TPS8268150SIPR - Texas Instruments

100

0.0001 0.001 0.01 0.1 1

Efficiency (%)

Iout (A)

2.5 V

3 V

3.6 V

4.2 V

5 V

C006

VIN SW

MODE

VOUT

1.80V / up to 1.6A

TPS8268180SIP

VBAT

MODE pin;

tie to VIN

ENABLE

DC/DC Converter

GND

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

TPS8268180

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SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

TPS8268x 1600-mA High-Efficiency MicroSiP™ Step-Down Converter Module

(Profile < 1.0mm)

The TPS8268x is based on a high-frequency

1 Features synchronous step-down dc-dc converter optimized for

1• Wide VIN Range From 2.5V to 5.5V battery-powered portable applications in which high

• Total Solution Size < 6.7 mm2load currents in a very small solution size and height

are required. The TPS8268x is optimized for high

• Sub 1-mm Profile Solution efficiency and low output voltage ripple and supports

• ±1.5% DC Voltage Accuracy up to 1600-mA load current. With an input voltage

• Up to 1600-mA Load Current range of 2.5-V to 5.5-V, the device supports

applications powered by Li-Ion batteries as well as 5-

• Up to 90% Efficiency V and 3.3-V rails.

• Fixed Output Voltage: The TPS8268x operates at a 5.5-MHz switching

– TPS8268180: 1.80V frequency with spread spectrum capability. For noise-

– TPS8268150: 1.50V sensitive applications, this provides a lower noise

– TPS8268120: 1.20V regulated output, as well as low noise at the input.

The device supports a fixed output voltage, requiring

– TPS8268105: 1.05V no external feedback network.

– TPS8268090: 0.90V These features, combined with high PSRR and AC

• Low EMI by Spread Spectrum PWM Frequency load regulation performance, make this device

Dithering suitable to replace a linear regulator to obtain better

•Best in Class Load and Line Transient Response power conversion efficiency with the same size.

• Internal Soft Start The TPS8268x is packaged in a compact (2.3mm x

• Current Overload and Thermal Shutdown 2.9mm) and low profile BGA package suitable for

Protection automated assembly by standard surface mount

equipment.

2 Applications Device Information(1)

• Optical Modules PART NUMBER PACKAGE BODY SIZE (NOM)

• Cell Phones, Smart-Phones TPS8268180 µSIP 2.30 mm × 2.90 mm

• Solid State Disk Drive Applications TPS8268150 µSIP 2.30 mm × 2.90 mm

• Space constrained applications TPS8268120 µSIP 2.30 mm × 2.90 mm

TPS8268105 µSIP 2.30 mm × 2.90 mm

3 Description TPS8268090 µSIP 2.30 mm × 2.90 mm

The TPS8268x device is a complete DC/DC step-

down power supply optimized for small solution size. (1) For all available packages, see the orderable addendum at

the end of the datasheet.

Included in the package are the switching regulator,

inductor and input/output capacitors. Integration of all

passive components enables a tiny solution size of

only 6.7mm2..Efficiency vs Load Current for TPS8268180

Typical Application

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

www.ti.com

Table of Contents

1 Features.................................................................. 19 Application and Implementation ........................ 13

9.1 Application Information............................................ 13

2 Applications ........................................................... 19.2 Typical Application ................................................. 13

3 Description............................................................. 110 Power Supply Recommendations ..................... 18

4 Revision History..................................................... 211 Layout................................................................... 19

5 Device Comparison Table..................................... 311.1 Layout Guidelines ................................................. 19

6 Pin Configuration and Functions......................... 311.2 Layout Example .................................................... 20

7 Specifications......................................................... 411.3 Surface Mount Information ................................... 20

7.1 Absolute Maximum Ratings ...................................... 411.4 Thermal and Reliability Information ...................... 21

7.2 ESD Ratings.............................................................. 412 Device and Documentation Support ................. 23

7.3 Recommended Operating Conditions....................... 412.1 Documentation Support ....................................... 23

7.4 Thermal Information.................................................. 412.2 Related Links ........................................................ 23

7.5 Electrical Characteristics........................................... 512.3 Trademarks........................................................... 23

7.6 Timing Requirements................................................ 612.4 Electrostatic Discharge Caution............................ 23

7.7 Typical Characteristics.............................................. 612.5 Glossary................................................................ 23

8 Detailed Description............................................ 10 13 Mechanical, Packaging, and Orderable

8.1 Overview................................................................. 10 Information........................................................... 24

8.2 Functional Block Diagram....................................... 10 13.1 Package Summary................................................ 24

8.3 Feature Description................................................. 10 13.2 MicroSiP™ DC/DC Module Package Dimensions 24

8.4 Device Functional Modes........................................ 11

4 Revision History

Changes from Revision B (June 2015) to Revision C Page

• Deleted "Preview" from Device Comparison Table and Electrical Characteristics table for TPS8268120 and

TPS8268180 devices ............................................................................................................................................................ 3

Changes from Revision A (November 2014) to Revision B Page

• Added Preview devices TPS8268180 and TPS8268120 specifications and typical application curves to the data

sheet. ..................................................................................................................................................................................... 1

• Moved timing specs from Electrical Characteristics table to Timing Requirements table ..................................................... 6

Changes from Original (October 2014) to Revision A Page

• Changed from Product Preview to Production Data .............................................................................................................. 1

