF 0806
MCF 1210
MCF 2010
MC 2012
③Taping Dimensions
●Paper tape (8mm wide)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E04R01
Type Thickness
mm（inch）
Chip cavity Insertion Pitch Tape Thickness
Ａ Ｂ Ｆ Ｔ
CK1608（0603） 0.8 （0.031） 1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
CK2125（0805） 0.85（0.033） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
CKS2125（0805） 0.85（0.033） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
CKP1608（0603） 0.8 （0.031） 1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
LK1005（0402） 0.5 （0.020） 0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
LK1608（0603） 0.8 （0.031） 1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
LK2125（0805） 0.85（0.033） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
HK0603（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
HK1005（0402） 0.5 （0.020） 0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
HK1608（0603） 0.8 （0.031） 1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
HKQ0402（01005） 0.2 （0.008） 0.25±0.04
（0.010±0.002）
0.45±0.04
（0.018±0.002）
2.0±0.05
（0.079±0.002）
0.36max
（0.014max）
HKQ0603W（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
HKQ0603C（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
HKQ0603S（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
HKQ0603U（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
AQ105（0402） 0.5 （0.020） 0.75±0.1
（0.030±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
BK0402（01005） 0.2 （0.008） 0.25±0.04
（0.010±0.002）
0.45±0.04
（0.018±0.002）
2.0±0.05
（0.079±0.002）
0.36max
（0.014max）
BK0603（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
BK1005（0402） 0.5 （0.020） 0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
BK1608（0603） 0.8 （0.031） 1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
BK2125（0805） 0.85（0.033） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
BK2010（0804） 0.45（0.018） 1.2±0.1
（0.047±0.004）
2.17±0.1
（0.085±0.004）
4.0±0.1
（0.157±0.004）
0.8max
（0.031max）
BKP0402（01005） 0.2 （0.008） 0.25±0.04
（0.010±0.002）
0.45±0.04
（0.018±0.002）
2.0±0.05
（0.079±0.002）
0.36max
（0.014max）
BKP0603（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
BKP1005（0402） 0.5 （0.020） 0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
BKP1608（0603） 0.8 （0.031） 1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
BKP2125（0805） 0.85（0.033） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
BKH0603（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
BKH1005（0402） 0.5 （0.020） 0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
MCF0605（0202） 0.3 （0.012） 0.62±0.03
（0.024±0.001）
0.77±0.03
（0.030±0.001）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
MCFE1608（0603） 0.65（0.026） 1.1±0.05
（0.043±0.002）
1.9±0.05
（0.075±0.002）
4.0±0.1
（0.157±0.004）
0.72max
（0.028max）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E04R01
●Embossed Tape (8mm wide)
Type Thickness
mm（inch）
Chip cavity Insertion Pitch Tape Thickness
Ａ Ｂ Ｆ K T
CK2125（0805） 1.25（0.049） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
CKS2125（0805） 1.25（0.049） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
CKP2012（0805） 0.9 （0.035） 1.55±0.2
（0.061±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.3
（0.012）
CKP2016（0806） 0.9 （0.035） 1.8±0.1
（0.071±0.004）
2.2±0.1
（0.087±0.004）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.25
（0.01）
CKP2520（1008）
0.7 （0.028）
2.3±0.1
（0.091±0.004）
2.8±0.1
（0.110±0.004）
4.0±0.1
（0.157±0.004）
1.4
（0.055）
0.3
（0.012）
0.9 （0.035） 1.4
（0.055）
1.1 （0.043） 1.7
（0.067）
NM2012（0805） 0.9 （0.035） 1.55±0.2
（0.061±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.3
（0.012）
NM2520（1008）
0.9 （0.035） 2.3±0.1
（0.091±0.004）
2.8±0.1
（0.110±0.004）
4.0±0.1
（0.157±0.004）
1.4
（0.055） 0.3
（0.012）
1.1 （0.043） 1.7
（0.067）
LK2125（0805） 1.25（0.049） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
HK2125（0805）
0.85（0.033） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.5
（0.059） 0.3
（0.012）
1.0 （0.039） 2.0
（0.079）
BK2125（0805） 1.25（0.049） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
BK3216（1206） 0.8（0.031） 1.9±0.1
（0.075±0.004）
3.5±0.1
（0.138±0.004）
4.0±0.1
（0.157±0.004）
1.4
（0.055）
0.3
（0.012）
MCF0806（0302） 0.4 （0.016） 0.75±0.05
（0.030±0.002）
0.95±0.05
（0.037±0.002）
2.0±0.05
（0.079±0.002）
0.55
（0.022）
0.3
（0.012）
MCF1210（0504） 0.55（0.022） 1.15±0.05
（0.045±0.002）
1.40±0.05
（0.055±0.002）
4.0±0.1
（0.157±0.004）
0.65
（0.026）
0.3
（0.012）
MCF2010（0804） 0.45（0.018） 1.1±0.1
（0.043±0.004）
2.3±0.1
（0.091±0.004）
4.0±0.1
（0.157±0.004）
0.85
（0.033）
0.3
（0.012）
MCKK2012（0805） 1.0 （0.039） 1.55±0.2
（0.061±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.25
（0.010）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E04R01
●Embossed Tape (4mm wide)
Type Thickness
mm（inch）
Chip cavity Insertion Pitch Tape Thickness
Ａ Ｂ Ｆ K T
HKQ0402（01005） 0.2 （0.008） 0.23 0.43 1.0±0.02 0.5max. 0.25max.
