145 Adams Avenue, Hauppauge, NY 11788 USA
Tel: (631) 435-1110 • Fax: (631) 435-1824
Package Details -
Central
Semiconductor Corp.
www.centralsemi.com
TM
R0 (21-June 2004)
Mechanical Drawing
TO-92
Packing Code: D
D = White corrugated box with
black conductive coating
(surface resistivity of <105ohms per square).
MIN MAX MIN MAX
A (DIA) 0.175 0.205 4.45 5.21
B 0.170 0.210 4.32 5.33
C 0.500 - 12.70 -
D 0.016 0.022 0.41 0.56
E
F
G 0.125 0.165 3.18 4.19
H 0.080 0.105 2.03 2.67
I
TO-92 (REV: R1)
0.015 0.38
DIMENSIONS
SYMBOL
INCHES MILLIMETERS
0.100 2.54
0.050 1.27
Standard Packing Quantity: 2.5K
Also available in the following lead form options
TO-92-SF, TO-92-ST, TO-92-ST1, TO-92-18F, TO-92-18R
LEAD CODE:
TRIAC
1) MT1
2) GATE
3) MT2
SCR
1) ANODE
2) GATE
3) CATHODE
or
1) CATHODE
2) GATE
3) ANODE
or
1) DRAIN
2) GATE
3) SOURCE
1) SOURCE
2) DRAIN
3) GATE
PUT
1) ANODE
2) GATE
3) CATHODE
or
1) EMITTER
2) COLLECTOR
3) BASE
1) BASE
2) EMITTER
3) COLLECTOR
* Note: See individual device datasheet
for pinout information
*
1) GATE
2) SOURCE
3) DRAIN
FET
1) DRAIN
2) SOURCE
3) GATE
*
TRANSISTOR
1) EMITTER
2) BASE
3) COLLECTOR
1) COLLECTOR
2) BASE
3) EMITTER
*
1
Package Details -
Central
Semiconductor Corp.
www.centralsemi.com
TM
TO-92 TR
Tape and Reel Specifications
2
1.0. Purpose:
This specification defines the tape and reel packaging requirements for TO-92
devices.Devices supplied to this specification are taped in accordance with
Electronic Industries Association Standard EIA-468-B.
2.0 Requirements:
2.1 Tape and Reel Requirements: Devices to be taped and reeled in
accordance with Figures 2 and 3.
2.2 Style Type: A suffix is added to par t number to indicate Style Type.
Example: CS92B TRE (CS92B taped and reeled in accordance with
STYLE E). Note: STYLE E is preferred.
2.3 Packaging Base: Devices to be taped 2000 pieces per reel.
FIGURE 1. PHYSICAL DIMENSIONS
ALL DIMENSIONS IN INCHES (mm).
Package Details -
Central
Semiconductor Corp.
www.centralsemi.com
TM
TO-92 TR
Tape and Reel Specifications
(Continued)
NOTES: 1 ) MAXIMUM ALIGNMENT DEVIATION BETWEEN LEADS NOT TO BE GREATER THAN 0.2mm.
2) AS ILLUSTRATED , THE CLEARANCE T O THE LEAD STANDOFF FORM SHALL BE DEFINED TO THE POINT OF RADIUS FOR THE STANDOFF FORM.
3) MAXIMUM CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1.0mm IN 20 PITCHES.
4) OVERALL TAPED PACKAGE THICKNESS, INCLUDING COMPONENT LEADS AND TAPE SPLICES SHALL NOT EXCEED 1.44mm.
5 ) HOLDDOWN TAPE NOT TO EXTEND BEYOND THE EDGES OF CARRIER TAPE AND THERE SHALL BE NO EXPOSURE OF ADHESIVE.
6) NO MORE THAN 0.1% MISSING AND NO CONSECUTIVE MISSING COMPONENTS PER REEL IS PERMITTED.
7) A TAPE LEADER AND TRAILER, HAVING AT LEAST 3 SPROCKET HOLES IS REQUIRED.
8) NO MORE THAN 10 SPLICES PER REEL IS PERMITTED AND SPLICES SHALL NOT INTERFERE WITH SPROCKET FEED HOLES.