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

SIP-9

(TOP VIEW)

SIP-9

(BOTTOM VIEW)

GND

MODE

VOUT

GND C1

VIN

GND

VIN

GND

VOUT

MODE

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

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SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

5 Device Comparison Table (1)

DEVICE NUMBER FEATURES OUTPUT VOLTAGE Marking

TPS8268180 PWM Spread Spectrum Modulation 1.80V HK

Output Capacitor Discharge

TPS8268150 PWM Spread Spectrum Modulation 1.50V YR

Output Capacitor Discharge

TPS8268120 PWM Spread Spectrum Modulation 1.20V HJ

Output Capacitor Discharge

TPS8268105 PWM Spread Spectrum Modulation 1.05V YO

Output Capacitor Discharge

TPS8268090 PWM Spread Spectrum Modulation 0.90V YP

Output Capacitor Discharge

(1) For other voltage options please contact a TI sales representative.

6 Pin Configuration and Functions

Pin Functions

PIN I/O DESCRIPTION

NAME NO.

VOUT A1, A2 O Power output pin. Apply output load between this pin and GND.

VIN A3, B3 I Supply voltage connection

This is the enable pin of the device. Connecting this pin low forces the device into shutdown

EN B2 I mode. Pulling this pin high enables the device. This pin must not be left floating and must be

terminated.

MODE B1 I This pin must be tied to the input supply voltage VIN.

GND C1, C2, C3 – Ground pin.

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SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN MAX UNIT

Voltage at VIN(2) –0.3 6

VIVoltage at VOUT(2) –0.3 3.6 V

Voltage at EN, MODE(2) –0.3 VIN + 0.3

Peak output current 1600 mA

TJOperating internal junction temperature range –40 125 °C

Tstg Storage temperature range –55 125 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground terminal.

7.2 ESD Ratings VALUE UNIT

Human body model ±2000 V

V(ESD) Electrostatic discharge (1) (2) Charge device model ±500 V

Machine model ±100 V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT

VIN Input voltage range 2.5 5.5 V

IOUT Peak output current for TPS8268090, TPS8268105, VIN ≥2.8V

TPS8268120 0 1600(1) mA

Peak output current for TPS8268150, TPS8268180 VIN ≥3.2V

IOUT Average output current for TPS8268090, VIN ≥2.7V

TPS8268105, TPS8268120 0 1200(1) mA

Average output current for TPS8268150, VIN ≥2.9V

TPS8268180

IOUT Average output current during soft-start Vout ≤0.9 x VOUT,nom 0 1000(2) mA

Additional effective input capacitance 0 µF

Additional effective output capacitance 0 30(3) µF

TAOperating ambient temperature range –40 85 °C

(1) See Thermal and Reliability Information for additional details

(2) See Soft Start for additional details

(3) Due to the dc bias effect of ceramic capacitors, the effective capacitance is lower then the nominal value when a voltage is applied.

7.4 Thermal Information TPS8268x

THERMAL METRIC(1) SIP UNIT

9 PINS

RθJA Junction-to-ambient thermal resistance 62 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 22 °C/W

RθJB Junction-to-board thermal resistance 25 °C/W

ψJT Junction-to-top characterization parameter 11 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

Thermal Information (continued)

TPS8268x

THERMAL METRIC(1) SIP UNIT

9 PINS

ψJB Junction-to-board characterization parameter 25 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W

7.5 Electrical Characteristics

Minimum and maximum values are at VIN = 2.5 V to 5.5 V, EN = VIN and TA= –40°C to 85°C; Circuit of Parameter

Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6 V, EN = VIN and TA= 25°C

(unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SUPPLY CURRENT

IQOperating quiescent current IOUT = 0mA 7 mA

ISD Shutdown current EN = low 0.5 5 μA

VIN rising 2.1 2.3 V

UVLO Undervoltage lockout threshold VIN falling 1.95 2.25 V

ENABLE, MODE

VIH High-level input voltage 0.9 V

VIL Low-level input voltage 0.4 V

Input connected to GND or VIN; TJ= –40°C to

Ilkg Input leakage current 0.01 1.5 μA

85°C

PROTECTION

Thermal shutdown Temperature rising 140 °C

Thermal shutdown hysteresis Temperature falling 10 °C

ILIM Average output current limit 2100 mA

Input current limit under short-circuit

ISC VOUT shorted to ground 150 mA

condition

OUTPUT

TPS8268180 1.80 V

TPS8268150 1.50 V

TPS8268120 1.20 V

Nominal output

VOUT,NOM TPS8268105 1.05 V

voltage

TPS8268090 0.90 V

TPS8268120, 2.8V ≤VIN ≤5.5V, 0mA ≤IOUT ≤1600 mA

TPS8268105, TJ= –40°C to 85°C

TPS8268090 0.985×VOUT,NOM VOUT,NOM 1.015×VOUT,NOM V

TPS8268180, 3.2V ≤VIN ≤5.5V, 0mA ≤IOUT ≤1600 mA

TPS8268150 TJ= –40°C to 85°C

Output voltage

accuracy TPS8268120, 2.7V ≤VIN ≤5.5V, 0mA ≤IOUT ≤1200 mA

TPS8268105, TJ= –40°C to 125°C

TPS8268090 0.98×VOUT,NOM VOUT,NOM 1.025×VOUT,NOM V

TPS8268180, 2.9V ≤VIN ≤5.5V, 0mA ≤IOUT ≤1200 mA

TPS8268150 TJ= –40°C to 125°C

Line regulation VIN = 2.5V to 5.5V, IOUT = 200 mA 0.2 %/V

Load regulation IOUT = 0mA to 1600 mA –0.85 %/A

fSW Nominal oscillator frequency IOUT = 0mA 5.5 MHz

RDIS VOUT discharge resistor 12 Ω

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0.0001 0.001 0.01 0.1 1

Frequency (MHz)