Unit : mm
④LEADER AND BLANK PORTION
Blank portion Chip cavity Blank portion Leader
160mm or more
(6.3inches or more)
Direction of tape feed
100mm or more
(3.94inches or more)
400mm or more
(15.7inches or more)
⑤Reel Size
E
C
D
R B
t
A
W
A B C D E R
φ178±2.0 φ50 or more φ13.0±0.2 φ21.0±0.8 2.0±0.5 1.0
t W
4mm width tape 1.5max. 5±1.0
8mm width tape 2.5max. 10±1.5
(Unit : mm)
⑥Top tape strength
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below.
0～15° Top tape
Base tape
Pull direction
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
BK0402
－55～＋125℃
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
－55～＋85℃
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0605
－40～＋85℃
MCF 0806
MCF 1210
MCF 2010
CK1608
－40～＋85℃
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HKQ0402
－55～＋125℃
HK0603
HK1005
HK1608 －40～＋85℃
HK2125
HKQ0603W/HKQ0603C/HKQ0603S/
HKQ0603U/ －55～＋125℃
AQ105
MCFE1608 －40～＋125℃（Including self-generated heat）
MCKK2012
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
2. Storage Temperature Range
Specified Value
BK0402
－55～＋125℃
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
－55～＋85℃
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0605
－40～＋85℃
MCF 0806
MCF 1210
MCF 2010
CK1608
－40～＋85℃
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HKQ0402
－55～＋125℃
HK0603
HK1005
HK1608 －40～＋85℃
HK2125
HKQ0603W/HKQ0603C/HKQ0603S/
HKQ0603U/ －55～＋125℃
AQ105
MCFE1608 －40～＋85℃
MCKK2012
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
3. Rated Current
Specified Value
BK0402 150～750mA DC
BK0603 100～500mA DC
BK1005 120～1000mA DC
BKH0603 115～450mA DC
BKH1005 200～300mA DC
BK1608 150～1500mA DC
BK2125 200～1200mA DC
ARRAY BK2010 100mA DC
BK3216 100～200mA DC
BKP0402 0.55～1.1A DC
BKP0603 0.8～1.8A DC
BKP1005 0.8～2.4A DC
BKP1608 1.0～3.0A DC
BKP2125 1.5～4.0A DC
MCF 0605 0.05A DC
MCF 0806 0.1～0.13A DC
MCF 1210 0.1～0.15A DC
MCF 2010 0.1A DC
CK1608 50～60mA DC
CK2125 60～500mA DC
CKS2125 110～280mA DC
CKP1608 0.35～0.9A DC
CKP2012 0.7～1.7A DC
CKP2016 0.9～1.6A DC
CKP2520 1.1～1.8A DC
NM2012 1.0～1.2A DC
NM2520 0.9～1.2A DC
LK1005 20～25mA DC
LK1608 1～150mA DC
LK2125 5～300mA DC
HK0603 60～470mA DC
HK1005 110～300mA DC (-55～+125℃） 200～900mA DC (-55～+85℃)
HK1608 150～300mA DC
HK2125 300mA DC
HKQ0402 100～500mA DC
HKQ0603W 100～850mA DC
HKQ0603C 160～850mA DC
HKQ0603S 130～600mA DC
HKQ0603U 190～900mA DC
AQ105 280～710mA DC
MCFE1608 Idc1 ：1400～2600ｍA DC, Idc2 ：800～1500mA DC
MCKK2012 Idc1 ：2000mA DC, Idc2 ：1400ｍA DC
Definition of rated current：
・In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20℃.
・In the BK Series P type, CK Series P type, NM Series, the rated current is the value of current at which the temperature of the element is increased within 40℃.
・In the LK, HK, HKQ0603, and AQ Series, the rated current is either the DC value at which the initial L value is decreased within 5% with the application of DC bias, or the value of
current at which the temperature of the element is increased within 20℃.
・In the HKQ0402(～9N1), the rated current is either the DC value at which the initial L value is decreased within 5% with the application of DC bias, or the value of current at which the
temperature of the element is increased within 20℃.