INCHES MM
SYMBOL DESCRIPTION MIN MAX MIN MAX NOTE
A FRONT TO REAR DEFLECTION --- 0.039 --- 1.0 1
A1 LEFT TO RIGHT DEFLECTION --- 0.039 --- 1.0
D FEED HOLE DIAMETER 0.15 0.17 3.8 4.2
F1 COMPONENT LEAD PITCH 0.09 0.11 2.4 2.9 6
F2 COMPONENT LEAD PITCH 0.09 0.11 2.4 2.9 6
H FEED HOLE TO BOTTOM OF COMPONENT 0.75 0.79 19.0 20.0
H1 HEIGHT OF SEATING PLANE 0.61 0.65 15.5 16.5 2
H2 HEIGHT OF FEED HOLE LOCATION 0.33 0.37 8.5 9.5 7,8
P FEED HOLE PITCH 0.49 0.51 12.5 12.9 3
P1 CENTER OF SEATING PLANE LOCATION 0.23 0.26 5.95 6.75
T CARRIER TAPE THICKNESS 0.015 0.027 0.38 0.68 4
T1 O VERALL TAPE THICKNESS 0.020 0.035 0.50 0.90
T2 T O TAL TAPED PACKA GE THICKNESS --- 0.057 --- 1.44 4
W CARRIER TAPE WIDTH 0.69 0.75 17.5 19.0
W1 ADHESIVE TAPE WIDTH 0.20 0.28 5.0 7.0 5
W2 LEAD ENCLOSURE 0.18 --- 4.5 ---
W3 ADHESIVE TAPE POSITION --- 0.020 --- 0.5 5
FIGURE 2.TAPING SPECIFICATIONS
3
Package Details -
Central
Semiconductor Corp.
www.centralsemi.com
TM
TO-92 TR
Tape and Reel Specifications
(Continued) FIGURE3.TAPING STYLE
4
Package Details -
Central
Semiconductor Corp.
www.centralsemi.com
TM
TO-92 AP
Ammopack
Specifications
1.0. PURPOSE:
This specification defines the TO-92 Ammopack requirements. Devices supplied
to this specification are taped in accordance with Electronic Industries Association
Standard EIA-468-B.
2.0 REQUIREMENTS:
2.1 Tape Requirements: Devices to be taped in accordance with Figure 2.
2.2 Style Type: STYLE M (PREFERRED) or STYLE P (See Figures 3 and 4).
2.3 Ordering Info: Add suffix to par t number to indicate Style Type .
Suffix APM For STYLE M (Equivalent to reel pack STYLE E).
Example: CS92B APM (CS92B SCR, Ammopack STYLE M).
or
Suffix APP For STYLE P (Equivalent to reel pack STYLE A).
Example: CS92B APP (CS92B SCR, Ammopack STYLE P).
2.4 Packaging Base: Devices to be taped 2000 pieces per Ammopack.
FIGURE 1. PHYSICAL DIMENSIONS
All Dimensions in Inches (mm)
5
Package Details -
Central
Semiconductor Corp.
www.centralsemi.com
TM
TO-92 AP
TO-92 Ammopack
Specifications
(Continued) FIGURE 2. (TAPING SPECIFICATIONS)
NOTES: 1 ) MAXIMUM ALIGNMENT DEVIATION BETWEEN LEADS NOT TO BE GREATER THAN 0.2mm.
2) AS ILLUSTRATED , THE CLEARANCE T O THE LEAD STANDOFF FORM SHALL BE DEFINED TO THE POINT OF RADIUS FOR THE STANDOFF FORM.
3) MAXIMUM CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1.0mm IN 20 PITCHES.
4) OVERALL TAPED PACKAGE THICKNESS, INCLUDING COMPONENT LEADS AND TAPE SPLICES SHALL NOT EXCEED 1.44mm.
5 ) HOLDDOWN TAPE NOT TO EXTEND BEYOND THE EDGES OF CARRIER TAPE AND THERE SHALL BE NO EXPOSURE OF ADHESIVE.
6) NO MORE THAN 0.1% MISSING AND NO CONSECUTIVE MISSING COMPONENTS PER REEL IS PERMITTED.
7) A TAPE LEADER AND TRAILER, HAVING AT LEAST 3 SPROCKET HOLES IS REQUIRED.
8) NO MORE THAN 10 SPLICES PER REEL IS PERMITTED AND SPLICES SHALL NOT INTERFERE WITH SPROCKET FEED HOLES.