Iout (A)

3 V

3.5 V

4 V

5 V

C014

VIN (V)

VOUT DC (V)

2.5 3 3.5 4 4.5 5 5.5 6

1.746

1.758

1.77

1.782

1.794

1.806

1.818

1.83

1.842

1.854

D023

1 mA

316 mA

501 mA

1 A

1.6 A

100

0.0001 0.001 0.01 0.1 1

Efficiency (%)

Iout (A)

2.5 V

3 V

3.6 V

4.2 V

5 V

C006

IOUT (A)

VOUT (V)

0.0001 0.001 0.01 0.05 0.2 0.5 1 2

1.785

1.79

1.795

1.8

1.805

1.81

D024

2.9 V

3.0 V

3.6 V

4.2 V

5.0 V

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

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7.6 Timing Requirements

Minimum and maximum values are at VIN = 2.5 V to 5.5 V, EN = VIN and TA= –40°C to 85°C; Circuit of Parameter

Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6 V, EN = VIN and TA= 25°C

(unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

OUTPUT

Start-up delay time Time from EN = high to start switching 120 300 μs

IOUT = 0mA, Time from start switching until 95%

tRAMP Ramp time 150 μs

of nominal output voltage

7.7 Typical Characteristics

VOUT = 1.80 V 25°C

VOUT = 1.80V 25°C Figure 2. Output Voltage vs Output Current

Figure 1. Efficiency vs Output Current

VOUT = 1.80 V 25°C VOUT = 1.80 V 25°C

Figure 3. Output Voltage vs Input Voltage Figure 4. Switching Frequency vs Output Current

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

100

0.0001 0.001 0.01 0.1 1

Efficiency (%)

Iout (A)

2.5 V

3 V

3.6 V

4.2 V

5 V

C005

1.164

1.176

1.188

1.200

1.212

1.224

1.236

0.0001 0.001 0.01 0.1 1

Vout DC (V)

Iout (A)

2.5 V

3 V

3.6 V

4.2 V

5 V

C008

0.01 0.1 1

Frequency (MHz)

Iout (A)

3 V

3.5 V

4 V

5 V

C019

1.455

1.470

1.485

1.500

1.515

1.530

1.545

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

Vout (V)

Vin (V)

1 mA

316 mA

501 mA

1 A

1.58 A

C003

100

0.0001 0.001 0.01 0.1 1

Efficiency (%)

Iout (A)

2.5 V

3 V

3.6 V

4.2 V

5 V

C001

1.455

1.470

1.485

1.500

1.515

1.530

1.545

0.0001 0.001 0.01 0.1 1

Vout (V)

Iout (A)

2.5 V

3 V

3.6 V

4.2 V

5 V

C002

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

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SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

Typical Characteristics (continued)

VOUT = 1.50V 25°C VOUT = 1.50 V 25°C

Figure 5. Efficiency vs Output Current Figure 6. Output Voltage vs Output Current

VOUT = 1.50 V 25°C VOUT = 1.50 V 25°C

Figure 7. Output Voltage vs Input Voltage Figure 8. Switching Frequency vs Output Current

VOUT = 1.20V 25°C VOUT = 1.20 V 25°C

Figure 9. Efficiency vs Output Current Figure 10. Output Voltage vs Output Current

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

1.0185

1.0290

1.0395

1.0500

1.0605

1.0710

1.0815

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

Vout (V)

Vin (V)

1 mA

316 mA

501 mA

1 A

1.6 A

C012

0.01 0.1 1

Frequency (MHz)

Iout (A)

3 V

3.5 V

4 V

5 V

C018

100

0.001 0.01 0.1 1

Efficiency (%)

Iout (A)

2.5 V

3 V

3.3 V

4.2 V

5 V

C010

1.0185

1.0290

1.0395

1.0500

1.0605

1.0710

1.0815

0.0001 0.001 0.01 0.1 1

Vout (V)

Iout (A)

2.5 V

3 V

3.3 V

4.2 V

5 V

C011

VIN (V)

VOUT DC (V)

2 2.5 3 3.5 4 4.5 5 5.5 6

1.164

1.176

1.188

1.2

1.212

1.224

1.236

D022

1 mA

316 mA

501 mA

1 A

1.6 A

0.0001 0.001 0.01 0.1 1

Frequency (MHz)

Iout (A)

2.5 V

3 V

3.5 V

4 V

5 V

C013

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

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Typical Characteristics (continued)

VOUT = 1.20 V 25°C

VOUT = 1.20 V 25°C Figure 12. Switching Frequency vs Output Current

Figure 11. Output Voltage vs Input Voltage

VOUT = 1.05 V 25°C

VOUT = 1.05V 25°C

Figure 14. Output Voltage vs Output Current

Figure 13. Efficiency vs Output Current

VOUT = 1.05 V 25°C VOUT = 1.05 V 25°C

Figure 15. Output Voltage vs Input Voltage Figure 16. Switching Frequency vs Output Current

