BIPOLAR ANALOG INTEGRATED CIRCUIT
SILICON RFIC 2.5 GHz FREQUENCY UP-CONVERTER
FOR WIRELESS TRANSCEIVER
UPC8172TB
DESCRIPTION
The UPC8172TB is a silicon monolithic integrated circuit
designed as a frequency up-converter for a wireless trans-
ceiver transmitter stage. This IC is manufactured using the
30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar
process. This IC has the same circuit current as the conven-
tional UPC8106TB, but operates at higher frequency, higher
gain and lower distortion. Such performance and operation
from a 3 volts supply makes this device ideal for mobile
communications and wireless LAN applications.
Stringent quality assurance and test procedures ensure
the highest reliability and performance.
•PCS1900 MHz
•2.4 GHz band transmitter/receiver system (wireless
LAN, etc.)
APPLICATIONS
BT2718CPUREBMUN TRAP
60SENILTUO EGAKCAP
SYMBOLS PARAMETERS AND CONDITIONS1UNITS MIN TYP MAX
ICC 0.310.95.5Am)langis on( tnerruC tiucriC
ICC(PS) Circuit Current in Power Save Mode, VPS 2––AµV 0 =
f1GC RFout = 0.9 GHz, PIFin 5.215.95.6BdmBd 03- =
CG2 Conversion Gain, fRFout = 1.9 GHz, PIFin 5.115.85.5BdmBd 03- =
f3GC RFout = 2.4 GHz, PIFin 0.110.80.5BdmBd 03- =
PO(SAT)1 fRFout = 0.9 GHz, PIFin = 0 dBm dBm -2.5 0.5 –
PO(SAT)2 Saturated RF Output Power, fRFout = 1.9 GHz, PIFin = 0 dBm dBm -3.5 0 –
PO(SAT)3 fRFout = 2.4 GHz, PIFin = 0 dBm dBm -4.0 -0.5 –
Output Third-Order Distortion Intercept Point,
OIP3f1 RFout = 0.9 GHz fIFin1 = 240 MHz dBm – 7.5 –
OIP3f2 RFout = 1.9 GHz fIFin2 = 241 MHz dBm – 6.0 –
OIP3f3 RFout –0.4–mBdzHG 4.2 =
Input Third-Order Distortion Intercept Point,
IIP3f1 RFout = 0.9 GHz fIFin1 = 240 MHz dBm – -2.0 –
IIP3f2 RFout = 1.9 GHz fIFin2 = 241 MHz dBm – -2.5 –
IIP3f3 RFout –0.4-–mBdzHG 4.2 =
f1FN•BSS RFout = 0.9 GHz, fIFin –5.9–BdzHM 042 = 1
SSB•NF2 SSB Noise Figure, fRFout = 1.9 GHz, fIFin –4.01–BdzHM 042 = 1
f3FN•BSS RFout = 2.4 GHz, fIFin –6.01–BdzHM 042 = 1
TPS(rise) Power Save Response Time Rise Time, VPS: GND’VCC µs – 1 –
TPS(fall) Fall Time, VPS: VCC’GND µs – 1.5 –
ELECTRICAL CHARACTERISTICS
(TA = 25°C, VCC = VRFOUT = 3.0 V, fIFin = 240 MHz, PLOin = -5 dBm, and VPS ≥2.7 V unless otherwise specified))
Note:
1. fRFout < fLOin @ fRFout = 0.9 GHz
fLOin < fRFout @ fRFout = 1.9 GHz/2.4 GHz
BLOCK DIAGRAM
(Top View)
LO input
GND
IF input
PS
VCC
RF output
•RECOMMENDED OPERATING FREQUENCY:
fRFout = 0.8 to 2.5 GHz
•SUPPLY VOLTAGE:
VCC = 2.7 to 3.3 V
•HIGHER IP3 AND CONVERSION GAIN:
CG = 9.5 dB TYP
OIP3 = +7.5 dBm TYP @ fRFout = 0.9 GHz
•HIGH-DENSITY SURFACE MOUNTING:
6-pin super minimold package
FEATURES
SYMBOLS PARAMETERS UNITS MIN TYP MAX
VCC Supply Voltage1V 2.7 3.0 3.3
TAOperating
Ambient Temperature ˚C -40 +25 +85
PLOin Local Input Level2dBm -10 -5 0
fRFout RF Output Frequency3GHz 0.8 – 2.5
fIFin IF Input Frequency MHz 50 – 400
ABSOLUTE MAXIMUM RATINGS1
(TA = +25°C unless otherwise specified)
UPC8172TB
RECOMMENDED
OPERATING CONDITIONS
Note:
1. Same voltage applied to pins 5 and 6.
2. ZS = 50 Ω (without matching).
3. With external matching circuit.
SYMBOLS PARAMETERS UNITS RATINGS
VCC Supply Voltage V 3.6
VPS PS Pin Input Voltage V 3.6
PDPower Dissipation2mW 270
TAOperating Ambient °C -40 to +85
Temperature
TSTG Storage Temperature °C -55 to +150
PIN Input Power dBm +10
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage.
2. Mounted on a double-sided copper clad 50x50x1.6 mm epoxy
glass PWB, TA = +85°C.
Part Number ICC fRFout CG (dB OIP3 (dBm)
(mA) (GHz) @RF 0.9 GHz2@RF 1.9 GHz @RF 2.4 GHz @RF 0.9 GHz2@RF 1.9 GHz @RF 2.4 GHz
UPC8172TB 9 0.8 to 2.5 9.5 8.5 8.0 +7.5 +6.0 +4.0
UPC8106TB 9 0.4 to 2.0 9 7 – +5.5 -1.0 –
UPC8109TB 5 0.4 to 2.0 6 4 – +1.5 +2.0 –
UPC8163TB 16.5 0.8 to 2.0 9 5.5 – +9.5 +6.0 –
SERIES PRODUCTS1 (TA = +25°C, VCC = VRFout = 3.0 V, ZS = ZL = 50 Ω)
Notes:
1. Typical performance.
2. fRFout = 0.83 GHz @ UPC8163TB
Pin Pin Applied Pin Function and Explanation Equivalent Circuit
No. Name Voltage Voltage
(V) (V)
1 IFinput — 1.4
2 GND GND —
3 LOinput – 2.3
5VCC 2.7 to 3.3 —
6 RFoutput Same bias —
as VCC
through
external
inductor
4PSVCC/GND
PIN FUNCTIONS (Voltage is measured at VCC = VPS = VRFOUT = 3.0 V)
GND pin. Ground pattern on the board should be
formed as wide as possible. Track length should
be kept as short as possible to minimize ground
inductance.
This pin is the IF input pin to the double balanced
mixer (DBM). The input is designed as a high
impedance. The circuit helps suppress spurious
signals. Also this symmetrical circuit can keep
specified performance insensitive to process-
condition distribution. For that reason, a double
balanced mixer is adopted.
Local input pin. Recommendable input level is -10
to 0 dBm.
This pin is the RF output from the double
balanced mixer. This pin is designed as an open
collector. Due to the high impedance output, this
pin should be externally equipped with an LC
matching circuit to the next stage.
Supply voltage pin.
Power save control pin. Bias controls operate as
follows:
Pin Bias Control
VCC Operation
GND Power Save
3
5
1
6
2
5
4
2
VCC
GND
TYPICAL PERFORMANCE CURVES (TA = 25°C)
UPC8172TB
TA = +25°C
TA = -40°C
TA = +85°C
no signal
VCC = VPS
12
10
8
6
4
2
0
01 234
12
10
8
6
4
2
0
01234
VCC = 3.0 V
15
10
5
0
-5
-10
-15
-30 -25 -20 -15 -10 -5 0 5 10
f
RFout
= 900 MHz
f
LOin
= 1140 MHz
P
IFin
= -30 dBm
V
CC
= V
PS
V
CC
= 3.0 V
5
0
-5
-10
-15
-20
-25
-30 -25 -20 -15 -10 -5 0 5 10
f
RFout
= 900 MHz
f
LOin
= 1140 MHz
P
LOin
= -5 dBm
V
CC
= V
PS
V
CC
= 3.0 V
15
10
5
0
-5
-10
-15
VCC = 3.0 V
fRFout = 1.9 GHz