・In the HKQ0402(10N～), the rated current is either the DC value at which the initial L value is decreased within 5% with the application of DC bias, or the value of current at which the
temperature of the element is increased within 25℃.
・In the MC Series, Idc1 is the DC value at which the initial L value is decreased within 30% and Idc2 is the DC value at which the temperature of element is increased within 40℃ by
the application of DC bias. （at 20℃）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
4. Impedance
Specified Value
BK0402 10～330Ω ±5Ω(10Ω), ±25%(Other)
BK0603 10～1200Ω ±25%
BK1005 10～1800Ω ±25%
BKH0603 25～1500Ω ±25%
BKH1005 600～1800Ω ±25%
BK1608 22～2500Ω ±25%
BK2125 15～2500Ω ±25%
ARRAY BK2010 5～1000Ω ±25%
BK3216 60～1000Ω ±25%
BKP0402 10～33Ω ±5Ω(10Ω)、±25%(Other)
BKP0603 10～120Ω ±5Ω(10Ω), ±25%(Other)
BKP1005 10～330Ω ±5Ω(EM100), ±25%(Other)
BKP1608 33～470Ω ±25%
BKP2125 33～330Ω ±25%
MCF 0605 12～90Ω ±5Ω(12Ω), ±20%(35Ω), ±25%(Other)
MCF 0806 12～90Ω ±5Ω(12Ω), ±20%(Other)
MCF 1210 40～90Ω ±20%（2H900）,±25%（Other）
MCF 2010 90Ω ±25%
CK1608
－
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HKQ0402
HK0603
HK1005
HK1608
HK2125
HKQ0603W/HKQ0603C/HKQ0603S/
HKQ0603U
AQ105
MCFE1608
MCKK2012
Test Methods and
Remarks
BK0402Series, BKP0402Series
Measuring frequency : 100±1MHz
Measuring equipment : E4991A（or its equivalent）
Measuring jig : 16197A（or its equivalent）
BK0603Series, BKP0603Series
Measuring frequency : 100±1MHz
Measuring equipment : 4291A（or its equivalent）
Measuring jig : 16193A（or its equivalent）
BK1005Series, BKP1005Series ,BKH1005Series
Measuring frequency : 100±1MHz
Measuring equipment : 4291A（or its equivalent）
Measuring jig : 16192A（or its equivalent）, 16193A（or its equivalent）
BK1608・2125Series, BKP1608・2125Series
Measuring frequency : 100±1MHz
Measuring equipment : 4291A（or its equivalent）, 4195A（or its equivalent）
Measuring jig : 16092A（or its equivalent） or 16192A（or its equivalent）/HW
BK2010・3216Series, MCF Series
Measuring frequency : 100±1MHz
Measuring equipment : 4291A（or its equivalent）, 4195A（or its equivalent）
Measuring jig : 16192A（or its equivalent）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
5. Inductance
Specified Value
BK0402
－
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0605
MCF 0806
MCF 1210
MCF 2010
CK1608 4.7～10.0μH： ±20%
CK2125 0.1～10.0μH： ±20%
CKS2125 1.0～10.0μH： ±20%
CKP1608 0.33～2.2μH： ±20%
CKP2012 0.47～4.7μH： ±20%
CKP2016 0.47～4.7μH： ±20%
CKP2520 0.47～4.7μH： ±20%
NM2012 0.82～1.0μH： ±20%
NM2520 1.0～2.2μH： ±20%
LK1005 0.12～2.2μH： ±10 or 20%
LK1608 0.047～33.0μH： ±20% 0.10～12.0μH： ±10%
LK2125 0.047～33.0μH： ±20% 0.10～12.0μH： ±10%
HK0603 1.0～6.2nH： ±0.3nH 6.8～100nH： ±5%
HK1005 1.0～6.2nH： ±0.3nH 6.8～270nH： ±5%
HK1608 1.0～5.6nH： ±0.3nH 6.8～470nH： ±5%
HK2125 1.5～5.6nH： ±0.3nH 6.8～470nH： ±5%
HKQ0402 0.5～3.9nH： ±0.1 or 0.2 or 0.3nH 4.3～5.6nH： ±0.3nH or 3% or 5%
6.2～47nH： ±3 or 5%
HKQ0603W 0.6～3.9nH： ±0.1 or 0.2 or 0.3nH 4.3～6.2nH： ±0.2 or 0.3nH or 3 or 5%
6.8～27nH： ±3 or 5% 33～100nH： ±5%
HKQ0603C 0.6～3.9nH： ±0.1 or 0.2 or 0.3nH 4.3～6.2nH： ±0.2 or 0.3nH 6.8～22nH： ±3 or 5%
HKQ0603S 0.6～6.2nH： ±0.2 or 0.3nH 6.8～22nH： ±3 or 5%