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

0.873

0.882

0.891

0.900

0.909

0.918

0.927

2 2.5 3 3.5 4 4.5 5 5.5

Vout (V)

Vin (V)

1 mA

316 mA

501 mA

1 A

1.6 A

C016

0.01 0.1 1

Frequency (MHz)

Iout (A)

3 V

3.5 V

4 V

5 V

C017

100

0.0001 0.001 0.01 0.1 1

Efficiency (%)

Iout (A)

2.5 V

3 V

3.6 V

4.2 V

5 V

C004

0.873

0.882

0.891

0.900

0.909

0.918

0.927

0.0001 0.001 0.01 0.1 1

Vout (V)

Iout (A)

2.5 V

3 V

3.6 V

4.2 V

5 V

C007

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

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SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

Typical Characteristics (continued)

VIN = 0.9 V 25°C

VOUT = 0.9 V 25°C

Figure 18. Output Voltage vs Output Current

Figure 17. Efficiency vs Output Current

VIN = 0.9 V 25°C VIN = 0.9 V 25°C

Figure 19. Output Voltage vs Input Voltage Figure 20. Switching Frequency vs Output Current

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

Gate Driver

Anti

Shoot-Through

Timing Generator

Feedback Divider

SSFM

GND

Soft-Start

EN VIN

Current Sense

Undervoltage

Lockout

Bias Supply

Bandgap

Thermal

Shutdown

Negative Inductor

Current Detect

VIN

MODE

V = 0.8 V

REF

VREF

VOUT

DC/DC CONVERTER

VOUT

VIN

TPS8268180

TPS8268150

TPS8268120

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SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

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8 Detailed Description

8.1 Overview

The TPS8268x is a complete DC/DC step-down power supply intended for small size and low profile

applications. Included in the package are the switching regulator, inductor and input/output capacitors. It is a

complete Plug & Play Solution, meaning typically no additional components are required to finish the design.

Integration of all required passive components enables a tiny solution size of only 6.7mm2. The converter

operates with fixed frequency pulse width modulation (PWM).

The TPS8268x integrates an input current limit to protect the device against heavy load or short circuits and

features an undervoltage lockout circuit to prevent the device from misoperation at low input voltages.

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 Soft Start

The TPS8268x has an internal soft start circuit that controls the ramp up of the output voltage. Once the

converter is enabled and the input voltage is above the undervoltage lockout threshold VUVLO, the output voltage

ramps up to 95% of its nominal value within tRamp of typ. 150μs. This ensures a controlled ramp up of the output

voltage and limits the input voltage drop when a battery or a high-impedance power source is connected to the

input of the DC/DC converter.

The inrush current during start-up is directly related to the effective capacitance and load present at the output of

the converter.

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SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

Feature Description (continued)

During soft start, the current limit is reduced to 2/3 of its nominal value. The maximum load current during soft

start should be less than 1A. Once the internal reference voltage has reached 90% of its target value, the current

limit is set to its nominal target value.

8.3.2 Undervoltage Lockout

The undervoltage lockout circuit prevents the device from misoperation at low input voltages. It prevents the

converter from turning on either MOSFET under undefined conditions. The TPS8268x has a rising UVLO

threshold of 2.1V (typical).

8.3.3 Short-Circuit Protection

The TPS8268x integrates current limit circuitry to protect the device against heavy load or short circuits. When

the average current in the high-side MOSFET reaches its current limit, the high-side MOSFET is turned off and

the low-side MOSFET is turned on ramping down the inductor current.

As soon as the converter detects a short circuit condition, it shuts down. After a delay of approximately 20 µs, the

converter restarts. In case the short circuit condition remains, the converter shuts down again after hitting the

current limit threshold. In case the short circuit condition remains present on the converters output, the converter

periodically re-starts with a small duty cycle and shuts down again, thereby limiting the current drawn from the

input.

8.3.4 Thermal Shutdown

As soon as the junction temperature, TJ, exceeds typically 140°C, the device goes into thermal shutdown. In this

mode, the power stage is turned off. The device continues its operation when the junction temperature falls

below typically 130°C.

8.3.5 Enable

The TPS8268x device starts operation when EN is set high. For proper operation, the EN pin must be terminated

and must not be left floating.

Pulling the EN pin low forces the device into shutdown, with a shutdown current of typically 0.5μA. In this mode,

the internal high-side and low-side MOSFETs are turned off, the internal resistor feedback divider is

disconnected, and the entire internal control circuitry is switched off. The TPS8268x device actively discharges

the output capacitor when it turns off. The integrated discharge resistor has a typical resistance of 12Ω. This

internal discharge transistor is only turned on after the device had been enabled at least once. The required time

to discharge the output capacitor at the output node depends on load current and the effective output

capacitance.

The TPS8268x is designed such that it can start into a pre-biased output, in case the output discharge circuit

was active for too short a time to fully discharge the output capacitor. In this case, the converter starts switching

as soon as the internal reference has approximately reached the equivalent voltage to the output voltage

present. It then ramps the output from that voltage level to its target value.

8.3.6 MODE Pin

This pin must be tied to the input voltage VIN and must not be left floating.