fLOin = 1660 MHz
PLOin = -30 dBm
VCC = VPS
-30 -25 -20 -15 -10 -5 0 5 10
CIRCUIT CURRENT
vs. SUPPLY VOLTAGE
Supply Voltage, VCC (V)
Circuit Current, I
CC
(mA)
Circuit Current, I
CC
(mA)
PS Pin Input Voltage, VPS (V)
PS PIN CONTROL RESPONSE TIME
CONVERSION GAIN
vs. LOCAL INPUT LEVEL
Local Input Level, PLOin (dBm)
CIRCUIT CURRENT
vs. PS PIN INPUT VOLTAGE
Conversion Gain, CG (dB)
RF OUTPUT LEVEL
vs. IF INPUT LEVEL
RF Output Level, P
RFout
(dBm)
IF Input Level, PIFin (dBm)
CONVERSION GAIN
vs. LOCAL INPUT LEVEL
Local Input Level, PLOin (dBm)
Conversion Gain, CG (dB)
REF LVL = 0 dBm
ATT = 10 dB
10 dB/DIV (Vertical axis)
CENTER = 0.9 GHz
SPAN = 0 Hz
RBW = 3 MHz
VBW = 3 MHz
SWP = 50 µsec
5 µsec/DIV (Horizontal axis)
5
0
-5
-10
-15
-20
-25
-30 -25 -20 -15 -10 -5 0 5 10
fRFout = 1.9 GHz
fLOin = 1660 MHz
PLOin = -5 dBm
VCC = VPS
VCC = 3.0 V
TYPICAL PERFORMANCE CURVES (TA = 25°C)
UPC8172TB
RF OUTPUT LEVEL
vs. IF INPUT LEVEL
IF Input Level, PIFin (dBm)
RF Output Level, P
RFout
(dBm)
15
10
5
0
–5
–
10
–
15
–30 –25 –20 –15 –10 –5 0 5 10
V
CC
= 3.0 V
f
RFout
= 2.4 GHz
f
LOin
= 2160 MHz
P
IFin
= –30 dBm
V
CC
= V
PS
5
0
–5
–
10
–
15
–
20
–
25
–30 –25 –20 –15 –10 –5 0 5 10
V
CC
= 3.0 V
f
RFout
= 2.4 GHz
f
LOin
= 2160 MHz
P
LOin
= –5 dBm
V
CC
= V
PS
10
0
–
10
–
20
–
30
–
40
–
50
–
60
–
70
–
80
–30 –25 –20 –15 –10 –5 0 5
T
A
= +25ºC
Vcc = VPS = 3.0 V
f
RFout
= 900 MHz
f
IFin1
= 240 MHz
f
IFin2
= 241 MHz
f
LOin
= 1140 MHz
P
LOin
= –5 dBm
10
0
–
10
–
20
–
30
–
40
–
50
–
60
–
70
–
80
–30 –25 –20 –15 –10 –5 0 5
T
A
= +25ºC
Vcc = V
PS
= 3.0 V
f
RFout
= 1.9 GHz
f
IFin1
= 240 MHz
f
IFin2
= 241 MHz
f
LOin
= 1660 MHz
P
LOin
= –5 dBm
10
0
–
10
–
20
–
30
–
40
–
50
–
60
–
70
–
80
–30 –25 –20 –15 –10 –5 0 5
T
A
= +25ºC
Vcc = V
PS
= 3.0 V
f
RFout
= 2.4 GHz
f
IFin1
= 240 MHz
f
IFin2
= 241 MHz
f
LOin
= 2160 MHz
P
LOin
= –5 dBm
RF OUTPUT LEVEL
vs. IF INPUT LEVEL
IF Input Level, PIFin (dBm)
RF Output Level, P
RFout
(dBm)
CONVERSION GAIN
vs. LOCAL INPUT LEVEL
Local Input Level, PLOin (dBm)
Conversion Gain, CG (dB)
IM3, RF OUTPUT LEVEL
vs. IF INPUT LEVEL
3rd Order Intermodulation Distortion, IM
3
(dBm)
RF Output Level of Each Tone, PRFout (dBm)
IF Input Level, PIFin (dBm)
IM3, RF OUTPUT LEVEL
vs. IF INPUT LEVEL
3rd Order Intermodulation Distortion, IM
3
(dBm)
RF Output Level of Each Tone, PRFout (dBm)
IF Input Level, PIFin (dBm)
IM3, RF OUTPUT LEVEL
vs. IF INPUT LEVEL
3rd Order Intermodulation Distortion, IM
3
(dBm)
RF Output Level of Each Tone, PRFout (dBm)
IF Input Level, PIFin (dBm)
0
0
–
10
–
20
–
30
–
40
–
50
0.5 1 1.5 2 2.5 3
fRFout = 900 MHz
PLOin = –5 dBm
