
© 2005 Fairchild Semiconductor Corporation DS500249 www.fairchildsemi.com
September 2000
Revised May 2005
74LCXH162244 Low Voltage 16-Bit Buffer /Line Driver with Bushol d and 26: Seri es Resistors in Outputs
74LCXH162244
Low Voltage 16-Bit Buffer/Line Driver with Bushold
and 26: Series Resistors in Outputs
General Descript ion
The LCXH162244 contains sixteen non-inverting buffers
with 3-STATE outputs designed to be employed as a mem-
ory and addre ss driver, clock driver, or bu s o riented trans-
mitter/receiver . The device is nibble controlled. Each nibble
has separate 3- S TAT E con tro l inpu ts which can be sh ort ed
together for full 16-bit operation.
The LCXH162244 data inputs include active bushold cir-
cuitry, eliminating the need for external pull-up resistors to
hold unused or floating data inputs at a valid logic level.
In addition, the outputs include equivalent 26
:
(nominal)
series resistors to reduce overshoot and undershoot and
are designed to sink/source up to 12 mA at VCC
3.0V.
The LCXH162244 is designed for low voltage (2.5V or
3.3V) VCC applications with capability of interfacing to a 5V
signal environment.
The LCXH162244 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Features
■5V tolerant control inputs and outputs
■2.3V–3.6V VCC specifications provided
■Outputs include equivalent series resistance of 26
:
to
make external termination resistors unnecessary and
reduce overshoot and undershoot
■Bushold on data inputs eliminat es the need for external
pull-up/pull-down resistors
■5.3 ns tPD max (VCC
3.0V), 20
P
A ICC max
■Power down high impedance inputs and outputs
■
r
12 mA output drive (VCC
3.0V)
■Latch-up per for man c e exce eds 500 mA
■ESD performa nce :
Human body model
!
2000V
Machine model
!
200V
Ordering Code:
Order Number Package Number Package Description
74LCXH162244MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[RAIL]
74LCXH162244MEX MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TAPE and REEL]
74LCXH162244MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[RAIL]
74LCXH162244MTX MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TAPE and REEL]
■Implements proprietary noise/EMI reduction circuitry