INCHES MM
SYMBOL DESCRIPTION MIN MAX MIN MAX NOTE
A FRONT TO REAR DEFLECTION --- 0.039 --- 1.0 1
A1 LEFT TO RIGHT DEFLECTION --- 0.039 --- 1.0
D FEED HOLE DIAMETER 0.15 0.17 3.8 4.2
F1 COMPONENT LEAD PITCH 0.09 0.11 2.4 2.9 6
F2 COMPONENT LEAD PITCH 0.09 0.11 2.4 2.9 6
H FEED HOLE TO BOTTOM OF COMPONENT 0.75 0.79 19.0 20.0
H1 HEIGHT OF SEATING PLANE 0.61 0.65 15.5 16.5 2
H2 HEIGHT OF FEED HOLE LOCATION 0.33 0.37 8.5 9.5 7,8
P FEED HOLE PITCH 0.49 0.51 12.5 12.9 3
P1 CENTER OF SEATING PLANE LOCATION 0.23 0.26 5.95 6.75
T CARRIER TAPE THICKNESS 0.015 0.027 0.38 0.68 4
T1 OVERALL TAPE THICKNESS 0.020 0.035 0.50 0.90
T2 TOTAL TAPED PA CKA GE THICKNESS --- 0.057 --- 1.44 4
W CARRIER TAPE WIDTH 0.69 0.75 17.5 19.0
W1 ADHESIVE TAPE WIDTH 0.20 0.28 5.0 7.0 5
W2 LEAD ENCLOSURE 0.18 --- 4.5 ---
W3 ADHESIVE TAPE POSITION --- 0.020 --- 0.5 5
6
Package Details - TO-92 AP
Ammopack
Specifications (Continued)
Note: The box is accessible from either side depending upon whether PIN 1 or PIN 3 is required at the leading edge.
Central
Semiconductor Corp.
www.centralsemi.com
TM
7
Material Composition Specification
TO-92 (Eutectic Die Attach)
Pb (lead)-free plating**
Device average mass. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 mg
Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%
www.centralsemi.com
R2 (25-October 2010)
Component Material
Material
Substance CAS No.
Substance
(%wt) (mg) (%wt) (mg) (ppm)
active device doped Si 0.034% 0.07 Si 7440-21-3 0.034% 0.07 340
bond wire gold 0.016% 0.032 Au 7440-57-5 0.016% 0.032 155
leadframe Cu alloy
w/ silver plating 44.824% 92.338
Cu 7440-50-8 44.641% 91.96 446,408
Fe 7439-89-6 0.045% 0.092 447
P 7723-14-0 0.016% 0.032 155
Ag 7440-22-4 0.123% 0.254 1,233
encapsulation*
EMC 52.286% 107.71
silica 7631-86-9 40.694% 83.83 406,942
epoxy resin 29690-82-2 5.267% 10.85 52,670
phenol resin 9003-35-4 4.748% 9.78 47,476
carbon black 1333-86-4 0.149% 0.306 1,485
Sb2O31309-64-4 1.146% 2.36 11,456
TBBA 79-94-7 0.283% 0.584 2,835
EMC GREEN 52.286% 107.71
silica 7631-86-9 38.816% 79.96 388,155
epoxy resin 29690-82-2 5.024% 10.35 50,243
phenol resin 9003-35-4 4.529% 9.33 45,291
carbon black 1333-86-4 0.568% 1.17 5,680
metal
hydroxide 1309-42-8 3.35% 6.9 33,495
plating**
tin lead process 2.84% 5.85
Sn 7440-31-5 2.282% 4.7 22,816
Pb 7439-92-1 0.558% 1.15 5,583
100% matte tin 2.84% 5.85 Sn 7440-31-5 2.84% 5.85 28,398
*EMC GREEN molding compound is Halogen Free.
**Specify Lead-Free when ordering 100% tin (Pb-free) plating.
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct.
However, there is no guarantee to completeness or accuracy, as some information is derived from data sources
outside the company.
Material Composition Specification
TO-92 (Solder Die Attach)
Pb (lead)-free plating**
Device average mass. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 mg
Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%
www.centralsemi.com
R2 (25-October 2010)
Component Material
Material
Substance CAS No.
Substance
(%wt) (mg) (%wt) (mg) (ppm)
active device doped Si 0.035% 0.07 Si 7440-21-3 0.035% 0.073 354
bond wire gold 0.016% 0.032 Au 7440-57-5 0.016% 0.032 155
leadframe Cu alloy
w/ silver plating 44.82% 92.34
Cu 7440-50-8 44.64% 91.96 446,408
Fe 7439-89-6 0.045% 0.092 447
P 7723-14-0 0.016% 0.032 155
Ag 7440-22-4 0.123% 0.254 1,233
die attach silver epoxy 0.121% 0.25
Pb 7439-92-1 0.113% 0.232 1,126
Sn 7440-31-5 0.006% 0.012 58
Ag 7440-22-4 0.003% 0.006 29
encapsulation*
EMC 52.16% 107.46
silica 7631-86-9 40.6% 83.64 406,019
epoxy resin 29690-82-2 5.25% 10.82 52,524
phenol resin 9003-35-4 4.74% 9.76 47,379
carbon black 1333-86-4 0.148% 0.305 1,481
Sb2O31309-64-4 1.14% 2.35 11,408
TBBA 79-94-7 0.283% 0.582 2,825
EMC GREEN 52.16% 107.46
silica 7631-86-9 38.72% 79.77 387,233
epoxy resin 29690-82-2 5.015% 10.33 50,146
phenol resin 9003-35-4 4.519% 9.31 45,194
carbon black 1333-86-4 0.567% 1.167 5,665
metal
hydroxide 1309-42-8 3.34% 6.88 33,398
plating** tin lead process 2.84% 5.85 Sn 7440-31-5 2.282% 4.7 22,816
Pb 7439-92-1 0.558% 1.15 5,583
100% matte tin 2.84% 5.85 Sn 7440-31-5 2.84% 5.85 28,398
*EMC GREEN molding compound is Halogen Free.