Vcc = VPS = 3.0 V
0
0
–
10
–
20
–
30
–
40
–
50
0.5 1 1.5 2 2.5 3
f
RFout
= 1.9 GHz
P
LOin
= –5 dBm
Vcc = V
PS
= 3.0 V
0
0
–
10
–
20
–
30
–
40
–
50
0.5 1 1.5 2 2.5 3
f
RFout
= 900 MHz
P
LOin
= –5 dBm
Vcc = V
PS
= 3.0 V
0
0
10
20
30
40
50
0.5 1 1.5 2 2.5 3
f
RFout
= 1.9 GHz
P
LOin
= –5 dBm
Vcc = V
PS
= 3.0 V
0
0
–
10
–
20
–
30
–
40
–
50
0.5 1 1.5 2 2.5 3
fRFout = 2.4 GHz
PLOin = –5 dBm
Vcc = VPS = 3.0 V
0
0
–
10
–
20
–
30
–
40
–
50
0.5 1 1.5 2 2.5 3
f
RFout
= 2.4 GHz
P
LOin
= –5 dBm
Vcc = V
PS
= 3.0 V
TYPICAL PERFORMANCE CURVES (TA = 25°C)
LOCAL LEAKAGE AT IF PIN
vs. LOCAL INPUT FREQUENCY
Local Input Frequency, fLOin (GHz)
Local Leakage at IF Pin, LO
if
(dBm)
LOCAL LEAKAGE AT IF PIN
vs. LOCAL INPUT FREQUENCY
Local Input Frequency, fLOin (GHz)
Local Leakage at IF Pin LO
if
(dBm)
LOCAL LEAKAGE AT RF PIN
vs. LOCAL INPUT FREQUENCY
Local Input Frequency, fLOin (GHz)
Local Leakage at RF Pin, LO
rf
(dBm)
LOCAL LEAKAGE AT RF PIN
vs. LOCAL INPUT FREQUENCY
Local Input Frequency, fLOin (GHz)
Local Leakage at RF Pin LO
rf,
(dBm)
LOCAL LEAKAGE AT RF PIN
vs. LOCAL INPUT FREQUENCY
Local Input Frequency, fLOin (GHz)
Local Leakage at RF Pin LO
rf,
(dBm)
LOCAL LEAKAGE AT IF PIN
vs. LOCAL INPUT FREQUENCY
Local Input Frequency, fLOin (GHz)
Local Leakage at IF Pin LO
rf,
(dBm)
UPC8172TB
SYSTEM APPLICATION EXAMPLE
Wireless Transceiver
Phase
Shifter
0˚
90˚
DEMO I
Q
I
Q
÷N PLL
PLL
UPC8172TB
RX
SW
TX
PA
LNA
VCO
UPC8172TB
S-PARAMETERS FOR EACH PORT (VCC = VPS = VRFout = 3.0 V)
(The paramters are monitored at DUT pins)
LO port
S11 Z
REF 1.0 Units
1 200.0 mUnits/
21.625 Ω -91.148 Ω
hp
MARKER 1
1.15 GHz
MARKER 2
1.65 GHz
MARKER 3
2.15 GHz
RF port (without matching)
S22 Z
REF 1.0 Units
1 200.0 mUnits/
71.5 Ω -240.34 Ω
hp
MARKER 1
900 MHz
MARKER 2
1.9 GHz
MARKER 3
2.5 GHz
IF port
S11 Z
REF 1.0 Units
1 200.0 mUnits/
332.63 Ω -601.34 Ω
hp
MARKER 1
240.0 MHz
1
2
3
32
1
1
START 0.400000000 GHz
STOP 2.500000000 GHz
START 0.400000000 GHz
STOP 2.500000000 GHz
START 0.100000000 GHz
STOP 1.000000000 GHz
UPC8172TB
∆∆
∆
TEST CIRCUIT 1 (fRFout = 900 MHz)
50 Ω
50 Ω
Signal Generator
Signal Generator
100 pF
100 pF
C1
C2
1
2
3
GND
LOinput
IFinput
RFoutput
VCC
PS
6
5
4
C8
C3
C4
C6
C7
C5
10 nH
1000 pF
1 µF 1 µF68 pF
100 pF
100 pF
1 pF
L
50 Ω
Spectrum Analyzer
VCC
Strip Line
UPC8172TB
EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD
PS
C6
C7
C5
VCC
C3
C2
C1
C
8
GND
LOinput
IFinput
UPC8172TB
PS Bias
Voltage Supply
RFoutput
L
C4
FORM SYMBOL VALUE
Chip Capacitor C1, C2, C3100 pF
C41000 pF
C5, C61 µF
C768 pF
C81 pF
Chip Inductor L 10 nH1
Note:
1. 10 nH: LL1608-FH10N (TOKO Co., Ltd.)