HKQ0603U 0.6～4.2nH： ±0.1 or 0.2 or 0.3nH 4.3～6.5nH： ±0.2 or 0.3nH 6.8～22nH： ±3 or 5%
AQ105 1.0～6.2nH： ±0.3nH 6.8～15nH： ±5%
MCFE1608 0.24～1.0μH： ±20%
MCKK2012 1.0 μH： ±20%
Test Methods and
Remarks
CK、LK、CKP、NM、MC Series
Measuring frequency : 2～4MHz（CK1608）
Measuring frequency : 2～25MHz（CK2125）
Measuring frequency : 2～10MHz（CKS2125）
Measuring frequency : 10～25MHz（LK1005）
Measuring frequency : 1～50MHz（LK1608）
Measuring frequency : 0.4～50MHz（LK2125）
Measuring frequency : 1MHz（CKP1608・CKP2012・CKP2016・CKP2520・NM2012・NM2520・MCFE1608・MCKK2012）
Measuring equipment /jig :・4194A＋16085B＋16092A（or its equivalent） ・4195A＋41951＋16092A（or its equivalent）
・4294A＋16192A（or its equivalent） ・4291A＋16193A（or its equivalent）/LK1005
・ 4285A＋ 42841A ＋ 42842C＋42851 － 61100（ or its equivalent ） /CKP1608･CKP2012・CKP2016・CKP2520・NM2012・
NM2520・MCFE1608・MCKK2012
Measuring current :・1mA rms（0.047～4.7μH）
・0.1mA rms（5.6～33μH）
HK、HKQ、AQ Series
Measuring frequency : 100MHz（HK0603・HK1005・AQ105）
Measuring frequency : 50/100MHz（HK1608・HK2125）
Measuring frequency : 500MHz（HKQ0603C･HKQ0603S・HKQ0603U）
Measuring frequency : 300/500MHz（HKQ0603W）
Measuring frequency : 100/500MHz（HKQ0402）
Measuring equipment /jig :・4291A＋16197A（or its equivalent）/HK0603・AQ105
・4291A＋16193A（or its equivalent）/HK1005
・E4991A＋16197A（or its equivalent）/HKQ0603S・HKQ0603U・HKQ0603W・HKQ0603C
・4291A＋16092A ＋ in-house made jig（or its equivalent）/HK1608・HK2125
・E4991A＋16196D（or its equivalent）/HKQ0402
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
6. Q
Specified Value
BK0402
－
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0605
MCF 0806
MCF 1210
MCF 2010
CK1608
－
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 10～20 min.
LK1608 10～35 min.
LK2125 15～50 min.
HK0603 4～5 min.
HK1005 8 min.
HK1608 8～12 min.
HK2125 10～18 min.
HKQ0402 3～8 min.
HKQ0603W 6～15 min.
HKQ0603C 14～15 min.
HKQ0603S 10～13 min.
HKQ0603U 14 min.
AQ105 8 min.
MCFE1608 －
MCKK2012
Test Methods and
Remarks
LK Series
Measuring frequency : 10～25MHz（LK1005）
Measuring frequency : 1～50MHz（LK1608）
Measuring frequency : 0.4～50MHz（LK2125）
Measuring equipment /jig :・4194A＋16085B＋16092A（or its equivalent）
・4195A＋41951＋16092A（or its equivalent）
・4294A＋16192A（or its equivalent）
・4291A＋16193A（or its equivalent）/LK1005
Measuring current ・1mA rms（0.047～4.7μH）
・0.1mA rms（5.6～33μH）
HK、HKQ、AQ Series
Measuring frequency : 100MHz（HK0603・HK1005・AQ105）
Measuring frequency : 50/100MHz（HK1608・HK2125）
Measuring frequency : 500MHz（HKQ0603C･HKQ0603S・HKQ0603U）
Measuring frequency : 300/500MHz（HKQ0603W）
Measuring frequency : 100/500MHz（HKQ0402）
Measuring equipment /jig :・4291A＋16197A（or its equivalent）/HK0603・AQ105
・4291A＋16193A（or its equivalent）/HK1005
・E4991A＋16197A（or its equivalent）/HKQ0603S・HKQ0603U・HKQ0603W・HKQ0603C
・4291A＋16092A ＋ in-house made jig（or its equivalent）/HK1608, HK2125
・E4991A＋16196D（or its equivalent）HKQ0402
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
7. DC Resistance
Specified Value
BK0402 0.07～1.2Ω max.
BK0603 0.065～1.50Ω max.
BK1005 0.03～0.90Ω max.
BKH0603 0.26～3.20Ω max.
BKH1005 0.85～2.00Ω max.
BK1608 0.05～1.10Ω max.
BK2125 0.05～0.75Ω max.
ARRAY BK2010 0.10～0.90Ω max.