8.4 Device Functional Modes

8.4.1 Spread Spectrum, PWM Frequency Dithering

The goal is to spread out the emitted RF energy over a larger frequency range, so that the resulting EMI is

similar to white noise. The end result is a spectrum that is continuous and lower in peak amplitude, making it

easier to comply with electromagnetic interference (EMI) standards and with power supply ripple requirements in

cellular and non-cellular wireless applications. Radio receivers are typically susceptible to narrowband noise that

is focused on specific frequencies.

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

( ) ( )

m c m

B = 2 1 + m = 2 +

´ ¦ ´ ´ D ¦ ¦

=ƒ

δ ƒ

m = ƒ

( )

hmfB

ffmfB

fmh

mcfm

×+××=

+D×=+××=

)(212

( ) )(212 mcfm ffmfB +D×=+××=

0 dBV

0 dBVref

FENV,PEAK Dfc Dfc Non-modulated harmonic

Side-band harmonics

window after modulation

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

www.ti.com

Device Functional Modes (continued)

Switching regulators can be particularly troublesome in applications where electromagnetic interference (EMI) is

a concern. Switching regulators operate on a cycle-by-cycle basis to transfer power to their output. In most

cases, the frequency of operation is either fixed or regulated, based on the output load. This method of

conversion creates large components of noise at the frequency of operation (fundamental) and multiples of the

operating frequency (harmonics).

The spread spectrum architecture varies the switching frequency by around ±10% of the nominal switching

frequency, thereby significantly reducing the peak radiated and conducted noise on both the input and output

supplies. The frequency dithering scheme is modulated with a triangle profile and a modulation frequency fm.

Figure 21. Spectrum Of A Frequency Modulated Figure 22. Spread Bands Of Harmonics In

Sin. Wave With Sinusoidal Variation In Time Modulated Square Signals (1)

The above figures show that after modulation the side-band harmonic is attenuated compared to the non-

modulated harmonic, and the harmonic energy is spread into a certain frequency band. The higher the

modulation index (mf), the larger the attenuation.

(1)

where:

fcis the carrier frequency (5.5 MHz)

fmis the modulating frequency (approx. 0.008*fc)

δis the modulation ratio (approx 0.1)

(2)

The maximum switching frequency fcis limited by the device and finally the parameter modulation ratio (δ),

together with fm, which is the side-band harmonic´s bandwidth around the carrier frequency fc. The bandwidth of

a frequency modulated waveform is approximately given by Carson’s rule and is summarized as:

(3)

fm< RBW (resolution bandwidth): The receiver is not able to distinguish individual side-band harmonics, so,

several harmonics are added in the input filter and the measured value is higher than expected in theoretical

calculations.

fm> RBW: The receiver is able to properly measure each individual side-band harmonic separately, so the

measurements match with the theoretical calculations.

(1) Spectrum illustrations and formulae (Figure 21 and Figure 22) copyright IEEE TRANSACTIONS ON ELECTROMAGNETIC

COMPATIBILITY, VOL. 47, NO.3, AUGUST 2005. See References Section for full citation.

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

VIN SW

MODE

VOUT

1.05 V / up to 1.6A

TPS8268105SIP

VBAT

2.5V .. 5.5V

MODE pin;

tie to VIN

DC/DC Converter

GND

C1 +

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

www.ti.com

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

The TPS8268x device is a complete DC/DC step-down power supply optimized for small solution size. Included

in the package are the switching regulator, inductor and input/output capacitors. Integration of passive

components enables a tiny solution size of only 6.7mm2.

9.2 Typical Application

Figure 23. Typical Application Schematic

9.2.1 Design Requirements

Figure 23 shows the schematic of the typical application. The following design guidelines provide all information

to operate the device within the recommended operating conditions. An external input capacitor may be required

depending on the source impedance of the battery or pre-regulator used to power TPS8268x. See also Power

Supply Recommendations.

Reference Description Manufacturer

IC1 MicroSIP Module TPS8268xSIP Texas Instruments

Tantalum Capacitor;

C1 Kemet

T520B157M006ATE025; 150uF/6.3V

9.2.2 Detailed Design Procedure

The TPS8268x allows the design of a complete power supply with no additional external components. The input

capacitance can be increased in case the source impedance is large or if there are high load transients expected

at the output. The dc bias effect of the input and output capacitors must be taken into account and the total

capacitance on the output must not exceed the value given in the recommended operating conditions.

9.2.2.1 Input Capacitor Selection

Because the nature of the buck converter has a pulsating input current, a low ESR input capacitor is required.

For most applications, the input capacitor that is integrated into the TPS8268x is sufficient. If the application

exhibits a noisy or erratic switching frequency, experiment with additional input ceramic capacitance to find a

remedy.

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

www.ti.com

The TPS8268x uses a tiny ceramic input capacitor. When a ceramic capacitor is combined with trace or cable

inductance, such as from a wall adapter, a load step at the output can induce ringing at the VIN pin. This ringing

can couple to the output and be mistaken as loop instability or can even damage the part. In this circumstance,

additional "bulk" capacitance, such as electrolytic or tantalum, should be placed between the input of the

converter and the power source lead to reduce ringing that can occur between the inductance of the power

source leads and CI.