**Specify Lead-Free when ordering 100% tin (Pb-free) plating.
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct.
However, there is no guarantee to completeness or accuracy, as some information is derived from data sources
outside the company.
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Central Semiconductor's
RoHS compliance
RoHS:
The European Union has adopted Directive 2002/95/EC - the Restriction of Hazardous Substances (RoHS) in
electrical and electronic equipment. This legislation bans the use of lead, mercury, cadmium, hexavalent
chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) in electrical and
electronic devices after July 1, 2006 with certain exemptions.
Central’s Policy:
Central Semiconductor is doing its part to help improve the environment by reducing and removing any
substances that are considered harmful to the environment. Central has put procedures in place to comply with
legislation pertaining to environmental concerns. Central has implemented procedures to comply with RoHS
banned substances.
Table 1 lists the allowable limits for banned substances.
(1) Applicable to products with Pb-free lead finish only.
(2) Maximum limit does not apply to applications for which exemptions
have been granted by the RoHS directive.
Central’s current products do not contain any of the following banned substances: Mercury, Cadmium,
hexavalent chromium, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE). Nearly all of
Central’s products are currently available with lead free exterior finishes, in the form of 99.9% matte tin plating.
Presently most of Central’s products are available in both Lead free (99.9% Tin), and Tin/Lead finishes.
Special Notations
1. Tin Whisker Mitigation Methods:
Central’s Pb free plating meets the following criteria:
a. External plating composition is 99.9% Matte Tin (Sn) minimum.
b. External plating thickness is 315 micro-inches (8µm) minimum.
c. External plating grain size is 40 micro-inches (1µm) minimum.
d. External plating carbon content is 0.1% maximum.
e. Devices do not have a Nickel (Ni) barrier underlayer.
f. Some case types include a post plating anneal bake.
2. Central’s Pb free devices are RoHS compliant.
3. Central’s Pb free devices are compatible with both tin/lead and lead free solder processes.
4. Central’s Pb free devices can withstand a MAX temperature of 260°C for 30 seconds maximum.
Click here for Central’s typical reflow & wave soldering temperature profile.
5. Central’s Pb free surface mount devices have a Moisture Sensitivity Level (MSL) of 1. (per JEDEC J-
STD-020D)
6. Central’s Pb free devices are not a change in form, fit or function.
7. Central’s Pb free devices are controlled by an internal lot tracking system.
8. In order to receive Pb free devices please add a suffix of “Lead Free” to the part number when ordering.
(Example: CMPD2004S TR LEAD FREE)
9. Devices ordered as Pb free are certified to contain less than 1000ppm Pb content on the terminal plating
and will be labeled with Central’s Lead Free/RoHS Compliant Logo.
Sample Label
Table 1
Substance
Maximum Limit
(ppm )
Cadmium (Cd) 100
Lead (Pb) 1000 (1) (2)
Mercury (Hg) 1000
Hexavalent Chromium (Cr 6+) 1000
Poly Brominated Biphenyls (PBB) 1000
Poly Brominated Diphenyl Ethers (PBDE) 1000
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10. Devices with tin/lead plating are still available for certain customer’s requirements. Please contact
Central’s sales department for additional detail.
Central Semiconductor’s
REACH compliance
The European Union’s REACH (Registration, Evaluation, Authorization, and restriction of Chemicals)
regulation applies to chemical substances manufactured in or imported to the EU in quantities of
1 tonne or more per year. It applies to chemical substances on their own, in preparations, or in articles
(manufactured goods). The goal of REACH is to improve the protection of human health and the
environment through better and earlier identification of chemical substances.
Central’s Policy:
Central’s devices are in compliance with article 57 of Regulation (EC) No. 1907/2006 (the REACH
Regulation). They do not contain, nor are they manufactured with, any of the currently identified SVHCs
(Substances of Very High Concern). They do not contain any substances meant for intentional release.
Click here for a PDF version of this statement.
For additional information please contact the Central sales department at (631) 435-1110.
145 Adams Avenue
Hauppauge, NY 11788 USA
TEL (631) 435-1110
FAX (631) 435-1824
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