BK3216 0.15～0.80Ω max.
BKP0402 0.05～0.15Ω max.
BKP0603 0.030～0.180Ω max.
BKP1005 0.0273～0.220Ω max.
BKP1608 0.025～0.18Ω max.
BKP2125 0.020～0.075Ω max.
MCF 0605 2.5～6.5Ω max
MCF 0806 2.5～5.0Ω max.
MCF 1210 2.5～4.5Ω max.
MCF 2010 4.5Ω max.
CK1608 0.45～0.85Ω（±30%）
CK2125 0.16～0.65Ω max.
CKS2125 0.12～0.52Ω max.
CKP1608 0.15～0.35Ω max.
CKP2012 0.08～0.28Ω max.
CKP2016 0.075～0.20Ω max
CKP2520 0.05～0.16Ω max.
NM2012 0.10～0.15Ω max.
NM2520 0.11～0.22Ω max.
LK1005 0.41～1.16Ω max.
LK1608 0.2～2.2Ω max.
LK2125 0.1～1.1Ω max.
HK0603 0.11～3.74Ω max.
HK1005 0.08～4.8Ω max.
HK1608 0.05～2.6Ω max.
HK2125 0.10～1.5Ω max.
HKQ0402 0.08～5.0Ω max.
HKQ0603W 0.07～4.1Ω max.
HKQ0603C 0.07～1.6Ω max.
HKQ0603S 0.06～1.29Ω max.
HKQ0603U 0.06～1.29Ω max.
AQ105 0.07～0.45Ω max.
MCFE1608 0.100～0.340Ω max.
MCKK2012 0.123Ω max.
Test Methods and
Remarks Measuring equipment：VOAC-7412, VOAC-7512, VOAC-7521（made by Iwasaki Tsushinki）, HIOKI3227 (or its equivalent)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
8. Self Resonance Frequency（SRF）
Specified Value
BK0402
－
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0605
MCF 0806
MCF 1210
MCF 2010
CK1608 17～25MHz min.
CK2125 24～235MHz min.
CKS2125 24～75MHz min.
CKP1608
－
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 40～180MHz min.
LK1608 9～260MHz min.
LK2125 13～320MHz min.
HK0603 900～10000MHz min.
HK1005 400～10000MHz min.
HK1608 300～10000MHz min.
HK2125 200～4000MHz min.
HKQ0402 1200～10000MHz min.
HKQ0603W 800～10000MHz min.
HKQ0603C 2500～10000MHz min.
HKQ0603S 1900～10000MHz min.
HKQ0603U 1900～10000MHz min.
AQ105 2300～10000MHz min.
MCFE1608 －
MCKK2012
Test Methods and
Remarks
LK、CK Series :
Measuring equipment : 4195A（or its equivalent）
Measuring jig : 41951＋16092A（or its equivalent）
HK、HKQ、AQ Series :
Measuring equipment : 8719C（or its equivalent）・8753D（or its equivalent）/HK2125
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
9. Temperature Characteristic
Specified Value
BK0402
－
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0605
MCF 0806
MCF 1210
MCF 2010
CK1608
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0603
Inductance change：Within ±10％
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603C
HKQ0603S
HKQ0603U
AQ105
MCFE1608
MCKK2012
Test Methods and
Remarks
HK、HKQ、AQ Series：
Temperature range : －30～＋85℃
Reference temperature : ＋20℃
MC Series：
Temperature range : －40～＋85℃
Reference temperature : ＋20℃
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
10. Resistance to Flexure of Substrate
Specified Value
BK0402
No mechanical damage.
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0605
MCF 0806
MCF 1210
MCF 2010
CK1608
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603C
HKQ0603S
HKQ0603U
AQ105
MCFE1608
MCKK2012
Test Methods and
Remarks
Warp : 2mm（BK Series without 0402size、BKP、BKH1005、CK、CKS、CKP、NM、LK、HK、HKQ0603S、HKQ0603U、
AQ Series、MCF1210、MC Series）
: 1mm（BK0402、BKP0402、BKH0603、HKQ0402、HKQ0603W、HKQ0603C Series、MCF Series without 1210 size,）
Testing board : glass epoxy-resin substrate
Thickness : 0.8mm
20
Warp
Board
（Unit：mm）
R-230
45 45
Deviation±1
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
11. Solderability
Specified Value
BK0402
At least 75％ of terminal electrode is covered by new solder.
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0605
MCF 0806
MCF 1210
MCF 2010
CK1608
At least 75％ of terminal electrode is covered by new solder.