9.2.2.2 Output Capacitor Selection

The advanced fast-response voltage mode control scheme of the TPS8268x allows the use of tiny ceramic

output capacitors. Ceramic capacitors with low ESR values have the lowest output voltage ripple and are

recommended. For most applications, the output capacitor integrated in the TPS8268x is sufficient. An additional

output capacitor may be used for the purpose of improving AC voltage accuracy during large load transients.

To further reduce the voltage drop during load transients, additional external output capacitance up to 30µF can

be added. A low ESR multilayer ceramic capacitor (MLCC) is suitable for most applications. The total effective

output capacitance must remain below 30µF.

As the device operates in PWM mode, the overall output voltage ripple is the sum of the voltage step that is

caused by the output capacitor´s ESL and the ripple current that flows through the output capacitor´s impedance.

Because the damping factor in the output path is directly related to several resistive parameters (e.g. inductor

DCR, power-stage rDS(on), PCB DC resistance, load switches rDS(on) …) that are temperature dependant, the

converter´s small and large signal behavior should be checked over the input voltage range, load current range

and temperature range.

The easiest test is to evaluate, directly at the converter’s output, the following items:

• efficiency

• load transient response

• output voltage ripple

During the recovery time from a load transient, the output voltage can be monitored for settling time, overshoot or

ringing that helps judge the converter’s stability. Without any ringing, the loop typically has more than 45° of

phase margin.

9.2.3 Application Curves

Figure 24. Load Transient Response for TPS8268180 Figure 25. Line Transient Response for TPS8268180

(Vout = 1.80V, Iout = 170mA to 1.47A to 170mA, Vin = 5V) (Vout = 1.80V; Iout = 800mA, Vin = 4V to 5V to 4V)

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

www.ti.com

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

Figure 27. Output Voltage Ripple for TPS8268180

Figure 26. Startup for TPS8268180 (Vin = 5V, Vout = 1.80V, Iout = 900mA)

(Vin = 5V, Vout = 1.80V)

Figure 28. Load Transient Response for TPS8268150 Figure 29. Line Transient Response for TPS8268150

(Vout = 1.5V, Iout = 160mA to 1.44A to 160mA, Vin = 5V) (Vout = 1.5V, Iout = 800mA, Vin = 4V to 5V to 4V)

Figure 31. Output Voltage Ripple for TPS8268150

Figure 30. Startup for TPS8268150 (Vin = 5V, Vout = 1.5V, Iout = 900mA)

(Vin = 5V, Vout = 1.5V)

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

www.ti.com

Figure 32. Load Transient Response for TPS8268120 Figure 33. Line Transient Response for TPS8268120

(Vout = 1.20V, Iout = 170mA to 1.47A to 170mA, Vin = 5V) (Vout = 1.20V; Iout = 800mA, Vin = 4V to 5V to 4V)

Figure 34. Startup for TPS8268120 Figure 35. Output Voltage Ripple for TPS8268120

(Vin = 5V, Vout = 1.20V) (Vin = 5V, Vout = 1.20V, Iout = 900mA)

Figure 36. Load Transient Response for TPS8268105 Figure 37. Line Transient Response for TPS8268105

(Vout = 1.05V, Iout = 160mA to 1.44A to 160mA, Vin = 5V) (Vout = 1.05V; Iout = 900mA, Vin = 4V to 5V to 4V)

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

www.ti.com

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

Figure 39. Output Voltage Ripple for TPS8268105

Figure 38. Startup for TPS8268105 (Vin = 5V, Vout = 1.05V, Iout = 900mA)

(Vin = 5V, Vout = 1.05V)

Figure 40. Load Transient Response for TPS8268090 Figure 41. Line Transient Response for TPS8268090

(Vout = 0.9V, Iout = 170mA to 1.47A to 170mA, Vin = 5V) (Vout = 0.90V; Iout = 900mA, Vin = 4V to 5V to 4V)

Figure 42. Startup for TPS8268090 Figure 43. Output Voltage Ripple for TPS8268090

(Vin = 5V, Vout = 0.9V) (Vin = 5V, Vout = 0.9V, Iout = 900mA)

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

www.ti.com

10 Power Supply Recommendations

The input power supply to the TPS8268x must have a current rating according to the input voltage and output

current of the TPS8268x. TPS8268x provides a fast transient response due to its high switching frequency and

fast control loop. For highly dynamic loads, the device demands high inputs currents within a short time. The

power supply to TPS8268x therefore needs to have a low output impedance in order to keep the input voltage

stable during fast load changes. Make sure the input voltage to TPS8268x at any time is above the minimum

voltage level required to supply the load at the output. See the electrical characteristics for the minimum input

voltage for a given load current for the different output voltage versions. Additional input capacitance needs to be

added if the input voltage dops below the minimum level required.

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

Copper Trace Width

Solder Pad Width

Solder Mask Opening

Copper Trace Thickness

Solder Mask Thickness

M0200-01

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

www.ti.com

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

11 Layout

11.1 Layout Guidelines

TPS8268x allows the design of a power supply with small solution size. In order to properly dissipate the heat,

wide copper traces for the power connections should be used to distribute the heat across the PCB. If possible, a

GND plane should be used as it provides a low impedance connection as well as serves as a heat sink.

In making the pad size for the SiP LGA balls, it is recommended that the layout use a non-solder-mask defined

(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the

opening size is defined by the copper pad width. Figure 44 shows the appropriate diameters for a MicroSiPTM

layout.

