CPC1330 Single-Pole, Normally Open 4-Pin OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameters Peak Blocking Voltage Ratings 350 Units VP Load Current On-Resistance (max) 120 30 mArms / mADC Description The CPC1330G is a single-pole normally-open (1-Form-A) Solid State Relay with an enhanced input to output isolation barrier of 5000Vrms. The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. Features * * * * * * * 5000Vrms Input/Output Isolation 350VP Blocking Voltage 100% Solid State Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 4-Pin Package Approvals * UL Certified Component: File E76270 * CSA Certified Component: Certificate 1172007 * EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Applications Ordering Information * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment--Patient/Equipment Isolation * Security * Aerospace * Industrial Controls Part Number CPC1330G CPC1330GR CPC1330GRTR Description 4-Pin DIP (100/Tube) 4-Pin Surface Mount (100/Tube) 4-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Control 1 4 2 3 Load Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1330-R06 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1330 Absolute Maximum Ratings @ 25C Parameter Peak Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33mW / C 2 Derate linearly 3mW / C Ratings 350 5 50 1 100 550 5000 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25C Parameters Output Characteristics Load Current Continuous Peak On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output Conditions Symbol Min Typ Max Units mArms / mADC mAP - IL - - 120 t=10ms IL=120mA VL=350VP ILPK RON ILEAK - 25 - 350 30 1 IF=5mA, VL=10V (See Timing Diagram) IF=0mA, VL=50V, f=1MHz ton toff COUT - 25 2 1 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.2 0.9 - 0.33 0.3 1.2 - 2 1.4 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF A ms pF Timing Diagram IF 0 mA 90% IL 2 10% 0 mA ton toff www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1330 PERFORMANCE DATA (@25C Unless Otherwise Noted)* Device Count (N) Device Count (N) 30 20 15 10 25 25 20 20 Device Count (N) 35 25 Typical Turn-Off Time (N=50, IF=5mA, IL=120mA) Typical Turn-On Time (N=50, IF=5mA, IL=120mA) Typical LED Forward Voltage Drop (N=50, IF=5mA) 15 10 5 15 10 5 5 0 0 1.17 1.19 1.21 1.23 0 0.85 1.25 0.90 LED Forward Voltage Drop (V) 1.25 0.21 Typical IF for Switch Dropout (N=50, IL=120mA) 25 20 20 15 10 5 0 0.30 0.31 0.32 0.33 0.34 LED Current (mA) 0.23 0.24 0.25 0.26 Turn-Off Time (ms) 0.27 30 15 10 5 25 20 15 10 5 0 0.29 0.22 Typical On-Resistance Distribution (N=50, IL=120mA) 35 Device Count (N) 25 Device Count (N) Device Count (N) Typical IF for Switch Operation (N=50, IL=120mA) 1.00 1.10 1.15 1.20 Turn-On Time (ms) 0 0.35 0.27 0.28 0.29 0.30 0.31 0.32 0.33 23.5 24 24.5 25 25.5 26 26.5 On-Resistance (:) LED Current (mA) Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 370 I F = 50mA I F = 30mA I F = 20mA I F = 10mA I F = 5mA 1.2 1.0 0.8 -40 -20 0 20 40 60 Temperature (C) 80 100 120 400 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=120mA) 0.7 0.6 Turn-Off Time (ms) 1.4 Turn-On Time (ms) LED Forward Voltage Drop (V) 1.6 380 385 390 395 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=120mA) Typical LED Forward Voltage Drop vs. Temperature 1.8 375 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1330 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 I F = 5mA I F = 10mA -40 -20 0 20 40 60 Temperature (C) 80 0 80 0.4 0.2 -20 0 20 40 60 80 0.6 20 40 60 Temperature (C) 80 100 0.4 50 0 -50 -100 -40 -20 0 20 40 60 80 -150 100 Temperature (C) Temperature (C) -3 -1 0 1 Load Voltage (V) Maximum Load Current vs. Temperature Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured Across Pins 3 & 4 0.016 395 0.014 120 100 I F = 10mA 80 I F = 2mA 60 40 390 385 380 375 20 370 0 365 0 20 40 60 80 Temperature (C) 100 Leakage (PA) 140 Blocking Voltage (VP) 400 160 -20 0 100 180 -40 -20 150 0.8 100 10 Typical Load Current vs. Load Voltage (IF=5mA) 0 -40 20 -40 0.2 0 30 100 Load Current (mA) 0.6 40 0 20 40 60 Temperature (C) 1.0 0.8 50 Typical IF for Switch Dropout vs. Temperature (IL=80mA) 1.2 LED Current (mA) LED Current (mA) I F = 5mA -20 Typical On-Resistance vs. Temperature (IF=10mA, IL=80mA) 60 I F = 10mA -40 1.0 Load Current (mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100 Typical IF for Switch Operation vs. Temperature (IL=80mA) 1.2 Typical Turn-Off Time vs. Temperature (IL=80mA) On-Resistance (:) Typical Turn-On Time vs. Temperature (IL=80mA) Turn-Off Time (ms) Turn-On Time (ms) PERFORMANCE DATA (@25C Unless Otherwise Noted)* 2 3 0.012 0.010 0.008 0.006 0.004 0.002 -40 120 -2 -20 0 20 40 60 Temperature (C) 80 100 0 -40 -20 0 20 40 60 Temperature (C) 80 100 Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10s 100s 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1330 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1330G CPC1330GR MSL 1 MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)C. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1330GR, the solder reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed. For the through-hole device, CPC1330G, and any other processes, the guidelines of J-STD-020 must be observed. Device Maximum Body Temperature (Tc) Time CPC1330GR 250C 15 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1330 MECHANICAL DIMENSIONS CPC1330G 0.991 (0.039) PC Board Pattern (Top View) 0.254 (0.010) 3.30 0.050 (0.130 0.002) 6 - 0.800 DIA. (6 - 0.031 DIA.) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 4.572 0.127 (0.180 0.005) 7.620 0.127 (0.300 0.005) PIN 1 9 (ALL) 9 (ALL) 7.620 0.250 (0.300 0.010) 2.159 (0.085) 0.457 0.076 (0.018 0.003) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) 0.508 (0.020) 3.175 (0.125) 2.540 0.127 (0.100 0.005) Dimensions mm (inches) CPC1330GR 2.540 0.127 (0.100 0.005) PCB Land Pattern 3.300 0.050 (0.130 0.002) 0.635 0.254 (0.025 0.010) 6.350 0.127 (0.250 0.005) 9.525 (0.375) 7.620 0.254 (0.300 0.010) 8.80 (0.346) 1.60 (0.063) PIN #1 0.991 (0.039) 9 1 (ALL) 2.287 (0.09) 3.480 0.076 (0.137 0.003) 4.572 0.127 (0.180 0.005) 0.254 (0.010) 0.95 (0.037) 2.540 0.127 (0.100 0.005) 2.287 0.127 (0.090 0.005) 6 0.102 min / 0.254 max (0.004 min / 0.010 max) www.ixysic.com Dimensions mm (inches) R06 INTEGRATED CIRCUITS DIVISION CPC1330 CPC1330GRTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.000.30 (0.6300.012) B0=5.00 (0.197) K0=4.20 (0.165) K1=3.70 (0.146) A0=10.01 (0.394) P=12.00 (0.472) Dimensions mm (inches) Embossed Carrier Embossment NOTES: 1. All dimensions meet EIA-481-C requirements 2. Unless otherwise noted, tolerances = 0.10 (0.004) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-CPC1330-R06 (c)Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/7/2016 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: IXYS: CPC1330G CPC1330GR CPC1330GRTR