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603C
HKQ0603S
HKQ0603U
AQ105
MCFE1608
MCKK2012
Test Methods and
Remarks
Solder temperature ：230±5℃ (JIS Z 3282 H60A or H63A)
Solder temperature ：245±3℃ (Sn/3.0Ag/0.5Cu)
Duration ：4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
12. Resistance to Soldering
Specified Value
BK0402
Appearance：No significant abnormality
Impedance change：Within ±30％
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0605
Appearance：No significant abnormality
Impedance change：Within ±20％
MCF 0806
MCF 1210
MCF 2010
CK1608 No mechanical damage.
Remaining terminal electrode：70％ min
Inductance change
R10～4R7： Within ±10％
6R8～100： Within ±15％
CKS2125 ： Within ±20％
CKP1608、CKP2012、CKP2016、CKP2520、NM2012、NM2520： Within ±30％
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
No mechanical damage.
Remaining terminal electrode：70％ min.
Inductance change： Within ±15％
LK1608 No mechanical damage.
Remaining terminal electrode：70％ min.
Inductance change
47N～4R7： Within ±10％
5R6～330： Within ±15％
LK2125
HK0603
No mechanical damage.
Remaining terminal electrode：70％ min.
Inductance change： Within ±5％
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603C
HKQ0603S
HKQ0603U
AQ105
MCFE1608 No mechanical damage.
Remaining terminal electrode：70％ min.
Inductance change： Within ±10％
MCKK2012
Test Methods and
Remarks
Solder temperature ：260±5℃
Duration ：10±0.5 sec.
Preheating temperature ：150 to 180℃
Preheating time ：3 min.
Flux ：Immersion into methanol solution with colophony for 3 to 5 sec.
Recovery ：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
13. Thermal Shock
Specified Value
BK0402
Appearance：No significant abnormality
Impedance change： Within ±30％
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0605
Appearance：No significant abnormality
Impedance change： Within ±20％
MCF 0806
MCF 1210
MCF 2010
CK1608 No mechanical damage.
Inductance change：Within ±20％ Q change：Within ±30％
Inductance change：Within ±20％ （CKS2125）
CK2125
CKS2125
CKP1608
No mechanical damage.
Inductance change： Within ±30％
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±30％
LK1608
LK2125
HK0603
No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±20％
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603C
HKQ0603S
HKQ0603U
AQ105
MCFE1608 Appearance：No significant abnormality
Inductance change： Within ±10％
MCKK2012
Test Methods and
Remarks
Conditions for 1 cycle
Step temperature（℃） time（min.）
1 Minimum operating temperature ＋0/－3 30±3
2 Room temperature 2～3
3 Maximum operating temperature ＋3/－0 30±3
4 Room temperature 2～3
Number of cycles：5
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
14. Damp Heat（ Steady state）
Specified Value
BK0402
Appearance：No significant abnormality
Impedance change： Within ±30％
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0605
Appearance：No significant abnormality
Impedance change： Within ±20％
MCF 0806
MCF 1210
MCF 2010
CK1608 No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
CK2125
CKS2125 Inductance change： Within ±20％
CKP1608
No mechanical damage.
Inductance change： Within ±30％
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±30％
LK1608
LK2125 No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
HK0603
No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±20％
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603C
HKQ0603S
HKQ0603U
AQ105
MC1608 Appearance：No significant abnormality
Inductance change： Within ±10％
MC2012
Test Methods and
Remarks
BK、BKP、BKH Series、MCF Series：
Temperature ：40±2℃
Humidity ：90 to 95％RH
Duration ：500＋24/－0 hrs
Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQ、MC Series：
Temperature ：40±2℃（ LK、CK、CKS、CKP、NM Series）
：60±2℃（ HK、HKQ、AQ、MC Series）
Humidity ：90 to 95％RH
Duration ：500±12 hrs
Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
15. Loading under Damp Heat
Specified Value
BK0402
Appearance：No significant abnormality
Impedance change： Within ±30％
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
BKP0603
BKP1005
BKP1608
BKP2125
CK1608 No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
CK2125
CKS2125 No mechanical damage.
Inductance change： Within ±20％
CKP1608
No mechanical damage.
Inductance change： Within ±30％
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±30％
LK1608
No mechanical damage.
Inductance change： 0.047～12.0μH： Within ±10％ 15.0～33.0μH： Within ±15％
Q change： Within ±30％
LK2125 No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
HK0603
No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±20％
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603C
HKQ0603S
HKQ0603U
AQ105
MCFE1608 Appearance：No significant abnormality
Inductance change： Within ±10％
MCKK2012
Test Methods and
Remarks
BK、BKP、BKH Series：
Temperature ：40±2℃
Humidity ：90 to 95％RH
Applied current ：Rated current
Duration ：500＋24/－0 hrs
Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
LK、CK、CKS、CKP、NK、HK、HKQ、AQ、MC Series：
Temperature ：40±2℃（ LK、CK、CKS、CKP、NM Series）
：60±2℃（ HK、HKQ、AQ、MC Series）
Humidity ：90 to 95％RH
Applied current ：Rated current
Duration ：500±12 hrs
Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E04R01
16. Loading at High Temperature
Specified Value
BK0402
Appearance：No significant abnormality
Impedance change： Within ±30％
BK0603
BK1005
BKH0603
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0402
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0605
Appearance：No significant abnormality
Impedance change： Within ±20％
MCF 0806
MCF 1210
MCF 2010
CK1608 No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
CK2125
CKS2125 No mechanical damage.