Figure 44. Recommended Land Pattern Image and Dimensions

SOLDER PAD SOLDER MASK (5) COPPER STENCIL (6)

COPPER PAD STENCIL THICKNESS

DEFINITIONS(1)(2)(3)(4) OPENING THICKNESS OPENING

Non-solder-mask 0.30mm 0.360mm 1oz max (0.032mm) 0.34mm diameter 0.1mm thick

defined (NSMD)

(1) Circuit traces from non-solder-mask defined PCB lands should be 75μm to 100μm wide in the exposed area inside the solder mask

opening. Wider trace widths reduce device stand off and slightly reduce reliability. However, wider traces may be used to improve the

thermal relief of the device as well as to provide sufficient current handling.

(2) Best reliability results are achieved when the PCB laminate glass transition temperature is above the operating the range of the intended

application.

(3) Recommend solder paste is Type 3 or Type 4.

(4) For a PCB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue

performance.

(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.

(6) For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste

volume control.

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

GND

VIN VOUT

EN MODE

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

www.ti.com

11.2 Layout Example

Figure 45. Recommended PCB Layout

11.3 Surface Mount Information

The TPS8268x MicroSiP™ DC/DC converter uses an open frame construction that is designed for a fully

automated assembly process and that features a large surface area for pick and place operations. See the "Pick

Area" in the package drawings.

Package height and weight have been kept to a minimum to allow the MicroSiP™ device to be handled similarly

to a 0805 component.

See JEDEC/IPC standard J-STD-20b for reflow recommendations.

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

www.ti.com

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

11.4 Thermal and Reliability Information

The TPS8268x´s output current may need to be de-rated if it is required to operate in a high ambient temperature

or deliver a large amount of continuous power. The amount of current de-rating is dependent upon the input

voltage, output power and environmental thermal conditions. Care should especially be taken in applications

where the localized PCB temperature exceeds 65°C.

The TPS8268x die and inductor temperature should be kept lower than the maximum rating of 125°C, so care

should be taken in the circuit layout to ensure good heat sinking. Sufficient cooling should be provided to ensure

reliable operation.

Three basic approaches for enhancing thermal performance are listed below:

• Improve the power dissipation capability of the PCB design.

• Improve the thermal coupling of the component to the PCB.

• Introduce airflow into the system.

To estimate the junction temperature, approximate the power dissipation within the TPS8268x by applying the

typical efficiency stated in this datasheet to the desired output power; or, by taking an actual power

measurement. Then, calculate the internal temperature rise of the TPS8268x above the surface of the printed

circuit board by multiplying the TPS8268x´s power dissipation by its thermal resistance.

The thermal resistance numbers listed in the Thermal Information table are based on modeling the MicroSiP™

package mounted on a high-K test board specified per the JEDEC standard. For increased accuracy and fidelity

to the actual application, it is recommended to run a thermal image analysis of the actual system.

Thermal measurements have been taken on the EVM to give a guideline on what temperature can be expected

when the device is operated in free air at 25°C ambient under a certain load. The temperatures have been

checked at 4 different spots as listed below:

• Spot1: temperature of the input capacitor

• Spot2: temperature of the output capacitor

• Spot3: temperature of the inductor

• Spot4: temperature on the main pcb next to the module

Figure 46. VIN= 5V, VOUT=1.05V, IOUT= 1A Figure 47. VIN= 5V, VOUT= 1.05V, IOUT= 1.2A

388mW Power Dissipation 466mW Power Dissipation

The TPS8268x contains a thermal shutdown that inhibits switching at high junction temperatures. The activation

threshold of this function, however, is above 125°C to avoid interfering with normal operation. Thus, prolonged or

repetitive operation under a condition in which the thermal shutdown activates necessarily means that the

components internal to the MicroSiP™ package are subjected to high temperatures for prolonged or repetitive

intervals, which may decrease the reliability of the device.

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

100

10k

100k

0 20 40 60 80 100 120 140

Lifetime (kHours)

Capacitor Case Temperature (C)

Vin = 3.6 V

Vin = 4.5 V

Vin = 5 V

Vin = 5.5 V

C020

100

10k

100k

0 20 40 60 80 100 120 140

Lifetime (kHours)

Capacitor Case Temperature (C)

Vout = 1.5 V

Vout = 2 V

C021

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

www.ti.com

Thermal and Reliability Information (continued)

MLCC capacitor reliability/lifetime depends on temperature and applied voltage. At higher temperatures, MLCC

capacitors are subject to stronger stress. On the basis of frequently evaluated failure rates determined with

standardized test conditions, the reliability of all MLCC capacitors can be calculated for their actual operating

temperature and voltage.

Failures caused by systematic degradation are described by the Arrhenius model. The most critical parameter

(IR) is the Insulation Resistance (i.e. leakage current). The drop of IR below a lower limit (e.g. 1 MΩ) is used as

the failure criterion. See Figure 48 and Figure 49. Note that the wear-out mechanisms occurring in the MLCC

capacitors are not reversible but cumulative over time.

Input Capacitor Lifetime Output Capacitor Lifetime

vs vs

Temperature and Voltage Temperature and Voltage

Figure 48. Input Capacitor Lifetime Figure 49. Output Capacitor Lifetime

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

www.ti.com

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 References

"EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE

TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by

Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David González, Javier Gago.