COMPONENT LIST
(*1) 35x42x0.4 mm polymide board, double-sided copper clad
(*2) Ground pattern on rear of the board
(*3) Solder plated patterns
(*4) mmm: Through holes
TEST CIRCUIT 2 (fRFout = 1.9 GHz)
EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD
FORM SYMBOL VALUE
Chip Capacitor C1, C2, C3100 pF
C41000 pF
C5, C61 µF
C730 pF
C82.75 pF
Chip Inductor L 470 nH1
Note:
1. 470 nH: LL2012-FR47 (TOKO Co., Ltd.)
COMPONENT LIST
(*1) 35 x 42 x 0.4 mm polymide board, double-sided copper clad
(*2) Ground pattern on rear of the board
(*3) Solder plated patterns
(*4) mmm: Through holes
50 Ω
50 Ω
Signal Generator
Signal Generator
100 pF
100 pF
C
1
C
2
1
2
3
GND
LO
input
IF
input
RF
output
V
CC
PS
6
5
4
C
8
C
3
C
4
C
6
C
7
C
5
470 nH
1000 pF
1 µF 1 µF
30 pF
100 pF
100 pF
L
50 Ω
Spectrum Analyzer
V
CC
Strip Line
2.75 pF
PS
C6
C7
C5
VCC
C3
C2
C1
GND
LOinput
IFinput
UPC8172TB
PS Bias
Voltage Supply
RFoutput
L
C4
UPC8172TB
TEST CIRCUIT 3 (fRFout = 2.4 GHz)
EXAMPLE OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD
FORM SYMBOL VALUE
Chip Capacitor C1, C2, C3100 pF
C41000 pF
C5, C61 µF
C710 pF
C81.75 pF
Chip Inductor L 470 nH1
Note:
1. 470 nH: LL2012-FR47 (TOKO Co., Ltd.)
COMPONENT LIST
(*1) 35 x 42 x 0.4 mm polymide board, double-sided copper clad
(*2) Ground pattern on rear of the board
(*3) Solder plated patterns
(*4) mmm: Through holes
PS
L
C
6
C7
C5
VCC
C3
C8
C2
C1
GND
LOinput
IFinput
UPC8172TB
PS Bias
Voltage Supply
RFoutput
C4
50 Ω
50 Ω
Signal Generator
Signal Generator
100 pF
100 pF
C
1
C
2
1
2
3
GND
LO
input
IF
input
RF
output
V
CC
PS
6
5
4
C
8
C
3
C
4
C
6
C
7
C
5
470 nH
1000 pF
1 µF 1 µF
10 pF
100 pF
L
50 Ω
Spectrum Analyzer
V
CC
Strip Line
100 pF
1.75 pF
UPC8172TB
5-150
UPC8172TB
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE S06
Note:
All dimensions are typical unless otherwise specified.
EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM
06/14/2001
DATA SUBJECT TO CHANGE WITHOUT NOTICE
0 to 0.1
0.2
+0.10
-0.05
0.15
1.3
2.1 ±0.1
1.25 ±0.1
0.1 MIN
+0.10
-0.05
2.0 ±0.2 0.65
0.65
0.9 ± 0.1
0.7
PIN CONNECTIONS
PIN NO. PIN NAME
1 IFinput
2GND
3 LOinput
4 PS
5 VCC
6 RFoutput
BLOCK DIAGRAM
(Top View)
LO input
GND
IF input
PS
V
CC
RF output
4
5
6
4
5
6
1
2
3
1
2
3
C3A
(Top View) (Bottom View)
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ORDERING INFORMATION
Note: Embossed tape, 8 mm wide. Pins 1, 2 and 3 face the tape
perforation side.