Inductance change： Within ±20％
CKP1608
No mechanical damage.
Inductance change： Within ±30％
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±30％
LK1608
No mechanical damage.
Inductance change： 0.047～12.0μH： Within ±10％ 15.0～33.0μH： Within ±15％
Q change： Within ±30％
LK2125 No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
HK0603
No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±20％
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603C
HKQ0603S
HKQ0603U
AQ105
MCFE1608 Appearance：No significant abnormality
Inductance change： Within ±10％
MCKK2012
Test Methods and
Remarks
BK、BKH、BKP Series、MCF Series：
Temperature : 125±3℃（BK、BKH Series）
: 85±3℃（BKP、MCF Series）
Applied current ：Rated current
Duration ：500＋24/－0 hrs
Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
（See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQ、MC Series：
Temperature : 85±2℃（LK、CK、CKS、CKP、NM、MC Series）
: 85±2℃（HK1608，2125）
: 85±2℃（HK1005, AQ105 operating temperature range－55～＋85℃）
: 125±2℃（HKQ0402, HK0603, HK1005, HKQ0603S, HKQ0603U, HKQ0603W, HKQ0603C, AQ105
operating temperature range－55～＋125℃）
Applied current ：Rated current
Duration ：500±12 hrs
Recovery ：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless
otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E04R01
Precautions on the use of Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications.
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly
differentiated from components used in general purpose applications.
◆Operating Current（Verification of Rated current）
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
Precautions
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
soldering point is separated by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to
design land patterns smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to
minimize stress.
Technical
considerations
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets
which extend above the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
C
B A B
Chip inductor
Land pattern
Solder-resist
L
W
Chip inductor
Recommended land dimensions for wave-soldering （Unit：mm）
Type 1608 2012 2125 2016 2520 3216
Size L 1.6 2.0 2.0 2.0 2.5 3.2
W 0.8 1.25 1.25 1.6 2.0 1.6
A 0.8～1.0 1.0～1.4 1.0～1.4 1.0～1.4 1.0～1.4 1.8～2.5
B 0.5～0.8 0.8～1.5 0.8～1.5 0.8～1.5 0.6～1.0 0.8～1.7
C 0.6～0.8 0.9～1.2 0.9～1.2 1.3～1.6 1.6～2.0 1.2～1.6
Recommended land dimensions for reflow-soldering （Unit：mm）
Type 0402 0603 1005 105 1608 2012 2125 2016 2520 3216
Size L 0.4 0.6 1.0 1.0 1.6 2.0 2.0 2.0 2.5 3.2
W 0.2 0.3 0.5 0.6 0.8 1.25 1.25 1.6 2.0 1.6
A 0.15～0.25 0.20～0.30 0.45～0.55 0.50～0.55 0.8～1.0 0.8～1.2 0.8～1.2 0.8～1.2 1.0～1.4 1.8～2.5
B 0.10～0.20 0.20～0.30 0.40～0.50 0.30～0.40 0.6～0.8 0.8～1.2 0.8～1.2 0.8～1.2 0.6～1.0 0.6～1.5
C 0.15～0.30 0.25～0.40 0.45～0.55 0.60～0.70 0.6～0.8 0.9～1.6 0.9～1.6 1.2～2.0 1.8～2.2 1.2～2.0
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E04R01
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when
designing land-patterns.
d
c
a
b
a
d
c
a
b
a
Recommended land dimension for Reflow-soldering
Type 3216 2010 1210 0806 0605
Size L 3.2 2.0 1.25 0.85 0.65
W 1.6 1.0 1.0 0.65 0.50
a 0.7～0.9 0.5～0.6 0.45～0.55 0.25～0.35 0.27～0.33
b 0.8～1.0 0.5～0.6 0.7～0.8 0.25～0.35 0.17～0.23
c 0.4～0.5 0.2～0.3 0.25～0.35 0.25～0.35 0.20～0.26
d 0.8 0.5 0.55 0.5 0.4
（Unit：mm）
（（2） Examples of good and bad solder application
Item Not recommended Recommended
Mixed mounting of SMD and
leaded components
Lead wire of component
Solder-resist
Component placement close to
the chassis
Chassis
Solder (for grounding)
Electrode pattern
Solder-resist
Hand-soldering of leaded
components near mounted
components
Soldering iron
Lead wire of component
Solder-resist
Horizontal component
placement
Solder-resist
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item Not recommended Recommended
Deflection of the board
Position the component at a
right angle to the direction of
the mechanical stresses that
are anticipated.