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

TECHNICAL TOOLS & SUPPORT &

PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY

TPS8268180 Click here Click here Click here Click here Click here

TPS8268150 Click here Click here Click here Click here Click here

TPS8268120 Click here Click here Click here Click here Click here

TPS8268105 Click here Click here Click here Click here Click here

TPS8268090 Click here Click here Click here Click here Click here

12.3 Trademarks

MicroSiP is a trademark of Texas Instruments.

12.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

TOP VIEW BOTTOM VIEW

YML

LSB

TPS8268180

TPS8268150

TPS8268120

TPS8268105

TPS8268090

SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015

www.ti.com

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

13.1 Package Summary

SIP PACKAGE

Code:

• CC — Customer Code (device/voltage specific)

• YML — Y: Year, M: Month, L: Lot trace code

• LSB — L: Lot trace code, S: Site code, B: Board locator

13.2 MicroSiP™ DC/DC Module Package Dimensions

TheTPS8268x is available in an 9-bump ball grid array (BGA) package. The package dimensions are:

• D = 2.30 ±0.05 mm

• E = 2.90 ±0.05 mm

Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090

www.ti.com

PACKAGE OUTLINE

1 MAX

0.10

0.06

2 TYP

1 TYP

1.6

TYP

0.8

TYP

9X 0.35

0.25

B2.95

2.85

2.35

2.25

MicroSiP - 1 mm max heightSIP0009B

MICRO SYSTEM IN PACKAGE

4218356/B 11/2014

AREA

PIN A1 INDEX

NOTE 3

PICK AREA

0.05 C

SEATING PLANE

0.015 C A B

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. For pick and place nozzle recommendation, see product datasheet.

4. Location, size and quantity of each component are for reference only and may vary.

MicroSiP is a trademark of Texas Instruments.

SCALE 5.500

www.ti.com

EXAMPLE BOARD LAYOUT

(1) TYP

( )

METAL

0.3

SOLDER MASK

OPENING

0.05 MAX 0.05 MIN

9X ( )

SEE DETAILS

0.3

(0.8)

TYP

METAL UNDER MASK

( )

SOLDER MASK

OPENING

0.3

MicroSiP - 1 mm max heightSIP0009B

MICRO SYSTEM IN PACKAGE

4218356/B 11/2014

SYMM

LAND PATTERN EXAMPLE

SCALE:20X

NOTES: (continued)

5. For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017).

SOLDER MASK DETAILS

NOT TO SCALE

NON-SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

www.ti.com

EXAMPLE STENCIL DESIGN

METAL

UNDER PASTE

( )0.34

(1) TYP

(0.8)

TYP

( ) TYP

SEE DETAIL

0.34

MicroSiP - 1 mm max heightSIP0009B

MICRO SYSTEM IN PACKAGE

4218356/B 11/2014

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

SCALE:20X

SOLDER PASTE DETAIL

TYPICAL

PACKAGE OPTION ADDENDUM

www.ti.com 30-Aug-2018

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

TPS8268090SIPR ACTIVE uSiP SIP 9 3000 TBD Call TI Call TI -40 to 85 YP

TXI682

TPS8268090SIPT ACTIVE uSiP SIP 9 250 TBD Call TI Call TI -40 to 85 YP

TXI682

TPS8268105SIPR ACTIVE uSiP SIP 9 3000 TBD Call TI Call TI -40 to 85 YO

TXI681

TPS8268105SIPT ACTIVE uSiP SIP 9 250 TBD Call TI Call TI -40 to 85 YO

TXI681

TPS8268120SIPR ACTIVE uSiP SIP 9 3000 TBD Call TI Call TI -40 to 85 HJ

TXI8120EC

TPS8268120SIPT ACTIVE uSiP SIP 9 250 TBD Call TI Call TI -40 to 85 HJ

TXI8120EC

TPS8268150SIPR ACTIVE uSiP SIP 9 3000 TBD Call TI Call TI -40 to 85 YR

TXI685

TPS8268150SIPT ACTIVE uSiP SIP 9 250 TBD Call TI Call TI -40 to 85 YR

TXI685

TPS8268180SIPR ACTIVE uSiP SIP 9 3000 TBD Call TI Call TI -40 to 85 HK

TXI8180EC

TPS8268180SIPT ACTIVE uSiP SIP 9 250 TBD Call TI Call TI -40 to 85 HK

TXI8180EC

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

PACKAGE OPTION ADDENDUM

www.ti.com 30-Aug-2018

Addendum-Page 2

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

IMPORTANT NOTICE

Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its

semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers

should obtain the latest relevant information before placing orders and should verify that such information is current and complete.

TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated

circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and

services.

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Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers

remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have

full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products

used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with

respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous

consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and

take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will

thoroughly test such applications and the functionality of such TI products as used in such applications.

TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,

including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to

assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any

way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource

solely for this purpose and subject to the terms of this Notice.

TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI

products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,

enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically

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Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that

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endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR

REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO

ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF

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INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF

PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,

DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN

CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN

ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949

and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.

Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such

products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards

and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must

ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in

life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.

Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life

support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all

medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.

TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).

Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications

and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory

requirements in connection with such selection.

Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-

compliance with the terms and provisions of this Notice.

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