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on inductor layout.
An example below should be counted for better design.
E
D
C
A B
Slit
Magnitude of stress A＞B＝C＞D＞E
Perforation
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E04R01
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
◆Selection of Adhesives
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics
unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening
temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and
amounts of adhesive to use.
Technical
considerations
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the
following points should be considered before lowering the pick-up nozzle:
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the
board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be
used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item Improper method Proper method
Single-sided mounting
chipping
or cracking
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
supporting pins
or back-up pins
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical
impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance,
inspection and replacement of the pin should be conducted periodically.
◆Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of
the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the
board may adversely affect component placement, so the following precautions should be noted in the application of adhesives.
（1） Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect
component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much
adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad.
［Recommended conditions］
Figure 0805 case sizes as examples
a 0.3mm min
b 100～120μm
c Area with no adhesive
Amount of adhesives
a a
b
After inductors are bonded
c c
4. Soldering
Precautions
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong
acidity content should not be applied.
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us
about peak temperature when you use lead-free paste.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E04R01
Technical
considerations
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive
amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the
surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may
detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high
humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference
between the components and cleaning process should not be greater than 100℃.
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the
soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal
shock.
［Reflow soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
Preheating 230℃
Within 10sec.
Slow cooling
60sec.
Min.
60sec
Min.
300
200
100
0
Temperature（℃）
Peak
260℃ Max.
Within 10sec.
Slow
cooling
Heating above
230℃
40sec. Max.
300
200
100
0
Temperature（℃）
Preheating150℃
60sec. Min.
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be reflow soldering for 2 times.
Caution
1. The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of the inductor, as shown
below:
1/2T～1/3T
PC board
Solder
Inductor
T
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to
recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
230～250℃
Within 3sec.
Slow cooling
Preheating
120sec. Min.
300
200
100
0
Temperature（℃）
Peak
260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
300
200
100
0
Temperature（℃）
Preheating
150℃
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130℃.
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic soldering
【Recommended condition for Pb-free soldering】
230～280
℃
Within 3sec.
Slow cooling
Preheating
60sec. Min.
400
200
100
0
Temperature（℃）
300
Peak
350℃ Max.
Within 3sec.
Slow cooling
⊿T
400
200
100
0
Temperature（℃）
Preheating
150℃ Min.
60sec. Min.
300
（※⊿Ｔ≦190℃（ 3216Type max）, ⊿Ｔ≦130℃（ 3225 Type min）
※It is recommended to use 20W soldering iron and the tip is 1φ or less.
※The soldering iron should not directly touch the components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable soldering condition, therefore
these profiles are not always recommended.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E04R01
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
5. Cleaning
Precautions
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux
used and purpose of the cleaning（e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's
characteristics.
Technical
considerations
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation
of the inductor's electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors.
（1） Excessive cleaning
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the
cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
Ultrasonic output Below 20W/ℓ
Ultrasonic frequency Below 40kHz
Ultrasonic washing period 5 min. or less
6. Post cleaning processes
Precautions
◆Application of resin coatings, moldings, etc. to the PCB and components.
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the inductor's performance.
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat
may lead to inductor damage or destruction.
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
Precautions
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection
or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded.
5. Keep bare hands and metal products（i.e., metal desk）away from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other
boards or components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
Ambient temperature Below 30℃
Humidity Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions inductor electrode solderability decreases as
time passes, so inductors should be used within 6 months from the time of delivery.
*The packaging material should be kept where no chlorine or sulfur exists in the air.
Technical
considerations
◆Storage
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of
terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within
6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors.
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MDMK4040T4R7MM MDMK3030T3R3MM MDMK3030T4R7MM MDMK4040T100MM MDKK2020T100MM
MDKK2020T2R2MM MDKK2020T3R3MM MDMK2020T2R2MMV MDMK3030T1R0MM MDMK4040T1R0MFV
MDMK4040T1R0MM MDMK4040T2R2MM MDMK4040T6R8MM MDKK2020T1R0MM MDKK2020T1R5MM
MDKK2020TR68MM MDKK3030T1R0MM MDKK3030T3R3MM MDKK3030T4R7MM MDMK2020T3R3MMV
MDMK2020T4R7MMV MDMK3030T1R5MM MDMK3030T2R2MM MDMK4040T1R2MFV MDMK4040T1R5MFV
MDMK4040T1R5MM MDMK4040T3R3MM MDMK4040TR68MM MDPK5050T3R3MM MDPK5050T6R8MM
MDPK5050T100MM MDPK5050T2R2MM MDPK5050T1R0MM
